Crystal oscillator with built-in temperature sensor

Abstract

To provide a temperature sensor-integrated quartz oscillator with a novel, practical structure that can reduce the temperature difference between the temperature sensor and the quartz crystal oscillator. [Solution] The quartz oscillator 10 comprises an AT-cut quartz crystal oscillating element 11, a temperature sensor 13, a container 15 enclosing these, and a substrate 17 that is not integrated with the container, the substrate 17 being connected to the container by a conductive member 19 at a first portion 17aa of the first main surface 17a. The temperature sensor is connected to a second portion 17ab of the first main surface of the substrate, other than the first portion, via a conductive member 21. The quartz crystal oscillating element is connected to a second main surface side portion (opposing portion) 17ba of the second main surface 17b, which is the surface opposite to the first main surface of the substrate, via a conductive member 19, on the substrate side with respect to the second portion.

Description

Technical Field

[0001] The present invention relates to a crystal oscillator incorporating a temperature sensor such as a thermistor.

Background Art

[0002] In recent years, a so-called crystal oscillator with a built-in temperature sensor, in which an AT-cut crystal oscillator piece and a temperature sensor are incorporated in one container, has been frequently used. An external electronic device (chip set) designed on the premise of using this crystal oscillator compensates the oscillation frequency of the crystal oscillator piece based on the temperature information detected by the temperature sensor. Therefore, with this crystal oscillator, the target frequency can be obtained with higher accuracy. As an example of a crystal oscillator with a built-in temperature sensor, there is a one-room structure. That is, there is one in which a crystal oscillator piece and a temperature sensor are mounted in one room and hermetically sealed (for example, Patent Document 1 and Patent Document 2).

[0003] The one described in Patent Document 1 is one in which a temperature sensor is mounted on a region between a pair of connection pads on which a crystal oscillator piece is mounted inside a container (summary of Patent Document 1, etc.). The one described in Patent Document 2 has a vibrator provided on a first part of a support portion extending from the inner wall of the container, and a temperature sensor provided on a second part facing the first part in the thickness direction of the support portion (summary of Patent Document 2, etc.). In any of them, since the temperature sensor and the crystal oscillator piece are likely to be close to each other, the temperature difference between the two can be reduced (summary of Patent Documents 1 and 2, etc.). Reducing the temperature difference between the temperature sensor and the crystal oscillator piece is useful as one means for improving temperature compensation accuracy.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Patent Document 2

Summary of the Invention

[0005] However, in the case of the structure described in Patent Document 1, the distance between the pair of connecting pads is narrow, and there are limitations to miniaturizing the temperature sensor, making it practically difficult to mount a temperature sensor between the pair of connecting pads of the container. Furthermore, in the case of the structure described in Patent Document 2, the support portion protrudes horizontally from the inner wall of the package and is integrated with the container, making it practically difficult to provide a quartz crystal vibrator on the first surface of the support portion and a temperature sensor on the second surface. This application has been made in view of these points, and therefore the object of this application is to provide a temperature sensor-integrated quartz oscillator having a novel, practical structure that can reduce the temperature difference between the temperature sensor and the quartz oscillator. [Means for solving the problem]

[0006] To achieve this objective, according to this invention, a temperature sensor-integrated quartz oscillator comprising an AT-cut quartz crystal oscillating element, a temperature sensor, and a container enclosing these, A substrate that is not integrated with the container, comprising a substrate connected to the container by a conductive member at a first portion of the first main surface, and, The temperature sensor is connected to the second portion of the first main surface of the substrate, other than the first portion, via a conductive member. The quartz crystal vibrator is characterized in that it is connected via a conductive member to the second main surface (opposing portion) of the second main surface, which is the surface of the substrate opposite to the first main surface, and which is opposite to the second portion across the substrate. [Effects of the Invention]

