Electronic structure, method of manufacturing electronic circuit, and method of manufacturing electronic structure

Abstract

To improve the peelability of a composite film from a substrate. [Solution] The electronic structure 1 comprises a formation substrate 10 having a formation substrate surface 10A, a light-emitting element 14 having an electronic function, and a base film 13 and cover layer 18 covering the light-emitting element 14; a composite film 2 having a composite film back surface 2B facing the formation substrate surface 10A; and microspacers 12 protruding from the formation substrate surface 10A toward the composite film back surface 2B; the composite film 2 has a recess 13D on the composite film back surface 2B at a position facing the microspacer 12; and the microspacer 12 is formed to be smaller in area than the composite film back surface 2B, and has a microspacer surface 12A that fits into the recess 13D in the composite film back surface 2B.

Description

[Technical Field]

[0001] The present invention relates to an electronic structure, a method for manufacturing an electronic circuit, and a method for manufacturing an electronic structure, and is suitable for application to the manufacturing of a film having a plurality of electronic elements and attaching it to a wiring board. [Background technology]

[0002] Generally, electronic circuits are manufactured by mounting electronic elements (also called devices) with various functions on a wiring board. In recent years, a method has been developed to simplify the mounting process by configuring multiple types of different electronic elements as a single film and attaching the film to a wiring board.

[0003] For example, in a micro LED (Light Emitting Diode) display panel incorporated into a display device, one pixel is made up of light emitting elements (LEDs) of three colors, for example, red, green, and blue, and a large number of light emitting elements are arranged in a grid pattern on a circuit board. This micro LED display panel can be manufactured by, for example, configuring the red, green, and blue light emitting elements corresponding to one pixel as a single thin-film composite film and attaching the composite film in a grid pattern on a wiring board.

[0004] A method for producing such a composite film has been proposed in which a support layer is formed on a substrate, a composite film containing electronic elements is formed on this support layer, and then a portion of the support layer is removed to easily peel the composite film from the substrate (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0005] [Patent Document 1] JP 2017-108160 A (Figs. 1 to 9, etc.) Summary of the Invention [Problem to be solved by the invention]

[0006] However, this method has the problem that the area of ​​the remaining support layer is smaller than the area of ​​the composite film, and therefore the portion of the composite film separated from the support layer sags and adheres strongly to the substrate, which may result in poor peelability.

[0007] The present invention has been made in consideration of the above points, and aims to propose an electronic structure, a method for manufacturing an electronic circuit, and a method for manufacturing an electronic structure that can improve the peelability of a composite film from a substrate. [Means for solving the problem]

[0008] In order to solve such problems, the electronic structure of the present invention comprises a substrate having a first surface, a functional element having an electronic function, and a protective member covering the functional element, and further comprises a functional element unit having a second surface opposite the first surface, and a protrusion protruding from the first surface toward the second surface, the functional element unit having a recess on the second surface at a position opposite the protrusion, the protrusion being formed smaller in area than the second surface, and having a third surface recessed into the recess on the second surface.

[0009] The method for manufacturing an electronic circuit of the present invention includes the steps of separating the functional element unit from the protruding portion in the electronic structure and transferring the functional element unit to a substrate other than the substrate.

[0010] Furthermore, the method for manufacturing an electronic component of the present invention includes a first step of forming a substrate having a first surface, a second step of forming a support portion on the first surface of the substrate, a third step of forming a protrusion portion on the first surface of the substrate using a material different from that of the support portion, a fourth step of forming a functional element unit on the support portion and the protrusion portion, the functional element unit having a functional element with an electronic function and a protective member covering the functional element, and a fifth step of removing the support portion, wherein a second surface of the functional element unit opposite the first surface has a recess at a position opposite the protrusion portion, and the protrusion has a third surface that is smaller in area than the second surface and that extends into the recess of the second surface.

[0011] In the present invention, the second surface of the functional element unit is supported in a state where it is raised above the first surface by a protruding portion protruding from the first surface of the substrate, and the area of ​​the third surface of the protruding portion is smaller than the second surface of the functional element unit. Therefore, in the present invention, when a force is applied to the functional element unit in a direction away from the substrate, the functional element unit can be easily separated from the substrate and the protruding portion, compared to a configuration in which the protruding portion is omitted and the functional element unit is in close contact with the substrate. [Effects of the Invention]

[0012] According to the present invention, it is possible to realize an electronic structure, a method for manufacturing an electronic circuit, and a method for manufacturing an electronic structure that can improve the peelability of a composite film from a substrate. [Brief explanation of the drawings]

[0013] [Figure 1] 1A and 1B are a schematic plan view and a schematic cross-sectional view showing a configuration of an electronic structure according to a first embodiment. [Figure 2] 10 is a flowchart showing a manufacturing peel-and-mount processing procedure according to the first embodiment. [Figure 3] 2A to 2C are schematic cross-sectional views illustrating the manufacture of an electronic component according to the first embodiment. [Figure 4] 2A to 2C are schematic cross-sectional views illustrating the manufacture of an electronic component according to the first embodiment. [Figure 5] 3A to 3C are schematic cross-sectional views showing peeling and mounting of the composite film according to the first embodiment. [Figure 6] 2A to 2C are schematic plan views illustrating the manufacture of an electronic structure according to the first embodiment. [Figure 7] 2A to 2C are schematic plan views illustrating the manufacture of an electronic structure according to the first embodiment. [Figure 8] 2A to 2C are schematic plan views illustrating the manufacture of an electronic structure according to the first embodiment. [Figure 9] 5A and 5B are a schematic plan view and a schematic cross-sectional view showing the configuration of an electronic structure according to a second embodiment. [Figure 10] 10 is a flowchart showing a manufacturing peel-and-mount processing procedure according to the second embodiment. [Figure 11] 5A to 5C are schematic cross-sectional views illustrating the manufacture of an electronic component according to a second embodiment. [Figure 12] 5A to 5C are schematic cross-sectional views illustrating the manufacture of an electronic component according to a second embodiment. [Figure 13] 10A and 10B are schematic cross-sectional views showing peeling and mounting of a composite film according to a second embodiment. [Figure 14] 10A and 10B are a schematic plan view and a schematic cross-sectional view showing the configuration of an electronic structure according to a third embodiment. [Figure 15] 10 is a flowchart showing a manufacturing peel-and-mount process procedure according to the third embodiment. [Figure 16] 10A to 10C are schematic cross-sectional views illustrating the manufacture of an electronic component according to a third embodiment. [Figure 17] 10A to 10C are schematic cross-sectional views illustrating the manufacture of an electronic component according to a third embodiment. [Figure 18] 10A and 10B are schematic cross-sectional views showing peeling and mounting of a composite film according to a third embodiment. [Figure 19] 10A and 10B are a schematic plan view and a schematic cross-sectional view showing the configuration of an electronic structure according to a fourth embodiment. [Figure 20] 10A and 10B are a schematic plan view and a schematic cross-sectional view showing the configuration of an electronic structure according to a fifth embodiment. [Figure 21]10 is a schematic cross-sectional view showing peeling of a composite film according to a fifth embodiment. FIG. DETAILED DESCRIPTION OF THE INVENTION

[0014] Hereinafter, modes for carrying out the invention (hereinafter referred to as embodiments) will be described with reference to the drawings.

[0015] 1. First Embodiment [1-1. Configuration of electronic structure and composite film] Fig. 1(A) is a schematic plan view showing the configuration of an electronic structure 1 and a composite film 2 according to a first embodiment. Fig. 1(B) is a schematic cross-sectional view showing the A11-A12 cross section of Fig. 1(A). The electronic structure 1 has a configuration in which a support layer 11 and microspacers 12 are provided on a formation substrate 10, and a composite film 2 is attached to the upper side thereof.

[0016] 1A, the direction from left to right is referred to as the X direction, the direction from top to bottom is referred to as the Y direction, and the direction from the back to the front of the page is referred to as the Z direction. Furthermore, for convenience, the Z direction side and the opposite side of each part are also referred to as the front side and back side, respectively.

[0017] The composite film 2 has, for example, sides each measuring approximately 30 to 50 μm in the X and Y directions, and a side measuring approximately 1 to 15 μm in the Z direction. This composite film 2 has light-emitting elements of three colors, red (R), green (G), and blue (B), arranged sequentially along the X direction, each connected to wiring members and connection terminals, and assembled into a single film-like package. Specifically, the composite film 2 is composed of a base film 13, light-emitting elements 14 (14R, 14G, and 14B), connection pads 15, an insulating film 16, wiring portions 17, and a cover layer 18.

[0018] For convenience of explanation, hereinafter, the composite film 2 will also be referred to as a functional element unit, the light-emitting element 14 as a functional element, and the connection pad 15 as a conductive member. Furthermore, since the light-emitting element 14, wiring portion 17, and connection pad 15 have an electronic function of "emitting light in response to the supply of current," they will also be collectively referred to as a functional portion hereinafter. Furthermore, in the composite film 2, the various portions relating to the light-emitting elements 14 of each color are configured in the same manner. Therefore, hereinafter, the explanation will focus on the portion relating to the red light-emitting element 14R, and some explanations of the green light-emitting element 14G and the blue light-emitting element 14B will be omitted.

[0019] As shown in FIG. 1(B), the composite film 2 is overlaid on the Z-direction side (i.e., the front side) of the formation substrate 10, the support layer 11, and the microspacers 12, and as a whole constitutes the electronic structure 1. The formation substrate 10 is a plate-like member made of an inorganic material and has sufficient strength. Specifically, the formation substrate 10 can be a plate-like member made of various inorganic materials, such as a silicon (Si) substrate, a glass substrate, or a sapphire substrate. The formation substrate surface 10A, which is the surface of the formation substrate 10, is formed to be extremely flat, with a surface roughness of 10 nm or less. Hereinafter, the formation substrate surface 10A will also be referred to as the first surface.

