Conductive ink composition

Abstract

To provide a conductive structure [Solution] The present invention provides conductive structures. The conductive ink composition comprises a silver complex formed by mixing silver carboxylate, at least one solvent for dissolving the silver carboxylate, and a catalyst. The catalyst comprises an amine that decarboxylates the silver carboxylate to produce the conductive ink composition. The catalyst decarboxylates the silver carboxylate at a temperature of 100°C or below. The present invention also provides an ink composition comprising a metal salt and ligand having sterically bulky counterions. The present invention further provides an ink composition for producing conductive structures, comprising a reducing metal complex formed by mixing a reducing agent dissolved in a solvent with at least one metal salt or metal complex containing a metal of group 4, 5, 6, 7, 8, 9, 10, 11, or 12, wherein the reducing agent reduces the metal to form a conductive structure.

Description

[Technical Field]

[0001] Related applications This application claims priority to U.S. Provisional Patent Application No. 61 / 980,863, No. 61 / 980,933, No. 61 / 980,827, and No. 61 / 980,870, filed on April 17, 2014, which are incorporated herein by reference.

[0002] Field of Invention This disclosure relates in general to novel ink compositions. More specifically, this disclosure relates to methods for preparing novel ink formulations based on metal compositions. [Background technology]

[0003] The electronics, display, and energy industries rely on the manufacture and use of conductive material coatings and patterns for forming circuits on organic and inorganic substrates. Printed electronics offer an attractive alternative to conventional technologies by enabling the low-cost creation of large-area, flexible devices. Many applications exist for highly conductive materials with fine features in solar cell electrodes, flexible displays, radio frequency identification tags, antennas, and many other modern electronic devices. To make these cutting-edge devices increasingly affordable, the substrates used typically have relatively low temperature resilience and require low processing temperatures to maintain integrity.

[0004] The vast majority of commercially produced conductive inks are designed for inkjet, screen printing, or roll-to-roll processing methods, particularly for processing large areas with fine features in a short time. These inks have entirely different viscosity and synthesis parameters. Particle-based inks are typically based on conductive metal particles that are synthesized separately and then mixed into the ink formulation. The resulting inks are then adjusted for specific particle processes.

[0005] Typically, precursor-based inks are based on thermally unstable precursor complexes that reduce to conductive metals upon heating. Conventional particle and precursor-based methods generally rely on high temperatures to form conductive coatings and may therefore be unsuitable for substrates that require low processing temperatures to maintain integrity. For example, silver compounds with carbamates or other ligands with relatively small molecular weights (compared to polymer stabilizers) have been synthesized that decompose at temperatures around 150°C, resulting in electrical conductivity close to that of bulk silver. Unfortunately, even at these temperatures, these inks are unsuitable for many plastic and paper substrates used in flexible electronic and biomedical devices.

[0006] Therefore, an object of the present invention is to provide an improved ink composition. [Overview of the Initiative] [Means for solving the problem]

[0007] This invention discloses improved ink compositions for forming conductors from reactive metals and alloys, and methods for producing conductive structures.

[0008] In one embodiment, the conductive ink composition comprises a silver complex formed by mixing silver carboxylate; at least one solvent for dissolving the silver carboxylate; and a catalyst, the catalyst comprising an amine that decarboxylates the silver carboxylate to produce the conductive ink composition, the catalyst decarboxylates the silver carboxylate at a temperature of 200°C or less.

[0009] In another embodiment, the conductive ink composition comprises a silver complex formed by mixing silver carboxylate, the silver carboxylate comprising silver; at least one solvent for dissolving the silver carboxylate; and a catalyst for reducing the silver of the silver carboxylate to produce the conductive ink composition, the catalyst comprising an amine. The catalyst reduces the silver of the silver carboxylate at a temperature of 200°C or less.

[0010] In another embodiment, a method for producing a conductive structure includes the steps of: decarboxylating silver carboxylate dissolved in a solvent in the presence of an amine to form a silver complex; coating the silver complex onto a substrate; and heating the silver complex on the substrate at a decomposition temperature of about 200°C or less to form a conductive structure.

[0011] In another embodiment, the ink composition comprises a metal salt having sterically bulky counterions and ligands.

[0012] In another embodiment, a method for preparing an ink is disclosed. This method includes the steps of: adding a metal salt having a sterically bulky counterion to a solvent to form a first mixture; and adding a ligand to the first mixture to form an ink composition.

[0013] In another embodiment, a method for producing a conductive structure includes the steps of: adding a metal salt having a sterically bulky counterion to a solvent to form a first mixture; adding a ligand to the first mixture to form an ink composition; and heating the ink composition to form a conductive structure.

[0014] In another embodiment, an ink composition for producing a conductive structure comprises a reducing agent dissolved in a solvent and a reducing metal complex formed by mixing at least one metal salt or metal complex containing a metal, wherein the reducing agent reduces the metal of the metal salt or metal complex to form a conductive structure.

[0015] In another embodiment, an ink composition for producing a conductive structure comprises a reducing metal complex formed by mixing a reducing agent dissolved in a solvent with at least one metal salt or metal complex containing a metal of group 4, 5, 6, 7, 8, 9, 10, 11, or 12, wherein the reducing agent reduces its metal to form a conductive structure, and the reducing agent reduces the metal of the metal salt or metal complex to form a conductive structure.

[0016] In another embodiment, a method for producing a conductive structure includes the steps of: mixing a reducing agent dissolved in at least one solvent with at least one metal salt or metal complex to form a reducing metal complex; coating the reducing metal complex onto a substrate; and decomposing the reducing metal complex on the substrate to form a conductive structure. [Modes for carrying out the invention]

[0017] Method for producing conductive structures from silver precursors This invention discloses a composition for providing a conductive ink structure and a method for producing the composition. The ink composition derived from a silver metal precursor is described in the "Ink Composition for Making a Conductive Silver" application filed on December 20, 2012. This is described in International Patent Application No. PCT / US2012 / 071034, entitled "er Structure," which is incorporated herein by reference in its entirety.

[0018] An improved ink composition is disclosed, formed by creating a silver complex that does not require a high decomposition temperature. By using a lower decomposition temperature and a shorter tack time to form a conductive structure, the improved ink composition is compatible with a wider range of substrates that do not require a high processing temperature to maintain integrity. Furthermore, this method for producing the ink composition is simple and yields high returns.

[0019] This ink composition may have low viscosity, and as a result, it can be adapted to a wide range of patterning techniques, including slot die coating, spin coating, gravure printing, roll-to-roll printing including flexographic printing, rotary screen printing, screen printing, aerosol jet printing, inkjet printing, air brushing, Meyer rod coating, flood coating, 3D printing, and electrohydrodynamic printing. The patterned features are highly conductive at room temperature and can achieve bulk conductivity when decomposed at mild temperatures (e.g., below about 100°C). Finally, this ink can remain stable at room temperature for several months without particle precipitation.

[0020] Therefore, conductive ink compositions (also referred to as “conductive inks” or “inks”) are created for printing highly conductive features at room temperature. Such inks are stable, particle-free, and may be suitable for a wide range of patterning techniques. In one embodiment, a “particle-free” ink is an ink that does not contain particles larger than about 10 nm in diameter. In another embodiment, a “particle-free” ink is an ink having less than about 1% particles, preferably less than about 0.1% particles. Silver salts are used in the ink as precursor materials that ultimately result in a conductive silver coating, line, or pattern of silver. Any suitable silver precursor can be used.

[0021] In one embodiment, the conductive ink composition comprises a silver complex formed by mixing silver carboxylate, at least one solvent for dissolving the silver carboxylate, and a catalyst. The catalyst comprises an amine that decarboxylates the silver carboxylate to produce the conductive ink composition. In one embodiment, the silver carboxylate is soluble in the solvent. As is known to those skilled in the art, solubility is the property of a substance, such as silver carboxylate, to dissolve in a solvent such as a solvent. In one embodiment, the silver complex is first coated onto a substrate. In one embodiment, the catalyst decarboxylates the silver carboxylate at a temperature of about 200°C or less. In one embodiment, the catalyst decarboxylates the silver carboxylate at a temperature of about 100°C or less. In some embodiments, the catalyst decarboxylates silver carboxylate at temperatures of about 220°C, about 210°C or less, about 190°C or less, about 180°C or less, about 170°C or less, about 160°C or less, about 150°C or less, about 140°C or less, about 130°C or less, about 120°C or less, about 110°C or less, about 90°C or less, about 80°C or less, about 70°C or less, about 60°C or less, or about 50°C or less.

[0022] In another embodiment, the conductive ink composition comprises a silver complex formed by mixing silver carboxylate, at least one solvent for dissolving the silver carboxylate, and a catalyst for reducing the silver in the silver carboxylate. In one embodiment, the silver carboxylate is soluble in the solvent. The catalyst contains an amine. In one embodiment, the silver complex is first coated onto a substrate. In one embodiment, the catalyst reduces the silver in the silver carboxylate at a temperature of about 200°C or less. In one embodiment, the catalyst reduces the silver in the silver carboxylate at a temperature of about 100°C or less. In some embodiments, the catalyst reduces the silver in the silver carboxylate at about 210°C or less, about 220°C or less, about 190°C or less, about 180°C or It is reduced at temperatures below that, approximately 170°C or below, approximately 160°C or below, approximately 150°C or below, approximately 140°C or below, approximately 130°C or below, approximately 120°C or below, approximately 110°C or below, approximately 90°C or below, approximately 80°C or below, approximately 70°C or below, approximately 60°C or below, or approximately 50°C or below. Silver carboxylate

[0023] In one embodiment, the silver carboxylate comprises a silver salt of an aliphatic carboxylic acid. In one embodiment, the silver carboxylate comprises a silver salt of a long-chain aliphatic carboxylic acid. In one embodiment, the silver carboxylate comprises a silver salt of a long-chain aliphatic carboxylic acid having 10 to 30 carbon atoms. In one embodiment, the catalyst reduces the silver of the silver carboxylate at high temperatures.

[0024] In one embodiment, the silver carboxylate is selected from the group consisting of silver propionate, silver butyrate, silver pentanoate, silver hexanoate, silver heptanoate, silver ethylhexanoate, silver behenate, silver oleate, silver octanoate, silver nonanoate, silver decanoate, silver neodecanoate, and silver hexafluoroacetylacetoneate. In one embodiment, the silver carboxylate is silver neodecanoate. In one embodiment, the silver carboxylate is silver hexafluoroacetylacetoneate. In one embodiment, the silver carboxylate is silver propionate. In one embodiment, the silver carboxylate is silver butyrate. In one embodiment, the silver carboxylate is silver pentanoate. In one embodiment, the silver carboxylate is silver hexanoate. In one embodiment, the silver carboxylate is silver heptanoate. In one embodiment, the silver carboxylate is silver ethylhexanoate. In one embodiment, the silver carboxylate is silver behenate. In one embodiment, the silver carboxylate is silver oleate. In one embodiment, the silver carboxylate is silver nonanoate. In one embodiment, the silver carboxylate is silver decanoate.

[0025] In one embodiment, about 0.4 grams to about 0.6 grams of silver carboxylate is dissolved in the solvent. In some embodiments, about 0.4 grams, about 0.5 grams, or about 0.6 grams of silver carboxylate is dissolved in the solvent. In one embodiment, about 0.4 grams to about 0.6 grams of silver neodecanoate is dissolved in the solvent. In some embodiments, about 0.4 grams, about 0.5 grams, or about 0.6 grams of silver neodecanoate is dissolved in the solvent. In one embodiment, about 0.4 grams to about 0.6 grams of silver hexafluoroacetylacetate is dissolved in the solvent. In some embodiments, about 0.4 grams, about 0.5 grams, or about 0.6 grams of silver hexafluoroacetylacetate is dissolved in the solvent. Solvent

[0026] As described above, at least one solvent dissolves the disclosed silver carboxylate. The solvent acts as a stabilizer and solvent for the silver carboxylate. The solvent is not intended to act as a reducing agent for the silver carboxylate. In one embodiment, the solvent has a boiling point of about 200°C or less. In one embodiment, the solvent has a boiling point of about 100°C or less. In some embodiments, the solvent has a boiling point of about 220°C or less, about 210°C or less, about 190°C or less, about 180°C or less, about 170°C or less, about 160°C or less, about 150°C or less, about 140°C or less, about 130°C or less, about 120°C or less, about 110°C or less, about 90°C or less, about 80°C or less, about 70°C or less, about 60°C or less, or about 50°C or less.

[0027] In one embodiment, the solvent can be selected based on the type of silver carboxylate used to produce the ink composition. In one embodiment, the solvent can be selected based on the boiling point / tack time for a specific application. In one embodiment, the solvent is Regarding compatibility and wetting properties, the choice of solvent can be based on the type of substrate to which the ink composition will be applied. For example, for inkjet printing or e-jet deposition methods, higher stability is generally preferred, and therefore, it is preferable to use a solvent with a higher boiling point.

[0028] In one embodiment, the solvent is selected from the group consisting of organic solvents, chelating agents, and combinations thereof. In one embodiment, the solvent is at least one organic solvent. In one embodiment, the solvent is at least one nonpolar organic solvent. In one embodiment, the solvent is at least one chelating agent. In one embodiment, the diluent is a mixture of one or more solvents and one or more chelating agents.

[0029] In one embodiment, the solvent is selected from the group consisting of alkane hydrocarbons, carbamates, alkenes, cyclic hydrocarbons, aromatic hydrocarbons, amines, polyamines, amides, ethers, esters, alcohols, thiols, thioethers, phosphines, and combinations thereof.

[0030] In one embodiment, the solvent is an organic solvent. In one embodiment, the solvent is a C 5~20 The solvent may contain one or more linear or branched alkane hydrocarbons. For example, the solvent may contain pentane, hexane, heptane, octane, nonane, decane, undecane, dodecane, tridecane, tetradecane, pentadecane, hexadecane, octadecane, nonadecane, and eicosane.

[0031] In one embodiment, the solvent has a length C 6~20 The solvent may contain one or more cyclic hydrocarbons. For example, the solvent may contain cyclohexane, cycloheptane, cyclooctane, cyclononane, cyclodecane, and decalin. In one embodiment, the solvent may contain aromatic hydrocarbons. For example, the solvent may contain benzene, toluene, xylene, and tetralin. In one embodiment, the solvent is xylene.

[0032] In one embodiment, the solubilizer may include a linear ether, a branched ether, or a cyclic ether. In one embodiment, the solubilizer may include a linear or branched ether. For example, the solubilizer may include dimethyl ether, diethyl ether, dipropyl ether, dibutyl ether, and methyl t-butyl ether. In one embodiment, the solubilizer may include one or more cyclic ethers. For example, the solubilizer may include tetrahydrofuran, tetrahydropyran, dihydropyran, and 1,4-dioxane.

[0033] In one embodiment, the solvent is an alcohol. In one embodiment, the solvent is a primary alcohol, a secondary alcohol, or a tertiary alcohol. In one embodiment, the alcohol is selected from the group consisting of propanol, butanol, pentanol, hexanol, and octanol, and combinations thereof. In one embodiment, the alcohol is selected from the group consisting of 1-propanol, 2-propanol, 1-methoxy-2-propanol, 1-butanol, 2-butanol, 1-pentanol, 2-pentanol, 3-pentanol, 1-hexanol, 2-hexanol, 3-hexanol, 1-octanol, 2-octanol, 3-octanol, tetrahydrofurfuryl alcohol, cyclopentanol, terpineol, and combinations thereof. In one embodiment, the solvent is terpineol.

[0034] In one embodiment, the solvent is a chelating agent. In one embodiment, the solvent is ethylenediaminetetraacetic acid, iminodiacetic acid, ethylenediamine-di(o-hydroxyphenylacetic acid), nitrilotriacetic acid, dihydroxyethylglycine, trans-1,2-cyclohexanediaminetetraacetic acid, diethylenetriamine-N,N The solvent is selected from the group consisting of ,N',N”,N”-pentaacetic acid, glycol etherdiamine-N,N,N',N'-tetraacetic acid, dimethyl sulfoxide, diethylenetriamine, tert-octylamine, tert-butylamine, 2-ethylhexylamine, and ethylenediamine. In one embodiment, the solvent is tert-octylamine. In one embodiment, the solvent is tert-butylamine. In one embodiment, the solvent is 2-ethylhexylamine.

[0035] In one embodiment, an amount of solvent is added such that the silver carboxylate is substantially or completely dissolved in the solvent. In one embodiment, "substantially dissolved" means that the silver carboxylate has a solubility of about 400 g / L in the solvent at 25°C.

[0036] In one embodiment, silver carboxylate is dissolved in about 0.5 mL to about 2.0 mL of solvent. In another embodiment, silver carboxylate is dissolved in about 1.0 mL to about 2.0 mL of solvent. In some embodiments, silver carboxylate is dissolved in about 0.5 mL, about 1.0 mL, about 1.5 mL, or about 2.0 mL of solvent.

[0037] In one embodiment, silver carboxylate is dissolved in about 0.5 mL to about 2.0 mL of xylene. In another embodiment, silver carboxylate is dissolved in about 1.0 mL to about 2.0 mL of xylene. In several embodiments, silver carboxylate is dissolved in about 0.5 mL, about 1.0 mL, about 1.5 mL, or about 2.0 mL of xylene.

[0038] In one embodiment, silver carboxylate is dissolved in about 0.5 mL to about 2.0 mL of terpineol. In another embodiment, silver carboxylate is dissolved in about 1.0 mL to about 2.0 mL of terpineol. In several embodiments, silver carboxylate is dissolved in about 0.5 mL, about 1.0 mL, about 1.5 mL, and about 2.0 mL of terpineol.

[0039] In one embodiment, silver carboxylate is dissolved in a mixture of xylene and terpineol in about 0.5 mL to about 2.0 mL. In another embodiment, silver carboxylate is dissolved in a mixture of xylene and terpineol in about 1.0 mL to about 2.0 mL. In several embodiments, silver carboxylate is dissolved in a mixture of xylene and terpineol in about 0.5 mL, about 1.0 mL, about 1.5 mL, or about 2.0 mL.

[0040] In one embodiment, the solvent contains two organic solvents. In one embodiment, the volume ratio of the two organic solvents is about 1:1 between the first and second organic solvents. In one embodiment, the volume ratio of the two organic solvents is about 2:1 between the first and second organic solvents. In one embodiment, the volume ratio of the two organic solvents is about 3:1 between the first and second organic solvents. In one embodiment, the volume ratio of the two organic solvents is about 4:1 between the first and second organic solvents.

[0041] In one embodiment, the solvent contains two chelating agents. In one embodiment, the volume ratio of the two chelating agents is about 1:1 for the first chelating agent to the second chelating agent. In one embodiment, the volume ratio of the two chelating agents is about 2:1 for the first chelating agent to the second chelating agent. In one embodiment, the volume ratio of the two chelating agents is about 3:1 for the first chelating agent to the second chelating agent. In one embodiment, the volume ratio of the two chelating agents is about 4:1 for the first chelating agent to the second chelating agent.

