resin composition

Abstract

Provided is a resin composition that contributes to lowering the dielectric loss tangent of a cured product, particularly a resin composition that contributes to realizing a cured product that exhibits a lower dielectric loss tangent even in a high-temperature (100°C) environment. [Solution] A resin composition containing (A) a cyclic ether compound having a four-membered ring or less, (B) a curing agent, (C) an inorganic filler, and (1D) an aluminum complex, wherein component (A) includes (A1) a cyclic ether compound having a four-membered ring or less and having cationic polymerizability.

Description

[Technical Field]

[0001] The present invention relates to a resin composition, and further to a resin sheet, a prepreg, a cured product, a circuit board, a semiconductor chip package, and a semiconductor device obtained using the resin composition. [Background technology]

[0002] In recent years, there has been an increasing demand for high-performance electronic devices such as smartphones and tablet devices, and this has led to demand for even higher performance in insulating materials for printed wiring boards and the like used in these small electronic devices, as well as sealing and insulating materials for semiconductor chips, etc. Known sealing and insulating materials are formed by curing resin compositions, and examples thereof include the resin composition disclosed in Patent Document 1. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2018-53092 Summary of the Invention [Problem to be solved by the invention]

[0004] Sealing and insulating materials are required to have excellent dielectric properties (low dielectric constant, low dielectric dissipation factor) to reduce transmission loss when used in high-frequency environments. The inventors have discovered that even if a cured product has a low dielectric dissipation factor at around room temperature (23°C), the dielectric dissipation factor may increase significantly in a high-temperature (100°C) environment.

[0005] The present invention has been made in view of the above-mentioned problems, and an object of the present invention is to provide a resin composition that contributes to lowering the dielectric loss tangent of a cured product, particularly a resin composition that contributes to realizing a cured product that exhibits a lower dielectric loss tangent even in a high-temperature (100°C) environment. [Means for solving the problem]

[0006] As a result of extensive investigations, the present inventors have found that the above problems can be solved by a resin composition having the following constitution, and have completed the present invention.

[0007] That is, the present invention includes the following. [1] (A) a cyclic ether compound having a four-membered ring or less, (B) a curing agent; (C) inorganic fillers, and (1D) Aluminum complexes, A resin composition comprising: A resin composition, wherein the component (A) contains (A1) a cationically polymerizable cyclic ether compound having a four- or less-membered ring. [2] (A) a cyclic ether compound having a four-membered ring or less, (B) a curing agent; (C) Inorganic filler, (2D-1) Aluminum, and (2D-2) an organic ligand having an oxygen atom as a coordinating atom; A resin composition comprising: A resin composition, wherein the component (A) contains (A1) a cationically polymerizable cyclic ether compound having a four- or less-membered ring. [3] The resin composition according to [1] or [2], wherein the component (A) further contains a cyclic ether compound having a four-membered ring or less other than the component (A1) (hereinafter referred to as "component (A2)"). [4] The resin composition according to any one of [1] to [3], wherein the content of the component (A1) is 0.1 to 6.0% by mass, where the total amount of non-volatile components in the resin composition is 100% by mass. [5] The resin composition according to any one of [1] to [4], wherein the content of component (C) is 50% by mass or more when the total amount of nonvolatile components in the resin composition is 100% by mass. [6] The resin composition according to any one of [1] and [3] to [5], wherein the content of the component (1D) is 0.01 to 0.20% by mass, when the total amount of non-volatile components in the resin composition is 100% by mass. [7] The resin composition according to any one of [2] to [5], wherein the total content of the components (2D-1) and (2D-2) is 0.01 to 0.20% by mass, when the total non-volatile components in the resin composition is 100% by mass. [8] The resin composition according to any one of [1] to [7], wherein the component (A1) contains an alicyclic epoxy resin. [9] The resin composition according to any one of [3] to [8], wherein the component (A2) contains an aromatic epoxy resin.

[10] The resin composition according to any one of [1] to [9], wherein the component (B) contains an active ester curing agent.

[11] The resin composition according to any one of [1] to

[10] , wherein the component (C) contains an inorganic oxide.

[12] The resin composition according to any one of [1] to

[11] , wherein the component (C) contains silica.

[13] The resin composition according to any one of [1] to

[12] , wherein the average particle size of component (C) is 5.0 μm or less.

[14] (C) The specific surface area of ​​the component is 0.1 to 50 m 2 The resin composition according to any one of [1] to

[13] , wherein the resin composition is a resin composition having a molecular weight of 1.0 or less.

[15] The resin composition according to any one of [1], [3] to [6], and [8] to

[14] , wherein the component (1D) contains an aluminum chelate complex.

[16] The resin composition according to any one of [1], [3] to [6], and [8] to

[15] , wherein the component (1D) contains one or more aluminum complexes selected from the group consisting of aluminum complexes having an alkoxide as a ligand, aluminum complexes having a β-diketone enolate as a ligand, and aluminum complexes having a β-ketoester enolate as a ligand.

[17] The resin composition according to any one of [2] to [5] and [7] to

[14] , wherein the component (2D-1) contains aluminum ions.

[18] The resin composition according to any one of [2] to [5], [7] to

[14] , and

[17] , wherein the component (2D-2) contains one or more organic ligands selected from the group consisting of alcohols, alkoxides, β-diketones, β-diketone enolates, β-ketoesters, and β-ketoester enolates.

[19] The resin composition according to any one of [1] to

[18] , further comprising (E) a radical curable resin.

[20] The resin composition according to any one of [1] to

[19] , further comprising (F) a curing accelerator.

[21] The resin composition according to any one of [1] to

[20] , further comprising (G) an organic filler.

[22] The resin composition according to any one of [1] to

[21] , further comprising (H) a thermoplastic resin.

[23] The resin composition according to any one of [1] to

[22] , wherein the dielectric loss tangent (Df) of a cured product of the resin composition is 0.0050 or less when measured at 5.8 GHz and 100°C.

[24] The resin composition according to any one of [1] to

[23] , which is for use in an insulating layer of a circuit board.

[25] The resin composition according to any one of [1] to

[23] , which is used for semiconductor encapsulation.

[26] A resin sheet comprising a support and a layer of the resin composition according to any one of [1] to

[25] provided on the support.

[27] The resin sheet according to

[26] , wherein the support is a thermoplastic resin film or a metal foil.

[28] A prepreg obtained by impregnating a sheet-like fiber substrate with the resin composition according to any one of [1] to

[25] .

[29] A cured product of the resin composition according to any one of [1] to

[25] .

[30] A circuit board comprising an insulating layer made of a cured product of the resin composition according to any one of [1] to

[24] .

[31] A semiconductor chip package comprising an encapsulating layer made of a cured product of the resin composition according to any one of [1] to

[23] and

[25] .

[32] The semiconductor chip package according to

[31] , which is a fan-out type package.

[33] A semiconductor device comprising the circuit board according to

[30] .

[34] A semiconductor device comprising the semiconductor chip package according to

[31] or

[32] . [Effects of the Invention]

[0008] According to the present invention, it is possible to provide a resin composition that contributes to lowering the dielectric loss tangent of a cured product, particularly a resin composition that contributes to realizing a cured product that exhibits a lower dielectric loss tangent even in a high-temperature (100°C) environment, as well as a resin sheet, prepreg, cured product, circuit board, semiconductor chip package, and semiconductor device obtained using the resin composition. DETAILED DESCRIPTION OF THE INVENTION

[0009] The present invention will be described in detail below with reference to embodiments and examples. However, the present invention is not limited to the embodiments and examples described below, and can be implemented with any modifications within the scope of the claims and their equivalents.

[0010] [Terminology] In the following description, unless otherwise specified, the expressions "XX to YY" or "XX to YY" representing a numerical range mean a numerical range including the lower and upper limits, which are the endpoints. When a numerical range is described in stages, the upper and lower limits of each numerical range can be combined in any way.

[0011] In the following description, the term "non-volatile components" refers to all components constituting the resin composition other than the organic solvent, which will be described later. The term "resin components" refers to all components constituting the resin composition other than the inorganic filler, which will be described later.

[0012] In the following description, "dielectric constant" refers to "relative dielectric constant" unless otherwise specified.

[0013] In the following description, unless otherwise specified, the term "optionally substituted" in reference to a compound or group means both a case where the hydrogen atoms of the compound or group are not substituted with a substituent and a case where some or all of the hydrogen atoms of the compound or group are substituted with a substituent. Furthermore, when the number of constituent atoms or carbon atoms of the compound or group is stated, the number of constituent atoms or carbon atoms does not include the number of constituent atoms or carbon atoms of substituents, unless otherwise specified.

[0014] In the following description, the term "aromatic ring" refers to a ring conforming to Hückel's rule, in which the number of electrons contained in the π-electron system on the ring is 4r+2 (r is a natural number), and includes monocyclic aromatic rings and fused aromatic rings in which two or more monocyclic aromatic rings are fused. Unless otherwise specified, the aromatic ring is preferably a monocyclic aromatic ring. The aromatic ring may be an aromatic carbocyclic ring having only carbon atoms as ring-constituting atoms, or an aromatic heterocyclic ring having heteroatoms such as oxygen atoms, nitrogen atoms, and sulfur atoms as ring-constituting atoms in addition to carbon atoms. Unless otherwise specified, the aromatic ring is preferably an aromatic carbocyclic ring. The number of carbon atoms in the aromatic ring is preferably 3 or more, more preferably 4 or more or 5 or more, and even more preferably 6 or more, unless otherwise specified, and the upper limit is preferably 24 or less, more preferably 18 or less or 14 or less, and even more preferably 10 or less. The number of carbon atoms does not include the number of carbon atoms of substituents.

[0015] Examples of the monocyclic aromatic ring include a benzene ring, a furan ring, a thiophene ring, a pyrrole ring, a pyrazole ring, an oxazole ring, an isoxazole ring, a furazan ring, a thiazole ring, an isothiazole ring, a thiadiazole ring, an imidazole ring, a triazole ring, a tetrazole ring, a pyridine ring, a pyridazine ring, a pyrimidine ring, a pyrazine ring, and a pyridazine ring. Examples of fused aromatic rings in which two or more monocyclic aromatic rings are fused include a naphthalene ring, an anthracene ring, a phenanthrene ring, a benzofuran ring, an isobenzofuran ring, an indole ring, an isoindole ring, a benzothiophene ring, a benzimidazole ring, an indazole ring, a benzoxazole ring, a benzisoxazole ring, a benzothiazole ring, a quinoline ring, an isoquinoline ring, a quinoxaline ring, an acridine ring, a quinazoline ring, a cinnoline ring, a phthalazine ring, a pyridothiazole ring, a benzotriazole ring, an imidazopyridine ring, a triazopyridine ring, a purine ring, etc. Unless otherwise specified, the aromatic ring is preferably a benzene ring or a naphthalene ring, more preferably a benzene ring.

[0016] In the following description, the component (1D) and the combination of the components (2D-1) and (2D-2) may be collectively referred to as the "component (D)." Furthermore, the resin composition of the first embodiment and the resin composition of the second embodiment may be collectively referred to as the "resin composition."

[0017] [Resin composition of the first embodiment] A resin composition according to a first embodiment of the present invention contains (A) a cyclic ether compound having a four-membered or smaller ring, (B) a curing agent, (C) an inorganic filler, and (1D) an aluminum complex, wherein the component (A) contains (A1) a cationically polymerizable cyclic ether compound having a four-membered or smaller ring. By incorporating the components (A) to (1D) in combination into the resin composition, a cured product exhibiting an excellent dielectric loss tangent can be obtained, even in a high-temperature (100°C) environment. That is, the resin composition contributes to a low dielectric loss tangent of the cured product, particularly a cured product exhibiting a lower dielectric loss tangent even in a high-temperature (100°C) environment. While the reason for this is unclear, it is presumed that during thermal curing of the resin composition, the (A1) cationically polymerizable cyclic ether compound having a four-membered or smaller ring reacts with the hydroxyl groups on the surface of the (C) inorganic filler using the (1D) aluminum complex as a Lewis acid catalyst, forming a crosslinked structure between the inorganic filler and the resin portion, thereby suppressing molecular motion of the polymer molecules in the cured product. The present inventors have also confirmed that the resin composition of the first embodiment of the present invention exhibits an excellent dielectric loss tangent even at room temperature (23°C), and can produce a cured product with a low linear expansion coefficient and a high glass transition temperature. The resin composition of the first embodiment may also contain, as component (A), a cyclic ether compound with a four-membered ring or less other than component (A1) (hereinafter referred to as "component (A2)"). The resin composition of the first embodiment may further contain optional components in combination with components (A) to (1D). Examples of optional components include (E) a radical curable resin, (F) a curing accelerator, (G) an organic filler, (H) a thermoplastic resin, (I) an organic solvent, and (J) other additives. Each component contained in the resin composition of the first embodiment will be described in detail below.

[0018] <(A) Cyclic ether compounds with four or fewer members> The resin composition of the first embodiment of the present invention contains (A) a cyclic ether compound having a four or smaller ring. Examples of (A) a cyclic ether compound having a four or smaller ring include an epoxy resin, which is a three-membered cyclic ether compound, and an oxetane resin, which is a four-membered cyclic ether compound. The (A) component may be used alone or in combination of two or more. In one embodiment, the resin composition of the first embodiment preferably contains two or more types of (A) component, more preferably three or more types of (A) component, even more preferably four or more types of (A) component, and particularly preferably five or more types of (A) component.

[0019] The content of component (A), when the total nonvolatile components in the resin composition is taken as 100% by mass, is preferably 1% by mass or more or 3% by mass or more, more preferably 5% by mass or more or 8% by mass or more, even more preferably 10% by mass or more or 12% by mass or more, and particularly preferably 15% by mass or more or 18% by mass or more, from the viewpoint of significantly achieving the effects of the present invention. In one embodiment, the content may be 20% by mass or more, 22% by mass or more, 25% by mass or more, 27% by mass or more, etc. The upper limit is preferably 60% by mass or less or 55% by mass or less, more preferably 50% by mass or less or 45% by mass or less, even more preferably 40% by mass or less, 38% by mass or less or 35% by mass or less, and particularly preferably 32% by mass or less, 30% by mass or less or 28% by mass or less.

[0020] When the resin component in the resin composition is taken as 100% by mass, the content of component (A) is preferably 5% by mass or more, 10% by mass or more, or 20% by mass or more, more preferably 25% by mass or more, 30% by mass or more, or 35% by mass or more, even more preferably 40% by mass or more, 45% by mass or more, or 50% by mass or more, particularly preferably 55% by mass or more, 60% by mass or more, or 65% by mass or more, when the resin component in the resin composition is taken as 100% by mass, from the viewpoint of significantly achieving the effects of the present invention. The upper limit is preferably 95% by mass or less, more preferably 85% by mass or less, more preferably 80% by mass or less, even more preferably 78% by mass or less, and particularly preferably 72% by mass or less, 70% by mass or less, or 68% by mass or less.

[0021] <(A1) Cationic polymerizable cyclic ether compound with four or less members> In the resin composition according to the first embodiment of the present invention, component (A) contains (A1) a cationically polymerizable cyclic ether compound having a four-membered ring or less. Component (A1) may be used singly or in combination of two or more.

[0022] Examples of component (A1) include cationic polymerizable epoxy resins and cationic polymerizable oxetane resins. Here, oxetane resins are generally considered to be component (A1) because they are cationic polymerizable. Generally, epoxy resins are curable resins with epoxy groups and an epoxy equivalent of 5,000 g / eq. or less, and are primarily classified into glycidyl-type epoxy resins and epoxy resins obtained by direct oxidation of alkenes. Here, glycidyl-type epoxy resins are considered to be component (A2), which will be described later, and epoxy resins obtained by direct oxidation of alkenes are considered to be component (A1).

[0023] As mentioned above, examples of the cationically polymerizable epoxy resin in component (A1) include epoxy resins obtained by the direct oxidation of alkenes. As epoxy resins obtained by the direct oxidation of alkenes, alicyclic epoxy resins are preferred, with alicyclic epoxy resins having a six-membered ring being more preferred. That is, component (A1) preferably contains a cationically polymerizable epoxy resin, more preferably an epoxy resin obtained by the direct oxidation of an alkene, even more preferably an alicyclic epoxy resin, and particularly preferably an alicyclic epoxy resin having a six-membered ring. The number of epoxy groups in the cationically polymerizable epoxy resin molecule is typically one or more, with two or more being preferred.

[0024] The number of carbon atoms in the cationically polymerizable epoxy resin is preferably 2 to 100. The lower limit of the number of carbon atoms in the cationically polymerizable epoxy resin is more preferably 3 or more, 4 or more, or 5 or more, even more preferably 6 or more or 7 or more, and particularly preferably 8 or more or 9 or more. The upper limit of the number of carbon atoms in the cationically polymerizable epoxy resin is more preferably 100 or less, 90 or less, 80 or less, or 70 or less, even more preferably 60 or less or 50 or less, and particularly preferably 40 or less or 30 or less. In one embodiment, the upper limit may be 25 or less, 20 or less, 15 or less, etc.

[0025] The molecular weight of the cationically polymerizable epoxy resin is preferably 50 to 5,000. The lower limit of the molecular weight of the cationically polymerizable epoxy resin is more preferably 80 or more, even more preferably 100 or more or 120 or more, and particularly preferably 140 or more or 160 or more. The upper limit of the molecular weight of the cationically polymerizable epoxy resin is more preferably 4,000 or less, 3,000 or less, or 2,000 or less, even more preferably 1,000 or less or 800 or less, and particularly preferably 600 or less or 500 or less. In one embodiment, the upper limit may be 450 or less, 400 or less, 350 or less, 300 or less, etc.

[0026] In one embodiment, the cationically polymerizable epoxy resin preferably has a partial structure represented by the following formula (A-1) or a partial structure represented by the following formula (A-2). The cationically polymerizable epoxy resin may have both the partial structure represented by the following formula (A-1) and the partial structure represented by the following formula (A-2). Furthermore, when the epoxy resin has both the partial structure represented by the following formula (A-1) and the partial structure represented by the following formula (A-2), the cyclohexane ring in the following formula (A-1) and the cyclohexane ring in the following formula (A-2) may be shared. [ka] (In formula (A-1) and formula (A-2), R a1 represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms. * represents a bond to the structure of another part of the epoxy resin. na1 represents an integer of 0 to 11, and the number of bonds to the structure of other parts is n a1 n a2 represents an integer of 0 to 11, and the number of bonds to the structure of other parts is n a2 This means there are pieces.)

[0027] In formula (A-1), R a1 represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms. The alkyl group is a chain (straight-chain or branched) alkyl group or a cyclic alkyl group. The alkyl group preferably has 1 to 5 carbon atoms, more preferably 1 to 3, and even more preferably 1. Examples of the chain alkyl group include a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, an isobutyl group, an s-butyl group, a t-butyl group, an n-pentyl group, an isopentyl group, a hexyl group, a 2-ethylhexyl group, an octyl group, and a decyl group. Of these, a methyl group, an ethyl group, an n-propyl group, or an isopropyl group is preferred, a methyl group or an ethyl group is more preferred, and a methyl group is even more preferred. Examples of the cyclic alkyl group include a cyclopentyl group, a cyclohexyl group, and a cyclooctyl group. Among these, R a1 is preferably a hydrogen atom or a methyl group.

[0028] In formula (A-1), n a1 represents an integer from 0 to 11. a1 The lower limit of n is preferably 1 or more, and more preferably 2 or more. a1 The upper limit of is preferably 10 or less or 8 or less, more preferably 6 or less or 5 or less, and even more preferably 4 or less or 3 or less.

[0029] In formula (A-2), n a1 represents an integer from 0 to 10. a1 The lower limit of n is preferably 1 or more, and more preferably 2 or more. a1 The upper limit is preferably 8 or less or 7 or less, more preferably 6 or less or 5 or less, and even more preferably 4 or less or 3 or less.

[0030] Specific examples of epoxy resins having cation polymerization properties include epoxy resins represented by the following formulas (A-3-1) to (A-3-12), of which the epoxy resin represented by formula (A-3-1), the epoxy resin represented by formula (A-3-2), or the epoxy resin represented by formula (A-3-3) is preferred, and the epoxy resin represented by formula (A-3-1) is more preferred. [ka] (In the formula, m, n, n1, n2, and n3 each independently represent an integer of 0 or more.)

[0031] Commercially available epoxy resins having cation polymerization properties include, for example, "Limonene dioxide" (an epoxy resin represented by formula (A-3-1)) manufactured by Cargill; "Celloxide 2021P" (an epoxy resin represented by formula (A-3-2)), "EHPE3150" (an epoxy resin represented by formula (A-3-3)), "Celloxide 2081" (an epoxy resin represented by formula (A-3-4)), "Epolead PB4700", "Epolead PB3600", "Epofreend AT501" (an epoxy resin represented by formula (A-3-6)), "Epolead GT401" (an epoxy resin represented by formula (A-3-7)), and "Cyclomer M10" (an epoxy resin represented by formula (A-3-8)). 0" (epoxy resin represented by formula (A-3-8)), "Celloxide 2000" (epoxy resin represented by formula (A-3-9)); "DE-102" (epoxy resin represented by formula (A-3-11)), "DE-103" (epoxy resin represented by formula (A-3-11)), "THI-DE" (epoxy resin represented by formula (A-3-12)) manufactured by ENEOS Corporation; "DCPD-DE" (epoxy resin represented by formula (A-3-10)) manufactured by Japan Materials Technology Co., Ltd.; and "LDO" (epoxy resin represented by formula (A-3-1)) manufactured by SYMRISE.

[0032] The number of oxetane rings contained in one molecule of the oxetane resin in component (A1) is usually 1 or more, preferably 2 or more, and may be 2. Furthermore, one type of oxetane resin may be used alone, or two or more types may be used in combination.

[0033] The number of carbon atoms in the oxetane resin is preferably 3 to 100. The lower limit of the number of carbon atoms in the oxetane resin is more preferably 4 or more, 5 or more, or 6 or more, even more preferably 7 or more or 8 or more, and particularly preferably 9 or more, 10 or more, or 11 or more. The upper limit of the number of carbon atoms in the oxetane resin is more preferably 80 or less, 50 or less, 45 or less, 40 or less, or 35 or less, even more preferably 30 or less, 25 or less, or 20 or less, and particularly preferably 18 or less, 16 or less, or 14 or less.

[0034] The molecular weight of the oxetane resin is preferably 100 to 1,000. The lower limit of the molecular weight of the oxetane resin is more preferably 120 or more or 140 or more, even more preferably 160 or more or 180 or more, and particularly preferably 200 or more or 210 or more. The upper limit of the molecular weight of the oxetane resin is more preferably 800 or less, 600 or less, 500 or less, or 400 or less, even more preferably 350 or less, 300 or less, or 280 or less, and particularly preferably 260 or less, 240 or less, or 220 or less.

[0035] The oxetane resin is preferably liquid at 20°C. The viscosity range of the oxetane resin at 20°C is preferably 0.1 mPa·s or more, more preferably 1 mPa·s or more, even more preferably 7 mPa·s or more, and preferably 100 mPa·s or less, more preferably 25 mPa·s or less, even more preferably 16 mPa·s or less. The viscosity can be measured using an E-type viscometer (for example, the "RE-80U" manufactured by Toki Sangyo Co., Ltd., with a 1°34' x R24 cone).

[0036] The oxetane resin preferably contains an aliphatic group. An oxetane resin containing an aliphatic group is also called an "aliphatic oxetane resin." The aliphatic group contained in the oxetane resin may be linear, branched, or cyclic, preferably linear or branched, and more preferably linear. The aliphatic group may be a saturated aliphatic group or an unsaturated aliphatic group, but a saturated aliphatic group is preferred. For example, the oxetane resin may contain a monovalent or polyvalent aliphatic group. The number of carbon atoms in this aliphatic group is usually 1 or more, preferably 2 or more, and preferably 8 or less, more preferably 6 or less, and even more preferably 4 or less. Preferred examples of such aliphatic groups include monovalent or polyvalent chain hydrocarbon groups. Specific examples of these chain hydrocarbon groups include alkyl groups such as methyl, ethyl, propyl, and butyl; alkylene groups such as methylene, ethylene, propylene, and butylene; and the like.

[0037] Examples of the oxetane resin include oxetane resins represented by the following formulas (A-4-1) to (A-4-8), and the oxetane resin represented by the following formula (A-4-3) is preferred. [ka]

[0038] Commercially available oxetane resins may be used. Examples of commercially available oxetane resins include "OXT-101" (resin of formula (A-4-1)), "OXT-212" (resin of formula (A-4-2)), "OXT-221" (resin of formula (A-4-3)), and "OXT-121" (resin of formula (A-4-6)) from the ARON OXETANE series manufactured by Toagosei Co., Ltd.; and "EHO" (resin of formula (A-4-1)), "HBOX" (resin of formula (A-4-4)), "OXMA" (resin of formula (A-4-5)), "OXBP" (resin of formula (A-4-8)), and "OXIPA" (resin of formula (A-4-7)) from the ETERNACOLL series manufactured by UBE Corporation.

[0039] The functional group equivalent of component (A1) is preferably 50 g / eq. to 3,000 g / eq. The lower limit of the functional group equivalent of component (A1) is more preferably 60 g / eq. or more or 70 g / eq. or more, even more preferably 80 g / eq. or more, and particularly preferably 90 g / eq. or more. The upper limit of the functional group equivalent of component (A1) is more preferably 2,000 g / eq. or less or 1,000 g / eq. or less, even more preferably 800 g / eq. or less or 500 g / eq. or less, and particularly preferably 300 g / eq. or less or 200 g / eq. The functional group equivalent of component (A1) is the mass of component (A1) per equivalent of functional group (epoxy group or oxetane group).

[0040] The content of component (A1), based on 100% by mass of the nonvolatile components in the resin composition, is preferably 0.01% by mass or more or 0.02% by mass or more, more preferably 0.05% by mass or more or 0.08% by mass or more, even more preferably 0.1% by mass or more or 0.2% by mass or more, and particularly preferably 0.5% by mass or more, 0.8% by mass or more, or 0.9% by mass or more, from the viewpoint of significantly achieving the effects of the present invention. The upper limit is preferably 20.0% by mass or less or 15.0% by mass or less, more preferably 10.0% by mass or less, 8.0% by mass or less or 6.0% by mass or less, and even more preferably 5.0% by mass or less, from the viewpoint of reducing the linear expansion coefficient of the cured product and increasing the glass transition temperature of the cured product. In one embodiment, the content may be 4.0% by mass or less, 3.0% by mass or less, 2.0% by mass or less, 1.5% by mass or less, 1.2% by mass or less, etc. In one embodiment, the content of the component (A1) is preferably 0.1 to 6.0% by mass when the total nonvolatile components in the resin composition is taken as 100% by mass.

[0041] The content of component (A1), when the resin component in the resin composition is taken as 100% by mass, is preferably 0.05% by mass or more, 0.08% by mass or more, or 0.1% by mass or more, more preferably 0.2% by mass or more, 0.5% by mass or more, or 0.8% by mass or more, even more preferably 1.0% by mass or more, 1.2% by mass or more, or 1.5% by mass or more, and particularly preferably 1.8% by mass or more, 2.0% by mass or more, or 2.2% by mass or more, from the viewpoint of significantly achieving the effects of the present invention. The upper limit is preferably 40% by mass or less, more preferably 35% by mass or less, even more preferably 25% by mass or less, or 20% by mass or less, and particularly preferably 15% by mass or less, or 12% by mass or less, from the viewpoint of reducing the linear expansion coefficient of the cured product and increasing the glass transition temperature of the cured product. In one embodiment, the content may be 10% by mass or less, 8% by mass or less, 6% by mass or less, 4% by mass or less, 3% by mass or less, 2.5% by mass or less, etc.

[0042] The content of component (A1), when component (A) in the resin composition is taken as 100% by mass, is preferably 0.1% by mass or more or 0.2% by mass or more, more preferably 0.5% by mass or more, 0.8% by mass or more, or 1.0% by mass or more, even more preferably 1.5% by mass or more, 2.0% by mass or more, or 2.5% by mass or more, and particularly preferably 3.0% by mass or more, 3.2% by mass or more, or 3.4% by mass or more. There is no particular upper limit, but it may be 100% by mass, or may be 90% by mass or less, 70% by mass or less, 50% by mass or less, 40% by mass or less, 30% by mass or less, 20% by mass or less, 15% by mass or less, 10% by mass or less, 8% by mass or less, 5% by mass or less, 4% by mass or less, etc.

[0043] <4-membered or smaller cyclic ether compounds other than component (A1)> In the resin composition of the first embodiment of the present invention, the component (A) may contain a cyclic ether compound (component (A2)) other than the component (A1) that has a four-membered ring or less, and preferably contains the component (A2). The component (A2) may be used alone or in combination of two or more. In one embodiment, the resin composition of the first embodiment preferably contains two or more types of the component (A2), more preferably three or more types of the component (A2), and even more preferably four or more types of the component (A2).

[0044] Examples of the component (A2) include glycidyl-type epoxy resins, and glycidyl-type epoxy resins having an aromatic ring (hereinafter also referred to as "aromatic epoxy resins"). More specifically, examples of the component (A2) include bixylenol-type epoxy resins, bisphenol A-type epoxy resins, bisphenol F-type epoxy resins, bisphenol S-type epoxy resins, bisphenol AF-type epoxy resins, dicyclopentadiene-type epoxy resins, trisphenol-type epoxy resins, naphthol novolac-type epoxy resins, phenol novolac-type epoxy resins, tert-butyl-catechol-type epoxy resins, naphthalene-type epoxy resins, naphthol-type epoxy resins, anthracene-type epoxy resins, glycidylamine-type epoxy resins, glycidyl ester-type epoxy resins, cresol novolac-type epoxy resins, phenol Examples of epoxy resins include aryl aralkyl type epoxy resins, biphenyl type epoxy resins, biphenyl aralkyl type epoxy resins, linear aliphatic epoxy resins, epoxy resins having a butadiene structure, heterocyclic epoxy resins, spiro ring-containing epoxy resins, cyclohexane type epoxy resins, cyclohexane dimethanol type epoxy resins, naphthylene ether type epoxy resins, trimethylol type epoxy resins, tetraphenylethane type epoxy resins, isocyanurate type epoxy resins, phenolphthalimidine type epoxy resins, glycerol type epoxy resins, alkyleneoxy skeleton-containing epoxy resins, fluorene structure-containing epoxy resins, and halogenated epoxy resins. Component (A2) preferably contains an aromatic epoxy resin, more preferably contains one or more epoxy resins selected from the group consisting of bisphenol A-type epoxy resins, naphthalene-type epoxy resins, biphenyl-type epoxy resins, bixylenol-type epoxy resins, naphthylene ether-type epoxy resins, and dicyclopentadiene-type epoxy resins, even more preferably contains one or more epoxy resins selected from the group consisting of bisphenol A-type epoxy resins, naphthalene-type epoxy resins, and biphenyl-type epoxy resins, even more preferably contains one or more epoxy resins selected from the group consisting of naphthalene-type epoxy resins and biphenyl-type epoxy resins, and particularly preferably contains a naphthalene-type epoxy resin and a biphenyl-type epoxy resin.

[0045] In one embodiment, from the viewpoint of significantly achieving the effects of the present invention, the component (A2) preferably contains two or more epoxy resins selected from the group consisting of bisphenol A-type epoxy resins, naphthalene-type epoxy resins, biphenyl-type epoxy resins, bixylenol-type epoxy resins, naphthylene ether-type epoxy resins, and dicyclopentadiene-type epoxy resins, more preferably contains three or more epoxy resins selected from the above group, and even more preferably contains four or more epoxy resins selected from the above group.

[0046] In one embodiment, from the viewpoint of reducing the linear expansion coefficient of the cured product, the component (A2) preferably contains one or more epoxy resins selected from the group consisting of bisphenol A epoxy resins, bixylenol epoxy resins, naphthylene ether epoxy resins, and dicyclopentadiene epoxy resins, more preferably contains two or more epoxy resins selected from the above group, even more preferably contains three or more epoxy resins selected from the above group, and particularly preferably contains four or more epoxy resins selected from the above group.

[0047] The resin composition of the present invention preferably contains, as component (A2), an epoxy resin having two or more epoxy groups per molecule. From the viewpoint of significantly achieving the desired effects of the present invention, the proportion of the epoxy resin having two or more epoxy groups per molecule, relative to 100% by mass of component (A2), is preferably 50% by mass or more, more preferably 60% by mass or more, and particularly preferably 70% by mass or more.