[0020] Support layer 11, which serves as a support portion, is formed as a thin film from an inorganic material such as silicon oxide (SiO2) or silicon nitride (SiN). Support layer surface 11A, which is the surface of support layer 11, is formed to be extremely flat, similar to the surface of formation substrate 10, with a surface roughness of 10 nm or less. Support layer 11 is located near the center of the back surface (i.e., the -Z direction side) of composite film 2, i.e., near the center in both the X and Y directions.

[0021] The microspacers 12 are made of an organic material such as polyimide, polyamide, acrylic resin, epoxy resin, or silicone resin. The microspacers 12 are formed in a cylindrical shape along the Z direction, and the diameter thereof is sufficiently smaller (shorter) than the length of the support layer 11 along the X or Y direction. The cross-sectional area of ​​the microspacers 12 in the XY plane is, for example, several tens of μm 2 ], which is sufficiently smaller than the area of ​​the support layer surface 11A. In other words, the microspacers 12 are configured in a shape that protrudes from the formation substrate surface 10A of the formation substrate 10 in the direction in which the composite film 2 exists (i.e., the Z direction). Therefore, hereinafter, the microspacers 12 are also referred to as protrusions.

[0022] The electronic structure 1 is also provided with microspacers 12 at 12 locations forming a grid, four at predetermined intervals along the X direction and three at predetermined intervals along the Y direction. Each microspacer 12 is disposed at a position spaced apart from the support layer 11 in both the X and Y directions by a predetermined distance or more.

[0023] From another perspective, in the electronic structure 1, when two microspacers 12 are appropriately selected, these microspacers 12 may be positioned on opposite sides of the support layer 11 on the formation substrate surface 10A. For example, in FIG. 1(B), the microspacer 12 on the -Y direction side and the microspacer 12 on the Y direction side are positioned on opposite sides of the support layer 11.

[0024] The composite film 2 is in contact with the support layer surface 11A in a limited area near the center in the X and Y directions of its back surface, the composite film back surface 2B. Like the support layer surface 11A, the composite film back surface 2B is extremely smooth, with a surface roughness of 10 nm or less. Hereinafter, the composite film back surface 2B will also be referred to as the second surface. Furthermore, the microspacer surface 12A, which is the upper surface (the surface facing the Z direction) of the microspacer 12, will also be referred to as the third surface.

[0025] Furthermore, the formation substrate 10, the support layer 11, and the microspacers 12 are all used in the manufacturing stage of the composite film 2, and the composite film 2 is completed by peeling the composite film 2 from the support layer 11 and the microspacers 12. The completed composite film 2 is mounted on a wiring board, which will be described later.

[0026] That is, the electronic structure 1 is almost completed, with the composite film 2 attached to the formation substrate 10, the support layer 11, and the microspacers 12. By configuring the electronic structure 1 in this manner, the rear surface 2B of the composite film is protected, and the composite film 2 can be easily handled as a single unit with the formation substrate 10 during transportation, storage, and the like.

[0027] The base film 13 is made of an organic material such as polyimide resin, acrylic resin, or epoxy resin, and has insulating properties. The base film 13 is formed into a flat rectangular parallelepiped or thin plate shape overall, with the length of the side along the Z direction being significantly shorter than the sides along the X direction and the Y direction. Hereinafter, the back surface of the base film 13 will be referred to as the base film back surface 13B. The base film back surface 13B is formed extremely flat, with a surface roughness of 10 nm or less.

[0028] The base film 13 is larger than the support layer 11 in both the X and Y directions, and significantly protrudes from the support layer 11 in both the X and -X directions, and the Y and -Y directions. In other words, the support layer 11 is formed to be sufficiently smaller than the base film 13 in both the X and Y directions. Accordingly, a support gap SG is formed in the electronic structure 1 at a location that is outside the support layer 11 and inside the base film 13 on the XY plane, and that is between the formation substrate 10 and the base film 13 in the Z direction.

[0029] Furthermore, square connection holes 13H penetrating in the Z direction are formed at three locations spaced apart along the X direction in the base film 13 closer to the overall Y direction (toward the bottom in FIG. 1(A)). Furthermore, square connection holes 13H penetrating in the Z direction are formed at three locations spaced apart along the X direction in the base film 13 closer to the overall -Y direction (toward the top in FIG. 1(A)).

[0030] In addition, recesses 13D recessed in the Z direction are formed on the surface on the -Z direction side of the base film 13 at the locations where the microspacers 12 are provided. Therefore, the microspacer surface 12A of each microspacer 12 is recessed into each recess 13D.

[0031] The red light-emitting element 14R is an electronic element made of, for example, a gallium arsenide (GaAs)-based material, and is a functional element that constitutes a red light-emitting diode. This red light-emitting element 14R is provided on the -X direction side of the surface of the base film 13, near the center in the Y direction. Incidentally, the Z direction surface of the light-emitting element 14R has an anode terminal on the -Y direction side and a cathode terminal on the Y direction side.

[0032] The green light-emitting element 14G is an electronic element made of, for example, a gallium nitride (GaN)-based material, and is a functional element that constitutes a green light-emitting diode. The light-emitting element 14G is configured in the same shape as the light-emitting element 14R, and is located on the surface of the base film 13 at a position slightly away from the light-emitting element 14R in the X direction.

[0033] Blue light-emitting element 14B is an electronic element made of, for example, a gallium nitride (GaN)-based material, and is a functional element that constitutes a blue light-emitting diode. Light-emitting element 14B is configured in the same shape as light-emitting element 14R, and is located on the surface of base film 13, slightly away from light-emitting element 14G in the X direction. In this way, composite film 2 is provided with two or more different types of functional elements.

[0034] Each connection pad 15 is a thin film, i.e., a metal film, made of a conductive metal material such as gold (Au) or platinum (Pt). This connection pad 15 fills the inside of the connection hole 13H in the base film 13 and is provided so as to rise onto the surface side of the base film 13 near its outer periphery. That is, each connection pad 15 is disposed on each of the Y direction side and the -Y direction side of the light emitting element 14R. The connection pad back surface 15B, which is the surface on the -Z direction side of this connection pad 15, is formed extremely flat, similar to the base film back surface 13B, and its surface roughness is 10 nm or less.

[0035] In the composite film 2, the base film back surface 13B and the connection pad back surface 15B form a substantially continuous plane, which is the composite film back surface 2B. In the composite film back surface 2B, the distance in the Z direction between the base film back surface 13B and the connection pad back surface 15B, i.e., the "height of the step," is extremely small. Specifically, the height of the step in the composite film back surface 2B is 1 / 1000 or less of the shortest side in the XY plane of the outer shape of the composite film 2, i.e., the shorter of the length of the side along the X direction or the length of the side along the Y direction.

[0036] The insulating film 16 is made of an insulating material such as silicon oxide (SiO2), etc. Two insulating films 16 are provided for the light emitting element 14R, specifically, one on the Y direction side and one on the −Y direction side of the light emitting element 14R, and they mainly cover the side surfaces and vicinities thereof on the −Y direction side and Y direction side of the light emitting element 14R, respectively.

[0037] The wiring portion 17 is made of a conductive metal material such as gold (Au), aluminum (Al), copper (Cu), titanium (Ti), platinum (Pt), etc. The wiring portion 17 is provided on each of the −Y direction side and the Y direction side of the light emitting element 14R, and electrically connects the light emitting element 14R to each connection pad 15.

[0038] Like the base film 13, the cover layer 18 is made of an organic material such as polyimide resin, and is provided so as to cover the upper portions of the base film 13, the light-emitting element 14, the connection pads 15, the insulating film 16, and the wiring portion 17. The surface of the cover layer 18, i.e., the surface of the composite film 2 (hereinafter also referred to as the composite film surface 2A), is formed to be generally flat. Hereinafter, the base film 13 and the cover layer 18 will also be referred to as protective members.

[0039] Thus, the composite film 2 has three color light-emitting elements 14 arranged side by side on the surface side of the base film 13, and the back surfaces 15B of the connection pads 15 electrically connected to each of them form substantially the same plane as the back surface 13B of the base film.

[0040] In the electronic structure 1, the base film 13 and the cover layer 18 are both made of organic materials. Therefore, the base film 13 and the cover layer 18 form relatively strong bonds, such as covalent bonds and hydrogen bonds, at the molecular level. In the electronic structure 1, the formation substrate 10 and the support layer 11 are both made of inorganic materials. Therefore, the formation substrate 10 and the support layer 11 form relatively strong bonds, such as covalent bonds and hydrogen bonds, at the molecular level.

[0041] On the other hand, in the electronic structure 1, the support layer 11 is made of an inorganic material, while the base film 13 is made of an organic material. Therefore, the support layer 11 and the base film 13 form a relatively weak bond at the molecular level, such as van der Waals forces. Also, in the electronic structure 1, the outer shape of the support layer 11 is formed slightly smaller than the outer shape of the base film 13 on the XY plane. Therefore, the contact area between the support layer 11 and the base film 13 is slightly smaller than the total area of ​​the base film 13.

[0042] That is, in the electronic structure 1, of the forces acting between the stacked layers, the force acting between the support layer 11 and the base film 13 is the smallest. For this reason, in the electronic structure 1, if a sufficiently large force in the Z direction is applied to the cover layer 18 while the formation substrate 10 is fixed, the support layer 11 and the base film 13 will separate, and the composite film 2 will peel off from the formation substrate 10, etc. and the support layer 11.

