Sensor module

Abstract

To provide a sensor module that can be made lower in profile. [Solution] The sensor module comprises a sensor substrate having a circuit board and an inertial sensor mounted on the circuit board; a package having a first surface and a second surface that are in a front-back relationship and a side surface connecting the first surface and the second surface, and housing the sensor substrate inside; and a flexible wiring portion electrically connected to the sensor substrate and extending out of the package from the side surface, wherein the package has a protrusion that protrudes from the first surface and engages with an object.

Description

Technical Field

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[0001] The present invention relates to a sensor module.

Background Art

[0002] The inertial measurement device described in Patent Document 1 includes an inner case, a circuit board mounted on the lower surface of the inner case, and an outer case that covers the inner case and houses the circuit board between the inner case and itself. Further, a Z-axis angular velocity sensor, a three-axis acceleration sensor, and a plug-type connector are mounted on the upper surface of the circuit board, a microcontroller is mounted on the lower surface of the circuit board, and an X-axis angular velocity sensor and a Y-axis angular velocity sensor are mounted on the side surface of the circuit board.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, in the inertial measurement device of Patent Document 1, since the plug-type connector is arranged in a posture standing upright with respect to the circuit board, it is difficult to reduce the height of the entire device.

Means for Solving the Problems

[0005] The sensor module of the present invention includes a sensor substrate having a circuit board and an inertial sensor mounted on the circuit board, a package having a first surface and a second surface in a front-back relationship and a side surface connecting the first surface and the second surface, and housing the sensor substrate inside, and a flexible wiring portion electrically connected to the sensor substrate and extending out of the package from the side surface. The package has a protrusion that extends from the first surface and engages with an object. [Brief explanation of the drawing]

[0006] [Figure 1] This is a perspective view showing a sensor module according to the first embodiment. [Figure 2] This is a disassembled perspective view of the sensor module. [Figure 3] This is a bottom view of the sensor module. [Figure 4] This is a top view of the sensor board. [Figure 5] This is a cross-sectional view of an accelerometer. [Figure 6] This is a plan view showing an angular velocity sensor. [Figure 7] This is a schematic diagram showing the operating state of the angular velocity sensor. [Figure 8] This is a schematic diagram showing the operating state of the angular velocity sensor. [Figure 9] This is a cross-sectional view showing the sensor module mounted on a circuit board. [Figure 10] This is a top view showing a modified example of a flexible wiring section. [Figure 11] This is a top view showing a modified example of a flexible wiring section. [Figure 12] This is a perspective view of the sensor module according to the second embodiment. [Figure 13] This is a cross-sectional view of the sensor module. [Figure 14] This is a cross-sectional view of a sensor module according to the third embodiment. [Figure 15] This is a bottom view of the sensor module. [Figure 16] This is a bottom view showing a modified version of the sensor module. [Figure 17] This is a bottom view showing a modified version of the sensor module. [Figure 18] This is a bottom view of the sensor module according to the fourth embodiment. [Figure 19] This is a cross-sectional view of a sensor module according to the fifth embodiment. [Figure 20] It is a cross-sectional view showing a modified example of the sensor module.

Embodiments for Carrying Out the Invention

[0007] Hereinafter, the sensor module of the present invention will be described in detail based on the embodiments shown in the accompanying drawings. For convenience of explanation, in each figure except FIGS. 6 to 8, three mutually orthogonal axes are illustrated as the X-axis, Y-axis, and Z-axis. Further, hereinafter, for convenience of explanation, the direction parallel to the X-axis is also referred to as the "X-axis direction", the direction parallel to the Y-axis is also referred to as the "Y-axis direction", and the direction parallel to the Z-axis is also referred to as the "Z-axis direction". Also, the arrow side of each axis is also referred to as the "plus side", and the opposite side is also referred to as the "minus side". Further, the arrow side in the Z-axis direction is also referred to as "up", and the opposite side is also referred to as "down".

