Packages, piezoelectric vibrators, and piezoelectric devices

Abstract

To ensure mounting accuracy of piezoelectric vibrators while accommodating the miniaturization and low-profile design of electronic devices. [Solution] The device comprises a rectangular base made of quartz or glass in plan view, two mounting pads positioned on the upper surface of the base which transmit electrical signals to a piezoelectric vibrator and mount the piezoelectric vibrator, and a measuring pad positioned around the two mounting pads which reflects laser light.

Description

Technical Field

[0001] The present disclosure relates to a package for mounting a piezoelectric vibrating piece, a piezoelectric oscillator using the same, and a piezoelectric device.

Background Art

[0002] In various electronic devices such as mobile phones and personal computers, in order to easily obtain a stable frequency required for information processing or communication processing, etc., it is known to use a crystal oscillator that combines a crystal resonator and an integrated circuit (IC) chip. Further, a crystal resonator is configured by mounting a piezoelectric vibrating piece on a package made of ceramic or the like.

[0003] With the miniaturization of electronic devices in recent years, the demand for miniaturization and low profile of crystal resonators has been increasing more and more. In order to meet such demands, it is known to use a crystal resonator that employs glass or crystal instead of ceramic as the package material. For example, in Patent Document 1, a piezoelectric oscillator in which borosilicate glass is used for the lid and the base is disclosed.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] [[ID=Incidentally, when mounting a quartz crystal (piezoelectric vibrator) in a quartz oscillator, mounting accuracy is ensured by measuring the height of the pad on which the crystal vibrator is mounted using a laser displacement meter. However, when packages made of transparent materials such as glass are further miniaturized and made lower in height (for example, in the case of ultra-small low-profile packages with a thickness of 0.1 mm or less), there are limitations to height measurement using a laser displacement meter, and it becomes impossible to ensure the mounting accuracy of the piezoelectric vibrator. Furthermore, even when the laser beam is incident at an angle, it is difficult to perform the measurement because the laser beam hits the inner wall of the package. Therefore, in ultra-small low-profile packages made of transparent materials, it is desirable to be able to measure the height with the laser beam incident perpendicularly.

[0006] This disclosure has been made in view of these challenges, and its purpose is to provide a package that can ensure mounting accuracy of piezoelectric vibrators while responding to the miniaturization and reduction of the height of electronic devices, as well as a piezoelectric vibrator and piezoelectric device using the same. [Means for solving the problem]

[0007] According to one aspect of the present disclosure, a package is provided that comprises "a rectangular base in plan view made of quartz or glass, two mounting pads arranged on the upper surface of the base which transmit electrical signals to a piezoelectric vibrator and mount the piezoelectric vibrator, and a measuring pad arranged around the two mounting pads which reflects laser light."

[0008] According to one aspect of the present disclosure, a piezoelectric vibrator is provided, comprising: a rectangular base in plan view made of quartz or glass; two mounting pads disposed on the upper surface of the base, which transmit electrical signals to a piezoelectric vibrator and mount the piezoelectric vibrator; a measuring pad disposed around the two mounting pads, which reflects laser light; and the piezoelectric vibrator mounted on the upper surface of the base.

[0009] According to one aspect of the present disclosure, a piezoelectric device is provided, comprising: a package having a rectangular base in plan view made of quartz or glass; two mounting pads disposed on the upper surface of the base for transmitting electrical signals to a piezoelectric vibrator and mounting the piezoelectric vibrator; a measuring pad disposed around the two mounting pads for reflecting laser light; a piezoelectric vibrator having the piezoelectric vibrator mounted on the upper surface of the base; and an IC chip mounted on the bottom surface of the base. [Effects of the Invention]

[0010] According to this disclosure, it is possible to provide a package that can ensure mounting accuracy of piezoelectric vibrators while accommodating the miniaturization and low-profile design of electronic devices, as well as piezoelectric vibrators and piezoelectric devices using the same.

