Manufacturing methods for electronic components

Abstract

This invention provides a method for manufacturing electronic components that ensures stable quality. [Solution] The method comprises the steps of: immersing the first electronic component and the second electronic component in a single conductive paste layer 51, which is a precursor of an external electrode, from the first end face 115 side of each; moving the immersed components relative to the conductive paste layer in the in-plane direction of the first end face; and pulling the components out of the conductive paste layer after they have been moved relative to the conductive paste layer in the in-plane direction of the first end face. In the step of immersing the components in the conductive paste layer from the first end face side, the base body of the first electronic component is immersed in a first region R1 of the conductive paste layer, and the base body of the second electronic component is immersed in a second region R2 of the conductive paste layer. In the step of moving the components relative to the conductive paste layer in the in-plane direction of the first end face, the base body of the first electronic component is moved relative to the conductive paste layer such that at least a portion of it reaches the second region R2.

Description

Technical Field

[0001] The present disclosure relates to a method for manufacturing electronic components.

Background Art

[0002] Conventionally, an electronic component including a substantially rectangular parallelepiped body portion in which a plurality of dielectric layers and internal electrode layers are alternately laminated, and external electrodes provided on a pair of end faces in the length direction of the body portion is known. Japanese Patent Application Laid-Open No. 2006-319272 (Patent Document 1) discloses a method for manufacturing a multilayer ceramic capacitor as an example of such an electronic component.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] From the viewpoint of stabilizing the quality of the manufactured electronic component, it is important to suppress the occurrence of so-called bubble entrainment in which bubbles are entrapped in the gap between the end face and the external electrode when the external electrode is formed on the end face of the body portion. This is because if bubble entrainment occurs, there is a risk that the manufactured electronic component will not have the desired performance.

[0005] Therefore, the present disclosure has been made to solve the above-described problems, and an object thereof is to provide a method for manufacturing an electronic component in which quality is stabilized.

Means for Solving the Problems

[0006] The present disclosure is a method for manufacturing electronic components that simultaneously manufactures a first electronic component and a second electronic component, each comprising a base body having a first end face and a second end face opposite to each other in the longitudinal direction, and external electrodes provided on each of the first end face and the second end face. The present disclosure is a method for manufacturing electronic components that comprises the steps of immersing each of the base body parts of the first electronic component and the second electronic component in a single conductive paste layer which is a precursor of the external electrodes, from the first end face side of each of the first electronic component and the second electronic component, and while the base body parts of the first electronic component and the second electronic component are immersed in the conductive paste layer from the first end face side of each of the first electronic component and the second electronic component, The process includes the steps of moving each of the above-mentioned base body parts relative to the conductive paste layer in the in-plane direction of the first end face of each of the first electronic component and the second electronic component, and after the above-mentioned base body parts of each of the first electronic component and the second electronic component have been moved relative to the conductive paste layer in the in-plane direction of the first end face of each of the first electronic component and the second electronic component, the above-mentioned base body parts of each of the first electronic component and the second electronic component are pulled up from the conductive paste layer.

[0007] In the method for manufacturing an electronic component according to the above disclosure, in the step of immersing the base body portion of each of the first electronic component and the second electronic component in the conductive paste layer from the first end face side of each of the first electronic component and the second electronic component, the base body portion of the first electronic component is immersed in a first region of the conductive paste layer, and the base body portion of the second electronic component is immersed in a second region of the conductive paste layer. Furthermore, in the method for manufacturing an electronic component according to the above disclosure, in the step of moving the base body portion of each of the first electronic component and the second electronic component relative to the conductive paste layer in the in-plane direction of the first end face of each of the first electronic component and the second electronic component, the base body portion of the first electronic component is moved relative to the conductive paste layer such that at least a part of the base body portion reaches the second region. [Effects of the Invention]

[0008] According to this disclosure, it is possible to provide a method for manufacturing electronic components with stabilized quality. [Brief explanation of the drawing]

[0009] [Figure 1] This is a schematic perspective view showing the appearance of a multilayer ceramic capacitor manufactured according to the manufacturing method for multilayer ceramic capacitors according to the embodiment. [Figure 2] Figure 1 is a schematic cross-sectional view of a multilayer ceramic capacitor. [Figure 3] Figure 1 is a schematic cross-sectional view of a multilayer ceramic capacitor. [Figure 4] This is a flowchart showing the manufacturing method of a multilayer ceramic capacitor according to an embodiment. [Figure 5] Figure 4 is a detailed flow chart of step S8 in the manufacturing flow shown. [Figure 6] Figure 5 is a schematic front view illustrating steps S811 and S812 of the manufacturing flow shown. [Figure 7] This is a schematic plan view illustrating the arrangement of the multiple structural components shown in Figure 6. [Figure 8] This is a schematic front view illustrating step S812 of the manufacturing flow shown in Figure 5. [Figure 9] This is a schematic front view illustrating step S813 of the manufacturing flow shown in Figure 5. [Figure 10] Figure 9 is a schematic plan view illustrating the movement of multiple structural components. [Figure 11] This is a schematic front view illustrating step S813 of the manufacturing flow shown in Figure 5. [Figure 12] This is a schematic plan view illustrating the movement of one of several base parts in step S813 of the manufacturing flow shown in Figure 5. [Figure 13] This is a schematic front view illustrating step S814 of the manufacturing flow shown in Figure 5. [Figure 14]A schematic plan view for explaining step S813 of the manufacturing flow shown in Fig. 5 in the method for manufacturing a multilayer ceramic capacitor according to the first modification example [Figure 15] A schematic front view for explaining step S814 of the manufacturing flow shown in Fig. 5 in the method for manufacturing a multilayer ceramic capacitor according to the second modification example

Embodiments for Carrying Out the Invention

[0010] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings. The embodiments shown below exemplify a method for manufacturing a multilayer ceramic capacitor as a method for manufacturing an electronic component. Note that the method for manufacturing an electronic component according to the present embodiment shown below is also applicable to a method for manufacturing a multilayer ceramic inductor or a multilayer ceramic thermistor.

[0011] In the embodiments shown below, the same or common parts are denoted by the same reference numerals in the drawings, and the description thereof will not be repeated. In the drawings, the length direction of the body part is denoted by L, the width direction of the body part is denoted by W, and the stacking direction of the body part is denoted by T. The body part will be described in detail later.

