Substrate transport apparatus and substrate transport method

Abstract

This reduces damage to the substrate when the substrate transport device comes into contact with it. [Solution] The substrate transport device 100 includes an end effector 130A which includes a hand 140 for gripping the substrate W and a plunger 150A that contacts the substrate W and aligns the substrate W. The plunger 150A includes a contact portion 151A that contacts the substrate W by moving in the substrate direction, which is the direction towards the substrate W. The contact portion 151A has a contact bottom surface 1511A that contacts the substrate W and is inclined so that its thickness decreases as it approaches the tip.

Description

Technical Field

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[0005]

[0001] The present disclosure relates to a substrate transfer device and a substrate transfer method, and particularly to a substrate transfer device that grips and transfers a semiconductor substrate or the like.

Background Art

[0002] When manufacturing a semiconductor substrate, a liquid crystal substrate, a panel, etc. (hereinafter, these may be simply referred to as a substrate in general), a plurality of manufacturing apparatuses are used. A transfer device for transferring the substrate between these manufacturing apparatuses is used. The transfer device includes an industrial robot. <000001o>

[0003] Patent Document 1 discloses a substrate gripping hand including a base plate and a guide member provided on the base plate and formed in an L shape when viewed from the horizontal direction. A horizontal portion is provided at the base end portion of the bottom surface of the guide member, and a first corner portion, which is a corner portion formed by the bottom surface and the inner wall surface of the guide member, is formed in a curved shape. A substrate gripping hand for gripping a disk-shaped substrate provided with a guide member is disclosed.

[0004] Patent Document 2 discloses a clamp device capable of holding and releasing a workpiece. This clamp device includes a tip-side fixed block provided on the tip side, a base-end-side fixed block provided on the base end side, and a movable block on a workpiece holding table. Each fixed block has an upward fixed inclined surface formed thereon, and the movable block has a downward movable inclined surface formed thereon. When holding the workpiece, with the workpiece placed across the upward fixed inclined surface, the movable block is advanced so that the downward movable inclined surface abuts against the side surface of the workpiece. When releasing the workpiece on the workpiece holding table, a clamp device for retreating the movable block in a direction opposite to the workpiece is disclosed.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Patent Document 2

[0006] When a substrate transport device transports a substrate, the contact points of the device move and come into contact with the substrate in order to grip it. During this process, the contact points move at a predetermined speed, which can potentially damage the substrate. For example, if the contact points come into contact with the edge of the substrate, chipping or other damage to the edge of the substrate may occur. [Means for solving the problem]

[0007] A device for transporting substrates includes an end effector which includes a hand for gripping the substrate and a plunger that contacts the substrate and aligns the substrate, wherein the plunger includes a contact portion that contacts the substrate by moving in the direction toward the substrate, which is the direction toward the substrate, and the contact portion has a contact bottom surface that is inclined such that its thickness decreases towards the tip.

[0008] In a method for transporting a substrate, a contact portion driven by a plunger moves in the direction toward the substrate, and the contact bottom surface of the contact portion contacts the substrate. The contact bottom surface is inclined such that its thickness decreases towards its tip, and by further moving the contact portion toward the substrate with the plunger, the contact side surface of the contact portion contacts the substrate, and the substrate is gripped by the contact side surface. [Effects of the Invention]

[0009] This reduces the impact generated when the substrate comes into contact with the contact point. This can sometimes reduce damage to the substrate when the contact point comes into contact with it. [Brief explanation of the drawing]

[0010] [Figure 1] This figure shows the top view of a substrate transport device according to one or more embodiments. [Figure 2A] This is a top view showing a portion of an end effector according to one or more embodiments. [Figure 2B] This is a cross-sectional view showing a portion of an end effector according to one or more embodiments. [Figure 3A] This is a cross-sectional view showing the end effector. [Figure 3B] This is a cross-sectional view showing the end effector. [Figure 3C] This is a cross-sectional view showing the end effector. [Figure 3D] This is a cross-sectional view showing the end effector. [Figure 4A] This figure shows an example of a contact portion according to one or more embodiments. [Figure 4B] This figure shows an example of a contact portion according to one or more embodiments. [Figure 4C] This figure shows an example of a contact portion according to one or more embodiments. [Figure 4D] This figure shows an example of a contact portion according to one or more embodiments. [Figure 5A] This figure shows the acceleration of movement of a substrate when a substrate transport device, which includes a contact portion having a plane perpendicular to the Z direction, grips the substrate. [Figure 5B] This figure shows the acceleration of movement of a substrate when a substrate transport device, which includes contact parts according to one or more embodiments, grips a substrate. [Figure 6] This figure shows the top view of a substrate transport device according to one or more embodiments. [Modes for carrying out the invention]

