Relay boards and modules

Abstract

The present invention provides a relay board that suppresses warping and a module including the relay board. [Solution] In module 1, the relay board 10 provided between the mounting substrate 20 and the electronic element 30 comprises a conductor (pillar electrode 121) that electrically connects the mounting substrate and the electronic elements 31 and 32, a mechanical member 122 that is electrically insulated from the mounting substrate, the electronic elements and the conductor, and a first resin material 126 provided around the conductor and the mechanical member, wherein the mechanical member has a Young's modulus higher than that of the first resin material.

Description

Technical Field

[0001] The present invention relates to an interposer substrate and a module including the interposer substrate.

Background Art

[0002] An electronic element such as a semiconductor chip and a mounting substrate are connected via, for example, an interposer substrate. The interposer substrate is a so-called interposer (see, for example, Patent Document 1). Among the developments of various interposer substrates, the development of an interposer substrate having a resin layer is also underway.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In such an interposer substrate including a resin layer, it is desirable to suppress warping.

[0005] The present invention has been made in view of the above circumstances, and an object thereof is to provide an interposer substrate and a module capable of suppressing warping.

Means for Solving the Problems

[0006] The above problems are achieved by the following means.

[0007] (1) An interposer substrate provided between a mounting substrate and an electronic element, the interposer substrate including a conductor that electrically connects the mounting substrate and the electronic element, a mechanical member that is electrically insulated from the mounting substrate, the electronic element, and the conductor, and a first resin material provided around the conductor and the mechanical member, wherein the mechanical member has a Young's modulus higher than that of the first resin material.

[0008] (2) The relay substrate according to (1) above, wherein the Young's modulus of the mechanical member is 70 GPa or more.

[0009] (3) The relay substrate according to (1) or (2) above, wherein the mechanism member includes at least one of ceramic and glass.

[0010] (4) The relay substrate according to (3) above, wherein the ceramic comprises at least one of aluminum oxide, aluminum nitride, and silicon carbide.

[0011] (5) The mechanism member is a relay board according to any one of (1) to (4) above, extending along at least one side of the relay board.

[0012] (6) A relay substrate according to any one of (1) to (5) above, having a plurality of conductors, wherein the plurality of conductors are arranged side by side in a first direction and in a second direction intersecting the first direction, and the mechanism member is provided between adjacent conductors in the first direction and includes a first mechanism member extending along the second direction.

[0013] (7) The relay substrate according to (6) above, wherein the mechanism member is provided between the conductors adjacent to each other in the two directions and further includes a second mechanism member extending along the first direction.

[0014] (8) The first mechanism member is further provided between adjacent conductors in the second direction, as described in (6).

[0015] (9) The relay board according to any one of (1) to (8) above, further comprising an electronic component electrically connected to at least one of the mounted board and the electronic element.

[0016] (10) The relay board according to any one of (1) to (9) above, wherein the area occupied by the mechanism member relative to the area of ​​the relay board is 0.1% or more on a predetermined surface parallel to the main surface of the relay board.

[0017] (11) The relay substrate according to any one of (1) to (10) above, wherein in a direction orthogonal to the main surface of the relay substrate, the size of the mechanism member is not greater than the size of the conductor.

[0018] (12) The relay substrate according to any one of (1) to (11) above, having a plurality of the mechanism members.

[0019] (13) A module including the relay substrate according to any one of (1) to (12) above, the mounting substrate, and the electronic element.

[0020] (14) The module according to (13) above, further having a second resin material provided around the electronic element.

Advantages of the Invention

[0021] The relay substrate and the module according to the present invention have a mechanism member having a Young's modulus higher than that of the first resin material. As a result, the influence of internal stress in the relay substrate is further reduced. Therefore, it is possible to suppress warping of the relay substrate.

