Machining apparatus

Abstract

To provide a processing device capable of improving productivity.SOLUTION: The processing apparatus 1 includes a mounting table 5 on which a housing container 100 that houses a package substrate W as a workpiece is mounted, a holding table 30 that holds the package substrate W conveyed from the mounting table 5, a processing unit 40 that processes the package substrate W held by the holding table 30, and a temporary placement stage 90 that temporarily places a device chip DT as a processed workpiece until the device chip DT is conveyed to another apparatus 200.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a processing device. [Background technology]

[0002] Cutting machines are known as machines for dividing multiple devices formed on the surface of a workpiece, such as a silicon wafer, into individual device chips. The devices formed on the surface of the workpiece include, for example, devices such as integrated circuits (ICs) and large scale integrations (LSIs), as well as packaged devices such as chip size packages (CSPs) and quad flat non-leaded packages (QFNs), which are used in various electrical equipment.

[0003] For example, Patent Document 1 describes a processing device that performs cutting on workpieces such as package substrates. The workpieces are stored in a cassette and are transported from the cassette to a chuck table via a temporary storage area. After being processed on the chuck table, the workpieces are transported back into the cassette. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Publication No. 2020-92143 Summary of the Invention [Problem to be solved by the invention]

[0005] In Patent Document 1, the workpieces processed by the processing device are returned to a cassette, and then the cassette containing the workpieces is manually transported to another device that performs the next process, which poses productivity issues.

[0006] The present invention provides a processing device that can improve productivity. [Means for solving the problem]

[0007] The processing device of the present invention comprises: a mounting table on which a container for accommodating the workpiece is placed; a holding table for holding the workpiece transferred from the mounting table; a processing unit that processes the workpiece held on the holding table; and a temporary placement stage on which the processed workpiece is temporarily placed until it is transported to another device. [Effects of the Invention]

[0008] According to the present invention, the processing of the workpieces carried out by the processing device and other devices can be carried out continuously, and the productivity of the processing of the workpieces can be improved. [Brief explanation of the drawings]

[0009] [Figure 1] 1 is a schematic perspective view of a processing device 1 according to an embodiment of the present invention. [Figure 2] FIG. 2 is an enlarged perspective view of the holding table 30 and the processing unit 40. [Figure 3] 1 is a schematic side view of a storage shelf 3, a container transport unit 4, and a mounting table 5. FIG. [Figure 4] 10 is a diagram showing the mounting table 5 moved to the height position of the upper storage shelf 3. FIG. [Figure 5] 10 is a diagram showing a state in which the storage container 100 is transported from the upper storage shelf 3 to the mounting table 5. FIG. [Figure 6] FIG. 10 is a diagram showing how the table 5 on which the container 100 is placed moves downward. [Figure 7] FIG. 10 is a diagram showing a state in which the storage container 100 placed on the table 5 has been emptied. [Figure 8] 10 is a diagram showing how an empty storage container 100 is transported from a mounting table 5 to a lower storage shelf 3. FIG. [Figure 9] 10 is a top view of a package substrate W in which misalignment has occurred on the first transport unit 10. FIG. [Figure 10] 2 is a schematic side view showing a specific configuration of the position information acquisition unit 50. FIG. [Figure 11] 10 is a top view of a package substrate W that has been transported to a position where it can be imaged by an imaging device 52. FIG. [Figure 12] 1 is a perspective view showing the schematic configuration of a water case 60, a storage tank 68, and a waste liquid supply unit 70. FIG. [Figure 13] 1 is a schematic cross-sectional view of a downstream case 62 of a water case 60 and a storage tank 68. FIG. [Figure 14] FIG. 2 is a block diagram of a temporary stage 90 and another device 200. [Figure 15] The upper figure is a top view of the temporary stage 90, and the lower figure is a side view thereof. DETAILED DESCRIPTION OF THE INVENTION

[0010] An embodiment of the processing apparatus of the present invention will be described below with reference to the accompanying drawings. In the following description, the arrow directions shown in the drawings will be referred to as the X-axis, Y-axis, and Z-axis directions, respectively.

[0011] [Overall overview of the processing equipment] 1 is a schematic perspective view of a processing apparatus 1. The processing apparatus 1 includes a base 2 that supports components described below, and performs a predetermined processing process on a workpiece. In this embodiment, the processing apparatus 1 performs cutting processing on, for example, a package substrate W (an example of a workpiece) on which a plurality of devices D are formed, and separates the package substrate W into individual device chips DT (an example of a workpiece after processing).

