Probe card

Abstract

The objective is to provide a probe card that allows probes inserted through guide holes in the guide plate to be secured to the guide plate to prevent them from falling out, while also enabling them to be arranged at a narrower pitch. [Solution] The device comprises two or more probes 200 and a first guide plate 14 having two or more first guide holes 14h through which each probe 200 is inserted. Each probe 200 is positioned at an angle to the first guide plate 14 and has a locking portion 21 projecting from a side surface 210 in a first direction d1 where the angle with respect to the first guide plate 14 is acute, and an offset portion 22 on a side surface 220 in a second direction d2 where the angle with respect to the first guide plate 14 is obtuse, offset toward the locking portion 21. Two adjacent probes 220 are positioned such that one locking portion 21 faces the other offset portion 22.

Description

Technical Field

[0001] The present invention relates to a probe card, and more particularly to an improvement of a probe card in which two or more probes are supported by a guide plate.

Background Art

[0002] A probe card is an inspection device used for inspecting the electrical characteristics of semiconductor devices formed on a semiconductor wafer, and a number of probes for respectively contacting electrode pads on the semiconductor device are provided on a wiring board. The characteristic inspection of the semiconductor device is performed by connecting a tester device for inputting and outputting test signals to the probe card, bringing the semiconductor wafer close to the probe card, contacting the tip of the probe with the electrode pad on the semiconductor device, and conducting the tester device and the semiconductor device through the probe and the wiring board.

[0003] FIG. 17 is a diagram showing an example of a conventional probe card (for example, Patent Document 1). In this probe card, a probe 300 having a locking portion 31 is supported by a guide plate 14. Guide plates 14 and 15 are provided below the wiring boards 10 and 11 of the probe card. The probe 300 is inserted through the guide holes 14h and 15h of both guide plates 14 and 15, the upper end contacts a probe electrode 11t formed on the lower surface of the wiring board 11, and the lower end contacts an electrode pad formed on the upper surface of the semiconductor wafer.

[0004] The probe 300 has a pair of locking portions 31 that project the side surfaces above the upper guide plate 14. The pair of locking portions 31 are formed by projecting the opposing side surfaces of the probe, and the probe 300 is supported so as not to fall off from the first guide plate 14.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

[0006] Recent advances in microfabrication technology have led to narrower electrode pads in semiconductor devices, and consequently, narrower probes are also required. To narrow the probe spacing, it is necessary to shorten the probe width or the probe spacing. However, considering the electrical characteristics and mechanical strength required of the probes, there are limits to how much the cross-sectional area of ​​the probes can be reduced. Therefore, to achieve further narrowing of the probe spacing, it is necessary to shorten the probe spacing, and consequently, the amount of protrusion of the locking portion 31 must also be shortened.

[0007] Due to this progress in narrowing the pitch, the amount of protrusion of the locking portion 31 is approaching the gap between the probe 300 and the guide hole 14h, and if the amount of protrusion is shortened any further, there is a risk that the locking portion 31 will fall out of the guide hole 14h.

[0008] The present invention has been made in view of the above circumstances, and aims to provide a probe card that can be arranged at a narrower pitch while retaining the probes inserted through the guide holes of the guide plate in place so as not to fall out. [Means for solving the problem]

[0009] A probe card according to a first embodiment of the present invention comprises two or more probes and a first guide plate having two or more first guide holes through which each probe is inserted, wherein each probe is arranged to be inclined with respect to the first guide plate and has a locking portion that protrudes from the side surface above the first guide plate, on the side surface in the first direction where the angle with respect to the first guide plate is acute, and the side surface above the first guide plate of the probe, on the side surface in the second direction where the angle with respect to the first guide plate is obtuse, is configured such that the distance from the central axis of the probe is shorter than the distance from the protruding surface of the locking portion.

[0010] The probe inserted into the first guide hole is inclined with respect to the first guide plate, and a locking portion is formed by protruding the side surface on the first direction side, which is above the first guide plate and has an acute angle with respect to the first guide plate. As a result, the locking portion faces the upper surface of the first guide plate around the first guide hole, and the probe is locked to the first guide plate. Therefore, regardless of the size of the gap between the probe width and the first guide hole, the amount of protrusion of the locking portion can be reduced, and the probes can be arranged at a narrow pitch. Furthermore, the side surface on the opposite side from the first direction side, that is, the side surface on the second direction side, which is above the first guide plate and has an obtuse angle with respect to the first guide plate, is at a distance closer to the central axis than the protruding surface of the locking portion, so the probes can be arranged at an even narrower pitch.

[0011] In addition to the above configuration, the probe card according to the second embodiment of the present invention further has an offset portion on the side facing the second direction that is offset toward the locking portion, and two adjacent probes are arranged such that the locking portion of one probe faces the offset portion of the other probe.