[0043] [1-2. Manufacturing of electronic structures and peeling and mounting of composite films] Next, the manufacture of the electronic structure 1 and the peeling and mounting of the composite film 2 will be described with reference to Figures 2, 3, 4, 5, 6, 7, and 8. Figure 2 is a flowchart showing the manufacturing, peeling, and mounting process steps involved in the manufacture of the electronic structure 1 and the peeling and mounting of the composite film 2. Figures 3, 4, and 5 are schematic cross-sectional views showing each step of the electronic structure 1 and the composite film 2. Figures 6, 7, and 8 are schematic plan views (i.e., views showing the appearance as viewed from the Z direction) showing each step of the electronic structure 1 and the composite film 2. Here, the Z direction side will also be referred to as "top," and the -Z direction side will also be referred to as "bottom."

[0044] The electronic component 1 is manufactured by stacking layers stepwise on a formation substrate 10 using a predetermined manufacturing, peeling, and mounting apparatus 80 in accordance with various processes similar to those used in manufacturing a general semiconductor. The composite film 2, which is a part of the electronic component 1, is subsequently peeled from the support layer 11 and the microspacers 12 by the manufacturing, peeling, and mounting apparatus 80, and then mounted on a wiring substrate 90 (described later) in accordance with various processes similar to those used in manufacturing and mounting a general semiconductor.

[0045] Specifically, when the manufacturing peel-and-mounting apparatus 80 starts the manufacturing peel-and-mounting processing procedure RT1 (FIG. 2), it proceeds to the first step SP1, where it forms a support layer 11 on the formation substrate surface 10A of the formation substrate 10, as shown in FIGS. 3(A) and 6(A), and then proceeds to the next step SP2. Specifically, the manufacturing peel-and-mounting apparatus 80 forms a thin-film support layer 11 made of an inorganic material, for example, by using CVD (Chemical Vapor Deposition, not shown). At this time, the support layer surface 11A is formed to be extremely flat, just like the formation substrate surface 10A.

[0046] 3(B) and 6(B), the manufacturing peel-and-mounting apparatus 80 forms support holes 11H penetrating the support layer 11 in the Z direction at multiple locations in the support layer 11 by etching, and then proceeds to the next step SP3. Each support hole 11H has a circular shape when viewed from the Z direction.

[0047] In step SP3, the manufacturing peel-and-mounting apparatus 80 forms microspacers 12 at the locations of each support hole 11H, as shown in Figures 3(C) and 6(C), and then proceeds to the next step SP4. Specifically, the manufacturing peel-and-mounting apparatus 80 fills an organic material such as polyimide in an area surrounding each support hole 11H in the support layer 11 using a well-known process such as lithography. At this time, the manufacturing peel-and-mounting apparatus 80 fills the inside of the support hole 11H with the organic material and also causes it to slightly overflow, causing the organic material to protrude around the support hole 11H.

[0048] Hereinafter, the columnar portion of the microspacer 12 located within the support hole 11H will be referred to as the columnar portion 12P, and the portion formed above the columnar portion 12P and protruding in the X and Y directions beyond the columnar portion 12P will be referred to as the flange portion 12F. In other words, the diameter of the flange portion 12F is larger than that of the columnar portion 12P. Furthermore, the microspacer surface 12A is located above (in the Z direction) the support layer surface 11A.

[0049] 3(D) and 6(D), the manufacturing peel-and-mounting apparatus 80 forms the base film 13, and then proceeds to the next step SP5. Specifically, the manufacturing peel-and-mounting apparatus 80 performs a well-known patterning process, such as lithography, to form the thin-film base film 13 made of an organic material on the support layer surface 11A so as to cover each microspacer 12, and also form the connection holes 13H.

[0050] At this time, the back surface 13B of the base film 13 is formed in contact (adherence) with the support layer surface 11A, and is therefore formed extremely flat, similar to the support layer surface 11A. However, in the base film 13, where the microspacer 12 is formed, the portion corresponding to the flange portion 12F is recessed in the Z direction, forming a recess 13D.

[0051] In step SP5, the manufacturing, peeling, and mounting apparatus 80 provides the light-emitting element 14 on the base film 13, as shown in Figures 3(E) and 7(A), and then proceeds to the next step SP6. The light-emitting element 14 is separately manufactured by a predetermined LED manufacturing device (not shown) or the like. The manufacturing, peeling, and mounting apparatus 80 transfers the light-emitting element 14 to a predetermined location on the base film 13 by using a well-known transfer technique.

[0052] 3(F) and 7(B), the manufacturing peel-and-mounting apparatus 80 forms connection pads 15 near each connection hole 13H in the base film 13, and then proceeds to the next step SP7. Specifically, the manufacturing peel-and-mounting apparatus 80 deposits a thin film of a metal material such as gold (Au) or platinum (Pt) by, for example, lithography and vapor deposition in an area surrounding each connection hole 13H in the base film 13, to form the connection pads 15. At this time, the connection pad back surface 15B of the connection pad 15 is formed in contact (adherence) with the support layer surface 11A, similar to the base film back surface 13B of the base film 13, and therefore is extremely smooth.

[0053] In step SP7, the manufacturing peel-and-mount apparatus 80 forms an insulating film 16 from an insulating material so as to overlap a portion of the light-emitting element 14 and a portion of the base film 13, as shown in Figures 4(A) and 7(C), and then proceeds to the next step SP8. In step SP8, the manufacturing peel-and-mount apparatus 80 forms a wiring portion 17 from a conductive material so as to overlap a portion of the light-emitting element 14, a portion of the insulating film 16, and a portion of the connection pad 15, as shown in Figures 4(B) and 7(D), and then proceeds to the next step SP9. Incidentally, the manufacturing peel-and-mount apparatus 80 can use techniques such as photolithography and vapor deposition in steps SP7 and SP8.

[0054] 4(C) and 8(A), the manufacturing peel-and-mount apparatus 80 forms a cover layer 18 of an organic material so as to cover the upper side of the base film 13, etc., in step SP9, thereby completing the composite film 2, and then proceeds to the next step SP10. At this time, the composite film 2 is attached to the support layer surface 11A of the support layer 11.

[0055] 4(D) and 8(B), in step SP10, the manufacturing peel-and-mounting apparatus 80 removes a portion of the support layer 11 to form a support gap SG, and then proceeds to the next step SP11. Specifically, the manufacturing peel-and-mounting apparatus 80 performs an etching process that uses a predetermined chemical solution (etchant) such as fluorine or phosphoric acid to react with the inorganic material, and removes a portion of the support layer 11 except for the center of the composite film 2, thereby forming the support gap SG.

[0056] At this time, since the microspacers 12 are made of an organic material, they do not react with the etchant and remain between the formation substrate 10 and the base film 13. This allows each microspacer 12 to support the portion of the rear surface 2B of the composite film that is not supported by the support layer 11 at its respective position.

[0057] In this way, the manufacturing peel-and-mount apparatus 80 can manufacture the electronic structure 1 through steps SP1 to SP10. Hereinafter, these steps will be referred to as a manufacturing process group Q1.

[0058] 5(A), the manufacturing peel-and-mount device 80 adsorbs a stamp 81 having an adsorption function onto the composite film surface 2A, and then proceeds to the next step SP12. Here, the electronic structure 1 adsorbed by the stamp 81 is roughly divided into four types of objects, namely, the formation substrate 10, the support layer 11 and microspacers 12, the composite film 2, and the stamp 81, which are stacked in order in the Z direction.

[0059] Of these, the magnitude of the adsorptive force at three adjacent locations is different. As described above, a relatively large adsorptive force acts between the formation substrate 10 and the support layer 11, both of which are inorganic materials. Also, a relatively large adsorptive force acts between the stamp 81 and the composite film surface 2A, since the stamp 81 is in contact with the composite film surface 2A over almost the entire area.

[0060] On the other hand, a relatively small adhesive force acts between the support layer 11, which is an inorganic material, and the base film 13, which is an organic material, due to the sufficiently small area of ​​the support layer 11 and the action of van der Waals forces, etc. Also, a small adhesive force acts between the microspacer 12 and the base film 13 because the area of ​​the flange portion 12F of the microspacer 12 is sufficiently small.

[0061] In step SP12, the manufacturing peeling and mounting apparatus 80 displaces the stamp 81 in the Z direction while the formation substrate 10 is fixed by a predetermined fixing jig (not shown), and proceeds to the next step SP13. As a result, in the electronic structure 1 to which the stamp 81 is attached, the support layer 11 and the microspacers 12 are peeled off from the area with the weakest adhesive force, i.e., the base film 13, as shown in FIG. 5(B), and the composite film 2 is separated from the support layer 11, the microspacers 12, and the formation substrate 10.

[0062] Incidentally, the molecules of the base film 13 and the support layer 11 each form a structure with sufficient strength, so that the composite film 2 can have an extremely flat back surface 13B of the base film without a part of the base film 13 separating and remaining on the support layer 11 side, or a part of the support layer 11 separating and remaining attached to the base film 13 side.

[0063] In this way, the manufacturing peeling and mounting apparatus 80 can peel the composite film 2 of the electronic structure 1 from the formation substrate 10, the support layer 11, and the microspacers 12 through the processes of step SP11 and step SP12. Hereinafter, these processes will be referred to as peeling process group Q2.

[0064] In step SP13, the manufacturing peeling and mounting apparatus 80 displaces the stamp 81 as shown in FIG. 5(C) to position the composite film 2 above the wiring board 90 (on the Z direction side), and then proceeds to the next step SP14.

