Indication device

Abstract

To improve the performance of display devices. [Solution] A display device comprising: a heater wiring containing metal; a first substrate containing first wiring; a second substrate facing the first substrate; and a liquid crystal layer provided between the first substrate and the second substrate, wherein, in a plan view, the heater wiring is provided so as to overlap with the position of the first wiring and along the first wiring.

Description

Technical Field

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[0003] , , , , , , , <000000​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​A display device according to one embodiment comprises a heater wiring including metal, a first substrate including first wiring, a second substrate facing the first substrate, and a liquid crystal layer provided between the first substrate and the second substrate, wherein, in a plan view, the heater wiring is provided so as to overlap with the position of the first wiring and along the first wiring. [Brief explanation of the drawing]

[0007] [Figure 1] Figure 1 is an explanatory diagram showing the positional relationship when a viewer on one side of a transparent display panel views the background on the opposite side through the transparent display panel. [Figure 2] Figure 2 is an explanatory diagram showing an example of a background visible through a transparent display panel. [Figure 3] Figure 3 is a perspective view showing an example of a display device. [Figure 4] Figure 4 is a cross-sectional view of the display device shown in Figure 3. [Figure 5] Figure 5 is an overhead view of the display device shown in Figure 4. [Figure 6] Figure 6 is a circuit block diagram showing an example of the circuitry of the display device shown in Figure 4. [Figure 7] Figure 7 is a cross-sectional view of a display device according to another embodiment. [Figure 8] Figure 8 is an overhead view of the display device shown in Figure 7. [Figure 9] Figure 9 is a cross-sectional view of a display device according to another embodiment. [Figure 10] Figure 10 is an overhead view of the display device shown in Figure 9. [Figure 11] Figure 11 is a cross-sectional view of a display device according to another embodiment. [Figure 12] Figure 12 is an overhead view of the display device shown in Figure 11. [Figure 13] Figure 13 is a cross-sectional view of a display device according to another embodiment. [Figure 14] Figure 14 is an overhead view of the display device shown in Figure 13. [Figure 15]Figure 15 is a cross-sectional view of a display device according to another embodiment. [Figure 16] Figure 16 is an overhead view of the display device shown in Figure 15. [Figure 17] Figure 17 is a cross-sectional view of a display device according to another embodiment. [Figure 18] Figure 18 is an overhead view of the display device shown in Figure 17. [Modes for carrying out the invention]

[0008] The embodiments of the present invention will be described below with reference to the drawings. Note that the disclosure is merely an example, and modifications that can be easily conceived by those skilled in the art while maintaining the spirit of the invention are naturally included within the scope of the present invention. Furthermore, the drawings may schematically represent the width, thickness, shape, etc., of each part in order to clarify the explanation, but these are merely examples and do not limit the interpretation of the present invention. In addition, in this specification and in each drawing, elements similar to those described above in previously shown drawings are denoted by the same reference numerals, and detailed explanations may be omitted as appropriate.

[0009] In this application, descriptions of embodiments are divided into multiple sections for convenience as needed, but unless otherwise explicitly stated, these are not independent or separate entities, but rather, regardless of the order of description, they are parts of a single example, one being a detail of another, or a modification of one or all of the other. Furthermore, as a general rule, repeated explanations of similar parts are omitted. In addition, each component in an embodiment is not essential unless otherwise explicitly stated, such as when its number is theoretically limited or when it is clearly not the case from the context.

[0010] In the accompanying drawings, conversely, when it becomes complicated or the distinction from voids is clear, hatching or the like may be omitted even for a cross-section. In connection with this, even for a planar closed hole, the background contour line may be omitted when it is clear from the description or the like. Further, even if it is not a cross-section, hatching or a dot pattern may be added to clarify that it is not a void or to clarify the boundary of a region.

[0011] The display device according to this embodiment will be described. The display device according to this embodiment has a transparent display panel. First, the characteristics of the transparent display panel will be described. FIG. 1 is an explanatory diagram showing the positional relationship when a viewer on one side of the transparent display panel views the background on the opposite side through the transparent display panel. FIG. 2 is an explanatory diagram showing an example of the background viewed through the transparent display panel.

[0012] As shown in FIG. 1, when the observer 100 looks from one side to the other side of the display panel P1, the background 111 is viewed through the display panel P1. As shown in FIG. 2, when both the display area DA(PIX) and the peripheral area PFA outside the display area DA transmit light, the entire background 111 can be viewed without a sense of incongruity. On the other hand, when the peripheral area PFA has a light-shielding property that does not transmit light, a part of the background 111 viewed through the display panel P1 is blocked by the peripheral area PFA, which may give the observer 100 a sense of incongruity. Thus, in the case of the display panel P1 which is a transparent display panel, it is preferable that each of the display area DA and the peripheral area PFA has visible light transmissibility. Further, from the viewpoint of viewing the background 111 without a sense of incongruity, it is particularly preferable that the visible light transmission characteristics of each of the display area DA and the peripheral area PFA are of the same degree.

[0013] FIG. 3 is a perspective view showing an example of a display device. In FIG. 3, the boundary between the display area DA and the peripheral area PFA is indicated by a two-dot chain line. Also, in FIG. 3, a part of the signal wiring (specifically, the gate wiring GL and the source wiring SL) for transmitting signals for driving the liquid crystal among the circuits included in the display panel P1 is schematically shown by a one-dot chain line. In the following drawings including FIG. 3, the direction along the thickness direction of the display panel P1 is defined as the Z direction, in the X - Y plane orthogonal to the Z direction, the extending direction of one side of the display panel P1 is defined as the X direction, and the direction intersecting the X direction is defined as the Y direction for explanation.

[0014] As shown in FIG. 3, the display device 1A according to the present embodiment includes a display panel P1, a light source unit 30, and a drive circuit 40.

[0015] When configured as a display device, in addition to each part included in the display panel P1 shown in FIG. 3, for example, a flexible substrate connected to the display panel P1 or a housing may be included. In FIG. 3, parts other than the display panel P1 are not shown. Also, the display device 1A according to the present embodiment does not necessarily have a polarizing plate.

[0016] The display panel P1 has a display area DA where an image is formed according to an input signal supplied from the outside, and a peripheral area (frame area) PFA around the display area DA. Note that although the display area DA of the display panel P1 shown in FIG. 3 is rectangular, the display area DA may have a shape other than a rectangle, such as a polygon or a circle. The display area DA is the effective area where the display panel P1 displays an image in a plan view when viewing the display surface. In FIG. 3, the display surface is parallel to the XY plane. In the example shown in FIG. 3, each of the light source unit 30 and the drive circuit 40 is mounted on the display panel P1. As a modification, a light source substrate not shown separately from the display panel P1 may be attached to the peripheral area PFA of the display panel P1, and the light source unit 30 may be mounted on the light source substrate not shown.

