Semiconductor device lead repair method and lead repair device

Abstract

To easily correct the position of a lead in a semiconductor device. [Solution] Before being repaired, the leads 102 have irregular bends. As shown in FIG. 4(b), a jig 10 is pressed against each lead 102 from the positive z-direction side, and the tip ends of each lead 102 are engaged and accommodated in the corresponding recesses 11 (engagement process). Then, with their positional relationship in the z-direction fixed, as shown in FIG. 4(c), the jig 10 is swung and moved toward the negative x-direction, deforming each lead 102 so that the tip ends of each lead 102 uniformly move toward the negative x-direction. Then, as shown in FIG. 4(d), the jig 10 is moved back to the positive x-direction (original position), and the tip ends of each lead 102 move to the deepest portion 11A of each recess 11 (swinging process). This plastically deforms each lead 102, and when the jig 10 is separated as shown in FIG. 4(e), the position of the tip ends of each lead 102 is appropriately corrected.

Description

[Technical Field]

[0001] An embodiment of the present disclosure relates to a lead repair method and a lead repair device for adjusting lead positions in a semiconductor device having a configuration in which a plurality of arranged leads protrude. [Background technology]

[0002] In a semiconductor device in the form of a package, a plurality of leads used for electrical connection to the semiconductor chip are provided protruding from a resin layer, for example, rectangular in shape, in which a semiconductor chip is provided. When this semiconductor device is mounted and used, the semiconductor device (package) is fixed, for example, on a printed circuit board so that external wiring is connected to the leads.

[0003] At this time, it is required that the multiple leads are arranged properly to ensure proper connection. Generally, the die pad on which the semiconductor chip is mounted and the multiple leads inside the resin layer are formed by patterning a single metal plate, and at this stage the positional accuracy of the lead arrangement is high. However, various subsequent processes can cause the lead arrangement (the positional relationship of the lead tips) to become misaligned.

[0004] For this reason, immediately before shipping such semiconductor devices, a step of finely adjusting (correcting appropriately) the positions of the tip ends of the leads is carried out. The configuration of a lead correction device for this purpose is described in, for example, Patent Document 1.

[0005] In this technology, for example, in a SIP (Single In-line Package) type semiconductor device in which a plurality of leads are arranged in a line and protrude from one side of a resin layer, the position of each lead in the vertical direction is properly corrected by clamping and pressurizing the lead arrangement with members from both sides in the direction perpendicular to the lead arrangement direction (horizontal direction) and the vertical direction. Also, a member is used in which grooves formed in the horizontal direction that are deeper than the length of the leads are formed corresponding to each lead, and by accommodating each lead in each groove, the position of the lead in the horizontal direction is properly corrected. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Japanese Patent Application Laid-Open No. 2008-205349 Summary of the Invention [Problem to be solved by the invention]

[0007] In the technology described in Patent Document 1, the work of correcting the leads using grooves was not easy to manufacture a component with such grooves, especially when the lead spacing (pitch) was small. Also, while correcting the leads in a SIP-type semiconductor device was relatively easy, for example, in a DIP (Dual In-line Package)-type semiconductor device in which multiple leads are arranged in a line and protrude from each of the two side surfaces of a resin layer, it was necessary to correct the lead positions in the vertical and horizontal directions for each side surface, which resulted in a problem of either a complicated device configuration or a complicated correction process.

[0008] For this reason, there has been a demand for a technique that allows the positions of leads in semiconductor devices to be easily corrected.

[0009] The present disclosure has been made in consideration of the above problems, and aims to provide a lead correction method and a lead correction device that solve the above problems. [Means for solving the problem]

