Exposure apparatus, measurement method, and article manufacturing method

Abstract

To measure an original mark with high accuracy. [Solution] An exposure apparatus that transfers a pattern of an original onto a substrate, comprising: an original stage on which an original holder that holds the original is mounted; a measurement unit that irradiates measurement light onto an original mark provided on the original and measures the measurement light reflected by the original mark; a shading unit that blocks the measurement light; and a control unit that controls the driving of the shading unit, wherein the control unit controls the shading unit, which is positioned at a position that does not block the measurement light, so that the shading unit blocks the measurement light that has passed through the original mark at the timing when the measurement unit measures the original mark.

Description

[Technical Field]

[0001] The present invention relates to an exposure apparatus, a measurement method, and a method for manufacturing an article. [Background technology]

[0002] One type of lithography equipment used in the manufacturing process of semiconductor devices, flat panel displays (FPDs), etc. is an exposure apparatus that transfers the pattern of a master mounted on a master stage onto a substrate. In an exposure apparatus, to transfer the pattern of the master onto the substrate with high precision, the positional deviation of the master relative to the master stage can be measured by detecting a reference mark on the master stage and a master mark on the master using a scope.

[0003] Exposure apparatuses are required to mount various types of originals on their stages. In this case, the relative positions of the reference marks and original marks when the original is mounted on the original stage may differ depending on the type of original. Therefore, it is required to accurately measure the positional deviation of the original relative to the stage depending on the type of original mounted on the stage.

[0004] Patent Document 1 describes that an original smaller than the standard size of an original that can be mounted on a stage is mounted on the stage by using a holder that holds the peripheral portion of the original. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Laid-Open No. 2003-007609 Summary of the Invention [Problem to be solved by the invention]

[0006] In Patent Document 1, the positional deviation of the holder relative to the stage is measured by detecting a mark provided on the holder and a reference mark on the original stage, and the positional deviation of the original relative to the stage is determined based on the measurement results. However, since the relative positions of the holder and the original may be shifted when the original is mounted on the stage using the holder, the method described in Patent Document 1 may not be able to accurately measure the positional deviation of the original relative to the stage. [Means for solving the problem]

[0007] In order to achieve the above-mentioned object, an exposure apparatus as one aspect of the present invention is an exposure apparatus that transfers a pattern of an original onto a substrate, and includes: an original stage on which an original holder that holds the original is mounted; a measurement unit that irradiates measurement light onto an original mark provided on the original and measures the measurement light reflected by the original mark; a shading unit that blocks the measurement light; and a control unit that controls the driving of the shading unit, wherein the control unit controls the shading unit, which is positioned at a position that does not block the measurement light, so that the shading unit blocks the measurement light that has passed through the original mark at the timing when the measurement unit measures the original mark. [Effects of the Invention]

[0008] According to the present invention, it is possible to provide an exposure apparatus that is advantageous in measuring original marks with high precision. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 1 is a schematic diagram showing the configuration of an exposure apparatus. [Figure 2] FIG. 2 is a perspective view showing the configuration of an original holder. [Figure 3] FIG. 2 is a side view showing the configuration of the master holder. [Figure 4] FIG. 10 is a diagram for explaining the position of a mark. [Figure 5] 10 is a flowchart of alignment measurement. [Figure 6]1 is a flowchart of a method for manufacturing an article. DETAILED DESCRIPTION OF THE INVENTION

[0010] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings. In the drawings, the same reference numerals are used to designate the same components, and redundant explanations will be omitted.

[0011] In this specification and the accompanying drawings, directions are indicated in an XYZ coordinate system, with the X direction and Y direction being mutually orthogonal directions in a plane parallel to the holding surface of the master stage that holds the master. The directions parallel to the X-axis, Y-axis, and Z-axis in the XYZ coordinate system are the X direction, Y direction, and Z direction, respectively. Control and drive (movement) along the X-axis, Y-axis, and Z-axis refer to control or drive (movement) along the direction parallel to the X-axis, Y-axis, and Z-axis, respectively.

