Laminated sheets, containers, carrier tapes, and electronic component packaging

Abstract

To provide a laminated sheet that has sufficient bending strength and is less prone to burr formation during punching or slitting, as well as containers, carrier tapes, and electronic component packaging obtained using the same. [Solution] The laminated sheet 10 comprises a base layer 1 and surface layers 2 and 3 laminated on at least one surface of the base layer 1, wherein the base layer 1 contains a first thermoplastic resin and an inorganic filler, and the surface layers 2 and 3 contain a second thermoplastic resin and a conductive material, and the inorganic filler content in the base layer 1 is 0.3 to 28% by mass based on the total amount of the base layer.

Description

Technical Field

[0001] The present invention relates to a laminated sheet, a container, a carrier tape, and an electronic component package.

Background Art

[0002] For packaging containers of intermediate products of industrial products such as electronic devices and automobiles, vacuum-formed trays, embossed carrier tapes, etc. obtained by thermoforming a resin sheet are used. And as a sheet for packaging containers of ICs that dislike static electricity and various components having ICs, a laminated sheet in which a surface layer containing a thermoplastic resin and a conductive material such as carbon black is laminated on a base material layer made of a thermoplastic resin is used (for example, see Patent Documents 1 to 3 below). When manufacturing a carrier tape, a slit product obtained by slitting a raw sheet as necessary is used. In an embossed carrier tape, feed holes and the like used for conveyance in the encapsulation process of various electronic components such as ICs are provided (for example, see Patent Document 4).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Patent Document 2

Patent Document 3

Patent Document 4

Summary of the Invention

Problems to be Solved by the Invention

[0004] In recent years, with the miniaturization of electronic components such as ICs, carrier tapes and similar materials require minimal burrs on their cross-sections when slitting or punching holes in the raw material sheet. On the other hand, resin sheets used to form embossed carrier tapes must not only be resistant to burrs generated by punching and slitting, but also possess sufficient bending strength to prevent cracking during known sheet forming methods such as vacuum forming, pressure forming, and press forming.

[0005] The present invention aims to provide a laminated sheet that has sufficient bending strength and is less prone to generating burrs during punching or slitting, as well as a container, carrier tape, and electronic component packaging obtained using the same. [Means for solving the problem]

[0006] To solve the above problems, one aspect of the present invention provides a laminated sheet comprising a base layer and a surface layer laminated on at least one surface of the base layer, wherein the base layer comprises a first thermoplastic resin and an inorganic filler, and the surface layer comprises a second thermoplastic resin and a conductive material, and the inorganic filler content in the base layer is 0.3 to 28% by mass based on the total amount of the base layer.

[0007] In the laminated sheet described above, it is preferable that the average primary particle size of the inorganic filler is 25 nm to 5.0 μm.

[0008] The above substrate layer may contain carbon black as an inorganic filler.

[0009] The above-mentioned substrate layer may include, as the first thermoplastic resin, a thermoplastic resin of the same type as the second thermoplastic resin contained in the surface layer, and as the inorganic filler, an inorganic filler made of the same material as the conductive material contained in the surface layer.

[0010] The content of the conductive material in the above-mentioned surface layer can be 10 to 30% by mass, based on the total amount of the surface layer.

[0011] The thickness of the base material layer can be 70 to 97% of the thickness of the entire laminated sheet.

[0012] Another aspect of the present invention provides a container which is a molded body of the above laminated sheet.

[0013] Another aspect of the present invention provides a carrier tape which is a molded body of the above laminated sheet and is provided with a storage portion capable of storing an article.

[0014] Another aspect of the present invention provides an electronic component package including the above carrier tape, an electronic component stored in the storage portion of the carrier tape, and a cover film adhered to the carrier tape as a lid material.

Advantages of the Invention

[0015] According to the present invention, it is possible to provide a laminated sheet having sufficient folding strength and being less likely to generate burrs by punching or slitting, and a container, a carrier tape, and an electronic component package obtained by using the same.