[0017] <Display Panel> The configuration of the display panel P1 will now be described. Figure 4 is a cross-sectional view of the display device shown in Figure 3. Figure 4 is a cross-sectional view taken along line AA in Figure 3. That is, Figure 4 is a cross-sectional view taken when the display panel of the display device shown in Figure 3 is cut by a plane perpendicular to the Y direction. Figure 4 is a cross-sectional view, but the hatching of each component except the liquid crystal layer LQL has been omitted. Figure 5 is an overhead view of the display device shown in Figure 4. Figure 5 is an overhead view of the display device shown in Figure 4, viewed from above.

[0018] As shown in Figure 4, the display panel P1 includes an array substrate 10, a counter substrate 20, a front cover substrate 52, a back cover substrate 51, an adhesive layer 80, a liquid crystal layer LQL, an alignment film 70, a planarization layer 60, a heater wiring HL, a light-shielding material BM, and a source wiring SL.

[0019] The array substrate 10 can also be simply called a substrate, but in the following description, it will be referred to as an array substrate 10, meaning a substrate on which multiple switching elements are arranged in an array. As shown in Figure 4, the array substrate 10 has an upper surface and a lower surface opposite the upper surface. The upper surface and the lower surface of the array substrate 10 are spaced apart from each other. The array substrate 10 also has a side surface provided between the upper surface and the lower surface. In this embodiment, the array substrate 10 is a TFT (Thin Film Transistor) substrate. As shown in Figures 4 and 5, the array substrate 10 has source wiring SL and gate wiring GL. As shown in Figure 4, the source wiring SL is provided on the upper surface of the array substrate 10. The source wiring SL is in contact with the upper surface of the array substrate 10. The array substrate 10 is transparent to visible light. Switching elements (active elements) Tr, which will be described later, may be provided on the array substrate 10. The thickness of the array substrate 10 is, for example, 0.1 mm or more and 10 mm or less. The source wiring SL shown in Figure 4 is wiring for transmitting video signals. The gate wiring GL shown in Figure 5 is wiring for transmitting scanning signals.

[0020] When the display panel P1 is viewed from above, the light L1 emitted from the light source 30 appears to be traveling along the Y direction. Also, in Figure 4, when the XZ plane is viewed from above, the light L1 emitted from the light source 30 appears to be traveling along the Z direction while undergoing repeated total internal reflection. As shown in Figure 3, the source wiring SL is provided along the Y direction. That is, when the display panel P1 is viewed from above, the source wiring SL is provided along the direction of propagation of the light emitted from the light source 30. Also, as shown in Figure 5, when the display panel P1 is viewed from above, the gate wiring GL is provided so as to intersect with the source wiring SL. In this embodiment, the source wiring SL and the gate wiring GL are orthogonal to each other. The source wiring SL and the gate wiring GL are spaced apart from each other. The source wiring SL is electrically isolated from the gate wiring GL. In the overhead view shown in Figure 5, the source wiring SL is hidden by the light-shielding material BM. Here, viewing the display panel P1 from above means viewing the XY plane in Figure 3 from above.

[0021] As shown in Figure 4, the opposing substrate 20 is spaced apart from the array substrate 10. The opposing substrate 20 can also be simply called a substrate, but in the following description, it will be referred to as the opposing substrate 20 in the sense that it is a substrate positioned opposite the array substrate 10. The opposing substrate 20 has an upper surface and a lower surface opposite the upper surface. The upper surface and the lower surface of the opposing substrate 20 are spaced apart from each other. The opposing substrate 20 also has a side surface provided between the upper surface and the lower surface. As shown in Figure 4, the lower surface of the opposing substrate 20 and the upper surface of the array substrate 10 are opposite each other. The opposing substrate 20 is transparent to visible light. The thickness of the opposing substrate 20 is, for example, 0.1 mm or more and 10 mm or less.

[0022] The opposing substrate 20 is bonded to the array substrate 10, for example, via a sealing portion (sealing material) SLM. The sealing portion (sealing material) SLM bonds the array substrate 10 and the opposing substrate 20. The sealing portion SLM bonds the upper surface of the array substrate 10 and the lower surface of the opposing substrate 20. The sealing portion SLM is provided, for example, to surround the outer periphery of the liquid crystal layer LQL. Together with the array substrate 10 and the opposing substrate 20, the sealing portion SLM surrounds the entire liquid crystal layer LQL. In other words, the liquid crystal layer LQL is inside the sealing portion SLM. The sealing portion SLM acts as a seal that encapsulates the liquid crystal layer LQL between the array substrate 10 and the opposing substrate 20. The sealing portion SLM also acts as an adhesive that bonds the array substrate 10 and the opposing substrate 20.

[0023] As shown in Figure 4, the liquid crystal layer LQL is provided between the upper surface of the array substrate 10 and the lower surface of the opposing substrate 20. The liquid crystal layer LQL contains liquid crystal LQ. The liquid crystal layer LQL is an optical modulation element capable of changing the light transmission state by electrically driving the orientation state of the liquid crystal. The display panel P1 has the function of driving the orientation state of the liquid crystal molecules and modulating the light L1 passing through it by controlling the state of the electric field formed around the liquid crystal layer LQL via the switching element described above.

[0024] Liquid crystal (LQ) is a polymer-dispersed liquid crystal (LC) containing a liquid crystalline polymer and liquid crystal molecules. The liquid crystalline polymer is formed in streaks, and the liquid crystal molecules are dispersed in the gaps between the polymer. Both the liquid crystalline polymer and the liquid crystal molecules exhibit optical anisotropy or refractive index anisotropy. The responsiveness of the liquid crystalline polymer to an electric field is lower than that of the liquid crystal molecules. The orientation direction of the liquid crystalline polymer hardly changes regardless of the presence or absence of an electric field.

[0025] On the other hand, the orientation direction of the liquid crystal molecules changes in response to the electric field when a voltage above a threshold is applied to the liquid crystal LQ. When no voltage is applied to the liquid crystal LQ, the optical axes of the liquid crystalline polymer and the liquid crystal molecules are parallel to each other. Therefore, light L1 incident on the liquid crystal layer LQL is transmitted through the liquid crystal layer LQL with almost no scattering (transparent state). When a voltage is applied to the liquid crystal LQ, the optical axes of the liquid crystalline polymer and the liquid crystal molecules intersect each other. Therefore, light L1 incident on the liquid crystal LQ is scattered within the liquid crystal layer LQL (scattered state). The display panel P1 controls the transparent state and the scattered state by controlling the orientation of the liquid crystal LQ in the propagation path of light L1. In the scattered state, light L1 is emitted as emitted light L2 by the liquid crystal LQ and exits the display panel P1 from the upper side of the front cover substrate 52. Furthermore, background light L3 incident from the lower side of the back cover substrate 51 passes through the array substrate 10, the liquid crystal layer LQL, the opposing substrate 20, and the front cover substrate 52, and is emitted to the outside from the upper surface of the front cover substrate 52. The emitted light L2 and background light L3 are visible to an observer on the upper side of the front cover substrate 52. The observer can perceive the emitted light L2 and background light L3 in combination. In this way, the transparent display panel P1 is a display panel that allows an observer to perceive the displayed image and the background in combination.

