Method and system for device thermal control in electronic test equipment

Abstract

A test apparatus is provided.SOLUTION: The slot assembly is removably attached to the frame. Each slot assembly allows for individual heating and thermal control of a respective cartridge inserted into the slot assembly. A closed loop air path is defined by the frame, and the heater and cooler are located in the closed loop air path to heat or cool the cartridge with air. Individual cartridges can be inserted or removed while other cartridges are at various locations to be tested or at various locations of the temperature gradient.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001]

[0001] The present invention relates to test equipment used to test microelectronic circuits. [Background technology]

[0002]

[0002] Microelectronic circuits are typically fabricated in and on semiconductor wafers. Such wafers are then "singulated" or "diced" into individual dies. Such dies are typically mounted on a support substrate, which provides rigidity to the support substrate and communicates with the die's integrated or microelectronic circuitry. Final packaging can include encapsulation of the die, and the resulting package can then be shipped to a customer.

[0003]

[0003] Dies or packages must be tested before they are shipped to customers. Ideally, dies should be tested at a processing stage in order to identify defects that occur during early manufacturing. Wafer-level testing can be accomplished by providing a handling device and a contactor with contacts, and then using the handling device to move the wafer so that the contacts on the wafer come into contact with the contacts on the contactor. Power and electronic signals are then transferred to and from the microelectronic circuits formed on the wafer through the contactor.

[0004] According to various embodiments, a wafer includes a substrate, such as a silicon substrate or a printed circuit board, and one or more devices fabricated in or attached to the substrate.

[0005] Alternatively, the wafer can be placed in a portable cartridge having an electrical interface and a thermal chuck, with power and signals supplied to and from the wafer via the electrical interface, while the temperature of the wafer is thermally controlled by heating or cooling the thermal chuck. Summary of the Invention

[0006]

[0006] The present invention provides a test apparatus comprising a frame and a plurality of slot assemblies, each slot assembly including a slot assembly body attached to the frame, a holder attached to the slot assembly body and forming a test location for placing a respective wafer having at least one microelectronic device, a plurality of electrical conductors, and a temperature detector in proximity to each wafer for detecting the temperature of each wafer, the test apparatus comprising at least one temperature correction device for transferring heat to or from the wafer during operation, at least one thermal controller for controlling the transfer of heat based on the temperature of the wafer detected by the temperature detector, a power supply connected to the wafers in the test location through the electrical conductors and for supplying at least power to each microelectronic device, and a tester connected to the wafers through the electrical conductors and for measuring the performance of the microelectronic devices.

[0007]

[0007] The present invention further provides a method for testing microelectronic devices, the testing method comprising the steps of placing each wafer of a plurality of wafers, each wafer having at least one microelectronic device, in a respective test location provided by a respective holder of a respective slot assemblies mounted on a frame; detecting a respective temperature of each wafer with a respective temperature detector adjacent to each wafer; transferring heat to or from the wafer; controlling the heat transfer based on the temperature of the wafer detected by the temperature detector; and testing the microelectronic devices by supplying at least power to each microelectronic device and measuring performance of the microelectronic device.

[0008]

[0008] The present invention further provides a testing apparatus comprising: a frame defining at least a first closed-loop air path; at least a first fan located within the first closed-loop air path for recirculating air through the first closed-loop air path; and a plurality of slot assemblies, each slot assembly including a slot assembly body mounted to the frame; a holder attached to the slot assembly body and forming a test location for placing each wafer having at least one microelectronic device and held in the first closed-loop air path; and a plurality of electrical conductors; and the testing apparatus comprises a temperature correction device mounted on the frame within the first closed-loop air path and, in operation, causing heat transfer between the air in the first closed-loop air path and the temperature correction device within the first closed-loop air path; at least one temperature detector for detecting temperature; a thermal controller for controlling the heat transfer based on the temperature; a power supply connected to the wafers in the test location via the electrical conductors and for supplying at least power to each of the microelectronic devices; and a tester connected to the wafers via the electrical conductors and for measuring performance of the microelectronic devices.