Brief Description of the Drawings

[0016] [Figure 1] It is a schematic cross-sectional view showing an embodiment of the laminated sheet. [Figure 2] It is a partially cutaway perspective view showing an embodiment of the carrier tape. [Figure 3] It is a partially cutaway perspective view showing an embodiment of the electronic component package.

Embodiments for Carrying Out the Invention

[0017] Hereinafter, preferred embodiments of the present invention will be described in detail.

[0018] [Laminated Sheet] The laminated sheet of the present embodiment includes a base material layer and a surface layer laminated on at least one surface of the base material layer. The base material layer contains a first thermoplastic resin and an inorganic filler, and the surface layer contains a second thermoplastic resin and a conductive material. Note that the first thermoplastic resin and the second thermoplastic resin may be the same resin or different resins from each other.

[0019] FIG. 1 is a schematic cross-sectional view showing an embodiment of the laminated sheet of the present embodiment. The laminated sheet 10 shown in FIG. 1 includes a base material layer 1 and surface layers 2 and 3 laminated on both surfaces of the base material layer 1. The surface layer may be laminated only on one surface of the base material layer 1.

[0020] <Base material layer> Examples of the first thermoplastic resin contained in the base material layer include styrene resins, olefin resins, polycarbonate resins, and polyester resins (PET, PBT, etc.). These thermoplastic resins can be used alone or in combination of two or more.

[0021] Examples of the styrene resin include polystyrene resin (GPPS), impact-resistant polystyrene resin (rubber-modified styrene resin, HIPS), and copolymers of monomers such as acrylonitrile, butadiene, ethylene-propylene-diene, butadiene, and methyl methacrylate with styrene (AS, ABS, AES, MS, etc.).

[0022] Examples of the aromatic vinyl monomer constituting the styrene resin include styrene, vinyltoluene, o-methylstyrene, p-methylstyrene, p-tert-butylstyrene, 1,3-dimethylstyrene, α-methylstyrene, vinylnaphthalene, vinylanthracene, 1,1-diphenylethylene, etc. Among these aromatic vinyl monomers, styrene, vinyltoluene, o-methylstyrene, etc. can be used, and styrene is preferably used.

[0023] Impact-resistant polystyrene resin is a polystyrene resin in which styrene monomers are graft-polymerized onto a rubbery elastic body mainly composed of conjugated dienes. Examples of conjugated dienes that can be used include 1,3-butadiene, 2-methyl-1,3-butadiene (isoprene), 2,3-dimethyl-1,3-butadiene, 1,3-pentadiene, and 1,3-hexadiene. Of these, 1,3-butadiene is preferred.

[0024] Examples of olefin resins include polyethylene resins such as high-density polyethylene, ultra-low-density polyethylene, and linear low-density polyethylene; polypropylene resins; and ethylene-α-olefin copolymers obtained by copolymerizing ethylene with α-olefin hydrocarbons having 3 or more carbon atoms, such as propylene, 1-butene, and 1-hexene. Olefin resins may also be copolymers of olefins with monomers having polar groups copolymerizable with olefins. Examples of such resins include ethylene-vinyl acetate copolymers, ethylene-acrylic acid copolymers, ethylene-ethyl acrylate copolymers, ethylene-methacrylic acid ester copolymers, and ethylene-vinyl acetate-vinyl chloride copolymers, which are terpolymers. These olefin resins can be used alone or in combination with other olefin resins.

[0025] Examples of polycarbonate resins include aromatic polycarbonate resins, aliphatic polycarbonate resins, and aromatic-aliphatic polycarbonates. Aromatic polycarbonate resins are typically classified as engineering plastics and can be obtained by polycondensation of bisphenol A and phosgene or bisphenol A and carbonate esters. Aromatic polycarbonate resins are preferred in terms of mechanical strength.

