Component mounting device and component mounting method

Abstract

To prevent contact between components mounted on the back surface of a board and a backup pin. [Solution] The component mounting device includes a substrate transport device that transports a substrate while supporting its edges, backup pins that support the back surface of the substrate, a mounting head that mounts components on the front surface of the substrate, a pin moving device that moves the backup pins, a height sensor that detects the height of the back surface of the substrate, and a controller. The controller has an identifying unit that identifies mounting areas on the back surface of the substrate where components are mounted and non-mounting areas where components are not mounted based on detection data from the height sensor, a pin control unit that controls the pin moving device so that the backup pins support the non-mounting areas, and a head control unit that controls the mounting head so that components are mounted on the front surface of the substrate while the backup pins are supporting the non-mounting areas.

Description

[Technical Field]

[0001] The technologies disclosed herein relate to component mounting apparatus and component mounting methods. [Background technology]

[0002] Component mounting devices may use backup pins such as those disclosed in Patent Document 1. The backup pins support the rear surface of the board to prevent the board from bending. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2016-171126 Summary of the Invention [Problem to be solved by the invention]

[0004] When components are mounted on the back of a circuit board, there is a need for technology to prevent backup pins from contacting those components.

[0005] The technology disclosed herein aims to suppress contact between components mounted on the back surface of a substrate and backup pins. [Means for solving the problem]

[0006] This specification discloses a component mounting apparatus. The component mounting apparatus includes a substrate transport device that transports a substrate while supporting its edge, backup pins that support the back surface of the substrate, a mounting head that mounts components on the front surface of the substrate, a pin moving device that moves the backup pins, a height sensor that detects the height of the back surface of the substrate, and a controller. The controller includes an identifying unit that identifies a mounting area on the back surface of the substrate where components are mounted and a non-mounting area where components are not mounted based on detection data from the height sensor, a pin control unit that controls the pin moving device so that the backup pins support the non-mounting area, and a head control unit that controls the mounting head so that components are mounted on the front surface of the substrate while the backup pins support the non-mounting area. [Effects of the Invention]

[0007] According to the technology disclosed in this specification, contact between the backup pin and components mounted on the back surface of the board is suppressed. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a plan view schematically showing a component mounting apparatus according to an embodiment. [Figure 2] FIG. 2 is a side view schematically showing the component mounting apparatus according to the embodiment. [Figure 3] FIG. 3 is a block diagram showing a controller of the component mounting apparatus according to the embodiment. [Figure 4] FIG. 4 is a flowchart showing a component mounting method according to the embodiment. [Figure 5] FIG. 5 is a diagram for explaining a method for detecting the height of the rear surface of a substrate according to an embodiment. [Figure 6] FIG. 6 is a diagram for explaining a mounting area and a non-mounting area according to the embodiment. [Figure 7] FIG. 7 is a diagram for explaining a component mounting method according to the embodiment. [Figure 8] FIG. 8 is a plan view schematically showing a component mounting apparatus according to a first modified example of the embodiment. [Figure 9] FIG. 9 is a side view schematically showing a component mounting apparatus according to a second modified example of the embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0009] Embodiments of the present invention will be described below with reference to the drawings, but the present invention is not limited to these embodiments. The components of the embodiments described below can be combined as appropriate. Some components may not be used.

[0010] In the following description, an XYZ Cartesian coordinate system is set for the component mounting device 1, and the positional relationships of each part are described with reference to this XYZ Cartesian coordinate system. The direction parallel to the X-axis (first axis) on a predetermined plane is defined as the X-axis direction (first axis direction). The direction parallel to the Y-axis (second axis) perpendicular to the X-axis on a predetermined plane is defined as the Y-axis direction (second axis direction). The direction parallel to the Z-axis (third axis) perpendicular to the predetermined plane is defined as the Z-axis direction (third axis direction). The direction of rotation or tilting around the X-axis is defined as the θX direction. The direction of rotation or tilting around the Y-axis is defined as the θY direction. The direction of rotation or tilting around the Z-axis is defined as the θZ direction. The predetermined plane is the XY plane. In this embodiment, the predetermined plane is assumed to be parallel to the horizontal plane. The Z-axis direction is the vertical direction (up and down direction). The +Z side is the upper side, and the -Z side is the lower side.

[0011] [Component mounting equipment] Figure 1 is a schematic plan view showing a component mounting apparatus 1 according to an embodiment. Figure 2 is a schematic side view showing a component mounting apparatus 1 according to an embodiment. The component mounting apparatus 1 includes a substrate transport device 2 that supports the edge of the substrate P in the Y-axis direction and transports the substrate P, backup pins 3 that support the back surface Pb of the substrate P, a mounting head 5 that mounts components C on the surface Pa of the substrate P, a pin moving device 6 that moves the backup pins 3, and a height sensor 7 that detects the height of the back surface Pb of the substrate P.

