Stator of an axial gap motor

Abstract

The objective is to provide a stator for an axial gap motor with improved shock resistance. [Solution] A stator for an axial gap motor comprising a printed circuit board having a plurality of insulating layers including a first and a second insulating layer, a plurality of first coil patterns formed by a conductive pattern on the first insulating layer, and a plurality of second coil patterns formed by a conductive pattern on the second insulating layer.

Description

Technical Field

[0001] The present invention relates to a stator of an axial gap motor.

Background Art

[0002] The stator of an axial gap motor includes a substrate and coils disposed on the substrate (see, for example, Patent Document 1).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] For example, when an impact is applied to the stator of such an axial gap motor, the position of the coil may shift with respect to the substrate. Such a displacement may change the output characteristics of the axial gap motor.

[0005] Therefore, an object of the present invention is to provide a stator of an axial gap motor with improved shock resistance.

Means for Solving the Problems

[0006] The above object can be achieved by a stator of an axial gap motor including a printed circuit board having a plurality of insulating layers including a first insulating layer and a second insulating layer, a plurality of first coil patterns formed by conductor patterns on the first insulating layer, and a plurality of second coil patterns formed by conductor patterns on the second insulating layer.

Effects of the Invention

[0007] It is possible to provide a stator of an axial gap motor with improved shock resistance. [Brief explanation of the drawing]

[0008] [Figure 1] This is a cross-sectional view of an axial gap motor. [Figure 2] This is a front view of a printed circuit board. [Figure 3] This is a front view of a printed circuit board. [Figure 4] This is a cross-sectional view AA in Figure 2. [Figure 5] Figure 2 is a cross-sectional view of BB. [Figure 6] This is a cross-sectional view of a modified printed circuit board. [Modes for carrying out the invention]

[0009] [Outline configuration of an axial gap motor] Figure 1 is a cross-sectional view of the axial gap motor 1. Note that Figure 1 schematically represents the axial gap motor 1. The axial gap motor 1 includes a support shaft 10, a yoke 20, magnetic pole sections 30 and 40, and a stator S. The support shaft 10 rotatably supports the yoke 20. The yoke 20, magnetic pole sections 30 and 40 correspond to the rotor. The support shaft 10 includes a flange section 11, a stepped section 12, and a thin shaft section 13. The stepped section 12 has a smaller diameter than the flange section 11. The thin shaft section 13 has a smaller diameter than the stepped section 12. Two bearings B are held in the thin shaft section 13. The yoke 20 includes a cylindrical section 22, flange sections 23 and 24. The flange sections 23 and 24 are flange-shaped. The flange sections 23 and 24 are spaced apart from each other in the axial direction A. The stator S includes a printed circuit board 50. The printed circuit board 50 is a multilayer board, as will be described in more detail later, and has multiple coil patterns formed inside. The stator S is positioned between the flange portions 23 and 24. The printed circuit board 50 has an opening 51 in the center to accommodate the support shaft 10.

[0010] The magnetic pole portion 30 is provided on the surface of the flange portion 23 facing the stator S. The magnetic pole portion 40 is provided on the surface of the flange portion 24 facing the stator S. Each of the magnetic pole portions 30 and 40 is an annular permanent magnet. The surfaces of each of the magnetic pole portions 30 and 40 facing the stator S are magnetized alternately with different polarities in the circumferential direction. In this embodiment, each of the magnetic pole portions 30 and 40 has eight poles in the circumferential direction. Note that each of the magnetic pole portions 30 and 40 may be a plurality of permanent magnets arranged in the circumferential direction. In this case as well, the surfaces of these plurality of permanent magnets facing the stator S are magnetized alternately with different polarities in the circumferential direction.

