Magnetic adsorption electronic components and DIY circuit kits

Abstract

To provide a magnetic adsorption electronic component that has a simple structure, is easy to manufacture, and reduces manufacturing costs. [Solution] The magnetic adsorption electronic component of the present invention comprises a circuit board, a functional member, at least one magnet, and at least one conductive fixing member. The circuit board has a circuit pattern; the functional member is provided on the circuit board and electrically connected to the circuit pattern; the magnet is provided on one side of the circuit board; and the conductive fixing member is electrically connected to the circuit pattern of the circuit board and also fixes the magnet. The present invention also provides a DIY circuit kit that utilizes the above magnetic adsorption electronic component.

Description

Technical Field

[0001] The present invention relates to electronic components, and particularly to a magnetic adsorption electronic component and a do-it-yourself circuit kit applying the magnetic adsorption electronic component.

Background Art

[0002] Printed electronic products are a new technology and have potential application prospects in fields such as solar power generation, transistors, displays, batteries, antennas, and sensors. In recent years, electronic circuit products applied to paper substrates have emerged in the market, and this paper substrate has advantages such as low cost, curvature possibility, light weight, and disposable.

[0003] In accordance with this circuit product, U.S. Patent No. US9401239 discloses a magnetic adsorption electronic component 100 (see FIG. 1) that can be adsorbed on a paper substrate 114 and another base 116 (for example, an iron plate). Since the magnetic adsorption electronic component 100 can be quickly and easily adsorbed on the conductive wire 120 of the paper substrate 114 by the magnetic adsorption method, a simple or complex circuit can be constructed, which is suitable for various applications in engineering, education, etc. As shown in FIG. 1, the magnetic adsorption electronic component 100 includes a circuit board 102, two support columns 104, and a functional member 124. The functional member 124 is provided on the upper surface 102a of the circuit board 102, and the two support columns 104 are provided on the lower surface 102b of the circuit board 102. Each support column 104 includes a passage 106 extending from the top opening to the bottom opening. The magnet 108 is movably position-limited within the passage 106 and is electrically connected to the circuit board 102. The width of the bottom opening of the passage 106 is smaller than the maximum lateral dimension of the magnet 108. Further, by providing a conductive spring 112 in the passage 106, the magnet 108 is movably position-limited within the passage 106, and the magnet 108 can be electrically connected to the circuit board 102.

[0004] However, in order to fix the support column 104 to the circuit board 102, multiple through holes are first formed in the circuit board 102, and then multiple legs of the plastic support column 104 are passed through these through holes. After that, the parts of the legs that protrude after passing through these through holes are processed by a heat melting manufacturing step to form multiple welded parts 104a. Such conventional structural designs not only require multiple different parts but also require the combination of multiple manufacturing steps, making it a very complex and time-consuming process.

[0005] Therefore, providing magnetic adsorption electronic components that have a simple structure, are easy to manufacture, and reduce manufacturing costs is indeed one of the most important challenges for the industry. [Overview of the project] [Problems that the invention aims to solve]

[0006] The objective of the present invention is to provide a magnetic adsorption electronic component that has a simple structure, is easy to manufacture, and reduces manufacturing costs. [Means for solving the problem]

[0007] To achieve the above objective, the present invention provides a magnetic adsorption electronic component comprising a circuit board, a functional member, at least one magnet, and at least one conductive fixing member. The circuit board has a circuit pattern; the functional member is provided on the circuit board and electrically connected to the circuit pattern; the magnet is provided on one side of the circuit board; and the conductive fixing member is electrically connected to the circuit pattern of the circuit board and also fixes the magnet.

[0008] In one embodiment, the conductive fixing member includes a main body and at least two connecting legs, and a magnet is provided between the circuit board and the main body. These connecting legs are connected to the main body and the circuit board, respectively, and are also provided adjacent to the magnet. Thus, the magnet is confined to the area between the main body, these connecting legs, and the circuit board, and at least one of these connecting legs is electrically connected to the circuit pattern of the circuit board.

[0009] In one embodiment, the main body has a contact portion, and the magnet is fixed between the main body, the connecting legs, and the circuit board by the contact portion pressing against the magnet.

[0010] In one embodiment, the conductive fixing member further includes a position-limiting flange, one end of which is connected to the main body and the other end of which is a free end. By providing the position-limiting flange adjacent to the magnet, the magnet is restricted to the space between the main body, their connecting legs, the position-limiting flange, and the circuit board.

[0011] In one embodiment, at least one of these connecting legs is electrically connected to the circuit pattern by soldering.