[0012] The substrate transport device 2 transports the substrate P from the entrance position Q1 to the processing position Q2. The entrance position Q1 is positioned on the -X side of the processing position Q2. The substrate transport device 2 transports the substrate P to the +X side. The processing position Q2 is a position where a mounting process is performed to mount the component C on the substrate P. The entrance position Q1 is a position where a carry-in process is performed to carry the substrate P into the processing position Q2.

[0013] The substrate transfer device 2 supports the substrate P so that the front surface Pa of the substrate P faces upward and the back surface Pb of the substrate P faces downward. The front surface Pa of the substrate P and the back surface Pb of the substrate P are substantially parallel. The substrate transfer device 2 supports the substrate P so that the back surface Pb of the substrate P is parallel to the XY plane. The substrate transfer device 2 transfers the substrate P while maintaining the back surface Pb of the substrate P parallel to the XY plane. At both the entrance position Q1 and the processing position Q2, the back surface Pb of the substrate P is parallel to the XY plane.

[0014] In the XY plane, the outer shape of the substrate P is rectangular. The substrate P is long in the X-axis direction. The substrate transfer device 2 transfers the substrate P in the longitudinal direction of the substrate P.

[0015] The substrate transport device 2 has a pair of guide members 21 that guide the substrate P, a pair of transport belts 22 that support and transport the ends of the substrate P, and a plurality of pulleys 23 that support the transport belts 22. The guide members 21 are long in the X-axis direction. One guide member 21 and the other guide member 21 are arranged at a distance in the Y-axis direction. The guide members 21 guide the substrate P in the X-axis direction. The transport belts 22 are circular. The transport belts 22 are endless belts. One transport belt 22 and the other transport belt 22 are arranged at a distance in the Y-axis direction. The pair of transport belts 22 support both ends of the substrate P in the Y-axis direction. One transport belt 22 supports the end on the +Y side of the back surface Pb of the substrate P from below. The other transport belt 22 supports the end on the -Y side of the back surface Pb of the substrate P from below. At least one of the plurality of pulleys 23 is a drive pulley that is rotated by a transport motor. The drive pulley rotates by the rotational force generated by the transport motor while supporting the transport belt 22. The rotation of the drive pulley causes the transport belt 22 to rotate. The substrate P is transported in the X-axis direction by the rotation of the transport belt 22. After the substrate P is placed at the processing position Q2, both ends of the substrate P in the Y-axis direction are clamped by a clamping mechanism (not shown). The clamping mechanism fixes the substrate P at the processing position Q2.

[0016] The backup pins 3 support the back surface Pb of the substrate P located at the processing position Q2. In this embodiment, two backup pins 3 are provided. The backup pins 3 include a first backup pin 31 and a second backup pin 32. In the X-axis direction, the first backup pin 31 and the second backup pin 32 are positioned at different locations. The first backup pin 31 is positioned -X side than the second backup pin 32. The first backup pin 31 moves within a first movement range in the XY plane. The second backup pin 32 moves within a second movement range in the XY plane, which is different from the first movement range. The first movement range of the first backup pin 31 is positioned -X side than the second movement range of the second backup pin 32. In this embodiment, each of the first backup pin 31 and the second backup pin 32 moves in the X-axis direction. The first backup pin 31 moves within a first movement range in the X-axis direction. The second backup pin 32 moves within a second movement range in the X-axis direction.

[0017] The mounting head 5 has a nozzle 4 for holding components C. The mounting head 5 mounts components C onto the surface Pa of the substrate P located at the processing position Q2. With the back surface Pb of the substrate P supported by the backup pins 3, the mounting head 5 mounts the components C held by the nozzle 4 onto the surface Pa of the substrate P. The mounting head 5 holds the components C supplied from the component feeder with the nozzle 4 and mounts them onto the surface Pa of the substrate P.

[0018] The mounting head 5 is movable in the X-axis and Y-axis directions by a head moving device (not shown). The mounting head 5 supports the nozzle 4 so that it is movable in the Z-axis and θZ directions. The nozzle 4 is movable in the Z-axis and θZ directions by a nozzle moving device (not shown). The nozzle 4 is movable in four directions: X-axis, Y-axis, Z-axis, and θZ by the head moving device and the nozzle moving device. The nozzle 4 may also be movable in six directions: X-axis, Y-axis, Z-axis, θX, θY, and θZ. The mounting head 5 holds the component C supplied from the component feeder with the nozzle 4, transports it to the processing position Q2, and then mounts it on the surface Pa of the substrate P.