[0011] Multiple coil patterns formed inside the printed circuit board 50 face the magnetic pole portions 30 and 40 in the axial direction A, separated by a gap. By controlling the energization state of these multiple coil patterns, the yoke 20 rotates relative to the support shaft 10 in accordance with the magnetic force generated between the multiple coil patterns and the magnetic pole portion 30, and between the multiple coil patterns and the magnetic pole portion 40. The stator S is held at its outer peripheral end by a holder (not shown), preventing it from rotating relative to the yoke 20.

[0012] Figures 2 and 3 are front views of the printed circuit board 50. The printed circuit board 50 has a first insulating layer 53 and a second insulating layer 55, which are mainly made of resin. The first insulating layer 53 and the second insulating layer 55 have electrical insulating properties. The first insulating layer 53 and the second insulating layer 55 are formed, for example, by impregnating a glass woven fabric (glass cloth) or glass nonwoven fabric with an insulating epoxy resin, phenolic resin, polyimide resin, BT resin, etc., and curing it. Figure 2 shows the coil patterns U1, W1, V2, U3, W3, and V4 formed in the first insulating layer 53 of the printed circuit board 50 with dotted lines. Figure 3 shows the coil patterns V1, U2, W2, V3, U4, and W4 formed in the second insulating layer 55 of the printed circuit board 50 with dotted lines. In Figure 2, for ease of understanding, the coil patterns V1, U2, W2, V3, U4, and W4 formed in the second insulating layer 55 are omitted from the illustration. In Figure 3, for ease of understanding, the coil patterns U1, W1, V2, U3, W3, and V4 formed within the first insulating layer 53 are omitted from the illustration. Figure 4 is a cross-sectional view AA of Figure 2. Figure 5 is a cross-sectional view BB of Figure 2. The first insulating layer 53 faces the magnetic pole portion 30, and the second insulating layer 55 faces the magnetic pole portion 40. Signal patterns, power supply patterns, ground patterns, etc., are formed on the first insulating layer 53 and the second insulating layer 55, although these are not shown.

[0013] The printed circuit board 50 has coil-shaped coil patterns U1-U4, V1-V4, and W1-W4 formed from conductive patterns. Specifically, as shown in Figure 2, coil patterns U1, W1, V2, U3, W3, and V4 are formed in the first insulating layer 53 at 60-degree intervals in the circumferential direction C. Coil patterns U1, W1, V2, U3, W3, and V4 are examples of the first coil patterns. As shown in Figure 3, coil patterns V1, U2, W2, V3, U4, and W4 are formed in the second insulating layer 55 at 60-degree intervals in the circumferential direction C. Coil patterns V1, U2, W2, V3, U4, and W4 are examples of the second coil patterns. In other words, the printed circuit board 50 has U-phase coil patterns U1-U4, V-phase coil patterns V1-V4, and W-phase coil patterns W1-W4. Coil patterns U1 to U4 are electrically connected to each other within the printed circuit board 50. The same applies to coil patterns V1 to V4 and coil patterns W1 to W4. Coil patterns U1 to U4 are constructed using distributed winding. The same applies to coil patterns V1 to V4 and W1 to W4.

[0014] Each coil pattern is formed by a conductor pattern that is coiled and revolves approximately four times on the same plane. In other words, the number of turns in each coil pattern is approximately four, but is not limited to this. Also, as shown in Figures 4 and 5, each coil pattern consists of six coil-shaped conductor patterns that are spaced apart from each other and overlapping in the thickness direction of the printed circuit board 50, i.e., the axial direction A. Note that the number of coil-shaped conductor patterns is not limited to six; there may be one or more.

[0015] Coil patterns U1, V1, W1, U2, V2, W2, U3, V3, W3, U4, V4, and W4 are arranged in the circumferential direction C (counterclockwise in Figures 2 and 3). Coil patterns U1 to U4 are set at 90-degree intervals in the circumferential direction C. Coil patterns V1 to V4 are set at 90-degree intervals in the circumferential direction C. Coil patterns W1 to W4 are set at 90-degree intervals in the circumferential direction C. The number of coil patterns formed in the first insulating layer 53 and the number of coil patterns formed in the second insulating layer 55 are both 6.

