Support structure for membrane probe card and test method for membrane probe card

Abstract

Provides a support structure for membrane probe cards. [Solution] The support structure includes a frame body, a fastener, an adjustment mechanism, and a first elastic structure. The frame body is configured to be in contact with the membrane. The fastener is configured to fix the frame body to the substrate and to restrain the frame body so that it is movable along a direction perpendicular to the substrate. The fastener includes through holes. The adjustment mechanism is movably and tightly positioned within the through holes. The first elastic structure is positioned in a first space of the frame body, and each of the first elastic structures corresponds to the position of one of the adjustment mechanisms. The adjustment mechanism is configured to adjust the elastic force of the first elastic structure.

Description

Technical Field

[0001] (Cross - reference to Related Applications) This application claims the benefit of Chinese Patent Application No. 202411215762.3 (the priority date is August 30, 2024), and the subject matter thereof is incorporated herein by reference.

[0002] The present invention relates to a membrane probe card and a test method for a membrane probe card, and more specifically, to a membrane probe card having an adjustable support structure and a test method for the membrane probe card.

Background Art

[0003] Electrical testing is an important step carried out in the process of integrated circuit manufacturing to ensure normal device function. From the perspective of today's high - speed circuits, membrane probe cards can advantageously perform high - frequency tests. However, since the membrane is not made of a rigid material, the intensity of the contact force between each probe and the device under test (DUT) becomes non - uniform, thereby degrading the test quality.

[0004] Furthermore, the flatness of the probe card or DUT can vary. Alternatively, the force applied to the probe card becomes non - uniform, which may cause a difference in the flatness of the membrane. If the flatness of the membrane does not match the flatness of the DUT, the results of the electrical test may be incorrect.

[0005] Therefore, it is essential to ensure the contact quality between the thin film and the DUT.

[0006] The above description of the "Prior Art" merely serves to clarify the background art and is not intended to admit that the above description of the "Prior Art" discloses the subject matter of the present disclosure, constitutes the prior art of the present disclosure, or is part of the present disclosure.

Summary of the Invention

Problems to be Solved by the Invention

[0007] In view of the aforementioned drawbacks of the prior art, the object of the present invention is to provide a support structure for a membrane probe card and a method for testing the membrane probe card. [Means for solving the problem]

[0008] Embodiments of the present disclosure provide a support structure for a membrane probe card, which is positioned between a substrate and a membrane fixed to the substrate to support a test area of ​​the membrane. The support structure includes a frame body, a fixture, an adjustment mechanism, and a first elastic structure. The frame body is fitted to contact the membrane. The fixture is fitted to fix the frame body to the substrate and to ensure that the frame body is movable in a direction perpendicular to the substrate. The fixture has a plurality of through holes. The adjustment mechanism is positioned movable and tightly within each through hole. The first elastic structure is positioned in a first space of the frame body, corresponding to the position of each adjustment mechanism. The adjustment mechanism adjusts the elastic force of the first elastic structure.

[0009] Another embodiment of the present disclosure provides a test method for a membrane probe card, the membrane probe card comprising a substrate, a support structure, and a membrane, wherein the support structure is positioned between the substrate and the membrane to support a test area within the membrane. The test method includes the steps of: applying a first stress to the substrate to allow not only for the test area of ​​the membrane probe card to contact the device under test, but also for a first contact stress to exist between the test area and the device under test; measuring a second stress between the support structure and the test area; adjusting the elastic force of at least one of a plurality of elastic structures in the support structure in accordance with the second stress; and applying a first stress to the substrate to allow not only for the test area of ​​the membrane probe card to contact the device under test, but also for a second contact stress to exist between the test area and the device under test. The second contact stress and the first contact stress are not equal. [Effects of the Invention]

[0010] Therefore, the disclosed support structure for the membrane probe card and the test method for the membrane probe card are effective in maintaining an equal strength of contact force between the membrane and the device under test, and in obtaining reliable test results.

