Manufacturing method for dual IC cards

Abstract

This invention provides a method for manufacturing a dual IC card that can stabilize the electrical connection between the conductive wire and the connection terminal. [Solution] The method for manufacturing a dual IC card includes: an arrangement step of arranging an antenna 2 having a plurality of conductive wires 7 arranged in the radial direction on the first main surface of a sheet-like substrate; a pressing step of pressing the conductive wires with a pressing member having a flat pressing surface to embed at least a portion of the conductive wires 7 into the substrate; a cutting step of forming a housing recess 8 by cutting the substrate and cutting a portion of the conductive wires 7 to expose the cut surface 7a; and a connection step of arranging an IC module 3 in the housing recess 8 and electrically connecting the connection terminals and the cut surface 7a.

Description

Technical Field

[0001] The present invention relates to a method for manufacturing a dual IC card.

Background Art

[0002] Dual IC cards are used in financial cards such as credit cards and public cards such as my number cards. A dual IC card includes an IC module provided with an IC chip having contact and non-contact communication functions, and an antenna enabling non-contact communication (see, for example, Patent Document 1). <## <##

[0003] <## A dual IC card can be manufactured, for example, as follows. An antenna made of conductive wires is installed on the surface of a base material, and a recess is formed in the base material to expose the conductive wires. Next, an IC module is disposed in the recess, and a connection terminal of the IC module is electrically connected to the exposed conductive wires.<##

Prior Art Documents

Patent Documents

[0004] <## <##

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] <## However, in the above-described method for manufacturing a dual IC card, the electrical connection between the conductive wires of the antenna and the connection terminals of the IC module may become unstable. <## <##

[0006] <## One aspect of the present invention aims to provide a method for manufacturing a dual IC card capable of stabilizing the electrical connection between the conductive wires of the antenna and the connection terminals of the IC module. <##

Means for Solving the Problems

[0007] <## A method for manufacturing a dual IC card according to a first aspect of the present invention is a method for manufacturing a dual IC card comprising an IC module having an IC chip having contact-type and contactless communication functions and a substrate having connection terminals connected to the IC chip, comprising: an arrangement step of arranging an antenna having a plurality of conductive wires arranged in the radial direction on a first main surface of a sheet-like substrate; a pressing step of pressing the conductive wires with a pressing member having a flat pressing surface to embed at least a portion of the conductive wires into the substrate; a cutting step of forming a housing recess by cutting the substrate and cutting a portion of the conductive wires to expose the cut surface; and a connection step of arranging the IC module in the housing recess and electrically connecting the connection terminals and the cut surface.

[0008] A second aspect of the present invention is a method for manufacturing a dual IC card according to the first aspect, wherein in the pressing step, the entire conductive wire is embedded in the substrate.

[0009] A third aspect of the present invention is a method for manufacturing a dual IC card according to the first or second aspect, wherein in the pressing step, the conductive wire is pressed by the pressing member and deformed in the compression direction.

[0010] A fourth aspect of the present invention is a method for manufacturing a dual IC card according to any one of the first to third aspects, wherein a sheet-like auxiliary substrate is placed on the first main surface after the pressing step and prior to the cutting step. [Effects of the Invention]

[0011] According to one aspect of the present invention, a method for manufacturing a dual IC card can be provided that can stabilize the electrical connection between the conductive wires of the antenna and the connection terminals of the IC module. [Brief explanation of the drawing]

[0012] [Figure 1] This is a process diagram showing a method for manufacturing a dual IC card according to an embodiment. [Figure 2]It is a process diagram showing a method for manufacturing a dual IC card according to an embodiment. [Figure 3] It is a process diagram showing a method for manufacturing a dual IC card according to an embodiment. [Figure 4] It is a process diagram showing a method for manufacturing a dual IC card according to an embodiment. [Figure 5] It is a process diagram showing a method for manufacturing a dual IC card according to an embodiment. [Figure 6] It is a process diagram showing a method for manufacturing a dual IC card according to an embodiment. [Figure 7] It is a process diagram showing a method for manufacturing a dual IC card according to an embodiment. [Figure 8] It is a process diagram showing a method for manufacturing a dual IC card according to an embodiment. [Figure 9] It is a process diagram showing a method for manufacturing a dual IC card according to an embodiment. [Figure 10] It is a cross-sectional view of a dual IC card obtained by the method for manufacturing a dual IC card according to an embodiment. [Figure 11] It is a plan view of an antenna of a dual IC card obtained by the method for manufacturing a dual IC card according to an embodiment.