[0012] By adopting this configuration, two or more probes can be placed adjacent to each other so that one locking portion faces the other offset portion, and by aligning the protruding direction of the locking portion with the offset direction of the offset portion, the probes can be arranged at an even narrower pitch. Furthermore, by forming the offset portion on the side facing the second direction, the amount of offset can be increased regardless of the size of the gap between the probe width and the first guide hole, allowing the probes to be arranged at an even narrower pitch.

[0013] In addition to the above configuration, the probe card according to the third embodiment of the present invention is configured such that the lower surface of the offset portion is formed below the lower surface of the locking portion on the central axis of the probe.

[0014] By adopting this configuration, it is possible to prevent the lower end of the locking portion from contacting the side surface below the offset portion, and to arrange the probes at a narrow pitch.

[0015] In addition to the above configuration, the probe card according to the fourth embodiment of the present invention is configured such that the outermost edge of the lower surface of the offset portion is positioned below the upper surface of the first guide plate.

[0016] By adopting this configuration, the lower end of the locking portion is prevented from contacting the side surface below the offset portion, allowing the probes to be positioned at a narrow pitch.

[0017] In addition to the above configuration, the probe card according to the fifth embodiment of the present invention is configured such that the lower surface of the offset portion is inclined with respect to the central axis of the probe such that the amount of offset decreases as it goes downwards.

[0018] By adopting this configuration, it is possible to suppress contact between the locking portion and the side surface below the offset portion. Furthermore, by providing the offset portion, it is possible to suppress the impact on the electrical characteristics and mechanical strength of the probe.

[0019] A probe card according to a sixth embodiment of the present invention further comprises, in addition to the above configuration, a wiring board disposed above the first guide plate and having two or more probe electrodes with which the upper ends of the probes abut each, wherein the offset portion is configured as a recess formed on the side surface facing the locking portion.

[0020] By adopting this configuration, the width of the upper end of the probe can be increased, the range of inclination angles over which the upper end of the probe can contact the probe electrode can be increased, and the probe and probe electrode can be made to conduct electricity more reliably.

[0021] In addition to the above configuration, the probe card according to the seventh embodiment of the present invention is configured such that the outermost edge of the upper surface of the offset portion is formed above the outermost edge of the upper surface of the locking portion on the central axis of the probe.

[0022] By adopting such a configuration, it is possible to suppress the upper end of the locking portion from contacting the side surface above the offset portion, and the probes can be arranged in a narrow pitch.

[0023] In addition to the above configuration, the probe card according to the eighth embodiment of the present invention is configured such that the upper surface of the offset portion is inclined with respect to the central axis of the probe so that the offset amount decreases as it goes upward.

[0024] By adopting such a configuration, it is possible to suppress the locking portion from contacting the side surface above the offset portion. In addition, by providing the offset portion, it is possible to suppress the influence on the electrical characteristics and mechanical strength of the probe.

[0025] In addition to the above configuration, the probe card according to the ninth embodiment of the present invention further includes a second guide plate disposed below the first guide plate and having two or more second guide holes through which the probes are respectively inserted, and the first guide holes and the second guide holes are configured to be disposed at positions offset relative to each other in the direction in which the probes are inclined.

[0026] By adopting such a configuration, the probe inserted into the first guide hole can be inclined with respect to the first guide plate.

Advantages of the Invention

[0027] According to the present invention, it is possible to provide a probe card that can be arranged in a narrower pitch while locking the probe inserted into the guide hole of the guide plate so as not to fall off.

Brief Description of the Drawings

[0028] [Figure 1] It is a cross-sectional view showing a configuration example of a probe card 100 according to Embodiment 1 of the present invention. [Figure 2] It is a plan view showing a configuration example of the first guide plate 14 in FIG. 1. [Figure 3] This is a schematic diagram showing the assembly of the probe 200 and guide plates 14 and 15. [Figure 4] This is an external view showing one example configuration of probe 200. [Figure 5] This is a magnified view showing a portion of probe 200. [Figure 6] Figure 5 is a cross-sectional view showing the section taken along the AA cutting line. [Figure 7] This is an enlarged cross-sectional view showing a portion of the first guide plate 14 and probe 200 in Figure 1. [Figure 8] This figure shows the main parts of a comparative example to be compared with Embodiment 1 of the present invention. [Figure 9] This figure shows an example of the main part of the probe 201 according to Embodiment 2 of the present invention. [Figure 10] Figure 9 is a cross-sectional view showing the cross-section along the BB cutting line. [Figure 11] This is an enlarged cross-sectional view showing a portion of the first guide plate 14 and the probe 201. [Figure 12] This figure shows the main parts of a comparative example to be compared with Embodiment 2 of the present invention. [Figure 13] This figure shows an example of the main part of the probe 202 according to Embodiment 3 of the present invention. [Figure 14] This is an enlarged cross-sectional view showing a portion of the first guide plate 14 and the probe 202. [Figure 15] This figure shows an example of the main part of the probe 203 according to Embodiment 4 of the present invention. [Figure 16] This is an enlarged cross-sectional view showing a portion of the first guide plate 14 and the probe 203. [Figure 17] This diagram shows an example of a conventional probe card. [Modes for carrying out the invention]

