Component mounting device

The component mounting apparatus addresses the challenge of parallel substrate transport by using a substrate transport unit with movable lifting bodies to support substrates, allowing one lane to extend without interfering with the other, thus enabling efficient dual-lane operations.

JP2026061665APending Publication Date: 2026-04-09PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2024-09-30
Publication Date
2026-04-09

AI Technical Summary

Technical Problem

Conventional component mounting devices cannot transport substrates simultaneously and in parallel on both transport lanes when one lane's width is increased, as it interferes with the other lane's substrate support mechanism.

Method used

A component mounting apparatus with a substrate transport unit that positions substrates at four matrix-aligned positions, using vertically movable lifting bodies to support substrate ends, and allows one lane to extend into the other while selectively removing support members to avoid interference.

Benefits of technology

Enables simultaneous and parallel transport of substrates on both lanes, even when one lane's width is extended, facilitating efficient component mounting operations.

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Abstract

The objective is to provide a component mounting device that can transport substrates and perform component mounting work simultaneously and in parallel on both transport lanes, even when the width of one of the two transport lanes is increased and extends to the other side. [Solution] When attempting to transport substrates KB simultaneously and in parallel by each of the two transport lanes 21 with the first lane movable conveyor 23A positioned above two lifting bodies (third lifting body 51R, fourth lifting body 51S) that move up and down below the second lane movable conveyor 23B, all or part of the support members 36 corresponding to the other two substrate positions (second substrate position PsQ, third substrate position PsR) that are different from the two diagonal positions (first substrate position PsP, fourth substrate position PsS) that are set as substrate positions to support substrates KB are removed from the two transport lanes 21, and the substrates KB are supported at the aforementioned diagonal positions.
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Description

Technical Field

[0001] The present disclosure relates to a component mounting device that mounts components on a substrate conveyed and positioned by a conveyance lane.

Background Art

[0002] A conventionally known component mounting device is configured to convey a substrate by a conveyance lane composed of a pair of conveyors, position it at a predetermined work position, and perform a component mounting operation on the substrate. The conveyance lane usually includes a fixed-side conveyor (fixed conveyor) and a movable-side conveyor (movable conveyor), and the lane width (conveyor interval) can be adjusted according to the width of the substrate to be conveyed by relatively moving the movable conveyor with respect to the fixed conveyor. Also, a configuration in which two conveyance lanes are arranged parallel to each other is known (see, for example, Patent Document 1 below). In such a type of component mounting device, by positioning one of the two conveyance lanes so as to protrude into the area of the other, it is possible to handle substrates of large sizes. Each conveyor is provided with a plurality of support members (movable clamps in Patent Document 1) that are pushed up by elevating bodies that rise from below, and both ends of the substrate positioned at the substrate position set for each conveyance lane are supported by a pair of support members pushed up by the elevating bodies located below it.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, in the conventional component loading device described above, if the movable conveyor of one transport lane extends into the area of ​​the other transport lane, in order to push up the support members of that transport lane to support both ends of the substrate, it is necessary to push up not only the lifting body on the side of that transport lane but also the lifting body on the side of the other transport lane. As a result, when supporting a substrate positioned on the side of one transport lane, the support members provided on the movable conveyor of the other transport lane are also pushed up, hindering the transport of the substrate by the other transport lane. For this reason, conventionally, when one transport lane extends into the side of the other transport lane, it was not possible to transport substrates on the other transport lane, and component loading work could not be performed by transporting substrates on both transport lanes simultaneously and in parallel.

[0005] Therefore, the present disclosure aims to provide a component mounting apparatus that can transport substrates simultaneously and in parallel on both transport lanes and perform component mounting work, even when the width of one of the two transport lanes is increased and extends to the other side. [Means for solving the problem]

[0006] The component mounting apparatus of the present disclosure comprises a substrate transport unit that positions substrates at four substrate positions arranged in a matrix, set upstream and downstream along each of the two transport lanes, and a mounting head that mounts components on the substrates positioned by the substrate transport unit, wherein four vertically movable lifting bodies are provided below each of the four substrate positions, and these four lifting bodies rise individually to push up support members provided upstream and downstream along each of the two transport lanes, thereby supporting both ends of the substrates positioned at the substrate positions, and the two transport lanes are Each conveyor consists of a fixed conveyor located outside the other and a movable conveyor located inside the other and movable in the second direction. When attempting to transport substrates simultaneously and in parallel by each of the two conveyor lanes, with the movable conveyor of one of the two conveyor lanes positioned to extend above two lifting bodies that move up and down below the other conveyor lane, all or part of the support members corresponding to the two other substrate positions, which are different from the two substrate positions located at one diagonal position set as substrate support positions among the four substrate positions, are removed from the two conveyor lanes, or the substrates are supported at the one diagonal position in a state where they are not pushed up by the lifting bodies even when the lifting bodies rise. [Effects of the Invention]

[0007] According to this disclosure, even if the width of one of the two transport lanes is increased and extended to the other side, substrates can be transported simultaneously and in parallel on both transport lanes to perform component mounting work. [Brief explanation of the drawing]

[0008] [Figure 1] This is a perspective view of a component mounting device in one embodiment of the present disclosure. [Figure 2] This is a side view of a component mounting device in one embodiment of the present disclosure. [Figure 3]This is a perspective view of a substrate transport section included in a component mounting device according to one embodiment of the present disclosure. [Figure 4] (a)(b)This is a cross-sectional perspective view of a substrate transport section of a component mounting device according to one embodiment of the present disclosure. [Figure 5] This is an exploded perspective view of a part of the substrate transport section of a component mounting device according to one embodiment of the present disclosure. [Figure 6] (a)(b) This is a partial cross-sectional side view of a part of the substrate transport section of a component mounting device according to one embodiment of the present disclosure. [Figure 7] The following are (a) a plan view, (b) a cross-sectional view taken along the line V1-V1, and (c) a cross-sectional view taken along the line W1-W1, of a part of the substrate transport section of a component mounting device according to one embodiment of the present disclosure. [Figure 8] The following are (a) a plan view, (b) a cross-sectional view taken along the line V2-V2, and (c) a cross-sectional view taken along the line W2-W2, of a part of the substrate transport section of a component mounting device in one embodiment of the present disclosure. [Figure 9] (a) A plan view of a part of the substrate transport section of a component mounting device in one embodiment of the present disclosure. (b) A cross-sectional view taken along the line V3-V3. (c) A cross-sectional view taken along the line W3-W3. [Figure 10] (a) A plan view of a part of the substrate transport section of a component mounting device in one embodiment of the present disclosure. (b) A cross-sectional view taken along the line V4-V4. (c) A cross-sectional view taken along the line W4-W4. [Figure 11] (a) A plan view of a part of the substrate transport section of a component mounting device in one embodiment of the present disclosure. (b) A cross-sectional view taken along the line V5-V5. (c) A cross-sectional view taken along the line W5-W5. [Figure 12] The following are (a) a plan view, (b) a cross-sectional view taken along the line V6-V6, and (c) a cross-sectional view taken along the line W6-W6, of a part of the substrate transport section of a component mounting device according to one embodiment of the present disclosure. [Modes for carrying out the invention]