[0019] The pin moving device 6 moves the backup pin 3 in the XY plane. In one embodiment, the pin moving device 6 moves the backup pin 3 in the X-axis direction. The pin moving device 6 includes a slider 61 to which the lower end of the backup pin 3 is fixed, and a guide rail 62 that guides the slider 61 in the X-axis direction. The position of the guide rail 62 is fixed. The pin moving device 6 includes a linear motor. The slider 61 includes the movable element of the linear motor. The guide rail 62 includes the stator of the linear motor. The linear motor may be a moving coil type, where the movable element is a coil and the stator is a magnet. The linear motor may also be a moving magnet type, where the movable element is a magnet and the stator is a coil.

[0020] The slider 61 includes a first slider 611 to which the lower end of the first backup pin 31 is fixed, and a second slider 612 to which the lower end of the second backup pin 32 is fixed. The guide rail 62 guides the first slider 611 and the second slider 612 in the X-axis direction. The first slider 611 moves in the X-axis direction on the -X side of the second slider 612. The second slider 612 moves in the X-axis direction on the +X side of the first slider 611.

[0021] The backup pin 3 has a base portion 3A fixed to the slider 61 and a pin portion 3B, at least a part of which is positioned above the base portion 3A. The lower end of the base portion 3A is fixed to the slider 61. The pin portion 3B protrudes upward from the upper end of the base portion 3A. The backup pin 3 supports the back surface Pb of the substrate P with the upper end of the pin portion 3B. The pin portion 3B is fixed to the base portion 3A. The pin portion 3B may also be movable in the Z-axis direction relative to the base portion 3A by a pin actuator (not shown).

[0022] The backup pin 3 is positioned between one conveyor belt 22 and the other conveyor belt 22 in the Y-axis direction. The backup pin 3 supports the center of the back surface Pb of the substrate P in the Y-axis direction. The guide rail 62 is positioned so that the backup pin 3 supports the center of the back surface Pb of the substrate P in the Y-axis direction.

[0023] The height sensor 7 detects the height of the back surface Pb of the substrate P. The height sensor 7 detects the height of the back surface Pb of the substrate P while the edge of the substrate P in the Y-axis direction is supported by the substrate transport device 2.

[0024] The height sensor 7 detects the height of the back surface Pb of the substrate P without coming into contact with the substrate P. The height sensor 7 is an optical sensor having a light-emitting section that irradiates detection light onto the substrate P and a light-receiving section that receives the detection light reflected by the substrate P. The height sensor 7 is arranged below the substrate P that is transported by the substrate transport device 2. The height sensor 7 is arranged at a position facing the back surface Pb of the substrate P that is arranged at the entrance position Q1. The height sensor 7 detects the height of the back surface Pb of the substrate P that is arranged at the entrance position Q1.

[0025] The height sensor 7 is disposed on the -X side (the entrance position Q1 side) of the guide rail 62 of the pin moving device 6. The position of the height sensor 7 is fixed. The height sensor 7 detects the height of the back surface Pb of the substrate P while the substrate P is passing through the entrance position Q1 by the substrate transport device 2. The height sensor 7 detects the height of the back surface Pb of the substrate P before the substrate P is transported to the processing position Q2.

[0026] In the Y-axis direction, the height sensor 7 is disposed at the same position as the backup pins 3 (guide rails 62). The height sensor 7 detects the height of the center of the back surface Pb of the substrate P at least in the Y-axis direction. The detection range of the height sensor 7 is set so as to include the center of the back surface Pb of the substrate P in the Y-axis direction. The detection range of the height sensor 7 includes the irradiation range of the detection light. The detection range of the height sensor 7 is set so as to include at least a partial area of ​​the back surface Pb of the substrate P that can be supported by the backup pins 3.

[0027] [controller] FIG. 3 is a block diagram showing the controller 8 of the component mounting apparatus 1 according to the embodiment. The component mounting apparatus 1 includes the controller 8. The controller 8 includes a computer. The controller 8 has a processor 8A, a main memory 8B, a storage 8C, and an input / output interface 8D. The processor 8A includes a central processing unit (CPU) or a microprocessing unit (MPU). The main memory 8B includes a non-volatile memory such as a read-only memory (ROM) or a volatile memory such as a random access memory (RAM). The storage 8C is a non-transitory tangible storage medium. Examples of the storage 8C include a magnetic disk, a magneto-optical disk, or a semiconductor memory. The input / output interface 8D includes an input / output circuit. The functions of the controller 8 are stored in the storage 8C as a computer program. The processor 8A reads the computer program from the storage 8C, loads it into the main memory 8B, and executes processing in accordance with the computer program. The computer program may be distributed to the controller 8 via a network. The processor 8A is connected to the substrate transport device 2, the mounting head 5, the pin moving device 6, and the height sensor 7 via an input / output interface 8D.