[0007] According to this invention, the quartz crystal oscillator and the temperature sensor are positioned in close proximity, facing each other across the substrate in the thickness direction. Therefore, heat conduction to the quartz crystal oscillator and the temperature sensor via the same object occurs through a common substrate and from substantially the same location on the substrate. Consequently, the quartz crystal oscillator and the temperature sensor share a common thermal environment, except for the difference in specific heat, thus reducing the temperature difference between them. Furthermore, since the substrate is not integrated with the container, the material of the substrate can be freely selected. For example, a substrate with a desired thermal conductivity or a desired thermal expansion coefficient can be selected. Furthermore, since the substrate is not integrated with the container, a quartz crystal oscillator with a built-in temperature sensor can be manufactured in a practical way, for example, by mounting the temperature sensor on the first main surface of the substrate, then mounting the substrate into the container, and then mounting the quartz crystal oscillator on the second main surface of the substrate. Therefore, we can provide a temperature sensor-integrated quartz oscillator with a novel, practical structure that can reduce the temperature difference between the temperature sensor and the quartz oscillator. [Brief explanation of the drawing]

[0008] [Figure 1] This is a diagram illustrating a quartz crystal oscillator 10 with a built-in temperature sensor according to the embodiment. [Figure 2] This figure illustrates the details of the substrate of the temperature sensor-integrated quartz oscillator 10 in this embodiment. [Figure 3] This figure illustrates a preferred example for a quartz crystal vibrator when using a quartz substrate as the base material. [Figure 4] This diagram illustrates preferred examples of the relationship between the thickness of the temperature sensor and the recess in the container, as well as the length of the substrate and the width of the recess. [Figure 5] This is a diagram illustrating a specific example of a quartz crystal oscillator. [Modes for carrying out the invention]

[0009] Embodiments of this invention will be described below with reference to the drawings. Note that the drawings used in this description are only schematic representations sufficient to understand the invention. Furthermore, in the drawings, similar components are indicated by the same number, and their descriptions may be omitted. Also, the structural examples and materials described below are merely preferred examples within the scope of this invention. Therefore, the present invention is not limited to the embodiments described below.

[0010] 1. Crystal oscillator of the embodiment Figures 1 and 2 are diagrams illustrating a temperature sensor-integrated quartz crystal oscillator 10 (hereinafter sometimes abbreviated as quartz crystal oscillator 10) according to the embodiment. Specifically, Figure 1(A) is a top view of the quartz crystal oscillator 10, Figure 1(B) is a cross-sectional view along the PP line in Figure 1(A), and Figure 1(C) is a bottom view. However, Figure 1(A) shows the state with the cover member 21 removed. Figure 2 is a diagram illustrating the relationship between the quartz crystal oscillating element 11 and the substrate 17. Specifically, Figure 2(B) is a top view of the substrate 17 and a cross-section along the RR line in this top view.

[0011] This crystal oscillator 10 comprises an AT-cut crystal oscillating element 11, a temperature sensor 13, a container 15 enclosing the crystal oscillating element 11 and the temperature sensor 13, and a predetermined substrate 17. The predetermined substrate 17 is a substrate that is not integrated with the container 15, and is connected to the container 15 by a conductive member 19 at a first portion 17aa of the first main surface 17a. The temperature sensor 13 is connected to the second portion 17ab of the first main surface 17a of the substrate 17, excluding the first portion 17aa, via a conductive member 19. The quartz crystal oscillator 11 is connected to the second main surface 17b of the substrate 17, which is the opposite side of the substrate 17 from the first main surface 17a, via a conductive member 19 to the second main surface side portion (also called the opposing portion) 17ba, which is opposite the second portion 17ab across the substrate 17. The container 15 is sealed by a lid member 21. Each component will be described in detail below.