[0010] In order to solve the above problems, the present disclosure has the following configuration. The lead correction method of the present disclosure is a lead correction method for a semiconductor device having a configuration in which a plurality of metal leads are arranged and protrude from a body and extend along a first direction, the method appropriately correcting the positions of the tip ends of the leads in a direction perpendicular to the first direction, the method comprising: a surface intersecting the first direction; and a slope inclined from the surface toward the deepest part around a deepest part located at the deepest position from the surface, the depth of the deepest part from the surface being three times or less the thickness of the metal plate constituting the leads; The method includes an engagement process using a jig having a recess corresponding to each lead and formed so that the tip end of the lead enters and engages along the first direction, and engaging each of the tip ends of the multiple leads with the corresponding recess in the jig; and a swinging process fixing one of the jig or the main body and swinging the other so that the positional relationship between the jig and the main body in a direction perpendicular to the first direction changes while the tip ends of the multiple leads are engaged with the multiple recesses in the jig. The lead correction device for a semiconductor device of the present disclosure is a lead correction device for properly correcting the position of the tip end of a lead in a direction perpendicular to a first direction for a semiconductor device having a configuration in which a plurality of metal leads are arranged, protruding from a main body and extending along the first direction, the lead correction device having a surface intersecting the first direction and an inclined surface inclined from the surface toward the deepest part around the deepest part located at the deepest position from the surface, the depth of the deepest part from the surface being three times or less the thickness of the metal plate constituting the lead, The semiconductor device is characterized in that a jig is used that has a recess corresponding to each of the leads and formed so that the tip of the lead can enter and engage along the first direction, and the device is equipped with a first drive unit that moves either the jig or the main body along the first direction so as to engage each of the leads in the semiconductor device with the corresponding recess, and a second drive unit that oscillates either the jig or the main body along a direction perpendicular to the first direction while engaging each of the leads in the semiconductor device with the corresponding recess. [Effects of the Invention]

[0011] Since the present disclosure is configured as described above, the positions of the leads in a semiconductor device can be easily corrected. [Brief explanation of the drawings]

[0012] [Figure 1] 1 is a perspective view of a semiconductor device to which a lead repair method according to an embodiment of the present disclosure is applied; [Figure 2] FIG. 1 is a perspective view of a jig used in a lead repair method according to an embodiment of the present disclosure. [Figure 3] 10A and 10B are diagrams illustrating a relationship between a recess and a lead in a jig used in a lead repair method according to an embodiment of the present disclosure. [Figure 4] FIG. 10 is a diagram illustrating the simplest case of a lead correction method according to an embodiment of the present disclosure. [Figure 5] 1 is a diagram (part 1) showing an improved form of a lead correction method according to an embodiment of the present disclosure. [Figure 6] FIG. 2 is a diagram (part 2) showing an improved form of the lead correction method according to the embodiment of the present disclosure. [Figure 7] 10A to 10C are diagrams illustrating examples of shapes of recesses in a jig used in a lead repair method according to an embodiment of the present disclosure. [Figure 8] 1A to 1C are diagrams illustrating a flow between devices in a semiconductor device manufacturing process using a lead repair method according to an embodiment of the present disclosure. [Figure 9] 1A and 1B are diagrams (part 1) illustrating the operation of the lead correction device according to the embodiment of the present disclosure. [Figure 10] 10A and 10B are diagrams (part 2) illustrating the operation of the lead correction device according to the embodiment of the present disclosure. DETAILED DESCRIPTION OF THE INVENTION

[0013] A lead correction method and device for a semiconductor device according to an embodiment of the present disclosure will be described below. Figure 1 is a perspective view showing the configuration of a semiconductor device 100 to be corrected in this case. In the following, the x direction (second direction), y direction (third direction), and z direction (first direction) are defined as shown in the figure.

[0014] In this DIP-type semiconductor device 100, a semiconductor chip is mounted on a die pad in a substantially rectangular resin layer (main body) 101, whose sides are parallel to the x, y, and z directions (neither is shown). Multiple leads 102 protrude from the negative and positive side surfaces of the resin layer 101 in the y direction and are arranged along the x direction. The leads 102 extend from these side surfaces along the y direction, but are bent 90° outward, with their ends pointing toward the positive z direction. When the semiconductor device 100 is actually mounted on a printed circuit board, the positive z direction generally faces the printed circuit board. The leads 102 are made of copper or a copper alloy, and a surface layer of solder or the like is formed on their surfaces to facilitate soldering and other operations. The leads 102 are mounted on the printed circuit board or the like, engaged with through holes (via holes).