[0029] Embodiment 1. <Probe Card 100> Figure 1 is a cross-sectional view showing an example configuration of a probe card 100 according to Embodiment 1 of the present invention, showing a cross-section when a horizontally positioned probe card 100 is cut by a vertical plane. The probe card 100 is an inspection device that makes an electrical connection to an object to be inspected (not shown), such as a semiconductor wafer, and has a number of probes 200 that contact a number of electrode pads on the object to be inspected, each of which is arranged to correspond to the electrode pad. The illustrated probe card 100 consists of a main substrate 10, an ST (space transformer) substrate 11, a reinforcing plate 12, a spacer 13, a first guide plate 14, a second guide plate 15, and two or more probes 200.

[0030] The main board 10 is a wiring board that can be detachably attached to a prober (not shown), and for example, a disc-shaped printed circuit board can be used. The main board 10 is arranged approximately horizontally, and a reinforcing plate 12 is attached to its upper surface. The reinforcing plate 12 is a reinforcing member for suppressing distortion of the main board 10, and for example, a metal block can be used. In addition, two or more external electrodes 10t are provided on the outer edge of the upper surface of the main board 10, outside the reinforcing plate 12, to which the signal terminals of a tester (not shown) are connected.

[0031] The ST substrate 11 is a wiring board that converts the electrode pitch and is attached to the lower surface of the main substrate 10. Two or more probe electrodes 11t are formed on the lower surface of the ST substrate 11. The probe electrodes 11t are electrode terminals that the probe 200 makes contact with, and are arranged at a pitch corresponding to the probe 200. They are also electrically connected to external electrodes 10t, which are arranged at a wider pitch, through the wiring patterns and through-holes of the main substrate 10 and the ST substrate 11.

[0032] Guide plates 14 and 15 are both support substrates that support the probe 200, and for example, a flat silicon substrate can be used. Guide plates 14 and 15 are fixed to the main substrate 10 or ST substrate 11 via spacers 13 and are positioned approximately horizontally at a distance from the ST substrate 11.

[0033] The first guide plate 14 has two or more first guide holes 14h. The first guide holes 14h are through holes that penetrate the first guide plate 14 in the vertical direction, and the probe 200 is inserted through them. The first guide plate 14 is positioned below the ST substrate 11 at intervals to support the probe 200 so that it does not fall out, and also to position the probe 200 horizontally relative to the ST substrate 11.

[0034] The second guide plate 15 has two or more second guide holes 15h. The second guide holes 15h are through holes that penetrate the second guide plate 15 in the vertical direction, and the probe 200 is inserted through them. The second guide plate 15 is positioned below and spaced apart from the first guide plate 14, and supports the probe 200 so that it can move in the vertical direction, and positions the probe 200 horizontally with respect to the object to be inspected.

[0035] Guide holes 14h and 15h through which the same probe 200 is inserted are positioned so as to be offset by a certain distance in the horizontal direction. By relatively offsetting the positions of the corresponding guide holes 14h and 15h, the probe 200 undergoes curvature deformation between the guide plates 14 and 15, and the vicinity of both ends of the probe 200 is inclined with respect to the guide plates 14 and 15. The inclination direction D is the direction on the horizontal plane that indicates the inclination of the probe 200.

[0036] The probe 200 is a vertical probe with an elongated shape and is made of a conductive material. The upper end of the probe 200 contacts the probe electrode 11t on the ST substrate 11, and the lower end contacts the electrode pad of the object to be inspected.

[0037] By performing an overdrive process that brings the probe 200 and the object to be inspected closer together after contact, the probe 200 undergoes elastic deformation, causing its lower end to move up and down. Therefore, by offsetting the guide holes 14h and 15h, the probe 200 is curved when not being inspected, and during overdrive, the curved portion of the probe 200 is buckled, allowing for appropriate pressure to be applied to the object to be inspected while ensuring a sufficient stroke length for vertical movement. Furthermore, by curving each probe 200 to approximately the same shape when not being inspected, it is possible to prevent buckled probes from contacting the guide plates 14 and 15.

[0038] <Guide plates 14, 15> Figure 2 is a plan view showing one example configuration of the first guide plate 14 in Figure 1, and the top surface of the first guide plate 14 is shown.

[0039] The illustrated first guide plate 14 is a roughly rectangular flat plate, with numerous first guide holes 14h arranged in two dimensions so as to be aligned in the inclination direction D and in a direction perpendicular thereto. The first guide holes 14h are through holes perpendicular to the main surface, and their cross-section consists of a rectangle with a pair of sides perpendicular to the inclination direction D.