Embodiments for Carrying Out the Invention

[0013] Hereinafter, referring to the drawings, a method for manufacturing a dual IC card according to an embodiment will be specifically described.

[0014] [Dual IC Card] FIG. 10 is a cross-sectional view of a dual IC card 100 obtained by the manufacturing method according to the embodiment. FIG. 11 is a plan view of the antenna 2. As shown in FIG. 10, the dual IC card 100 includes a card substrate 1, an antenna 2, and an IC module 3.

[0015] The card substrate 1 is formed in a plate shape. The card substrate 1 is formed of a resin or the like. The card substrate 1 is, for example, rectangular in a plan view. The card substrate 1 includes a main substrate 4, a first surface layer 5, and a second surface layer 6.

[0016] The antenna 2 is formed by a conductive wire 7. The conductive wire 7 may be, for example, a metal wire or a coated wire obtained by applying an insulating coating to a metal wire. The metal wire is formed of a metal such as copper, a copper alloy, aluminum, or an aluminum alloy.

[0017] As shown in FIG. 11, for example, the antenna 2 has a meandering shape (a meander shape) in which the conductive wire 7 is formed. In the present embodiment, the conductive wire 7 has a first extending portion 7A, a second extending portion 7B, and a third extending portion 7C. The first to third extending portions 7A, 7B, and 7C are formed in straight lines parallel to each other. The antenna 2 has a meander shape by alternately connecting one end and the other end of adjacent extending portions.

[0018] The first extending portion 7A is the extending portion located innermost among the first to third extending portions 7A, 7B, and 7C. The second extending portion 7B is disposed adjacent to the first extending portion 7A. The third extending portion 7C is disposed adjacent to the second extending portion 7B. The first extending portion 7A, the second extending portion 7B, and the third extending portion 7C are arranged in the wire diameter direction (width direction) from the inside to the outside of the antenna 2. Two adjacent ones of the first to third extending portions 7A, 7B, and 7C may be in contact with each other or may be arranged with a gap therebetween.

[0019] As shown in FIG. 10, the first surface layer 5 is formed on one surface (the first main surface 4a) of the main substrate 4. The second surface layer 6 is formed on the second main surface 4b opposite to the first main surface 4a of the main substrate 4. The first surface layer 5 and the second surface layer 6 are, for example, transparent.

[0020] The IC module 3 is located inside a housing recess 8 formed in the card substrate 1. The IC module 3 has both contact-type and contactless communication functions. The IC module 3 comprises a substrate 31 and an IC chip section 32. A connection terminal 33 is formed on the opposing surface 31a of the substrate 31. The connection terminal 33 is electrically connected to the antenna 2.

[0021] The IC chip portion 32 is provided on the opposing surface 31a of the substrate 31. The IC chip portion 32 protrudes downward from the opposing surface 31a of the substrate 31. The IC chip portion 32 has an IC chip 34 and a sealing portion 35 that covers the IC chip 34.

[0022] The IC chip 34 has both a contact interface and a non-contact interface. The IC chip 34 is electrically connected to the connection terminal 33, for example, by bonding wires 36. The sealing portion 35 is formed of resin or the like. The IC chip portion 32 is smaller than the substrate 31 in a plan view.

[0023] [Manufacturing method for dual IC cards] A method for manufacturing a dual IC card 100 according to an embodiment will be described with reference to Figures 1 to 10. In the following description, the vertical positional relationship will be tentatively defined according to Figure 1. In Figure 1, the vertical direction is the thickness direction (height direction) of the base material 10. A plan view is a view from the thickness direction of the base material 10.