[0065] Here, wiring board 90 is separately manufactured as a circuit board mainly made of, for example, glass epoxy, and has mounting locations 91 where composite film 2 is to be mounted on wiring board surface 90A (hereinafter also referred to as wiring board surface), which is the surface on the Z direction side. Electrodes 92 are respectively arranged on mounting locations 91 at locations corresponding to each connection pad rear surface 15B on composite film rear surface 2B of composite film 2, and wiring patterns are appropriately formed using wiring material (not shown). Furthermore, wiring board surface 90A, which is the surface of wiring board 90, is formed extremely flat, with a surface roughness of 10 nm or less.

[0066] The manufacturing peeling and mounting device 80 appropriately moves the stamp 81 to position the rear surface 2B of the composite film at a location slightly away in the Z direction from the mounting location 91 on the surface 90A of the wiring board, and aligns the rear surface 15B of each connection pad with each electrode 92.

[0067] In step SP14, the manufacturing peeling and mounting device 80 displaces the stamp 81 in a direction approaching the wiring board 90, thereby attaching the composite film 2 to the wiring board 90, and then proceeds to the next step SP15.

[0068] Specifically, the manufacturing peel-and-mount device 80 first moves the stamp 81 in the -Z direction to bring the rear surface 2B of the composite film into contact with the mounting location 91 on the front surface 90A of the wiring board. This allows an intermolecular force to act between the composite film 2 and the wiring board 90, and the composite film 2 can be attached to the mounting location 91 of the wiring board 90.

[0069] At this time, both the rear surface 2B of the composite film 2 and the front surface 90A of the wiring board are extremely flat, and the entire area of ​​the rear surface 2B of the composite film 2 is in contact with the front surface 90A of the wiring board. Therefore, the adsorptive force acting between the composite film 2 and the wiring board 90 becomes relatively large and exceeds the adsorptive force of the stamp 81.

[0070] Thereafter, the manufacturing, peeling, and mounting apparatus 80 moves the stamp 81 in the Z direction. At this time, the stamp 81 is separated from the composite film 2 due to the magnitude of the suction force. As a result, the manufacturing, peeling, and mounting apparatus 80 can attach the composite film back surface 2B of the composite film 2 to the wiring board front surface 90A of the wiring board 90, that is, mount the composite film 2 on the wiring board 90.

[0071] In this way, the manufacturing peel-and-mount apparatus 80 can mount the composite film 2 on the wiring substrate 90 through steps SP13 and SP14. Hereinafter, these steps will be referred to as a mounting step group Q3.

[0072] In step SP15, the manufacturing, peeling, and mounting apparatus 80 ends the manufacturing, peeling, and mounting processing procedure RT1. For ease of explanation, hereinafter, the manufacturing process group Q1 from step SP1 to step SP10, the peeling process group Q2 of steps SP11 and SP12, and the mounting process group Q3 of steps SP13 and SP14 will be collectively referred to as the manufacturing, peeling, and mounting process group Q10.

[0073] The manufacturing process group Q1, peeling process group Q2, and mounting process group Q3 of the manufacturing, peeling, and mounting procedure RT1 have been described as being all performed by a single manufacturing, peeling, and mounting apparatus 80, i.e., the manufacturing of the electronic structure 1 and the peeling and mounting of the composite film 2 are all performed. However, in this embodiment, for example, the manufacturing process group Q1 can be performed by a specific manufacturing apparatus, and the peeling process group Q2 and the mounting process group Q3 can be performed by a mounting apparatus installed in a different location from the manufacturing apparatus. In this case, after the electronic structure 1 is completed by the manufacturing process group Q1, the electronic structure 1 can be transported from the manufacturing apparatus to the mounting apparatus.

[0074] [1-3. Effects, etc.] In the above-described configuration, the electronic structure 1 according to the first embodiment has the formation substrate 10 and support layer 11 laminated on the lower side made of inorganic materials, while the base film 13 and cover layer 18 of the composite film 2 laminated on the upper side made of organic materials. Furthermore, the electronic structure 1 is formed such that the outer shape of the support layer 11 is sufficiently smaller than the outer shape of the base film 13 (FIG. 1).

[0075] Therefore, in the electronic structure 1, the adhesive force acting between the rear surface 2B of the composite film and the front surface 11A of the support layer can be made smaller than the adhesive force at other locations. As a result, when a force is applied to the composite film 2 in a direction away from the formation substrate 10, the electronic structure 1 can easily separate and peel off the composite film 2 from the support layer 11 (FIGS. 5(A) and (B)).

[0076] In particular, the electronic structure 1 is made by sequentially laminating the formation substrate 10, the support layer 11, and the composite film 2, and then removing the outer periphery of the support layer 11 by etching, thereby adjusting the adhesive force acting between the composite film 2 and the support layer 11 (FIG. 1(B)). As a result, during storage or transportation of the electronic structure 1, the composite film 2 can be kept in a state of being adhered to the formation substrate 10 and the support layer 11, and the back surface 2B of the composite film can be kept smooth and not damaged.

[0077] However, in the electronic structure 1, the area of ​​the support layer 11 is reduced relative to the area of ​​the rear surface 2B of the composite film in order to adjust the adsorption force acting between the composite film 2 and the support layer 11 to an appropriate level. As a result, in the electronic structure 1, the distance from the support layer 11 to the outer periphery of the composite film 2 becomes relatively long, which may cause the outer periphery of the composite film 2 to sag.

[0078] Therefore, in the electronic structure 1, microspacers 12 are provided at multiple locations between the formation substrate 10 and the base film 13, slightly spaced from the support layer 11 (see FIG. 1, etc.). As a result, in the electronic structure 1, the locations of the composite film 2 that are not supported by the support layer 11, such as the areas near the periphery, can be properly supported by the microspacers 12. This makes it possible for the electronic structure 1 to prevent a portion of the composite film 2 from sagging in the -Z direction and adhering to the formation substrate 10.

[0079] In other words, by providing the microspacers 12, the electronic structure 1 can simultaneously reduce the area of ​​the support layer 11 to an extent that an appropriate adhesive force acts between the support layer 11 and the composite film 2, and maintain the composite film 2 separated from the formation substrate 10.

[0080] For example, in the electronic structure 1, if the thickness (length in the Z direction) of the composite film 2 is approximately 2 μm and the thickness of the support layer 11 is approximately 1 μm, the rear surface 2B of the composite film can be prevented from adhering to the surface 10A of the formation substrate within a range of 5 to 10 μm in the XY plane from the upper end of the microspacer 12.

[0081] Furthermore, the electronic structure 1 has circular support holes 11H formed in the support layer 11 made of an inorganic material, which are filled with an organic material that forms the microspacers 12 (steps SP2 and SP3 in FIG. 2, and FIGS. 3(B) and (C)). Therefore, in the process of removing a portion of the support layer 11 (step SP10 in FIG. 2, FIG. 4(D), etc.), the electronic structure 1 can be formed into a desired shape without melting the microspacers 12, simply by using an etchant that reacts with inorganic materials but not with organic materials.

[0082] In the electronic structure 1, if the amount of organic material filled in the support holes 11H (FIG. 2B) of the support layer 11 is insufficient, at least a portion of the upper surface (the surface facing the Z direction) of the microspacer 12 will be located below (in the -Z direction) the support layer surface 11A of the support layer 11. In this case, when the base film 13 is formed (FIG. 2D), part of the material will enter the support holes 11H, resulting in a shape in which part of the back surface 13B of the base film protrudes downward (in the -Z direction) from the surrounding area. In this case, the composite film 2 (FIG. 5B) separated from the formation substrate 10, etc., will have a portion of the back surface 13B of the base film protruding in the -Z direction from the surrounding area, resulting in an insufficient contact area with the wiring board surface 90A of the wiring board 90 (FIG. 5C), which may result in insufficient suction force.

[0083] In this regard, the electronic structure 1 is configured such that the organic material constituting the microspacer 12 is filled into the support hole 11H of the support layer 11 to the extent that it slightly overflows the support hole 11H, thereby forming a flange portion 12F on the microspacer 12 (FIG. 3(C)). This reliably prevents the formation of a portion on the back surface 13B of the base film that protrudes downward (toward the -Z direction) from the surrounding area, and allows a sufficiently large suction force to act between the composite film 2 and the wiring board 90 (FIG. 5(C)).

[0084] At this time, the presence of flange portion 12F forms recess 13D (FIG. 5(B)) on composite film back surface 2B of composite film 2, so the suction force with respect to wiring board surface 90A is reduced compared to when recess 13D is not present and the surface is flat. However, in composite film 2, the area of ​​flange portion 12F is extremely small compared to the overall area of ​​composite film back surface 2B (FIG. 6(C)), so the extent of the reduction in suction force is also minimal, allowing a sufficiently large suction force to act between composite film 2 and wiring board surface 90A.

[0085] Furthermore, in the electronic structure 1, the base film 13 and cover layer 18 of the composite film 2, which will ultimately be required, are made of organic materials, while the formation substrate 10 and support layer 11, which will ultimately be unnecessary, are made of inorganic materials. Therefore, by using an appropriate etchant in the etching process, the electronic structure 1 can remove the inorganic material without causing much damage to the organic material, i.e., it is possible to ensure the etching selectivity.

[0086] From another perspective, in the electronic structure 1, the organic material and the inorganic material are brought into contact with each other at the boundary between the support layer 11 and the base film 13, which will be peeled off in a later step, making the adhesive force between them relatively small. Therefore, in the electronic structure 1, in the peeling step group Q2 (FIGS. 2 and 5), simply by displacing the composite film front surface 2A away from the formation substrate 10, the support layer 11 and the base film 13 can be satisfactorily separated, and the composite film back surface 2B can be made extremely flat.