[0009] Embodiments of this disclosure will be described below with reference to the drawings. Figures 1 and 2 show the component mounting device 10 in this embodiment. The component mounting device 10 is a device for mounting components BH onto a substrate KB, and comprises a base 11, a substrate transport unit 12, a parts feeder 13, a head movement mechanism 14, and a mounting head 15. In this embodiment, for the sake of explanation, the transport direction of the substrate KB by the component mounting device 10 (left-right direction as seen from the operator OP) is defined as the X direction, the horizontal plane direction perpendicular to the X direction (front-back direction as seen from the operator OP) is defined as the Y direction, and the up-down direction is defined as the Z direction.

[0010] In Figures 1 and 2, the substrate transport unit 12 is configured to have two transport lanes 21 (a front first lane 21A and a rear second lane 21B) that extend in the X direction and are arranged side by side in the Y direction. That is, in this embodiment, the component mounting device 10 has a configuration in which two transport lanes 21 (first lane 21A and second lane 21B) extending in a horizontal first direction (X direction) are arranged side by side in a second direction (Y direction) that intersects the first direction. The substrate transport unit 12 receives substrates KB from the upstream device (left side as seen from the operator OP in Figure 1) and transports them, and then transports the substrates KB after the component mounting work is completed to the downstream device (right side as seen from the operator OP).

[0011] In Figure 1, a trolley 11D is connected to each of the two ends of the base 11 in the Y direction. The parts feeder 13 is mounted side by side in the X direction on the top of each of the two trolleys 11D. The parts feeder 13 functions as a parts supply unit and continuously supplies parts BH to a parts retrieval position 13T set at the end on the board transport unit 12 side. In this embodiment, the parts feeder 13 consists of a tape feeder that supplies parts BH to the parts retrieval position 13T by pulling out a parts supply tape BT containing parts BH from a reel RL and transporting it, but the parts feeder 13 is not limited to a tape feeder and can supply parts BH as long as it supplies them.

[0012] The head movement mechanism 14 includes a fixed table 14a provided on the base 11 and extending in the Y direction, and two movable tables 14b extending in the X direction with one end attached to the fixed table 14a. The two mounting heads 15 are attached to the two movable tables 14b respectively.

[0013] The two movable tables 14b are each moved in the Y direction by the fixed table 14a, and the mounting head 15 is moved in the X direction by each of the two movable tables 14b. Therefore, each mounting head 15 is moved in the XY plane (horizontal plane) by the movement operation of the movable table 14b in the Y direction by the fixed table 14a and the movement operation of the mounting head 15 in the X direction by the movable table 14b.

[0014] In FIG. 2, each of the two mounting heads 15 includes a plurality of nozzles 15N extending downward. Each mounting head 15 moves above the parts feeder 13, brings the nozzle 15N close to the parts picking position 13T, and generates a vacuum adsorption force at the lower end of the nozzle 15N, so that the parts BH supplied by the parts feeder 13 can be picked up.

[0015] The operations of each part of the component mounting device 10 are controlled by a control device (not shown) provided in the base 11. The control device includes a CPU (Central Processing Unit), operates the substrate transfer unit 12 to transfer and position the substrate KB, operates each parts feeder 13 to supply the parts BH to the parts picking position 13T. Further, the control device operates the head movement mechanism 14 to move the two mounting heads 15, and makes each of the two mounting heads 15 pick up the parts BH.

[0016] When the component mounting device 10 performs a component mounting operation of mounting the component BH on the substrate KB, first, the substrate conveyance unit 12 receives and carries in the substrate KB sent from the upstream device, and positions it at a predetermined working position. As will be described later, the substrate conveyance unit 12 conveys and positions the substrate KB by each of the two conveyance lanes 21 (the first lane 21A and the second lane 21B), or conveys and positions the substrate KB by one of the two conveyance lanes 21 (the first lane 21A).

[0017] When the substrate conveyance unit 12 positions the substrate KB, each parts feeder 13 operates to supply the component BH to each component extraction position 13T. The head movement mechanism 14 reciprocates the two mounting heads 15 between the parts feeder 13 and the substrate KB, and causes each mounting head 15 to execute a mounting turn. The mounting turn executed by the mounting head 15 includes an operation of moving above the parts feeder 13 to pick up the component BH supplied by the parts feeder 13, and an operation of moving above the substrate KB in the state of having picked up the component BH to mount the component BH on the substrate KB. When all the components BH to be mounted on the substrate KB are mounted by repeatedly executing the mounting turn by the mounting head 15, the substrate conveyance unit 12 operates to carry out the substrate KB to the downstream device.

[0018] In the component mounting device 10 having such a configuration, in the present embodiment, the operation of the substrate conveyance unit 12 is characterized, and the description thereof will be given below. First, the configuration of the substrate conveyance unit 12 will be described.

[0019] In Figure 3, the two transport lanes 21 (first lane 21A and second lane 21B) of the substrate transport unit 12 each consist of a fixed conveyor 22 located outside each other and a movable conveyor 23 located inside each other. The fixed conveyor 22 is fixed to the base 11, and the movable conveyor 23 is movable in the Y direction relative to the base 11. Hereinafter, the fixed conveyor 22 of the first lane 21A will be referred to as the first lane fixed conveyor 22A, and the movable conveyor 23 of the first lane 21A will be referred to as the first lane movable conveyor 23A. Similarly, the fixed conveyor 22 of the second lane 21B will be referred to as the second lane fixed conveyor 22B, and the movable conveyor 23 of the second lane 21B will be referred to as the second lane movable conveyor 23B.