[0012] (Embodiment) <A. Configuration of Multilayer Ceramic Capacitor> Fig. 1 is a perspective view schematically showing the appearance of a multilayer ceramic capacitor manufactured according to the method for manufacturing a multilayer ceramic capacitor according to the embodiment. Fig. 2 is a schematic cross-sectional view taken along line II-II of the multilayer ceramic capacitor shown in Fig. 1. Fig. 3 is a schematic cross-sectional view taken along line III-III of the multilayer ceramic capacitor shown in Fig. 1. First, referring to Figs. 1 to 3, the configuration of a multilayer ceramic capacitor 100 manufactured according to the method for manufacturing a multilayer ceramic capacitor according to the present embodiment will be described.

[0013] As shown in Figs. 1 to 3, the multilayer ceramic capacitor 100 according to the present embodiment includes a body part 110 and external electrodes.

[0014] The base body 110 has a substantially rectangular parallelepiped shape. The base body 110 has a first side surface 111 and a second side surface 112 that face each other in the stacking direction T, a third side surface 113 and a fourth side surface 114 that face each other in the width direction W orthogonal to the stacking direction T, and a first end surface 115 and a second end surface 116 that face each other in the length direction L orthogonal to the stacking direction T and the width direction W.

[0015] The size of the base body 110 is, for example, the dimension in the length direction L is 0.1 mm or more and 3.2 mm or less, the dimension in the width direction W is 0.05 mm or more and 1.6 mm or less, and the dimension in the stacking direction T is 0.05 mm or more and 1.6 mm or less. Note that tolerances are taken into account for the above sizes.

[0016] The external electrodes are composed of a first external electrode 120 and a second external electrode 130. The first external electrode 120 is provided on the first end surface 115. The second external electrode 130 is provided on the second end surface 116.

[0017] The first external electrode 120 includes an end surface side first external electrode 121 and a side surface side first external electrode 122. The end surface side first external electrode 121 is a portion provided on the entire first end surface 115. The side surface side first external electrode 122 is a portion extending from the first end surface 115 to each of the first side surface 111, the second side surface 112, the third side surface 113, and the fourth side surface 114.

[0018] The second external electrode 130 includes an end surface side second external electrode 131 and a side surface side second external electrode 132. The end surface side second external electrode 131 is a portion provided on the entire second end surface 116. The side surface side second external electrode 132 is a portion extending from the second end surface 116 to each of the first side surface 111, the second side surface 112, the third side surface 113, and the fourth side surface 114.

[0019] The first external electrode 120 and the second external electrode 130 include a base electrode layer 160 and a plating layer 170. The plating layer 170 covers the base electrode layer 160.

[0020] The base electrode layer 160 includes at least one of a baked layer, a resin layer, and a thin film layer. In this embodiment, the base electrode layer 160 is composed of a baked layer.

[0021] The baked layer contains, for example, a metal component and a glass component. The metal component consists of one metal component selected from the group consisting of Ni, Cu, Ag, Pd, and Au, or an alloy containing this metal; for example, an alloy of Ag and Pd can be used. The glass component contains at least one of Si and Zn.

[0022] The baked layer may consist of a single layer or multiple stacked layers. The baked layer may be a layer baked after the conductive paste 53 is applied to the base part 110, or a layer fired simultaneously with the internal electrode layer 118. If the baked layer is a layer baked after the conductive paste 53 is applied to the base part 110, it is preferable that the baked layer contains a glass component. If the baked layer is a layer fired simultaneously with the internal electrode layer 118, it is preferable that the baked layer contains a dielectric. The conductive paste 53 and the internal electrode layer 118 will be described later.

[0023] The plating layer 170 is placed on the under electrode layer 160. The material constituting the plating layer 170 can be one metal selected from the group consisting of Ni, Cu, Ag, Pd, Au, and Sn, or an alloy containing this metal. As an example, the plating layer 170 can be made up of a layer of Ni and a layer of Sn laminated together.

[0024] Furthermore, a resin layer containing a metal filler may be provided between the base electrode layer 160, which is composed of a baked layer, and the plating layer 170. This resin layer can be formed by going through the same process as the process in which the base electrode layer 160 is formed in the manufacturing method of the multilayer ceramic capacitor according to this embodiment, which will be described in detail later (see steps S811 to S815 in Figure 5 later).

[0025] The base body 110 has a plurality of internal electrode layers 118 and a plurality of dielectric layers 119 that are alternately stacked along the stacking direction T.

[0026] The multiple internal electrode layers 118 include multiple first internal electrode layers 118a and multiple second internal electrode layers 118b. The multiple first internal electrode layers 118a and multiple second internal electrode layers 118b are stacked alternately in the stacking direction T.

[0027] The first internal electrode layer 118a is drawn out to the first end face 115. The first end face 115 is covered by the first external electrode 120. The first external electrode 120 is electrically connected to the first internal electrode layer 118a. The second internal electrode layer 118b is drawn out to the second end face 116. The second end face 116 is covered by the second external electrode 130. The second external electrode 130 is electrically connected to the second internal electrode layer 118b.

[0028] Although Figures 2 and 3 show examples in which seven first internal electrode layers 118a and seven second internal electrode layers 118b are provided, the number of each of the first internal electrode layers 118a and second internal electrode layers 118b is not particularly limited to seven.

[0029] The multiple dielectric layers 119 consist of an outer dielectric layer located between the first side surface 111 and the inner electrode layer 118 located on the first side surface 111 side in the stacking direction T, and between the second side surface 112 and the inner dielectric layer 118 located on the second side surface 112 side in the stacking direction T, and an inner dielectric layer located between adjacent inner electrode layers 118 in the stacking direction T.

[0030] Each of the first internal electrode layer 118a and the second internal electrode layer 118b contains Ni as its main component. Each of the first internal electrode layer 118a and the second internal electrode layer 118b may further contain a dielectric material of the same composition as the ceramic contained in the dielectric layer 119. Each of the first internal electrode layer 118a and the second internal electrode layer 118b may contain Sn at the interface with the dielectric layer 119.

[0031] Each of the plurality of dielectric layers 119 is made of a dielectric ceramic material mainly composed of a perovskite compound containing Ba and Ti, for example. The dielectric layer 119 may contain at least one selected from the group consisting of Si, Mg, Mn, V, Cr, and rare earths as an additive.

[0032] The body part 110 includes an inner layer part C. The inner layer part C has a capacitance by laminating the first internal electrode layer 118a in a portion facing the second internal electrode layer 118b adjacent in the stacking direction T and the second internal electrode layer 118b in a portion facing the first internal electrode layer 118a adjacent in the stacking direction T in the stacking direction T.