[0011] A substrate transport device according to one or more embodiments will be described in detail with reference to the drawings. In the drawings, identical or similar parts may be denoted by the same or similar reference numerals. The drawings are schematic, and the relationship between thickness and dimensions, and the ratios of length and thickness of each part are examples only and do not limit the scope of the technical concept. The relationships and ratios of dimensions may differ between drawings. In the following description, when describing the positional relationship of each component, terms such as "top," "bottom," "right side," and "left side" will be used as appropriate based on the orientation of the referenced drawing or a specific object, but these indications do not limit the scope of the technical concept. Expressions such as "top," "bottom," "right side," and "left side" may be used even if the parts are not touching each other. "Longitudinal direction" may mean the direction of the longer side on the main surface of the component. "Width direction" may mean the direction of the shorter side on the main surface of the component. "Height direction" and "up and down direction" may mean the direction related to the thickness of the main surface of the component. Furthermore, the X-axis, Y-axis, Z-axis, or combinations thereof may be displayed in the figures, and the terms "X-axis direction," "Y-axis direction," and "Z-axis direction" may be used in the specification or drawings to describe the direction.

[0012] FIG. 1 is a diagram showing the upper surface of a substrate transfer device 100 according to one or more embodiments. The substrate transfer device 100 includes a base 300, a link 600 rotatably connected to the base 300, and an end effector 130 rotatably connected about a rotation axis 601 and configured to transfer a substrate W. The substrate transfer device 100 may have a telescopic elevator (not shown) capable of moving the link 600 and the end effector 130 in the vertical direction (the Z direction shown in the figure). Also, although only one link 600 is shown in FIG. 1, the present invention is not limited to this, and the substrate transfer device 100 may include two, three, four, or five links 600. Further, the substrate transfer device 100 may be configured such that the end effector 130 is directly connected to the elevator without including the link 600. Furthermore, the substrate transfer device 100 may be configured such that one or more links 600 are directly connected to the base 300 without including the elevator. Although the substrate transfer device 100 shown in FIG. 1 particularly shows a horizontally articulated type substrate transfer device, the present invention is not limited to this, and a so-called linear motion type substrate transfer device etc. having no joints or rotation mechanisms can also be implemented. The various operations of the substrate transfer device 100 are controlled by a controller (not shown). The controller performs various operation controls including lifting and rotation operations of the elevator, the link 600, the end effector 130, etc.

[0013] The end effector 130 includes a hand 140 for gripping substrates such as semiconductor substrates and liquid crystal substrates, or various panels (hereinafter collectively referred to simply as substrate W), and a plunger 150 that contacts the substrate W to grip and align the substrate. The hand 140 includes substrate contact portions 141A, 141B, 142A, and 142B. The plunger 150 includes a movable contact portion 151 for gripping the substrate W and a holder 153. Under the control of the controller, the end effector 130 acquires the substrate W from a predetermined position using the hand 140 and transports the substrate W to a predetermined position. When acquiring a substrate W stored in a FOUP (Front Opening Unified Pod) or the like, the hand 140 moves above or below the substrate W. When it is recognized that the hand 140 has moved to a predetermined position on the substrate W, the hand 140 stops moving forward. Subsequently, the end effector 130 performs a gripping operation on the substrate W. During this operation, the contact portion 151 of the plunger 150 moves and grips the substrate W. The hand 140 may use a so-called edge gripping method to grip the substrate W. In the edge gripping method, the substrate W is held to some extent by the substrate contact portions 141A, 141B, 142A, and 142B, and the contact portion 151 moves and contacts the substrate W. As a result, the contact portion 151 grips the substrate W. After these steps, the end effector 130 can grip the substrate W and transport it to a predetermined position.

[0014] The substrate W includes substrates such as semiconductor substrates and liquid crystal substrates, as well as various types of panels. For example, the substrate W shown in Figure 1 is circular, but is not limited to this. The substrate W may be made of a transparent material containing a light-transmitting material, or it may be semi-transparent or opaque.