[0012] This embodiment will be described. An exposure apparatus is known as one type of lithography apparatus used in the manufacturing processes of semiconductor devices, flat panel displays (FPDs), and the like. An exposure apparatus performs an exposure process in which a pattern formed on an original is transferred (formed) onto a substrate by exposing the substrate through an original. Methods for performing exposure processes on multiple shot areas on a substrate include the step-and-repeat method and the step-and-scan method. An exposure apparatus that employs the step-and-repeat method is sometimes called a stepper, and performs an exposure process in which the pattern on the original is transferred onto the substrate all at once, sequentially for each shot area on the substrate. On the other hand, an exposure apparatus that employs the step-and-scan method is sometimes called a scanner, and performs an exposure process in which the pattern on the original is transferred onto the substrate while scanning the original and the substrate relative to each other, sequentially for each shot area on the substrate. This embodiment will be described using an exposure apparatus that employs the step-and-scan method as an example, and the relative scanning direction between the original and the substrate in this exposure apparatus is defined as the Y direction.

[0013] 1 is a schematic diagram showing the configuration of an exposure apparatus EXP. The exposure apparatus EXP has an original stage 4 on which an original 3 is mounted, a substrate stage 7 on which a substrate 6 is mounted, an alignment measurement unit 2 (measurement unit) that illuminates an alignment mark, and a control unit 11. The exposure apparatus EXP also includes an illumination optical system 1 that illuminates the original 3, a projection optical system 5 that projects the pattern of the original 3 onto the substrate 6, and light-shielding mechanisms 9a and 9b (light-shielding units) that can be driven to block light that has passed through the projection optical system 5. The original 3 and the substrate 6 are positioned at approximately optically conjugate positions (the object plane and image plane of the projection optical system 5) via the projection optical system 5.

[0014] The alignment measurement unit 2 includes an irradiation unit that irradiates measurement light and a light receiving unit that receives measurement light reflected from marks, etc. The illumination unit is composed of light emitting diodes, etc., and the illuminance of the irradiated light can be changed. The light receiving unit is composed of sensors, etc. The alignment measurement unit 2 can be driven in the X and Y directions by a drive mechanism (not shown), and measures the reflected light when irradiating a reference mark group 8 on the original stage 4 and an alignment mark group 10 on the original. The alignment measurement unit 2 also has a focus adjustment mechanism (not shown), and can change the focus (position in the Z direction) according to the measurement mark to perform measurements.

[0015] The control unit 11 determines and controls the drive amount of each drive mechanism of the exposure apparatus EXP. The control unit 11 has a data storage unit 12, a drive amount calculation unit 13 (calculation unit), and a drive instruction unit 14. The data storage unit 12 stores mark position information measured by the alignment measurement unit 2, drive offsets of various drive axes, drive parameters such as sensitivity, and various measurement data acquired by the exposure apparatus. The drive amount calculation unit 13 determines drive instruction amounts for the original stage 4, substrate stage 7, etc. during exposure. The drive instruction unit 14 outputs drive instructions to each drive mechanism using the drive instruction amounts for each drive mechanism determined by the drive amount calculation unit 13. The control unit 11 is configured as a hardware configuration, for example, by a computer device including a CPU (central processing unit) and memory. In this case, the data storage unit 12 is realized by the memory, and the drive amount calculation unit 13 and drive instruction unit 14 are realized by the CPU.

[0016] The illumination optical system 1 includes a light source such as an ultra-high pressure mercury lamp (not shown), a wavelength selection filter, a lens group, a shutter, etc. The illumination optical system 1 irradiates the original 3 with light of a wavelength suitable for exposure. The original stage 4 carrying the original 3 is scanned in the Y direction by a drive mechanism (not shown) under the control of a control unit 11.