[0026] As shown in Figure 4, the alignment film 71 is provided between the upper surface of the array substrate 10 and the liquid crystal layer LQL. The alignment film 71 can align the liquid crystal molecules of the liquid crystal LQ. The alignment film 71 is in contact with the liquid crystal LQ of the liquid crystal layer LQL.

[0027] The light-shielding material BM is provided on the lower surface of the opposing substrate 20. The light-shielding material BM is provided along the source wiring SL. When the display panel P1 is viewed from above, the position of the light-shielding material BM coincides with the position of the source wiring SL. When the display panel P1 is viewed from above, it is preferable that the width of the light-shielding material BM is greater than the width of the source wiring SL. When the display panel P1 is viewed from above, it is preferable that the source wiring SL is located within the area where the light-shielding material BM is located. The light-shielding material BM is formed of, for example, a black resin or a metal material. Examples of metal materials include copper, aluminum, chromium, molybdenum, titanium, and Al alloy.

[0028] As shown in Figure 4, the alignment film 72 is provided between the lower surface of the opposing substrate 20 and the liquid crystal layer LQL. The alignment film 72 can align the liquid crystal molecules of the liquid crystal LQ. The alignment film 72 is in contact with the liquid crystal LQ of the liquid crystal layer LQL. Hereinafter, the term alignment film 70 may be used as a general term for the alignment film 71 and the alignment film 72.

[0029] As shown in Figure 4, the back cover substrate 51 has an upper surface and a lower surface opposite the upper surface. The back cover substrate 51 and the front cover substrate 52, which will be described later, can each be simply called a substrate, but in the following description, they will be referred to as the back cover substrate 51 and the front cover substrate 52 to distinguish them. The upper surface and the lower surface are spaced apart from each other. The back cover substrate 51 also has a side surface provided between the upper surface and the lower surface. In this embodiment, the back cover substrate 51 is made of glass. In other words, the back cover substrate 51 is a glass substrate made of glass. The back cover substrate 51 is transparent to visible light. Examples of materials for the back cover substrate 51 include glass, acrylic resin, or polycarbonate resin. The thickness of the back cover substrate 51 is, for example, 0.5 mm to 10 mm.

[0030] As shown in Figure 4, the heater wiring HL is provided on the upper surface 51a of the back cover substrate 51. The heater wiring HL is in contact with the upper surface 51a of the back cover substrate 51. The heater wiring HL contains metal. The heater wiring HL contains, for example, a single metal or an alloy. Examples of single metals include copper and aluminum. An example of an alloy is Al alloy (aluminum alloy). The heater wiring HL can contain not only a single phase but also multiple layers. The heater wiring HL comprises, for example, a metal wire and a coating layer covering the outer surface of the metal wire.

[0031] In this embodiment, the heater wiring HL is provided along the source wiring SL. When the display panel P1 is viewed from above, the position of the heater wiring HL coincides with the position of the source wiring SL. In the example shown in Figure 4, the heater wiring HL is provided along the Y direction. That is, when the display panel P1 is viewed from above, the heater wiring HL is provided parallel to the light-ingress direction. Here, the light-ingress direction refers to the direction in which light emitted from the light source unit enters the display panel P1 when the display panel P1 is viewed from above. In the example shown in Figure 4, the light-ingress direction refers to the direction in which light emitted from the light source unit enters the side surface 52c of the front cover substrate 52 when the display panel P1 is viewed from above. That is, in the example shown in Figure 4, the light-ingress direction is the Y direction.

[0032] The heater wiring HL is a heater that uses a resistance heating method. In other words, when current flows through the heater wiring HL, the heater wiring HL can generate heat. When the display panel P1 is viewed from above, the width of the heater wiring HL is, for example, 0.05 μm to 10 μm. To increase the heating capacity of the heater wiring HL, the resistance of the heater wiring is lowered and the current flowing through the heater wiring HL is increased. For this purpose, the thickness of the heater wiring HL is preferably 1 μm to 5 μm. Within this thickness range, it is preferable to increase the thickness of the heater wiring HL because it lowers the resistance of the heater wiring HL. This is because it is possible to increase the current flowing through the heater wiring HL even with the same applied voltage. On the other hand, if the thickness of the heater wiring HL is thick, the light emitted from the light source unit 30 and incident on the panel P1 is scattered by the heater wiring HL, resulting in a deterioration of contrast. Therefore, from the viewpoint of preventing scattered light, the thickness of the heater wiring HL is more preferably 0.1 μm or more and 1 μm or less, and even more preferably 0.3 μm or more and 0.7 μm or less. This makes it less likely for the light emitted from the light source unit 30 to be scattered by the heater wiring HL.

[0033] In the example shown in Figure 4, three source wirings SL are provided, and three heater wirings HL are provided along each source wiring SL. On the other hand, in another embodiment, for example, three source wirings SL are provided, but only two heater wirings HL are provided. In other words, the number of heater wirings HL is less than the number of source wirings SL. Furthermore, when the display panel P1 is viewed from above, it is preferable that the multiple heater wirings HL are arranged at equal intervals. This makes moiré patterns less noticeable even if they occur depending on the viewing angle.

[0034] The flattening layer 60 is provided on the upper surface 51a of the back cover substrate 51. The flattening layer 60 is provided so as to cover the heater wiring HL. The flattening layer 60 has an upper surface and a lower surface opposite the upper surface. The lower surface of the flattening layer 60 is in contact with the back cover substrate 51. Since the flattening layer 60 covers the heater wiring HL, the upper surface of the flattening layer 60 and the heater wiring HL are spaced apart from each other. In other words, the thickness of the flattening layer 60 is greater than the thickness of the heater wiring HL. This protects the heater wiring HL. Therefore, it is possible to prevent the heater wiring HL, which has metal, from undergoing a corrosion reaction with, for example, the adhesive layer 81. Also, if the heater wiring HL is provided on the upper surface 51a of the back cover substrate 51, a step is formed. By providing the flattening layer 60 so as to cover the heater wiring HL, the step can be reduced. This makes it easier to bond the back cover substrate 51 on which the heater wiring HL is provided to other substrates. The thickness of the flattening layer 60 is preferably 1 to 10 times the thickness of the heater wiring HL, and more preferably 1.5 to 5 times. This makes it possible to reduce the thickness of the display panel P1.