[0048] Epoxy resins include epoxy resins that are liquid at a temperature of 20°C (hereinafter sometimes referred to as "liquid epoxy resins") and epoxy resins that are solid at a temperature of 20°C (hereinafter sometimes referred to as "solid epoxy resins"). The resin composition of the present invention may contain, as component (A2), only a liquid epoxy resin, only a solid epoxy resin, or a combination of a liquid epoxy resin and a solid epoxy resin. In one embodiment, the resin composition of the first embodiment of the present invention preferably contains, as component (A2), a combination of a liquid epoxy resin and a solid epoxy resin.

[0049] The liquid epoxy resin is preferably a liquid epoxy resin having two or more epoxy groups in one molecule.

[0050] Examples of liquid epoxy resins include glycerol-type epoxy resins, bisphenol A-type epoxy resins, bisphenol F-type epoxy resins, bisphenol AF-type epoxy resins, naphthalene-type epoxy resins, glycidyl ester-type epoxy resins, glycidylamine-type epoxy resins, phenol novolac-type epoxy resins, cyclohexanedimethanol-type epoxy resins, cyclic aliphatic glycidyl ethers, epoxy resins having a butadiene structure, dicyclopentadiene-type epoxy resins, alkyleneoxy skeleton-containing epoxy resins, and fluorene structure-containing epoxy resins, with bisphenol A-type epoxy resins being preferred.

[0051] Specific examples of liquid epoxy resins include "EX-992L" manufactured by Nagase ChemteX Corporation, "YX7400" manufactured by Mitsubishi Chemical Corporation, "HP4032", "HP4032D", and "HP4032SS" (naphthalene-type epoxy resins) manufactured by DIC Corporation; "828US", "jER828EL", "828EL", "825", and "Epikote 828EL" manufactured by Mitsubishi Chemical Corporation, and "850S" (bisphenol A-type epoxy resin) manufactured by DIC Corporation; and "jER807" and "1750" manufactured by Mitsubishi Chemical Corporation. "(Bisphenol F type epoxy resin); "jER152" (phenol novolac type epoxy resin) manufactured by Mitsubishi Chemical Corporation; "630", "630LSD", and "604" (glycidylamine type epoxy resin) manufactured by Mitsubishi Chemical Corporation; "ED-523T" (glycilol type epoxy resin) manufactured by ADEKA Corporation; "EP-3950L" and "EP-3980S" (glycidylamine type epoxy resin) manufactured by ADEKA Corporation; "EP-4088S" and "EP-4088L" (glycidylamine type epoxy resin) manufactured by ADEKA Corporation. Chloropentadiene type epoxy resin; "ZX-1059" manufactured by Nippon Steel Chemical & Material Co., Ltd. (a mixture of bisphenol A type epoxy resin and bisphenol F type epoxy resin); "EX-721" manufactured by Nagase ChemteX Corporation (glycidyl ester type epoxy resin); "EX-991L" manufactured by Nagase ChemteX Corporation (an epoxy resin containing alkyleneoxy skeleton); "PB-3600" manufactured by Daicel Corporation, "JP-100" and "JP-200" manufactured by Nippon Soda Co., Ltd. (epoxy resins with butadiene structure) epoxy resin); "ZX1658" and "ZX1658GS" (liquid 1,4-glycidylcyclohexane type epoxy resin) manufactured by Nippon Steel Chemical & Material Co., Ltd.; "EG-280" (fluorene structure-containing epoxy resin) manufactured by Osaka Gas Chemicals Co., Ltd.; "EX-201", "EX-321L", "EX-212L", "EX-214L", "EX-810P", "EX-991L", and "EX-121" manufactured by Nagase ChemteX Corporation; "Showfree CDMDG" manufactured by Resonac Corporation; and the like. These may be used alone or in combination of two or more.

[0052] As the solid epoxy resin, a solid epoxy resin having two or more epoxy groups in one molecule is preferred, and an aromatic solid epoxy resin having three or more epoxy groups in one molecule is more preferred.

[0053] Examples of solid epoxy resins include bixylenol-type epoxy resins, naphthalene-type epoxy resins, naphthalene-type tetrafunctional epoxy resins, naphthol novolac-type epoxy resins, cresol novolac-type epoxy resins, dicyclopentadiene-type epoxy resins, trisphenol-type epoxy resins, naphthol-type epoxy resins, biphenyl-type epoxy resins, biphenylaralkyl-type epoxy resins, naphthylene ether-type epoxy resins, anthracene-type epoxy resins, bisphenol A-type epoxy resins, bisphenol AF-type epoxy resins, phenolaralkyl-type epoxy resins, tetraphenylethane-type epoxy resins, phenolphthalimidine-type epoxy resins, and fluorene-structure-containing epoxy resins. Naphthalene-type epoxy resins, biphenyl-type epoxy resins, bixylenol-type epoxy resins, naphthylene ether-type epoxy resins, and dicyclopentadiene-type epoxy resins are preferred, and naphthalene-type epoxy resins and biphenyl-type epoxy resins are more preferred.

[0054] Specific examples of solid epoxy resins include "HP-4032H" and "HP-4032SS" (naphthalene-type epoxy resins) manufactured by DIC Corporation; "HP-4700" and "HP-4710" (naphthalene-type tetrafunctional epoxy resins) manufactured by DIC Corporation; "N-690" and "N-695" (cresol novolac-type epoxy resins) manufactured by DIC Corporation; "HP-7200", "HP-7200HH", "HP-7200H", and "HP-7200L" (dicyclopentadiene-type epoxy resins) manufactured by DIC Corporation; "EXA-7311" and "EXA-7311-G3" manufactured by DIC Corporation. "EXA-7311-G4", "EXA-7311-G4S", "HP-6000", "HP-6000L" (naphthylene ether type epoxy resin); "EPPN-502H" (trisphenol type epoxy resin) manufactured by Nippon Kayaku Co., Ltd.; "NC7000L" (naphthol novolac type epoxy resin) manufactured by Nippon Kayaku Co., Ltd.; "NC3000", "NC3000L", "NC3000FH", "NC3100" (biphenyl type epoxy resin) manufactured by Nippon Kayaku Co., Ltd.; "NC3000H" (biphenyl aralkyl type epoxy resin) manufactured by Nippon Steel Chemical & Material Co., Ltd. "ESN475V" and "ESN4100V" (naphthalene-type epoxy resins) manufactured by Nippon Steel Chemical & Material Co., Ltd.; "ESN485" (naphthol-type epoxy resin) manufactured by Nippon Steel Chemical & Material Co., Ltd.; "ESN375" (dihydroxynaphthalene-type epoxy resin) manufactured by Nippon Steel Chemical & Material Co., Ltd.; "YX4000H", "YX4000", "YX4000HK", and "YL7890" (bixylenol-type epoxy resins) manufactured by Mitsubishi Chemical Corporation; "YL6121" (biphenyl-type epoxy resin) manufactured by Mitsubishi Chemical Corporation; "YX8800" (anthracene-type epoxy resin) manufactured by Mitsubishi Chemical Corporation. "YX7700" (phenol aralkyl type epoxy resin) manufactured by Mitsubishi Chemical Corporation; "PG-100" and "CG-500" manufactured by Osaka Gas Chemicals Co., Ltd.; "YL7760" (bisphenol AF type epoxy resin) manufactured by Mitsubishi Chemical Corporation; "YL7800" (fluorene structure-containing epoxy resin) manufactured by Mitsubishi Chemical Corporation; "jER1010" (bisphenol A type epoxy resin) manufactured by Mitsubishi Chemical Corporation; "jER1031S" (tetraphenylethane type epoxy resin) manufactured by Mitsubishi Chemical Corporation; "WHR991S" (phenolphthalimidine type epoxy resin) manufactured by Nippon Kayaku Co., Ltd.These may be used alone or in combination of two or more.

[0055] The epoxy equivalent of component (A2) is preferably 50 to 5,000 g / eq. The lower limit of the epoxy equivalent is more preferably 60 g / eq. or more, even more preferably 80 g / eq. or more, and particularly preferably 110 g / eq. or more. The upper limit of the epoxy equivalent is more preferably 3,000 g / eq. or less or 2,000 g / eq. or less, even more preferably 1,000 g / eq. or less, and particularly preferably 500 g / eq. or less. The epoxy equivalent is the mass of an epoxy resin containing one equivalent of epoxy groups, and can be measured in accordance with JIS K7236.

[0056] The weight average molecular weight (Mw) of the component (A2) is preferably 100 to 5,000, more preferably 250 to 3,000, and even more preferably 400 to 1,500. The weight average molecular weight (Mw) of the epoxy resin can be measured by the GPC method as a polystyrene-equivalent value.

[0057] When the resin composition of the first embodiment contains the (A2) component, the content of the (A2) component, when the total nonvolatile components in the resin composition is taken as 100% by mass, is preferably 1% by mass or more, more preferably 3% by mass or more or 5% by mass or more, even more preferably 8% by mass or more or 10% by mass or more, and particularly preferably 12% by mass or more or 15% by mass or more, from the viewpoint of significantly achieving the effects of the present invention. In one embodiment, the content may be 18% by mass or more, 20% by mass or more, 22% by mass or more, 25% by mass or more, etc. The upper limit is preferably 60% by mass or less or 55% by mass or less, more preferably 50% by mass or less or 45% by mass or less, even more preferably 40% by mass or less or 35% by mass or less, and particularly preferably 30% by mass or less or 28% by mass or less.

[0058] When the resin composition of the first embodiment contains the (A2) component, the content of the (A2) component, when the resin components in the resin composition are taken as 100% by mass, is preferably 5% by mass or more or 10% by mass or more, more preferably 15% by mass or more or 20% by mass or more, even more preferably 25% by mass or more or 30% by mass or more, and particularly preferably 35% by mass or more, 40% by mass or more, or 45% by mass or more. In one embodiment, the content may be 50% by mass or more, 55% by mass or more, 60% by mass or more, 62% by mass or more, etc. The upper limit is preferably 95% by mass or less or 90% by mass or less, more preferably 85% by mass or less or 80% by mass or less, even more preferably 78% by mass or less, 75% by mass or less or 72% by mass or less, and particularly preferably 70% by mass or less, 68% by mass or less, or 65% by mass or less.

[0059] When the resin composition of the first embodiment contains the component (A2), the content of the component (A2) is, from the viewpoint of significantly obtaining the effects of the present invention, preferably 99.9% by mass or less or 99.8% by mass or less, more preferably 99.5% by mass or less, 99.2% by mass or less, or 99.0% by mass or less, even more preferably 98.5% by mass or less, 98.0% by mass or less, or 97.5% by mass or less, and particularly preferably 97.0% by mass or less, 96.8% by mass or less, or 96.6% by mass or less, when the content of the component (A) in the resin composition is taken as 100% by mass. The lower limit is not particularly limited, and may be 0% by mass or more, or may be 10% by mass or more, 30% by mass or more, 50% by mass or more, 60% by mass or more, 70% by mass or more, 80% by mass or more, 85% by mass or more, 90% by mass or more, 92% by mass or more, 95% by mass or more, 96% by mass or more, etc.

[0060] When the resin composition of the first embodiment contains the (A2) component, the mass ratio of the (A1) component to the (A2) component [(A1) component / (A2) component] is preferably 0.0001 or more or 0.0005 or more, more preferably 0.001 or more or 0.002 or more, even more preferably 0.005 or more or 0.008 or more, and particularly preferably 0.01 or more, 0.02 or more, or 0.03 or more, from the viewpoint of significantly achieving the effects of the present invention. There is no particular upper limit, but from the viewpoint of reducing the linear expansion coefficient of the cured product and increasing the glass transition temperature of the cured product, it is preferably 10 or less, more preferably 5 or less or 2 or less, even more preferably 1 or less or 0.8 or less, and particularly preferably 0.5 or less, 0.4 or less, or 0.3 or less. In one embodiment, the mass ratio may be 0.2 or less, 0.1 or less, 0.08 or less, 0.05 or less, 0.04 or less, etc.

[0061] <(B) Hardener> The resin composition of the first embodiment of the present invention contains a (B) curing agent. The (B) curing agent reacts with the (A) cyclic ether compound having a four- or less-membered ring to cure the resin composition. The (B) curing agent may be used alone or in combination of two or more. In one embodiment, the (B) curing agent preferably contains an epoxy resin curing agent, and the (B) curing agent is more preferably an epoxy resin curing agent.

[0062] The functional group equivalent of the (B) curing agent is preferably 50 g / eq. to 3,000 g / eq., more preferably 100 g / eq. to 1,000 g / eq., even more preferably 100 g / eq. to 500 g / eq., and particularly preferably 100 g / eq. to 300 g / eq. The functional group equivalent is the mass of the (B) curing agent per equivalent of the functional group.

[0063] Examples of (B) curing agents include active ester curing agents, carbodiimide curing agents, phenolic curing agents, acid anhydride curing agents, amine curing agents, benzoxazine curing agents, cyanate ester curing agents, and thiol curing agents. Among these, from the viewpoint of significantly achieving the effects of the present invention, the (B) curing agent preferably contains one or more selected from phenolic curing agents, active ester curing agents, and carbodiimide curing agents, more preferably one or more selected from active ester curing agents and carbodiimide curing agents, and even more preferably an active ester curing agent. Furthermore, in one embodiment, the (B) curing agent preferably contains two or more selected from phenolic curing agents, active ester curing agents, and carbodiimide curing agents, and more preferably a phenolic curing agent, active ester curing agent, and carbodiimide curing agent.

[0064] The active ester curing agent is not particularly limited, but a compound having one or more active ester groups per molecule can be used. Among these, preferred active ester curing agents are compounds having two or more highly reactive ester groups per molecule, such as phenol esters, thiophenol esters, N-hydroxyamine esters, and esters of heterocyclic hydroxy compounds. The active ester compound is preferably one obtained by a condensation reaction between a carboxylic acid compound and / or a thiocarboxylic acid compound and a hydroxy compound and / or a thiol compound. From the viewpoint of improving heat resistance, active ester compounds obtained from a carboxylic acid compound and a hydroxy compound are preferred, and active ester compounds obtained from a carboxylic acid compound and a phenol compound and / or a naphthol compound are more preferred.

[0065] Examples of the carboxylic acid compound include benzoic acid, acetic acid, succinic acid, maleic acid, itaconic acid, phthalic acid, isophthalic acid, terephthalic acid, and pyromellitic acid.

[0066] Examples of phenol compounds and / or naphthol compounds include hydroquinone, resorcinol, bisphenol A, bisphenol F, bisphenol S, phenolphthaline, methylated bisphenol A, methylated bisphenol F, methylated bisphenol S, phenol, o-cresol, m-cresol, p-cresol, catechol, α-naphthol, β-naphthol, 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 2,6-dihydroxynaphthalene, dihydroxybenzophenone, trihydroxybenzophenone, tetrahydroxybenzophenone, phloroglucin, benzenetriol, dicyclopentadiene-type diphenol compounds, and phenol novolak. Here, "dicyclopentadiene-type diphenol compounds" refers to diphenol compounds obtained by condensing one dicyclopentadiene molecule with two phenol molecules.

[0067] Specific examples of the active ester curing agent include dicyclopentadiene-type active ester curing agents, naphthalene-type active ester curing agents containing a naphthalene structure, active ester curing agents containing an acetylated product of phenol novolac, and active ester curing agents containing a benzoylated product of phenol novolac. Among these, at least one selected from dicyclopentadiene-type active ester curing agents and naphthalene-type active ester curing agents is more preferred, and naphthalene-type active ester curing agents are even more preferred. As the dicyclopentadiene-type active ester curing agent, an active ester curing agent containing a dicyclopentadiene-type diphenol structure is preferred.

[0068] Commercially available active ester curing agents include "EXB9451," "EXB9460," "EXB9460S," "HPC-8000L-65TM," "HPC-8000-65T," "EXB-8000H," and "EXB-8000L-65TM" (manufactured by DIC Corporation) as active ester curing agents containing a dicyclopentadiene-type diphenol structure; and "EXB-9416-70BK," "EXB-8100L-65T," "HPC-8150-62T," "EXB-8150L-65T," "EXB-8100L-65T," and "EXB-8" (manufactured by DIC Corporation) as active ester curing agents containing a naphthalene structure. Examples of such curing agents include "EXB9401" (manufactured by DIC Corporation), which is a phosphorus-containing active ester curing agent; "DC808" (manufactured by Mitsubishi Chemical Corporation) which is an active ester curing agent containing an acetylated product of phenol novolac; "YLH1026," "YLH1030," and "YLH1048" (manufactured by Mitsubishi Chemical Corporation) and "EXB-8500-65T" (manufactured by DIC Corporation) which are active ester curing agents containing a benzoylated product of phenol novolac; and "PC1300-02-65T" and "PC1300-02-65MA" (manufactured by Air Water Inc.) which are active ester curing agents containing a styryl group and a naphthalene structure.

[0069] The carbodiimide curing agent is a compound having one or more carbodiimide groups (-N=C=N-) in one molecule, and the carbodiimide curing agent is preferably a compound having two or more carbodiimide groups in one molecule. Examples of the carbodiimide curing agent include aliphatic biscarbodiimides such as tetramethylene-bis(t-butylcarbodiimide) and cyclohexane-bis(methylene-t-butylcarbodiimide); aromatic biscarbodiimides such as phenylene-bis(xylylcarbodiimide); aliphatic polycarbodiimides such as polyhexamethylenecarbodiimide, polytrimethylhexamethylenecarbodiimide, polycyclohexylenecarbodiimide, poly(methylenebiscyclohexylenecarbodiimide), and poly(isophoronecarbodiimide); poly(phenylenecarbodiimide), poly(naphthalenecarbodiimide), and the like. and polycarbodiimides such as aromatic polycarbodiimides such as poly(methylenebis(methylphenylene)carbodiimide), poly(tolylenecarbodiimide), poly(methyldiisopropylphenylenecarbodiimide), poly(triethylphenylenecarbodiimide), poly(diethylphenylenecarbodiimide), poly(triisopropylphenylenecarbodiimide), poly(diisopropylphenylenecarbodiimide), poly(xylylenecarbodiimide), poly(tetramethylxylylenecarbodiimide), poly(methylenediphenylenecarbodiimide), and poly[methylenebis(methylphenylene)carbodiimide]. These may be used alone or in combination of two or more.

[0070] Commercially available carbodiimide curing agents include, for example, Carbodilite V-03 (carbodiimide group equivalent: 216 g / eq.), Carbodilite V-05 (carbodiimide group equivalent: 262 g / eq.), Carbodilite V-07 (carbodiimide group equivalent: 200 g / eq.), and Carbodilite V-09 (carbodiimide group equivalent: 200 g / eq.), all manufactured by Nisshinbo Chemical Inc.; and Stavaxol P (carbodiimide group equivalent: 302 g / eq.) manufactured by Lanxess AG.

[0071] As the phenolic curing agent, a curing agent having one or more, preferably two or more, hydroxyl groups (phenolic hydroxyl groups) bonded to an aromatic ring such as a benzene ring or a naphthalene ring per molecule can be used. From the viewpoint of heat resistance and water resistance, phenolic curing agents having a novolac structure are preferred. Furthermore, from the viewpoint of adhesion to the adherend, nitrogen-containing phenolic curing agents are preferred, and triazine skeleton-containing phenolic curing agents are more preferred. Among these, triazine skeleton-containing phenolic novolac resins are preferred from the viewpoint of highly satisfying heat resistance, water resistance, and adhesion. These may be used alone or in combination of two or more.

[0072] Specific examples of phenol-based curing agents and naphthol-based curing agents include "MEH-7700," "MEH-7810," and "MEH-7851" manufactured by Meiwa Chemical Industry Co., Ltd.; "NHN," "CBN," and "GPH" manufactured by Nippon Kayaku Co., Ltd.; "SN170," "SN180," "SN190," "SN475," "SN485," "SN495," "SN-495V," "SN375," and "SN395" manufactured by Nippon Steel Chemical & Material Co., Ltd.; and "TD-2090," "LA-7052," "LA-7054," "LA-1356," "LA-3018-50P," and "EXB-9500" manufactured by DIC Corporation.

[0073] The acid anhydride curing agent may be a curing agent having one or more acid anhydride groups in one molecule, and a curing agent having two or more acid anhydride groups in one molecule is preferred. Specific examples of the acid anhydride curing agent include phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, methylnadic anhydride, hydrogenated methylnadic anhydride, trialkyltetrahydrophthalic anhydride, dodecenyl succinic anhydride, 5-(2,5-dioxotetrahydro-3-furanyl)-3-methyl-3-cyclohexene-1,2-dicarboxylic anhydride, trimellitic anhydride, pyromellitic anhydride, and benzophenonetetracarboxylic dianhydride. Examples of suitable acid anhydrides include anhydrides, biphenyltetracarboxylic dianhydride, naphthalenetetracarboxylic dianhydride, oxydiphthalic dianhydride, 3,3'-4,4'-diphenylsulfonetetracarboxylic dianhydride, 1,3,3a,4,5,9b-hexahydro-5-(tetrahydro-2,5-dioxo-3-furanyl)-naphtho[1,2-C]furan-1,3-dione, ethylene glycol bis(anhydrotrimellitate), and polymeric acid anhydrides such as styrene-maleic acid resins, which are copolymers of styrene and maleic acid. These may be used alone or in combination of two or more.

[0074] Commercially available acid anhydride curing agents include "HNA-100," "MH-700," "MTA-15," "DDSA," and "OSA" manufactured by New Japan Chemical Co., Ltd.; "YH-306" and "YH-307" manufactured by Mitsubishi Chemical Corporation; "HN-2200" and "HN-5500" manufactured by Resonac Corporation; and "EF-30," "EF-40," "EF-60," and "EF-80" manufactured by Cray Valley Chemical Industries, Ltd. These may be used alone or in combination of two or more.

[0075] Examples of amine-based curing agents include curing agents having one or more, preferably two or more, amino groups in one molecule. The amino group of the amine-based curing agent is preferably a primary amino group or a secondary amino group, more preferably a primary amino group. Examples of amine-based curing agents include aliphatic amines, polyether amines, alicyclic amines, and aromatic amines, and among these, aromatic amines are preferred from the viewpoint of achieving the desired effects of the present invention. The amine-based curing agent is preferably a primary amine or a secondary amine, more preferably a primary amine.

[0076] Specific examples of amine-based curing agents include 4,4'-methylenebis(2,6-dimethylaniline), 4,4'-diaminodiphenylmethane, 4,4'-diaminodiphenyl sulfone, 3,3'-diaminodiphenyl sulfone, m-phenylenediamine, m-xylylenediamine, diethyltoluenediamine, 4,4'-diaminodiphenyl ether, 3,3'-dimethyl-4,4'-diaminobiphenyl, 2,2'-dimethyl-4,4'-diaminobiphenyl, 3,3'-dihydroxybenzidine, and 2,2-bis(3-amino-4-hydroxyphenyl)propane. propane, 3,3-dimethyl-5,5-diethyl-4,4-diphenylmethanediamine, 2,2-bis(4-aminophenyl)propane, 2,2-bis(4-(4-aminophenoxy)phenyl)propane, 1,3-bis(3-aminophenoxy)benzene, 1,3-bis(4-aminophenoxy)benzene, 1,4-bis(4-aminophenoxy)benzene, 4,4'-bis(4-aminophenoxy)biphenyl, bis(4-(4-aminophenoxy)phenyl)sulfone, bis(4-(3-aminophenoxy)phenyl)sulfone, and the like. Commercially available amine-based curing agents may be used, and examples thereof include "SEIKACURE-S" manufactured by Seika Corporation, "KAYABOND C-200S," "KAYABOND C-100," "KAYAHARD AA," "KAYAHARD AB," and "KAYAHARD AS" manufactured by Nippon Kayaku Co., Ltd., "Epicure W" manufactured by Mitsubishi Chemical Corporation, and "DTDA" manufactured by Sumitomo Seika Chemicals Co., Ltd. These may be used alone or in combination of two or more.

[0077] Specific examples of benzoxazine curing agents include "JBZ-OP100D" and "ODA-BOZ" manufactured by JFE Chemical Corporation, "HFB2006M" manufactured by Showa Polymer Co., Ltd., and "Pd" and "Fa" manufactured by Shikoku Chemicals Corporation. These may be used alone or in combination of two or more.

[0078] Examples of cyanate ester curing agents include bifunctional cyanate resins such as bisphenol A dicyanate, polyphenol cyanate, oligo(3-methylene-1,5-phenylene cyanate), 4,4'-methylenebis(2,6-dimethylphenyl cyanate), 4,4'-ethylidene diphenyl dicyanate, hexafluorobisphenol A dicyanate, 2,2-bis(4-cyanate)phenylpropane, 1,1-bis(4-cyanatephenylmethane), bis(4-cyanate-3,5-dimethylphenyl)methane, 1,3-bis(4-cyanatephenyl-1-(methylethylidene))benzene, bis(4-cyanatephenyl)thioether, and bis(4-cyanatephenyl)ether; multifunctional cyanate resins derived from phenol novolac and cresol novolac; and prepolymers in which these cyanate resins are partially converted to triazine. Commercially available cyanate ester curing agents include "PT-30" and "PT-60" (phenol novolac type multifunctional cyanate ester resin), "ULL-950S" (multifunctional cyanate ester resin), "BA-230" and "BA-230S75" (prepolymer in which part or all of bisphenol A dicyanate is triazinized to form a trimer), all manufactured by Arxada. These may be used alone or in combination of two or more.

[0079] Examples of thiol-based curing agents include trimethylolpropane tris(3-mercaptopropionate), pentaerythritol tetrakis(3-mercaptobutyrate), tris(3-mercaptopropyl)isocyanurate, etc. These may be used alone or in combination of two or more.

[0080] From the viewpoint of achieving the remarkable effects of the present invention, the ratio of the amount of the (A) cyclic ether compound having a four-membered ring or less to the amount of the (B) curing agent is preferably in the range of 1:0.01 to 1:10, more preferably 1:0.3 to 1:5, and even more preferably 1:0.5 to 1:3, in terms of the ratio of [total number of functional groups in component (A)] to [total number of functional groups in component (B)]. Here, "the total number of functional groups in component (A)" refers to the sum of all values ​​obtained by dividing the mass of the nonvolatile components of component (A) present in the resin composition by the functional group equivalent of component (A). Furthermore, "the total number of functional groups in component (B)" refers to the sum of all values ​​obtained by dividing the mass of the nonvolatile components of component (B) present in the resin composition by the functional group equivalent of component (B).

[0081] The content of component (B), when the total nonvolatile components in the resin composition is taken as 100% by mass, is preferably 1% by mass or more, more preferably 2% by mass or more or 3% by mass or more, even more preferably 4% by mass or more or 5% by mass or more, and particularly preferably 6% by mass or more or 7% by mass or more, from the viewpoint of significantly achieving the effects of the present invention. In one embodiment, the content may be 8% by mass or more, 9% by mass or more, 10% by mass or more, 11% by mass or more, 12% by mass or more, etc. The upper limit is preferably 50% by mass or less or 45% by mass or less, more preferably 40% by mass or less or 35% by mass or less, even more preferably 30% by mass or less or 25% by mass or less, and particularly preferably 20% by mass or less, 15% by mass or less, or 13% by mass or less.

[0082] The content of component (B), when the resin component in the resin composition is taken as 100% by mass, is preferably 5% by mass or more or 10% by mass or more, more preferably 15% by mass or more or 18% by mass or more, even more preferably 20% by mass or more or 22% by mass or more, and particularly preferably 24% by mass or more or 25% by mass or more, from the viewpoint of significantly achieving the effects of the present invention. In one embodiment, the content may be 26% by mass or more, 28% by mass or more, etc. The upper limit is preferably 80% by mass or less or 75% by mass or less, more preferably 70% by mass or less, 65% by mass or less or 60% by mass or less, even more preferably 55% by mass or less, 50% by mass or less or 45% by mass or less, and particularly preferably 40% by mass or less, 35% by mass or less or 32% by mass or less.

[0083] The total content of components (A) and (B), when the total nonvolatile components in the resin composition is taken as 100% by mass, is preferably 2% by mass or more, more preferably 5% by mass or more or 10% by mass or more, even more preferably 15% by mass or more or 20% by mass or more, and particularly preferably 22% by mass or more or 24% by mass or more, from the viewpoint of significantly achieving the effects of the present invention. In one embodiment, the total content may be 25% by mass or more, 28% by mass or more, 30% by mass or more, 32% by mass or more, 34% by mass or more, 36% by mass or more, 38% by mass or more, etc. The upper limit is preferably 70% by mass or less or 65% by mass or less, more preferably 60% by mass or less or 55% by mass or less, even more preferably 50% by mass or less or 48% by mass or less, and particularly preferably 45% by mass or less, 42% by mass or less, or 40% by mass or less.

[0084] From the viewpoint of significantly achieving the effects of the present invention, the mass ratio of component (A1) to component (B) [component (A1) / component (B)] is preferably 0.001 or more or 0.002 or more, more preferably 0.005 or more or 0.008 or more, even more preferably 0.01 or more or 0.015 or more, and particularly preferably 0.02 or more, 0.05 or more, or 0.07 or more. From the viewpoint of reducing the linear expansion coefficient of the cured product and increasing the glass transition temperature of the cured product, the upper limit is preferably 10 or less, more preferably 8 or less or 5 or less, even more preferably 2 or less or 1 or less, and particularly preferably 0.8 or less, 0.6 or less, or 0.5 or less. In one embodiment, the mass ratio may be 0.4 or less, 0.3 or less, 0.2 or less, 0.1 or less, 0.08 or less, etc.

[0085] When the resin composition of the first embodiment contains the (A2) component, the mass ratio of the (B) component to the (A2) component [(B) component / (A2) component] is, from the viewpoint of significantly achieving the effects of the present invention, preferably 0.001 or more or 0.005 or more, more preferably 0.01 or more or 0.02 or more, even more preferably 0.05 or more, 0.08 or more or 0.1 or more, and particularly preferably 0.2 or more, 0.3 or more or 0.4 or more. The upper limit is preferably 10 or less, more preferably 8 or less or 5 or less, even more preferably 2 or less or 1 or less, and particularly preferably 0.8 or less or 0.7 or less. In one embodiment, the mass ratio may be 0.6 or less, 0.5 or less, etc.

[0086] From the viewpoint of significantly achieving the effects of the present invention, the mass ratio of component (B) to component (A) [component (B) / component (A)] is preferably 0.001 or more or 0.005 or more, more preferably 0.01 or more or 0.02 or more, even more preferably 0.05 or more or 0.08 or more, and particularly preferably 0.1 or more, 0.2 or more, or 0.3 or more. In one embodiment, it may be 0.4 or more. The upper limit is preferably 10 or less or 8 or less, more preferably 5 or less or 2 or less, even more preferably 1 or less or 0.8 or less, and particularly preferably 0.6 or less or 0.5 or less.

[0087] <(C) Inorganic filler> The resin composition according to a first embodiment of the present invention contains (C) an inorganic filler. The (C) inorganic filler may be an inorganic compound. Examples of (C) inorganic fillers include silica, alumina, aluminosilicate, glass powder, cordierite, barium sulfate, barium carbonate, talc, clay, mica powder, zinc oxide, hydrotalcite, boehmite, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, magnesium oxide, boron nitride, aluminum nitride, manganese nitride, aluminum borate, strontium carbonate, strontium titanate, calcium titanate, magnesium titanate, bismuth titanate, titanium oxide, zirconium oxide, barium titanate, barium titanate zirconate, barium zirconate, calcium zirconate, zirconium phosphate, and zirconium tungstate phosphate. Among these, silica or alumina is preferred, and silica is more preferred. In other words, in one embodiment, component (C) preferably contains at least one selected from the group consisting of silica and alumina, and more preferably contains silica. Examples of silica include amorphous silica, fused silica, crystalline silica, synthetic silica, and hollow silica. The preferred shape of silica is spherical. (C) The inorganic filler may be used alone or in any combination of two or more types in any ratio.

[0088] In one embodiment, the inorganic filler (C) preferably contains an inorganic oxide. Examples of inorganic oxides include silica, alumina, glass powder, zinc oxide, magnesium oxide, titanium oxide, and zirconium oxide. Silica, alumina, or glass powder is preferred, silica or alumina is more preferred, and silica is even more preferred. In another embodiment, the inorganic filler (C) may contain alumina, or may contain silica and alumina.