[0015] FIG. 2A is a top view showing a part of the end effector 130A according to one or more embodiments. In FIG. 2A, the hand 140 is omitted for convenience of explanation. The end effector 130A includes a plunger 150A. The plunger 150A includes a contact portion 15L A that abuts against the substrate W and fixes the substrate W, and a holder 153A that holds the contact portion 15L A and allows the contact portion 15L A to move freely. The holder 153A is connected to a shaft portion (not shown). The shaft portion has a first end connected to the holder 153A and a second end connected to a drive portion (not shown). The drive portion applies power to the shaft portion, whereby the shaft portion reciprocates in, for example, the longitudinal direction of the shaft portion (the X direction shown in the figure). As the shaft portion reciprocates, the holder 153A also reciprocates. As the holder 153A reciprocates, the contact portion 15L A moves to abut against the substrate to fix the substrate W.

[0016] Figure 2B is a cross-sectional view showing a portion of the end effector 130A according to one or more embodiments. As shown, when acquiring a substrate W, the hand 140 moves below the substrate W, and when it is recognized that the hand 140 has moved to a predetermined position on the substrate W, the hand 140 stops moving and places the substrate W on the hand 140. After that, a gripping operation of the substrate W is performed. During the gripping operation of the substrate W, it is sufficient for the drive of the drive unit to be transmitted to the contact portion 151, so the shaft portion and the contact portion 151A may be directly connected. In other words, the holder 153A is not necessarily required. Also, since it is sufficient for the drive of the drive unit to be transmitted to the contact portion 151A, the contact portion 151A may be connected to the drive unit. In other words, the shaft portion is not necessarily required. The drive unit that provides power for the reciprocating motion of the contact portion 151A may include a motor or a cylinder. Using a motor in the drive unit allows for precise control of position, speed, and torque, enabling delicate motion control. Furthermore, the use of a motor allows for fine adjustment of the gripping force of the contact portion 151A. On the other hand, cylinders include hydraulic and pneumatic cylinders. Hydraulic cylinders offer high output and precise control. Pneumatic cylinders, on the other hand, are lightweight and enable high-speed motion control. Generally, cylinders are suitable as power sources for simple linear motion. However, complex motion and position control using cylinders may be inferior compared to motors. In this embodiment, complex control is unnecessary when gripping the substrate, so even when using a cylinder, damage to the substrate can be minimized.

[0017] Figures 3A, 3B, 3C, and 3D are cross-sectional views of the end effector 130A. These figures will be used to explain the operation of the end effector 130A in gripping the substrate W. Figure 3A shows the state in which the substrate W is placed on the hand 140. First, the contact portion 151A moves toward the substrate W (X direction) by the holder 153A. Figure 3B shows the state in which the contact portion 151A is in contact with the substrate W. When the contact portion 151A moves in the X direction and comes into contact with the substrate W, the contact portion 151A moves at a predetermined speed, so the substrate W may be damaged. For example, since the contact portion 151A comes into contact with the edge of the substrate W, chipping of the edge of the substrate may occur. Figure 3C shows the state in which the contact portion 151A comes into contact with the substrate W and grips it. After the contact portion 151A comes into contact with the substrate W, the contact portion 151A moves further in the X direction. Here, the contact portion 151A in one or more embodiments has a contact bottom surface, which is the bottom surface that the substrate W contacts, and a contact side surface, which is the side surface that the substrate W contacts. Furthermore, the contact interface surface connecting the contact bottom surface and the contact side surface of the contact portion 151A is curved. The contact bottom surface of the contact portion 151A is inclined such that its thickness decreases as it moves toward its tip direction (X direction). In Figure 3C, the substrate W first contacts the contact bottom surface of the contact portion 151A. Subsequently, as the contact portion 151A moves further in the X direction, the substrate W that was in contact with the contact bottom surface of the contact portion 151A moves a distance d upward (Z direction) along the contact interface surface and reaches the contact side surface. Because the contact interface surface of the contact portion 151A in one or more embodiments is curved, the impact on the substrate W is reduced. Figure 3D shows the state in which the contact portion 151A grips the substrate W. The contact portion 151A stops at a position where it can sufficiently grip the substrate W. After that, the substrate transport device 100 transports the substrate W to a predetermined location.

[0018] Figures 4A, 4B, 4C, and 4D show examples of contact portions according to one or more embodiments. Figure 4A shows an example of a contact portion 151A. The contact portion 151A includes a contact bottom surface 1511A, which is the bottom surface that the substrate (not shown) contacts, and a contact side surface 1513A, which is the side surface that the substrate contacts. The contact portion 151A also includes a contact interface surface 1512A that connects the contact bottom surface 1511A and the contact side surface 1513A that the substrate contacts. As shown in the figure, the contact bottom surface 1511A is inclined such that its thickness decreases as it approaches its tip direction (X direction). In other words, the contact bottom surface 1511A is inclined in the opposite direction to the Z direction as it approaches its tip direction. The contact side surface 1513A extends in a nearly vertical direction (Z direction). The contact interface surface 1512A is curved in an arc.