[0020] In each conveying lane 21, the configuration of the fixed conveyor 22 (first lane fixed conveyor 22A and second lane fixed conveyor 22B) and the configuration of the movable conveyor 23 (first lane movable conveyor 23A and second lane movable conveyor 23B) are almost the same. The fixed conveyor 22 and the movable conveyor 23 each include a base member 31, a plurality of pulleys 32, a conveyor belt 33, a drive motor 34, a pressed member 35, and a support member 36, as shown in Figures 4(a), (b) and 5, respectively.

[0021] In Figures 4(a), (b) and 5, the base member 31 consists of a plate-shaped member extending in the X direction along the XZ plane. Multiple pulleys 32 are provided on the inner surface of the base member 31 (the surface on which the fixed conveyor 22 and the movable conveyor 23 face each other), and the conveyor belt 33 is stretched across the multiple pulleys 32. A drive motor 34 is provided on the base member 31 and drives one of the multiple pulleys 32 to rotate, thereby driving the conveyor belt 33.

[0022] In Figures 5 and 6(a) and 6(b), the pressed member 35 is provided at the upper end of the base member 31, with one end in the Y direction protruding inward (towards the direction where the fixed conveyor 22 and the movable conveyor 23 face each other). The support member 36 consists of a plate-shaped member extending in the X direction within the XZ plane, and is provided on the inner surface side of the base member 31.

[0023] Support members 36 are located on the upstream and downstream sides of both the fixed conveyor 22 and the movable conveyor 23. Hereinafter, as shown in Figures 7(a), (b), and (c), the support member 36 on the upstream side of the first lane fixed conveyor 22A will be referred to as the "first support member 36A," and the support member 36 on the upstream side of the first lane movable conveyor 23A will be referred to as the "second support member 36B." The support member 36 on the downstream side of the first lane fixed conveyor 22A will be referred to as the "third support member 36C," and the support member 36 on the downstream side of the first lane movable conveyor 23A will be referred to as the "fourth support member 36D."

[0024] Furthermore, as shown in Figures 7(a), (b), and (c), the support member 36 on the upstream side of the second lane fixed conveyor 22B is referred to as the "fifth support member 36E," and the support member 36 on the upstream side of the second lane movable conveyor 23B is referred to as the "sixth support member 36F." The support member 36 on the downstream side of the second lane fixed conveyor 22B is referred to as the "seventh support member 36G," and the support member 36 on the downstream side of the second lane movable conveyor 23B is referred to as the "eighth support member 36H."

[0025] In Figures 4(a), (b), 5, and 6, each support member 36 has a shape that extends upward to avoid the conveyor belt 33. As shown in Figures 4(a), (b), and 5, each support member 36 has an elongated hole 41 at each end in the X direction that extends vertically and penetrates in the plate thickness direction (Y direction).

[0026] In Figure 5, two screw members 31S, which are attached to the inner surface of the base member 31, are inserted through each of the two elongated holes 41 in each support member 36. As a result, the support member 36 is movable in the Z direction relative to the base member 31 (and therefore relative to the conveyor belt 33) using the two elongated holes 41 as guides. A post member 42 extending downward from the support member 36 is detachably provided on the lower surface of each of the left and right ends (X direction) of the support member 36.

[0027] As shown in Figures 3 and 4(a) and 4(b), a lifting body 51 is positioned between the fixed conveyor 22 and the movable conveyor 23 of the first lane 21A and the second lane 21B, respectively. One lifting body 51 is positioned on the upstream side and one on the downstream side of the first lane 21A and the second lane 21B. Hereinafter, the lifting body 51 positioned on the upstream side of the first lane 21A will be referred to as the "first lifting body 51P," and the lifting body 51 positioned on the downstream side of the first lane 21A will be referred to as the "second lifting body 51Q." Furthermore, the lifting body 51 positioned on the upstream side of the second lane 21B will be referred to as the "third lifting body 51R," and the lifting body 51 positioned on the downstream side of the second lane 21B will be referred to as the "fourth lifting body 51S."

[0028] In this embodiment, four substrate positions Ps (positions for positioning substrate KB) corresponding to the arrangement of the four lifting bodies 51 are set in a 2x2 matrix in a plan view. As shown in Figure 7(a), of these four substrate positions Ps, the substrate position Ps above the first lifting body 51P is referred to as the "first substrate position PsP", the substrate position Ps above the second lifting body 51Q is referred to as the "second substrate position PsQ", the substrate position Ps above the third lifting body 51R is referred to as the "third substrate position PsR", and the substrate position Ps above the fourth lifting body 51S is referred to as the "fourth substrate position PsS".

[0029] In Figures 3 and 4(a) and 4(b), a plurality of upwardly extending support pins 52 are attached to the upper surface of each lifting body 51. The support pins 52 support the lower surface of the circuit board KB positioned above them, and are attached to the lifting body 51 in an arrangement that corresponds to the circuit board KB to be supported (for example, an arrangement that avoids components BH mounted on the lower surface of the circuit board KB).

[0030] The four lifting bodies 51 are individually raised and lowered by four lifting cylinders 53 (Figures 3 and 4(a), (b)) provided on the base 11, corresponding to each lifting body 51. When the lifting bodies 51 are positioned at the normal height (H=H0) shown in Figures 7(b), (c) by the lifting cylinders 53, and the post member 42 extending downward from the support member 36 is spaced apart from the upper surface of the lifting body 51, the support member 36 hangs down under its own weight with the upper edge of the elongated hole 41 in contact with the screw member 31S from above (Figures 4(a) and 6(a)).

[0031] As the lifting body 51 is raised from the state in which the support member 36 is hanging down under its own weight, the lifting body 51 pushes up the support member 36 via the left and right post members 42. As a result, if the substrate KB is supported by the conveyor belt 33, the ends of the substrate KB are lifted by the support member 36 and moved upward away from the conveyor belt 33 and pressed against the pressed member 35 (Figure 4(a) → Figure 4(b), Figure 6(a) → Figure 6(b)). As a result, both ends of the substrate KB are clamped by the pair of support members 36 and the pair of pressed members 35 located above them (Figure 3).