[0012] The AT-cut quartz crystal oscillating element 11, as shown in Figure 2(C), is square in plan view, in this example rectangular, has a predetermined thickness corresponding to the oscillation frequency, and is equipped with excitation electrodes 11a on the main front and back surfaces, and a lead-out electrode 11b drawn out from the excitation electrodes 11a to one of the short sides of the quartz crystal oscillating element. The crystal oscillator 11 can be an X-long type, where the longer side is parallel to the X-axis (crystal axis of the crystal) and the shorter side is parallel to the Z'-axis (crystal axis of the crystal), or a Z-long type, where the longer side is parallel to the Z'-axis (crystal) and the shorter side is parallel to the X-axis (crystal) of the crystal, or a rectangular type with one side parallel to either the X-axis or Z'-axis of the crystal, selected according to the design of the crystal oscillator. However, the rectangular shape of the crystal oscillator 11 is not limited to a rectangular shape; it may also be a circular or elliptical shape, for example.

[0013] The temperature sensor 13 is preferably constructed using a thermistor. However, the temperature sensor 13 is not limited to a thermistor; other components, such as a diode, may also be used. This is because a temperature sensor can be realized by utilizing the temperature dependence of the diode's PN junction. In this example, the temperature sensor 13 is rectangular in shape and has connection terminals 13a at both ends in the longitudinal direction. However, the temperature sensor 13 is not limited to the above example; other configurations, such as a thin-film thermistor, may also be used. Furthermore, it is preferable that the portion of the temperature sensor 13 other than the portion connected to the substrate 17 is not in contact with other components. In this example, it is preferable that the portion of the temperature sensor 13 other than the portion connected to the substrate 17 is not in contact with the inner wall of the recess 15c provided in the base 15a of the container 15. This is to ensure that the only solid heat conduction path to the temperature sensor 13 is through the substrate 17.

[0014] In this case, the container 15 is composed of a ceramic package having a rectangular planar shape, specifically a rectangular shape. The container 15 includes a base 15a, a flange portion 15b provided along the edge of the base 15a, and a recess 15c provided in the base 15a and capable of planarly enclosing the temperature sensor 13. The crystal resonator 11 and the temperature sensor 13 are enclosed in the space surrounded by the base 15a and the flange portion 15b. However, in this example, the temperature sensor 13 is housed in the recess 15c. Here, the recess 15c in this example has a depth that can house the temperature sensor 13 in whole or in part in the height direction at a portion corresponding to one end side inside the container 15, that is, a portion closer to the flange portion 15b. A preferred example of the relationship between the recess 15c and the temperature sensor 13 will be described later with reference to FIG. 4. On the region of the base 15a, there are provided adhesive pads 15d, 15e for connecting the substrate 17. However, in this example, the adhesive pad 15d is an adhesive pad related to the temperature sensor 13, and the adhesive pad 15e is an adhesive pad related to the crystal resonator 11. That is, these adhesive pads 15d, 15e are connected to the crystal resonator 11 and the temperature sensor 13 in a predetermined relationship via connection wirings 17c, 17d provided on the substrate 17.

[0015] Also, at the four corners of the outer bottom surface of the container 15, there are provided external connection terminals 15f, 15g, 15h, 15i for connecting the crystal oscillator 10 to an arbitrary electronic device, for example, an electronic substrate for a mobile phone (see FIG. 1(C)). The adhesive pads 15d, the adhesive pad 15e, and the external connection terminals 15f, 15g, 15h, 15i are electrically connected by via wirings or castellated wirings not shown in a predetermined relationship. Also, on the top surface of the flange portion 15b of the container 15, there is a treatment according to the sealing method. Specifically, when the sealing method is a seam sealing method, a seam ring not shown is provided on the top surface of the flange portion 15b.

