Circuit board splitting jig

Abstract

To provide a small circuit board splitting jig that suppresses the impact on the edges of the circuit board when splitting the board. [Solution] The substrate splitting jig comprises: a gripping portion for gripping the substrate splitting jig; a first clamping portion having one of a pair of clamping surfaces for clamping the edge of a substrate and extending toward the tip from the gripping portion; a second clamping portion having the other clamping surface and extending toward the tip and connected to the first clamping portion; a first shock absorbing portion extending toward the tip from the end of the first clamping portion opposite to the gripping portion and having a first member holding surface of a pair of member holding surfaces that face each other and are further apart than the clamping surfaces; a second shock absorbing portion extending toward the tip from the end of the second clamping portion opposite to the gripping portion, being shorter than the first shock absorbing portion in the tip direction and having a second member holding surface of a pair of member holding surfaces; a first shock absorbing material fixed to the first member holding surface; and a second shock absorbing material fixed to the second member holding surface.

Description

Technical Field

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[0001] The present invention relates to a substrate dividing jig for dividing a multi-sided substrate (hereinafter referred to as a composite substrate).

Background Art

[0002] Generally, a printed substrate (hereinafter referred to as a substrate) includes a printed wiring board (PWB) in a state where electronic components are not mounted and a printed circuit board (PCB) in a state where electronic components are mounted and operate as an electronic circuit. A composite substrate is formed by connecting a plurality of product substrates (hereinafter referred to as substrate bodies) or a dummy substrate (also referred to as a discard substrate) to each other at a dividing portion such as a V-cut groove or a perforation, and the portions other than the dividing portion may be separated by a dividing slit. After component mounting, the dividing portion can be used to divide each substrate body using a dividing device or a dividing jig such as a router or a cutter.

[0003] For example, Patent Document 1 discloses a substrate dividing device including first and second holding means whose peripheries are uniformly held by elastic means, and first and second buffer means provided on the inner surfaces of the first and second holding means for sandwiching the mounted substrate, respectively. By abutting and pressing a pressing means from the back surface of the first or second holding means on the side where the dividing groove of the mounted substrate is not formed, the mounted substrate is divided into individual pieces at the dividing groove.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] However, the substrate splitting apparatus described in Patent Document 1 is large, and in the case of small composite substrates (multi-paneled substrates) including small-volume product substrates, the cushioning means used to hold the composite substrate during substrate splitting sometimes did not adequately transmit the stress required to split the composite substrate to the composite substrate.

[0006] Generally, to apply the stress required for separation, the ends of the composite substrate can be bent downwards by hand or with a separation jig, and each substrate can be separated along the V-cut groove.

[0007] However, in the method of bending the edges of the composite circuit board by hand or with a splitting jig to separate the individual circuit boards along the V-cut groove, a spring-back shock occurs at the separated edges of the product circuit board (circuit board body) during the bending process. This increases the distortion of the circuit board near the split area, and this increased distortion is applied to the small chip components surrounding the split area, causing component damage or cracks in the soldered areas.

[0008] The present invention has been made in view of the above points, and aims to provide a small, portable tool that suppresses impact on the edges of the substrate body when the substrate is divided. [Means for solving the problem]

[0009] The substrate splitting jig according to the present invention is characterized by comprising: a gripping portion for gripping the substrate splitting jig; a first clamping portion having one of a pair of clamping surfaces for clamping the end of the substrate and extending toward the tip from the gripping portion; a second clamping portion having the other of the clamping surfaces and extending toward the tip and connected to the first clamping portion; a first shock absorbing portion extending toward the tip from the end of the first clamping portion opposite to the gripping portion and having a first member holding surface of a pair of member holding surfaces that face each other and are further apart from each other than the clamping surfaces; a second shock absorbing portion extending toward the tip from the end of the second clamping portion opposite to the gripping portion, being shorter than the first shock absorbing portion in the tip direction and having a second member holding surface of the pair of member holding surfaces; a first shock absorbing material fixed to the first member holding surface; and a second shock absorbing material fixed to the second member holding surface. [Effects of the Invention]

[0010] According to the present invention, a compact substrate splitting jig can be provided that can reduce the impact on mounted components near the split portion when bending and splitting a substrate. [Brief explanation of the drawing]