[0015] In this configuration, the positional relationship of the tips of the numerous leads 102 must be accurate. In practice, during manufacturing, each lead 102 and the die pad are formed by patterning a single metal plate, so the positional accuracy of the tips of each lead 102 is maintained at a high level in the early stages of manufacturing. However, as the manufacturing process of the semiconductor device 100 progresses, the positional relationship of the tips often becomes distorted, for example, due to processes such as cutting the leads 102. Furthermore, as shown in FIG. 1 , for leads 102 having a portion bent at approximately 90°, the positional relationship of the tips in the x and y directions is easily distorted during the bending process that imparts this bend. This bending process is similar to general metal bending, in that a punch is pressed against the base of the lead 102 in a sliding manner while holding it from above and below, thereby bending the lead 102. Depending on the condition of the solder on the surface of the lead 102, variations in the bending may occur, making the tip position easily distorted.

[0016] The positions of the tips of such multiple leads 102 are properly corrected by a semiconductor device lead correction method and lead correction device according to an embodiment of the present disclosure. The following description will be given assuming that multiple leads 102 provided on the negative y-direction side in FIG. 1 are being corrected. As will be described later, this correction can actually be performed simultaneously on the positive y-direction side as well. FIG. 2 is a perspective view showing the structure of a jig 10 used for this purpose. Here, the x, y, and z directions are shown corresponding to the respective directions in the semiconductor device 100 of FIG. 1 when this jig 10 is used.

[0017] As shown in Fig. 2, this jig 10 is formed into a plate shape from metal (for example, stainless steel), and on its surface (jig surface 10A) on the negative side in the z direction (the side on which the semiconductor device 100 is located when in use) are formed a plurality of shallow recesses 11 corresponding to the tip ends of the plurality of leads 102 on the negative side in the y direction in Fig. 1. Also, in Fig. 2, fixing holes 10B are formed as through holes for fixing this jig 10 to a jig fixing part, which will be described later.

[0018] The recess 11 has a circular shape when viewed from the negative z-direction. FIG. 3 shows a cross-sectional view of the recess 11 at the center in the y-direction along the x- and z-directions at the location where the recess 11 is formed, and the shape of the lead 102 that engages with it. For convenience, a perspective view of the lead 102 tilted from the y-direction is shown. As shown, each recess 11 is formed in a conical shape with its apex on the positive z-direction. Therefore, as shown in the figure, the recess 11 has a deepest portion 11A and an inclined surface 11B that slopes downward in FIG. 3 from the jig surface 10A outside the recess 11 toward the deepest portion 11A. In FIGS. 2 and 3, the position of the deepest portion 11A along the x- and y-directions is formed to correspond to the appropriate position of the lead 102.

[0019] The depth D of the recess 11 along the z direction from the jig surface 10A to the deepest portion 11A is set sufficiently smaller than the length L of the lead 102 along the z direction. That is, the recess 11 is formed sufficiently shallower than the length L of the lead 102. In practice, the lead 102 is formed by processing a metal plate, and the thickness of this metal plate corresponds to the size (thickness) T of the tip of the lead 102 along the y direction. Also, if the size (width) of the tip of the lead 102 along the x direction is W, D is preferably set to be no more than three times the larger of W and T. On the other hand, if the depth D is small, it becomes difficult to engage the lead 102 with the recess 11 (it becomes difficult to restrain the tip of the lead 102 in the recess 11), making the engagement process described below difficult or the tip of the lead 102 is more likely to move during the swinging process described below, making correction difficult. For this reason, D is preferably set to be at least 0.5 times the larger of W and T. However, since the thickness T is generally smaller than the width W, the above criteria are often determined by the thickness T.

[0020] 4 is a cross-sectional view showing, in the simplest form, the operation of repairing leads 102 using this jig 10. As shown in FIG. 4(a), the leads 102 before repair have irregular bends, and the positions of their tips (lower ends in the figure) are not equally spaced, and here we will repair their positions along the x direction.