[0011] The technical features and advantages of this disclosure are described above in general and extensively in order to enable the understanding of the detailed description of this disclosure below. Other technical features and advantages of the subject matter of the claims of this disclosure are described below. Those skilled in the art will understand that they can easily use the concepts and specific embodiments presented below to modify or design any other structure or manufacturing process to achieve the same objectives as the disclosure. They will also understand that the equivalent configurations described above cannot deviate from the spirit and scope defined in the appended claims of this disclosure. [Brief explanation of the drawing]

[0012] Those skilled in the art can gain insights into the present disclosure by referring to the embodiments, claims, and drawings of this disclosure. In the drawings, similar components are given the same reference numerals.

[0013] [Figure 1] This is a schematic diagram of a test system according to some embodiments of the present disclosure. [Figure 2] This is a schematic diagram of a support structure according to some embodiments of the present disclosure. [Figure 3] This is a schematic diagram of a method for testing a device under test using a membrane probe card, according to some embodiments of the present disclosure. [Figure 4] This is a schematic top view of the arrangement of support structures according to some embodiments of the present disclosure. [Figure 5] This is a schematic top view of the arrangement of support structures according to some embodiments of the present disclosure. [Figure 6] This is a schematic top view of the arrangement of support structures according to some embodiments of the present disclosure. [Figure 7] Figures 7A and 7B are schematic top views of the arrangement of an adjustment mechanism according to some embodiments of the present disclosure. [Figure 8] Figures 8A and 8B are schematic top views of the arrangement of an adjustment mechanism according to some embodiments of the present disclosure. [Figure 9] Figures 9A and 9B are schematic top views of the arrangement of an adjustment mechanism according to some embodiments of the present disclosure. [Figure 10] Figures 10A and 10B are schematic top views of the arrangement of an adjustment mechanism according to some embodiments of the present disclosure. [Figure 11] Figures 11A and 11B are schematic top views of the arrangement of an adjustment mechanism according to some embodiments of the present disclosure. [Figure 12] It is a schematic diagram of another test system according to other embodiments of the present disclosure. [Figure 13] It is a schematic diagram of another test system according to other embodiments of the present disclosure. [Figure 14] It is a schematic diagram of a process flow of a test method according to some embodiments of the present disclosure.

Best Mode for Carrying Out the Invention

[0014] In the following description, for the purpose of exemplifying embodiments of the present disclosure, drawings are attached which are incorporated herein and form a part thereof. However, the present disclosure is not limited to these embodiments. The embodiments described below may be combined as appropriate to realize other embodiments.

[0015] The expressions "one embodiment", "embodiment", "exemplary embodiment", "other embodiment", and "another embodiment" used herein state that embodiments of the present disclosure may include specific features, structures, or characteristics. However, not all embodiments need to include specific features, structures or characteristics. Furthermore, repeated use of the expression "in one embodiment" should not exclude the possibility of referring to the same embodiment, and thus does not necessarily mean referring to the same embodiment.

[0016] The following description details steps and structures to enable a complete understanding of the present disclosure. As is apparent, embodiments of the present disclosure impose no limitation to specific details well-known to those skilled in the art. Further, well-known structures and steps are not repeated herein so as not to unnecessarily limit the present disclosure. Preferred embodiments of the present disclosure are described in detail below. However, in addition to the detailed description, the present disclosure can be implemented extensively in other embodiments. The scope of the present disclosure is defined not by the detailed description but by the appended claims.

[0017] The following description provides different embodiments or examples for use in implementing different features of the present disclosure. To simplify the content of the present disclosure, specific embodiments or examples of components and arrangements are described in detail herein. The specific embodiments and examples are illustrative rather than limiting the present disclosure. For example, the dimensions of the components are not limited to the disclosed ranges or values, but are based on process criteria and / or the expected properties of the device. In the following description, an embodiment in which a first feature is formed above or on a second feature includes any embodiment in which the first feature thus formed is in direct contact with the second feature, or any embodiment in which additional features are formed between the first feature and the second feature so that the first feature and the second feature are not in direct contact with each other. For simplicity and clarity, various features in the accompanying drawings are not drawn to actual scale. For simplicity, some layers / features are omitted in the accompanying drawings.

