Program, information processing apparatus, film forming apparatus, film forming method, and article manufacturing method

Abstract

To provide a technique advantageous for improving flatness.SOLUTION: A program for causing a computer to execute a method for generating control data of a film forming apparatus that forms a film of a composition on a substrate by irradiating the composition on the substrate with light includes an acquisition step of acquiring information on a shape of a pattern of a lower layer formed on the substrate, and a generation step of generating the control data including designation of an exposure amount distribution for the composition applied to the upper layer, which is determined based on the acquired information and a curing shrinkage characteristic of the composition.SELECTED DRAWING: Figure 11

Description

[Technical Field]

[0001] The present invention relates to a program, an information processing device, a film forming device, a film forming method, and an article manufacturing method. [Background technology]

[0002] The device manufacturing process includes a step of etching a substrate on which a pattern has been formed. If the residual film thickness of the pattern formed on the substrate is not uniform across the entire surface of the substrate due to this step, the shape (e.g., line width) of the pattern obtained by removing the residual film may be non-uniform. Therefore, a technology for making the residual film thickness uniform and planarizing the substrate is needed. Conventionally, technologies have been proposed to planarize steps on the substrate, such as forming a coating film using an existing coating machine, but these technologies do not provide sufficient planarization performance for steps on the nanoscale.

[0003] In response to this, in recent years, devices that planarize substrates using imprint technology have been studied. In such devices, a planarizing material (composition) is molded on a substrate using a mold without a pattern (also called a planar template or superstrate), and the molded composition is cured, for example, by UV exposure, to form a planarizing film. The formed planarizing film can then be subjected to a baking process.

[0004] In an apparatus for forming a composition using imprint technology, an amount of composition is supplied onto a substrate according to the level difference of the substrate, and therefore it is expected that the accuracy of planarization will be improved compared to existing methods (for example, Patent Document 1). [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Laid-Open No. 2016-219679 Summary of the Invention [Problem to be solved by the invention]

[0006] UV exposure and baking cause the composition to shrink during cure. If the cure shrinkage rate is constant regardless of the position on the substrate, the amount of cure shrinkage will differ between areas with a deep and shallow pattern depth on the substrate where the composition is applied. This results in differences in the remaining film thickness after the bake process, resulting in poor flatness.

[0007] The present invention provides an advantageous technique for improving flatness. [Means for solving the problem]

[0008] According to one aspect of the present invention, there is provided a program for causing a computer to execute a method for generating control data for a film forming apparatus that irradiates light onto a composition on a substrate to form a film of the composition on the substrate, the program being characterized by causing the computer to execute an acquisition step of acquiring information about the shape of a pattern of a lower layer formed on the substrate, and a generation step of generating control data that includes a specification of an exposure dose distribution for a composition to be applied to an upper layer, the control data being determined based on the information and the cure shrinkage characteristics of the composition. [Effects of the Invention]

[0009] According to the present invention, it is possible to provide an advantageous technique for improving flatness. [Brief explanation of the drawings]

[0010] [Figure 1] FIG. 1 is a diagram illustrating an outline of a flattening process. [Figure 2] FIG. 1 is a diagram showing the configuration of a film forming apparatus according to a first embodiment. [Figure 3] FIG. 2 is a diagram showing an example of the configuration of a control unit. [Figure 4] 1 is a flowchart of a film forming method. [Figure 5] 1A and 1B are diagrams showing the process of forming a liquid film. [Figure 6] FIG. 10 is a diagram for explaining that the amount of cure shrinkage varies depending on the location. [Figure 7]1 is a graph showing the relationship between the cumulative exposure dose of a composition and the cure shrinkage rate. [Figure 8] FIG. 10 is a diagram showing an example of adjustment of an integrated exposure amount. [Figure 9] FIG. 10 is a diagram showing an example of a configuration for creating an exposure amount distribution in a film forming unit. [Figure 10] FIG. 10 is a diagram showing an example of a configuration for creating an exposure amount distribution in a film forming unit. [Figure 11] 10 is a flowchart of a method for generating control data for specifying an exposure dose distribution. [Figure 12] FIG. 10 is a diagram showing an example of adjustment of an integrated exposure amount. DETAILED DESCRIPTION OF THE INVENTION

[0011] Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. Note that the following embodiments do not limit the scope of the invention claimed. Although multiple features are described in the embodiments, not all of these multiple features are necessarily essential to the invention, and multiple features may be combined arbitrarily. Furthermore, in the accompanying drawings, the same reference numerals are used to designate the same or similar components, and redundant explanations will be omitted.

[0012] First Embodiment A film forming apparatus according to an embodiment will be described below. The film forming apparatus is used in the manufacture of devices such as semiconductor devices as articles, and comprises: placing an uncured composition on a substrate; molding the composition in a mold; and forming a film of the composition on the substrate. In this embodiment, the film forming apparatus may be a film forming apparatus employing a photocuring method. Because the photocuring method is employed, the composition is a photocurable, moldable material.