[0042] In one embodiment, the solvent comprises one organic solvent and one chelating agent. In one embodiment, the volume ratio of the organic solvent to the chelating agent is about 1:about 1. In one embodiment, the volume ratio of the organic solvent to the chelating agent is about 2:about 1. In one embodiment, the volume ratio of the organic solvent to the chelating agent is about 2:about 1. The volume ratio is approximately 3 to 1. In one embodiment, the volume ratio of the organic solvent to the chelating agent is approximately 4 to 1. In one embodiment, the volume ratio of the organic solvent to the chelating agent is approximately 1 to 2. In one embodiment, the volume ratio of the organic solvent to the chelating agent is approximately 1 to 3. In one embodiment, the volume ratio of the organic solvent to the chelating agent is approximately 1 to 4. catalyst

[0043] As discussed above, catalysts are disclosed. In one embodiment, the catalyst is a reducing agent. In one embodiment, the catalyst reduces a silver salt to silver metal. In one embodiment, the catalyst is a decarboxylizer. In one embodiment, the catalyst decarboxylates silver carboxylate to produce a conductive ink composition. In one embodiment, the catalyst reduces the silver in silver carboxylate to produce a conductive ink composition. In one embodiment, the catalyst is both a decarboxylizer and a reducing agent. In one embodiment, the catalyst simultaneously decarboxylates silver carboxylate and reduces the silver in silver carboxylate to produce a conductive ink composition.

[0044] Any suitable silver precursor can be used. In one embodiment, the silver precursor includes Ag(I) or an oxidation state of +1. In one embodiment, the silver precursor includes Ag(II) or an oxidation state of +2. In one embodiment, the silver precursor includes Ag(III) or an oxidation state of +3. In one embodiment, the amount of catalyst added is such that the silver salt is completely reduced to a silver metal having an oxidation state of 0. In one embodiment, a relatively small amount of catalyst is added. In one embodiment, the amount of catalyst added depends on the desired viscosity of the ink.

[0045] In one embodiment, the catalyst is silver ions (Ag + ) silver metal (Ag 0 It can be reduced to silver ions (Ag). In one embodiment, the catalyst is silver ions (Ag 2+ ) silver metal (Ag 0 It can be reduced to silver ions (Ag). In one embodiment, the catalyst is silver ions (Ag 3+ ) silver metal (Ag 0 It can be reduced to ).

[0046] In one embodiment, the catalyst is an amine. In one embodiment, the catalyst is a primary amine, a secondary amine, a tertiary amine, or a polyamine. In one embodiment, the catalyst is a primary amine. A "primary amine" refers to an amine having two hydrogen atoms bonded to the nitrogen of the amine group. In one embodiment, the catalyst is an alkylamine having 1 to 18 carbon atoms. For example, the catalyst may include methylamine, ethylamine, propylamine, butylamine, pentylamine, hexylamine, heptylamine, octylamine, nonylamine, decylamine, undecylamine, dodecylamine, tridecylamine, tetradecylamine, pentadecylamine, hexadecylamine, heptadecylamine, octadecylamine, and combinations thereof. Other examples of usable catalysts include allylamine, n-propylamine, isopropylamine, n-butylamine, sec-butylamine, tert-butylamine, n-pentylamine, isopentylamine, 2-ethylhexylamine, tert-hexylamine, phenylamine, cyclopentylamine, tert-octylamine, tert-decylamine, tert-dodecylamine, tert-octadecylamine, and combinations thereof. In one embodiment, the catalyst is tert-octylamine. In one embodiment, the catalyst is 2-ethylhexylamine.

[0047] In one embodiment, the catalyst may include a secondary amine. A "secondary amine" refers to an amine having one hydrogen atom bonded to the nitrogen of the amine group. For example, the catalyst may include dimethylamine, diethylamine, dipropylamine, dibutylamine, diphenylamine, dicyclopentylamine, methylbutylamine, and combinations thereof.

[0048] In one embodiment, the catalyst may include a tertiary amine. A "tertiary amine" refers to an amine that does not have a hydrogen atom bonded to the nitrogen of the amine group. For example, the catalyst may include trimethylamine, triethylamine, tripropylamine, triphenylamine, and combinations thereof. It can include combinations.

[0049] In one embodiment, the catalyst may include a polyamine. For example, the catalyst may include ethylenediamine, 1,3-diaminopropane, hexamethylenediamine, and combinations thereof. In one embodiment, the catalyst is ethylenediamine. In one embodiment, the catalyst is 1,3-diaminopropane. In one embodiment, the catalyst is hexamethylenediamine.

[0050] In one embodiment, the silver complex is formed by adding about 0.1 mL to about 1 mL of catalyst. In one embodiment, the silver complex is formed by adding about 0.1 mL to about 0.8 mL of catalyst. In one embodiment, the silver complex is formed by adding about 0.1 mL to about 0.7 mL of catalyst. In one embodiment, the silver complex is formed by adding about 0.1 mL to about 0.6 mL of catalyst. In one embodiment, the silver complex is formed by adding about 0.2 mL to about 0.6 mL of catalyst. In one embodiment, the silver complex is formed by adding about 0.2 mL to about 0.5 mL of catalyst. In one embodiment, the silver complex is formed by adding about 0.2 mL to about 0.6 mL of catalyst. In one embodiment, the silver complex is formed by adding about 0.3 mL to about 0.4 mL of catalyst. In some embodiments, the silver complex is formed by adding about 0.1 mL, about 0.2 mL, about 0.3 mL, about 0.4 mL, about 0.5 mL, about 0.6 mL, about 0.7 mL, about 0.8 mL, about 0.9 mL, or about 1.0 mL of catalyst.

[0051] In one embodiment, the silver complex is formed by adding about 0.1 mL to about 1 mL of tert-octylamine. In one embodiment, the silver complex is formed by adding about 0.1 mL to about 0.8 mL of tert-octylamine. In one embodiment, the silver complex is formed by adding about 0.1 mL to about 0.7 mL of tert-octylamine. In one embodiment, the silver complex is formed by adding about 0.1 mL to about 0.6 mL of tert-octylamine. In one embodiment, the silver complex is formed by adding about 0.2 mL to about 0.6 mL of tert-octylamine. In one embodiment, the silver complex is formed by adding about 0.2 mL to about 0.5 mL of tert-octylamine. In one embodiment, the silver complex is formed by adding about 0.2 mL to about 0.6 mL of tert-octylamine. In one embodiment, the silver complex is formed by adding about 0.3 mL to about 0.4 mL of tert-octylamine. In other embodiments, the silver complex is formed by adding about 0.1 mL, about 0.2 mL, about 0.3 mL, about 0.4 mL, about 0.5 mL, about 0.6 mL, about 0.7 mL, about 0.8 mL, about 0.9 mL, or about 1.0 mL of tert-octylamine.

[0052] In one embodiment, the silver complex is formed by adding about 0.1 mL to about 1 mL of 2-ethylhexylamine. In one embodiment, the silver complex is formed by adding about 0.1 mL to about 0.8 mL of 2-ethylhexylamine. In one embodiment, the silver complex is formed by adding about 0.1 mL to about 0.7 mL of 2-ethylhexylamine. In one embodiment, the silver complex is formed by adding about 0.1 mL to about 0.6 mL of 2-ethylhexylamine. In one embodiment, the silver complex is formed by adding about 0.2 mL to about 0.6 mL of 2-ethylhexylamine. In one embodiment, the silver complex is formed by adding about 0.2 mL to about 0.5 mL of 2-ethylhexylamine. In one embodiment, the silver complex is formed by adding about 0.2 mL to about 0.6 mL of 2-ethylhexylamine. In one embodiment, the silver complex is formed by adding about 0.3 mL to about 0.4 mL of 2-ethylhexylamine. In other embodiments, the silver complex is used in amounts of approximately 0.1 mL, 0.2 mL, 0.3 mL, 0.4 mL, 0.5 mL, 0.6 mL, 0.7 mL, 0.8 mL, and 0.9 mL. It is formed by adding 2-ethylhexylamine in an amount of L or approximately 1.0 mL.

[0053] In one embodiment, the catalyst is a solvent. In one embodiment, the conductive ink composition contains a silver complex formed by mixing silver carboxylate with the catalyst. In one embodiment, silver carboxylate is dissolved in the catalyst. The catalyst also acts as a reducing agent. The catalyst contains an amine that reduces silver carboxylate to produce the conductive ink composition. In one embodiment, tert-octylamine dissolves and reduces silver carboxylate. In one embodiment, tert-butylamine dissolves and reduces silver carboxylate. In one embodiment, 2-ethylhexylamine dissolves and reduces silver carboxylate. Conductive ink composition combination of silver carboxylate, solvent, and catalyst

[0054] In one embodiment, the silver carboxylate is silver neodecanoate. In one embodiment, the silver carboxylate is silver hexafluoroacetylacetone. In one embodiment, the solvent is xylene. In one embodiment, the solvent contains xylene and terpineol. In one embodiment, the catalyst is tert-octylamine. In one embodiment, the catalyst is 2-ethylhexylamine.

[0055] In one embodiment, the conductive ink composition has a silver concentration of about 1 to about 40 wt% of the conductive ink composition. In one embodiment, the conductive ink composition has a silver concentration of about 1 to about 30 wt% of the conductive ink composition. In one embodiment, the conductive ink composition has a silver concentration of about 1 to about 20 wt% of the conductive ink composition. In one embodiment, the conductive ink composition has a silver concentration of about 1 to about 10 wt% of the conductive ink composition. In one embodiment, the conductive ink composition has a silver concentration of about 5 to about 15 wt% of the conductive ink composition. In some embodiments, the conductive ink composition contains approximately 1 wt%, 2 wt%, 3 wt%, 4 wt%, 5 wt%, 6 wt%, 7 wt%, 8 wt%, 9 wt%, 10 wt%, 11 wt%, 12 wt%, 13 wt%, 14 wt%, 15 wt%, 16 wt%, 17 wt%, 18 wt%, and 19 wt% of the conductive ink composition. It has a silver concentration of approximately 20 wt%, 21 wt%, 22 wt%, 23 wt%, 24 wt%, 25 wt%, 26 wt%, 27 wt%, 28 wt%, 29 wt%, 30 wt%, 31 wt%, 32 wt%, 33 wt%, 34 wt%, 35 wt%, 36 wt%, 37 wt%, 38 wt%, 39 wt%, or 40 wt%.

[0056] In one embodiment, the conductive structure has a low root mean square (RMS) value. In one embodiment, the conductive structure has an RMS value of less than approximately 20 nm. In one embodiment, the conductive structure has an RMS value of less than approximately 10 nm.

[0057] In one embodiment, the electrical conductivity of a conductive structure is measured. In one embodiment, the electrical conductivity of the conductive structure is approximately 2 × 10⁻⁶-6 Ω·cm to approximately 1×10 -5 Ω·cm. In one embodiment, the electrical conductivity of the conductive structure is about 3×10 -6 Ω·cm to about 6×10 -6 Ω·cm. In some embodiments, the electrical conductivity of the conductive structure is at least about 2×10 -6 Ω·cm, about 3×10 -6 Ω·cm, about 4×10 -6 Ω·cm, about 5×10 -6 Ω·cm, about 6×10 -6 Ω·cm, about 7×10 -6 Ω·cm, about 8×10 -6 Ω·cm or about 9×10 -6 Ω·cm. In some embodiments, the electrical conductivity of the conductive structure is at most about 1×10 -5 Ω·cm, about 9×10 -6 Ω·cm, about 8×10 -6 Ω·cm, about 7×10 -6 Ω·cm, about 6×10 -6 Ω·cm, about 5×10 -6 Ω·cm, about 4×10 -6 Ω·cm or about 3×10 -6 Ω·cm. A combination of silver neodecanoate, xylene and 2-ethylhexylamine

[0058] In one embodiment, the conductive ink composition comprises a silver complex formed by mixing silver neodecanoate dissolved in xylene with 2- ethylhexylamine. 2-Ethylhexylamine decarboxylates silver neodecanoate at a temperature of about 100°C or less. In another embodiment, 2-ethylhexylamine decarboxylates silver neodecanoate at a temperature of about 190°C or less.

[0059] In one embodiment, the conductive ink composition contains a silver complex formed by mixing about 0.5 grams of silver neodecanoate dissolved in about 1 mL of xylene with about 0.2 mL of 2-ethylhexylamine. The 2-ethylhexylamine decarboxylates the silver neodecanoate at a temperature of about 100°C or less. In some embodiments, the 2-ethylhexylamine decarboxylates the silver neodecanoate at a temperature of about 95°C or less or about 105°C or less.

[0060] In one embodiment, the conductive ink composition comprises a silver complex formed by mixing silver neodecanoate dissolved in xylene with 2-ethylhexylamine. The 2-ethylhexylamine decarboxylates the silver neodecanoate at a temperature of about 100°C or below. In some embodiments, the conductive ink composition comprises a silver complex formed by mixing about 0.5 grams of silver neodecanoate dissolved in about 1 mL of xylene with about 0.4 mL or about 0.6 mL of 2-ethylhexylamine. The 2-ethylhexylamine decarboxylates the silver neodecanoate at a temperature of about 100°C or below.

[0061] In one embodiment, the conductive ink composition contains a silver complex formed by mixing silver neodecanoate dissolved in xylene with 2-ethylhexylamine. The 2-ethylhexylamine decarboxylates the silver neodecanoate at a temperature of about 100°C or below. In another embodiment, the conductive ink composition contains a silver complex formed by mixing about 0.4 grams or about 0.6 grams of silver neodecanoate dissolved in about 1 mL of xylene with about 0.2 mL of 2-ethylhexylamine. The 2-ethylhexylamine decarboxylates the silver neodecanoate at a temperature of about 100°C or below. A combination of silver hexafluoroacetylacetate, xylene, and tert-octylamine.

[0062] In one embodiment, the conductive ink composition comprises a silver complex formed by mixing silver hexafluoroacetylacetate dissolved in xylene with tert-octylamine. The tert-octylamine decarboxylates the silver hexafluoroacetylacetate at a temperature of about 100°C or less. In another embodiment, the tert-octylamine decarboxylates the silver hexafluoroacetylacetate at a temperature of about 160°C or less.

[0063] In one embodiment, the conductive ink composition contains a silver complex formed by mixing about 0.4 grams of silver hexafluoroacetylacetate dissolved in about 1 mL of xylene with about 0.2 mL of tert-octylamine. The tert-octylamine decarboxylates the silver neodecanoate at a temperature of about 100°C or less. In some embodiments, the tert-octylamine decarboxylates the silver neodecanoate at a temperature of about 95°C or less or about 105°C or less.

[0064] In one embodiment, the conductive ink composition comprises a silver complex formed by mixing silver hexafluoroacetylacetate dissolved in xylene with tert-octylamine. The tert-octylamine decarboxylates silver hexafluoroacetylacetate at a temperature of about 100°C or less. In some embodiments, the conductive ink composition comprises a silver complex formed by mixing about 0.4 grams of silver hexafluoroacetylacetate dissolved in about 1 mL of xylene with about 0.4 mL or about 0.6 mL of tert-octylamine. The tert-octylamine decarboxylates silver neodecanoate at about 100°C. Alternatively, decarbonate at a temperature below that.

[0065] In one embodiment, the conductive ink composition contains a silver complex formed by mixing silver hexafluoroacetylacetate dissolved in xylene with tert-octylamine. The tert-octylamine decarboxylates the silver hexafluoroacetylacetate at a temperature of about 100°C or below. In some embodiments, the conductive ink composition contains a silver complex formed by mixing about 0.3 grams or about 0.5 grams of silver hexafluoroacetylacetate dissolved in about 1 mL of xylene with about 0.2 mL of tert-octylamine. The tert-octylamine decarboxylates the silver neodecanoate at a temperature of about 100°C or below. A combination of silver neodecanoate, xylene, terpineol, and tert-octylamine.

[0066] In one embodiment, the conductive ink composition comprises a silver complex formed by mixing silver neodecanoate dissolved in xylene and terpineol with tert-octylamine. The tert-octylamine decarboxylates the silver neodecanoate at a temperature of about 100°C or less. In another embodiment, the tert-octylamine decarboxylates the silver neodecanoate at a temperature of about 200°C or less.

[0067] In one embodiment, the conductive ink composition comprises a silver complex formed by mixing about 0.5 grams of silver neodecanoate dissolved in a mixture of about 0.5 mL of xylene and about 0.5 mL of terpineol with about 0.2 mL of tert-octylamine. The tert-octylamine decarboxylates the silver neodecanoate at a temperature of about 100°C or less. In some embodiments, the tert-octylamine decarboxylates the silver neodecanoate at a temperature of about 80°C or less, about 90°C or less, or about 110°C or less.

[0068] In one embodiment, the conductive ink composition comprises a silver complex formed by mixing silver neodecanoate dissolved in xylene and terpineol with tert-octylamine. The tert-octylamine decarboxylates the silver neodecanoate at a temperature of about 100°C or below. In some embodiments, the conductive ink composition comprises a silver complex formed by mixing about 0.5 grams of silver neodecanoate dissolved in a mixture of about 0.5 mL of xylene and about 0.5 mL of terpineol with about 0.4 mL or about 0.6 mL of tert-octylamine. The tert-octylamine decarboxylates the silver neodecanoate at a temperature of about 100°C or below.

[0069] In one embodiment, the conductive ink composition comprises a silver complex formed by mixing silver neodecanoate dissolved in xylene and terpineol with tert-octylamine. The tert-octylamine decarboxylates the silver neodecanoate at a temperature of about 100°C or below. In some embodiments, the conductive ink composition comprises a silver complex formed by mixing about 0.4 grams or about 0.6 grams of silver neodecanoate dissolved in a mixture of about 0.5 mL of xylene and about 0.5 mL of terpineol with about 0.2 mL of tert-octylamine. The tert-octylamine decarboxylates the silver neodecanoate at a temperature of about 100°C or below.

[0070] In one embodiment, the conductive ink composition comprises a silver complex formed by mixing silver neodecanoate dissolved in xylene and terpineol with tert-octylamine. The tert-octylamine decarboxylates the silver neodecanoate at a temperature of about 100°C or less. In one embodiment, the conductive ink composition comprises a silver complex formed by mixing about 0.5 grams of silver neodecanoate dissolved in a mixture of about 0.6 mL of xylene and about 0.4 mL of terpineol with about 0.2 mL of tert-octylamine. tert-octylamine decarboxylates silver neodecanoate at temperatures of approximately 100°C or below.