[0011] The effects described above are merely illustrative for the sake of explanation, and the effects relating to this disclosure are not limited to those described above. In addition to the effects described above, any other effects described herein may be achieved. [Brief explanation of the drawing]

[0012] [Figure 1] This is a perspective view of a quartz crystal oscillator according to the first embodiment. [Figure 2] Figure 2(a) is an end view along the dashed line AA in Figure 1. Figure 2(b) is an end view along the dashed line BB in Figure 2(a). [Figure 3] This is a top view of a quartz crystal oscillator according to the first embodiment. [Figure 4] This is an end view of the package according to the first embodiment, similar to Figure 2(b), and is a schematic diagram showing the measurement process using a laser displacement meter. [Figure 5] Figure 5(a) is an end view of a quartz crystal oscillator according to a modified example of the first embodiment, similar to Figure 2(b). Figure 5(b) is an end view of a package according to a modified example of the first embodiment, similar to Figure 4, and is a schematic diagram showing the measurement process using a laser displacement meter. [Figure 6] This is an end view of a crystal oscillator according to the second embodiment, similar to Figure 2(a). [Modes for carrying out the invention]

[0013] Hereinafter, with reference to the drawings, a quartz crystal resonator, which is an example of a piezoelectric resonator, a quartz oscillator, which is an example of a piezoelectric device, and the packages used therein will be described in detail. Note that this disclosure is not limited to the content described below, and can be modified and implemented as such without altering its essence. Furthermore, the drawings used in each embodiment and its modifications are schematic representations of the quartz crystal resonator, quartz oscillator, and package related to this disclosure, and may include partial emphasis, enlargement, reduction, or omission to enhance understanding, and may not accurately represent the scale or shape of each component. Additionally, some numerical values ​​used in each embodiment and its modifications are examples only and can be changed as needed. Common components in the drawings are denoted by the same reference numerals.

[0014] (First Embodiment) First, the basic structure of the quartz crystal oscillator according to this disclosure will be described with reference to Figures 1 to 3. Figure 1 is a perspective view of the quartz crystal oscillator according to this embodiment. Figure 2(a) is an end view along the dashed line AA in Figure 1, and is in particular an end view of the long side of the quartz crystal oscillator. Figure 2(b) is an end view along the dashed line BB in Figure 2(a), and is in particular an end view of the short side of the quartz crystal oscillator. Figure 3 is a top view of the quartz crystal oscillator according to this embodiment.

[0015] As shown in Figures 1, 2(a), and 2(b), the quartz crystal resonator 1, an example of a piezoelectric resonator, has a package 2, a quartz crystal diaphragm 3 mounted in a concave mounting space 2a formed in the inner region of the package 2, and a cover (lid) 5 for sealing the mounting space 2a. The quartz crystal resonator 1 is an element that can generate a constant frequency due to the piezoelectric effect when a voltage is applied to the quartz crystal diaphragm 3, which is an example of a piezoelectric resonator. Regarding the quartz crystal diaphragm, the type of cut from the quartz crystal is not limited to the AT cut, but may also be a Z cut or a two-turn cut such as the SC cut.

[0016] Package 2 has a laminated structure in which a frame wall 11, which is a bank section with an opening of a predetermined size, and a rectangular base 12 are stacked. In particular, the frame wall 11 is provided along the edge of the base 12. With this laminated structure, package 2 forms a concave mounting space 2a for mounting the quartz crystal diaphragm 3. Furthermore, the frame wall 11 and base 12 are made of a transparent material such as quartz or glass. By using quartz or glass for the frame wall 11 and base 12, it becomes possible to easily form them at the wafer level, leading to a smaller and lower profile package 2 compared to other ceramic packages.

[0017] Package 2 has a rectangular shape, and when viewed from above (Figure 3), it is rectangular. In the following, the thickness direction of the quartz crystal oscillator 1 and package 2 is defined as the vertical direction, and the direction perpendicular to this vertical direction is defined as the horizontal direction. Furthermore, the horizontal direction may be distinguished as the longitudinal direction (direction of the longer side) and the short side (direction of the shorter side) of the quartz crystal oscillator 1 and package 2. In addition, in the quartz crystal oscillator 1, the surface located on the upper side in the vertical direction may be referred to as the top surface or front surface, and the surface located on the lower side may be referred to as the bottom surface or back surface.

[0018] On the upper surface (the upper surface in the vertical direction) of the frame wall 11, a sealing member 13 for sealing the mounting space 2a is formed. As the sealing member 13, for example, in addition to metal-based sealing members such as Au-Su alloy and solder, sealing members such as a seal ring and low melting point glass can also be adopted. Further, the planar shape of the sealing member 13 is a frame shape similar to the frame wall 11. And the frame wall 11 and the cover 5 are joined via the sealing member 13. Thereby, the mounting space 2a of the package 2 is sealed, and the mounting space 2a is sealed using a gas such as vacuum or nitrogen.

