Cooling equipment and in-vehicle devices

Abstract

Provided is a cooling device and an on-vehicle device that can prevent short circuits and migration in a substrate even if leakage of a liquid refrigerant or condensation occurs. [Solution] The cooling device of one embodiment is a cooling device that cools multiple components to be cooled mounted on a substrate, and includes a liquid cooling unit that is thermally coupled to the components to be cooled and flows liquid refrigerant through a liquid refrigerant flow path to cool the components to be cooled, an inlet that introduces liquid refrigerant into the liquid refrigerant flow path, an outlet that discharges the liquid refrigerant from the liquid refrigerant flow path, and a housing that houses the liquid cooling unit with the inlet and outlet protruding, and the housing has a guide member that guides the liquid to be removed in a predetermined direction.

Description

[Technical Field]

[0001] The present disclosure relates to a cooling device and an in-vehicle device. [Background technology]

[0002] Conventionally, in the case of a board on which multiple chips are mounted, when the heat generated from the chips to be dissipated on the board is dissipated using a heat dissipation component such as a heat sink, a cooling device has been proposed that reduces the thermal resistance by narrowing the gap between the chip and the heat dissipation component, thereby enabling efficient heat dissipation. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2006-294699 Summary of the Invention [Problem to be solved by the invention]

[0004] However, in cooling equipment that cools a substrate using a metallic water-cooling unit through which a liquid refrigerant is circulated, there is a risk that the liquid refrigerant (e.g., water) will leak from the liquid refrigerant flow path or that condensation will occur on the water-cooling unit itself, which could lead to a short circuit in the substrate. To address this issue, conventionally, substrates have been coated with a water- and moisture-resistant coating. However, because applying a coating increases the resistance and creates a non-conductive state, this has been difficult to address for communication lines, ground lines, and the like, which must maintain a conductive state.

[0005] In view of the above problems, the present invention aims to provide a cooling device and an on-board device that can prevent short circuits and migration in a board even if leakage of a liquid refrigerant or condensation occurs. [Means for solving the problem]

[0006] In order to solve the above problem, the cooling device of an embodiment is a cooling device that cools multiple components to be cooled that are mounted on a board, and includes a liquid cooling unit that is thermally coupled to the components to be cooled and that cools the components to be cooled by flowing liquid refrigerant through a liquid refrigerant flow path, an inlet that introduces liquid refrigerant into the liquid refrigerant flow path, an outlet that discharges the liquid refrigerant from the liquid refrigerant flow path, and a housing that houses the liquid cooling unit with the inlet and outlet protruding, and the housing has a guide member that guides the liquid to be removed in a predetermined direction. [Effects of the Invention]

[0007] According to the present disclosure, even if leakage or condensation of the liquid refrigerant occurs, short circuits and migration on the substrate can be prevented. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a block diagram showing the outline of the configuration of a substrate cooling system according to an embodiment. [Figure 2] FIG. 2 is an exploded perspective view of an example of an in-vehicle device equipped with the cooling unit of the embodiment. [Figure 3] FIG. 3 is an external perspective view of the cooling unit of the first embodiment. [Figure 4] FIG. 4 is a cross-sectional view taken along line AA in FIG. [Figure 5] FIG. 5 is a cross-sectional view illustrating the outline of a mounting state of the cooling unit according to the second embodiment. [Figure 6] FIG. 6 is a schematic explanatory diagram of a mounting state of the cooling unit according to the third embodiment. [Figure 7] FIG. 7 is a cross-sectional view illustrating the outline of a mounting state of the cooling unit according to the fourth embodiment. [Figure 8] FIG. 8 is a cross-sectional view illustrating the outline of a mounting state of the cooling unit according to the fifth embodiment. [Figure 9] FIG. 9 is a cross-sectional view illustrating the outline of a mounting state of the cooling unit according to the sixth embodiment. [Figure 10]FIG. 10 is a perspective view of the appearance of the heat transfer member of the sixth embodiment in a mounted state. [Figure 11] FIG. 11 is a cross-sectional view illustrating the outline of a mounting state of the cooling unit according to the seventh embodiment. [Figure 12] FIG. 12 is a cross-sectional view illustrating the outline of a mounting state of the cooling unit according to the eighth embodiment. [Figure 13] FIG. 13 is a cross-sectional view illustrating the outline of a mounting state of the cooling unit according to the ninth embodiment. [Figure 14] FIG. 14 is a cross-sectional view illustrating the outline of a mounting state of the cooling unit according to the tenth embodiment. [Figure 15] FIG. 15 is a schematic explanatory cross-sectional view of a mounting state of the cooling unit of the eleventh embodiment. [Figure 16] FIG. 16 is a cross-sectional view illustrating the outline of a mounting state of a cooling unit according to the twelfth embodiment. [Figure 17] FIG. 17 is a schematic explanatory diagram of a mounting state of the cooling unit according to the thirteenth embodiment. [Figure 18] FIG. 18 is a schematic explanatory diagram of a mounting state of the cooling unit according to the thirteenth embodiment. [Figure 19] FIG. 19 is a cross-sectional view illustrating the outline of a mounting state of a cooling unit according to the fifteenth embodiment. [Figure 20] FIG. 20 is a cross-sectional view illustrating the outline of a mounting state of the cooling unit according to the sixteenth embodiment. [Figure 21] FIG. 21 is a schematic explanatory diagram of a mounting state of the cooling unit according to the seventeenth embodiment. [Figure 22] FIG. 22 is a partially exploded perspective view (part 1) of the cooling unit of the seventeenth embodiment. [Figure 23] FIG. 23 is a partially exploded perspective view (part 2) of the cooling unit of the seventeenth embodiment. [Figure 24] FIG. 24 is an enlarged perspective view of a part of a cross section of the cooling unit of the seventeenth embodiment. [Figure 25] FIG. 25 is an explanatory diagram of the flow of liquid refrigerant in the cooling unit of the seventeenth embodiment. [Figure 26]FIG. 26 is an explanatory diagram (part 1) of another example of the shape of the convex portion in the flow channel. [Figure 27] FIG. 27 is an explanatory diagram of the flow of liquid refrigerant on the inlet side. [Figure 28] FIG. 28 is an explanatory diagram of the flow of liquid refrigerant on the outlet side. [Figure 29] FIG. 29 is an explanatory diagram (part 2) of another example of the shape of the convex portion in the flow channel. [Figure 30] FIG. 30 is an explanatory view of the inside of the cooling unit of the eighteenth embodiment. [Figure 31] FIG. 31 is an explanatory diagram of a modified example of the eighteenth embodiment. [Figure 32] FIG. 32 is an external perspective view of the cooling unit of the nineteenth embodiment as viewed from the rear side. [Figure 33] FIG. 33 is an explanatory diagram of the twentieth embodiment. [Figure 34] FIG. 34 is a partially exploded perspective view of the cooling unit of the twenty-first embodiment. [Figure 35] FIG. 35 is a plan view of the cooling unit of the twenty-second embodiment. [Figure 36] FIG. 36 is a cross-sectional view of the portion enclosed by the dashed line BA in FIG. [Figure 37] FIG. 37 is a cross-sectional view of a cooling unit according to a modification of the twenty-second embodiment. [Figure 38] FIG. 38 is an explanatory diagram of the 23rd embodiment. [Figure 39] FIG. 39 is an explanatory diagram of the 24th embodiment. [Figure 40] FIG. 40 is an explanatory diagram of the 25th embodiment. [Figure 41] FIG. 41 is an explanatory diagram of the 25th embodiment when the slit member is inserted and after brazing. [Figure 42] FIG. 42 is an explanatory diagram of a first modified example of the twenty-fifth embodiment. [Figure 43] FIG. 43 is an explanatory diagram of a second modified example of the twenty-fifth embodiment. [Figure 44] FIG. 44 is an explanatory diagram of a third and fourth modified example of the twenty-fifth embodiment. [Figure 45A] FIG. 45A is a three-view diagram of an introduction coupler according to a first aspect of the twenty-sixth embodiment. [Figure 45B] FIG. 45B is a three-view diagram of the introduction coupler of the second aspect of the twenty-sixth embodiment. [Figure 46] FIG. 46 is an explanatory perspective view of an example in which a cooling unit is housed between the housing and the front chassis. [Figure 47] FIG. 47 is a front view showing a case where a cooling unit is housed between the housing and the front chassis. [Figure 48] FIG. 48 is an external perspective view of a cooling unit with a liquid intrusion prevention wall member of the 27th embodiment attached thereto. [Figure 49] FIG. 49 is a diagram of the cooling unit with the liquid intrusion prevention wall member of the 27th embodiment attached, viewed from the inlet coupler and outlet coupler side. [Figure 50] FIG. 50 is a front view of a case in which a cooling unit is housed between the housing and the front chassis, and a liquid intrusion prevention wall member and a liquid intrusion prevention member according to the 27th embodiment are provided. [Figure 51] FIG. 51 is an explanatory diagram of the 28th embodiment. [Figure 52] FIG. 52 is a partially enlarged view of the housing of the twenty-ninth embodiment. [Figure 53] FIG. 53 is an explanatory diagram of a modified example of the twenty-ninth embodiment. [Figure 54] FIG. 54 is an explanatory diagram of the 30th embodiment. [Figure 55] FIG. 55 is an explanatory diagram of a first modified example of the 30th embodiment. [Figure 56] FIG. 56 is an explanatory diagram of a second modified example of the 30th embodiment. [Figure 57] FIG. 57 is an external perspective view of the cooling unit of the thirty-first embodiment. [Figure 58] FIG. 58 is an exploded perspective view of the cooling unit of the thirty-first embodiment. [Figure 59] FIG. 59 is an external perspective view of the cooling unit of the thirty-second embodiment. [Figure 60]FIG. 60 is an exploded perspective view of the cooling unit of the thirty-second embodiment. [Figure 61] FIG. 61 is an explanatory diagram of the assembled state. [Figure 62] FIG. 62 is an explanatory diagram of the process of fitting the sealing member into the cooling unit. [Figure 63] FIG. 63 is an exploded perspective view (part 1) of the cooling unit according to the thirty-third embodiment when assembled. [Figure 64] FIG. 64 is an exploded perspective view (part 2) of the cooling unit according to the thirty-third embodiment when assembled. [Figure 65] FIG. 65 is an exploded perspective view (part 3) of the cooling unit according to the thirty-third embodiment when assembled. [Figure 66] FIG. 66 is a completed perspective view of the cooling unit of the thirty-third embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0009] Next, the embodiment will be described in detail with reference to the drawings. FIG. 1 is a block diagram showing the outline of the configuration of a substrate cooling system according to an embodiment. The substrate cooling system SYS includes a cooling unit CU and a refrigerant cooling / circulation unit CCCU. In FIG. 1, the substrates SB1 and SB2, which are actually thermally (and mechanically) coupled to the cooling unit CU, are shown in a separated state for ease of understanding.

[0010] In this case, chips CP11 to CP15 to be cooled are mounted on the back side (lower surface in Figure 1) of the substrate SB1, and chips CP21 to CP24 to be cooled are mounted on the front side (upper surface in Figure 1) of the substrate SB2.

[0011] The cooling unit CU includes an inlet coupler CL1 into which liquid refrigerant supplied from the refrigerant cooling / circulation unit CCCU is introduced, an outlet coupler CL2 through which the cooled liquid refrigerant is discharged to the refrigerant cooling / circulation unit CCCU, and height adjustment parts (coupling position adjustment parts) AD11 to AD15 formed on the first surface SF1 side of the cooling unit CU.

[0012] In the above configuration, in actual use, the height adjustment units AD11 to AD15 are thermally coupled to the corresponding chips CP11 to CP15 to be cooled that are mounted on the substrate SB1, and cool the chips CP11 to CP15 by transferring the heat generated in the chips CP11 to CP15 to the cooling unit CU side and performing heat exchange. In this case, thermal coupling includes direct coupling (direct contact) as well as coupling via a thermally conductive material such as thermally conductive grease (the same applies hereinafter).

[0013] 1, height adjustment unit AD11 corresponds to chip CP11 mounted on substrate SB1, height adjustment unit AD12 corresponds to chip CP12, height adjustment unit AD13 corresponds to chip CP13, height adjustment unit AD14 corresponds to chip CP14, and height adjustment unit AD15 corresponds to chip CP15.

[0014] In the above explanation, we have described the case where height adjustment parts AD11 to AD15 are provided on chips CP11 to CP15, respectively, but if there is a chip that can be configured to be directly thermally coupled to the first surface SF1 of the cooling unit, it is also possible to configure the chip to be directly thermally coupled to the cooling unit CU.

[0015] Although not shown in FIG. 1, four height adjustment parts are also formed on the second surface SF2 side of the cooling unit CU in correspondence with the chips CP21 to CP24 to be cooled that are mounted on the substrate SB2.

[0016] Next, the outline of the operation of the substrate cooling system SYS shown in FIG. 1 will be described. The refrigerant cooling / circulation unit CCCU introduces cooled liquid refrigerant into the cooling unit CU via an inlet coupler CL1. As a result, the liquid refrigerant exchanges heat with the chips to be cooled via the height adjusting parts AD11 to AD15 and the height adjusting parts on the second surface SF2 side of the cooling unit CU, thereby cooling the chips to be cooled.

[0017] Furthermore, the liquid refrigerant after heat exchange returns to the refrigerant cooling / circulation unit CCCU via the outlet coupler CL2, where it is cooled and supplied to the inlet coupler CL1.

[0018] By repeating the above operation, the chips CP11 to CP15 to be cooled mounted on the board SB1 and the chips CP21 to CP24 to be cooled mounted on the board SB2 can operate in a cooled state, and can reliably perform the specified processing without causing a decrease in processing speed due to heat generation, thereby achieving the desired performance.

[0019] FIG. 2 is an exploded perspective view of an example of an in-vehicle device equipped with the cooling unit of the embodiment. The in-vehicle device 10 includes a top panel 11, a first board 12, a cooling unit 13, side chassis 14A, 14C, a side cover 14B, a central chassis 15, a second board 16, and a bottom panel 17.

[0020] The top panel 11 is made of, for example, pressed aluminum, and constitutes a part of the casing of the in-vehicle device 10. The first substrate 12 is a printed circuit board (PCB) on which a plurality of semiconductor chips to be cooled are mounted.

[0021] The cooling unit 13 has a liquid refrigerant flow path formed therein, and performs heat exchange with the semiconductor chips mounted on the first substrate 12 and the second substrate 16 to perform cooling. The side chassis 14A, 14C are formed of, for example, pressed aluminum material, and form part of the casing of the in-vehicle device 10. The side cover 14B is formed by two-color molding of resin and rubber, for example, and forms a part of the casing of the in-vehicle device 10.

[0022] The central chassis 15 is, for example, a die-cast aluminum component. The first board 12, the cooling unit 13, and the second board 16 are fixed to the central chassis 15, and the central chassis 15 supports the first board 12 and the second board 16 while maintaining the first board 12 and the second board 16 in a state where they are thermally coupled to the cooling unit 13.

[0023] Similar to the first substrate 12, the second substrate 16 is a printed circuit board (PCB) on which a plurality of semiconductor chips to be cooled are mounted. The bottom panel 17 is made of, for example, pressed aluminum, and forms a part of the casing of the in-vehicle device 10 .

[0024] Next, more specific embodiments will be described with reference to the drawings. [1] First embodiment FIG. 3 is an external perspective view of the cooling unit of the first embodiment. The cooling unit 13 includes a heat transfer member 21, a cooling unit body 22, an inlet coupler 23A, an outlet coupler 23B, a screw fastening portion 24A, and a stud 24B. The heat transfer member 21 is made of one metal plate, and is provided with height adjustment portions 21A1 and 21A2 corresponding to a plurality of semiconductor chips to be cooled.

[0025] In this case, the shape, height and planar shape of the height adjustment portions 21A1 and 21A2 are determined according to the planar shape and height of the semiconductor chip to be cooled and the mounting position of the semiconductor chip.

[0026] The cooling unit main body 22 has a liquid refrigerant flow path formed therein, and exchanges heat with the semiconductor chip to be cooled via the heat transfer member 21, thereby cooling the semiconductor chip.

[0027] The inlet coupler 23A is connected to a refrigerant cooling / circulation unit (not shown), and liquid refrigerant is introduced into the cooling unit main body 22 from the refrigerant cooling / circulation unit (not shown). The outlet coupler 23B is connected to a refrigerant cooling / circulation unit (not shown), and the liquid refrigerant after heat exchange is discharged to the refrigerant cooling / circulation unit (not shown).

[0028] The screw fastening portions 24A show a state in which screws are inserted into through holes provided in the cooling unit 13 and fastened. Therefore, when the cooling unit 13 is not fastened with screws, through holes are provided at positions corresponding to the screw fastening portions 24A. In FIG. 3, the screw fastening portions 24A are shown as being used to fasten the water cooling units together, but they do not necessarily function as screw fastening portions 24; it is also possible to provide positioning pins in the required number of through holes as needed. Studs 24B are also provided on both the upper and lower surfaces of the cooling unit 13, and the first substrate 12 and the second substrate 16 are fixed and supported by screws or the like while being spaced a predetermined distance apart.

[0029] Here, the internal structure of the cooling unit 13 will be described. FIG. 4 is a cross-sectional view taken along line AA in FIG. A liquid refrigerant flow path 31 is formed inside the cooling unit body 22 of the cooling unit 13, and fins (flow straightening plates) 32 for straightening the flow of the liquid refrigerant are arranged inside the liquid refrigerant flow path 31.

[0030] 4, the height adjustment portion 21A2 of the heat transfer member 21 is formed by drawing a metal plate-shaped member with a press, and has a convex cross section. As a result, a space is formed between the height adjustment portion 21A2 and the cooling unit main body 22.