[0028] The processor 8A includes a board control unit 81, a head control unit 82, a pin control unit 83, a profile generation unit 84, and an identification unit 85. The storage 8C includes a profile storage unit 86.

[0029] The board control unit 81 outputs a control command for controlling the board transport device 2. The head control unit 82 outputs a control command for controlling the mounting head 5 including the nozzle 4. The pin control unit 83 outputs a control command for controlling the pin moving device 6. The profile generation unit 84 generates profile data indicating the three-dimensional shape of the back surface Pb of the board P based on the detection data of the height sensor 7. The identification unit 85 identifies a mounting area M on the back surface Pb of the board P where a component C is mounted and a non-mounting area N on which a component C is not mounted, based on the detection data of the height sensor 7. The profile storage unit 86 stores the profile data generated by the profile generation unit 84. The identification unit 85 identifies the mounting area M and the non-mounting area N based on the profile data stored in the profile storage unit 86.

[0030] [Component mounting method] 4 is a flowchart showing a component mounting method according to an embodiment. A substrate P is carried into an entrance position Q1 of a substrate transport device 2 from an upstream device of the component mounting device 1. An example of an upstream device of the component mounting device 1 is a solder printing device that applies cream solder to the front surface Pa of the substrate P. The substrate control unit 81 controls the substrate transport device 2 so that the substrate P is carried from the entrance position Q1 to a processing position Q2. The substrate P is carried from the entrance position Q1 to the processing position Q2. The height sensor 7 detects the height of the back surface Pb of the substrate P in parallel with the carrying in of the substrate P (step S1).

[0031] 5 is a diagram for explaining a method for detecting the height of the rear surface Pb of a substrate P according to an embodiment. As shown in FIG. 5, components C have already been mounted on the rear surface Pb of the substrate P. The substrate P with components C mounted on the rear surface Pb passes through an entrance position Q1. The substrate P with components C mounted on the rear surface Pb is carried from the entrance position Q1 to a processing position Q2.

[0032] The height sensor 7 detects the height of the back surface Pb of the substrate P while the substrate P is passing through the entrance position Q1 by the substrate transport device 2. The height sensor 7 also irradiates detection light onto the back surface Pb of the substrate P while the substrate P is passing through the entrance position Q1.

[0033] The height of the back surface Pb of the substrate P refers to the position of the back surface Pb in the Z-axis direction. The height of the back surface Pb of the substrate P includes the height of the components C mounted on the back surface Pb of the substrate P. The height of the components C includes the position of the bottom surface of the components C in the Z-axis direction. Detecting the height of the back surface Pb of the substrate P includes detecting the height of the components C mounted on the back surface Pb of the substrate P. Irradiating the back surface Pb of the substrate P with detection light includes irradiating the components C mounted on the back surface Pb of the substrate P with detection light.

[0034] The profile generation unit 84 acquires detection data from the height sensor 7. The profile generation unit 84 generates profile data indicating the three-dimensional shape of the back surface Pb of the substrate P based on the detection data from the height sensor 7. The profile data includes the three-dimensional shapes of the components C mounted on the back surface Pb of the substrate P. The profile data includes position data of the back surface Pb of the substrate P in the Z-axis direction along at least the X-axis direction. The profile data includes position data of multiple detection points on the back surface Pb of the substrate P in the X-axis direction, Y-axis direction, and Z-axis direction. The profile data includes the three-dimensional shape of the back surface Pb of the substrate P. The profile data generated by the profile generation unit 84 is stored in the profile storage unit 86 (step S2).

[0035] The identification unit 85 identifies the mounting area M on the back surface Pb of the substrate P where component C is mounted and the non-mounted area N where component C is not mounted, based on the profile data stored in the profile storage unit 86 (step S3).

[0036] Figure 6 is a diagram illustrating the mounting area M and non-mounting area N according to the embodiment. As shown in Figure 6, the profile data includes profile lines PL that show the three-dimensional shape of the back surface Pb of the substrate P. The back surface Pb of the substrate P is a flat surface parallel to the XY plane. Of the profile lines PL, the reference profile line representing the back surface Pb of the substrate P is parallel to the XY plane. Of the profile lines PL, the component profile line representing component C protrudes downward from the reference profile line. The identification unit 85 can identify the mounting area M and non-mounting area N based on the reference profile line representing the back surface Pb of the substrate P and the component profile line representing component C from the profile lines PL. The identification unit 85 can identify the mounting area M and non-mounting area N based on the amount of protrusion of the component profile line that protrudes downward from the reference profile line. The identification unit 85 determines that the portion where the amount of protrusion of the profile line PL that protrudes downward from the reference profile line is greater than or equal to a predetermined threshold is the mounting area M.