[0035] In the edge-lit display device 1A, light may pass through the planarization layer 60 multiple times. Therefore, it is preferable that the planarization layer 60 be made of a material that absorbs as little light as possible and has low wavelength dispersion. The planarization layer 60 is formed to cover the base substrate (e.g., back cover substrate 51) on which the pattern (e.g., heater wiring HL) is formed. The planarization layer 60 is an insulating layer made of, for example, an organic insulating material. The planarization layer 60 has the function of flattening the irregularities caused by the pattern formed on the base substrate. In the example shown in Figure 4, the planarization layer 60 is also called the overcoat layer.

[0036] As shown in Figure 4, the adhesive layer 81 is provided between the lower surface of the array substrate 10 and the upper surface of the planarization layer 60. The adhesive layer 81 has an upper surface and a lower surface opposite the upper surface. The upper surface of the adhesive layer 81 is in contact with the lower surface of the array substrate 10. The lower surface 81b of the adhesive layer 81 is in contact with the upper surface of the planarization layer 60. The adhesive layer 81 plays the role of bonding the array substrate 10 and the planarization layer 60. The planarization layer 60 and the back cover substrate 51 are fixed to the array substrate 10 by the adhesive layer 81. The adhesive layer 81 has visible light transmission properties. It is preferable that the refractive index of the adhesive layer 81 is closer to the refractive index of the planarization layer 60 and the array substrate 10 than that of air. By having the refractive index of the adhesive layer 81 be the same as that of the planarization layer 60 and the array substrate 10, the reflection of light L1 at the interface between the upper surface of the planarization layer 60 and the lower surface of the array substrate 10 and the adhesive layer 81 can be suppressed. Examples of the adhesive layer 81 include a transparent adhesive sheet called OCA (Optical Clear Adhesive) formed in sheet form, and OCR (Optical Clear Resin) which is made by curing a liquid transparent adhesive.

[0037] As shown in Figure 4, the front cover substrate 52 has an upper surface and a lower surface opposite the upper surface. The upper and lower surfaces are spaced apart from each other. The front cover substrate 52 also has a side surface 52c (see Figure 3) provided between the upper and lower surfaces. In the example shown in Figure 4, the side surface 52c of the front cover substrate 52 functions as a light incident surface for introducing light into the interior of the front cover substrate 52. The front cover substrate 52 functions as a light guide plate. The side surface 52c of the front cover substrate 52 faces the light source unit 30. In this embodiment, when the display panel P1 is viewed from above, the light emitted from the light source unit 30 travels along the Y direction shown in Figure 4.

[0038] In this embodiment, the front cover substrate 52 is made of glass. In other words, the front cover substrate 52 is a glass substrate made of glass. The front cover substrate 52 is transparent to visible light. Examples of materials for the front cover substrate 52 include glass, acrylic resin, or polycarbonate resin.

[0039] As shown in Figure 4, the adhesive layer 82 is provided between the lower surface of the front cover substrate 52 and the upper surface of the opposing substrate 20. The adhesive layer 82 has an upper surface and a lower surface opposite to the upper surface. The upper surface of the adhesive layer 82 is in contact with the lower surface of the front cover substrate 52. The lower surface of the adhesive layer 82 is in contact with the upper surface of the opposing substrate 20. The adhesive layer 82 plays the role of bonding the front cover substrate 52 and the opposing substrate 20. The adhesive layer 82 fixes the front cover substrate 52 to the opposing substrate 20. The adhesive layer 82 has visible light transmission properties. It is preferable that the refractive index of the adhesive layer 82 is closer to the refractive index of the front cover substrate 52 and the opposing substrate 20 than that of air. By having the refractive index of the adhesive layer 82 be the same as that of the front cover substrate 52 and the opposing substrate 20, the reflection of light L1 at the interface between the lower surface of the front cover substrate 52 and the upper surface of the opposing substrate 20 and the adhesive layer 82 can be suppressed. Examples of adhesive layers 82 include transparent adhesive sheets called OCA (Optical Clear Adhesive) formed in sheet form, and OCR (Optical Clear Resin) which is made by curing a liquid transparent adhesive. Hereafter, the term adhesive layer 80 may be used as a general term for adhesive layers 81 and 82.

[0040] Next, we will explain, using Figure 5, how the display panel P1 appears when observer 100A, as shown in Figure 4, views it from above. In the case of an overhead view, if the positional relationship between the observer and the object changes, the positional relationship between the objects also changes. That is, the appearance of the objects changes. On the other hand, in the case of a plan view, even if the positional relationship between the observer and the object changes, the positional relationship between the objects does not change. As shown in Figure 5, the source wiring SL is blocked by the light-shielding material BM, so it is not directly visible to observer 100A, as shown in Figure 4. Of the three heater wirings HL shown in Figure 4, the central heater wiring HL is blocked by the light-shielding material BM, so it is not directly visible to observer 100A, as shown in Figure 4. The two heater wirings HL adjacent to the central heater wiring HL can be directly seen by observer 100A, as shown in Figure 4.

[0041] Next, the effects of the display device 1A according to this embodiment will be described. Transparent displays generally display color images by field sequential driving using RGB three-color LEDs. As the ambient temperature decreases, the rise time response speed of the liquid crystal LQ decreases. As a result, the brightness of the display begins to decrease. Also, as the ambient temperature decreases, the fall time response speed of the liquid crystal LQ decreases. As a result, the LED remains lit during the illumination period of the next frame's color. Therefore, colors may mix, and the display of the image may change to monochrome as the temperature decreases.

[0042] To address brightness reduction and monochrome issues, improving the response speed of the liquid crystal (LCD) is a possible solution. To improve the response speed of the LCD, heating is necessary. One heating method involves forming a metal heater wiring (HL) on a glass substrate and generating heat by passing an electric current through it. The heater wiring (HL) is expected to be formed on the front cover substrate (52), back cover substrate (51), opposing substrate (20), and array substrate (10) of the display device 1A. However, if the metal wiring overlaps the pixel aperture, it can cause a decrease in brightness due to a reduction in aperture ratio and lead to moiré patterns. Therefore, it is desirable to lay out the heater wiring (HL) so that it is hidden by the pixel source wiring (SL), gate wiring (GL), light-shielding material (BM), etc. Furthermore, there is a concern that LED light incident from the side of the glass will irradiate the heater wiring (HL), generating scattered light, which increases black brightness and reduces contrast. Therefore, it is necessary to arrange the heater wiring (HL) to minimize scattered light as much as possible.

[0043] The display device 1A according to this embodiment has heater wiring HL. This improves the response speed of the liquid crystal LQ. As a result, it is possible to prevent a decrease in the brightness of the display device 1A. It is also possible to prevent a decrease in the fall-off speed. As a result, when the display device 1A is used in a low-temperature environment, it is possible to prevent the image from being displayed in monochrome. In the display device 1A according to this embodiment, when the display panel P1 is viewed from above, the heater wiring HL is provided so as to overlap with the position of the source wiring SL and along the source wiring SL. As a result, even when heater wiring HL is provided, it is possible to prevent the generation of scattered light. As a result, even when heater wiring HL is provided, it is possible to prevent an increase in black brightness and a decrease in contrast.