[0089] (C) Examples of commercially available inorganic fillers include "SP60-05" and "SP507-05" manufactured by Nippon Steel Chemical & Material Co., Ltd.; "YC100C", "YA050C", "YA050C-MJE", "YA010C", "SC2500SQ", "SO-C4", "SO-C2", "SO-C1", "SC2300-SVJ", "SC2050-SXF", and "180nmSX-C1" manufactured by Admatechs Co., Ltd.; "UFP-30", "DAW-03", "FB-105FD", "ASFP-40", and "FB-5SDC" manufactured by Denka Co., Ltd.; "Silfil NSS-3N", "Silfil NSS-4N", and "Silfil NSS-5N" manufactured by Tokuyama Corporation; and "CellSpheres" and "MGH-005" manufactured by Taiheiyo Cement Corporation.

[0090] From the viewpoint of increasing the glass transition temperature of the cured product, the average particle size of the (C) inorganic filler is preferably 10.0 μm or less, more preferably 5.0 μm or less, even more preferably 2.0 μm or less, even more preferably 1.0 μm or less, and particularly preferably 0.7 μm or less or 0.6 μm or less. The lower limit of the average particle size of the (C) inorganic filler is not particularly limited, but is preferably 0.01 μm or more, more preferably 0.05 μm or more, even more preferably 0.1 μm or more, and particularly preferably 0.15 μm or more or 0.2 μm or more. The average particle size of the (C) inorganic filler can be measured by a laser diffraction / scattering method based on Mie scattering theory. Specifically, the particle size distribution of the inorganic filler is prepared on a volume basis using a laser diffraction / scattering particle size distribution analyzer, and the median diameter is used as the average particle size. A measurement sample can be prepared by weighing 100 mg of the inorganic filler and 10 g of methyl ethyl ketone into a vial and dispersing it ultrasonically for 10 minutes. The wavelength of the light source used in the laser diffraction particle size distribution analyzer can be blue or red, and the measurement can be performed using a flow cell system. Examples of the laser diffraction particle size distribution analyzer include the "LA-960" manufactured by Horiba, Ltd.

[0091] The specific surface area of ​​the inorganic filler (C) is preferably 0.1 m from the viewpoint of adjusting the number of hydroxy groups on the surface of the inorganic filler (C) that react with the component (A1) using the aluminum complex (1D) as a Lewis acid catalyst. 2 / g or more, more preferably 0.5m 2 / g or more, more preferably 1m 2 / g or more or 3m 2 The upper limit of the specific surface area of ​​the inorganic filler (C) is preferably 100 m 2 / g or less, more preferably 70m 2 / g or less, more preferably 50m 2 / g or less, particularly preferably 40m 2 / g or less, 35m 2 / g or less or 30m 2 In one embodiment, the specific surface area of ​​the inorganic filler (C) is 0.1 to 50 m 2 The specific surface area of ​​the inorganic filler can be calculated according to the BET method by adsorbing nitrogen gas onto the surface of a sample using a specific surface area measuring device (Macsorb HM-1210 manufactured by Mountech Co., Ltd.) and then using the BET multipoint method.

[0092] The inorganic filler (C) is preferably surface-treated with a surface treatment agent. This surface treatment can enhance the moisture resistance and dispersibility of the inorganic filler (C). Furthermore, the number of hydroxyl groups on the surface of the inorganic filler (C) that react with the component (A1) can be adjusted using an aluminum complex (1D) as a Lewis acid catalyst. In one embodiment, an inorganic filler that has been surface-treated with a surface treatment agent may be used in combination with an inorganic filler that has not been surface-treated. When an inorganic filler that has been surface-treated with a surface treatment agent is used in combination with an inorganic filler that has not been surface-treated, the difference between the dielectric tangent (Df) at high temperature (100°C) and the dielectric tangent (Df) at room temperature (23°C) (the temperature dependence of the dielectric tangent) can be reduced.

[0093] Examples of the surface treatment agent include vinyl-based silane coupling agents such as vinyltrimethoxysilane and vinyltriethoxysilane; epoxy-based silane coupling agents such as 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, and 3-glycidoxypropyltriethoxysilane; and styryl-based silane coupling agents such as p-styryltrimethoxysilane. coupling agents; methacrylic silane coupling agents such as 3-methacryloxypropylmethyldimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropylmethyldiethoxysilane, and 3-methacryloxypropyltriethoxysilane; acrylic silane coupling agents such as 3-acryloxypropyltrimethoxysilane; N-(2-aminoethyl)-3-aminopropylmethyldimethoxysilane, N-(2-aminoethyl)-3-aminopropyltrimethoxysilane, and 3-aminopropyltriethoxysilane; Amino-based silane coupling agents such as propyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-triethoxysilyl-N-(1,3-dimethylbutylidene)propylamine, N-phenyl-3-aminopropyltrimethoxysilane, N-phenyl-8-aminooctyltrimethoxysilane, and N-(vinylbenzyl)-2-aminoethyl-3-aminopropyltrimethoxysilane; isocyanurate-based silane coupling agents such as tris(trimethoxysilylpropyl)isocyanurate; ureido-based silane coupling agents such as ureidopropyltrialkoxysilane; mercapto-based silane coupling agents such as 3-mercaptopropylmethyldimethoxysilane and 3-mercaptopropyltrimethoxysilane; isocyanate-based silane coupling agents such as 3-isocyanatepropyltriethoxysilane; acid anhydride-based silane coupling agents such as 3-trimethoxysilylpropylsuccinic anhydride; sulfide-based silane coupling agents such as bis(triethoxysilylpropyl)tetrasulfide;Examples of suitable surface treatment agents include silane coupling agents such as methyltrimethoxysilane and phenyltrimethoxysilane, non-silane coupling alkoxysilane compounds such as methyltrimethoxysilane and phenyltrimethoxysilane, organosilazane compounds, and titanate-based coupling agents. The surface treatment agents may be used alone or in combination of two or more in any ratio. In one embodiment, the inorganic filler (C) is preferably surface-treated with an amino-based silane coupling agent, and more preferably surface-treated with N-phenyl-3-aminopropyltrimethoxysilane.

[0094] The degree of surface treatment with the surface treatment agent preferably falls within a predetermined range from the viewpoint of improving the dispersibility of the inorganic filler and adjusting the number of hydroxy groups on the surface of the inorganic filler (C) that react with component (A1) using the aluminum complex (1D) as a Lewis acid catalyst. Specifically, 100 parts by mass of the inorganic filler is preferably surface-treated with 0.2 to 5 parts by mass of the surface treatment agent, more preferably 0.2 to 3 parts by mass, and even more preferably 0.3 to 2 parts by mass.

[0095] The degree of surface treatment with the surface treatment agent can be evaluated by the amount of carbon per unit surface area of ​​the inorganic filler. From the viewpoint of improving the dispersibility of the inorganic filler, the amount of carbon per unit surface area of ​​the inorganic filler is set to 0.02 mg / m 2 More than 0.1 mg / m is preferable. 2 More preferably, 0.2 mg / m or more 2 More preferably, the upper limit is 1 mg / m 2 Less than 0.8 mg / m is preferred 2 Less than 0.5 mg / m is more preferable. 2 The following is even more preferred:

[0096] (C) The amount of carbon per unit surface area of ​​the inorganic filler can be measured after the surface-treated inorganic filler is washed with a solvent (e.g., methyl ethyl ketone (MEK)). Specifically, a sufficient amount of MEK as a solvent is added to the inorganic filler that has been surface-treated with a surface treatment agent, and ultrasonic cleaning is performed at 25°C for 5 minutes. After removing the supernatant and drying the solid content, the amount of carbon per unit surface area of ​​the inorganic filler can be measured using a carbon analyzer. An "EMIA-320V" manufactured by Horiba, Ltd., or the like can be used as the carbon analyzer.

[0097] The content of component (C), when the total nonvolatile components in the resin composition is taken as 100% by mass, is preferably 10% by mass or more or 20% by mass or more, more preferably 30% by mass or more or 35% by mass or more, even more preferably 40% by mass or more or 45% by mass or more, and particularly preferably 50% by mass or more or 55% by mass or more, from the viewpoints of significantly achieving the effects of the present invention, further reducing the dielectric loss tangent of the cured product at room temperature (23°C) and high temperature (100°C), and reducing the linear expansion coefficient of the cured product. The upper limit is preferably 95% by mass or less, more preferably 90% by mass or less, even more preferably 85% by mass or less, and particularly preferably 80% by mass or less or 75% by mass or less. In one embodiment, the content may be 70% by mass or less, 65% by mass or less, 60% by mass or less, etc.

[0098] The total content of components (A), (B), and (C), when the total amount of nonvolatile components in the resin composition is taken as 100% by mass, is preferably 30% by mass or more or 40% by mass or more, more preferably 50% by mass or more or 60% by mass or more, even more preferably 70% by mass or more, 80% by mass or more, or 85% by mass or more, and particularly preferably 90% by mass or more, 95% by mass or more, or 97% by mass or more, in order to significantly achieve the effects of the present invention. In one embodiment, the total content may be 98% by mass or more, 98.5% by mass or more, etc. The upper limit is preferably 99.9% by mass or less, more preferably 99.8% by mass or less, even more preferably 99.5% by mass or less, and particularly preferably 99.2% by mass or less.

[0099] The mass ratio of component (A1) to component (C) [component (A1) / component (C)] is preferably 0.0001 or more, more preferably 0.0002 or more or 0.0005 or more, even more preferably 0.0008 or more or 0.001 or more, and particularly preferably 0.002 or more or 0.003 or more, from the viewpoint of significantly achieving the effects of the present invention. In one embodiment, the mass ratio may be 0.005 or more, 0.007 or more, 0.008 or more, 0.01 or more, 0.012 or more, 0.015 or more, etc. The upper limit is preferably 1 or less, more preferably 0.8 or less, even more preferably 0.5 or less or 0.2 or less, and particularly preferably 0.15 or less or 0.1 or less, from the viewpoint of reducing the linear expansion coefficient of the cured product, increasing the glass transition temperature of the cured product, and further reducing the dielectric loss tangent of the cured product at room temperature (23°C) and a high temperature (100°C). In one embodiment, the value may be 0.08 or less, 0.05 or less, 0.04 or less, 0.03 or less, 0.02 or less, or the like.

[0100] When the resin composition of the first embodiment contains the (A2) component, the mass ratio of the (A2) component to the (C) component [(A2) component / (C) component] is, from the viewpoint of significantly achieving the effects of the present invention, preferably 0.001 or more or 0.005 or more, more preferably 0.01 or more or 0.02 or more, even more preferably 0.05 or more or 0.1 or more, and particularly preferably 0.15 or more or 0.2 or more. In one embodiment, the mass ratio may be 0.25 or more, 0.3 or more, 0.35 or more, 0.4 or more, etc. The upper limit is preferably 20 or less or 10 or less, more preferably 8 or less or 5 or less, even more preferably 2 or less or 1 or less, and particularly preferably 0.8 or less, 0.6 or less, or 0.5 or less.

[0101] The mass ratio of component (B) to component (C) [component (B) / component (C)] is preferably 0.001 or more or 0.002 or more, more preferably 0.005 or more or 0.008 or more, even more preferably 0.01 or more or 0.02 or more, and particularly preferably 0.05 or more, 0.08 or more, or 0.10 or more, from the viewpoint of significantly achieving the effects of the present invention. In one embodiment, the mass ratio may be 0.12 or more, 0.15 or more, 0.18 or more, 0.20 or more, etc. The upper limit of the mass ratio is preferably 20 or less or 10 or less, more preferably 8 or less, 5 or less, or 2 or less, even more preferably 1 or less, 0.8 or less, or 0.5 or less, and particularly preferably 0.4 or less, 0.3 or less, or 0.25 or less, from the viewpoint of further reducing the dielectric loss tangent of the cured product at room temperature (23°C) and a high temperature (100°C) and from the viewpoint of reducing the linear expansion coefficient of the cured product.

[0102] <(1D) Aluminum Complex> The resin composition of the first embodiment of the present invention contains a (1D) aluminum complex. The (1D) aluminum complex has a structure in which one or more ligands are coordinated to a trivalent aluminum ion. The (1D) aluminum complex may be used alone or in combination of two or more.

[0103] Examples of the ligand of the (1D) aluminum complex include alcohols, alkoxides, phenols, phenoxides, β-diketones, β-diketone enolates, β-ketoesters, β-ketoester enolates, carboxylic acids, carboxylate ions, water, hydroxide ions, oxygen atoms, ammonia, amines, and cyanide ions. A ligand selected from the group consisting of alcohols, alkoxides, β-diketones, β-diketone enolates, β-ketoesters, and β-ketoester enolates is preferred, and a ligand selected from the group consisting of β-diketones, β-diketone enolates, β-ketoesters, and β-ketoester enolates is more preferred. That is, the (1D) component preferably contains one or more aluminum complexes selected from the group consisting of aluminum complexes having an alkoxide as a ligand, aluminum complexes having a β-diketone enolate as a ligand, and aluminum complexes having a β-ketoester enolate as a ligand.

[0104] The (1D) aluminum complex may have two or more different ligands. In one embodiment, the (1D) component preferably has one or more ligands selected from the group consisting of alcohols, alkoxides, β-diketones, β-diketone enolates, β-ketoesters, and β-ketoester enolates, and more preferably has two or more ligands selected from the above group.

[0105] The alcohol as a ligand is preferably an alcohol having 1 to 20 carbon atoms. The lower limit of the number of carbon atoms of the alcohol is more preferably 2 or more, and even more preferably 3 or more. The lower limit of the number of carbon atoms of the alcohol is preferably 18 or less or 16 or less, more preferably 14 or less or 12 or less, even more preferably 10 or less or 8 or less, and particularly preferably 6 or less or 4 or less. Examples of alcohols include methanol, ethanol, n-propyl alcohol, isopropyl alcohol, n-butyl alcohol, sec-butyl alcohol, isobutyl alcohol, t-butyl alcohol, pentyl alcohol, and hexyl alcohol. Ethanol, isopropyl alcohol, or sec-butyl alcohol is preferred, and isopropyl alcohol or sec-butyl alcohol is more preferred.

[0106] The alkoxide as a ligand is an anion generated by dissociating a hydrogen ion from a hydroxy group of an alcohol. The number of carbon atoms in the alkoxide is preferably 1 to 20. The lower limit of the number of carbon atoms in the alkoxide is more preferably 2 or more, and even more preferably 3 or more. The lower limit of the number of carbon atoms in the alkoxide is more preferably 18 or less, 16 or less, 14 or less, or 12 or less, even more preferably 10 or less or 8 or less, and particularly preferably 6 or less or 4 or less. Examples of alkoxides include methoxide, ethoxide, n-propyl alkoxide, isopropyl alkoxide, n-butyl alkoxide, sec-butyl alkoxide, isobutyl alkoxide, t-butyl alkoxide, pentyl alkoxide, and hexyl alkoxide. Ethoxide, isopropyl alkoxide, or sec-butyl alkoxide is preferred, and isopropyl alkoxide or sec-butyl alkoxide is more preferred.

[0107] The β-diketone as a ligand is preferably a β-diketone having 5 to 20 carbon atoms. The upper limit of the number of carbon atoms of the β-diketone is more preferably 20 or less, 18 or less, 16 or less, or 14 or less, even more preferably 12 or less or 10 or less, and particularly preferably 8 or less or 6 or less. In one embodiment, the number of carbon atoms of the β-diketone is preferably 5.

[0108] In one embodiment, the β-diketone is preferably a compound represented by the following formula (1d-1): [ka] (In formula (1d-1), R d1 and R d2 R each independently represents an alkyl group having 1 to 10 carbon atoms, which may have a halogen atom as a substituent, or an aryl group having 1 to 10 carbon atoms. d3 represents a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, or an aryl group having 1 to 10 carbon atoms.

[0109] In formula (1d-1), R d1 and R d2 R each independently represents an alkyl group having 1 to 10 carbon atoms, which may have a halogen atom as a substituent, or an aryl group having 1 to 10 carbon atoms. d1 and R d2 may be the same or different from each other.

[0110] R d1 and R d2Examples of the alkyl group that may have a halogen atom as a substituent include an alkyl group that has a halogen atom as a substituent and an alkyl group that does not have a halogen atom as a substituent, with an alkyl group that does not have a halogen atom as a substituent being preferred. Hereinafter, an "alkyl group that does not have a halogen atom as a substituent" will be simply referred to as an "alkyl group." The alkyl group is a chain (straight-chain or branched) alkyl group or a cyclic alkyl group. The alkyl group preferably has 1 to 10 carbon atoms, more preferably 1 to 5, even more preferably 1 to 3, and particularly preferably 1. Examples of the chain alkyl group include a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, an isobutyl group, an s-butyl group, a t-butyl group, an n-pentyl group, an isopentyl group, a hexyl group, a 2-ethylhexyl group, an octyl group, and a decyl group, with a methyl group, an ethyl group, an n-propyl group, or an isopropyl group being preferred, a methyl group or an ethyl group being more preferred, and a methyl group being even more preferred. Examples of the cyclic alkyl group include a cyclopentyl group, a cyclohexyl group, and a cyclooctyl group.

[0111] Examples of the halogen atom as a substituent include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom. A fluorine atom, a chlorine atom, or a bromine atom is preferred, a fluorine atom or a chlorine atom is more preferred, and a fluorine atom is even more preferred.

[0112] The alkyl group having a halogen atom as a substituent is preferably an alkyl group in which part or all of the hydrogen atoms are substituted with halogen atoms, in the preferred embodiments of the alkyl group described above. Examples of the alkyl group having a halogen atom as a substituent include a trifluoromethyl group, a pentafluoroethyl group, and a trichloromethyl group, and the trifluoromethyl group is preferred.

[0113] R d1 and R d2 The aryl group in R is a group in which one hydrogen atom on the aromatic ring is removed from an aromatic compound. d1 and R d2The number of carbon atoms in the aryl group as a substituent in the formula (I) is preferably 1 to 10, more preferably 3 to 10, still more preferably 5 to 10, and particularly preferably 6 to 10. Examples of the aryl group include a phenyl group, a naphthyl group, a thienyl group, a pyrrolyl group, a furanyl group, a furyl group, a pyridyl group, a pyridazinyl group, a pyrimidyl group, a pyrazinyl group, a triazinyl group, a pyrrolidyl group, a piperidyl group, a quinolyl group, and an isoquinolyl group. A phenyl group, a naphthyl group, a furyl group, or a thienyl group is preferred, a phenyl group, a furyl group, or a thienyl group is more preferred, and a phenyl group is even more preferred.

[0114] Among these, R d1 and R d2 is preferably a methyl group, a trifluoromethyl group or a phenyl group, more preferably a methyl group.

[0115] In formula (1d-1), R d3 represents a hydrogen atom, an alkyl group having 1 to 10 carbon atoms which may have a halogen atom as a substituent, or an aryl group having 1 to 10 carbon atoms. d3 A preferred embodiment of the alkyl group in R d1 and R d2 The alkyl group is the same as that in R d3 A preferred embodiment of the aryl group in R d1 and R d2 Among these, R d3 is preferably a hydrogen atom or a methyl group, more preferably a hydrogen atom.

[0116] Specific examples of β-diketones include acetylacetone, benzoylacetone, dibenzoylmethane, 2-furoylbenzoylmethane, trifluoroacetylacetone, 2-furoyltrifluoroacetone, and 2-furoyltrifluoroacetone, with acetylacetone being preferred.

[0117] The β-diketone enolate as a ligand is an anion generated by dissociation of a hydrogen ion at the α-position of a β-diketone. The number of carbon atoms in the β-diketone enolate is preferably 5 to 20. The upper limit of the number of carbon atoms in the β-diketone enolate is more preferably 20 or less, 18 or less, 16 or less, or 14 or less, even more preferably 12 or less or 10 or less, and particularly preferably 8 or less or 6 or less. In one embodiment, the number of carbon atoms in the β-diketone enolate is preferably 5.

[0118] In one embodiment, the β-diketone enolate is preferably an anion represented by the following formula (1d-2): [ka] (In formula (1d-2), R d1 and R d2 R each independently represents an alkyl group having 1 to 10 carbon atoms which may have a halogen atom as a substituent, or an aryl group having 1 to 10 carbon atoms which may have a halogen atom as a substituent. d3 represents a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, or an aryl group having 1 to 10 carbon atoms.

[0119] In formula (1d-2), R d1 and R d2 each independently represents an alkyl group having 1 to 10 carbon atoms, or an aryl group having 1 to 10 carbon atoms, which may have a halogen atom as a substituent; R d1 and R d2 is the same as

[0120] In formula (1d-2), R d3 represents a hydrogen atom, an alkyl group having 1 to 10 carbon atoms which may have a halogen atom as a substituent, or an aryl group having 1 to 10 carbon atoms, and R d3 is the same as

[0121] In general, β-diketone enolates are known to have a resonance structure between the structure represented by the following formula (1d-2-1) and the structure represented by the following formula (1d-2-2). Because the negative charge is delocalized, they are sometimes expressed as the following formula (1d-2-3). In this specification, even when one of the resonance structures is described, such as the above formula (1d-2), it means that the negative charge of the β-diketone enolate is delocalized. In other words, formula (1d-2) and formula (1d-2-3) represent the same structure and electronic state. [ka] [ka]

[0122] Specific examples of β-diketone enolates include anions represented by the following formulas (1d-2-4) to (1d-2-10), with the anion represented by formula (1d-2-4) being preferred. [ka]

[0123] The β-ketoester as a ligand is preferably a β-ketoester having 5 to 20 carbon atoms. The upper limit of the number of carbon atoms in the β-ketoester is more preferably 20 or less, 18 or less, 16 or less, or 14 or less, even more preferably 12 or less or 10 or less, and particularly preferably 8 or less or 7 or less. The lower limit of the number of carbon atoms in the β-ketoester is preferably 6 or more. In one embodiment, the number of carbon atoms in the β-ketoester is preferably 6.

[0124] In one embodiment, the β-ketoester is preferably a compound represented by the following formula (1d-3): [ka] (In formula (1d-3), R d4 and R d5R each independently represents an alkyl group having 1 to 10 carbon atoms, which may have a halogen atom as a substituent, or an aryl group having 1 to 10 carbon atoms. d6 represents a hydrogen atom, an alkyl group having 1 to 10 carbon atoms which may have a halogen atom as a substituent, or an aryl group having 1 to 10 carbon atoms.

[0125] In formula (1d-3), R d4 and R d5 R each independently represents an alkyl group having 1 to 10 carbon atoms, which may have a halogen atom as a substituent, or an aryl group having 1 to 10 carbon atoms. d4 and R d5 may be the same or different from each other.

[0126] R d4 and R d5 Examples of the alkyl group that may have a halogen atom as a substituent include an alkyl group that has a halogen atom as a substituent and an alkyl group that does not have a halogen atom as a substituent, with an alkyl group that does not have a halogen atom as a substituent being preferred. The alkyl group is a chain (straight-chain or branched) alkyl group or a cyclic alkyl group. The alkyl group preferably has 1 to 10 carbon atoms, more preferably 1 to 5, still more preferably 1 to 3, and particularly preferably 1 or 2. Examples of the chain alkyl group include a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, an isobutyl group, an s-butyl group, a t-butyl group, an n-pentyl group, an isopentyl group, a hexyl group, a 2-ethylhexyl group, an octyl group, and a decyl group, with a methyl group, an ethyl group, an n-propyl group, an isopropyl group, or an n-butyl group being preferred, with a methyl group or an ethyl group being more preferred. Examples of the cyclic alkyl group include a cyclopentyl group, a cyclohexyl group, and a cyclooctyl group.

[0127] Examples of the halogen atom as a substituent include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom. A fluorine atom, a chlorine atom, or a bromine atom is preferred, a fluorine atom or a chlorine atom is more preferred, and a fluorine atom is even more preferred.

[0128] The alkyl group having a halogen atom as a substituent is preferably an alkyl group in which part or all of the hydrogen atoms are substituted with halogen atoms, in the preferred embodiments of the alkyl group described above. Examples of the alkyl group having a halogen atom as a substituent include a trifluoromethyl group, a pentafluoroethyl group, and a trichloromethyl group, and the trifluoromethyl group is preferred.

[0129] R d4 and R d5 The aryl group in R is a group in which one hydrogen atom on the aromatic ring is removed from an aromatic compound. d4 and R d5 The number of carbon atoms in the aryl group as a substituent in the formula (I) is preferably 1 to 10, more preferably 3 to 10, still more preferably 5 to 10, and particularly preferably 6 to 10. Examples of the aryl group include a phenyl group, a naphthyl group, a thienyl group, a pyrrolyl group, a furanyl group, a furyl group, a pyridyl group, a pyridazinyl group, a pyrimidyl group, a pyrazinyl group, a triazinyl group, a pyrrolidyl group, a piperidyl group, a quinolyl group, and an isoquinolyl group. A phenyl group, a naphthyl group, a furyl group, or a thienyl group is preferred, a phenyl group, a furyl group, or a thienyl group is more preferred, and a phenyl group is even more preferred.

[0130] Among these, R d4 is preferably a methyl group, an ethyl group, an n-propyl group, or an n-butyl group, and more preferably an ethyl group. d5 is preferably a methyl group, a trifluoromethyl group or a phenyl group, more preferably a methyl group.

[0131] In formula (1d-3), R d6 represents a hydrogen atom, an alkyl group having 1 to 10 carbon atoms which may have a halogen atom as a substituent, or an aryl group having 1 to 10 carbon atoms, and R d3 is the same as

[0132] Specific examples of β-ketoesters include methyl acetoacetate, ethyl acetoacetate, n-propyl acetoacetate, n-butyl acetoacetate, and compounds represented by the following formulae (1d-3-1) to (1d-3-8), with ethyl acetoacetate being preferred. [ka]

[0133] The β-ketoester enolate as a ligand is an anion generated by dissociation of a hydrogen ion at the α-position of a β-ketoester. The β-ketoester preferably has 5 to 20 carbon atoms. The upper limit of the number of carbon atoms in the β-ketoester enolate is more preferably 20 or less, 18 or less, 16 or less, or 14 or less, even more preferably 12 or less or 10 or less, and particularly preferably 8 or less or 7 or less. The lower limit of the number of carbon atoms in the β-ketoester enolate is preferably 6 or more. In one embodiment, the number of carbon atoms in the β-ketoester enolate is preferably 6.

[0134] In one embodiment, the β-ketoester enolate is preferably an anion represented by the following formula (1d-4): [ka] (In formula (1d-4), R d4 and R d5 R each independently represents an alkyl group having 1 to 10 carbon atoms, which may have a halogen atom as a substituent, or an aryl group having 1 to 10 carbon atoms. d6 represents a hydrogen atom, an alkyl group having 1 to 10 carbon atoms which may have a halogen atom as a substituent, or an aryl group having 1 to 10 carbon atoms.

[0135] In formula (1d-4), R d4 and R d5 each independently represents an alkyl group having 1 to 10 carbon atoms, or an aryl group having 1 to 10 carbon atoms, which may have a halogen atom as a substituent; R d4 and Rd5 is the same as

[0136] In formula (1d-4), R d6 represents a hydrogen atom, an alkyl group having 1 to 10 carbon atoms which may have a halogen atom as a substituent, or an aryl group having 1 to 10 carbon atoms, and R d3 is the same as

[0137] In general, β-ketoester enolates are known to have a resonance structure between the structure represented by the following formula (1d-4-1) and the structure represented by the following formula (1d-4-2). Because the negative charge is delocalized, they are sometimes expressed as the following formula (1d-4-3). In this specification, even when one of the resonance structures is written as in the above formula (1d-4), it means that the negative charge of the β-ketoester enolate is delocalized. In other words, formula (1d-4) and formula (1d-4-3) represent the same structure and electronic state. [ka] [ka]

[0138] Specific examples of β-ketoester enolates include methyl acetoacetate, ethyl acetoacetate, n-propyl acetoacetate, n-butyl acetoacetate, and anions represented by the following formulas (1d-4-4) to (1d-4-11), with ethyl acetoacetate being preferred. [ka]

[0139] The carboxylic acid as a ligand is preferably a carboxylic acid having 1 to 40 carbon atoms. The lower limit of the number of carbon atoms of the carboxylic acid is more preferably 2 or more or 3 or more, even more preferably 4 or more or 5 or more, and particularly preferably 6 or more or 7 or more. The upper limit of the number of carbon atoms of the carboxylic acid is preferably 40 or less or 36 or less, more preferably 32 or less or 28 or less, even more preferably 26 or less or 24 or less, and particularly preferably 22 or less or 20 or less. Examples of carboxylic acids include formic acid, acetic acid, propionic acid, butyric acid, valeric acid, hexanoic acid, heptanoic acid, octanoic acid, nonanoic acid, decanoic acid, lauric acid, palmitic acid, and stearic acid, with octanoic acid or stearic acid being preferred.

[0140] The carboxylate ion as a ligand is an anion generated by dissociating a hydrogen ion from the carboxy group of a carboxylic acid. The carboxylate ion preferably has 1 to 40 carbon atoms. The lower limit of the number of carbon atoms in the carboxylate ion is more preferably 2 or more or 3 or more, even more preferably 4 or more or 5 or more, and particularly preferably 6 or more or 7 or more. The upper limit of the number of carbon atoms in the carboxylate ion is preferably 40 or less or 36 or less, more preferably 32 or less or 28 or less, even more preferably 26 or less or 24 or less, and particularly preferably 22 or less or 20 or less. Examples of carboxylate ions include formate ion, acetate ion, propionate ion, butyrate ion, valerate ion, hexanoate ion, heptanoate ion, octanoate ion, nonanoate ion, decanoate ion, laurate ion, palmitate ion, and stearate ion, with octanoate ion or stearate ion being preferred.

[0141] In one embodiment, the (1D) aluminum complex preferably includes an aluminum chelate complex. By using a bidentate or higher-density ligand among the above-mentioned ligands, the (1D) component can be made into an aluminum chelate complex. The ligand of the aluminum chelate complex preferably includes a bidentate ligand. Examples of bidentate ligands include β-diketone, β-diketone enolate, β-ketoester, and β-ketoester enolate.

[0142] The (1D) aluminum complex may be a mononuclear aluminum complex containing one aluminum ion per molecule, or a polynuclear aluminum complex containing two or more aluminum ions per molecule. In one embodiment, the (1D) component preferably contains a mononuclear aluminum complex.

[0143] The coordination number of the (1D) aluminum complex is preferably 1 to 12. Here, when one bidentate ligand is coordinated, the coordination number is considered to be 2. The lower limit of the coordination number is preferably 2 or more, more preferably 3 or more, and may be 4 or more, or 5 or more. The upper limit of the coordination number is preferably 10 or less, more preferably 8 or less, and even more preferably 7 or less. In one embodiment, the coordination number of the aluminum complex is preferably 6.

[0144] The number of ligands in the (1D) aluminum complex is preferably 1 to 12. Here, when one bidentate ligand is coordinated, the number of ligands is considered to be 1. The lower limit of the number of ligands is preferably 2 or more, more preferably 3 or more. The upper limit of the number of ligands is preferably 10 or less, more preferably 8 or less, even more preferably 6 or less, and particularly preferably 5 or less or 4 or less. In one embodiment, the number of ligands in the (1D) aluminum complex is preferably 3.

[0145] The molecular weight of the (1D) aluminum complex is preferably 100 to 2,000. The lower limit of the molecular weight of the (1D) aluminum complex is more preferably 120 or more or 140 or more, even more preferably 160 or more or 180 or more, and particularly preferably 200 or more or 210 or more. The upper limit is more preferably 1,500 or less, 1,000 or less, or 900 or less, even more preferably 800 or less, 700 or less, or 600 or less, and particularly preferably 500 or less, 450 or less, or 400 or less.

[0146] Specific examples of the (1D) aluminum complex include aluminum triisopropylate (aluminum complex represented by formula (1d-5-1)), aluminum diisopropylate monosec-butylate (aluminum complex represented by formula (1d-5-2)), aluminum trisec-butylate (aluminum complex represented by formula (1d-5-3)), aluminum triethylate (aluminum complex represented by formula (1d-5-4)), aluminum ethylacetoacetate diisopropylate (aluminum complex represented by formula (1d-5-5)), aluminum tris(ethylacetoacetate) (aluminum complex represented by formula (1d-5-6)), aluminum alkylacetoacetate diisopropylate (aluminum complex represented by formula (1d-5-7)), aluminum Examples of suitable aluminum complexes include aluminum monoacetylacetonate bis(ethylacetoacetate) (aluminum complex represented by formula (1d-5-8)), aluminum tris(acetylacetonate) (aluminum complex represented by formula (1d-5-9)), cyclic aluminum oxide isopropylate (aluminum complex represented by formula (1d-5-10)), cyclic aluminum oxide stearate (aluminum complex represented by formula (1d-5-11)), and cyclic aluminum oxide octylate (aluminum complex represented by formula (1d-5-12)). Aluminum monoacetylacetonate bis(ethylacetoacetate) or aluminum diisopropylate monosec-butylate is preferred, and aluminum monoacetylacetonate bis(ethylacetoacetate) is more preferred. The aluminum complexes may be present in the resin composition in a state where some of the ligands are dissociated. [ka] (In formula (1d-5-7), R d0 represents an alkyl group.