[0017] A reflecting mirror (not shown) is arranged on the original stage 4, which reflects measurement light from a laser interferometer (not shown) arranged outside the original stage 4. The laser interferometer receives the reflected measurement light and constantly monitors and measures the position of the original stage 4. A control unit 11 controls the position and speed of the original stage 4 based on the measurement results from the laser interferometer.

[0018] The projection optical system 5 has mirrors and lenses (not shown) that reflect and refract the exposure light, thereby projecting the pattern formed on the original 3 onto the substrate 6. The light-blocking mechanisms 9a and 9b have a drive mechanism (not shown) that is driven in the X direction to block at least a portion of the light that has passed through the projection optical system 5, thereby limiting the area projected onto the substrate 6. In other words, when the exposure apparatus EXP transfers the pattern of the original onto the substrate, at least a portion of the exposure light is blocked, allowing the exposure area to have a desired shape. The light-blocking mechanisms 9a and 9b can be disposed between the original and the substrate.

[0019] The substrate stage 7 carrying the substrate 6 is driven in the X, Y, Z, and θ directions by a drive mechanism (not shown) under the control of the control unit 11. The substrate stage 7 is equipped with multiple reflecting mirrors (not shown) that reflect measurement light from a laser interferometer (not shown) located outside the substrate stage 7. The laser interferometer receives the reflected measurement light and constantly monitors and measures the position of the substrate stage 7. The control unit 11 controls the position and speed of the substrate stage 7 based on the measurement results from the laser interferometer.

[0020] In the exposure apparatus EXP of this embodiment, only originals of a predetermined size can be placed on the original stage 4. Since the size of the original may vary depending on the product being produced, this can be disadvantageous for users of the exposure apparatus EXP in terms of cost, etc. Therefore, by using an original holder that can be attached as an attachment to the original 3, exposure can be performed even if the original size varies. Specifically, by using the original holder, it becomes possible to use originals that are smaller than those that can be applied to the original stage 4.

[0021] FIG. 2 is a perspective view showing the configuration of the master holder 20 of this embodiment. FIG. 3 is a side view showing the configuration of the master holder 20 of this embodiment. The master holder 20 has a bottom portion 20a that holds (supports) at least a portion of the underside of the master 3. The bottom portion 20a holds the vicinity of the edge of the master. The master holder 20 has side portions 20b that are suction-held from the underside by the master stage 4. The master holder 20 has a bottom portion 20a that is staggered relative to the side portions 20b. This prevents the height of the master 3 from changing whether the master holder 20 is used or not, which can be advantageous when adjusting the height position during exposure. Note that the master holder 20 does not need to be designed to have a completely constant height, as described above. For convenience of explanation, the bottom portion 20a and the side portions 20b are described as separate members, but they can also be interpreted as an integrated member.

[0022] At least a portion of the master holder 20 may be a transparent member. For example, as shown in FIG. 3, the master holder 20 has a transparent portion 20c. This is to enable the alignment measurement unit 2, which is located at the master stage 4, to measure the reference mark group 8 (stage marks) provided on the master stage 4 when the master holder 20 is placed on the master stage 4. Therefore, the transparent portion 20c needs to be located at a position directly above the reference mark group 8 when the master holder 20 is placed on the master stage 4. The entire master holder 20 may be transparent. The master 3 also has an alignment mark group 10 (master marks). The control unit 11 functions as a processing unit that determines the drive amount of each drive mechanism during exposure using mark position information measured by the alignment measurement unit 2.