[0026] As the polyester resin, a resin obtained by polycondensation reaction between a dicarboxylic acid and a diol can be used. Examples of dicarboxylic acids include phthalic acid, isophthalic acid, terephthalic acid, 2-methylterephthalic acid, 4,4'-diphenyldicarboxylic acid, 5-sulfisophthalic acid, 2,6-naphthalenedicarboxylic acid, malonic acid, succinic acid, glutaric acid, adipic acid, maleic acid, and maleic anhydride. These can be used individually or in combination of two or more. Examples of diols include ethylene glycol, diethylene glycol, polyethylene glycol, propylene glycol, polypropylene glycol, and 1,3-propanediol. These can be used individually or in combination of two or more.

[0027] The base layer preferably contains one or more of the following: styrene resin, polycarbonate resin, and polyester resin.

[0028] Examples of inorganic fillers included in the substrate layer include carbon black, graphite, CNTs, graphite, calcium carbonate, talc, and silica. These inorganic fillers can be used individually or in combination of two or more.

[0029] Inorganic fillers may be surface-modified, such as through oxidation treatment or coating, to improve their compatibility and dispersibility with thermoplastic resins.

[0030] The shape of the inorganic filler is not particularly limited, but may be spherical, needle-shaped, plate-shaped, or flaky.

[0031] From the viewpoint of achieving a high level of both burr suppression and bending strength, the average primary particle size of the inorganic filler is preferably 25 nm to 5.0 μm, more preferably 25 nm to 100 nm, and even more preferably 25 nm to 55 nm.

[0032] The average primary particle size of the inorganic filler can be determined by the following method. First, an ultrasonic disperser is used to disperse an inorganic filler sample in chloroform for 10 minutes under conditions of 150 kHz and 0.4 kW to prepare a dispersed sample. This dispersed sample is sprinkled onto a carbon-reinforced support film and fixed, and then photographed with a transmission electron microscope (JEOL, JEM-2100). From the image magnified 50,000 to 200,000 times, the particle size (maximum diameter for non-spherical shapes) of more than 1,000 inorganic fillers is measured randomly using an Ender device, and the average value is taken as the average primary particle size.

[0033] The inorganic filler content in the base layer can be 0.3 to 28% by mass, based on the total amount of the base layer. Laminated sheets having such a base layer have sufficient bending strength and are less prone to burr formation during punching or slitting. From the viewpoint of further suppressing burr formation, the inorganic filler content is preferably 0.9 to 28% by mass, and more preferably 6 to 28% by mass, based on the total amount of the base layer. From the viewpoint of achieving bending strength, the inorganic filler content is preferably 0.3 to 25% by mass, and more preferably 0.3 to 10% by mass, based on the total amount of the base layer.

[0034] From the same viewpoint as described above, the inorganic filler content in the base layer may be 0.3 to 28% by mass, 0.9 to 28% by mass, 6 to 28% by mass, 0.3 to 25% by mass, or 0.3 to 10% by mass, based on the total mass of the first thermoplastic resin and the inorganic filler.

[0035] Various additives such as plasticizers, processing aids, and conductive materials can be added to the base layer.

[0036] The base layer may contain recycled materials. Examples of recycled materials include crushed ends of laminated sheets in which the base layer and surface layer are laminated, and scraps from the manufacturing process. The proportion of recycled materials in the base layer can be 2 to 30% by mass, 2 to 20% by mass, or 2 to 15% by mass, based on the total amount of the base layer.

[0037] The base layer may contain, as a first thermoplastic resin, the same type of thermoplastic resin as the second thermoplastic resin contained in the surface layer, and as an inorganic filler, an inorganic filler made of the same material as the conductive material contained in the surface layer. Such a base layer can be formed by the compounding of the recycled material described above. In this case, the amount of recycled material can be appropriately set so that the inorganic filler content in the base layer falls within the range described above.