[0016] The substrate 17 is interposed between the container 15, the crystal resonator 11, and the temperature sensor 13, and has a common pedestal role for the crystal resonator 11 and the temperature sensor 13. The substrate 17 is not limited to this, but it is preferable to use one that is rectangular in shape when viewed from above, because it is easy to process. Furthermore, the substrate 17 can be made of any suitable material. For example, the substrate may be made of glass, ceramic, resin, or quartz. If you want to easily transfer heat from the container 15 to the quartz vibrator 11 and temperature sensor 13, you can select a substrate made of a material with high thermal conductivity, and if you want to make it difficult to transfer heat, you can select a substrate made of a material with low thermal conductivity. Moreover, the substrate may be made of quartz to match the thermal expansion coefficient of the quartz vibrator 11. An appropriate example considering the crystal axis of the quartz when the substrate 17 is made of quartz will be explained later. Furthermore, the thickness of the substrate 17 should be determined considering factors such as thermal conductivity and the effect of stress on the quartz crystal oscillator. If the substrate 17 is too thin, the strength of the substrate cannot be ensured, and if it is too thick, it will affect the overall thickness of the quartz crystal oscillator 10. For example, the thickness should be 30 to 100 μm, preferably 40 to 70 μm, and it may be even thinner. Also, the substrate is not limited to one sheet; for example, it may be composed of multiple substrates made of different materials. Furthermore, the planar size of the substrate 17 is naturally limited to a size that fits within the container 15, but in this example, it is larger in planar size than the crystal oscillator 11. However, other examples will be explained later with reference to Figure 4.

[0017] Furthermore, the first portion 17aa, the second portion 17ab, and the second main surface portion (opposing portion) 17ba as referred to in this invention are preferably regions within the substrate 17, such as the following. First, the second part 17ab, that is, the part to which the temperature sensor 13 is connected, should be a region on one end of the substrate 17, with a width sufficient to connect the temperature sensor 13 from one end of the substrate 17, taking into consideration the effective use of the substrate 17. Specifically, if the temperature sensor 13 is a rectangular parallelepiped, for example, a so-called 0603 type, the width of the temperature sensor 13 is 0.3 mm, so the second part 17ab should be a region of about 0.3 mm from one end of the substrate 17. Generally speaking, if the width of the temperature sensor 13 is represented as S (see Figure 1(A)), the second part 17ab should be a region from 0.8S to 1.5S from one end of the substrate 17, preferably from 0.8S to 1.2S from one end of the substrate 17, and even more preferably from 0.9S to 1.2S from one end of the substrate 17. Furthermore, the second main surface portion (opposing portion) 17ba, which faces the first portion 17aa, should be wide enough to support the quartz crystal oscillating element 11. Specifically, it should be approximately the same size as the support portion of the quartz crystal oscillating element 11. Alternatively, although not limited to this, similar to the second portion 17ab described above, the region from 0.8S to 1.5S from one end of the substrate 17 is good, and preferably the region from 0.8S to 1.2S. In this example, the region of the second portion 17ad is defined by the width S of the temperature sensor, but if the temperature sensor is smaller and the long side dimension of the temperature sensor is also smaller than the fixed area of ​​the quartz crystal oscillating element 11, then of course S may be the dimension of the long side.

[0018] On the other hand, the first portion 17aa has an area that can accommodate connection wiring 17d from the temperature sensor 13 (see Figure 2(B)) and connection wiring 17c from the quartz crystal oscillator 11 (see Figure 2(B)), and an area that can accommodate the substrate 17 to the container 15 with the desired strength. For example, considering the width S of the temperature sensor, the first portion 17aa is preferably the region from 1.5S to 3S from the edge of the second portion 17ab, preferably from 1.5S to 2.5S, and more preferably from 1.5S to 2S. In this example, the first portion 17aa is the region that is connected to a total of four connection pads: the connection pad 15d for the quartz crystal oscillator 11 and the connection pad 15e for the temperature sensor 13.

[0019] Furthermore, in order to electrically connect the quartz crystal oscillator 11, the temperature sensor 13, and the container 15, As shown in Figure 2(B), the substrate 17 is provided with predetermined connection wirings 17c and 17d on its first main surface 17a and second main surface 17b. Specifically, the substrate 17 is provided with connection wiring 17c extending from the first main surface 17a to the second main surface 17b to connect the crystal oscillator 11 to the container's connection pad 15e, and the substrate 17 is provided with connection wiring 17d on its second main surface 17b to connect the temperature sensor 13 to the connection pad 15d.