[0147] (1D) Commercially available aluminum complexes include, for example, "AIPD," "PADM," "AMD," "ASBD," "Aluminium Ethoxide," "ALCH," "S-75P," "ALCH-TR," "Aluminum Chelate M," "Aluminum Chelate D," "Aluminum Chelate A," "Aluminum Chelate A(a)," "Algomer," "Algomer S," "Algomer 800AF," and "Algomer 1000SF," all manufactured by Kawaken Fine Chemicals Co., Ltd.

[0148] When the total amount of nonvolatile components in the resin composition is taken as 100% by mass, the content of component (1D) is preferably 0.0001% by mass or more or 0.0005% by mass or more, more preferably 0.001% by mass or more or 0.002% by mass or more, even more preferably 0.005% by mass or more or 0.008% by mass or more, and particularly preferably 0.01% by mass or more, 0.015% by mass or more, or 0.017% by mass or more, from the viewpoint of significantly achieving the effects of the present invention. In one embodiment, the content may be 0.02% by mass or more, 0.025% by mass or more, 0.03% by mass or more, 0.035% by mass or more, etc. The upper limit is preferably 2.00% by mass or 1.00% by mass, more preferably 0.80% by mass or 0.50% by mass, even more preferably 0.20% by mass or less, 0.15% by mass or less, 0.10% by mass or less, or 0.08% by mass or less, and particularly preferably 0.07% by mass or less, 0.06% by mass or less, 0.05% by mass or less, or 0.04% by mass or less. In one embodiment, the content of component (1D) is preferably 0.01 to 0.20% by mass, and more preferably 0.01 to 0.15% by mass, when the total nonvolatile components in the resin composition is 100% by mass.

[0149] When the resin component in the resin composition is taken as 100% by mass, the content of component (1D) is preferably 0.001% by mass or more or 0.002% by mass or more, more preferably 0.005% by mass or more or 0.008% by mass or more, even more preferably 0.01% by mass or more or 0.02% by mass or more, particularly preferably 0.05% by mass or more, 0.06% by mass or more or 0.08% by mass or more, and the upper limit is preferably 10% by mass or less or 8% by mass or less, more preferably 5% by mass or less or 2% by mass or less, even more preferably 1% by mass or less, 0.8% by mass or less or 0.5% by mass or less, and particularly preferably 0.2% by mass or less, 0.18% by mass or less, 0.15% by mass or less, 0.12% by mass or less, or 0.1% by mass or less, from the viewpoint of significantly achieving the effects of the present invention.

[0150] In the resin composition of the first embodiment, the total content of components (A), (B), (C), and (1D), when the total nonvolatile components in the resin composition is taken as 100% by mass, is preferably 30% by mass or more or 40% by mass or more, more preferably 50% by mass or more or 60% by mass or more, even more preferably 70% by mass or more, 80% by mass or more, or 85% by mass or more, and particularly preferably 90% by mass or more, 95% by mass or more, or 97% by mass or more, from the viewpoint of significantly achieving the effects of the present invention. In one embodiment, the total content may be 98% by mass or more, 98.5% by mass or more, etc. The upper limit may be 100% by mass, or may be 99.9% by mass or less, 99.8% by mass or less, 99.5% by mass or less, 99.2% by mass or less, etc.

[0151] The mass ratio of component (1D) to component (A1) [component (1D) / component (A1)] is preferably 0.0001 or more or 0.0002 or more, more preferably 0.0005 or more or 0.0008 or more, even more preferably 0.001 or more or 0.002 or more, and particularly preferably 0.005 or more, 0.006 or more, or 0.007 or more, from the viewpoints of significantly achieving the effects of the present invention, reducing the linear expansion coefficient of the cured product, and increasing the glass transition temperature of the cured product. In one embodiment, the mass ratio may be 0.01 or more, 0.02 or more, 0.03 or more, etc. The upper limit is preferably 5 or less or 2 or less, more preferably 1 or less or 0.8 or less, even more preferably 0.5 or less or 0.2 or less, and particularly preferably 0.1 or less, 0.08 or less, 0.06 or less, 0.05 or less, or 0.04 or less.

[0152] When the resin composition of the first embodiment contains the component (A2), the mass ratio of the component (1D) to the component (A2) [component (1D) / component (A2)] is preferably 1×10 -5 or more or 2 x 10 -5 More preferably, 5 × 10 -5 or more or 8 x 10 -5 More preferably, 1 × 10 -4 That's it, 2 x 10 -4 or more or 5 x 10 -4 More preferably, 8 × 10 -4 That's it, 1×10 -3 or more than 1.2 x 10 -3 The upper limit is preferably 1 or less or 5 × 10 -1 Less than or equal to 1×10 -1 or less or 8 x 10 -2 Less than 5 × 10, more preferably -2 Below, 2 x 10 -2 or less or 1×10 -2 Below, particularly preferably 8 × 10 -3 Below, 5 x 10 -3 Below, 2 x 10 -3 Below, 1.8 x 10 -3 or less or 1.5 x 10 -3 The following is the result.

[0153] From the viewpoint of significantly achieving the effects of the present invention, the mass ratio of the component (1D) to the component (A) [component (1D) / component (A)] is preferably 1×10 -5 or more or 2 x 10 -5 More preferably, 5 × 10 -5 That's it, 8 x 10 -5 or more or 1 x 10 -4 More preferably, 2 × 10 -4 That's it, 5 x 10 -4 or more or 8 x 10 -4 More preferably, 1×10 -3 That's it, 1.1 x 10 -3 or more than 1.2 x 10 -3 The upper limit is preferably 1 or less or 5 × 10 -1 Less than or equal to 1×10 -1 Below, 8 x 10 -2 or less or 5 x 10 -2 or less, more preferably 2 × 10 -2 Below, 1×10 -2 or less or 8 x 10 -3 Below 5 × 10, particularly preferably -3 Below, 3 x 10 -3 Below, 2 x 10 -3 Below, 1.8 x 10 -3 or less or 1.5 x 10 -3 The following is the result.

[0154] The mass ratio of the component (1D) to the component (B) [component (1D) / component (B)] is preferably 1×10 -5 or more or 5 x 10 -5 or more, more preferably 1×10 -4 or more or 2 x 10 -4 More preferably, 5 × 10 -4 or more or 8 x 10 -4 More preferably, 1×10 -3 That's it, 2 x 10 -3 or more than 2.5 x 10 -3 The upper limit is preferably 1 or less or 5 × 10 -1 Less than or equal to 1×10 -1 Below, 8 x 10 -2 or less or 5 x 10-2 or less, more preferably 2 × 10 -2 Below, 1×10 -2 or less or 8 x 10 -3 Below 6 × 10, particularly preferably -3 Below, 5 x 10 -3 Below, 4 x 10 -3 or less or 3 x 10 -3 The following is the result.

[0155] From the viewpoint of significantly achieving the effects of the present invention, the mass ratio of the component (1D) to the component (C) [component (1D) / component (C)] is preferably 1×10 -5 More preferably, 2×10 -5 or more or 5 x 10 -5 More preferably, 8 × 10 -5 or more or 1 x 10 -4 More preferably, 2 × 10 -4 or more or 3 x 10 -4 In one embodiment, 4×10 -4 That's it, 5 x 10 -4 That's it, 6 x 10 -4 The upper limit is preferably 1×10 from the viewpoint of further reducing the dielectric loss tangent of the cured product at room temperature (23° C.) and at a high temperature (100° C.) and from the viewpoint of reducing the linear expansion coefficient of the cured product. -1 or less or 8 x 10 -2 Less than or equal to 5 × 10 -2 or less or 2 x 10 -2 or less, more preferably 1 × 10 -2 Below, 8 x 10 -3 or less or 5 x 10 -3 Below 2 × 10, particularly preferably -3 Below, 1×10 -3 Below, 9 x 10 -4 Below, 8 x 10 -4 or less or 7 x 10 -4 The following is the result.

[0156] <(E) Radical curing resin> The resin composition of the first embodiment of the present invention may contain (E) a radically curable resin as an optional component. The (E) radically curable resin may be used alone or in combination of two or more. By including (E) a radically curable resin in the resin composition, it is possible to reduce the difference between the dielectric loss tangent (Df) at high temperature (100°C) and the dielectric loss tangent (Df) at room temperature (23°C) (temperature dependency of the dielectric loss tangent), and to increase the glass transition temperature (Tg) of the cured product.

[0157] The (E) radical curable resin may have an ethylenically unsaturated bond. The (E) radical curable resin may have a radical polymerizable group such as an unsaturated hydrocarbon group (e.g., vinyl group, allyl group, 3-cyclohexenyl group, 3-cyclopentenyl group, p-vinylphenyl group, m-vinylphenyl group, or o-vinylphenyl group); or an α,β-unsaturated carbonyl group (e.g., acryloyl group, methacryloyl group, or maleimide group (2,5-dihydro-2,5-dioxo-1H-pyrrol-1-yl group); preferably an unsaturated hydrocarbon group or an α,β-unsaturated carbonyl group, and more preferably an α,β-unsaturated carbonyl group. The (E) radical curable resin preferably has two or more radical polymerizable groups.

[0158] Examples of (E) radically curable resins include (meth)acrylic radically curable resins, styrene radically curable resins, allyl radically curable resins, and maleimide radically curable resins. Styrenic radically curable resins or maleimide radically curable resins are preferred, and maleimide radically curable resins are more preferred. "(Meth)acrylic radically curable resin" refers to a resin having an acryloyl group or a methacryloyl group. By incorporating a maleimide radically curable resin into a resin composition, the difference between the dielectric loss tangent (Df) at high temperature (100°C) and the dielectric loss tangent (Df) at room temperature (23°C) (temperature dependence of the dielectric loss tangent) can be reduced. Furthermore, by incorporating a styrene radically curable resin into a resin composition, the dielectric loss tangent of the cured product at room temperature (23°C) and high temperature (100°C) can be further reduced, the linear expansion coefficient of the cured product can be reduced, and the glass transition temperature of the cured product can be increased.

[0159] The (meth)acrylic radical curable resin is, for example, a compound having one or more, preferably two or more, acryloyl groups and / or methacryloyl groups. Examples of the (meth)acrylic radical curable resin include cyclohexane-1,4-dimethanol di(meth)acrylate, cyclohexane-1,3-dimethanol di(meth)acrylate, tricyclodecane dimethanol di(meth)acrylate, neopentyl glycol di(meth)acrylate, 1,4-butanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, 1,8-octanediol di(meth)acrylate, 1,9-octanediol di(meth)acrylate, 1,6-octanediol di(meth)acrylate, 1,8-octanediol di(meth)acrylate, 1,9 ...8-octanediol di(meth)acrylate, 1,8-octanediol di(meth)acrylate, 1 Low molecular weight (molecular weight less than 1000) aliphatic (meth)acrylic acid ester compounds such as nanediol di(meth)acrylate, 1,10-decanediol di(meth)acrylate, trimethylolpropane tri(meth)acrylate, trimethylolethane tri(meth)acrylate, glycerin tri(meth)acrylate, and pentaerythritol tetra(meth)acrylate; dioxane glycol di(meth)acrylate, 3,6-dioxa-1,8-octanediol di(meth)acrylate, Examples of the ether-containing (meth)acrylic acid ester compounds include low molecular weight (molecular weight less than 1000) ether-containing (meth)acrylic acid ester compounds such as bis(meth)acrylate, 3,6,9-trioxaundecane-1,11-diol di(meth)acrylate, polyethylene glycol di(meth)acrylate, polypropylene glycol di(meth)acrylate, 9,9-bis[4-(2-acryloyloxyethoxy)phenyl]fluorene, ethoxylated bisphenol A di(meth)acrylate, and propoxylated bisphenol A di(meth)acrylate; low molecular weight (molecular weight less than 1000) isocyanurate-containing (meth)acrylic acid ester compounds such as tris(3-hydroxypropyl)isocyanurate tri(meth)acrylate, tris(2-hydroxyethyl)isocyanurate tri(meth)acrylate, and ethoxylated isocyanuric acid tri(meth)acrylate; and high molecular weight (molecular weight 1000 or more) acrylic acid ester compounds such as (meth)acrylic-modified polyphenylene ether resins.Among these, as the (meth)acrylic radical curable resin, a low molecular weight (molecular weight less than 1000) ether-containing (meth)acrylic acid ester compound is preferred, dioxane glycol di(meth)acrylate is more preferred, and dioxane glycol diacrylate is even more preferred.

[0160] Commercially available (meth)acrylic radical curable resins include, for example, "A-DOG" (dioxane glycol diacrylate) manufactured by Shin-Nakamura Chemical Co., Ltd., "DCP-A" (tricyclodecane dimethanol diacrylate) and "DCP" (tricyclodecane dimethanol dimethacrylate) manufactured by Kyoeisha Chemical Co., Ltd., "KAYARAD R-684" (tricyclodecane dimethanol diacrylate) and "KAYARAD R-604" (dioxane glycol diacrylate) manufactured by Nippon Kayaku Co., Ltd., and "SA-9000" and "SA-9000-111" (methacrylic-modified polyphenylene ether) manufactured by SABIC.

[0161] The styrene-based radical curable resin is, for example, a compound having one or more, preferably two or more, vinyl groups directly bonded to an aromatic carbon atom. Examples of the styrene-based radical curable resin include low-molecular-weight (molecular weight less than 1000) styrene-based compounds such as divinylbenzene, 2,4-divinyltoluene, 2,6-divinylnaphthalene, 1,4-divinylnaphthalene, 4,4'-divinylbiphenyl, 1,2-bis(4-vinylphenyl)ethane, 2,2-bis(4-vinylphenyl)propane, and bis(4-vinylphenyl)ether; and high-molecular-weight (molecular weight 1000 or more) styrene-based compounds such as vinylbenzyl-modified polyphenylene ether resin and styrene-divinylbenzene copolymer. Among these, the styrene-based radical curable resin is preferably a high-molecular-weight (molecular weight 1000 or more) styrene-based compound, and more preferably a vinylbenzyl-modified polyphenylene ether resin.

[0162] Examples of commercially available styrene-based radical curable resins include "ODV-XET(X03)", "ODV-XET(X04)", and "ODV-XET(X05)" (styrene-divinylbenzene copolymers) manufactured by Nippon Steel Chemical & Material Co., Ltd., and "OPE-2St", "OPE-2St 1200", and "OPE-2St 2200" (vinylbenzyl-modified polyphenylene ether resins) manufactured by Mitsubishi Gas Chemical Company, Inc.

[0163] The allyl radical curable resin is, for example, a compound having one or more, preferably two or more, allyl groups. Examples of the allyl radical curable resin include aromatic carboxylic acid allyl ester compounds such as diallyl diphenate, triallyl trimellitate, diallyl phthalate, diallyl isophthalate, diallyl terephthalate, diallyl 2,6-naphthalenedicarboxylate, and diallyl 2,3-naphthalenecarboxylate; isocyanuric acid allyl ester compounds such as 1,3,5-triallyl isocyanurate and 1,3-diallyl-5-glycidyl isocyanurate; 2,2-bis[3-allyl-4-(glycidyloxy)phenyl]propanol; benzoxazine-containing aromatic allyl compounds such as bis[3-allyl-4-(3,4-dihydro-2H-1,3-benzoxazin-3-yl)phenyl]methane; ether-containing aromatic allyl compounds such as 1,3,5-triallyl ether benzene; allylsilane compounds such as diallyldiphenylsilane; and resins represented by the following formula (E-1) obtained by reacting ortho-allylphenol, dicyclopentadiene-phenol copolymer resin, and isophthalic acid chloride. [ka] (In formula (E-1), the wavy line represents a structure obtained by reacting isophthalic acid chloride with a phenol polyaddition resin and / or ortho-allylphenol.)

[0164] Among these, the allyl-based radical curable resin is preferably an aromatic carboxylic acid allyl ester compound or a resin represented by the above formula (E-1), and more preferably diallyl diphenate or a resin represented by the above formula (E-1).

[0165] Commercially available allyl radical curable resins include, for example, "TAIC" (1,3,5-triallyl isocyanurate) manufactured by Nippon Kasei Chemical Industry Co., Ltd., "DAD" (diallyl diphenate) manufactured by Nisshoku Techno Fine Chemical Co., Ltd., "TRIAM-705" (triallyl trimellitate) manufactured by Fujifilm Wako Pure Chemical Industries, Ltd., trade name "DAND" (2,3-naphthalene carboxylic acid diallyl) manufactured by Nisshoku Techno Fine Chemical Co., Ltd., "ALP-d" (bis [3-allyl-4- (3,4-dihydro-2H-1,3-benzoxazin-3-yl) phenyl] methane) manufactured by Shikoku Chemical Industry Co., Ltd., "RE-810NM" (2,2-bis [3-allyl-4- (glycidyloxy) phenyl] propane) manufactured by Nippon Kayaku Co., Ltd., and "DA-MGIC" (1,3-diallyl-5-glycidyl isocyanurate) manufactured by Shikoku Chemical Industry Co., Ltd.

[0166] The maleimide radical curable resin is, for example, a compound having one or more, preferably two or more, maleimide groups. The maleimide radical curable resin may be an aliphatic maleimide compound containing an aliphatic amine skeleton, or an aromatic maleimide compound containing an aromatic amine skeleton. Commercially available maleimide radical curable resins include, for example, "SLK-2600" manufactured by Shin-Etsu Chemical Co., Ltd.; "BMI-1500," "BMI-1700," "BMI-3000J," "BMI-689," and "BMI-2500" (dimer diamine structure-containing maleimide resins) manufactured by Designer Molecules Inc.; "BMI-6100" (aromatic maleimide resin) manufactured by Designer Molecules Inc.; "MIR-5000-60T" and "MIR-3000-70MT" (biphenylaralkyl novolac maleimide resins) manufactured by Nippon Kayaku Co., Ltd.; "BMI-70" and "BMI-80" manufactured by K.I. Chemical Industry Co., Ltd.; and "BMI-2300" and "BMI-TMH" manufactured by Daiwa Kasei Kogyo Co., Ltd. Furthermore, as the maleimide-based radical curable resin, a maleimide resin (maleimide resin containing an indane ring skeleton) disclosed in the Japan Institute of Invention and Innovation's Technical Disclosure No. 2020-500211 may be used. Among these, as the maleimide-based radical curable resin, a dimer diamine structure-containing maleimide resin or a biphenylaralkyl novolac-type maleimide resin is preferred.

[0167] The ethylenically unsaturated bond equivalent of the (E) radically curable resin is preferably 20 to 3,000 g / eq., more preferably 50 to 2,500 g / eq., even more preferably 70 to 2,000 g / eq., and particularly preferably 90 to 1,500 g / eq. The ethylenically unsaturated bond equivalent represents the mass of the radically curable resin per equivalent of ethylenically unsaturated bond.

[0168] The weight average molecular weight (Mw) of the (E) radical curable resin is preferably 40,000 or less, more preferably 10,000 or less, even more preferably 5,000 or less, and particularly preferably 3,000 or less. The lower limit is not particularly limited, but can be, for example, 150 or more.

[0169] When the resin composition of the first embodiment contains component (E), the content of component (E) is, from the viewpoint of significantly achieving the effects of the present invention, preferably 0.01% by mass or more or 0.02% by mass or more, more preferably 0.05% by mass or more, 0.08% by mass or more or 0.1% by mass or more, even more preferably 0.2% by mass or more, 0.5% by mass or more or 0.8% by mass or more, and particularly preferably 1% by mass or more, 1.2% by mass or more or 1.4% by mass or more, based on 100% by mass of the nonvolatile components in the resin composition. The upper limit is preferably 20% by mass or less or 18% by mass or less, more preferably 15% by mass or less, 12% by mass or less or 10% by mass or less, even more preferably 8% by mass or less, 5% by mass or less or 4% by mass or less, and particularly preferably 3% by mass or less, 2% by mass or less or 1.8% by mass or less.

[0170] When the resin composition of the first embodiment contains component (E), the content of component (E) is, from the viewpoint of significantly achieving the effects of the present invention, preferably 0.02 mass% or more, 0.05 mass% or more, or 0.1 mass% or more, more preferably 0.2 mass% or more, 0.5 mass% or more, or 0.8 mass% or more, even more preferably 1 mass% or more, 1.5 mass% or more, or 2 mass% or more, particularly preferably 2.5 mass% or more, 3 mass% or more, or 3.5 mass% or more, when the resin components in the resin composition are taken as 100 mass%. The upper limit is preferably 30 mass% or less or 25 mass% or less, more preferably 20 mass% or less, 15 mass% or less, or 10 mass% or less, even more preferably 9 mass% or less, 8 mass% or less, or 7 mass% or less, particularly preferably 6 mass% or less, 5 mass% or less, or 4.5 mass% or less.

[0171] When the resin composition of the first embodiment contains component (E), the mass ratio of component (E) to component (A1) [component (E) / component (A1)] is preferably 0.01 or more, 0.02 or more, or 0.05 or more, more preferably 0.08 or more, 0.1 or more, or 0.2 or more, even more preferably 0.5 or more, 0.8 or more, or 1 or more, particularly preferably 1.2 or more, 1.4 or more, or 1.6 or more, from the viewpoints of significantly achieving the effects of the present invention, reducing the linear expansion coefficient of the cured product, and increasing the glass transition temperature of the cured product. The upper limit is preferably 100 or less, or 80 or less, more preferably 50 or less, 20 or less, or 10 or less, even more preferably 8 or less, 5 or less, or 4 or less, and particularly preferably 3 or less, 2 or less, or 1.8 or less.

[0172] When the resin composition of the first embodiment contains the (A2) component and the (E) component, the mass ratio of the (E) component to the (A2) component [(E) component / (A2) component] is, from the viewpoint of significantly achieving the effects of the present invention, preferably 0.0001 or more or 0.0005 or more, more preferably 0.001 or more, 0.002 or more or 0.005 or more, even more preferably 0.008 or more, 0.01 or more or 0.02 or more, particularly preferably 0.03 or more, 0.04 or more or 0.05 or more. The upper limit is preferably 5 or less or 2 or less, more preferably 1 or less or 0.8 or less, even more preferably 0.5 or less, 0.2 or less or 0.1 or less, and particularly preferably 0.09 or less, 0.08 or less or 0.07 or less.

[0173] When the resin composition of the first embodiment contains component (E), the mass ratio of component (E) to component (A) [component (E) / component (A)] is, from the viewpoint of significantly achieving the effects of the present invention, preferably 0.0001 or more or 0.0005 or more, more preferably 0.001 or more, 0.002 or more or 0.005 or more, even more preferably 0.008 or more, 0.01 or more or 0.02 or more, particularly preferably 0.03 or more, 0.04 or more or 0.05 or more. The upper limit is preferably 5 or less or 2 or less, more preferably 1 or less or 0.8 or less, even more preferably 0.5 or less, 0.2 or less or 0.1 or less, and particularly preferably 0.09 or less, 0.08 or less or 0.07 or less.

[0174] When the resin composition of the first embodiment contains the component (E), the mass ratio of the component (E) to the component (B) [component (E) / component (B)] is, from the viewpoint of significantly achieving the effects of the present invention, preferably 0.001 or more or 0.002 or more, more preferably 0.005 or more, 0.008 or more or 0.01 or more, even more preferably 0.02 or more, 0.05 or more or 0.08 or more, and particularly preferably 0.1 or more, 0.12 or more or 0.14 or more. The upper limit is preferably 10 or less, 8 or less, or 5 or less, more preferably 2 or less, 1 or less, or 0.8 or less, even more preferably 0.6 or less, 0.5 or less, or 0.4 or less, and particularly preferably 0.3 or less, 0.2 or less, or 0.18 or less.

[0175] When the resin composition of the first embodiment contains the (E) component, the mass ratio of the (E) component to the (C) component [(E) component / (C) component] is preferably 0.0001 or more, 0.0002 or more, or 0.0005 or more, more preferably 0.0008 or more, 0.001 or more, or 0.002 or more, even more preferably 0.005 or more, 0.008 or more, or 0.01 or more, and particularly preferably 0.015 or more, 0.02 or more, or 0.025 or more, from the viewpoint of significantly achieving the effects of the present invention. The upper limit is preferably 2 or less, more preferably 0.8 or less, 0.5 or less, or 0.2 or less, even more preferably 0.1 or less, 0.08 or less, or 0.06 or less, and particularly preferably 0.05 or less, 0.04 or less, or 0.03 or less, from the viewpoint of further reducing the dielectric loss tangent of the cured product at room temperature (23°C) and high temperature (100°C) and from the viewpoint of reducing the linear expansion coefficient of the cured product.

[0176] When the resin composition of the first embodiment contains the component (E), the mass ratio of the component (1D) to the component (E) [component (1D) / component (E)] is, from the viewpoint of significantly achieving the effects of the present invention, preferably 0.0001 or more or 0.0005 or more, more preferably 0.001 or more or 0.002 or more, even more preferably 0.005 or more, 0.008 or more or 0.01 or more, particularly preferably 0.015 or more, 0.018 or more or 0.02 or more. The upper limit is preferably 2 or less or 1 or less, more preferably 0.8 or less, 0.5 or less or 0.2 or less, even more preferably 0.1 or less, 0.08 or less or 0.06 or less, particularly preferably 0.05 or less, 0.04 or less, 0.035 or less, 0.03 or less, or 0.025 or less.

[0177] <(F) Curing accelerator> The resin composition of the first embodiment of the present invention may contain, and preferably contains, a curing accelerator (F) as an optional component. The curing accelerator (F) functions as a curing catalyst that accelerates the curing of the cyclic ether compound (A) having a four- or smaller ring and / or the curing agent (B).

[0178] Examples of the (F) curing accelerator include phosphorus-based curing accelerators, urea-based curing accelerators, guanidine-based curing accelerators, imidazole-based curing accelerators, metal-based curing accelerators, and amine-based curing accelerators. The (F) curing accelerators may be used alone or in combination of two or more. The (F) curing accelerator preferably includes an amine-based curing accelerator or an imidazole-based curing accelerator, and more preferably includes an amine-based curing accelerator.

[0179] Examples of the amine curing accelerator include trialkylamines such as triethylamine and tributylamine, pyridines such as 4-dimethylaminopyridine, benzyldimethylamine, 2,4,6-tris(dimethylaminomethyl)phenol, and 1,8-diazabicyclo(5,4,0)-undecene, among which pyridines are preferred, and 4-dimethylaminopyridine is more preferred. These may be used alone or in combination of two or more.

[0180] As the amine-based curing accelerator, commercially available products may be used, such as "MY-25" manufactured by Ajinomoto Fine-Techno Co., Ltd. and "DMAP" manufactured by Koei Chemical Industry Co., Ltd.

[0181] Examples of the phosphorus-based curing accelerator include aliphatic phosphonium salts such as tetrabutylphosphonium bromide, tetrabutylphosphonium chloride, tetrabutylphosphonium acetate, tetrabutylphosphonium decanoate, tetrabutylphosphonium laurate, bis(tetrabutylphosphonium)pyromellitate, tetrabutylphosphonium hydrogenhexahydrophthalate, tetrabutylphosphonium 2,6-bis[(2-hydroxy-5-methylphenyl)methyl]-4-methylphenolate, and di-tert-butylmethylphosphonium tetraphenylborate; methyltriphenylphosphonium bromide, ethyltriphenylphosphonium bromide, propyltriphenylphosphonium bromide, butyltriphenylphosphonium bromide, benzyltriphenylphosphonium chloride, tetraphenylphosphonium bromide, p-tolyltriphenylphosphonium tetra-p-tolylborate, and tetraphenylphosphonium bromide. aromatic phosphonium salts such as tetraphenylborate, tetraphenylphosphonium tetra-p-tolylborate, triphenylethylphosphonium tetraphenylborate, tris(3-methylphenyl)ethylphosphonium tetraphenylborate, tris(2-methoxyphenyl)ethylphosphonium tetraphenylborate, (4-methylphenyl)triphenylphosphonium thiocyanate, tetraphenylphosphonium thiocyanate, and butyltriphenylphosphonium thiocyanate; aromatic phosphine-borane complexes such as triphenylphosphine-triphenylborane; aromatic phosphine-quinone adducts such as triphenylphosphine-p-benzoquinone adduct; aliphatic phosphines such as tributylphosphine, tri-tert-butylphosphine, trioctylphosphine, di-tert-butyl(2-butenyl)phosphine, di-tert-butyl(3-methyl-2-butenyl)phosphine, and tricyclohexylphosphine;Dibutylphenylphosphine, di-tert-butylphenylphosphine, methyldiphenylphosphine, ethyldiphenylphosphine, butyldiphenylphosphine, diphenylcyclohexylphosphine, triphenylphosphine, tri-o-tolylphosphine, tri-m-tolylphosphine, tri-p-tolylphosphine, tris(4-ethylphenyl)phosphine, tris(4-propylphenyl)phosphine, tris(4-isopropylphenyl)phosphine, tris(4-butylphenyl)phosphine, tris(4-tert-butylphenyl)phosphine, tris(2,4-dimethylphenyl)phosphine, tris(2,5-dimethylphenyl)phosphine, tris(2,6-dimethylphenyl)phosphine Examples of aromatic phosphines include tris(3,5-dimethylphenyl)phosphine, tris(2,4,6-trimethylphenyl)phosphine, tris(2,6-dimethyl-4-ethoxyphenyl)phosphine, tris(2-methoxyphenyl)phosphine, tris(4-methoxyphenyl)phosphine, tris(4-ethoxyphenyl)phosphine, tris(4-tert-butoxyphenyl)phosphine, diphenyl-2-pyridylphosphine, 1,2-bis(diphenylphosphino)ethane, 1,3-bis(diphenylphosphino)propane, 1,4-bis(diphenylphosphino)butane, 1,2-bis(diphenylphosphino)acetylene, and 2,2'-bis(diphenylphosphino)diphenyl ether. These may be used alone or in combination of two or more.

[0182] Examples of the urea-based curing accelerator include 1,1-dimethylurea; aliphatic dimethylureas such as 1,1,3-trimethylurea, 3-ethyl-1,1-dimethylurea, 3-cyclohexyl-1,1-dimethylurea, and 3-cyclooctyl-1,1-dimethylurea; 3-phenyl-1,1-dimethylurea, 3-(4-chlorophenyl)-1,1-dimethylurea, 3-(3,4-dichlorophenyl)-1,1-dimethylurea, 3-(3-chloro-4-methylphenyl)-1,1-dimethylurea, 3-(2-methylphenyl)-1,1-dimethylurea, 3-(4-methylphenyl)-1,1-dimethylurea, and 3-(3,4-dimethylphenyl)-1,1-dimethylurea. and aromatic dimethylureas such as toluenebis(dimethylurea), 3-(4-isopropylphenyl)-1,1-dimethylurea, 3-(4-methoxyphenyl)-1,1-dimethylurea, 3-(4-nitrophenyl)-1,1-dimethylurea, 3-[4-(4-methoxyphenoxy)phenyl]-1,1-dimethylurea, 3-[4-(4-chlorophenoxy)phenyl]-1,1-dimethylurea, 3-[3-(trifluoromethyl)phenyl]-1,1-dimethylurea, N,N-(1,4-phenylene)bis(N',N'-dimethylurea), and N,N-(4-methyl-1,3-phenylene)bis(N',N'-dimethylurea) [toluenebisdimethylurea]. These may be used alone or in combination of two or more.

[0183] Examples of guanidine curing accelerators include dicyandiamide, 1-methylguanidine, 1-ethylguanidine, 1-cyclohexylguanidine, 1-phenylguanidine, 1-(o-tolyl)guanidine, dimethylguanidine, diphenylguanidine, trimethylguanidine, tetramethylguanidine, pentamethylguanidine, 1,5,7-triazabicyclo[4.4.0]dec-5-ene, 7-methyl-1,5,7-triazabicyclo[4.4.0]dec-5-ene, 1-methylbiguanide, 1-ethylbiguanide, 1-n-butylbiguanide, 1-n-octadecylbiguanide, 1,1-dimethylbiguanide, 1,1-diethylbiguanide, 1-cyclohexylbiguanide, 1-allylbiguanide, 1-phenylbiguanide, and 1-(o-tolyl)biguanide. These may be used alone or in combination of two or more.