[0071] In one embodiment, the conductive ink composition contains a silver complex formed by mixing silver neodecanoate dissolved in xylene and terpineol with tert-octylamine. The tert-octylamine decarboxylates the silver neodecanoate at a temperature of about 100°C or below. In another embodiment, the conductive ink composition contains a silver complex formed by mixing about 0.5 grams of silver neodecanoate dissolved in a mixture of about 0.7 mL of xylene and about 0.3 mL of terpineol with about 0.2 mL of tert-octylamine. The tert-octylamine decarboxylates the silver neodecanoate at a temperature of about 100°C or below.

[0072] In one embodiment, the conductive ink composition contains a silver complex formed by mixing silver neodecanoate dissolved in xylene and terpineol with tert-octylamine. The tert-octylamine decarboxylates the silver neodecanoate at a temperature of about 100°C or below. In another embodiment, the conductive ink composition contains a silver complex formed by mixing about 0.5 grams of silver neodecanoate dissolved in a mixture of about 0.8 mL of xylene and about 0.2 mL of terpineol with about 0.2 mL of tert-octylamine. The tert-octylamine decarboxylates the silver neodecanoate at a temperature of about 100°C or below.

[0073] In one embodiment, the conductive ink composition contains a silver complex formed by mixing silver neodecanoate dissolved in xylene and terpineol with tert-octylamine. The tert-octylamine decarboxylates the silver neodecanoate at a temperature of about 100°C or below. In another embodiment, the conductive ink composition contains a silver complex formed by mixing about 0.5 grams of silver neodecanoate dissolved in a mixture of about 0.4 mL of xylene and about 0.6 mL of terpineol with about 0.2 mL of tert-octylamine. The tert-octylamine decarboxylates the silver neodecanoate at a temperature of about 100°C or below.

[0074] In one embodiment, the conductive ink composition contains a silver complex formed by mixing silver neodecanoate dissolved in xylene and terpineol with tert-octylamine. The tert-octylamine decarboxylates the silver neodecanoate at a temperature of about 100°C or less. In another embodiment, the conductive ink composition contains a silver complex formed by mixing about 0.5 grams of silver neodecanoate dissolved in a mixture of about 0.3 mL of xylene and about 0.7 mL of terpineol with about 0.2 mL of tert-octylamine. The tert-octylamine decarboxylates the silver neodecanoate at a temperature of about 100°C or less.

[0075] In one embodiment, the conductive ink composition contains a silver complex formed by mixing silver neodecanoate dissolved in xylene and terpineol with tert-octylamine. The tert-octylamine decarboxylates the silver neodecanoate at a temperature of about 100°C or below. In another embodiment, the conductive ink composition contains a silver complex formed by mixing about 0.5 grams of silver neodecanoate dissolved in a mixture of about 0.2 mL of xylene and about 0.8 mL of terpineol with about 0.2 mL of tert-octylamine. The tert-octylamine decarboxylates the silver neodecanoate at a temperature of about 100°C or below. Method for preparing a conductive ink composition

[0076] One embodiment discloses a method for manufacturing a conductive structure. In one embodiment, this method is A The method includes the step of mixing silver carboxylate in the presence of a catalyst containing mine to form a silver complex. The silver carboxylate is dissolved in at least one solvent. In one embodiment, the method also includes the step of coating the silver complex onto a substrate. In some embodiments, the method includes the step of heating the silver complex on the substrate at a decomposition temperature of about 200°C or less to form a conductive structure. In some embodiments, the method includes the step of heating the silver complex on the substrate at a decomposition temperature of about 100°C or less to form a conductive structure. In some embodiments, the method includes the step of heating a silver complex on a substrate at a decomposition temperature of about 210°C or less, about 220°C or less, about 190°C, about 180°C or less, about 170°C or less, about 160°C, about 150°C or less, about 140°C or less, about 130°C or less, about 120°C or less, about 110°C or less, about 90°C or less, about 80°C or less, about 70°C or less, about 60°C or less, or about 50°C or less to form a conductive structure. In one embodiment, the silver complex is heated with a heat source. Examples of heat sources include an IR lamp, an oven, or a heating substrate.

[0077] In one embodiment, silver carboxylate is dissolved in the solvent before the catalyst is added. In another embodiment, silver carboxylate is mixed with the catalyst before the silver carboxylate is dissolved in the solvent. In yet another embodiment, silver carboxylate, the solvent, and the catalyst are added simultaneously.

[0078] In one embodiment, the silver complex has a desired viscosity. In one embodiment, the desired viscosity is obtained using a microVISC viscometer. In one embodiment, the silver complex has a viscosity of about 50 centipoise to about 1000 centipoise. In one embodiment, the silver complex has a viscosity of about 5 centipoise to about 50 centipoise. In one embodiment, the silver complex has a viscosity of about 10 centipoise to about 40 centipoise. In one embodiment, the silver complex has a viscosity of about 20 centipoise to about 30 centipoise. In one embodiment, the silver complex has a viscosity of about 18 centipoise to about 20 centipoise. In some embodiments, the silver complex has a viscosity of about 18, about 19, or about 20 centipoise. In some embodiments, the silver complex has a viscosity of at least about 5 cmoise, about 10 cmoise, about 20 cmoise, about 30 cmoise, about 40 cmoise, about 50 cmoise, about 60 cmoise, about 70 cmoise, about 80 cmoise, about 90 cmoise, about 100 cmoise, about 200 cmoise, about 300 cmoise, about 400 cmoise, about 500 cmoise, about 600 cmoise, about 700 cmoise, about 800 cmoise, or about 900 cmoise. In some embodiments, the silver complex has a viscosity of up to about 1000 centipoise, about 900 centipoise, about 800 centipoise, about 700 centipoise, about 600 centipoise, about 500 centipoise, about 400 centipoise, about 300 centipoise, about 200 centipoise, about 100 centipoise, about 90 centipoise, about 80 centipoise, about 70 centipoise, about 60 centipoise, about 50 centipoise, about 40 centipoise, about 30 centipoise, about 20 centipoise, or about 10 centipoise.

[0079] In one embodiment, the viscosity of the complex is adjusted based on the amount of solvent used. In another embodiment, the viscosity of the complex is adjusted based on the type of solvent used. In embodiments where the solvent contains terpineol and xylene, the viscosity increases when more terpineol is used and less xylene is used. In one embodiment, the viscosity of the silver complex can be adjusted to 5 centipoise with a large proportion of xylene and to 50 centipoise with a large proportion of terpineol.

[0080] Furthermore, the viscosity of the complex is adjusted based on the amount of catalyst added. Using more catalyst increases the viscosity of the silver complex. In one embodiment, the viscosity of the silver complex can be increased far beyond 1000 centipoise by increasing the amount of catalyst. In one embodiment, the viscosity of the silver complex can be increased far beyond 1000 centipoise by increasing the amount of catalyst from about 0.2 mL to about 0.6 mL. In one embodiment, the viscosity of the silver complex decreases when less catalyst is used. Uses of conductive ink compositions

[0081] Conductive ink compositions can be used in a variety of printing applications, including slot die coating, spin coating, gravure printing, roll-to-roll printing including flexographic printing, rotary screen printing, screen printing, aerosol jet printing, inkjet printing, air brushing, Meyer rod coating, flood coating, 3D printing, dispenser, and electrohydrodynamic printing. Furthermore, patterns can be created using photolithography to create a mask for etching silver from specific areas, thereby producing high-fidelity features. Patterns can be created using both positive and negative patterning processes.

[0082] In one embodiment, a silver salt of silver carboxylate is completely dissolved in at least one solvent. The completely dissolved silver salt is compatible with many non-polar polymer substrates, glass and ceramic substrates where the polar complex is not sufficiently wetted. In one embodiment, the silver complex is coated onto a polymer substrate. In one embodiment, the silver complex is coated onto a non-polar polymer substrate. In one embodiment, the silver complex is coated onto a glass substrate. In one embodiment, the silver complex is coated onto a ceramic substrate.

[0083] Furthermore, elastomers and 3D substrates having a uniquely non-planar topography can be used together with conductive structures. In one embodiment, a silver complex is coated onto the elastomer. In another embodiment, a silver complex is coated onto the 3D substrate.

[0084] The specular reflectance of conductive structures is a byproduct of their extremely low RMS value. In one embodiment, the RMS value of the conductive structure is about 10 nanometers or less. In one embodiment, the conductive structure is used on a substrate having a smooth surface. In one embodiment, the conductive structure is used for electrode structures for OLED displays and photovoltaic technology. These structures are also used as conductive traces and electrodes in displays and touchscreens, as well as in printed antennas. Ink composition definition

[0085] In describing the compounds, compositions, methods, and processes of this disclosure, the following terms have the meanings set forth below, unless otherwise specified.

[0086] The term "alkyl" refers to a substance having a specified number of carbon atoms (i.e., C 1~30A alkyl group means a hydrocarbon group that may have 1 to 30 carbon atoms, be linear, cyclic, branched, or a combination thereof. Examples of alkyl groups include methyl, ethyl, n-propyl, isopropyl, n-butyl, t-butyl, isobutyl, sec-butyl, cyclohexyl, cyclopentyl, (cyclohexyl)methyl, cyclopropylmethyl, bicyclo[2.2.1]heptane, bicyclo[2.2.2]octane, etc. Unless otherwise specified, alkyl groups may be substituted or unsubstituted.

[0087] The term "cycloalkyl" refers to a saturated monocyclic, bicyclic, tricyclic, or other polycyclic hydrocarbon group. Any atom may be substituted, for example, by one or more substituents. The ring carbon acts as a bonding site with other parts of the cycloalkyl group. The cycloalkyl group may contain a condensed ring. A condensed ring is a ring that shares a common carbon atom. The cycloalkyl group may include, for example, cyclopropyl, cyclobutyl, cyclopentyl, cyclohexyl, cycloheptyl, adamantyl, and norbornyl (bicyclo(bicycle)[2.2.1]heptyl).

[0088] The term "bulky" means that the size of the base can cause steric hindrance. A "sterically bulky counterion" is a counterion that can cause steric hindrance.

[0089] The term "ligand" refers to a compound that can form one or more bonds with a single metal ion. Examples of ligands include amines, ethers, and thioethers. composition

[0090] This disclosure also relates to ink compositions generally comprising metal salts having sterically bulky counterions and ligands.

[0091] Any suitable metal salt having a sterically bulky counterion can be used. In some embodiments, the metal salt is selected from the group consisting of silver salts, copper salts, nickel salts, gold salts, platinum salts, palladium salts, aluminum salts, magnesium salts, zinc salts, and tin salts. In one embodiment, the salt is a silver salt.

[0092] In some embodiments, the sterically bulky counterion is selected from the group consisting of carboxylate ions, cyanide ions, sulfonate ions, borate ions, phosphate ions, and perchlorate ions. In some embodiments, the sterically bulky counterion is a long-chain or branched carboxylate ion. In some embodiments, the sterically bulky counterion is R 1 COO - That is. R 1 R was selected from the group consisting of unsubstituted or substituted alkyl, unsubstituted or substituted cycloalkyl and unsubstituted or substituted heterocycloalkyl. In some embodiments, R 1 is substitution C1~C 30 It is alkyl. In some embodiments, C1~C 30 The alkyl group may be substituted with at least one alkyl and keto group. The selected substituent is preferably large enough to provide steric hindrance to the sterically bulky counterion. In some embodiments, the sterically bulky counterion is the neodecanoate ion, 2-ethyloctanoate ion, 2-ethylhexanoate ion, 2-ethylpentanoate ion, 2-ethylbutylnoate ion, 2-ethyl-2-methylbutanoate ion, 2,2-diethylbutanoate ion, or combinations thereof. In one embodiment, the sterically bulky counterion is the neodecanoate ion. In other embodiments, the sterically bulky counterion is the β-ketocarboxylate ion, for example, the 3-oxobutanoate ion, the 3-oxopentanoate ion, or the 3-oxohexanoate ion.

[0093] In other embodiments, the sterically bulky counterion is the tetrafluoroborate ion ([BF4] -), hexafluorophosphate ion ([PF6] - ) or perchlorate ions.

[0094] In some embodiments, the metal salt having a sterically bulky counterion is silver neodecanoate, silver 2-ethylhexanoate, or silver β-ketocarboxylate. In one embodiment, the salt is silver neodecanoate.

[0095] The ligand can be any suitable ligand. Generally, ligands have a relatively low boiling point (below 200°C). If the temperature is increased above 100°C, the ligand will begin to evaporate. As a result, the ink maintains a high viscosity without the need for particles or polymers to increase its viscosity. It maintains its properties while having a low annealing temperature.

[0096] In some embodiments, the ligand is a bulky ligand. In some embodiments, the ligand is selected from the group consisting of primary amines, secondary amines, tertiary amines, and cyclic amines. In some embodiments, the ligand is selected from the group consisting of tert-butylamine, 2-methylbutan-2-amine, 2-methylpentan-2-amine, 2-ethylhexylamine, 2-ethylheptylamine, N-ethylhexane-1-amine, N-ethylheptan-1-amine, and tert-octylamine. In one embodiment, the ligand is tert-octylamine. In some embodiments, the ligand is an unsubstituted or substituted pyrrolidine and an unsubstituted or substituted piperidine.

[0097] In some embodiments, the ligand is selected from the group consisting of thioethers, cyclic thioethers, ethers, crown ethers, and combinations thereof. In some embodiments, the ligand is selected from the group consisting of branched thioethers and branched ethers. For example, the ligand may be of the formula R'XR'', where R' and R'' are independently long-chain or branched alkyl groups, and X is S or O.

[0098] In some embodiments, the molar ratio of ligand to metal salt is about 10,000:1 to about 50:1. In some embodiments, the molar ratio of ligand to metal salt is greater than about 30:1. In some embodiments, the molar ratio of ligand to metal salt is greater than about 15:1. In some embodiments, the molar ratio of ligand to metal salt is greater than about 10:1. In some embodiments, the molar ratio of metal salt to ligand is about 1.

[0099] The ink composition may further contain a solvent. Generally, the solvent has a low boiling point. In some embodiments, the solvent is a polar solvent such as water and dimethylformamide. In some embodiments, xylene is used as the solvent. preparation

[0100] The disclosure also provides a method for preparing an ink composition. The method comprises the steps of: adding a metal salt having a sterically bulky counterion to a solvent to form a mixture; and adding a ligand to the mixture to form an ink composition.

[0101] When this metal salt is dissolved in a solvent, the mixture has a relatively low viscosity and flows freely. The viscosity increases rapidly upon the addition of the metal salt. After the addition of ligands, the viscosity reaches approximately 100 cPs. With the addition of more ligands, the viscosity continues to increase, reaching approximately 10,000 cPs. Without getting bogged down in theory, the bulky counterions of the metal salt create a significant amount of steric hindrance for the metal ions when it is dissolved in a suitable solvent. The association between the bulky ligands and the hindrance creates a completely gelled mixture. This completely gelled mixture has high viscosity and does not flow freely. In one embodiment, this mixture does not flow even when a container filled with the mixture is inverted.

[0102] In this disclosure, the metal salt is selected from the group consisting of silver salts, copper salts, nickel salts, gold salts, platinum salts, palladium salts, aluminum salts, magnesium salts, zinc salts, and tin salts. In one embodiment, the salt is a silver salt.

[0103] In some embodiments, the sterically bulky counterion is selected from the group consisting of carboxylate ions, cyanide ions, sulfonate ions, borate ions, phosphate ions, and perchlorate ions. In some embodiments, the sterically bulky counterion is a long-chain or branched carboxylate ion. In some embodiments, the sterically bulky counterion is N is R 1 COO - That is. R 1 R was selected from the group consisting of unsubstituted or substituted alkyl, unsubstituted or substituted cycloalkyl and unsubstituted or substituted heterocycloalkyl. In some embodiments, R 1 is substitution C1~C 30 It is alkyl. In some embodiments, C1~C 30 The alkyl group is substituted with at least one alkyl and keto group. The selected substituent is preferably large enough to provide steric hindrance to sterically bulky counterions.

[0104] In some embodiments, the sterically bulky counterions are the neodecanoate ion, 2-ethyloctanoate ion, 2-ethylhexanoate ion, 2-ethylpentanoate ion, 2-ethylbutanoate ion, 2-ethyl-2-methylbutanoate ion, 2,2-diethylbutanoate ion, and combinations thereof. In one embodiment, the sterically bulky counterion is the neodecanoate ion. In other embodiments, the sterically bulky counterion is the β-ketocarboxylate ion, for example, the 3-oxobutanoate ion, the 3-oxopentanoate ion, or the 3-oxohexanoate ion.

[0105] In other embodiments, the sterically bulky counterion is the tetrafluoroborate ion ([BF4] - ), hexafluorophosphate ion ([PF6] - ) or perchlorate ions.

[0106] In some embodiments, the metal salt having a sterically bulky counterion is silver neodecanoate, silver 2-ethylhexanoate, or silver β-ketocarboxylate. In one embodiment, the salt is silver neodecanoate.

[0107] The ligand may be any suitable ligand. In some embodiments, the ligand is a bulky ligand. In some embodiments, the ligand is selected from the group consisting of primary amines, secondary amines, tertiary amines, and cyclic amines.

[0108] In some embodiments, the ligand is selected from the group consisting of tert-butylamine, 2-methylbutan-2-amine, 2-methylpentan-2-amine, 2-ethylhexylamine, 2-ethylheptylamine, N-ethylhexane-1-amine, N-ethylheptan-1-amine, and tert-octylamine. In one embodiment, the ligand is tert-octylamine. In some embodiments, the ligand is unsubstituted or substituted pyrrolidine and unsubstituted or substituted piperidine.

[0109] In some embodiments, the ligand is selected from the group consisting of thioethers, cyclic thioethers, ethers, crown ethers, and combinations thereof. In some embodiments, the ligand is selected from the group consisting of branched thioethers and branched ethers. For example, the ligand may be of the formula R'XR'', where R' and R'' are independently long-chain or branched alkyl groups, and X is S or O.

[0110] In some embodiments, the molar ratio of ligand to metal salt is about 10,000:1 to about 50:1. In some embodiments, the molar ratio of ligand to metal salt is greater than about 30:1. In some embodiments, the molar ratio of ligand to metal salt is greater than about 15:1. In some embodiments, the molar ratio of ligand to metal salt is greater than about 10:1. In some embodiments, the molar ratio of metal salt to ligand is about 1:1.