[0016] As shown in Figures 2 and 3, the coil patterns U1-U4, V1-V4, and W1-W4 are formed within the printed circuit board 50. Therefore, even if the printed circuit board 50 is subjected to an impact, for example, displacement of the coil patterns U1-U4, V1-V4, and W1-W4 relative to the printed circuit board 50 is suppressed. Consequently, the stator S has improved impact resistance. Furthermore, the coil patterns U1-U4, V1-V4, and W1-W4 are formed within the thickness of the printed circuit board 50. Therefore, compared to a stator in which multiple coils are installed on a printed circuit board, for example, the stator S of this embodiment is thinner.

[0017] As shown in Figures 2 and 3, coil pattern U1 is spaced apart in the axial direction A from coil patterns W4 and V1 and partially overlaps them in the axial direction A. Coil pattern W1 is spaced apart in the axial direction A from coil patterns V1 and U2 and partially overlaps them in the axial direction A. Coil pattern V2 is spaced apart in the axial direction A from coil patterns U2 and W2 and partially overlaps them in the axial direction A. Coil pattern U3 is spaced apart in the axial direction A from coil patterns W2 and V3 and partially overlaps them in the axial direction A. Coil pattern W3 is spaced apart in the axial direction A from coil patterns V3 and U4 and partially overlaps them in the axial direction A. Coil pattern V4 is spaced apart in the axial direction A from coil patterns U4 and W4 and partially overlaps them in the axial direction A. Coil pattern V1 is spaced apart in the axial direction A from coil patterns U1 and W1 and partially overlaps them in the axial direction A. Coil pattern U2 is spaced apart in the axial direction A from coil patterns W1 and V2 and partially overlaps them in the axial direction A. Coil pattern W2 is spaced apart in the axial direction A from coil patterns V2 and U3 and partially overlaps them in the axial direction A. Coil pattern V3 is spaced apart in the axial direction A from coil patterns U3 and W3 and partially overlaps them in the axial direction A. Coil pattern U4 is spaced apart in the axial direction A from coil patterns W3 and V4 and partially overlaps them in the axial direction A. Coil pattern W4 is spaced apart in the axial direction A from coil patterns V4 and U1 and partially overlaps them in the axial direction A. As a result, many coil patterns are formed in the circumferential direction C while suppressing an increase in the thickness of the printed circuit board 50.

[0018] As shown in FIG. 2, the position sensors P1, P2, and P3 are respectively surrounded by the coil patterns W1, V2, and U1, and are provided in the first insulating layer 53 of the printed circuit board 50. The temperature sensor T is surrounded by the coil pattern V4 and is provided in the first insulating layer 53 of the printed circuit board 50. Specifically, holes 541, 542, 543, and 544 surrounded by the coil patterns W1, V2, U1, and V4 are formed in the first insulating layer 53. The position sensors P1, P2, and P3 are respectively located in the holes 541, 542, and 543, and are mounted on the end surface of the second insulating layer 55 which is the interface between the first insulating layer 53 and the second insulating layer 55. Similarly, the temperature sensor T is located in the hole 544 and is mounted on the end surface of the second insulating layer 55 which is the interface between the first insulating layer 53 and the second insulating layer 55. In this way, interference between the position sensors P1 to P3 and the temperature sensor T and the coil patterns W1, V2, U1, and V4 is avoided respectively. As a result, the installation areas of the coil patterns U's, V's, and W's are ensured. Incidentally, each of the position sensors P1 to P3 is a Hall element.