[0009]

[0009] The present invention further provides a method for testing microelectronic devices, the method comprising the steps of placing each wafer of a plurality of wafers, each wafer having at least one microelectronic device, at a respective test location provided by a respective holder of a respective slot assemblies mounted on a frame, the wafers being held within a first closed-loop air path defined by the frame; operating at least a first fan located in the first closed-loop air path to recirculate air through the first closed-loop air path; transferring heat between at least one temperature correction device mounted on the frame within the first closed-loop air path and the air in the first closed-loop air path; detecting the temperature; controlling the heat transfer based on the temperature; and testing the microelectronic devices by supplying at least power to each microelectronic device and measuring performance of the microelectronic device.

[0010]

[0010] The present invention further provides a test apparatus comprising a frame and a plurality of slot assemblies, each slot assembly including a slot assembly body attached to the frame, a holder attached to the slot assembly body and forming a test location for placing a respective wafer having at least one microelectronic device, a plurality of electrical conductors, and a temperature detector adjacent to each wafer for detecting the temperature of each wafer, the test apparatus comprising at least one temperature correction device that causes heat transfer to or from the wafers when operated, and a tester connected to the wafers in the test location through the electrical conductors and for testing the microelectronic devices by supplying at least power to each microelectronic device and measuring performance of the microelectronic devices, and at least one of the electrical conductors of a first slot assembly of the slot assemblies is connectable between a first wafer of the wafers and a power source while transferring heat to or from a second wafer of the wafers connected to the power source.

[0011]

[0011] The present invention further provides a method for testing microelectronic devices, the testing method comprising the steps of placing each wafer of a plurality of wafers, each wafer having at least one microelectronic device, in a respective test location provided by a respective holder of a respective slot assembly mounted on a frame; detecting a respective temperature of each wafer with a respective temperature detector adjacent to each wafer; transferring heat to or from the wafer; testing the microelectronic devices by supplying at least power to each microelectronic device and measuring performance of the microelectronic device; and connecting at least one of the conductors of a first slot assembly of the slot assemblies between a first wafer of the wafers and the power source while transferring heat to or from a second wafer of the wafers that is connected to a power source.

[0012]

[0012] The invention will now be further described, by way of example only, with reference to the accompanying drawings, in which: [Brief explanation of the drawings]

[0013] [Figure 1] 1 is a cross-sectional side view of a test device having a slot assembly according to one embodiment of the present invention. [Figure 2] FIG. 2 is a cross-sectional side view of the test apparatus of FIG. 1 taken along line 2-2. [Figure 3] FIG. 3 is a cross-sectional side view of the test apparatus of FIG. 1 taken along line 3-3. [Figure 4] FIG. 4 is a cross-sectional side view of the test apparatus of FIGS. 2 and 3 taken along line 4-4. [Figure 5A] FIG. 10 is a cross-sectional side view of a testing device having a slot assembly according to another embodiment of the present invention. [Figure 5B] 10 is a cross-sectional side view of a test device having a slot assembly according to a further embodiment of the present invention. [Figure 5C] 10 is a cross-sectional side view of a test device having a slot assembly according to a further embodiment of the present invention. [Figure 6A] 1 is a perspective view showing a testing apparatus and illustrating an example of inserting or removing a portable cartridge into or from an oven defined by a frame. [Figure 6B] 1 is a perspective view showing a testing apparatus and illustrating an example of inserting or removing a portable cartridge into or from an oven defined by a frame. [Figure 6C] 1 is a perspective view showing a testing apparatus and illustrating an example of inserting or removing a portable cartridge into or from an oven defined by a frame. [Figure 7] 1 is a timing diagram showing how one cartridge is inserted and used to test the electronics of a wafer, and then another cartridge is inserted. [Figure 8] FIG. 10 is a perspective view of a test apparatus illustrating the insertion or removal of one slot assembly. DETAILED DESCRIPTION OF THE INVENTION

[0014]

[0022] FIG. 1 of the accompanying drawings illustrates a testing apparatus 10 according to an embodiment of the present invention, including a tester 12, a frame 14, a power bus 16, first and second slot assemblies 18A and 18B, first and second tester interfaces 20A and 20B, first and second power interfaces 22A and 22B, first and second pressurized air interfaces 24A and 24B, first and second vacuum interfaces 26A, 26B, first and second cartridges 28A and 28B, and first and second wafers 30A and 30B.

[0015]

[0023] The slot assembly 18A includes a slot assembly body 32, a thermal chuck 34, a temperature detector 36, a temperature modifier in the form of a heating element 38, a cooling element 39, a first slot assembly interface 40, and a plurality of second slot assembly interfaces including a control interface 44, a power interface 46, and a vacuum interface 48.