[0012] In one embodiment, the circuit board is a printed circuit board, and the circuit pattern includes at least one trace formed on the printed circuit board.

[0013] In one embodiment, the circuit board is a circular, triangular, rectangular, or polygonal sheet-like structure.

[0014] In one embodiment, the functional member is electrically connected by a circuit pattern and a conductive fixing member.

[0015] In one embodiment, the functional member includes a passive component, an active component, a power supply component, a switch component, and / or a conductive component.

[0016] In one embodiment, the functional component includes a light-emitting diode, a buzzer, a speaker, a motor, a fan, a dimming film, a heating sheet, and / or an electromagnet.

[0017] In one embodiment, the magnetic adsorption electronic component includes two magnets and two conductive fixing members, the two conductive fixing members being electrically connected to the circuit patterns of the circuit board and fixing the two magnets respectively.

[0018] In one embodiment, the magnetic adsorption electronic component further includes a battery and a power supply fixing member. The circuit pattern electrically connected to the battery supplies power to the functional member, and the power supply fixing member electrically connects to the circuit pattern on the circuit board and also fixes the battery.

[0019] To achieve the above objective, the present invention provides a DIY circuit kit comprising a magnetic adsorption plate, a DIY circuit module, and at least one magnetically adsorbed electronic component. The DIY circuit module is mounted on the magnetic adsorption plate, and at least one DIY circuit pattern is formed on the DIY circuit module; the magnetically adsorbed electronic component is movably mounted on the DIY circuit module and is attracted to the magnetic adsorption plate, so that the DIY circuit module is positioned between the magnetically adsorbed electronic component and the magnetic adsorption plate. The magnetically adsorbed electronic component includes a circuit plate, a functional member, at least one magnet, and at least one conductive fixing member. The circuit plate has a circuit pattern; the functional member is mounted on the circuit plate and electrically connected to the circuit pattern; the magnet is mounted on one side of the circuit plate; the conductive fixing member is electrically connected to the circuit pattern of the circuit plate and also fixes the magnet. When the magnetically adsorbed electronic component is installed on the DIY circuit module, the magnet is attracted to the magnetic adsorption plate, and the conductive fixing member is in contact with the DIY circuit pattern.

[0020] In one embodiment, the conductive fixing member includes a main body and at least two connecting legs, a magnet is provided between the circuit board and the main body, and these connecting legs are connected to the main body and the circuit board respectively, and each is provided adjacent to the magnet, thereby restricting the magnet between the main body, these connecting legs and the circuit board, and at least one of these connecting legs is electrically connected to the circuit pattern of the circuit board.

[0021] In one embodiment, the main body has a contact portion, and the magnet is fixed between the main body, the connecting legs, and the circuit board by the contact portion pressing against the magnet.

[0022] In one embodiment, the conductive fixing member further includes a position-limiting flange, one end of the position-limiting flange is connected to the main body, and the other end of the position-limiting flange is a free end. By providing the position-limiting flange adjacent to the magnet, the magnet is restricted between the main body, these connecting legs, the position-limiting flange and the circuit board.

[0023] In one embodiment, at least some of these connecting legs are electrically connected to the circuit pattern by a soldering method.

[0024] In one embodiment, the functional member is electrically connected to the conductive fixing member via the circuit pattern.

[0025] In one embodiment, the handmade circuit module further includes a circuit substrate, and the handmade circuit pattern is provided on the circuit substrate.

[0026] In one embodiment, the handmade circuit pattern is composed of a conductive seal, conductive ink, conductive gel and / or conductive paper.

[0027] In one embodiment, the magnetically adsorbed electronic component further includes a battery and a power supply fixing member. The battery is electrically connected to the circuit pattern of the circuit board to supply power to the functional member. The power supply fixing member is electrically connected to the circuit pattern of the circuit board and fixes the battery. When the magnetically adsorbed electronic component is provided on the handmade circuit module, the power supply fixing member contacts the handmade circuit pattern.

[0028] To achieve the above object, the present invention further provides a manufacturing method of a magnetically adsorbed electronic component, including the following steps: providing a circuit board having a circuit pattern; providing a functional member on the circuit board so that the functional member is electrically connected to the circuit pattern; connecting at least one conductive fixing member to the circuit board so that the conductive fixing member is electrically connected to the circuit pattern of the circuit board; installing at least one magnet between the conductive fixing member and the circuit board; processing the conductive fixing member so that the magnet is fixed between the conductive fixing member and the circuit board.