[0019] FIG. 3 shows the mounting positions of the position sensors P1 to P3 and the temperature sensor T on the end surface of the second insulating layer 55. As shown in FIG. 3, the position sensor P1 is installed between the coil patterns V1 and U2 adjacent to each other in the circumferential direction C. The position sensor P2 is installed between the coil patterns U2 and W2 adjacent to each other in the circumferential direction C. The position sensor P3 is installed between the coil patterns W4 and V1 adjacent to each other in the circumferential direction C. The temperature sensor T is installed between the coil patterns U4 and W4 adjacent to each other in the circumferential direction C. In this way, the position sensors P1 to P3 and the temperature sensor T are provided at positions that do not overlap any of the coil patterns U's, V's, and W's in the axial direction A. Thereby, the influence on the detection accuracy of the position sensors P1 to P3 and the temperature sensor T due to the energization of the coil patterns U's, V's, and W's is suppressed.

[0020] Details of the conductive connections of the coil patterns U1 to U4, V1 to V4, and W1 to W4 will be described. As shown in FIG. 2, connection portions u11 and u12 formed in the first insulating layer 53 are conductively connected to one end and the other end of the coil pattern U1, respectively. The connection portion u11 is located inside so as to be surrounded by the wound coil pattern U1. The connection portion u12 is located outside the coil pattern U1. Similarly, one end and the other end of the coil pattern W1, one end and the other end of the coil pattern V2, one end and the other end of the coil pattern U3, one end and the other end of the coil pattern W3, and one end and the other end of the coil pattern V4 are conductively connected to connection portions w11 and w12, v21 and v22, u31 and u32, w31 and w32, and v41 and v42 formed in the first insulating layer 53, respectively.

[0021] Similarly, as shown in FIG. 3, one end and the other end of the coil pattern V1, one end and the other end of the coil pattern U2, one end and the other end of the coil pattern W2, one end and the other end of the coil pattern V3, one end and the other end of the coil pattern U4, and one end and the other end of the coil pattern W4 are conductively connected to connection portions v11 and v12, u21 and u22, w21 and w22, v31 and v32, u41 and u42, and w41 and w42 formed in the second insulating layer 55, respectively.

[0022] As shown in FIG. 2, a connection portion v10 is formed in the first insulating layer 53 between the coil patterns U1 and W1. Similarly, connection portions u20, w20, v30, u40, and w40 are formed in the first insulating layer 53 between the coil patterns W1 and V2, between the coil patterns V2 and U3, between the coil patterns U3 and W3, between the coil patterns W3 and V4, and between the coil patterns V4 and U1, respectively. The connection portions v10, u20, w20, v30, u40, and w40 are conductively connected to connection portions v11, u21, w21, v31, u41, and w41 formed in the second insulating layer 55, respectively.

[0023] As shown in Figure 3, the second insulating layer 55 has connection parts u10, w10, v20, u30, w30, and v40 formed between coil patterns W4 and V1, between coil patterns V1 and U2, between coil patterns U2 and W2, between coil patterns W2 and V3, between coil patterns V3 and U4, and between coil patterns U4 and W4, respectively. The connection parts u10, w10, v20, u30, w30, and v40 are electrically connected to connection parts u11, w11, v21, u31, w31, and v41 formed in the first insulating layer 53, respectively.

[0024] The connection portion v40 formed in the second insulating layer 55 is connected to a power supply pattern ep (not shown) and energized. The connection portion v40 is electrically connected to the connection portion v41, coil pattern V4, and connection portion v42 formed in the first insulating layer 53. The connection portion v42 is electrically connected to the connection portion v10 via a pattern (not shown) formed in the first insulating layer 53. The connection portion v10 is electrically connected to the connection portion v11, coil pattern V1, and connection portion v12 formed in the second insulating layer 55. The connection portion v12 is electrically connected to the connection portion v20 via a pattern (not shown) formed in the second insulating layer 55. The connection portion v20 is electrically connected to the connection portion v21, coil pattern V2, and connection portion v22 formed in the first insulating layer 53. The connection portion v22 is electrically connected to the connection portion v30 via a pattern (not shown) formed in the first insulating layer 53. Connection portion v30 is electrically connected to connection portion v31, coil pattern V3, and connection portion v32 formed in the second insulating layer 55. Connection portion v32 is electrically connected to connection portions w22 and u42 via a pattern not shown formed in the second insulating layer 55.