[0016]

[0024] A first slot assembly interface 40 is located within and attached to the slot assembly body 32. A second interface in the form of a control interface 44, a power interface 46, and a vacuum interface 48 is attached to the left side wall of the slot assembly body 32, which is attached to the frame 14.

[0017]

[0025] The slot assembly 18A is insertable into and removable from the frame 14. When the slot assembly 18A is inserted into the frame 14, the tester interface 20A, the power interface 22A, and the first vacuum interface 26A are connected to the control interface 44, the power interface 46, and the vacuum interface 48, respectively. When the slot assembly 18A is removed from the frame 14, the tester interface 20A, the power interface 22A, and the first vacuum interface 26A are disconnected from the control interface 44, the power interface 46, and the vacuum interface 48.

[0018]

[0026] The slot assembly 18A includes a motherboard 60 with test electronics, a plurality of channel module plates 62 with test electronics, a flexible connector 64, and a connection plate 66. The control interface 44 and power interface 46 are connected to the motherboard 60, which has a thermal controller 50 mounted thereon. The channel module plates 62 are electrically connected to the motherboard 60. The flexible connector 64 connects the channel module plates 62 to the connection plate 66. Control functionality is provided via conductors connecting the control interface 44 to the motherboard 60. Power is provided to the motherboard 60 via the power interface 46. Both power and control are provided from the motherboard 60 to the channel module plates 62 via conductors. The flexible connector 64 provides conductors connecting the channel module plates 62 to the connection plate 66. The connection plate 66 includes conductors connecting the flexible connector 64 to the first slot assembly interface 40. This first slot assembly interface 40 is thus connected to the control interface 44 and the power interface 46 via various conductors, such that power and control can be supplied to the first slot assembly interface 40 via the control interface 44 and the power interface 46.

[0019]

[0027] The second slot assembly 18B includes similar components to the first slot assembly 18A, and like reference numerals refer to like components. The second slot assembly 18B is inserted into the frame 14, and the control interface 44, power interface 46, and vacuum interface 48 of the second slot assembly 18B are adapted to connect to the tester interface 20B, power interface 22B, and second vacuum interface 26B, respectively.

[0020]

[0028] Cartridge 28A includes a cartridge body 70 formed by a thin chuck 72 and a backplate 74. Temperature detector 36 is located within thin chuck 72. Wafer 30A has multiple microelectronic devices formed therein. Wafer 30A is inserted into cartridge body 70 between thin chuck 72 and backplate 74. Multiple cartridge contacts 76 contact respective contacts (not shown) on wafer 30A. Cartridge 28A further includes a cartridge interface 78 on backplate 74. Conductors within backplate 74 connect cartridge interface 78 to cartridge contacts 76.

[0021]

[0029] Cartridge 28A has a seal 77 connected between backplate 74 and thin chuck 72. A vacuum is applied to the area defined by seal 77, backplate 74, and thin chuck 72. The vacuum holds cartridge 28A together and ensures proper contact between cartridge contacts 76 and contacts on wafer 30A. Temperature detector 36 is in close proximity to wafer 30A and therefore close enough to wafer 30A to detect the temperature of wafer 30A to within 5 degrees Celsius, and preferably within 2 degrees Celsius.

[0022]

[0030] The slot assembly 18A further includes a door 82 connected to the slot assembly body 32 by a hinge 84. When the door 82 is rotated to an open position, the cartridge 28A can be inserted into the slot assembly body 32 through a door opening 86. The cartridge 28A is then lowered onto the thermal chuck 34, and the door 82 closes. The slot assembly 18A further includes a seal 88 positioned between the thermal chuck 34 and the thin chuck 72. A vacuum is applied to the area defined by the seal 88, the thermal chuck 34, and the thin chuck 72 through the vacuum interface 48 and a vacuum line 90. The thermal chuck 34 then essentially forms a holder with a test site for the wafer. The thermal chuck 34 is attached to the slot assembly body 32, which provides a good thermal connection between the thermal chuck 34 and the thin chuck 72. When the heating element 38 generates heat, the heat travels through the thermal chuck 34 and the thin chuck 72 to the wafer 30A.

[0023]

[0031] The cartridge interface 78 engages with the first slot assembly interface 40. Power and signals are supplied to the wafer 30A via the first slot assembly interface 40, the cartridge interface 78, and the cartridge contacts 76. The performance of the devices in the wafer 30A is measured via the cartridge contacts 76, the cartridge interface 78, and the first slot assembly interface 40.