[0032] As mentioned above, the post member 42 is detachable from the support member 36, and when the post member 42 is detached from the support member 36, the support member 36 is not pushed up by the lifting body 51 even when the lifting body 51 is raised. Therefore, if the post member 42 is detached from the support member 36, the lifting body 51 will remain hanging down by its own weight, regardless of whether or not it is being raised by the lifting cylinder 53.

[0033] As described above, when the lifting body 51 rises and the upper ends of the two support members 36 come into contact with the lower surface of the substrate KB, the upper ends of the multiple support pins 52 provided on the lifting body 51 also come into contact with the lower surface of the substrate KB. Therefore, when both ends of the substrate KB are supported by the pair of support members 36 (including when it is pressed against the pair of pressed members 35), the entire central part of the lower surface of the substrate KB is supported by the multiple support pins 52.

[0034] The first lane 21A and the second lane 21B can have their respective lane widths (the distance in the Y direction between the fixed conveyor 22 and the movable conveyor 23) changed according to the width (Y-direction dimension) of the substrate KB being transported. The lane width is changed by operating the spacing-changing motors (not shown) provided on each of the first lane 21A and the second lane 21B, thereby moving the movable conveyor 23 in the Y direction relative to the fixed conveyor 22. When the lane width is changed and the distance between the fixed conveyor 22 and the movable conveyor 23 is changed, the distance between the support member 36 provided on the fixed conveyor 22 and the support member 36 provided on the movable conveyor 23 is also changed, as is the distance between the pressed member 35 provided on the fixed conveyor 22 and the pressed member 35 provided on the movable conveyor 23.

[0035] In this embodiment, the first lane movable conveyor 23A can be positioned to extend (enter) into the area of ​​the third substrate position PsR and the fourth substrate position PsS. At this time, the upstream support member 36 (second support member 36B) provided on the first lane movable conveyor 23A is positioned above the upstream lifting body 51 (third lifting body 51R) that moves up and down below the second lane 21B. Also, the downstream support member 36 (fourth support member 36D) provided on the first lane movable conveyor 23A is positioned above the downstream lifting body 51 (fourth lifting body 51S) that moves up and down below the second lane 21B. It is also possible to position the second lane movable conveyor 23B to extend (enter) into the area of ​​the first substrate position PsP and the second substrate position PsQ.

[0036] (Basic Dual Mode) In the component mounting device 10 of this embodiment, the first lane 21A and the second lane 21B can transport, position, and clamp the substrate KB independently of each other to mount the component BH onto the substrate KB in a mode (referred to as the "basic dual mode"). In the basic dual mode, the first lane movable conveyor 23A is not extended to the side of the second lane 21B, and as shown in Figures 8(a), (b), and (c), the first lane 21A positions and clamps the substrate KB at the first substrate position PsP and the second substrate position PsQ respectively to perform component mounting work, and the second lane 21B positions and clamps the substrate KB at the third substrate position PsR and the fourth substrate position PsS respectively to perform component mounting work.

[0037] In the basic dual mode, the upstream support member 36 (first support member 36A) provided on the first lane fixed conveyor 22A and the upstream support member 36 (second support member 36B) provided on the first lane movable conveyor 23A are both located above the first lifting body 51P, while the downstream support member 36 (third support member 36C) provided on the first lane fixed conveyor 22A and the downstream support member 36 (fourth support member 36D) provided on the first lane movable conveyor 23A are both located above the second lifting body 51Q. Furthermore, the upstream support member 36 (fifth support member 36E) provided on the second lane fixed conveyor 22B and the upstream support member 36 (sixth support member 36F) provided on the second lane movable conveyor 23B are both located above the third lifting body 51R, and the downstream support member 36 (seventh support member 36G) provided on the second lane fixed conveyor 22B and the downstream support member 36 (eighth support member 36H) provided on the second lane movable conveyor 23B are both located above the fourth lifting body 51S.

[0038] In the basic dual mode, when clamping a substrate KB positioned at the first substrate position PsP, the lifting cylinder 53 raises the first lifting body 51P from the normal height (H=H0) to the clamping height (H=H1), which is the height at which the substrate KB is clamped. As a result, the first support member 36A and the second support member 36B are pushed up by the first lifting body 51P, and both ends of the substrate KB positioned at the first substrate position PsP are supported by the first support member 36A and the second support member 36B and clamped between them and the pressed member 35 (Figure 8(b)). Note that the clamping height (H=H1) of the lifting body 51 varies depending on the thickness of the substrate KB to be clamped, and becomes lower as the thickness of the substrate KB increases.

[0039] In the basic dual mode, when clamping the substrate KB positioned at the second substrate position PsQ, the lifting cylinder 53 raises the second lifting body 51Q from the normal height (H=H0) to the clamping height (H=H1). As a result, the third support member 36C and the fourth support member 36D are pushed up by the second lifting body 51Q, and both ends of the substrate KB positioned at the second substrate position PsQ are supported by the third support member 36C and the fourth support member 36D and clamped between them and the pressed member 35 (Figure 8(c)).

[0040] In the basic dual mode, when clamping the substrate KB positioned at the third substrate position PsR, the lifting cylinder 53 raises the third lifting body 51R from the normal height (H=H0) to the clamping height (H=H1). As a result, the fifth support member 36E and the sixth support member 36F are pushed up by the third lifting body 51R, and both ends of the substrate KB positioned at the third substrate position PsR are supported by the fifth support member 36E and the sixth support member 36F and clamped between them and the pressed member 35 (Figure 8(b)).

[0041] In the basic dual mode, when clamping the substrate KB positioned at the fourth substrate position PsS, the fourth lifting body 51S is raised from the normal height (H=H0) to the clamping height (H=H1) by the lifting cylinder 53. As a result, the seventh support member 36G and the eighth support member 36H are pushed up by the fourth lifting body 51S, and both ends of the substrate KB positioned at the fourth substrate position PsS are supported by the seventh support member 36G and the eighth support member 36H and clamped between them and the pressed member 35 (Figure 8(c)).