[0025] The connection portion u10 formed in the second insulating layer 55 is connected to a power supply pattern ep (not shown) and energized. The connection portion u10 is electrically connected to the connection portion u11, coil pattern U1, and connection portion u12 formed in the first insulating layer 53. The connection portion u12 is electrically connected to the connection portion u20 via a pattern (not shown) formed in the first insulating layer 53. The connection portion u20 is electrically connected to the connection portion u21, coil pattern U2, and connection portion u22 formed in the second insulating layer 55. The connection portion u22 is electrically connected to the connection portion u30 via a pattern (not shown) formed in the second insulating layer 55. The connection portion u30 is electrically connected to the connection portion u31, coil pattern U3, and connection portion u32 formed in the second insulating layer 55. The connection portion u32 is electrically connected to the connection portion u40 via a pattern (not shown) formed in the first insulating layer 53. The connection portion u40 is electrically connected to the connection portion u41, the coil pattern U4, and the connection portion u42 formed in the second insulating layer 55. The connection portion u42 is electrically connected to the connection portions v32 and w22 via a pattern (not shown) formed in the second insulating layer 55.

[0026] The connection portion w30 formed in the second insulating layer 55 is connected to a power supply pattern ep (not shown) and energized. The connection portion w30 is electrically connected to the connection portion w31, coil pattern W3, and connection portion w32 formed in the first insulating layer 53. The connection portion w32 is electrically connected to the connection portion w40 via a pattern (not shown) formed in the second insulating layer 55. The connection portion w40 is electrically connected to the connection portion w41, coil pattern W4, and connection portion w42 formed in the second insulating layer 55. The connection portion w42 is electrically connected to the connection portion w10 via a pattern (not shown) formed in the second insulating layer 55. The connection portion w10 is electrically connected to the connection portion w11, coil pattern W1, and connection portion w12 formed in the first insulating layer 53. The connection portion w12 is electrically connected to the connection portion w20 via a pattern (not shown) formed in the first insulating layer 53. Connection w20 is electrically connected to connection w21, coil pattern W2, and connection w22 formed in the second insulating layer 55. Connection w22 is electrically connected to connection v32 and u42 via a pattern (not shown) formed in the second insulating layer 55. The pattern connecting connection w22, v32, and u42 corresponds to the neutral point.

[0027] As shown in Figure 4, the position sensor P3, surrounded by the coil pattern U1, does not protrude from the end face of the first insulating layer 53 opposite to the second insulating layer 55. That is, the position sensor P3 is located within the thickness of the first insulating layer 53. The same applies to the position sensors P1 and P2 and the temperature sensor T. Furthermore, the coil patterns U1, W1, V2, U3, W3, and V4 are located within the first insulating layer 53, while the coil patterns V1, U2, W2, V3, U4, and W4 are located within the second insulating layer 55. Consequently, the stator S is made thinner.

[0028] Furthermore, as shown in Figure 4, the position sensor P3 is electrically connected to a pad ppd provided on the upper surface of the second insulating layer 55. That is, the hole 543 in which the position sensor P3 is placed is formed to penetrate the first insulating layer 53. The same applies to the other holes 541 and 542. For example, unlike this embodiment, it is possible to form the structure of the first insulating layer 53 and the second insulating layer 55 from a single insulating layer, rather than manufacturing the first insulating layer 53 and the second insulating layer 55 separately. It is conceivable to create a hole in that insulating layer that does not penetrate, and place the position sensor in that hole. In this case, it is necessary to form a hole in the printed circuit board to the depth position of the pad ppd to which the position sensor is electrically connected. If a hole deeper than the depth of the pad ppd is formed, the pad ppd will be damaged, and conversely, if a hole shallower than the depth of the pad ppd is formed, the pad ppd will remain embedded in the insulating layer, which is expected to cause a connection failure. Thus, it may be difficult to achieve a manufacturing method that achieves high precision. On the other hand, in this embodiment, the first insulating layer 53 and the second insulating layer 55 are manufactured separately, and the first insulating layer 53 is processed to form through-holes 541 to 543. This makes it easier to manufacture the printed circuit board 50.