[0044] Furthermore, in the display device 1A according to this embodiment, the heater wiring HL is provided on the upper surface 51a of the back cover substrate 51. This improves the flexibility of the layout of the heater wiring HL pattern. Moreover, since the upper surface 51a of the back cover substrate 51 on which the heater wiring HL is located is far from the light incident surface of the front cover substrate 52, the generation of scattered light can be suppressed.

[0045] Furthermore, the heater wiring HL can be provided along the gate wiring GL. For example, when the display panel P1 is viewed from above, the heater wiring HL overlaps with the position where the gate wiring GL is located. When the display panel P1 is viewed from above, it is preferable that the width of the heater wiring HL is smaller than the width of the gate wiring GL. When the display panel P1 is viewed from above, the heater wiring HL provided along the gate wiring GL intersects with the heater wiring HL provided along the source wiring SL. The heater wiring HL provided along the gate wiring GL is in electrical contact with the heater wiring HL provided along the source wiring SL. In other words, the heater wiring HL is provided in a mesh-like pattern. This prevents a decrease in heater function due to breakage of the heater wiring HL.

[0046] When the display panel P1 is viewed from above, it is preferable that the width of the heater wiring HL is smaller than the width of the source wiring SL. When the display panel P1 is viewed from above, it is preferable that the position of the heater wiring HL is inside the area where the source wiring SL is located. This further suppresses the generation of scattered light. The heater wiring HL is provided along the light-shielding material BM. When the display panel P1 is viewed from above, the position of the heater wiring HL overlaps with the position of the light-shielding material BM. When the display panel P1 is viewed from above, it is preferable that the width of the heater wiring HL is smaller than the width of the light-shielding material BM. When the display panel P1 is viewed from above, it is preferable that the position of the heater wiring HL is inside the area where the light-shielding material BM is located. This further suppresses the generation of scattered light.

[0047] <Example of circuit configuration> Next, an example of the circuit configuration of the display device 1A shown in Figure 4 will be described. Figure 6 is a circuit block diagram showing an example of the circuit of the display device shown in Figure 4. The wiring path connected to the common electrode CE shown in Figure 6 is formed, for example, on the opposing substrate 20 shown in Figure 4. In the example shown in Figure 6, the light source control unit 32 is included in the drive circuit 40. As a modification, the light source control unit 32 may be provided separately from the drive circuit 40. The light source control unit 32 is formed, for example, on a wiring board (not shown) connected to the light source unit 30 shown in Figure 3, and is electrically connected to the light source 31 via the wiring board.

[0048] In the example shown in Figure 6, the drive circuit 40 includes a signal processing circuit 41, a pixel control circuit 42, and a display panel drive circuit 47. The display panel drive circuit 47 includes a gate drive circuit 43, a source drive circuit 44, and a common potential drive circuit 45. The light source 31 includes, for example, a red light source section 31r, a green light source section 31g, and a blue light source section 31b. By making the area of ​​the array substrate 10 larger than the area of ​​the opposing substrate 20, the drive circuit 40 and the light source section 30 can be provided on the array substrate 10.

[0049] The signal processing circuit 41 includes an input signal analysis unit (input signal analysis circuit) 411, a storage unit (storage circuit) 412, and a signal adjustment unit 413. The display panel P1 has a control unit 90 equipped with a control circuit for controlling the display of images, and the input signal VS is input to the input signal analysis unit 411 of the signal processing circuit 41 from the control unit 90 via a wiring path such as a flexible wiring board (not shown). The input signal analysis unit 411 performs analysis processing based on the input signal VS input from the outside and generates an input signal VCS. The input signal VCS is a signal that determines, for example, what grayscale value to assign to each pixel PIX (see Figure 3) of the display panel P1 (see Figure 3) based on the input signal VS.

[0050] The signal adjustment unit 413 generates an input signal VCSA from the input signal VCS input from the input signal analysis unit 411. The signal adjustment unit 413 sends the input signal VCSA to the pixel control circuit 42 and the light source control signal LCSA to the light source control unit 32. The light source control signal LCSA is a signal that includes information about the light intensity of the light source 31, which is set according to the input grayscale value to the pixel PIX, for example. For example, when a dark image is displayed, the light intensity of the light source 31 is set low. When a bright image is displayed, the light intensity of the light source 31 is set high.

[0051] The pixel control circuit 42 generates a horizontal drive signal HDS and a vertical drive signal VDS based on the input signal VCSA. For example, in this embodiment, since it is driven in a field sequential manner, the horizontal drive signal HDS and the vertical drive signal VDS are generated for each color that the light source 31 can emit light. The gate drive circuit 43 sequentially selects the gate wiring GL of the display panel P1 (see Figure 3) within one vertical scanning period based on the horizontal drive signal HDS. The order of selection of the gate wiring GL is arbitrary. As shown in Figure 3, the multiple gate wirings (signal wirings) GL extend in the X direction and are arranged along the Y direction.

[0052] The source drive circuit 44 supplies a grayscale signal to each source wiring SL of the display panel P1 (see Figure 3) within one horizontal scanning period, based on the vertical drive signal VDS, according to the output grayscale value of each pixel PIX (see Figure 3). As shown in Figure 3, the multiple source wirings (signal wirings) SL extend in the Y direction and are arranged along the X direction. One pixel PIX is formed at each intersection of the gate wiring GL and the source wiring SL. A switching element Tr is formed at each intersection of the gate wiring GL and the source wiring SL. The multiple gate wirings GL and the multiple source wirings SL correspond to multiple signal wirings that transmit drive signals to drive the liquid crystal LQ.

[0053] As shown in Figure 6, a thin-film transistor is used as the switching element Tr. The type of thin-film transistor is not particularly limited, and examples include the following. Classified by gate position, bottom-gate transistors or top-gate transistors can be cited. Also, classified by the number of gates, single-gate thin-film transistors and double-gate thin-film transistors can be cited. One of the source electrode and drain electrode of the switching element Tr is connected to the source wiring SL, the gate electrode is connected to the gate wiring GL, and the other of the source electrode and drain electrode is connected to one end of the capacitance of the polymer-dispersed liquid crystal LC. One end of the capacitance of the polymer-dispersed liquid crystal LC is connected to the switching element Tr via the pixel electrode PE, and the other end is connected to the common potential wiring CML via the common electrode CE. Furthermore, a retaining capacitance HC is generated between the pixel electrode PE and the retaining capacitance electrode electrically connected to the common potential wiring CML. The common potential wiring CML is supplied from the common potential driving circuit 45.