[0023] Figure 4 shows an example of the arrangement of a group of reference marks 8 on the master stage and a group of alignment marks 10 on the master, which are used for alignment when using a master holder. Figure 4(a) illustrates the master stage 4, and Figure 4(b) illustrates the master holder 20 with a master 3 mounted thereon. The master holder 20 is fixed to a master 3 that is smaller than the specified size. The reference marks 8a and 8b on the master stage are positioned in the same positions as the marks when a master of the specified size is used. The positions of these marks in the X and Y directions, with the center of the master stage 4 as the origin, are defined as (XL1, YL1) and (XR1, YR1), respectively. Two alignment marks 10a and 10b are positioned on the master 3 in the X direction. The positions of these marks in the X and Y directions, with the center of the master 3 as the origin, are defined as (XL2, YL2) and (XR2, YR2), respectively. However, it is assumed that the center of the master stage and the center of the master coincide at the expected mounting position of the master. A transmitting section 20c is provided in a part of the original holder 20 corresponding to the positions of the reference marks 8a and 8b when the original holder 20 is mounted on the original stage 4. The transmitting section 20c may be made of glass or may be transparent. It is desirable that the transmitting section 20c be made of the same material and thickness as the original so that the amount of focus adjustment when measuring the reference marks 8a and 8b with the original 3 mounted in the alignment measurement unit 2 matches the amount of focus adjustment when measuring the same marks with the original holder 15 mounted.

[0024] When calculating the relative position information between the mark positions on the original 3 and the mark positions on the original stage 4 after the original 3 is mounted on the original stage 4 via the original holder 20, it is desirable to perform this calculation in parallel with other processes from the perspective of throughput. However, there is a possibility that the measurement light reflected by the substrate 6 and the substrate stage 7 may affect the measurement results of the alignment measurement unit 2 as a disturbance. For example, depending on the position or movement of the substrate stage, the measurement light that has passed through the original mark may be reflected by the substrate or the substrate stage, changing the measurement conditions for the original alignment mark. As a result, phenomena such as a shift in the measurement value of the original alignment mark or measurement failure may occur.

[0025] Therefore, in this embodiment, the light-shielding mechanisms 9a and 9b are driven to block the measurement light from the alignment measurement unit 2 so that the measurement light from the alignment measurement unit 2 does not reach the substrate 6 and the substrate stage 7. Typically, the light-shielding mechanisms 9a and 9b are used to limit the exposure area during the exposure operation as described above, and therefore can be placed in a retracted position when the exposure operation is not in progress. In this embodiment, during alignment measurement, the light-shielding mechanisms 9a and 9b are driven from the retracted position to a light-shielding position where they block the measurement light from the alignment measurement unit 2. This reduces the influence of external disturbances that affect the measurement results of the alignment measurement unit 2. The light-shielding mechanisms 9a and 9b only need to be driven to block at least a portion of the measurement light from the alignment measurement unit 2. The light-shielding mechanisms 9a and 9b can have the property of blocking the exposure light used for transfer by the exposure apparatus EXP and the measurement light from the alignment measurement unit 2.

[0026] 5 is a flowchart of a measurement method illustrating the above-described alignment measurement and a series of steps for driving the light blocking mechanisms 9a and 9b. Each step in the flowchart can be executed by the control unit 11 controlling each part of the exposure apparatus EXP.

[0027] In step S101, the original stage 4 and alignment measurement unit 2 are driven in the X and Y directions so that the reference marks 8a and 8b on the original stage can be measured. The reference marks 8a and 8b are then measured by the alignment measurement unit 2. When driving the original stage 4 and alignment measurement unit 2, if necessary, the focus adjustment mechanism of the alignment measurement unit 2 may be adjusted so that the marks on the original stage are in focus. The measurement value here indicates the amount of deviation of the mark from the center of the field of view of the alignment measurement unit 2. The measurement value of reference mark 8a is (dxL1, dyL1), and the measurement value of reference mark 8b is (dxR1, dyR1).

[0028] In step S102, the light blocking mechanisms 9a and 9b are driven (driving step) so as to block the measurement light from the alignment measurement unit 2. "So as to block the measurement light from the alignment measurement unit 2" means that the light blocking mechanisms 9a and 9b are disposed in the optical path of the measurement light irradiated from the alignment measurement unit 2 in the measurement step of step S103, which will be described later.