[0008] <First Embodiment> FIG. 1 is a perspective view showing a sensor module according to the first embodiment. FIG. 2 is an exploded perspective view of the sensor module. FIG. 3 is a bottom view of the sensor module. FIG. 4 is a top view of the sensor substrate. FIG. 5 is a cross-sectional view of the acceleration sensor. FIG. 6 is a plan view showing the angular velocity sensor. FIGS. 7 and 8 are schematic views showing the driving states of the angular velocity sensor, respectively. FIG. 9 is a cross-sectional view showing a state where the sensor module is mounted on a mounting substrate. FIGS. 10 and 11 are top views showing modified examples of the flexible wiring portion, respectively.

[0009] The sensor module 1 shown in FIG. 1 is an inertial measurement unit (IMU) that independently measures the angular velocity around each of the X-axis, Y-axis, and Z-axis and the acceleration in the direction of each of the X-axis, Y-axis, and Z-axis. Such a sensor module 1 includes a package 2, a sensor substrate 3 housed in the package 2, and a flexible wiring portion 4 that is electrically connected to the sensor substrate 3 and extends from the package 2. [[ID=​​​As shown in FIG. 1, the package 2 is cubic and has a lower surface 2a as the first surface in the front-back relationship and an upper surface 2b as the second surface, and a frame-shaped side surface 2c connecting the lower surface 2a and the upper surface 2b. Since the lower surface 2a is constituted by the X-Y plane, the "plan view from the Z-axis direction" frequently used below has the same meaning as the "plan view of the lower surface 2a".

[0011] Also, as shown in FIG. 2, the package 2 has an inner case 22 and an outer case 23. The outer case 23 is covered over the inner case 22 from above. In such a package 2, the lower surface 2a is constituted by the inner case 22, and the upper surface 2b is constituted by the outer case 23.

[0012] The inner case 22 and the outer case 23 are each made of aluminum (Al). Thereby, the package 2 having high rigidity is obtained. In particular, in the present embodiment, by subjecting the surfaces of the inner case 22 and the outer case 23 to anodizing treatment respectively, the package 2 is provided with insulation. However, the constituent materials of the inner case 22 and the outer case 23 are not particularly limited, and for example, they may be made of metal materials such as titanium, magnesium, stainless steel, or ceramics such as alumina and titania.

[0013] The inner case 22 has a mounting table 221 erected along its edge portion on which the sensor substrate 3 is mounted. The inner case 22 is also erected so as to project above the mounting table 221 and has a plurality of positioning protrusions 222 for positioning the sensor substrate 3 with respect to the mounting table 221. Also, as shown in FIG. 3, the inner case 22 has a columnar convex portion 223 protruding from the lower surface 2a. The convex portion 223 is located on the plus side in the Y-axis direction with respect to the center O of the lower surface 2a. That is, the convex portion 223 is located on the side opposite to the flexible wiring portion 4 with respect to the center O. In the present embodiment, the planar shape of the convex portion 223 is circular, but it is not limited thereto, and it may be square, triangular, irregular, or the like.

[0014] As shown in Figure 2, the outer case 23 is a rectangular box-shaped body with a recess opening on its bottom surface. The outer case 23 is placed over the inner case 22 from above by inserting the inner case 22 into the recess. The inner case 22 and the outer case 23 are then bonded and fixed together by an adhesive (not shown). However, the method of fixing the inner case 22 and the outer case 23 is not particularly limited, and for example, they may be fixed by screwing.

[0015] The above describes Package 2, but the configuration of Package 2 is not particularly limited.

[0016] ≪Sensor board 3≫ As shown in Figure 4, the sensor board 3 includes a circuit board 5, an acceleration sensor 6 as an inertial sensor, an X-axis angular velocity sensor 7X, a Y-axis angular velocity sensor 7Y, and a Z-axis angular velocity sensor 7Z, and a circuit element 8.

[0017] The circuit board 5 is made of a rigid substrate, such as a multilayer glass epoxy substrate. The circuit board 5 is fixed to the upper surface of the mounting base 221 via an adhesive (not shown). However, the method of fixing the circuit board 5 to the upper surface of the mounting base 221 is not particularly limited, and it may be fixed by screwing, for example.