[0033] <B. Method for Manufacturing a Multilayer Ceramic Capacitor> FIG. 4 is a flowchart showing a method for manufacturing a multilayer ceramic capacitor according to an embodiment. FIG. 5 is a detailed flowchart of step S8 in the manufacturing flow shown in FIG. 4. FIGS. 6, 8, 9, 11, and 13 are schematic front views for explaining each step of the manufacturing flow shown in FIG. 5. FIG. 7 is a schematic plan view for explaining the arrangement of a plurality of body parts shown in FIG. 6. FIG. 10 is a schematic plan view for explaining the movement of a plurality of body parts shown in FIG. 9. FIG. 12 is a schematic plan view for explaining the movement of one of the plurality of body parts in step S813 of the manufacturing flow shown in FIG. 5. Hereinafter, a method for manufacturing the multilayer ceramic capacitor 100 according to the present embodiment will be described with reference to FIGS. 4 to 13. In FIGS. 7, 10, and 12, illustration of the holding part 20 is omitted (the same applies to FIG. 14 described later).

[0034] The method for manufacturing the multilayer ceramic capacitor 100 according to the present embodiment simultaneously manufactures a plurality of multilayer ceramic capacitors 100.

[0035] First, as shown in Figure 4, a ceramic dielectric slurry is prepared (step S1). Specifically, ceramic dielectric powder, additive powder, binder resin, and dissolving solution are dispersed and mixed. This prepares the ceramic dielectric slurry.

[0036] The ceramic dielectric powder is, for example, perovskite dielectric particles such as BaTiO3, CaTiO3, SrTiO3, CaZrO3, or CaHfO3. The additive powder consists of, for example, at least one of Si compounds, Mg compounds, Mn compounds, Fe compounds, Cr compounds, Ni compounds, and Co compounds. As the binder resin, polyurethane resin, urea resin, melamine resin, epoxy resin, vinyl acetate resin, acrylic resin, or aqueous polymers such as polyvinyl alcohol (PVA) or polyvinyl butyral (PVB) can be used. These may be used individually or in mixtures of two or more. The ceramic dielectric slurry may be solvent-based or water-based. When the ceramic dielectric slurry is a water-based paint, the ceramic dielectric slurry is prepared by mixing a water-soluble binder and dispersant with dielectric raw materials dissolved in water.

[0037] Next, a ceramic dielectric sheet is formed (step S2). Specifically, the ceramic dielectric slurry is formed into a sheet on a carrier film using a die coater, gravure coater, or microgravure coater and then dried. This forms a ceramic dielectric sheet. From the viewpoint of miniaturizing and increasing the capacitance of the multilayer ceramic capacitor, the thickness of the ceramic dielectric sheet is preferably 0.4 μm or more and 0.8 μm or less.

[0038] Next, a mother sheet is formed (step S3). Specifically, a conductive paste is applied to a ceramic dielectric sheet so as to have a predetermined pattern. This forms a mother sheet on which a predetermined internal electrode pattern is provided on the ceramic dielectric sheet. The conductive paste contains Ni powder, a solvent, a dispersant, and a binder, and is prepared to have a constant viscosity. PVA or PVB can be used as the binder. Screen printing, inkjet printing, or gravure printing can be used as methods for applying the conductive paste. From the viewpoint of miniaturizing and increasing the capacitance of the multilayer ceramic capacitor, the thickness of the internal electrode pattern is preferably 0.3 μm to 0.8 μm. In addition to the mother sheet with the internal electrode pattern, a ceramic dielectric sheet that has not undergone step S3 is also prepared.

[0039] Next, multiple mother sheets are stacked (step S4). Specifically, a predetermined number of mother sheets consisting only of ceramic dielectric sheets and without an internal electrode pattern are stacked so that the thickness is, for example, between 10 μm and 30 μm. On top of that, a predetermined number of mother sheets with an internal electrode pattern are stacked. The number of stacked mother sheets with an internal electrode pattern is, for example, between 1 and 1000. Furthermore, a predetermined number of mother sheets consisting only of ceramic dielectric sheets and without an internal electrode pattern are stacked on top of that so that the thickness is, for example, between 10 μm and 30 μm. This constitutes a group of mother sheets.

[0040] Next, the mother sheets are pressed together to form a dielectric block (step S5). Specifically, the mother sheets are pressed together in the stacking direction by hydrostatic pressing or rigid pressing. This forms a dielectric block. At this time, the ceramic dielectric sheets are pressed at a predetermined temperature, causing them to adhere closely to each other. In addition, a ceramic dielectric sheet of a certain thickness is placed and pressed as the outermost layer in the stacking direction. This protects the dielectric sheet on which the internal electrode pattern is formed.

[0041] Next, the dielectric block is divided to form chips (step S6). Specifically, the dielectric block is divided into multiple chips by cutting, dicing, or laser cutting to form a matrix. When dividing the dielectric block, it may be heated and softened before division.

[0042] Next, the chip is fired (step S7). Specifically, the heating of the chip causes the dielectric material and conductive material contained in the chip to be fired, forming the base body 110. The firing temperature is, for example, 900°C to 1300°C. The firing temperature is set appropriately in accordance with the dielectric material and conductive material.

[0043] Next, the external electrodes are formed (step S8). As shown in Figure 5, step S8 includes steps S81 to S83, which will be described below.

[0044] First, the first external electrode 120 is formed (step S81). Step S81 further includes steps S811 to S816, which will be described below.

[0045] First, as shown in Figures 5 and 6, a single conductive paste layer 51, which is a precursor to the external electrode, is formed on the main surface of the flat plate portion 60 (step S811).

[0046] The conductive paste layer 51 is formed by a conductive paste 53 in which conductive particles are mixed with a binder, solvent, and dispersant, etc., and arranged in layers. The flat plate portion 60 is made of, for example, a metal material. The surface of the main surface of the flat plate portion 60 extends in the horizontal direction.

[0047] Next, as shown in Figures 5 to 8, multiple base body parts 110 are immersed in the conductive paste layer 51 (step S812).

[0048] In detail, first, the multiple base body parts 110 are held by the holding part 20 such that each of the first end faces 115 of the base body parts 110 faces the conductive paste layer 51. The holding part 20 is for holding the base body parts 110 such that one of the pair of end faces of the base body part 110 faces downward in the vertical direction.