[0029] In one embodiment, the conductive fixing member includes a main body and at least two connecting legs. These connecting legs are respectively connected to the main body. The step of electrically connecting the conductive fixing member to the circuit pattern of the circuit board is to respectively connect these connecting legs to the circuit board, and at least any one of these connecting legs is electrically connected to the circuit pattern of the circuit board.

[0030] In one embodiment, the step of processing the conductive fixing member to fix the magnet between the conductive fixing member and the circuit board is as follows: by pressing the main body, a contact portion is formed on the main body; by pressing the contact portion against the magnet, the magnet is fixed between the main body, these connecting legs and the circuit board.

[0031] In one embodiment, the conductive fixing member further includes a position-limiting flange, one end of the position-limiting flange is connected to the main body, and the other end of the position-limiting flange is a free end. The step of processing the conductive fixing member to fix the magnet between the conductive fixing member and the circuit board is to bend the position-limiting flange, so that the magnet is restricted between the main body, these connecting legs, the position-limiting flange and the circuit board.

[0032] In one embodiment, at least any one of these connecting legs is electrically connected to the circuit pattern by a soldering method.

[0033] In one embodiment, the manufacturing method of the magnetic adsorption electronic component further includes the following steps: by connecting the power supply fixing member to the circuit board, the power supply fixing member is electrically connected to the circuit pattern of the circuit board; installing the battery between the power supply fixing member and the circuit board, and supplying power to the functional member by the battery being electrically connected to the circuit pattern of the circuit board.

[0034] As described above, the magnetic adsorption electronic component of the present invention includes a circuit board, a functional member, at least one magnet, and at least one conductive fixing member. The functional member is provided on the circuit board and electrically connected to the circuit pattern of the circuit board; the conductive fixing member is electrically connected to the circuit pattern of the circuit board and also fixes the magnet to one side of the circuit board. Compared with the prior art, the magnetic adsorption electronic component and its manufacturing method of the present invention have a simple structure, making it easier to manufacture the magnetic adsorption electronic component and reducing manufacturing costs.

[0035] Furthermore, the DIY circuit kit of the present invention includes a magnetic adsorption plate, a DIY circuit module, and at least one of the aforementioned magnetic adsorption electronic components. The DIY circuit module is mounted on the magnetic adsorption plate, at least one DIY circuit pattern is formed on the DIY circuit module, and the magnetic adsorption electronic component is movably mounted on the DIY circuit module and adsorbed to the magnetic adsorption plate, thereby positioning the DIY circuit module between the magnetic adsorption electronic component and the magnetic adsorption plate. When the magnetic adsorption electronic component is mounted on the DIY circuit module, the magnet is attracted to the magnetic adsorption plate, and the conductive fixing member comes into contact with the DIY circuit pattern. Compared to the prior art, in the DIY circuit kit of the present invention, the conductive fixing member of the magnetic adsorption electronic component can provide a larger electrical contact area, making the magnetic adsorption electronic component advantageous for the assembly work of the DIY circuit kit. [Effects of the Invention]

[0036] The magnetic adsorption electronic component of the present invention has a simple structure, is easy to manufacture, and reduces manufacturing costs. [Brief explanation of the drawing]

[0037] [Figure 1] This is a diagram showing a conventional magnetic adsorption electronic component. [Figure 2] This figure shows a three-dimensional representation of a magnetic adsorption electronic component according to an embodiment of the present invention. [Figure 3] This figure shows another three-dimensional representation of the magnetic adsorption electronic component according to an embodiment of the present invention. [Figure 4] This figure shows an exploded view of a magnetic adsorption electronic component according to an embodiment of the present invention. [Figure 5] This figure shows a three-dimensional representation of a magnetic adsorption electronic component according to another embodiment of the present invention. [Figure 6] This figure shows a three-dimensional representation of a handmade circuit kit according to an embodiment of the present invention. [Figure 7] This figure shows a cross-section of a handmade circuit kit according to an embodiment of the present invention. [Figure 8] This figure shows another cross-section of a handmade circuit kit according to an embodiment of the present invention. [Figure 9] This figure shows a cross-section of a handmade circuit kit according to another embodiment of the present invention. [Figure 10] This figure shows a cross-section of a handmade circuit kit, which is another embodiment of the present invention. [Figure 11] This is a flowchart of the manufacturing method for a magnetic adsorption electronic component according to an embodiment of the present invention. [Figure 12] This is a flowchart of a method for manufacturing a magnetic adsorption electronic component according to another embodiment of the present invention. [Modes for carrying out the invention]

[0038] Using the drawings, better embodiments relating to the magnetic adsorption electronic component and the DIY circuit kit of the present invention will be described below. The same elements will be denoted by the same reference numerals.