[0012] The package substrate W is, for example, a CSP substrate or a QFN substrate, and is a rectangular plate-like object. The package substrate W is divided into multiple regions by division lines arranged in a grid pattern on its surface, and a device D is formed in each region.

[0013] The processing apparatus 1 includes a mounting table 5 on which a storage container 100 (sometimes referred to as a cassette) for storing package substrates W is placed, a first transport unit 10 that transports the package substrate W from the mounting table 5 to a predetermined position A, a second transport unit 20 that transports the package substrate W from the predetermined position A, a holding table 30 on which the package substrate W transported from the predetermined position A by the second transport unit 20 is placed and which holds the package substrate W, a processing unit 40 that processes the package substrate W held by the holding table 30, a processing water supply unit 46 that can supply processing water to the package substrate W, a third transport unit 80 that transports the package substrate W (i.e., device chips DT) processed by the processing unit 40, a cleaning unit 86 that cleans the device chips DT, and a drying unit 87 that dries the cleaned device chips DT. These units and the mounting table 5 that are components of the processing apparatus 1 are supported by a base 2.

[0014] One storage container 100 is placed on the mounting table 5. The storage container 100 has multiple shelves arranged at predetermined intervals in the vertical direction, and multiple package substrates W can be stored horizontally on the shelves. The mounting table 5 is arranged to be movable in the Z-axis direction (i.e., the vertical direction), and can adjust the height position of the package substrate W taken out of the storage container 100 to the height position of the mounting surface for the package substrate W in the first transport unit 10.

[0015] The first transport unit 10 is provided adjacent to the mounting table 5 and includes a conveyor 11 on which a package substrate W taken out of the container 100 in the +Y direction is placed and which transports the package substrate W to a predetermined position A. The conveyor 11 is, for example, a belt conveyor including an endless belt and a motor for driving the belt. Here, the predetermined position A is a downstream area on the conveyor 11, and is an area where the second transport unit 20 can hold the package substrate W.

[0016] The second transport unit 20 transports the package substrate W placed at a predetermined position A to the holding table 30. The second transport unit 20 has a suction pad 21 that suction-holds the upper surface of the package substrate W, a lifting mechanism 22 that supports the suction pad 21 and raises and lowers it up and down, an operating arm 23 that supports the lifting mechanism 22, and a moving mechanism (not shown) that moves the operating arm 23 along the Y-axis direction. The lifting mechanism 22 may be formed, for example, by an air cylinder or by a motor and a ball screw.

[0017] Two holding tables 30 are provided side by side along the Y-axis direction. Each holding table 30 has a circular holding surface, and suction holes (not shown) are exposed on this holding surface. A suction path is formed inside the holding table 30, which communicates with the suction holes and is connected to a suction source such as a vacuum pump. The holding table 30 having this configuration suction-holds the package substrate W transported by the second transport unit 20.

[0018] Further, around each holding table 30, a tray 65 is provided for receiving processing water supplied during processing and processing waste.

[0019] 2 is an enlarged perspective view of the holding table 30 and the processing unit 40. Note that the tray 65 is not shown.

[0020] The holding table 30 is provided so as to be movable along the X-axis direction (processing feed direction) by an X-axis direction moving means 35 provided below the holding table 30. The holding table 30 is also provided so as to be rotatable within a predetermined angle (for example, 90°) around a central axis extending in the Z-axis direction by a rotation drive mechanism (not shown).

[0021] The processing unit 40 cuts the package substrate W held on the holding table 30 along the planned division line. The processing unit 40 has a spindle 41 arranged along the Y-axis direction (indexing feed direction) and a disk-shaped cutting blade 42 attached to the tip of the spindle 41. The spindle 41 and the cutting blade 42 are provided so as to be movable in the Y-axis direction and the Z-axis direction by a Y-axis direction moving means 36 and a Z-axis direction moving means 37. The spindle 41 and the cutting blade 42 are rotated at a predetermined speed by, for example, a servo motor.

[0022] The processing water supply units 46 are provided on both sides of the cutting blade 42 in the X-axis direction and have spray nozzles 47 that can supply processing water. The processing water supplied from the spray nozzles 47 is supplied to the cutting area between the cutting blade 42 and the package substrate W. The processing water cools the cutting area and can wash away processing waste generated during cutting.

[0023] 1, the third transport unit 80 transports the individual device chips DT separated by the processing unit 40 to the cleaning unit 86. Similar to the second transport unit 20, the third transport unit 80 has a suction pad 81 that suction-holds the device chips DT, a lifting mechanism 82 that supports the suction pad 81 and raises and lowers it up and down, an operating arm 83 that supports the lifting mechanism 82, and a moving mechanism (not shown) that moves the operating arm 83 along the Y-axis direction.