[0031] As described above, according to the configuration of the first embodiment, the heat transfer member 21 is configured as a single member, and multiple height adjustment portions are formed according to the height of the semiconductor chip and the mounting position of the semiconductor chip, so that it is possible to efficiently cool the semiconductor chip without increasing the number of parts.

[0032] [2] Second embodiment FIG. 5 is a cross-sectional view illustrating the outline of a mounting state of the cooling unit according to the second embodiment. The heat transfer member 21 of the second embodiment is formed by forging.

[0033] The heat transfer member 21 formed by forging serves as a height adjustment part that is thermally coupled to the semiconductor chip, and unlike when the height adjustment part is formed between the cooling unit main body 22 and the member by drawing using a press, no gap due to an air layer is formed, which reduces thermal resistance and improves heat dissipation efficiency.

[0034] 5, for ease of understanding, the heat transfer member 21 is shown disposed only on the second surface 22SF2 of the cooling unit body 22. In FIG. The cooling unit 13 includes a heat transfer member 21 formed by forging and a cooling unit body 22.

[0035] In the example of FIG. 5, a semiconductor chip CP1 having a first height and a semiconductor chip CP2 having a second height higher than the first height are mounted on the surface of a substrate SB2. Therefore, the height of the height adjustment portion AD1 formed on the heat transfer member 21 is set lower than the height of the height adjustment portion AD2.

[0036] In addition, a thermally conductive material TGR such as thermally conductive grease is provided between the semiconductor chip CP1 and the height adjustment portion AD1 and between the semiconductor chip CP2 and the height adjustment portion AD2, thereby reducing thermal resistance and improving cooling efficiency compared to when the thermally conductive material TGR is not provided.

[0037] As a result, the heat generated by the operation of the semiconductor chips CP1 and CP2 is transmitted to the cooling unit main body 22 via the thermally conductive member TGR, the height adjustment member AD1 and the height adjustment member AD2, and is exchanged with the refrigerant flowing in the liquid refrigerant flow path 31 within the cooling unit main body 22. Therefore, the semiconductor chips CP1 and CP2 are cooled and can continue to operate normally.

[0038] [3] Third embodiment FIG. 6 is a schematic explanatory diagram of a mounting state of the cooling unit according to the third embodiment. FIG. 6A is a cross-sectional view illustrating the outline of the mounting state of the cooling unit according to the third embodiment. FIG. 6B is a plan view of the vicinity of the height adjustment unit AD21 as viewed from below in FIG. 6A. Incidentally, the heat transfer member 21 formed by forging, metal pressing, or casting is joined to the surface of the cooling unit body 22 (the second surface 22SF2 in the example of FIG. 6) by so-called brazing, and is thermally and physically coupled. The heat transfer member 21 may be formed by metal pressing or casting instead of forging. Also, instead of brazing, soldering may be used to thermally and physically join the heat transfer member 21.

[0039] 6, the surfaces of the heat transfer member 21 and the cooling unit main body 22 are joined together over a relatively large area, making brazing difficult and increasing the possibility of air bubbles being generated during brazing between the heat transfer member 21 and the cooling unit main body 22. This is also true when soldering is performed. In particular, since the portions where the height adjustment members AD1 and AD2 are provided are the contact surfaces for the semiconductor chips CP1 and CP2, if air bubbles occur at the interface between the heat transfer member 21 and the cooling unit main body 22, the presence of the air layer caused by the air bubbles will increase the thermal resistance and reduce the heat transfer coefficient, making it impossible to perform cooling efficiently. Therefore, it is particularly desirable to be able to remove air bubbles from the portions where the height adjusting members AD1 and AD2, which are convex portions, are provided.

[0040] Therefore, as shown in Figure 6(B), by providing multiple holes HL near the height adjustment member AD21 as a convex portion, air bubbles generated during brazing can escape through the holes HL, preventing the air bubbles from remaining between the heat transfer member 21 and the cooling unit main body 22, and surface tension acts to ensure uniform brazing (or soldering). Therefore, according to the third embodiment, it is possible to construct a substrate cooling system that does not reduce heat transfer efficiency.

[0041] [4] Fourth embodiment FIG. 7 is a cross-sectional view illustrating the outline of a mounting state of the cooling unit according to the fourth embodiment. In each of the above embodiments, a height adjustment portion is provided for all semiconductor chips to be cooled, but if the height of the semiconductor chips to be cooled is sufficiently high, it is also possible to provide an opening OHL as the height adjustment portion, penetrate the interior of the opening OHL, and thermally couple the opening OHL directly to the cooling unit main body 22 via the thermally conductive member TGR.

[0042] The heat transfer member 21 of the fourth embodiment is also formed by forging, metal pressing or casting, and therefore, unlike when a height adjustment portion is formed between the cooling unit main body 22 by drawing using a press, no gap is formed by an air layer, which reduces thermal resistance and improves heat dissipation efficiency. 7 also shows a case where the heat transfer member 21 is arranged only on the second surface 22SF2 of the cooling unit body 22 for ease of understanding.

[0043] The cooling unit 13 includes a heat transfer member 21 formed by forging and a cooling unit body 22. In the example of FIG. 7, a semiconductor chip CP1 having a first height and a semiconductor chip CP2 having a second height higher than the first height are mounted on the surface of a substrate SB2.

[0044] In this case, since the height of the semiconductor chip CP2 is relatively much higher than the height of the semiconductor chip CP1, the semiconductor chip CP2 is provided with an opening OHL instead of a protruding shape like the height adjustment portion AD1, and is configured to be thermally coupled directly to the second surface 22SF2 of the cooling unit main body 22 via a thermally conductive material TGR such as thermally conductive grease.

[0045] Therefore, compared to when protruding height adjusting portions are provided, it is possible to reliably reduce thermal resistance and improve cooling efficiency.

[0046] As a result, the heat generated by the operation of the semiconductor chips CP1 and CP2 is transferred to the cooling unit main body 22 via the thermally conductive member TGR and the height adjustment member AD1 for the semiconductor chip CP1, while the heat generated by the operation of the semiconductor chips CP2 is transferred to the cooling unit main body 22 only via the thermally conductive member TGR for the semiconductor chip CP2.

[0047] Therefore, the semiconductor chips CP1 and CP2 exchange heat with the refrigerant flowing in the liquid refrigerant flow path 31 in the cooling unit body 22, although the heat exchange efficiency is different between the semiconductor chips CP1 and CP2. As a result, the semiconductor chips CP1 and CP2 are cooled and can continue to operate normally.

[0048] As described above, this configuration can further reduce the thermal resistance of the heat conduction path, particularly for the semiconductor chip CP2 corresponding to the opening OHL, thereby improving the cooling effect. Furthermore, the weight of the heat transfer member 21 can be reduced, and the manufacturing cost can also be reduced.

[0049] [5] Fifth embodiment FIG. 8 is a cross-sectional view illustrating the outline of a mounting state of the cooling unit according to the fifth embodiment. In each of the above embodiments, the case where the planar shape of the heat transfer member 21 is substantially the same as that of the cooling unit main body 22 has been described. However, the fifth embodiment is an embodiment where, when the cooling unit 22 and the heat transfer member 21 are viewed in a plan view, for example, the area of ​​the heat transfer member 21 is larger than the area of ​​the cooling unit 22, and when Figure 8 is viewed from above, the stacked heat transfer member 21 is visible and not hidden by the cooling unit 22.

[0050] The heat transfer member 21 of the fifth embodiment is also formed by forging, metal pressing or casting, and therefore, unlike when a height adjustment portion is formed between the cooling unit main body 22 by drawing using a press, no gap is formed by an air layer, which reduces thermal resistance and improves heat dissipation efficiency. 8 also shows a case where the heat transfer member 21 is arranged only on the second surface 22SF2 of the cooling unit body 22 for ease of understanding.

[0051] The cooling unit 13 includes a heat transfer member 21 formed by forging and a cooling unit body 22. In the example of Figure 8, a semiconductor chip CP1 having a first height, a semiconductor chip CP2 having a second height higher than the first height, a semiconductor chip CP3 having a third height higher than the first height and lower than the second height, and a semiconductor chip CP4 having the same height as the first height are mounted on the surface of the substrate SB2.

[0052] In this case, the heat transfer member 21 includes a height adjustment portion AD1 having a height and protruding shape corresponding to the height of the semiconductor chip CP1, a height adjustment portion AD2 having a height and protruding shape corresponding to the height of the semiconductor chip CP2, a height adjustment portion AD3 having a height and protruding shape corresponding to the height of the semiconductor chip CP3, and a height adjustment portion AD4 having a height and protruding shape corresponding to the height of the semiconductor chip CP4.

[0053] Furthermore, the height adjustment section AD2 and the height adjustment section AD3, and thus the semiconductor chip CP2 and the semiconductor chip CP3, are arranged in a position facing the second surface 22SF2 of the cooling unit main body 22, and have the same positional relationship as in each of the above embodiments.

[0054] In contrast, the height adjustment portions AD1 and AD4, and in turn the semiconductor chips CP1 and CP4, are not provided at positions facing the second surface 22SF2 of the cooling unit body 22 except for parts thereof.

[0055] Therefore, although the thermal resistance of the heat transfer path corresponding to height adjustment unit AD1 and height adjustment unit AD4 is higher than that of height adjustment unit AD2 and height adjustment unit AD3, heat exchange is possible by heat transfer member 21.

[0056] Therefore, when adopting such a configuration, the cooling efficiency can be effectively set to the desired value by increasing the flow rate of the liquid refrigerant flowing through the liquid refrigerant flow path 31 of the cooling unit main body 22, or by configuring the semiconductor chips, such as the semiconductor chips CP1 and CP4, to be placed in locations with higher thermal resistance, so that the semiconductor chips that generate less heat are located therein.

[0057] Furthermore, according to this embodiment, the cooling unit body can be made smaller while increasing the actual placement area of ​​the cooling target, thereby reducing the construction cost of the entire cooling system, relaxing the installation conditions for the cooling unit body 22, and making it easier to construct a cooling system.

[0058] [6] Sixth embodiment FIG. 9 is a cross-sectional view illustrating the outline of a mounting state of the cooling unit according to the sixth embodiment. In each of the above embodiments, the height adjustment section was provided on the heat transfer member 21 that was mechanically supported on the side of the cooling unit main body 22, but the present sixth embodiment is an embodiment in which the heat transfer member is provided on the side of the substrate on which the semiconductor chip to be cooled is mounted.

[0059] The heat transfer member 21 of the sixth embodiment can also be formed by forging, but in the example of FIG. 9, a case will be described in which the height adjustment portion is formed by drawing using a press. 9 also shows a case where the heat transfer member 41 is arranged only on the second surface 22SF2 of the cooling unit body 22 for ease of understanding.

[0060] As shown in FIG. 9, the heat transfer member 41 is supported and fixed to the substrate SB2. A height adjustment portion AD31 corresponding to the height of the semiconductor chip CP1 is provided at a position of the heat transfer member 41 facing the semiconductor chip CP1, and is thermally coupled to the semiconductor chip CP1 via a thermally conductive member TGR such as thermally conductive grease.

[0061] Similarly, a height adjustment portion AD32 corresponding to the height of the semiconductor chip CP2 is provided at a position of the heat transfer member 41 facing the semiconductor chip CP2, and is thermally coupled to the semiconductor chip CP2 via the thermally conductive member TGR.

[0062] As a result, the heat generated by the operation of the semiconductor chips CP1 and CP2 is transmitted to the cooling unit main body 22 via the thermally conductive member TGR, height adjustment portion AD31 and height adjustment portion AD32, and is heat exchanged with the refrigerant flowing in the liquid refrigerant flow path 31 within the cooling unit main body 22. Therefore, the semiconductor chips CP1 and CP2 are cooled and can continue to operate normally.

[0063] FIG. 10 is a perspective view of the appearance of the heat transfer member of the sixth embodiment in a mounted state. In FIG. 10, it is assumed that four semiconductor chips CP1 to CP4 to be cooled are mounted on the board SB2.

[0064] In this case, the heat transfer member 41 is formed with four recesses (protrusions when viewed from the semiconductor chips CP1 to CP4 side) corresponding to the height adjustment portions AD31 to AD34. Therefore, the heat transfer member 41 covers the semiconductor chips CP1 to CP4 on the substrate SB2.

[0065] With this configuration, according to the sixth embodiment, by covering the substrate SB2 with the heat transfer member 41, it is possible to take measures against dew condensation. Furthermore, by grounding the heat transfer member 41, it is possible to ensure a large area of ​​grounding. Furthermore, by constructing the heat transfer member 41 from a conductive material such as an aluminum plate, grounding it, and surrounding the entire target circuit, electrical shielding is provided, making it easy to eliminate the effects of noise, etc., and achieving highly reliable circuit operation.

[0066] [7] Seventh embodiment In the above first to sixth embodiments, a configuration has been described in which a height adjustment section is provided on a heat transfer member separate from the cooling unit main body 22, but the seventh embodiment is an embodiment in which a height adjustment section is provided on the cooling unit.

[0067] FIG. 11 is a cross-sectional view illustrating the outline of a mounting state of the cooling unit according to the seventh embodiment. The cooling unit 13A of the seventh embodiment includes a first housing 13A1, a second housing 14A2, a liquid refrigerant flow path 31, and fins 32. The first housing 13A1 is formed by drawing a metal plate using a press machine to form a part of the liquid refrigerant flow path and the height adjustment portion AD41.

[0068] 11, the height adjustment unit AD41 is formed as a single member as the first housing 13A1 so as to have a height corresponding to a corresponding position based on the height and arrangement of the semiconductor chip CP1 mounted on the board SB1. The height adjustment unit AD41 is thermally coupled to the semiconductor chip CP1 via a thermally conductive member TGR such as thermally conductive grease.

[0069] Furthermore, the semiconductor chip CP2 mounted on the board SB1 is thermally coupled to the top surface (upper surface in FIG. 11) of the first housing 13A1 via a thermally conductive member TGR. In the example of Figure 11, only height adjustment unit AD41 is shown, but if multiple semiconductor chips to be cooled are mounted on substrate SB1, height adjustment units will be formed as a single member as first housing 13A1 at positions corresponding to each of them.

[0070] The second housing 13A2 is brazed to the first housing 13A1, and the two are integrated to form a liquid refrigerant flow path 31.

[0071] In the example of Figure 11, for ease of understanding, no height adjustment portion is formed on the second housing 13A2, but if there is a semiconductor chip to be cooled on the second substrate SB2 located below the second housing 13A2, a height adjustment portion may be formed at the corresponding position.

[0072] By configuring it in this manner, the semiconductor chips CP1 and CP2 are cooled by heat exchange via the thermally conductive material TGR by the refrigerant flowing through the liquid refrigerant flow path 31 from the back of the paper to the front, or from the front to the back, of the paper.

[0073] As described above, according to the configuration of the seventh embodiment, the first housing 13A1 of the cooling unit 13A is configured as a single member, and a height adjustment portion is formed according to the height of the semiconductor chip and the mounting position of the semiconductor chip, so that it is possible to efficiently cool the semiconductor chip without increasing the number of parts.

[0074] [8] Eighth embodiment FIG. 12 is a cross-sectional view illustrating the outline of a mounting state of the cooling unit according to the eighth embodiment. In FIG. 12, the same parts as those in the seventh embodiment in FIG. 11 are denoted by the same reference numerals.

[0075] The cooling unit 13A of the eighth embodiment includes a first housing 13A1, a second housing 13A2, a liquid refrigerant flow path 31, fins 32, second fins 33, and a spacer . The first housing 13A1 is formed by drawing a metal plate using a press machine to form a part of the liquid refrigerant flow path and the height adjustment portion AD41.

[0076] Here, the problem in the seventh embodiment will be explained. In the seventh embodiment, there was a gap from the upper surface of the height adjustment unit AD41 to the upper surface of the fins 32, so that as the vertical height increased, the flow straightening effect of the fins 32 decreased, which in turn could result in a decrease in heat exchange efficiency. Furthermore, as the refrigerant pressure increased, the height adjustment unit AD41 deformed, which could cause unnecessary stress on the semiconductor chip CP1 and lead to a decrease in reliability.

[0077] Therefore, in order to ensure pressure resistance and rectifying effect and improve the reliability of the cooling unit 13A, it is possible to consider providing a second fin 33 within the height adjustment section AD41. However, depending on the shapes of the fin 32 and the second fin 33, the peaks of the fins may overlap, making it impossible to maintain the shape of the height adjustment section AD41, and also reducing the rectifying effect and the heat exchange efficiency.

[0078] Therefore, in the eighth embodiment, as shown in FIG. 12(A), a plate-shaped spacer 34 is disposed between the fin 32 and the second fin 33, and the fin 32 and the second fin 33 are brazed to this spacer 34.

[0079] With this configuration, the peaks of the fins 32 and the second fins 33 do not overlap, the shape of the height adjusting portion AD41 can be maintained, the rectifying effect is maintained, and there is no decrease in heat exchange efficiency.

[0080] 12(A), the height adjustment unit AD41 is formed as a single member as the first housing 13A1 so as to have a height corresponding to a position based on the height and arrangement of the semiconductor chip CP1 mounted on the board SB1. The height adjustment unit AD41 is thermally coupled to the semiconductor chip CP1 via the thermally conductive member TGR.

[0081] Similarly, the semiconductor chip CP2 mounted on the substrate SB1 is thermally coupled to the top surface (upper surface in FIG. 12(A)) of the first housing 13A1 via a thermally conductive member TGR. In the example of Figure 12(A), only height adjustment unit AD41 is shown, but if multiple semiconductor chips to be cooled are mounted on substrate SB1, height adjustment units will be formed as a single member as first housing 13A1 at positions corresponding to each of them.

[0082] The second housing 13A2 is brazed to the first housing 13A1, and the two are integrated to form a liquid refrigerant flow path 31. In the example of Figure 12, for ease of understanding, no height adjustment portion is formed on the second housing 13A2, but if there is a semiconductor chip to be cooled on the second substrate SB2 located below the second housing 13A2, a height adjustment portion may be formed at the corresponding position.