[0018] As shown in Figure 4, the acceleration sensor 6 is mounted on the top surface of the circuit board 5, facing the positive side of the Z-axis direction. The acceleration sensor 6 is a 3-axis acceleration sensor that can independently detect acceleration in the X-axis direction (Ax), the Y-axis direction (Ay), and the Z-axis direction (Az).

[0019] As shown in Figure 5, the acceleration sensor 6 has a package 61 and sensor elements 62x, 62y, and 62z housed in the package 61. It is electrically connected to the circuit board 5 via connection terminals (not shown) located on the package 61.

[0020] Sensor element 62x is an element that detects acceleration Ax in the X-axis direction, sensor element 62y is an element that detects acceleration Ay in the Y-axis direction, and sensor element 62z is an element that detects acceleration Az in the Z-axis direction. Although not shown in the figures, these sensor elements 62x, 62y, and 62z are silicon MEMS vibration elements having a fixed electrode fixed to the package 61 and a movable electrode that is variable relative to the package 61. In such sensor elements 62x, 62y, and 62z, when acceleration in the detection axis direction is received, the movable electrode is displaced relative to the fixed electrode, and the capacitance formed between the fixed electrode and the movable electrode changes accordingly. Therefore, the change in capacitance of sensor elements 62x, 62y, and 62z can be extracted as a detection signal, and the acceleration in each axis direction can be determined based on the extracted detection signal.

[0021] The acceleration sensor 6 has been described above, but the configuration of the acceleration sensor 6 is not particularly limited. For example, a configuration using quartz oscillators as the sensor elements 62x, 62y, and 62z is also possible.

[0022] As shown in Figure 4, the X-axis angular velocity sensor 7X is mounted on the side of the circuit board 5, facing the positive side in the X-axis direction. The X-axis angular velocity sensor 7X detects the angular velocity ωx around the X-axis. The Y-axis angular velocity sensor 7Y is mounted on the side of the circuit board 5, facing the positive side in the Y-axis direction. The Y-axis angular velocity sensor 7Y detects the angular velocity ωy around the Y-axis. The Z-axis angular velocity sensor 7Z is mounted on the top surface of the circuit board 5, facing the positive side in the Z-axis direction. The Z-axis angular velocity sensor 7Z detects the angular velocity ωz around the Z-axis.

[0023] As shown in Figure 6, the X-axis angular velocity sensor 7X, the Y-axis angular velocity sensor 7Y, and the Z-axis angular velocity sensor 7Z each have a package 71 and a sensor element 72 housed in the package 71. They are electrically connected to the circuit board 5 via connection terminals (not shown) located on the package 71.

[0024] The sensor element 72 is, for example, a quartz crystal oscillator and has a base 720, four drive vibration arms 722, and two detection vibration arms 721. In such a sensor element 72, as shown in Figure 7, when a drive signal is applied to drive the drive vibration arms 722 and an angular velocity ω around the detection axis J is applied, the detection vibrations are excited by the Coriolis force, as shown in Figure 8. The charge generated in the detection vibration arms 721 by the detection vibrations is then extracted as a detection signal, and the angular velocity ω can be determined based on the extracted detection signal.

[0025] The configurations of the X-axis angular velocity sensor 7X, Y-axis angular velocity sensor 7Y, and Z-axis angular velocity sensor 7Z have been summarized above. The X-axis angular velocity sensor 7X is positioned so that its detection axis J is aligned with the X-axis, the Y-axis angular velocity sensor 7Y is positioned so that its detection axis J is aligned with the Y-axis, and the Z-axis angular velocity sensor 7Z is positioned so that its detection axis J is aligned with the Z-axis. As a result, the X-axis angular velocity sensor 7X can detect angular velocity ωx, the Y-axis angular velocity sensor 7Y can detect angular velocity ωy, and the Z-axis angular velocity sensor 7Z can detect angular velocity ωz.

[0026] However, the configuration of the X-axis angular velocity sensor 7X, the Y-axis angular velocity sensor 7Y, and the Z-axis angular velocity sensor 7Z is not particularly limited. For example, the sensor element 72 may be a silicon MEMS vibration element.