[0013] Pattern transfer methods and devices that apply imprint lithography using a photocuring method are known for use in mass-production equipment for semiconductor devices and the like. Photocuring imprinting is generally performed as follows: First, a composition that cures under ultraviolet light is supplied to the shot area on the substrate to be imprinted using a supply mechanism (dispenser) such as an inkjet nozzle. A mold on which a device pattern has been drawn is then brought into contact with the composition. Once the composition has sufficiently penetrated the mold pattern, it is irradiated with light (ultraviolet (UV)) to cure the composition. The mold is then separated from the composition. This makes it possible to form fine patterns with good linewidth variation on the wafer.

[0014] In the EUV photolithography process, the depth of focus (DOF) of the projected image of a fine circuit pattern has become increasingly shallower due to the increasing numerical aperture (NA). In recent examples, the allowable DOF for an EUV lithography tool with an NA of 0.33 is 300–110 nm (depending on the illumination mode). The allowable DOF for an EUV lithography tool with an NA of 0.55 is 160–40 nm (depending on the illumination mode). However, it has proven difficult to achieve sufficient surface planarization within this allowable range using conventional spin coaters. In particular, spin coating creates a uniformly thick layer on the wafer due to the viscosity of the SOC coating agent dispensed onto the substrate (wafer) and the centrifugal force of the spin. Therefore, if the wiring density of the underlying pattern on the process wafer varies over a long period of 5 μm or more, the boundary where the wiring density changes will be clearly visible on the SOC film surface.

[0015] Therefore, in recent years, planarization methods that apply the above-mentioned imprint technology have been investigated. In this method, a superstrate, which is a member without a pattern formed thereon, is pressed against a liquid composition supplied onto a substrate, and once the composition has spread, UV exposure is performed to harden the composition, and then the superstrate is removed. Note that the term "imprint" is often used to refer to the concept of transferring a pattern drawn on a mold by imprinting it, but in the planarization process, no pattern is drawn on the superstrate.

[0016] An outline of a planarization process using imprint technology based on a photo-curing method will be described with reference to FIG. 1. In a planarization process using imprint technology based on a photo-curing method, a substrate can be planarized through a supplying step shown in FIG. 1(a), a contacting step shown in FIG. 1(b), a curing step shown in FIG. 1(c), and a releasing step shown in FIG. 1(d). In FIG. 1, a circuit pattern has already been formed on the surface of a substrate W chucked by a substrate chuck C, and pattern-induced irregularities of, for example, about 80 to 100 nm may exist. A requirement for planarization in this embodiment is to flatten the surface irregularities caused by this pattern.

[0017] In the supplying step shown in FIG. 1(a), a dispenser DP supplies a planarizing material, Composition ML, to the surface of a substrate W held by a substrate chuck C. The dispenser DP may be placed on a bridge (not shown) suspended above a surface plate that also serves as a Z-direction guide for the substrate stage holding the substrate chuck C. The substrate W held by the substrate chuck C is scanned one or more times below the dispenser DP to supply Composition ML over the entire substrate surface. The dispenser DP may be a jetting module that supplies Composition ML in droplet form. The dispenser DP may distribute the amount of Composition ML depending on the arrangement of the concave-convex pattern formed on the surface of the substrate W. Specifically, Composition ML may be supplied so that the density of droplets is high in areas with a high proportion of concaves in the pattern on the substrate surface and low in areas with a low proportion. Therefore, when the dispenser DP supplies Composition ML, substrate alignment measurement may be performed to align the position of the pattern formed on the substrate W with the shaded pattern of Composition ML to be supplied. The composition ML may be supplied (applied) by a spin coating method.

[0018] 1(b), a superstrate SS (also called a "planar template"), which is a mold having an outer diameter equal to or greater than that of the substrate W and a flat surface without a pattern formed thereon, is brought into contact with the composition ML, and the superstrate SS is pressed over the entire surface of the substrate W. This causes the composition ML to spread in a layer (hereinafter referred to as "filling" or "spreading").

[0019] 1(c), while the superstrate SS is in contact with the composition ML on the substrate W, ultraviolet light from the light source IL is irradiated all over the surface of the substrate W (or as repeated partial exposures), thereby curing the composition ML that has spread in a layer.

[0020] In the demolding process shown in Figure 1(d), the superstrate SS is separated from the cured composition ML on the substrate W. This flattens the surface irregularities caused by the pattern on the substrate W. Note that the objective here is not to correct the flatness of low spatial frequency components, such as distortion of the overall substrate profile relative to an absolute flat surface. Such components are compensated for by focus tracking control of the exposure tool in the subsequent pattern formation process.

[0021] In this way, planarization processing using imprint technology is a technology that achieves nano-order planarization by supplying a composition according to the steps on a substrate, contacting the supplied composition with a flat, thin member called a superstrate, and curing the composition. Note that the use of a superstrate is not essential for planarization processing. If a solvent is added to the composition, planarization may be achieved without the use of a superstrate. Therefore, a type of planarization processing is also possible in which the composition is allowed to naturally spread and planarize without contacting the composition with a superstrate, and then the composition is cured.