[0083] FIG. 12(B) is a cross-sectional view taken along the line AA in FIG. 12(A). As shown in Figure 12(B), there is a predetermined gap between the front end (left end in Figure 12(B)) and rear end of the second fin 33 in the fin extension direction and the inner wall surface of the height adjustment section AD41, so that the liquid refrigerant flowing in from the rear end (right end in Figure 12(B)) of the fin 32 easily branches and, as shown by the thin arrows, is led to the rear end of the second fin 33, passes through the inside of the second fin 33, is rectified, is led out from the front end of the second fin 33, and then merges with the liquid refrigerant flowing inside the fin 32 again, flows smoothly, and performs heat exchange.

[0084] By configuring it in this manner, the semiconductor chips CP1 and CP2 are cooled by the refrigerant flowing through the liquid refrigerant flow path 31 from the back of the paper to the front or from the front to the back of the paper, through highly efficient heat exchange via the thermally conductive material TGR.

[0085] As described above, according to the configuration of the eighth embodiment, the first housing 13A1 of the cooling unit 13A is configured as a single member, and a height adjustment portion AD41 is formed according to the height of the semiconductor chip and the mounting position of the semiconductor chip, so that the semiconductor chip can be cooled efficiently without increasing the number of parts.

[0086] Furthermore, a plate-shaped spacer 34 is placed between the fin 32 and the second fin 33 and brazed thereto, so that the peaks of the fin 32 and the second fin 33 do not overlap, the shape of the height adjustment section AD41 can be maintained, the straightening effect is also maintained, and the heat exchange efficiency is not reduced.

[0087] [9] Ninth embodiment FIG. 13 is a cross-sectional view illustrating the outline of a mounting state of the cooling unit according to the ninth embodiment. In the above-described eighth embodiment, a plate-shaped spacer 34 is placed between the fin 32 and the second fin 33 and brazed to the fin 32 so that the fin 32 and the second fin 33 overlap and do not obstruct the flow of the refrigerant. However, the need to braze the fin 32 and the second fin 33 increases the number of manufacturing steps.

[0088] Therefore, in this ninth embodiment, a cooling unit is provided that simplifies the manufacturing process by changing the shape of the spacer, while preventing the peaks of the fin 32 and the second fin 33 from overlapping, and can maintain the shape of the height adjustment section AD41.

[0089] In FIG. 13, the same parts as those in the seventh embodiment in FIG. 11 are denoted by the same reference numerals. The cooling unit 13A of the ninth embodiment includes a first housing 13A1, a second housing 13A2, a liquid refrigerant flow path 31, fins 32, second fins 33, and a spacer 34A.

[0090] In the ninth embodiment, as shown in FIG. 13(A), a plate-shaped spacer 34A is arranged between the fin 32 and the second fin 33, and the folded portion 34A1 of the spacer 34A, which is triangular in front view, is arranged to fit into the valley portion of the fin 32.

[0091] With this configuration, the side edges of the bent portion 34A1 come into contact with the fin 32, and as shown in Figure 13(A), the raised portions at the left and right ends of the spacer 34A do not abut against the side walls of the height adjustment portion AD41 and rise up, and the spacer 34A remains fixed in place. As a result, the relative positions of the fins 32 and the second fins 33 are fixed, the peaks of the fins 32 and the second fins 33 do not overlap, the shape of the height adjustment section AD41 can be maintained, the straightening effect is also maintained, and the heat exchange efficiency is not reduced.

[0092] 13(A), the height adjustment unit AD41 is formed as a single member as the first housing 13A1 so as to have a height corresponding to a position based on the height and arrangement of the semiconductor chip CP1 mounted on the board SB1. The height adjustment unit AD41 is thermally coupled to the semiconductor chip CP1 via the thermally conductive member TGR.

[0093] Similarly, the semiconductor chip CP2 mounted on the substrate SB1 is thermally coupled to the top surface (upper surface in FIG. 13(A)) of the first housing 13A1 via a thermally conductive member TGR. In the example of Figure 13(A), only height adjustment unit AD41 is shown, but if multiple semiconductor chips to be cooled are mounted on substrate SB1, height adjustment units will be formed as a single member as first housing 13A1 at positions corresponding to each of them.

[0094] The second housing 13A2 is brazed to the first housing 13A1, and the two are integrated to form a liquid refrigerant flow path 31. In the example of Figure 13(A), for ease of understanding, no height adjustment portion is formed on the second housing 13A2, but if there is a semiconductor chip to be cooled on the second substrate SB2 located below the second housing 13A2, a height adjustment portion may be formed at the corresponding position.

[0095] FIG. 13(B) is a cross-sectional view taken along the line AA in FIG. 13(A). As shown in Figure 13(B), there is a predetermined gap between the front end (left end in Figure 13(B)) and rear end of the second fin 33 in the fin extension direction and the inner wall surface of the height adjustment section AD41, so that the liquid refrigerant flowing in from the rear end (right end in Figure 13(B)) of the fin 32 is guided by the bending section 34A1 and easily branches, and as shown by the thin arrows, is led to the rear end of the second fin 33, passes through the inside of the second fin 33, is rectified, is discharged from the front end of the second fin 33, and merges with the liquid refrigerant flowing inside the fin 32 again to flow smoothly and perform heat exchange.

[0096] By configuring it in this manner, the semiconductor chips CP1 and CP2 are cooled by the refrigerant flowing through the liquid refrigerant flow path 31 from the back of the paper to the front or from the front to the back of the paper, through highly efficient heat exchange via the thermally conductive material TGR.

[0097] As described above, according to the configuration of the ninth embodiment, the first housing 13A1 of the cooling unit 13A is configured as a single member, and a height adjustment portion AD41 is formed according to the height of the semiconductor chip and the mounting position of the semiconductor chip, so that the semiconductor chip can be cooled efficiently without increasing the number of parts.

[0098] Furthermore, a plate-shaped spacer 34 is placed between the fin 32 and the second fin 33 and brazed thereto, so that the peaks of the fin 32 and the second fin 33 do not overlap, the shape of the height adjustment section AD41 can be maintained, the straightening effect is also maintained, and the heat exchange efficiency is not reduced.

[0099]

[10] Tenth embodiment FIG. 14 is a cross-sectional view illustrating the outline of a mounting state of the cooling unit according to the tenth embodiment. In the tenth embodiment, as in the ninth embodiment, a cooling unit is provided in which the manufacturing process is simplified by changing the shape of the spacer, while the peaks of the fin 32 and the second fin 33 do not overlap, and the shape of the height adjustment portion AD41 is maintained.

[0100] In FIG. 14, the same parts as those in the seventh embodiment in FIG. 11 are denoted by the same reference numerals. The cooling unit 13A of the tenth embodiment includes a first housing 13A1, a second housing 13A2, a liquid refrigerant flow path 31, fins 32, second fins 33, and a spacer 34B.

[0101] In the tenth embodiment, as shown in Figure 14(A), a plate-shaped spacer 34B is arranged between the fin 32 and the second fin 33, and the bent protrusions 34B1 of the spacer 34B at four locations as shown in Figure 14(B) abut against the side walls of the height adjustment portion AD41, so that the spacer 34B does not float up and is fixed in place.

[0102] As a result, the relative positions of the fins 32 and the second fins 33 are fixed, the peaks of the fins 32 and the second fins 33 do not overlap, the shape of the height adjustment section AD41 can be maintained, the straightening effect is also maintained, and the heat exchange efficiency is not reduced.

[0103] In the example of Figure 14(A), for ease of understanding, no height adjustment portion is formed on the second housing 13A2, but if there is a semiconductor chip to be cooled on the second substrate SB2 located below the second housing 13A2, a height adjustment portion may be formed at the corresponding position.

[0104] As described above, according to the configuration of the tenth embodiment, the first housing 13A1 of the cooling unit 13A is configured as a single member, and a height adjustment portion AD41 is formed according to the height of the semiconductor chip and the mounting position of the semiconductor chip, so that the semiconductor chip can be cooled efficiently without increasing the number of parts.

[0105] Furthermore, since a plate-shaped spacer 34B is placed between the fin 32 and the second fin 33, the peaks of the fin 32 and the second fin 33 do not overlap, the shape of the height adjustment section AD41 can be maintained, the straightening effect is also maintained, and the heat exchange efficiency is not reduced.

[0106]

[11] Eleventh embodiment FIG. 15 is a schematic explanatory cross-sectional view of a mounting state of the cooling unit of the eleventh embodiment. In the above eighth to tenth embodiments, the configuration was provided with a second fin 33 and spacers 34, 34A, and 34B, but in this eleventh embodiment, instead, an extrusion fin 35 with a bottom plate is provided.

[0107] According to the present eleventh embodiment, the first housing 13A1 of the cooling unit 13A is constructed as a single member, and a height adjustment portion AD41 is formed according to the height of the semiconductor chip and the mounting position of the semiconductor chip, so that the semiconductor chip can be cooled efficiently without increasing the number of parts. Furthermore, since there is no need to provide a second fin, the manufacturing process can be simplified, the shape of the height adjustment portion AD41 can be maintained, the flow straightening effect can be maintained, and there is no decrease in heat exchange efficiency.

[0108]

[12] Twelfth embodiment FIG. 16 is a cross-sectional view illustrating the outline of a mounting state of a cooling unit according to the twelfth embodiment. In the eleventh embodiment, the extrusion fins 35 with bottom plates are provided in place of the second fins and spacers, but in this embodiment, a block-shaped member 36 having thermal conductivity is provided instead.

[0109] According to the present eleventh embodiment, the first housing 13A1 of the cooling unit 13A is constructed as a single member, and has a height adjustment portion AD41 supported from the inside by a block-shaped member 36 having thermal conductivity according to the height of the semiconductor chip and the mounting position of the semiconductor chip, so that the semiconductor chip can be cooled efficiently without increasing the number of parts.

[0110] Furthermore, since there is no need to provide a second fin, the manufacturing process can be simplified, the shape of the height adjustment portion AD41 can be maintained, and the heat exchange efficiency will not decrease.

[0111]

[13] Thirteenth embodiment FIG. 17 is a schematic explanatory diagram of a mounting state of the cooling unit according to the thirteenth embodiment. In the above eighth to twelfth embodiments, the height adjustment part AD41 was provided as a single component in the first housing 13A1 of the cooling unit 13A, but in this embodiment, a cylindrical burring part is formed in the first housing 13A1, and a thermally conductive disk-shaped block member serving as the height adjustment part AD51, as shown in Figure 17(A), is fitted into this burring part and brazed.

[0112] By configuring it in this manner, the semiconductor chip CP1 is cooled by the refrigerant flowing through the liquid refrigerant flow path 31 from the back of the paper to the front or from the front to the back of the paper, through highly efficient heat exchange via the disk-shaped block member AD51 and the thermally conductive member TGR. Similarly, the semiconductor chip CP2 is cooled by highly efficient heat exchange via the thermally conductive member TGR.

[0113] As described above, according to the configuration of the thirteenth embodiment, the burring portion of the first housing 13A1 of the cooling unit 13A is provided with a disk-shaped block member AD51 that constitutes a height adjustment portion, so that the semiconductor chips can be cooled efficiently without significantly increasing the number of parts.

[0114]

[14] Fourteenth embodiment FIG. 18 is a schematic explanatory diagram of a mounting state of the cooling unit according to the fourteenth embodiment. In the above eighth to twelfth embodiments, the height adjustment part AD41 was provided as a single component in the first housing 13A1 of the cooling unit 13A, but in this embodiment, a burring part BR having a diameter that decreases toward the top is formed in the first housing 13A1, and a thermally conductive truncated cone-shaped block member serving as the height adjustment part AD52, as shown in Figure 18, is fitted into this burring part BR from the underside of the first housing 13A1 and brazed.

[0115] By configuring it in this manner, the semiconductor chip CP1 is cooled by the refrigerant flowing through the liquid refrigerant flow path 31 from the back of the paper to the front or from the front to the back of the paper, through highly efficient heat exchange via the truncated cone-shaped block member AD51 and the thermally conductive member TGR. Similarly, the semiconductor chip CP2 is cooled by highly efficient heat exchange via the thermally conductive member TGR.

[0116] As described above, according to the configuration of the 14th embodiment, the burring portion BR of the first housing 13A1 of the cooling unit 13A is provided with a truncated cone-shaped block member AD52 that constitutes a height adjustment portion, so that the semiconductor chip can be cooled efficiently without significantly increasing the number of parts.

[0117]

[15] Fifteenth embodiment FIG. 19 is a cross-sectional view illustrating the outline of a mounting state of a cooling unit according to the fifteenth embodiment. In FIG. 19, the same parts as those in the seventh embodiment in FIG. 11 are denoted by the same reference numerals.

[0118] In the above eighth to tenth embodiments, no mention was made of the types of fins 32 and second fins 33, but in the present fifteenth embodiment, the shape of the fins is specified so that when a fin and a second fin are stacked and arranged, the second fin does not get stuck inside the fin.

[0119] The cooling unit 13A of the fifteenth embodiment includes a first housing 13A1, a second housing 13A2, a liquid refrigerant flow path 31, straight fins 32S, and wave fins 33W. The first housing 13A1 is formed by drawing a metal plate using a press machine to form a part of the liquid refrigerant flow path and the height adjustment portion AD41.

[0120] In the fifteenth embodiment, a combination of fins is selected that has a shape such that the peaks or valleys of the fins do not overlap even when stacked. More specifically, in the example of FIG. 19, wave fins 33W having zigzag wave shapes are stacked on straight fins 32S having straight shapes within the height adjustment section AD41.

[0121] 19, the height adjustment unit AD41 is formed as a single member as the first housing 13A1 so as to have a height corresponding to a corresponding position based on the height and arrangement of the semiconductor chip CP1 mounted on the board SB1. The height adjustment unit AD41 is thermally coupled to the semiconductor chip CP1 via the thermally conductive member TGR.

[0122] Similarly, the semiconductor chip CP2 mounted on the board SB1 is thermally coupled to the top surface (upper surface in FIG. 19) of the first housing 13A1 via a thermally conductive member TGR. In the example of Figure 19, only height adjustment unit AD41 is shown, but if multiple semiconductor chips to be cooled are mounted on substrate SB1, height adjustment units will be formed as a single member as first housing 13A1 at positions corresponding to each of them.

[0123] The second housing 13A2 is brazed to the first housing 13A1, and the two are integrated to form a liquid refrigerant flow path 31. In the example of Figure 19, for ease of understanding, no height adjustment portion is formed on the second housing 13A2, but if there is a semiconductor chip to be cooled on the second substrate SB2 located below the second housing 13A2, a height adjustment portion may be formed at the corresponding position.

[0124] As described above, according to the configuration of the 15th embodiment, the peaks or valleys of the straight fins 32S and the wave fins 33W do not overlap with each other, and the shape of the height adjustment section AD41 can be maintained, while the straightening effect is also maintained, and there is no decrease in heat exchange efficiency.

[0125] In the above explanation, a combination of straight fins and wave fins has been described as a combination of fin shapes that does not cause the peaks or valleys of the fins to overlap when stacked. However, other combinations such as the following are also applicable.

[0126] (1) A combination of wave fins and offset fins. Here, the offset fins refer to fins in which short straight fins are sequentially offset in a direction intersecting the flow direction of the liquid refrigerant. (2) A combination of straight fins and offset fins. (3) A combination of offset fins and offset fins.

[0127]

[16] Sixteenth embodiment FIG. 20 is a cross-sectional view illustrating the outline of a mounting state of the cooling unit according to the sixteenth embodiment. In FIG. 20, the same parts as those in the seventh embodiment in FIG. 11 are denoted by the same reference numerals.

[0128] In the sixteenth embodiment, the height adjustment portion AD61 is formed by pressing a thermally conductive metal thick plate with a press machine, leaving a portion where a convex portion is to be formed.

[0129] Specifically, a heat-conductive metal thick plate AD60 shown in FIG. 20(A) is pressed by a press machine, leaving a portion where the protrusion will actually be formed, to form the height adjusting member AD61.

[0130] FIG. 20C is a cross-sectional view illustrating the outline of the mounting state of the cooling unit of the sixteenth embodiment. According to the 16th embodiment, even if the combination of the first housing 13D1 and the second housing 13D2 of the cooling unit 13D is the same (completely shared) or only one is the same (partially shared), or even if the combination is completely different, by standardizing the shape of the joining surfaces of the cooling unit and the height adjustment member (the shapes do not have to be exactly the same, but a shape that allows for sufficient thermal coupling), even if various cooling units are used, by forming the height adjustment member AD61 to match the mounting position and height of the semiconductor chip on the board SB1, it can be made to accommodate various boards, and the semiconductor chip can be cooled efficiently without increasing the number of parts.

[0131] Furthermore, since it is only necessary to form a height adjusting member corresponding to the board for the common combination of first housing 13D1 and second housing 13D2, the manufacturing process can be simplified.

[0132]

[17] Seventeenth embodiment FIG. 21 is a three-view diagram of the cooling unit of the seventeenth embodiment. Figure 21(A) is a front view of the cooling unit 13F of the 17th embodiment, Figure 21(B) is a (right) side view of the cooling unit 13F of the 17th embodiment, and Figure 21(C) is a rear view of the cooling unit 13F of the 17th embodiment. The cooling unit 13F includes heat transfer members 51F and 51B, a cooling unit body 52, an inlet coupler 53A, an outlet coupler 53B, a screw fastening portion 54A, a stud 54B, and inner flow path convex portions 55A to 55D. Heat transfer members 51F and 51B are each made of a single metal plate, and in the example of Fig. 21, heat transfer member 51B is provided with height adjustment portion 51B1 corresponding to the semiconductor chip to be cooled. Note that the height adjustment portion is provided as needed, and one or more height adjustment portions can be provided in heat transfer member 51F or heat transfer member 51B.