[0040] Focusing on the inclination direction D, the first guide holes 14h are through holes with width Hw and are spaced apart by a distance Hi. In other words, they are aligned with a pitch Hp = Hw + Hi. The cross-sectional shape of the probes 200 is determined by the electrical characteristics and mechanical strength required of the probes 200. Therefore, if the probes 200 are to be spaced closer together, the distance Hi must be shortened. Recently, it has become necessary to have a distance Hi of less than or equal to half the width Hw, for example, less than or equal to one-third. As a result, short circuits between adjacent probes 200 are more likely to occur.

[0041] The second guide plate 15 has the exact same configuration as the first guide plate 14, except that the position of the second guide hole 15h is offset from the position of the first guide hole 14h.

[0042] Figure 3 is a schematic diagram showing the assembly of the probe 200 and guide plates 14 and 15. Figure (a) shows the probe 200 inserted through the guide holes 14h and 15h, and Figure (b) shows the probe 200 curved and deformed by offsetting the guide holes 14h and 15h.

[0043] Figure (a) shows the guide plates 14 and 15 positioned so that the corresponding guide holes 14h and 15h are aligned, and a linear probe 200 is inserted through the guide holes 14h and 15h. Subsequently, by moving the guide plates 14 and 15 in relative parallel to each other in the tilt direction D, the positions of the corresponding guide holes 14h and 15h can be offset. Figure (b) shows the state after the guide holes 14h and 15h have been offset. Then, the ST substrate 11 is attached so that the upper end of the probe 200 contacts the probe electrode 11t.

[0044] <Probe 200> Figure 4 is an external view showing one example configuration of the probe 200. In the figure, (a) is a front view of the probe 200, and (b) is a right side view of the probe 200.

[0045] The probe 200 is formed as a columnar body having substantially the same rectangular cross-section, and the upper and lower ends of the probe 200 are sharpened so that the central axis J of the probe 200 protrudes from them. In addition, a locking portion 21 is provided near the upper end of the probe 200, with a part of its side surface protruding.

[0046] The probe 200 is divided into an upper probe 251, a probe body 252, and a lower probe 253. The probe body 252 is an elastically deformable part positioned between the guide plates 14 and 15. The upper probe 251 is above the probe body 252, and the lower probe 253 is below it. The locking part 21 is provided on the upper probe 251.

[0047] The probe 200 has a three-layer structure, for example, in which one intermediate layer 302 is sandwiched between two outer layers 301 and 303, and is fabricated using MEMS (Micro Electro Mechanical Systems) technology. The intermediate layer 302 is a conductive layer made of a metal material with good conductivity, and the outer layers 301 and 303 are stress layers made of a metal material with good mechanical strength. In addition, a contact layer 304 made of a metal material with good conductivity is formed on the upper end surface of the probe 200 so as to be in contact with each end surface of the three main layers 301 to 303. The three main layers 301 to 303 are stacked as layers parallel to the central axis J and the inclination direction D, and the locking portion 21 is formed as a substantially rectangular convex portion in the planar shape of each layer 301 to 303.

[0048] Figures 5 and 6 show the detailed configuration of the probe 200 shown in Figure 4. Figure 5 is a magnified view of a part of the probe 200, and Figure 6 is a cross-sectional view showing the cross-section along the AA cutting line in Figure 5.

[0049] The locking portion 21 is formed by projecting one side surface 210 in the inclination direction D in a direction perpendicular to the central axis J, and has a lower surface 211 and an upper surface 213 perpendicular to the central axis J, and a protruding surface 212 parallel to the central axis J. On the other hand, the other side surface 220 in the inclination direction D does not have a locking portion formed thereon.

[0050] In the figure, Lw is the probe width and L21 is the protrusion amount of the locking portion 21. The distance of the probe 200 from the central axis J is L31 = Lw / 2 + L21 for the protruding surface 212, while it is L32 = Lw / 2 for the side surface 220 facing the locking portion 21. The distance of the side surface 220 from the central axis J is shorter than that of the protruding surface 212 by the protrusion amount L21.

[0051] Figure 7 is an enlarged cross-sectional view showing a portion of the first guide plate 14 and probe 200 in Figure 1. The upper end of the probe 200 abuts against the probe electrode 11t of the ST substrate 11, and the lower surface 211 of the locking portion 21 abuts against the upper surface of the first guide substrate 14. Therefore, the probe 200 can be electrically connected to the probe electrode 11t and the probe 200 can be supported so as not to fall out of the first guide hole 14h.

[0052] The upper part 251 of the probe is positioned at an angle to the first guide plate 14 in the inclination direction D. Of the inclination directions D, the direction in which the angle between the central axis J of the probe 200 and the first guide plate 14 is acute above the first guide plate 14 is defined as the first direction d1, and the direction opposite to the first direction d1, that is, the direction in which the angle between the central axis J of the probe 200 and the first guide plate 14 is obtuse above the first guide plate 14, is defined as the second direction d2.