[0022] Therefore, in one example, the film forming apparatus may be a planarization apparatus that uses imprint technology. In the following, the film forming apparatus will be described as a specific example being a planarization apparatus.

[0023] 2 is a schematic diagram showing the configuration of a film forming apparatus 1 according to this embodiment. In the accompanying drawings, the Z axis is taken as the vertical direction, and the X and Y axes, which are perpendicular to each other, are taken in a plane perpendicular to the Z axis. In the following, the directions parallel to the X, Y, and Z axes are referred to as the X direction, Y direction, and Z direction, respectively.

[0024] 2, film forming apparatus 1 may include a composition supply unit 2, a film formation unit 3, a bake unit 4, and a control unit 5. A substrate 6 is transported to each of the composition supply unit 2, the film formation unit 3, and the bake unit 4 by a transport device (not shown). The composition supply unit 2 includes a substrate stage 7, the film formation unit 3 includes a substrate stage 10, and the bake unit 4 includes a substrate stage 19. A chuck (vacuum chuck or electrostatic chuck) (not shown) is mounted on the top of each of the substrate stages 7, 10, and 19, and the substrate 6 can be fixed by the chuck.

[0025] The composition supply unit 2 includes a substrate stage 7 that holds and moves a substrate 6 (wafer), and a supply unit 8 (dispenser) that places the composition in the form of droplets on the substrate 6. The control unit 5 can use the supply unit 8 to place a composition 9 containing a solvent and a polymerizable material on the substrate 6 while moving the substrate stage 7 and the supply unit 8 relatively in the X and Y directions. This method of supplying droplets using a dispenser is called a jetting method, but other methods (spin coating, slit coating, screen printing, etc.) may also be used.

[0026] The composition is a curable composition that cures when curing energy is applied. Examples of curing energy include electromagnetic waves and heat. The electromagnetic waves can be, for example, light having a wavelength selected from the range of 10 nm to 1 mm, such as infrared light, visible light, and ultraviolet light. The curable composition can be a composition that cures when irradiated with light or when heated. Among these, photocurable compositions that cure when irradiated with light contain at least a polymerizable compound and a photopolymerization initiator and may further contain a non-polymerizable compound or a solvent, as needed. The non-polymerizable compound is at least one selected from the group consisting of sensitizers, hydrogen donors, internal mold release agents, surfactants, antioxidants, and polymer components. The viscosity of the curable composition (at 25°C) can be, for example, 1 mPa·s to 100 mPa·s. Examples of materials that can be used for the substrate include glass, ceramics, metals, semiconductors, and resins. If necessary, a member made of a material different from the substrate may be provided on the surface of the substrate. The substrate is, for example, a silicon wafer, a compound semiconductor wafer, or quartz glass.

[0027] In this embodiment, composition 9 is a curable composition that cures when irradiated with light of a specific wavelength. The curable composition contains at least a polymerizable compound, which is a non-volatile component, and a solvent, which is a volatile component. The solvent is a solvent that dissolves the polymerizable compound. Examples of such solvents include alcohol-based solvents, ketone-based solvents, ether-based solvents, ester-based solvents, and nitrogen-containing solvents. In this specification, a cured film refers to a film obtained by polymerizing and curing composition 9 on a substrate.

[0028] The film forming unit 3 includes a substrate stage 10 that holds and moves the substrate 6, a mold holding unit 22 that holds a mold 21 (also called a superstrate or flattening plate) that is brought into contact with a film 20 (liquid film) made of a composition 9 on the substrate 6, and an irradiation unit 23 that irradiates light to cure the liquid film 20. The irradiation unit 23 may include a light source. The light source may be a UV lamp, UV-LED, or the like, but is not limited to a specific light source as long as it transmits through the mold 21 and emits light of a wavelength that cures the composition 9. The mold 21 is made of a material that transmits the light irradiated from the irradiation unit 23. The mold holding unit 22 adsorbs and holds the mold 21. By irradiating light from the irradiation unit 23 while the mold 21 (flat surface of the mold 21) is in contact with the liquid film 20 on the substrate 6, the liquid film 20 on the substrate 6 can be cured to form a cured film (flattening film).

[0029] The bake unit 4 includes a substrate stage 19 that holds and moves the substrate 6, a heating plate 11 that is mounted on the substrate stage 19 and heats the planarizing film via the substrate 6, and a chamber 13 that accommodates them. In the bake unit 4, a baking process is performed to impart heat resistance to the planarizing film formed in the film formation unit 3. In one example, the baking process may include baking the planarizing film on the heating plate 11 at 250°C for 2 minutes in an N2 environment.