[0133] In this case, the shape, height and planar shape of the height adjusting portion 51B1 are determined according to the planar shape and height of the semiconductor chip to be cooled and the mounting position of the semiconductor chip.

[0134] The cooling unit main body 52 has a liquid refrigerant flow path formed therein, and exchanges heat with the semiconductor chips to be cooled via the heat transfer members 51F and 51B, thereby cooling the semiconductor chips.

[0135] The inlet coupler 53A is connected to a refrigerant cooling / circulation unit (not shown), and liquid refrigerant is introduced into the cooling unit main body 52 from the refrigerant cooling / circulation unit (not shown). The outlet coupler 53B is connected to a refrigerant cooling / circulation unit (not shown), and the liquid refrigerant after heat exchange is discharged to the refrigerant cooling / circulation unit (not shown).

[0136] The screw fastening portions 54A are configured as through holes, into which screws are inserted for fastening. In Fig. 21, the screw fastening portions 54A are shown as being used to fasten the water cooling units together, but they do not necessarily function as screw fastening portions 54A, and it is also possible to configure the necessary number of through holes to have positioning pins provided as needed. The studs 24B are provided on both the heat transfer members 51F and 51B, and the corresponding substrates (not shown) are fixed and supported at a predetermined distance.

[0137] Here, the internal structure of the cooling unit 13F will be described. FIG. 22 is a partially exploded perspective view (part 1) of the cooling unit of the seventeenth embodiment. FIG. 23 is a partially exploded perspective view (part 2) of the cooling unit of the seventeenth embodiment. A liquid refrigerant flow path 61 is formed inside the cooling unit main body 52 of the cooling unit 13F, and two fins (straightening plates) 62A and 63B are arranged inside the liquid refrigerant flow path 61, which has a U-shape when viewed in a plane, to straighten the flow of the liquid refrigerant.

[0138] Furthermore, the cooling unit main body 52 includes a first cooling unit main body portion 52F having an inlet coupler 53A and an outlet coupler 53B, and a second cooling unit main body portion 52B arranged opposite the first cooling unit main body portion 52F and cooperating to form a liquid refrigerant flow path 61. Here, the first cooling unit main body 52F and the second cooling unit main body 52B are joined by brazing, welding, or the like.

[0139] The first cooling unit main body 52F has an intra-flow path convex portion 55A having an elliptical track shape in a plan view that protrudes into the liquid refrigerant flow path 61, and is provided near the inlet coupler 53A so as to extend in the X-axis direction in Figure 22. Similarly, the first cooling unit main body 52F has an in-flow path convex portion 55B, which is shaped like an elliptical track in a plan view and protrudes into the liquid refrigerant flow path 61, near the outlet coupler 53B, extending in the X-axis direction in Figure 22.

[0140] The second cooling unit main body 52B is arranged to extend in the X-axis direction in Figure 22 near the position where the flow path convex portion 55C, which has an elliptical track shape in a plan view and protrudes into the liquid refrigerant flow path 61, partially faces the inlet coupler 53A.

[0141] Similarly, the second cooling unit main body 52B is arranged so as to extend in the X-axis direction in Figure 22 near a position where a convex portion 55D in the flow path, which has an elliptical track shape in a plan view and protrudes into the liquid refrigerant flow path 61, partially faces the outlet coupler 53B.

[0142] In the above configuration, the lengths of the inner flow path convex portion 55A and the inner flow path convex portion 55B in the X-axis direction are the same, and the lengths of the inner flow path convex portion 55C and the inner flow path convex portion 55D in the X-axis direction are the same. Furthermore, the length in the X-axis direction of the intra-flow path convex portion 55C and the intra-flow path convex portion 55D is longer than the length in the X-axis direction of the intra-flow path convex portion 55A and the intra-flow path convex portion 55B.

[0143] FIG. 24 is an enlarged perspective view of a part of a cross section of the cooling unit of the seventeenth embodiment. As shown in FIG. 24, the inner flow path convex portion 55A and the inner flow path convex portion 55C are joined at their opposing surfaces by brazing, welding, or the like to form a joint portion 57. Similarly, the inner flow path convex portion 55B and the inner flow path convex portion 55D are joined at their opposing surfaces by welding or the like to form a joint portion.

[0144] The reason for joining the convex portion 55A in the flow path to the convex portion 55C in the flow path and the convex portion 55B in the flow path to the convex portion 55D in this manner is to ensure the strength of the first cooling unit main body portion 52F and the second cooling unit main body portion 52B and to prevent the cooling unit main body 52 from deforming due to the liquid refrigerant pressure.

[0145] FIG. 25 is an explanatory diagram of the flow of liquid refrigerant in the cooling unit of the seventeenth embodiment. As a result, when liquid refrigerant is introduced into the liquid refrigerant flow path 61 from the inlet coupler 53A, the flow of the liquid refrigerant is diffused as shown by the arrows in FIG. 25, and spreads more uniformly in the width direction of the fin 62A, i.e., in the Y-axis direction in FIG. 22, thereby making the flow velocity of the liquid refrigerant uniform and improving heat exchange efficiency. Furthermore, when the liquid refrigerant is discharged from the liquid refrigerant flow path 61 to the discharge coupler 53B, a vortex is generated to discharge the liquid refrigerant more quickly, thereby suppressing an increase in flow path resistance.

[0146] In the above description, the inner flow path convex portions 55A to 55D have a track shape in plan view, but the shape of the inner flow path convex portions is not limited to this. In the above description, the length of intra-flow path convex portion 55C and intra-flow path convex portion 55D is longer than the length of intra-flow path convex portion 55A and intra-flow path convex portion 55B, but they may be the same length.

[0147] A more specific explanation will be given below. FIG. 26 is an explanatory diagram (part 1) of another example of the shape of the convex portion in the flow channel. For ease of understanding, FIG. 26 shows only the convex portions in the flow paths formed on the fins 62A side of the second cooling unit main body 52B.

[0148] FIG. 26(A) is a plan view of an inner flow path convex portion 55F as another example of shape. The intra-flow path convex portion 55F has a triangular shape in plan view, is provided to protrude into the liquid refrigerant flow path 61, and is disposed so that one vertex faces the upstream side. As a result, the liquid refrigerant introduced from inlet coupler 53A (not shown) is diffused by inner convex portion 55F of the flow path and directed toward fins 62A.

[0149] In this case, the convex portion in the flow path protruding toward the first cooling unit main body 52A side may have the same shape as the convex portion in the flow path 55F, that is, may be long in the X-axis direction or short in the X-axis direction as shown in Fig. 22. The point is that it may be formed so as to achieve the desired diffusion state. Even in this case, the inner convex portion 55F of the flow path and the inner convex portion of the flow path protruding toward the first cooling unit main body portion 52A are joined by brazing, welding, etc., thereby ensuring strength and suppressing deformation of the cooling unit main body 52.

[0150] FIG. 26(B) is a plan view of an inner flow path convex portion 55G as another example of shape. The intra-flow path convex portion 55G has a rounded triangular shape in plan view, is provided to protrude into the liquid refrigerant flow path 61, and is disposed so that one vertex faces the upstream side. FIG. 27 is an explanatory diagram of the flow of liquid refrigerant on the inlet side. As a result, as shown by the arrows in FIG. 27(A), the liquid refrigerant introduced from inlet coupler 53A is diffused along inner flow path convex portion 55G and directed toward fins 62A.

[0151] In this case, the convex portion in the flow path protruding toward the first cooling unit main body 52A side may have the same shape as the convex portion in the flow path 55G, that is, may be long in the X-axis direction or short in the X-axis direction as shown in Fig. 22. The point is that it may be formed so as to achieve the desired diffusion state. In this case as well, the inner flow path convex portion 55G and the inner flow path convex portion protruding toward the first cooling unit main body portion 52A are joined by brazing, welding, or the like.

[0152] FIG. 26(C) is a plan view of an inner flow path convex portion 55H as another example of shape. The intra-flow path convex portion 55H has an oval shape in a plan view, is provided to protrude into the liquid refrigerant flow path 61, and is disposed such that the longitudinal direction thereof runs from the upstream side to the downstream side. As a result, as shown by the arrows in FIG. 27(B), the liquid refrigerant introduced from inlet coupler 53A is diffused by channel inner convex portion 55H, and some of the liquid refrigerant recombines and flows toward fins 62A.

[0153] In this case, the convex portion in the flow path protruding toward the first cooling unit main body 52A side may have the same shape as the convex portion in the flow path 55H, that is, may be long in the X-axis direction or short in the X-axis direction as shown in Fig. 22. The point is that it may be formed so as to achieve the desired diffusion state. In these cases, the inner flow path convex portion 55H and the inner flow path convex portion protruding toward the first cooling unit main body portion 52A are joined by brazing, welding, or the like.

[0154] FIG. 26(D) is a plan view of an inner flow path convex portion 55J as another example of shape. The intra-flow path convex portion 55J has a rounded diamond shape in plan view, protruding into the liquid refrigerant flow path 61, and is disposed so that one vertex in the longitudinal direction faces the upstream side. As a result, as shown by the arrows in FIG. 27(C), the liquid refrigerant introduced from inlet coupler 53A is diffused by channel inner convex portion 55J, and some of the liquid refrigerant rejoins and flows toward fins 62A.

[0155] In this case, the convex portion in the flow path protruding toward the first cooling unit main body 52A side may have the same shape as the convex portion in the flow path 55J, and may be elongated in the X-axis direction as shown in Fig. 22, or conversely, may be short in the X-axis direction. The point is that it may be formed so as to achieve the desired diffusion state. In these cases, the inner flow path convex portion 55J and the inner flow path convex portion protruding toward the first cooling unit main body portion 52A are joined by brazing, welding, or the like.

[0156] FIG. 28 is an explanatory diagram of the flow of liquid refrigerant on the outlet side. FIG. 28(A) is an explanatory diagram of a case where the distribution of the liquid refrigerant flow is uneven on the outlet side. If there is a bias in the distribution of the liquid refrigerant flow, as shown in Figure 28(A), a vortex will be generated in the liquid refrigerant discharged from the discharge coupler 53B, reducing the effective discharge speed and ultimately reducing the heat exchange efficiency.

[0157] FIG. 28(B) is an explanatory diagram of a case where, when there is a bias in the distribution of the liquid refrigerant flow on the outlet side, the installation position of the convex portion in the flow path is shifted to suppress the bias in the distribution of the liquid refrigerant flow.

[0158] If there is a bias in the distribution of the liquid refrigerant flow, as shown in Figure 28(B), for example, by arranging the convex portion in the flow path (in the example of Figure 28(B), convex portion in the flow path 55J) on the side where more liquid refrigerant is flowing (the right side in Figure 28(B)) rather than in the center of the liquid refrigerant flow path 61 (indicated by the dashed dotted line CL in Figure 28(B)), the distribution of the liquid refrigerant flow will be made uniform, and the liquid refrigerant will be smoothly discharged without generating vortices in the liquid refrigerant discharged from the discharge coupler 53B.

[0159] As a result, it is possible to suppress a decrease in the effective discharge speed, and in turn, to maintain the heat exchange efficiency at a predetermined value.

[0160] FIG. 29 is an explanatory diagram (part 2) of another example of the shape of the convex portion in the flow channel. For ease of understanding, FIG. 29 also shows only the convex portions in the flow paths formed on the fins 62A side of the second cooling unit main body 52B. The convex portion in the flow path in FIG. 29 differs from the convex portion in the flow path in FIG. 26 in that a plurality of convex portions are combined to form the convex portion in the flow path.

[0161] FIG. 29(A) is a plan view of an inner flow path convex portion 55K as another shape example. The intra-flow path convex portion 55K is arranged so that a pair of rod-shaped projections protruding into the liquid refrigerant flow path 61 form an inverted V shape and face the upstream side. As a result, when the liquid refrigerant introduced from the inlet coupler 53A (not shown) passes near the inner convex portion 55K of the flow path, the flow path resistance gradually decreases, and the refrigerant is diffused and directed toward the fins 62A.

[0162] In this case, the convex portion in the flow path protruding toward the first cooling unit main body 52A side may have the same shape as the convex portion in the flow path 55F, that is, may be long in the X-axis direction or short in the X-axis direction as shown in Fig. 22. The point is that it may be formed so as to achieve the desired diffusion state. Even in this case, the inner convex portion 55F of the flow path and the inner convex portion of the flow path protruding toward the first cooling unit main body portion 52A are joined by brazing, welding, etc., thereby ensuring strength and suppressing deformation of the cooling unit main body 52.

[0163] FIG. 29(B) is a plan view of an inner flow path convex portion 55L as another shape example. The intra-flow path convex portion 55L is formed by multiple cylindrical pins protruding into the liquid refrigerant flow path 61, which are arranged in a triangular shape in a plan view, with one vertex of the triangle facing upstream. As a result, the liquid refrigerant introduced from inlet coupler 53A (not shown) is gradually diffused by the multiple pins that form inner flow path convex portion 55L, and directed toward fins 62A.

[0164] In this case, the convex portion in the flow path protruding toward the first cooling unit main body 52A side may have the same shape as the convex portion in the flow path 55L, or may have a shape in which the diameter of each pin is increased or decreased as shown in Fig. 22. In short, it is sufficient that the shape is such that the desired diffusion state is achieved. In this case as well, the inner flow path convex portion 55L and the inner flow path convex portion protruding toward the first cooling unit main body portion 52A side are joined by brazing, welding, or the like.

[0165] As described above, according to the seventeenth embodiment, it is possible to suppress a decrease in the effective liquid refrigerant discharge speed, and thus to maintain the heat exchange efficiency at a predetermined value, thereby enabling an improvement in the component mounting density or miniaturization of the device. Furthermore, variations in heat exchange efficiency (heat dissipation efficiency) due to variations in flow velocity at different locations within the liquid refrigerant flow path can be suppressed, thereby achieving uniform and highly efficient cooling efficiency.

[0166] Furthermore, by joining the convex portion within the flow path protruding toward the first cooling unit main body portion 52A side and the convex portion within the flow path protruding toward the second cooling unit main body portion 52B side by brazing, welding, etc., it is possible to improve mechanical strength, increase resistance to liquid refrigerant pressure, suppress deformation of the cooling unit main body portion, and suppress the application of unnecessary stress to the components to be cooled.

[0167] Furthermore, pressure loss can be reduced and the output of pumps for circulating the liquid refrigerant can be kept low, which allows for reduced power consumption and downsizing of the equipment.

[0168] In the above explanation, the configuration is such that convex portions of the same shape are provided in the flow path on the inlet side of the liquid refrigerant (the inlet coupler 53A side) and the outlet side of the liquid refrigerant (the outlet coupler 53B side). However, it is possible to provide a convex portion in the flow path on the inlet side of the liquid refrigerant that has a shape that prioritizes suppressing variations in flow speed depending on the location in the liquid refrigerant flow path and achieving uniformity, and a convex portion in the flow path on the outlet side of the liquid refrigerant that can ensure strength to suppress deformation of the cooling unit main body, reduce thickness loss, and prioritize maintaining a high outlet speed.

[0169] If there is no problem in terms of the refrigerant pressure or the strength of the cooling unit body (pressure resistance performance when pressurized or negative pressure is applied), it is also possible to configure the outlet side without providing a convex portion in the flow path.

[0170]

[18] Eighteenth embodiment FIG. 30 is an explanatory view of the inside of the cooling unit of the eighteenth embodiment. The cooling unit 13G includes a cooling unit main body 71, an inlet coupler 72A, an outlet coupler 72B, a screw fastening portion 73, and convex portions 74A and 74B in the flow path.

[0171] The inlet coupler 72A is connected to a refrigerant cooling / circulation unit (not shown), and liquid refrigerant is introduced into the cooling unit main body 71 from the refrigerant cooling / circulation unit (not shown). The outlet coupler 72B is connected to a refrigerant cooling / circulation unit (not shown), and the liquid refrigerant after heat exchange is discharged to the refrigerant cooling / circulation unit (not shown).

[0172] The screw fastening portions 73A are configured as through holes, into which screws are inserted for fastening. In Fig. 30, the screw fastening portions 73A are configured as screw fastening portions 54A used to fasten the water cooling units together, but they do not necessarily function as screw fastening portions 54A, and it is also possible to configure the necessary number of through holes to have positioning pins provided as needed. A liquid refrigerant flow path 75 is formed inside the cooling unit main body 52 of the cooling unit 13G, and four fins (straightening plates) 76A to 76D and a convex portion 77 within the flow path are arranged within the liquid refrigerant flow path 75, which has a U-shape when viewed from above, to straighten the flow of the liquid refrigerant.

[0173] As shown in FIG. 30, in the U-shaped liquid refrigerant flow path 75, the liquid refrigerant introduced from the inlet coupler 72A is diffused by the convex portion 74A in the flow path, passes through the fins 76A and 76B, makes a U-turn, and heads toward the outlet coupler 72B. When the liquid refrigerant makes a U-turn and flows in this way, the distribution of the liquid refrigerant flow becomes biased toward the outside of the liquid refrigerant flow path 75 (to the left of the fins 76C and 76D in the example of FIG. 30).

[0174] Therefore, in the 18th embodiment, as shown in FIG. 30, a convex portion 77 is provided in the flow path at a location where the distribution of the liquid refrigerant flow between the fin 76C and the fin 76D is uneven. As shown by the arrows in FIG. 30, the flow of the liquid refrigerant is forcibly diffused and returned to the side with less flow, so that the flow introduced into the fin 76D is again less uneven and heads toward the outlet coupler 72B. In this way, by providing the convex portion 77 in the flow path, the distribution of the flow of the liquid refrigerant is made uniform, and the liquid refrigerant is smoothly discharged from the discharge coupler 72B.