[0037] The specific unit 85 sets up multiple divided areas D on the back surface Pb of the substrate P based on the number of backup pins 3. The specific unit 85 sets up the divided areas D such that the areas of the multiple divided areas D are equal to each other. The specific unit 85 sets up multiple divided areas D by dividing the back surface Pb of the substrate P equally according to the number of backup pins 3. In this embodiment, the number of backup pins 3 is 2. The specific unit 85 divides the back surface Pb of the substrate P into a first divided area D1 and a second divided area D2. The specific unit 85 divides the back surface Pb of the substrate P equally into a first divided area D1 and a second divided area D2 (step S4).

[0038] The first division area D1 is the division area D supported by the first backup pin 31. The second division area D2 is the division area D supported by the second backup pin 32. The first backup pin 31 is located on the -X side of the second backup pin 32. The first division area D1 is set on the -X side of the second division area D2. In the XY plane, the outline and area of ​​the first division area D1 and the outline and area of ​​the second division area D2 are substantially equal.

[0039] The specifying unit 85 determines a support position G in the divided area D where the backup pin 3 supports. The support position G is a position where the upper end of the pin portion 3B comes into contact with the rear surface Pb of the substrate P. The specifying unit 85 sets the support position G in the non-mounting area N that is closest to the center of the divided area D in the XY plane (step S5).

[0040] In this embodiment, the backup pin 3 moves only in the X-axis direction. In this embodiment, the center of the divided area D refers to the center of the divided area D in the X-axis direction.

[0041] The support position G is determined so that the backup pin 3 and component C do not come into contact. The specific unit 85 determines the support position G so as to be closest to the center of the divided area D and satisfy the condition that the backup pin 3 and component C do not come into contact. Based on the profile data of the back surface Pb of the substrate P and the known shape and dimensions of the backup pin 3, the specific unit 85 can determine the support position G so as to be closest to the center of the divided area D and satisfy the condition that the backup pin 3 and component C do not come into contact.

[0042] If the center of divided area D is located in non-mounting area N, support position G is determined to be the center of divided area D. If the center of divided area D is located in non-mounting area N, there is a possibility that backup pin 3 and component C will come into contact when backup pin 3 supports the center of divided area D. If the center of divided area D is located in non-mounting area N, there is a possibility that backup pin 3 and component C will come into contact when backup pin 3 supports the center of divided area D, the specifying unit 85 sets support position G at a position away from the center of divided area D so that backup pin 3 and component C will not come into contact.

[0043] When the center of divided area D is located in mounting area M, support position G is determined to be the position closest to the center of divided area D in non-mounting area N that exists around the center of divided area D. There is a possibility that backup pin 3 and component C will come into contact when backup pin 3 supports the position closest to the center of divided area D in non-mounting area N. When backup pin 3 supports the position closest to the center of divided area D in non-mounting area N, there is a possibility that backup pin 3 and component C will come into contact when backup pin 3 supports the position closest to the center of divided area D in non-mounting area N, the specifying unit 85 sets support position G to a position in non-mounting area N that is away from the position closest to the center of divided area D so that backup pin 3 and component C do not come into contact.

[0044] The specifying unit 85 determines a first support position G1 in the first divided area D1 where the first backup pin 31 supports. The specifying unit 85 determines a second support position G2 in the second divided area D2 where the second backup pin 32 supports. The first support position G1 is determined to be closest to the center of the first divided area D1 and to satisfy the condition that the first backup pin 31 does not come into contact with the component C. The second support position G2 is determined to be closest to the center of the second divided area D2 and to satisfy the condition that the second backup pin 32 does not come into contact with the component C.

[0045] After the support position G is determined, the pin control unit 83 controls the pin moving device 6 so that the backup pins 3 support the unmounted area N on the back surface Pb of the substrate P. The pin control unit 83 controls the pin moving device 6 so that the first backup pin 31 supports the first divided area D1 on the back surface Pb of the substrate P, and the second backup pin 32 supports the second divided area D2 on the back surface Pb of the substrate P. The pin control unit 83 controls the pin moving device 6 so that the first backup pin 31 supports the unmounted area N closest to the center of the first divided area D1, and the second backup pin 32 supports the unmounted area N closest to the center of the second divided area D2 (step S6).

[0046] The pin control unit 83 controls the pin moving device 6 so that the first backup pin 31 supports the first support position G1 determined in step S5, and the second backup pin 32 supports the second support position G2 determined in step S5. The pin moving device 6 adjusts the respective X-axis positions of the first backup pin 31 and the second backup pin 32 so that the first backup pin 31 supports the first support position G1, and the second backup pin 32 supports the second support position G2.