[0019] Figure 4B shows an example of the contact portion 151B. The contact portion 151B includes a contact bottom surface 1511B, which is the bottom surface that the substrate (not shown) contacts, and a contact side surface 1513B, which is the side surface that the substrate contacts. The contact portion 151B also includes a contact interface surface 1512B that connects the contact bottom surface 1511B and the contact side surface 1513B that the substrate contacts. As shown in the figure, the contact bottom surface 1511B is inclined such that its thickness decreases as it approaches its tip (X direction). In other words, the contact bottom surface 1511B is inclined in the opposite direction to the Z direction as it approaches its tip. The contact side surface 1513B is gently curved in the X direction toward the nearly vertical direction (Z direction). In other words, the Z-direction vertex 1514B of the contact side surface 1513B is located in the X direction more than the contact interface surface 1512B. When the contact portion 151B contacts the substrate and grips it, the contact portion 151B moves further in the X direction after contacting the substrate. At this time, the substrate may move rapidly in the Z direction and come off the contact portion, making it impossible to perform an accurate gripping operation. As shown in Figure 4B, the contact side surface 1513B is gently curved in the X direction from the almost vertical direction (Z direction), and this curve extends to the X direction, so even if the substrate moves rapidly in the Z direction, the possibility of it coming off the contact portion can be reduced.

[0020] Figure 4C shows an example of the contact portion 151C. The contact portion 151C includes a contact bottom surface 1511C, which is the bottom surface that the substrate (not shown) contacts, and a contact side surface 1513C, which is the side surface that the substrate contacts. The contact portion 151C also includes a contact interface surface 1512C that connects the contact bottom surface 1511C and the contact side surface 1513C that the substrate contacts. As shown in the figure, the contact bottom surface 1511C curves gently and inclined so that its thickness decreases as it approaches its tip (X direction). In other words, the contact bottom surface 1511C curves gently and inclined in the opposite direction to the Z direction as it approaches its tip. The contact side surface 1513C extends almost vertically (Z direction). The contact interface surface 1512C curves in an arc. Here, the curvature of the contact interface 1512C may be greater than the curvature of the contact bottom surface 1511C.

[0021] Figure 4D shows an example of the contact portion 151D. The contact portion 151D includes a contact bottom surface 1511D, which is the bottom surface that the substrate (not shown) contacts, and a contact side surface 1513D, which is the side surface that the substrate contacts. The contact portion 151D also includes a contact interface surface 1512D that connects the contact bottom surface 1511D and the contact side surface 1513D that the substrate contacts. As shown in the figure, the contact bottom surface 1511D curves gently and becomes thinner as it approaches its tip (X direction). In other words, the contact bottom surface 1511D curves gently and becomes thinner in the opposite direction to the Z direction as it approaches its tip. The contact side surface 1513D curves gently in the X direction toward the almost vertical direction (Z direction). In other words, the vertex 1514D in the Z direction of the contact surface 1513D is located in the X direction more than the contact interface surface 1512D.

[0022] Although the shape of the contact portion has been explained using Figures 4A, 4B, 4C, and 4D, the substrate contact portions 141A, 141B, 142A, and 142B may also have the shapes shown in Figures 4A, 4B, 4C, and 4D.

[0023] Figure 5A shows the acceleration of a substrate when a substrate transport device, which includes a contact portion having a plane perpendicular to the Z direction, grips the substrate. In Figure 5A, the horizontal axis represents time (in seconds) and the vertical axis represents acceleration (G). In Figure 5A, the substrate comes into contact with the contact portion around 0.4 seconds, resulting in a strong acceleration in the X direction. That is, the substrate experiences a certain amount of impact when it comes into contact with the contact portion. On the other hand, Figure 5B shows the acceleration of a substrate when a substrate transport device, which includes a contact portion 151A having the shape of Figure 4A, grips the substrate. In Figure 5B, the horizontal axis represents time (in seconds) and the vertical axis represents acceleration (G). In Figure 5B, the substrate comes into contact with the contact portion around 0.4 seconds, but the acceleration in the X direction is not as large as in Figure 5A. That is, the impact generated when the substrate comes into contact with the contact portion can be reduced. This reduces damage to the substrate when the contact portion comes into contact with it. In Figures 5A and 5B, the substrate transport device holds the substrate for approximately 0.4 seconds after the contact part starts moving and grips the substrate for approximately 0.7 seconds, but this is not limited to these dimensions. For example, the substrate transport device may hold the substrate for approximately 0.2 seconds to 0.6 seconds after the contact part starts moving. Furthermore, the gripping operation may be completed approximately 0.5 seconds to 1 second after the contact part starts moving.