[0042] (Basic single mode) In the component mounting device 10 of this embodiment, the second lane 21B is not used from the basic dual mode described above, and the work can also be performed in a mode (referred to as the "basic single mode") in which the substrate KB is transported, positioned, and clamped using only the first lane 21A to mount the component BH. In the basic single mode, as shown in Figures 9(a), (b), and (c), the substrate KB is positioned and clamped at the first substrate position PsP and the second substrate position PsQ of the first lane 21A to perform the component mounting work, and the substrate KB is not transported in the second lane 21B.

[0043] In basic single mode, the substrate KB positioned at the first substrate position PsP is supported at both ends by the first support member 36A and the second support member 36B, which are pushed up by the first lifting body 51P, and clamped between them and the pressed member 35. Similarly, the substrate KB positioned at the second substrate position PsQ is supported at both ends by the third support member 36C and the fourth support member 36D, which are pushed up by the second lifting body 51Q, and clamped between them and the pressed member 35. The second lane 21B is not used, so the third lifting body 51R and the fourth lifting body 51S are not raised.

[0044] (Extended single mode) In the component mounting device 10 of this embodiment, the first lane 21A is extended to the side of the second lane 21B, and instead of using the second lane 21B, the work can be performed in a mode (referred to as "extended single mode") in which a relatively large substrate KB is transported, positioned, and clamped in the extended first lane 21A to mount the component BH. In extended single mode, as shown in Figures 10(a), (b), and (c), the substrate KB is positioned and clamped at the first substrate position PsP and the second substrate position PsQ of the first lane 21A to perform component mounting work, and the substrate KB is not transported in the second lane 21B.

[0045] In the overhang single mode, as shown in Figures 10(a), (b), and (c), the upstream support member 36 (first support member 36A) provided on the first lane fixed conveyor 22A is located above the first lifting body 51P, and the upstream support member 36 (second support member 36B) provided on the first lane movable conveyor 23A is located above the third lifting body 51R. The downstream support member 36 (third support member 36C) provided on the first lane fixed conveyor 22A is located above the second lifting body 51Q, and the downstream support member 36 (fourth support member 36D) provided on the first lane movable conveyor 23A is located above the fourth lifting body 51S. The upstream support member 36 (fifth support member 36E) provided on the second lane fixed conveyor 22B and the upstream support member 36 (sixth support member 36F) provided on the second lane movable conveyor 23B are both located above the third lifting body 51R, while the downstream support member 36 (seventh support member 36G) provided on the second lane fixed conveyor 22B and the downstream support member 36 (eighth support member 36H) provided on the second lane movable conveyor 23B are both located above the fourth lifting body 51S (Figure 10(a), (b), (c)).

[0046] In the overhang single mode, when clamping a substrate KB positioned at the first substrate position PsP, the first lifting body 51P is raised from the normal height (H=H0) to the clamping height (H=H1), and the third lifting body 51R is also raised from the normal height (H=H0) to the clamping height (H=H1). As a result, the first support member 36A is pushed up by the first lifting body 51P, and the second support member 36B is pushed up by the third lifting body 51R, so that both ends of the substrate KB positioned at the first substrate position PsP are supported by the first support member 36A and the second support member 36B and clamped between them and the pressed member 35 (Figure 10(b)).

[0047] Furthermore, in the overhang single mode, when clamping the substrate KB positioned at the second substrate position PsQ, the second lifting body 51Q is raised from the normal height (H=H0) to the clamping height (H=H1), and the fourth lifting body 51S is also raised from the normal height (H=H0) to the clamping height (H=H1). As a result, the third support member 36C is pushed up by the second lifting body 51Q, and the fourth support member 36D is pushed up by the fourth lifting body 51S, so that both ends of the substrate KB positioned at the second substrate position PsQ are supported by the third support member 36C and the fourth support member 36D, and clamped between them and the pressed member 35 (Figure 10(c)).

[0048] In this overhang single mode, when the third lifting body 51R rises and the second support member 36B is pushed up, the fifth support member 36E and the sixth support member 36F are also pushed up together. Similarly, when the fourth lifting body 51S rises and the fourth support member 36D is pushed up, the seventh support member 36G and the eighth support member 36H are also pushed up together. The upper ends of these pushed-up fifth support member 36E, sixth support member 36F, seventh support member 36G, and eighth support member 36H protrude above the conveyor belt 33 of the second lane 21B and enter the transport path for the substrate KB by the second lane 21B. However, since the second lane 21B does not transport the substrate KB, this does not pose any particular problem.

[0049] (Extended Dual Mode) In this embodiment, the component mounting device 10 retains the advantage of being able to perform component mounting work on relatively large substrates KB in the overhang single mode shown in Figures 10(a), (b), and (c), while also utilizing the second lane 21B, which was not used in the overhang single mode, to perform work in a mode (referred to as "overhang dual mode") in which the substrate KB is positioned and clamped and components BH are mounted in the second lane 21B. In overhang dual mode, as shown in Figures 11(a), (b), and (c), two diagonally opposite substrate positions Ps (here referred to as the first substrate position PsP and the fourth substrate position PsS) of the four substrate positions Ps (first substrate position PsP, second substrate position PsQ, third substrate position PsR, and fourth substrate position PsS) set up in a 2x2 matrix in plan view are set as the substrate positions Ps for actually positioning the substrate KB, and then the substrate KB is positioned and clamped at these two set substrate positions Ps to mount the components BH.

[0050] In the overhang dual mode, as shown in Figures 11(a), (b), and (c), the downstream support member 36 (fourth support member 36D) is removed from the first lane movable conveyor 23A, the upstream support member 36 (fifth support member 36E) is removed from the second lane fixed conveyor 22B, and the upstream support member 36 (sixth support member 36F) is removed from the second lane movable conveyor 23B. These support members 36 (fourth support member 36D, fifth support member 36E, and sixth support member 36F) are some of the support members 36 that are not involved in clamping the substrate KB at the first substrate position PsP or clamping the substrate KB at the fourth substrate position PsS, and if they were left on the second lane movable conveyor 23B, the problems described later would occur.

[0051] In the overhang dual mode shown in Figures 11(a), (b), and (c), the upstream support member 36 (first support member 36A) on the first fixed lane conveyor 22A is located above the first lifting body 51P, and the upstream support member 36 (second support member 36B) on the first movable lane conveyor 23A is located above the third lifting body 51R. The downstream support member 36 (third support member 36C) on the first fixed lane conveyor 22A is located above the second lifting body 51Q. The downstream support member 36 (seventh support member 36G) on the second fixed lane conveyor 22B and the downstream support member 36 (eighth support member 36H) on the second movable lane conveyor 23B are both located above the fourth lifting body 51S.