[0018] Furthermore, for illustrative purposes, expressions relating to spatial relationships, such as “downward,” “below,” “lower,” “upward,” and “upper,” are used herein to describe the relationship between one component (or feature) and another, as shown in the accompanying drawings. These expressions relating to spatial relationships are intended to indicate any other directions in which the component is used or operated, in addition to the directions shown in the accompanying drawings. A component may have any other orientation (e.g., rotated 90 degrees or aligned with another orientation), and the expressions relating to spatial relationships may be interpreted accordingly.

[0019] Figure 1 is a schematic diagram of test system 1 in some embodiments of the present disclosure. Test system 1 tests a device under test (DUT). In some embodiments, the device under test (DUT) is an electronic device having contacts. In some embodiments, the device under test (DUT) is an integrated circuit on a die or a wafer-level integrated circuit. However, the present disclosure is not limited to any electronic component capable of transmitting electrical signals, as such, the device under test (DUT) disclosed herein may be any electronic component capable of transmitting electrical signals.

[0020] The test system 1 comprises a membrane probe card 10, a carrier 20, a circuit board 30, and a connecting structure 40. The carrier 20 transports the device under test (DUT). The membrane probe card 10 is adapted to contact the DUT and transmit electrical signals to the DUT via the circuit board 30 and the connecting structure 40 to perform the test. For simplicity, Figure 1 shows only one DUT. However, the disclosure is not limited thereto, as the membrane probe card 10 can test one or more DUTs each time.

[0021] The membrane probe card 10 includes a support structure 100, a substrate 200, and a membrane 300. As shown in Figure 1, both ends of the membrane 300 are fixed to the substrate 200, and the support structure 100 is positioned between the substrate 200 and the membrane 300, supporting the test area TA of the membrane 300. The test area TA corresponds to the intended test area location of the device under test (DUT). Different test area TAs correspond to different locations on the DUT. The test area TAs can be adjusted to adapt to the DUT. For example, one test area TA may correspond to the location of one or more DUTs.

[0022] As shown in Figure 1, the membrane 300 is fixed to the second surface 202 of the substrate 200. In various embodiments, the membrane 300 is fixed to the first surface 201 of the substrate 200. The first surface 201 and the second surface 202 are oriented away from each other.

[0023] The membrane probe card 10 has a probe 310 positioned within the test area TA of the membrane 300. After the membrane probe card 10 makes contact with the device under test (DUT), the probe 310 makes direct contact with the electronic contacts of the DUT. The membrane 300 further has path lines for transmitting electronic signals between the circuit board 30 and / or connection structure 40 and the probe 310.

[0024] The membrane is made of a flexible material. As disclosed in the prior art, if tolerances exist in the flatness of the probe card or the device under test, the strength of the contact force exerted by the probe on the device under test will not be equal, resulting in either insufficient or excessive contact force. Insufficient contact force results in poor quality contact between the probe and the device under test, resulting in excessive impedance in signal transmission and even an open circuit. If the contact force is too strong, the probe may either destroy the contact point on the device under test or cause damage to the probe. If the destroyed contact point on the device under test is a bump and the device under test needs to undergo a subsequent reflow process, the destroyed bump is prone to generating bubbles and degrading the bump's electrical properties. All of the aforementioned events adversely affect the test results.

[0025] Compared to the prior art, the embodiments of this disclosure provide an elastically adjustable support structure 100, and by adjusting the elastic force of the support structure 100, the pre-force exerted on different points of the test area TA of the membrane can be adjusted, thereby compensating for the phenomenon of non-uniform contact stress. Furthermore, if the flatness of the membrane probe card 10 or the device under test DUT is non-uniform, the test results will be unsatisfactory, but the flatness of the membrane probe card 10 or the device under test DUT becomes constant when the strength of the contact force is adjusted to be uniform.

[0026] Referring to Figure 2, schematic diagrams of support structures 100 in some embodiments of the present disclosure are shown. The support structure 100 includes a frame body 110, a fastener 120, an elastic structure 130, an adjustment mechanism 140, and a plate 150. The fastener 120 is positioned on the first surface 201 of the substrate 200, and the frame body 110 is positioned on the second surface 202 of the substrate 200. The fastener 120 fastens the frame body 110 to the substrate 200 with screws.