[0024] The cleaning unit 86 physically or chemically cleans the device chips DT. The cleaning unit 86 includes, for example, a mechanism for supplying a cleaning liquid and a cleaning tool such as a sponge that comes into contact with the device D to clean it.

[0025] The drying unit 87 dries the device chips DT cleaned by the cleaning unit 86. The drying unit 87 includes, for example, a heater.

[0026] [Storage shelf] As shown in FIG. 1, the processing apparatus 1 further includes a storage shelf 3 capable of storing at least one storage container 100, and a container transport unit 4 that transports the storage container 100 stored in the storage shelf 3 to a mounting table 5.

[0027] If the processing apparatus 1 were not equipped with the storage shelf 3 and the container transport unit 4, when replacing an empty storage container 100 after all of the package substrates W stored therein have been transported, it would be necessary to manually move the empty storage container 100 from the mounting table 5, and then bring a new storage container 100 from outside the processing apparatus 1 and place it on the mounting table 5. In this embodiment, since the processing apparatus 1 is equipped with the storage shelf 3 and the container transport unit 4, the storage container 100 can be smoothly replaced on the mounting table 5, and the productivity of the processing apparatus 1 can be improved.

[0028] 3 to 8, the storage shelves 3, the container transport unit 4, and the mounting table 5 will be described in detail below. In this embodiment, a configuration in which two storage shelves 3 are provided one above the other will be described as an example, but a configuration in which three or more storage shelves 3 are provided one above the other may also be used. Furthermore, a configuration in which multiple storage shelves 3 are provided horizontally may also be used, or a configuration in which only one storage shelf 3 is provided.

[0029] Each storage shelf 3 extends in the horizontal direction and is configured to be able to horizontally store a plurality of storage containers 100. Specifically, each storage shelf 3 extends in the X-axis direction and is configured to be able to store a plurality of storage containers 100 lined up in the X-axis direction.

[0030] The storage shelf 3 is provided adjacent to the mounting table 5 and has a conveyor 3a that transports the storage containers 100 to the mounting table 5. In this embodiment, the container transport unit 4 is configured to include this conveyor 3a. The conveyor 3a is, for example, a belt conveyor that includes an endless belt and a motor that drives the belt, and multiple storage containers 100 are placed on the upper surface of the belt. The mounting table 5 is provided adjacent to the end of the direction in which the conveyor 3a transports the storage containers 100, i.e., the X-axis direction, and the conveyor 3a transports the storage containers 100 toward the mounting table 5. As the storage shelf 3 has the conveyor 3a in this way, the storage shelf 3 can also function as the container transport unit 4, and the processing apparatus 1 can be made more compact.

[0031] The mounting table 5 is equipped with a moving mechanism 5a that is movable in the Z-axis direction (i.e., the up-down direction), and is configured to be movable up and down to the height position of each storage shelf 3. The moving mechanism 5a may be configured, for example, by an air cylinder or by a motor and a ball screw. By providing multiple storage shelves 3 one above the other, many storage containers 100 can be stored on the storage shelves 3 in the limited space within the processing device 1. Furthermore, since the height positions of the mounting table 5 and each storage shelf 3 can be aligned, transportation from the storage shelf 3 to the mounting table 5 by the container transport unit 4 (conveyor 3a) can be performed smoothly. Note that, although an example in which the mounting table 5 is configured to be movable up and down has been shown here, this is not limiting, and each storage shelf 3 may be configured to be movable up and down to the height position of the mounting table 5.

[0032] The mounting table 5 is provided with a positioning portion 6a for positioning the storage container 100 on an extension of the path along which the storage container 100 is transported from the storage shelf 3 to the mounting table 5. The positioning portion 6a is configured as a wall portion erected from the mounting surface on which the storage container 100 is placed on the mounting table 5. When the storage container 100 is transported from the storage shelf 3 to the mounting table 5, the side surface of the storage container 100 abuts against the positioning portion 6a, thereby positioning the storage container 100 on the mounting table 5.

[0033] The mounting table 5 is also provided with a fixing portion 6b that fixes the storage container 100 transported by the container transport unit 4 to the mounting table 5. The fixing portion 6b is provided at the upper end of the positioning portion 6a and is capable of pressing down on the upper surface of the storage container 100 placed on the mounting table 5 from above. The fixing portion 6b is capable of moving up and down relative to the positioning portion 6a, and is positioned above the upper surface of the storage container 100 before the storage container 100 is transported to the mounting table 5, and moves down after the storage container 100 is placed on the mounting table 5, thereby pressing down on the upper surface of the storage container 100. The provision of the fixing portion 6b makes it possible to stably fix the storage container 100 placed on the mounting table 5.