Brief Description of the Drawings

[0022] [Figure 1] It is a cross-sectional view showing an example of the configuration of a module according to an embodiment of the present invention. [Figure 2] It is a view showing an example of the planar configuration of the resin layer shown in FIG. 1. [Figure 3] It is a cross-sectional view showing a step of the manufacturing method of the module shown in FIG. 1. [Figure 4] It is a cross-sectional view showing a step following FIG. 3. [Figure 5] It is a cross-sectional view showing a step following FIG. 4. [Figure 6] It is a cross-sectional view showing a step following FIG. 5. [Figure 7] It is a cross-sectional view showing a step following FIG. 6. [Figure 8] It is a cross-sectional view showing a step following FIG. 7. [Figure 9] This is a cross-sectional view showing the process following Figure 8. [Figure 10] This figure shows an example of the planar configuration of the resin layer in a modified example. [Figure 11] This is a plan view showing another example of the resin layer shown in Figure 10. [Modes for carrying out the invention]

[0023] Embodiments of the present invention will be described in detail below with reference to the attached drawings. In the following drawings, the same reference numerals refer to the same components, and the size of each component in the drawings is exaggerated for clarity and convenience of explanation. On the other hand, the embodiments described below are merely illustrative, and various modifications are possible from such embodiments.

[0024] In the following, "top" or "above" may include not only things that are directly above and in contact with the object, but also things that are above but not in contact with the object.

[0025] A singular expression includes multiple expressions unless the context clearly indicates otherwise. Furthermore, when a part "contains" or "has" a component, it does not exclude other components, but rather may include other components, unless otherwise specified.

[0026] Furthermore, the use of the term "the aforementioned," and similar demonstrative terms, can be singular or plural.

[0027] Unless explicitly stated otherwise, the steps constituting the method shall be performed in the appropriate order. This order is not necessarily limited to the order in which the steps are described. The use of all examples or illustrative terms (e.g., e.g.) is solely for illustrative purposes and is not limited by the scope of the claims, unless otherwise defined.

[0028] <Embodiment> (Configuration of Module 1) Figure 1 shows an example of the configuration of module 1 according to one embodiment of the present invention. This module 1 includes, for example, a relay substrate 10, a mounting substrate 20, and an electronic element layer 30 as its main components. The relay substrate 10 functions as an interposer connecting the mounting substrate 20 and the electronic element layer 30. This module 1 is composed of, for example, the mounting substrate 20, the relay substrate 10, and the electronic element layer 30. In the following description, the direction in which the mounting substrate 20, the relay substrate 10, and the electronic element layer 30 are arranged in this order may be referred to as the Z direction, the direction perpendicular to the Z direction as the X direction, and the direction perpendicular to both the Z and X directions as the Y direction. The main surfaces of the relay substrate 10 and the mounting substrate 20 are, for example, the XY plane. Here, the X direction corresponds to a specific example of the first direction of the present invention, and the Y direction corresponds to a specific example of the second direction of the present invention.

[0029] The electronic element layer 30 includes, for example, electronic elements 31 and 32, a sealing material 33, an underfill material 34, and bumps 35. The electronic elements 31 and 32 are, for example, semiconductor chips having predetermined functions. The electronic elements 31 and 32 are, for example, IC (Integrated Circuit) chips or memory chips. For example, electronic element 31 is an ASIC (Application Specific Integrated Circuit), and electronic element 32 is an HBM (High Bandwidth Memory). For example, electronic element 31 has a plurality of electrodes 311 on the surface facing the relay substrate 10 (for example, the XY plane). For example, electronic element 32 has a plurality of electrodes 321 on the surface facing the relay substrate 10 (for example, the XY plane).

[0030] Each of the electrodes 311 and 321 is electrically connected to the relay substrate 10 via a bump 35. The electronic element layer 30 is provided with, for example, a plurality of bumps 35. The bumps 35 contain, for example, solder material. An underfill material 34 is provided between the electronic elements 31 and 32 and the relay substrate 10. For example, the space between adjacent bumps 35 is filled with the underfill material 34. The underfill material 34 contains, for example, a resin material. A sealing material 33 is laminated on the underfill material 34. The sealing material 33 surrounds the electronic elements 31 and 32. Here, the sealing material 33 corresponds to a specific example of the second resin material of the present invention.

[0031] The mounting substrate 20 is, for example, a semiconductor package substrate and a motherboard. The mounting substrate 20 includes, for example, a base material 21, a wiring layer 22, electrodes 23 and a solder resist layer 24.

[0032] The mounting substrate 20 is electrically connected to the relay substrate 10 via a plurality of bumps 25. The plurality of bumps 25 are provided on electrodes 23. The bumps 25 contain, for example, solder material.