[0024] Figure 6 shows a top view of a substrate transport device 100 according to one or more embodiments. This substrate transport device 100 includes a base 300, a link 600 rotatably connected to the base 300, and an end effector 130 rotatably connected around a rotation axis 601 for transporting substrates W. The substrate transport device 100 may also have an extendable elevator (not shown) that can move the link 600 and the end effector 130 vertically (in the Z direction shown). Although only one link 600 is shown in Figure 6, the substrate transport device 100 is not limited to this and may include two, three, four, or five links 600. Furthermore, the substrate transport device 100 may not include a link 600 and may directly connect the end effector 130 to an elevator (not shown). Furthermore, the substrate transport device 100 may not include an elevator and may directly connect one or more links 600 to the base 300. The substrate transport device 100 in Figure 6 specifically shows a horizontal multi-joint type substrate transport device, but it is not limited to this, and so-called linear type substrate transport devices without joints or rotation mechanisms can also be implemented. Various operations of the substrate transport device 100 are controlled by a controller (not shown). The controller controls various operations, including the lifting and lowering and rotational movements of the elevator, link 600, and end effector 130.

[0025] The end effector 130 includes a hand 140 for gripping substrates such as semiconductor substrates and liquid crystal substrates, or various panels, and a plunger 150 that contacts the substrate W to grip and align the substrate. The hand 140 includes substrate contact portions 141A and 141B. The plunger 150 includes a plurality of movable contact portions 151B and 151C for gripping the substrate W. Under the control of the controller, the end effector 130 acquires the substrate W from a predetermined position using the hand 140 and transports the substrate W to a predetermined position. When acquiring a substrate W stored in a FOUP (Front Opening Unified Pod) or the like, the hand 140 moves above or below the substrate W. When it is recognized that the hand 140 has moved to a predetermined position on the substrate W, the hand 140 stops moving. After that, the gripping operation of the substrate W is performed. At this time, multiple contact portions 151B and 151C of the plunger 150 move and grip the substrate W. As a method for the hand 140 to grip the substrate W, a so-called edge grip method may be used. In the edge grip method, the substrate W is held to some extent by the contact portions 151B, 151C and the substrate contact portions 141A, 141B, and the contact portions 151B and 151C move and come into contact with the substrate W. As a result, the contact portions 151B and 151C grip the substrate W.

[0026] One or more embodiments described herein can be combined with one another insofar as they are practicable within the scope of the intended embodiments. The embodiments described herein should be considered in all respects to be illustrative and not limiting. The illustrated and described embodiments can be extended to include other embodiments in addition to those specifically described without departing from the technical scope. The technical scope should be determined not by the foregoing description alone, but in light of the specification including its equivalents. Accordingly, all configurations including the technical scope and the scope of equivalents are intended to be included in the technical scope.

[0027] The one or more exemplary embodiments described above are specific examples of the following embodiments.

[0028] (Aspect 1) In a device for transporting substrates, The end effector includes a hand for gripping the substrate and a plunger that contacts the substrate and aligns the substrate, The plunger includes a contact portion that contacts the substrate by moving in the direction toward the substrate, which is the direction toward the substrate. The aforementioned contact portion has a contact bottom surface that slopes so as to decrease in thickness towards the tip, in a substrate transport device.

[0029] (Aspect 2) The substrate transport apparatus according to embodiment 1, wherein the contact portion includes a contact interface connected to the contact bottom surface and a contact side connected to the contact interface and positioned substantially vertically.

[0030] (Aspect 3) The substrate transport device according to embodiment 2, wherein after the contact bottom surface contacts the substrate, the contact portion further moves toward the substrate, thereby gripping the substrate with the contact side surface.

[0031] (Aspect 4) The substrate transport apparatus according to embodiment 3, wherein the contact surface includes a curved portion.

[0032] (Appendix 5) The substrate transport apparatus according to embodiment 4, wherein the contact bottom surface includes a curved portion.