[0039] Please refer to Figures 2 to 4. Figure 2 is a three-dimensional view (viewed from above at an angle) of the magnetic adsorption electronic component 20 according to an embodiment of the present invention. Figure 3 is a different three-dimensional view (viewed from below at an angle) of the magnetic adsorption electronic component 20 according to an embodiment of the present invention. Figure 4 is a diagram showing the magnetic adsorption electronic component 20 according to an embodiment of the present invention in an exploded view.

[0040] Please refer to Figures 2 to 4. The magnetic adsorption electronic component 20 of this embodiment includes a circuit board 22, a functional member 24, at least one magnet 26, and at least one conductive fixing member 28.

[0041] In this embodiment, the circuit board 22 has a circuit pattern. For example, the circuit board 22 is a printed circuit board (PCB), but is not limited thereto. The circuit board 22 has a multilayer structure, for example, one or more circuit layers, each circuit layer containing multiple traces, and the upper and lower surfaces of the circuit board 22 are provided with multiple connecting pads, and these traces and connecting pads can jointly define the circuit pattern of the circuit board 22. Furthermore, the circuit board 22 has any suitable sheet-like structure, such as a circular, triangular, rectangular, or polygonal sheet-like structure, but is not limited thereto. In this embodiment, the circuit board 22 is an example of a rectangular sheet-like structure. It should be noted that the above description is illustrative and the present invention is not limited thereto.

[0042] Furthermore, the functional member 24 is provided on the circuit board 22 and electrically connected to the circuit pattern of the circuit board 22. In this embodiment, the functional member 24 is provided on the upper surface of the circuit board 22 and may include, but is not limited to, passive components, active components, power supply components, switch components, and / or conductive components. Also, the functional member 24 may include, but is not limited to, light-emitting diodes, buzzers, speakers, motors, fans, dimming films, heating sheets, and / or electromagnets. In this embodiment, the functional member 24 is an example of a light-emitting diode. Furthermore, in this embodiment, the functional member 24 is electrically connected to the circuit pattern of the circuit board 22 by, for example, being electrically connected to a connecting pad on the upper surface of the circuit board 22. It should be noted that the above description is illustrative and the present invention is not limited thereto.

[0043] Furthermore, as shown in Figures 2 to 4, a magnet 26 is provided on one side of the circuit board 22, and a conductive fixing member 28 electrically connects to the circuit pattern of the circuit board 22 and also fixes the magnet 26. The conductive fixing member 28 includes a main body 28a and at least two connecting legs 28b, and in this embodiment, the conductive fixing member 28 includes three connecting legs 28b. As shown in the figures, the magnet 26 is provided between the circuit board 22 and the main body 28a, and these connecting legs 28b are connected to the main body 28a and the circuit board 22 respectively, and are also provided adjacent to the magnet 26, thereby restricting the magnet 26 between the main body 28a, these connecting legs 28b, and the circuit board 22. In addition, at least one of these connecting legs 28b is electrically connected to the circuit pattern of the circuit board 22, for example, one of the connecting legs 28b is electrically connected to a connecting pad provided on the lower surface of the circuit board 22 by soldering, and is electrically connected to the circuit pattern of the circuit board 22. Therefore, the functional member 24 is electrically connected to the conductive fixing member 28 via the circuit pattern of the circuit board 22. It should be noted that the above description is illustrative and the present invention is not limited thereto.

[0044] Furthermore, in this embodiment, the main body 28a has a contact portion R, and the contact portion R presses against the magnet 26, thereby fixing the magnet 26 between the main body 28a, their connecting legs 28b, and the circuit board 22.

[0045] As shown in Figures 2 to 4, in this embodiment, the magnetic adsorption electronic component 20 includes two magnets 26 and two conductive fixing members 28. The two conductive fixing members 28 are electrically connected to the circuit patterns of the circuit board 22 and each fixes the two magnets 26. It should be noted that the above description is illustrative and the present invention is not limited thereto. For example, in another embodiment, the magnetic adsorption electronic component 20 includes three magnets 26 and three conductive fixing members 28 (not shown in the figures), the three conductive fixing members 28 are electrically connected to the circuit patterns of the circuit board 22 and each fixes the three magnets 26. In this case, the circuit board 22 of the magnetic adsorption electronic component 20 may be, for example, a triangular sheet structure. It should be noted that if one of the magnets in this embodiment is replaced with a battery, the magnetic adsorption electronic component can be actively powered, and for example, by supplying power to a functional member, the functional member is driven, so such a type of magnetic adsorption electronic component can be made into an active magnetic adsorption electronic component. Conversely, the magnetic adsorption electronic component 20 described above can be a passive magnetic adsorption electronic component.