[0033] (Configuration of the relay board 10) The relay substrate 10 includes, for example, a first redistribution layer 11, a resin layer 12, and a second redistribution layer 13. In the relay substrate 10, for example, the first redistribution layer 11, the resin layer 12, and the second redistribution layer 13 are stacked in this order from the mounting substrate 20 side. The first redistribution layer 11 is provided with, for example, wiring 111 and insulating material 112. The resin layer 12 is provided with, for example, pillar electrodes 121, 124, mechanical members 122, electronic components 123, an adhesive layer 125, and resin material 126. The second redistribution layer 13 is provided with, for example, wiring 131 and insulating material 132. Here, the pillar electrode 121 corresponds to one specific example of the conductor of the present invention, and the resin material 126 corresponds to one specific example of the first resin material of the present invention.

[0034] The first redistribution layer 11 is provided with, for example, a plurality of wires 111. For example, the electrode 23 and the pillar electrode 121 are electrically connected via the wires 111. For example, the electrode 23 and the electronic component 123 are electrically connected via the wires 111. The plurality of wires 111 are embedded in an insulating material 112. The wires 111 include, for example, conductive metallic materials such as gold, platinum, palladium, silver, copper, aluminum, cobalt, titanium, chromium, nickel, tungsten, iron, tin, indium, or zinc. The insulating material 112 includes, for example, organic insulating materials such as epoxy resin, phenolic resin, and acrylic resin.

[0035] Figure 2 shows an example of the planar (XY plane) configuration of the resin layer 12. The resin layer 12 shown in Figure 1 corresponds to the cross-sectional configuration along line II shown in Figure 2. The resin layer 12 has, for example, a rectangular planar shape. The resin layer 12 has, for example, sides 12S1 and 12S3 extending in the Y direction and sides 12S2 and 12S4 extending in the X direction. The electronic component 123 is, for example, located approximately in the center of the region enclosed by these sides 12S1, 12S2, 12S3, and 12S4. The multiple pillar electrodes 124 are, for example, located in positions overlapping with the electronic component 123. The multiple pillar electrodes 121 are arranged around the electronic component 123, for example, side by side in the X direction and the Y direction. That is, the multiple pillar electrodes 121 are arranged in a matrix. The mechanism member 122 is located near the periphery of the resin layer 12. The resin layer 12 is provided with, for example, a plurality of mechanical members 122. For example, the mechanical members 122 include a first mechanical member 1221, a second mechanical member 1222, a third mechanical member 1223, and a fourth mechanical member 1224.

[0036] The resin material 126 provided around the pillar electrodes 121, 124 and the mechanical member 122 is an insulating resin material. The resin material 126 includes, for example, epoxy resin, phenolic resin, acrylic resin, polyimide resin, and liquid crystal polymer. The resin material 126 may also contain fillers. The Young's modulus of the resin material 126 is, for example, 100 MPa to 10000 MPa. By using the resin material 126, compared to using inorganic materials or silicon (Si), it is possible to improve the electrical properties of the relay substrate 10 and reduce costs.

[0037] The pillar electrodes 121 and 124 extend in the Z direction. The height (size in the Z direction) of the pillar electrode 121 is approximately the same as the thickness of the resin layer 12. The thickness (size in the Z direction) of the resin layer 12 is, for example, about 50 μm to 200 μm. The thickness of the resin layer 12 is, for example, smaller than the thickness (size in the Z direction) of the electronic element layer 30. The pillar electrode 121 electrically connects the wiring 111 and the wiring 131.

[0038] The height (magnitude in the Z direction) of the pillar electrode 124 is, for example, smaller than the height of the pillar electrode 121. For example, one end of the pillar electrode 124 in the Z direction is in contact with the electronic component 123. The pillar electrode 124 electrically connects the electronic component 123 and the wiring 131.

[0039] The pillar electrodes 121 and 124 contain, for example, copper (Cu). The resin layer 12 may have connecting holes instead of the pillar electrodes 121 and 124.

[0040] The mechanism members 122 are arranged in the vicinity of each of the sides 12S1, 12S2, 12S3, and 12S4. Near sides 12S1 and 12S3, for example, a first mechanism member 1221 and a third mechanism member 1223 are provided, extending along sides 12S1 and 12S3, respectively. The first mechanism member 1221 and the third mechanism member 1223 are arranged between adjacent pillar electrodes 121 in the X direction. Near side 12S2, a second mechanism member 1222 is provided, extending along side 12S2. This second mechanism member 1222 is arranged between adjacent pillar electrodes 121 in the Y direction. Near side 12S4, a fourth mechanism member 1224 is provided in a selective region of the central part of side 12S4. This fourth mechanism member 1224 is arranged between adjacent pillar electrodes 121 in the Y direction.