[0049] In this embodiment, as shown in Figure 7, nine base body parts 110 are arranged in a matrix consisting of a row direction parallel to a first direction X perpendicular to the length direction L, and a column direction parallel to a second direction Y perpendicular to both the length direction L and the first direction X. More specifically, the nine base body parts 110 are held by the holding part 20 so as to be spaced apart from each other in a 3x3 layout. The number and layout of the base body parts 110 are not limited to the number and layout described above and can be changed as appropriate. In this embodiment, the first direction X corresponds to the stacking direction T of the base body parts 110A, and the second direction Y corresponds to the width direction W of the base body parts 110A.

[0050] In the following explanation, for the sake of clarity, as shown in Figure 7, one of the two adjacent elemental parts 110 in the first direction X will also be referred to as elemental part 110A, and the other of the two elemental parts 110 will also be referred to as elemental part 110B. Furthermore, one of the two elemental parts 110 adjacent to elemental part 110B in the second direction Y will also be referred to as elemental part 110C. In addition, an elemental part 110 adjacent to elemental part 110A in the second direction Y and adjacent to elemental part 110C in the first direction X will also be referred to as elemental part 110D.

[0051] Furthermore, for the sake of clarity, in the following explanation, we may focus on the elemental part 110A among the multiple elemental parts 110 when describing each process. For example, in this embodiment, elemental part 110A corresponds to the elemental part of the first electronic component, and elemental part 110B corresponds to the elemental part of the second electronic component.

[0052] The holding portion 20 includes a base layer 21 and an adhesive layer 22 provided on the main surface of the base layer 21. The base layer 21 is made of, for example, a metal material. The adhesive layer 22 is made of, for example, silicone rubber. In this embodiment, the base portion 110 is held by the holding portion 20 such that the second end face 116 of the base portion 110 is attached to the adhesive layer 22, causing the first end face 115 to face downward in the vertical direction.

[0053] An actuator 23 is attached to the holding part 20. Based on a signal from the control unit 90, the actuator 23 can move the holding part 20 in any direction. Specifically, the actuator 23 is driven so that the holding part 20 can move in three orthogonal axes: the length direction L, the width direction W, and the stacking direction T. The actuator 23 is composed of, for example, a servo motor, a stepping motor, or a robot cylinder, but the type of actuator 23 is not particularly limited to these.

[0054] The control unit 90 controls the operation of the actuator 23. The control unit 90 mainly consists of a CPU (Central Processing Unit) 91, a memory 92, and input / output devices (not shown) for inputting and outputting various signals. Note that the actuator 23, control unit 90, CPU 91, and memory 92 are not shown in Figures 8, 9, 11, and 13, which will be described later.

[0055] The CPU 91 is responsible for executing programs. Memory 92 includes ROM (Read Only Memory) and RAM (Random Access Memory). ROM stores data non-volatilely. RAM stores data generated by the execution of programs by the CPU 91 volatilely.

[0056] Each component of the control unit 90 is connected to the others by a data bus. Processing in the CPU 91 is realized by each piece of hardware and software executed by the CPU 91. Such software is pre-stored in ROM / RAM. The control unit 90 is powered by an internal power supply (not shown) or an external power supply (not shown). For connection to the external power supply, for example, an AC adapter (not shown) is used.

[0057] As shown in Figures 6 and 8, the control unit 90 drives the actuator 23 to immerse the multiple base parts 110 in the conductive paste layer 51 from the first end face 115 side (see arrow AR1 in Figure 6). When the base part 110A, which does not have conductive paste 53 attached to the first end face 115, moves vertically and the entire surface of the first end face 115 of the base part 110A is immersed in the conductive paste layer 51, the area of ​​the conductive paste layer 51 that overlaps with the base part 110A when the main surface of the flat plate part 60 is viewed from above is defined as the first region R1. Thus, the base part 110A is immersed in the first region R1 of the conductive paste layer 51. The base part 110B is immersed in the second region R2 of the conductive paste layer 51. In this embodiment, the first direction X passes through the first region R1 and the second region R2.

[0058] Preferably, the first end face 115 of each of the multiple base body parts 110 immersed in the conductive paste layer 51 is positioned slightly apart from the bottom 52 of the conductive paste layer 51. In this embodiment, the multiple base body parts 110 are immersed in the conductive paste layer 51 such that the distance between the first end face 115 and the bottom 52 of the conductive paste layer 51 (see dimension d in Figure 8) is 50 μm or more and 300 μm or less.

[0059] Next, as shown in Figure 5 and Figures 9 to 12, the multiple base parts 110 are moved relative to the conductive paste layer 51 in the in-plane direction of the first end face 115 (step S813).

[0060] More specifically, as shown in Figures 9 and 10, with the multiple base parts 110 immersed in the conductive paste layer 51 from the first end face 115 side, the control unit 90 drives the actuator 23. As a result, the multiple base parts 110 are moved relative to the conductive paste layer 51 in the direction from the first side surface 111 to the second side surface 112 (in the direction of arrow AR2 in Figures 9 and 10).

[0061] By immersing the base body 110 in the conductive paste layer 51 and moving the base body 110 relative to the conductive paste layer 51 in the direction of arrow AR2, the conductive paste 53 is applied to a portion of the base body 110.

[0062] As described above, the first end face 115 is positioned slightly apart from the bottom 52 of the conductive paste layer 51. This prevents the amount of conductive paste 53 applied to the first end face 115 from being insufficient. This is because the conductive paste 53 applied to the first end face 115 is not peeled off by rubbing against the surface of the flat plate portion 60.

[0063] Here, as the base body 110 moves relative to the conductive paste layer 51, the base body 110 moves while pushing aside the portion of the conductive paste layer 51 located downstream of the base body 110 in the direction of movement. This promotes wetting of multiple sides of the base body 110 with the conductive paste 53. The amount of wetting of multiple sides with the conductive paste 53 can be adjusted, for example, by appropriately changing the distance between the first end face 115 of the base body 110 and the bottom 52 of the conductive paste layer 51.

[0064] As shown in Figures 11 and 12, the base body 110A is moved relative to the conductive paste layer 51 so that its entirety reaches the second region R2 (see arrow DR1 in Figure 12). This effectively suppresses the occurrence of so-called bubble trapping, where air bubbles are trapped in the gap between the first end face 115 and the conductive paste 53 in the portion that becomes the first external electrode 121 on the end face side, a point that will be described in detail later.

[0065] Once the base body 110A reaches the second region R2, it is further moved relative to the conductive paste layer 51. Specifically, as shown in Figure 12, the base body 110A moves in a circular motion in the XY plane, tracing a rectangular (square in this embodiment) trajectory by alternately moving in the second direction Y and the first direction X (see arrows DR2 to DR4 in Figure 12).