[0046] Furthermore, please refer to Figure 5. Figure 5 shows a three-dimensional representation of a magnetic adsorption electronic component 30 according to another embodiment of the present invention. In this embodiment, the arrangement of components and connection relationships of the magnetic adsorption electronic component 30 shown in Figure 5 are generally the same as those of the magnetic adsorption electronic component 20 shown in Figure 3. The difference is that the conductive fixing member 38 of the magnetic adsorption electronic component 30 in this embodiment further includes at least one position-limiting flange 38c, one end of which is connected to the main body 38a, and the other end of which is a free end. By providing the position-limiting flange 38c adjacent to the magnet 36, the magnet 36 is restricted between the main body 38a, their connecting legs 38b, the position-limiting flange 38c, and the circuit board 32. In this embodiment, the number of position-limiting flanges 38c is determined by actual needs, for example, as shown in Figure 5, the conductive fixing member 38 includes two position-limiting flanges 38c. It should be noted that the above description is illustrative and the present invention is not limited thereto. For example, in one embodiment, the conductive fixing member includes two connecting legs and two sets of position-limiting flanges. These connecting legs and position-limiting flanges are arranged intersectingly around the main body, and each set of position-limiting flanges includes one or two position-limiting flanges (not shown in the figure).

[0047] Please refer to Figures 6 to 8. Figure 6 is a three-dimensional representation of the handmade circuit kit 40 according to an embodiment of the present invention. Figure 7 is a cross-sectional representation of the handmade circuit kit 40 according to an embodiment of the present invention. Figure 8 is a different cross-sectional representation of the handmade circuit kit 40 according to an embodiment of the present invention.

[0048] As shown in Figures 6 to 8, the handmade circuit kit 40 of this embodiment comprises a magnetic adsorption plate 42, a handmade circuit module 44, and at least one magnetic adsorption electronic component 20. In this embodiment, the handmade circuit kit 40 includes, for example, multiple magnetic adsorption electronic components 20 from the above embodiment, and its structural design will not be described again as it can be seen from the description of the above embodiment. Of course, in other embodiments, the handmade circuit kit 40 includes multiple magnetic adsorption electronic components 30 from the above embodiment, or includes a combination of multiple magnetic adsorption electronic components 20 and multiple magnetic adsorption electronic components 30, and the present invention is not limited.

[0049] In this embodiment, a handmade circuit module 44 is provided on a magnetic adsorption plate 42, at least one handmade circuit pattern 44a is formed on the handmade circuit module 44, and a magnetic adsorption electronic component 20 is movably provided on the handmade circuit module 44 and is attracted to the magnetic adsorption plate 42, so that the handmade circuit module 44 is positioned between the magnetic adsorption electronic component 20 and the magnetic adsorption plate 42. Furthermore, when the magnetic adsorption electronic component 20 is provided on the handmade circuit module 44, the magnet 26 of the magnetic adsorption electronic component 20 is attracted to the magnetic adsorption plate 42, and the conductive fixing member 28 of the magnetic adsorption electronic component 20 comes into contact with the handmade circuit pattern 44a.

[0050] In this embodiment, the magnetic adsorption plate 42 is exemplified by an iron plate, but is not limited thereto. Therefore, the magnet 26 can be attracted to the magnetic adsorption plate 42 by magnetic force. In this embodiment, the handmade circuit module 44 further includes a circuit substrate 44b, and a handmade circuit pattern 44a is provided on the circuit substrate 44b. The handmade circuit pattern 44a is exemplified by being composed of a conductive seal, conductive ink, conductive gel, and / or conductive paper, but is not limited thereto. The circuit substrate 44b is exemplified by being composed of a rigid or flexible material substrate such as a paper card or plastic card, but is not limited thereto. As described above, in this embodiment, the handmade circuit pattern 44a is formed on the circuit substrate 44b by attaching a conductive seal to the circuit substrate 44b according to the design. In another embodiment, the handmade circuit pattern 44a can be defined on the circuit substrate 44b by drawing directly on the circuit substrate 44b with a conductive ink pen (conductive ink). It should be noted that the above description is illustrative, and the present invention is not limited thereto.

[0051] In other embodiments, the design may not require a circuit board 44b. For example, the design may involve directly attaching a conductive seal to the magnetic adsorption plate 42, thereby forming a handmade circuit pattern 44a on the magnetic adsorption plate 42. In another embodiment, a pattern can be drawn directly onto the magnetic adsorption plate 42 with a conductive ink pen, and the drawn pattern can define the handmade circuit pattern 44a. It should be noted that the above description is illustrative and the present invention is not limited thereto.