[0175] As a result, it is possible to suppress a decrease in the effective discharge speed, and in turn, to maintain the heat exchange efficiency at a predetermined value.

[0176] FIG. 31 is an explanatory diagram of a modified example of the eighteenth embodiment. FIG. 31 is a cross-sectional view of the liquid refrigerant flow path. For example, in the 18th embodiment, when a semiconductor chip CP30 requiring height adjustment in the portion corresponding to the fin 76A is mounted on a substrate (not shown) located at the top in FIG. 31, the height within the liquid refrigerant flow path 75 is made constant by bending the liquid refrigerant flow path upward in a zigzag shape without providing a height adjustment portion.

[0177] Furthermore, by configuring the fin 76A using three more fins 76A1 to 76A3 of the same height, the cooling unit body 71 can be brought into direct contact with the semiconductor chip CP30, and the semiconductor chip CP30 can be cooled more efficiently.

[0178] Although the above description has been given as a modified example of the eighteenth embodiment, it can be similarly applied to other embodiments. As explained above, fins of the same height can be used, which reduces manufacturing costs and enables highly efficient cooling compared to a configuration in which the liquid refrigerant flow path height is partially changed and fins of different heights are used.

[0179]

[19] 19th embodiment FIG. 32 is an external perspective view of the cooling unit of the nineteenth embodiment as viewed from the rear side. In FIG. 32, the same parts as those in FIG. 21 are denoted by the same reference numerals. The cooling unit 13H includes a cooling unit main body 81, an introduction coupler 53A, a screw fastening portion 54A, and convex portions 55C and 55D in the flow path. In this case, a heat insulating protrusion 85 is provided in the flow path on the rear side of the cooling unit main body 81 on the outlet coupler 53B side.

[0180] Here, the reason why the heat insulating protrusions 85 are provided will be explained. If the semiconductor chip CP31 and the semiconductor chip CP31 are arranged without providing the insulating protrusion 85, there is a possibility that the heat transferred from the semiconductor chip CP31 to the liquid refrigerant via the thermally conductive member TGR and the height adjustment portion AD81 and the heat transferred from the semiconductor chip CP32 to the liquid refrigerant via the thermally conductive member TGR will interfere with each other, resulting in malfunction of cooling.

[0181] Therefore, in the 19th embodiment, a heat insulating protrusion 85 is provided, and a space is provided below it through which the liquid refrigerant can pass, so that the heat transferred from the semiconductor chip to the liquid refrigerant via the thermally conductive member is immediately moved by causing the liquid refrigerant to flow within the space 85X, thereby preventing thermal interference.

[0182] As a result, according to the configuration of the 19th embodiment, even liquid refrigerant immediately before being discharged can be cooled with high efficiency, making it possible to configure a highly reliable device.

[0183]

[20] Twentieth embodiment FIG. 33 is an explanatory diagram of the twentieth embodiment. As shown in FIG. 33, it is assumed that a semiconductor chip CP31 and a semiconductor chip CP31 which are heat sources to be cooled are located at positions facing each other with the cooling unit main body 81 interposed therebetween. In such a situation, if the semiconductor chip CP31 and the semiconductor chip CP31 are arranged without providing the insulating protrusion 85, there is a possibility that the heat transferred from the semiconductor chip CP31 to the liquid refrigerant via the thermally conductive member TGR and the height adjustment portion AD81 and the heat transferred from the semiconductor chip CP32 to the liquid refrigerant via the thermally conductive member TGR will interfere with each other, resulting in malfunction of cooling.

[0184] Therefore, in the 20th embodiment, an insulating protrusion 85 is provided, and a space 85X is provided below it through which the liquid refrigerant can pass, and the heat transferred from the semiconductor chip CP32 to the liquid refrigerant via the thermally conductive material TGR is immediately moved by causing the liquid refrigerant to flow within the space 85X, thereby preventing thermal interference.

[0185] As a result, according to the configuration of the 20th embodiment, even if a heat source is located in an opposite position via the cooling unit 13H, cooling can be performed with high efficiency, making it possible to configure a highly reliable device.

[0186]

[21] Twenty-first embodiment FIG. 34 is a partially exploded perspective view of the cooling unit of the twenty-first embodiment. In FIG. 34, the same parts as those in the cooling unit of the seventeenth embodiment in FIG. 23 are denoted by the same reference numerals. A liquid refrigerant flow path 61 is formed inside the cooling unit main body 52 of the cooling unit 13J, and two fins (straightening plates) 62C, 63B are arranged inside the liquid refrigerant flow path 61, which has a U-shape when viewed in a plane, to straighten the flow of the liquid refrigerant.

[0187] Furthermore, the cooling unit main body 52 includes a first cooling unit main body portion 52F having an inlet coupler 53A and an outlet coupler 53B, and a second cooling unit main body portion 52B arranged opposite the first cooling unit main body portion 52F and cooperating to form a liquid refrigerant flow path 61. Here, the first cooling unit main body 52F and the second cooling unit main body 52B are joined by brazing, welding, or the like.

[0188] The first cooling unit main body 52F has an intra-flow path convex portion 55A having an elliptical track shape in a plan view that protrudes into the liquid refrigerant flow path 61, and is provided near the inlet coupler 53A so as to extend in the X-axis direction in Figure 22. Similarly, the first cooling unit main body 52F has an in-flow path convex portion 55B, which is shaped like an elliptical track in a plan view and protrudes into the liquid refrigerant flow path 61, near the outlet coupler 53B, extending in the X-axis direction in Figure 22.

[0189] The second cooling unit main body 52B is arranged to extend in the X-axis direction in Figure 22 near the position where the flow path convex portion 55C, which has an elliptical track shape in a plan view and protrudes into the liquid refrigerant flow path 61, partially faces the inlet coupler 53A.

[0190] Similarly, the second cooling unit main body 52B is arranged so as to extend in the X-axis direction in Figure 22 near a position where a convex portion 55D in the flow path, which has an elliptical track shape in a plan view and protrudes into the liquid refrigerant flow path 61, partially faces the outlet coupler 53B.

[0191] In the above configuration, the fin 62C differs from the fin 62B in that the tip on the inlet coupler 53A side is cut obliquely. This is because the liquid refrigerant supplied from the inlet coupler 53A has a high flow rate in the central portion, which increases the flow path resistance, and a low flow rate at both ends, which decreases the flow path resistance, ultimately resulting in a uniform flow overall.

[0192] As a result, by providing the fins 62C with diagonally cut tips, the distribution of the liquid refrigerant flow is made uniform, the liquid refrigerant is discharged smoothly from the discharge coupler 72B, a decrease in the effective discharge speed is suppressed, and ultimately, the heat exchange efficiency can be maintained at a predetermined value.

[0193]

[22] Twenty-second embodiment FIG. 35 is a plan view of the cooling unit of the twenty-second embodiment. 35 shows a state in which the cooling unit 13K is housed in the casing 81. In FIG.

[0194] A cooling unit 13K of the twenty-second embodiment includes a cooling unit main body 71, an inlet coupler 72A, an outlet coupler 72B, and a cooling block CB. A liquid refrigerant flow path 73 is provided within the cooling unit body 71, as shown by the thick dashed line in FIG.

[0195] Furthermore, the cooling unit main body 71 includes a first cooling unit main body portion 72BF having an inlet coupler 72A and an outlet coupler 72B, and a second cooling unit main body portion 72BB arranged opposite the first cooling unit main body portion 72BF and cooperating to form a liquid refrigerant flow path 73. As can be seen from the configuration of the liquid refrigerant flow path 73, the cooling unit 13K cools only the semiconductor chip CP41 as a heat source via the cooling block CB.

[0196] FIG. 36 is a cross-sectional view of the portion enclosed by the dashed line BA in FIG. As shown in Figure 36, the cooling block CB has a heat transfer part CB12 protruding from a cover part CB11 which has a track shape in a plan view to close the opening 72H provided in the first cooling unit main body part 72BF in a watertight manner, and is inserted into the opening 72H.

[0197] Then, with the O-ring 83 fitted into the groove provided in the lid portion CB11 and the groove provided in the first cooling unit main body portion 72BF, a screw 82 is inserted through the screw hole provided in the lid portion CB11 and screwed into the screw groove provided in the first cooling unit main body portion 72BF, and the heat transfer portion CB12 is positioned within the liquid refrigerant flow path 73 in a watertight state.

[0198] As a result, as shown by the arrows in Figure 36, the liquid refrigerant flows through the liquid refrigerant flow path 73, and the heat generated by the semiconductor chip CP41, which serves as a heat source, is transferred to the liquid refrigerant via the thermally conductive member TGR and the cooling block CB, thereby dissipating the heat.

[0199] Therefore, unlike the above-described embodiments, heat can be directly transferred and dissipated by the liquid refrigerant without passing through the cooling unit body, thereby further improving the cooling efficiency. Therefore, according to the twenty-second embodiment, even if the semiconductor chip CP41 is a heat source that generates a large amount of heat, such as a power semiconductor for an electric power system, it can be cooled efficiently.

[0200] FIG. 37 is a cross-sectional view of a cooling unit according to a modification of the twenty-second embodiment. In FIG. 36, the heat transfer portion CB12 is inserted into the opening 72H, but in this modification, the liquid refrigerant flow path is branched off to the cooling block side. Specifically, as shown in FIG. 37, the liquid refrigerant flow path 73 is divided into two parts: a liquid refrigerant flow path leading to an opening 72H1 provided in the first cooling unit main body portion 72BF, and a liquid refrigerant flow path from an opening 72H2 provided in the first cooling unit main body portion 72BF. Furthermore, an opening CB1H1 provided at a position corresponding to the opening 72H1 of the cooling block CB1 and an opening CB1H2 provided at a position corresponding to the opening 72H2 of the cooling block CB1 are arranged at corresponding positions.

[0201] Then, the O-ring 83 is fitted into the groove provided in the cover portion CB21 and the groove provided in the first cooling unit main body portion 72BF. At the same time, the O-ring 84 is similarly fitted into the groove provided in the heat transfer portion CB22 and the groove provided in the first cooling unit main body portion 72BF. Then, screws 82 are inserted through screw holes provided in the cover portion CB21 and screwed into thread grooves provided in the first cooling unit main body portion 72BF, thereby attaching the cooling block CB1 to the first cooling unit main body portion 72BF in a watertight state. As a result, the liquid refrigerant flow path leading to the opening 72H1 provided in the first cooling unit main body portion 72BF and the liquid refrigerant flow path from the opening 72H2 provided in the first cooling unit main body portion 72BF are connected within the cooling block CB1, forming an integrated liquid refrigerant flow path.

[0202] As a result, as shown by the arrows in Figure 37, the liquid refrigerant flows through the liquid refrigerant flow path 73 and at the same time flows through the cooling block CB1, and the heat generated by the semiconductor chip CP41 as a heat source is transferred to the liquid refrigerant via the thermally conductive member TGR and the cooling block CB1, thereby dissipating the heat.

[0203] According to this configuration, the cooling block CB1 has an opening CB1H1 at a position corresponding to the opening 72H1 of the cooling block CB1, and an opening CB1H2 at a position corresponding to the opening 72H2 of the cooling block CB1. Since the shape can be easily changed, the design freedom is further improved by making the shape suitable for the target heat source.

[0204] Therefore, in this modified example, heat can be directly transferred and dissipated by the liquid refrigerant without going through the cooling unit main body, as in the above embodiments, while also improving design freedom, thereby further improving cooling efficiency and enabling efficient cooling even for heat sources with large heat generation.

[0205]

[23] Twenty-third embodiment FIG. 38 is an explanatory diagram of the 23rd embodiment. FIG. 38 shows an embodiment in which semiconductor chips CP41 to CP43, which are heat sources mounted on three substrates SB21 to SB23, respectively, are cooled by one cooling unit. As shown in Figure 38, the cooling unit 13L of the 23rd embodiment is configured to cool not only the first cooling unit main body 91F and the second cooling unit main body 91B that constitute the cooling unit 91 containing the liquid refrigerant flow path 92, but also the frame portion 91C and the heat transfer member 101. In the example of FIG. 38, it is assumed that a semiconductor chip CP41 as a heat source is mounted on a board SB21, a semiconductor chip CP42 as a heat source is mounted on a board SB22, and semiconductor chips CP43 to CP44 as heat sources are mounted on a board SB23. Also, it is assumed that the semiconductor chips CP41 to CP43 generate a large amount of heat, while the semiconductor chip CP44 generates less heat than the semiconductor chips CP41 to CP43 and does not require much cooling.

[0206] In the above configuration, the semiconductor chip CP41 is thermally coupled to the first cooling unit main body 91F of the cooling unit 13L via the thermally conductive member TGR and the height adjustment portion AD81. The semiconductor chip CP42 is thermally coupled to the second cooling unit main body 91B of the cooling unit 13L via the thermally conductive member TGR and the height adjustment portion AD82.

[0207] Furthermore, since the semiconductor chip CP43 is located on the back side of the substrate SB22 relative to the cooling unit 13L, it is thermally coupled to the second cooling unit main body portion 91B of the cooling unit 13L via the thermal conductive member TGR and the height adjustment portion AD83 through the opening SB22H provided in the substrate 22.

[0208] In contrast to these, the semiconductor chip CP44 generates relatively little heat, and is therefore thermally coupled to the heat transfer member 101 via the thermally conductive member TGR and the height adjustment portion AD84, and is also thermally coupled to the cooling unit 13L via the heat transfer member 101 and the frame portion 91C.

[0209] As explained above, according to the 23rd embodiment, even if there are three or more substrates, it is possible to cool the mounted semiconductor chips as long as the cooling performance of the cooling unit 13L allows, eliminating the need to provide multiple cooling units and allowing the device to be made smaller.

[0210] In the above description, the heat transfer member 101 is arranged on the surface of the frame portion 91C facing the second cooling unit main body portion 91B, but by arranging the heat transfer member 101 on the surface of the frame portion 91C facing the first cooling unit main body portion 91F, it is also possible to reduce the height of the height adjustment portion AD84 and further improve the cooling efficiency.

[0211]

[24] Twenty-fourth embodiment FIG. 39 is an explanatory diagram of the 24th embodiment. The twenty-fourth embodiment is an embodiment for dealing with heat-generating components that constitute a so-called SiP (System in Package). In a SiP mounted on a substrate, multiple semiconductor chips of different heights are mounted in the SiP itself, making it difficult to efficiently cool them.

[0212] Therefore, in the 24th embodiment, openings are provided in the heat transfer member, and heat transfer blocks of different thicknesses are incorporated into each opening and brazed or welded to accommodate the differences in height of each heat-generating component within the SiP, thereby optimizing the thickness of the thermally conductive member TGR (gap filler or TIM). More specifically, as shown in FIG. 39, semiconductor chips CP51 to CP53 having different heights are mounted on a SiP110 mounted on a substrate SB31.

[0213] On the other hand, a cooling unit 13M of the 24th embodiment has a liquid refrigerant passage 112 provided in a cooling unit body 111, and a heat transfer member 113 having a plurality of openings provided on one surface by brazing or welding. Metal blocks MB1 to MB3 serving as TIM (Thermal Interface Material) corresponding to the heights of the semiconductor chips CP51 to CP53 are fixed to the openings of the heat transfer member 113 by brazing.

[0214] As a result, it is possible to optimize the thickness of the gap fillers GF1 to GF3 as the thermal conduction members TGR to a more suitable thickness. As a result, according to the twenty-fourth embodiment, even when semiconductor chips of different heights are mounted in a small area, such as in the SiP110, it is possible to easily cope with this. Furthermore, since the shape of the heat transfer member 113 can be easily changed, the cooling unit body 111 can be standardized to easily accommodate different specifications.

[0215]

[25] Twenty-fifth embodiment FIG. 40 is an explanatory diagram of the 25th embodiment. In the above description, a convex portion is provided in the liquid refrigerant flow path to eliminate uneven distribution of the liquid refrigerant flow within the liquid refrigerant flow path. However, in the 25th embodiment, a slit member is provided in the liquid refrigerant flow path to eliminate uneven distribution of the liquid refrigerant flow.

[0216] FIG. 40(A) is a partial front view of a cooling unit 13N according to the twenty-fifth embodiment. FIG. 40(B) is a front view of the slit member of the twenty-fifth embodiment. FIG. 40(C) is an explanatory diagram of a case where a slit member is inserted into a cooling unit 13N of the 25th embodiment.

[0217] As shown in Figures 40(A) and 40(C), the cooling unit 13N of the 25th embodiment has a slit-shaped insertion hole 121C in the cooling unit main body 121 that connects from the first cooling unit main body portion 121F to the second cooling unit main body portion 121B. The cooling unit 13N is also provided with an inlet coupler 123A and an outlet coupler 123B.

[0218] When the cooling unit 13N is actually used, the slit member 122 is inserted into the slit-shaped insertion hole 121C, the slit member 122 is made to protrude from the second cooling unit main body part 121B, and the slit member 122 is fixed to the cooling unit main body 121 by brazing.

[0219] FIG. 41 is an explanatory diagram of the 25th embodiment when the slit member is inserted and after brazing. 41(A) is a cross-sectional view taken along line BB in FIG. 42, and FIG. 41(B) is a view corresponding to the cross-section taken along line BB after the slit member 122 has been brazed.

[0220] As a result, a slit group 122A consisting of multiple slits (holes) is located in the liquid refrigerant flow path on the inlet coupler 123A side within the cooling unit main body 121, and all the liquid refrigerant passes through this and flows into the liquid refrigerant flow path on the outlet coupler 123B side.

[0221] Similarly, a slit group 122B consisting of a plurality of slits (holes) is located in the liquid refrigerant flow path on the outlet coupler 123B side in the cooling unit main body 121, and all the liquid refrigerant passes through this and flows toward the outlet coupler 123B.