[0034] 3 to 8, a process for replacing the storage container 100 placed on the mounting table 5 will be described. Here, an example will be described in which the upper storage shelf 3 stores the storage container 100 containing the package substrate W, and the lower storage shelf 3 stores the empty storage container 100.

[0035] FIG. 3 shows the mounting table 5 without a storage container 100 placed thereon and positioned at the height of the first transport unit 10 (see FIG. 1). In this state, the mounting table 5 moves upward to the height of the upper storage shelf 3, as shown in FIG. 4. Then, as shown in FIG. 5, the conveyor 3a of the upper storage shelf 3 is driven, and the storage container 100 placed closest to the mounting table 5 is transported to the mounting table 5. At this time, the fixing part 6b is positioned upward, and the positioning part 6a positions the transported storage container 100. After the storage container 100 is placed on the mounting table 5, the fixing part 6b moves downward and presses down on the top surface of the storage container 100 to fix the storage container 100 to the mounting table 5. As shown in FIG. 6, the mounting table 5 with the storage container 100 placed thereon moves downward to the height of the first transport unit 10.

[0036] 7 shows a state in which the storage container 100 placed on the mounting table 5 is emptied, i.e., a state in which all of the package substrates W have been transported. In this state, the fixing portion 6b moves upward, and the fixing of the storage container 100 is released. Then, as shown in FIG. 8, the storage container 100 is transported to the lower storage shelf 3. When transporting to the lower storage shelf 3, for example, the empty storage container 100 is pushed back to the lower storage shelf 3 by a pressing mechanism (not shown) built into the positioning portion 6a.

[0037] In this way, the container transport unit 4 is configured to be able to transport the empty storage container 100 from the mounting table 5 to the storage shelf 3, and by repeating the steps of Figures 3 to 8, the storage containers 100 placed on the mounting table 5 can be continuously replaced. Therefore, the productivity of the processing device 1 can be further improved.

[0038] Furthermore, at least one shelf (here, the lower shelf 3) among the multiple storage shelves 3 is configured to store only emptied storage containers 100. This allows for smooth collection of used storage containers 100.

[0039] [Location information acquisition unit] When the package substrate W is taken out of the container 100 or during transport by the first transport unit 10, the package substrate W may be displaced.

[0040] 9 is a top view of a package substrate W in which misalignment has occurred on the first transport unit 10. The area surrounded by the two-dot chain line in FIG. 9 is a virtual area that matches the outline of the package substrate W in a top view when the package substrate W is transported without misalignment, and is hereinafter also referred to as a reference area B as an area that serves as a reference on the transport path of the package substrate W. The misalignment of the package substrate W includes, for example, a deviation of the center position CP of the package substrate W from the center position of the reference area B (the intersection of the thick dashed lines in FIG. 9) and / or an inclination θ of the package substrate W with respect to a reference direction (here, the Y-axis direction).

[0041] If the package substrate W is placed on the holding table 30 in such a state where the package substrate W is misaligned, it will be necessary to reposition the package substrate W due to the misalignment after placing the package substrate W on the holding table 30, which will reduce the productivity of the processing device 1.

[0042] 1, the processing apparatus 1 further includes a position information acquisition unit 50 that acquires position information of the package substrate W transported from the mounting table 5. Then, the package substrate W is placed on the holding table 30 based on the position information of the package substrate W acquired by the position information acquisition unit 50.

[0043] The position information of the package substrate W acquired by the position information acquisition unit 50 includes, for example, information about the center position CP of the package substrate W and / or information about the inclination θ of the package substrate W with respect to the reference direction. In other words, this information can be said to be the deviation of the package substrate W with respect to the reference area B described above.

[0044] 10 is a schematic side view showing a specific configuration of the position information acquisition unit 50. The position information acquisition unit 50 includes a light irradiation device 51 that irradiates light onto the package substrate W transported from the mounting table 5, an imaging device 52 that images the package substrate W, and an image processing device 53 that acquires position information of the package substrate W based on the image captured by the imaging device 52.

[0045] The light irradiation device 51 is provided below the conveyor 11 of the first transport unit 10. The conveyor 11 is made of a material that transmits light, and the light irradiation device 51 irradiates the package substrate W with light from below the conveyor 11.