[0041] The mechanical component 122 is configured to be electrically insulated from the mounting substrate 20, the electronic element layer 30, the pillar electrodes 121 and 124, and the electronic component 123. In other words, the mechanical component 122 exists independently of the electronic circuits within module 1. The mechanical component 122 has insulating properties. The electrical resistance of the mechanical component 122 is 10 6 It is preferable that the impedance is ohm or higher.

[0042] The mechanical member 122 has a Young's modulus higher than that of the resin material 126. In this embodiment, since such a mechanical member 122 is provided in the resin layer 12, the influence of internal stress in the resin layer 12 is reduced compared to when the mechanical member 122 is not provided. As will be described in detail later, this makes it possible to suppress warping of the relay substrate 10.

[0043] For example, the mechanism member 122 is made of a material having a Young's modulus higher than that of the resin material 126. The mechanism member 122 has a Young's modulus of, for example, 20 GPa or more, preferably 70 GPa or more. The mechanism member 122 preferably contains at least one of ceramic and glass. The ceramic includes, for example, at least one of aluminum oxide (Al2O3), aluminum nitride (AlN), and silicon carbide (SiC). The mechanism member 122 containing ceramic or glass can achieve good insulation and elasticity. The mechanism member 122 can be molded, for example, by mold molding and laser processing.

[0044] Preferably, the area occupied by the mechanical member 122 relative to the area of ​​the relay substrate 10 on a predetermined plane parallel to the main surface of the relay substrate 10 is 0.1% or more. The predetermined plane parallel to the main surface of the relay substrate 10 is, for example, the XY cross-section of the relay substrate 10 in the portion where the mechanical member 122 is located. For example, in a predetermined XY cross-section of the relay substrate 10 (see Figure 2), the sum of the areas of the XY planes of each of the four mechanical members 122 relative to the area of ​​the relay substrate 10 is 0.1%. This allows the mechanical member 122 to function efficiently and more effectively suppress warping of the relay substrate 10. On a predetermined plane parallel to the main surface of the relay substrate 10, the area occupied by the mechanical member 122 relative to the area of ​​the relay substrate 10 is, for example, 0.1% or more and 90% or less. By limiting the area occupied by the mechanical member 122 to 90% or less, the function of the relay substrate 10 can be maintained.

[0045] The size of the mechanism member 122 in the Z direction is, for example, approximately the same as the thickness of the resin layer 12. In other words, the size of the mechanism member 122 in the Z direction is approximately the same as the height of the pillar electrode 121. The size of the mechanism member 122 in the Z direction only needs to be less than or equal to the thickness of the resin layer 12. For example, the size of the mechanism member 122 in the Z direction may be smaller than the height of the pillar electrode 121.

[0046] The electronic component 123 is embedded in the resin material 126. The electronic component 123 has a predetermined function, such as an IC, bridge, capacitor, inductor, coil, thermistor, resistor, and fuse. The electronic component 123 is, for example, a semiconductor chip. By having the electronic component 123 in the relay substrate 10, a desired function can be provided to the interposer that connects the electronic elements 31, 32 and the mounting substrate 20. This makes it possible to miniaturize and enhance the functionality of module 1. The constituent material of the electronic component 123 is different from that of the resin material 126. The elastic modulus of the electronic component 123 is different from that of the resin material 126. The thickness (size in the Z direction) of the electronic component 123 is smaller than the thickness of the resin layer 12.

[0047] The adhesive layer 125, provided between the electronic component 123 and the first redistribution layer 11, plays the role of adhering the electronic component 123 to the first redistribution layer 11. The adhesive layer 125 is surrounded by a resin material 126.

[0048] The adhesive layer 125 contains, for example, an organic insulating material such as epoxy resin, phenolic resin, acrylic resin, polyimide resin, and liquid crystal polymer. The adhesive layer 125 may also contain a filler. Preferably, the coefficient of thermal expansion of the adhesive layer 125 is lower than that of the resin material 126. This makes it possible to suppress warping of the intermediate substrate 10. Preferably, the thermal conductivity of the adhesive layer 125 is higher than that of the resin material 126. This makes it possible to improve the heat dissipation of the intermediate substrate 10.