[0021] 4(b), the jig 10 is pressed against each lead 102 (semiconductor device 100) in this state from the positive side in the z direction, and the tip end of each lead 102 is locked and accommodated in the corresponding recess 11 (engagement process). Here, each lead 102 (semiconductor device 100) side is fixed and the jig 10 moves in the z direction, but conversely, the semiconductor device 100 side may be moved as long as the relative positional relationship between them is similarly realized.

[0022] Then, while maintaining their positional relationship in the z direction, the jig 10 is swung toward the negative x-direction as shown in FIG. 4(c), deforming the leads 102 so that the tips of the leads 102 uniformly move toward the negative x-direction. Then, as shown in FIG. 4(d), the jig 10 is moved toward the positive x-direction (original position), causing the tips of the leads 102 to move to the deepest portions 11A of the recesses 11 (swinging step). This position is the appropriate position for the tips of the leads 102. In this case, the inclined surfaces 11B, in particular, facilitate the movement of the tips of the leads 102 toward the deepest portions 11A. By plastically deforming the leads 102, the positions of the tips of the leads 102 are appropriately adjusted in the state shown in FIG. 4(e) where the jig 10 is separated. As in the case of FIG. 4(b), the semiconductor device 100 may be moved in FIGS. 4(c) and 4(d).

[0023] The above-described correction of each lead 102 is achieved by plastic deformation of the metal material (copper, copper alloy, etc.) that constitutes each lead 102. However, in practice, if the amount of deformation of the leads 102 in the above process is small, elastic deformation is likely to occur rather than plastic deformation. In this case, in the state shown in FIG. 4(e), each lead 102 returns to the state shown in FIG. 4(a), and no correction is achieved. For this reason, in order to reliably achieve such plastic deformation after properly adjusting the relative positional relationship of each lead 102, it has been found that it is particularly effective to perform the above-described swinging process as follows.

[0024] 5 and 6 are diagrams illustrating this operation in correspondence with FIG. 4. In these diagrams, it is assumed that the position is corrected along the x direction (the direction in which the leads 102 are arranged). FIGS. 5(a) and 5(b) are the same as the states shown in FIGS. 4(a) and 4(b), respectively. That is, in the state shown in FIG. 4(b), the tip end of each lead 102 is housed in the corresponding recess 11. In this state, even if deformation of each lead 102 occurs, it is highly likely that this deformation is elastic.

[0025] 5(c), when the jig 10 is moved significantly in the positive x-direction as a swinging step, each lead 102 is deformed so that its tip moves uniformly in the positive x-direction in parallel, as shown in the figure. Because the amount of deformation is large, it becomes plastic deformation.

[0026] From this state, when the jig 10 is moved significantly in the negative x-direction as shown in Fig. 5(d), each lead 102 moves in parallel so that the tip ends move uniformly in the negative x-direction as shown in the figure. The deformation occurring when changing from the state in Fig. 5(c) to the state in Fig. 5(d) is also plastic deformation.

[0027] In this way, when each lead 102 undergoes plastic deformation so that its tip moves significantly to the positive or negative side in the x direction, although the inclination angle of each lead 102 is large, the relative positional relationship of the leads 102 approaches an appropriate state.

[0028] Then, as shown in Fig. 6(e), when the jig 10 is again moved slightly in the positive x-direction, the amount of deformation is also large, and therefore this amount of deformation becomes plastic deformation. Then, as shown in Fig. 6(f), the jig 10 is again moved slightly in the negative x-direction, and then, as shown in Fig. 6(g), the jig 10 is moved to a position where the positions of the leads 102 are corrected. Although the amount of deformation during this process is not large, the positions of the leads 102 are corrected in the state shown in Fig. 6(h) after the jig 10 is moved away, compared to the case where the state shown in Fig. 4(a) is changed to the state shown in Fig. 4(c) and (d) and then to the state shown in Fig. 4(e). In other words, by providing the steps shown in Figs. 5(c) to 6(f), continuous plastic deformation can be caused, and the positions of the leads 102 can be reliably corrected.