[0027] As shown in Figure 2, the frame body 110 has spaces 111 for housing each of the elastic structures 130.

[0028] The fastener 120 has a through hole 121. The substrate 200 has a through hole 210 (shown in Figure 1). The through hole 121 of the fastener 120 corresponds to the position of the through hole 210 of the substrate 200. As a result, when the fastener 120 is placed on the substrate 200, the through hole 121 of the fastener 120 and the through hole 210 of the substrate 200 come together to form a continuous through hole. In one embodiment, a position limiting post 122 is placed between the fastener 120 and the frame body 110, so that the frame body 110 can move up and down in a direction perpendicular to the substrate 200 (i.e., the Z direction) rather than moving in the X, Y directions or rotating around an axis extending in the X, Y directions.

[0029] Each adjustment mechanism 140 is movably and tightly positioned in a through hole 121 of the fastener 120. A plate 150 is positioned between one of the adjustment mechanisms 140 and the corresponding one of the elastic structures 130. Each of the adjustment mechanisms 140 has one end that contacts one end of the corresponding one of the plates 150. The other end of the plate 150 is connected to the first end 131 of the corresponding one of the elastic structures 130. The second end 132 of the elastic structure 130 is connected to the frame body 110.

[0030] In some embodiments, the adjustment mechanism 140 is a screw. The through hole 121 of the fastener 120 has a screw thread. The adjustment mechanism 140 engages with the screw thread and rotates relative to the screw thread to move up and down (i.e., in the Z direction), causing the plate 150 to move up and down. Since the first end 131 of the elastic structure 130 is connected to the plate 150, each time the adjustment mechanism 140 moves up and down in the through hole 121, the position of the first end 131 of the elastic structure 130 changes.

[0031] In some embodiments, the elastic structure 130 is a spring. When the length L between the first end 131 and the second end 132 of each elastic structure 130 changes, the elastic force (F) of each elastic structure 130 changes with the change in length L (x), according to Hooke's Law (F = -x·κ), where κ represents the spring constant. When the adjustment mechanism 140 is moved to a different position, the elastic structure 130 has a different elastic force. Thus, the adjustment mechanism 140 adjusts the elastic force of the elastic structure 130.

[0032] In some embodiments, the frame body 110 is in contact with the membrane 300, and the elastic force of the elastic structure 130 within the frame body 110 affects the contact stress of each probe 310 in contact with a corresponding one of the DUTs under test. Therefore, the contact stress of each probe 310 in contact with a corresponding one of the DUTs under test can be adjusted according to the change in the position of the adjustment mechanism 140. In some embodiments, the frame body 110 corresponds to the position of one or more DUTs under test.

[0033] Referring to Figure 3, schematic diagrams are shown of a method for testing a device under test (DUT) using a membrane probe card 10 in some embodiments of the present disclosure. When a stress σ1 is applied to the substrate 200, the edge EG of the test area TA bends after the probe 310 contacts the device under test (DUT). Thus, the bending of the edge EG causes different contact stresses between probes 311 and 312, which are in contact with each device under test (DUT). If the contact stresses are not equal, the flatness of the thin film 300 within the test area TA will be inconsistent. For example, since probe 311, which is closer to the edge EG, is located distal to the device under test (DUT), the contact stress between probe 311 and the device under test (DUT) is smaller than the contact stress between probe 312 and the device under test (DUT). To compensate for the difference in contact stresses, the adjustment mechanism 140 near the edge EG is adjusted to be positioned downward to compress the elastic structure 130. This shortens the length L to L1, resulting in the elastic structure 130 exerting a greater elastic force on the thin film 300, and increasing the contact stress between the probe 311 and the device under test (DUT). The increased contact stress between the probe 311 and the device under test (DUT) not only improves the uniformity of the contact stress between the probe 311 and the device under test (DUT) and between the probe 312 and the device under test (DUT), but also brings the flatness of the membrane 300 at probe 311 closer to the flatness of the thin film 300 at probe 312 (i.e., improves the uniformity of the flatness of the membrane 300). In some embodiments, when adjusting the elastic force of the elastic structure 130 corresponding to the position of probe 311, when probes 311 and 312 are in contact with the device under test (DUT), the elastic force of the elastic structure 130 corresponding to the position of probe 311 is not equal to the elastic force of the elastic structure 130 corresponding to the position of probe 312. In some embodiments, when adjusting the elastic force of the elastic structure 130 corresponding to the position of probe 311, the contact stress between probe 311 and the DUT is substantially equal to the contact stress between probe 312 and the DUT when probes 311 and 312 are in contact with the DUT under test.In some embodiments, when adjusting the elastic force of the elastic structure 130 corresponding to the position of probe 311, a predetermined flatness within the test area TA can be maintained when probes 311 and 312 are in contact with the device under test DUT.