[0030] The control unit 5 can control the entire film forming apparatus 1. Specifically, the control unit 5 controls the transport device (not shown), the supply unit 8, the irradiation unit 23, the heating plate 11, the mold holding unit 22, and the substrate stages 7, 10, and 19. The control unit 5 can be configured as a general-purpose or dedicated computer with a built-in program, or a combination of all or part of these. FIG. 3 shows an example configuration of the control unit 5. The control unit 5 in FIG. 3 is configured as a computer (information processing device). The control unit 5 can include, for example, a CPU 51, a ROM 52 that stores a boot program and fixed data, and a RAM 53 that provides a work area for the CPU 51 and stores temporary data. The control unit 5 can also include a memory unit 54 that stores a control program for performing the planarization process. In this embodiment, the control unit 5 can function as a generation unit that generates control data for the film forming apparatus 1.

[0031] A film formation method using the film forming apparatus 1 will be described with reference to the flowchart in Fig. 4. S101 is a placement step of placing a composition 9 on a substrate 6. The substrate 6 is carried into the composition supply unit 2 by the transport device, and is placed on the substrate stage 7 and fixed by a chuck. The control unit 5 controls the supply unit 8 and the substrate stage 7 to discretely place the composition 9 on the substrate 6.

[0032] The substrate 6 on which the composition 9 has been placed is transported by a transport device from the composition supply unit 2 and into the film formation unit 3. The multiple droplets of the composition 9 discretely placed on the substrate 6 by the supply unit 8 begin to spread on the surface of the substrate 6 immediately after being placed on the substrate 6. FIG. 5 is a diagram showing the spreading of multiple droplets of the composition 9 on the surface of the substrate 6. First, the multiple droplets of the composition 9 discretely placed begin to spread on the substrate 6. As the multiple droplets of the composition 9 continue to spread, adjacent droplets combine with each other, and eventually, the spaces between the compositions 24 (between the droplets) are filled, forming a film 20 (liquid film). The state of the formation of the liquid film from the composition 9 may be observed using an imaging unit (not shown).

[0033] S102 is a volatilization step in which the solvent contained in the liquid film is volatilized. This volatilization step may be understood as a waiting step in which the process waits for a predetermined time to volatilize the solvent contained in the liquid film. During the waiting time, the environment may be adjusted to enhance the volatilization effect of the solvent.

[0034] S103 is a forming step in which the film 20 formed on the substrate 6 is cured to form a cured film. The forming step may include a contacting step S1031, a curing step S1032, and a separating step S1033. In the contacting step S1031, the control unit 5 drives at least one of the mold holding unit 22 and the substrate stage 10 to bring the film 20 on the substrate 6 into contact with the mold 21 (the flat portion thereof). In the curing step S1032, the control unit 5 causes the irradiation unit 23 to irradiate light while the film 20 and the mold 21 are in contact with each other, thereby curing the film 20. As a result, a cured film (solid layer) is formed on the substrate 6. In the separating step S1033, the control unit 5 drives at least one of the mold holding unit 22 and the substrate stage 19 to separate the cured film 20 from the mold 21. It should be noted that, if the film forming unit 3 is of a type that performs planarization without using the mold 21, the contacting step S1031 and the separating step S1033 are omitted. In this case, the planarization process is performed by waiting for the composition 9 to be planarized by naturally spreading, and then curing the composition 9 using the irradiation unit 23.

[0035] The substrate 6, on whose surface a cured film of composition 9 has been formed, is carried out by a transport device from the film forming unit 3 and into the bake unit 4. The substrate 6 carried into the bake unit 4 is placed on a substrate stage 19 and fixed by a chuck. Then, in S104, a bake step is performed in which the substrate 6 and the cured film thereon are heated. After the bake step is completed, the control unit 5 controls the transport device to carry the substrate 6 out of the bake unit 4.

[0036] The curing and baking steps are accompanied by cure shrinkage of the film 20. To obtain excellent planarization performance, it is desirable that the cure shrinkage of the film 20 of the composition 9 between before the curing step and after the baking step is low (for example, 5.0% or less). Here, the cure shrinkage refers to the linear shrinkage of the film 20 after the baking step. If the cure shrinkage is S, the film thickness before the curing step is Du, and the film thickness after the baking step is Db, then the cure shrinkage S is given by S=(Tu-Tb) / Tu The curing shrinkage of the film 20 is unavoidable during the curing and baking processes. The problem is that the amount of cure shrinkage of the film 20 of composition 9 formed on the upper layer varies depending on the pattern shape (pattern depth, pattern density) of the lower layer. Figure 6 shows a cross-sectional schematic of the lower layer UL on the substrate and the film 20 of composition 9 formed on the upper layer. Figure 6(a) shows the state before the curing process. The lower layer UL has a pattern formed thereon, with regions where the pattern depth is deep and regions where it is shallow (regions without a pattern). The film thickness in the deep pattern depth region is D1, while the film thickness in the shallow pattern depth region is D2, which is smaller than D1. If the cure shrinkage rate is the same, the amount of cure shrinkage will differ between the region with a film thickness of D1 and the region with a film thickness of D2. Figure 6(b) shows the state after the bake process. The amount of cure shrinkage of the region with a film thickness of D1 before the curing process is SH1, and the amount of cure shrinkage of the region with a film thickness of D2 before the curing process is SH2, which is smaller than SH1. As described above, after the baking step, the amount of cure shrinkage differs depending on the pattern shape of the lower layer, resulting in poor flatness.