[0066] More specifically, the base body 110A that has reached the second region R2 is then moved relative to the conductive paste layer 51 so as to reach the region of the conductive paste layer 51 into which the base body 110C was immersed in step S812. The base body 110A that has reached that region is then moved relative to the conductive paste layer 51 so as to reach the region of the conductive paste layer 51 into which the base body 110D was immersed in step S812. The base body 110A that has reached that region is then moved relative to the conductive paste layer 51 so as to reach the first region R1 of the conductive paste layer 51 into which the base body 110A was immersed in step S812.

[0067] By moving in this manner, the base body 110A is returned to the first region R1 after being moved from the first region R1. Furthermore, by moving in this manner, it becomes possible to evenly wet the conductive paste 53 on all four sides of the base body 110A.

[0068] Next, as shown in Figures 5 and 13, multiple base body parts 110 are pulled up from the conductive paste layer 51 (step S814).

[0069] In detail, after the base body 110A is returned to the first region R1, the control unit 90 drives the actuator 23. This moves the multiple base body 110 so that multiple base body 110s are lifted out of the conductive paste layer 51 (see arrow AR3 in Figure 13).

[0070] In this way, conductive paste 53, which is a precursor to the base electrode layer 160 of the first external electrode 120, is applied to each of the four sides of the multiple base body parts 110 that have been lifted from the conductive paste layer 51.

[0071] Next, as shown in Figure 5, the conductive paste 53 is baked (step S815). Specifically, the conductive paste 53 applied to the first end face 115 and its surrounding area is heated, for example, in a drying oven, to form a baked layer that constitutes the base electrode layer 160. The baking temperature is, for example, 700°C to 900°C. Note that the baking temperature can be appropriately changed depending on the dielectric material and conductive material.

[0072] Next, as shown in Figure 5, a plating layer 170 (see Figure 2, etc.) is provided on the surface of the baked layer (step S816). This provides the first external electrode 120 on the first end face 115.

[0073] Next, as shown in Figure 5, the multiple base parts 110 are inverted (step S82). In detail, first, a holding part 20 is prepared that has a configuration that is generally the same as the holding part 20 that holds the multiple base parts 110, but is constructed separately from the holding part 20. For the sake of explanation, the holding part 20 that holds the multiple base parts 110 will also be referred to as the first holding part, and the holding part 20 constructed separately from the first holding part will also be referred to as the second holding part.

[0074] Next, the second retaining part is positioned relative to the first retaining part so that the adhesive layer 22 of the second retaining part faces the first external electrode 120. Then, the first retaining part is moved relative to the second retaining part so that the first retaining part and the second retaining part are closer to each other. As a result, the first external electrode 120 is pressed against the adhesive layer 22 of the second retaining part.

[0075] Next, the first holding part, the second holding part, and the base body part 110 are inverted together so that their top and bottom are reversed.

[0076] Next, the first retaining part is moved relative to the second retaining part so that the first retaining part and the second retaining part are separated from each other. Here, the adhesive force of the adhesive layer 22 of the second retaining part is set to be stronger than the adhesive force of the adhesive layer 22 of the first retaining part. As a result, the base part 110 to which the first external electrode 120 is attached to the adhesive layer 22 of the second retaining part is peeled off from the adhesive layer 22 of the first retaining part.

[0077] As a result, multiple base parts 110 are held by the second holding part such that the second end face 116 faces downward in the vertical direction.

[0078] Next, as shown in Figure 5, a second external electrode 130 is formed on the second end face 116 (step S83). Step S83 further includes steps corresponding to steps S811 to S816 described above. Since the contents of these steps are basically the same as those of steps S811 to S816, their explanation will be omitted.

[0079] Next, as shown in Figure 4, the multilayer ceramic capacitor 100 is recovered (step S9). Recovery of the multilayer ceramic capacitor 100 is achieved, for example, by inserting the tip of a recovery blade into the gap between the adhesive layer 22 of the second holding part and the first external electrode 120, thereby removing the multilayer ceramic capacitor 100 from the second holding part.

[0080] By following the steps described above, multiple multilayer ceramic capacitors 100 can be manufactured simultaneously according to the manufacturing method of multilayer ceramic capacitors according to this embodiment.

[0081] <C. Parentheses> In the method for manufacturing a multilayer ceramic capacitor according to the present embodiment, as described above, when the first external electrode 120 is provided on the element body 110, the element body 110 is immersed in the conductive paste layer 51 from the first end face 115 side, and the element body 110 is relatively moved in the in-plane direction of the first end face 115 with respect to the conductive paste layer 51.

[0082] Thereby, it is possible to effectively suppress the occurrence of air bubble entrainment, which causes air bubbles to be entrapped in the gap between the first end face 115 and the conductive paste 53 of the portion that becomes the first external electrode 121 on the end face side. This is because the unintentionally entrapped air bubbles in the above gap are pushed out of the gap toward the outside by the relative movement of the element body 110 with respect to the conductive paste layer 51 of the element body 110.

[0083] Here, when the element body 110 is relatively moved with respect to the conductive paste layer 51 as described above, as shown in FIG. 9, the conductive paste layer 51 of the portion located downstream of the element body 110 in the moving direction of the element body 110 is pushed out toward the downstream side in the moving direction by the element body 110.

[0084] As a result, the thickness of the conductive paste layer 51 of the portion through which the element body 110 has passed (see dimension t1 in FIG. 9) becomes smaller than the thickness of the conductive paste layer 51 of the portion through which the element body 110 has not passed (see dimension t2 in FIG. 9).

[0085] In other words, the thicknesses of the first region R1 and the second region R2 of the conductive paste layer 51 are both smaller than the thickness of the conductive paste layer 51 of the portion through which the element body 110 has not passed. This is because the first region R1 and the second region R2 are the portions through which the element bodies 110A and 110B have passed, respectively.

[0086] In the manufacturing method of the multilayer ceramic capacitor according to this embodiment, as described above, the base body portion 110A is moved relative to the conductive paste layer 51 so as to reach the second region R2. This makes it possible to more effectively suppress the occurrence of air bubbles compared to the case where the base body portion 110A is moved relative to the conductive paste layer 51 so as to pass only through the portion of the conductive paste layer 51 that is thicker than the second region R2.