[0029] Furthermore, as shown in Figure 4, the connection portion u11 includes a through-hole H penetrating the first insulating layer 53 and pads pd that are electrically connected to the through-hole H and provided on the surface and bottom of the first insulating layer 53, respectively. In this embodiment, they are referred to as pads, but they may also be called lands. The connection portion u10 includes a plurality of through-holes h penetrating the second insulating layer 55 and pads pd that are electrically connected to the plurality of through-holes h and provided on the surface and bottom of the second insulating layer 55, respectively. The through-hole H and the plurality of through-holes h overlap in the thickness direction of the printed circuit board 50 and are electrically connected via the plurality of pads pd. The inner diameter of the through-hole H is larger than the inner diameter of the through-hole h. Also, the through-hole H and the plurality of through-holes h overlap so as to communicate with each other. A common solder sd is filled inside the through-hole H and the plurality of through-holes h. With the first insulating layer 53 and the second insulating layer 55 stacked, solder sd is filled through the through-hole H, allowing the solder sd to flow to multiple through-holes h. In this way, the connection part u11 and the connection part u10 are electrically connected via the solder sd. As mentioned above, the through-hole H and the multiple through-holes h are electrically connected via pads pd, but simply bringing the pads pd into contact with each other is unreliable in situations where impact is applied. On the other hand, in this embodiment, by filling the through-hole H and the multiple through-holes h with solder sd, the coil pattern etc. formed in the first insulating layer 53 is easily electrically connected to the power supply pattern ep etc. formed in another insulating layer, the second insulating layer 55, and the insulating layers are firmly connected to each other, improving impact resistance. In addition, since the inner diameter of the through-hole H is larger than that of the through-hole h, it is easy to fill the through-hole H with solder sd.

[0030] In addition, each of the connection parts v10, u20, w20, v30, u40, w40, u11, w11, v21, u31, w31, and v41 formed on the first insulating layer 53 is firmly connected to each of the connection parts v11, u21, w21, v31, u41, w41, u10, w10, v20, u30, w30, and v40 formed on the second insulating layer 55 by solder connecting the through-hole H to multiple through-holes h. Figure 4 shows a power supply pattern ep that is conductive to the pad pd of connection part u10 on the bottom surface of the second insulating layer 55.

[0031] As shown in Figure 5, the connection part w12 includes a through-hole H that penetrates the first insulating layer 53, and pads pd that are electrically connected to the through-hole H and provided on the surface and bottom of the first insulating layer 53, respectively. The through-hole H of the connection part w12 is not filled with solder. The inner wall of the through-hole H is made of a conductive material, and the six layers of the coil pattern W1 are electrically connected to each other. The other connection parts u12, v22, u32, w32, and v42 formed in the first insulating layer 53 have a similar configuration and are not filled with solder. They are electrically connected to the power supply pattern ep, signal patterns (not shown), power patterns, ground patterns, etc., through the pads pd. Although not shown in Figure 5, the inner wall of the through-hole h formed in the second insulating layer 55 is also made of a conductive material, and the connection parts v12, u22, w22, v32, u42, and w42 have a similar configuration and are not filled with solder. Similarly, electrical connections are established through pad pd to the power supply pattern ep, signal patterns (not shown), power patterns, ground patterns, etc. In this way, when electrical connections are established between coil patterns formed within the first insulating layer 53 or the second insulating layer 55, or between coil patterns and the power supply pattern ep, etc., it is not necessary to fill the through-holes H or through-hole h with solder sd; the electrical connections between coil patterns, etc., can be established solely through the through-holes H or through-hole h. Therefore, the number of soldering points can be reduced, and production costs can be lowered.