[0020] The conductive member 19 may be various conductive adhesives such as silicone-based conductive adhesives, epoxy-based conductive adhesives, or polyimide-based conductive adhesives, or it may be something other than an adhesive, such as a metal bump. However, considering the relaxation of thermal stress and shock absorption, a silicone-based conductive adhesive is preferred. The conductive member between the substrate 17 and the temperature sensor 13 and the conductive member between the substrate 17 and the quartz crystal oscillator 11 may be the same or different, but it is preferable that they be the same. The lid member 21 can be any material depending on the sealing method. If the sealing method is seam sealing, the lid member 21 can be made of, for example, Kovar material with nickel plating.

[0021] In the embodiment of the quartz oscillator 10, the quartz crystal 11 and the temperature sensor 13 are positioned in close proximity to each other, sandwiching the substrate 17 in the thickness direction. Therefore, heat conduction to the quartz crystal 11 and the temperature sensor via the substrate 17 occurs through a common area of ​​the substrate, namely the second portion 17ab and the second main surface portion (opposing portion) 17ba of the substrate 17. Thus, the temperature difference between the quartz crystal 11 and the temperature sensor can be reduced. Moreover, since the substrate 17 is not integrated with the container 15, the material of the substrate 17 can be freely selected. Furthermore, since the substrate 17 is not integrated with the container 15, a quartz oscillator with a built-in temperature sensor can be manufactured in a practical way, for example, by mounting the temperature sensor 13 on the first main surface 17a of the substrate 17, then mounting the substrate 17 in the container 15, and then mounting the quartz crystal 11 on the second main surface 17b of the substrate 17.

[0022] 2. Preferred example when using a quartz substrate 17 Although the constituent material of the substrate 17 is described above as arbitrary, it is preferable to use a quartz substrate 17, taking into consideration compatibility with the thermal expansion coefficient of the quartz crystal oscillator 11. Furthermore, it is preferable to arrange the quartz crystal oscillator 11 and the quartz substrate 17 in a manner that takes into account the crystal axis of the quartz. An example of this will be explained below with reference to Figure 3. Figure 3(A) shows a case where the quartz crystal oscillator 11 is connected to substrates 17x and 17y at two locations along the X-axis of the quartz crystal. That is, the two lead electrodes 11b are located at two separate locations along the X-axis of the quartz crystal oscillator 11, and the quartz crystal oscillator 11 is bonded to substrates 17x and 17y at these locations. Specifically, the example shown in the lower left of Figure 2(A) is a substrate 17x made of an AT-cut quartz crystal, with connecting wires 17c and 17d at two locations along the X-axis of the quartz crystal, respectively. The example shown in the lower right of Figure 2(A) is a substrate 17y made of a Z-cut quartz crystal, with connecting wires 17c and 17d at two locations along the Z' axis of the quartz crystal, respectively. The quartz crystal vibrator 11 and the substrate 17x or substrate 17y are positioned such that the X axes of the quartz crystals are parallel to the first direction a (see Figure 3(A)), i.e., they coincide. Note that "coincidence" means not only exact coincidence, but also cases where the axes are slightly misaligned within the scope of the objectives of the present invention (the same applies hereinafter). Note that the Z' axis of the quartz crystal in Figure 2 is an axis that deviates from the true Z axis of the quartz crystal due to the cutting orientation of the AT-cut quartz crystal (the same applies hereinafter).

[0023] Figure 3(B) shows an example where the quartz crystal oscillator 11 is connected to the substrate 17z at two points along the Z' axis of the quartz crystal. In this case, the substrate 17z contains the Z axis or Z' axis of the quartz crystal within its plane and is capable of connecting the quartz crystal oscillator 11 at two points along this Z axis or Z' axis. Specifically, the substrate 17z is made of AT-cut quartz crystal and is provided with connection wirings 17c and 17d along the Z' axis of the quartz crystal on the substrate 17z, corresponding to the lead electrodes 11b of the quartz crystal oscillator 11. The crystal oscillator 11 and the substrate 17z are positioned such that the Z' axes of their respective crystals are parallel to the first direction a (see Figure 3(A)), i.e., they coincide. Further details regarding the preference for using a quartz substrate and aligning the crystal axes of the quartz crystal with those of the quartz substrate are described, for example, in Table 2 and related text of Japanese Patent Application No. 2014-72182 and Japanese Patent Application No. 2024-154016, which precedes this application, by the applicant of this application.