[0184] Examples of imidazole-based curing accelerators include 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 1,2-dimethylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-methylimidazole, 1-benzyl-2-phenylimidazole, and 1-cyanoethyl-2-methylimidazole. , 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-undecylimidazolium trimellitate, 1-cyanoethyl-2-phenylimidazolium trimellitate, 2,4-diamino-6-[2'-methylimidazolyl-(1')]-ethyl-s-triazine, 2,4-diamino-6 -[2'-Undecylimidazolyl-(1')]-ethyl-s-triazine, 2,4-diamino-6-[2'-ethyl-4'-methylimidazolyl-(1')]-ethyl-s-triazine, 2,4-diamino-6-[2'-methylimidazolyl-(1')]-ethyl-s-triazine isocyanuric acid adduct, 2-phenylimidazole isocyanuric acid adduct, 2-phenyl-4,5-dihydroxymethylimidazole imidazole compounds such as 2-phenyl-4-methyl-5-hydroxymethylimidazole, 2,3-dihydro-1H-pyrrolo[1,2-a]benzimidazole, 1-dodecyl-2-methyl-3-benzylimidazolium chloride, 2-methylimidazoline, and 2-phenylimidazoline, as well as adducts of imidazole compounds with epoxy resins, with 1-benzyl-2-phenylimidazole being preferred.

[0185] Commercially available imidazole curing accelerators include, for example, "1B2PZ," "2E4MZ," "2MZA-PW," "2MZ-OK," "2MA-OK," "2MA-OK-PW," "2P4MZ," "2PHZ," "2PHZ-PW," "Cl1Z," "Cl1Z-CN," "Cl1Z-CNS," and "C11Z-A" manufactured by Shikoku Chemical Industry Co., Ltd.; and "P200-H50" manufactured by Mitsubishi Chemical Corporation. These may be used alone or in combination of two or more.

[0186] Examples of metal-based curing accelerators include organometallic complexes or organometallic salts of metals such as cobalt, copper, zinc, iron, nickel, manganese, and tin. Specific examples of organometallic complexes include organic cobalt complexes such as cobalt(II) acetylacetonate and cobalt(III) acetylacetonate, organic copper complexes such as copper(II) acetylacetonate, organic zinc complexes such as zinc(II) acetylacetonate, organic iron complexes such as iron(III) acetylacetonate, organic nickel complexes such as nickel(II) acetylacetonate, and organic manganese complexes such as manganese(II) acetylacetonate. Examples of organometallic salts include zinc octoate, tin octoate, zinc naphthenate, cobalt naphthenate, tin stearate, and zinc stearate. These may be used alone or in combination of two or more.

[0187] When the resin composition of the first embodiment contains component (F), the content of component (F) is, from the viewpoint of significantly achieving the effects of the present invention, preferably 0.001% by mass or more or 0.002% by mass or more, more preferably 0.005% by mass or more or 0.008% by mass or more, even more preferably 0.01% by mass or more, 0.02% by mass or more or 0.05% by mass or more, particularly preferably 0.06% by mass or more, 0.08% by mass or more or 0.09% by mass or more, based on 100% by mass of the nonvolatile components in the resin composition. The upper limit is preferably 10% by mass or less or 8% by mass or less, more preferably 5% by mass or less, 2% by mass or less or 1% by mass or less, even more preferably 0.8% by mass or less, 0.5% by mass or less or 0.4% by mass or less, particularly preferably 0.3% by mass or less, 0.2% by mass or less or 0.15% by mass or less.

[0188] When the resin composition of the first embodiment contains component (F), the content of component (F) is, from the viewpoint of significantly achieving the effects of the present invention, preferably 0.002, 0.005, or 0.008% by mass or more, more preferably 0.01, 0.02, or 0.05% by mass or more, even more preferably 0.08, 0.1, or 0.12% by mass or more, particularly preferably 0.15, 0.2, or 0.22% by mass or more, when the resin components in the resin composition are taken as 100% by mass. The upper limit is preferably 20, 10, or 8% by mass or less, more preferably 5, 2, or 1% by mass or less, even more preferably 0.8, 0.6, or 0.5% by mass or less, particularly preferably 0.4, 0.3, or 0.25% by mass or less.

[0189] When the resin composition of the first embodiment contains the (F) component, the mass ratio of the (F) component to the (A1) component [(F) component / (A1) component] is preferably 0.001 or more, more preferably 0.002 or more or 0.005 or more, even more preferably 0.008 or more or 0.01 or more, and particularly preferably 0.015 or more or 0.02 or more, from the viewpoints of significantly achieving the effects of the present invention, reducing the linear expansion coefficient of the cured product, and increasing the glass transition temperature of the cured product. In one embodiment, the mass ratio may be 0.03 or more, 0.05 or more, 0.08 or more, or 0.09 or more. The upper limit is preferably 5 or less, more preferably 2 or less or 1 or less, even more preferably 0.8 or less or 0.6 or less, and particularly preferably 0.5 or less or 0.45 or less. In one embodiment, the mass ratio may be 0.4 or less, 0.3 or less, 0.2 or less, or 0.15 or less.

[0190] When the resin composition of the first embodiment contains the component (A2) and the component (F), the mass ratio of the component (F) to the component (A2) [component (F) / component (A2)] is preferably 1×10 -5 or more or 5 x 10 -5 or more, more preferably 1×10 -4 or more or 2 x 10 -4More preferably, 5 × 10 -4 or more or 8 x 10 -4 More preferably, 1×10 -3 That's it, 2 x 10 -3 or more or 3 x 10 -3 The upper limit is preferably 1 or less or 5 × 10 or less, more preferably 1 × 10 or less or 8 × 10 or less, even more preferably 5 × 10 or less or 2 × 10 or less, and particularly preferably 1 × 10 or less, 8 × 10 or less, or 7 × 10 or less. -3 Below, 5 x 10 -3 Below, 4 x 10 -3 It could be as follows:

[0191] When the resin composition of the first embodiment contains the component (F), the mass ratio of the component (F) to the component (A) [component (F) / component (A)] is preferably 1×10 -5 or more or 5 x 10 -5 or more, more preferably 1×10 -4 or more or 2 x 10 -4 More preferably, 5 × 10 -4 or more or 8 x 10 -4 More preferably, 1×10 -3 That's it, 2 x 10 -3 or more or 3 x 10 -3 The upper limit is preferably 1 or less or 5 × 10 -1 Less than or equal to 1×10 -1 or less or 8 x 10 -2 Less than 5 × 10, more preferably -2 Below, 2 x 10 -2 or less or 1×10 -2 Below, particularly preferably 8 × 10 -3 Below, 5 x 10 -3 or less or 4 x 10 -3 The following is the result.

[0192] When the resin composition of the first embodiment contains the component (F), the mass ratio of the component (F) to the component (B) [component (F) / component (B)] is preferably 1×10 -5or more or 5 x 10 -5 or more, more preferably 1×10 -4 That's it, 2 x 10 -4 or more or 5 x 10 -4 More preferably, 8 × 10 -4 That's it, 1×10 -3 or more or 2 x 10 -3 More preferably, 3×10 -3 That's it, 5 x 10 -3 or more or 7 x 10 -3 Preferably, it is 1 or less or 8 × 10 -1 Less than or equal to 5 × 10 -1 or less or 2 x 10 -1 or less, more preferably 1 × 10 -1 or less or 8 x 10 -2 Below 5 × 10, particularly preferably -2 Below, 2 x 10 -2 or less or 1.5 x 10 -2 In one embodiment, the value is 1×10 -2 Below, 9 x 10 -3 Below, 8 x 10 -3 It could be as follows:

[0193] When the resin composition of the first embodiment contains the component (F), the mass ratio of the component (F) to the component (C) [component (F) / component (C)] is preferably 1×10 -5 or more or 2 x 10 -5 More preferably, 5 × 10 -4 or more or 8 x 10 -5 More preferably, 1 × 10 -4 or more or 2 x 10 -4 More preferably, 5 × 10 -4 or more or 8 x 10 -4 In one embodiment, 9×10 -4 That's it, 1×10 -3 That's it, 1.2 x 10 -3 That's it, 1.5 x 10 -3 The upper limit is preferably 1 or less, 5×10 or less, from the viewpoint of further reducing the dielectric loss tangent of the cured product at room temperature (23° C.) and at a high temperature (100° C.) and from the viewpoint of reducing the linear expansion coefficient of the cured product.-1 or less or 1×10 -1 Less than or equal to 8 × 10 -2 Below, 5 x 10 -2 or less or 2 x 10 -2 or less, more preferably 1 × 10 -2 Below, 8 x 10 -3 or less or 5 x 10 -3 Below 3 × 10, particularly preferably -3 Below, 2 x 10 -3 or less than 1.8 x 10 -3 The following is the result.

[0194] When the resin composition of the first embodiment contains the (F) component, the mass ratio of the (1D) component to the (F) component [(1D) component / (F) component] is, from the viewpoint of significantly achieving the effects of the present invention, preferably 0.001 or more or 0.005 or more, more preferably 0.01 or more or 0.02 or more, even more preferably 0.05 or more or 0.08 or more, and particularly preferably 0.1 or more or 0.15 or more. In one embodiment, the mass ratio may be 0.2 or more, 0.3 or more, 0.35 or more, etc. The upper limit is preferably 50 or less or 20 or less, more preferably 10 or less or 8 or less, even more preferably 5 or less, 2 or less, or 1 or less, and particularly preferably 0.8 or less, 0.7 or less, 0.6 or less, 0.5 or less, or 0.4 or less.

[0195] When the resin composition of the first embodiment contains the (E) component and the (F) component, the mass ratio of the (F) component to the (E) component [(F) component / (E) component] is, from the viewpoint of significantly obtaining the effects of the present invention, preferably 0.0001 or more or 0.0005 or more, more preferably 0.001 or more, 0.002 or more or 0.005 or more, even more preferably 0.008 or more, 0.01 or more or 0.02 or more, particularly preferably 0.03 or more, 0.04 or more or 0.05 or more. The upper limit is preferably 5 or less or 2 or less, more preferably 1 or less or 0.8 or less, even more preferably 0.5 or less, 0.2 or less or 0.1 or less, and particularly preferably 0.09 or less, 0.08 or less or 0.07 or less.

[0196] <(G)Organic filler> The resin composition of the first embodiment of the present invention may contain (G) an organic filler as an optional component. The (G) organic filler may be used alone or in combination of two or more. Furthermore, the resin composition of the first embodiment preferably contains at least one of the (G) organic filler and the (H) thermoplastic resin described below.

[0197] The (G) organic filler is present in the resin composition in the form of particles. Examples of the (G) organic filler include rubber particles, polyamide fine particles, silicone particles, and core-shell particles. In the present invention, from the viewpoint of significantly achieving the desired effects of the present invention, the (G) organic filler preferably contains either rubber particles or core-shell particles, more preferably rubber particles, and even more preferably core-shell rubber particles.

[0198] Examples of the rubber component contained in the rubber particles include olefin-based thermoplastic elastomers such as polybutadiene, polyisoprene, polychlorobutadiene, ethylene-vinyl acetate copolymer, styrene-butadiene copolymer, styrene-isoprene copolymer, styrene-isobutylene copolymer, acrylonitrile-butadiene copolymer, isoprene-isobutylene copolymer, isobutylene-butadiene copolymer, ethylene-propylene-diene terpolymer, and ethylene-propylene-butene terpolymer; and acrylic thermoplastic elastomers such as polypropyl(meth)acrylate, polybutyl(meth)acrylate, polycyclohexyl(meth)acrylate, and polyoctyl(meth)acrylate; with acrylic thermoplastic elastomers being preferred. Rubber particles containing an acrylic thermoplastic elastomer as the rubber component are referred to as "acrylic rubber particles." Core-shell particles containing an acrylic thermoplastic elastomer as the rubber component are referred to as "acrylic core-shell particles." Core-shell rubber particles containing an acrylic thermoplastic elastomer as the rubber component are referred to as "acrylic core-shell rubber particles." That is, the (G) organic filler preferably contains either acrylic rubber particles or acrylic core-shell particles, more preferably acrylic rubber particles, and even more preferably acrylic core-shell rubber particles. Furthermore, the rubber component may be mixed with a silicone rubber such as polyorganosiloxane rubber. The rubber component contained in the rubber particles preferably has a glass transition temperature of 0°C or lower, more preferably -10°C or lower, even more preferably -20°C or lower, and particularly preferably -30°C or lower.

[0199] Commercially available rubber particles may be used, such as "EXL2655" manufactured by Dow Chemical Japan, and "Staphyloid AC3401N" and "Staphyloid AC3816N" manufactured by Aica Kogyo Co., Ltd. "Staphyloid AC3816N" also falls under the category of core-shell type rubber particles.

[0200] Core-shell particles are particulate organic fillers consisting of a core particle containing a rubber component as described above and one or more shell layers covering the core particle. Furthermore, the core-shell particles are preferably core-shell graft copolymer particles consisting of a core particle containing a rubber component as described above and a shell formed by graft copolymerization of a monomer component copolymerizable with the rubber component contained in the core particle. The term "core-shell" as used here does not necessarily refer only to particles in which the core particle and the shell are clearly distinguishable, but also includes particles in which the boundary between the core particle and the shell is unclear, and the core particle does not necessarily have to be completely covered by the shell.

[0201] The rubber component is preferably contained in the core-shell graft copolymer particles in an amount of 40% by mass or more, more preferably 50% by mass or more, and even more preferably 60% by mass or more. The upper limit of the rubber component content in the core-shell graft copolymer particles is not particularly limited, but from the viewpoint of sufficiently covering the core particles with the shell portion, it is preferably, for example, 95% by mass or less, and more preferably 90% by mass.

[0202] Examples of monomer components that form the shell portion of the core-shell graft copolymer particles include (meth)acrylic acid esters such as methyl (meth)acrylate, ethyl (meth)acrylate, butyl (meth)acrylate, cyclohexyl (meth)acrylate, octyl (meth)acrylate, and glycidyl (meth)acrylate; (meth)acrylic acid; N-substituted maleimides such as N-methylmaleimide and N-phenylmaleimide; maleimide; α,β-unsaturated carboxylic acids such as maleic acid and itaconic acid; aromatic vinyl compounds such as styrene, 4-vinyltoluene, and α-methylstyrene; and (meth)acrylonitrile, among which (meth)acrylic acid esters are preferred, and methyl (meth)acrylate is more preferred.

[0203] Commercially available core-shell graft copolymer particles include, for example, "CHT" manufactured by Samsung SDI; "B602" manufactured by Techno UMG; "Paraloid EXL2602," "Paraloid EXL2603," "Paraloid EXL2655," "Paraloid EXL2311," "Paraloid EXL2313," "Paraloid EXL2315," "Paraloid KM330," "Paraloid KM336P," and "Paraloid KCZ201" manufactured by Dow Chemical Japan; "Metablen C-223A," "Metablen E-901," "Metablen S-2001," "Metablen W-450A," and "Metablen SRK-200" manufactured by Mitsubishi Chemical Corporation; and "Kane Ace M-511," "Kane Ace M-600," "Kane Ace M-400," "Kane Ace M-580," and "Kane Ace MR-01" manufactured by Kaneka Corporation. These may be used alone or in combination of two or more.

[0204] The average particle size (average primary particle size) of the core-shell graft copolymer particles is not particularly limited, but is preferably 20 nm or more, more preferably 50 nm or more, even more preferably 80 nm or more, and particularly preferably 100 nm or more. The upper limit is preferably 5,000 nm or less, more preferably 2,000 nm or less, even more preferably 1,000 nm or less, and particularly preferably 500 nm or less. The average particle size (average primary particle size) of the core-shell graft copolymer particles can be measured using a zeta potential particle size distribution analyzer or the like.

[0205] When the resin composition of the first embodiment contains component (G), the content of component (G) is, from the viewpoint of significantly achieving the effects of the present invention, preferably 0.001% by mass or more or 0.005% by mass or more, more preferably 0.01% by mass or more or 0.02% by mass or more, even more preferably 0.05% by mass or more, 0.08% by mass or more or 0.1% by mass or more, particularly preferably 0.2% by mass or more, 0.5% by mass or more or 0.7% by mass or more, based on 100% by mass of the nonvolatile components in the resin composition. The upper limit is preferably 20% by mass or less or 15% by mass or less, more preferably 10% by mass or less, 8% by mass or less or 6% by mass or less, even more preferably 5% by mass or less, 4% by mass or less or 3% by mass or less, and particularly preferably 2% by mass or less, 1.5% by mass or less or 1% by mass or less.

[0206] When the resin composition of the first embodiment contains component (G), the content of component (G) is, from the viewpoint of significantly achieving the effects of the present invention, preferably 0.01 mass% or more, 0.02 mass% or more, or 0.05 mass% or more, more preferably 0.08 mass% or more, 0.1 mass% or more, or 0.2 mass% or more, even more preferably 0.5 mass% or more, 0.8 mass% or more, or 1 mass% or more, particularly preferably 1.5 mass% or more, 2 mass% or more, or 2.5 mass% or more, when the resin components in the resin composition are taken as 100 mass%. The upper limit is preferably 30 mass% or less or 25 mass% or less, more preferably 20 mass% or less or 15 mass% or less, even more preferably 10 mass% or less, 8 mass% or less, or 6 mass% or less, particularly preferably 5 mass% or less, 4 mass% or less, or 3 mass% or less.

[0207] When the resin composition of the first embodiment contains component (G), the mass ratio of component (G) to component (A1) [component (G) / component (A1)] is preferably 0.01 or more or 0.02 or more, more preferably 0.05 or more or 0.08 or more, even more preferably 0.1 or more or 0.2 or more, and particularly preferably 0.5 or more, 0.8 or more or 0.9 or more, from the viewpoints of significantly obtaining the effects of the present invention, reducing the linear expansion coefficient of the cured product, and increasing the glass transition temperature of the cured product. The upper limit is preferably 100 or less or 80 or less, more preferably 50 or less or 20 or less, even more preferably 10 or less, 8 or less or 5 or less, and particularly preferably 2 or less, 1.5 or less or 1.2 or less.

[0208] When the resin composition of the first embodiment contains the (A2) component and the (G) component, the mass ratio of the (G) component to the (A2) component [(G) component / (A2) component] is, from the viewpoint of significantly achieving the effects of the present invention, preferably 0.0001 or more or 0.0005 or more, more preferably 0.001 or more or 0.002 or more, even more preferably 0.005 or more, 0.008 or more or 0.01 or more, particularly preferably 0.02 or more, 0.03 or more or 0.04 or more. The upper limit is preferably 5 or less or 2 or less, more preferably 1 or less or 0.8 or less, even more preferably 0.5 or less, 0.2 or less or 0.1 or less, particularly preferably 0.08 or less, 0.06 or less or 0.05 or less.

[0209] When the resin composition of the first embodiment contains the (G) component, the mass ratio of the (G) component to the (A) component [(G) component / (A) component] is, from the viewpoint of significantly achieving the effects of the present invention, preferably 0.0001 or more or 0.0005 or more, more preferably 0.001 or more or 0.002 or more, even more preferably 0.005 or more, 0.008 or more or 0.01 or more, particularly preferably 0.02 or more, 0.03 or more or 0.04 or more. The upper limit is preferably 5 or less or 2 or less, more preferably 1 or less or 0.8 or less, even more preferably 0.5 or less, 0.2 or less or 0.1 or less, particularly preferably 0.08 or less, 0.06 or less or 0.05 or less.

[0210] When the resin composition of the first embodiment contains the (G) component, the mass ratio of the (G) component to the (B) component [(G) component / (B) component] is, from the viewpoint of significantly achieving the effects of the present invention, preferably 0.001 or more or 0.002 or more, more preferably 0.005 or more or 0.008 or more, even more preferably 0.01 or more, 0.02 or more or 0.04 or more, and particularly preferably 0.05 or more, 0.07 or more or 0.08 or more. The upper limit is preferably 10 or less or 8 or less, more preferably 5 or less or 2 or less, even more preferably 1 or less, 0.8 or less or 0.5 or less, and particularly preferably 0.3 or less, 0.2 or less or 0.1 or less.

[0211] When the resin composition of the first embodiment contains the (G) component, the mass ratio of the (G) component to the (C) component [(G) component / (C) component] is preferably 0.0001 or more or 0.0002 or more, more preferably 0.0005 or more or 0.0008 or more, even more preferably 0.001 or more or 0.002 or more, and particularly preferably 0.005 or more, 0.008 or more, or 0.01 or more, from the viewpoint of significantly achieving the effects of the present invention. The upper limit is preferably 1 or less, 0.8 or less, or 0.5 or less, more preferably 0.2 or less, 0.1 or less, or 0.08 or less, even more preferably 0.06 or less, 0.05 or less, or 0.04 or less, and particularly preferably 0.03 or less, 0.02 or less, or 0.015 or less, from the viewpoint of further reducing the dielectric loss tangent of the cured product at room temperature (23°C) and high temperature (100°C) and from the viewpoint of reducing the linear expansion coefficient of the cured product.

[0212] When the resin composition of the first embodiment contains the (G) component, the mass ratio of the (1D) component to the (G) component [(1D) component / (G) component] is, from the viewpoint of significantly achieving the effects of the present invention, preferably 0.0001 or more or 0.0005 or more, more preferably 0.001 or more or 0.002 or more, even more preferably 0.005 or more, 0.008 or more or 0.01 or more, particularly preferably 0.02 or more, 0.03 or more or 0.04 or more. The upper limit is preferably 5 or less or 2 or less, more preferably 1 or less or 0.8 or less, even more preferably 0.5 or less, 0.2 or less or 0.1 or less, particularly preferably 0.08 or less, 0.07 or less or 0.06 or less.

[0213] When the resin composition of the first embodiment contains the (F) component and the (G) component, the mass ratio of the (F) component to the (G) component [(F) component / (G) component] is, from the viewpoint of significantly achieving the effects of the present invention, preferably 0.001 or more or 0.002 or more, more preferably 0.005 or more, 0.008 or more or 0.01 or more, even more preferably 0.02 or more, 0.05 or more or 0.08 or more, and particularly preferably 0.1 or more, 0.15 or more or 0.18 or more. The upper limit is preferably 20 or less or 10 or less, more preferably 8 or less or 5 or less, even more preferably 2 or less, 1 or less or 0.8 or less, and particularly preferably 0.5 or less, 0.4 or less or 0.3 or less.

[0214] <(H)Thermoplastic resin> The resin composition of the first embodiment of the present invention may contain a thermoplastic resin (H) as an optional component. The thermoplastic resin (H) may be used alone or in combination of two or more. The resin composition of the first embodiment preferably contains at least one of the organic filler (G) and the thermoplastic resin (H).

[0215] Examples of thermoplastic resins include phenoxy resins, polyvinyl acetal resins, polyolefin resins, polybutadiene resins, polyimide resins, polyamideimide resins, polyetherimide resins, polysulfone resins, polyethersulfone resins, polyphenylene ether resins, polycarbonate resins, polyetheretherketone resins, and polyester resins. Among these, phenoxy resins are preferred from the viewpoint of achieving significant effects of the present invention. The phenoxy resins described here are components other than those corresponding to epoxy resins. Furthermore, the thermoplastic resins may be used alone or in combination of two or more.

[0216] Examples of phenoxy resins include phenoxy resins having one or more skeletons selected from the group consisting of bisphenol A, bisphenol F, bisphenol S, bisphenolacetophenone, novolac, biphenyl, fluorene, dicyclopentadiene, norbornene, naphthalene, anthracene, adamantane, terpene, and trimethylcyclohexane. The terminal of the phenoxy resin may be any functional group such as a phenolic hydroxyl group or an epoxy group.

[0217] Specific examples of phenoxy resins include "1256" and "4250" manufactured by Mitsubishi Chemical Corporation (both of which are phenoxy resins containing a bisphenol A skeleton); "YX8100" manufactured by Mitsubishi Chemical Corporation (phenoxy resin containing a bisphenol S skeleton); "YX6954" manufactured by Mitsubishi Chemical Corporation (phenoxy resin containing a bisphenol acetophenone skeleton); "FX280" and "FX293" manufactured by Nippon Steel Chemical & Material Co., Ltd.; and "YL6954BH30," "YL7500BH30," "YX6954BH30," "YX7553," "YX7553BH30," "YL7769BH30," "YL6794," "YL7213," "YL7290," "YL7482," and "YL7891BH30" manufactured by Mitsubishi Chemical Corporation.

[0218] Examples of polyvinyl acetal resins include polyvinyl formal resins and polyvinyl butyral resins, with polyvinyl butyral resins being preferred. Specific examples of polyvinyl acetal resins include S-LEC BH series, BX series (e.g., BX-5Z), KS series (e.g., KS-1), BL series, and BM series manufactured by Sekisui Chemical Co., Ltd.

[0219] Examples of polyolefin resins include ethylene copolymer resins such as low-density polyethylene, very low-density polyethylene, high-density polyethylene, ethylene-vinyl acetate copolymer, ethylene-ethyl acrylate copolymer, and ethylene-methyl acrylate copolymer; and polyolefin polymers such as polypropylene and ethylene-propylene block copolymer.

[0220] Specific examples of polyimide resins include "Rikacoat SN20" and "Rikacoat PN20" manufactured by New Japan Chemical Co., Ltd.

[0221] Specific examples of polyamide-imide resins include "Vylomax HR11NN" and "Vylomax HR16NN" manufactured by Toyobo Co., Ltd. Specific examples of polyamide-imide resins also include modified polyamide-imides such as "KS9100" and "KS9300" (polysiloxane skeleton-containing polyamide-imides) manufactured by Resonac Corporation.

[0222] A specific example of the polyethersulfone resin is "PES5003P" manufactured by Sumitomo Chemical Co., Ltd.

[0223] Specific examples of polysulfone resins include polysulfones "P1700" and "P3500" manufactured by Solvay Advanced Polymers.

[0224] Examples of polyester resins include polyethylene terephthalate resin, polyethylene naphthalate resin, polybutylene terephthalate resin, polybutylene naphthalate resin, polytrimethylene terephthalate resin, polytrimethylene naphthalate resin, and polycyclohexane dimethyl terephthalate resin.

[0225] From the viewpoint of significantly obtaining the effects of the present invention, the weight average molecular weight (Mw) of the thermoplastic resin is preferably 8,000 or more, more preferably 10,000 or more, particularly preferably 20,000 or more, and preferably 70,000 or less, more preferably 60,000 or less, particularly preferably 50,000 or less.

[0226] When the resin composition of the first embodiment contains component (H), the content of component (H) is, from the viewpoint of significantly achieving the effects of the present invention, preferably 0.005% by mass, 0.01% by mass or more, or 0.02% by mass or more, more preferably 0.05% by mass or more or 0.08% by mass or more, even more preferably 0.1% by mass or more or 0.2% by mass or more, particularly preferably 0.5% by mass or more, 0.8% by mass or more, or 1% by mass or more, when the total amount of non-volatile components in the resin composition is taken as 100% by mass. The upper limit is preferably 20% by mass or less or 15% by mass or less, more preferably 10% by mass or less, 8% by mass or less, or 6% by mass or less, even more preferably 5% by mass or less, 4% by mass or less, or 3% by mass or less, and particularly preferably 2% by mass or less, 1.5% by mass or less, or 1.2% by mass or less.

[0227] When the resin composition of the first embodiment contains component (H), the content of component (H) is, from the viewpoint of significantly achieving the effects of the present invention, preferably 0.01 mass% or more, 0.02 mass% or more, or 0.05 mass% or more, more preferably 0.08 mass% or more, 0.1 mass% or more, or 0.2 mass% or more, even more preferably 0.5 mass% or more, 0.8 mass% or more, or 1 mass% or more, particularly preferably 1.5 mass% or more, 2 mass% or more, or 2.5 mass% or more, when the resin components in the resin composition are taken as 100 mass%. The upper limit is preferably 30 mass% or less or 25 mass% or less, more preferably 20 mass% or less or 15 mass% or less, even more preferably 10 mass% or less, 8 mass% or less, or 6 mass% or less, particularly preferably 5 mass% or less, 4 mass% or less, or 3 mass% or less.

[0228] When the resin composition of the first embodiment contains component (H), the mass ratio of component (H) to component (A1) [component (H) / component (A1)] is preferably 0.001 or more or 0.005 or more, more preferably 0.01 or more or 0.02 or more, even more preferably 0.05 or more or 0.08 or more, and particularly preferably 0.1 or more, 0.15 or more or 0.2 or more, from the viewpoints of significantly achieving the effects of the present invention, reducing the linear expansion coefficient of the cured product, and increasing the glass transition temperature of the cured product. In one embodiment, the mass ratio may be 0.3 or more, 0.4 or more, 0.5 or more, 0.6 or more, 0.7 or more, 0.8 or more, 0.9 or more, 1 or more, 1.1 or more, etc. The upper limit is preferably 100 or less, 80 or less, or 50 or less, more preferably 20 or less, 10 or less, or 8 or less, even more preferably 5 or less, 4 or less, or 3 or less, and particularly preferably 2 or less, 1.5 or less, or 1.3 or less.

[0229] When the resin composition of the first embodiment contains the (A2) component and the (H) component, the mass ratio of the (H) component to the (A2) component [(H) component / (A2) component] is, from the viewpoint of significantly achieving the effects of the present invention, preferably 0.0001 or more or 0.0005 or more, more preferably 0.001 or more or 0.002 or more, even more preferably 0.005 or more, 0.008 or more or 0.01 or more, and particularly preferably 0.02 or more, 0.03 or more or 0.04 or more. The upper limit is preferably 5 or less or 2 or less, more preferably 1 or less or 0.8 or less, even more preferably 0.5 or less, 0.2 or less or 0.1 or less, and particularly preferably 0.08 or less, 0.06 or less or 0.055 or less. In one embodiment, the mass ratio may be 0.05 or less, 0.045 or less, etc.

[0230] When the resin composition of the first embodiment contains component (H), the mass ratio of component (H) to component (A) [component (H) / component (A)] is, from the viewpoint of significantly achieving the effects of the present invention, preferably 0.0001 or more or 0.0005 or more, more preferably 0.001 or more or 0.002 or more, even more preferably 0.005 or more, 0.008 or more or 0.01 or more, particularly preferably 0.02 or more, 0.03 or more or 0.04 or more. The upper limit is preferably 5 or less or 2 or less, more preferably 1 or less or 0.8 or less, even more preferably 0.5 or less, 0.2 or less or 0.1 or less, particularly preferably 0.08 or less, 0.06 or less or 0.05 or less.

[0231] When the resin composition of the first embodiment contains component (H), the mass ratio of component (H) to component (B) [component (H) / component (B)] is, from the viewpoint of significantly achieving the effects of the present invention, preferably 0.001 or more or 0.002 or more, more preferably 0.005 or more or 0.008 or more, even more preferably 0.01 or more, 0.02 or more or 0.04 or more, particularly preferably 0.05 or more, 0.07 or more, 0.08 or more or 0.09 or more. The upper limit is preferably 10 or less or 8 or less, more preferably 5 or less or 2 or less, even more preferably 1 or less, 0.8 or less or 0.5 or less, particularly preferably 0.3 or less, 0.2 or less or 0.15 or less. In one embodiment, it may be 0.1 or less, etc.

[0232] When the resin composition of the first embodiment contains component (H), the mass ratio of component (H) to component (C) [component (H) / component (C)] is, from the viewpoint of significantly achieving the effects of the present invention, preferably 0.0001 or more or 0.0002 or more, more preferably 0.0005 or more or 0.0008 or more, even more preferably 0.001 or more or 0.002 or more, particularly preferably 0.005 or more, 0.008 or more, or 0.01 or more. In one embodiment, it may be 0.012 or more, 0.015 or more, 0.018 or more, etc. The upper limit is preferably 1 or less, 0.8 or less, or 0.5 or less, more preferably 0.2 or less, 0.1 or less, or 0.08 or less, even more preferably 0.06 or less, 0.05 or less, or 0.04 or less, and particularly preferably 0.03 or less, or 0.02 or less, from the viewpoint of further reducing the dielectric tangent of the cured product at room temperature (23°C) and high temperature (100°C) and from the viewpoint of reducing the linear expansion coefficient of the cured product.

[0233] When the resin composition of the first embodiment contains the component (H), the mass ratio of the component (1D) to the component (H) [component (1D) / component (H)] is, from the viewpoint of significantly achieving the effects of the present invention, preferably 0.0001 or more or 0.0005 or more, more preferably 0.001 or more or 0.002 or more, even more preferably 0.005 or more, 0.008 or more or 0.01 or more, particularly preferably 0.02 or more, 0.025 or more or 0.03 or more. The upper limit is preferably 5 or less or 2 or less, more preferably 1 or less or 0.8 or less, even more preferably 0.5 or less, 0.2 or less or 0.1 or less, particularly preferably 0.08 or less, 0.06 or less, 0.05 or less or 0.04 or less.