[0087] Furthermore, in the manufacturing process of the electronic structure 1, the surface of the formation substrate 10 is formed extremely smooth, and the support layer surface 11A of the support layer 11 superimposed on it is also formed extremely smooth, so that the base film back surface 13B of the base film 13 laminated on it is also formed extremely smooth.

[0088] That is, the rear surface 2B of the composite film 2 of the electronic structure 1 can be made extremely flat when the composite film 2 is peeled off from the formation substrate 10 and the support layer 11. As a result, the composite film 2 peeled off from the electronic structure 1 can generate a sufficiently large adsorptive force and obtain the necessary electrical continuity simply by being attached to the wiring board surface 90A of the wiring board 90.

[0089] Furthermore, in the manufacturing process, the composite film 2 is manufactured by sequentially laminating each portion on the surface of the formation substrate 10, which has been formed to be extremely flat (FIGS. 3 and 4). Therefore, the composite film 2 can be easily manufactured so that the rear surface 2B of the composite film is extremely flat, i.e., so that both the rear surface 13B of the base film and the rear surface 15B of the connection pads are extremely flat, without the need for a process for flattening the rear surface 2B of the composite film.

[0090] In other words, the electronic structure 1 can form an extremely smooth back surface 2B of the composite film through a much easier process than when an anchor is formed on the underside of the composite film and then removed to flatten it, as in Patent Document 1.

[0091] Furthermore, the connection pads 15 of the electronic structure 1 are made of a metal material that has an extremely low ionization tendency and is conductive, such as gold (Au) or platinum (Pt). Therefore, even if the etchant comes into contact with the connection pads 15 during an etching process that removes a portion of the support layer 11, the electronic structure 1 can minimize the degree of damage to the surface and maintain good smoothness.

[0092] Adhesives are sometimes used to bond two objects together. Some adhesives utilize intermolecular forces to achieve adhesion. Generally, adhesives are liquid and are applied to the surfaces of the two objects to be bonded, and are then cured while sandwiched between them to form a bond. When using such adhesives, in order to separate the bonded objects, the cured adhesive must be physically destroyed, which can damage the objects.

[0093] Furthermore, in many cases where electrical connection is required, such as between electrodes on a wiring board and electrodes on a device, a eutectic alloy is formed between the electrodes by bump connection. In this case, it is possible to remove the bump connection by, for example, laser removal, but this will cause considerable damage, especially to the electrodes on the wiring board.

[0094] In contrast, in the present embodiment, such adhesive is not used, and physical and electrical bonding is achieved by directly contacting composite film back surface 2B of composite film 2 with wiring board front surface 90A of wiring board 90, and allowing intermolecular force to act directly between them. Therefore, in the present embodiment, if a defective portion is detected after composite film 2 is mounted on wiring board 90, composite film 2 can be peeled off extremely easily with almost no damage to wiring board 90, and a new composite film 2 can be attached to the same location.

[0095] According to the above configuration, the electronic structure 1 according to the first embodiment has a configuration in which a support layer 11 is laminated on a formation substrate 10, and a composite film 2 is further laminated thereon, with the area of ​​the support layer 11 being smaller than the area of ​​the composite film 2, and further provided with a plurality of microspacers 12. As a result, the adhesive force acting between the composite film 2 and the support layer 11 of the electronic structure 1 can be appropriately adjusted so that they do not peel off during storage or transportation, and can be easily peeled off using a stamp 81 before mounting, and the rear surface 2B of the composite film can be prevented from sticking to the formation substrate 10. As a result, the electronic structure 1 can be easily stored and transported while maintaining the smoothness of the rear surface 2B of the composite film, and the composite film 2 can also be easily peeled off from the support layer 11 and mounted on a wiring board 90.

[0096] 2. Second Embodiment 9(A), which corresponds to FIG. 1(A), is a schematic plan view showing the configuration of an electronic structure 201 and a composite film 202 according to a second embodiment. FIG. 9(B), which corresponds to FIG. 1(B), is a schematic cross-sectional view showing the A21-A22 cross section of FIG. 9(A). In this second embodiment, the X, Y, and Z directions are defined in the same manner as in the first embodiment.

[0097] The electronic structure 201 differs from the electronic structure 1 according to the first embodiment in that it has a composite film 202 instead of the composite film 2, but is otherwise configured similarly. The composite film 202 differs from the composite film 2 according to the first embodiment in that it has a base film 213 instead of the base film 13, but is otherwise configured similarly.

[0098] This base film 213 differs from the base film 13 in the first embodiment in that it has a recess 213D instead of the recess 13D, but is otherwise configured in the same manner. This recess 213D is formed slightly larger than the recess 13D. Hereinafter, the recess 213D will also be referred to as a protective recess.

[0099] That is, in the electronic structure 1 according to the first embodiment (FIG. 1(B)), the surface forming the inner side surface of the recess 13D has almost the same shape as the surface forming the microspacer surface 12A. Therefore, in the electronic structure 1, almost the entire area of ​​the recess 13D is in close contact with the microspacer surface 12A.

[0100] In contrast, in the electronic structure 201 according to the second embodiment (FIG. 9(B)), the surface forming the inner side surface of the recess 213D has a larger radius of curvature than the surface forming the microspacer surface 12A. Therefore, in the electronic structure 201, the recess 213D is raised above the microspacer surface 12A, or a portion of the composite film 202 hangs down due to the action of gravity and abuts against a portion of the microspacer surface 12A. In other words, in the electronic structure 201, the microspacer surface 12A extends into the recess 213D, and a gap is formed between the recess 213D and the microspacer surface 12A.

[0101] Next, the manufacture of the electronic structure 201 and the peeling and mounting of the composite film 202 will be described with reference to FIGS. 10, 11, 12 and 13, which correspond to FIGS. 2, 3, 4 and 5, respectively.

[0102] The electronic structure 201 is manufactured by a manufacturing, peeling, and mounting apparatus 280 corresponding to the manufacturing, peeling, and mounting apparatus 80 in the first embodiment, by stacking each layer in stages on the formation substrate 10. The composite film 202 is subsequently peeled from the support layer 11 and the microspacers 12 by the manufacturing, peeling, and mounting apparatus 280, and then mounted on the wiring substrate 90.

[0103] Specifically, when the manufacturing peel-and-mounting apparatus 280 starts the manufacturing peel-and-mounting processing procedure RT201 (FIG. 10), it performs the same processes as steps SP1, SP2, and SP3 (FIG. 2) of the first embodiment in steps SP201, SP202, and SP203, respectively, and then proceeds to the next step SP204. As a result, the manufacturing peel-and-mounting apparatus 280 forms the support layer 11 on the formation substrate surface 10A of the formation substrate 10, forms support holes 11H at multiple locations in the support layer 11, and further forms multiple microspacers 12 (FIGS. 11(A), (B), and (C)).

[0104] 11(D), the manufacturing peel-and-mounting apparatus 280 forms a coating layer 221 on the upper side (Z direction side) of each microspacer 12, and then proceeds to the next step SP205. Specifically, the manufacturing peel-and-mounting apparatus 280 deposits a layer of an inorganic material similar to the support layer 11 in an area slightly wider than the flange portion 12F of each microspacer 12 by a well-known process such as lithography.

[0105] Thereafter, the manufacturing / peel-and-mounting apparatus 280 performs steps SP205 to SP211 (FIG. 10) similar to steps SP4 to SP10 (FIG. 2) of the first embodiment to manufacture the electronic structure 201, and then proceeds to the next step SP211. At this time, the manufacturing / peel-and-mounting apparatus 280 performs an etching process using a predetermined chemical solution (etchant) in step SP211, as shown in FIG. 12(D), to remove a portion of the support layer 11 to form a support gap SG and remove the coating layer 221. As a result, in the electronic structure 201, a gap is formed between the recess 213D of the base film 213 and the microspacer surface 12A, or a portion of the recess 213D is in contact with the microspacer surface 12A. That is, in the electronic structure 201, the microspacer surface 12A is embedded in the recess 213D.

[0106] In this way, the manufacturing / peel-and-mounting apparatus 280 according to the second embodiment can manufacture the electronic structure 201 through steps SP201 to SP211. Hereinafter, these steps will be referred to as a manufacturing process group Q201.

[0107] Thereafter, in steps SP212 to SP215, the manufacturing peeling and mounting apparatus 280 performs the same processes as steps SP11 to SP14 in the first embodiment, thereby peeling the composite film 202 from the formation substrate 10 etc. and mounting it on the wiring board 90. Hereinafter, the processes of steps SP212 and SP213 will be referred to as a peeling process group Q202, and the processes of steps SP214 and SP215 will be referred to as a mounting process group Q203.

[0108] In step SP216, the manufacturing, peeling, and mounting apparatus 280 ends the manufacturing, peeling, and mounting processing procedure RT201. For ease of explanation, the manufacturing process group Q201 from step SP201 to step SP211, the peeling process group Q202 from step SP212 and step SP213, and the mounting process group Q203 from step SP214 and step SP215 will hereinafter be collectively referred to as the manufacturing, peeling, and mounting process group Q210.

[0109] In the above configuration, the electronic structure 201 according to the second embodiment, like the first embodiment, is configured such that microspacers 12 are provided at multiple locations between the formation substrate 10 and the base film 213, each slightly spaced from the support layer 11 (see FIG. 9, etc.). As a result, in the electronic structure 201, like the first embodiment, the locations of the composite film 202 that are not supported by the support layer 11 can be properly supported by the microspacers 12, and it is possible to prevent the composite film 202 from sagging in the -Z direction and adhering to the formation substrate 10.