[0024]

[0032] Door 82 of slot assembly 18B is shown in the closed position. A front seal 100 is attached to the top of slot assembly 18A and seals against the underside of slot assembly 18B. A front seal 102 is attached to the top of slot assembly 18A and seals against the underside of frame 14. Doors 82 and front seals 100 and 102 of slot assemblies 18A and 18B provide a continuous, sealed front wall 104.

[0025]

[0033] The slot assembly 18A further includes a thermal controller 50. The temperature detector 36 is connected to the thermal controller 50 via a temperature feedback line 52. Power is supplied to the heating element 38 via the power interface 46 and a power line 54, causing the heating element 38 to heat up. The heating element 38 then heats the thermal chuck 34 and the wafer 30A thereon. The cooling element 39 is located opposite the heating element 38 and may be, for example, a cooling element body through which fluid flows at a controllable rate to control the amount of heat transferred away from the wafer and thermal chuck 34. The heating element 38 and the cooling element 39 are configured to be controlled by the thermal controller 50 based on the temperature detected by the temperature detector 36.

[0026]

[0034] Slot assembly 18A includes a separator seal 108 attached to the upper surface of slot assembly body 32 above its inner wall 106. Separator seal 108 seals against the underside of slot assembly 18B. Slot assembly 18B has a separator seal 110 attached to the upper surface of its slot assembly body 32. Separator seal 108 seals against the underside of frame 14. A continuous, sealed separator wall 112 is provided by the inner walls 106 and separator seals 108 and 110 of slot assemblies 18A and 18B.

[0027]

[0035] Figure 2 shows the test fixture 10 of Figure 1 at 2-2. The frame 14 defines a first closed-loop air path 120. Air inlet and outlet openings (not shown) can be opened to convert the first closed-loop air path 120 to an open air path, where room temperature air flows through the frame 14 without recirculating. A closed-loop path is particularly useful in cleanroom environments because cleanroom environments result in less particulate matter being released into the air.

[0028]

[0036] The test fixture 10 includes a first fan 122, a first fan motor 124, a temperature compensation device in the form of a water chiller 126, a temperature compensation device in the form of an electric heater 128, a damper 130, a damper actuator 132, and a thermal controller 134.

[0029]

[0037] A first fan 122 and a first fan motor 124 are mounted in the upper portion of the first closed-loop air path 120. A damper 130 is pivotally mounted to the frame 14 between a raised position and a lowered position. A water chiller 126 and an electric heater 128 are mounted to the frame 14 within the upper portion of the first closed-loop air path 120.

[0030]

[0038] A damper actuator 132 is connected to the damper 130 to rotate the damper between a raised position and a lowered position. A thermal controller 134 controls the operation of the damper actuator 132 and the current supplied to the electric heater 128. The thermal controller 134 receives input from an air temperature measuring device 140 located in the first closed-loop air path 120. As represented by block 142, the air temperature set point set by the thermal controller 134 is determined by all of the following: 1) wafer temperature setpoint (programmed by the user); 2) dynamic feedback from slot temperature measurements by temperature sensor 36 in FIG. 1; 3) a constant deviation from the wafer temperature to the sensed wafer temperature, which may be a function of wafer wattage, primarily the thermocouple fluctuations and temperature drop that can be calibrated; and 4) Wafer wattage is a function of

[0031]

[0039] Cartridges 28A and 28B are positioned in slot assemblies 18A and 18B and are within the bottom half of first closed-loop air path 120.

[0032]

[0040] In use, current is supplied to the first fan motor 124. The first fan motor 124 rotates the first fan 122. The first fan 122 recirculates air through the first closed-loop air path 120 in a clockwise direction.

[0033]

[0041] The temperature controller 134 receives the temperature from the temperature measurement device 140. The thermal controller 134 is configured to maintain the temperature of the air in the first closed-loop air path 120 at a predetermined setpoint. When the air needs to be heated, the temperature controller 134 actuates the damper actuator 132 to rotate the damper 130 to the up position. Air is diverted from the water chiller 126 toward the electric heater 128, which then heats the air.