[0029] In step S103, the alignment measurement unit 2 is driven in the X and Y directions so that the alignment marks 10a and 10b on the original can be measured. Then, the alignment marks 10a and 10b are measured by the alignment measurement unit 2. At this time, because the light-shielding mechanisms 9a and 9b are placed in the light-shielding positions where they block the measurement light in step S102, the influence of reflected light that has passed through the projection optical system 5 on the measurement results can be reduced.

[0030] In step S103, when the center of the original stage 4 is the origin, the drive position of the light-shielding mechanism 9a can be calculated as XL2+OFFSET, and the drive position of 9b can be calculated as XR2-OFFSET. OFFSET indicates an offset amount sufficient to completely block light transmitted through the alignment marks 10a and 10b. From the perspective of throughput, it is preferable that the drive of the light-shielding mechanisms 9a and 9b be performed in parallel and completed by the time S101 to S103 are completed.

[0031] The measurement value in step S103 indicates the amount of deviation of the mark from the center of the field of view of the alignment measurement unit 2. The measurement value of alignment mark 10a is (dxL2, dyL2), and the measurement value of alignment mark 10b is (dxR2, dyR2). When driving the alignment measurement unit 2, if necessary, the focus adjustment mechanism of the alignment measurement unit 2 may be adjusted so that the focus is on the mark on the original. The drive amount of the alignment measurement unit 2 in the X and Y directions here is determined from the relative distances from reference mark 8a to alignment mark 10a and from reference mark 8b to alignment mark 10b. The relative distance from reference mark 8a to alignment mark 10a can be calculated as (XL2-XL1, YL2-YL1), and the relative distance from reference mark 8b to alignment mark 10b can be calculated as (XR2-XR1, YR2-YR1).

[0032] In step S104, relative position information between the mark positions on the original and the original stage is calculated from the measurement values ​​of the marks on the original obtained in S103 (first measurement result) and the measurement values ​​of the marks on the original stage obtained in S101 (second measurement result). The relative position between reference mark 8a and alignment mark 10a can be calculated as (dxL2-dxL1, dyL2-dyL1), and the relative position between reference mark 8b and alignment mark 10b can be calculated as (dxR2-dxR1, dyR2-dyR1).

[0033] Furthermore, the amount of deviation between the mark positions on the original and the mark positions on the original stage is calculated based on the ideal relative positions of the reference mark 8b and the alignment mark 10b and the calculated relative positions. This deviation amount is used as a correction amount when synchronizing the original stage and the substrate stage in the exposure process, and can correct the relative positions between the original 3 and the substrate 6. This makes it possible to guarantee the pattern overlay accuracy in the exposure process.

[0034] Note that when the focus adjustment mechanism is driven in S101 and S103, there is a possibility that the image will shift in the X or Y direction in addition to the change in the Z direction. Therefore, the amount of image shift in the X or Y direction when the focus adjustment mechanism in the alignment measurement unit is driven at an arbitrary pitch is measured and stored as a table in the data storage unit 12. Then, the amount of image shift in the X or Y direction corresponding to the drive amount of the focus adjustment mechanism in the alignment measurement unit may be subtracted from the measurement result of the mark position on the substrate. This measurement may be performed at any timing before S101.

[0035] When the alignment measurement unit 2 is driven in the X or Y direction in S101 and S103, there is a possibility that the actual drive position may shift in the X or Y direction relative to the drive command value. Therefore, the shift amount in the X or Y direction when the alignment measurement unit 2 is driven in the X or Y direction at an arbitrary pitch is measured and stored as a table in the data storage unit 12. The shift amount in the X or Y direction corresponding to the drive position of the alignment measurement unit 2 may then be subtracted from the mark position measurement result. This measurement may be performed at any timing before S101. Furthermore, S102 may be performed by the time of measurement in S103. For example, it may be performed before S101 or in parallel with S101 and S103. The control unit 11 controls the light-shielding mechanisms 9a and 9b, which are positioned so as not to shield the measurement light, so that the light-shielding mechanisms 9a and 9b shield the measurement light that has passed through the original mark when the alignment measurement unit 2 measures the original mark.