[0054] <Light source part> The configuration of the light source unit 30 will now be described. The light source unit 30 is provided at a position facing the side surface 52c of the front cover substrate 52. The light source unit 30 is not particularly limited, but for example, it comprises a light source 31 and a lens. The light source 31 comprises, for example, a red light source unit 31r, a green light source unit 31g, and a blue light source unit 31b. The red light source unit 31r, the green light source unit 31g, and the blue light source unit 31b are composed of, for example, a plurality of light-emitting diode elements. The lens is, for example, positioned between the side surface 52c of the front cover substrate 52 shown in Figure 4 and the plurality of light-emitting diode elements. The plurality of light-emitting diode elements include a light-emitting diode element capable of emitting light of a first color (e.g., red), a light-emitting diode element capable of emitting light of a second color (e.g., green) different from the first color, and a light-emitting diode element capable of emitting light of a third color (e.g., blue) different from the first and second colors. The plurality of light-emitting diode elements are arranged along the X direction so as to be along the side surface 52c of the front cover substrate 52.

[0055] In the case of the display device 1A that performs color display, for example, the on / off switching of the light source 31 is controlled. In addition, the red light source section 31r, the green light source section 31g, and the blue light source section 31b are made to emit light at different timings. Specifically, the light source control unit 32 shown in Figure 6 outputs a signal SGr to the red light source section 31r to control the on / off switching of the red light source section 31r, a signal SGg to the green light source section 31g to control the on / off switching of the green light source section 31g, and a signal SGb to the blue light source section 31b to control the on / off switching of the blue light source section 31b.

[0056] When adjusting the white balance of the display device 1A, the brightness of each light-emitting diode element is adjusted based on the chromaticity of each individual RGB color. Specifically, during white balance adjustment, the current and illumination time input to the red light source 31r, the green light source 31g, and the blue light source 31b are adjusted to minimize variations in the brightness of each RGB color.

[0057] The above describes an example in which the light source unit 30 is provided at a position facing the side surface 52c of the front cover substrate 52. The arrangement of the light source unit 30 is not particularly limited and can be provided at a position facing the side surface of the back cover substrate 51, or at a position facing the side surface of the opposing substrate 20.

[0058] <Variation> A modified example of the display device according to the embodiment will be described below. Note that identical components may be denoted by the same reference numerals and their descriptions may be omitted.

[0059] Figure 7 is a cross-sectional view of a display device according to another embodiment. Figure 8 is an overhead view of the display device shown in Figure 7.

[0060] The display device 1B shown in Figure 7 differs from the display device 1A shown in Figure 4 in that the heater wiring HL is provided on the lower surface 10b of the array substrate 10. The heater wiring HL is in contact with the lower surface 10b of the array substrate 10. Also, as shown in Figure 7, the planarization layer 60 is provided on the lower surface 10b of the array substrate 10. The upper surface of the planarization layer 60 is in contact with the lower surface 10b of the array substrate 10. The planarization layer 60 is provided so as to cover the heater wiring HL. The lower surface of the planarization layer 60 is spaced apart from the heater wiring HL. The adhesive layer 81 is provided between the planarization layer 60 and the back cover substrate 51. The upper surface 81a of the adhesive layer 81 is in contact with the lower surface of the planarization layer 60. The lower surface of the adhesive layer 81 is in contact with the upper surface of the back cover substrate 51.

[0061] Next, we will explain, using Figure 8, how the display panel P1 appears when observer 100B, as shown in Figure 7, views it from above. As shown in Figure 8, the source wiring SL is obscured by the light-shielding material BM, so it is not directly visible to observer 100B, as shown in Figure 7. Of the three heater wirings HL shown in Figure 7, the central heater wiring HL is obscured by the light-shielding material BM, so it is not directly visible to observer 100B, as shown in Figure 7. The two heater wirings HL adjacent to the central heater wiring HL can be directly seen by observer 100B, as shown in Figure 7.

[0062] According to the display device 1B shown in Figure 7, the heater wiring HL is provided on the lower surface 10b of the array substrate 10, which improves the freedom of layout for the heater wiring HL pattern. Furthermore, since the lower surface 10b of the array substrate 10 on which the heater wiring HL is located is away from the light incident surface of the front cover substrate 52, the generation of scattered light can be suppressed. In addition, the heater wiring HL can be protected by the planarization layer 60, so the back cover substrate 51 and the adhesive layer 81 can be omitted.

[0063] Figure 9 is a cross-sectional view of a display device according to another embodiment. Figure 10 is an overhead view of the display device shown in Figure 9. The display device 1C shown in Figure 9 differs from the display device 1A shown in Figure 4 in that the heater wiring HL is provided on the upper surface 10a of the array substrate 10. The heater wiring HL is in contact with the upper surface 10a of the array substrate 10. The planarization layer 60 is provided on the upper surface 10a of the array substrate 10. The planarization layer 60 is provided between the array substrate 10 and the alignment film 71. The lower surface of the planarization layer 60 is in contact with the upper surface 10a of the array substrate 10. The upper surface of the planarization layer 60 is spaced apart from the heater wiring HL. The upper surface of the planarization layer 60 is in contact with the lower surface 71b of the alignment film 71. The source wiring SL is provided on the upper surface of the planarization layer 60. The adhesive layer 81 is provided between the array substrate 10 and the back cover substrate 51. The upper surface of the adhesive layer 81 is in contact with the lower surface of the array substrate 10. The lower surface of the adhesive layer 81 is in contact with the upper surface of the back cover substrate 51.

[0064] The display device 1C shown in Figure 9 can be manufactured, for example, by forming a heater wiring HL on the TFT circuit side of the array substrate 10, providing a planarization layer 60 to flatten it, and then forming the TFT circuit.

[0065] Next, we will explain, using Figure 10, how the display panel P1 appears when observer 100C, as shown in Figure 9, views it from above. As shown in Figure 10, the source wiring SL is obscured by the light-shielding material BM, so it is not directly visible to observer 100C, as shown in Figure 9. Similarly, the heater wiring HL is also obscured by the light-shielding material BM, so it is not directly visible to observer 100C, as shown in Figure 9.

[0066] According to the display device 1C shown in Figure 9, the heater wiring HL can be formed in the film deposition process of the array substrate 10, thus enabling high alignment accuracy between the heater wiring HL and the source wiring SL. Furthermore, in the display device 1C, the distance between the heater wiring HL, the source wiring SL, and the light-shielding material BM is short, which suppresses the occurrence of moiré patterns due to the viewing angle. In addition, since the light entering the heater wiring HL is blocked by the light-shielding material BM or the source wiring SL, the generation of scattered light can be suppressed.