[0047] Figure 7 is a diagram illustrating a mounting method for component C according to an embodiment. As shown in Figure 7, the first backup pin 31 supports a first support position G1 on the back surface Pb of the substrate P. The second backup pin 32 supports a second support position G2 on the back surface Pb of the substrate P. After the backup pins 3(31,32) support the support positions G(G1,G2) in the non-mounted area N, the head control unit 82 controls the mounting head 5 so that component C is mounted on the surface Pa of the substrate P while the backup pins 3 are supporting the support positions G in the non-mounted area N (step S7).

[0048] Since the back surface Pb of the circuit board P is supported by the backup pins 3, the bending of the circuit board P is suppressed, and the component C is mounted on the circuit board P. The backup pins 3 support the back surface Pb of the circuit board P in a way that prevents contact with the component C on the back surface Pb of the circuit board P, thus preventing damage to the component C mounted on the back surface Pb of the circuit board P or the component C from falling off the circuit board P.

[0049] After the components C are mounted on the front surface Pa of the substrate P, the substrate control unit 81 controls the substrate transport device 2 to unload the substrate P from the processing position Q2 (step S8). After the mounting process is completed, the substrate P is unloaded from the processing position Q2 to the +X side.

[0050] [effect] As described above, the identification unit 85 identifies the mounting area M on the back surface Pb of the substrate P where component C is mounted and the non-mounted area N where component C is not mounted, based on the detection data of the height sensor 7. Since the backup pin 3 supports the non-mounted area N, contact between the component C mounted on the back surface Pb of the substrate P and the backup pin 3 is suppressed. Because contact between component C and the backup pin 3 is suppressed, damage to component C or detachment of component C from the substrate P is suppressed. The pin control unit 83 controls the pin moving device 6 so that the backup pin 3 supports the non-mounted area N. The operator of the component mounting device 1 does not have to manually set the backup pin 3, thus reducing the burden on the operator.

[0051] The height sensor 7 detects the height of the back surface Pb of the substrate P placed at the entrance position Q1. As a result, profile data of the back surface Pb of the substrate P is generated and the support position G is determined before the substrate P is placed at the processing position Q2.

[0052] The height sensor 7 detects the height of the back surface Pb of the substrate P while the substrate P is passing through the entrance position Q1. The detection range of the height sensor 7 and the back surface Pb of the substrate P move relatively, and the detection range of the height sensor 7 scans the back surface Pb of the substrate P, so that profile data of the back surface Pb of the substrate P is generated efficiently.

[0053] The first backup pin 31 supports the first divided area D1 of the rear surface Pb of the substrate P, and the second backup pin 32 supports the second divided area D2 of the rear surface Pb of the substrate P. This effectively suppresses bending of the substrate P.

[0054] The pin control unit 83 controls the pin moving device 6 so that the first backup pin 31 supports the unmounted area N closest to the center of the first divided area D1, and the second backup pin 32 supports the unmounted area N closest to the center of the second divided area D2. This effectively suppresses the bending of the substrate P while preventing contact between the backup pins 3 and the component C.

[0055] [Other embodiments] Figure 8 is a schematic plan view showing a component mounting apparatus 1 according to a first modified example of the embodiment. The distance between one conveyor belt 22 and the other conveyor belt 22 in the Y-axis direction may be changed. For example, the distance between one conveyor belt 22 and the other conveyor belt 22 in the Y-axis direction may be changed to match the dimensions of the substrate P in the Y-axis direction. The guide rail 62 of the pin moving device 6 may move in the Y-axis direction to match the distance between one conveyor belt 22 and the other conveyor belt 22. The guide rail 62 moves in the Y-axis direction so that the center of the back surface Pb of the substrate P is supported by the backup pins 3. The guide rail 62 moves in the Y-axis direction by a guide moving actuator (not shown). When the distance between one conveyor belt 22 and the other conveyor belt 22 is changed, the controller 8 may control the guide moving actuator to move the guide rail 62 in the Y-axis direction so that the center of the back surface Pb of the substrate P is supported by the backup pins 3 in the Y-axis direction.

[0056] In the above-described embodiment, there are two backup pins 3. However, any number of backup pins 3, three or more, may be provided. The number of divided areas D may be set in accordance with the number of backup pins 3.