[0034] In some embodiments, the surface of the device under test (DUT) has a contact point at the position corresponding to probe 313 that is higher (in the Z direction) than the contact point at the position corresponding to probe 314. On the other hand, the contact stress between probe 313 and the device under test (DUT) is greater than the contact stress between probe 314 and the device under test (DUT) when probes 313 and 314 are in contact with the device under test (DUT). To compensate for the difference in contact stress, the adjustment mechanism 140 at the position corresponding to probe 314 is adjusted to be positioned higher so as to stretch the corresponding elastic structure 130. Thus, the length L is extended to length L2, and as a result, the corresponding elastic structure 130 exerts a weaker elastic force on the membrane 300, reducing the contact stress between probe 313 and the device under test (DUT). A decrease in the contact stress between probe 313 and the device under test (DUT) not only improves the uniformity of the contact stress between probe 313 and the DUT, and between probe 314 and the DUT, but also brings the flatness of the membrane 300 at probe 313 closer to the flatness of the membrane 300 at probe 314 (i.e., increases the uniformity of the flatness of the membrane 300). In some embodiments, when adjusting the elastic force of the elastic structure 130 corresponding to probe 313, when probes 313 and 314 are in contact with the DUT, the elastic force of the elastic structure 130 corresponding to the position of probe 313 is not equal to the elastic force of the elastic structure 130 corresponding to the position of probe 314. In some embodiments, when adjusting the elastic force of the elastic structure 130 corresponding to probe 313, when probes 313 and 314 are in contact with the DUT, the contact stress between probe 313 and the DUT is substantially equal to the contact stress between probe 314 and the DUT. In some embodiments, when adjusting the elastic force of the elastic structure 130 corresponding to the probe 313, a predetermined flatness within the test area TA can be maintained when the probes 313 and 314 are in contact with the device under test (DUT).

[0035] Therefore, after adjusting the elastic force of the elastic structure 130, applying a stress σ1 to the substrate 200 allows the probes 310 to contact the device under test DUT, respectively. This not only makes the contact stress between the probes 311-314 and the device under test DUT more uniform, but also allows the membrane 300 to have appropriate flatness for testing the device under test DUT. In some embodiments, the contact stress between each of the probes 311-314 and the device under test DUT is substantially the same.

[0036] In another embodiment, the adjusted elastic force of the elastic structure 130 is equal to the unadjusted elastic force of the elastic structure 130.

[0037] In other embodiments, the adjusted contact stress of the probe corresponding to the position of the elastic structure 130 is not equal to the unadjusted contact stress of the probe corresponding to the position of the elastic structure 130.

[0038] In some embodiments, the membrane probe card 10 includes a support structure 100, and the elastic structure 130 of each support structure 100 is either identical or different. For example, in some embodiments, the springs used in the support structure 100, which have different diameters or different wire diameters, differ from one support structure to another. In other embodiments, the same support structure 100 uses springs with different diameters or different wire diameters. Therefore, the spring constant κ of the elastic structure 130 in each support structure 100 is either the same or different.

[0039] As shown in Figures 1, 2, and 3, the support structure 100 has two adjustment mechanisms 140 and two spaces 111 that accommodate two elastic structures 130. However, the number of adjustment mechanisms 140, spaces 111, and elastic structures 130 can be any number and still fall within the scope of the disclosure, so the disclosure is not limited thereto.