[0053] The locking portion 21 is formed on the side surface 210 of the upper part 251 of the probe on the first direction d1 side. In other words, the locking portion 21 is formed by making the side surface 210, which is above the first guide plate 14, protrude so that the angle with respect to the first guide plate 14 is acute due to the inclination. Therefore, regardless of the shape and size of the locking portion 21 and the first guide hole 14h, the lower surface 211 of the locking portion 21 faces the upper surface of the guide plate 14 around the first guide hole 14h, and the locking portion 21 is locked to the first guide plate 14, supporting the probe 200 so that it does not fall out of the first guide hole 14h.

[0054] For example, the probe 200 can be supported even if the upper part 251 of the probe is pre-designed to be able to pass through the first guide hole 14h, or if it becomes able to pass through afterward due to wear or damage.

[0055] Furthermore, compared to the case where the locking portion 21 is formed on the side surface 220 on the second direction d2 side, that is, the side surface above the first guide plate 14, where the angle with respect to the first guide plate 14 becomes obtuse due to the inclination, the amount of protrusion L21 of the locking portion 21 can be reduced, so that the probe pitch Lp can be reduced while ensuring a predetermined probe spacing Li.

[0056] The probe spacing Li is the distance from the protruding surface 212 of the locking portion 21 of one of two adjacent probes 200 to the side surface 220 on the second direction d2 side of the other probe, and the probe pitch is Lp = Lw + L21 + Li. For example, if the probe width Lw is 20 μm, the protrusion amount L21 of the locking portion 21 is 7 μm, and the probe spacing Li is 13 μm, then the probe pitch Lp will be 40 μm. To achieve a narrow pitch arrangement, it is desirable that the protrusion amount L21 of the locking portion 21 is less than or equal to the probe width Lw, and more preferably less than or equal to half the probe width Lw. Also, it is desirable that the probe spacing Li is less than or equal to the probe width Lw.

[0057] Figure 8 shows the main parts of a comparative example to be compared with Embodiment 1 of the present invention. The comparative probe 200' is positioned at an angle to the first guide plate 14 and has a pair of locking portions 21 that protrude from two sides 210 and 220, respectively, on the first direction d1 side and the second direction d2 side opposite to the first direction d1. Compared to the probe 200 in Figure 7, this probe 200' has the disadvantage that the probe pitch Lp is longer by the amount of protrusion L21 when trying to secure the same probe spacing Li.

[0058] In this embodiment, the probe card has a locking portion 21 that protrudes from the side surface 210 in the first direction d1 where the probe 200 and the first guide plate 14 are positioned at an inclination relative to the first guide plate 14, and the angle between the probe 200 and the first guide plate 14 is acute above the first guide plate 14. Therefore, the locking portion 21 can be locked to the upper surface of the first guide plate 14, supporting the probe 200 so that it does not fall off. In addition, regardless of the size of the gap between the probe 200 and the first guide hole 14h, the amount of protrusion L21 of the locking portion 21 can be shortened, and the probe pitch Lp can be shortened.

[0059] Furthermore, the probe 200 does not have a locking portion formed on the side surface 220 facing the locking portion 21. Therefore, for two adjacent probes 200, one locking portion 21 faces the other side surface 220, and the locking portions 21 do not face each other. As a result, compared to using a probe with locking portions 21 on both opposing side surfaces 210 and 220, the same probe spacing Li can be secured, and the probe pitch Lp can be shortened.

[0060] In the above embodiment, an example was described in which the side surface 220 facing the locking portion 21 is flat, but the present invention is not limited to this case. That is, the side surface facing the locking portion 21 only needs to have a distance L32 from the central axis J that is shorter than the distance L31 from the central axis J to the protruding surface 212, and may have recesses or protrusions, or may be curved. In other words, in the cross-section including the locking portion 21, the central axis J only needs to be eccentric toward the second direction d2.

[0061] Embodiment 2. In Embodiment 1, a case was described in which a probe 200 is used that is positioned at an angle to the first guide plate 14 and has a locking portion 21 that protrudes from the side surface 210 on the first direction d1 side, where the angle between the probe 200 and the first guide plate 14 is acute above the first guide plate 14. In this embodiment, in addition to the above, a case is described in which a probe 201 is used that has an offset portion 22 on the side surface 220 on the second direction d2 side, opposite to the first direction d1, offset toward the central axis J side.

[0062] Figures 9 and 10 show an example of the main parts of a probe 201 that constitutes a probe card according to Embodiment 2 of the present invention. Figure 9 is a partially enlarged view showing a part of the probe 201, and Figure 10 is a cross-sectional view showing the cross-section along the BB cutting line of Figure 9.