[0087] In other words, the immersion depth of the base body 110A along the longitudinal direction L into the conductive paste layer 51 in the second region R2 (see dimension D1 in Figure 11) is smaller than the immersion depth of the base body 110A along the longitudinal direction L into the conductive paste layer 51 in the portion of the conductive paste layer 51 that is thicker than the second region R2 (see dimension D2 in Figure 9).

[0088] As the immersion depth of the base body 110A becomes relatively smaller in the second region R2, the path that air bubbles trapped in the gap between the first end face 115 and the conductive paste 53 applied thereto take to be discharged from the gap to the outside can be relatively shortened. As a result, the air bubbles become easier to discharge from the gap, and the occurrence of trapped air bubbles is dramatically suppressed. This effect of suppressing the occurrence of trapped air bubbles has been confirmed by verification tests described later.

[0089] Thus, by using the manufacturing method for multilayer ceramic capacitors according to this embodiment, the occurrence of air bubbles is dramatically suppressed, thereby enabling the production of multilayer ceramic capacitors 100 with improved quality stability.

[0090] Therefore, by configuring it as described above, a method for manufacturing electronic components with stable quality can be achieved.

[0091] One possible method to suppress the occurrence of air bubbles is to significantly reduce the relative movement speed of the base part 110 with respect to the conductive paste layer 51 when immersing and withdrawing the base part 110 from the conductive paste layer 51. However, if the movement speed of the base part 110 is reduced in this way, the manufacturing efficiency of the multilayer ceramic capacitor 100 will decrease significantly.

[0092] In this respect, in the manufacturing method of the multilayer ceramic capacitor according to the embodiment described above, there is no need to suppress the movement speed of the base body 110 in this way. Therefore, by using the manufacturing method of the multilayer ceramic capacitor according to this embodiment, it is possible to improve the manufacturing efficiency of the multilayer ceramic capacitor 100.

[0093] Furthermore, as in the manufacturing method of the multilayer ceramic capacitor according to this embodiment, the base body 110 is moved relative to the conductive paste layer 51 in the XY plane, which promotes the wetting of the conductive paste 53 onto the side surface of the base body 110, as described above. Therefore, in this respect as well, it is possible to improve the manufacturing efficiency of the multilayer ceramic capacitor 100.

[0094] In the manufacturing method of the multilayer ceramic capacitor according to this embodiment, the example given is that the base body 110A is moved from the first region R1 to the second region R2 and then returned to the first region R1. However, the base body 110A only needs to be moved relative to the conductive paste layer 51 so that it reaches at least the second region R2.

[0095] Furthermore, in the manufacturing method of the multilayer ceramic capacitor according to this embodiment, in step S813 described above, the example given is that the base body 110A moves from the first region R1 to the second region R2 in a first direction X that is perpendicular to the length direction L and passes through the first region R1 and the second region R2. However, the base body 110A may move from the first region R1 to the second region R2 in the first direction X, and further move to a region located further away from the first region R1 than the second region R2 in the first direction X.

[0096] Furthermore, in the manufacturing method of the multilayer ceramic capacitor according to this embodiment, the example given is that the entire base portion 110A is moved to reach the second region R2, but it is sufficient if at least a part of the base portion 110A is moved to reach the second region R2.

[0097] Furthermore, in the method for manufacturing a multilayer ceramic capacitor according to this embodiment, the example given is that the first end face 115 of the base body 110 immersed in the conductive paste layer 51 is located slightly away from the bottom 52 of the conductive paste layer 51. However, the base body 110 may be immersed in the conductive paste layer 51 such that the first end face 115 substantially reaches the bottom 52.

[0098] This makes it possible to reduce the thickness of the end-face side first external electrode 121 that covers the first end face 115 of the base body 110. This is because even if the conductive paste 53 is applied in excess to the first end face 115 within the conductive paste layer 51, the base body 110 moves relative to the conductive paste layer 51 in the XY plane, causing the excess conductive paste 53 to rub against the flat plate portion 60, thereby peeling off the excess conductive paste 53 from the first end face 115.

[0099] Note that the phrase "the first end face 115 substantially reaches the bottom 52" means not only that the first end face 115 abuts against the surface of the flat plate portion 60, but also that the first end face 115 is disposed at a position slightly separated from the surface of the flat plate portion 60. This is because, due to dimensional tolerances in the length direction L of the base body portion 110 and the like, it is conceivable that the first end face 115 of some of the plurality of base body portions 110 abuts against the surface of the flat plate portion 60 while the first end face 115 of the remaining base body portions 110 among the plurality of base body portions 110 does not abut against the surface of the flat plate portion 60.

[0100] Furthermore, in the method for manufacturing a multilayer ceramic capacitor according to the present embodiment, although the case where the holding portion 20 including the base layer 21 and the adhesive layer 22 is used has been exemplified, instead of the holding portion 20 having such a configuration, a holding portion including a base layer in which a plurality of through holes are arranged in a lattice pattern and a substantially cylindrical adhesive portion inserted into each of the plurality of through holes may be used.

[0101] In this case, the plurality of base body portions 110 are held by the holding portion by being inserted into each of the plurality of adhesive portions. Also, in this case, by pushing out the plurality of multilayer ceramic capacitors 100 from the through holes with pins or the like, the plurality of multilayer ceramic capacitors 100 can be transferred to a holding portion configured separately from the holding portion, or the plurality of multilayer ceramic capacitors 100 can be recovered.

[0102] <D. Verification Test> In this verification test, in order to clarify the effects achieved by the method for manufacturing a multilayer ceramic capacitor according to the present embodiment, a verification was performed by comparing the occurrence rate of air bubble bites in a multilayer ceramic capacitor manufactured based on the method for manufacturing a multilayer ceramic capacitor according to the present embodiment (hereinafter also referred to as the multilayer ceramic capacitor according to the example) with the occurrence rate of air bubble bites in a multilayer ceramic capacitor manufactured based on the method for manufacturing a multilayer ceramic capacitor according to the comparative example (hereinafter also referred to as the multilayer ceramic capacitor according to the comparative example).

[0103] The manufacturing method of the multilayer ceramic capacitor according to the comparative example differs from the manufacturing method of the multilayer ceramic capacitor according to this embodiment only in that it does not include the above-described step S813 (see Figure 5), and is otherwise identical. That is, in the manufacturing method of the multilayer ceramic capacitor according to the comparative example, the plurality of elemental parts 110 are pulled out of the conductive paste layer 51 without being moved relative to the conductive paste layer 51 in the in-plane direction of the first end face 115 with respect to the conductive paste layer 51 while immersed in the conductive paste layer 51.