[0046] The imaging device 52 is configured with optical means such as a microscope or a CCD (Charge Coupled Device) camera, and transmits captured image data to the image processing device 53. The imaging device 52 is provided in the second transport unit 20, and captures an image of the package substrate W from above the conveyor 11.

[0047] The image processing device 53 is configured to include a processor, a memory, etc., and processes the image captured by the imaging device 52 to obtain position information of the package substrate W. Specifically, the image processing device 53 obtains the coordinate position of the center position CP of the package substrate W in a predetermined coordinate system that is set in advance, and / or the inclination θ of the package substrate W with respect to a reference direction.

[0048] 11 is a top view of the package substrate W transported to a position where it can be imaged by the imaging device 52. When the imaging field of view that can be imaged with sufficient resolution is smaller than the entire package substrate W, the imaging device 52 partially images multiple regions of the package substrate W. In the example shown in FIG. 11, the imaging device 52 partially images six regions surrounded by dashed circles (i.e., the imaging field of view). Note that when the imaging field of view that can be imaged with sufficient resolution includes the entire package substrate W, the imaging device 52 may image the entire package substrate W in one go.

[0049] In order to properly acquire position information of the package substrate W, the imaging device 52 preferably captures an image of at least an area including the periphery of the package substrate W. In the example shown in Fig. 11, the imaging device 52 partially captures images of six areas including four corners of the package substrate W as the area including the periphery of the package substrate W. With this configuration, even if an image of the entire package substrate W is not available, the image processing device 53 can acquire position information such as a position inside the periphery of the package substrate W (e.g., the center position CP) and the tilt θ of the package substrate W, based on the image of the area including the periphery of the package substrate W.

[0050] 1, the processing apparatus 1 further includes a control device 7 that adjusts the relative position of the holding table 30 and the package substrate W based on position information of the package substrate W acquired by a position information acquisition unit 50 when the second transport unit 20 places the package substrate W on the holding table 30. The control device 7 has a processor that performs arithmetic processing according to a control program, and memories such as a ROM (Read Only Memory) and a RAM (Random Access Memory), and is also configured to be able to receive the position information of the package substrate W transmitted by the position information acquisition unit 50. The control device 7 adjusts the position of the second transport unit 20 and / or the position of the holding table 30 (including the position in the rotational direction about the central axis) based on the position information of the package substrate W, thereby properly placing the package substrate W on the holding table 30.

[0051] As described above, the position information acquisition unit 50 acquires the position information of the package substrate W before placing the package substrate W on the holding table 30, and the package substrate W is placed on the holding table 30 based on the position information. Therefore, even if the package substrate W is misaligned, the package substrate W can be appropriately placed on the holding table 30 taking into account the misalignment. Furthermore, a mechanical mechanism for positioning the package substrate W before transport by the second transport unit 20 is not required.

[0052] The position information acquisition unit 50 acquires position information of the package substrate W while the package substrate W is being transported by the first transport unit 10, or when the package substrate W is placed at a predetermined position A, which is an area where the second transport unit 20 can hold the package substrate W. With this configuration, the position information acquisition unit 50 can appropriately acquire position information of the package substrate W while the package substrate W is being transported by the first transport unit 10.

[0053] As described above, the first transport unit 10 is configured such that the conveyor 11 carrying the package substrate W transports the package substrate W to the predetermined position A. Therefore, the package substrate W is stably transported by the conveyor 11, and the position information acquisition unit 50 can acquire the position information of the package substrate W with high accuracy.

[0054] [Waste liquid supply unit] 12 and 13, the processing apparatus 1 further includes a water case 60 that receives the processing water supplied from the processing water supply unit 46, a storage tank 68 that stores the processing water received by the water case 60 as waste liquid, and a waste liquid supply unit 70 that can supply at least a portion of the waste liquid stored in the storage tank 68 to the water case 60. The dashed arrows in Fig. 13 indicate the flow of the waste liquid supplied from the waste liquid supply unit 70 to the water case 60. In the following description, upstream and downstream are based on the flow direction of the processing water supplied from the processing water supply unit 46.

[0055] The water case 60 has an upstream case 61 that is provided on the upstream side and covers the two holding tables 30 from below, and a downstream case 62 that is provided on the downstream side and guides the waste liquid to the storage tank 68. The upstream case 61 has a tray shape that is open at the top and covers the holding tables 30 and the X-axis direction moving means 35 (see FIG. 2) from below. Both the upstream case 61 and the downstream case 62 have inclined surfaces that slope downward toward the downstream side and guide the waste liquid toward the storage tank 68.