[0024] (1st process: placement process) As shown in Figure 1, a sheet-like substrate 10 is prepared. One side of the substrate 10 (the top surface in Figure 1) is the first main surface 10a. The other side of the substrate 10 (the bottom surface in Figure 1) is the second main surface 10b. The substrate 10 is formed of, for example, a resin. The substrate 10 is formed of a thermoplastic resin such as polyvinyl chloride (PVC), glycol-modified polyethylene terephthalate (PETG), or polycarbonate (PC).

[0025] An antenna 2 is placed on the first main surface 10a of the base material 10. The antenna 2 is formed by a conductive wire 7. The conductive wire 7 has a meander shape. In this embodiment, the conductive wire 7 has a first extension portion 7A, a second extension portion 7B, and a third extension portion 7C. The first to third extension portions 7A, 7B, and 7C extend in a direction perpendicular to the plane of the paper in Figure 1. The antenna 2 has a meander shape by alternately connecting one end and the other end of adjacent extension portions.

[0026] The conductive wire 7 may be partially embedded in the base material 10. In this embodiment, the portion of the conductive wire 7 including the lowest part is located in a recess 10c formed in the first main surface 10a of the base material 10. The upper part of the conductive wire 7 protrudes upward from the first main surface 10a. To embed a portion of the conductive wire 7 in the base material 10, for example, the conductive wire 7 is pressed against the base material 10 that has been softened by heating. Note that the conductive wire 7 does not have to be embedded in the base material 10.

[0027] The first extension portion 7A is the innermost extension portion among the first to third extension portions 7A, 7B, and 7C. The second extension portion 7B is positioned adjacent to the first extension portion 7A. The third extension portion 7C is positioned adjacent to the second extension portion 7B. The first extension portion 7A, the second extension portion 7B, and the third extension portion 7C are aligned radially from the inside to the outside of the antenna 2.

[0028] Two adjacent extensions of the first to third extensions 7A, 7B, and 7C may be in contact with each other or spaced apart. Two or more of the first to third extensions 7A, 7B, and 7C may be at different heights relative to the base material 10.

[0029] (Second process: Pressing process) As shown in Figure 2, a flat pressing member 20 is prepared. The pressing surface 20a (bottom surface) of the pressing member 20 is formed flat. The pressing member 20 is sized to encompass the entire antenna 2 in a plan view, for example. The pressing member 20 is made of a metal such as stainless steel or aluminum alloy.

[0030] As shown in Figure 3, the pressing member 20 is lowered in a position where the pressing surface 20a is parallel to the first main surface 10a. The pressing member 20 is heated to a temperature at which the base material 10 softens. The pressing surface 20a contacts the conductive wire 7, which is located at a higher position, and presses the conductive wire 7 downward (in the thickness direction of the base material 10). When the base material 10 is softened by heating, the conductive wire 7 pressed by the pressing member 20 moves downward so that its embedding depth into the base material 10 increases.

[0031] As the conductive wire 7, which is positioned higher, moves downward, the height positions of the conductive wires 7 (first to third extensions 7A, 7B, 7C) are aligned. It is desirable that all conductive wires 7 be at the same height. The conductive wires 7 (first to third extensions 7A, 7B, 7C) are aligned in a direction parallel to the first main surface 10a.

[0032] In this embodiment, a portion of the conductive wire 7 (extended portions 7A, 7B, 7C) (for example, the portion excluding the uppermost part) is embedded in the base material 10. It is preferable that the entire conductive wire 7 is embedded in the base material 10. In that case, the height of the uppermost part of the conductive wire 7 is the same as the height of the first main surface 10a.

[0033] The conductive wire 7 (extended portions 7A, 7B, 7C) may be deformed in the compression direction by the pressure applied by the pressing member 20. For example, a portion of the upper surface of the conductive wire 7 pressed by the pressing member 20 may become nearly flat. The conductive wire 7 may also become, for example, an elliptical shape having a major axis parallel to the pressing surface 20a.