[0029] 5 and 6, as shown in Fig. 5(c) to Fig. 6(f), the jig 10 is oscillated in multiple cycles along the x direction, thereby adjusting the position of the tip of each lead 102 to be appropriate in the x direction. However, if the direction of this oscillation is the y direction, the position of the tip can be adjusted to be appropriate in the y direction. In this case, a common jig 10 corresponding to the configuration in Fig. 1 can also be used.

[0030] In the examples of Figures 5 and 6, for simplicity, two cycles are performed in sequence: one with a large amplitude of oscillation (Figures 5(c)(d)) and one with a small amplitude (Figures 6(e)(f)). However, more cycles of oscillation motion that change from large amplitude to small amplitude may also be applied.

[0031] The technology described in Patent Document 1 uses grooves with a depth equal to the length of the leads, unlike the shallow recesses 11 described above. In contrast, the above configuration uses shallow recesses 11, which makes it possible to realize large swings, particularly as shown in Figures 5(c) and 5(d), and thereby plastically deform the leads 102 so that their relative positional relationships become appropriate. In other words, by using shallow recesses 11, it is possible to easily realize the movements shown in Figures 5(c) to 6(f).

[0032] Furthermore, when the spacing between the leads 102 is narrow, it is not easy to form the deep grooves used in the technique described in Patent Document 1 close together, or forming such grooves reduces the mechanical strength of the portions of the jig between the grooves, thereby reducing the durability of the jig. In contrast, it is easy to form the shallow recesses 11 described above close together, and the resulting reduction in mechanical strength is small.

[0033] 5 and 6 show a case where the jig 10 shown in FIG. 2 is used to correct the positions of the multiple leads 102 in FIG. 1 along the x direction, but the same operation can be applied to the arrangement of the leads 102 on the negative and positive sides of the y direction in FIG. 1. In this case, the movements shown in FIGS. 5 and 6 can also be generated simultaneously on the negative and positive sides of the y direction. In this case, the correction process is simplified. In other words, the configuration of the correction device, which will be described later, can be simplified.

[0034] 5 and 6 may be achieved by fixing the jig 10 and moving the semiconductor device 100. When fixing the semiconductor device 100 and moving the jig 10, different movements can be achieved on the negative y-direction side and the positive y-direction side by using a first jig and a second jig, respectively.

[0035] Next, the specific shape of the recess will be described. Fig. 7(a) is a cross-sectional view (upper side) of the recess 11 (jig 10) along the z direction, similar to Fig. 3, and a top view (lower side) seen from the negative side in the z direction, and Figs. 7(b) to (e) are similar views showing the recesses 21, 31, 41, and 51 (corresponding jigs 20, 30, 40, and 50) that are modifications of the recesses.

[0036] The recesses 11, 21, and 31 (FIGS. 7(a) to 7(c)) are all conical, with apex angles of 120°, 90°, and 60°, respectively. Generally, the larger the apex angle, the easier the manufacturing process. However, as the depth of the deepest portion increases, the diameter at the surface also increases. Therefore, when the leads 102 are close to each other, adjacent recesses are likely to overlap. In this case, as shown in FIG. 5(b), the leads 102 tend to slip into the recess adjacent to the corresponding recess, making proper repair impossible. Furthermore, the smaller the inclination angle of the inclined surfaces, the less effective the inclined surfaces are in guiding the tips of the leads 102 to the deepest portion. When the cone has an apex angle of 60°, if the depth of the deepest portion is three times the larger of W and T, the tips of the leads can engage with the recesses even if their positions vary by twice the larger of W and T.

[0037] On the other hand, when the apex angle is small, manufacturing is not as easy as in the above case, but it is easy to separate the recesses on the surface of the jig even when the leads 102 are close to each other, and the inclined surface has a greater effect of guiding the tips of the leads 102 to the deepest part. For example, if the lead thickness T is 0.4 mm and the width W is 0.5 mm, the depth of the deep part of the recess 11 is preferably about 0.6 mm. In this case, even if the apex angle of the cone is 120°, it can be used for semiconductor devices with a lead spacing of 1.78 mm. Furthermore, processing the inclined surface to make it smooth makes it easier to guide the tips of the leads 102 to the deepest part.