[0033] (Aspect 6) The substrate transport apparatus according to embodiment 1, further comprising a drive unit for driving the contact portion.

[0034] (Aspect 7) The substrate transport device according to embodiment 6, wherein the drive unit includes a cylinder, and the contact portion is driven by the power of the cylinder.

[0035] (Pattern 8) The substrate transport apparatus according to embodiment 1, wherein the hand further includes a plurality of substrate contact portions provided at the tip and base of the hand.

[0036] (Aspect 9) The substrate transport device according to embodiment 8, wherein the substrate contact portion provided at the tip of the plurality of substrate contact portions includes a contact interface connected to the contact bottom surface and a contact side connected to the contact interface and arranged substantially vertically.

[0037] (Aspect 10) The substrate contact portion provided at the base of the plurality of substrate contact portions includes a contact interface connected to the contact bottom surface and a contact side connected to the contact interface and positioned substantially vertically. The substrate transport device according to embodiment 9.

[0038] (Aspect 11) In a method for transporting substrates, The contact portion, driven by the plunger, moves in the direction toward the substrate, which is the direction toward the substrate. The contact bottom surface of the contact portion contacts the substrate, and the contact bottom surface is inclined such that its thickness decreases towards its tip. As the plunger moves the contact portion further toward the substrate, the contact surface of the contact portion comes into contact with the substrate. A substrate transport method comprising gripping the substrate with the aforementioned contact surface.

[0039] (Aspect 12) The substrate transport method according to embodiment 11, wherein the contact surface includes a curved portion.

[0040] (Aspect 13) The substrate transport method according to embodiment 11, wherein the contact bottom surface includes a curved portion. [Explanation of Symbols]

[0041] W board 100 Substrate transport device 130, 130A End Effector 140 hands 141A,141B,142A,142B Board contact part 150, 150A plunger 151,151A,151B,151C,151D Contact part 1511A, 1511B, 1511C, 1511D When connecting the bottom surface 1512A, 1512B, 1512C, 1512D (When connecting to the boundary surface) 1513A, 1513B, 1513C, 1513D When connected to the side 153,153A ホルダ 300 abutments 600 リンク 601 return axis

Claims

1. In a device for transporting substrates, The end effector includes a hand for gripping the substrate and a plunger that contacts the substrate and aligns the substrate, The plunger includes a contact portion that contacts the substrate by moving in the direction toward the substrate, which is the direction toward the substrate. The aforementioned contact portion has a contact bottom surface that slopes so as to decrease in thickness towards the tip, in a substrate transport device.

2. The substrate transport apparatus according to claim 1, wherein the contact portion includes a contact interface connected to the contact bottom surface and a contact side connected to the contact interface and positioned substantially vertically.

3. The substrate transport device according to claim 2, wherein after the contact bottom surface contacts the substrate, the contact portion is further moved toward the substrate so that the substrate is gripped by the contact side surface.

4. The substrate transport apparatus according to claim 3, wherein the contact surface includes a curved portion.

5. The substrate transport apparatus according to claim 4, wherein the contact bottom surface includes a curved portion.

6. The substrate transport device according to claim 1, further comprising a drive unit for driving the contact portion.

7. The substrate transport device according to claim 6, wherein the drive unit includes a cylinder, and the contact portion is driven by the power of the cylinder.

8. The substrate transport device according to claim 1, wherein the hand further includes a plurality of substrate contact portions provided at the tip and base of the hand.

9. The substrate transport device according to claim 8, wherein the substrate contact portion provided at the tip of the plurality of substrate contact portions includes a contact interface connected to the contact bottom surface and a contact side connected to the contact interface and arranged substantially vertically.

10. The substrate transport apparatus according to claim 9, wherein the substrate contact portion provided at the base of the plurality of substrate contact portions includes a contact interface connected to the contact bottom surface and a contact side connected to the contact interface and arranged substantially vertically.

11. In a method for transporting substrates, The contact portion, driven by the plunger, moves in the direction toward the substrate, which is the direction toward the substrate. The contact bottom surface of the contact portion contacts the substrate, and the contact bottom surface is inclined such that its thickness decreases towards its tip. By further moving the contact portion toward the substrate using the plunger, the contact surface of the contact portion comes into contact with the substrate. A substrate transport method comprising gripping the substrate with the aforementioned contact surface.

12. The substrate transport method according to claim 11, wherein the contact surface includes a curved portion.

13. The substrate transport method according to claim 11, wherein the contact bottom surface includes a curved portion.

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