[0011] [Figure 1] This is a schematic perspective view showing the appearance of a substrate splitting jig according to a first embodiment of the present invention. [Figure 2] This is a partial cross-sectional view of the substrate splitting jig along line AA in Figure 1. [Figure 3] This is a schematic perspective view showing the appearance of the substrate splitting jig of the first embodiment attached to a composite substrate. [Figure 4] Figure 3 is a partial cross-sectional view of the composite substrate and substrate splitting jig along line AA. [Figure 5] This is a partial cross-sectional view of the composite substrate and the substrate splitting jig as they were split by the substrate splitting jig of the first embodiment. [Figure 6] This is a schematic perspective view showing the appearance of the substrate splitting jig of the second embodiment when inverted vertically. [Figure 7] This is a partial cross-sectional view of the composite substrate and substrate splitting jig in the second embodiment. [Modes for carrying out the invention]

[0012] The substrate splitting jig 1 according to an embodiment of the present invention will be described in detail below with reference to the drawings. In this embodiment, components having substantially the same function and configuration are denoted by the same reference numerals, and redundant explanations will be omitted.

[0013] (First example) Figure 1 is a schematic perspective view showing the substrate splitting jig 1 of this embodiment. Figure 2 is a partial cross-sectional view of the substrate splitting jig 1 along line AA in Figure 1. Figure 3 is a schematic perspective view showing the substrate splitting jig 1 attached to a composite substrate 11. Figure 4 is a partial cross-sectional view of the composite substrate 11 and the substrate splitting jig 1 along line AA in Figure 3. For the sake of explanation, as shown in the figures, the directions of each axis of the orthogonal XYZ coordinate system will be defined as the XYZ directions, the direction of the tip (substrate fitting side) of the substrate splitting jig 1 will be defined as the Z direction (i.e., front and back), and the directions will be described as left and right (X direction) and up and down (Y direction) as viewed from the user when the user holds the substrate splitting jig 1.

[0014] The substrate splitting jig 1 comprises, for example, a metal fitting portion 2 at the tip and a gripping portion 3 at the front. The fitting portion 2 is fixed to the gripping portion 3 for gripping the substrate splitting jig 1.

[0015] The fitting portion 2 comprises a first clamping portion 2K1 and a second clamping portion 2K2 that are parallel to each other, and has a U-shaped groove (a groove that fits into the end of the composite substrate 11) in a longitudinal cross-section from front to back. The first clamping portion 2K1 has a clamping surface K1 that clamps the end of the composite substrate 11 and extends from the gripping portion 3 toward the front. The second clamping portion 2K2 has a clamping surface K2 and extends toward the front and is connected to the first clamping portion 2K1.

[0016] The fitting portion 2 further includes a first shock absorbing portion 2a and a second shock absorbing portion 2c (first width Wa > second width Wc) that extend parallel to each other in a direction from the end portions of the first clamping portion 2K1 and the second clamping portion 2K2 on the side opposite to the gripping portion 3 toward the tip. The first shock absorbing portion 2a and the second shock absorbing portion 2c have a first member holding surface H1 and a second member holding surface H2. The distance Hd between the first member holding surface H1 and the second member holding surface H2 is greater than and separated from the distance Kd between the clamping surfaces K1 and K2 of the first clamping portion 2K1 and the second clamping portion 2K2.

[0017] The fitting portion 2 further includes a first shock absorbing material 4a and a second shock absorbing material 4c on the surfaces of the first shock absorbing portion 2a and the second shock absorbing portion 2c that face each other. That is, the first shock absorbing material 4a and the second shock absorbing material 4c are fixed to the first member holding surface H1 and the second member holding surface H2 of the first shock absorbing portion 2a and the second shock absorbing portion 2c, respectively.

[0018] The first shock absorbing material 4a and the second shock absorbing material 4c are not particularly limited as long as they are soft materials that come into contact with the end portion of the composite substrate 11 and perform a shock absorbing function. Specifically, examples include sheets and sponge sheets such as urethane rubber and silicone rubber. The thickness 4T of the first shock absorbing material 4a and the second shock absorbing material 4c is set such that the distance s between the first shock absorbing material 4a and the second shock absorbing material 4c is not more than the distance Kd between the clamping surfaces K1 and K2 of the first clamping portion 2K1 and the second clamping portion 2K2 and does not prevent the insertion of the end portion (dummy substrate 14) of the composite substrate 11.