[0032] Figure 6 is a cross-sectional view of a modified printed circuit board 50a. Figure 6 corresponds to Figure 4. The second insulating layer 55 of the printed circuit board 50a does not have the aforementioned connection portion u10 formed thereon. A pad pd is formed on the end face of the second insulating layer 55 and is electrically connected to the pad pd of the connection portion u11. The pad pd on the end face of the second insulating layer 55 is electrically connected to the power supply pattern ep, signal patterns (not shown), power patterns, ground patterns, etc., formed on the end face of the second insulating layer 55. As explained in Figure 4, by filling the through-holes H with solder sd, the coil pattern etc. formed in the first insulating layer 53 can be easily electrically connected to the power supply pattern ep etc. formed in the second insulating layer 55, which is another insulating layer, and the insulating layers are firmly connected to each other, improving impact resistance. The same applies when filling the through-holes h of the second insulating layer with solder sd.

[0033] As described above, coil patterns U1-U4, V1-V4, and W1-W4 constitute a three-phase coil pattern. The total number of these coil patterns is an even number, 12. Also, the number of poles in magnetic pole sections 30 and 40 is 8. Thus, the total number of coil patterns is 1.5 times the number of poles.

[0034] As another example, the total number of coil patterns may be an even number of 6, and the number of poles in the magnetic pole section may be 4. In this case, the number of coil patterns for each of the U-phase, V-phase, and W-phase is 2. For example, three coil patterns may be provided in the first insulating layer 53 of the printed circuit board 50, and the remaining three coil patterns may be provided in the second insulating layer 55 of the printed circuit board 50. In this case as well, the total number of coil patterns is 1.5 times the number of poles.

[0035] As yet another example, the total number of coil patterns may be an even number, 18, and the number of poles in the magnetic pole section may be 6. In this case, the number of coil patterns for each of the U-phase, V-phase, and W-phase is 6. For example, 9 coil patterns may be provided in the first insulating layer 53 of the printed circuit board 50, and the remaining 9 coil patterns may be provided in the second insulating layer 55 of the printed circuit board 50. In this case, the total number of coil patterns is 3 times the number of poles.

[0036] As in the example above, when a coil pattern is wound in a distributed winding manner, a position sensor is surrounded by one of the coil patterns, and the position sensor is positioned between two other coil patterns that are spaced apart in the axial direction A and adjacent to each other in the circumferential direction C, it is preferable to configure a three-phase coil pattern as in the example above, with an even number of coil patterns and a total number of coil patterns equal to 1.5 or 3 times the number of poles. This allows the coil patterns and position sensor to be positioned in the theoretical location without interference. Furthermore, 1.5 times the number of poles is preferable. This is because if the number of poles increases, such as to 3 times the number of poles, the number of required coil patterns increases, making the configuration more complex and thus more difficult to manufacture.

[0037] As described above, multiple coil patterns are formed within the printed circuit board 50. For example, if the printed circuit board and multiple coils are manufactured separately and the multiple coils are fixed to desired positions on the printed circuit board, the work process becomes complicated. In this embodiment, each coil pattern is formed within the printed circuit board 50 using a conductive material during the manufacturing process of the printed circuit board 50. In this way, the work process is simplified.

[0038] During the manufacturing process of the printed circuit board 50, circuit patterns for position sensors P1 to P3 are formed simultaneously with the formation of each coil pattern, and the position sensors P1 to P3 and the circuit patterns are connected at the aforementioned positions. This improves the relative positional accuracy between each coil pattern and position sensors P1 to P3. As a result, the switching timing of each coil pattern based on the detection results of position sensors P1 to P3 becomes more accurate, improving the accuracy of rotation control.