[0110] In addition, in the electronic structure 201, a gap is formed between the recess 213D of the base film 213 and the upper surface of the microspacer 12, or a part of the recess 213D is made to abut against the upper surface of the microspacer 12. As a result, in the electronic structure 201, when the composite film 202 is peeled off from the formation substrate 10 or the like (FIG. 13(B)), the microspacer 12 can be easily separated from the back surface 202B of the composite film, and the microspacer 12 can be effectively prevented from being accidentally peeled off from the formation substrate 10.

[0111] In the manufacturing process of the electronic structure 201, the covering layer 221 covering the top surface of the microspacer 12 is made of the same inorganic material as the support layer 11 (FIG. 11(D)). Therefore, compared to the first embodiment, the electronic structure 201 requires an additional step of providing the covering layer 221, but the covering layer 221 can be removed together with part of the support layer 11 by etching, so no additional step is required.

[0112] In other respects as well, the electronic structure 201 according to the second embodiment can achieve the same effects as the electronic structure 1 according to the first embodiment.

[0113] 3. Third Embodiment 1(A) and 14(A) are schematic plan views showing the configuration of an electronic structure 301 and a composite film 2 according to a third embodiment. 14(B) and 14(B) are schematic cross-sectional views showing the A31-A32 cross section of FIG. 14(A). In this third embodiment, the X, Y, and Z directions are defined in the same manner as in the first embodiment.

[0114] The electronic structure 301 differs from the electronic structure 1 according to the first embodiment in that it has a formation substrate 310 and microspacers 312 instead of the formation substrate 10 and microspacers 12, but is otherwise configured similarly. The formation substrate 310 differs from the formation substrate 10 according to the first embodiment in that substrate recesses 310D are formed at the locations where the microspacers 312 are provided, but is otherwise configured similarly.

[0115] The microspacer 312 differs from the microspacer 12 of the first embodiment in that the root portion 312R is provided below (toward the -Z direction) the formation substrate surface 310A of the formation substrate 310, and the root portion 312R extends into the substrate recess 310D, but is otherwise configured in the same manner.

[0116] Next, the manufacture of the electronic structure 301 and the peeling and mounting of the composite film 2 will be described with reference to FIGS. 15, 16, 17, and 18, which correspond to FIGS. 2, 3, 4, and 5, respectively.

[0117] The electronic structure 301 is manufactured by a manufacturing, peeling, and mounting apparatus 380 corresponding to the manufacturing, peeling, and mounting apparatus 80 in the first embodiment, by stacking each layer in stages on a formation substrate 310. The composite film 2 is subsequently peeled from the support layer 11 and the microspacers 312 by the manufacturing, peeling, and mounting apparatus 380, and then mounted on the wiring substrate 90.

[0118] Specifically, when the manufacturing peel-and-mounting apparatus 380 starts the manufacturing peel-and-mounting processing procedure RT301 (FIG. 15), it performs the same processes as steps SP1 and SP2 in the first embodiment in steps SP301 and SP302, respectively, and then proceeds to the next step SP303. As a result, the manufacturing peel-and-mounting apparatus 380 forms the support layer 11 on the formation substrate surface 310A of the formation substrate 310, and forms support holes 11H at multiple locations in the support layer 11 (FIGS. 16(A) and 16(B)).

[0119] 16(C), the manufacturing peel-and-mount apparatus 380 forms substrate recesses 310D in the formation substrate 310 at locations directly below each support hole 11H by etching, and then proceeds to the next step, SP304. As a result, each support hole 11H becomes a space that communicates with the substrate recesses 310D formed below it.

[0120] Furthermore, in the substrate recess 310D formed at this time, the outer diameter of a virtual cross section parallel to the XY plane is larger at a lower substrate recess portion 310DL located below an upper substrate recess portion 310DU located near the formation substrate surface 310A. For example, the outer diameter of the substrate recess 310D at the upper substrate recess portion 310DU is approximately 5.1 μm, while the outer diameter at the lower substrate recess portion 310DL is approximately 6.1 μm. Hereinafter, the upper substrate recess portion 310DU will also be referred to as a first substrate recess portion, and the lower substrate recess portion 310DL will also be referred to as a second substrate recess portion.

[0121] In step SP304, the manufacturing / peel-and-mounting apparatus 380 fills the support holes 11H with an organic material to form microspacers 312, as in step SP3 of the first embodiment, as shown in FIG. 16(D). The manufacturing / peel-and-mounting apparatus 380 then proceeds to the next step SP305. At this time, the manufacturing / peel-and-mounting apparatus 380 fills the support holes 11H and the substrate recesses 310D with the organic material, thereby forming root portions 312R in the microspacers 312. The outer diameter of the root portion 312R is larger at the lower portion located within the lower substrate recess 310DL than at the upper portion. Furthermore, as in the first embodiment, the organic material protrudes around the support holes 11H, forming flange portions 312F in the microspacers 312.

[0122] Thereafter, the manufacturing, peeling and mounting apparatus 380 performs the same processes as steps SP4 to SP10 (FIG. 2) in the first embodiment in steps SP305 to SP311 (FIG. 15), thereby manufacturing the electronic structure 301, and proceeds to the next step SP311.

[0123] In this way, the manufacturing / peel-and-mounting apparatus 380 according to the third embodiment can manufacture the electronic structure 301 through steps SP301 to SP311. Hereinafter, these steps will be referred to as a manufacturing process group Q301.

[0124] Thereafter, in steps SP312 to SP315, the manufacturing peeling and mounting apparatus 380 performs the same processes as steps SP11 to SP14 in the first embodiment, thereby peeling the composite film 2 from the formation substrate 310 etc. and mounting it on the wiring board 90. Hereinafter, the processes of steps SP312 and SP313 will be referred to as a peeling process group Q302, and the processes of steps SP314 and SP315 will be referred to as a mounting process group Q303.

[0125] In step SP316, the manufacturing, peeling, and mounting apparatus 380 ends the manufacturing, peeling, and mounting processing procedure RT301. For ease of explanation, the manufacturing process group Q301 from step SP301 to step SP311, the peeling process group Q302 from step SP312 and step SP313, and the mounting process group Q303 from step SP314 and step SP315 will hereinafter be collectively referred to as the manufacturing, peeling, and mounting process group Q310.

[0126] In the above configuration, the electronic structure 301 according to the third embodiment, like the first embodiment, is provided with microspacers 312 at multiple locations between the formation substrate 310 and the base film 13, each slightly spaced from the support layer 11 (see FIG. 14, etc.). As a result, like the first embodiment, in the electronic structure 301, the locations of the composite film 2 that are not supported by the support layer 11 can be properly supported by the microspacers 312, and it is possible to prevent the composite film 2 from sagging in the -Z direction and sticking to the formation substrate 10.

[0127] In addition, in the electronic structure 301, a substrate recess 310D is provided in the formation substrate 310, and the roots 312R of the microspacers 312 are formed in the substrate recess 310D. This effectively prevents the microspacers 312 from accidentally peeling off from the formation substrate 310 while still adhering to the rear surface 2B of the composite film when the composite film 2 is peeled off from the formation substrate 310 or the like (FIG. 18(B)).

[0128] Furthermore, in the electronic structure 301, the outer diameter of the substrate recess 310D in a virtual cross section parallel to the XY plane is larger at the lower substrate recess portion 310DL than at the upper substrate recess portion 310DU (FIG. 16(C)). Therefore, in the electronic structure 301, the root portion 312R of the microspacer 312 can be reliably prevented from slipping out of the substrate recess 310D in the Z direction.

[0129] In other respects as well, the electronic structure 301 according to the third embodiment can achieve the same effects as the electronic structure 1 according to the first embodiment.

[0130] 4. Fourth Embodiment Figure 19(A), which corresponds to Figure 1(A), is a schematic plan view showing the configuration of an electronic structure 401 and a composite film 2 according to a fourth embodiment. Figure 19(B), which corresponds to Figure 1(B), is a schematic cross-sectional view showing the A41-A42 cross section of Figure 19(A). In this fourth embodiment, the X, Y, and Z directions are defined in the same way as in the first embodiment.

[0131] The electronic structure 401 is different from the electronic structure 1 according to the first embodiment in that it has support layers 411 (411R, 411G, and 411B) instead of the support layer 11, but is otherwise configured similarly. The support layer 411 differs from the support layer 11 according to the first embodiment in that support layers 411R, 411G, and 411B are formed in three locations directly below the light emitting elements 14R, 14G, and 14B, respectively.

[0132] That is, in the electronic structure 401, the area of ​​the portion of the support layer 11 that is not removed in the etching process (FIG. 4(D)) is larger than that of the electronic structure 1 according to the first embodiment. Therefore, in the electronic structure 401, the time required for the etching process can be shortened compared to the first embodiment, and the manufacturing efficiency of the electronic structure 401 can be improved.

[0133] In other respects as well, the electronic structure 401 according to the fourth embodiment can achieve the same effects as the electronic structure 1 according to the first embodiment.

[0134] 5. Fifth Embodiment Fig. 20(A) is a schematic plan view showing the configuration of an electronic structure 501 according to a fifth embodiment. Fig. 20(B) is a schematic cross-sectional view showing the A51-A52 cross section of Fig. 20(A). The electronic structure 501 has a configuration in which a plurality of support layers 11 are provided on a formation substrate 510, and a plurality of composite films 2 are respectively attached to the upper sides of the support layers 11.

[0135] The formation substrate 510 is similar to the formation substrate 10 (FIG. 1, etc.) in the first embodiment in that the constituent materials and the surface on the Z direction side are extremely smooth. However, the formation substrate 510 is significantly larger than the formation substrate 10 in the X and Y directions.