[0222] In this case, the liquid refrigerant that has passed through the slit group 122A is diffused due to the flow path resistance that corresponds to the shape of each slit that constitutes the slit group 122A, and the distribution of the liquid refrigerant flow is made uniform, allowing the liquid refrigerant to flow smoothly into the liquid refrigerant flow path on the outlet coupler 123B side.

[0223] Furthermore, the liquid refrigerant passes through slit group 122B, and is diffused due to the flow path resistance corresponding to the shape of each slit constituting slit group 122B, and the distribution of the liquid refrigerant flow becomes more uniform, and the liquid refrigerant reaches outlet coupler 123B smoothly.

[0224] As a result, the flow of the liquid refrigerant passing through the outlet coupler 123B does not generate vortices, and is smoothly discharged from the outlet coupler 123B. Therefore, the cooling unit 13N of the 25th embodiment also makes it possible to suppress a decrease in the effective discharge speed, and in turn to maintain the heat exchange efficiency at a predetermined value.

[0225] In this case, the slits formed in the slit member 122 can be varied in many ways depending on the intended use, and therefore can be applied to a variety of uses.

[0226] FIG. 42 is an explanatory diagram of a first modified example of the twenty-fifth embodiment. In FIG. 42, the same parts as those in FIG. 40 are denoted by the same reference numerals. Figure 42 differs from Figure 40 in that the slit member 125 has a wide through hole 121D instead of the slit-shaped insertion hole 121C, and in that the number of slits is different and the slit width on the central side of the slits that make up the slit groups 125A and 125B is larger than the slit width on either side.

[0227] In this way, the slits formed in the slit member 125 can be varied in many ways depending on the intended use, and therefore can be applied to a variety of uses.

[0228] FIG. 43 is an explanatory diagram of a second modified example of the twenty-fifth embodiment. FIG. 43 differs from FIG. 40 in that the slit member 127 has a group of slits 127A on the inlet coupler 123A side and a group of slits 127B on the outlet coupler 123B side that are different from each other.

[0229] That is, the slit group 127A on the inlet coupler 123A side does not have a slit in the center to increase the flow resistance and diffuse the liquid refrigerant introduced from the inlet coupler 123A, since the flow rate in the center is high, which causes flow rate variations.

[0230] On the other hand, the slit group 127B on the outlet coupler 123B side is required to allow smooth outlet, so the slit width at the center is made larger to reduce the flow path resistance and allow the liquid refrigerant to be smoothly discharged. As a result, it is possible to suppress a decrease in the effective discharge speed, and in turn, it is possible to maintain the heat exchange efficiency at a predetermined value, thereby enabling efficient cooling.

[0231] FIG. 44 is an explanatory diagram of a third and fourth modified example of the twenty-fifth embodiment. FIG. 44(A) is an explanatory diagram of a third modified example of the 25th embodiment, and FIG. 44(B) is an explanatory diagram of a fourth modified example of the 25th embodiment.

[0232] FIG. 44(A) differs from FIG. 43 in that the configuration of the slit group 129A on the inlet coupler 123A side is different from the configuration of the slit group 129B on the outlet coupler 123B side in the slit member 129.

[0233] That is, in the slit group 129A on the inlet coupler 123A side, the liquid refrigerant introduced from the inlet coupler 123A has a high flow rate in the center, which causes flow rate variations, so in order to increase the flow path resistance and diffuse the refrigerant, narrow slits are provided in the center to increase the flow path resistance, and in the slit group 129B on the outlet coupler 123B side, the slit width is made larger in the center to reduce the flow path resistance and allow the liquid refrigerant to be discharged smoothly, as it is necessary to discharge the refrigerant smoothly.

[0234] As a result, it is possible to suppress a decrease in the effective discharge speed, and in turn, it is possible to maintain the heat exchange efficiency at a predetermined value, thereby enabling efficient cooling. FIG. 44(B) differs from FIG. 43 in that the configuration of the slit group 131A on the inlet coupler 123A side is different from the configuration of the slit group 131B on the outlet coupler 123B side in the slit member 131.

[0235] That is, the slit group 131A on the inlet coupler 123A side has a larger opening ratio than that of the third modified example, thereby further reducing the flow path resistance. Similarly, in the slit group 131B on the outlet coupler 123B side, the opening ratio of the slits is made larger than in the third modified example, thereby reducing the flow path resistance, and efficient cooling can be performed not only when the introduction pressure of the liquid refrigerant is high, but also when the introduction pressure of the liquid refrigerant is low.

[0236] The liquid refrigerant introduced from the inlet coupler 123A has a high flow rate in the center, which causes flow rate variations. Therefore, in order to increase the flow path resistance and diffuse the refrigerant, narrow slits are provided in the center to increase the flow path resistance. Since the slit group 129B on the outlet coupler 123B side needs to be able to discharge the refrigerant smoothly, the slit width in the center is increased to reduce the flow path resistance and allow the liquid refrigerant to be discharged smoothly. As a result, it is possible to suppress a decrease in the effective discharge speed, and in turn, it is possible to maintain the heat exchange efficiency at a predetermined value, thereby enabling efficient cooling.

[0237]

[26] Twenty-sixth embodiment In each of the above embodiments, the shape of the inlet coupler is substantially cylindrical, and the liquid refrigerant is diffused by the convex portion or slit member in the flow path. In the 26th embodiment, by changing the shape of the inlet coupler, the liquid refrigerant is diffused at the time of being introduced into the cooling unit main body, eliminating uneven flow within the liquid refrigerant flow path and achieving a uniform flow.

[0238] FIG. 45A is a three-view diagram of an introduction coupler according to a first aspect of the twenty-sixth embodiment. 45A(A) is a plan view of the introduction coupler 130, FIG. 45(B) is a front view of the introduction coupler 130, and FIG. 45(C) is a side view of the introduction coupler 130. FIG. As shown in FIG. 45A, introduction coupler 130 of the first embodiment includes bulge portion 131, introduction coupler main body portion 132, and flange portion 133.

[0239] The bulge portion 131 functions as a connector portion to which a refrigerant supply pipe of an external refrigerant cooling / circulation unit as shown in FIG. 1 is connected, and is provided at a portion protruding from the cooling unit of the present application. The bulge portion 131 has a substantially cylindrical shape, and is formed by bulging, with a part of the bulge portion having an expanded diameter.

[0240] The introduction coupler main body 132 has a shape that resembles a partially crushed funnel shape, which corresponds to the side of a truncated cone, and as shown in Figure 45(B), when viewed from the front, the opening portion 132A at the tip has the appearance of an infinity symbol with large openings at both end portions 132AT, and the central portion 132AC is narrow. The flange portion 133 has a flange-like protruding shape and is provided so as to abut against the inner surface of the cooling unit.

[0241] Therefore, when the liquid refrigerant passes through the inlet coupler main body 132, the flow resistance is higher in the central portion 132AC, making it more difficult for the liquid refrigerant to flow, and the liquid refrigerant is discharged in a diffused state into the liquid refrigerant flow path in the cooling unit main body along the fan-shaped planar view shown in Figure 45A.

[0242] This allows the liquid refrigerant to flow uniformly over the fins provided on the downstream side, allowing the liquid refrigerant to flow smoothly toward the outlet coupler. As a result, it is possible to suppress a decrease in the effective discharge speed, and in turn, it is possible to maintain the heat exchange efficiency at a predetermined value, thereby enabling efficient cooling.

[0243] FIG. 45B is a three-view diagram of the introduction coupler of the second aspect of the twenty-sixth embodiment. In FIG. 45B, the same parts as those in FIG. 45A are denoted by the same reference numerals. 45B(A) is a plan view of introduction coupler 130X, FIG. 45B(B) is a front view of introduction coupler 130X, and FIG. 45(C) is a side view of introduction coupler 130X. As shown in FIG. 45, the introduction coupler 130 includes a bulge portion 131, an introduction coupler main body portion 132X, and a flange portion 133.

[0244] The bulge portion 131 functions as a connector portion to which a refrigerant supply pipe of an external refrigerant cooling / circulation unit as shown in FIG. 1 is connected, and is provided at a portion protruding from the cooling unit of the present application. The bulge portion 131 has a substantially cylindrical shape, and is formed by bulging, with a part of the bulge portion having an expanded diameter.

[0245] The introduction coupler main body 132 has a shape that resembles a squashed funnel, which corresponds to the side of a truncated cone, and as shown in Figure 45(B), the opening portion 132B at the tip has a so-called track shape when viewed from the front, with the opening width of both end portions 132BT and the opening width of the central portion 132BC being approximately equal. The flange portion 133 has a flange-like protruding shape and is provided so as to abut against the inner surface of the cooling unit.

[0246] Therefore, when the liquid refrigerant passes through the inlet coupler main body 132X, the liquid refrigerant is discharged into the liquid refrigerant flow path in the cooling unit main body in a slightly diffused state along the fan-shaped planar view shown in Figure 45A.

[0247] This allows the liquid refrigerant to flow uniformly over the fins provided on the downstream side, allowing the liquid refrigerant to flow smoothly toward the outlet coupler. Furthermore, it is possible to reduce the flow path resistance compared to the inlet coupler 130 of the first embodiment. As a result, it is possible to suppress a decrease in the effective discharge speed, and in turn, it is possible to maintain the heat exchange efficiency at a predetermined value, thereby enabling efficient cooling.

[0248]

[27] Twenty-seventh embodiment The cooling units described in the above embodiments are connected to an external refrigerant cooling / circulation unit as shown in FIG. 1, and naturally, liquid refrigerant is supplied to them, which may result in leakage of the liquid refrigerant. Furthermore, as mentioned above, the cooling unit main body has a structure with many bumps and grooves, and even if it is housed in a housing, the inlet coupler and outlet coupler must protrude from the housing, and it is possible that liquid may seep in through the gap formed between the cooling unit main body and the housing.

[0249] Furthermore, since the cooling unit main body is a cooling device, there is a very high possibility that moisture in the air will condense inside the housing depending on the ambient temperature and humidity conditions.

[0250] Furthermore, since the housing also incorporates various sensors such as temperature sensors and pressure sensors, control circuits for controlling these sensors, and electronic circuits such as communication circuits for communicating with the outside, it is desirable to avoid liquid intrusion from the outside and condensation as much as possible, and, if liquid intrusion from the outside or condensation does occur, to encourage the liquid to be discharged to the outside and reduce the impact as much as possible.

[0251] Therefore, in view of the above-mentioned problems, the present 27th embodiment aims to provide a cooling unit having a structure that can prevent the intrusion of liquid from the outside and condensation as much as possible, and can minimize the effects of liquid intrusion from the outside and condensation if they do occur.

[0252] Before describing the embodiments, the problems to be solved will be described below. FIG. 46 is an explanatory perspective view of an example in which a cooling unit is housed between the housing and the front chassis. FIG. 47 is a front view showing a case where a cooling unit is housed between the housing and the front chassis.

[0253] As shown in FIG. 46, when the cooling unit main body 133 is stored between the front chassis 131 and the housing 132, the inlet coupler 133A and outlet coupler 133B of the cooling unit main body 133 must protrude outside the housing 132. As a result, a gap SP is generated between the front chassis 131 and the upper surface of the cooling unit main body 133, as shown in FIG. Therefore, in order to prevent liquid from entering from the outside through this portion, it is necessary to provide a separate component that fills the gap SP.

[0254] However, since the cooling unit body of cooling unit 132 has unevenness formed by drawing or the like, the dimensional precision is not necessarily high, and even if separate components were used, it would be difficult to assemble with the desired precision. Also, if liquid refrigerant leaks from inlet coupler 133A or outlet coupler 133B, there is a possibility that the liquid refrigerant will enter housing 131.

[0255] FIG. 48 is an external perspective view of a cooling unit with a liquid intrusion prevention wall member of the 27th embodiment attached thereto. FIG. 49 is a diagram of the cooling unit with the liquid intrusion prevention wall member of the 27th embodiment attached, viewed from the inlet coupler and outlet coupler side. FIG. 50 is a front view of a case in which a cooling unit is housed between the housing and the front chassis, and a liquid intrusion prevention wall member and a liquid intrusion prevention member according to the 27th embodiment are provided.

[0256] As shown in Figure 48, by providing a liquid intrusion prevention wall member 135 perpendicular to the vertical direction of the cooling unit main body 133 near the inlet coupler 133A and outlet coupler 133B of the cooling unit main body 133, it is possible to fill the gap SP by pressing a liquid intrusion prevention member 136 arranged between the front chassis 131 and the cooling unit main body 133 against the surface 135A of this liquid intrusion prevention wall member 135, as shown in Figure 50.

[0257] In the above configuration, the liquid intrusion prevention wall members 135 may be inserted into openings provided at opposing positions in the vertical direction of the cooling unit main body 133 so as to penetrate the cooling unit main body 133, and then assembled by brazing. Alternatively, the liquid intrusion prevention wall member 135 can be divided into two parts, upper and lower, as shown in Figure 49, to form a two-part structure, which can be assembled by brazing them to the cooling unit main body 133 from above and below the cooling unit main body 133.

[0258]

[28] Twenty-eighth embodiment Next, a 28th embodiment will be described. The 28th embodiment is an embodiment for preventing the intrusion of liquid from the outside. FIG. 51 is an explanatory diagram of the 28th embodiment.

[0259] In the 28th embodiment, a liquid guide member 141 having a slope in the left-right direction in a side view is arranged in front of the liquid intrusion prevention wall member 135 so as to cover the gap SP between the front chassis 131 shown in Figure 47 and the upper surface of the cooling unit main body 133.

[0260] As a result, according to the 28th embodiment, even if liquid from the outside flows from above in the direction indicated by the arrow AR1 in Figure 48, the liquid guide member 141 will block its path and cause it to flow in the direction indicated by the arrow AR2, thereby making it possible to prevent liquid from entering from the outside.

[0261]

[29] Twenty-ninth embodiment Next, a 29th embodiment will be described. FIG. 52 is a partially enlarged view of the housing of the twenty-ninth embodiment. The 29th embodiment is an embodiment that addresses the situation where liquid enters from the outside between the housing 132 and the cooling unit main body 133, or between the cooling unit main body 133 and the front chassis 131, or where liquid is generated due to condensation.

[0262] Therefore, the housing 132 of the twenty-ninth embodiment is provided with a liquid drain hole 151 facing downward when the housing 132 is actually installed in a vehicle or the like. In this case, it is preferable that the liquid discharge hole 151 is provided on the side of the housing where electronic components such as semiconductor chips and electrical components such as connector terminals are not arranged.

[0263] According to this configuration, even if liquid seeps in from the outside between the housing 132 and the cooling unit main body 133, or between the cooling unit main body 133 and the front chassis 131, or if liquid occurs due to condensation, the liquid can be quickly drained to the outside, making it possible to avoid adverse effects caused by the intrusion of liquid, etc.

[0264] FIG. 53 is an explanatory diagram of a modified example of the twenty-ninth embodiment. In the example of Figure 53, liquid discharge holes 151A and 151B are provided in a direction that will be the lower side when housing 131 is actually installed in a vehicle or the like. Furthermore, slope members 152A to 152C are provided inside housing 132, and are configured to guide the liquid dropping from the top of FIG. 53 to liquid drain hole 151A or liquid drain hole 151B and quickly drain it to the outside. As a result, even if liquid seeps in from the outside between the housing 132 and the cooling unit main body 133, or between the cooling unit main body 133 and the front chassis 131, or if liquid occurs due to condensation, the liquid can be quickly drained to the outside, making it possible to avoid adverse effects caused by the intrusion of liquid, etc.

[0265]

[30] Thirty-first embodiment Next, a 30th embodiment will be described. FIG. 54 is an explanatory diagram of the 30th embodiment. The thirtieth embodiment is an embodiment that addresses the case where liquid is generated on the cooling unit body 133 due to condensation.

[0266] Therefore, a liquid absorbing member 155 that absorbs liquid generated by condensation is attached to the surface of the cooling unit body 133 of the thirtieth embodiment. The liquid absorbing member 155 may be made of, for example, nonwoven fabric. This prevents the liquid from dripping immediately even if condensation occurs, reducing the impact on electronic boards and other components installed inside the housing and further improving reliability.

[0267] FIG. 55 is an explanatory diagram of a first modified example of the 30th embodiment. In the first modified example of the thirtieth embodiment, the liquid drain hole 151 is provided in a direction that faces downward when the housing 132 is actually installed in a vehicle or the like. In this case, it is preferable that the liquid discharge hole 151 is provided on the side of the housing where electronic components such as semiconductor chips, boards, and electrical components such as connector terminals are not arranged.

[0268] A liquid absorbing member 155A having a home plate shape, for example, is attached to the surface of the cooling unit body 133 of the first modified example of the 30th embodiment. The liquid absorbing member 155A may be made of, for example, nonwoven fabric. As a result, when condensation occurs, the liquid that has formed is absorbed by the liquid absorbing member 155A and does not immediately drip down.

[0269] Furthermore, if a large amount of condensation occurs, gravity will gradually transfer it to the pointed part at the lower end of the liquid absorbing member 155A, and when the amount becomes too much for the liquid absorbing member 155A to hold, gravity will cause it to drip from the pointed part at the lower end into the liquid drain hole 151 and be discharged outside the housing 132. Therefore, the influence on the electronic boards and the like installed inside the housing 132 can be reduced, and reliability can be further improved.

[0270] FIG. 56 is an explanatory diagram of a second modified example of the 30th embodiment. In the second modified example of the thirtieth embodiment, liquid discharge holes 151A and 151B are provided on the downward side when housing 132 is actually installed in a vehicle or the like. In this case, it is preferable that liquid discharge holes 1511A and 151B are provided on the side of housing 132 where electronic components such as semiconductor chips, boards, and electrical components such as connector terminals are not arranged.

[0271] A W-shaped liquid absorbing member 155B, for example, is attached to the surface of the cooling unit body 133 of the modified example of the 30th embodiment. The liquid absorbing member 155B may be made of, for example, nonwoven fabric. As a result, when condensation occurs, the liquid that has formed is absorbed by the liquid absorbing member 155B and does not immediately drip down.