[0111] The solvent may be any suitable solvent. Generally, the solvent has a low boiling point. In some embodiments, the solvent is a polar solvent such as water and dimethylformamide. In some embodiments, xylene is used as the solvent. In some embodiments, the ligand can act as the solvent. application

[0112] A method for fabricating a conductive structure is disclosed. The method comprises the steps of: adding a metal salt having a sterically bulky counterion to a solvent to form a first mixture; adding a ligand to the first mixture to form an ink composition; and heating the ink composition to form a conductive structure. In some embodiments, the method includes the step of fixing the ink composition onto a substrate. The substrate includes glass, cellulose acetate, cellophane, polyimide and polyethylene terephthalate (PET) film, ITO, PC, and CPO. Reactive metal complexes and their alloys

[0113] Compositions for providing conductive ink structures and methods for producing such compositions are also disclosed. The improved ink compositions are formed by producing reducing metal complexes that do not require high decomposition temperatures. By using lower decomposition temperatures to form conductive structures, the improved ink compositions are compatible with a wider range of substrates that do not require high processing temperatures to maintain integrity. Furthermore, this method for producing the ink compositions is simple and yields high yields. The ink compositions may have low viscosity and can therefore be compatible with a wide range of patterning techniques, including slot die coating, spin coating, gravure printing, roll-to-roll printing including flexographic printing, rotary screen printing, screen printing, aerosol jet printing, inkjet printing, air brushing, Meyer rod coating, flood coating, 3D printing, and electrohydrodynamic printing. The patterned features are highly conductive at room temperature and can achieve bulk conductivity when decomposed at mild temperatures (e.g., below about 100°C). Finally, the ink can remain stable at room temperature for several months without particle precipitation.

[0114] Several systems and methods disclose reducing agents for reducing metal salts on a substrate to form metallic ink formulations. U.S. Patent No. 8,066,805 (in its entirety incorporated herein by reference) discloses a printable metallic formulation from a metallic ink precursor, a method for preparing the formulation, and a method for coating or printing a thin film thereof, wherein the metallic formulation comprises one or more metal salts or metal complexes of Group 4, 5, 6, 7, 8, 9, 10, 11, or 12. U.S. Patent Application No. 2005 / 0006339 (in its entirety incorporated herein by reference) describes a method and system for fixing a metallic pattern and reducing metal salts on a substrate.

[0115] This invention discloses a composition for providing conductive ink structures and a method for producing such a composition. The ink composition (also referred to as “conductive ink” or “ink”) is produced for printing highly conductive features at room temperature. Such inks may be stable, particle-free, and suitable for a wide range of patterning techniques.

[0116] In one embodiment, the ink composition includes a reducing metal complex formed by mixing a reducing agent dissolved in a solvent with at least one metal salt or metal complex. The reducing agent is soluble in the solvent. As is known to those skilled in the art, solubility is the property of a substance, such as a reducing agent, to dissolve in a solvent, such as a solvent. In one embodiment, the reducing agent is a hydride. In some embodiments, the reducing agent is a formate or a β-ketocarboxylate. In one embodiment, the reducing agent reduces the metal of the metal salt or metal complex to form a conductive structure. In one embodiment, mixing the reducing agent with at least one metal salt or metal complex forms a precipitate. In one embodiment, the precipitate is removed before coating the reducing metal complex onto a substrate. In one embodiment, the precipitate is removed before decomposing the reducing metal complex on the substrate.

[0117] In one embodiment, an ink composition for producing a conductive structure comprises a reducing metal complex formed by mixing a reducing agent dissolved in a solvent with at least one metal salt or metal complex. The metal of the metal salt or metal complex is a metal of group 4, 5, 6, 7, 8, 9, 10, 11, or 12. In one embodiment, the reducing agent is a hydride. In some embodiments, the reducing agent is a formate or a β-ketocarboxylate. The reducing agent reduces the metal of the metal salt or metal complex to form a conductive structure. Metals and metal complexes

[0118] In one embodiment, the metal salt is of formula MX n It has the following characteristics. In one embodiment, the metal complex is of formula M(L) p X nIn one embodiment, M is a metal of group 4, 5, 6, 7, 8, 9, 10, 11, or 12. In one embodiment, X is a halide, pseudohalide, nitrate, sulfate, formate, acetate, cyanate, isocyanate, alkoxide, or diketonate. In one embodiment, L is selected from the group consisting of NH3, CO, NO, N2, H2S, C2H4, C6H6, CN, NC, and PH3. In one embodiment, n is equal to the formal charge of M divided by the formal charge of X. In one embodiment, p is the number of coordination sites on M from X. n It is an integer equal to the result of subtracting the coordination site occupied by it. In one embodiment, M(L) p X n It contains nickel tetracarbonyl. In one embodiment, M(L) p X n It contains cobalt tetracarbonyl.

[0119] In one embodiment, M is selected from the group consisting of: aluminum, magnesium, titanium, silicon, vanadium, zinc, tin, copper, nickel, palladium, zirconium, iron, niobium, germanium, manganese, chromium, cobalt, tungsten, molybdenum, bismuth, ruthenium, and combinations thereof.

[0120] In one embodiment, the metal complex includes a silicon alkyl complex. In one embodiment, the metal complex is selected from the group consisting of tetramethylsilane, tetraethylsilane, 1,2-dichlorotetramethylsilane, 1,2-diphenyltetramethylsilane, 1,2-dichlorotetraethylsilane, 1,2-diphenyltetraethylsilane, 1,2,3-trichlorotetramethylsilane, or 1,2,3-tetramethyltriphenylsilane. In one embodiment, the metal complex includes tetraethylsilane.

[0121] In one embodiment, ligand L is an alkene or an alkyne. In one embodiment, ligand L is selected from the group consisting of cyclooctadiene, norbornadiene, and ethylene. In one embodiment, the metal complex includes a metal alkene complex. In one embodiment, the metal complex includes a nickel(0) alkene complex. In one embodiment, the metal complex includes bis(cyclooctadiene)nickel(0). In one embodiment, the metal complex includes tris(ethylene)nickel(0). In one embodiment, the metal complex includes a metal alkyne complex. In one embodiment, the metal complex includes a platinum(0) alkyne complex.

[0122] In one embodiment, the ink composition contains a metal salt at a concentration of about 0.1 to 40 wt% of the ink composition. In one embodiment, the ink composition contains a metal salt at a concentration of about 1 to 30 wt% of the ink composition. In one embodiment, the ink composition contains a metal salt at a concentration of about 1 to 20 wt% of the ink composition. In one embodiment, the ink composition contains a metal salt at a concentration of about 1 to 10 wt% of the ink composition. In one embodiment, the ink composition contains a metal salt at a concentration of about 5 to 15 wt% of the ink composition. In some embodiments, the ink composition contains approximately 0.1 wt%, 0.2 wt%, 0.3 wt%, 0.4 wt%, 0.5 wt%, 0.6 wt%, 0.7 wt%, 0.8 wt%, 0.9 wt%, 1 wt%, 2 wt%, 3 wt%, 4 wt%, 5 wt%, 6 wt%, 7 wt%, 8 wt%, 9 wt%, 10 wt%, 11 wt%, 12 wt%, 13 wt%, 14 wt%, 15 wt%, 16 wt%, 17 wt%, 18 wt%, and 19 wt% of the ink composition. Alternatively, it may contain a metal at a concentration of approximately 20 wt%.

[0123] In some embodiments, the ink composition contains a metal salt at a concentration of at least about 0.1 wt%, about 0.2 wt%, about 0.3 wt%, about 0.4 wt%, about 0.5 wt%, about 0.6 wt%, about 0.7 wt%, about 0.8 wt%, about 0.9 wt%, 1 wt%, about 2 wt%, about 3 wt%, about 4 wt%, about 5 wt%, about 6 wt%, about 7 wt%, about 8 wt%, about 9 wt%, about 10 wt%, about 11 wt%, about 12 wt%, about 13 wt%, about 14 wt%, about 15 wt%, about 16 wt%, about 17 wt%, about 18 wt%, about 19 wt%, or about 20 wt% of the ink composition. In some embodiments, the ink composition contains metal salts in concentrations of up to approximately 40 wt%, approximately 39 wt%, approximately 38 wt%, approximately 37 wt%, approximately 36 wt%, approximately 35 wt%, approximately 34 wt%, approximately 33 wt%, approximately 32 wt%, 31 wt%, approximately 30 wt%, approximately 29 wt%, approximately 28 wt%, approximately 27 wt%, approximately 26 wt%, approximately 25 wt%, approximately 24 wt%, approximately 23 wt%, approximately 22 wt%, approximately 21 wt%, approximately 20 wt%, approximately 19 wt%, approximately 18 wt%, approximately 17 wt%, approximately 16 wt%, approximately 15 wt%, approximately 14 wt%, approximately 13 wt%, or approximately 12 wt% of the ink composition.

[0124] In one embodiment, the ink composition contains a metal complex at a concentration of about 0.1 to 40 wt% of the ink composition. In one embodiment, the ink composition contains a metal complex at a concentration of about 1 to 30 wt% of the ink composition. In one embodiment, the ink composition contains a metal complex at a concentration of about 1 to 20 wt% of the ink composition. In one embodiment, the ink composition contains a metal complex at a concentration of about 1 to 10 wt% of the ink composition. In one embodiment, the ink composition contains a metal complex at a concentration of about 5 to 15 wt% of the ink composition. In some embodiments, the ink composition contains a metal complex at a concentration of about 0.1 wt%, about 0.2 wt%, about 0.3 wt%, about 0.4 wt%, about 0.5 wt%, about 0.6 wt%, about 0.7 wt%, about 0.8 wt%, about 0.9 wt%, 1 wt%, about 2 wt%, about 3 wt%, about 4 wt%, about 5 wt%, about 6 wt%, about 7 wt%, about 8 wt%, about 9 wt%, about 10 wt%, about 11 wt%, about 12 wt%, about 13 wt%, about 14 wt%, about 15 wt%, about 16 wt%, about 17 wt%, about 18 wt%, about 19 wt%, or about 20 wt% of the ink composition.

[0125] In some embodiments, the ink composition contains a metal complex at a concentration of at least about 0.1 wt%, about 0.2 wt%, about 0.3 wt%, about 0.4 wt%, about 0.5 wt%, about 0.6 wt%, about 0.7 wt%, about 0.8 wt%, about 0.9 wt%, 1 wt%, about 2 wt%, about 3 wt%, about 4 wt%, about 5 wt%, about 6 wt%, about 7 wt%, about 8 wt%, about 9 wt%, about 10 wt%, about 11 wt%, about 12 wt%, about 13 wt%, about 14 wt%, about 15 wt%, about 16 wt%, about 17 wt%, about 18 wt%, about 19 wt%, or about 20 wt% of the ink composition. In some embodiments, the ink composition contains a metal complex at a concentration of approximately 40 wt%, approximately 39 wt%, approximately 38 wt%, approximately 37 wt%, approximately 36 wt%, approximately 35 wt%, approximately 34 wt%, approximately 33 wt%, approximately 32 wt%, 31 wt%, approximately 30 wt%, approximately 29 wt%, approximately 28 wt%, approximately 27 wt%, approximately 26 wt%, approximately 25 wt%, approximately 24 wt%, approximately 23 wt%, approximately 22 wt%, approximately 21 wt%, approximately 20 wt%, approximately 19 wt%, approximately 18 wt%, approximately 17 wt%, approximately 16 wt%, approximately 15 wt%, approximately 14 wt%, approximately 13 wt%, or approximately 12 wt% of the ink composition. Solvent

[0126] As described above, at least one solvent dissolves the disclosed reducing agent. The solvent acts as a stabilizer and a solvent for the reducing agent. The solvent is not intended to act as a reducing agent for metals and metal complexes or metal salts. In one embodiment, the solvent has a boiling point of about 200°C or less. In one embodiment, the solvent can be selected based on the type of reducing agent used to make the ink composition. In one embodiment, the solvent can be selected based on the boiling point for a particular application of the ink composition. It can be selected. In one embodiment, the solvent can be selected based on the type of substrate to which the ink composition will be applied. For inkjet printing or other deposition methods such as e-jet, higher stability is generally preferred, and therefore, it may be preferable to use a solvent with a higher boiling point.

[0127] At least one solvent is used to dissolve the reducing agent. In one embodiment, the solvent is at least one organic solvent. In one embodiment, the solvent is at least one nonpolar organic solvent.

[0128] In one embodiment, the solvent is selected from the group consisting of saturated hydrocarbons, aromatic hydrocarbons, ethers, alcohols, and combinations thereof. In one embodiment, the solvent is one or more C10s. 5~20 The solvent may contain linear or branched alkane hydrocarbons. For example, the solvent may contain pentane, hexane, heptane, octane, nonane, decane, undecane, dodecane, tridecane, tetradecane, pentadecane, hexadecane, octadecane, nonadecane, eicosane, and combinations thereof.

[0129] In one embodiment, the solvent is one or more C of length C 6~20 The solvent may include cyclic hydrocarbons. For example, the solvent may include cyclohexane, cycloheptane, cyclooctane, cyclononane, cyclodecane, decalin, and combinations thereof.

[0130] In one embodiment, the solvent may include aromatic hydrocarbons. For example, the solvent may include benzene, toluene, xylene, and tetralin. In one embodiment, the solvent is xylene.

[0131] In one embodiment, the solubilizer may include a linear ether, a branched ether, or a cyclic ether. In one embodiment, the solubilizer may include a linear or branched ether. For example, the solubilizer may include dimethyl ether, diethyl ether, dipropyl ether, dibutyl ether, methyl t-butyl ether, and combinations thereof. In one embodiment, the solubilizer is diethyl ether. In one embodiment, the solubilizer may include one or more cyclic ethers. For example, the solubilizer may include tetrahydrofuran, tetrahydropyran, dihydropyran, and 1,4-dioxane.

[0132] In one embodiment, the solvent is an alcohol. In one embodiment, the solvent is a primary alcohol, a secondary alcohol, or a tertiary alcohol. In one embodiment, the alcohol is selected from the group consisting of propanol, butanol, pentanol, hexanol, and octanol and combinations thereof. In one embodiment, the alcohol is selected from the group consisting of 1-propanol, 2-propanol, 1-methoxy-2-propanol, 2-amino-2-methyl-1-propanol, 1-butanol, 2-butanol, 1-pentanol, 2-pentanol, 3-pentanol, 1-hexanol, 2-hexanol, 3-hexanol, 1-octanol, 2-octanol, 3-octanol, tetrahydrofurfuryl alcohol, cyclopentanol, terpineol and combinations thereof. In one embodiment, the solvent is 2-amino-2-methyl-1-propanol.

[0133] In one embodiment, an amount of solvent is added such that the reducing agent is substantially or completely dissolved in the solvent. In one embodiment, "substantially dissolved" means that the reducing agent has a solubility in the solvent of about 100 to 500 g / L at 25°C.

[0134] In one embodiment, the reducing agent is dissolved in approximately 0.5 mL to approximately 2.0 mL of solvent. In some embodiments, the reducing agent is dissolved in about 1.0 mL to about 2.0 mL of solvent. In some embodiments, the reducing agent is dissolved in about 0.5 mL, about 1.0 mL, about 1.5 mL, or about 2.0 mL of solvent.

[0135] In one embodiment, the reducing agent is dissolved in about 0.5 mL to about 2.0 mL of diethyl ether. In another embodiment, the reducing agent is dissolved in about 1.0 mL to about 2.0 mL of diethyl ether. In some embodiments, the reducing agent is dissolved in about 0.5 mL, about 1.0 mL, about 1.5 mL, or about 2.0 mL of diethyl ether.

[0136] In one embodiment, the solvent contains two organic solvents. In one embodiment, the volume ratio of the two organic solvents is about 1:1 between the first and second organic solvents. In one embodiment, the volume ratio of the two organic solvents is about 2:1 between the first and second organic solvents. In one embodiment, the volume ratio of the two organic solvents is about 3:1 between the first and second organic solvents. In one embodiment, the volume ratio of the two organic solvents is about 4:1 between the first and second organic solvents. Reducing agent

[0137] As discussed above, reducing agents are disclosed. In one embodiment, at least one reducing agent is mixed with at least one metal salt or metal complex. In one embodiment, the reducing agent reduces the metal salt to a metal. In one embodiment, the reducing agent reduces the metal of the metal salt or metal complex to form a conductive structure.

[0138] Any suitable metal precursor can be used. In one embodiment, the metal precursor includes an oxidation state of M(I) or +1, where M represents the metal salt. In one embodiment, the metal precursor includes an oxidation state of M(II) or +2. In one embodiment, the metal precursor includes an oxidation state of M(III) or +3. In one embodiment, the metal precursor includes an oxidation state of M(III) or +3. In one embodiment, the metal precursor includes an oxidation state of M(IV) or +4. In one embodiment, the metal precursor includes an oxidation state of M(V) or +5. In one embodiment, the metal precursor includes an oxidation state of M(VI) or +6. In one embodiment, the metal precursor includes an oxidation state of M(VII) or +7. In one embodiment, the metal precursor includes an oxidation state of M(VIII) or +8. In one embodiment, an amount of reducing agent is used to completely reduce the metal salt to a metal having an oxidation state of 0. In one embodiment, the reducing agent is the metal ion M + M 2+ M 3+ M 4+ M 5+ M 6+ M 7+ or M 8+ Reduces metal M 0 This can be achieved. In one embodiment, a relatively small amount of reducing agent is used. In one embodiment, the viscosity does not depend on the amount of reducing agent.

[0139] In one embodiment, the reducing agent is selected from the group consisting of alkali metal hydrides, alkali metal-boron complex hydrides, alkali metal-aluminum complex hydrides, formate salts, β-ketocarboxylate salts, and combinations thereof.

[0140] In one embodiment, the reducing agent is a metal hydride. For example, the reducing agent may include lithium hydride, sodium hydride, potassium hydride, rubidium hydride, cesium hydride, and combinations thereof. In one embodiment, the reducing agent is lithium hydride.

[0141] In one embodiment, the reducing agent is a complex hydride of an alkali metal and boron. In one embodiment, the reducing agent is selected from the group consisting of lithium borohydride, sodium borohydride, potassium borohydride, and combinations thereof.

[0142] In one embodiment, the reducing agent is a complex hydride of alkali metal and aluminum. In one embodiment, the reducing agent is lithium aluminum hydride, sodium aluminum hydride The reducing agent is selected from the group consisting of aluminum, potassium aluminum hydride, and combinations thereof. In one embodiment, the reducing agent is lithium aluminum hydride.

[0143] In one embodiment, the reducing agent is a formate salt. In one embodiment, the reducing agent is selected from the group consisting of sodium formate, potassium formate, ammonium formate, and combinations thereof. In one embodiment, the reducing agent is a β-ketocarboxylate salt.