[0136] On the upper side (Z direction side) of the formation substrate 510, multiple composite films 2 are arranged in a grid pattern along the X and Y directions. Each composite film 2 forms a film gap FG at adjacent locations in the X and Y directions, with the distance d between them. Each support layer 11 is configured in the same way as in the first embodiment, and a support gap SG is formed around each support layer 11.

[0137] This electronic structure 501 is manufactured in stages by the same procedures as the manufacturing process group Q1 (FIG. 2) in the first embodiment, at multiple locations on the upper side of the formation substrate 510. At this time, the electronic structure 501 is manufactured in stages by a manufacturing, peel-and-mounting apparatus 580 (described in detail later) that replaces the manufacturing, peel-and-mounting apparatus 80.

[0138] Next, the manufacturing peeling and mounting apparatus 580 performs the same procedures as the peeling process group Q2 (FIG. 2) in the first embodiment in parallel for each composite film 2 of the electronic structure 501, as shown in FIG. 21(A) corresponding to FIG. 5(B).

[0139] Specifically, the manufacturing peeling and mounting device 580 adsorbs each composite film 2 onto a stamp 581 and peels them in parallel from each support layer 11. At this time, each composite film 2 maintains a state of being aligned in a lattice pattern on the XY plane, and the distance between each composite film 2 is maintained at distance d.

[0140] Next, the manufacturing, peeling, and mounting apparatus 580 performs in parallel the same procedures as the mounting process group Q3 (FIG. 2) in the first embodiment. Specifically, as shown in FIG. 21(B), the manufacturing, peeling, and mounting apparatus 580 attaches and mounts each composite film 2 to a plurality of mounting locations 591 provided on the wiring board surface 590A of the wiring board 590, and then peels the stamp 581 away from each composite film 2.

[0141] As a result, each composite film 2 has its rear surface 2B mounted on a mounting location 591 on the wiring board surface 590A, and connection pads 15 (FIG. 1, etc.) are electrically connected to electrodes 592 of the wiring board 590. At this time, the composite films 2 remain aligned in a grid pattern on the XY plane, and the distance between each composite film 2 remains at distance d. Incidentally, the wiring board 590 on which each composite film 2 is mounted is, for example, a display panel incorporated into an LED display device, and one composite film 2 corresponds to one picture element (pixel).

[0142] In the above configuration, electronic structure 501 according to the fifth embodiment has a plurality of support layers 11 and composite films 2 arranged in a grid pattern on the surface of formation substrate 510 (FIG. 20). Manufacturing peeling and mounting device 580 adsorbs each composite film 2 onto stamp 581, peels them off simultaneously from each support layer 11, and attaches each composite film to each mounting location 591 on wiring substrate 590 (FIG. 21).

[0143] In other words, the electronic structure 501 allows multiple composite films 2 to be mounted on a wiring board by simply performing a single peeling process and mounting process, thereby significantly improving work efficiency compared to the first embodiment.

[0144] Furthermore, the manufacturing, peeling, and mounting apparatus 580 adheres the multiple composite films 2 to the stamp 581, and maintains the arrangement of the composite films 2 until the composite films 2 are attached to the wiring substrate 590. That is, the composite films 2 are maintained in a grid-like arrangement, and the distance d between the composite films 2 is also maintained.

[0145] If the manufacturing, peeling, and mounting device uses stamp 81 (FIG. 5) according to the first embodiment, the device will repeatedly peel off each composite film 2 from formation substrate 510 one by one and attach it to each mounting location 591 on wiring board 590. At this time, the manufacturing, peeling, and mounting device needs to align the position of composite film 2 with each mounting location 591 on wiring board 590.

[0146] In particular, when the wiring substrate 590 is a display panel and each composite film 2 represents one pixel, extremely high precision alignment is required when mounting the composite film 2. However, in the mounting process using a manufacturing peel-and-mount device, misalignment may occur, and alignment may take time.

[0147] In this regard, electronic structure 501 according to the present embodiment can appropriately set the positions of each composite film 2 and support layer 11 on formation substrate 510 in advance, in accordance with the arrangement and spacing of each mounting location 591 on wiring board 590. In other words, electronic structure 501 can optimize the spacing between each composite film 2 on formation substrate 510 with the positional accuracy of exposure processing or the like in the semiconductor manufacturing process, and can mount each composite film 2 on wiring board 590 while maintaining this spacing.

[0148] In other words, by using the stamp 581 (Figure 21) of the manufacturing peeling and mounting device 580, the electronic structure 501 can mount each composite film 2 to the wiring board with extremely high positional accuracy in an extremely short time required for a single peeling and mounting process.

[0149] In other respects as well, the electronic structure 501 according to the fifth embodiment can achieve the same effects as the first embodiment.

[0150] 6. Other Embodiments In the first embodiment described above, the flange portion 12F is formed on the microspacer 12 (see FIG. 2, etc.). However, the present invention is not limited to this. For example, the flange portion 12F may be omitted. In this case, for example, in the step shown in FIG. 3(C), the organic material may be filled up to a height equivalent to the upper end of the support hole 11H, or the portion of the support layer 11 that protrudes above (in the Z direction) the support layer surface 11A may be removed. Furthermore, the upper end of the microspacer 12, i.e., the end portion on the Z direction side, may be positioned above (in the Z direction) a position 10 nm below (in the -Z direction) the support layer surface 11A to ensure smoothness on the back surface 13B of the base film. The same applies to the second to fifth embodiments.

[0151] In the first embodiment described above, the microspacer 12 is formed in a substantially cylindrical shape, and the multiple microspacers 12 provided in the electronic structure 1 have the same shape (see FIG. 1, etc.). However, the present invention is not limited to this. For example, the microspacer 12 may be formed in a cylindrical shape having various cross-sectional shapes, such as an elliptical or rectangular column. Alternatively, the microspacer 12 may have a shape whose cross-sectional shape changes depending on the position in the Z direction, such as by gradually becoming thicker or thinner toward the Z direction. Furthermore, the multiple microspacers 12 provided in the electronic structure 1 may be a combination of multiple shapes. The same applies to the second to fifth embodiments.

[0152] Furthermore, in the first embodiment described above, the support layer 11 is abutted near the center of the back surface 2B of the composite film, and two microspacers 12 are arranged at positions on opposite sides of the support layer 11 (FIGS. 1(A) and (B)). However, the present invention is not limited to this. For example, the support layer 11 may be provided near the outer periphery of the back surface 2B of the composite film, and the microspacers 12 may be arranged in other positions, so that the support layer 11 and the microspacers 12 are abutted at any position on the back surface 2B of the composite film. The same applies to the second to fifth embodiments.

[0153] Furthermore, in the first embodiment described above, the electronic structure 1 is provided with 12 microspacers 12 (FIG. 1, etc.). However, the present invention is not limited to this, and the electronic structure 1 may be provided with 11 or less or 13 or more microspacers 12. The same applies to the second to fifth embodiments.

[0154] Furthermore, in the second embodiment described above, in the step shown in FIG. 11(D), the coating layer 221 is provided so as to cover an area slightly larger than the flange portion 12F of the microspacer 12. However, the present invention is not limited to this. For example, the coating layer 221 may be provided so that at least a portion thereof extends outside the flange portion 12F. The key point is that, compared to the first embodiment (FIG. 1, etc.), it is sufficient to reduce the contact area between the microspacer 12 and the base film 213 after removal of the coating layer 221 and thereby reduce the adhesive force acting between them. Furthermore, in this case, since at least a portion of the coating layer 221 is in direct contact with the support layer 11, the coating layer 221 can also be removed when removing a portion of the support layer 11 by erosion with an etchant.

[0155] 16C, the outer diameter of the lower substrate recess portion 310DL may be larger than the outer diameter of the upper substrate recess portion 310DU. However, the present invention is not limited to this. For example, the outer diameter of the lower substrate recess portion 310DL may be equal to the outer diameter of the upper substrate recess portion 310DU, or the outer diameter of the lower substrate recess portion 310DL may be smaller. The key point is that, compared to the first embodiment, the contact area between the microspacer 312 and the formation substrate 310 may be increased, making the microspacer 312 less likely to come off the formation substrate 310.

[0156] Furthermore, in the first embodiment described above, the base film 13 and cover layer 18 of the composite film 2 and the microspacers 12 are made of organic materials, the support layer 11 is made of inorganic material, and a portion of the support layer 11 is removed by etching. However, the present invention is not limited to this. For example, the composite film may be protected by an inorganic material, the microspacers 12 may also be made of inorganic material, and the support layer 11 may be made of organic material, and a portion of the support layer 11 may be removed by etching. In this case, the etching may be, for example, dry etching using oxygen (O2). The same applies to the second to fifth embodiments.

[0157] Furthermore, in the first embodiment described above, in the step shown in Fig. 4(D), a case has been described in which a part of the support layer 11 is left while the other part is removed by etching. However, the present invention is not limited to this, and for example, the entire support layer 11 may be removed. The same applies to the second to fifth embodiments.

[0158] Furthermore, in the first embodiment described above, a silicon substrate made of silicon (Si), a glass substrate, a sapphire substrate, or the like is used as the formation substrate 10. However, the present invention is not limited to this, and substrates made of various other inorganic materials may also be used as the formation substrate 10. In this case, it is sufficient that the surface of the formation substrate 10 is formed extremely smooth, for example, with a surface roughness of 10 nm or less. The same applies to the second to fifth embodiments.