[0038] The thickness of the base layer may be 100 to 300 μm. The thickness of the base layer (T1 in Figure 1) can be 70 to 97% of the total thickness of the laminated sheet (T0 in Figure 1). When the surface layer is provided on both sides of the base layer, the thickness of the base layer is preferably 70 to 94% of the total thickness of the laminated sheet. When the surface layer is provided on only one side of the base layer, the thickness of the base layer is preferably 85 to 97% of the total thickness of the laminated sheet.

[0039] <Surface layer> As the second thermoplastic resin included in the surface layer, the same resin as the first thermoplastic resin described above can be used.

[0040] The surface layer preferably contains one or more of the following: styrene resin, polycarbonate resin, and polyester resin.

[0041] Examples of conductive materials included in the surface layer include carbon black, graphite, CNTs, graphite, and Ketjenblack. These conductive materials can be used individually or in combination of two or more.

[0042] The conductive material may be in the form of particles, in which case the average primary particle size of the conductive material may be 10 nm to 5.0 μm or 20 to 50 nm. The average primary particle size of the conductive material can be determined in the same way as the average primary particle size of the inorganic filler described above.

[0043] The content of conductive material in the surface layer can be 10 to 30% by mass, or 20 to 30% by mass, based on the total amount of the surface layer.

[0044] The surface layer has a surface resistivity of 10 2 ~10 10 It is preferable that the surface resistivity of the surface layer is within this range. When the surface resistivity of the surface layer is within this range, it becomes easier to prevent damage to electronic components due to static electricity or damage to electronic components due to the inflow of electricity from the outside.

[0045] Various additives such as lubricants, plasticizers, and processing aids can be added to the surface layer.

[0046] The thickness of the surface layer may be 10 to 100 μm. If the surface layer is provided on both sides of the substrate layer, the thickness of each surface layer (T in Figure 1) 2、 T3) may be the same or may be different.

[0047] The thickness of the laminated sheet can be set appropriately depending on the application, and can range from 100 μm to 1.0 mm. When used as packaging containers or carrier tapes for miniaturized electronic components, for example, it can be 100 to 300 μm.

[0048] The laminated sheet in this embodiment may be an unprocessed raw sheet, or it may be a sheet that has undergone a predetermined process such as slitting.

[0049] The laminated sheet of this embodiment can be molded into shapes suitable for the application by known thermoforming methods such as vacuum forming, pressure forming, and press forming.

[0050] The laminated sheet of this embodiment can be used as a material for packaging containers for active components such as ICs, components equipped with ICs, passive components such as capacitors and connectors, and mechanical components. It is also suitable for use in vacuum-formed trays, magazines, and embossed carrier tapes (embossed carrier tapes).

[0051] According to the laminated sheet of this embodiment, burrs are less likely to be generated during punching or slitting. As a result, burrs generated during slitting can be made extremely small in slit products, and burrs generated on the cross-section when punching out feed holes, etc., in embossed carrier tapes can be made extremely small. Furthermore, since the laminated sheet of this embodiment has sufficient bending strength, the occurrence of cracks during molding can be suppressed.

[0052] [Method for manufacturing laminated sheets] The laminated sheet according to this embodiment can be manufactured by a general method. For example, a substrate layer forming composition for forming a substrate layer is prepared, which consists of pellets obtained by kneading and pelletizing the raw materials constituting the substrate layer using a known method such as an extruder, and a surface layer forming composition for forming a surface layer is prepared, which consists of pellets obtained by kneading and pelletizing the raw materials constituting the surface layer using a known method such as an extruder. These pellets can then be used to form a laminated sheet by a known method such as an extruder. The extruder temperature can be set to, for example, 200 to 280°C.

[0053] The base layer and the surface layer may be formed by first extruding the base layer forming composition and the surface layer forming composition into sheets or films using separate extruders, and then laminating them in stages using methods such as heat lamination, dry lamination, and extrusion lamination. Alternatively, a surface layer made of the surface layer forming composition may be laminated onto one or both sides of a base layer sheet that has been pre-formed from the base layer forming composition by methods such as extrusion coating.