[0039] By integrally forming the first insulating layer 53 and the second insulating layer 55 in the manufacturing process of the printed circuit board 50, the relative positional accuracy between the multiple coil patterns formed in the first insulating layer 53 and the multiple coil patterns formed in the second insulating layer 55 is improved. This also improves the accuracy of rotational control.

[0040] The first insulating layer 53 and the second insulating layer 55 may be formed separately, and then the first insulating layer 53 and the second insulating layer 55 may be joined together with an adhesive or the like. This makes it easier to change the manufacturing process of the printed circuit board 50, for example, to respond to changes in specifications.

[0041] Coil patterns U1, W1, V2, U3, W3, and V4 are formed within the first insulating layer 53, but may also be formed on the end face of the first insulating layer 53 opposite to the second insulating layer 55, for example. Coil patterns V1, U2, W2, V3, U4, and W4 are formed within the second insulating layer 55, but may also be formed on the end face of the second insulating layer 55 opposite to the first insulating layer 53, for example. Furthermore, although the printed circuit board 50 described above has two first insulating layers 53 and a second insulating layer 55, it may have three or more layers.

[0042] Furthermore, although it was explained that the pads pd of the first insulating layer 53 and the second insulating layer 55 are electrically connected to each other, or that the pads pd are electrically connected to the power supply pattern ep, signal pattern, power pattern, and ground pattern, etc., the pads pd are not necessarily required. For example, the conductive materials on the inner walls of through-holes H and h are electrically connected to each other, or the conductive material on the inner wall is electrically connected to the power supply pattern ep, etc., or the solder sd filled in through-holes H and h is electrically connected to the conductive material on the inner wall of through-holes H and h, or the solder sd filled in through-holes H and h is electrically connected to the power supply pattern ep, etc.

[0043] Although preferred embodiments of the present invention have been described in detail above, the present invention is not limited to these specific embodiments, and modifications and changes are possible within the scope of the gist of the present invention as described in the claims. [Explanation of symbols]

[0044] 1. Axial gap motor 20 York 30, 40 magnetic pole part S stator 50 Printed circuit boards 53. First insulating layer 55 Second insulating layer U1, W1, V2, U3, W3, V4 coil patterns (first coil pattern) V1, U2, W2, V3, U4, W4 coil patterns (second coil patterns) P1~P3 Position Sensors T temperature sensor 541~544 holes

Claims

1. A printed circuit board having a plurality of insulating layers including a first and a second insulating layer, A plurality of first coil patterns formed by a conductor pattern on the first insulating layer, A plurality of second coil patterns formed by a conductor pattern on the second insulating layer, Stator of an axial gap motor equipped with [a specific feature / feature].

2. A first through-hole formed in the first insulating layer and electrically connected to any of the plurality of first coil patterns, A second through-hole is formed in the second insulating layer, is electrically connected to any of the plurality of second coil patterns, overlaps the first through-hole in the thickness direction of the printed circuit board, and is electrically connected to the first through-hole, A stator for an axial gap motor according to claim 1, comprising the following:

3. Multiple second through-holes are formed in the second insulating layer. The stator of an axial gap motor according to claim 2, wherein the first through-hole overlaps with the plurality of second through-holes in the thickness direction of the printed circuit board and is electrically connected to the plurality of second through-holes.

4. The stator for an axial gap motor according to claim 3, wherein the inner diameter of the first through-hole is larger than the inner diameter of the second through-hole.

5. The stator of an axial gap motor according to claim 4, wherein a common solder is filled into the first through-hole and the plurality of second through-holes.

6. A first through-hole formed in the first insulating layer and electrically connected to any of the plurality of first coil patterns, A pad formed in the second insulating layer, electrically connected to the power supply pattern, overlapping the first through-hole in the thickness direction of the printed circuit board and electrically connected to the first through-hole, A stator for an ankylous gap motor according to claim 1, comprising:

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