[0063] Probe 201 differs from probe 200 (Embodiment 1) in Figure 5 in that it has an offset portion 22 in which the side surface 220 facing the locking portion 21 is offset inward. The other configurations are the same as those of probe 200, so redundant explanations are omitted.

[0064] The offset portion 22 is formed by offsetting the side surface 220 of the upper probe 251 on the second direction d2 side toward the protruding direction of the locking portion 21, and has a lower surface 221 perpendicular to the central axis J and an offset surface 222 parallel to the central axis J. The offset portion 22 is also provided at a position corresponding to the locking portion 21 on the central axis J, and the offset surface 222 faces the protruding surface 212 and extends to the upper end of the probe. The lower surface 221 constitutes a stepped portion formed at the boundary between the side surface 220 and the offset surface 222, and is provided below the lower surface 211 of the locking portion 21. In other words, the lower end of the offset portion 22 is located even lower than the lower end of the locking portion 21 on the central axis J.

[0065] In the figure, L22 represents the offset amount of the offset portion 22. The distance of the probe 201 from the central axis J is L31 = Lw / 2 + L21 for the protruding surface 212, while it is L32 = Lw / 2 - L22 for the offset surface 222. The distance of the offset surface 222 from the central axis J is shorter than that of the protruding surface 212 by the sum of the protrusion amount L21 and the offset amount L22.

[0066] Figure 11 is an enlarged cross-sectional view showing a portion of the first guide plate 14 and probe 201. One locking portion 21 of two adjacent probes 201 faces the offset portion 22 of the other probe. Furthermore, the offset portion 22 is formed so that the lower end of one locking portion 21 of two adjacent probes 201 does not come into contact with the side surface 220 below the offset portion 22 of the other probe. Therefore, compared to the probe 200 (Embodiment 1) in Figure 7, the probe pitch Lp can be shortened by the offset amount L22 when trying to maintain the same probe spacing Li.

[0067] When the probe 201 is tilted, the outermost edge 225 of the lower surface 221 of the offset portion 22 is positioned below the outermost edge 215 of the lower surface 211 of the locking portion 21. In other words, the outermost edge 225 of the lower surface 221 of the offset portion 22 is positioned below the upper surface of the first guide plate 14, for example, within the first guide hole 14h. By adopting this configuration, it is possible to prevent the outermost edge 215 of the lower surface 211 of the locking portion 21 from contacting the side surface 220 below the offset portion 22. The outermost edges 215 and 225 are the edges of the lower surfaces 211 and 221 that are furthest from the central axis J.

[0068] The probe spacing Li is the distance from one protruding surface 212 to the other offset surface 222 of an adjacent probe 201, and the probe pitch is Lp = Lw + L21 - L22 + Li. For example, if the probe width Lw is 20 μm, the protrusion amount L21 of the locking portion 21 is 7 μm, the offset amount L22 is 5 μm, and the probe spacing Li is 13 μm, then the probe pitch Lp will be 35 μm.

[0069] Figure 12 shows the main parts of a comparative example to be compared with Embodiment 2 of the present invention. In the comparative example probe 201', the lower end of the offset portion 22 is provided at a position corresponding to the lower end of the locking portion 21. That is, the lower surface 221 of the offset portion 22 and the lower surface 211 of the locking portion 21 are formed at the same position on the central axis J of the probe 201'. Therefore, if the probe 201' is positioned at an angle, the outermost edge 225 of the lower surface 221 of the offset portion 22 is located above the upper surface of the first guide plate 14, and the outermost edge 215 of the lower surface 211 of the locking portion 21 is at the same height as the side surface 220 below the offset portion 22. As a result, there is a risk that the locking portion 21 of one of two adjacent probes 201' may come into contact with the non-offset side surface 220 of the other, and even if an offset portion 22 is provided, the probe pitch Lp cannot be shortened.

[0070] The probe 201 constituting the probe card according to this embodiment has an offset portion 22 on its side surface 220 facing the locking portion 21, which is offset in the direction of the protrusion of the locking portion 21. Therefore, compared to the case without the offset portion 22, the probe pitch Lp can be further shortened while maintaining the same probe spacing Li.

[0071] Furthermore, in the probe 201 constituting the probe card according to this embodiment, when in an inclined state, the lower end of the offset portion 22 is located below the upper surface of the first guide plate 14, for example, within the first guide hole 14h. Therefore, it is possible to prevent one locking portion 21 from contacting the lower side surface 220 of the other offset portion 22 between two adjacent probes 201, and the probe pitch Lp can be shortened.

[0072] Embodiment 3. Embodiment 2 described a case in which a probe 201 having an offset portion 22 extending to the upper end of the probe is used. In contrast, this embodiment describes a case in which a probe 202 having an offset portion 22 formed as a recess that does not reach the upper end of the probe is used.