[0144] In one embodiment, the reducing metal complex is formed by adding about 0.1 mL to about 1 mL of reducing agent. In one embodiment, the reducing metal complex is formed by adding about 0.1 mL to about 0.8 mL of reducing agent. In one embodiment, the reducing metal complex is formed by adding about 0.1 mL to about 0.7 mL of reducing agent. In one embodiment, the reducing metal complex is formed by adding about 0.1 mL to about 0.6 mL of reducing agent. In one embodiment, the reducing metal complex is formed by adding about 0.2 mL to about 0.6 mL of reducing agent. In one embodiment, the reducing metal complex is formed by adding about 0.2 mL to about 0.5 mL of reducing agent. In one embodiment, the reducing metal complex is formed by adding about 0.2 mL to about 0.6 mL of reducing agent. In one embodiment, the reducing metal complex is formed by adding about 0.3 mL to about 0.4 mL of reducing agent. In some embodiments, the reducing metal complex is formed by adding about 0.1 mL, about 0.2 mL, about 0.3 mL, about 0.4 mL, about 0.5 mL, about 0.6 mL, about 0.7 mL, about 0.8 mL, about 0.9 mL, or about 1.0 mL of reducing agent.

[0145] In one embodiment, the reducing metal complex is formed by adding about 0.1 mL to about 1 mL of lithium aluminum hydride. In one embodiment, the reducing metal complex is formed by adding about 0.1 mL to about 0.8 mL of lithium aluminum hydride. In one embodiment, the reducing metal complex is formed by adding about 0.1 mL to about 0.7 mL of lithium aluminum hydride. In one embodiment, the reducing metal complex is formed by adding about 0.1 mL to about 0.6 mL of lithium aluminum hydride. In one embodiment, the reducing metal complex is formed by adding about 0.2 mL to about 0.6 mL of lithium aluminum hydride. In one embodiment, the reducing metal complex is formed by adding about 0.2 mL to about 0.5 mL of lithium aluminum hydride. In one embodiment, the reducing metal complex is formed by adding about 0.2 mL to about 0.6 mL of lithium aluminum hydride. In one embodiment, the reducing metal complex is formed by adding about 0.3 mL to about 0.4 mL of lithium aluminum hydride. In other embodiments, the reducing metal complex is formed by adding lithium aluminum hydride in amounts of about 0.1 mL, about 0.2 mL, about 0.3 mL, about 0.4 mL, about 0.5 mL, about 0.6 mL, about 0.7 mL, about 0.8 mL, about 0.9 mL, or about 1.0 mL.

[0146] In one embodiment, the reducing metal complex is formed by adding about 0.1 mL to about 1 mL of lithium hydride. In one embodiment, the reducing metal complex is formed by adding about 0.1 mL to about 0.8 mL of lithium hydride. In one embodiment, the reducing metal complex is formed by adding about 0.1 mL to about 0.7 mL of lithium hydride. In one embodiment, the reducing metal complex is formed by adding about 0.1 mL to about 0.6 mL of lithium hydride. In one embodiment, the reducing metal complex is formed by adding about 0.2 mL to about 0.6 mL of lithium hydride. In one embodiment, the reducing metal complex is formed by adding about 0.2 mL to about 0.5 mL of lithium hydride. In one embodiment, the reducing metal complex is formed by adding about 0.2 mL to about 0.6 mL of lithium hydride. In one embodiment, the reducing metal complex is formed by adding about 0.3 mL to about 0.4 mL of lithium hydride. In other embodiments, the reducing metal complex is lithium hydride in an amount of about 0.1 mL, about 0.2 mL, It is formed by adding approximately 0.3 mL, 0.4 mL, 0.5 mL, 0.6 mL, 0.7 mL, 0.8 mL, 0.9 mL, or 1.0 mL. Decomposition

[0147] In one embodiment, a reducing metal complex is decomposed on a substrate to form a conductive structure on the substrate. In one embodiment, the reducing metal complex is decomposed by heating the reducing metal complex at a temperature of approximately 270°C or lower. In some embodiments, the reducing metal complex is decomposed by heating it at a temperature of about 260°C or less, about 250°C or less, about 240°C or less, about 230°C or less, about 220°C or less, about 210°C or less, about 200°C or less, about 190°C or less, about 180°C or less, about 170°C or less, about 160°C or less, about 150°C or less, about 140°C or less, about 130°C or less, about 120°C or less, about 110°C or less, about 100°C or less, about 90°C or less, about 80°C or less, or about 70°C or less. In one embodiment, the reducing metal complex is heated by a heat source. Examples of heat sources include an IR lamp, an oven, or a heating substrate.

[0148] In one embodiment, the reducing metal complex is decomposed by mixing a catalyst with the reducing metal complex to form a catalytic reducing metal complex. In one embodiment, the catalytic reducing metal complex is decomposed at a temperature lower than the temperature required to decompose the reducing metal complex. In one embodiment, the catalytic reducing metal complex is heated to a temperature of about 220°C or less, about 210°C or less, about 200°C or less, about 190°C or less, about 180°C or less, about 170°C or less, about 160°C or less, about 150°C or less, about 140°C or less, about 130°C or less, about 120°C or less, about 110°C or less, about 100°C or less, about 90°C or less, about 80°C or less, or about 70°C or less.

[0149] In one embodiment, the catalyst is a hydride abstractor. In one embodiment, the catalyst is a carbonyl extractor. In one embodiment, the catalyst is selected from the group consisting of titanium(IV) compounds, phenazine methosulfate, phenazine ethosulfate, 1-methoxyphenazine methosulfate, Meldola blue, and combinations thereof. In one embodiment, the catalyst is a titanium(IV) compound. In one embodiment, the catalyst is selected from the group consisting of titanium(IV) oxide, titanium(IV) sulfide, titanium(IV) nitrate, titanium(IV) alkoxide, and combinations thereof. In one embodiment, the titanium(IV) alkoxide is titanium(IV) isopropoxide or titanium(IV) 2-ethylhexyl oxide. In one embodiment, the catalyst is titanium(IV) ethoxide.

[0150] In one embodiment, the reducing metal complex is decomposed by exposing it to a light source with a wavelength of approximately 100 nm to approximately 1500 nm. In another embodiment, the reducing metal complex is decomposed by exposing it to a light source such as a xenon lamp or IR lamp with a wavelength of approximately 100 nm to approximately 1000 nm. In yet another embodiment, the reducing metal complex is decomposed by exposing it to a light source with a wavelength of approximately 100 nm to approximately 700 nm. In yet another embodiment, the reducing metal complex is decomposed by exposing it to a light source with a wavelength of approximately 100 nm to approximately 500 nm. In yet another embodiment, the reducing metal complex is decomposed by exposing it to a light source with a wavelength of approximately 100 nm to approximately 300 nm. In some embodiments, the reducing metal complex is exposed to a light source with wavelengths of approximately 100 nm, 200 nm, 300 nm, 400 nm, 500 nm, 600 nm, 700 nm, 800 nm, 900 nm, or 1000 nm. It is broken down by doing so.

[0151] In one embodiment, since the metal complex contains a metal having a zero oxidation state, a reducing agent is not required to form the ink composition. In one embodiment, the ink composition for producing a conductive structure contains a metal(0) complex containing a group 4, 5, 6, 7, 8, 9, 10, 11, or 12 metal having a zero oxidation state. The metal(0) complex is decomposed on a substrate to form a conductive structure. In one embodiment, the metal(0) complex is decomposed by heating the metal(0) complex at a temperature of about 270°C or less. In one embodiment, the metal(0) complex is heated by a heat source. Examples of heat sources include an IR lamp, an oven, or a heating substrate. In one embodiment, the metal(0) complex is decomposed by mixing a catalyst with a metal hydride complex to form a catalytic metal(0) complex, and then heating this catalytic metal(0) complex at a temperature of about 220°C or less. In one embodiment, a metal(0) complex is decomposed by exposing it to a light source with a wavelength of approximately 100 nm to approximately 1500 nm. In one embodiment, the light source is a xenon lamp or an IR lamp.

[0152] In one embodiment, a chemical additive is added to the metal complex to prevent the ink surface from oxidizing at high temperatures. In one embodiment, the chemical additive prevents the ink surface from oxidizing at a high temperature of about 25°C. In one embodiment, the chemical additive prevents the ink surface from oxidizing at a high temperature of about 30°C. In one embodiment, the chemical additive prevents the ink surface from oxidizing at a high temperature of about 35°C. In one embodiment, the chemical additive prevents the ink surface from oxidizing at a high temperature of about 40°C.

[0153] In one embodiment, the chemical additive forms a complex with the metal surface. In one embodiment, the chemical additive forms a complex with copper. In one embodiment, the chemical additive is selected from the group consisting of acidic sulfites, sodium thiosulfate, ammonium thioglycolate, diisopropylammonium nitrite, benzotriazole, pentaerythritol tetranitrate, and dicyclohexylammonium nitrite. In one embodiment, the chemical additive is benzotriazole. Ink composition combinations of metals and / or metal complexes, solvents and reducing agents

[0154] In one embodiment, the metal of at least one metal salt or metal complex is selected from the group consisting of aluminum, magnesium, titanium, silicon, vanadium, zinc, tin, copper, nickel, palladium, zirconium, iron, niobium, germanium, manganese, chromium, cobalt, tungsten, molybdenum, bismuth, ruthenium, and combinations thereof. In one embodiment, the reducing agent is lithium aluminum hydride. In one embodiment, the reducing agent is lithium hydride. In one embodiment, the dissolving agent is diethyl ether. In one embodiment, the conductive structure is an elemental metal or a metal alloy.

[0155] The reducing agent, along with the metal salt and complex, are mixed together in different molar ratios. In one embodiment, the molar ratio of the reducing agent to at least one metal salt or metal complex depends on the oxidation state of the metal in that at least one metal salt or metal complex. In one embodiment, the molar ratio of the reducing agent to at least one metal salt or metal complex is equal to the oxidation state of the metal in that at least one metal salt or metal complex. For example, if the metal in that metal salt or metal complex has an oxidation state of +2, the molar ratio of the reducing agent to at least one metal salt or metal complex is 2:1, or 2.

[0156] In one embodiment, if the metal has an oxidation state of +1, the reducing agent is added to at least one metal salt or metal complex in a molar ratio of reducing agent to metal salt or metal complex of 1:1. In another embodiment, if the metal has an oxidation state of +2, the reducing agent is added to at least one metal salt or metal complex in a molar ratio of reducing agent to metal salt or metal complex of 2:1. In one embodiment, if the metal has an oxidation state of +3, the reducing agent is added to at least one metal salt or metal complex in a molar ratio of reducing agent to metal salt or metal complex of 3:1. In one embodiment, if the metal has an oxidation state of +4, the reducing agent is added to at least one metal salt or metal complex in a molar ratio of reducing agent to metal salt or metal complex of 4:1. In one embodiment, if the metal has an oxidation state of +5, the reducing agent is added to at least one metal salt or metal complex in a molar ratio of reducing agent to metal salt or metal complex of 5:1. In one embodiment, if the metal has an oxidation state of +6, the reducing agent is added to at least one metal salt or metal complex in a molar ratio of reducing agent to metal salt or metal complex of 6:1. In one embodiment, if the metal has an oxidation state of +7, the reducing agent is added to at least one metal salt or metal complex in a molar ratio of reducing agent to metal salt or metal complex of 7:1.

[0157] As is known to those skilled in the art, specular reflection is the mirror-like reflection of light from a surface, where a single incoming direction is reflected in a single outgoing direction. The specular reflectivity of a conductive structure is a byproduct of an extremely low root mean square (RMS) value of the conductive structure. In some embodiments, the conductive structure has an RMS value of about 15 nanometers or less, about 14 nanometers or less, about 13 nanometers or less, about 12 nanometers or less, about 11 nanometers or less, about 10 nanometers or less, about 9 nanometers or less, about 8 nanometers or less, about 7 nanometers or less, about 6 nanometers or less, or about 5 nanometers or less.

[0158] In one embodiment, the electrical conductivity of a conductive structure is measured. In one embodiment, the electrical conductivity of the conductive structure is approximately 1 × 10⁻⁶ -6 It is Ω·cm or greater. In one embodiment, the electrical conductivity of the conductive structure is about 1 × 10⁻⁶. -6 Ω cm ~ approx. 8×10 -4Ω·cm. In one embodiment, the electrical conductivity of the conductive structure is about 3×10 -6 Ω·cm to about 6×10 -6 Ω·cm. In some embodiments, the electrical conductivity of the conductive structure is at least about 1×10 -6 Ω·cm, about 2×10 -6 Ω·cm, about 3×10 -6 Ω·cm, about 4×10 -6 Ω·cm, about 5×10 -6 Ω·cm, about 6×10 -6 Ω·cm, about 7×10 -6 Ω·cm, about 8×10 -6 Ω·cm, about 9×10 -6 Ω·cm, about 1×10 -5 Ω·cm, about 2×10 -5 Ω·cm, about 3×10 -5 Ω·cm, about 4×10 -5 Ω·cm, about 5×10 -5 Ω·cm, about 6×10 -5 Ω·cm, about 7×10 -5 Ω·cm, about 8×10 -5 Ω·cm, about 9×10 -5 Ω·cm, about 1×10 -4 Ω·cm, about 2×10 -4 Ω·cm, about 3×10 -4 Ω·cm, about 4×10 -4 Ω·cm, about 5×10 -4 Ω·cm, about 6×10 -4 Ω·cm or about 7×10 -4 Ω·cm. In one embodiment, the electrical conductivity of the conductive structure is at most about 8×10 -4 Ω·cm, 7×10 -4 Ω·cm, about 6×10 -4 Ω·cm, about 5×10 -4 Ω·cm, about 4×10 -4 Ω·cm, about 3×10 -4 Ω·cm, about 2×10 -4 Ω·cm or about 1×10 -4 Ω·cm, about 9×10 -5 Ω·cm, about 8×10 -5 Ω·cm, about 7×10 -5 Ω·cm, about 6×10 -5 Ω·cm, about 5×10-5 Ω cm, approx. 4×10 -5 Ω cm, approx. 3×10 -5 Ω cm, approximately 2×10 -5 Ω cm, approximately 1×10 -5 Ω cm, approx. 9×10 -6 Ω cm, approximately 8×10 -6 Ω cm, approximately 7×10 -6 Ω cm, approx. 6×10 -6 Ω cm, approx. 5×10 -6 Ω cm, approx. 4×10 -6 Ω cm, approx. 3×10 -6 Ω·cm or approximately 2 × 10 -6 It is Ω·cm. Magnesium conductive structures

[0159] In one embodiment, the conductive structure is magnesium. In one embodiment, the conductive structure is formed by mixing lithium hydride and magnesium halide to form a magnesium hydride complex. Zinc-conductive structures

[0160] In one embodiment, the conductive structure is zinc. In one embodiment, the conductive structure is formed by mixing lithium aluminum hydride with zinc halide to form a zinc hydride complex. Aluminum conductive structures

[0161] In one embodiment, the conductive structure is made of aluminum. In one embodiment, the conductive structure is formed by mixing lithium aluminum hydride dissolved in diethyl ether with anhydrous aluminum chloride under argon gas to form an aluminum hydride complex. In one embodiment, when lithium aluminum hydride is mixed with anhydrous aluminum chloride, lithium chloride precipitates.

[0162] In one embodiment, an aluminum hydride complex is heated under argon gas at a temperature of 250°C to produce a pure aluminum film. In another embodiment, the aluminum hydride complex is catalytically decomposed using a titanium complex, such as a titanium(IV) compound, as a hydride extractor to produce an aluminum film at a decomposition temperature of approximately 180°C to 200°C. In one embodiment, broad wavelength light is used to accelerate the decomposition of the aluminum hydride complex. In one embodiment, the aluminum film has a conductivity of approximately 30% of bulk aluminum. In another embodiment, the aluminum film is highly reflective and looks like bulk metal. Nickel-conductive structures

[0163] In one embodiment, the conductive structure is nickel. In one embodiment, the conductive structure is formed by mixing nickel tetracarbonyl with a carbonyl extractor to form a nickel(0) complex.

[0164] In one embodiment, the conductive structure is formed by mixing nickel(0) alkenes and dissolving the nickel(0) alkene complex to form an ink. In one embodiment, the ink decomposes at a temperature of 80°C to form a nickel conductive structure. copper conductive structures

[0165] In one embodiment, the conductive structure is made of copper. In one embodiment, the conductive structure is formed by dissolving copper formate in 2-amino-2-methyl-1-propanol to form a copper complex.

[0166] In one embodiment, the conductive structure is formed by mixing a copper complex with benzotriazole to form an ink. In another embodiment, the ink decomposes at a temperature of 120°C to form a copper conductive structure.

[0167] In one embodiment, the conductive structure is formed by mixing a copper complex with benzotriazole and a catalyst. The ink is then decomposed at a temperature of 80°C to form the copper conductive structure. In one embodiment, the catalyst is a silver complex or a palladium complex. Titanium alloy conductive structures

[0168] In one embodiment, the conductive structure is a titanium alloy. In one embodiment, the titanium alloy is formed by mixing lithium aluminum hydride, a vanadium complex, and a titanium salt to form a titanium hydride complex. In one embodiment, the vanadium complex is vanadylacetylacetonate or vanadium hexacarbonyl. Aluminum alloy conductive structures

[0169] In one embodiment, the conductive structure is an aluminum alloy. The aluminum alloy is formed by mixing a silicon alkyl complex, an aluminum salt, and lithium aluminum hydride to form an aluminum hydride complex. In one embodiment, the silicon alkyl complex is tetraethylsilane.

[0170] In one embodiment, the ink composition is an aluminum alloy containing about 0.2 wt% to about 1.0 wt% alkylsilicon complex. In another embodiment, the ink composition is an aluminum alloy containing about 0.4 wt% to about 0.8 wt% alkylsilicon complex. In several embodiments, the ink composition is an aluminum alloy containing about 0.2 wt%, about 0.3 wt%, about 0.4 wt%, about 0.5 wt%, about 0.6 wt%, about 0.7 wt%, about 0.8 wt%, about 0.9 wt%, or about 1.0 wt% alkylsilicon complex. In one embodiment, the conductive structure is 6061 aluminum. Copper alloy conductive structure

[0171] In one embodiment, the conductive structure is a copper alloy. In one embodiment, the copper alloy is formed by mixing a silicon alkyl complex, a copper salt, and a β-ketocarboxylate salt to form a β-ketocarboxylate copper complex. In one embodiment, the silicon alkyl complex is tetraethylsilane.

[0172] In one embodiment, the ink composition is a copper alloy containing about 0.1 wt% to about 0.6 wt% alkylsilicon complex. In another embodiment, the ink composition is a copper alloy containing about 0.15 wt% to about 0.4 wt% alkylsilicon complex. In several embodiments, the ink composition is a copper alloy containing about 0.1 wt%, about 0.2 wt%, about 0.3 wt%, about 0.4 wt%, about 0.5 wt%, or about 0.6 wt% alkylsilicon complex. Magnesium alloy conductive structures

[0173] In one embodiment, the conductive structure is a magnesium alloy. In one embodiment, the magnesium alloy is formed by mixing a silicon alkyl complex, a magnesium salt, and lithium hydride to form a magnesium hydride complex. In one embodiment, the silicon alkyl complex is tetraethylsilane.