[0019] On the upper surface 12a of the base 12, two mounting pads 16, 17 for mounting the crystal oscillator 3 and a measurement pad 18 for reflecting laser light from a laser displacement meter 30 described later are formed. The mounting pads 16, 17 are provided on one end side in the long side direction in the inner region surrounded by the frame wall 11. Further, a conductive adhesive 19 is applied to each of the mounting pads 16, 17, and the crystal oscillator 3 is mounted via the conductive adhesive 19. On the other hand, four external connection terminals 20a, 20b, 20c, 20d are formed on the lower surface 12b of the base 12, and each of the mounting pads 16, 17 is electrically connected to the external connection terminals 20a to 20d via a connection wiring (not shown) provided inside the package 2. In particular, the mounting pad 17 extends horizontally to have a T-shaped configuration in order to connect to the separated external connection terminals 20a, 20d, but the shape is not limited thereto, and for example, it may be an I-shaped, L-shaped, or S-shaped.

[0020] The measurement pad 18 is provided between the two mounting pads 16 and 17 on the upper surface 12a of the base 12. However, the installation location is not limited to the above, and it may be any location where the laser light from the laser displacement meter 30 described later can be reflected. For example, the measurement pad 18 may be provided around the mounting pads 16 and 17. Here, the periphery may be the range indicated by the region R in FIG. 3. Specifically, the measurement pad 18 can be installed within the range of the region R on one end side in the long side direction of the upper surface 12a and at a location that does not contact the mounting pads 16 and 17. In other words, the measurement pad 18 may be installed around the portion where the conductive adhesive 19 of the mounting pads 16 and 17 is applied. The size of the measurement pad 18 can also be appropriately changed according to the installation location and the like. However, considering mounting the crystal oscillator 3 on the mounting pads 16 and 17, it is preferable to provide the measurement pad 18 between or near the mounting pads 16 and 17. This is because when the distance from the mounting pads 16 and 17 to the measurement pad 18 increases, even if the height of the measurement pad 18 can be measured, the relationship with the height of the mounting pads 16 and 17 becomes low.

[0021] Next, with reference to FIG. 4, the measurement by the laser displacement meter will be described. FIG. 4 is an end view of the package according to the present embodiment, similarly shown in FIG. 2(b), and is a schematic diagram showing the state of measurement by the laser displacement meter. Since FIG. 4 shows the state of measurement by the laser displacement meter before mounting the crystal oscillator 3, the conductive adhesive 19, the crystal oscillator 3, and the cover 5 have not been provided yet.

[0022] First, when mounting the crystal oscillator 3 onto the mounting pads 16 and 17 via conductive adhesive 19, known image processing techniques are used to take images from above the base 12. Based on the captured image data, the positions of the mounting pads 16 and 17 and the measurement pad 18 are identified, and the height of the identified measurement pad 18 is measured using a laser displacement meter 30. Next, the three-dimensional position of the measurement pad 18 is identified, and the three-dimensional positions of the mounting pads 16 and 17 are calculated and identified from the position of the identified measurement pad 18. Then, the conductive adhesive 19 is applied to the identified mounting pads 16 and 17, and subsequently, the crystal oscillator 3 is mounted.

[0023] The laser displacement meter 30 measures the height of the measuring pad 18 by directing (emitting) laser light toward the measuring pad 18 and receiving the reflected light reflected from the measuring pad 18. Here, the reflectivity of the measuring pad 18 is preferably 20% to 85%, and more preferably 25% to 35%. For example, if a material with extremely high reflectivity (e.g., gold) is used for the measuring pad 18, when the package 2 according to this disclosure and a different package (ceramic package) are placed on the same quartz crystal oscillator manufacturing line, the reflectivity of gold and ceramic will differ greatly, resulting in a large amount of adjustment required to the settings of the laser displacement meter 30 (adjustment of the measurement recipe). On the other hand, by using a material with reflectivity of 20% to 85%, more preferably 25% to 35%, for the measuring pad 18, the adjustment of the measurement recipe of the laser displacement meter 30 can be minimized or eliminated, ensuring the mounting accuracy of the quartz crystal oscillator 3 and improving work efficiency. In other words, it is preferable that the reflectivity of the measuring pad 18 is selected within the range described above so as to be the same as or substantially the same as the reflectivity of the material of the package that flows on the same manufacturing line as the package 2 according to this disclosure.