[0036] Furthermore, when calculating the relative position information between the mark position on the original and the mark position on the original stage, it is preferable to perform this in parallel with other processes from the viewpoint of throughput, for example, during substrate exchange. Therefore, it is desirable to mount the mark on the substrate in a position that overlaps the mark on the original at the substrate stage position during substrate exchange.

[0037] Although the above description has been given of the light-shielding mechanisms 9a and 9b having the function of blocking exposure light during transfer by the exposure device, this is not limiting, and the light-shielding mechanisms 9a and 9b may not have the function of blocking exposure light during transfer. In other words, the light-shielding mechanisms 9a and 9b may be units provided for the purpose of being used during alignment measurement.

[0038] <Embodiments of manufacturing methods of articles> The method for manufacturing an article according to an embodiment of the present invention is suitable for manufacturing articles such as flat panel displays (FPDs), semiconductor devices, sensors, and optical elements. FIG. 6 is a flowchart of the method for manufacturing an article according to this embodiment. The method for manufacturing an article according to this embodiment includes a step of forming a latent image pattern on a photosensitive material coated on a substrate by exposure using the exposure apparatus EXP to obtain an exposed substrate (exposure step, step S11). The method also includes a step of developing the substrate exposed in this step to obtain a developed substrate (development step, step S12). Furthermore, the manufacturing method includes other well-known steps (oxidation, film formation, vapor deposition, doping, planarization, etching, resist stripping, dicing, bonding, packaging, etc.) (processing step, step S13). The method for manufacturing an article according to this embodiment is advantageous over conventional methods in at least one of the performance, quality, productivity, and production cost of the article.

[0039] Although the preferred embodiments of the present invention have been described above, it goes without saying that the present invention is not limited to these embodiments, and various modifications and changes are possible within the scope of the gist of the present invention.

[0040] The disclosure of the present specification includes at least the following exposure apparatus, measurement method, and article manufacturing method.

[0041] (Item 1) An exposure apparatus that transfers a pattern of an original onto a substrate, an original stage on which an original holder for holding the original is mounted; a measurement unit that irradiates a master mark provided on the master with measurement light and measures the measurement light reflected by the master mark; a light blocking portion that blocks the measurement light; a control unit that controls driving of the light blocking unit; and an exposure apparatus characterized in that the control unit controls the shading unit, which is positioned at a position that does not shade the measurement light, so that the shading unit shades the measurement light that has passed through the original mark at the timing when the measurement unit measures the original mark.

[0042] (Item 2) 2. The exposure apparatus according to item 1, wherein the measurement unit further measures the measurement light reflected by a stage mark provided on the original stage.

[0043] (Item 3) a calculation unit that calculates a relative position between the original and the original stage, The exposure apparatus described in item 2, characterized in that the calculation unit calculates the relative position based on a first measurement result obtained by measuring the measurement light reflected by the original mark and a second measurement result obtained by measuring the measurement light reflected by the stage mark via the original holder.

[0044] (Item 4) 3. The exposure apparatus according to item 2, wherein the original holder has a transmitting portion that transmits the measurement light.

[0045] (Item 5) 5. The exposure apparatus according to any one of items 1 to 4, wherein the control unit drives the light blocking unit to block a portion of the exposure light when transferring the pattern of the original onto the substrate using exposure light.

[0046] (Item 6) 6. The exposure apparatus according to any one of items 1 to 5, wherein the light-shielding portion is disposed between the original and the substrate.

[0047] (Item 7) 7. The exposure apparatus according to any one of items 1 to 6, wherein the control unit moves the measurement unit to a position where the original mark can be measured, while moving the shading unit, which is positioned so as not to block the measurement light, so that the shading unit blocks the measurement light that has passed through the original mark.