[0057] In the above embodiment, for example, if the area of ​​the non-mounted area N is small, that is, if the components C are densely packed, the backup pin 3 may not be able to support the non-mounted area N. If it is determined that the backup pin 3 cannot support the non-mounted area N, the pin control unit 83 may control the pin moving device 6 so that the backup pin 3 moves to the outside of the substrate P. That is, if it is determined that the backup pin 3 cannot support the non-mounted area N, the pin control unit 83 may move the backup pin 3 to a position that does not face the back surface Pb of the substrate P. If it is determined that, among the multiple divided areas D, the first backup pin 31 cannot support the non-mounted area N of the first divided area D1, and the second backup pin 32 can support the non-mounted area N of the second divided area D2, the pin control unit 83 may control the pin moving device 6 so that the first backup pin 31 moves to a position that does not face the back surface Pb of the substrate P, and the second backup pin 32 supports the non-mounted area N of the second divided area D2. In addition, when the pin portion 3B can be moved in the Z-axis direction relative to the base portion 3A by a pin actuator not shown, if it is determined that the backup pin 3 cannot support the non-mounting area N, the pin control unit 83 may lower the pin portion 3B so that the pin portion 3B moves away from the back surface Pb of the substrate P.

[0058] In the embodiment described above, the backup pin 3 is configured to move only in the X-axis direction. The backup pin 3 may move in both the X-axis and Y-axis directions. The pin moving device 6 may move the backup pin 3 in both the X-axis and Y-axis directions. The support position G may be determined to be closest to the center of the divided area D in both the X-axis and Y-axis directions, and to satisfy the condition that the backup pin 3 and component C do not come into contact.

[0059] In the above embodiment, the detection range of the height sensor 7 may be a long slit in the Y-axis direction. The +Y side end of the detection range of the height sensor 7 may coincide with the +Y side end of the back surface Pb of the substrate P being transported to the substrate transport device 2. The -Y side end of the detection range of the height sensor 7 may coincide with the -Y side end of the back surface Pb of the substrate P being transported to the substrate transport device 2. When the substrate P is passing through the entrance position Q1, detection light is emitted from the height sensor 7, so that the entire back surface Pb of the substrate P is irradiated with detection light. When the substrate P is passing through the entrance position Q1, detection light is emitted from the height sensor 7, so that the entire back surface Pb of the substrate P is irradiated with detection light.

[0060] In the above-described embodiment, parameters for determining the support position G by the specific unit 85 may be specified in advance. Examples of parameters for determining the support position G include the range in which the support position G is set on the back surface Pb of the substrate P, the lower limit of the distance between adjacent support position Gs, the ratio of the spacing between multiple support position Gs, and the lower limit of the distance between the support position G and the component C. When an input device such as a computer keyboard or touch panel is connected to the controller 8, the operator of the component mounting device 1 can specify the parameters for determining the support position G by operating the input device. The operator may also specify the range in which the support position G is set on the back surface Pb of the substrate P by operating the input device. If there are multiple backup pins 3, the operator may also specify the lower limit of the distance between adjacent support position Gs by operating the input device. The operator may also specify the ratio of the spacing between multiple support position Gs so that the ratio of the spacing between multiple support position Gs is the same, that is, so that multiple support position Gs are arranged at equal intervals. The operator may also specify the lower limit of the distance between the support position G and the component C by operating the input device. The operator may operate the input device to specify the position of the support position G. The support position G may be specified in the non-mounting area N that is closest to the center of the divided area D, or may be specified in the non-mounting area N that is farthest from the center of the divided area D.

[0061] In the above-described embodiment, priority conditions for the parameters used by the specific unit 85 when determining the support position G may be specified. The operator of the component mounting device 1 can specify the priority conditions by operating the input device. The operator may operate the input device to specify that the distance between adjacent support positions G does not fall below a lower limit as the highest priority. The operator may operate the input device to specify that the ratio of the spacing between multiple support positions G is the same as the highest priority. The operator may operate the input device to specify that the distance between a support position G and a component C does not fall below a lower limit as the highest priority.

[0062] As described in the above embodiment, the height sensor 7 detects the height of the back surface Pb of the substrate P as the substrate P passes the entrance position Q1 due to the rotation of the conveyor belt 22. If the substrate P slips on the conveyor belt 22, there is a possibility that the actual three-dimensional shape of the back surface Pb of the substrate P and the profile line PL generated in the profile generation unit 84 will diverge. In order to suppress the divergence between the actual three-dimensional shape of the back surface Pb of the substrate P and the profile line PL, measures may be taken to suppress the slipping of the substrate P on the conveyor belt 22. For example, the surface of the conveyor belt 22 may be formed of a material with a high coefficient of friction with respect to the substrate P. The surface of the conveyor belt 22 may be cleaned periodically or automatically. The conveying acceleration and conveying deceleration when the conveyor belt 22 conveys the substrate P may be reduced. The distance in the Y-axis direction between one conveyor belt 22 and the other conveyor belt 22 may be adjusted to match the dimensions of the substrate P.