[0027] As shown in Figure 4, the circuit element 8 is mounted on the underside of the circuit board 5. The circuit element 8 is electrically connected to the acceleration sensor 6, the X-axis angular velocity sensor 7X, the Y-axis angular velocity sensor 7Y, and the Z-axis angular velocity sensor 7Z via the circuit board 5. Such a circuit element 8 is, for example, an MCU (Micro Controller Unit) that comprehensively controls each part of the sensor module 1. Specifically, the circuit element 8 has a control circuit that controls the driving of the acceleration sensor 6, the X-axis angular velocity sensor 7X, the Y-axis angular velocity sensor 7Y, and the Z-axis angular velocity sensor 7Z via the circuit board 5, and an interface circuit that communicates with the outside.

[0028] The control circuit controls the driving of the accelerometer 6, the X-axis angular velocity sensor 7X, the Y-axis angular velocity sensor 7Y, and the Z-axis angular velocity sensor 7Z. Based on the detection signal output from the accelerometer 6, it detects acceleration Ax, Ay, and Az, and based on the detection signals output from the X-axis, Y-axis, and Z-axis angular velocity sensors 7X, 7Y, and 7Z, it detects angular velocity ωx, ωy, and ωz. The interface circuit transmits and receives signals, accepts commands from the outside, and outputs the detected acceleration Ax, Ay, Az and angular velocity ωx, ωy, and ωz to the outside.

[0029] The sensor board 3 has been described above, but its configuration is not particularly limited. For example, in this embodiment, the inertial sensors include an acceleration sensor 6, an X-axis angular velocity sensor 7X, a Y-axis angular velocity sensor 7Y, and a Z-axis angular velocity sensor 7Z, but it is not limited to this, and it is sufficient to have at least one inertial sensor.

[0030] ≪Flexible wiring section 4≫ As shown in Figures 2 and 4, the flexible wiring section 4 is electrically connected to the circuit board 5 and has the function of electrically connecting the circuit board 5 to the mounting board 91. Such a flexible wiring section 4 is a flexible wiring and is made of, for example, a flexible substrate. In particular, in this embodiment, the circuit board 5 and the flexible wiring section 4 are integrally formed by a rigid-flexible substrate, which is formed by connecting a rigid substrate that will become the circuit board 5 and a flexible substrate that will become the flexible wiring section 4. This simplifies the device configuration of the sensor module 1. Furthermore, since the circuit board 5 and the flexible wiring section 4 can be connected without using parts such as connectors, the number of parts can be reduced, and the sensor module 1 can be made smaller and lighter.

[0031] This flexible wiring section 4 is connected to the negative Y-axis end of the circuit board 5 and extends out of the package 2 from the side surface 2c of the package 2 that faces the negative Y-axis. A connector 41 is attached to the free end of the flexible wiring section 4, and it is connected to an external device via this connector 41.

[0032] The configuration of the sensor module 1 has been described above. Such a sensor module 1 is mounted on a mounting board 91 as shown in Figure 9. As shown in Figure 2, the mounting board 91 has a circuit board 92 and a connector 93 mounted on the upper surface of the circuit board 92. The circuit board 92 also has a recess 921 into which a protrusion 223 protruding from the lower surface 2a of the package 2 engages.

[0033] First, the connector 41 provided on the flexible wiring section 4 is connected to the connector 93 on the mounting board 91. This electrically connects the sensor module 1 and the mounting board 91. Next, the sensor module 1 is placed on the upper surface of the circuit board 92 with its lower surface 2a facing the mounting board 91, and the protrusion 223 is engaged with the recess 921. This fixes the sensor module 1 to the circuit board 92. The protrusion 223 may be bonded and fixed to the recess 921 with an adhesive. Alternatively, the protrusion 223 may be fixed to the recess 921 by press-fitting it into the recess 921.

[0034] With the above steps, the mounting of the sensor module 1 onto the mounting board 91 is completed. With this configuration, the sensor module 1 is fixed to the mounting board 91 at two locations: the connector 41 and the protrusion 223. Therefore, the sensor module 1 can be fixed to the mounting board 91 in a stable position.