[0052] Please also refer to Figure 9. Figure 9 shows a cross-section of a handmade circuit kit according to another embodiment of the present invention.

[0053] As shown in Figure 9, the component arrangement and connection relationships of the handmade circuit kit 40' of this embodiment are generally the same as those of the handmade circuit kit 40 of the previous embodiment. The difference is that the magnetic adsorption electronic component 20' of the handmade circuit kit 40' of this embodiment comprises a set of magnets 26, a conductive fixing member 28, a set of batteries 52, and a power supply fixing member 54. In this embodiment, the batteries 52 are electrically connected to the circuit pattern of the circuit board 22 to supply power to the functional member 24, and the power supply fixing member 54 is electrically connected to the circuit pattern of the circuit board 22 and also fixes the batteries 52. The batteries 52 are exemplified by button batteries, but are not limited to these. When the power supply fixing member 54 is connected to the circuit board 22, the batteries 52 can be fixed between the power supply fixing member 54 and the circuit board 22. In particular, since the batteries 52 are installed removable between the power supply fixing member 54 and the circuit board 22, they can be replaced when the power of the batteries 52 runs out. Furthermore, when the magnetic adsorption electronic component 20' is installed on the handmade circuit module 44, the power supply fixing member 54 comes into contact with the handmade circuit pattern 44a, thereby enabling the handmade circuit pattern 44a and the circuit pattern on the circuit board 22 to be electrically connected via the power supply fixing member 54. It should be noted that the power supply fixing member 54 and the battery 52 can be designed to be electrically insulated, thus avoiding direct electrical connection between the battery 52 and the handmade circuit pattern 44a via the power supply fixing member 54. In one embodiment, the power supply fixing member 54 and the battery 52 are electrically insulated by forming an insulating layer inside the power supply fixing member 54. In this embodiment, the battery 52 is installed in the body of the magnetic adsorption electronic component 20' to supply power to the functional member 24, and the magnetic adsorption electronic component 20' becomes an active magnetic adsorption electronic component.

[0054] It should be noted that the arrangement and connection relationships of each component in this embodiment will not be explained again, as they can be seen in the previous embodiment. Furthermore, the above description is illustrative, and the present invention is not limited thereto.

[0055] Please also refer to Figure 10. Figure 10 shows a cross-section of a handmade circuit kit, which is another embodiment of the present invention.

[0056] As shown in Figure 10, the component arrangement and connection relationships of the handmade circuit kit 40'' of this embodiment are generally the same as those of the handmade circuit kit 40' of the previous embodiment. The difference is that the handmade circuit kit 40'' of this embodiment further includes a magnetic adsorption electronic component 20, which is directly mounted on top of the magnetic adsorption electronic component 20', and the magnetic adsorption electronic component 20' is directly mounted on the handmade circuit module 44. In this embodiment, the battery 52 of the magnetic adsorption electronic component 20' is used to simultaneously supply power to the functional member 24 of the magnetic adsorption electronic component 20' and the functional member 24 of the magnetic adsorption electronic component 20. In this embodiment, the magnetic adsorption electronic component 20' is an active magnetic adsorption electronic component, the magnetic adsorption electronic component 20 is a passive magnetic adsorption electronic component, and the handmade circuit kit 40'' of this embodiment is designed to combine an active and a passive magnetic adsorption electronic component.

[0057] It should be noted that the arrangement and connection relationships of each component in this embodiment will not be explained again, as they can be seen in the previous embodiment. Furthermore, the above description is illustrative, and the present invention is not limited thereto.

[0058] Please refer to Figure 11. Figure 11 is a flowchart of the manufacturing method for a magnetically adsorbed electronic component according to an embodiment of the present invention.

[0059] As shown in Figure 11, in this embodiment, the method for manufacturing a magnetically adsorbed electronic component includes the following steps: providing a circuit board having a circuit pattern (step S01); providing a functional member on the circuit board so that the functional member is electrically connected to the circuit pattern (step S02); connecting at least one conductive fixing member to the circuit board so that the conductive fixing member is electrically connected to the circuit pattern on the circuit board (step S03); installing at least one magnet between the conductive fixing member and the circuit board (step S04); and fixing the magnet between the conductive fixing member and the circuit board by processing the conductive fixing member (step S05).

[0060] In this embodiment, the step (step S03) in which the conductive fixing member is electrically connected to the circuit pattern of the circuit board is such that the connecting legs are each connected to the circuit board, and at least one of these connecting legs is electrically connected to the circuit pattern of the circuit board. In this embodiment, at least one of these connecting legs is electrically connected to the circuit pattern by soldering.