[0019] The composite substrate 11 to be divided includes a substrate body 13 and a dummy substrate 14 partitioned by a linear dividing portion 12 for bending and cutting. The dividing portion 12 is a linear portion that is more fragile than the periphery with a V-cut groove for dividing the dummy substrate 14 from the substrate body 13.

[0020] As shown in FIG. 1, in the substrate dividing jig 1, it is inserted between the first shock absorber 4a and the second shock absorber 4c and between the first clamping portion 2K1 and the second clamping portion 2K2 from the dummy substrate 14 of the composite substrate 11 to be divided, and the end portion of the dummy substrate 14 is arranged and fitted between the first clamping portion 2K1 and the second clamping portion 2K2.

[0021] Thus, the substrate dividing jig 1 includes a pair of first and second shock absorbing portions 2a and 2c each having shock absorbers 4a and 4c attached thereto, first and second clamping portions 2K1 and 2K2 adapted to the thickness of the composite substrate 11 for transmitting force to the composite substrate 11, and a gripping portion 3 for applying the stress of substrate division. Further, in order that the fitting portion 2 does not interfere with the composite substrate 11 and the substrate-mounted component 13c during substrate division, it has a configuration in which the second shock absorbing portion 2c on one side is shorter than the first shock absorbing portion 2a in the direction of the front end.

[0022] (Description of operation) As shown in FIG. 4, when the composite substrate 11 is bent and cut, the composite substrate 11 is clamped by the first clamping portion 2K1 and the second clamping portion 2K2 such that the tip of the second shock absorbing portion 2c does not exceed the dividing portion 12 and the tip of the first shock absorbing portion 2a exceeds the dividing portion 12. Then, as shown by the white arrow, for the bending and cutting of the composite substrate 11, the gripping portion 3 is operated downward so as to approach the composite substrate 11 from the side of the second clamping portion 2K2.

[0023] That is, the first shock absorbing portion 2a to which the first shock absorber 4a is attached and the second shock absorbing portion 2c to which the second shock absorber 4c is attached are positioned so as to cover the dividing portion 12. However, when the position from the dividing portion 12 to the substrate-mounted component 13c is close, the second shock absorbing portion 2c may be at a position in contact with the dividing portion 12.

[0024] As shown in Figure 5, with the dummy substrate 14 of the composite substrate 11 held between the first clamping portion 2K1 and the second clamping portion 2K2, the gripping portion 3 is pushed down in the direction of the second shock absorbing portion 2c, as indicated by the white arrow. The first clamping portion 2K1 and the second clamping portion 2K2 transmit the stress for substrate splitting to the dummy substrate 14 of the composite substrate 11 without going through the first shock absorbing material 4a (second shock absorbing material 4c), and the dummy substrate 14 of the composite substrate 11 is split. Since the split portion 12 is encased in the soft first shock absorbing material 4a (second shock absorbing material 4c), the impact generated in the split portion 12 during substrate splitting is absorbed by the first shock absorbing material 4a of the shock absorbing portion 2a of the substrate splitting jig 1, suppressing the generation of distortion in the composite substrate 11.

[0025] (Explanation of effects) As described above, according to the first embodiment, the impact generated when the composite substrate 11 is split by pressing and breaking the divided portion 12 can be absorbed by the shock-absorbing material, thereby suppressing distortion. Furthermore, by providing a substrate clamping portion, the stress required to split the substrate is transmitted to the substrate without attenuation, and since the shock-absorbing material holds the edges of the substrate, the spread of distortion during substrate splitting to the surrounding area can be suppressed.

[0026] (Second example) (Structure and explanation) Figure 6 is a schematic perspective view showing the appearance of the substrate splitting jig 1 of the second embodiment inverted vertically. Figure 7 is a partial cross-sectional view of the composite substrate 11 and the substrate splitting jig 1 in the second embodiment, corresponding to the partial cross-sectional view of the substrate splitting jig 1 along line AA in Figure 6. As shown in Figures 6 and 7, the second embodiment is identical to the first embodiment except for the addition of a depth adjustment section 5.