[0034]

[0042] When the air in the first closed-loop air path 120 needs to be cooled, the thermal controller 134 reduces the current to the electric heater 128 and operates the damper actuator 132 to rotate the damper 130 to the lowered position. In the lowered position, the damper 130 diverts air away from the electric heater 128, causing most of the air to flow over the heat exchanger of the water cooler 126. The water cooler 126 then cools the air. The air then flows through the slot assemblies 18A and 18B over the cartridge 28A or 28B. The cartridge 28A or 28B is then heated or cooled by the convective air.

[0035]

[0043] Figure 3 shows the test fixture 10 of Figure 1 at 3-3. The frame 14 defines a second closed-loop air path 150. The test fixture 10 further includes a second fan 152, a second fan motor 154, and a temperature compensation device in the form of a water chiller 156. No electric heater or damper is provided as in Figure 2. Air inlet and outlet openings (not shown) can be opened to convert the first closed-loop air path 150 to an open air path, in which room temperature air passes through the frame 14 without being recirculated.

[0036]

[0044] The closed-loop air path is particularly useful in a clean room environment because clean room environments result in less particulate matter being emitted into the air. A second fan 152 and a second fan motor 154 are located in the upper portion of the second closed-loop air path 150. A water chiller 156 is located slightly downstream from the second fan 152 in the second closed-loop air path 150. The motherboard 60 and channel module board 62, which form part of the slot assemblies 18A and 18B, are located in the lower half of the second closed-loop air path 150.

[0037]

[0045] In use, current is supplied to the second fan motor 154, causing the second fan 152 to rotate. The second fan 152 then recirculates air in a clockwise direction through the second closed-loop air path 150. The air is cooled by the water cooler 156. The cooled air passes over the motherboard 60 and channel module boards 62, and heat is transferred from the motherboard 60 and channel module boards 62 to the air by convection.

[0038]

[0046] The air recirculating through the first closed-loop air path 120, Figure 1, is kept separated from the air in the second closed-loop air path 150, Figure 3, by the continuously sealed separation wall 112, shown in Figure 1. The continuously sealed front wall 104, shown in Figure 1, prevents air from escaping the first closed-loop air path 120.

[0039]

[0047] 4, a plenum 160 separates the first closed-loop air path 120 from the second closed-loop air path 150 in all areas except those provided by the continuously sealed separator wall 112. The frame 14 has a left wall 162 and a right wall 164 that further define the closed-loop air paths 120 and 150.

[0040]

[0048] 5A illustrates a test fixture 210 having a slot assembly 218 according to an alternative embodiment of the present invention. The slot assembly 218 includes a heating resistor 220 that operates similarly to the heating element 38 shown in FIG. 1. The heating resistor 220 is located within a thermal chuck 222. The thermal chuck 222 has a thermal fluid passage 224 formed therein. The thermal fluid passage 224 holds a thermal fluid. The thermal fluid is preferably a liquid, as opposed to a gas, because liquids are incompressible and heat convects into and out of the liquid more quickly. Different thermal fluids are used for different applications, with oil being used for the hottest applications.

[0041]

[0049] The opposite end of the thermal fluid passage 224 is connected to first and second tubular bodies 226 and 228. The slot assembly 218 includes a pneumatic interface 230 and a pneumatic switch 232. The pneumatic interface 230 connects to a pressurized air interface 24A on the frame 14 of the test fixture 10.

[0042]

[0050] Air pressure higher than atmospheric pressure is supplied to either the first cylinder 226 or the second cylinder 228 via the air pressure switch 232. When pressurized air is supplied to the first cylinder 226, the first cylinder 226 acts as a thermal fluid actuator, pushing thermal fluid in one direction through the thermal fluid passage 224. The second cylinder 228 then receives the thermal fluid. When air pressure is supplied to the second cylinder 228 via the air pressure switch 232, the second cylinder 228 pushes thermal fluid in the opposite direction through the thermal fluid passage 224, and the first cylinder 226 receives the thermal fluid. The air pressure switch 232 constantly alternates its position, causing the thermal fluid to constantly alternate its movement direction through the thermal fluid passage 224. The heating resistor 220 functions as a heater mounted in a position that heats the thermal chuck 222 and heats the thermal fluid. By recirculating the thermal fluid through thermal fluid passages 224, thermal chuck 222 provides a uniform distribution of heat to thermal chuck 34 and ultimately to wafer 300A.