[0174] In one embodiment, the ink composition is a magnesium alloy containing about 0.5 wt% to about 1.5 wt% alkylsilicon complex. In another embodiment, the ink composition is a magnesium alloy containing about 0.8 wt% to about 1.2 wt% alkylsilicon complex. In several embodiments, the ink composition is a magnesium alloy containing about 0.5 wt%, about 0.6 wt%, about 0.7 wt%, about 0.8 wt%, about 0.9 wt%, about 1.0 wt%, about 1.1 wt%, about 1.2 wt%, about 1.3 wt%, about 1.4 wt%, or about 1.5 wt% alkylsilicon complex. Nickel alloy conductive structures

[0175] In one embodiment, the conductive structure is a nickel alloy. In one embodiment, the nickel alloy is formed by mixing a nickel salt with a cyclic alkene to create a nickel(0) complex. Method for preparing an ink composition

[0176] One embodiment discloses a method for fabricating a conductive structure. In one embodiment, the method includes the step of mixing a reducing agent with the metal of at least one metal salt or metal complex to form a reducing metal complex. In one embodiment, the reducing agent is dissolved in at least one solvent. In one embodiment, the reducing agent is a hydride. In some embodiments, the reducing agent is a formate or a β-ketocarboxylate. In one embodiment, the method also includes the step of coating the reducing metal complex onto a substrate. In one embodiment, the step of mixing the reducing agent with at least one metal salt or metal complex is performed before the step of coating the reducing metal complex onto the substrate. In one embodiment, the method also includes the step of decomposing a reducing metal complex on a substrate to form a conductive structure. In one embodiment, the reducing metal complex is formed in the presence of argon gas or nitrogen gas.

[0177] In one embodiment, the method for forming a reducing metal complex is carried out under anhydrous conditions. In one embodiment, the use of anhydrous conditions depends on the metal salt or metal complex used to form the reducing metal complex. In one embodiment, anhydrous conditions are used to produce ink at reduction potentials of about -0.15V or less, about -0.25V or less, or about -0.35V or less. In one embodiment, anhydrous conditions are used to prevent disproportionation reactions from occurring during the decomposition or annealing of the reducing metal complex. For example, anhydrous conditions are used when producing copper hydride complexes.

[0178] In one embodiment, the step of decomposing a reducing metal complex on a substrate to form a conductive structure includes heating the reducing metal complex at a temperature of about 270°C or less. In some embodiments, the step of decomposing a reducing metal complex on a substrate to form a conductive structure includes heating the reducing metal complex at a temperature of about 260°C or less, about 250°C or less, about 240°C or less, about 230°C or less, about 220°C or less, about 210°C or less, about 200°C or less, about 190°C or less, about 180°C or less, about 170°C or less, about 160°C or less, about 150°C or less, about 140°C or less, about 130°C or less, about 120°C or less, about 110°C or less, about 100°C or less, about 90°C or less, about 80°C or less, or about 70°C or less. In one embodiment, the reducing metal complex is heated with a heat source. Examples of heat sources include an IR lamp, an oven, or a heating substrate.

[0179] In one embodiment, the step of decomposing a reducing metal complex on a substrate to form a conductive structure includes mixing a catalyst with the reducing metal complex to form a catalytic reducing metal complex. In one embodiment, the catalyst is mixed with a reducing agent and a metal salt or metal complex before forming the reducing metal complex. In one embodiment, the catalyst is mixed with the reducing metal complex before coating the reducing metal complex onto the substrate. In one embodiment, the catalyst is mixed with the reducing metal complex after coating the reducing metal complex onto the substrate.

[0180] In one embodiment, the catalytically reducing metal complex is heated to a temperature of approximately 220°C or less, approximately 210°C or less, approximately 200°C or less, approximately 190°C or less, approximately 180°C or less, approximately 170°C or less, approximately 160°C or less, approximately 150°C or less, approximately 140°C or less, approximately 130°C or less, approximately 120°C or less, approximately 110°C or less, approximately 100°C or less, approximately 90°C or less, approximately 80°C or less, or approximately 70°C or less.

[0181] In one embodiment, the catalyst is a hydride extractor. In one embodiment, the catalyst is a carbonyl extractor. In one embodiment, the catalyst is selected from the group consisting of titanium(IV) compounds, phenazine methosulfate, phenazine ethosulfate, 1-methoxyphenazine methosulfate, Meldola blue, and combinations thereof. In one embodiment, the catalyst is a titanium(IV) compound. In one embodiment, the catalyst is selected from the group consisting of titanium(IV) oxide, titanium(IV) sulfide, titanium(IV) nitrate, titanium(IV) alkoxide, and combinations thereof. In one embodiment, the titanium(IV) alkoxide is titanium(IV) isopropoxide or titanium(IV) 2-ethylhexyl oxide. In one embodiment, the catalyst is titanium(IV) ethoxide.

[0182] In one embodiment, the step of decomposing a reducing metal complex on a substrate to form a conductive structure includes exposing the reducing metal complex to a light source with a wavelength of about 100 nm to about 1500 nm. In one embodiment, the step of decomposing a reducing metal complex on a substrate to form a conductive structure includes exposing the reducing metal complex to a light source, a xenon lamp, or an IR lamp with a wavelength of about 100 nm to about 1000 nm. In one embodiment, the step of decomposing a reducing metal complex on a substrate to form a conductive structure includes exposing the reducing metal complex to a light source with a wavelength of about 100 nm to about 700 nm. In one embodiment, the step of decomposing a reducing metal complex on a substrate to form a conductive structure includes exposing the reducing metal complex to a light source with a wavelength of about 100 nm to about 500 nm. In one embodiment, the step of decomposing a reducing metal complex on a substrate to form a conductive structure includes exposing the reducing metal complex to a light source with a wavelength of about 100 nm to about 300 nm. In some embodiments, the step of decomposing a reducing metal complex on a substrate to form a conductive structure includes exposing the reducing metal complex to a light source with a wavelength of about 100 nm, about 200 nm, about 300 nm, about 400 nm, about 500 nm, about 600 nm, about 700 nm, about 800 nm, about 900 nm, or about 1000 nm.

[0183] In one embodiment, the reducing agent is dissolved in the solvent before being added. In another embodiment, the reducing agent is mixed with the solvent before being dissolved in the solvent. In yet another embodiment, the reducing agent, solvent, and at least one metal salt or metal complex are added simultaneously.

[0184] In one embodiment, the reducing metal complex has a desired viscosity. In one embodiment, the desired viscosity is obtained using a microVISC viscometer. In one embodiment, the reducing metal complex has a viscosity of about 50 centipoise to about 1000 centipoise. In one embodiment, the reducing metal complex has a viscosity of about 5 centipoise to about 50 centipoise. In one embodiment, the reducing metal complex has a viscosity of about 10 centipoise to about 40 centipoise. In one embodiment, the reducing metal complex has a viscosity of about 20 centipoise to about 30 centipoise. In one embodiment, the reducing metal complex has a viscosity of about 18 centipoise to about 20 centipoise. In some embodiments, the reducing metal complex has a viscosity of about 18, about 19, or about 20 centipoise.

[0185] In one embodiment, the viscosity of the complex is adjusted based on the amount of solvent used. In another embodiment, the viscosity of the complex is adjusted based on the type of solvent used. In yet another embodiment, the viscosity of the complex is adjusted based on the amount of diethyl ether used. In yet another embodiment, increasing the amount of diethyl ether increases the viscosity of the reducing metal complex.

[0186] Furthermore, the viscosity of the complex is adjusted based on the amount of reducing agent added. Using more reducing agent increases the viscosity of the reducing metal complex. In one embodiment, increasing the amount of reducing agent can increase the viscosity of the reducing metal complex well beyond 1000 centipoise. In one embodiment, increasing the amount of reducing agent from about 0.2 mL to about 0.6 mL can increase the viscosity of the reducing metal complex well beyond 1000 centipoise. In one embodiment, using less reducing agent decreases the viscosity of the reducing metal complex. Uses of ink compositions

[0187] This ink composition can be used in a variety of printing applications, including slot die coating, spin coating, gravure printing, roll-to-roll printing including flexographic printing, rotary screen printing, screen printing, aerosol jet printing, inkjet printing, air brushing, Meyer rod coating, flood coating, 3D printing, and electrohydrodynamic painting. Furthermore, it can be used to create masks for etching metal from specific areas. Therefore, by using photolithography to create patterns, it is possible to produce high-fidelity features.

[0188] In one embodiment, this reducing metal complex is compatible with many non-polar polymer substrates, glass and ceramic substrates where the polar complex is not sufficiently wetted. In one embodiment, the reducing metal complex is coated onto a polymer substrate. In one embodiment, the reducing metal complex is coated onto a non-polar polymer substrate. In one embodiment, the reducing metal complex is coated onto a glass substrate. In one embodiment, the reducing metal complex is coated onto a ceramic substrate.

[0189] Furthermore, elastomers and 3D substrates having a specific non-planar topography can be used together with conductive structures. In one embodiment, a reducing metal complex is coated onto the elastomer. In another embodiment, a reducing metal complex is coated onto the 3D substrate.

[0190] The specular reflectivity of conductive structures is a byproduct of their extremely low RMS value. In one embodiment, the RMS value of the conductive structure is about 10 nanometers or less. In one embodiment, the conductive structure is used on a substrate having a smooth surface. In one embodiment, the conductive structure is used as an electrode structure for fine features to prevent electromigration. Another embodiment uses it to create structural features from alloys. [Examples]

[0191] Other uses, embodiments, and advantages of this conductive structure are further illustrated in the following examples, but the specific materials and quantities, as well as other conditions and details, mentioned in these examples should not be construed as unduly limiting this conductive structure. (Example 1)

[0192] In one embodiment, approximately 0.5 grams of silver neodecanoate is dissolved in a mixture of approximately 0.5 mL of xylene and approximately 0.5 mL of terpineol. Approximately 0.2 mL of tert-octylamine is added to the silver neodecanoate dissolved in xylene and terpineol. The silver complex has a viscosity of approximately 18 centipoise to approximately 20 centipoise. The viscosity of the complex increases when more terpineol and less xylene are used. The viscosity of the complex also increases when more amine is used. The viscosity of this complex can be adjusted from approximately 5 centipoise by using excess xylene to approximately 50 centipoise by using excess terpineol. The viscosity can be further increased to over 1000 centipoise by increasing the amount of tert-octylamine from approximately 0.2 mL to approximately 0.6 mL.

[0193] The silver complex ink is patterned and heated to a temperature of approximately 180°C to 200°C. Approximately 5 minutes after patterning, xylene and terpineol have mostly evaporated, and the conductive structure film begins to turn yellow. Approximately 10 to 15 minutes after patterning, the film begins to change to reddish-brown. Approximately 20 to 30 minutes after patterning, the film begins to turn black, and then transforms into a metallic silver luster, which eventually covers the entire film, thereby indicating that the entire complex is decomposing into a metallic conductive structure.

[0194] The conductive structure is approximately 3 × 10 -6 Ω cm ~ approx. 6×10 -6It has an electrical conductivity of Ω·cm. The specular reflectivity of the conductive structure is a byproduct of its extremely low RMS value. The RMS value of the conductive structure is approximately 10 nanometers or less. (Example 2)

[0195] In one embodiment, approximately 0.5 grams of silver neodecanoate are dissolved in approximately 1 mL of xylene. 0.2 mL of 2-ethylhexylamine is added to the silver neodecanoate dissolved in xylene. The silver complex has a viscosity of approximately 18 centipoise to approximately 20 centipoise. The viscosity of the complex increases when more 2-ethylhexylamine is used. By increasing the amount of 2-ethylhexylamine from approximately 0.2 mL to approximately 0.6 mL, the viscosity can be increased to over 1000 centipoise.

[0196] The silver complex ink is patterned and heated to a temperature of approximately 190°C. Approximately 5 minutes after patterning, most of the xylene evaporates, and the conductive structure film begins to turn yellow. Approximately 10-15 minutes after patterning, the film begins to change to reddish-brown. Approximately 20-30 minutes after patterning, the film begins to turn black, and then transforms into a metallic silver luster, which eventually covers the entire film, indicating that the entire complex is decomposing into a metallic conductive structure.

[0197] The conductive structure is approximately 2 × 10 -6 Ω cm ~ approx. 1×10 -5 It has an electrical conductivity of Ω·cm. The specular reflectivity of the conductive structure is a byproduct of its extremely low RMS value. The RMS value of the conductive structure is approximately 10 nanometers or less. (Example 3)

[0198] In one embodiment, approximately 0.4 grams of silver hexafluoroacetylacetate are dissolved in approximately 1 mL of xylene. Approximately 0.2 mL of tert-octylamine is added to the silver hexafluoroacetylacetate dissolved in xylene. This silver complex has a viscosity of approximately 18 centipoise to approximately 20 centipoise. The viscosity of the complex increases with the use of more tert-octylamine. By increasing the amount of tert-octylamine from approximately 0.2 mL to approximately 0.6 mL, the viscosity can be increased to over 1000 centipoise.

[0199] The silver complex ink is patterned and heated to a temperature of approximately 160°C. Approximately 5 minutes after patterning, most of the xylene evaporates, and the conductive structure film begins to turn yellow. Approximately 10-15 minutes after patterning, the film begins to change to reddish-brown. Approximately 20-30 minutes after patterning, the film begins to turn black, and then transforms into a metallic silver luster, which eventually covers the entire film, indicating that the entire complex is decomposing into a metallic conductive structure.

[0200] The conductive structure is approximately 2 × 10 -6 Ω cm ~ approx. 1×10 -5 It has an electrical conductivity of Ω·cm. The specular reflectivity of the conductive structure is a byproduct of its extremely low RMS value. The RMS value of the conductive structure is approximately 10 nanometers or less. (Example 4)

[0201] 0.5 grams (0.179 mmol) of silver neodecanoate was dissolved in 2 mL of xylene. This solution had a viscosity of 6 cPs. Adding 0.4 mL (2.49 mmol) of tert-octylamine increased the viscosity of the solution to 100 cPs. Further addition of tert-octylamine (over 0.8 mL) resulted in complete gelation of the solution, achieving a viscosity of 10,000 cPs. (Example 5)

[0202] Lithium aluminum hydride is mixed with an ether solution of aluminum chloride in a molar ratio of 3:1. When lithium aluminum hydride is mixed with aluminum chloride, the lithium chloride precipitates, leaving the ether solution of aluminum hydride. A small amount of titanium(IV) ethoxide is added to the ether solution. Then, The resulting solution is heated at 140°C to obtain an aluminum film. (Example 6)

[0203] Lithium aluminum hydride is mixed with an aluminum chloride ether solution in a molar ratio of 3:1. When lithium aluminum hydride is mixed with aluminum chloride, the lithium chloride precipitates, leaving the aluminum hydride ether solution. This solution is heated to 180-200°C to obtain an aluminum film. (Example 7)

[0204] Lithium hydride is mixed with an ether solution of tetraethylsilane and magnesium hydride in a molar ratio of 4:1 between lithium hydride and a mixture of tetraethylsilane and magnesium hydride. When lithium hydride is mixed with the mixture of tetraethylsilane and magnesium hydride, lithium silicate precipitates, leaving an ether solution of the magnesium hydride complex. A small amount of titanium(IV) ethoxide is added to the ether solution. The resulting solution is then heated to 140°C to obtain an aluminum alloy. (Example 8)

[0205] Lithium hydride is mixed with an ether solution of tetraethylsilane and magnesium hydride in a molar ratio of 4:1 between lithium hydride and a mixture of tetraethylsilane and magnesium hydride. When lithium hydride is mixed with the mixture of tetraethylsilane and magnesium hydride, lithium silicate precipitates, leaving an ether solution of the magnesium hydride complex. The resulting solution is then heated at 180-200°C to obtain an aluminum alloy. (Example 9)

[0206] Lithium aluminum hydride is mixed with a zinc chloride ether solution in a molar ratio of 2:1. When lithium aluminum hydride is mixed with zinc chloride, the lithium chloride precipitates, leaving the zinc hydride ether solution. A small amount of titanium(IV) ethoxide is added to the ether solution. The resulting solution is then heated at 140°C to obtain a zinc film. (Example 10)

[0207] Lithium aluminum hydride is mixed with a zinc chloride ether solution in a molar ratio of 2:1. When lithium aluminum hydride is mixed with zinc chloride, the lithium chloride precipitates, leaving the zinc hydride ether solution. The resulting solution is then heated at 140-200°C to obtain a zinc film.

[0208] While the present invention has been described herein in relation to the embodiments described, those skilled in the art will understand that additions, modifications, substitutions, and deletions not specifically described can be made without departing from the spirit and scope of the invention as defined in the appended claims. Therefore, the above detailed description is intended to be illustrative rather than restrictive, and the spirit and scope of the invention are defined by the following claims, including all equivalents.