[0067] Figure 11 is a cross-sectional view of a display device according to another embodiment. Figure 12 is an overhead view of the display device shown in Figure 11. The display device 1D shown in Figure 11 differs from the display device 1A shown in Figure 4 in that the heater wiring HL is provided on the lower surface 20b of the opposing substrate 20. The heater wiring HL is in contact with the lower surface 20b of the opposing substrate 20. The planarization layer 60 is provided on the lower surface 20b of the opposing substrate 20. The planarization layer 60 is provided between the opposing substrate 20 and the alignment film 72. The upper surface of the planarization layer 60 is in contact with the lower surface 20b of the opposing substrate 20. The lower surface of the planarization layer 60 is spaced apart from the heater wiring HL. The lower surface of the planarization layer 60 is in contact with the upper surface 72a of the alignment film 72. The light-shielding material BM is provided on the lower surface of the planarization layer 60. The light-shielding material BM is in contact with the lower surface of the planarization layer 60.

[0068] The display device 1D shown in Figure 11 can be manufactured, for example, by forming a heater wiring HL film on the light-shielding material BM side of the opposing substrate 20, providing a planarization layer 60 and planarizing it, and then forming the light-shielding material BM.

[0069] Next, we will explain, using Figure 12, how the display panel P1 appears when viewed from above by observer 100D, as shown in Figure 11. As shown in Figure 12, the source wiring SL is obscured by the heater wiring HL and the light-shielding material BM, so it is not directly visible to observer 100D, as shown in Figure 11. Furthermore, the light-shielding material BM is also obscured by the heater wiring HL, so it is not directly visible to observer 100D, as shown in Figure 11.

[0070] According to the display device 1D shown in Figure 11, the heater wiring HL can be formed in the film deposition process of the opposing substrate 20, thus enabling high alignment accuracy between the heater wiring HL and the light-shielding material BM. Furthermore, in the display device 1D, the distance between the heater wiring HL, the source wiring SL, and the light-shielding material BM is short, which suppresses the occurrence of moiré patterns due to the viewing angle. In addition, since the heater wiring HL is electrically insulated from the light-shielding material BM by the planarization layer 60, a voltage can be continuously applied to the heater wiring HL.

[0071] In the display device 1D shown in Figure 11, the light-shielding material BM can also be used as heater wiring HL. In other words, the light-shielding material BM can function as a heater. This eliminates the need to provide separate heater wiring HL from the light-shielding material BM. When the light-shielding material BM is used as heater wiring HL, the system is controlled to temporally separate the period during which the light-shielding material BM is used as common potential wiring CML from the period during which the light-shielding material BM is used as a heater.

[0072] Figure 13 is a cross-sectional view of a display device according to another embodiment. Figure 14 is an overhead view of the display device shown in Figure 13. The display device 1E shown in Figure 13 differs from the display device 1A shown in Figure 4 in that the heater wiring HL is provided on the upper surface 20a of the opposing substrate 20. The heater wiring HL is in contact with the upper surface 20a of the opposing substrate 20. The planarization layer 60 is provided on the upper surface 20a of the opposing substrate 20. The lower surface of the planarization layer 60 is in contact with the upper surface 20a of the opposing substrate 20. The planarization layer 60 is provided between the adhesive layer 82 and the opposing substrate 20. The upper surface of the planarization layer 60 is spaced apart from the heater wiring HL. The upper surface of the planarization layer 60 is in contact with the lower surface 82b of the adhesive layer 82.

[0073] Next, we will explain, using Figure 14, how the display panel P1 appears when viewed from above by observer 100E, as shown in Figure 13. As shown in Figure 14, the source wiring SL is obscured by the light-shielding material BM, so it is not directly visible to observer 100E as shown in Figure 13. Of the three light-shielding materials BM shown in Figure 13, the central light-shielding material BM is obscured by the heater wiring HL, so it is not directly visible to observer 100E as shown in Figure 13. The two light-shielding materials BM adjacent to the central light-shielding material BM can be directly seen by observer 100E as shown in Figure 13.

[0074] According to the display device 1E shown in Figure 13, since the heater wiring HL is provided on the upper surface 20a of the opposing substrate 20, the degree of freedom in the layout of the heater wiring HL pattern can be improved.

[0075] Figure 15 is a cross-sectional view of a display device according to another embodiment. Figure 16 is an overhead view of the display device shown in Figure 15. The display device 1F shown in Figure 15 differs from the display device 1A shown in Figure 4 in that the heater wiring HL is provided on the lower surface 52b of the front cover substrate 52. The heater wiring HL is in contact with the lower surface 52b of the front cover substrate 52. The planarization layer 60 is provided on the lower surface 52b of the front cover substrate 52. The upper surface of the planarization layer 60 is in contact with the lower surface 52b of the front cover substrate 52. The lower surface of the planarization layer 60 is spaced apart from the heater wiring HL. The planarization layer 60 is provided between the front cover substrate 52 and the adhesive layer 82. The lower surface of the planarization layer 60 is in contact with the upper surface 82a of the adhesive layer 82.

[0076] Next, we will explain, using Figure 16, how the display panel P1 appears when viewed from above by observer 100F, as shown in Figure 15. As shown in Figure 16, the source wiring SL is obscured by the light-shielding material BM, so it is not directly visible to observer 100F, as shown in Figure 15. Of the three light-shielding materials BM shown in Figure 15, the central light-shielding material BM is obscured by the heater wiring HL, so it is not directly visible to observer 100F, as shown in Figure 15. The two light-shielding materials BM adjacent to the central light-shielding material BM can be directly seen by observer 100F, as shown in Figure 15.

[0077] According to the display device 1F shown in Figure 15, the heater wiring HL is provided on the lower surface 52b of the front cover substrate 52. This improves the flexibility of the layout of the heater wiring HL pattern.

[0078] Figure 17 is a cross-sectional view of a display device according to another embodiment. Figure 18 is an overhead view of the display device shown in Figure 17. The display device 1G shown in Figure 17 differs from the display device 1A shown in Figure 4 in that the heater wiring HL is provided on the upper surface 51a of the back cover substrate 51 and on the lower surface 52b of the front cover substrate 52. The heater wiring HL is in contact with the lower surface 52b of the front cover substrate 52. The display device 1G shown in Figure 17 includes a plurality of planarization layers 60. The plurality of planarization layers 60 include a planarization layer 61 and a planarization layer 62. The planarization layer 62 is provided on the lower surface 52b of the front cover substrate 52. The upper surface of the planarization layer 62 is in contact with the lower surface 52b of the front cover substrate 52. The lower surface of the planarization layer 62 is spaced apart from the heater wiring HL. The planarization layer 62 is provided between the front cover substrate 52 and the adhesive layer 82. The lower surface of the planarization layer 62 is in contact with the upper surface 82a of the adhesive layer 82. The planarization layer 61 has the same arrangement as the planarization layer 60 of the display device 1A shown in Figure 4.