[0038] 7(a) to 7(c) where the recesses are conical, the tip of the lead 102 is constrained to the deepest part in both the x and y directions in the steps of Fig. 5(c) to Fig. 6(f). Therefore, the jigs 10, 20, and 30 having the recesses 11, 21, and 31, respectively, can be used for correcting the position along both the x and y directions.

[0039] Furthermore, the planar shape of the recesses may not be circular, but may be elliptical (oval), as shown in recess 41 (jig 40: FIG. 7(d)). If the minor axis direction of this ellipse is the arrangement direction (x direction) of recesses 41, adjacent recesses 41 are less likely to overlap even when leads 102 are close to each other. Furthermore, the margin for engagement of the tip ends of leads 102 in the y direction is increased, making the engagement process easier. Meanwhile, in this case, the tip ends of leads 102 are less likely to be constrained in the major axis direction (y direction) of recess 41 in the processes of FIGS. 5(c) to 6(f), so this structure is particularly preferable for correcting the position along the x direction (when applying oscillation along the x direction).

[0040] Alternatively, by increasing the major axis of the ellipse in FIG. 7(d), the recess may be formed into a V-shaped groove extending in the direction perpendicular to the ellipse (y direction), as in recess 51 (jig 50: FIG. 7(e)). In FIG. 7(e), the end of recess 51 in the y direction is outside the illustrated range. Here, in accordance with the overall shape, deepest portion 51A is also linear along the y direction. In this case, the engagement process is particularly easy, as described above. However, if recess 51 is long along the extension direction, this extension direction cannot be the arrangement direction of recess 51 (x direction). Therefore, in this case, this jig is used exclusively for correcting the position along the x direction.

[0041] As described above, the jig with the recesses shown in Figures 7(d) and (e) is effective only for correcting the position along either the x-direction or the y-direction. However, because each lead 102 is fixed on the resin layer 101 side opposite the tip, if the tip of the lead 102 is fixed in the correct position in the x-direction, the position of this tip will generally not deviate significantly from the correct position in the y-direction. Furthermore, the position of the tip of the lead 102 requires particular precision in the x-direction (the direction in which the leads 102 are arranged). Therefore, the jig with the recesses shown in Figures 7(d) and (e) may be used to correct the position only in the x-direction, which simplifies the correction process.

[0042] FIG. 8 is a diagram schematically illustrating the manufacturing process of this semiconductor device 100, where each process corresponds to a single device and the product flows between the devices. First, a product (DIP-type package) is manufactured before bending each lead 102 in the z direction in FIG. 1. This process is similar to the manufacturing method of a commonly known DIP-type package. At this stage, each lead 102 in FIG. 1 has not been bent to bend along the z direction, and each lead 102 extends along the y direction. In this state, the positional relationship of the tip ends of each lead 102 is determined by the patterning of the metal plate that constitutes the leads 102 and the die pad, and is therefore generally determined with high precision.

[0043] Next, in this state, lead bending device 210 uses a mold to bend each lead 102 toward the positive z-direction as shown in Fig. 1. This results in semiconductor device 100 having the configuration shown in Fig. 1. However, as described above, this bending process reduces the accuracy of the positional relationship of the tip ends of each lead 102.

[0044] Therefore, the positions of the tips of the leads 102 are corrected as described above for the semiconductor device 100 in this state. Prior to this stage, the entire semiconductor device 100 is cleaned using a brush or the like by the cleaning device 220. This removes, for example, pieces of resin material adhering to the leads 102, allowing subsequent processes to be carried out properly.

[0045] Thereafter, each lead 102 is repaired as described above by a repair device (y) (lead repair device) 230 using, for example, the jig 10 (corresponding to repair along the y direction). Here, repair (oscillation) along the y direction is applied to each lead 102. Thereafter, each lead 102 is repaired by a repair device (x) (lead repair device) 240 using the jig 10 (corresponding to repair (oscillation) along the x direction). As described above, here, oscillation along the x direction is applied to each lead 102. Note that the cleaning device 220 and the repair devices 230, 240 are prone to generating dust and the like, so a dust collection device 250 is connected to these devices. Note that the repair along the y direction and the repair along the x direction may be performed in the reverse order, or as described above, only repair along the x direction may be performed.