[0159] Furthermore, in the first embodiment described above, the support layer 11 is configured as an oxide film or nitride film made of silicon oxide (SiO2) or silicon nitride (SiN). However, the present invention is not limited to this, and the support layer 11 may be configured as a thin film made of various oxides, nitrides, or other inorganic materials. In this case, it is sufficient that the support layer surface 11A can be formed extremely smooth and that a portion of it can be removed by etching in step SP10 of the manufacturing peel-and-mount processing procedure RT1 (FIG. 2) to form the support gap SG. The same applies to the second to fifth embodiments.

[0160] Furthermore, in the first embodiment described above, the length of each side of the composite film 2 along the X and Y directions is approximately 30 to 50 μm, and the outer shape of the support layer 11 is positioned significantly inward from the outer shape of the composite film 2. However, the present invention is not limited to this, and various other sizes may be used, for example, the length of each side of the composite film 2 along the X and Y directions is approximately 1 to 2 mm, and the outer shape of the support layer 11 may be positioned approximately 20 μm inward from the outer shape of the composite film 2. The same applies to the second to fifth embodiments.

[0161] Furthermore, in the first embodiment described above, the connection pads 15 are described as being made of gold (Au) or platinum (Pt). However, the present invention is not limited to this. For example, the connection pads 15 may be made of a conductive metal material such as copper (Cu) or aluminum (Al), or an alloy of multiple materials. In these cases, it is desirable to select an etching solution that will damage the surfaces of the connection pads 15 as little as possible in step SP10 of the manufacturing peel-mounting processing procedure RT1 (FIG. 2). The same applies to the second to fifth embodiments.

[0162] Furthermore, in the first embodiment described above, the microspacers 12 are made solely of an organic material such as polyimide resin. However, the present invention is not limited to this. For example, the microspacers 12 may be made of a mixed material containing an organic material as the main component and an inorganic filler, etc., for the purpose of improving various properties. In this case, the ratio of inorganic material to organic material is preferably about 10% or less by volume. The same applies to the base film 13 and the cover layer 18. Furthermore, the support layer 11 and the formation substrate 10 may be made solely of an inorganic material, or may be made of a mixed material containing an inorganic material as the main component and an organic filler, etc. The same applies to the second to fifth embodiments.

[0163] Furthermore, in the first embodiment described above, the formation substrate 10 is described as being made solely of inorganic materials. However, the present invention is not limited to this. For example, various processing treatments, such as coating, may be applied to the surface of the inorganic material to improve various properties, such as smoothness. Furthermore, the formation substrate 10 may have a multi-layer structure in which multiple types of materials are appropriately laminated, rather than a single-layer structure made of one type of material. Alternatively, various processing treatments may be applied to the surfaces of organic materials, such as the microspacer 12, base film 13, and cover layer 18. The same applies to the second to fifth embodiments.

[0164] Furthermore, in the first embodiment described above, a liquid etching solution is used to remove a portion of the support layer 11 in step SP10 of the manufacturing peel-and-mount processing procedure RT1 (FIG. 2). However, the present invention is not limited to this, and a gaseous etching gas may be used to remove a portion of the support layer 11. In this case, it is sufficient that the microspacers 12 remain. The same applies to the second to fifth embodiments.

[0165] Furthermore, in the first embodiment described above, the composite film 2 is provided with three light-emitting elements 14, each emitting a different light color (see FIG. 1, etc.). However, the present invention is not limited to this, and for example, the composite film 2 may be provided with two or fewer or four or more light-emitting elements 14. In this case, the light-emitting elements may emit different light colors, or at least some of them may emit the same light color. Furthermore, the arrangement of the light-emitting elements 14 is not limited to a straight line along the X direction, and various arrangements may be used. The same applies to the second to fifth embodiments.

[0166] Furthermore, in the first embodiment described above, the case where light-emitting elements 14 (i.e., LEDs) are provided on the composite film 2 has been described (FIG. 1, etc.). However, the present invention is not limited to this, and the composite film 2 may be provided with various elements having various electronic functions, such as resistors, capacitors, or electronic elements such as light-receiving elements, piezoelectric elements, and various sensor elements, or semiconductor elements such as transistors and ICs (Integrated Circuits). In this case, multiple electronic elements may be provided on one composite film 2, and electronic elements of the same or different types may be appropriately combined. The same applies to the second to fifth embodiments.

[0167] Furthermore, in the first embodiment described above, two connection pads 15 are associated with one light emitting element 14 in the composite film 2 (see FIG. 1, etc.). However, the present invention is not limited to this, and one electronic element may be associated with any number of connection pads or lower electrodes. The same applies to the second to fifth embodiments.

[0168] Furthermore, in the first embodiment described above, wiring board 90 is described as a circuit board mainly made of glass epoxy. However, the present invention is not limited to this, and various circuit boards, such as a film-like flexible circuit board, may be used as wiring board 90. In this case, it is sufficient that the surface of the circuit board is formed extremely smooth so that composite film 2 can be adsorbed. The same applies to the second to fifth embodiments.

[0169] Furthermore, in the fifth embodiment described above, the composite films 2 in the electronic structure 501 are arranged in a grid pattern on the XY plane (FIG. 20). However, the present invention is not limited to this, and the composite films 2 may be arranged in various patterns, such as a staggered pattern. The key is that each composite film 2 is arranged in a position corresponding to each mounting location 591 on the wiring board 590.

[0170] Furthermore, in the above-described fifth embodiment, the case where the interval between the composite films 2 is set to the distance d in both the X direction and the Y direction has been described. However, the present invention is not limited to this. For example, the interval in the X direction and the interval in the Y direction may be different, or the composite films 2 may be arranged at irregular intervals. In this case, too, it is essential that each composite film 2 is arranged at a position corresponding to each mounting location 591 on the wiring board 590.

[0171] Furthermore, the present invention is not limited to the above-described embodiments and other embodiments. That is, the present invention also covers embodiments that arbitrarily combine all or part of the above-described embodiments with the other embodiments, or embodiments that extract parts of the above-described embodiments. Specifically, for example, the second and third embodiments may be combined to form the root portion 312R of the microspacer 312, and the covering layer 221 may be removed together with part of the support layer 11 after the covering layer 221 is formed.

[0172] Furthermore, in the above-described embodiment, the electronic structure 1 is configured by the formation substrate 10 as the substrate, the composite film 2 as the functional element unit, the support layer 11 as the support portion, and the microspacers 12 as the protrusions. However, the present invention is not limited to this, and the electronic structure may be configured by a substrate, a functional element unit, a support portion, and a protrusion having various other configurations. [Industrial Applicability]

[0173] The present invention can be used, for example, when manufacturing a display panel to be incorporated into an LED display device. [Explanation of symbols]

[0174] 1, 201, 301, 401, 501...Electronic structure, 2, 202...Composite film, 2B, 202B...Back surface of composite film, 10, 310, 510...Forming substrate, 10A, 310A...Forming substrate surface, 11, 411...Support layer, 11A...Support layer surface, 11H...Support hole, 12, 312...Microspacer, 12A...Microspacer surface, 12F, 312F...Flange portion, 12P...Columnar portion, 13, 213...Base film, 1 4...light-emitting element, 15...connection pad, 18...cover layer, 80, 280, 380, 580...manufacturing peel-and-mount apparatus, 90, 590...wiring board, 90A, 590A...wiring board surface, 213D...recess, 221...covering layer, 310D...board recess, 310DL...portion within lower board recess, 310DU...portion within upper board recess, 312R...root, 510...forming board, 591...mounting location, 592...electrode, SG...support gap, d...distance.

Claims

1. a substrate having a first surface; a functional element unit including a functional element having an electronic function and a protective member covering the functional element, the functional element unit having a second surface opposite to the first surface; a protrusion protruding from the first surface toward the second surface; and The functional element unit comprises: a recessed portion on the second surface at a position facing the protruding portion; The protrusion is a third surface formed smaller than the area of ​​the second surface and recessed into the recess of the second surface; An electronic structure comprising:

2. The protrusion abuts against the inner surface of the recess.

2. The electronic structure of claim 1.

3. At least a portion of the inner surface of the recess is spaced from the protrusion.

2. The electronic structure of claim 1.

4. The protective member has insulating properties, The recess is formed in the protective member.

4. The electronic structure according to claim 1, wherein the first and second electrodes are electrically connected to each other.

5. the substrate has a substrate recess recessed from the first surface, The protrusion has a root located within the substrate recess. The electronic structure according to any one of claims 1 to 4.

6. The substrate recess is a location within a first substrate recess spaced from the first surface; a second substrate recessed portion located farther from the first surface than the first substrate recessed portion; and The diameter of the second substrate recess in a cross section parallel to the first surface is larger than the diameter of the first substrate recess in a cross section parallel to the first surface.

6. The electronic structure of claim 5.

7. At least two or more of the protrusions are provided.

7. The electronic structure according to claim 1, wherein the first and second electrodes are electrically connected to each other.

8. a step of separating the functional element unit from the protrusion in the electronic structure according to any one of claims 1 to 7; transferring the functional element unit to a substrate different from the substrate; A method for manufacturing an electronic circuit having the above structure.

9. A first step of forming a substrate having a first surface; a second step of forming a support on the first surface of the substrate; a third step of forming a protrusion on the first surface of the substrate using a material different from that of the support; a fourth step of forming a functional element unit on the support portion and the protrusion portion, the functional element unit including a functional element having an electronic function and a protective member covering the functional element; a fifth step of removing the support; and a second surface of the functional element unit facing the first surface has a recess at a position facing the protrusion, The protrusion has a third surface that is smaller in area than the second surface and that is recessed into the recess of the second surface. A method for manufacturing an electronic structure comprising the steps of:

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