[0052] Furthermore, the third support member 36C (the downstream support member 36 provided on the first lane fixed conveyor 22A) may be removed. The second lifting body 51Q does not need to be raised because it is not involved in clamping the substrate KB at the second substrate position PsQ, and therefore the third support member 36C is not pushed up by the second lifting body 51Q.

[0053] In the overhang dual mode shown in Figures 11(a), (b), and (c), when clamping the substrate KB positioned at the first substrate position PsP, the first lifting body 51P is raised from the normal height (H=H0) to the clamping height (H=H1), and the third lifting body 51R is also raised from the normal height (H=H0) to the clamping height (H=H1). As a result, the first support member 36A is pushed up by the first lifting body 51P, and the second support member 36B is pushed up by the third lifting body 51R, so that both ends of the substrate KB positioned at the first substrate position PsP are supported by the first support member 36A and the second support member 36B and clamped between them and the pressed member 35 (Figure 11(b)).

[0054] Furthermore, in the overhang single mode shown in Figures 11(a), (b), and (c), when clamping the substrate KB positioned at the fourth substrate position PsS, the fourth lifting body 51S is raised from the normal height (H=H0) to the clamping height (H=H1). As a result, both the seventh support member 36G and the eighth support member 36H are pushed up by the fourth lifting body 51S, and both ends of the substrate KB positioned at the fourth substrate position PsS are supported by the seventh support member 36G and the eighth support member 36H, and clamped between them and the pressed member 35 (Figure 11(c)). Note that the second lifting body 51Q does not need to be raised and is therefore not raised.

[0055] Here, if the fourth support member 36D were to remain attached to the first lane movable conveyor 23A, the fourth support member 36D would be pushed up by the fourth lifting body 51S, and the upper end of the pushed-up fourth support member 36D would protrude above the conveyor belt 33 of the first lane 21A (entering the transport path of the substrate KB by the first lane 21A), thus obstructing the transport of the substrate KB by the first lane 21A.

[0056] Furthermore, if the fifth support member 36E were to remain attached to the second lane fixed conveyor 22B and the sixth support member 36F were to remain attached to the second lane movable conveyor 23B, then the fifth support member 36E and the sixth support member 36F would be pushed up by the third lifting body 51R, and the upper ends of the pushed-up fifth support member 36E and the sixth support member 36F would protrude above the conveyor belt 33 of the second lane 21B (entering the transport path of the substrate KB by the second lane 21B), thus obstructing the transport of the substrate KB by the second lane 21B. However, in the overhang dual mode, the fourth support member 36D is removed from the first lane movable conveyor 23A, the fifth support member 36E is removed from the second lane fixed conveyor 22B, and the sixth support member 36F is removed from the second lane movable conveyor 23B. Therefore, there is no inconvenience in that the transport of substrates KB by the first lane 21A and the transport of substrates KB by the second lane 21B are not hindered.

[0057] By the way, in the overhang dual mode shown in Figures 11(a), (b), and (c), the two diagonally opposite board positions Ps for positioning the board KB were set to the first board position PsP and the fourth board position PsS, but they can also be set to the second board position PsQ and the third board position PsR (Figures 12(a), (b), and (c)).

[0058] In this case, as shown in Figures 12(a), (b), and (c), the upstream support member 36 (second support member 36B) is removed from the first lane movable conveyor 23A, the downstream support member 36 (seventh support member 36G) is removed from the second lane fixed conveyor 22B, and the downstream support member (eighth support member 36H) is removed from the second lane movable conveyor 23B. These support members 36 (second support member 36B, seventh support member 36G, and eighth support member 36H) are all parts of the support members 36 that are not involved in either clamping the substrate KB at the second substrate position PsQ or clamping the substrate KB at the third substrate position PsR, and if they were left in place, the same inconveniences would occur for the reasons described above.

[0059] In the overhang dual mode shown in Figures 12(a), (b), and (c), the downstream support member 36 (third support member 36C) on the first lane fixed conveyor 22A is located above the second lifting body 51Q, and the downstream support member 36 (fourth support member 36D) on the first lane movable conveyor 23A is located above the fourth lifting body 51S. The upstream support member 36 (first support member 36A) on the first lane fixed conveyor 22A is located above the first lifting body 51P. The upstream support member 36 (fifth support member 36E) on the second lane fixed conveyor 22B and the upstream support member 36 (sixth support member 36F) on the second lane movable conveyor 23B are both located above the third lifting body 51R.

[0060] Furthermore, the first support member 36A (the upstream support member 36 provided on the first lane fixed conveyor 22A) may be removed. This is because the first lifting body 51P does not participate in clamping the substrate KB at the first substrate position PsP and therefore does not need to be raised, and consequently the first support member 36A is not pushed up by the first lifting body 51P.

[0061] In the overhang dual mode shown in Figures 12(a), (b), and (c), when clamping the substrate KB positioned at the second substrate position PsQ, the second lifting body 51Q is raised from the normal height (H=H0) to the clamping height (H=H1), and the fourth lifting body 51S is also raised from the normal height (H=H0) to the clamping height (H=H1). As a result, the third support member 36C is pushed up by the first lifting body 51P, and the fourth support member 36D is pushed up by the fourth lifting body 51S, so that both ends of the substrate KB positioned at the second substrate position PsQ are supported by the third support member 36C and the fourth support member 36D and clamped between them and the pressed member 35 (Figure 12(b)).

[0062] Furthermore, in the overhang single mode shown in Figures 12(a), (b), and (c), when clamping the substrate KB positioned at the third substrate position PsR, the third lifting body 51R is raised from the normal height (H=H0) to the clamping height (H=H1). As a result, both the fifth support member 36E and the sixth support member 36F are pushed up by the third lifting body 51R, and both ends of the substrate KB positioned at the third substrate position PsR are supported by the fifth support member 36E and the sixth support member 36F and clamped between them and the pressed member 35 (Figure 12(c)). Note that the first lifting body 51P does not need to be raised and is therefore not raised.