[0054] Furthermore, laminated sheets can be manufactured by supplying the raw materials constituting the base layer and the surface layer (for example, the pellets mentioned above) to separate extruders and using a multilayer co-extrusion method such as extrusion molding using a multilayer T-die with a multi-manifold, or T-die extrusion molding using a feed block. This method is preferable because it allows for the production of a laminated sheet in a single step.

[0055] When recycled material is incorporated into the base layer, the raw materials for the base layer and the recycled material can be supplied to the extruder that forms the base layer. In this case, the amount of raw materials supplied to the extruder is appropriately adjusted according to the type and amount of recycled material to obtain a predetermined base layer composition.

[0056] [Containers, carrier tapes, and electronic component packaging] The container of this embodiment is a molded body of the laminated sheet according to the above embodiment. The container can be obtained by molding the laminated sheet according to the present embodiment into a shape suitable for the application. As the molding method, known thermoforming methods such as vacuum forming, pressure forming, and press forming can be used.

[0057] The molding temperature can range from 100 to 500°C.

[0058] The carrier tape of this embodiment is a molded laminated sheet according to the above embodiment, and is provided with a storage section capable of accommodating articles. Figure 2 is a perspective view showing one embodiment of the carrier tape. The carrier tape 100 shown in Figure 2 is an embossed carrier tape consisting of a molded laminated sheet 12 according to the present embodiment, which is provided with a storage section 20 by embossing. The molded sheet 12 is provided with feed holes 30 that can be used for transporting various electronic components such as ICs in encapsulation processes. Holes for inspecting electronic components may be provided at the bottom of the storage section 20.

[0059] The feed holes 30 can be provided, for example, by punching. In this embodiment, the laminated sheet can minimize the amount of burrs generated on the punched cross-section. Therefore, even when the diameter of the feed holes 30 is small, the risk of foreign matter contamination of components due to burr detachment and the resulting short circuits during mounting can be significantly reduced. For this reason, the carrier tape of this embodiment is suitable as a packaging container for miniaturized electronic components.

[0060] In the carrier tape of this embodiment, the punching burr ratio in the feed holes having the above-described shape can be set to 4.0% or less. Here, the punching burr ratio refers to the ratio of the burr area to a predetermined punched area where no burrs are generated, as viewed from the punching direction. For example, if the punched shape is a perfect circle, the punched area refers to the area of ​​a perfect circle without burrs.

[0061] The carrier tape of this embodiment can be wound up into a reel.

[0062] The carrier tape of this embodiment is suitable as a packaging container for electronic components. Examples of electronic components include ICs, LEDs (light-emitting diodes), resistors, liquid crystals, capacitors, transistors, piezoelectric resistors, filters, crystal oscillators, diodes, connectors, switches, potentiometers, relays, inductors, and the like. The electronic components may be intermediate products using the above components, or they may be final products.

[0063] The electronic component packaging of this embodiment comprises the carrier tape of this embodiment described above, electronic components housed in the housing portion of the carrier tape, and a cover film adhered to the carrier tape as a lid material. Figure 3 is a partially cutaway perspective view showing one embodiment of the electronic component packaging. The electronic component packaging 200 shown in Figure 3 comprises an embossed carrier tape made of a molded laminated sheet 12 according to this embodiment, which is provided with a housing portion 20 and a feed hole 30, electronic components 40 housed in the housing portion 20, and a cover film 50 adhered to the embossed carrier tape.

[0064] Examples of cover films include those disclosed in Japanese Patent No. 4630046 and Japanese Patent No. 5894578.

[0065] The cover film can be heat-sealed to the upper surface of the embossed carrier tape containing the electronic components.

[0066] The electronic component packaging of this embodiment can be used as a carrier tape wound on a reel for storing and transporting electronic components. [Examples]

[0067] The present invention will be described in more detail below with reference to examples and comparative examples, but the present invention is not limited to the following examples.