[0272] If a large amount of condensation occurs, the liquid gradually moves due to gravity to the pointed portion 156A at the lower end of the liquid absorbing member 155B or the pointed portion 156B at the lower end of the liquid absorbing member 155B as shown by the arrows. When the amount of liquid reaches a level that liquid absorbing member 155A cannot hold, the liquid accumulated in pointed lower end portion 156A drips down liquid drain hole 151A by gravity and is discharged outside housing 132. Similarly, the liquid pooled in the pointed portion 156B at the lower end drips down the liquid drain hole 151B by gravity and is discharged to the outside of the housing 132. Therefore, the influence on the electronic boards and the like installed inside the housing 132 can be reduced, and reliability can be further improved.

[0273]

[31] Thirty-first embodiment Next, a thirty-first embodiment will be described. FIG. 57 is an external perspective view of the cooling unit of the thirty-first embodiment. The cooling unit 160 of the thirty-first embodiment can house an electronic circuit board, a terminal board, and the like, and includes a front chassis 161 , a housing 162 , a cooling unit body 163 , and a sealing member 164 .

[0274] In the following description, for ease of understanding, illustrations of electronic circuit boards, terminal boards, etc. are omitted, but in an actual device, the electronic circuit boards, terminal boards, etc. are arranged between the front chassis 161 and the cooling unit main body 163, or between the housing 162 and the cooling unit main body 163. The same applies to each of the following embodiments.

[0275] FIG. 58 is an exploded perspective view of the cooling unit of the thirty-first embodiment. In FIG. 58, for ease of understanding, the front chassis 161 is omitted from the illustration. As shown in FIG. 58, the sealing member 164 includes a first sealing member 164A and a second sealing member 164B.

[0276] By using two members, the first sealing member 164A and the second sealing member 164B, sealing ability is ensured and assembly is facilitated. Then, the first sealing member 164A is placed on the abutment surface 162B of the housing 162 with the notch 164A1 of the first sealing member 164A fitted into the engagement protrusion 162A of the housing 162.

[0277] In this state, the cooling unit body 163 is placed in the housing 162 so that the first sealing member 164A abuts against a predetermined position of the cooling unit body 163. Then, second sealing member 164B is fitted into cooling unit main body 163 from above, and second sealing member 164B is fixed to housing 162. Then, the front chassis 161 (not shown) is placed over the top surface and fixed in place, completing the assembly as shown in FIG.

[0278] According to the configuration of the 31st embodiment, a sealing state can be reliably ensured between the cooling unit main body 163 and the front chassis 161 and housing 162 through a simple process, thereby ensuring the operation of electronic devices placed between the housing 162 and the front chassis 161 and maintaining high reliability.

[0279]

[32] Thirty-second embodiment Next, a thirty-second embodiment will be described. FIG. 59 is an external perspective view of the cooling unit of the thirty-second embodiment. The cooling unit 170 of the thirty-first embodiment includes a front chassis 171, a housing 172, a cooling unit main body 173, and a sealing member 174.

[0280] FIG. 60 is an exploded perspective view of the cooling unit of the thirty-second embodiment. In FIG. 60 as well, the front chassis 171 is omitted for ease of understanding. As shown in FIGS. 59 and 60, sealing member 174 is made of rubber and has a C-shape including a first arm portion 174A and a second arm portion 174B.

[0281] FIG. 61 is an explanatory diagram of the assembled state. FIG. 61(A) is an external perspective view of the cooling unit body 173 in an assembled state, and FIG. 61(B) is a front view of the cooling unit body 173 in an assembled state. Sealing member 174 is C-shaped and includes first arm portion 174A and second arm portion 174B, which improves assembly efficiency.

[0282] FIG. 62 is an explanatory diagram of the process of fitting the sealing member into the cooling unit. As shown in Figure 62, when fitting the sealing member 174 into the cooling unit main body 173, the first arm portion 174A and the second arm portion 174B of the sealing member 174 are opened to positions 174AX and 174BX as shown by the dashed lines in Figure 61, and then fitted into the predetermined positions of the cooling unit main body 173.

[0283] In this state, when the first arm portion 174A and the second arm portion 174B are returned to their original positions, the state shown in FIG. 61(B) is obtained. Then, the front chassis 171 (not shown) is placed over the top surface and fixed in place, completing the assembly as shown in FIG.

[0284] According to the configuration of the 32nd embodiment, a sealing state can be reliably ensured between the cooling unit main body 173 and the front chassis 171 and housing 172 through a simple process, thereby ensuring the operation of electronic devices placed anywhere between the housing 172 and the front chassis 171 and maintaining high reliability.

[0285]

[33] Thirty-third embodiment Next, a thirty-third embodiment will be described. FIG. 63 is an exploded perspective view (part 1) of the cooling unit according to the thirty-third embodiment when assembled. The cooling unit 180 of the thirty-third embodiment includes a cooling unit main body housing part 181 and a coupler panel 182.

[0286] The cooling unit main body housing part 181 is formed by integrating the main part of the cooling unit main body and the housing in the above-mentioned embodiment, which reduces the paths for liquid to enter compared to when they are constructed separately, thereby further improving reliability.

[0287] As shown in FIG. 63, the cooling unit main body housing 181 includes a liquid refrigerant flow path forming portion 181A1 that forms a liquid refrigerant flow path, and a fin forming portion 181A2 on which fins are formed. With the coupler panel 182 attached, the liquid refrigerant flow path forming portion 181A1 forms a liquid refrigerant flow path in cooperation with the coupler panel. On the other hand, the coupler panel 182 is provided with an inlet coupler 182A and an outlet coupler 182B on one end side.

[0288] FIG. 64 is an exploded perspective view (part 2) of the cooling unit according to the thirty-third embodiment when assembled. FIG. 64 shows a state in which a coupler panel 182 is attached to a cooling unit main body housing part 181. In this case, the cooling unit main body housing part 181 and the coupler panel 182 are joined by, for example, FSW processing.

[0289] FIG. 65 is an exploded perspective view (part 3) of the cooling unit according to the thirty-third embodiment when assembled. 65, a sealing member 183 for sealing the gap between the coupler panel 182 and a front chassis (described later) to prevent liquid from entering the inside of the cooling unit 180 is attached to predetermined positions of the cooling unit main body housing 181 and the coupler panel 182. The sealing member 183 is made of plastic resin or rubber.

[0290] FIG. 65 is a completed perspective view of the cooling unit of the thirty-third embodiment. FIG. 65 shows a state in which a front chassis 184 is attached to a cooling unit main body housing part 181 so as to cover the coupler panel 182 and the sealing member 183. In this case, the cooling unit main body housing part 181 and the front chassis 184 are fastened together with screws, for example.

[0291] According to the 33rd embodiment, the cooling unit main body housing part 181 is formed integrally with the main part of the cooling unit main body in the above-mentioned embodiments and the housing, so that the possibility of liquid intrusion from the outside can be further reduced compared to when they are formed separately, and it is possible to ensure the operation of electronic devices placed between the cooling unit main body housing part 181 and the front chassis 184 and maintain high reliability.

[0292]

[17] Modifications of the embodiment In the above explanation, except for the explanation of the 16th embodiment, no mention has been made of the sharing of parts, but by forming parts or height adjustment members with height adjustment sections, including the first and second housings of the cooling unit, it is possible to accommodate a variety of substrates, and to efficiently cool the semiconductor chips, which are the parts to be cooled, without increasing the number of parts.

[0293] In the above explanation, we have mainly described the height adjustment portion (height adjustment member) as having a convex shape, but it is also possible to configure it as a concave shape, an opening, or a notch depending on the mounting state of the semiconductor chip, which is the component to be cooled.

[0294] In the above explanation, the component to be cooled is a semiconductor chip, but the present invention is not limited to this and can be applied to any component that requires cooling, such as a storage battery, a transformer, a capacitor, a coil, a resistive element, a crystal oscillator, a Peltier element, etc.

[0295]

[18] Summary As described above, according to each embodiment, a cooling system can be easily constructed on a substrate on which semiconductor chips of various heights are mounted, depending on the mounting state of the semiconductor chips to be cooled, without increasing the manufacturing process or the number of parts.

[0296] Although the embodiments of the present disclosure have been described above, the above-described embodiments are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be embodied in various other forms, and various omissions, substitutions, and modifications can be made without departing from the spirit of the invention. These novel embodiments and modifications thereof are included within the scope and spirit of the invention, and are also included in the scope of the invention and its equivalents as defined in the claims.

[0297] Furthermore, the effects of the embodiments described in this specification are merely examples and are not limiting, and other effects may also be obtained.

[0298] [Note] This embodiment can also be modified as follows. A cooling device according to a first alternative embodiment is a cooling device that cools a plurality of chips to be cooled that are mounted on a substrate, a heat transfer member configured as a single member and having a plurality of height adjustment portions formed thereon in accordance with the height of the chip and the mounting position of the chip; a liquid cooling unit thermally coupled to the heat transfer member and through which a liquid refrigerant is circulated; Equipped with. According to this aspect, it is possible to reduce the number of parts of the heat transfer member, simplify the manufacturing process, and maintain the cooling efficiency.

[0299] A cooling device according to a second aspect of the present invention is the cooling device according to the first aspect of the present invention, wherein the liquid cooling unit has a plate-like shape having two flat cooling surfaces; The heat transfer member is thermally coupled to at least one of the cooling surfaces. According to this aspect, it is possible to realize a cooling device that can accommodate a plurality of types of substrates while using a common liquid supply unit.

[0300] A cooling device according to a third alternative embodiment is the cooling device according to the first alternative embodiment, wherein the height adjustment portion is formed as a convex portion, a concave portion, a notch, or an opening in the heat transfer member. According to this aspect, it is possible to form heat transfer members in various aspects based on the mounting state of the chip to be cooled (position on the substrate, height, relationship with other components).

[0301] A fourth aspect of the cooling device is the cooling device of the first aspect, The heat transfer member has the height adjustment portion formed by pressing a metal plate. According to this aspect, it is possible to easily form height adjustment sections according to the mounting state of a plurality of chips to be cooled.

[0302] A cooling device according to a fifth aspect of the present invention is the cooling device according to the first aspect of the present invention, The heat transfer member has the height adjustment portion formed by forging a metal plate. According to this aspect, it is possible to easily form height adjustment sections according to the mounting state of a plurality of chips to be cooled.

[0303] A cooling device according to a sixth aspect of the present invention is the cooling device according to the first aspect of the present invention, The heat transfer member is brazed to the liquid cooling unit. According to this aspect, the mounting position of the heat transfer member relative to the liquid supply unit does not change, and cooling can be performed reliably.

[0304] A cooling device according to a seventh aspect of the present invention is the cooling device according to the sixth aspect of the present invention, The height adjustment portion is formed as a convex portion, The heat transfer member has holes formed around the height adjustment portion. According to this aspect, when the heat transfer member is brazed to the liquid transfer unit, no air bubbles are trapped in the brazed portion, the thermal resistance is reduced, and cooling can be easily performed.

[0305] The cooling device of another embodiment of the present invention is the cooling device of the first embodiment of the present invention, The heat transfer member is provided on the substrate. According to this aspect, the structure of the liquid cooling unit can be simplified, and the heat transfer member can be used for shielding or grounding.

[0306] A cooling device according to another aspect of the present invention is a cooling device for cooling a plurality of chips to be cooled that are mounted on a substrate, The liquid cooling unit is configured as a single member in which a plurality of height adjustment sections are arranged according to the height of the chip and the mounting position of the chip, and in which a liquid refrigerant is circulated. According to this aspect, it is possible to reduce the number of parts of the heat transfer member, simplify the manufacturing process, and maintain the cooling efficiency.

[0307] A cooling device according to a tenth aspect of the present invention is the cooling device according to the ninth aspect of the present invention, The liquid cooling unit includes a first housing that constitutes a housing; a second housing that constitutes the housing and is integrated with the first housing to form a flow path space through which the liquid refrigerant flows; one or more first fin members disposed in the flow path space; an inlet for introducing the liquid refrigerant into the flow path space; an inlet for discharging the liquid refrigerant from the flow path space; Equipped with The height adjustment portion is formed as the single member in at least one of the first housing and the second housing. According to this aspect, the cooling efficiency can be maintained with a simple configuration.

[0308] The cooling device of another aspect 11 is the cooling device of another aspect 10, The height adjusting portion is formed as a convex portion having a height corresponding to the corresponding chip to be cooled. According to this aspect, it is possible to reliably thermally couple the chip to be cooled, thereby improving the cooling efficiency.

[0309] A cooling device according to a twelfth aspect of the present invention is the cooling device according to the eleventh aspect of the present invention, A second fin member is disposed between the housing and the first fin member on the side of the convex portion facing the flow path space. According to this aspect, it is possible to avoid a decrease in the strength of the cooling device due to the formation of the height adjusting portion, and it is possible to improve reliability.

[0310] The cooling device of another aspect 13 is the cooling device of another aspect 12, A separator is provided between the first fin member and the second fin member to separate the second fin member from the first fin member. According to this aspect, overlapping of the first fin members and the second fin members when stacked can be eliminated, and the flow of the liquid refrigerant can be maintained in a desired state.

[0311] A cooling device according to a fourteenth aspect of the present invention is the cooling device according to the thirteenth aspect of the present invention, The separator has a flat plate shape and is fixed to both the first fin member and the second fin member. According to this aspect, the positional relationship between the first fin member and the second fin member can be stabilized, and a stable liquid refrigerant flow path can be formed.

[0312] A cooling device according to a fifteenth aspect of the present invention is the cooling device according to the thirteenth aspect of the present invention, The separator includes a separator body and a movement restricting member that is bent from the separator body between the fins of the first fin member and abuts against the fins of the first fin member to restrict movement of the separator. According to this aspect, the positional relationship between the first fin member and the second fin member can be stabilized, and a stable liquid refrigerant flow path can be formed.

[0313] A cooling device according to a sixteenth aspect of the present invention is the cooling device according to the thirteenth aspect of the present invention, The separator includes a separator body and and a movement restricting member that is bent from the separator body into the height adjusting portion and abuts against a wall of the height adjusting portion to restrict movement of the separator. According to this aspect, the positional relationship between the first fin member and the second fin member can be stabilized, and a stable liquid refrigerant flow path can be formed.

[0314] A cooling device according to a seventeenth aspect of the present invention is the cooling device according to the thirteenth aspect of the present invention, A bottom plate-equipped extrusion fin is disposed on the side of the convex portion facing the flow path space, in contact with both the housing and the first fin member, and is restricted in movement. According to this aspect, a stable liquid refrigerant flow path can be formed.

[0315] The cooling device of another aspect of the present invention is the cooling device of another aspect of the present invention, A block-shaped height adjuster holding member is disposed on the side of the convex portion facing the flow path space, in contact with both the housing and the first fin member, and is restricted in movement. According to this aspect, a stable liquid refrigerant flow path can be formed.

[0316] A cooling device according to a nineteenth aspect of the present invention is the cooling device according to the ninth aspect of the present invention, The liquid cooling unit includes a first housing that constitutes a housing; a second housing that constitutes the housing and is integrated with the first housing to form a flow path space through which the liquid refrigerant flows; one or more first fin members disposed in the flow path space; an inlet for introducing the liquid refrigerant into the flow path space; an inlet for discharging the liquid refrigerant from the flow path space; Equipped with At least one of the first housing and the second housing has a burring portion; A block-shaped member is inserted into the opening of the burring portion from the side opposite to the side where the first fin member will be located, and the joined member is formed integrally with the housing as the height adjustment portion. According to this aspect, a stable liquid refrigerant flow path can be formed without increasing the number of parts.

[0317] A cooling device according to a twentieth aspect of the present invention is the cooling device according to the ninth aspect of the present invention, The liquid cooling unit includes a first housing that constitutes a housing; a second housing that constitutes the housing and is integrated with the first housing to form a flow path space through which the liquid refrigerant flows; one or more first fin members disposed in the flow path space; an inlet for introducing the liquid refrigerant into the flow path space; an inlet for discharging the liquid refrigerant from the flow path space; Equipped with At least one of the first housing and the second housing has a burring portion; A block-shaped member is inserted into the opening of the burring portion from the side where the first fin member will be located and joined, and is formed integrally with the housing as the height adjustment portion. According to this aspect, a stable liquid refrigerant flow path can be formed without increasing the number of parts.

[0318] A cooling device according to a twenty-first aspect of the present invention is the cooling device according to the eleventh aspect of the present invention, a second fin member is disposed between the housing and the first fin member on the side of the convex portion facing the flow path space; The first fin member and the second fin member have a fin arrangement that is a straight arrangement, a wave arrangement, or an offset arrangement, and both fin members are not in a straight arrangement. According to this aspect, the positional relationship between the first fin member and the second fin member can be stabilized, and a stable liquid refrigerant flow path can be formed.

[0319] A cooling device according to a twenty-second aspect of the present invention is the cooling device according to the ninth aspect of the present invention, The liquid cooling unit includes a first housing that constitutes a housing; a second housing that is integrated with the first housing to form the housing; one or more height adjustment units formed on at least one of the first housing and the second housing; A flow path space through which the liquid refrigerant flows is formed inside the housing including the height adjustment unit, and a three-dimensional fin member is provided in which liquid refrigerant flow paths through which the liquid refrigerant flows in three-dimensional directions within the flow path space are stacked three-dimensionally. According to this aspect, a stable liquid refrigerant flow path can be formed while maintaining heat exchange efficiency.

[0320] A cooling device according to a twenty-third aspect of the present invention is the cooling device according to the twenty-second aspect of the present invention, The three-dimensional fin member is formed by stacking a plurality of sub-three-dimensional fin members. According to this aspect, a stable liquid refrigerant flow path can be ensured, and stable heat exchange can be performed.