[0048] (Item 8) 8. The exposure apparatus according to any one of items 1 to 7, wherein the light blocking section has a property of blocking exposure light used for transfer by the exposure apparatus and the measurement light.

[0049] (Item 9) A method for measuring an alignment mark in an exposure apparatus that transfers a pattern of an original onto a substrate, comprising: a driving step of driving the light blocking unit so as to block the measurement light from the measurement unit; a measurement step of irradiating a master mark provided on the master with the measurement light by the measurement unit and measuring the measurement light reflected by the master mark; Including, The driving process is a measurement method characterized in that the light-shielding unit, which is arranged in a position that does not block the measurement light, is driven so that the light-shielding unit blocks the measurement light that has passed through the original mark at the timing when the measurement unit measures the original mark.

[0050] (Item 10) an exposure step of exposing a substrate using the exposure apparatus according to any one of items 1 to 8 to obtain an exposed substrate; a developing step of developing the exposed substrate to obtain a developed substrate, A method for manufacturing an article, comprising manufacturing an article from the developed substrate. [Explanation of symbols]

[0051] 2 Alignment measurement unit (measurement unit) 3 Original version 4 Original Stage 6 PCB 9a, 9b Light shielding mechanism (light shielding part) 11 Control section 10 Alignment marks (master marks) 20 Master holder EXP exposure equipment

Claims

1. An exposure apparatus that transfers a pattern of an original onto a substrate, an original stage on which an original holder for holding the original is mounted; a measurement unit that irradiates a master mark provided on the master with measurement light and measures the measurement light reflected by the master mark; a light blocking portion that blocks the measurement light; a control unit that controls driving of the light blocking unit; and an exposure apparatus characterized in that the control unit controls the shading unit, which is positioned at a position that does not shade the measurement light, so that the shading unit shades the measurement light that has passed through the original mark at the timing when the measurement unit measures the original mark.

2. 2. The exposure apparatus according to claim 1, wherein the measurement unit further measures the measurement light reflected by a stage mark provided on the original stage.

3. a calculation unit that calculates a relative position between the original and the original stage, 3. The exposure apparatus according to claim 2, wherein the calculation unit calculates the relative position based on a first measurement result obtained by measuring the measurement light reflected by the original mark and a second measurement result obtained by measuring the measurement light reflected by the stage mark via the original holder.

4. 3. An exposure apparatus according to claim 2, wherein the original holder has a transmitting portion that transmits the measurement light.

5. 2. The exposure apparatus according to claim 1, wherein the control unit drives the light blocking unit so as to block a portion of the exposure light when the pattern of the original is transferred onto the substrate by the exposure light.

6. 2. The exposure apparatus according to claim 1, wherein the light-shielding portion is disposed between the original and the substrate.

7. 2. The exposure apparatus according to claim 1, wherein the control unit moves the measurement unit to a position where the original mark can be measured, while moving the shading unit, which is positioned so as not to block the measurement light, so that the shading unit blocks the measurement light that has passed through the original mark.

8. 2. The exposure apparatus according to claim 1, wherein the light blocking portion has a property of blocking exposure light used for transfer by the exposure apparatus and the measurement light.

9. A method for measuring an alignment mark in an exposure apparatus that transfers a pattern of an original onto a substrate, comprising: a driving step of driving the light blocking unit so as to block the measurement light from the measurement unit; a measurement step of irradiating a master mark provided on the master with the measurement light by the measurement unit and measuring the measurement light reflected by the master mark; Including, The driving process is a measurement method characterized in that the light-shielding unit, which is arranged in a position that does not block the measurement light, is driven so that the light-shielding unit blocks the measurement light that has passed through the original mark at the timing when the measurement unit measures the original mark.

10. an exposure step of exposing a substrate using the exposure apparatus according to any one of claims 1 to 8 to obtain an exposed substrate; a developing step of developing the exposed substrate to obtain a developed substrate, A method for manufacturing an article, comprising manufacturing an article from the developed substrate.

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