[0027] The depth adjustment section 5 of the second embodiment consists of a stopper 5a that can slide parallel to the left-right direction in the direction towards the front and towards the front on a rail (not shown) between the opposing surfaces of the clamping section 2K1 and the second clamping section 2K2, a bolt and nut 5b that passes through the stopper, and a slit 5c formed in the clamping section 2K1 and the second clamping section 2K2 that extends in the direction towards the front and towards the front so that the bolt and nut 5b passes through.

[0028] (Operation description) By visually inspecting from the side of the second shock-absorbing part 2c, the stopper 5a and bolt nut 5b of the depth adjustment part 5 are moved along the slit 5c until the tip of the second shock-absorbing part 2c is located near the divided part 12 of the composite substrate 11 and the end of the dummy substrate 14 of the composite substrate 11 is at the depth position between the clamping part 2K1 and the second clamping part 2K2, bringing them into contact with the end of the dummy substrate 14 of the composite substrate 11, and the stopper 5a is fixed with the bolt nut 5b. This allows for the determination of an appropriate depth position of the end of the dummy substrate 14 (the position between the first clamping part 2K1 and the second clamping part 2K2) during the cutting operation, as shown in Figure 7, enabling accurate substrate division. In addition, this embodiment can perform the same operation as the first embodiment.

[0029] (Explanation of effects) In the second embodiment, the edges of the dummy substrate 14 of the composite substrate 11 can be more securely fixed during the cutting operation, which is expected to improve work efficiency. In this embodiment as well, it is possible to achieve the same effects as in the first embodiment.

[0030] In the two embodiments described above, the case of dividing a composite substrate (printed circuit board) on which electronic components are mounted was explained. However, the composite substrate may also be a printed wiring board without electronic components, and the present invention can be applied to any board-shaped object other than a composite substrate.

[0031] Furthermore, although the above embodiments described a case where the dividing portion 12 for separating the dummy substrate 14 from the substrate body 13 of the composite substrate 11 is a continuous V-cut groove, the present invention is also applicable when the dividing portion 12 is a linear portion that is weaker than the surrounding area and has perforations or short slits combined with perforations. [Explanation of symbols]

[0032] 1. Circuit board splitting jig 2. Fitting part 2K1 1st clamping part 2K2 2nd clamping part 2a First shock absorption section 2c Second impact absorption section 3 Gripping part 4a First Impact Absorber 4c Second Impact Absorber 4. Shock-absorbing material 5 Depth adjustment section 11 Composite substrate 12 Division 13 Main board 13c PCB-mounted components 14 Dummy circuit boards

Claims

1. A substrate splitting jig for splitting a substrate, A gripping portion for gripping the aforementioned substrate splitting jig, A first clamping portion having one of a pair of clamping surfaces that clamp the end of the substrate and extending from the gripping portion toward the tip, A second clamping portion having the other side of the clamping surface, extending in the direction of the tip, and connected to the first clamping portion, A first impact absorbing portion having a first member holding surface, which extends from the end of the first clamping portion opposite to the gripping portion toward the tip, and which is one of a pair of member holding surfaces that face each other and are further apart from each other than the clamping surface, The second impact absorbing portion extends from the end of the second clamping portion opposite to the gripping portion toward the tip, is shorter than the first impact absorbing portion toward the tip, and has the second member holding surface of the pair of member holding surfaces, The first impact absorbing material fixed to the first member holding surface, The second impact absorbing material fixed to the second member holding surface, A substrate splitting jig characterized by having the following features.

2. The substrate comprises a dummy substrate partitioned by linear divisions for bending and cutting, The end of the substrate is the end of the dummy substrate, When bending and cutting the substrate, the substrate is held between the first clamping portion and the second clamping portion such that the tip of the second shock absorbing portion does not exceed the divided portion and the tip of the first shock absorbing portion exceeds the divided portion. The substrate splitting jig according to claim 1, characterized in that when the substrate is bent and cut, the gripping portion is operated to approach the substrate from the second clamping portion side.

3. The first clamping portion and the second clamping portion are equipped with depth adjustment portions. The substrate splitting jig according to claim 1, characterized in that the depth adjustment portion includes a stopper that is slidable between the opposing surfaces of the first clamping portion and the second clamping portion, a bolt and nut that penetrate the stopper, and slits that extend in the direction of the tip and are formed in the first clamping portion and the second clamping portion so that the bolt and nut penetrate.

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