[0321] A cooling device according to a 24th aspect of the present invention is the cooling device according to the 22nd aspect of the present invention, The liquid cooling unit includes a first housing that constitutes a housing; a second housing that constitutes the housing and is integrated with the first housing to form a flow path space through which the liquid refrigerant flows; a plurality of first fin members arranged in a stack in the flow path space, through which the liquid refrigerant flows in a zigzag pattern in a direction perpendicular to the overall flow direction; an inlet for introducing the liquid refrigerant into the flow path space; an inlet for discharging the liquid refrigerant from the flow path space; Equipped with At least one of the first housing and the second housing has an opening, The height adjustment member is formed by pressing a thick metal plate member, and has one or more height adjustment portions formed thereon, and is joined to close the opening. According to this aspect, a cooling device that can be adapted to various mounting states can be obtained through a simple manufacturing procedure.

[0322] A cooling device according to another aspect of the present invention includes: A cooling device that cools a plurality of components to be cooled that are mounted on a board, a liquid cooling unit configured as a single member in which a plurality of height adjustment units are arranged according to the height of the component to be cooled and the mounting position of the component to be cooled, and in which a liquid refrigerant is circulated; The liquid cooling unit includes a first housing that constitutes a housing; a second housing that constitutes the housing and is integrated with the first housing to form a flow path space through which the liquid refrigerant flows; one or more fin members disposed in the flow path space; an inlet for introducing the liquid refrigerant into the flow path space; an outlet for discharging the liquid refrigerant from the flow path space; Equipped with A convex portion in the flow path is provided in the flow path space downstream of the inlet or upstream of the outlet to reduce unevenness in the distribution of the liquid refrigerant flow and make it closer to uniformity. According to this aspect, the effective cooling efficiency can be improved.

[0323] A cooling device according to a 26th aspect of the present invention is the cooling device according to the 25th aspect of the present invention, The convex portion within the flow path is formed on at least one of the first housing and the second housing. According to this aspect, the uneven flow of the liquid refrigerant can be improved, and the effective cooling efficiency can be improved.

[0324] A cooling device according to a 27th aspect of the present invention is the cooling device according to the 25th aspect of the present invention, The convex portions within the flow path are provided at opposing positions on both the first housing and the second housing, and the convex portions within the flow path at opposing positions are joined together. According to this aspect, it is possible to improve the cooling efficiency while increasing the strength of the housing and suppressing deformation of the housing.

[0325] A cooling device according to a twenty-eighth aspect of the present invention is the cooling device according to the twenty-seventh aspect of the present invention, The opposing inner convex portions have different lengths in the extending direction of the flow path space. According to this aspect, the diffusion of the liquid refrigerant can be further promoted.

[0326] A cooling device according to a twenty-ninth aspect of the present invention is the cooling device according to the twenty-fifth aspect of the present invention, The shape of the convex portion in the flow path provided downstream of the inlet is the same as the shape of the convex portion in the flow path provided upstream of the outlet. According to this aspect, the unevenness of the flow of the liquid refrigerant can be similarly improved downstream of the inlet and upstream of the outlet, thereby improving the effective cooling efficiency.

[0327] A cooling device according to a 30th aspect of the present invention is the cooling device according to the 25th aspect of the present invention, The shape of the convex portion in the flow path provided downstream of the inlet is different from the shape of the convex portion in the flow path provided upstream of the outlet. According to this aspect, it is possible to preferably improve the bias of the flow of the liquid refrigerant downstream of the inlet and upstream of the outlet, thereby improving the effective cooling efficiency.

[0328] A cooling device according to a 30th aspect of the present invention is the cooling device according to the 25th aspect of the present invention, the convex portion in the flow path provided downstream of the inlet is shaped to diffuse the liquid refrigerant, The convex portion in the flow passage provided upstream of the outlet is shaped to suppress the generation of vortex currents. According to this aspect, the amount of liquid refrigerant remaining in the cooling device can be reduced, thereby improving heat exchange efficiency.

[0329] A cooling device according to a thirty-first aspect of the present invention is the cooling device according to the twenty-fifth aspect of the present invention, a plurality of the fin members are provided between the inlet and the outlet, The convex portion in the flow passage is provided between the upstream fin member and the downstream fin member. According to this aspect, even in the middle of the flow path space, the unevenness of the flow of the liquid refrigerant is reduced, and the heat exchange efficiency is further improved, thereby enabling cooling.

[0330] A cooling device according to another aspect of the thirty-second aspect includes: A cooling device that cools a plurality of components to be cooled that are mounted on a board, a liquid cooling unit thermally coupled to the component to be cooled and configured to cool the component to be cooled by flowing a liquid refrigerant through a liquid refrigerant flow path; an inlet for introducing a liquid refrigerant into the liquid refrigerant flow path; an outlet for discharging the liquid refrigerant from the liquid refrigerant flow path; a housing that houses the liquid cooling unit with the inlet and the outlet protruding, The housing has a guide member that guides the liquid to be removed in a predetermined direction. According to this aspect, it is possible to prevent the liquid to be removed from reaching the component to be cooled, thereby improving reliability.

[0331] A cooling device according to a thirty-third aspect of the present invention is the cooling device according to the thirty-second aspect of the present invention, The liquid to be removed is The liquid is a liquid that has entered the housing or a liquid that has been generated within the housing. According to this aspect, it is possible to deal with either liquid to be removed that has entered from the outside or liquid to be removed that has been generated within the housing, and the impact on multiple components to be cooled mounted on the board can be reduced, ensuring reliable cooling.

[0332] A cooling device according to a thirty-fourth aspect of the present invention is the cooling device according to the thirty-second aspect of the present invention, the housing is provided with one or more drain holes for discharging the liquid to be removed outside the housing, The guide member guides the liquid to be removed to the drain hole. According to this aspect, the liquid to be removed is guided to the outside of the housing through the drain hole, so that the influence on the multiple components to be cooled mounted on the board is suppressed, and cooling can be performed reliably.

[0333] A cooling device according to a thirty-fifth aspect of the present invention is the cooling device according to the thirty-second aspect of the present invention, The guide member has a slope, and the slope guides the liquid to be removed in a predetermined direction. According to this aspect, the liquid to be removed is guided in a predetermined direction by the slope, so that the influence on the multiple components to be cooled mounted on the board is suppressed, and cooling can be performed reliably.

[0334] The guide member is provided on the upper surface of the housing, and guides the liquid that has reached it from above via the slope to the side surface of the housing.

[0335] A cooling device according to a thirty-sixth aspect of the present invention is the cooling device according to the thirty-fifth aspect of the present invention, The guide member is provided on the upper surface of the housing, and guides the liquid that has reached it from above via the slope to the side surface of the housing. According to this aspect, the liquid to be removed is guided by the slope as it arrives from above to the side of the housing, thereby minimizing the impact on the multiple components to be cooled mounted on the board and ensuring reliable cooling.

[0336] A cooling device according to a thirty-seventh aspect of the present invention is the cooling device according to the thirty-second aspect of the present invention, The guide member is made of a material capable of absorbing and retaining a predetermined amount of the liquid to be removed. According to this aspect, the movement of the liquid to be removed is restricted, and the influence on the multiple components to be cooled mounted on the board is suppressed, thereby ensuring reliable cooling.

[0337] A cooling device according to a thirty-eighth aspect of the present invention is the cooling device according to the thirty-sixth aspect of the present invention, The guide member is attached to the surface of the liquid cooling unit. According to this aspect, the guide member can reliably guide the liquid to be removed from the surface of the liquid cooling unit, thereby ensuring reliable cooling while minimizing the impact on multiple components to be cooled mounted on the board.

[0338] A cooling device according to a thirty-ninth aspect of the present invention is the cooling device according to the thirty-seventh aspect of the present invention, The guide member is formed so that the tip in the direction of gravity becomes gradually thinner, and the liquid to be removed that can no longer be held is released from the tip in the direction of gravity by its own weight. According to this aspect, the liquid to be removed that can no longer be held is released from the gravity-direction tip of the guide member due to its own weight, so the liquid to be removed can be reliably guided without any control, and cooling can be reliably performed while minimizing the impact on multiple components to be cooled mounted on the board.

[0339] A cooling device according to a fortieth aspect of the present invention is the cooling device according to the thirty-ninth aspect of the present invention, A discharge hole is provided below the tip in the direction of gravity to discharge the liquid to be removed outside the housing. According to this aspect, the liquid to be removed can be reliably discharged outside the housing.

[0340] A cooling device according to a forty-first aspect of the present invention is the cooling device according to the thirty-ninth aspect of the present invention, The guide member is made of a nonwoven fabric. According to this aspect, the liquid to be removed can be reliably guided with a simple configuration.

[0341] A cooling device according to another aspect of the forty-second aspect includes: A cooling device that cools a plurality of components to be cooled that are mounted on a board, a housing integrally formed with a liquid cooling unit that is thermally coupled to the component to be cooled and that cools the component to be cooled by causing a liquid refrigerant to flow through a liquid refrigerant flow path; an inlet port projecting from the liquid cooling unit and configured to introduce a liquid refrigerant into the liquid refrigerant flow path; an outlet provided in the liquid cooling unit and configured to discharge the liquid refrigerant from the liquid refrigerant flow path; Equipped with. According to this aspect, the liquid cooling unit is provided with a housing integrally formed therewith, so that the generation of liquid to be removed and the liquid to be removed from reaching the components to be cooled can be suppressed, thereby improving reliability.

[0342] A cooling device according to a 43rd aspect of the present invention is the cooling device according to the 32nd aspect or the 42nd aspect, The housing is capable of housing a board on which components to be cooled are mounted. According to this aspect, cooling can be performed more efficiently.

[0343] The in-vehicle device of a 44th alternative aspect includes a cooling device of any one of the 32nd alternative aspect to the 42nd alternative aspect, the substrate on which the plurality of components to be cooled are mounted; Equipped with. According to this aspect, it is possible to prevent the liquid to be removed from reaching the component to be cooled, thereby improving the reliability of the in-vehicle equipment.

[0344] The in-vehicle device of another aspect of the present invention is the in-vehicle device of another aspect of the present invention, The cooling device and the board are housed in the housing. According to this aspect, the cooling efficiency of the board can be improved, and in turn, the reliability of the in-vehicle device can be improved.

[0345] The in-vehicle device of another aspect of the present invention is the in-vehicle device of another aspect of the present invention, The cooling device and the plurality of boards are housed in the housing. According to this aspect, the cooling efficiency of the plurality of substrates can be improved, and the reliability of the in-vehicle equipment can be improved.

[0346] The in-vehicle device according to another aspect of the present invention includes the cooling device according to another aspect of the present invention, The cooling device includes a substrate on which the plurality of components to be cooled are mounted. According to this aspect, the liquid cooling unit is provided with a housing integrally formed therewith, so that the generation of liquid to be removed and the liquid to be removed from reaching the components to be cooled on the substrate can be prevented, thereby improving reliability.

[0347] The in-vehicle device of another aspect of the present invention is the in-vehicle device of another aspect of the present invention, The housing is capable of housing a board on which components to be cooled are mounted. According to this aspect, the number of parts can be reduced, thereby further improving reliability. [Explanation of symbols]

[0348] 10 Onboard equipment 11 Top panel 12 First board 12, 22 Heat transfer section CB 13, 13A, 13D, 13F, 13G, 13H, 13J, 13K, 13L, 13M, 13N, 22, 91, 132, 160, 170, 180, CU Cooling Unit 13A1, 13D1 1st housing 13A2, 13D2, 14A2 Second housing 14A, 14C side chassis 14B Side cover 15 Central Chassis 16 Second board 17 Bottom panel 21, 41, 51B, 51F, 101, 113 Heat transfer members 21A1, 21A2, 51B1, AD1 to AD4, AD11 to AD15, AD21, AD31 to AD34, AD41, AD51, AD52, AD61, AD81 to AD84 Height adjustment section 21A1, 21A2 adjustment section 22, 52, 71, 81, 111, 121, 133, 163, 173 Cooling unit body SB1, SB2, SB21, SB22, SB23, SB31 boards SB22H opening 22SF2, SF2 second side 23A, 53A, 72A, 123A, 130, 133A, 182A Introductory Coupler 23B, 53B, 72B, 123B, 133B, 182B Derived Coupler 24, 24A, 54A, 73, 73A screw fastening part 24A Locating Pin 24B, 54B studs 31, 61, 73, 75, 92 Liquid refrigerant flow path 32, 62B, 76A1~76A3 Fins 32S straight fin 33 Second Fin 33W Wave Fin 34, 34A, 34B spacers 34A1 Bending part 34B1 Bending protrusion 35 Extruded fin with base plate 36 Block-shaped members 52A, 52F, 72BF, 91F, 121F First cooling unit main body 52B, 72BB, 91B, 121B Second cooling unit main body 55A, 55B, 55C, 55D, 55F, 55G, 55H, 55J, 55K, 55L, 74A, 74B, 77 Convex part in flow path 57 Joint 62A, 62C, 63B, 76A, 76B, 76C, 76D Fins (rectifier plates) 72H, 72H1, 72H2, OHL opening 81 Casing 82 Screw 83, 84 O-ring 85 Heat insulating convex part 85X space 91C Frame 112 Liquid refrigerant path 121C Insertion hole 121D through hole 122, 125, 127, 129, 131 Slit members 122A, 122B, 125A, 125B, 127A, 127B, 129A, 129B, 131A, 131B Slit group 131 Threaded part 131, 132, 162, 172 housing 131, 161, 171, 184 Front Chassis 131A screw groove 132 Introductory coupler body 132A opening part 135 Liquid intrusion prevention wall member 135A side 136 Liquid intrusion prevention member 141 Liquid guide member 151, 151A, 151B, 1511A Liquid drain hole 152A, 152B, 152C Slope members 155, 155A, 155B Liquid absorption member 156A, 156B part 162A Engagement protrusion 162B Contact surface 164, 174, 183 Sealing material 164A First sealing member 164B Second sealing member 174A First Arm 174B Second Arm 181 Cooling unit main body housing 181A1 Liquid refrigerant flow path forming portion 181A2 Fin forming section 182 Coupler Panel AD1, AD2, AD21, AD61 height adjustment members AD51, AD52 truncated cone block members AD51 Disc-shaped block member AD60 metal plank BR Burring section CCCU Refrigerant Cooling / Circulation Unit CB1 Cooling Block CB11, CB21 Lid CL1 Introductory Coupler CL2 Derived Coupler CB1H1, CB1H2 opening CP1~CP4, CP11~CP15, CP21~CP24, CP30~CP32, CP41~CP44, CP51~CP53 Semiconductor chips GF1, GF2, GF3 Gap Filler HL hole MB1, MB2, MB3 Metal Blocks SB2 Second board SF1 page 1 SYS Substrate Cooling System TGR thermal conductive material

Claims

1. A cooling device that cools a plurality of components to be cooled that are mounted on a board, a liquid cooling unit thermally coupled to the component to be cooled and configured to cool the component to be cooled by flowing a liquid refrigerant through a liquid refrigerant flow path; an inlet for introducing a liquid refrigerant into the liquid refrigerant flow path; an outlet for discharging the liquid refrigerant from the liquid refrigerant flow path; a housing that houses the liquid cooling unit with the inlet and outlet protruding, The housing has a guide member that guides the liquid to be removed in a predetermined direction. cooling equipment.

2. The liquid to be removed is The liquid is a liquid that has entered the housing or a liquid that has been generated within the housing. The cooling device according to claim 1 .

3. the housing is provided with one or more drain holes for discharging the liquid to be removed outside the housing, The guide member guides the liquid to be removed to the drain hole. The cooling device according to claim 1 .

4. the guide member has a slope, and the slope guides the liquid to be removed in a predetermined direction. The cooling device according to claim 1 .

5. the guide member is provided on the top surface of the housing and guides the liquid that has reached the top surface of the housing via the slope to the side surface of the housing. The cooling device according to claim 4.

6. The guide member is formed of a material capable of absorbing and retaining a predetermined amount of the liquid to be removed. The cooling device according to claim 1 .

7. the guide member is attached to a surface of the liquid cooling unit; The cooling device according to claim 5.

8. the guide member is formed so that the tip in the gravity direction becomes gradually thinner, and the liquid to be removed that can no longer be held is released from the tip in the gravity direction by its own weight; The cooling device according to claim 6.

9. a drain hole for draining the liquid to be removed outside the housing is provided below the tip in the gravity direction; The cooling device according to claim 8.

10. The guide member is made of a nonwoven fabric. The cooling device according to claim 7.

11. A cooling device that cools a plurality of components to be cooled that are mounted on a board, a housing integrally formed with a liquid cooling unit that is thermally coupled to the component to be cooled and that cools the component to be cooled by causing a liquid refrigerant to flow through a liquid refrigerant flow path; an inlet port projecting from the liquid cooling unit and configured to introduce a liquid refrigerant into the liquid refrigerant flow path; an outlet provided in the liquid cooling unit and configured to discharge the liquid refrigerant from the liquid refrigerant flow path; Cooling equipment equipped with.

12. The housing is capable of accommodating a board on which components to be cooled are mounted. The cooling device according to claim 1 or 11.

13. A cooling device according to any one of claims 1 to 10; the substrate on which the plurality of components to be cooled are mounted; An in-vehicle device comprising:

14. The in-vehicle device according to claim 13 , comprising a plurality of the substrates.

15. the cooling device and the board are housed in the housing; The in-vehicle device according to claim 13.

16. the cooling device and the plurality of boards are housed in the housing; The in-vehicle device according to claim 14.

17. A cooling device according to claim 11; the substrate on which the plurality of components to be cooled are mounted; An in-vehicle device comprising:

18. The housing is capable of accommodating a board on which components to be cooled are mounted. The in-vehicle device according to claim 17.

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