[0043]

[0051] FIG. 5B illustrates a test fixture 240 having a slot assembly 242 according to a further embodiment of the present invention. Similar to the embodiment of FIG. 5A, the slot assembly 242 includes a thermal fluid passage 224, cylinders 226 and 228, a pneumatic switch 232, and a pneumatic interface 230. The heating resistor 220 in the embodiment of FIG. 5A is replaced with a heating resistor 244, which is disposed outside the thermal chuck 222 near or around a line 246 connecting the first cylinder 226 to the thermal fluid passage 224. The heating resistor 244 is used to continuously heat the thermal fluid in the line 246. In the embodiment of FIG. 5B, the thermal fluid is heated more directly than in the embodiment of FIG. 5A.

[0044]

[0052] FIG. 5C illustrates a test fixture 340 having a slot assembly 318, which is similar to slot assembly 218 of FIG. 5A except that it includes a cooling element 320. The cooling element is aligned with thermal fluid passage 224. In use, heat is transferred to the thermal fluid in thermal fluid passage 224. The heated thermal fluid then flows to cooling element 320. The cooling element is located within first closed-loop air path 120 of FIG. 2 such that heat is transferred through cooling element 320 and then convected into the air in first closed-loop air path 120. The cooled thermal fluid then flows through first and second cylinders 226 and 228 to thermal fluid passage 224.

[0045]

[0053] While Figures 6A, 6B, and 6C illustrate how and when cartridges 30C, 30D, and 30E are inserted and removed, all other cartridges can be used to test devices on wafers and undergo various temperature gradients. Figure 7 illustrates this concept in more detail. At time T1, the first cartridge is inserted into frame 14, and the second cartridge is outside frame 14. At T1, heating of the first cartridge begins. Between T1 and T2, the temperature of the first cartridge increases from room temperature, approximately 22°C, to a test temperature at T2, which is 50°C to 150°C above room temperature. At T2, power is applied to the first cartridge, and the devices within it are tested. At T3, the second cartridge is inserted into frame 14, and heating of the second cartridge begins. At T4, testing of the first cartridge ends. At T4, cooling of the first cartridge also begins. At T5, the second cartridge reaches the test temperature, power is applied to the second cartridge, and the wafers in the second cartridge are tested. At T6, the second cartridge reaches a temperature near room temperature and is removed from the frame 14. A third cartridge is then inserted in place of the first cartridge. At T7, the second cartridge finishes testing and begins to cool. At T8, the second cartridge is cooled to or near room temperature and is removed from the frame 14.

[0046]

[0054] Different tests can be performed at different temperatures. For example, a cartridge can be inserted and a test performed at room temperature. Other tests can be performed during an upward temperature ramp. A further test can be performed at an increasing temperature. A further test can be performed during a downward temperature ramp. Two of these tests can be a single test going from one temperature step to the next.

[0047]

[0055] As shown in Figure 8, one slot assembly 18A can be removed from or inserted into frame 14. Slot assembly 18A can be inserted or removed while other slot assemblies within frame 14 are being used in wafer testing equipment, as described with reference to Figure 7.

[0048]

[0056] While certain exemplary embodiments have been described and illustrated in the accompanying drawings, it is to be understood that such embodiments are merely exemplary and do not limit the invention, and that, since modifications will occur to those skilled in the art, the invention is not limited to the specific construction and arrangements shown and described. [Explanation of symbols]

[0049] 10 Test equipment 12 Testing Machine 14 frames 18A, 18B Slot Assembly 28A, 28B cartridges 32 Slot assembly body 50 Temperature detector 126 Water cooler 128 Heater 134 Thermal Controller

Claims

1. A test apparatus comprising: The frame and a plurality of slot assemblies, each slot assembly comprising: a slot assembly body attached to the frame; a holder attached to the slot assembly body and defining a test site for placing a respective wafer having at least one microelectronic device thereon; a plurality of conductors; a temperature detector proximate to each of the wafers to detect the temperature of each of the wafers; the test apparatus includes at least one temperature modifying device that, when operated, causes heat transfer to or from the wafer; and a tester connected to the wafers in the test location through the electrical conductors and configured to test the microelectronic devices by supplying at least power to each microelectronic device and measuring performance of the microelectronic devices, wherein at least one of the electrical conductors of a first one of the slot assemblies is connectable between a first one of the wafers and the power source while transferring heat to or from a second one of the wafers connected to the power source.