[0068] [Fabrication of laminated sheets] (Examples 1-17, Comparative Examples 1-2) The raw materials shown in Tables 1 and 2 were weighed to achieve the composition ratios (mass%) shown in the same tables, uniformly mixed using a high-speed mixer, kneaded using a φ45 mm vented twin-screw extruder, and pelletized by the strand-cut method to obtain a resin composition for forming the surface layer and a resin composition for forming the base layer, respectively. Using these compositions, laminated sheets with a surface layer / base layer / surface layer laminated structure were fabricated using a feed-block method with a φ65 mm extruder (L / D=28), a φ40 mm extruder (L / D=26), and a 500 mm wide T-die, such that the surface layers formed on both sides of the base layer had approximately the same thickness. The thickness of the laminated sheet was 0.25 mm, and the thickness ratio of the surface layer / base layer / surface layer was 1:18:1.

[0069] The details of the raw materials shown in Tables 1 and 2 are as follows: Thermoplastic resin 1: Polycarbonate resin (manufactured by Teijin Corporation, product name "Panlight L-1225L") Thermoplastic resin 2: Polybutylene terephthalate resin (manufactured by Mitsubishi Engineering Plastics Corporation, product name "NovaDuran 5010R8M") Thermoplastic resin 3: Impact-resistant polystyrene resin (manufactured by Denka Co., Ltd., product name "H700") Thermoplastic resin 4: Acrylonitrile-butadiene-styrene copolymer (manufactured by Denka Co., Ltd., product name "SE-10") Thermoplastic resin 5: Acrylonitrile-styrene copolymer (manufactured by Denka Co., Ltd., product name "GR-ATR") Conductive material 1: Carbon black (manufactured by Denka Corporation, product name "Denka Black Granules", average primary particle size: 35 nm) Inorganic filler 1: Carbon black (manufactured by Tokai Carbon Co., Ltd., product name "TOKABLAC#5500", average primary particle size: 25nm) Inorganic filler 2: Carbon black (manufactured by Asahi Carbon Co., Ltd., product name "Asahi #51", average primary particle size: 91 nm) Inorganic filler 3: Silica (manufactured by Admatex, product name "YA010C", average primary particle size: 10 nm) Inorganic filler 4: Silica (manufactured by Nippon Shokubai Co., Ltd., product name "KE-P10", average primary particle size: 100 nm)

[0070] The average primary particle size of the conductive material and inorganic filler was determined by the following method. First, using an ultrasonic disperser, a sample of inorganic filler or conductive material was dispersed in chloroform for 10 minutes under conditions of 150 kHz and 0.4 kW to prepare a dispersed sample. This dispersed sample was sprinkled onto a carbon-reinforced support film and fixed, and then photographed with a transmission electron microscope (JEOL, JEM-2100). From the images magnified 50,000 to 200,000 times, the particle size (maximum diameter for shapes other than spherical) of more than 1,000 inorganic fillers was randomly measured using an Ender device, and the average value was defined as the average primary particle size.

[0071] [Evaluation of laminated sheets] Samples were taken in the extrusion direction of the laminated sheet and evaluated using the method described below. These results are summarized in Tables 1 and 2.

[0072] (1) Punching burr ratio Sheet samples were left for 24 hours in an atmosphere of 23°C and 50% relative humidity. Punching holes were then created in these samples using a Muehlbauer vacuum rotary molding machine (CT8 / 24) under the same conditions. The punching was performed at a speed of 240 m / h using a punching device equipped with a cylindrical punching pin with a sprocket hole pin tip diameter of 1.5 mm and a die hole with a diameter of 1.58 mm.