[0034] A sheet-like second auxiliary substrate 12 may be placed on the second main surface 10b of the substrate 10.

[0035] (Step 3: Formation of auxiliary substrate and surface layer) As shown in Figure 4, a sheet-like first auxiliary substrate 11 is placed on the first main surface 10a of the base material 10. The first auxiliary substrate 11 and the second auxiliary substrate 12 can be collectively referred to as auxiliary substrates 11 and 12. The formation of the auxiliary substrates 11 and 12 makes it less likely for the antenna 2 to fall off the base material 10.

[0036] The auxiliary substrates 11 and 12 are formed from thermoplastic resins such as PVC, PETG, or PC. The auxiliary substrates 11 and 12 are heat-fused to the substrate 10, for example. If the auxiliary substrates 11 and 12 are formed from the same material as the substrate 10, the auxiliary substrates 11 and 12 and the substrate 10 will be more easily heat-fused. The auxiliary substrates 11 and 12 may also be bonded to the substrate 10 by an adhesive layer. The adhesive layer can be formed by known coating methods, such as roll coating or gravure coating.

[0037] As shown in Figure 5, the base material 10 and auxiliary base materials 11, 12 are integrated by heating and pressing them. For example, the base material 10 and auxiliary base materials 11, 12 can be integrated by heating and pressing them in the thickness direction using a pressing member 20 (see Figure 3). This forms a composite base material 13 in which the base material 10 and auxiliary base materials 11, 12 are integrated.

[0038] As shown in Figure 6, a third auxiliary substrate 14 is laminated onto the first main surface 13a (top surface) of the composite substrate 13. A fourth auxiliary substrate 15 is laminated onto the second main surface 13b (bottom surface) of the composite substrate 13. The third auxiliary substrate 14 and the fourth auxiliary substrate 15 can be collectively referred to as auxiliary substrates 14 and 15. The auxiliary substrates 14 and 15 are provided, for example, for adjusting the thickness of the dual IC card 100.

[0039] The auxiliary substrates 14 and 15 are formed from thermoplastic resins such as PVC, PETG, or PC. The auxiliary substrates 14 and 15 are heat-fused to the composite substrate 13, for example. If the auxiliary substrates 14 and 15 are formed from the same material as the composite substrate 13, the auxiliary substrates 14 and 15 and the composite substrate 13 will be more easily heat-fused. The auxiliary substrates 14 and 15 may also be bonded to the composite substrate 13 by an adhesive layer. The adhesive layer can be formed by known coating methods, such as roll coating or gravure coating.

[0040] A first surface layer 5 is formed on the first main surface 14a (upper surface) of the third auxiliary substrate 14. A second surface layer 6 is formed on the second main surface 15b (lower surface) of the fourth auxiliary substrate 15. The first surface layer 5 and the second surface layer 6 can be collectively referred to as surface layers 5 and 6. Surface layers 5 and 6 are formed transparently. Surface layers 5 and 6 are formed from thermoplastic resins such as PETG and PC. Surface layers 5 and 6 are heat-fused to the auxiliary substrates 14 and 15, respectively. If surface layers 5 and 6 are formed from the same material as the auxiliary substrates 14 and 15, heat-fusion between the surface layers 5 and 6 and the auxiliary substrates 14 and 15 becomes easier. Surface layers 5 and 6 may also be bonded to the auxiliary substrates 14 and 15 by an adhesive layer. The adhesive layer can be formed by known coating methods, such as the roll coating method or the gravure coating method.

[0041] The surface layers 5 and 6 have a display layer (not shown) formed, for example, by printing. The display layer can represent, for example, characters, symbols, figures, patterns, colors, or a combination of two or more of these.