[0037] First Embodiment Therefore, in the first embodiment, light irradiation in the curing process is controlled based on the shape of the pattern of the lower layer formed on the substrate 6 and the curing shrinkage characteristics of the composition so that an exposure dose distribution is formed for the composition applied to the upper layer.

[0038] Fig. 7 shows a graph illustrating the relationship between the cumulative exposure dose and the cure shrinkage rate (cure shrinkage characteristics) of composition 9. According to Fig. 7, in the curing process, the greater the cumulative exposure dose, the smaller the cure shrinkage rate. Conventionally, the only measure taken to reduce the cure shrinkage rate was to increase the cumulative exposure dose, but in this embodiment, the region where the cure shrinkage rate changes significantly is actively utilized, and the cumulative exposure dose is adjusted so that the cure shrinkage rate increases or decreases.

[0039] A specific example will be described with reference to FIG. 8. FIG. 8(a) shows a diagram similar to FIG. 6(a). The film thickness of the upper layer in the region where the pattern depth of the pattern formed on the lower layer UL is deep is D1, and the film thickness of the upper layer in the region where the pattern depth is shallow is D2, which is smaller than D1. In this case, in the curing process, as shown in FIG. 8(b), the integrated exposure dose in the region where the pattern depth is deep is Ia, and the integrated exposure dose in the region where the pattern depth is shallow is Ib, which is smaller than Ia. The cure shrinkage rate of the film 20 when the integrated exposure dose is Ia is Sa%, and the cure shrinkage rate of the film 20 when the integrated exposure dose is Ib is Sb%, which is larger than Sa. The values ​​of Sa and Sb are determined according to the characteristics shown in FIG. 7 so that the cure shrinkage rates of the film 20 are equal in the region where the pattern depth is deep and the region where the pattern depth is shallow.

[0040] Therefore, the film forming unit 3 in this embodiment provides an exposure amount distribution according to the pattern depth so that the amount of cure shrinkage of the film 20 is constant over the entire surface of the substrate 6.

[0041] FIG. 9 shows an example of a configuration for creating an exposure dose distribution in the film formation unit 3. FIG. 9(a) shows an example in which a mask 91 is attached to the surface of the mold 21 (the surface opposite the substrate 6). The mask 91 can be a binary mask or a gray-tone mask having a pattern of light-shielding portions corresponding to the desired exposure dose distribution. FIG. 9(b) shows an example in which a mask 92 is disposed between the irradiation unit 23 (light source) and the mold 21. The mask 92 can be a binary mask or a gray-tone mask having a pattern of light-shielding portions corresponding to the desired exposure dose distribution. The mask 92 can be held by a mask holder 93.

[0042] FIG. 10 shows another example of a configuration for creating an exposure dose distribution in the film formation unit 3. In the example shown in FIG. 10(a), the irradiation unit 23 is configured to locally irradiate the substrate 6 with light from a point light source. The irradiation unit 23 and the substrate stage 10 can be driven relatively. The control unit 5 controls the on / off of the point light source while driving the irradiation unit 23 and the substrate stage 10 relative to each other, thereby creating a desired exposure dose distribution. In the example shown in FIG. 10(b), the irradiation unit 23 includes a light adjustment unit 231 that irradiates the substrate 6 with only specific light from the emitted light to form the exposure dose distribution. The light adjustment unit 231 includes one or more spatial light modulators (SLMs). An example of an SLM is a digital mirror device (DMD), such as a digital micromirror device. The DMD includes multiple mirrors that can control the direction of light emitted from a light source and operates to adjust the integrated exposure dose at each position on the substrate. The DMD individually adjusts the surface direction of each of the multiple mirrors to create a desired exposure dose distribution. 10(c), the irradiation unit 23 equipped with a light adjustment unit 231 (DMD) is configured to locally irradiate light onto the substrate 6. The irradiation unit 23 and the substrate stage 10 can be driven relatively. While the irradiation unit 23 and the substrate stage 10 are driven relatively, the DMD individually adjusts the surface direction of each of the multiple mirrors, thereby forming a desired exposure dose distribution.

[0043] 11 shows a flowchart of a method for generating control data for specifying an exposure dose distribution, which is executed by the control unit 5 (information processing device). The information processing device may be an external information processing device independent of the film forming apparatus 1. Alternatively, the information processing device may be the control unit 5 of the film forming apparatus 1. When the information processing device is the control unit 5, a program corresponding to the flowchart of FIG. 11 is included in a control program stored in, for example, the storage unit 54, and is executed by the CPU 51. The following describes the case where the information processing device is the control unit 5.