[0049] (Manufacturing method for Module 1) Next, an example of a manufacturing method for Module 1 will be explained using Figures 3 to 9.

[0050] First, the first redistribution layer 11 and the pillar electrode 121 are formed on the support substrate 40 in this order (Figure 3). The support substrate 40 is made of a plate-like member containing, for example, at least one of glass, silicon (Si), SUS (Stainless Used Steel), ferrite, alumina, and prepreg. The support substrate 40 preferably contains glass, for example, in terms of thermal expansion coefficient and surface smoothness. Between the support substrate 40 and the first redistribution layer 11, a first adhesion layer, a second adhesion layer, a release layer, a first seed layer, and a second seed layer may be provided from the support substrate 40 side.

[0051] After forming the pillar electrodes 121, the electronic component 123 is mounted on the first redistribution layer 11. Subsequently, a plurality of pillar electrodes 124 are formed on the electronic component 123 (Figure 4). The electronic component 123 is bonded to the first redistribution layer 11 using an adhesive layer 125. The adhesive layer 125 may be provided on the electronic component 123 or on the first redistribution layer 11. The adhesive layer 125 may be in any form, such as paste or film, but as an example, it is preferable to use a paste-type adhesive layer 125.

[0052] After forming the pillar electrode 124, the mechanism member 122 is formed (Figure 5). The mechanism member 122 is bonded to the first redistribution layer 11, for example, using an adhesive.

[0053] Next, a resin material 126 is provided on the first redistribution layer 11 so as to cover the pillar electrodes 121, 124 and the electronic component 123 (Figure 6). For example, the resin material 126 is provided using a film lamination method or a spin coating method.

[0054] Next, the resin material 126 is planarized (Figure 7). For example, the resin material 126 is planarized using the CMP (Chemical Mechanical Polishing) method. By planarizing the resin material 126 until the pillar electrodes 121 and 124 are exposed, the resin layer 12 is formed.

[0055] After forming the resin layer 12, the second redistribution layer 13 and the bumps 35 are formed on the resin layer 12 in that order (Figure 8). After this, the electronic element layer 30 and the bumps 25 are formed (Figure 9). The electronic element layer 30 and the bumps 25 are formed, for example, as follows.

[0056] First, electronic elements 31 and 32 are mounted on the second redistribution layer 13 via bumps 35. At this time, an underfill material 34 is formed between the electronic elements 31 and 32 and the relay substrate 10. Next, a sealing material 33 is formed to cover the electronic elements 31 and 32. For example, the thickness of the sealing material 33 may be adjusted by polishing or the like.

[0057] Next, the support substrate 40 is removed. Then, the bumps 25 are formed by connecting to the wiring 111 of the first redistribution layer 11. This forms the electronic element layer 30 and the bumps 25. After this, the module 1 can be manufactured by connecting the mounting substrate 20 to the relay substrate 10 via the bumps 25.

[0058] (Effects of the relay board 10 and module 1) The relay substrate 10 and module 1 of this embodiment have a mechanical member 122. The mechanical member 122 has a Young's modulus higher than that of the resin material 126. As a result, the influence of internal stress in the relay substrate 10 is reduced compared to when the relay substrate is not provided with a mechanical member. Therefore, it is possible to suppress warping of the relay substrate 10. The effects of this will be explained below.

[0059] When a relay substrate has a layer of resin material, it is more prone to warping than when it has a layer of inorganic material. This is because resin materials, which have a relatively low Young's modulus, are susceptible to internal stress. If warping occurs in the relay substrate due to this internal stress during module manufacturing and use, it can lead to electrical connection problems between the mounted substrate and the electronic element layer, potentially reducing the reliability of the module.

[0060] In contrast, in the relay substrate 10 of this embodiment, the mechanical member 122 is provided in the resin layer 12, so the influence of internal stress is reduced. As a result, warping of the relay substrate 10 during manufacturing and use is suppressed, and the connection reliability of the module 1 can be improved.

[0061] Furthermore, since the mechanical member 122 is electrically insulated from each electrical component of module 1, the shape, number, and position of the mechanical member 122 can be easily changed. Therefore, the degree and orientation of the curvature of the relay board 10 can be freely adjusted, improving the design flexibility of module 1.