[0061] Furthermore, in this embodiment, the step (step S05) in which the magnet is fixed between the conductive fixing member and the circuit board by processing the conductive fixing member is performed by pressing the main body, which forms a contact portion on the main body, and the contact portion presses against the magnet, thereby fixing the magnet between the main body, their connecting legs and the circuit board.

[0062] Furthermore, in this embodiment, the step (step S05) in which the magnet is fixed between the conductive fixing member and the circuit board by processing the conductive fixing member is performed by bending the position limiting flange so that the magnet is restricted between the main body, their connecting legs, the position limiting flange and the circuit board.

[0063] It should be noted that the arrangement and connection relationships of each component in this embodiment will not be explained again, as they can be seen in the previous embodiment. Furthermore, the above description is illustrative, and the present invention is not limited thereto.

[0064] Please also refer to Figure 12. Figure 12 is a flowchart of a method for manufacturing a magnetically adsorbed electronic component according to another embodiment of the present invention.

[0065] As shown in Figure 12, the steps of the manufacturing method for magnetically adsorbed electronic components in this embodiment are generally the same as the steps of the manufacturing method for magnetically adsorbed electronic components shown in Figure 11. The difference is that the manufacturing method for magnetically adsorbed electronic components in this embodiment further includes steps S06 and S07. Step S06 involves connecting the power supply fixing member to the circuit board, thereby electrically connecting the power supply fixing member to the circuit pattern of the circuit board. Step S07 involves placing a battery between the power supply fixing member and the circuit board, thereby supplying power to the functional component by electrically connecting the battery to the circuit pattern of the circuit board.

[0066] It should be noted that the arrangement and connection relationships of each component in this embodiment will not be explained again, as they can be seen in the previous embodiment. Furthermore, the above description is illustrative, and the present invention is not limited thereto.

[0067] In summary, the magnetic adsorption electronic component of the present invention comprises a circuit board, a functional member, at least one magnet, and at least one conductive fixing member. The functional member is provided on the circuit board and electrically connected to the circuit pattern of the circuit board; the conductive fixing member is electrically connected to the circuit pattern of the circuit board and also fixes the magnet to one side of the circuit board. Compared to the prior art, the magnetic adsorption electronic component and its manufacturing method of the present invention have a simple structure, making it easier to manufacture the magnetic adsorption electronic component and reducing manufacturing costs.

[0068] Furthermore, the DIY circuit kit of the present invention comprises a magnetic adsorption plate, a DIY circuit module, and at least one of the magnetic adsorption electronic components. The DIY circuit module is placed on the magnetic adsorption plate, at least one DIY circuit pattern is formed on the DIY circuit module, and the magnetic adsorption electronic component is movably attached to the DIY circuit module and adsorbed to the magnetic adsorption plate, thereby positioning the DIY circuit module between the magnetic adsorption electronic component and the magnetic adsorption plate. When the magnetic adsorption electronic component is attached to the DIY circuit module, the magnet is attracted to the magnetic adsorption plate, and the conductive fixing member comes into contact with the DIY circuit pattern. Compared to the prior art, in the DIY circuit kit of the present invention, the conductive fixing member of the magnetic adsorption electronic component can provide a larger electrical contact area, making the magnetic adsorption electronic component advantageous for the assembly work of the DIY circuit kit.

[0069] The above are merely examples and not limiting. That is, any modifications or changes made thereto, as long as they do not deviate from the spirit and scope of the invention, should be included in the claims of the invention. [Industrial applicability]

[0070] The magnetic adsorption electronic component of the present invention has a simple structure, is easy to manufacture, and reduces manufacturing costs. Furthermore, in the DIY circuit kit of the present invention, the conductive fixing member of the magnetic adsorption electronic component can provide a larger electrical contact area, making the magnetic adsorption electronic component advantageous for the assembly work of the DIY circuit kit. [Explanation of symbols]

[0071] 100, 20, 20', 30 Magnetic adsorption components 102, 22, 32 circuit board 102a Top surface 102b Bottom surface 104 Support column 104a Weld 106 Passage 108, 26, 36 magnets 112 Conductive spring 114 Paper circuit board 116 Base 120 conductive wire 124, 24 Functional components 28, 38 Conductive fixing member 28a, 38a Main Unit 28b, 38b articulating leg 38c Position-limited flange 40, 40', 40'' DIY Circuit Kit 42 Magnetic adsorption plate 44 Handmade Circuit Modules 44a Handmade Circuit Pattern 44b Circuit board material 52 Batteries 54 Power supply fixing member R Contact part Steps S01-S07

Claims

1. A circuit board having a circuit pattern, A functional member provided on the circuit board and electrically connected to the circuit pattern, At least one magnet provided on one side of the circuit board, and A magnetic adsorption electronic component characterized by comprising at least one conductive fixing member that is electrically connected to the circuit pattern of the circuit board and fixes the magnet.