[0056] The water case 60 further includes a bellows cover 63 and a plate-shaped cover 64 that cover the X-axis direction moving means 35 from above, and a tray 65 attached to the periphery of the holding table 30. The holding table 30, the bellows cover 63, the plate-shaped cover 64, and the tray 65 are provided inside the upstream case 61. The bellows cover 63 is provided on the +X side of the holding table 30, and its length changes as the holding table 30 moves in the X-axis direction. The plate-shaped cover 64 is provided on the -X side of the holding table 30, and has a slope that slopes downward toward the downstream case 62. The tray 65 is connected to the plate-shaped cover 64. The outer edge of the tray 65 is surrounded by an outer peripheral wall, and the outer peripheral wall has an opening at the connection portion with the plate-shaped cover 64. Therefore, processing water and relatively large processing chips flow from the tray 65 to the plate-shaped cover 64 and are guided to the downstream case 62. Furthermore, the processing water and relatively small processing debris scattered from the tray 65 are guided from the upstream case 61 to the downstream case 62 .

[0057] The downstream case 62 extends in the Y-axis direction and guides waste liquid and processing debris flowing from the upstream case 61 and the plate-like cover 64 to a storage tank 68.

[0058] The storage tank 68 is a container configured to be able to receive the waste liquid and processing debris, and is, for example, a container with an open top, and is provided at the lower end of the downstream case 62. The storage tank 68 is provided with a filter 69 that catches the processing debris. Therefore, processing debris mixed in the waste liquid is collected in the filter 69, and the waste liquid is stored in the storage tank 68. Note that the storage tank 68 may be provided integrally with the downstream case 62.

[0059] The waste liquid supply unit 70 has a flow path 71 communicating with the storage tank 68 and the water case 60, and a pump 72 provided in the flow path 71. The waste liquid supply unit 70 supplies at least a portion of the waste liquid stored in the storage tank 68 to the water case 60 via the flow path 71. The flow path 71 and pump 72 of the waste liquid supply unit 70 are provided, for example, in the internal space of the base 2, but may also be provided outside the base 2. By providing the waste liquid supply unit 70, the waste liquid can be used to clean the inside of the water case 60, preventing the accumulation of processing debris in the water case 60. Furthermore, compared to cleaning the water case 60 by separately supplying cleaning water to the water case 60 without using the waste liquid, water can be saved, thereby reducing the operating costs of the processing apparatus 1. Note that a portion of the waste liquid stored in the storage tank 68 may be discharged to the outside of the processing apparatus 1 through a discharge section (not shown).

[0060] The waste liquid supply unit 70 has multiple supply units that supply waste liquid to multiple locations within the water case 60. Specifically, the flow path 71 communicates with the storage tank 68, the upstream case 61, and the downstream case 62, and the waste liquid supply unit 70 has an upstream supply unit 73 provided in the upstream case 61 that supplies at least a portion of the waste liquid to the upstream case 61, and a downstream supply unit 74 provided in the downstream case 62 that supplies at least a portion of the waste liquid to the downstream case 62. With this configuration, waste liquid is supplied to multiple locations from the upstream side to the downstream side of the water case 60, thereby improving the cleaning performance of the water case 60 and conserving water.

[0061] The upstream supply unit 73 is configured, for example, with a spray nozzle that sprays waste liquid to supply it to the upstream case 61, and intermittently sprays the waste liquid. This allows for good cleaning of the water case 60. In this embodiment, the upstream supply unit 73 is provided to supply waste liquid to a tray 65 provided in the upstream case 61, but it may also be provided in the bellows cover 63 or the plate-shaped cover 64, or may be provided elsewhere in the upstream case 61.

[0062] The downstream supply unit 74 is formed, for example, in a cylindrical shape extending in the X-axis direction, and supplies waste liquid by a water curtain to the downstream case 62. The downstream supply unit 74 is configured to be swingable around the central axis of the cylindrical shape by a motor or the like (not shown).

[0063] [Temporary stage] 1 and 14, the processing apparatus 1 further includes a temporary placement stage 90 on which the processed package substrate W, i.e., the individual device chips DT, are temporarily placed until they are transported to another apparatus 200 (hereinafter also simply referred to as the apparatus 200). The temporary placement stage 90 functions as a transport port for transporting the device chips DT from the processing apparatus 1 to the apparatus 200.