[0040] In some embodiments, each adjustment mechanism 140 adjusts one elastic structure 130, and each elastic structure 130 corresponds to the position of one corresponding probe among the probes 310. In some embodiments, one of the adjustment mechanisms 140 adjusts at least two elastic structures 130, and one of the elastic structures 130 corresponds to the position of one corresponding probe among the probes 310. In some embodiments, one of the adjustment mechanisms 140 adjusts at least two elastic structures 130, and one of the elastic structures 130 corresponds to the positions of at least two probes 310.

[0041] Referring to Figures 4, 5, and 6, schematic top views of the arrangement of the support structure 100 in some embodiments of the present disclosure are shown. For ease of understanding, Figures 4, 5, and 6 simply show the relative positions of the membrane 300 and the support structure 100.

[0042] In the embodiment shown in Figure 4, the membrane probe card 10 includes two support structures 100 aligned with the main dimension (e.g., the X direction) of the membrane 300. In the embodiment shown in Figure 5, the membrane probe card 10 includes at least two support structures 100 aligned linearly extending in the main dimension (e.g., the X direction) of the membrane 300. In the embodiment shown in Figure 6, the membrane probe card 10 includes support structures 100 arranged in a matrix.

[0043] Referring to Figures 7A and 7B, schematic top views of the arrangement of the adjustment mechanisms 140 in some embodiments of the present disclosure are shown. In the embodiment shown in Figure 7A, the support structure 100 includes two adjustment mechanisms 140 aligned linearly in the X direction. In the embodiment shown in Figure 7B, the support structure 100 includes at least two adjustment mechanisms 140 aligned linearly in the X direction.

[0044] Referring to Figures 8A and 8B, schematic top views of the arrangement of the adjustment mechanisms 140 in some embodiments of the present disclosure are shown. In the embodiment shown in Figure 8A, the support structure 100 includes two adjustment mechanisms 140 aligned linearly in the Y direction perpendicular to the X direction. In the embodiment shown in Figure 8B, the support structure 100 includes at least two adjustment mechanisms 140 aligned linearly in the Y direction.

[0045] Referring to Figures 9A and 9B, schematic top views of the arrangement of the adjustment mechanisms 140 in some embodiments of the present disclosure are shown. In the embodiment shown in Figure 9A, the support structure 100 includes two linearly aligned adjustment mechanisms 140 extending in one direction that is not parallel to either the X or Y direction. In the embodiment shown in Figure 9B, the support structure 100 includes at least two linearly aligned adjustment mechanisms 140 extending in one direction that is not parallel to either the X or Y direction.

[0046] Referring to Figures 10A and 10B, schematic top views of the arrangement of the adjustment mechanisms 140 in some embodiments of the present disclosure are shown. In the embodiment shown in Figure 10A, the support structure 100 includes four adjustment mechanisms 140 arranged in a 2 × 2 matrix. In the embodiment shown in Figure 10B, the support structure 100 includes at least four adjustment mechanisms 140 arranged in an N × M matrix, where N and M are positive integers.

[0047] Referring to Figures 11A and 11B, schematic top views of the arrangement of the adjustment mechanisms 140 in some embodiments of the present disclosure are shown. In the embodiment shown in Figure 11A, the support structure 100 includes four adjustment mechanisms 140 arranged in two rows such that the adjustment mechanisms 140 in the first row are staggered in the Y direction relative to the adjustment mechanisms 140 in the second row. In the embodiment shown in Figure 11B, the support structure 100 includes at least four adjustment mechanisms 140 arranged in multiple rows such that the adjustment mechanisms 140 in any two adjacent rows are staggered in the Y direction.

[0048] In the embodiments shown in Figures 10A, 10B, 11A, and 11B, the adjustment mechanisms 140 in each row are equidistant.

[0049] Figure 12 is a schematic diagram of test system 2 according to another embodiment of the present disclosure. Test system 2 is similar to test system 1, except that in test system 2 the support structure 100 includes an elastomer 160 positioned between the frame body 110 and the membrane 300, and the elastomer 160 is in direct contact with the membrane 300 and the frame body 110. The elastomer 160 provides an additional buffer to the membrane 300 and the frame body 110.