[0234] When the resin composition of the first embodiment contains the (E) component and the (H) component, the mass ratio of the (H) component to the (E) component [(H) component / (E) component] is, from the viewpoint of significantly obtaining the effects of the present invention, preferably 0.001 or more or 0.005 or more, more preferably 0.01 or more, 0.02 or more or 0.05 or more, even more preferably 0.08 or more, 0.1 or more or 0.2 or more, and particularly preferably 0.4 or more, 0.5 or more or 0.6 or more. The upper limit is preferably 50 or less or 30 or less, more preferably 20 or less, 10 or less or 8 or less, even more preferably 5 or less, 3 or less or 2 or less, and particularly preferably 1 or less, 0.9 or less or 0.8 or less.

[0235] When the resin composition of the first embodiment contains the (F) component and the (H) component, the mass ratio of the (F) component to the (H) component [(F) component / (H) component] is, from the viewpoint of significantly achieving the effects of the present invention, preferably 0.0001 or more, 0.0005 or more, or 0.001 or more, more preferably 0.002 or more, 0.005 or more, or 0.008 or more, even more preferably 0.01 or more, 0.02 or more, or 0.03 or more, particularly preferably 0.05 or more, 0.06 or more, or 0.08 or more. The upper limit is preferably 10 or less, or 8 or less, more preferably 5 or less, or 2 or less, even more preferably 1 or less, 0.8 or less, or 0.5 or less, and particularly preferably 0.2 or less, 0.1 or less, or 0.09 or less.

[0236] <(I) Organic solvent> The resin composition of the first embodiment of the present invention may contain (I) an organic solvent as an optional component, and preferably contains (I) an organic solvent. By adding (I) an organic solvent to the resin composition, a resin composition varnish with an appropriate viscosity can be obtained. (I) The organic solvent may be used alone or in combination of two or more.

[0237] Examples of (I) organic solvents include organic solvents composed of atoms selected from carbon atoms, oxygen atoms, nitrogen atoms, phosphorus atoms, sulfur atoms, halogen atoms, and hydrogen atoms. From the viewpoint of safety, (I) organic solvents are preferably organic solvents composed of atoms selected from carbon atoms, oxygen atoms, and hydrogen atoms, and more preferably organic solvents composed of carbon atoms, oxygen atoms, and hydrogen atoms.

[0238] Examples of (I) organic solvents include glycol-based organic solvents, glycol ether-based organic solvents, glycol ether ester-based organic solvents, ketone-based organic solvents, ester-based organic solvents, ether-based organic solvents, alcohol-based organic solvents, aliphatic hydrocarbon-based organic solvents, aromatic organic solvents, nitrogen-based organic solvents, sulfur-based organic solvents, and halogen-based organic solvents. Examples of nitrogen-based organic solvents include amide-based organic solvents, urea-based organic solvents, and nitrile-based organic solvents. From the viewpoint of safety, (I) organic solvents are preferably ester-based organic solvents, ketone-based organic solvents, glycol-based organic solvents, glycol ether-based organic solvents, glycol ether ester-based organic solvents, alcohol-based organic solvents, or aromatic organic solvents, more preferably ester-based organic solvents, glycol ether-based organic solvents, ketone-based organic solvents, alcohol-based organic solvents, or aromatic organic solvents, still more preferably glycol ether-based organic solvents, ketone-based organic solvents, alcohol-based organic solvents, or aromatic organic solvents, and particularly preferably ketone-based organic solvents.

[0239] Examples of glycol-based organic solvents include ethylene glycol, diethylene glycol, propylene glycol, dipropylene glycol, and trimethylene glycol.

[0240] Examples of glycol ether organic solvents include cellosolves such as ethylene glycol monomethyl ether (also known as methyl cellosolve), ethylene glycol monoethyl ether (also known as cellosolve), ethylene glycol monopropyl ether (also known as propyl cellosolve), ethylene glycol monobutyl ether (also known as butyl cellosolve), ethylene glycol monoisobutyl ether (also known as isobutyl cellosolve), ethylene glycol mono-tert-butyl ether (also known as tert-butyl cellosolve), and ethylene glycol monohexyl ether; diethylene glycol monomethyl ether (also known as methyl carbitol), diethylene glycol monoethyl ether (also known as carbitol), and diethylene glycol monopropyl ether. carbitols such as diethylene glycol monobutyl ether (DB) (also known as butyl carbitol); propylene glycol ethers such as propylene glycol monomethyl ether (PGM, also known as 1-methoxy-2-propanol), propylene glycol monoethyl ether, propylene glycol monopropyl ether, and propylene glycol monobutyl ether; and dipropylene glycol ethers such as dipropylene glycol monomethyl ether, dipropylene glycol monoethyl ether, dipropylene glycol monopropyl ether, and dipropylene glycol monobutyl ether, with propylene glycol ethers being preferred and propylene glycol monomethyl ether being more preferred.

[0241] Examples of glycol ether ester organic solvents include cellosolve esters such as ethylene glycol monomethyl ether acetate (also known as methyl cellosolve acetate), ethylene glycol monoethyl ether acetate (also known as cellosolve acetate), and ethylene glycol monobutyl ether acetate (also known as butyl cellosolve acetate); carbitol esters such as diethylene glycol monoethyl ether acetate (EDGAc) (also known as carbitol acetate) and diethylene glycol monobutyl ether acetate (also known as butyl carbitol acetate); propylene glycol ether esters such as propylene glycol monomethyl ether acetate (PGMEAc) and propylene glycol monoethyl ether acetate; and dipropylene glycol ether esters such as dipropylene glycol monomethyl ether acetate, with carbitol esters being preferred and more preferred than diethylene glycol monoethyl ether acetate.

[0242] Examples of ketone-based organic solvents include aliphatic acyclic ketones such as acetone, methyl ethyl ketone (MEK), diethyl ketone, 2-pentanone, methyl isobutyl ketone, 2-hexanone, 2-heptanone (MAK), and diisobutyl ketone; aliphatic cyclic ketones such as cyclopentanone, cyclohexanone (Anone), and 2-methylcyclohexanone; and aromatic ketones such as acetophenone, with methyl ethyl ketone (MEK) or cyclohexanone being preferred. The lower limit of the number of carbon atoms in the ketone-based organic solvent is preferably 2 or more, more preferably 3 or more, and even more preferably 4 or more. The upper limit of the number of carbon atoms in the ketone-based organic solvent is preferably 10 or less, more preferably 8 or less, and even more preferably 6 or less.

[0243] Ester-based organic solvents are organic solvents having an ester structure that do not fall under the category of glycol ether ester-based organic solvents. Examples include fatty acid alkyl esters such as methyl acetate, ethyl acetate, n-propyl acetate, isopropyl acetate, n-butyl acetate, isobutyl acetate, sec-butyl acetate, tert-butyl acetate, n-pentyl acetate, isopentyl acetate, ethyl propionate, propyl propionate, and isopropyl propionate; hydroxy acid alkyl esters such as methyl lactate, ethyl lactate, and butyl lactate; keto acid alkyl esters such as methyl acetoacetate and ethyl acetoacetate; lactones such as γ-butyrolactone and α-acetyl-γ-butyrolactone; and aromatic esters such as methyl benzoate and ethyl benzoate. Lactones are preferred as ester-based organic solvents. Furthermore, the number of carbon atoms in the ester-based organic solvent is preferably 3 to 9.

[0244] The ether-based organic solvent is an organic solvent having an ether structure that does not fall under the category of glycol ether-based organic solvents or glycol ether ester-based organic solvents, and examples thereof include aliphatic acyclic ethers such as dimethyl ether, diethyl ether, methyl ethyl ether, diisopropyl ether, dibutyl ether, methyl tert-butyl ether, ethylene glycol dimethyl ether, diethylene glycol dimethyl ether, and triethylene glycol dimethyl ether; aliphatic cyclic ethers such as tetrahydrofuran, 1,4-dioxane, and 1,3-dioxolane; and aromatic ethers such as anisole and phenetole. The number of carbon atoms in the ether-based organic solvent is preferably 2 to 9.

[0245] Alcohol-based organic solvents are organic solvents having an alcohol structure that does not fall under the category of glycol-based organic solvents and glycol ether-based organic solvents. Examples of alcohol-based organic solvents include aliphatic acyclic alcohols such as methanol, ethanol, n-propanol, 2-propanol (also known as isopropanol), n-butyl alcohol, isobutyl alcohol, sec-butyl alcohol, tert-butyl alcohol, n-pentyl alcohol, isopentyl alcohol, sec-pentyl alcohol, tert-pentyl alcohol, neopentyl alcohol, n-hexyl alcohol, n-heptyl alcohol, isoheptyl alcohol, n-octyl alcohol, and 2-ethylhexyl alcohol; aliphatic cyclic alcohols such as cyclohexanol; and aromatic alcohols such as benzyl alcohol and phenethyl alcohol. Aliphatic acyclic alcohols are preferred, and 2-propanol is more preferred.

[0246] Examples of aliphatic hydrocarbon organic solvents include n-pentane, n-hexane, 2-methylpentane (also known as isohexane), n-heptane, n-octane, cyclopentane, cyclohexane, methylcyclohexane, ethylcyclohexane, decalin, etc. The aliphatic hydrocarbon organic solvent preferably has 5 to 10 carbon atoms.

[0247] Examples of aromatic organic solvents include C benzene, toluene, o-xylene, m-xylene, p-xylene, and ethylbenzene. 6-8 Aromatic hydrocarbons: C9 aromatic hydrocarbons such as 1,2,3-trimethylbenzene, 1,3,5-trimethylbenzene (also known as mesitylene), 1,2,4-trimethylbenzene, 4-ethyltoluene, 3-ethyltoluene, and 2-ethyltoluene; C1 aromatic hydrocarbons such as 1,2-diethylbenzene, 1,3-diethylbenzene, 1,4-diethylbenzene, 3-ethyl-o-xylene, 4-ethyl-o-xylene, 2-ethyl-p-xylene, 1,2,3,5-tetramethylbenzene, and tetralin. 10 Aromatic hydrocarbons include aromatic heterocyclic compounds such as pyridine, furan, and thiophene, and toluene is preferred. The aromatic organic solvent preferably has 6 to 10 carbon atoms.

[0248] Examples of amide-based organic solvents include aliphatic acyclic amides such as N,N-dimethylacetamide and N,N-dimethylformamide, lactams such as N-methyl-2-pyrrolidone and N-cyclohexyl-2-pyrrolidone, and phosphoric acid amides such as hexamethylphosphoramide. The number of carbon atoms in the amide-based organic solvent is preferably 2 to 10.

[0249] Examples of urea-based organic solvents include tetramethylurea and 1,3-dimethyl-2-imidazolinone.

[0250] Examples of the nitrile organic solvent include acetonitrile, propionitrile, benzonitrile, etc. The nitrile organic solvent preferably has 2 to 10 carbon atoms.

[0251] An example of the sulfur-based organic solvent is dimethyl sulfoxide.

[0252] Examples of halogen-based organic solvents include chloroform, methylene chloride, carbon tetrachloride, 1,2-dichloroethane, etc. The halogen-based organic solvent preferably has 1 to 10 carbon atoms.

[0253] Among these, (I) the organic solvent is preferably γ-butyrolactone, methyl ethyl ketone (MEK), cyclopentanone, cyclohexanone, propylene glycol, diethylene glycol monoethyl ether acetate, propylene glycol monomethyl ether acetate, propylene glycol monomethyl ether, 2-propanol, or toluene, more preferably methyl ethyl ketone (MEK), cyclohexanone, diethylene glycol monoethyl ether acetate, γ-butyrolactone, propylene glycol monomethyl ether, 2-propanol, or toluene, still more preferably methyl ethyl ketone (MEK), cyclohexanone, propylene glycol monomethyl ether, 2-propanol, or toluene, and particularly preferably methyl ethyl ketone (MEK) or cyclohexanone.

[0254] When the resin composition of the first embodiment of the present invention contains an organic solvent (I), the content of component (I) is, when all components in the resin composition are taken as 100% by mass, preferably 1% by mass or more or 3% by mass or more, more preferably 5% by mass or more or 8% by mass or more, even more preferably 10% by mass or more or 12% by mass or more, and particularly preferably 15% by mass or more or 18% by mass or more. The upper limit is preferably 50% by mass or less, more preferably 45% by mass or less or 40% by mass or less, even more preferably 35% by mass or less or 30% by mass or less, and particularly preferably 25% by mass or less or 22% by mass or less.

[0255] <(J) Other additives> The resin composition of the first embodiment of the present invention may further contain (J) other additives as optional components to the extent that the object of the present invention is not impaired. Examples of such additives include radical polymerization initiators such as peroxide radical polymerization initiators and azo radical polymerization initiators; organometallic compounds such as organocopper compounds, organozinc compounds, and organocobalt compounds; colorants such as phthalocyanine blue, phthalocyanine green, iodine green, diazo yellow, crystal violet, titanium oxide, and carbon black; polymerization inhibitors such as hydroquinone, catechol, pyrogallol, and phenothiazine; leveling agents such as silicone leveling agents and acrylic polymer leveling agents; thickeners such as bentone and montmorillonite; antifoaming agents such as silicone antifoaming agents, acrylic antifoaming agents, fluorine-based antifoaming agents, and vinyl resin antifoaming agents; ultraviolet absorbers such as benzotriazole ultraviolet absorbers; adhesion improvers such as urea silanes; triazole adhesion promoters, tetrazolates, and the like. Examples of suitable additives include adhesion promoters such as phenol-based adhesion promoters and triazine-based adhesion promoters; antioxidants such as hindered phenol-based antioxidants; fluorescent brighteners such as stilbene derivatives; surfactants such as fluorine-based surfactants and silicone-based surfactants; flame retardants such as phosphorus-based flame retardants (e.g., phosphate ester compounds, phosphazene compounds, phosphinic acid compounds, and red phosphorus), nitrogen-based flame retardants (e.g., melamine sulfate), halogen-based flame retardants, and inorganic flame retardants (e.g., antimony trioxide); dispersants such as phosphate ester-based dispersants, polyoxyalkylene-based dispersants, acetylene-based dispersants, silicone-based dispersants, anionic dispersants, and cationic dispersants; and stabilizers such as borate-based stabilizers, titanate-based stabilizers, aluminate-based stabilizers, zirconate-based stabilizers, isocyanate-based stabilizers, carboxylic acid-based stabilizers, and carboxylic anhydride-based stabilizers. The content of such additives may be determined depending on the properties required of the resin composition. Furthermore, the components (A) to (I) may have functions such as a radical polymerization initiator, organometallic compound, colorant, polymerization inhibitor, thickener, defoamer, UV absorber, adhesion improver, adhesion promoter, antioxidant, fluorescent brightener, flame retardant, dispersant, stabilizer, etc. In such cases, such components are considered to be part of the components (A) to (I) rather than the component (J).

[0256] [Resin composition of second embodiment] A resin composition according to a second embodiment of the present invention comprises (A) a cyclic ether compound having a four-membered or smaller ring, (B) a curing agent, (C) an inorganic filler, (2D-1) aluminum, and (2D-2) an organic ligand having an oxygen atom as a coordinating atom, wherein the (A) component comprises (A1) a cationically polymerizable cyclic ether compound having a four-membered or smaller ring. By incorporating components (A) to (2D-2) in combination into a resin composition, a cured product exhibiting an excellent dielectric loss tangent can be obtained, even in a high-temperature (100°C) environment. That is, the resin composition contributes to a low dielectric loss tangent of the cured product, particularly a cured product exhibiting a lower dielectric loss tangent even in a high-temperature (100°C) environment. While the reason for this is unclear, it is presumed as follows: (2D-1) aluminum and (2D-2) the organic ligand having an oxygen atom as a coordinating atom are thought to form an aluminum complex in the resin composition. During thermal curing of the resin composition, the (A1) cationic polymerizable cyclic ether compound having a four-membered or smaller ring reacts with the (C) inorganic filler's surface hydroxyl groups using the aluminum complex as a Lewis acid catalyst, forming a crosslinked structure between the inorganic filler and the resin portion. This suppresses the molecular motion of the polymer molecules in the cured product, presumably resulting in an excellent dielectric loss tangent even in a high-temperature (100°C) environment. The present inventors have also confirmed that the resin composition of the second embodiment of the present invention can produce a cured product that exhibits an excellent dielectric loss tangent even at room temperature (23°C), has a low linear expansion coefficient, and a high glass transition temperature. The resin composition of the second embodiment may also contain, as component (A), a four-membered or smaller cyclic ether compound other than component (A1) (hereinafter referred to as "component (A2)"). The resin composition of the second embodiment may further contain optional components in addition to components (A) to (2D-2). Examples of the optional components include (E) a radical curable resin, (F) a curing accelerator, (G) an organic filler, (H) a thermoplastic resin, (I) an organic solvent, (J) other additives, etc. Each component contained in the resin composition of the second embodiment will be described below.

[0257] <(A) Cyclic ether compounds with four or fewer members> The resin composition according to the second embodiment of the present invention contains (A) a cyclic ether compound having a four or smaller ring. The (A) cyclic ether compound having a four or smaller ring according to the second embodiment is the same as the (A) cyclic ether compound having a four or smaller ring according to the first embodiment.

[0258] <(A1) Cationic polymerizable cyclic ether compound with four or less members> In the resin composition according to the second embodiment of the present invention, the component (A) contains (A1) a cationically polymerizable cyclic ether compound having a four-membered or smaller ring. The cationically polymerizable cyclic ether compound (A1) according to the second embodiment is the same as the cationically polymerizable cyclic ether compound (A1) according to the first embodiment.

[0259] <4-membered or smaller cyclic ether compounds other than component (A1)> In the resin composition of the second embodiment of the present invention, the component (A) may contain a cyclic ether compound (component (A2)) other than the component (A1) that has a four-membered ring or less. The component (A2) according to the second embodiment is the same as the component (A2) according to the first embodiment.

[0260] <(B) Hardener> The resin composition according to the second embodiment of the present invention contains a curing agent (B). The curing agent (B) according to the second embodiment is the same as the curing agent (B) according to the first embodiment.

[0261] <(C) Inorganic filler> The resin composition according to the second embodiment of the present invention contains an inorganic filler (C). The inorganic filler (C) according to the second embodiment is the same as the inorganic filler (C) according to the first embodiment.

[0262] <(2D-1) Aluminum> The resin composition of the second embodiment of the present invention contains aluminum (2D-1). In the present invention, the term "aluminum" encompasses elements, compounds, and ions containing an aluminum atom. However, the component (2D-1) excludes those that fall under the category of inorganic filler (C). The component (2D-1) is preferably an aluminum ion, more preferably a trivalent aluminum ion, and even more preferably an aluminum complex. In one embodiment, the component (2D-1) may be ionic aluminum, trivalent aluminum, mononuclear aluminum, or the like. That is, the component (2D-1) preferably contains an aluminum ion, more preferably a trivalent aluminum ion, and even more preferably an aluminum complex. In one embodiment, the component (2D-1) may contain ionic aluminum, trivalent aluminum, mononuclear aluminum, or the like. When the component (2D-1) contains an aluminum complex, the preferred aspects of the aluminum complex for the component (2D-1) are the same as the preferred aspects of the aluminum complex for the component (1D).

[0263] Other specific examples of the component (2D-1) include aluminum glycinate, potassium aluminum sulfate, ammonium aluminum sulfate, aluminum formate, aluminum sulfate, and aluminum phosphate.

[0264] The content of component (2D-1), based on the total amount of nonvolatile components in the resin composition, is preferably 0.1 ppm by mass or more or 0.5 ppm by mass or more, more preferably 1 ppm by mass or more or 2 ppm by mass or more, even more preferably 5 ppm by mass or more or 8 ppm by mass or more, and particularly preferably 10 ppm by mass or more, 11 ppm by mass or more, or 12 ppm by mass or more, from the viewpoint of significantly achieving the effects of the present invention. In one embodiment, the content may be 15 ppm by mass or more, 18 ppm by mass or more, 20 ppm by mass or more, 22 ppm by mass or more, 24 ppm by mass or more, etc. The upper limit is preferably 2000 ppm by mass or less, 1500 ppm by mass or less, or 1000 ppm by mass or less, more preferably 800 ppm by mass or less, 500 ppm by mass or less, or 200 ppm by mass or less, even more preferably 100 ppm by mass or less, 80 ppm by mass or less, or 60 ppm by mass or less, and particularly preferably 50 ppm by mass or less, 40 ppm by mass or less, 35 ppm by mass or less, or 30 ppm by mass or less. When component (2D-1) is an aluminum complex, the above content is the content of aluminum ions and does not include the content of ligands. Similarly, when component (2D-1) is a compound containing aluminum, the above content is the content of aluminum and does not include the content of other elements in the compound.

[0265] The content of component (2D-1), based on the resin components in the resin composition, is preferably 0.2 ppm by mass or more or 0.5 ppm by mass or more, more preferably 1 ppm by mass or more, 2 ppm by mass or more, or 5 ppm by mass or more, even more preferably 8 ppm by mass or more, 10 ppm by mass or more, or 15 ppm by mass or more, and particularly preferably 20 ppm by mass or more, 25 ppm by mass or more, or 30 ppm by mass or more, from the viewpoint of significantly achieving the effects of the present invention. In one embodiment, the content may be 40 ppm by mass or more, 45 ppm by mass or more, 50 ppm by mass or more, 55 ppm by mass or more, 60 ppm by mass or more, etc. The upper limit is preferably 5000 ppm by mass or less, 3000 ppm by mass or less, or 2000 ppm by mass or less, more preferably 1000 ppm by mass or less, 800 ppm by mass or less, or 600 ppm by mass or less, even more preferably 500 ppm by mass or less, 400 ppm by mass or less, or 350 ppm by mass or less, and particularly preferably 300 ppm by mass or less, 250 ppm by mass or less, 200 ppm by mass or less, or 180 ppm by mass or less. In one embodiment, the upper limit may be 160 ppm by mass or less, 140 ppm by mass or less, 120 ppm by mass or less, 100 ppm by mass or less, 90 ppm by mass or less, 80 ppm by mass or less, 70 ppm by mass or less, or the like. When component (2D-1) is an aluminum complex, the above content refers to the content of aluminum ions and does not include the content of ligands. Similarly, when component (2D-1) is a compound containing aluminum, the above content refers to the content of aluminum and does not include the content of other elements in the compound.

[0266] <(2D-2) Organic Ligands Having Oxygen Atoms as Coordinating Atoms> The resin composition according to the second embodiment of the present invention contains (2D-2) an organic ligand having an oxygen atom as a coordinating atom. The (2D-2) component may be used alone or in combination of two or more.

[0267] (2D-2) Examples of organic ligands having an oxygen atom as a coordinating atom include alcohols, alkoxides, phenols, phenoxides, β-diketones, β-diketone enolates, β-ketoesters, β-ketoester enolates, carboxylic acids, carboxylate ions, etc. In one embodiment, component (2D-2) preferably contains one or more organic ligands selected from the group consisting of alcohols, alkoxides, β-diketones, β-diketone enolates, β-ketoesters, and β-ketoester enolates, and more preferably contains one or more organic ligands selected from the group consisting of β-diketones, β-diketone enolates, β-ketoesters, and β-ketoester enolates.

[0268] The alcohol in the component (2D-2) is the same as the alcohol as the ligand in the component (1D).

[0269] The alkoxide of the component (2D-2) is the same as the alkoxide as the ligand of the component (1D).

[0270] The β-diketone of the component (2D-2) is the same as the β-diketone used as the ligand of the component (1D).

[0271] The β-diketone enolate of the component (2D-2) is the same as the β-diketone enolate as the ligand of the component (1D).

[0272] The β-ketoester of the component (2D-2) is the same as the β-ketoester as the ligand of the component (1D).

[0273] The β-ketoester enolate of the component (2D-2) is the same as the β-ketoester enolate as the ligand of the component (1D).

[0274] The carboxylic acid for the component (2D-2) is the same as the carboxylic acid used as the ligand for the component (1D).

[0275] The carboxylate ion of the component (2D-2) is the same as the carboxylate ion serving as a ligand of the component (1D).

[0276] The component (2D-2) may form a complex with the aluminum (2D-1) in the resin composition. In another embodiment, the component (2D-2) is preferably contained in the resin composition as a component different from the aluminum (2D-1).

[0277] As the component (2D-2), a commercially available reagent can be used. Alternatively, the aluminum complexes listed above as specific examples of the component (1D) can be incorporated into the resin composition, and the ligand dissociated in the resin composition can be used as the component (2D-2).

[0278] When the total amount of nonvolatile components in the resin composition is taken as 100% by mass, the content of component (2D-2) is preferably 0.0001% by mass or more or 0.0005% by mass or more, more preferably 0.001% by mass or more or 0.002% by mass or more, even more preferably 0.005% by mass or more or 0.008% by mass or more, and particularly preferably 0.01% by mass or more, 0.015% by mass or more, or 0.016% by mass or more, from the viewpoint of significantly achieving the effects of the present invention. In one embodiment, the content may be 0.02% by mass or more, 0.025% by mass or more, 0.03% by mass or more, 0.032% by mass or more, etc. The upper limit is preferably 2.00% by mass or less or 1.00% by mass or less, more preferably 0.80% by mass or less or 0.50% by mass or less, even more preferably 0.20% by mass or less, 0.10% by mass or less, or 0.08% by mass or less, and particularly preferably 0.07% by mass or less, 0.06% by mass or less, 0.05% by mass or less, 0.045% by mass or less, 0.04% by mass or less, or 0.035% by mass or less.

[0279] When the resin component in the resin composition is taken as 100% by mass, the content of component (2D-2) is preferably 0.001% by mass or more or 0.002% by mass or more, more preferably 0.005% by mass or more or 0.008% by mass or more, even more preferably 0.01% by mass or more or 0.02% by mass or more, particularly preferably 0.05% by mass or more, 0.06% by mass or more or 0.08% by mass or more, and the upper limit is preferably 10% by mass or less or 8% by mass or less, more preferably 5% by mass or less or 2% by mass or less, even more preferably 1% by mass or less, 0.8% by mass or less or 0.5% by mass or less, and particularly preferably 0.2% by mass or less, 0.18% by mass or less, 0.15% by mass or less, 0.13% by mass or less, or 0.1% by mass or less, from the viewpoint of significantly achieving the effects of the present invention.

[0280] The total content of components (2D-1) and (2D-2), when the total amount of nonvolatile components in the resin composition is taken as 100% by mass, is preferably 0.0001% by mass or more or 0.0005% by mass or more, more preferably 0.001% by mass or more or 0.002% by mass or more, even more preferably 0.005% by mass or more or 0.008% by mass or more, and particularly preferably 0.01% by mass or more, 0.015% by mass or more, or 0.017% by mass or more. In one embodiment, the total content may be 0.02% by mass or more, 0.025% by mass or more, 0.03% by mass or more, 0.035% by mass or more, etc., from the viewpoint of significantly achieving the effects of the present invention. The upper limit is preferably 2.00% by mass or 1.00% by mass, more preferably 0.80% by mass or 0.50% by mass, even more preferably 0.20% by mass or less, 0.15% by mass or less, 0.10% by mass or less, or 0.08% by mass or less, and particularly preferably 0.07% by mass or less, 0.06% by mass or less, 0.05% by mass or less, or 0.04% by mass or less. In one embodiment, the total content of components (2D-1) and (2D-2) is preferably 0.01 to 0.20% by mass, and more preferably 0.01 to 0.15% by mass, based on 100% by mass of the nonvolatile components in the resin composition.

[0281] The total content of the (2D-1) component and the (2D-2) component, when the resin components in the resin composition are taken as 100% by mass, is preferably 0.001% by mass or more or 0.002% by mass or more, more preferably 0.005% by mass or more or 0.008% by mass or more, even more preferably 0.01% by mass or more or 0.02% by mass or more, particularly preferably 0.05% by mass or more, 0.06% by mass or more or 0.08% by mass or more, and the upper limit is preferably 10% by mass or less or 8% by mass or less, more preferably 5% by mass or less or 2% by mass or less, even more preferably 1% by mass or less, 0.8% by mass or less or 0.5% by mass or less, and particularly preferably 0.2% by mass or less, 0.18% by mass or less, 0.15% by mass or less, 0.12% by mass or less, or 0.1% by mass or less, from the viewpoint of significantly achieving the effects of the present invention.

[0282] <(E) Radical curing resin> The resin composition according to the second embodiment of the present invention may contain a radical curable resin (E) as an optional component. The radical curable resin (E) according to the second embodiment is the same as the radical curable resin (E) according to the first embodiment.

[0283] <(F) Curing accelerator> The resin composition according to the second embodiment of the present invention may contain a curing accelerator (F) as an optional component, and preferably contains a curing accelerator (F). The curing accelerator (F) according to the second embodiment is the same as the curing accelerator (F) according to the first embodiment.

[0284] <(G)Organic filler> The resin composition of the second embodiment of the present invention may contain an organic filler (G) as an optional component. The resin composition of the second embodiment preferably contains at least one of the organic filler (G) and a thermoplastic resin (H) described below. The organic filler (G) according to the second embodiment is the same as the organic filler (G) according to the first embodiment.

[0285] <(H)Thermoplastic resin> The resin composition of the second embodiment of the present invention may contain a (H) thermoplastic resin as an optional component. The resin composition of the second embodiment preferably contains at least one of the aforementioned (G) organic filler and (H) thermoplastic resin. The (H) thermoplastic resin according to the second embodiment is the same as the (H) thermoplastic resin according to the first embodiment.

[0286] <(I) Organic solvent> The resin composition according to the second embodiment of the present invention may contain, and preferably contains, an organic solvent (I) as an optional component. The organic solvent (I) according to the second embodiment is the same as the organic solvent (I) according to the first embodiment.

[0287] <(J) Other additives> The resin composition of the second embodiment of the present invention may further contain (J) other additives as optional components to the extent that the object of the present invention is not impaired. (J) other additives according to the second embodiment are the same as (J) other additives according to the first embodiment.

[0288] <Contents of each component of the resin composition of the second embodiment> In the resin composition of the second embodiment, the total content of components (A), (B), (C), (2D-1), and (2D-2) is preferably 30% by mass or more or 40% by mass or more, more preferably 50% by mass or more or 60% by mass or more, even more preferably 70% by mass or more, 80% by mass or more, or 85% by mass or more, and particularly preferably 90% by mass or more, 95% by mass or more, or 97% by mass or more, based on 100% by mass of the nonvolatile components in the resin composition, in order to significantly achieve the effects of the present invention. In one embodiment, the total content may be 98% by mass or more, 98.5% by mass or more, etc. The upper limit may be 100% by mass, or may be 99.9% by mass or less, 99.8% by mass or less, 99.5% by mass or less, 99.2% by mass or less, etc.