[0024] 3. Regarding the depth of the recess for mounting the temperature sensor, etc. Next, a preferred example of the relationship between the thickness h of the temperature sensor 13 and the depth d of the recess for the temperature sensor provided in the container 15, as well as the length of the substrate and the width of the recess, will be explained. This explanation will be given with reference to Figures 4(A) and (B). Note that Figures 4(A) and (B) correspond to the cross-sectional view shown in Figure 1(B). The crystal oscillator 10x shown in Figure 4(A) is configured such that d ≤ hs, where d is the depth of the recess 15c for mounting the temperature sensor 13 and h is the height of the temperature sensor 13. In the case of this crystal oscillator 10x, since d ≤ hs, the substrate 17 would directly touch the container 15, and the temperature sensor 13 would come into contact with the bottom surface of the recess 15c. If the temperature sensor 13 comes into contact with the bottom surface of the recess 15c, it will cause a difference in the heat conduction path between the temperature sensor 13 and the crystal oscillator 11, which is undesirable. To avoid this, the thickness of the adhesive pads 15d and 15e and the thickness of the conductive member 19 should be set to an appropriate thickness. However, since d ≤ hs, it is easy to make the overall thickness of the crystal oscillator 10x thinner.

[0025] The crystal oscillator 10y shown in Figure 4(B) is configured such that d > h, where d is the depth of the recess 15c for mounting the temperature sensor 13 and h is the height of the temperature sensor. In the case of this crystal oscillator 10y, since d > h, there is greater flexibility in the thickness of the adhesive pads 15d and 15e and the thickness of the conductive material 19. Manufacturing the crystal oscillator 10y is also easier compared to the crystal oscillator 10x. In both cases shown in Figures 4(A) and 4(B), the dimension L along the long side of the quartz crystal oscillator 11 on the substrate 17 is preferably small enough to ensure sufficient bonding area for connecting the substrate 17 to the container 15 and sufficient bonding surface for connecting the quartz crystal oscillator 11 and the temperature sensor 13 to the substrate 17. When the length L of the substrate 17 is smaller than the length of the quartz crystal oscillator 11, advantages such as reducing the risk of the tip of the quartz crystal oscillator 11 coming into contact with the substrate 17 and reducing the influence of stray capacitance on the excitation electrode 11a of the quartz crystal oscillator 11 can be obtained. Furthermore, it is preferable that the width W of the recess 15c be wide enough to secure an area for bonding the substrate 17 to the container 15 and an area for providing adhesive pads 15d and 15e in the area of ​​the container 15 other than the recess 15c. This also makes it easier to mount the substrate 17 with the temperature sensor 13 attached to the container 15.

[0026] 4. About the crystal vibrator In the example described above, the quartz crystal vibrator 11 had a uniform thickness and a rectangular planar shape, but the shape of the quartz crystal vibrator 11 is not limited to the example above. For example, as shown in Figure 5(A), the crystal diaphragm may have a so-called one-sided frame structure, having a vibrating part 11c with a thickness corresponding to the frequency and a support part 11d that is thicker than the vibrating part 11c. Alternatively, as shown in Figure 5(B), the crystal diaphragm may have a notch 11e between the vibrating part and the support part. Furthermore, as shown in Figure 5(C), the crystal diaphragm may have a through hole 11f between the vibrating part and the support part. The notch 11e and the through hole 17f may be provided in a crystal diaphragm with a uniform thickness, or in a crystal diaphragm with a one-sided frame structure as shown in Figure 11(A). [Explanation of Symbols]