[0050] Figure 13 is a schematic diagram of test system 3 according to another embodiment of the present disclosure. Test system 3 is similar to test system 1, except that test system 3 includes a pressure sensor 170 in each support structure 100. The pressure sensor 170 measures the stress σ2 between the frame body 110 and the membrane 300. The adjustment mechanism 140 adjusts the elastic force of the elastic structure 130 according to the stress σ2 measured by the pressure sensor 170. For example, if the stress σ2 measured by the pressure sensor 170 is greater than a first threshold, one of the corresponding adjustment mechanisms 140 reduces the elastic force of one of the corresponding elastic structures 130. Alternatively, if the stress σ2 measured by the pressure sensor 170 is less than a second threshold, one of the corresponding adjustment mechanisms 140 increases the elastic force of one of the corresponding elastic structures 130, so that the first threshold is greater than the second threshold.

[0051] In some embodiments, test system 1 includes the elastomer 160 of test system 2 and the pressure sensor 170 of test system 3.

[0052] In other embodiments, the stress σ2 of test system 1 and / or test system 2 is measured by an external pressure sensor. Before the test process of the device under test (DUT) begins, the probe 310 of test system 1 and / or test system 2 presses against the external pressure sensor, and then the adjustment mechanism 140 is adjusted according to the stress σ2 measured by the external pressure sensor, enabling the probe 310 to achieve the intended contact stress. Once the adjustment is complete, the test process of the device under test (DUT) begins.

[0053] Referring to Figure 14, schematic diagrams of the process flow of test method 4 according to some embodiments of the present disclosure are shown. In some embodiments, test system 1, test system 2, and / or test system 3 perform test method 4 to test the device under test (DUT). For ease of understanding, the reference numerals used in test system 1, test system 2, and test system 3 are also applicable to test method 4.

[0054] Test method 4 includes steps S42, S44, S46, and S48. Step S42 involves applying a first stress σ1 to the substrate 200 so that the test area TA of the membrane probe card 10 not only comes into contact with the device under test DUT, but also the test area TA can be made to a first degree of flatness. Step S44 involves measuring a second stress σ2 between the support structure 100 and the test area TA. Step S46 involves adjusting at least one elastic force of the elastic structure 130 in the support structure 100 in accordance with the second stress σ2. Step S48 involves applying a first stress σ1 to the substrate 200 so that the test area TA of the membrane probe card 10 comes into contact with the device under test DUT, but also the test area TA can be made to a second degree of flatness.

[0055] Steps S42, S44, S46, and S48 are not limited to Test Method 4 of this Disclosure. All the various operations described in the embodiments illustrated in Figures 1 to 13 are within the scope of Test Method 4 and the considerations therefor.

[0056] In conclusion, the membrane probe card support structure and the membrane probe card testing method provided in the embodiments of this disclosure are effective in controlling the flatness of the membrane by adjusting the stress between the membrane and the device under test through the elastic structure in the support structure. Accordingly, this disclosure optimizes the electrical contact between the device under test and each of the corresponding probes on the membrane, thereby improving test accuracy and protecting the probe card and the device under test from damage.

[0057] While the present disclosure and its advantages have been described in detail above, those skilled in the art will understand that various modifications, substitutions, and alternatives can be made to the present disclosure without departing from the spirit and scope defined by the claims attached to the present disclosure. For example, the processes described above can be carried out in different ways and can be replaced by other processes or combinations thereof.

[0058] The scope of this disclosure is not limited to specific embodiments of any process, machine, manufacture, material composition, means, method, and step described herein. The disclosures described herein enable those skilled in the art to implement the disclosure using any existing or potential process, machine, manufacture, material composition, means, method, or step that has the same function as or achieves substantially the same results as those disclosed in the embodiments described herein. Accordingly, these processes, machines, manufacture, material composition, means, method, and step fall within the scope of the claims appended to this disclosure.