[0024] Furthermore, similarly to the above, from the viewpoint of minimizing the difference in reflectivity with other ceramic packages, it is preferable that the surface (reflective surface) of the measurement pad 18 be made of chromium or ceramic. Also, from the viewpoint of avoiding contact with the measurement pad 18 when mounting the quartz crystal oscillator 3, it is preferable that the height of the measurement pad 18 be less than or equal to the height of the mounting pads 16 and 17. For example, if the height of the measurement pad 18 is the same as that of the mounting pads 16 and 17, the effort required to calculate the three-dimensional position of the mounting pads 16 and 17 from the position of the measurement pad 18 is reduced. On the other hand, if the height of the measurement pad 18 is made as low as possible, the difference in height measurement results with other packages that do not have a measurement pad will be reduced, making it possible to bring the measurement recipe of the laser displacement meter 30 closer to that of other packages, and minimizing the need to adjust the measurement recipe.

[0025] Furthermore, the piezoelectric resonator relating to this disclosure may be replaced with, for example, a surface acoustic wave (SAW) resonator, other piezoelectric resonators, or micro-electro-mechanical systems (MEMS) resonators, etc., instead of the quartz crystal resonator 1. In other words, the piezoelectric resonator is not limited to the quartz crystal resonator 1, but may be a resonator comprising other members having resonant characteristics (piezoelectric vibrating pieces such as ceramics or silicon), or a MEMS resonator, etc.

[0026] (Modification of the first embodiment) In the above embodiment, the measuring pad 18 was provided on the upper surface 12a of the base 12 between the two mounting pads 16 and 17, but it may also be provided inside the base 12. Such a case will be described as a modification of the first embodiment with reference to Figures 5(a) and 5(b). Figure 5(a) is an end view of a quartz crystal oscillator according to a modification of the first embodiment, shown in the same way as Figure 2(b). Figure 5(b) is an end view of a package according to a modification of the first embodiment, shown in the same way as Figure 4, and is a schematic diagram showing the measurement by a laser displacement meter. Components identical to those in the above embodiment are denoted by the same reference numerals, and their descriptions are simplified or omitted.

[0027] As shown in Figure 5(a), the crystal oscillator 101 according to this modified example has a base 112 that is different from the base 12 in the above embodiment. Specifically, the base 112 has a structure in which raw plates 121 and 122 made of crystal or glass are laminated via a bonding material 123 made of gold or the like. The measuring pad 118 is provided inside the base 112 in a space surrounded by the raw plates 121 and 122 and the bonding material 123.

[0028] As shown in Figure 5(b), the laser displacement meter 30 measures the height of the measuring pad 118 by directing (emitting) laser light toward the measuring pad 118 and receiving the reflected light reflected from the measuring pad 118. Here, since the base plate 121 is made of quartz or glass, the laser light can pass through the base plate 121, and as a result, the laser light can reach the measuring pad 118. For the same reason, the reflected light from the measuring pad 118 can also reach the laser displacement meter 30.

[0029] In this modified example, the reflectivity of the measuring pad 118 is preferably 20% to 85%, and more preferably 25% to 35%. Also, as in the above embodiment, the surface (reflective surface) of the measuring pad 118 is preferably made of chromium or ceramic. This minimizes or eliminates the need to adjust the measurement recipe of the laser displacement meter 30 when the package 102 according to this disclosure and other different ceramic packages are placed on the same quartz crystal manufacturing line, thereby ensuring the mounting accuracy of the quartz crystal 3 and improving work efficiency.

[0030] In this modified example, the measuring pad 118 is embedded inside the base 112. This eliminates the risk of the measuring pad 118 coming into contact with the mounted pads 16 and 17, and allows the size of the measuring pad 118 to be determined without being limited by the size of the mounted pads 16 and 17.

[0031] (Second Embodiment) In the first embodiment, a crystal oscillator 1 using package 2 was described as an example of a piezoelectric oscillator, but this package may also be applied to a piezoelectric device. Such a case will be described as the second embodiment with reference to Figure 6. Figure 6 is an end view of a crystal oscillator according to the second embodiment, shown in the same way as Figure 2(a). Components identical to those in the first embodiment are denoted by the same reference numerals, and their descriptions are simplified or omitted.

[0032] As shown in Figure 6, the crystal oscillator 201, an example of a piezoelectric device, has a package 202, a crystal diaphragm 3 mounted in the concave first mounting space 202a of the package 202, an IC chip 204 mounted in the second mounting space 202b of the package 202, and a metal cover (lid) 205 for sealing the first mounting space 202a. The crystal oscillator 201 is an electronic component that integrates the crystal diaphragm 3, an example of a piezoelectric diaphragm, and the IC chip 204, which is an oscillation circuit, into a single package, and can generate a stable frequency and produce a regular reference signal.