[0062] As described above, the relay substrate 10 and module 1 of this embodiment have a mechanism member 122 having a Young's modulus higher than that of the resin material 126. This reduces the influence of internal stress in the relay substrate 10. Therefore, it is possible to suppress warping of the relay substrate 10.

[0063] The following describes modified versions of the relay board 10 according to the above embodiment. To avoid repetition of the explanation, detailed descriptions of configurations similar to those of the relay board 10 in the above embodiment will be omitted.

[0064] <Variation> Figures 10 and 11 show an example of the planar configuration of the resin layer 12 according to a modified example. Figures 10 and 11 correspond to Figure 2 described in the above embodiment. For example, the mechanism member 122 does not have to be provided near all sides (sides 12S1, 12S2, 12S3, 12S4). For example, the mechanism member 122 may be provided near two opposing sides (12S1, 12S3) out of sides 12S1, 12S2, 12S3, 12S4.

[0065] For example, the first mechanism member 1221 and the third mechanism member 1223 extending in the Y direction may be provided between adjacent pillar electrodes 121 in the Y direction. The arrangement, size, and shape of the mechanism members 122 can be freely changed.

[0066] The configuration of the relay board 10 described above is merely an explanation of the main configuration for illustrating the features of the above-described embodiment, and is not limited to the above configuration; various modifications can be made within the scope of the claims. Furthermore, it does not preclude configurations that are generally found in relay boards.

[0067] For example, the relay substrate 10 may have one mechanical member 122, or it may have three or five or more mechanical members 122. The mechanical members 122 may be located at positions other than the periphery of the resin layer 12, for example, they may be located in the central part.

[0068] The mechanism member 122 may have a shape other than the shape shown in Figure 2, etc. For example, the mechanism member 122 may have a spherical or cylindrical shape.

[0069] The relay substrate 10 may have connection holes instead of pillar electrodes 121 and 124. In this case, the conductor of the present invention is composed of a conductive film provided in these connection holes. [Explanation of symbols]

[0070] 1 module 10 relay boards, 11 1st redistribution layer, 12 resin layers, 121,124 pillar electrodes 122 Mechanical components, 123 Electronic components, 125 adhesive layer, 13 Second redistribution layer, 20 mounted circuit boards, 30 Electronic element layers.

Claims

1. A relay substrate provided between the mounted substrate and the electronic element, The aforementioned relay board is A conductor electrically connects the aforementioned mounting substrate and the aforementioned electronic element, A mechanical member that is electrically insulated from the aforementioned mounting substrate, the aforementioned electronic element, and the aforementioned conductor, The conductor and the first resin material provided around the mechanism member Equipped with, The aforementioned mechanism member is a relay substrate having a Young's modulus higher than that of the first resin material.

2. The relay substrate according to claim 1, wherein the Young's modulus of the mechanical member is 70 GPa or more.

3. The relay substrate according to claim 1, wherein the mechanism member comprises at least one of ceramic and glass.

4. The relay substrate according to claim 3, wherein the ceramic comprises at least one of aluminum oxide, aluminum nitride, and silicon carbide.

5. The relay board according to claim 1, wherein the mechanism member extends along at least one side of the relay board.

6. Having a plurality of the aforementioned conductors, The plurality of conductors are arranged side by side in a first direction and a second direction intersecting the first direction. The relay substrate according to claim 1, wherein the mechanism member is provided between adjacent conductors in the first direction and includes a first mechanism member extending along the second direction.

7. The relay substrate according to claim 6, further comprising a second mechanism member provided between adjacent conductors in the second direction and extending along the first direction.

8. The relay substrate according to claim 6, wherein the first mechanism member is further provided between adjacent conductors in the second direction.

9. The relay board according to claim 1, further comprising an electronic component electrically connected to at least one of the mounted substrate and the electronic element.

10. The relay substrate according to claim 1, wherein the area occupied by the mechanism member relative to the area of ​​the relay substrate is 0.1% or more on a predetermined surface parallel to the main surface of the relay substrate.

11. The relay substrate according to claim 1, wherein the size of the mechanism member in a direction perpendicular to the main surface of the relay substrate is less than or equal to the size of the conductor.

12. The relay board according to claim 1, having a plurality of the aforementioned mechanical members.

13. The relay board according to claim 1, The aforementioned mounting substrate, The aforementioned electronics and A module equipped with the following features.

14. The module according to claim 13, further comprising a second resin material provided around the aforementioned electronic element.

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