[0044] In S1101, the control unit 5 acquires information about the shape of the pattern of the lower layer formed on the substrate 6 (acquisition step). In S1102, the control unit 5 generates control data including a specification of the exposure dose distribution for the film 20 formed by the composition 9 applied to the upper layer, which is determined based on the acquired information and the cure shrinkage characteristics of the composition 9 (generation step).

[0045] 9(a) or 9(b), the mask 91 or 92 is produced based on the exposure dose distribution specification included in the generated control data. In this case, in the production step, the control unit 5 preferably includes in the control data design data for the mask to be placed on the surface of the mold 21 in order to achieve the specified exposure dose distribution. This design data makes it easier to produce the mask.

[0046] 10(a), the control unit 5 can generate a recipe for the relative drive of the irradiation unit 23 and the substrate stage 10 and the on / off control of the point light source in accordance with the exposure dose distribution specification included in the generated control data. In this case, in the generation step, the control unit 5 preferably includes design data for a mask to be placed on the surface of the mold 21 in order to achieve the specified exposure dose distribution. This design data makes it easier to manufacture the mask.

[0047] When the film forming unit 3 has a configuration as shown in Figure 10(b), in S1102, the control unit 5 generates control information for the DMD to realize the exposure dose distribution determined based on the information acquired in S1101 and the curing shrinkage characteristics, and includes this in the control data.

[0048] Furthermore, when the film formation unit 3 has the configuration shown in FIG. 10(c), the control unit 5 generates a recipe for the relative drive of the irradiation unit 23 and the substrate stage 10, and control information for the DMD, in S1102.

[0049] The control unit 5 of the film forming apparatus 1 performs control processing to form a film of the composition on the substrate in accordance with the control data generated by the information processing device (the control unit 5 in the above example). That is, in the forming step S103, the control unit 5 controls the light irradiation of the composition based on the exposure dose distribution specification included in the control data.

[0050] According to the above embodiment, the flatness of the formed film can be improved.

[0051] Second Embodiment In the first embodiment described above, the depth of the pattern irregularities was used as a parameter for specifying the shape of the pattern of the lower layer. Instead of the depth of the pattern irregularities, the density of the pattern may be used. Alternatively, both the depth of the pattern irregularities and the density of the pattern may be used as parameters for specifying the shape of the pattern of the lower layer. A specific example is shown with reference to FIG. 12. FIG. 12 shows a diagram similar to FIG. 8. In FIG. 12(a), the film thickness of the upper layer in regions where the pattern depth of the pattern formed in the lower layer UL is deep is D1, and the film thickness of the upper layer in regions where the pattern depth is shallow is D2, which is smaller than D1. Furthermore, in regions where the film thickness of the upper layer is D1, there are regions where the pattern density is sparse and regions where it is dense. The amount (volume) of the composition applied in the upper layer differs between regions where the pattern density is sparse and regions where it is dense.

[0052] In this case, in the curing process, as shown in FIG. 12(b), the integrated exposure amount in the region where the pattern depth is deep and the pattern density is sparse is Ia, and the integrated exposure amount in the region where the pattern depth is deep but the pattern density is dense is Ic, which is less than Ia. The integrated exposure amount in the region where the pattern depth is shallow is Ib, which is less than Ic. The cure shrinkage rate of the film 20 when the integrated exposure amount is Ia and Ic is Sa%, and when the integrated exposure amount is Ib, the cure shrinkage rate of the film 20 is Sb%, which is greater than Sa. The values ​​of Sa and Sb are determined according to the characteristics shown in FIG. 7 so that the cure shrinkage rate of the film 20 is equal in the region where the pattern depth is deep and the region where the pattern depth is shallow.

[0053] Therefore, the film forming unit 3 in the second embodiment provides an exposure dose distribution according to the pattern depth so that the amount of cure shrinkage of the film 20 is constant over the entire surface of the substrate 6, based on the depth of the pattern irregularities and the density of the pattern.

[0054] <Third embodiment> 9(b) illustrates an example in which the curing step is performed in the film formation unit 3 by placing a mask 92 between the irradiation unit 23 (light source) and the mold 21. Alternatively, the curing step may be performed in an external exposure device (for example, an i-line exposure device) rather than in the film formation unit 3. Here, an example in which planarization is performed without using the mold 21 will be described.

[0055] A binary mask or gray-tone mask having the same function as the mask 92 is attached to the exposure tool as an original. That is, this original is an original prepared to obtain an exposure dose distribution determined based on the shape of the pattern of the lower layer of the substrate 6 and the cure shrinkage characteristics of the composition 9.

[0056] After the composition 9 is placed on the substrate 6 in the composition supply unit 2 and becomes a liquid film, the substrate 6 is transported to the exposure unit by the transport device. The curing step is then carried out by exposure to light by this exposure unit. After the curing step is completed, the substrate 6 is transported by the transport device to the bake unit 4, where the baking step is carried out.