[0073] The sheet punch-out holes formed as described above were photographed using a micro-measuring instrument (Mitutoyo Corporation, product name "MF-A1720H (image unit 6D)") in a light source environment with 0% reflected light, 40% transmitted light, and 0% ring. The captured images were processed using Adobe Photoshop Elements 14 (Adobe, product name) with a two-tone filter set to a threshold of 128 so that only the sprocket hole area would appear white. The number of pixels corresponding to a hole size of 1.5 mm in diameter was defined as the "number of white pixels in a burr-free sprocket hole." The number of white pixels was recorded, and the punch-out burr ratio was calculated using the following formula. Punching burr ratio (%) = (1 - (number of white pixels recorded) / (number of white pixels in burr-free sprocket holes)) × 100

[0074] (2) Folding strength From a sheet sample, a test specimen with a length of 150 mm, a width of 15 mm, and a thickness of 0.25 mm was prepared in accordance with JIS-P-8115 (2001) in the sheet extrusion direction. After leaving this test specimen in an atmosphere of 23°C and 50% relative humidity for 24 hours, the MIT folding strength was measured using an MIT folding fatigue testing machine manufactured by Toyo Seiki Seisakusho in the same atmosphere of 23°C and 50% relative humidity. The measurement was performed under the conditions of a bending angle of 135 degrees, a bending speed of 175 times per minute, and a measurement load of 250 g. The number of bending cycles at which the test specimen broke when this measurement was repeated was evaluated as the folding strength.

[0075] [Table 1]

[0076] [Table 2]

[0077] As shown in Tables 1 and 2, the laminated sheets of Examples 1 to 17 were confirmed to have a fold resistance of 10 or more cycles and a punching burr ratio of 4.0% or less. In particular, the laminated sheets of Examples 9 and 10 were able to achieve both a punching burr ratio of 2.0% or less and a fold resistance of 100 or more cycles. On the other hand, the laminated sheet of Comparative Example 1 had a punching burr ratio exceeding 4.0%, and the laminated sheet of Comparative Example 1 had a fold resistance of less than 10 cycles. [Explanation of symbols]

[0078] 1...Base layer, 2,3...Surface layers, 10...Laminated sheet, 12...Molded body, 20...Housing section, 30...Feed hole, 40...Electronic component, 50...Cover film, 100...Carrier tape, 200...Electronic component packaging.

Claims

1. It comprises a base layer and a surface layer laminated on at least one surface of the base layer, The substrate layer comprises a first thermoplastic resin and an inorganic filler. The surface layer comprises a second thermoplastic resin and a conductive material. The inorganic filler content in the substrate layer is 6 to 28% by mass, based on the total amount of the substrate layer. A laminated sheet that satisfies either condition (a) or condition (b) below. Condition (a): The first thermoplastic resin comprises an acrylonitrile-styrene copolymer, and the second thermoplastic resin comprises a polycarbonate resin and a polyester resin. Condition (b): The first thermoplastic resin contains an impact-resistant polystyrene resin, and the second thermoplastic resin contains an impact-resistant polystyrene resin, and the average primary particle size of the inorganic filler is 25 nm to 5.0 μm.

2. The laminated sheet according to claim 1, which satisfies the above condition (a) and has an average primary particle size of 25 nm to 5.0 μm of the inorganic filler.

3. The laminated sheet according to claim 1 or 2, wherein the substrate layer contains carbon black as the inorganic filler.

4. The laminated sheet according to any one of claims 1 to 3, wherein the content of the conductive material in the surface layer is 10 to 30% by mass, based on the total amount of the surface layer.

5. The laminated sheet according to any one of claims 1 to 4, wherein the thickness of the base material layer is 70 to 97% of the total thickness of the laminated sheet.

6. A container which is a molded body of a laminated sheet according to any one of claims 1 to 5.

7. A carrier tape comprising a molded laminated sheet according to any one of claims 1 to 5, wherein a storage portion capable of accommodating an article is provided.

8. An electronic component packaging comprising a carrier tape as described in claim 7, an electronic component housed in the housing portion of the carrier tape, and a cover film adhered to the carrier tape as a lid material.

Images