[0073] Figure 13 is a diagram showing an example of the main part of the probe 202 that constitutes the probe card according to Embodiment 3 of the present invention, and is a partially enlarged view showing an enlarged part of the probe 202. The probe 202 differs from the probe 201 (Embodiment 2) in Figure 9 in that the offset portion 22 is formed as a recess that does not reach the upper end of the probe. The other configurations are the same as those of the probe 201, so redundant explanations are omitted.

[0074] The offset portion 22 is formed by offsetting the side surface 220 on the second direction side of the upper probe portion 251 in the direction of the protrusion of the locking portion 21, and has a lower surface 221 and an upper surface 223 perpendicular to the central axis J, and an offset surface 222 parallel to the central axis J. Furthermore, the offset portion 22 is provided at a position on the central axis J corresponding to the locking portion 21, and the offset surface 222 faces the protruding surface 212 of the locking portion 21.

[0075] The offset portion 22 is formed as a recess that does not reach the upper end of the probe, and the unoffset side surface 220 is provided not only below the offset portion 22 but also above it. The upper surface 223 is a surface that constitutes a stepped portion formed at the boundary between the offset surface 222 and the upper side surface 220. The upper surface 223 is provided above the upper surface 213 of the locking portion 21. In other words, the upper end of the offset portion 22 is formed at a position further above the upper end of the locking portion 21 with respect to the central axis J. The lower surface 221 is a surface that constitutes a stepped portion formed at the boundary between the offset surface 222 and the lower side surface 220. The lower surface 221 is provided below the lower surface 211 of the locking portion 21. In other words, the lower end of the offset portion 22 is formed at a position further below the lower end of the locking portion 21 with respect to the central axis J.

[0076] Figure 14 is an enlarged cross-sectional view showing a portion of the first guide plate 14 and probe 202. One locking portion 21 of two adjacent probes 202 faces the offset portion 22 of the other. Furthermore, the offset portion 22 is formed so that the lower and upper ends of the locking portion 21 of one of the two adjacent probes 202 do not contact either the lower or upper side surface 220 of the other offset portion 22. Therefore, similar to probe 201 in Figure 11, the probe pitch Lp can be shortened. Also, unlike probe 201 in Figure 11, by forming the offset portion 22 as a recess, the width of the upper end of the probe is not narrowed by the offset. Therefore, the range of inclination angles of the probe in which the upper end of the probe can contact the probe electrode 11t can be widened, and for example, even if the inclination angle of probe 202 becomes excessive, it can still contact the probe electrode 11t.

[0077] When the probe 202 is tilted, the outermost edge 225 of the lower surface 221 of the offset portion 22 is positioned below the outermost edge 215 of the lower surface 211 of the locking portion 21. In other words, the outermost edge 225 of the lower surface 221 of the offset portion 22 is positioned below the upper surface of the first guide plate 14, for example, within the first guide hole 14h. By adopting this configuration, it is possible to prevent the outermost edge 215 of the lower surface 211 of the locking portion 21 from contacting the side surface 220 below the offset portion 22.

[0078] Furthermore, when the probe 202 is tilted, the outermost edge 227 of the upper surface 223 of the offset portion 22 is positioned above the outermost edge 217 of the upper surface 213 of the locking portion 21. By adopting this configuration, it is possible to prevent the outermost edge 217 of the upper surface 213 of the locking portion 21 from contacting the side surface 220 above the offset portion 22. Note that the outermost edges 217 and 227 are the edges of the upper surfaces 213 and 223 furthest from the central axis J.

[0079] Embodiment 4. Embodiment 3 described a case in which a probe 202 is used in which the upper surface 213 of the locking portion 21 and the lower surface 221 and upper surface 223 of the offset portion 22 are perpendicular to the central axis J. In contrast, this embodiment describes a case in which a probe 203 is used in which these are inclined with respect to the central axis J.

[0080] Figure 15 is a diagram showing an example of the main parts of the probe 203 that constitutes the probe card according to Embodiment 4 of the present invention, and is a partially enlarged view showing an enlarged part of the probe 203. The probe 203 differs from the probe 202 (Embodiment 3) in Figure 13 in that the upper surface 213 of the locking portion 21 and the lower surface 221 and upper surface 223 of the offset portion 22 are inclined with respect to the central axis J. The other configurations are the same as those of the probe 202, so redundant explanations are omitted.

[0081] The locking portion 21 is formed by protruding the side surface 210 on the first direction side of the upper part 251 of the probe, and has a lower surface 211 perpendicular to the central axis J, a protruding surface 212 parallel to the central axis J, and an upper surface 213 inclined with respect to the central axis J. The upper surface 213 is a plane or curved surface that decreases in protrusion as it goes upward and inclined to approach the central axis J.