[0027] 10: Crystal oscillator with built-in temperature sensor of the embodiment, 11: AT-cut quartz crystal oscillator 13: Temperature sensor 13a: Temperature sensor connection terminal 15: Container 15a: Base 15b: Embankment 15c: Recess 15d, 15e: Connection pad 15f, 15g, 15h, 15i: External connection terminals 17: Substrate 17a: First main surface of the substrate 17aa: First part of the first main surface 17ab: Second part of the first main surface 17b: Second main surface of the substrate 17ba: Second main surface side portion (opposite portion) 17c, 17d: Connecting wiring 19: Conductive material 21: Lid component d: Depth of recess W1: Width of recess h: Height of temperature sensor L: Length of circuit board S: Width of temperature sensor

Claims

1. In a temperature sensor-integrated quartz oscillator comprising an AT-cut quartz crystal oscillating element, a temperature sensor, and a container enclosing these, A substrate that is not integrated with the container, and comprises a substrate connected to the container by a conductive member at a first portion of the first main surface, The temperature sensor is connected to the second portion of the first main surface of the substrate, other than the first portion, via a conductive member. A temperature sensor-integrated quartz resonator characterized in that the quartz resonator is connected via a conductive member to the portion of the second main surface of the substrate, which is the surface opposite to the first main surface of the substrate, and which faces the second portion across the substrate.

2. The substrate is made of glass, ceramic, resin, or quartz. The temperature sensor-integrated quartz oscillator according to claim 1, characterized in that the quartz crystal vibrator is rectangular in plan view and connected to the substrate by the conductive member in a cantilevered manner at two locations along one of its sides.

3. The quartz crystal vibrator is rectangular in plan view and is cantilevered to the substrate by the conductive member at two points along one side of the crystal that lies along the X-axis. The substrate is an AT-cut or Z-cut quartz plate, and is arranged such that the X-axis of the quartz on the substrate coincides with the X-axis of the quartz crystal vibrator. A quartz crystal oscillator with a built-in temperature sensor, as described in claim 1.

4. The quartz crystal vibrator is rectangular in shape when viewed from above, and is cantilevered to the substrate by the conductive member at two points along one side of the crystal that lies along the Z' axis. The substrate is an AT-cut quartz plate, and is arranged such that the Z' axis of the quartz on the substrate coincides with the Z' axis of the quartz vibrator. A quartz crystal oscillator with a built-in temperature sensor, as described in claim 1.

5. The temperature sensor-integrated quartz oscillator according to claim 1, characterized in that the portion of the temperature sensor other than the portion connected to the substrate is not in contact with other components.

6. The container has a recess in which the temperature sensor can be housed in a planar manner. A temperature sensor-integrated quartz oscillator according to any one of claims 1 to 5, characterized in that the substrate is connected to the container such that all or part of the height of the temperature sensor connected to the substrate is included in the recess.

7. The container has a recess for mounting the temperature sensor, The substrate is connected to the container such that all or part of the height of the temperature sensor connected to the substrate is included in the recess. A temperature sensor-integrated quartz oscillator according to any one of claims 1 to 5, characterized in that when the depth of the recess is d and the height of the temperature sensor is h, d ≤ h.

8. The container has a recess for mounting the temperature sensor, The substrate is connected to the container such that all or part of the height of the temperature sensor connected to the substrate is included in the recess. A temperature sensor-integrated quartz oscillator according to any one of claims 1 to 5, characterized in that when the depth of the recess is d and the height of the temperature sensor is h, d ≥ h.

9. The temperature sensor-integrated quartz oscillator according to claim 1, characterized in that the substrate is rectangular in plan view, and the second portion is at one end of the substrate in the direction of the long side, and when the width of the temperature sensor is represented as S, it is a region from 0.8S to 1.5S from that end.

10. The first portion is the other end of the substrate in the direction of the long side, and is a region from 1.5S to 3S from the end of the second portion, where S is the width of the temperature sensor, as described in claim 9, for a temperature sensor-integrated quartz oscillator.

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