[0035] Furthermore, in this embodiment, the protrusion 223 is positioned on the opposite side of the flexible wiring section 4 from the center O. In other words, while the flexible wiring section 4 is positioned on the negative side of the Y-axis relative to the center O, the protrusion 223 is positioned on the positive side of the Y-axis relative to the center O. With this configuration, the two points fixed to the mounting substrate 91 can be spaced as far apart as possible, increasing the mounting stability of the sensor module 1.

[0036] In this embodiment, the connector 41 attached to the tip of the flexible wiring section 4 is electrically connected to the connector 93 on the mounting board 91. However, the embodiment is not limited to this. For example, as shown in Figure 10, the connector 41 may be omitted from the tip of the flexible wiring section 4, and the tip of the flexible wiring section 4 may be directly connected to the connector 93. Alternatively, as shown in Figure 11, a rigid board 42 may be placed at the tip of the flexible wiring section 4 instead of the connector 41, and the rigid board 42 may be connected to the connector 93.

[0037] The sensor module 1 has been described above. As previously mentioned, the sensor module 1 includes a circuit board 5, a sensor board 3 having an acceleration sensor 6, an X-axis angular velocity sensor 7X, a Y-axis angular velocity sensor 7Y, and a Z-axis angular velocity sensor 7Z mounted on the circuit board 5 as inertial sensors, a package 2 having a first surface, which is a bottom surface 2a, and a second surface, which is an top surface 2b, which are in a front-back relationship, and a side surface 2c connecting the bottom surface 2a and the top surface 2b, and housing the sensor board 3 inside, and a flexible wiring section 4 that is electrically connected to the sensor board 3 and extends out of the package 2 from the side surface 2c. The package 2 also has a protrusion 223 that protrudes from the bottom surface 2a and engages with the mounting substrate 91, which is the target object. With this configuration, the sensor module 1 can be electrically connected to the mounting substrate 91 via the flexible wiring section 4. Therefore, it is not necessary to mount a connector on the circuit board 5 as in the conventional method. In this way, the mounting of a connector on the circuit board 5 is eliminated, and furthermore, by extending the flexible wiring section 4 to the outside from the side 2c of the package 2, the height of the sensor module 1 can be reduced.

[0038] Furthermore, as mentioned above, the circuit board 5 and the flexible wiring section 4 are composed of a rigid-flexible circuit board, which has a rigid circuit board 5 and a flexible circuit board 4. This configuration simplifies the device configuration of the sensor module 1. In addition, since the circuit board 5 and the flexible wiring section 4 can be electrically connected without using components such as connectors, the number of components can be reduced, and the sensor module 1 can be made lower profile and lighter.

[0039] <Second Embodiment> Figure 12 is a perspective view of the sensor module according to the second embodiment. Figure 13 is a cross-sectional view of the sensor module.

[0040] The sensor module 1 of this embodiment is the same as that of the first embodiment described above, except that the configuration of the flexible wiring section 4 is different. In the following description, this embodiment will be described mainly in terms of the differences from the first embodiment described above, and similar matters will not be described. Also, in the figures of this embodiment, the same reference numerals are used for components that are the same as those in the previously described embodiment.

[0041] As shown in Figures 12 and 13, in the sensor module 1 of this embodiment, a screw insertion hole 43 is formed in the flexible wiring section 4 through which a screw N is inserted. In addition, in the mounting substrate 91, a screw hole 922 is formed in the circuit board 92 into which a screw N is screwed.

[0042] As shown in Figure 13, in this configuration, the sensor module 1 is mounted on the mounting substrate 91 in the same manner as in the first embodiment described above, and then the sensor module 1 is fixed to the circuit board 92 by fastening screws N inserted through screw insertion holes 43 into screw holes 922. By fixing the sensor module 1 using screws N in this way, the mounting stability of the sensor module 1 is increased. In addition, since the flexible wiring section 4 is fixed to the mounting substrate 91 by screws N, unwanted vibrations of the flexible wiring section 4 can be effectively suppressed.