Claims

1. A support structure for a membrane probe card, wherein the support structure is positioned between a substrate and a membrane fixed to the substrate, and supports the test area of ​​the membrane, and the support structure is, A frame body configured to contact the aforementioned membrane, A fixing device configured to fix the frame body onto the substrate and to restrain the frame body so that it can move along a direction perpendicular to the substrate, the fixing device having a plurality of through holes, Multiple adjustment mechanisms are movably and tightly arranged within the aforementioned through-hole, A plurality of first elastic structures are arranged in the first space of the frame body, each corresponding to the position of the adjustment mechanism, Equipped with, The adjustment mechanism is configured to adjust the elastic force of the first elastic structure, and is a support structure.

2. Multiple plates are positioned between one of the corresponding adjustment mechanisms and one of the corresponding first elastic structures. The support structure according to claim 1, further comprising:

3. The first elastic structure is, A first end that contacts one of the corresponding plates, The second end that contacts the frame body and The support structure according to claim 2, comprising:

4. The support structure according to claim 3, wherein the first elastic structure is a spring, the distance between the first end and the second end correlates with the elastic force of the first elastic structure, and the adjustment mechanism is configured to adjust the distance between the first end and the second end by adjusting the position of the plate.

5. The support structure according to claim 1, wherein the through hole has a screw thread, and the adjustment mechanism is a screw that engages with the screw thread and rotates relative to the screw thread so as to move in a direction perpendicular to the substrate.

6. The support structure according to claim 1, wherein each of the adjustment mechanisms is configured to adjust the corresponding elastic force of one of the first elastic structures.

7. The support structure according to claim 6, wherein the elastic force of the first elastic structure is adjusted so that the probe of the membrane has a uniform contact stress with respect to the device under test.

8. The support structure according to claim 1, wherein the elastic force of the first elastic structure is adjusted so that the test area of ​​the membrane is maintained to a predetermined degree of flatness.

9. A plurality of second elastic structures are arranged in the second space of the frame body, each corresponding to the position of the adjustment mechanism. Furthermore, The support structure according to claim 1, wherein the adjustment mechanism is configured to adjust the elastic force of the second elastic structure.

10. The support structure according to claim 9, wherein the elastic force of the second elastic structure is adjusted so that the probe of the membrane has a uniform contact stress with respect to the device under test.

11. The support structure according to claim 10, wherein the adjusted elastic force of the first elastic structure is equal to or not equal to the adjusted elastic force of the second elastic structure.

12. The support structure according to claim 9, wherein the membrane comprises a plurality of probes thereon, each of which corresponds to at least one position of the probes, and the elastic force of the second elastic structure is adjusted so that the contact stress exerted on the device under test by at least one of the probes is not equal to the contact stress exerted on the device under test by at least one other probe.

13. As viewed from a top view, the adjustment mechanism is aligned in a straight line extending in the first direction, as described in claim 1 of the support structure.

14. As viewed from a top view, the adjustment mechanism is arranged in an N × M matrix, where N and M are positive integers, according to claim 1.

15. As viewed from above, the support structure according to claim 1, wherein the adjustment mechanisms are arranged in a plurality of rows, each extending in a first direction, the adjustment mechanisms in each row are equally spaced, the adjustment mechanisms in any two adjacent rows are arranged alternately in a second direction, and the first direction is perpendicular to the second direction.

16. The elastomer disposed between the frame body and the membrane The support structure according to claim 1, further comprising:

17. A pressure sensor configured to measure a second stress between the frame body and the membrane. The support structure according to claim 1, further comprising:

18. The support structure according to claim 17, wherein the adjustment mechanism adjusts the elastic force of the first elastic structure in accordance with the second stress.

19. A method for testing a membrane probe card, wherein the membrane probe card comprises a substrate, a support structure, and a membrane, the support structure being positioned between the substrate and the membrane and configured to support a test area within the membrane, and the test method is: The step of applying a first stress to the substrate, thereby enabling not only the test area of ​​the membrane probe card to come into contact with the device under test, but also the existence of a first contact stress between the test area and the device under test, A step of measuring a second stress between the support structure and the test area, The steps include adjusting the elastic force of at least one of the multiple elastic structures in the support structure in accordance with the second stress, The step of applying the first stress to the substrate allows not only the test area of ​​the membrane probe card to come into contact with the device under test, but also the existence of a second contact stress between the test area and the device under test. Includes, A test method in which the second contact stress and the first contact stress are not equal.

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