[0033] Package 202 has a structure in which a first frame wall 211, which is a ridge portion with an opening of a predetermined size, a rectangular base 212, and a second frame wall 213, which has a smaller opening than the first frame wall 211, are stacked. Package 202 has a so-called H-shaped structure in which the first frame wall 211 is stacked on the upper surface 212a of the base 212 and the second frame wall 213 is stacked on the lower surface 212b of the base 212. With this structure, package 202 realizes a structure in which the crystal oscillator 3 and the IC chip 204 can be mounted in separate mounting spaces. However, the structure of package 202 is not limited to the above, and a so-called single-room type structure in which the crystal oscillator 3 and the IC chip 204 are mounted in the same mounting space may also be adopted.

[0034] The first frame wall 211, the second frame wall 213, and the base 212 are made of quartz or glass. This allows for easy formation at the wafer level, leading to miniaturization and a lower profile package 202.

[0035] A sealing member 214 for sealing the first mounting space 202a is formed on the upper surface of the first frame wall 211. The planar shape of the sealing member 214 is frame-shaped, similar to the first frame wall 211. In addition to metal sealing members such as Au-Su alloy or solder, sealing members such as seal rings or low-melting-point glass can also be used as the sealing member 214. The first frame wall 211 and the cover 205 are joined via the sealing member 214. As a result, the first mounting space 202a of the package 202 is sealed, and the first mounting space 202a is sealed using a vacuum or a gas such as nitrogen.

[0036] Multiple IC terminals 241 are formed on the back surface 212b of the base 212. Conductive adhesive 251 is applied to each of the IC terminals 241, and the IC chip 204 is mounted via these conductive adhesives 251. In other words, in the crystal oscillator 201, a flip-chip type IC chip 204 is mounted by flip-chip bonding. Each of the IC terminals 241 is electrically connected to an external connection terminal via connection wiring (not shown) provided inside the package 202.

[0037] Four external connection terminals (only external connection terminals 260c and 260d are shown in Figure 6) are formed on the back surface of the second frame wall 213 of package 202. Each of these external connection terminals is connected to either the mounting pads 16, 17 or the IC terminal 241 via connection wiring (not shown) provided inside package 202.

[0038] The crystal oscillator 3 according to this embodiment has the same structure as the crystal oscillator 3 according to the first embodiment, and the mounting method using the conductive adhesive 19 is also the same. Therefore, the structure and mounting method of the crystal oscillator 3 will not be described.

[0039] The upper surface 212a of the base 212 has two mounting pads 16 and 17 for mounting the quartz crystal oscillator 3, and a measuring pad 18 for reflecting laser light from the laser displacement meter. The position of the measuring pad is the same as shown in Figure 3. The mounting pads 16 and 17 and the measuring pad 18 in this embodiment have the same structure as those of the first embodiment, and the measurement method using the laser displacement meter is also the same, so their explanation is omitted.

[0040] Similar to the above-described modification 1, in this embodiment as well, the measuring pad 18 may be provided inside the base 212. Specifically, the base 212 may have a structure in which two plates made of quartz or glass are laminated with a bonding material made of gold or the like, and the measuring pad 18 may be provided inside the base 212 in a space surrounded by the two plates and the bonding material. In that case, similar to the above-described modification, there is no risk of the measuring pad 18 coming into contact with the mounted pads 16 and 17, and the size of the measuring pad 18 can be determined without being limited by the size of the mounted pads 16 and 17.

[0041] (Embodiments of this disclosure) A first embodiment of the present disclosure is a package characterized by comprising: a rectangular base in plan view made of quartz or glass; two mounting pads arranged on the upper surface of the base, which transmit electrical signals to a piezoelectric vibrator and mount the piezoelectric vibrator; and a measuring pad arranged around the two mounting pads, which reflects laser light.

[0042] In this way, by providing a measurement pad, even if the package itself is transparent and ultra-small and low-profile, it becomes possible to perform measurements by perpendicularly incidenting the laser beam of the laser displacement meter, thereby ensuring the mounting accuracy of the piezoelectric vibrator. In other words, it becomes possible to provide a package that can accommodate the miniaturization and low-profile design of electronic devices while ensuring the mounting accuracy of the piezoelectric vibrator.

[0043] A second embodiment of this disclosure is that, in the first embodiment, the reflectivity of the measuring pad is 20% or more and 85% or less. This reduces the amount of adjustment required for the measurement recipe of the laser displacement meter, ensuring the mounting accuracy of the piezoelectric vibrator and improving work efficiency.