[0042] As shown in Figure 7, the composite substrate 13, auxiliary substrates 14, 15, and surface layers 5, 6 are integrated by heating and pressing them. For example, the composite substrate 13, auxiliary substrates 14, 15, and surface layers 5, 6 can be integrated by heating and pressing them in the thickness direction using a pressing member 20 (see Figure 3). As a result, the composite substrate 13 and auxiliary substrates 14, 15 are integrated to form the main substrate 4. The thickness of the main substrate 4 is preferably twice or more the diameter of the conductive wire 7.

[0043] The surface layers 5 and 6 are integrated with the main substrate 4. The main substrate 4 and the surface layers 5 and 6 are integrated to form the card substrate 1.

[0044] (4th process: cutting process) As shown in Figure 8, a receiving recess 8 is formed on the first main surface 1a (top surface) of the card base material 1 by cutting. The receiving recess 8 is a two-stage recess having a first recess 21 and a second recess 22. The cutting process may be, for example, milling.

[0045] The first recess 21 is located in a position that overlaps with at least a portion of the antenna 2 in a plan view. In this embodiment, the first recess 21 is located in a position that overlaps with the first and second extension portions 7A and 7B in a plan view. The shape of the first recess 21 in a plan view may be, for example, a shape corresponding to the antenna 2. The first recess 21 may be, for example, rectangular.

[0046] The bottom surface 21a of the first recess 21 is higher than the lowest part of the conductive wire 7 and lower than the highest part of the conductive wire 7. Therefore, the upper part of the conductive wire 7 (extended portions 7A, 7B) is cut off by the formation of the first recess 21, and the metal wire of the cut surface 7a is exposed. The conductive wire 7 (extended portions 7A, 7B) formed in the first recess 21 has a smaller height dimension compared to the other conductive wire 7 (extended portion 7C). The cut surface 7a of the conductive wire 7 is flush with the bottom surface 21a. The cut surface 7a of the conductive wire 7 becomes the connection portion 23 that connects to the IC module 3. The bottom surface 21a is parallel to the first main surface 1a.

[0047] The second recess 22 is formed on the bottom surface 21a of the first recess 21. In a plan view, the area of ​​the second recess 22 is smaller than that of the first recess 21. In a plan view, the second recess 22 is located inward relative to the periphery of the first recess 21. The bottom surface 22a of the second recess 22 is located lower than the conductive wire 7. For example, in a plan view, the second recess 22 is located in a position that overlaps with a part of the first extension portion 7A.

[0048] As shown in Figure 9, the IC module 3 has both contact-type and contactless communication functions. The IC module 3 comprises a substrate 31 and an IC chip portion 32. The substrate 31 is an insulating substrate made of, for example, resin, fiber-reinforced resin, etc. The opposing surface 31a (bottom surface) of the substrate 31 is formed flat.

[0049] A connection terminal 33 is formed on the opposing surface 31a of the substrate 31. At least a portion of the connection terminal 33 is formed on the portion of the opposing surface 31a that faces the bottom surface 21a. It is desirable that the thickness of the substrate 31 is equal to the depth of the first recess 21.

[0050] The IC chip section 32 is provided on the opposing surface 31a of the substrate 31. The IC chip section 32 protrudes downward from the opposing surface 31a of the substrate 31. The IC chip section 32 includes an IC chip 34 and a sealing section 35 that covers the IC chip 34. The IC chip 34 has a contact interface and a non-contact interface.

[0051] The IC chip 34 is electrically connected to a connection terminal 33 formed on the opposing surface 31a, for example, by a bonding wire 36. The sealing portion 35 is formed of resin or the like. The IC chip portion 32 is smaller than the substrate 31 in a plan view. The IC chip portion 32 is formed, for example, in the portion of the opposing surface 31a that includes the center.

[0052] (Step 5: Connection Step) As shown in Figure 10, the IC module 3 is placed in the housing recess 8. The substrate 31 is housed in the first recess 21. It is desirable that the upper surface 31b of the substrate 31 be flush with the first main surface 1a (upper surface) of the card base material 1. The IC chip portion 32 is housed in the second recess 22.