[0064] The apparatus 200 is an apparatus provided adjacent to the processing apparatus 1, and is, for example, an inspection apparatus that inspects the device chips DT, or a processing apparatus that performs further processing on the device chips DT. The apparatus 200 includes a transport unit 210 that transports the device chips DT temporarily placed on the temporary placement stage 90. The transport unit 210 is configured to include, for example, a suction pad, a lifting mechanism, an operating arm, a moving mechanism, and the like, similar to the second transport unit 20 and the third transport unit 80 described above.

[0065] In FIG. 15, the upper figure is a top view of the temporary placement stage 90, and the lower figure is a side view thereof. The temporary placement stage 90 has a tray shape with an open top, and the device chip DT is temporarily placed on the temporary placement stage 90 while being held thereon. In the example shown in FIG. 15, an adhesive member 91 (e.g., a resin sheet) having adhesive force is provided on the bottom surface of the temporary placement stage 90, and the device chip DT is temporarily placed on the temporary placement stage 90 while being held thereon by the adhesive force of the adhesive member 91. Note that the temporary placement stage 90 may hold the device chip DT in other ways. For example, the temporary placement stage 90 may hold the device chip DT by negative pressure generated by suction from a plurality of suction holes provided on the bottom surface.

[0066] The device chips DT that have been subjected to the processing, cleaning, and drying processes are temporarily placed on the temporary placement stage 90 and are transported to the next apparatus 200 without returning to the storage container 100. Therefore, the processes performed by the processing apparatus 1 and the apparatus 200 can be performed continuously, and the productivity of the processing of the workpieces (package substrate W, device chips DT) can be improved.

[0067] Furthermore, if the device chip DT is returned to the storage container 100 placed on the mounting table 5 and this storage container 100 is manually transported to the apparatus 200, there is a risk that the device chip DT may be damaged during transport due to human error, etc., but in the processing apparatus 1 of this embodiment, the device chip DT is transported continuously from the temporary placement stage 90 to the apparatus 200 without human intervention, so damage to the device chip DT during transport can be prevented.

[0068] To explain in detail the transportation of the device chips DT in the processing apparatus 1, the device chips DT are transported by the same third transport unit 80 from the holding table 30 to the temporary placement stage 90 via the cleaning unit 86 and the drying unit 87. With this configuration, the processing apparatus 1 can be made smaller than when a plurality of transport units are provided from the holding table 30 to the temporary placement stage 90.

[0069] The holding table 30, the cleaning unit 86, the drying unit 87, and the temporary placement stage 90 are arranged side by side in the Y-axis direction on the base 2, and the third transport unit 80 is arranged to be movable in the Y-axis direction. In this way, the third transport unit 80 can have a simple configuration for transporting the device chips DT in a straight line.

[0070] The configuration of the third transport unit 80 is not limited to the above. For example, the transport of the device chip DT from the holding table 30 to the cleaning unit 86, the transport of the device chip DT from the cleaning unit 86 to the drying unit 87, and the transport of the device chip DT from the drying unit 87 to the temporary placement stage 90 may be performed by separate transport units.

[0071] Although one embodiment of the present invention has been described above with reference to the accompanying drawings, it goes without saying that the present invention is not limited to such an embodiment. It is clear that a person skilled in the art can conceive of various modifications or alterations within the scope of the claims, and it is understood that these also naturally fall within the technical scope of the present invention. Furthermore, the components of the above embodiment may be combined in any manner without departing from the spirit of the invention.

[0072] For example, in the above-described embodiment, the processing unit 40 is a cutting unit that performs cutting processing on a workpiece (package substrate W), but this is not limited to this. For example, the processing unit 40 may be a grinding unit that grinds the workpiece, a polishing unit that polishes the workpiece, or a laser irradiation unit that performs laser processing on the workpiece.

[0073] For example, in the above-described embodiment, the drying unit 87 and the temporary placement stage 90 are provided separately, but the drying unit 87 may be provided integrally with the temporary placement stage 90. By having the temporary placement stage 90 also serve as the drying unit 87, the space efficiency of the processing apparatus 1 can be improved.

[0074] In the above-described embodiment, the container transport unit 4 is configured to include the conveyor 3a of the storage shelf 3, but this is not limited to this. The container transport unit 4 may be configured to be provided independently of the storage shelf 3, and may be configured to include, for example, an arm or the like that can hold the storage container 100.

[0075] This specification describes at least the following: In parentheses, components corresponding to those in the above-described embodiments are shown as examples, but the present invention is not limited to these.