2. 2. The testing apparatus of claim 1, wherein each slot assembly includes a respective thermal controller that controls the heat transfer based on the temperature of the wafer positioned at the test location of the respective slot assembly.

3. Further comprising a plurality of cartridges, each cartridge comprising: a cartridge body for holding each wafer; a plurality of cartridge contacts carried by the cartridge body for contacting the contacts on the wafer; a cartridge interface connected to the cartridge contacts; and a plurality of first slot assembly interfaces, each first slot assembly interface being located in a respective one of the slot assemblies, each cartridge being insertable into the frame together with a respective wafer, each cartridge interface being connected to a respective first slot assembly interface.

4. a plurality of test machine interfaces; 4. The testing apparatus of claim 3, further comprising a plurality of second slot assembly interfaces, each second slot assembly interface located in a respective one of the slot assemblies, each slot assembly insertable into the frame, each second slot assembly interface leading to a respective test machine interface.

5. a plurality of vacuum interfaces on the frame for applying a vacuum pressure, each slot assembly comprising: a slot assembly body; 5. The testing device of claim 4, further comprising a vacuum interface on said slot assembly body that engages said vacuum interface on said frame when said slot assembly is inserted into said frame.

6. 6. The testing apparatus of claim 5, wherein each slot assembly includes a respective temperature correction device, the respective temperature correction devices changing temperature during operation to create a temperature difference between the temperature correction device and the wafer and heat transfer between the temperature correction device and the wafer to correct the temperature of the electrical equipment in the wafer based on the temperature measured by the respective temperature detector of the respective slot assembly, and the vacuum air pressure is applied to a space between the temperature correction device and the cartridge.

7. 4. The testing apparatus of claim 3, wherein the vacuum air pressure is applied to a space within the cartridge to ensure proper contact between the cartridge contacts and contacts on the wafer.

8. 1. A method for testing a microelectronic device, comprising: placing respective wafers of a plurality of wafers, each wafer having at least one microelectronic device, in respective test stations provided by respective holders in respective slot assemblies mounted to a frame; detecting the respective temperatures of the respective wafers with respective temperature detectors proximate to the respective wafers; transferring heat to or from the wafer; testing each microelectronic device by supplying at least power to the microelectronic device and measuring the performance of the microelectronic device; and connecting at least one of the electrical conductors of a first one of the slot assemblies between a first one of the wafers and the power source while transferring the heat to or from a second one of the wafers connected to the power source.

9. 9. The method of claim 8, further comprising controlling the heat transfer with a respective thermal controller forming part of a respective slot assembly based on the temperature of the wafer placed at the test location of the respective slot assembly.

10. 9. The method of claim 8, further comprising changing the temperature of each temperature correction device of each slot assembly to create a temperature difference between the temperature correction device and the wafer and heat transfer between the temperature correction device and the wafer to correct the temperature of the electrical equipment in the wafer based on the temperature measured by the respective temperature detector of each slot assembly.

11. holding each of a plurality of wafers within a respective one of the plurality of cartridges; a cartridge body for holding each wafer; bringing a plurality of cartridge contacts held by a cartridge body of each of the cartridges into contact with contacts on each of the wafers; inserting each cartridge with its respective wafer into the frame; 9. The method of claim 8, further comprising the step of: connecting a respective cartridge interface on each respective cartridge to a respective first slot assembly interface on said respective slot assembly.

12. inserting each of the slot assemblies into the frame; The method of claim 11 , further comprising the step of connecting a respective second slot assembly interface on each respective slot assembly to a respective test fixture interface.

13. a plurality of vacuum interfaces for applying vacuum air pressure on the frame, each slot assembly comprising: a slot assembly body; and a vacuum interface on the slot assembly that engages the vacuum interface on the frame when the slot assembly is inserted into the frame.

14. 14. The method of claim 13, wherein each slot assembly includes a respective temperature correction device, the respective temperature correction devices changing temperature during operation to create a temperature difference between the temperature correction device and the wafer and heat transfer between the temperature correction device and the wafer to correct the temperature of the electrical equipment in the wafer based on the temperature measured by the respective temperature detector of the respective slot assembly, and the vacuum air pressure is applied to the space between the temperature correction device and the cartridge.

15. The method of claim 11 , wherein the vacuum air pressure is applied to a space within the cartridge to ensure proper contact between the cartridge contacts and the contacts on the wafer.

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