[0289] The mass ratio of the component (2D-1) to the component (A1) [component (2D-1) / component (A1)] is preferably 1×10 to 1×10 from the viewpoints of significantly achieving the effects of the present invention, reducing the linear expansion coefficient of the cured product, and increasing the glass transition temperature of the cured product. -5 or more or 2 x 10 -5 More preferably, 5 × 10 -5 or more or 8 x 10 -5 More preferably, 1 × 10 -4 or more or 2 x 10 -4 More preferably, 5 × 10 -4 or more or 7 x 10 -4 In one embodiment, 8×10 -4 That's it, 1×10 -3 That's it, 2 x 10 -3 That's it, 2.5 x 10 -3 The upper limit is preferably 1 or less or 8×10 -1 Less than or equal to 5 × 10 -1 or less or 2 x 10 -1 or less, more preferably 1 × 10 -1 or less or 8 x 10 -2 Below 5 × 10, particularly preferably -2 or less or 2 x 10 -2 In one embodiment, the value is 1×10 -2 Below, 8 x 10 -3 Below, 5 x 10 -3 Below, 4 x 10 -3 Below, 3 x 10 -3 It could be as follows:

[0290] When the resin composition of the second embodiment contains the component (A2), the mass ratio of the component (2D-1) to the component (A2) [component (2D-1) / component (A2)] is preferably 1×10 -6 or more or 2 x 10 -6 More preferably, 5 × 10 -6 or more or 8 x 10 -6 More preferably, 1 × 10 -5 or more or 2 x 10 -5 More preferably, 5 × 10 -5 That's it, 8 x 10 -5or more or 9 x 10 -5 The upper limit is preferably 1×10 -1 Below, 8 x 10 -2 or less or 5 x 10 -2 Less than or equal to 2 × 10 -2 Below, 1×10 -2 or less or 8 x 10 -3 Less than 5 × 10, more preferably -3 Below, 2 x 10 -3 or less or 1×10 -3 Below, particularly preferably 8 × 10 -4 Below, 5 x 10 -4 or less or 3 x 10 -4 In one embodiment, the value is 3×10 -4 Below, 2 x 10 -4 Below, 1.5 x 10 -4 Below, 1×10 -4 It could be as follows:

[0291] From the viewpoint of significantly achieving the effects of the present invention, the mass ratio of the component (2D-1) to the component (A) [component (2D-1) / component (A)] is preferably 1×10 -6 or more or 2 x 10 -6 More preferably, 5 × 10 -6 or more or 8 x 10 -6 More preferably, 1 × 10 -5 or more or 2 x 10 -5 More preferably, 5 × 10 -5 That's it, 8 x 10 -5 or more or 9 x 10 -5 The upper limit is preferably 1×10 -1 Below, 8 x 10 -2 or less or 5 x 10 -2 Less than or equal to 2 × 10 -2 Below, 1×10 -2 or less or 8 x 10 -3 Less than 5 × 10, more preferably -3 Below, 2 x 10 -3 or less or 1×10 -3 Below, particularly preferably 8 × 10 -4 Below, 5 x 10 -4 or less or 3 x 10 -4In one embodiment, the value is 3×10 -4 Below, 2 x 10 -4 Below, 1.5 x 10 -4 Below, 1×10 -4 It could be as follows:

[0292] From the viewpoint of significantly achieving the effects of the present invention, the mass ratio of the component (2D-1) to the component (B) [component (2D-1) / component (B)] is preferably 1×10 -6 That's it, 2 x 10 -6 or more or 5 x 10 -6 More preferably, 8 × 10 -6 That's it, 1×10 -5 or more or 2 x 10 -5 More preferably, 5 × 10 -5 That's it, 8 x 10 -5 or more or 1 x 10 -4 More preferably, 1.5 × 10 -4 That's it, 1.8 x 10 -4 or more or 2 x 10 -4 The upper limit is preferably 1×10 -1 or less or 8 x 10 -2 Less than or equal to 5 × 10 -2 Below, 2 x 10 -2 or less or 1×10 -2 or less, more preferably 8 × 10-3 or less, 5 × 10 -3 or less or 2 x 10 -3 Below 1 × 10, particularly preferably -3 Below, 8 x 10 -4 or less or 6 x 10 -4 In one embodiment, the value is 6×10 -4 Below, 5 x 10 -4 Below, 4 x 10 -4 Below, 3 x 10 -4 It could be as follows:

[0293] From the viewpoint of significantly achieving the effects of the present invention, the mass ratio of the component (2D-1) to the component (C) [component (2D-1) / component (C)] is preferably 1×10 -7 That's it, 2 x 10 -7 or more or 5 x 10 -7 More preferably, 8 × 10-7 That's it, 1×10 -6 or more or 2 x 10 -6 More preferably, 5 × 10 -6 That's it, 8 x 10 -6 or more or 1 x 10 -5 More preferably, 1.5 × 10 -5 That's it, 2 x 10 -5 or more than 2.5 x 10 -5 In one embodiment, 3×10 -5 That's it, 4 x 10 -5 The upper limit is preferably 1×10 -2 or less or 8 x 10 -3 Less than or equal to 5 × 10 -3 Below, 2 x 10 -3 or less or 1×10 -3 Less than 8 × 10, more preferably -4 Below, 5 x 10 -4 or less or 2 x 10 -4 Below 1 × 10, particularly preferably -4 Below, 8 x 10 -5 Below, 6 x 10 -5 or less or 5 x 10 -5 The following is the result.

[0294] When the resin composition of the second embodiment contains the component (E), the mass ratio of the component (2D-1) to the component (E) [component (2D-1) / component (E)] is preferably 1×10 -5 or more or 2 x 10 -5 More preferably, 5 × 10 -5 That's it, 8 x 10 -5 or more or 1 x 10 -4 More preferably, 2 × 10 -4 That's it, 5 x 10 -4 or more or 8 x 10 -4 More preferably, 1×10 -3 That's it, 1.2 x 10 -3 or more than 1.4 x 10 -3 The upper limit is preferably 1 or less or 5 × 10 -1 Less than or equal to 1×10 -1 or less or 8 x 10 -2Less than 5 × 10, more preferably -2 Below, 2 x 10 -2 or less or 1×10 -2 Below, particularly preferably 8 × 10 -3 Below, 5 x 10 -3 Below, 3 x 10 -3 or less or 2 x 10 -3 The following is the result.

[0295] When the resin composition of the second embodiment contains the component (F), the mass ratio of the component (2D-1) to the component (F) [component (2D-1) / component (F)] is, from the viewpoint of significantly achieving the effects of the present invention, preferably 0.0001 or more or 0.0002 or more, more preferably 0.0005 or more or 0.0008 or more, even more preferably 0.001 or more, 0.002 or more or 0.005 or more, and particularly preferably 0.008 or more, 0.01 or more or 0.015 or more. In one embodiment, the mass ratio may be 0.02 or more, 0.022 or more, 0.025 or more, etc. The upper limit is preferably 5 or less or 2 or less, more preferably 1 or less or 0.8 or less, even more preferably 0.5 or less, 0.2 or less or 0.1 or less, and particularly preferably 0.08 or less, 0.05 or less, 0.04 or less, or 0.03 or less.

[0296] When the resin composition of the second embodiment contains the component (G), the mass ratio of the component (2D-1) to the component (G) [component (2D-1) / component (G)] is preferably 5 × 10 -5 or more or 8 x 10 -5 or more, more preferably 1×10 -4 That's it, 2 x 10 -4 or more or 5 x 10 -4 More preferably, 8 × 10 -4 That's it, 1×10 -3 or more or 2 x 10 -3 More preferably, 3×10 -3 That's it, 4 x 10 -3 or more or 5 x 10 -3 The upper limit is preferably 1 or less or 8 × 10 -1 Less than or equal to 5 × 10 -1 Below, 2 x 10 -1or less or 1×10 -1 Less than 8 × 10, more preferably -2 Below, 5 x 10 -2 or less or 2 x 10 -2 Below 1 × 10, particularly preferably -2 Below, 8 x 10 -3 or less or 7 x 10 -3 The following is the result.

[0297] When the resin composition of the second embodiment contains the component (H), the mass ratio of the component (2D-1) to the component (H) [component (2D-1) / component (H)] is preferably 1×10 -5 or more or 2 x 10 -5 More preferably, 5 × 10 -5 That's it, 8 x 10 -5 or more or 1 x 10 -4 More preferably, 2 × 10 -4 That's it, 5 x 10 -4 or more or 8 x 10 -4 More preferably, 1×10 -3 That's it, 1.5 x 10 -3 or more or 2 x 10 -3 The upper limit is preferably 1 or less or 5 × 10 -1 Less than or equal to 1×10 -1 Below, 8 x 10 -2 or less or 5 x 10 -2 or less, more preferably 2 × 10 -2 Below, 1×10 -2 or less or 8 x 10 -3 Below 5 × 10, particularly preferably -3 Below, 4 x 10 -3 or less or 3 x 10 -3 The following is the result.

[0298] The mass ratio of component (2D-2) to component (A1) [component (2D-2) / component (A1)] is preferably 0.0001 or more or 0.0002 or more, more preferably 0.0005 or more or 0.0008 or more, even more preferably 0.001 or more or 0.002 or more, and particularly preferably 0.005 or more, 0.006 or more, or 0.007 or more, from the viewpoints of significantly achieving the effects of the present invention, reducing the linear expansion coefficient of the cured product, and increasing the glass transition temperature of the cured product. In one embodiment, the mass ratio may be 0.01 or more, 0.02 or more, 0.03 or more, etc. The upper limit is preferably 5 or less or 2 or less, more preferably 1 or less or 0.8 or less, even more preferably 0.5 or less or 0.2 or less, and particularly preferably 0.1 or less, 0.08 or less, 0.06 or less, 0.05 or less, or 0.04 or less.

[0299] When the resin composition of the second embodiment contains the component (A2), the mass ratio of the component (2D-2) to the component (A2) [component (2D-2) / component (A2)] is preferably 1×10 -5 or more or 2 x 10 -5 More preferably, 5 × 10 -5 or more or 8 x 10 -5 More preferably, 1 × 10 -4 That's it, 2 x 10 -4 or more or 5 x 10 -4 More preferably, 8 × 10 -4 That's it, 1×10 -3 or more than 1.2 x 10 -3 The upper limit is preferably 1 or less or 5 × 10 -1 Less than or equal to 1×10 -1 or less or 8 x 10 -2 Less than 5 × 10, more preferably -2 Below, 2 x 10 -2 or less or 1×10 -2 Below, particularly preferably 8 × 10 -3 Below, 5 x 10 -3 Below, 2 x 10 -3 Below, 1.8 x 10 -3 or less or 1.5 x 10 -3 The following is the result.

[0300] From the viewpoint of significantly achieving the effects of the present invention, the mass ratio of the component (2D-2) to the component (A) [component (2D-2) / component (A)] is preferably 1×10 -5 or more or 2 x 10 -5 More preferably, 5 × 10 -5 That's it, 8 x 10 -5 or more or 1 x 10 -4 More preferably, 2 × 10 -4 That's it, 5 x 10 -4 or more or 8 x 10 -4 More preferably, 1×10 -3 That's it, 1.1 x 10 -3 or more than 1.2 x 10 -3 The upper limit is preferably 1 or less or 5 × 10 -1 Less than or equal to 1×10 -1 Below, 8 x 10 -2 or less or 5 x 10 -2 or less, more preferably 2 × 10 -2 Below, 1×10 -2 or less or 8 x 10 -3 Below 5 × 10, particularly preferably -3 Below, 3 x 10 -3 Below, 2 x 10 -3 Below, 1.8 x 10 -3 or less or 1.5 x 10 -3 The following is the result.

[0301] From the viewpoint of significantly achieving the effects of the present invention, the mass ratio of the component (2D-2) to the component (B) [component (2D-2) / component (B)] is preferably 1×10 -5 or more or 5 x 10 -5 or more, more preferably 1×10 -4 or more or 2 x 10 -4 More preferably, 5 × 10 -4 or more or 8 x 10 -4 More preferably, 1×10 -3 That's it, 2 x 10 -3 or more than 2.5 x 10 -3 The upper limit is preferably 1 or less or 5 × 10 -1 Less than or equal to 1×10 -1 Below, 8 x 10 -2or less or 5 x 10 -2 or less, more preferably 2 × 10 -2 Below, 1×10 -2 or less or 8 x 10 -3 Below 6 × 10, particularly preferably -3 Below, 5 x 10 -3 Below, 4 x 10 -3 or less or 3 x 10 -3 The following is the result.

[0302] From the viewpoint of significantly achieving the effects of the present invention, the mass ratio of the component (2D-2) to the component (C) [component (2D-2) / component (C)] is preferably 1×10 -5 More preferably, 2×10 -5 or more or 5 x 10 -5 More preferably, 8 × 10 -5 or more or 1 x 10 -4 More preferably, 2 × 10 -4 or more or 3 x 10 -4 In one embodiment, 4×10 -4 That's it, 5 x 10 -4 That's it, 6 x 10 -4 The upper limit is preferably 1×10 -1 or less or 8 x 10 -2 Less than or equal to 5 × 10 -2 or less or 2 x 10 -2 or less, more preferably 1 × 10 -2 Below, 8 x 10 -3 or less or 5 x 10 -3 Below 2 × 10, particularly preferably -3 Below, 1×10 -3 Below, 9 x 10 -4 Below, 8 x 10 -4 Below, 7 x 10 -4 or less or 6 x 10 -4 The following is the result.

[0303] When the resin composition of the second embodiment contains the component (E), the mass ratio of the component (2D-2) to the component (E) [component (2D-2) / component (E)] is, from the viewpoint of significantly achieving the effects of the present invention, preferably 0.0001 or more, 0.0002 or more, or 0.0005 or more, more preferably 0.0008 or more, 0.001 or more, or 0.002 or more, even more preferably 0.005 or more, 0.008 or more, or 0.01 or more, and particularly preferably 0.015 or more, or 0.018 or more. The upper limit is preferably 2 or 1 or less, more preferably 0.8 or less, 0.5 or less, or 0.2 or less, even more preferably 0.1 or less, 0.08 or less, or 0.06 or less, and particularly preferably 0.05 or less, 0.04 or less, 0.03 or less, or 0.025 or less.

[0304] When the resin composition of the second embodiment contains the (F) component, the mass ratio of the (2D-2) component to the (F) component [(2D-2) component / (F) component] is, from the viewpoint of significantly achieving the effects of the present invention, preferably 0.001 or more or 0.005 or more, more preferably 0.01 or more or 0.02 or more, even more preferably 0.05 or more or 0.08 or more, and particularly preferably 0.1 or more or 0.15 or more. In one embodiment, the mass ratio may be 0.2 or more, 0.3 or more, 0.32 or more, etc. The upper limit is preferably 50 or less or 20 or less, more preferably 10 or less or 8 or less, even more preferably 5 or less, 2 or less, or 1 or less, and particularly preferably 0.8 or less, 0.7 or less, 0.6 or less, 0.5 or less, or 0.4 or less.

[0305] When the resin composition of the second embodiment contains the component (G), the mass ratio of the component (2D-2) to the component (G) [component (2D-2) / component (G)] is, from the viewpoint of significantly achieving the effects of the present invention, preferably 0.0001 or more or 0.0005 or more, more preferably 0.001 or more or 0.002 or more, even more preferably 0.005 or more, 0.008 or more or 0.01 or more, particularly preferably 0.02 or more, 0.03 or more or 0.04 or more. The upper limit is preferably 5 or less or 2 or less, more preferably 1 or less or 0.8 or less, even more preferably 0.5 or less, 0.2 or less or 0.1 or less, particularly preferably 0.08 or less, 0.07 or less, 0.06 or less or 0.05 or less.

[0306] When the resin composition of the second embodiment contains the component (H), the mass ratio of the component (2D-2) to the component (H) [component (2D-2) / component (H)] is, from the viewpoint of significantly achieving the effects of the present invention, preferably 0.0001 or more or 0.0005 or more, more preferably 0.001 or more or 0.002 or more, even more preferably 0.005 or more, 0.008 or more or 0.01 or more, and particularly preferably 0.02 or more or 0.025 or more. The upper limit is preferably 5 or less or 2 or less, more preferably 1 or less or 0.8 or less, even more preferably 0.5 or less, 0.2 or less or 0.1 or less, and particularly preferably 0.08 or less, 0.06 or less, 0.05 or less, 0.04 or less, or 0.03 or less.

[0307] [Method of producing resin composition] The resin composition of the present invention can be prepared by appropriately mixing the necessary components among the above components (A) to (J), and kneading or mixing them as needed using kneading means such as a triple roll mill, ball mill, bead mill, sand mill, etc., or stirring means such as a super mixer, planetary mixer, high-speed rotary mixer, etc. When a component of the resin composition of the present invention is diluted with a solvent, the solid resin obtained by removing the solvent may be used, or the diluted component may be used as is, with the solvent portion being used as (I) organic solvent.

[0308] In one embodiment, the method for producing the resin composition of the present invention includes: (i) preparing a resin composition containing the component (A2), the curing agent (B), and the inorganic filler (C); and (ii) a step of mixing the resin composition of step (i) with (A1) a cationically polymerizable cyclic ether compound having a four-membered ring or less and component (D). Includes:

[0309] In step (i), a resin composition containing component (A2), a curing agent (B), and an inorganic filler (C) is prepared. Hereinafter, the resin composition of step (i) is also referred to as "resin composition (i)." Resin composition (i) may contain optional components such as a radical curable resin (E), a curing accelerator (F), an organic filler (G), a thermoplastic resin (H), an organic solvent (I), and other additives (J). Resin composition (i) can be prepared, for example, by mixing component (A2), component (B), component (C), and components (D) to (J).

[0310] In step (ii), the resin composition (resin composition (i)) from step (i) is mixed with (A1), a cationically polymerizable cyclic ether compound having a four-membered ring or less, and component (D). Hereinafter, the resin composition obtained in step (ii) is also referred to as "resin composition (ii)." Resin composition (ii) corresponds to the resin composition of the first embodiment and the resin composition of the second embodiment of the present invention.

[0311] The resin composition (ii) produced as described above has a reduced dielectric loss tangent of the cured product, particularly the dielectric loss tangent in a high-temperature (100°C) environment, compared to the reference resin composition (i). That is, according to the method for producing a resin composition of the present invention, the dielectric loss tangent of the cured product of the resin composition can be relatively reduced, and particularly the dielectric loss tangent in a high-temperature (100°C) environment can be relatively reduced.

[0312] [Method for reducing dielectric tangent] The method for reducing the dielectric tangent of the present invention includes the steps of: A step of mixing (A1) a cationically polymerizable cyclic ether compound having a four-membered ring or less and (D) component with other components constituting the resin composition. Includes:

[0313] Examples of other components constituting the resin composition include component (A2), (B) curing agent, (C) inorganic filler, (E) radical curable resin, (F) curing accelerator, (G) organic filler, (H) thermoplastic resin, (I) organic solvent, and (J) other additives. The order and method of mixing the other components constituting the resin composition with the (A1) cationic polymerizable cyclic ether compound having a four-membered or smaller ring and component (D) are not limited. The resin composition obtained after mixing components (A1) and (D) has a reduced dielectric loss tangent, particularly at high temperatures (100°C), compared to the resin composition before mixing components (A1) and (D). That is, the method for reducing the dielectric loss tangent of the cured resin composition can be relatively reduced, particularly at high temperatures (100°C).

[0314] In one embodiment, the method for reducing a dielectric loss tangent of the present invention comprises: (I) preparing a resin composition; and (II) A step of mixing the resin composition of step (I) with (A1) a cationically polymerizable cyclic ether compound having a four-membered ring or less and component (D). It is preferred that the compound contains:

[0315] In step (I), a resin composition is prepared. Hereinafter, the resin composition of step (I) is also referred to as the "resin composition step (I)." While there are no particular limitations on the resin composition (I), it preferably contains one or more components selected from the group consisting of component (A2), a curing agent (B), and an inorganic filler (C), more preferably two or more components selected from the above group, and even more preferably component (A2), a curing agent (B), and an inorganic filler (C). Furthermore, the resin composition step (I) may contain (E) a radical curable resin, (F) a curing accelerator, (G) an organic filler, (H) a thermoplastic resin, (I) an organic solvent, (J) other additives, and the like. The resin composition (I) can be prepared, for example, by mixing component (A2), component (B), component (C), and components (D) to (J).

[0316] In step (II), the resin composition (resin composition (I)) from step (I) is mixed with (A1) a cationically polymerizable cyclic ether compound having a four-membered ring or less, and component (D). Hereinafter, the resin composition obtained in step (II) is also referred to as "resin composition (II)."

[0317] The resin composition (II) has a reduced dielectric loss tangent of a cured product, particularly a reduced dielectric loss tangent in a high-temperature (100°C) environment, compared to the reference resin composition (I). That is, according to the method for reducing a dielectric loss tangent of the present invention, the dielectric loss tangent of a cured product of the resin composition can be relatively reduced, and particularly the dielectric loss tangent in a high-temperature (100°C) environment can be relatively reduced.

[0318] [Physical properties and applications of resin compositions] In one embodiment, a cured product of the resin composition of the present invention is characterized by a low dielectric loss tangent (Df) at room temperature (23°C). For example, when measured at 5.8 GHz and 23°C as described in the section "(3) Measurement of Dielectric Loss Tangent (Dielectric Properties)" below, the dielectric loss tangent (Df) of a cured product of the resin composition of the present invention is preferably 0.0100 or less or 0.0080 or less, more preferably 0.0060 or less or 0.0050 or less, even more preferably 0.0044 or less or 0.0040 or less, and particularly preferably 0.0035 or less or 0.0030 or less. The lower limit is not particularly limited, but may be 0.0001 or more or 0.0010 or more.

[0319] In one embodiment, a cured product of the resin composition of the present invention exhibits a low dielectric loss tangent (Df) even in a high-temperature (100°C) environment. For example, when measured at 5.8 GHz and 100°C as described in the section "(3) Measurement of Dielectric Loss Tangent (Dielectric Properties)" below, the dielectric loss tangent (Df) of the cured product of the resin composition of the present invention is preferably 0.0100 or less or 0.0080 or less, more preferably 0.0060 or less or 0.0055 or less, even more preferably 0.0050 or less, 0.0048 or less, or 0.0046 or less, and particularly preferably 0.0044 or less, 0.0040 or less, or 0.0035 or less. The lower limit is not particularly limited, but may be 0.0001 or more or 0.0010 or more.

[0320] In one embodiment, a cured product of the resin composition of the present invention is characterized by a small difference between the dielectric dissipation factor (Df) at high temperature (100°C) and the dielectric dissipation factor (Df) at room temperature (23°C). This means that the temperature dependence of the dielectric dissipation factor (Df) is small. When measured at 5.8 GHz, 23°C, and 100°C as described in the section "(3) Measurement of Dielectric Dissipation Factor (Dielectric Properties)" below, the difference between the dielectric dissipation factor (Df) at high temperature (100°C) and the dielectric dissipation factor (Df) at room temperature (23°C) is preferably 0.0030 or 0.0025 or less, more preferably 0.0020 or 0.0015 or 0.0012 or less, even more preferably 0.0010 or 0.0009 or 0.0008 or less, and particularly preferably 0.0007 or 0.0006 or 0.0005 or less. The lower limit is not particularly limited, but may be 0.00001 or more, or 0.0001 or more, for example.

[0321] In one embodiment, a cured product of the resin composition of the present invention is characterized by a high glass transition temperature (Tg). For example, as described in the section "(4) Measurement of Coefficient of Linear Thermal Expansion (CTE) and Glass Transition Temperature (Tg)" below, when measured by a tensile load method using a thermomechanical analyzer, the glass transition temperature (Tg) of a cured product of the resin composition of the present invention is preferably 120°C or higher or 125°C or higher, more preferably 130°C or higher or 135°C or higher, even more preferably 140°C or higher, 145°C or higher, or 150°C or higher, and particularly preferably 152°C or higher, 154°C or higher, or 156°C or higher. The upper limit is not particularly limited, but may be 400°C or lower, 300°C or lower, etc.

[0322] In one embodiment, a cured product of the resin composition of the present invention is characterized by a low coefficient of linear thermal expansion (CTE). For example, as described in the section "(4) Measurement of coefficient of linear thermal expansion (CTE) and glass transition temperature (Tg)" below, when measured using a thermomechanical analyzer by a tensile load method, the coefficient of linear thermal expansion (CTE) of a cured product of the resin composition of the present invention is preferably 70 ppm / °C or less, 60 ppm / °C or less, or 55 ppm / °C or less, more preferably 50 ppm / °C or less, 45 ppm / °C or less, or 42 ppm / °C or less, even more preferably 40 ppm / °C or less, 38 ppm / °C or less, or 35 ppm / °C or less, and particularly preferably 32 ppm / °C or less, 30 ppm / °C or less, or 28 ppm / °C or less. The lower limit is not particularly limited, but may be 1 ppm / °C or more, or 10 ppm / °C or more, for example.

[0323] In one embodiment, the present invention can be carried out by adding (A1) a cationically polymerizable cyclic ether compound having a four-membered or smaller ring and component (D) to a reference resin composition containing (A) a four-membered or smaller cyclic ether compound, (B) a curing agent, and (C) an inorganic filler to produce a resin composition of the present invention. In this case, the resin composition of the present invention has a reduced dielectric loss tangent, particularly at high temperatures (100°C), of the cured product compared to the reference resin composition. That is, the present invention provides a technique for relatively reducing the dielectric loss tangent of a cured product of a resin composition, particularly at high temperatures (100°C).

[0324] As described above, the resin composition of the present invention can produce a cured product exhibiting an excellent dielectric loss tangent even in a high-temperature (100°C) environment. Therefore, the resin composition of the present invention can be suitably used as a resin composition for forming an insulating layer of a printed wiring board (resin composition for an insulating layer of a printed wiring board), and more suitably used as a resin composition for forming an interlayer insulating layer of a printed wiring board (resin composition for an interlayer insulating layer of a printed wiring board). The resin composition of the present invention can also be suitably used when the printed wiring board is a circuit board with built-in components. The resin composition of the present invention can also be suitably used as a resin composition for a rewiring formation layer (resin composition for a rewiring formation layer) as an insulating layer for forming a rewiring layer in a semiconductor chip package, i.e., for forming an insulating layer of a rewiring substrate of a semiconductor chip package (insulating layer of a rewiring substrate). In the present invention, printed wiring boards and rewiring substrates are collectively referred to as "circuit boards," and therefore the resin composition of the present invention can be suitably used as an insulating layer for a circuit board.

[0325] The resin composition of the present invention can also be suitably used as a resin composition for encapsulating a semiconductor chip (a resin composition for semiconductor encapsulation) in a semiconductor chip package.

[0326] The resin composition of the present invention can also be used in a wide range of applications requiring a resin composition, such as sheet-like laminate materials such as resin sheets and prepregs, solder resists, underfill materials, die bonding materials, hole filling resins, and component embedding resins.

[0327] [Sheet-type laminated materials (resin sheets, prepregs)] The resin composition of the present invention can be used as it is, but may also be used in the form of a sheet-like laminate material containing the resin composition.

[0328] As the sheet-like laminate material, the following resin sheets and prepregs are preferred.

[0329] In one embodiment, the resin sheet includes a support and a layer of a resin composition (hereinafter simply referred to as a "resin composition layer") provided on the support, and is characterized in that the resin composition layer is formed from the resin composition of the present invention.

[0330] The thickness of the resin composition layer varies depending on the application, and may be appropriately determined depending on the application. For example, from the viewpoint of thinning printed wiring boards and semiconductor chip packages, the thickness of the resin composition layer is preferably 200 μm or less, more preferably 150 μm or less, 120 μm or less, 100 μm or less, 80 μm or less, 60 μm or less, or 50 μm or less. The lower limit of the thickness of the resin composition layer is not particularly limited, but can usually be 1 μm or more, 5 μm or more, etc.

[0331] Examples of the support include a thermoplastic resin film, a metal foil, and release paper, with a thermoplastic resin film and a metal foil being preferred. Therefore, in a preferred embodiment, the support is a thermoplastic resin film or a metal foil.

[0332] When a thermoplastic resin film is used as the support, examples of the thermoplastic resin include polyesters such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN), acrylics such as polycarbonate (PC) and polymethyl methacrylate (PMMA), cyclic polyolefins, triacetyl cellulose (TAC), polyether sulfide (PES), polyether ketone, polyimide, etc. Among these, polyethylene terephthalate and polyethylene naphthalate are preferred, with inexpensive polyethylene terephthalate being particularly preferred.

[0333] When a metal foil is used as the support, examples of the metal foil include copper foil and aluminum foil, with copper foil being preferred. The copper foil may be a foil made of a single metal, copper, or an alloy of copper and another metal (e.g., tin, chromium, silver, magnesium, nickel, zirconium, silicon, titanium, etc.).

[0334] The support may be subjected to a matte treatment, a corona treatment, or an antistatic treatment on the surface that will be bonded to the resin composition layer. Alternatively, a support with a release layer, which has a release layer on the surface that will be bonded to the resin composition layer, may be used. Examples of the release agent used in the release layer of the support with a release layer include one or more release agents selected from the group consisting of alkyd resins, polyolefin resins, urethane resins, and silicone resins. Commercially available release agents include "SK-1," "AL-5," and "AL-7" manufactured by Lintec Corporation. Alternatively, a commercially available support with a release layer may be used, such as "Lumirror T60" manufactured by Toray Industries, Inc., "Purex" manufactured by Teijin Limited, or "Uni-Peel" manufactured by Unitika Limited, which are PET films having a release layer primarily composed of an alkyd resin-based release agent.

[0335] The thickness of the support is not particularly limited, but is preferably in the range of 5 μm to 75 μm, more preferably 10 μm to 60 μm. When a support with a release layer is used, it is preferable that the thickness of the entire support with a release layer is in the above range.

[0336] When a metal foil is used as the support, a metal foil with a support substrate may be used, which is a thin metal foil with a peelable support substrate attached thereto. In one embodiment, the metal foil with a support substrate includes a support substrate, a release layer provided on the support substrate, and a metal foil provided on the release layer. When a metal foil with a support substrate is used as the support, the resin composition layer is provided on the metal foil.

[0337] In the metal foil with a supporting substrate, the material of the supporting substrate is not particularly limited, but examples thereof include copper foil, aluminum foil, stainless steel foil, titanium foil, copper alloy foil, etc. When copper foil is used as the supporting substrate, it may be electrolytic copper foil or rolled copper foil. Furthermore, the release layer is not particularly limited as long as it allows the metal foil to be released from the supporting substrate, and examples thereof include an alloy layer of an element selected from the group consisting of Cr, Ni, Co, Fe, Mo, Ti, W, and P; an organic coating, etc.

[0338] In the metal foil with a supporting substrate, the material of the metal foil is preferably, for example, copper foil or copper alloy foil.

[0339] In the metal foil with a supporting substrate, the thickness of the supporting substrate is not particularly limited, but is preferably in the range of 10 μm to 150 μm, more preferably in the range of 10 μm to 100 μm. The thickness of the metal foil may be, for example, in the range of 0.1 μm to 10 μm.

[0340] In one embodiment, the resin sheet may further include an optional layer, if necessary. Examples of such optional layers include a protective film provided on the surface of the resin composition layer that is not bonded to the support (i.e., the surface opposite the support). The thickness of the protective film is not particularly limited, but is, for example, 1 μm to 40 μm. By laminating the protective film, adhesion of dust and the like to the surface of the resin composition layer and scratches can be suppressed.

[0341] The resin sheet can be produced, for example, by preparing a liquid resin composition as is or a resin composition varnish by dissolving the resin composition in an organic solvent, applying this to a support using a die coater or the like, and then drying to form a resin composition layer.

[0342] Examples of the organic solvent include the same organic solvents as those described as components of the resin composition in the section <(G) Organic Solvent>. The organic solvents may be used alone or in combination of two or more.

[0343] Drying may be carried out by known methods such as heating or hot air blowing. Drying conditions are not particularly limited, but drying is carried out so that the content of organic solvent in the resin composition layer becomes 10% by mass or less, preferably 5% by mass or less. Although this varies depending on the boiling point of the organic solvent in the resin composition or resin varnish, for example, when a resin composition or resin varnish containing 10% by mass to 60% by mass of organic solvent is used, the resin composition layer can be formed by drying at 50°C to 150°C for 3 to 10 minutes.

[0344] The resin sheet can be stored in a rolled state. When the resin sheet has a protective film, it can be used by peeling off the protective film.

[0345] In one embodiment, the prepreg is formed by impregnating a sheet-like fiber substrate with the resin composition of the present invention.

[0346] The sheet-like fiber substrate used for the prepreg is not particularly limited, and commonly used prepreg substrates such as glass cloth, aramid nonwoven fabric, and liquid crystal polymer nonwoven fabric can be used. From the viewpoint of thinning printed wiring boards and semiconductor chip packages, the thickness of the sheet-like fiber substrate is preferably 50 μm or less, more preferably 40 μm or less, even more preferably 30 μm or less, and particularly preferably 20 μm or less. There is no particular lower limit to the thickness of the sheet-like fiber substrate. It is usually 10 μm or more.

[0347] The prepreg can be produced by a known method such as a hot melt method or a solvent method.

[0348] The thickness of the prepreg may be in the same range as that of the resin composition layer in the resin sheet described above.

[0349] The sheet-like laminate material of the present invention can be suitably used to form an insulating layer of a printed wiring board (for an insulating layer of a printed wiring board), and more suitably used to form an interlayer insulating layer of a printed wiring board (for an interlayer insulating layer of a printed wiring board). The sheet-like laminate material of the present invention can also be suitably used to form an insulating layer of a rewiring board of a semiconductor chip package (for an insulating layer of a rewiring board). That is, the sheet-like laminate material of the present invention can be suitably used as an insulating layer of a circuit board. The sheet-like laminate material of the present invention can also be suitably used to encapsulate a semiconductor chip (for semiconductor encapsulation).

[0350] [Circuit board] The resin composition of the present invention can be used to form an insulating layer for a circuit board. The present invention also provides such a circuit board, i.e., a circuit board comprising an insulating layer made of a cured product of the resin composition of the present invention.