[0043] As described above, in the sensor module 1 of this embodiment, the flexible wiring section 4 has a screw insertion hole 43 and is fixed to the mounting substrate 91 by a screw N inserted through the screw insertion hole 43. With this configuration, the mounting stability of the sensor module 1 is increased. In addition, since the flexible wiring section 4 is fixed to the mounting substrate 91 by the screw N, unwanted vibrations of the flexible wiring section 4 can be effectively suppressed.

[0044] This second embodiment can also achieve the same effects as the first embodiment described above.

[0045] <Third Embodiment> Figure 14 is a cross-sectional view of the sensor module according to the third embodiment. Figure 15 is a bottom view of the sensor module. Figures 16 and 17 are bottom views showing modified versions of the sensor module, respectively.

[0046] The sensor module 1 of this embodiment is the same as that of the first embodiment described above, except for the configuration of the package 2, specifically the number of protrusions 223. In the following description, this embodiment will focus on the differences from the first embodiment described above, and similar matters will not be explained. Also, in the figures of this embodiment, components the same as those in the previously described embodiment are denoted by the same reference numerals.

[0047] As shown in Figure 14, in the sensor module 1 of this embodiment, the package 2 has a plurality of protrusions 223 that project from the lower surface 2a. On the other hand, the mounting substrate 91 has a plurality of recesses 921 formed therein that engage with each of the protrusions 223. When the sensor module 1 is mounted on the mounting substrate 91, each protrusion 223 engages with the corresponding recess 921. In this way, the mounting stability of the sensor module 1 is increased by having a plurality of protrusions 223 in the package 2.

[0048] In particular, in this embodiment, as shown in Figure 15, the package 2 has two protrusions 223 that are positioned opposite each other with respect to the center O of the lower surface 2a. In other words, the package 2 has two protrusions 223 that are located on opposite sides of each other with respect to the center O of the lower surface 2a. By arranging the two protrusions 223 in this positional relationship, the two protrusions 223 can be spaced as far apart as possible, thereby further increasing the mounting stability of the sensor module 1.

[0049] In this embodiment, the two protrusions 223 are arranged along the Y-axis, but this is not limited to this configuration. For example, they may be arranged along the X-axis, as shown in Figure 16, or along the diagonal direction of the lower surface 2a, as shown in Figure 17.

[0050] As described above, in the sensor module 1 of this embodiment, the package 2 has a plurality of protrusions 223. With this configuration, the mounting stability of the sensor module 1 is increased.

[0051] Furthermore, as mentioned above, package 2 has a pair of protrusions 223 that are positioned opposite each other via the center O of the lower surface 2a. This configuration further increases the mounting stability of sensor module 1.

[0052] This third embodiment can also achieve the same effects as the first embodiment described above.

[0053] <Fourth Embodiment> Figure 18 is a bottom view of the sensor module according to the fourth embodiment.

[0054] The sensor module 1 of this embodiment is the same as that of the first embodiment described above, except for the configuration of the package 2, specifically the number of protrusions 223. In the following description, this embodiment will focus on the differences from the first embodiment described above, and similar matters will not be explained. Also, in the figures of this embodiment, the same reference numerals are used for components that are the same as those in the previously described embodiment.

[0055] As shown in Figure 18, in the sensor module 1 of this embodiment, the package 2 has three protrusions 223 that project from the lower surface 2a. Although not shown, the mounting substrate 91 has three recesses 921 formed therein, into which each protrusion 223 engages. When the sensor module 1 is mounted on the mounting substrate 91, each protrusion 223 engages with the corresponding recess 921. Thus, the presence of three protrusions 223 in the package 2 increases the mounting stability of the sensor module 1.

[0056] In particular, in this embodiment, the three protrusions 223 are arranged so as not to be aligned in a straight line. That is, the remaining protrusion 223 is offset from the line connecting any two of the three protrusions 223. By arranging the three protrusions 223 in this way, the three protrusions 223 are distributed, further increasing the mounting stability of the sensor module 1.

[0057] As described above, in the sensor module 1 of this embodiment, the package 2 has three or more protrusions 223, and in a plan view of the lower surface 2a, at least one protrusion 223 is offset from the straight line connecting any two protrusions 223. With this configuration, the mounting stability of the sensor module 1 is further increased.