[0076] (1) a mounting table (mounting table 5) on which a container for accommodating a workpiece (package substrate W) is placed; a holding table (holding table 30) for holding the workpiece transferred from the mounting table; a processing unit (processing unit 40) that processes the workpiece held on the holding table; and a temporary placement stage (temporary placement stage 90) on which the processed workpiece (device chip DT) is temporarily placed until it is transported to another device (another device 200). Processing equipment.

[0077] According to (1), after the workpiece is taken out of the storage container and processed, it is temporarily placed on the temporary placement stage without returning to the storage container until it is transported to another device. Therefore, unlike the case where the workpiece is returned to the storage container after processing and then transported to another device, the processing of the workpiece carried out in the processing device and other devices can be carried out continuously, and the productivity of the processing of the workpiece can be improved.

[0078] (2) The processing device according to (1), a cleaning unit (cleaning unit 86) for cleaning the workpiece after processing; and a drying unit (drying unit 87) that dries the workpiece cleaned by the cleaning unit. Processing equipment.

[0079] According to (2), the workpiece can be washed and dried before being transported to another device.

[0080] (3) The processing device according to (2), The processed workpiece held on the holding table is transported by the same transport unit (third transport unit 80) from the holding table to the temporary placement stage via the cleaning unit and the drying unit. Processing equipment.

[0081] According to (3), the processing device can be made smaller.

[0082] (4) The processing device according to (3), the holding table, the cleaning unit, the drying unit, and the temporary placement stage are arranged side by side in a predetermined direction (Y-axis direction), The transport unit is provided so as to be movable in the predetermined direction. Processing equipment.

[0083] According to (4), the transport unit can be configured simply.

[0084] (5) A processing device according to any one of (2) to (4), the drying unit is provided integrally with the temporary placement stage; Processing equipment.

[0085] According to (5), the temporary stage also serves as a drying unit, thereby improving the space efficiency of the processing device.

[0086] (6) A processing device according to any one of (1) to (5), a storage shelf (storage shelf 3) capable of storing at least one of the storage containers; and a container transport unit (container transport unit 4) that transports the container stored in the storage shelf to the placement table. Processing equipment.

[0087] According to (6), the container can be smoothly replaced on the mounting table, and the productivity of the processing device can be improved.

[0088] (7) A processing device according to any one of (1) to (6), a position information acquisition unit for acquiring position information of the workpiece being transported from the mounting table; The workpiece is placed on the holding table based on the position information of the workpiece acquired by the position information acquisition unit. Processing equipment.

[0089] According to (7), position information of the workpiece is acquired before the workpiece is placed on the holding table, and the workpiece is placed on the holding table based on the position information, so even if the workpiece is displaced when being removed from the container, the workpiece can be appropriately placed on the holding table taking into account the positional displacement. Therefore, there is no need to reposition the workpiece due to the positional displacement after it has been placed on the holding table, which further improves productivity. [Explanation of symbols]

[0090] 3 Storage Shelves 4 Container transport unit 5. Mounting table 30 Holding table 40 Processing Unit 80 Third transport unit (transport unit) 86 Cleaning Unit 87 Drying Unit 90 Temporary Stage DT device chip (workpiece after processing) W Package substrate (workpiece)

Claims

1. a mounting table on which a container for accommodating the workpiece is placed; a holding table for holding the workpiece transferred from the mounting table; a processing unit that processes the workpiece held on the holding table; a temporary placement stage on which the processed workpiece is temporarily placed until it is transported to another device, Processing equipment.

2. The processing device according to claim 1, a cleaning unit for cleaning the workpiece after processing; The cleaning system further includes a drying unit that dries the workpiece cleaned by the cleaning unit. Processing equipment.

3. The processing device according to claim 2, the processed workpiece held on the holding table is transported by a single transport unit from the holding table to the temporary placement stage via the cleaning unit and the drying unit; Processing equipment.

4. The processing device according to claim 3, the holding table, the cleaning unit, the drying unit, and the temporary placement stage are arranged side by side in a predetermined direction, The transport unit is provided so as to be movable in the predetermined direction. Processing equipment.

5. The processing device according to any one of claims 2 to 4, the drying unit is provided integrally with the temporary placement stage; Processing equipment.

6. The processing device according to any one of claims 1 to 4, a storage shelf capable of storing at least one of the storage containers; a container transport unit that transports the container stored on the storage shelf to the storage table, Processing equipment.

7. The processing device according to any one of claims 1 to 4, a position information acquisition unit for acquiring position information of the workpiece being transported from the mounting table; The workpiece is placed on the holding table based on the position information of the workpiece acquired by the position information acquisition unit. Processing equipment.

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