[0104] The base body of the multilayer ceramic capacitors in the examples and comparative examples has dimensions of 1.0 mm in length, 0.5 mm in width, and 0.5 mm in thickness, excluding tolerances.

[0105] To check for the presence or absence of air bubbles, the multilayer ceramic capacitor was first polished so that the LT cross-section of the capacitor located in the center of the width direction W was exposed. Next, the cross-section was observed using an electron microscope or the like to check for the presence or absence of air bubbles. If air bubbles were present, a gap was created between the exposed part of the capacitor and the external electrode.

[0106] The sample size for both the multilayer ceramic capacitors in the example and the comparative example is 100 units. The occurrence rate of bubble lock in the multilayer ceramic capacitors in the example is calculated by dividing the total number of samples in which bubble lock occurred by 100. The same applies to the occurrence rate of bubble lock in the multilayer ceramic capacitors in the comparative example.

[0107] The results of this verification test showed that the occurrence rate of bubbles in the multilayer ceramic capacitor according to the comparative example was 3%. On the other hand, the occurrence rate of bubbles in the multilayer ceramic capacitor according to the embodiment was 0%. From these results, it was confirmed that the occurrence of bubbles can be suppressed by manufacturing a multilayer ceramic capacitor based on the manufacturing method of the multilayer ceramic capacitor according to this embodiment.

[0108] (First variation) Figure 14 is a schematic plan view illustrating step S813 of the manufacturing flow shown in Figure 5 in the manufacturing method of a multilayer ceramic capacitor according to the first modified example. The manufacturing method of a multilayer ceramic capacitor according to the first modified example based on the above-described embodiment will now be explained with reference to Figure 14.

[0109] The manufacturing method for a multilayer ceramic capacitor according to this modified example differs from the manufacturing method for a multilayer ceramic capacitor according to the embodiment described above in the arrangement of the multiple base parts 110 held by the holding part 20 and the direction of movement of the base parts 110 in step S813.

[0110] More specifically, in this modified example, as shown in Figure 14, the multiple base parts 110 are arranged in a staggered layout, spaced apart from one another. When the multiple base parts 110 are viewed from above, the corners of two base parts 110 that are closest to each other face each other. Here, the corners of the base part 110 are the parts where the three faces of the base part 110 intersect.

[0111] In this modified example, in step S813 described above, the multiple base body parts 110 are moved relative to the conductive paste layer 51 in a direction that is inclined with respect to both the width direction W and the stacking direction T of the base body parts 110A in the WT plane (hereinafter also referred to as the first inclination direction) (see arrow DR11 in Figure 14). The first inclination direction is a direction that is perpendicular to the length direction L and passes through the first region R1 and the second region R2.

[0112] As a result, the base body 110A is moved relative to the conductive paste layer 51 so as to reach the second region R2. In this modified example, one of the two base body parts 110 that are closest to the base body part 110A in the first inclination direction corresponds to base body part 110B. Also, in this modified example, the first inclination direction corresponds to the first direction.

[0113] The base body 110A, having reached the second region R2, is then moved relative to the conductive paste layer 51 so as to return to the first region R1 (see arrow DR12 in Figure 14). In this way, the base body 110A is moved back and forth relative to the conductive paste layer 51 along the first inclination direction.

[0114] The base body 110A, which has been returned to the first region R1 in this manner, is then similarly moved back and forth toward the region where the remaining three base body 110s, which are located closest to the base body 110A, are situated.

[0115] By moving the base body 110 in this way, it becomes possible to adequately apply the conductive paste 53 to the corners, where it is generally difficult to form external electrodes of sufficient thickness.

[0116] In the manufacturing method of the multilayer ceramic capacitor according to this modified example, effects similar to those described in the above-described embodiment can be obtained, and a method for manufacturing electronic components with stabilized quality can be achieved.

[0117] (Second variation) Figure 15 is a schematic front view illustrating step S814 of the manufacturing flow shown in Figure 5 in the manufacturing method of a multilayer ceramic capacitor according to the second modified example. The manufacturing method of a multilayer ceramic capacitor according to the second modified example based on the above-described embodiment will now be explained with reference to Figure 15.

[0118] The manufacturing method for a multilayer ceramic capacitor according to this modified example differs from the manufacturing method for a multilayer ceramic capacitor according to the embodiment described above in that the direction of movement of the base body 110 in step S814 is different.

[0119] In detail, in this modified example, as shown in Figure 15, the base body 110 is moved relative to the conductive paste layer 51 in the XY plane, and then the base body 110 is pulled up vertically upward from the conductive paste layer 51 (see arrow AR4 in the figure).

[0120] After the base body 110 is lifted from the conductive paste layer 51 in this manner, the base body 110 is moved relative to the conductive paste layer 51 in the XY plane, with the conductive paste layer 51 and the base body 110 connected to each other by the conductive paste 53 stretched from the conductive paste layer 51 (see arrow AR5 in the figure).

[0121] By moving the base body 110 in this way, it becomes possible to easily cut the conductive paste 53 in the portion connecting the base body 110 and the conductive paste layer 51.

[0122] In the manufacturing method of the multilayer ceramic capacitor according to this modified example, effects similar to those described in the above-described embodiment can be obtained, and a method for manufacturing electronic components with stabilized quality can be achieved.

[0123] (Note) The characteristic configuration of the method for manufacturing electronic components disclosed in the above-described embodiments and their modified examples can be summarized as follows:

[0124] [Note 1] A method for manufacturing electronic components, comprising simultaneously producing a first electronic component and a second electronic component, each having a base body portion having a first end face and a second end face opposite to each other in the longitudinal direction, and external electrodes provided on each of the first and second end faces, The process involves immersing the base body portion of each of the first and second electronic components in a single conductive paste layer which is a precursor of the external electrode, from the first end face side of each of the first and second electronic components, With the base body portion of each of the first electronic component and the second electronic component immersed in the conductive paste layer from the first end face side of each of the first electronic component and the second electronic component, the base body portion of each of the first electronic component and the second electronic component is moved relative to the conductive paste layer in the in-plane direction of the first end face of each of the first electronic component and the second electronic component, The process includes the step of lifting the base body of each of the first and second electronic components from the conductive paste layer after the base body of each of the first end faces of the first and second electronic components has been moved relative to the conductive paste layer in the in-plane direction, In the process of immersing the base body portion of each of the first and second electronic components into the conductive paste layer from the first end face side of each of the first and second electronic components, the base body portion of the first electronic component is immersed in the first region of the conductive paste layer, and the base body portion of the second electronic component is immersed in the second region of the conductive paste layer. A method for manufacturing electronic components, comprising the step of moving the base body portion of each of the first and second electronic components relative to the conductive paste layer in the in-plane direction of the first end face of each of the first and second electronic components, wherein the base body portion of the first electronic component is moved relative to the conductive paste layer such that at least a part of the base body portion reaches the second region.