[0063] In the overhang dual mode (Figures 11(a), (b), (c) or 12(a), (b), (c)), there is only one substrate position Ps in the first lane 21A where positioning, clamping, and component mounting can be performed, which is fewer than the two in the overhang single mode (Figures 10(a), (b), (c)). However, since substrates KB of a different type (relatively small substrates KB) that are positioned, clamped, and mounted in the first lane 21A can also be positioned, clamped, and mounted in the second lane 21B simultaneously, the productivity of the component mounting device 10 is improved.

[0064] The embodiments described so far include the following items.

[0065] (Item 1) The component mounting device 10 of item 1 includes a substrate transport unit 12 that positions substrates KB at four substrate positions Ps (first substrate position PsP, second substrate position PsQ, third substrate position PsR, fourth substrate position PsS) arranged in a matrix along the upstream and downstream sides of each of the two transport lanes 21, and a mounting head 15 that mounts components BH onto the substrates KB positioned by the substrate transport unit 12. Below each of the four substrate positions Ps, there are four vertically movable lifting bodies (first lifting body 51P, second lifting body 51Q, third lifting body 51R, and fourth lifting body 51S). These four lifting bodies rise individually, pushing up the support members (first support member 36A to eighth support member 36H) located on the upstream and downstream sides of each of the two transport lanes 21, thereby supporting both ends of the substrate KB positioned at the substrate position Ps. Each of the two transport lanes 21 consists of a fixed conveyor 22 located outside of each other and a movable conveyor 23 located inside each other that is movable in a second direction. When attempting to transport substrates KB simultaneously and in parallel by each of the two transport lanes 21, with the movable conveyor 23 (first lane movable conveyor 23A) of one of the two transport lanes 21 (first lane 21A) positioned to extend above two lifting bodies 51 (third lifting body 51R and fourth lifting body 51S) that move up and down below the other transport lane 21 (second lane 21B), all or part of the multiple support members 36 corresponding to two other substrate positions Ps that are different from the two substrate positions Ps located at one diagonal position set as the substrate positions Ps that support the substrate KB are removed from the two transport lanes 21, or the substrates KB are supported at one diagonal position in a state where they are not pushed up by the lifting bodies 51 even when the lifting bodies 51 rise.

[0066] According to the component mounting device of item 1, the component mounting work can be performed by transporting substrates KB by each of the two transport lanes 21 with one transport lane 21 (first lane 21A) extended to the side of the other transport lane 21 (second lane 21B). By extending one transport lane 21 (first lane 21A) to the side of the other transport lane 21 (second lane 21B), the positioning, clamping, and component mounting of relatively large substrates KB can be performed on the first lane 21A in parallel with the positioning, clamping, and component mounting of substrates KB of a different type (relatively small substrates KB), thereby increasing the productivity of the component mounting device 10.

[0067] (Item 2) The component mounting device 10 of item 2 is the component mounting device of item 1, wherein the two transport lanes 21 consist of a first lane 21A and a second lane 21B, and the four substrate positions Ps consist of a first substrate position PsP on the upstream side of the first lane 21A and a second substrate position PsQ on the downstream side, and a third substrate position PsR on the upstream side of the second lane 21B and a fourth substrate position PsS on the downstream side. The four lifting bodies consist of a first lifting body 51P that moves up and down below the first substrate position PsP, a second lifting body 51Q that moves up and down below the second substrate position PsQ, a third lifting body 51R that moves up and down below the third substrate position PsR, and a fourth lifting body 51S that moves up and down below the fourth substrate position PsS. The support member 36 consists of a first support member (first support member 36A) provided on the fixed conveyor 22 of the first lane 21A and pushed up by the first lifting body 51P, a second support member (second support member 36B) provided on the movable conveyor 23 of the first lane 21A and pushed up by the first lifting body 51P or the third lifting body 51R, and a third support member (third support member 36C) provided on the fixed conveyor 22 of the first lane 21A and pushed up by the second lifting body 51Q. It consists of a fourth support member (fourth support member 36D) provided on the movable conveyor 23 of the first lane 21A and pushed up by the second lifting body 51Q or the fourth lifting body 51S, a fifth support member (fifth support member 36E) provided on the fixed conveyor 22 of the second lane 21B and pushed up by the third lifting body 51R, a sixth support member (sixth support member 36F) provided on the movable conveyor 23 of the second lane 21B and pushed up by the third lifting body 51R, a seventh support member (seventh support member 36G) provided on the fixed conveyor 22 of the second lane 21B and pushed up by the fourth lifting body 51S, and an eighth support member (eighth support member 36H) provided on the movable conveyor 23 of the second lane 21B and pushed up by the fourth lifting body 51S. Item 2 provides specific examples of the two transport lanes, two substrate positions, four lifting bodies, and support members in the component mounting device 10 of Item 1. In Item 2, the effects of Item 1 can be obtained by specifying the two transport lanes, two substrate positions, four lifting bodies, and support members as described above.

[0068] (Item 3) The component mounting device 10 of item 3 is the component mounting device described in item 2, and when the two diagonally opposite board positions Ps set as board positions Ps supporting the board KB are the first board position PsP and the fourth board position PsS, the fifth support member 36E and the sixth support member 36F are removed from the second lane 21B, or the fifth support member 36E and the sixth support member 36F are prevented from being pushed up by the third lifting body 51R, and the fourth support member 36D is removed from the first lane 21A, or the fourth support member 36D is prevented from being pushed up by the fourth lifting body 51S. Then, by raising the first lifting body 51P and the third lifting body 51R, the substrate KB located at the first substrate position PsP is supported by the first support member 36A and the second support member 36B, and by raising the fourth lifting body 51S, the substrate KB located at the fourth substrate position PsS is supported by the seventh support member 36G and the eighth support member 36H. Item 3 is a concrete example of the operation of the component mounting device 10 in Item 2. In Item 3, the effect of Item 2 (i.e., the effect of Item 1) is obtained under the specific operation described above.