[0058] This fourth embodiment can also achieve the same effects as the first embodiment described above.

[0059] <Fifth Embodiment> Figure 19 is a cross-sectional view of the sensor module according to the fifth embodiment.

[0060] The sensor module 1 of this embodiment is the same as that of the first embodiment described above, except that the configuration of the package 2, specifically the configuration of the protrusion 223, is different. In the following description, this embodiment will be described mainly in terms of the differences from the first embodiment described above, and similar matters will not be described. Also, in the figures of this embodiment, the same reference numerals are used for components that are the same as those in the previously described embodiment.

[0061] As shown in Figure 19, in the sensor module 1 of this embodiment, an elastic triangular pyramidal barb 223a is provided at the tip of the protrusion 223. The barb 223a is made of, for example, various rubber materials or various elastomers. On the other hand, in the mounting substrate 91, the recess 921 is made of a through hole that penetrates the circuit board 92. In this configuration, the protrusion 223 is inserted into the recess 921 so as to penetrate the barb 223a. As a result, the barb 223a catches on the circuit board 92, preventing the protrusion 223 from coming out of the circuit board 92, and the sensor module 1 is fixed to the mounting substrate 91.

[0062] This fifth embodiment can also achieve the same effects as the first embodiment described above.

[0063] Although the sensor module of the present invention has been described above based on the illustrated embodiment, the present invention is not limited thereto, and the configuration of each part can be replaced with any configuration having a similar function. Furthermore, other arbitrary configurations may be added to the present invention. Also, each embodiment may be combined as appropriate.

[0064] For example, as shown in Figure 20, the package 2 may be composed of a resin mold M. [Explanation of Symbols]

[0065] 1...Sensor module, 2...Package, 2a...Bottom, 2b...Top, 2c...Side, 22...Inner case, 221...Mounting base, 222...Positioning projection, 223...Protrusion, 223a...Return, 23...Outer case, 3...Sensor board, 4...Flexible wiring section, 41...Connector, 42...Rigid board, 43...Screw insertion hole, 5...Circuit board, 6...Accelerometer, 61...Package, 62x...Sensor element, 62y...Sensor element, 62z...Sensor element, 7X ...X-axis angular velocity sensor, 7Y...Y-axis angular velocity sensor, 7Z...Z-axis angular velocity sensor, 71...Package, 72...Sensor element, 720...Base, 721...Detection vibration arm, 722...Drive vibration arm, 8...Circuit element, 91...Mounting board, 92...Circuit board, 93...Connector, 921...Recess, 922...Screw hole, Ax...Acceleration, Ay...Acceleration, Az...Acceleration, J...Detection axis, N...Screw, M...Molded part, O...Center, ω...Angular velocity, ωx...Angular velocity, ωy...Angular velocity, ωz...Angular velocity

Claims

1. A sensor board having a circuit board and an inertial sensor mounted on the circuit board, A package having a first surface and a second surface that are in a front-back relationship, and a side surface connecting the first surface and the second surface, and housing the sensor substrate inside, It has a flexible wiring portion that is electrically connected to the sensor substrate and extends from the side to the outside of the package, The package is a sensor module characterized by having a protrusion that extends from the first surface and engages with an object.

2. The sensor module according to claim 1, wherein the circuit board and the flexible wiring section are composed of a rigid-flexible substrate having a rigid substrate which is the circuit board and a flexible substrate which is the flexible wiring section.

3. The package is a sensor module according to claim 1, having a plurality of the aforementioned protrusions.

4. The sensor module according to claim 3, wherein the package has a pair of protrusions that are arranged opposite each other through the center of the first surface.

5. The package has three or more of the aforementioned protrusions, The sensor module according to claim 3, wherein, in a plan view of the first surface, at least one of the protrusions is offset from a straight line connecting any two of the protrusions.

6. The aforementioned flexible wiring section has a screw insertion hole, The sensor module according to claim 1, which is fixed to the object by a screw inserted through the screw insertion hole.

Images