[0044] A third embodiment of this disclosure is that, in the second embodiment, the reflectivity of the measuring pad is 25% or more and 35% or less. This reduces the amount of adjustment required for the measurement recipe of the laser displacement meter, ensuring mounting accuracy of the piezoelectric vibrator and further improving work efficiency.

[0045] A fourth embodiment of this disclosure is that, in any of the first to third embodiments, the surface of the measuring pad is made of chromium or ceramic. This reduces the amount of adjustment required for the measurement recipe of the laser displacement meter, ensuring the mounting accuracy of the piezoelectric vibrator and improving work efficiency.

[0046] A fifth embodiment of this disclosure is the second embodiment, wherein the measuring pad is positioned on the upper surface of the base. This makes it easier to locate the measuring pad and ensures the mounting accuracy of the piezoelectric vibrator.

[0047] A sixth embodiment of the present disclosure is, in the second embodiment, the base having a structure in which plates made of quartz or glass are laminated with a bonding material, and the measuring pad is disposed inside the base in a space surrounded by the plates and the bonding material. This eliminates the risk of the measuring pad coming into contact with the mounted pad, and allows the size of the measuring pad to be determined without being limited by the size of the mounted pad.

[0048] A seventh embodiment of this disclosure is, in the fourth embodiment, that the height of the measuring pad is less than or equal to the height of the two mounting pads. This reduces the risk of the piezoelectric vibrator coming into contact with the measuring pad and being damaged when mounting the piezoelectric vibrator.

[0049] An eighth embodiment of this disclosure is a piezoelectric vibrator characterized by comprising the package of the first embodiment and the piezoelectric vibrator mounted on the upper surface of the base. In this way, by providing a measuring pad, even if the package itself is transparent and ultra-miniature and low-profile, it becomes possible to perform measurements by perpendicularly incidenting the laser beam of a laser displacement meter, thereby ensuring the mounting accuracy of the piezoelectric vibrator. In other words, it becomes possible to provide a piezoelectric vibrator that ensures the mounting accuracy of the piezoelectric vibrator while accommodating the miniaturization and low-profile design of electronic devices.

[0050] A ninth embodiment of this disclosure is a piezoelectric device characterized by comprising a piezoelectric vibrator of the eighth embodiment and an IC chip mounted on the bottom surface of the base. In this way, by providing a measuring pad, even if the package itself is transparent and ultra-miniature and low-profile, it becomes possible to perform measurements by perpendicularly incidenting the laser beam of a laser displacement meter, thereby ensuring the mounting accuracy of the piezoelectric vibrator. In other words, it becomes possible to provide a piezoelectric device that ensures the mounting accuracy of the piezoelectric vibrator while accommodating the miniaturization and low-profile design of electronic devices. [Explanation of Symbols]

[0051] 1. Quartz crystal oscillator (piezoelectric oscillator) 2 packages 3. Crystal vibrating element (piezoelectric vibrating element) 5 Cover (Lid) 11 Frame wall 12 bass 12a Top side 16,17 Pads 18 Measuring pads 112 Bass 121,122 Plain board 123 Bonding material 201 Crystal Oscillator (Piezoelectric Device) 204 IC chips 212 base 212b Bottom

Claims

1. A rectangular base in plan view, made of crystal or glass, Two mounting pads are provided on the upper surface of the base, which transmit electrical signals to a piezoelectric vibrator and mount the piezoelectric vibrator. A measuring pad that reflects laser light is positioned around the two aforementioned mounting pads, A package characterized by having the following features.

2. The package according to claim 1, characterized in that the reflectivity of the measuring pad is 20% or more and 85% or less.

3. The package according to claim 2, characterized in that the reflectivity of the measuring pad is 25% or more and 35% or less.

4. The package according to any one of claims 1 to 3, characterized in that the surface of the measuring pad is made of chromium or ceramic.

5. The package according to claim 2, characterized in that the measuring pad is located on the upper surface of the base.

6. The base has a structure in which plates made of quartz or glass are laminated with a bonding material in between. The package according to claim 2, characterized in that the measuring pad is located inside the base and in a space surrounded by the base plate and the bonding material.

7. The package according to claim 4, characterized in that the height of the measuring pad is less than or equal to the height of the two mounted pads.

8. The package according to claim 1, The piezoelectric vibrator mounted on the upper surface of the base, A piezoelectric vibrator characterized by having the following features.

9. A piezoelectric vibrator according to claim 8, An IC chip mounted on the bottom surface of the base, A piezoelectric device characterized by having the following features.

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