[0053] The opposing surface 31a of the substrate 31 faces the bottom surface 21a of the first recess 21. The opposing surface 31a is bonded to the bottom surface 21a (see Figure 9) by an adhesive layer 37. The adhesive layer 37 is formed from, for example, ACP (Anisotropic Conductive Paste) or ACF (Anisotropic Conductive Film). The adhesive layer 37 is made conductive by conductive particles, such as metal particles.

[0054] The connection terminal 33 formed on the substrate 31 is electrically connected to the cut surface 7a (connection portion 23) of the conductive wire 7 via the adhesive layer 37.

[0055] [Effects of the manufacturing method for dual IC cards according to this embodiment] According to the manufacturing method of the dual IC card 100 of this embodiment, in the pressing process, the conductive wire 7 is pressed with a pressing member 20 having a flat pressing surface 20a, thereby suppressing variations in the height of the conductive wire 7 (extended portions 7A, 7B, 7C) and aligning the height positions of the conductive wire 7 (extended portions 7A, 7B, 7C). As a result, the area of ​​the cutting surface 7a can be increased. Consequently, the connection characteristics of all conductive wires 7 (extended portions 7A, 7B, 7C) with the connection terminal 33 can be improved. Thus, the electrical connection between the conductive wire 7 and the connection terminal 33 can be stabilized.

[0056] In the pressing process, by embedding the entire conductive wire 7 into the base material 10, the height of the uppermost part of the conductive wire 7 (extended portions 7A, 7B, 7C) can be made the same height as the first main surface 10a. Therefore, the height positions of the conductive wire 7 (extended portions 7A, 7B, 7C) can be precisely aligned. Thus, the electrical connection between the conductive wire 7 and the connection terminal 33 can be stabilized.

[0057] During the pressing process, when the conductive wire 7 is deformed in the compression direction by the pressing member 20, the width of the cutting surface 7a can be increased. This improves the connection characteristics between the conductive wire 7 and the connection terminal 33. Therefore, the electrical connection between the conductive wire 7 and the connection terminal 33 can be stabilized.

[0058] As shown in Figure 4, if the first auxiliary substrate 11 is formed on the first main surface 10a of the substrate 10 after the pressing process and prior to the cutting process, the antenna 2 becomes less likely to fall off the substrate 10.

[0059] Although embodiments of the present invention have been described above, the configurations and combinations thereof in the embodiments are merely examples, and additions, omissions, substitutions, and other modifications to the configurations are possible without departing from the spirit of the present invention. For example, the formation of the first auxiliary substrate 11 shown in Figure 4 can be carried out in any step from the pressing step to the cutting step. [Explanation of Symbols]

[0060] 2…Antenna, 3…IC module, 7…Conductive wire, 7a…Cut surface, 8…Receiving recess, 10…Base material, 10a…First main surface, 11…First auxiliary base material (auxiliary base material), 20…Pressing member, 20a…Pressing surface, 100…Dual IC card

Claims

1. A method for manufacturing a dual IC card comprising an IC module having an IC chip having contact-type and contactless communication functions and a substrate having connection terminals connected to the IC chip, A placement step involves arranging an antenna having multiple conductive wires arranged in the radial direction on the first main surface of a sheet-like substrate, A pressing step in which the conductive wire is pressed with a pressing member having a flat pressing surface to embed at least a portion of the conductive wire into the base material, A cutting process is performed to form a housing recess by cutting the substrate, and to cut a portion of the conductive wire to expose the cut surface, A connection step involves placing the IC module in the housing recess and electrically connecting the connection terminals to the cut surface, A method for manufacturing a dual IC card having the following characteristics.

2. In the aforementioned pressing process, The entire conductive wire is embedded in the substrate. A method for manufacturing an IC card according to claim 1.

3. In the aforementioned pressing process, The pressing member presses the conductive wire and deforms it in the compression direction. A method for manufacturing an IC card according to claim 1.

4. After the pressing process and prior to the cutting process, a sheet-like auxiliary substrate is placed on the first main surface. A method for manufacturing an IC card according to claim 1.

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