[0063] Figure 9 is a schematic side view showing a component mounting apparatus 1 according to a second modified example of the embodiment. In the above-described embodiment, the position of the height sensor 7 is fixed. The height sensor 7 may be moved. As shown in Figure 9, the height sensor 7 may be placed on a third slider 613 that moves along a guide rail 62. The height sensor 7 is movable in the X-axis direction by the movement of the third slider 613. The height sensor 7 detects the height of the back surface Pb of the substrate P placed at the processing position Q2. After the position of the substrate P is fixed at the processing position Q2, the height sensor 7 detects the height of the back surface Pb of the substrate P while moving in the X-axis direction. As the detection range of the height sensor 7 and the back surface Pb of the substrate P move relative to each other, profile data of the back surface Pb of the substrate P is generated as the detection range of the height sensor 7 scans the back surface Pb of the substrate P. After the profile data of the back surface Pb of the substrate P is generated, the support position G is determined, and the pin moving device 6 is controlled so that the backup pin 3 supports the support position G. After the backup pin 3 supports the support position G, component C is mounted on the surface Pa of the substrate P. [Explanation of symbols]

[0064] 1...Component mounting device, 2...Board transport device, 3...Backup pin, 3A...Base section, 3B...Pin section, 4...Nozzle, 5...Mounting head, 6...Pin movement device, 7...Height sensor, 8...Controller, 8A...Processor, 8B...Main memory, 8C...Storage, 8D...Input / output interface, 21...Guide member, 22...Transport belt, 23...Pulley, 31...First backup pin, 32...Second backup pin, 61...Slider, 62...Guide rail, 81...Board control section, 8 2...Head control unit, 83...Pin control unit, 84...Profile generation unit, 85...Specification unit, 86...Profile storage unit, 611...First slider, 612...Second slider, 613...Third slider, C...Component, D...Divided area, D1...First divided area, D2...Second divided area, G...Support position, G1...First support position, G2...Second support position, M...Mounting area, N...Non-mounted area, P...Substrate, Pa...Front surface, Pb...Back surface, PL...Profile line, Q1...Inlet position, Q2...Processing position.

Claims

1. a substrate transport device that supports an edge of a substrate and transports the substrate; a backup pin that supports the rear surface of the substrate; a mounting head that mounts components on the surface of the substrate; a pin moving device that moves the backup pin; a height sensor for detecting the height of the rear surface of the substrate; a controller; The controller an identifying unit that identifies a mounting area on the back surface of the board where components are mounted and a non-mounting area on the back surface of the board where components are not mounted based on detection data from the height sensor; a pin control unit that controls the pin moving device so that the backup pin supports the non-mounting area; a head control unit that controls the mounting head so that components are mounted on the surface of the board while the backup pins are supporting the non-mounting area. Component mounting equipment.

2. the substrate transport apparatus transports the substrate from an entrance location to a processing location; the backup pin supports the back surface of the substrate placed at the processing position; the mounting head mounts components on the surface of the substrate placed at the processing position; the pin moving device moves the backup pin in a predetermined plane parallel to the rear surface of the substrate; the height sensor detects the height of the back surface of the substrate placed at the entrance position; The component mounting device according to claim 1 .

3. the height sensor detects the height of the rear surface of the substrate while the substrate is passing through the entrance position by the substrate transport device. The component mounting device according to claim 2 .

4. The backup pins include a first backup pin and a second backup pin, the pin moving device includes a first slider to which a first backup pin is fixed, a second slider to which the second backup pin is fixed, and a guide rail that guides each of the first slider and the second slider in a first axial direction of the predetermined surface, the first backup pin supports a first division area on the rear surface of the substrate; the second backup pin supports a second divided area on the rear surface of the substrate; The component mounting device according to claim 2 .

5. the pin control unit controls the pin moving device so that the first backup pin supports the non-mounting area closest to the center of the first divided area, and the second backup pin supports the non-mounting area closest to the center of the second divided area. The component mounting device according to claim 4.

6. the substrate transport device has a pair of transport belts that support both ends of the substrate in a second axis direction perpendicular to the first axis direction on the predetermined plane, and transports the substrate in the first axis direction by the transport belts; a distance between one of the conveying belts and the other of the conveying belts in the second axial direction is changeable; The guide rail moves in the second axial direction in accordance with the distance. The component mounting device according to claim 4.

7. When it is determined that the backup pins cannot support the non-mounting area, the pin control unit controls the pin moving device so that the backup pins move to the outside of the board. The component mounting device according to claim 1 .

8. detecting the height of the rear surface of the substrate with a height sensor while the edge of the substrate is supported by the substrate transport device; Identifying a mounting area on the back surface of the board where components are mounted and a non-mounting area on which components are not mounted based on the detection data of the height sensor; Controlling a pin moving device that moves the backup pin so that the backup pin supports the non-mounting area; controlling the mounting head so that components are mounted on the front surface of the substrate while the backup pins support the non-mounting area. Component mounting method.

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