[0209] According to a preferred embodiment of the present invention, for example, the following is provided: (Section 1) A conductive ink composition, wherein the ink composition is Silver carboxylate; At least one solvent for dissolving the silver carboxylate; and catalyst It contains a silver complex formed by mixing, The catalyst comprises an amine that decarboxylates the silver carboxylate to produce the conductive ink composition. An ink composition in which the catalyst decarboxylates the silver carboxylate at a temperature of 100°C or less. (Item 2) A conductive ink composition, wherein the ink composition comprises: Silver carboxylate containing silver; At least one solvent for dissolving the silver carboxylate; and A catalyst for reducing the silver of the silver carboxylate to produce the conductive ink composition containing a silver complex formed by mixing, wherein the catalyst contains an amine, the catalyst is an ink composition that reduces the silver of the silver carboxylate at a temperature of 100 °C or lower. (Item 3) The composition according to any one of Items 1 to 2 above, wherein the silver carboxylate is selected from the group consisting of silver propionate, silver butyrate, silver pentanoate, silver hexanoate, silver heptanoate, silver ethylhexanoate, silver behenate, silver oleate, silver octanoate, silver nonanoate, silver decanoate, silver neodecanoate, and silver hexafluoroacetylacetonate. (Item 4) The composition according to Item 3 above, wherein the silver carboxylate is silver neodecanoate. (Item 5) The composition according to Item 3 above, wherein the silver carboxylate is silver hexafluoroacetylacetonate. (Item 6) The composition according to any one of Items 1 to 5 above, wherein the solvent is selected from the group consisting of an organic solvent, a chelating agent, and a combination thereof. (Item 7) The composition according to Item 6 above, wherein the solvent is at least one organic solvent. (Item 8) The composition according to any one of Items 6 to 7 above, wherein the solvent is selected from the group consisting of an alkane hydrocarbon, an alkene, a cyclic hydrocarbon, an aromatic hydrocarbon, a carbamate, an amine, a polyamine, an amide, an ether, an ester, an alcohol, a thiol, a thioether, a phosphine, and a combination thereof. (Item 9) The composition according to any one of Items 6 to 8 above, wherein the solvent contains at least one linear or branched alkane hydrocarbon having a length of C 5~20 of. (Item 10) The composition according to item 9 above, wherein the solvent is selected from the group consisting of pentane, hexane, heptane, octane, nonane, decane, undecane, dodecane, tridecane, tetradecane, pentadecane, hexadecane, octadecane, nonadecane, icosane, and combinations thereof. (Item 11) The composition according to any one of items 6 to 8 above, wherein the solvent contains at least one cyclic hydrocarbon having a length of C 6~20 The composition according to any one of items 6 to 8 above, wherein the solvent contains at least one cyclic hydrocarbon having a length of C (Item 12) The composition according to item 11 above, wherein the solvent is selected from the group consisting of cyclohexane, cycloheptane, cyclooctane, cyclononane, cyclodecane, decalin, and combinations thereof. (Item 13) The composition according to any one of items 6 to 8 above, wherein the solvent contains at least one aromatic hydrocarbon The composition according to any one of items 6 to 8 above, wherein the solvent contains at least one aromatic hydrocarbon (Item 14) The composition according to item 13 above, wherein the solvent is selected from the group consisting of benzene, toluene, xylene, tetralin, and combinations thereof. (Item 15) The composition according to any one of items 13 to 14 above, wherein the solvent is xylene. (Item 16) The composition according to any one of items 6 to 8 above, wherein the solvent contains at least one linear ether, branched ether, or cyclic ether. (Item 17) The composition according to item 16 above, wherein the solvent contains at least one linear ether or branched ether. (Item 18) The composition according to any one of items 16 to 17 above, wherein the solvent is selected from the group consisting of dimethyl ether, diethyl ether, dipropyl ether, dibutyl ether, methyl t-butyl ether, and combinations thereof. (Item 19) The composition according to item 16 above, wherein the solvent contains at least one cyclic ether. (Section 20) The composition according to item 19, wherein the solubilizer is selected from the group consisting of tetrahydrofuran, tetrahydropyran, dihydropyran, 1,4-dioxane, and combinations thereof. (Section 21) The composition according to any one of items 6 to 7, wherein the solvent is terpineol. (Section 22) The composition according to any one of items 6 to 7, wherein the solubilizer comprises xylene and terpineol. (Section 23) The composition according to item 22, wherein the solvent has xylene to terpineol in a volume ratio of about 1:about 1. (Section 24) The composition according to item 6, wherein the solubilizer comprises at least one chelating agent. (Section 25) The composition according to item 24, wherein the solvent is selected from the group consisting of ethylenediaminetetraacetic acid, iminodiacetic acid, ethylenediamine-di(o-hydroxyphenylacetic acid), nitrilotriacetic acid, dihydroxyethylglycine, trans-1,2-cyclohexanediaminetetraacetic acid, diethylenetriamine-N,N,N',N”,N”-pentaacetic acid, glycol etherdiamine-N,N,N',N'-tetraacetic acid, dimethyl sulfoxide, diethylenetriamine, tert-octylamine, 2-ethylhexylamine, and ethylenediamine. (Item 26) The composition according to any one of claims 1 to 25, wherein the catalyst is selected from the group consisting of primary amines, secondary amines, tertiary amines, and polyamines. (Section 27) The composition according to item 26, wherein the catalyst comprises at least one primary amine. (Section 28) The catalyst comprises at least one C 1~18 A composition according to either item 26 or 27, comprising an alkylamine having . (Section 29) The catalyst is methylamine, ethylamine, propylamine, butylamine, pentylamine, hexylamine, heptylamine, octylamine, nonylamine, decylamine. A composition according to any one of the above items 26 to 28, selected from the group consisting of n, undecylamine, dodecylamine, tridecylamine, tetradecylamine, pentadecylamine, hexadecylamine, heptadecylamine, octadecylamine, and combinations thereof. (Section 30) The composition according to item 27, wherein the catalyst is selected from the group consisting of allylamine, n-propylamine, isopropylamine, n-butylamine, sec-butylamine, tert-butylamine, n-pentylamine, isopentylamine, 2-ethylhexylamine, tert-hexylamine, phenylamine, cyclopentylamine, tert-octylamine, tert-decylamine, tert-dodecylamine, tert-octadecylamine, and combinations thereof. (Section 31) The composition according to item 30, wherein the catalyst is tert-octylamine. (Section 32) The composition according to item 30, wherein the catalyst is 2-ethylhexylamine. (Section 33) The composition according to item 26, wherein the catalyst comprises at least one secondary amine. (Section 34) The composition according to item 33, wherein the catalyst is selected from the group consisting of dimethylamine, diethylamine, dipropylamine, dibutylamine, diphenylamine, dicyclopentylamine, methylbutylamine, and combinations thereof. (Section 35) The composition according to item 26, wherein the catalyst comprises at least one tertiary amine. (Section 36) The composition according to item 35, wherein the catalyst is selected from the group consisting of trimethylamine, triethylamine, tripropylamine, triphenylamine, and combinations thereof. (Item 37) The composition according to item 26 above, wherein the catalyst contains at least one polyamine. (Item 38) The composition according to item 37 above, wherein the catalyst is selected from the group consisting of ethylenediamine, 1,3-diaminopropane, hexamethylenediamine, and combinations thereof. (Item 39) The composition according to any one of items 1 to 38 above, wherein the silver carboxylate is dissolved in the solvent before the catalyst is added. (Item 40) The composition according to any one of items 1 to 39 above, wherein the silver carboxylate is mixed with the catalyst before the silver carboxylate is dissolved in the solvent. (Item 41) The composition according to any one of items 1 to 40 above, wherein the conductive ink composition has silver at a concentration of about 1 to 40 wt% of the conductive ink composition. (Item 42) The composition according to any one of items 1 to 41 above, wherein the silver complex has a viscosity of about 5 centipoise to about 50 centipoise. (Item 43) The composition according to any one of items 1 to 41 above, wherein the silver complex has a viscosity of about 50 centipoise to about 1000 centipoise. (Item 44) The composition according to any one of items 42 to 43 above, wherein the viscosity is adjusted based on the amount of catalyst added. (Item 45) The composition according to any one of items 1 to 2 above, wherein the silver carboxylate is silver neodecanoate, the solvent is xylene, and the catalyst is 2-ethylhexylamine. (Item 46) [[ID=三十六]]The composition according to item 45 above, wherein the silver carboxylate is about 0.5 grams of silver neodecanoate, the solvent is about 1 mL of xylene, and the catalyst is about 0.2 mL of 2-ethylhexylamine. (Item 47) The composition according to any one of the above items 1 to 2, wherein the silver carboxylate is silver hexafluoroacetylacetone, the solvent is xylene, and the catalyst is tert-octylamine. (Section 48) The composition according to item 47, wherein the silver carboxylate is about 0.4 grams of silver hexafluoroacetylacetate, the xylene is about 1 mL, and the catalyst is about 0.2 mL of tert-octylamine. (Section 49) The composition according to any one of claims 1 to 2, wherein the silver carboxylate is silver neodecanoate, the solvent comprises xylene and terpineol, and the catalyst is tert-octylamine. (Section 50) The composition according to item 49, wherein the silver carboxylate is about 0.5 grams of silver neodecanoate, the solvent comprises about 0.5 mL of xylene and about 0.5 mL of terpineol, and the catalyst is about 0.2 mL of tert-octylamine. (Section 51) The conductive structure is approximately 2 × 10 -6 Ω cm ~ approx. 1×10 -5 A composition according to any one of items 1 to 50 above, having an electrical conductivity of Ω·cm. (Section 52) The composition according to any one of items 1 to 51 above, wherein the conductive structure has an RMS value of about 10 nanometers or less. (Section 53) A method for fabricating a conductive structure, A step of forming a silver complex by mixing silver carboxylate in the presence of an amine-containing catalyst, wherein the silver carboxylate is dissolved in at least one solvent; The steps include: coating the silver complex onto a substrate; The steps include: heating the silver complex on the substrate at a decomposition temperature of approximately 200°C or less to form the conductive structure; A method that includes this. (Section 54) The method according to item 53, wherein the silver carboxylate is selected from the group consisting of silver propionate, silver butyrate, silver pentanoate, silver hexanoate, silver heptanoate, silver ethylhexanoate, silver behenate, silver oleate, silver octanoate, silver nonanoate, silver decanoate, silver neodecanoate, and silver hexafluoroacetylacetone. (Section 55) The method according to item 54, wherein the silver carboxylate is silver neodecanoate. (Section 56) The method according to item 54, wherein the silver carboxylate is silver hexafluoroacetylacetone. (Section 57) The method according to any one of items 53 to 56, wherein the solubilizer is selected from the group consisting of organic solvents, chelating agents, and combinations thereof. (Section 58) The method according to item 57, wherein the solvent is at least one organic solvent. (Section 59) The method according to any one of claims 57 to 58, wherein the solubilizer is selected from the group consisting of alkane hydrocarbons, alkenes, cyclic hydrocarbons, aromatic hydrocarbons, carbamates, amines, polyamines, amides, ethers, esters, alcohols, thiols, thioethers, phosphines, and combinations thereof. (Section 60) The aforementioned solvent has a length C 5~20 The method according to any one of items 57 to 59, comprising at least one linear or branched alkane hydrocarbon. (Section 61) The method according to item 60, wherein the solvent is selected from the group consisting of pentane, hexane, heptane, octane, nonane, decane, undecane, dodecane, tridecane, tetradecane, pentadecane, hexadecane, octadecane, nonadecane, eicosane, and combinations thereof. (Section 62) The aforementioned solvent has a length C 6~20 The method according to any one of items 57 to 59 above, comprising at least one cyclic hydrocarbon. (Section 63) The method according to item 62, wherein the solubilizer is selected from the group consisting of cyclohexane, cycloheptane, cyclooctane, cyclononane, cyclodecane, decalin, and combinations thereof. (Section 64) The method according to any one of items 57 to 59, wherein the solvent comprises at least one aromatic hydrocarbon. (Section 65) The method according to item 64, wherein the solubilizer is selected from the group consisting of benzene, toluene, xylene, tetralin, and combinations thereof. (Section 66) The method according to any one of items 64 to 65, wherein the solubil is xylene. (Section 67) The method according to any one of items 57 to 59, wherein the solubilizer comprises at least one linear ether, branched ether, or cyclic ether. (Section 68) The method according to item 67, wherein the solubilizer comprises at least one linear ether or branched ether. (Section 69) The method according to any one of claims 67 to 68, wherein the solubilizer is selected from the group consisting of dimethyl ether, diethyl ether, dipropyl ether, dibutyl ether, methyl t-butyl ether, and combinations thereof. (Section 70) The method according to item 67, wherein the solvent comprises at least one cyclic ether. (Section 71) The method according to item 70, wherein the solubilizer is selected from the group consisting of tetrahydrofuran, tetrahydropyran, dihydropyran, 1,4-dioxane, and combinations thereof. (Item 72) The method according to any one of items 57 to 58, wherein the solvent is terpineol. (Item 73) The method according to any one of items 57 to 58, wherein the solubilizer comprises xylene and terpineol. (Section 74) The method according to item 73, wherein the solvent has xylene to terpineol in a volume ratio of about 1:about 1. (Section 75) The method according to item 57, wherein the solubilizer comprises at least one chelating agent. (Section 76) The method according to item 75, wherein the solvent is selected from the group consisting of ethylenediaminetetraacetic acid, iminodiacetic acid, ethylenediamine-di(o-hydroxyphenylacetic acid), nitrilotriacetic acid, dihydroxyethylglycine, trans-1,2-cyclohexanediaminetetraacetic acid, diethylenetriamine-N,N,N',N”,N”-pentaacetic acid, glycol etherdiamine-N,N,N',N'-tetraacetic acid, dimethyl sulfoxide, diethylenetriamine, tert-octylamine, 2-ethylhexylamine, and ethylenediamine. (Section 77) The method according to any one of claims 53 to 76, wherein the catalyst is selected from the group consisting of primary amines, secondary amines, tertiary amines, and polyamines. (Section 78) The method according to item 77, wherein the catalyst comprises at least one primary amine. (Section 79) The catalyst comprises at least one C 1~18 The method according to any one of items 77 to 78 above, comprising an alkylamine having the following properties. (Section 80) The method according to any one of items 77 to 79, wherein the catalyst is selected from the group consisting of methylamine, ethylamine, propylamine, butylamine, pentylamine, hexylamine, heptylamine, octylamine, nonylamine, decylamine, undecylamine, dodecylamine, tridecylamine, tetradecylamine, pentadecylamine, hexadecylamine, heptadecylamine, octadecylamine, and combinations thereof. (Section 81) The method according to item 78, wherein the catalyst is selected from the group consisting of allylamine, n-propylamine, isopropylamine, n-butylamine, sec-butylamine, tert-butylamine, n-pentylamine, isopentylamine, 2-ethylhexylamine, tert-hexylamine, phenylamine, cyclopentylamine, tert-octylamine, tert-decylamine, tert-dodecylamine, tert-octadecylamine, and combinations thereof. (Section 82) The method according to item 81, wherein the catalyst is tert-octylamine. (Section 83) The method according to item 81, wherein the catalyst is 2-ethylhexylamine. (Section 84) The method according to item 77, wherein the catalyst comprises at least one secondary amine. (Section 85) The method according to item 84, wherein the catalyst is selected from the group consisting of dimethylamine, diethylamine, dipropylamine, dibutylamine, diphenylamine, dicyclopentylamine, methylbutylamine, and combinations thereof. (Section 86) The method according to item 77, wherein the catalyst comprises at least one tertiary amine. (Section 87) The method according to item 86, wherein the catalyst is selected from the group consisting of trimethylamine, triethylamine, tripropylamine, triphenylamine, and combinations thereof. (Section 88) The method according to item 77, wherein the catalyst comprises at least one polyamine. (Section 89) The method according to item 88, wherein the catalyst is selected from the group consisting of ethylenediamine, 1,3-diaminopropane, hexamethylenediamine, and combinations thereof. (Section 90) The method according to any one of items 53 to 89, wherein the silver carboxylate is dissolved in the solvent before the catalyst is added. (Section 91) The method according to any one of items 53 to 89, wherein the silver carboxylate is mixed with the catalyst before the silver carboxylate is dissolved in the solvent. (Section 92) The method according to any one of claims 83 to 91, wherein the conductive ink composition has silver at a concentration of about 1 to 40 wt% of the conductive ink composition. (Section 93) The method according to any one of items 1 to 92, wherein the silver complex has a viscosity of about 5 cmpoise to about 50 cmpoise. (Section 94) The method according to any one of items 1 to 92, wherein the silver complex has a viscosity of about 50 centipoise to about 1000 centipoise. (Section 95) The method according to any one of items 93 to 94, wherein the viscosity is adjusted based on the amount of catalyst added. (Section 96) The method according to item 53, wherein the silver carboxylate is silver neodecanoate, the solvent is xylene, and the catalyst is 2-ethylhexylamine. (Section 97) The method according to item 96, wherein the silver carboxylate is about 0.5 grams of silver neodecanoate, the solvent is about 1 mL of xylene, and the catalyst is about 0.2 mL of 2-ethylhexylamine. (Section 98) The method according to item 53, wherein the silver carboxylate is silver hexafluoroacetylacetate, the solvent is xylene, and the catalyst is tert-octylamine. (Section 99) The method according to item 98, wherein the silver carboxylate is about 0.4 grams of silver hexafluoroacetylacetate, the xylene is about 1 mL, and the catalyst is about 0.2 mL of tert-octylamine. (Section 100) The method according to item 53, wherein the silver carboxylate is silver neodecanoate, the solvent comprises xylene and terpineol, and the catalyst is tert-octylamine. (Section 101) The method according to item 101, wherein the silver carboxylate is about 0.5 grams of silver neodecanoate, the solvent comprises about 0.5 mL of xylene and about 0.5 mL of terpineol, and the catalyst is about 0.2 mL of tert-octylamine. (Section 102) The aforementioned conductive structure is approximately 2 × 10 -6 Ω cm ~ approx. 1×10 -5 The method according to any one of items 53 to 101 above, having an electrical conductivity of Ω·cm. (Section 103) The method according to any one of items 53 to 102, wherein the conductive structure has an RMS value of about 10 nanometers or less. (Section 104) Metal salts having sterically bulky counterions; and Ligand An ink composition containing the following: (Section 105) The composition according to item 104, wherein the metal is selected from the group consisting of silver, copper, nickel, gold, platinum, palladium, aluminum, magnesium, zinc, and tin. (Section 106) The composition according to any one of items 104 to 105, wherein the sterically bulky counterion is selected from the group consisting of carboxylate ions, cyanide ions, sulfonate ions, borate ions, phosphate ions, and perchlorate ions. (Section 107) The aforementioned sterically bulky counterion is the tetrafluoroborate ion ([BF4] - ), hexafluorophosphate ion ([PF6] - ), a composition according to any one of items 104 to 106 above, selected from the group consisting of cyanide ions and perchlorate ions. (Section 108) The aforementioned sterically bulky counterion is R 1 COO - And here, R 1The composition is one of the items 104 to 106 above, selected from the group consisting of substituted alkyl, unsubstituted or substituted cycloalkyl and unsubstituted or substituted heterocycloalkyl. (Section 109) R 1 Substitution C1~C 30 The composition described in item 108 above, wherein the composition is alkyl. (Section 110) R 1 However, C1-C11 is substituted with at least one alkyl group and / or keto group. 