[0069] (Item 4) The component mounting device 10 of item 4 is the component mounting device 10 of item 2, and when the two diagonally opposite board positions Ps set as board positions Ps supporting the board KB are the second board position PsQ and the third board position PsR, the seventh support member 36G and the eighth support member 36H are removed from the second lane 21B, or the seventh support member 36G and the eighth support member 36H are prevented from being pushed up by the fourth lifting body 51S, and the second support member 36B is removed from the first lane 21A, or the second support member 36B is prevented from being pushed up by the third lifting body 51R. Then, by raising the second lifting body 51Q and the fourth lifting body 51S, the third support member 36C and the fourth support member 36D support the substrate KB located at the second substrate position PsQ, and by raising the third lifting body 51R, the fifth support member 36E and the sixth support member 36F support the substrate KB located at the third substrate position PsR. Item 4 is a concrete example of the operation of the component mounting device 10 in Item 2. In Item 4, the effect of Item 2 (i.e., the effect of Item 1) is obtained under the specific operation described above.

[0070] This concludes the disclosure, but the technology described herein is not limited to what is stated above, and various modifications are possible. For example, in the above-described embodiment, in order to prevent the support member 36 that does not participate in supporting the substrate KB from adversely affecting the transport of the substrate KB by the transport lane 21, the support member 36 that does not participate in supporting the substrate KB was removed from the transport lane. However, if removing the post member 42 from the support member 36 prevents the support member 36 from being pushed up by the lifting body 51, then instead of removing the support member 36 from the transport lane 21, the post member 42 may be removed from the support member 36. Alternatively, if the post member 42 is configured to be able to be retracted or extended and retracted relative to the support member 36, and the post member 42 can be retracted or retracted relative to the support member 36 to prevent it from being pushed up by the lifting body 51, then instead of removing the support member 36 from the transport lane 21, the post member 42 may be retracted or retracted. [Industrial applicability]

[0071] The present invention provides a component mounting device that allows for the simultaneous and parallel transport of substrates and component mounting operations on both transport lanes, even when the width of one of the two transport lanes is increased to extend to the other side. [Explanation of Symbols]

[0072] 10. Component mounting device 12. Substrate transport section 15 Mounted Heads 21 transport lanes 21A Lane 1 21B Lane 2 22 Fixed conveyor 22A First Lane Fixed Conveyor 22B Second Lane Fixed Conveyor 23 Movable conveyor 23A First Lane Movable Conveyor 23B Second Lane Movable Conveyor 35 Member to be pressed 36 Support Member 36A First support member 36B Second support member 36C Third support member 36D Fourth support member 36E Fifth support member 36F Sixth support member 36G Seventh support member 36H 8th support member 51 Lifting mechanism 51P First Elevator 51Q Second Elevator 51R Third Elevator 51S 4th Elevator Ps board position PsP 1st board position PsQ 2nd board position PsR 3rd board position PsS 4th board position BH parts KB board

Claims

1. A component mounting device comprising: a substrate transport unit that positions substrates at four substrate positions arranged in a matrix, set upstream and downstream along each of the two transport lanes, with two transport lanes extending horizontally in a first direction and arranged side by side in a second direction intersecting the first direction; and a mounting head that mounts components onto the substrates positioned by the substrate transport unit, Below each of the four substrate positions, four vertically movable lifting bodies are provided. These four lifting bodies rise individually, thereby pushing up the support members provided on the upstream and downstream sides of the two transport lanes, and supporting both ends of the substrate positioned at the substrate position. Each of the two transport lanes consists of a fixed conveyor located outside of each other and a movable conveyor located inside of each other that is movable in the second direction. When attempting to transport substrates simultaneously and in parallel by each of the two transport lanes, with the movable conveyor of one of the two transport lanes positioned to extend above the two lifting bodies that move up and down below the other transport lane, all or part of the support members corresponding to the two other substrate positions, which are different from the two substrate positions located at one diagonal position set as substrate support positions among the four substrate positions, are removed from the two transport lanes, or are supported at the one diagonal position in such a state that they are not pushed up by the lifting bodies even when the lifting bodies rise. Component mounting device.

2. The two transport lanes mentioned above consist of a first lane and a second lane. The four substrate positions consist of a first substrate position upstream and a second substrate position downstream of the first lane, and a third substrate position upstream and a fourth substrate position downstream of the second lane. The four lifting bodies consist of a first lifting body that moves up and down below the first substrate position, a second lifting body that moves up and down below the second substrate position, a third lifting body that moves up and down below the third substrate position, and a fourth lifting body that moves up and down below the fourth substrate position. The support members consist of a first support member provided on the fixed conveyor of the first lane and pushed up by the first lifting body, a second support member provided on the movable conveyor of the first lane and pushed up by the first lifting body or the third lifting body, a third support member provided on the fixed conveyor of the first lane and pushed up by the second lifting body, a fourth support member provided on the movable conveyor of the first lane and pushed up by the second lifting body or the fourth lifting body, a fifth support member provided on the fixed conveyor of the second lane and pushed up by the third lifting body, a sixth support member provided on the movable conveyor of the second lane and pushed up by the third lifting body, a seventh support member provided on the fixed conveyor of the second lane and pushed up by the fourth lifting body, and an eighth support member provided on the movable conveyor of the second lane and pushed up by the fourth lifting body. The component mounting device according to claim 1.

3. If the two diagonally opposite positions set as substrate positions for supporting the substrate are the first substrate position and the fourth substrate position, the fifth support member and the sixth support member are removed from the second lane, or the fifth support member and the sixth support member are prevented from being pushed up by the third lifting body, and the fourth support member is removed from the first lane, or the fourth support member is prevented from being pushed up by the fourth lifting body, and then the first lifting body and the third lifting body are raised to support the substrate located at the first substrate position with the first support member and the second support member, and the fourth lifting body is raised to support the substrate located at the fourth substrate position with the seventh support member and the eighth support member. The component mounting device according to claim 2.

4. If the two diagonally opposite positions set as substrate positions for supporting the substrate are the second substrate position and the third substrate position, the seventh support member and the eighth support member are removed from the second lane, or the seventh support member and the eighth support member are prevented from being pushed up by the fourth lifting body, and the second support member is removed from the first lane, or the second support member is prevented from being pushed up by the third lifting body, and then the second lifting body and the fourth lifting body are raised to support the substrate located at the second substrate position with the third support member and the fourth support member, and the third lifting body is raised to support the substrate located at the third substrate position with the fifth support member and the sixth support member. The component mounting device according to claim 2.

Citation Information

Patent Citations

  • Base board carrying device

    JP2019149433A