[0351] <Printed wiring board> In one embodiment, the circuit board of the present invention is a printed wiring board. The printed wiring board of the present invention includes an insulating layer made of a cured product of the resin composition of the present invention.

[0352] The printed wiring board can be produced, for example, by using the above-mentioned resin sheet by a method including the following steps (I) and (II). (I) A step of laminating a resin sheet on an inner layer substrate so that the resin composition layer of the resin sheet is bonded to the inner layer substrate. (II) Step of thermally curing the resin composition layer to form an insulating layer

[0353] In step (I), a resin sheet is laminated on an inner layer substrate so that the resin composition layer of the resin sheet is bonded to the inner layer substrate. The "inner layer substrate" used in step (I) is a member that serves as the substrate of a printed wiring board, and examples thereof include glass epoxy substrates, metal substrates, polyester substrates, polyimide substrates, BT resin substrates, and thermosetting polyphenylene ether substrates. The substrate may have a conductor layer on one or both sides, and this conductor layer may be patterned. An inner layer substrate having a conductor layer (circuit) formed on one or both sides of the substrate may be referred to as an "inner layer circuit board." In addition, an intermediate product on which an insulating layer and / or a conductor layer is to be further formed during the production of a printed wiring board is also included in the "inner layer substrate" referred to in the present invention. When the printed wiring board is a circuit board with built-in components, an inner layer substrate with built-in components may be used.

[0354] The inner layer substrate and the resin sheet can be laminated, for example, by thermocompression bonding the resin sheet to the inner layer substrate from the support side. Examples of a member for thermocompression bonding the resin sheet to the inner layer substrate (hereinafter also referred to as a "thermocompression bonding member") include a heated metal plate (such as a SUS end plate) or a metal roll (SUS roll). The thermocompression bonding member may be pressed directly onto the resin sheet, or may be pressed via an elastic material such as heat-resistant rubber so that the resin sheet can sufficiently conform to the surface irregularities of the inner layer substrate.

[0355] The lamination of the inner layer substrate and the resin sheet may be carried out by a vacuum lamination method. In the vacuum lamination method, the thermocompression temperature is preferably in the range of 60°C to 160°C, more preferably 80°C to 140°C, the thermocompression pressure is preferably in the range of 0.098MPa to 1.77MPa, more preferably 0.29MPa to 1.47MPa, and the thermocompression time is preferably in the range of 10 seconds to 400 seconds, more preferably 20 seconds to 300 seconds. The lamination may be carried out under reduced pressure conditions, preferably at a pressure of 26.7hPa or less.

[0356] The lamination can be performed using a commercially available vacuum laminator, such as a vacuum pressure laminator manufactured by Meiki Seisakusho Co., Ltd., a vacuum applicator manufactured by Nikko Materials Co., Ltd., or a batch vacuum pressure laminator.

[0357] After lamination, the laminated resin sheets may be smoothed under normal pressure (atmospheric pressure), for example, by pressing a thermocompression member from the support side. The pressing conditions for the smoothing treatment may be the same as the thermocompression conditions for lamination. The smoothing treatment may be performed using a commercially available laminator. Note that lamination and smoothing treatment may be performed consecutively using the commercially available vacuum laminator.

[0358] The support may be removed between step (I) and step (II), or after step (II). When a metal foil is used as the support, the conductor layer may be formed using the metal foil without peeling off the support. When a metal foil with a supporting substrate is used as the support, the supporting substrate (and the release layer) may be peeled off. Then, the conductor layer can be formed using the metal foil.

[0359] In step (II), the resin composition layer is thermally cured to form an insulating layer made of a cured product of the resin composition. The curing conditions for the resin composition layer are not particularly limited, and conditions typically employed for forming insulating layers for printed wiring boards may be used.

[0360] For example, the thermal curing conditions for the resin composition layer vary depending on the type of resin composition, but in one embodiment, the curing temperature is preferably 120° C. to 250° C., more preferably 150° C. to 240° C., and even more preferably 180° C. to 230° C. The curing time is preferably 5 minutes to 240 minutes, more preferably 10 minutes to 150 minutes, and even more preferably 15 minutes to 120 minutes.

[0361] Before thermally curing the resin composition layer, the resin composition layer may be preheated at a temperature lower than the curing temperature. For example, prior to thermally curing the resin composition layer, the resin composition layer may be preheated at a temperature of 50°C to 120°C, preferably 60°C to 115°C, more preferably 70°C to 110°C for 5 minutes or more, preferably 5 minutes to 150 minutes, more preferably 15 minutes to 120 minutes, and even more preferably 15 minutes to 100 minutes.

[0362] When manufacturing a printed wiring board, the following steps may be further performed: (III) drilling holes in the insulating layer, (IV) roughening the insulating layer, and (V) forming a conductor layer. These steps (III) to (V) may be performed according to various methods known to those skilled in the art and used in manufacturing printed wiring boards. When the support is removed after step (II), the support may be removed between steps (II) and (III), between steps (III) and (IV), or between steps (IV) and (V). Furthermore, if necessary, the formation of the insulating layer and the conductor layer in steps (I) to (V) may be repeated to form a multilayer wiring board.

[0363] In another embodiment, the printed wiring board of the present invention can be produced using the above-mentioned prepreg. The production method is basically the same as when a resin sheet is used.

[0364] Step (III) is a step of drilling holes in the insulating layer, thereby forming holes such as via holes and through holes in the insulating layer. Step (III) may be performed using, for example, a drill, a laser, plasma, or the like, depending on the composition of the resin composition used to form the insulating layer. The dimensions and shape of the holes may be determined appropriately depending on the design of the printed wiring board.

[0365] Step (IV) is a step of roughening the insulating layer. Usually, in this step (IV), smear removal (desmear) is also performed. The procedure and conditions of the roughening treatment are not particularly limited, and known procedures and conditions commonly used in forming insulating layers for printed wiring boards can be adopted. For example, the insulating layer can be roughened by performing a swelling treatment with a swelling liquid, a roughening treatment with an oxidizing agent, and a neutralization treatment with a neutralizing liquid in this order.

[0366] The swelling liquid used in the roughening treatment is not particularly limited, but examples thereof include alkaline solutions and surfactant solutions, and is preferably an alkaline solution, with sodium hydroxide solution and potassium hydroxide solution being more preferred. Commercially available swelling liquids include "Swelling Dip Securigance P" and "Swelling Dip Securigance SBU" manufactured by Atotech Japan. The swelling treatment using a swelling liquid is not particularly limited, but can be carried out by, for example, immersing the insulating layer in a swelling liquid at 30°C to 90°C for 1 to 20 minutes. To keep the swelling of the resin in the insulating layer to an appropriate level, it is preferable to immerse the insulating layer in a swelling liquid at 40°C to 80°C for 5 to 15 minutes.

[0367] The oxidizing agent used in the roughening treatment is not particularly limited, but examples include alkaline permanganate solutions prepared by dissolving potassium permanganate or sodium permanganate in an aqueous solution of sodium hydroxide. Roughening treatment using an oxidizing agent such as alkaline permanganate solution is preferably carried out by immersing the insulating layer in an oxidizing agent solution heated to 60°C to 100°C for 10 to 30 minutes. The concentration of permanganate in the alkaline permanganate solution is preferably 5% by mass to 10% by mass. Commercially available oxidizing agents include alkaline permanganate solutions such as "Concentrate Compact CP," "Concentrate Compact P," and "Dosing Solution Securigance P" manufactured by Atotech Japan.

[0368] The neutralizing solution used in the roughening treatment is preferably an acidic aqueous solution, and examples of commercially available products include "Reduction Solution Securigant P" manufactured by Atotech Japan.

[0369] Treatment with a neutralizing solution can be carried out by immersing the surface that has been roughened with an oxidizing agent in a neutralizing solution at 30° C. to 80° C. for 5 to 30 minutes. From the standpoint of workability, etc., a method in which the object that has been roughened with an oxidizing agent is immersed in a neutralizing solution at 40° C. to 70° C. for 5 to 20 minutes is preferred.

[0370] Step (V) is a step of forming a conductor layer, and the conductor layer is formed on the insulating layer. The conductor material used for the conductor layer is not particularly limited. In a preferred embodiment, the conductor layer contains one or more metals selected from the group consisting of gold, platinum, palladium, silver, copper, aluminum, cobalt, chromium, zinc, nickel, titanium, tungsten, iron, tin, and indium. The conductor layer may be a single metal layer or an alloy layer. Examples of alloy layers include layers formed from alloys of two or more metals selected from the above group (e.g., nickel-chromium alloys, copper-nickel alloys, and copper-titanium alloys). Among these, from the viewpoints of versatility in forming the conductor layer, cost, ease of patterning, etc., a single metal layer of chromium, nickel, titanium, aluminum, zinc, gold, palladium, silver, or copper, or an alloy layer of a nickel-chromium alloy, a copper-nickel alloy, or a copper-titanium alloy is preferred, a single metal layer of chromium, nickel, titanium, aluminum, zinc, gold, palladium, silver, or copper, or an alloy layer of a nickel-chromium alloy is more preferred, and a single metal layer of copper is even more preferred.

[0371] The conductor layer may have a single layer structure or a multi-layer structure in which two or more single metal layers or alloy layers made of different types of metals or alloys are laminated. When the conductor layer has a multi-layer structure, the layer in contact with the insulating layer is preferably a single metal layer of chromium, zinc, or titanium, or an alloy layer of a nickel-chromium alloy.

[0372] The thickness of the conductor layer depends on the desired design of the printed wiring board, but is generally 3 μm to 35 μm, preferably 5 μm to 30 μm.

[0373] In one embodiment, the conductor layer may be formed by plating. For example, a conductor layer having a desired wiring pattern can be formed by plating the surface of the insulating layer using a conventionally known technique such as a semi-additive method or a full-additive method. From the viewpoint of ease of production, it is preferable to form the conductor layer by a semi-additive method. An example of forming the conductor layer by a semi-additive method will be described below.

[0374] First, a plating seed layer is formed on the surface of an insulating layer by electroless plating. Next, a mask pattern is formed on the formed plating seed layer, exposing a portion of the plating seed layer corresponding to the desired wiring pattern. After a metal layer is formed on the exposed plating seed layer by electrolytic plating, the mask pattern is removed. Thereafter, unnecessary plating seed layer is removed by etching or the like, thereby forming a conductor layer having the desired wiring pattern.

[0375] In another embodiment, the conductor layer may be formed using a metal foil. When a metal foil is used to form the conductor layer, step (V) is preferably performed between steps (I) and (II). For example, after step (I), the support is removed, and a metal foil is laminated on the exposed surface of the resin composition layer. The lamination of the resin composition layer and the metal foil may be performed by a vacuum lamination method. The lamination conditions may be the same as those described for step (I). Next, step (II) is performed to form an insulating layer. Thereafter, a conductor layer having a desired wiring pattern can be formed using the metal foil on the insulating layer by a conventionally known technique such as a subtractive method or a modified semi-additive method.

[0376] The metal foil can be produced by a known method such as an electrolytic method, a rolling method, etc. Examples of commercially available metal foils include "HLP Foil" and "JXUT-III Foil" manufactured by JX Nippon Mining & Smelting Co., Ltd., and "3EC-III Foil" and "TP-III Foil" manufactured by Mitsui Mining & Smelting Co., Ltd.

[0377] Alternatively, when a metal foil or a metal foil with a supporting substrate is used as the support for the resin sheet, the conductor layer may be formed using the metal foil, as described above.

[0378] <Rewiring substrate for semiconductor chip packages> In one embodiment, the circuit board of the present invention is a rewiring substrate for a semiconductor chip package. Hereinafter, a method for manufacturing the semiconductor chip package will be described.

[0379] [Semiconductor chip package] The semiconductor chip package of the present invention includes a sealing layer made of a cured product of the resin composition of the present invention. As described above, the semiconductor chip package of the present invention may also include an insulating layer (rewiring formation layer) of a rewiring substrate made of a cured product of the resin composition of the present invention.

[0380] A semiconductor chip package can be produced, for example, by a method including the following steps (1) to (6) using the resin composition and resin sheet of the present invention. The resin composition and resin sheet of the present invention can be used to form the sealing layer in step (3) or the rewiring formation layer in step (5). An example of forming a sealing layer or a rewiring formation layer using a resin composition or a resin sheet will be shown below. However, techniques for forming sealing layers and rewiring formation layers for semiconductor chip packages are known, and a person skilled in the art can produce a semiconductor package using the resin composition and resin sheet of the present invention according to known techniques. (1) a step of laminating a temporary fixing film on a substrate; (2) a step of temporarily fixing a semiconductor chip on a temporary fixing film; (3) forming an encapsulation layer on the semiconductor chip; (4) peeling the substrate and the temporary fixing film from the semiconductor chip; (5) forming a rewiring formation layer as an insulating layer on the surface of the semiconductor chip from which the base material and the temporary fixing film have been peeled off; and (6) A step of forming a rewiring layer as a conductor layer on the rewiring formation layer.

[0381] <Process (1)> The material used for the substrate is not particularly limited. Examples of the substrate include a silicon wafer, a glass wafer, a glass substrate, a metal substrate such as copper, titanium, stainless steel, or cold-rolled steel sheet (SPCC), a substrate made of glass fiber impregnated with epoxy resin or the like and subjected to a thermosetting treatment (e.g., an FR-4 substrate), and a substrate made of bismaleimide triazine resin (BT resin).

[0382] The material of the temporary fixing film is not particularly limited as long as it can be peeled off from the semiconductor chip in step (4) and can temporarily fix the semiconductor chip. Commercially available products can be used as the temporary fixing film. Examples of commercially available products include Riva Alpha manufactured by Nitto Denko Corporation.

[0383] <Process (2)> The semiconductor chips can be temporarily fixed using known devices such as a flip chip bonder, a die bonder, etc. The layout and number of semiconductor chips to be arranged can be appropriately set depending on the shape and size of the temporary fixing film, the number of semiconductor packages to be produced, etc., and for example, the semiconductor chips can be temporarily fixed by arranging them in a matrix of multiple rows and multiple columns.

[0384] <Process (3)> The resin composition layer of the resin sheet of the present invention is laminated on a semiconductor chip, or the resin composition of the present invention is applied to a semiconductor chip and cured (for example, thermally cured) to form a sealing layer.

[0385] For example, lamination of a semiconductor chip and a resin sheet can be performed by removing the protective film from the resin sheet and then thermocompressing the resin sheet to the semiconductor chip from the support side. Examples of a member for thermocompressing the resin sheet to the semiconductor chip (hereinafter also referred to as a "thermocompression member") include a heated metal plate (such as a SUS plate) or a metal roll (SUS roll). It is preferable to press the thermocompression member not directly onto the resin sheet, but via an elastic material such as heat-resistant rubber, so that the resin sheet can adequately conform to the surface irregularities of the semiconductor chip. The semiconductor chip and resin sheet can also be laminated by a vacuum lamination method, and the lamination conditions and preferred ranges are the same as those described in relation to the method for manufacturing a printed wiring board.

[0386] After lamination, the resin composition is thermally cured to form the sealing layer under the same conditions as those described in relation to the method for producing a printed wiring board.

[0387] The support of the resin sheet may be peeled off after the resin sheet is laminated on the semiconductor chip and thermally cured, or the support may be peeled off before the resin sheet is laminated on the semiconductor chip.

[0388] When forming a sealing layer by applying the resin composition of the present invention, the application conditions are the same as the application conditions when forming the resin composition layer described in relation to the resin sheet of the present invention, and the preferred ranges are also the same.

[0389] <Process (4)> The method for peeling off the substrate and the temporary fixing film can be changed as appropriate depending on the material of the temporary fixing film, etc., and examples include a method in which the temporary fixing film is heated and foamed (or expanded) to peel it off, and a method in which ultraviolet light is irradiated from the substrate side to reduce the adhesive strength of the temporary fixing film and peel it off.

[0390] In the method of heating and foaming (or expanding) the temporary fixing film to peel it off, the heating conditions are usually 100 to 250°C for 1 to 90 seconds or 5 to 15 minutes. In the method of irradiating ultraviolet light from the substrate side to reduce the adhesive strength of the temporary fixing film to peel it off, the irradiation dose of ultraviolet light is usually 10 mJ / cm. 2 ~1000mJ / cm 2 is.

[0391] <Process (5)> The material for forming the rewiring formation layer (insulating layer) is not particularly limited as long as it has insulating properties when the rewiring formation layer (insulating layer) is formed, and from the viewpoint of ease of manufacturing a semiconductor chip package, ultraviolet-curable resins and thermosetting resins are preferred. The rewiring formation layer may be formed using the resin composition or resin sheet of the present invention.

[0392] After forming the redistribution layer, via holes may be formed in the redistribution layer to connect the semiconductor chip to a conductor layer (described later). The via holes may be formed by a known method depending on the material of the redistribution layer.

[0393] <Process (6)> The formation of the conductor layer on the rewiring formation layer may be carried out in the same manner as in step (V) described in relation to the method for producing a printed wiring board. Note that steps (5) and (6) may be repeated to alternately stack (build up) the conductor layer (rewiring layer) and the rewiring formation layer (insulating layer).

[0394] The manufacturing of the semiconductor chip package may further include the steps of (7) forming a solder resist layer on the conductor layer (rewiring layer), (8) forming bumps, and (9) dicing the plurality of semiconductor chip packages into individual semiconductor chip packages. These steps may be performed according to various methods known to those skilled in the art for use in manufacturing semiconductor chip packages.

[0395] By forming an encapsulating layer and a rewiring formation layer using the resin composition and resin sheet of the present invention, which produce a cured product exhibiting excellent dielectric properties, a semiconductor chip package with extremely low transmission loss can be realized, regardless of whether the semiconductor package is a fan-in package or a fan-out package. In one embodiment, the semiconductor chip package of the present invention is a fan-out package. The resin composition and resin sheet of the present invention can be applied to both a fan-out panel level package (FO-PLP) and a fan-out wafer level package (FO-WLP). In one embodiment, the semiconductor package of the present invention is a fan-out panel level package (FOPLP). In another embodiment, the semiconductor package of the present invention is a fan-out wafer level package (FOWLP).

[0396] [Semiconductor Devices] The semiconductor device of the present invention includes a layer made of a cured product of the resin composition of the present invention, and includes the circuit board or semiconductor chip package of the present invention.

[0397] Examples of semiconductor devices include various semiconductor devices used in electrical appliances (for example, computers, mobile phones, digital cameras, and televisions) and vehicles (for example, motorcycles, automobiles, trains, ships, and aircraft). [Example]

[0398] The present invention will be described in more detail below using examples, but the present invention is not limited to these examples. In the following description, unless otherwise specified, "parts" and "%" mean "parts by mass" and "% by mass", respectively.

[0399] <Production of Resin Composition (Resin Varnish)> Each component was weighed out in the parts by mass shown in Tables 1 and 2 and uniformly dispersed using a high-speed rotary mixer to obtain a resin composition (resin varnish). Specifically, among the components shown in Tables 1 and 2, component (A2), component (B), component (C), component (E), component (F), component (G), component (H), and component (I) were first mixed to produce resin composition (i). Next, resin composition (i) was mixed with component (A1) and component (D) to obtain resin composition (ii). [Table 1] [Table 2]

[0400] Details of each component listed in Tables 1 and 2 are as follows. Component (A1) Limonene dioxide: Cationic polymerizable epoxy resin (functional group equivalent: 96 g / eq., manufactured by Cargill) [ka] Celloxide 2021P: Cationic polymerizable epoxy resin (functional group equivalent weight 120g / eq., manufactured by Daicel Corporation) [ka] EHPE3150: Cationic polymerizable epoxy resin (functional group equivalent weight 180g / eq., manufactured by Daicel Corporation) [ka] (In the formula, n1, n2, and n3 each independently represent an integer of 0 or more.) OXT-221: Cationic polymerizable oxetane resin (functional group equivalent weight 107g / eq., manufactured by Toagosei Co., Ltd.) [ka]

[0401] (A2) Component 828EL: Bisphenol A epoxy resin (epoxy equivalent weight 180g / eq., manufactured by Mitsubishi Chemical Corporation) HP-4032SS: Naphthalene-type epoxy resin (epoxy equivalent: 144g / eq., manufactured by DIC Corporation) NC3000L: Biphenyl-type epoxy resin (epoxy equivalent 269g / eq., manufactured by Nippon Kayaku Co., Ltd.) YX4000HK: Bixylenol-type epoxy resin (epoxy equivalent weight 185g / eq., manufactured by Mitsubishi Chemical Corporation) ESN475V: Naphthalene-type epoxy resin (epoxy equivalent weight 332g / eq., manufactured by Nippon Steel Chemical & Material Co., Ltd.) HP-6000: Naphthylene ether epoxy resin (epoxy equivalent weight 250g / eq., manufactured by DIC Corporation) HP-7200HH: Dicyclopentadiene epoxy resin (epoxy equivalent weight 283g / eq., manufactured by DIC Corporation)

[0402] (B) Component HPC-8000-65T: Active ester curing agent containing a dicyclopentadiene-type diphenol structure (functional group equivalent weight 223 g / eq., toluene solution with non-volatile content of 65% by mass, manufactured by DIC Corporation) HPC-8150-62T: Naphthalene-type active ester curing agent (functional group equivalent weight 223 g / eq., non-volatile content 62% by mass in toluene solution, manufactured by DIC Corporation) LA-3018-50P: Triazine skeleton-containing phenolic curing agent (triazine skeleton-containing phenolic novolac resin) (functional group equivalent weight 151 g / eq., non-volatile content 50% by mass, propylene glycol monomethyl ether (1-methoxy-2-propanol) solution, manufactured by DIC Corporation) V-03: Carbodiimide curing agent (functional group equivalent weight 216 g / eq., non-volatile content 50% by mass in toluene solution, manufactured by Nisshinbo Chemical Inc.)

[0403] (C) Component SO-C2 (surface treated): Spherical silica (average particle size 0.5 μm, specific surface area 5.8 m) surface-treated with an amine-based silane coupling agent (N-phenyl-3-aminopropyltrimethoxysilane, Shin-Etsu Chemical Co., Ltd. "KBM-573"). 2 / g, manufactured by Admatechs Co., Ltd.) SO-C2: Spherical silica (average particle size 0.5 μm, specific surface area 5.8 m 2 / g, manufactured by Admatechs Co., Ltd.) ASFP-40: Spherical alumina (average particle size 0.4 μm, specific surface area 6.3 m) surface-treated with an amine-based silane coupling agent (N-phenyl-3-aminopropyltrimethoxysilane, Shin-Etsu Chemical Co., Ltd. "KBM-573"). 2 / g, manufactured by Denka Co., Ltd.) UFP-30: Spherical silica (average particle size 0.3 μm, specific surface area 30.7 m) surface-treated with an amine-based silane coupling agent (N-phenyl-3-aminopropyltrimethoxysilane, Shin-Etsu Chemical Co., Ltd. "KBM-573"). 2 / g, manufactured by Denka Co., Ltd.) FB-5SDC: Spherical silica (average particle size 4.1 μm, specific surface area 2.1 m) surface-treated with an amine-based silane coupling agent (N-phenyl-3-aminopropyltrimethoxysilane, Shin-Etsu Chemical Co., Ltd. "KBM-573"). 2 / g, manufactured by Denka Co., Ltd.)

[0404] (D) Component Aluminum chelate D: Aluminum monoacetylacetonate bis(ethylacetoacetate) (2-propanol solution with a non-volatile content of 76% by mass, manufactured by Kawaken Fine Chemicals Co., Ltd.) AMD: Aluminum diisopropyl monosec-butylate (Kawaken Fine Chemicals Co., Ltd.)

[0405] (E) Component MIR-3000-70MT: Biphenylaralkylnovolac-type maleimide resin (MEK / toluene mixed solution with 70% non-volatile content, manufactured by Nippon Kayaku Co., Ltd.) BMI-1500: Dimer diamine structure-containing polyimide resin with a maleimide group at the end (Designer Molecules Inc.) OPE-2St 2200: Vinylbenzyl-modified polyphenylene ether resin (toluene solution with a non-volatile content of 65% by mass, manufactured by Mitsubishi Gas Chemical Company, Inc.)

[0406] (F) Component DMAP: Amine curing accelerator (4-dimethylaminopyridine, manufactured by Tokyo Chemical Industry Co., Ltd.) 1B2PZ: Imidazole-based curing accelerator (1-benzyl-2-phenylimidazole, manufactured by Shikoku Chemicals Corporation)

[0407] (G) Component Staphyloid AC3816N: Acrylic core-shell rubber particles (manufactured by Aica Kogyo Co., Ltd.)

[0408] (H) Component YX7553BH30: Phenoxy resin (a 1:1 solution of MEK and cyclohexanone with a non-volatile content of 30% by mass, manufactured by Mitsubishi Chemical Corporation)

[0409] <Characteristics evaluation> (1) Preparation of a resin sheet having a resin composition layer thickness of 40 μm A polyethylene terephthalate film (thickness: 38 μm) that had been treated with an alkyd resin-based release agent ("AL-5" manufactured by Lintec Corporation) for release was prepared as a support. The resin compositions (resin varnishes) obtained in the Examples and Comparative Examples were uniformly applied onto the release layer of this support so that the thickness of the resin composition layer after drying would be 40 μm. The resin compositions were then dried at 80°C to 100°C (average 90°C) for 2 minutes to obtain a resin sheet including the support and the resin composition layer.

[0410] (2) Preparation of a cured resin composition layer The prepared resin sheet was cured for 90 minutes in an oven at 190° C. The resin sheet was taken out of the oven and the support was peeled off to obtain a cured resin composition layer.

[0411] (3) Measurement of dielectric loss tangent (dielectric properties) The cured resin composition layer was cut into a piece of 80 mm long and 2 mm wide, and the dielectric loss tangent (Df value) was measured by the cavity resonance perturbation method using an Agilent Technologies HP8362B at a measurement frequency of 5.8 GHz and measurement temperatures of 23°C and 100°C. Measurements were performed on two test pieces, and the average was calculated and evaluated according to the following criteria. In addition, the difference between the dielectric loss tangent at the measurement temperature of 100°C and the dielectric loss tangent at the measurement temperature of 23°C was calculated. Dielectric loss tangent at a measurement temperature of 23°C ○: Dielectric tangent (23℃) is 0.0044 or less ×: Dielectric tangent (23°C) is greater than 0.0044 Dielectric loss tangent at a measurement temperature of 100°C ○: Dielectric tangent (100℃) is 0.0050 or less ×: Dielectric tangent (100°C) is greater than 0.0050 The difference between the dielectric tangent at a measurement temperature of 100°C and the dielectric tangent at a measurement temperature of 23°C ○: The difference in dielectric tangent (100℃-23℃) is 0.0009 or less ×: The difference in dielectric tangent (100℃-23℃) is greater than 0.0009

[0412] (4) Measurement of coefficient of linear thermal expansion (CTE) and glass transition temperature (Tg) The cured resin composition layer was cut into a length of approximately 15 mm and a width of approximately 5 mm to obtain a test piece. Thermomechanical analysis was performed using a thermomechanical analyzer (Rigaku Corporation, "Thermo Plus TMA8310") by the tensile load method. Specifically, the test piece was mounted in the analyzer and subjected to two consecutive measurements under the following conditions: a load of 1 g and a temperature increase rate of 5°C / min. The first measurement was performed by raising the temperature to 200°C, and the second measurement was performed by raising the temperature to 260°C. In the second measurement, the average coefficient of linear thermal expansion (CTE) in the in-plane direction from 25°C to 150°C and the glass transition temperature (Tg) were calculated.

[0413] As shown in Tables 1 and 2, in Examples 1 to 17, which contained (A) a cyclic ether compound with a four-membered ring or less, (B) a curing agent, (C) an inorganic filler, and the component (D) specified in the present application, and in which the component (A) contained (A1) a cationically polymerizable cyclic ether compound with a four-membered ring or less, cured products exhibiting excellent dielectric loss tangents were obtained even in a high-temperature (100°C) environment. Comparative Example 1, which did not contain component (D), and Comparative Example 2, which did not contain component (A1), had high dielectric loss tangent values ​​at high temperatures (100°C), which were unsatisfactory.

Claims

1. (A) a cyclic ether compound having a 4-membered or smaller ring, (B) a curing agent, (C) an inorganic filler, and (1D) aluminum complexes, A resin composition comprising: A resin composition, wherein the component (A) contains (A1) a cationically polymerizable cyclic ether compound having a four- or less-membered ring.

2. (A) a cyclic ether compound having a 4-membered or smaller ring, (B) a curing agent, (C) inorganic filler, (2D-1) aluminum, and (2D-2) an organic ligand having an oxygen atom as a coordinating atom; A resin composition comprising: A resin composition, wherein the component (A) contains (A1) a cationically polymerizable cyclic ether compound having a four- or less-membered ring.

3. The resin composition according to claim 1 or 2, wherein the component (A) further comprises a cyclic ether compound having a four- or smaller ring member other than the component (A1) (hereinafter referred to as "component (A2)").

4. 3. The resin composition according to claim 1, wherein the content of the component (A1) is 0.1 to 6.0% by mass, based on 100% by mass of nonvolatile components in the resin composition.

5. The resin composition according to claim 1 or 2, wherein the content of the component (C) is 50% by mass or more when the total amount of nonvolatile components in the resin composition is 100% by mass.

6. The resin composition according to claim 1, wherein the content of the component (1D) is 0.01 to 0.20% by mass, when the total amount of nonvolatile components in the resin composition is 100% by mass.

7. The resin composition according to claim 2, wherein the total content of the components (2D-1) and (2D-2) is 0.01 to 0.20% by mass, when the total amount of non-volatile components in the resin composition is 100% by mass.

8. The resin composition according to claim 1 or 2, wherein the component (A1) comprises an alicyclic epoxy resin.

9. The resin composition according to claim 3 , wherein the component (A2) comprises an aromatic epoxy resin.

10. The resin composition according to claim 1 or 2, wherein the component (B) comprises an active ester-based curing agent.

11. The resin composition according to claim 1 or 2, wherein the component (C) comprises an inorganic oxide.

12. The resin composition according to claim 1 or 2, wherein the component (C) comprises silica.

13. The resin composition according to claim 1 or 2, wherein the average particle size of component (C) is 5.0 μm or less.

14. The specific surface area of ​​component (C) is 0.1 to 50 m ２ The resin composition according to claim 1 or 2, wherein the molecular weight of the resin composition is 1 / g.

15. The resin composition according to claim 1 , wherein component (1D) comprises an aluminum chelate complex.

16. The resin composition according to claim 1, wherein the component (1D) comprises one or more aluminum complexes selected from the group consisting of aluminum complexes having an alkoxide as a ligand, aluminum complexes having a β-diketone enolate as a ligand, and aluminum complexes having a β-ketoester enolate as a ligand.

17. The resin composition according to claim 2, wherein the component (2D-1) contains aluminum ions.

18. The resin composition according to claim 2, wherein the component (2D-2) comprises one or more organic ligands selected from the group consisting of alcohols, alkoxides, β-diketones, β-diketone enolates, β-ketoesters, and β-ketoester enolates.

19. The resin composition according to claim 1 or 2, further comprising (E) a radical curable resin.

20. The resin composition according to claim 1 or 2, further comprising (F) a curing accelerator.

21. The resin composition according to claim 1 or 2, further comprising (G) an organic filler.

22. The resin composition according to claim 1 or 2, further comprising a thermoplastic resin (H).

23. The resin composition according to claim 1 or 2, wherein the dielectric loss tangent (Df) of a cured product of the resin composition is 0.0050 or less when measured at 5.8 GHz and 100°C.

24. The resin composition according to claim 1 or 2, which is used for an insulating layer of a circuit board.

25. The resin composition according to claim 1 or 2, which is used for semiconductor encapsulation.

26. A resin sheet comprising a support and a layer of the resin composition according to claim 1 or 2 provided on the support.

27. The resin sheet according to claim 26, wherein the support is a thermoplastic resin film or a metal foil.

28. A prepreg obtained by impregnating a sheet-like fiber substrate with the resin composition according to claim 1 or 2.

29. A cured product of the resin composition according to claim 1 or 2.

30. A circuit board comprising an insulating layer made of a cured product of the resin composition according to claim 1 or 2.

31. A semiconductor chip package comprising an encapsulating layer made of a cured product of the resin composition according to claim 1 or 2.

32. 32. The semiconductor chip package of claim 31, which is a fan-out type package.

33. A semiconductor device comprising the circuit board according to claim 30.

34. 32. A semiconductor device comprising the semiconductor chip package of claim 31.

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