[0125] [Note 2] A method for manufacturing an electronic component according to Appendix 1, wherein, in the step of moving the base body portion of each of the first and second electronic components relative to the conductive paste layer in the in-plane direction of the first end face of each of the first and second electronic components, the base body portion of each of the first and second electronic components is moved reciprocally relative to the conductive paste layer along a first direction that is perpendicular to the length direction and passes through the first and second regions.

[0126] [Note 3] A method for manufacturing an electronic component according to Appendix 1 or 2, wherein, in the step of moving the base body portion of each of the first electronic component and the second electronic component relative to the conductive paste layer in the in-plane direction of the first end face of each of the first electronic component and the second electronic component, the base body portion of the first electronic component is returned to the first region after moving from the first region, and the base body portion of the second electronic component is returned to the second region after moving from the second region.

[0127] [Note 4] A method for manufacturing an electronic component according to any one of appendices 1 to 3, wherein, after the base body portion of each of the first electronic component and the second electronic component is pulled up from the conductive paste layer, the base body portion of each of the first electronic component and the first electronic component are connected to each other by the conductive paste stretched from the conductive paste layer, and the base body portion of each of the first electronic component and the second electronic component is moved relative to the conductive paste layer in the in-plane direction of the first end face of each of the first electronic component and the second electronic component.

[0128] (Other forms, etc.) In the embodiments and modifications of the present disclosure described above, a multilayer ceramic capacitor was used as an example of an electronic component, and its manufacturing method was explained. However, the manufacturing method of the electronic component shown in these embodiments and modifications may also be applied to the manufacturing of other electronic components, such as a multilayer ceramic inductor or a multilayer ceramic thermistor. When the electronic component is a multilayer ceramic inductor, for example, the dielectric is made of magnetic ceramic and the internal electrodes are made of coil-shaped conductors. When the electronic component is a multilayer ceramic thermistor, for example, the dielectric layer is made of semiconductor ceramic.

[0129] Furthermore, the shape, configuration, size, number, material, etc., of each part shown in the embodiments and modified examples of the present disclosure described above can be modified in various ways, as long as they do not deviate from the spirit of the present disclosure.

[0130] Furthermore, the characteristic configurations shown in the embodiments and modifications of the present disclosure described above can naturally be combined with each other without departing from the spirit of the present disclosure.

[0131] Thus, the embodiments and their variations disclosed herein are illustrative in all respects and not restrictive. The technical scope of the present invention is defined by the claims and includes all modifications within the meaning and scope equivalent to the claims. [Explanation of symbols]

[0132] 20 Holding part, 21 Base layer, 22 Adhesive layer, 23 Actuator, 51 Conductive paste layer, 52 Bottom, 53 Conductive paste, 60 Flat plate part, 90 Control unit, 91 CPU, 92 Memory, 100 Multilayer ceramic capacitor, 110, 110A~110D Base body part, 111 First side, 112 Second side, 113 Third side, 114 Fourth side, 115 First end face, 116 Second end face, 118 Internal electrode layer, 118a First internal electrode layer, 118b Second internal electrode layer, 119 Dielectric layer, 120 First external electrode, 121 First external electrode on end face side, 122 First external electrode on side side, 130 Second external electrode, 131 Second external electrode on end face side, 132 Second external electrode on side side, 160 Underlay electrode layer, 170 Plating layer, C inner layer, R1 first region, R2 second region.

Claims

1. A method for manufacturing electronic components, comprising simultaneously manufacturing a first electronic component and a second electronic component, each comprising a base body having a first end face and a second end face opposite to each other in the longitudinal direction, and external electrodes provided on each of the first and second end faces, The process involves immersing each of the first and second electronic components in a single conductive paste layer which is a precursor of the external electrode, from the first end face side of each of the first and second electronic components, With the base body portion of each of the first electronic component and the second electronic component immersed in the conductive paste layer from the first end face side of each of the first electronic component and the second electronic component, the base body portion of each of the first electronic component and the second electronic component is moved relative to the conductive paste layer in the in-plane direction of the first end face of each of the first electronic component and the second electronic component, The process includes the step of moving the base body portion of each of the first and second electronic components relative to the conductive paste layer in the in-plane direction of the first end face of each of the first and second electronic components, and then pulling the base body portion of each of the first and second electronic components out of the conductive paste layer, In the process of immersing the base body portion of each of the first and second electronic components into the conductive paste layer from the first end face side of each of the first and second electronic components, the base body portion of the first electronic component is immersed in a first region of the conductive paste layer, and the base body portion of the second electronic component is immersed in a second region of the conductive paste layer. A method for manufacturing electronic components, comprising the step of moving the base portion of each of the first and second electronic components relative to the conductive paste layer in the in-plane direction of the first end face of each of the first and second electronic components, wherein the base portion of the first electronic component is moved relative to the conductive paste layer such that at least a part of the base portion reaches the second region.

2. A method for manufacturing an electronic component according to claim 1, wherein in the step of moving the base body portion of each of the first electronic component and the second electronic component relative to the conductive paste layer in the in-plane direction of the first end face of each of the first electronic component and the second electronic component, the base body portion of each of the first electronic component and the second electronic component is moved reciprocally relative to the conductive paste layer along a first direction that is perpendicular to the length direction and passes through the first region and the second region.

3. A method for manufacturing an electronic component according to claim 1, wherein in the step of moving the base portion of each of the first electronic component and the second electronic component relative to the conductive paste layer in the in-plane direction of the first end face of each of the first electronic component and the second electronic component, the base portion of the first electronic component is returned to the first region after being moved from the first region, and the base portion of the second electronic component is returned to the second region after being moved from the second region.

4. A method for manufacturing an electronic component according to any one of claims 1 to 3, wherein, after the base body portion of each of the first electronic component and the second electronic component has been pulled up from the conductive paste layer, the base body portion of each of the first electronic component and the first electronic component are connected to each other by conductive paste stretched from the conductive paste layer, and then the base body portion of each of the first electronic component and the second electronic component is moved relative to the conductive paste layer in the in-plane direction of the first end face of each of the first electronic component and the second electronic component.

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