30 The composition described in item 108 above, wherein the composition is alkyl. (Section 111) The composition according to any one of items 104 to 105, wherein the sterically bulky counterion is selected from the group consisting of neodecanoate ion, 2-ethyloctanoate ion, 2-ethylhexanoate ion, 2-ethylpentanoate ion, 2-ethylbutanoate ion, 2-ethyl-2-methylbutanoate ion, 2,2-diethylbutanoate ion, 3-oxobutanoate ion, 3-oxopentanoate ion, and 3-oxohexanoate ion, and combinations thereof. (Section 112) The composition according to item 111, wherein the sterically bulky counterion is a neodecanoate ion. (Section 113) The composition according to any one of items 104 to 112, wherein the metal salt having a sterically bulky counterion is selected from the group consisting of silver neodecanoate, silver 2-ethylhexanoate, and silver β-ketocarboxylate. (Section 114) The composition according to any one of items 104 to 113, wherein the metal salt is silver neodecanoate. (Section 115) The composition according to any one of items 104 to 114, wherein the ligand is a bulky ligand. (Section 116) The composition according to any one of claims 104 to 115, wherein the ligand is selected from the group consisting of primary amines, secondary amines, tertiary amines, cyclic amines, thioethers, cyclic thioethers, ethers, branched ethers, crown ethers, and combinations thereof. (Clause 117) The ligands are tert-butylamine, 2-methylbutan-2-amine, 2-methylpentan-2-amine, 2-ethylhexylamine, 2-ethylheptylamine, N-ethylhexane-1-amine, N-ethylheptan-1-amine, and tert-octyl A composition according to any one of items 104 to 116, selected from the group consisting of amines, unsubstituted or substituted pyrrolidines, unsubstituted or substituted piperidines, and combinations thereof. (Item 118) The composition according to item 117, wherein the ligand is tert-octylamine. (Section 119) The composition according to any one of the above items 104 to 118, wherein the molar ratio of the ligand to the metal salt is greater than 50:1. (Section 120) The composition according to any one of items 104 to 119, wherein the molar ratio of the ligand to the metal salt is greater than 30:1. (Section 121) The composition according to any one of items 104 to 120, wherein the molar ratio of the ligand to the metal salt is greater than 15:1. (Section 122) The composition according to any one of items 104 to 121, wherein the molar ratio of the metal salt to the ligand is about 1. (Section 123) The composition according to any one of the above items 104 to 122, further comprising a solvent. (Section 124) The composition according to item 123, wherein the solvent is a polar solvent. (Section 125) The composition according to either item 123 or 124, wherein the solvent is selected from the group consisting of water, dimethylformamide, and xylene. (Section 126) The composition according to any one of the above items 123 to 125, wherein the solvent is xylene. (Section 127) A method for preparing an ink composition, The first step is to add a metal salt having a sterically bulky counterion to a solvent to form a first mixture; The steps include adding the ligand to the first mixture to form an ink composition, and A method that includes this. (Section 128) The method according to item 127, wherein the metal salt is selected from the group consisting of silver salts, copper salts, nickel salts, gold salts, platinum salts, palladium salts, aluminum salts, magnesium salts, zinc salts, and tin salts. (Section 129) The method according to any one of items 127 to 128, wherein the sterically bulky counterion is selected from the group consisting of carboxylate ions, cyanide ions, sulfonate ions, borate ions, phosphate ions, and perchlorate ions. (Section 130) The aforementioned sterically bulky counterion is R 1 COO - And here, R 1 The method according to any one of items 127 to 128 above, wherein is selected from the group consisting of substituted alkyl, unsubstituted or substituted cycloalkyl and unsubstituted or substituted heterocycloalkyl. (Section 131) An ink composition for fabricating conductive structures, The reducing agent dissolved in the solvent, A metal salt or metal complex containing a metal An ink composition comprising a reducing metal complex formed by mixing the reducing agent, wherein the reducing agent reduces the metal of the metal salt or metal complex to form the conductive structure. (Section 132) An ink composition for fabricating conductive structures, The reducing agent dissolved in the solvent; A metal salt or metal complex containing at least one metal from group 4, 5, 6, 7, 8, 9, 10, 11, or 12 An ink composition comprising a reducing metal complex formed by mixing the reducing agent, wherein the reducing agent reduces the metal to form the conductive structure. (Section 133) The composition according to any one of items 131 to 132, wherein the reducing metal complex is decomposed on the substrate to form the conductive structure. (Section 134) The composition according to item 133, wherein the reducing metal complex is decomposed by heating the reducing metal complex at a temperature of about 270°C or less. (Section 135) The composition according to item 133, wherein the reducing metal complex is decomposed by mixing a catalyst with the reducing metal complex to form a catalytic reducing metal complex, wherein the catalytic reducing metal complex is heated to approximately 220°C or below. (Section 136) The composition according to item 133, wherein the reducing metal complex is decomposed by exposing the reducing metal complex to a light source with a wavelength of about 100 nm to about 1500 nm. (Section 137) The composition according to any one of the above claims 131 to 136, wherein the reducing agent is selected from the group consisting of alkali metal hydrides, complex hydrides of alkali metals and boron, complex hydrides of alkali metals and aluminum, formate salts, β-ketocarboxylate salts, and combinations thereof. (Section 138) The composition according to item 137, wherein the reducing agent is selected from the group consisting of lithium hydride, sodium hydride, potassium hydride, rubidium hydride, cesium hydride, and combinations thereof. (Section 139) The composition according to item 138, wherein the reducing agent is lithium hydride. (Section 140) The composition according to item 137, wherein the reducing agent is selected from the group consisting of lithium borohydride, sodium borohydride, potassium borohydride, and combinations thereof. (Section 141) The composition according to item 137, wherein the reducing agent is selected from the group consisting of lithium aluminum hydride, sodium aluminum hydride, potassium aluminum hydride, and combinations thereof. (Section 142) The composition according to item 141, wherein the reducing agent is lithium aluminum hydride. (Section 143) The composition according to any one of items 131 to 142, wherein the solvent is an organic solvent. (Item 144) The composition according to item 143, wherein the solvent is selected from the group consisting of saturated hydrocarbons, aromatic hydrocarbons, ethers, and combinations thereof. (Section 145) The composition according to item 144, wherein the solvent is a linear ether, a branched ether, or a cyclic ether. (Section 146) The aforementioned solvent is selected from the group consisting of dimethyl ether, diethyl ether, dipropyl ether, dibutyl ether, methyl t-butyl ether, and combinations thereof. The composition described in item 145 above. (Section 147) The composition according to item 146, wherein the solvent is diethyl ether. (Section 148) The composition according to item 145, wherein the solubilizer is selected from the group consisting of tetrahydrofuran, tetrahydropyran, dihydropyran, 1,4-dioxane, and combinations thereof. (Section 149) The composition according to item 144, wherein the solubilizer is selected from the group consisting of benzene, toluene, xylene, tetralin, and combinations thereof. (Section 150) The composition according to item 144, wherein the solvent is a linear saturated hydrocarbon, a branched saturated hydrocarbon, or a cyclic saturated hydrocarbon. (Section 151) The composition according to item 150, wherein the solubilizer is selected from the group consisting of pentane, hexane, heptane, octane, nonane, decane, undecane, dodecane, tridecane, tetradecane, pentadecane, hexadecane, octadecane, nonadecane, eicosane, and combinations thereof. (Section 152) The composition according to item 150, wherein the solubilizer is selected from the group consisting of cyclohexane, cycloheptane, cyclooctane, cyclononane, cyclodecane, decalin, and combinations thereof. (Section 153) The aforementioned metal salt or metal complex is formula MX n or M(L) p X n The formula has the following characteristics, where M is a metal of group 4, 5, 6, 7, 8, 9, 10, 11, or 12: X is a halide, pseudohalide, nitrate, sulfate, formate, acetate, cyanate, isocyanate, alkoxide, or diketonate, and L is selected from the group consisting of NH3, CO, NO, N2, H2S, C2H4, C6H6, CN, NC, and PH3. n is equal to the formal charge of M divided by the formal charge of X, and p is the number of coordination sites on M, which corresponds to X. n The composition according to any one of items 131 to 152 above, which is an integer equal to the result of subtracting the coordination sites occupied by the . (Section 154) The composition according to item 153 above, wherein M is selected from the group consisting of aluminum, magnesium, titanium, silicon, vanadium, zinc, tin, copper, nickel, palladium, zirconium, iron, niobium, germanium, manganese, chromium, cobalt, tungsten, molybdenum, bismuth, ruthenium, and combinations thereof. (Section 155) The composition according to any one of items 131 to 154, wherein the conductive structure is an elemental metal or a metal alloy. (Section 156) The composition according to any one of claims 131 to 132, wherein the conductive structure contains magnesium, and the conductive structure is formed by mixing lithium hydride and magnesium halide to form a magnesium hydride complex. (Section 157) The composition according to any one of claims 131 to 132, wherein the conductive structure contains zinc, and the conductive structure is formed by mixing lithium aluminum hydride with zinc halide to form a zinc hydride complex. (Section 158) The conductive structure contains aluminum, and the conductive structure contains aluminum hydride The composition according to any one of items 131 to 132, which is formed by mixing thium with aluminum chloride to form an aluminum hydride complex. (Section 159) The composition according to any one of claims 131 to 132, wherein the conductive structure includes a titanium alloy, and the titanium alloy is formed by mixing lithium aluminum hydride, a vanadium complex, and a titanium salt to form a titanium hydride complex. (Section 160) The composition according to item 159, wherein the vanadium complex is vanadylacetylacetonate or vanadium hexacarbonyl. (Section 161) The composition according to any one of claims 131 to 132, wherein the conductive structure comprises an aluminum alloy, and the aluminum alloy is formed by mixing a silicon alkyl complex, an aluminum salt, and lithium aluminum hydride to form an aluminum hydride complex. (Section 162) The composition according to any one of claims 131 to 132, wherein the conductive structure contains nickel, and the conductive structure is formed by mixing nickel tetracarbonyl and a carbonyl extractor to form a nickel(0) complex. (Section 163) The composition according to any one of claims 131 to 132, wherein the conductive structure comprises a nickel alloy, and the nickel alloy is formed by mixing a nickel salt and a cyclic alkene to produce a nickel(0) complex. (Section 164) The composition according to item 135, wherein the catalyst is a hydride abstractant. (Section 165) The composition according to item 164, wherein the catalyst is selected from the group consisting of titanium(IV) compounds, phenazine methosulfate, phenazine ethosulfate, 1-methoxyphenazine methosulfate, Meldola blue, and combinations thereof. (Section 166) The composition according to any one of items 164 to 165, wherein the reducing agent is a titanium(IV) compound. (Section 167) The composition according to any one of items 164 to 166, wherein the reducing agent is selected from the group consisting of titanium(IV) oxide, titanium(IV) sulfide, titanium(IV) nitrate, titanium(IV) alkoxide, and combinations thereof. (Section 168) The composition according to any one of claims 131 to 167, wherein the ink composition has a metal salt in a concentration of about 0.1 to 40 wt% of the ink composition. (Section 169) The composition according to any one of claims 131 to 167, wherein the ink composition has a metal complex in a concentration of about 0.1 to 40 wt% of the ink composition. (Section 170) A method for fabricating a conductive structure, A reducing agent is mixed with at least one metal salt or metal complex to form a reducing metal complex, wherein the reducing agent is dissolved in at least one solvent; The steps include: coating the aforementioned reducing metal complex onto a substrate; The steps of decomposing the reducing metal complex on the substrate to form a conductive structure, A method that includes this. (Section 171) The method according to item 170, wherein the step of decomposing the reducing metal complex includes heating the reducing metal complex to a temperature of about 270°C or less. (Section 172) The method according to item 170, wherein the step of decomposing the reducing metal complex includes mixing a catalyst with the reducing metal complex to form a catalytic reducing metal complex, and heating the catalytic reducing metal complex to a temperature of about 220°C or less. (Section 173) The method according to item 170, wherein the step of decomposing the reducing metal complex includes exposing the reducing metal complex to a light source with a wavelength of about 100 nm to about 1500 nm. (Section 174) The method according to any one of items 170 to 173, wherein the reducing agent is selected from the group consisting of alkali metal hydrides, alkali metal-boron complex hydrides, alkali metal-aluminum complex hydrides, formates, β-ketocarboxylates, and combinations thereof. (Item 175) The method according to item 174, wherein the reducing agent is selected from the group consisting of lithium hydride, sodium hydride, potassium hydride, rubidium hydride, cesium hydride, and combinations thereof. (Section 176) The method according to item 175, wherein the reducing agent is lithium hydride. (Section 177) The method according to item 174, wherein the reducing agent is selected from the group consisting of lithium borohydride, sodium borohydride, potassium borohydride, and combinations thereof. (Section 178) The method according to item 174, wherein the reducing agent is selected from the group consisting of lithium aluminum hydride, sodium aluminum hydride, potassium aluminum hydride, and combinations thereof. (Section 179) The method according to item 178, wherein the reducing agent is lithium aluminum hydride. (Section 180) The method according to any one of items 170 to 179, wherein the solvent is an organic solvent. (Section 181) The method according to item 180, wherein the solvent is selected from the group consisting of saturated hydrocarbons, aromatic hydrocarbons, ethers, and combinations thereof. (Section 182) The method according to item 181, wherein the solubilizer is a linear ether, a branched ether, or a cyclic ether. (Section 183) The method according to item 182, wherein the solubilizer is selected from the group consisting of dimethyl ether, diethyl ether, dipropyl ether, dibutyl ether, methyl t-butyl ether, and combinations thereof. (Section 184) The method according to item 183, wherein the solvent is diethyl ether. (Section 185) The method according to item 182, wherein the solubilizer is selected from the group consisting of tetrahydrofuran, tetrahydropyran, dihydropyran, 1,4-dioxane, and combinations thereof. (Section 186) The method according to item 181, wherein the solubilizer is selected from the group consisting of benzene, toluene, xylene, tetralin, and combinations thereof. (Section 187) The method according to item 181, wherein the solvent is a linear saturated hydrocarbon, a branched saturated hydrocarbon, or a cyclic saturated hydrocarbon. (Section 188) The method according to item 187, wherein the solvent is selected from the group consisting of pentane, hexane, heptane, octane, nonane, decane, undecane, dodecane, tridecane, tetradecane, pentadecane, hexadecane, octadecane, nonadecane, eicosane, and combinations thereof. (Section 189) The method according to item 187, wherein the solvent is selected from the group consisting of cyclohexane, cycloheptane, cyclooctane, cyclononane, cyclodecane, decalin, and combinations thereof. (Section 190) The aforementioned metal salt or metal complex is formula MX n or M(L)p X n The formula has the following characteristics, where M is a metal of group 4, 5, 6, 7, 8, 9, 10, 11, or 12: X is a halide, pseudohalide, nitrate, sulfate, formate, acetate, cyanate, isocyanate, alkoxide, or diketonate, and L is selected from the group consisting of NH3, CO, NO, N2, H2S, C2H4, C6H6, CN, NC, and PH3. n is equal to the formal charge of M divided by the formal charge of X, and p is the number of coordination sites on M, which corresponds to X. n The method according to any one of items 170 to 189 above, which is an integer equal to the result of subtracting the coordination site occupied by the function. (Section 191) The composition according to item 190 above, wherein M is selected from the group consisting of aluminum, magnesium, titanium, silicon, vanadium, zinc, tin, copper, nickel, palladium, zirconium, iron, niobium, germanium, manganese, chromium, cobalt, tungsten, molybdenum, bismuth, ruthenium, and combinations thereof. (Section 192) The method according to any one of items 170 to 191, wherein the conductive structure is an elemental metal or a metal alloy. (Section 193) The method according to item 170, wherein the conductive structure contains magnesium, and the conductive structure is formed by mixing lithium hydride and magnesium halide to form a magnesium hydride complex. (Section 194) The method according to item 170, wherein the conductive structure contains zinc, and the conductive structure is formed by mixing lithium aluminum hydride with zinc halide to form a zinc hydride complex. (Section 195) The method according to item 170, wherein the conductive structure contains aluminum, and the conductive structure is formed by mixing lithium aluminum hydride with aluminum chloride to form an aluminum hydride complex. (Section 196) The method according to item 170, wherein the conductive structure includes a titanium alloy, and the titanium alloy is formed by mixing lithium aluminum hydride, a vanadium complex, and a titanium salt to form a titanium hydride complex. (Section 197) The method according to item 196, wherein the vanadium complex is vanadylacetylacetonate or vanadium hexacarbonyl. (Section 198) The conductive structure includes an aluminum alloy, and the aluminum alloy is silicon-alkyl The method according to item 170, wherein the aluminum complex is formed by mixing an aluminum complex, an aluminum salt, and lithium aluminum hydride to form an aluminum hydride complex. (Section 199) The method according to item 170, wherein the conductive structure contains nickel, and the conductive structure is formed by mixing nickel tetracarbonyl and a carbonyl extractor to form a nickel(0) complex. (Section 200) The method according to item 170, wherein the conductive structure comprises a nickel alloy, and the nickel alloy is formed by mixing a nickel salt and a cyclic alkene to produce a nickel(0) complex. (Section 201) The method according to item 172, wherein the catalyst is a hydride abstractant. (Section 202) The method according to item 201, wherein the catalyst is selected from the group consisting of titanium(IV) compounds, phenazine methosulfate, phenazine ethosulfate, 1-methoxyphenazine methosulfate, Meldola blue, and combinations thereof. (Section 203) The method according to any one of items 201 to 202 above, wherein the reducing agent is a titanium(IV) compound. (Section 204) The method according to any one of items 201 to 203 above, wherein the reducing agent is selected from the group consisting of titanium(IV) oxide, titanium(IV) sulfide, titanium(IV) nitrate, titanium(IV) alkoxide and combinations thereof. (Section 205) The composition according to item 153, further comprising a chemical additive. (Section 206) The composition according to item 205, wherein the chemical additive is selected from the group consisting of acidic sulfites, sodium thiosulfate, ammonium thioglycolate, diisopropylammonium nitrite, benzotriazole, pentaerythritol tetranitrate, and dicyclohexylammonium nitrite. (Section 207) The composition according to any one of the above items 205 to 206, wherein the chemical additive is benzotriazole. (Section 208) The composition according to any one of the above items 205 to 207, wherein M is copper and X is a formate. (Section 209) The aforementioned conductive structure is approximately 2 × 10 -6 Ω cm ~ approx. 1×10 -5 A composition according to any one of items 131 to 169 above, having an electrical conductivity of Ω·cm. (Section 210) The aforementioned conductive structure is approximately 3 × 10 -6 Ω cm ~ approx. 6×10 -6 A composition according to any one of items 131 to 169 above, having an electrical conductivity of Ω·cm. (Section 211) A method comprising the step of applying a composition described in any one of the above sections 209 to 210 to a substrate by slot die coating, spin coating, gravure printing, roll-to-roll printing including flexographic printing, rotary screen printing, screen printing, aerosol jet printing, inkjet printing, air brushing, Meyer rod coating, flood coating, 3D printing, dispenser, or electrohydrodynamic printing. (Section 212) The aforementioned conductive structure is approximately 2 × 10 -6 Ω cm ~ approx. 1×10 -5 Electrical conductivity in Ω·cm The method according to any one of items 170 to 204 above, having the characteristics of: (Section 213) The aforementioned conductive structure is approximately 3 × 10 -6 Ω cm ~ approx. 6×10 -6 The method according to any one of items 170 to 204 above, having an electrical conductivity of Ω·cm. (Section 214) The method according to any one of items 212 to 213, wherein the step of applying the reducing metal complex includes slot die coating, spin coating, gravure printing, roll-to-roll printing including flexographic printing, rotary screen printing, screen printing, aerosol jet printing, inkjet printing, air brushing, Meyer rod coating, flood coating, 3D printing, dispenser or electrohydrodynamic printing.

Claims

[Claim 1] Reactivity of a metal for forming a conductive structure.