[0057] <Fourth embodiment> The amount of hardening of the film 20 due to light in the hardening step and the amount of hardening of the film 20 due to heat in the baking step may differ depending on the pattern shape (pattern depth, pattern density) of the lower layer.

[0058] Therefore, the ratio of the amount of curing due to light in the curing step to the amount of curing due to heat in the baking step may be changed depending on the position on the substrate, thereby making it possible to further improve flatness.

[0059] <Embodiment of an article manufacturing method> Next, a method for manufacturing an article (such as a semiconductor IC element, a liquid crystal display element, a color filter, or a MEMS) using the aforementioned molding apparatus will be described. This manufacturing method includes a step of planarizing a composition disposed on a substrate (such as a wafer or glass substrate) using a film-forming apparatus as the aforementioned molding apparatus, and a step of curing the composition. This results in a planarized film being formed on the substrate. The substrate on which the planarized film has been formed is then processed, such as by forming a pattern using a lithography apparatus, and the processed substrate is then processed in other well-known processing steps to manufacture the article. These other well-known steps include patterning exposure and associated pre-processing, etching, resist stripping, dicing, bonding, packaging, and the like. This manufacturing method enables the manufacture of higher-quality articles than conventional methods.

[0060] (Other embodiments) The present invention can also be realized by supplying a program that realizes one or more functions of the above-described embodiments to a system or device via a network or a storage medium, and having one or more processors in the computer of the system or device read and execute the program. It can also be realized by a circuit (e.g., ASIC) that realizes one or more functions.

[0061] The disclosure of the present specification includes at least the following techniques. (Item 1) 1. A program for causing a computer to execute a method for generating control data for a film forming apparatus that irradiates a composition on a substrate with light to form a film of the composition on the substrate, the program comprising: an acquisition step of acquiring information on the shape of a pattern of a lower layer formed on the substrate; generating control data including a specification of an exposure dose distribution for a composition to be applied to the upper layer, the control data being determined based on the information and the cure shrinkage characteristics of the composition; A program characterized by executing the following. (Item 2) 2. The program according to item 1, wherein the curing shrinkage characteristic is a characteristic that indicates the relationship between an integrated exposure amount and a curing shrinkage rate, and the larger the integrated exposure amount, the smaller the curing shrinkage rate. (Item 3) the film forming apparatus is configured to mold the composition on the substrate using a mold, and then irradiate the composition with light to form a film of the composition on the substrate; the control data includes design data of a mask to be placed on the surface of the mold to achieve the specified exposure dose distribution; 3. The program according to item 1 or 2. (Item 4) the film forming apparatus is configured to mold the composition on the substrate using a mold, and then irradiate the composition with light to form a film of the composition on the substrate; the film forming apparatus has a mask holder that holds a mask interposed between a light source and the mold; the control data includes design data of the mask for realizing the specified exposure dose distribution; 3. The program according to item 1 or 2. (Item 5) The film forming apparatus includes: a digital mirror device including a plurality of mirrors capable of controlling the direction of light emitted from a light source, the digital mirror device operating to adjust an integrated exposure amount at each position on the substrate; the control data includes control information for the digital mirror device as a designation of the exposure dose distribution; 3. The program according to item 1 or 2. (Item 6) An information processing device that generates control data for a film forming device that irradiates a composition on a substrate with light to form a film of the composition on the substrate, an acquisition means for acquiring information on the shape of a pattern of a lower layer formed on the substrate; a generating means for generating control data including a specification of an exposure dose distribution for the composition to be applied to the upper layer based on the information and the cure shrinkage characteristics of the composition; An information processing device comprising: (Item 7) A film forming apparatus for irradiating a composition on a substrate with light to form a film of the composition on the substrate, comprising: a control unit that performs control processing to form a film of the composition on the substrate in accordance with control data; the control data includes a specification of an exposure dose distribution for a composition to be applied to an upper layer, the exposure dose distribution being determined based on the shape of a pattern of a lower layer formed on the substrate and the cure shrinkage characteristics of the composition; the control unit controls the light irradiation of the composition based on the specified exposure dose distribution. A film forming apparatus characterized by: (Item 8) a forming step of irradiating a composition on a substrate with light in accordance with control data to form a film of the composition on the substrate; the control data includes a specification of an exposure dose distribution for a composition to be applied to an upper layer, the exposure dose distribution being determined based on the shape of a pattern of a lower layer formed on the substrate and the cure shrinkage characteristics of the composition; In the forming step, light irradiation of the composition is controlled based on the specified exposure dose distribution. A film forming method comprising: (Item 9) a curing step of irradiating the composition on the substrate with light to cure the composition; a baking step of heating the composition after the curing step; and the curing step is carried out by exposing the substrate to light using an exposure device, using a master prepared so as to obtain an exposure dose distribution determined based on the shape of a pattern of a lower layer of the substrate and the curing shrinkage characteristics of the composition; A film forming method comprising: (Item 10) a curing step of irradiating the composition on the substrate with light to cure the composition; a baking step of heating the composition after the curing step; and changing the ratio of the amount of curing by light in the curing step to the amount of curing by heat in the baking step depending on the position on the substrate; A film forming method comprising: (Item 11) A forming step of forming a film of the composition on a substrate using the film forming apparatus according to item 7; a processing step of processing the substrate on which the film is formed; and manufacturing an article from the processed substrate. (Item 12) A forming step of forming a film of the composition on a substrate according to the film forming method of any one of items 8 to 10; a processing step of processing the substrate on which the film is formed; and manufacturing an article from the processed substrate.