[0079] Next, we will explain, using Figure 18, how the display panel P1 appears when viewed from above by observer 100G, as shown in Figure 17. As shown in Figure 18, the source wiring SL is obscured by the light-shielding material BM, so it is not directly visible to observer 100G, as shown in Figure 17. Of the three heater wirings HL provided on the upper surface 51a of the back cover substrate 51 shown in Figure 17, the central heater wiring HL is obscured by the light-shielding material BM, etc., so it is not directly visible to observer 100G, as shown in Figure 17. The two heater wirings HL provided on the upper surface of the back cover substrate 51 adjacent to the central heater wiring HL can be directly seen by observer 100G, as shown in Figure 17. In addition, of the three light-shielding materials BM shown in Figure 17, the central light-shielding material BM is obscured by the heater wiring HL provided on the lower surface 52b of the front cover substrate 52, so it is not directly visible to observer 100G, as shown in Figure 17. The two light-shielding materials BM adjacent to the central light-shielding material BM can be directly seen by observer 100G as shown in Figure 17.

[0080] According to the display device 1G shown in Figure 17, the heater wiring HL is provided on both the lower surface 52b of the front cover substrate 52 and the upper surface 51a of the back cover substrate 51, thereby improving the heating performance of the heater wiring HL.

[0081] Within the scope of the spirit of the present invention, a person skilled in the art can conceive of various modifications and alterations, and it is understood that such modifications and alterations also fall within the scope of the present invention. For example, any addition, deletion, or design change of components, or addition, omission, or modification of processes, made by a person skilled in the art to the above-described embodiments, is also included within the scope of the present invention, as long as it retains the gist of the present invention.

[0082] Furthermore, any other effects and advantages brought about by the manner described in this embodiment that are evident from this specification or that can be appropriately conceived by a person skilled in the art are naturally considered to be brought about by the present invention. [Explanation of Symbols]

[0083] 1A display device 1B Display device 1C display device 1D display device 1E Display device 1F display device 1G display device 10 Array substrates 20 Opposing substrate 30 Light source section 31 Light source 31b Blue light source section 31g green light source section 31r Red light source section 32 Light source control unit 40 Drive Circuit 41 Signal Processing Circuits 42 Pixel control circuit 43 Gate drive circuit 44 Source drive circuit 45 Common Potential Drive Circuit 47 Display panel drive circuit 51 Back cover circuit board 52 Front cover substrate 60 Planarization layer 70-Orientation Film 71 Alignment film 72 Orientation film 80 Adhesive layer 81 Adhesive layer 82 Adhesive layer 90 Control Unit 100 Observers 100A Observer 100B Observer 100C Observer 100D Observer 100E Observer 100F Observer 100G Observer 111 Background 411 Input Signal Analysis Unit 412 Storage section 413 Signal Adjustment Section BM light shielding material CE Common Electrode CML Common Potential Wiring DA display area DF1 Display period GL gate wiring HC retention capacity HDS horizontal drive signal HL heater wiring L1 light L2 emission light L3 background light LC Polymer dispersed liquid crystal LCSA light source control signal LQ LCD LQL liquid crystal layer P1 Display Panel PE pixel electrode PFA related areas PIX pixels SGb signal SGg signal SGr signal SL Source Wiring SLM seal section Tr switching element NCS input signal VCSA input signal VDS Vertical Drive Signal VS Input signal

Claims

1. Heater wiring containing metal, A first circuit board including the first wiring, A second substrate facing the first substrate, A liquid crystal layer provided between the first substrate and the second substrate, In a plan view, the heater wiring is provided so as to overlap with the position of the first wiring and along the first wiring. Display device.

2. In claim 1, further, A third substrate is provided on the opposite side of the second substrate from the first substrate, The second substrate is provided with a light source located opposite the side surface of the substrate and capable of irradiating light in a first direction in a plan view, In a plan view, the first wiring is provided along the first direction, The heater wiring is provided on the surface of the third substrate facing the first substrate, in a display device.

3. In claim 1, further, A fourth substrate is provided on the opposite side of the first substrate from the second substrate, The fourth substrate is provided with a light source located opposite the side surface of the substrate and capable of irradiating light in a first direction in a plan view, The heater wiring is provided on the surface of the fourth substrate facing the second substrate, in a display device.

4. In claim 1, further, A third substrate is provided on the opposite side of the second substrate from the first substrate, A fourth substrate is provided on the opposite side of the first substrate from the second substrate, The fourth substrate is provided with a light source located opposite the side surface of the substrate and capable of irradiating light in a first direction in a plan view, A display device in which the heater wiring is provided on the surface of the third substrate facing the first substrate, and on the surface of the fourth substrate facing the second substrate.

5. In claim 1, further, The second substrate is provided with a light source located opposite the side surface and capable of irradiating light in a first direction in a plan view, The heater wiring is provided on the surface of the first substrate opposite to the surface of the second substrate that faces the first substrate, in a display device.

6. In claim 1, further, The second substrate is provided with a light source located opposite the side surface and capable of irradiating light in a first direction in a plan view, The heater wiring is provided on the surface of the first substrate facing the second substrate, in a display device.

7. In claim 1, further, The second substrate is provided with a light source located opposite the side surface and capable of irradiating light in a first direction in a plan view, The heater wiring is provided on the surface of the second substrate facing the first substrate, in a display device.

8. In claim 1, further, A third substrate is provided on the opposite side of the second substrate from the first substrate, The third substrate is provided with a light source located opposite the side surface of the substrate and capable of irradiating light in a first direction in a plan view, The heater wiring is provided on the surface of the second substrate opposite to the surface of the first substrate that faces the first substrate, in a display device.

9. In claim 1, Having a plurality of the first wirings, A display device in which, in a plan view, the position of one of two adjacent first wirings overlaps with the position of the heater wiring, while the position of the other first wiring does not overlap with the position of the heater wiring.

10. In claim 1, The first substrate further includes a second wiring that intersects with the first wiring, wherein the first substrate is a display device.

11. In claim 1, further, A light-shielding material is provided on the surface of the second substrate facing the first substrate, A display device in which, in a plan view, the light-shielding material is arranged along the first wiring and the heater wiring so as to overlap with the positions of the first wiring and the heater wiring.

12. In claim 1, A display device in which, in a plan view, the width of the heater wiring is smaller than the width of the first wiring.

13. In claim 1, In a plan view, the heater wiring is located within the region where the first wiring is located, in a display device.

14. In claim 1, Furthermore, the display device has a flattening layer provided to cover the heater wiring.

15. In claim 1, The first wiring is provided on the surface of the first substrate facing the second substrate, and is a display device.

16. In claim 1, The first wiring is a source wiring for the display device.

17. In claim 1, further, A third substrate is provided on the opposite side of the second substrate from the first substrate, A display device comprising an adhesive layer provided between the first substrate and the third substrate.

18. In claim 1, further, A fourth substrate is provided on the opposite side of the first substrate from the second substrate, A display device comprising an adhesive layer provided between the second substrate and the fourth substrate.

Images