[0082] The offset portion 22 is formed by offsetting the side surface 220 on the second direction side of the upper probe portion 251 toward the protruding direction of the locking portion 21, and has a lower surface 221 and an upper surface 223 that are inclined with respect to the central axis J, and an offset surface 222 that is parallel to the central axis J. The offset portion 22 is provided at a position corresponding to the locking portion 21 on the central axis J, and the offset surface 222 faces the protruding surface 212 of the locking portion 21. The lower surface 221, which is formed below the offset surface 222, is provided below the lower surface 211 of the locking portion 21, and is a plane or curved surface that is inclined so as to move away from the central axis J, with the amount of offset decreasing as it goes downwards. The upper surface 223, which is formed above the offset surface 222, is a plane or curved surface that is inclined so as to move away from the central axis J, with the amount of offset decreasing as it goes upwards.

[0083] Figure 16 is an enlarged cross-sectional view showing a portion of the first guide plate 14 and probe 203. Since the locking portion 21 of one of two adjacent probes 203 faces the offset portion 22 of the other, the probe pitch Lp can be shortened, similar to probe 202 (Embodiment 3) in Figure 14. On the other hand, unlike probe 201 in Figure 11, by inclining the upper surface 213 of the locking portion 21, the lower surface 221 of the offset portion 22, and the upper surface 223 of the offset portion 22 with respect to the central axis J, it is possible to suppress contact between the locking portion 21 of one of two adjacent probes 203 and the other. In addition, the influence of providing the offset portion 22 on the electrical characteristics and mechanical strength of the probe 203 can be suppressed.

[0084] Furthermore, when the probe 202 is tilted, the outermost edge 225 of the lower surface 221 of the offset portion 22 is positioned below the outermost edge 215 of the lower surface 211 of the locking portion 21, and the outermost edge 227 of the upper surface 223 of the offset portion 22 is positioned above the outermost edge 217 of the upper surface 213 of the locking portion 21. By adopting such a configuration, it is possible to prevent the locking portion 21 from contacting the side surface 220 near the offset portion 22.

[0085] Similarly, with respect to the probe 201 (Embodiment 2) shown in Figure 9, by inclining the upper surface 213 of the locking portion 21 or the lower surface 221 of the offset portion 22 with respect to the central axis J, it is possible to suppress contact between the upper or lower end of one locking portion 21 and the other between two adjacent probes 201. [Explanation of symbols]

[0086] 100 probe cards 10 Main board (wiring board) 10t external electrode 11 ST board (wiring board) Electrode for 11t probe 12 Reinforcement plate 13 Spacers 14. First guide plate 14h First guide hole 15. Second guide plate 15h Second guide hole 200~203 probes 21 Locking part 210 Side view on the first direction side 211 Lower surface of the locking part 212 Protruding surface of the locking part 213 Upper surface of the locking part 215 The outermost edge of the lower surface of the locking part 217 The outermost edge of the upper surface of the locking part 22 Offset section 220 Side view on the second direction side 221 Lower surface of the offset section 222 Offset surface of the offset section 223 Top surface of the offset section 225 The outermost edge of the lower surface of the offset section 227 Outermost edge of the upper surface of the offset section 251 Probe top 252 Probe body 253 Probe lower part 301~303 Main layer 304 Contact layer D Tilt direction d1 1st direction d2 2nd direction Hi: Spacing of the first guide hole Pitch of the first guide hole (Hp) Hw Width of the first guide hole J center axis L21 Overhang amount L22 Offset Amount L31 Distance from the central axis to the protruding surface L32 Distance from the central axis to the offset plane Li probe interval Lp probe pitch Lw probe width

Claims

1. A probe formed as a columnar body having a rectangular cross-section, The probe has a locking portion that protrudes outward from a portion of one side near the upper end of the columnar body, The columnar body has a recess formed by offsetting a portion of the side surface opposite to the locking portion near the upper end inward, The upper end of the recess is formed further above the upper end of the locking portion with respect to the central axis, The lower end of the recess is formed further below the lower end of the locking portion with respect to the central axis. The aforementioned probe is composed of two or more probes. The system comprises a first guide plate having two or more first guide holes through which the probes are each inserted at an angle, The side with the locking portion is inclined at an acute angle with respect to the first guide plate, and the locking portion is locked to the upper surface of the first guide plate. A probe card characterized in that the locking portion of one probe faces the recess of the other adjacent probe.

2. The system further comprises a second guide plate positioned below the first guide plate and having two or more second guide holes through which the probes are each inserted, The first guide hole and the second guide hole are positioned at offset locations. The probe card according to claim 1, characterized in that the probe is curved in the offset direction between the first guide plate and the second guide plate.

3. The probe has a multilayer structure in which layers are stacked in the offset direction and in the direction perpendicular to the central axis. The probe card according to claim 2, characterized in that a contact layer is formed on the upper end surface of the probe, which contacts each end surface of a plurality of layers.

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