[0062] The invention is not limited to the above-described embodiments, and various changes and modifications can be made without departing from the spirit and scope of the invention. Accordingly, the following claims are appended to apprise the public of the scope of the invention. [Explanation of symbols]

[0063] 1: film forming device, 2: composition supply unit, 3: film forming unit, 4: baking unit, 5: control unit

Claims

1. 1. A program for causing a computer to execute a method for generating control data for a film forming apparatus that irradiates a composition on a substrate with light to form a film of the composition on the substrate, the program comprising: an acquisition step of acquiring information on the shape of a pattern of a lower layer formed on the substrate; generating control data including a specification of an exposure dose distribution for a composition to be applied to the upper layer, the control data being determined based on the information and the cure shrinkage characteristics of the composition; A program characterized by executing the following.

2. 2. The program according to claim 1, wherein the curing shrinkage characteristic is a characteristic that indicates a relationship between an integrated exposure amount and a curing shrinkage rate, and the larger the integrated exposure amount, the smaller the curing shrinkage rate.

3. the film forming apparatus is configured to mold the composition on the substrate using a mold, and then irradiate the composition with light to form a film of the composition on the substrate; the control data includes design data of a mask to be placed on the surface of the mold to achieve the specified exposure dose distribution; 3. The program according to claim 1 or 2.

4. the film forming apparatus is configured to mold the composition on the substrate using a mold, and then irradiate the composition with light to form a film of the composition on the substrate; the film forming apparatus has a mask holder that holds a mask interposed between a light source and the mold; the control data includes design data of the mask for realizing the specified exposure dose distribution; 3. The program according to claim 1 or 2.

5. The film forming apparatus includes: a digital mirror device including a plurality of mirrors capable of controlling the direction of light emitted from a light source, the digital mirror device operating to adjust an integrated exposure amount at each position on the substrate; the control data includes control information for the digital mirror device as a designation of the exposure dose distribution; 3. The program according to claim 1 or 2.

6. An information processing device that generates control data for a film forming device that irradiates a composition on a substrate with light to form a film of the composition on the substrate, an acquisition means for acquiring information on the shape of a pattern of a lower layer formed on the substrate; a generating means for generating control data including a specification of an exposure dose distribution for the composition to be applied to the upper layer based on the information and the cure shrinkage characteristics of the composition; An information processing device comprising:

7. A film forming apparatus for irradiating a composition on a substrate with light to form a film of the composition on the substrate, comprising: a control unit that performs control processing to form a film of the composition on the substrate in accordance with control data; the control data includes a specification of an exposure dose distribution for a composition to be applied to an upper layer, the exposure dose distribution being determined based on the shape of a pattern of a lower layer formed on the substrate and the cure shrinkage characteristics of the composition; the control unit controls the light irradiation of the composition based on the specified exposure dose distribution. A film forming apparatus characterized by:

8. a forming step of irradiating a composition on a substrate with light in accordance with control data to form a film of the composition on the substrate; the control data includes a specification of an exposure dose distribution for a composition to be applied to an upper layer, the exposure dose distribution being determined based on the shape of a pattern of a lower layer formed on the substrate and the cure shrinkage characteristics of the composition; In the forming step, light irradiation of the composition is controlled based on the specified exposure dose distribution. A film forming method comprising:

9. a curing step of irradiating the composition on the substrate with light to cure the composition; a baking step of heating the composition after the curing step; and the curing step is carried out by exposing the substrate to light using an exposure device, using a master prepared so as to obtain an exposure dose distribution determined based on the shape of a pattern of a lower layer of the substrate and the curing shrinkage characteristics of the composition; A film forming method comprising:

10. a curing step of irradiating the composition on the substrate with light to cure the composition; a baking step of heating the composition after the curing step; and changing the ratio of the amount of curing by light in the curing step to the amount of curing by heat in the baking step depending on the position on the substrate; A film forming method comprising:

11. a forming step of forming a film of a composition on a substrate using the film forming apparatus according to claim 7; a processing step of processing the substrate on which the film is formed; and manufacturing an article from the processed substrate.

12. a forming step of forming a film of the composition on a substrate according to the film forming method of any one of claims 8 to 10; a processing step of processing the substrate on which the film is formed; and manufacturing an article from the processed substrate.

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