[0046] This properly corrects the positional relationship of the tip ends of the leads 102 in the semiconductor device 100. To confirm this state, the semiconductor device 100 is moved to an inspection device 260 equipped with a camera, where its appearance is checked. For example, in the repair devices 230 and 240, there may be cases where the leads 102 are not locked into the corresponding recesses, causing the positions of the tips of the leads 102 to be shifted by one pitch, but this inspection device 260 can recognize such cases.

[0047] The semiconductor device 100 that is found to have no abnormalities by the inspection device 260 is then handed over for, for example, electrical inspection.

[0048] 9 and 10 are diagrams showing the configuration and operation of the repair device (x) (lead repair device) 240 in FIG. 8. Here, the semiconductor device 100 is fixed to a semiconductor device fixing part 241 with the positive side in the z direction in FIG. 1 as the upper side, and the semiconductor device fixing part 241 is installed on a moving part 242 that moves the semiconductor device fixing part 241 along the x direction. Meanwhile, the jig 10 is fixed on its upper side to a jig fixing part 243 so that the recess 11 faces downward (toward the semiconductor device 100). The jig fixing part 243 is moved along the z direction and the x direction by a first driving part 244 that moves it along the z direction and a second driving part 245 that swings the first driving part 244, the jig fixing part 243, etc. along the x direction.

[0049] 9(a), the semiconductor device 100 to be processed is moved by the moving unit 242 from the left side in the figure (the cleaning device 220 side in FIG. 8) toward the area directly below the jig 10, and as shown in FIG. 9(b), it stops at a predetermined position directly below the jig 10. Thereafter, as shown in FIG. 9(c) and FIG. 5(b) which is upside down, the jig fixing unit 243 is lowered by the first driving unit 244, and the recesses 11 in the jig 10 engage with the corresponding tips of the leads 102.

[0050] In this state, as shown in Fig. 9(d), the second driving unit 245 moves the jig fixing unit 243 in the positive x-direction while keeping its height (position in the z-direction) fixed, and then moves it in the opposite direction as shown in Fig. 10(e). This state corresponds to the large amplitude operation shown in Figs. 5(c) and (d). In reality, the small amplitude operation shown in Figs. 6(e) and (f) is also performed after this, but this is not shown in Figs. 9 and 10.

[0051] Then, as shown in Figure 10(f), the second driving unit 245 returns to its original position, and then, as shown in Figure 10(g), the first driving unit 244 raises the jig fixing unit 243 again, and then the moving unit 242 moves the semiconductor device 100 to the positive side of the x direction (towards the inspection device 260 in Figure 7).

[0052] 9 and 10 show the configuration and operation of the repair device (x) 240. However, the repair device (y) 230 in FIG. 8 is the same as the repair device (x) 240 except that the direction of movement of the jig fixing unit 243 by the second driving unit 245 in FIGS. 9(d) and 10(e) is the y direction (perpendicular to the page). In this case, if the jig has the recesses 11, 21, and 31 in FIG. 7, a common jig can be used for the repair device (x) 240 and the repair device (y) 230. On the other hand, if the jig has the recesses 41 and 51 in FIG. 7, it is preferable to use dedicated jigs for each of the repair device (x) 240 and the repair device (y) 230. Furthermore, when the semiconductor device 100 side is fixed and the jig 10 side is moved in this way, different movements (oscillations) can be realized on the negative and positive sides of the y direction.

[0053] In the above example, the lead 102 of the DIP-type semiconductor device 100 shown in Fig. 1 is to be repaired. However, it is clear that the above configuration is effective not only for DIP-type semiconductor devices, but also for semiconductor devices having a configuration in which multiple leads are arranged and protrude from the main body (resin layer). For example, the configuration of the lead repair device shown in Fig. 9 and Fig. 10 is set appropriately according to this form.