2. The conductive fixing member includes a main body and at least two connecting legs, the magnet is provided between the circuit board and the main body, and these connecting legs are connected to the main body and the circuit board respectively, and each is provided adjacent to the magnet, so that the magnet is confined between the main body, these connecting legs and the circuit board, and at least one of these connecting legs is electrically connected to the circuit pattern of the circuit board, as described in claim 1.

3. The conductive fixing member further includes a position-limiting flange, one end of the position-limiting flange is connected to the main body, the other end of the position-limiting flange is a free end, and the position-limiting flange is provided adjacent to the magnet, thereby restricting the magnet between the main body, the connecting legs, the position-limiting flange and the circuit board, as described in claim 2.

4. The magnetic adsorption electronic component according to claim 2, characterized in that at least one of these connecting legs is electrically connected to the circuit pattern by soldering.

5. The magnetic adsorption electronic component according to claim 1, wherein the circuit board is a printed circuit board, and the circuit pattern includes at least one trace formed on the printed circuit board.

6. The magnetic adsorption electronic component according to claim 1, characterized in that the functional member includes a passive component, an active component, a power supply component, a switch component, a conductive component, a light-emitting diode, a buzzer, a speaker, a motor, a fan, a dimming film, a heating sheet and / or an electromagnet.

7. The magnetic adsorption electronic component according to claim 1, comprising two magnets and two conductive fixing members, wherein the two conductive fixing members are electrically connected to the circuit pattern of the circuit board and each fixes the two magnets.

8. The magnetic adsorption electronic component according to claim 1, characterized in that it includes a battery that is electrically connected to the circuit pattern of the circuit board to supply power to the functional member, and a power supply fixing member that is electrically connected to the circuit pattern of the circuit board and also fixes the battery.

9. Magnetic adsorption plate and A handmade circuit module provided on the magnetic adsorption plate, on which at least one handmade circuit pattern is formed, The handmade circuit module is movably mounted on the handmade circuit module and, by being attracted to the magnetic adsorption plate, comprises at least one magnetic adsorption electronic component positioned between the magnetic adsorption electronic component and the magnetic adsorption plate, The aforementioned magnetic adsorption electronic component is A circuit board having a circuit pattern, A functional member provided on the circuit board and electrically connected to the circuit pattern, At least one magnet provided on one side of the circuit board, and The circuit board comprises at least one conductive fixing member that is electrically connected to the circuit pattern and fixes the magnet, A DIY circuit kit characterized in that, when the magnetically adsorbed electronic component is installed on the DIY circuit module, the magnet is attracted to the magnetic adsorption plate, and the conductive fixing member is in contact with the DIY circuit pattern.

10. The conductive fixing member includes a main body and at least two connecting legs, the magnet is provided between the circuit board and the main body, and these connecting legs are connected to the main body and the circuit board respectively, and each is provided adjacent to the magnet, so that the magnet is confined between the main body, these connecting legs and the circuit board, and at least one of these connecting legs is electrically connected to the circuit pattern of the circuit board, as described in claim 9.

11. The handmade circuit kit according to claim 10, wherein the conductive fixing member further includes a position-limiting flange, one end of the position-limiting flange is connected to the main body, the other end of the position-limiting flange is a free end, and the position-limiting flange is provided adjacent to the magnet, thereby restricting the magnet between the main body, the connecting legs, the position-limiting flange and the circuit board.

12. The DIY circuit kit according to claim 11, characterized in that at least one of these connecting legs is electrically connected to the circuit pattern by soldering.

13. The handmade circuit module further includes a circuit board, and the handmade circuit pattern is provided on the circuit board, as described in claim 9.

14. The handmade circuit kit according to claim 9, characterized in that the handmade circuit pattern is composed of conductive seals, conductive ink, conductive gel and / or conductive paper.

15. The magnetic adsorption electronic component comprises a battery that is electrically connected to the circuit pattern of the circuit board to supply power to the functional member, and a power supply fixing member that is electrically connected to the circuit pattern of the circuit board and also fixes the battery. The handmade circuit kit according to claim 9, characterized in that when the magnetically adsorbed electronic component is installed in the handmade circuit module, the power supply fixing member comes into contact with the handmade circuit pattern.

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