[0054] It is also clear that the shapes of the jigs and recesses other than those shown in Figures 2 and 7 can be applied as long as the same effect is achieved. The same applies to the configuration of the lead correction device shown in Figures 9 and 10. Furthermore, for the arrangement of leads protruding from two opposing surfaces of a package, dedicated jigs for the arrangements on each surface may be used, or a common jig may be used. [Explanation of symbols]

[0055] 10, 20, 30, 40, 50 jigs 10A, 20A, 30A, 40A, 50A Jig surface 10B fixing hole 11, 21, 31, 41, 51 recesses 11A, 21A, 31A, 41A, 51A deepest part 11B, 21B, 31B, 41B, 51B Slope 100 Semiconductor device (semiconductor module) 101 Resin layer (main body) 102 leads 210 Lead bending machine 220 Cleaning Equipment 230 Correction device (y) (Lead correction device) 240 Correction Device (x) (Lead Correction Device) 241 Semiconductor device fixing part 242 Mobile Division 243 Jig fixing part 244 First Drive Unit 245 Second Drive Unit 250 Dust collector 260 Inspection Equipment

Claims

1. 1. A lead correction method for a semiconductor device having a configuration in which a plurality of metal leads are arranged, protruding from a body and extending along a first direction, for properly correcting positions of tip ends of the leads in a direction perpendicular to the first direction, the method comprising: a surface intersecting the first direction; a recess formed around a deepest portion of the lead that is located at the deepest position from the surface, the recess having an inclined surface inclined from the surface toward the deepest portion, the depth of the deepest portion from the surface being three times or less the thickness of the metal plate that constitutes the lead, the recess corresponding to each of the leads, and the recess formed so that the tip end of the lead can enter and engage with the recess along the first direction; Using a jig having an engaging step of engaging each of the tip ends of the plurality of leads with the corresponding recess in the jig; a swinging step of fixing one of the jig and the main body and swinging the other so that a positional relationship between the jig and the main body in a direction perpendicular to the first direction changes in a state in which the tip ends of the plurality of leads are engaged with the plurality of recesses of the jig; 1. A method for repairing leads of a semiconductor device, comprising:

2. 2. The method for repairing leads of a semiconductor device according to claim 1, wherein in said swinging step, swinging is performed over a plurality of cycles so that the amplitude of the movement gradually decreases.

3. 3. The method for repairing leads of a semiconductor device according to claim 1, wherein in the swinging step, the main body is fixed and the jig is swung.

4. the semiconductor device has a configuration in which a plurality of the leads are arranged along a second direction perpendicular to the first direction, on one side and the other side in a third direction perpendicular to the first direction and the second direction, using a first jig corresponding to the plurality of leads on the one side and a second jig corresponding to the plurality of leads on the other side, 4. The semiconductor device lead repair method according to claim 3, wherein the swinging step using the first jig and the swinging step using the second jig are carried out separately.

5. 3. The method for repairing leads of a semiconductor device according to claim 1, wherein the recessed portion has a conical shape with the deepest portion as a vertex.

6. A lead correction device for a semiconductor device having a configuration in which a plurality of leads made of metal plates are arranged, protruding from a main body and extending along a first direction, for properly correcting positions of tip ends of the leads in a direction perpendicular to the first direction, comprising: a surface intersecting the first direction; a recess formed around a deepest portion of the lead that is located at the deepest position from the surface, the recess having an inclined surface inclined from the surface toward the deepest portion, the depth of the deepest portion from the surface being three times or less the thickness of the metal plate that constitutes the lead, the recess corresponding to each of the leads, and the recess formed so that the tip end of the lead can enter and engage with the recess along the first direction; A jig having the following is used, a first driving unit that moves either the jig or the main body along the first direction so as to engage each of the leads of the semiconductor device with the corresponding recess; a second driving unit that swings either the jig or the main body in a direction perpendicular to the first direction while engaging each of the leads of the semiconductor device with the corresponding recess; 1. A lead repair device for a semiconductor device, comprising:

7. 7. The device for repairing leads of a semiconductor device according to claim 6, wherein the second driving section performs a plurality of cycles of oscillation so that the amplitude of the operation gradually decreases.

8. 8. The device for repairing leads of a semiconductor device according to claim 6, wherein the second driving section fixes the main body and swings the jig.

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