Wiring circuit board

Abstract

The present invention provides a wiring circuit board that allows for simple and reliable electrical connection between elements and multiple terminals. [Solution] The wiring circuit board 1 comprises a base insulating layer 2, a plurality of wires 31 of different thicknesses, and a cover insulating layer 4, arranged in order from top to bottom. The plurality of wires 31 include the thickest first wire 311. The wiring circuit board 1 includes a plurality of terminals 32 located on the upper surface of the base insulating layer 2. The plurality of terminals 32 are electrically connected to the plurality of wires 31, respectively. The upper surfaces 321A, 322A of each of the plurality of terminals 32 are located above the upper surface 41A of the cover insulating layer 4 (wiring covering cover portion 41) that covers the first wire 311.

Description

Technical Field

[0001] The present invention relates to a wiring circuit board.

Background Art

[0002] There is known a wiring circuit board including, in order from the bottom, a base insulating layer, a plurality of wirings having different thicknesses, and a cover insulating layer (see, for example, Patent Document 1). Each of the plurality of wirings is electrically connected to each of a plurality of terminals.

[0003] Among the plurality of wirings in the circuit-mounted suspension board of Patent Document 1, the upper surface of the cover insulating layer covering the thickest wiring is located above the upper surface of the terminal continuous with the wiring.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] There are cases where an element is brought closer to the bottom side from above each of a plurality of terminals, and the element and the plurality of terminals are electrically connected in the vertical direction. When the element is projected in the vertical direction, it overlaps the plurality of terminals and the cover insulating layer located near the plurality of terminals. The lower surface of the element is flat. Then, the lower surface of the element contacts the upper surface of the cover insulating layer covering the thickest wiring before contacting the upper surface of the first terminal. Therefore, there is a problem that the element and the first terminal cannot be smoothly connected.

[0006] The present invention provides a wiring circuit board in which an element and each of a plurality of terminals can be easily and surely electrically connected.

Means for Solving the Problems

[0007] (1) The present invention provides a wiring circuit board comprising a base insulating layer, a plurality of wirings of different thicknesses, and a cover insulating layer, arranged in order from the top, wherein the plurality of wirings include the thickest first wiring, and the wiring circuit board further comprises a plurality of terminals disposed on the upper surface of the base insulating layer, each of which is electrically connected to the plurality of wirings, and the upper surface of each of the plurality of terminals is located above the upper surface of the cover insulating layer covering the first wiring.

[0008] In this wiring circuit board, the upper surface of each of the multiple terminals is located above the upper surface of the cover insulating layer covering the first wiring. Therefore, even when an element is brought close to each of the multiple terminals from above, contact with the upper surface of the cover insulating layer covering the first wiring is suppressed, and the lower surface of the element can be easily and reliably connected to the upper surface of each of the multiple terminals.

[0009] The present invention (2) includes the wiring circuit board described in (1), wherein the upper surface of each of the plurality of terminals is located 1 μm or more above the upper surface of the cover insulating layer.

[0010] In this wiring circuit board, the element is more reliably prevented from coming into contact with the upper surface of the cover insulating layer that covers the first wiring.

[0011] The present invention (3) includes the wiring circuit board according to (1) or (2), further comprising a protective metal layer disposed on the upper surface of each of the plurality of terminals.

[0012] In this wiring circuit board, a protective metal layer prevents corrosion of multiple terminals.

[0013] The present invention (4) includes a wiring circuit board according to any one of the (1) to (3) claims, wherein at least one of the plurality of terminals includes a plurality of conductor layers in order from upward.

[0014] The present invention (5) includes the wiring circuit board described in (4), wherein the wiring circuit board comprises a first conductor layer and a second conductor layer arranged in order above the base insulating layer, at least one of the plurality of terminals comprises the first conductor layer and the second conductor layer, and each of the plurality of wirings comprises one selected from the group consisting of the first conductor layer and the second conductor layer.

[0015] In this wiring circuit board, despite its simple configuration, the conductor patterns have various thicknesses depending on their function.

[0016] The present invention (6) includes the wiring circuit board described in (5), wherein at least one of the plurality of terminals includes a raising member disposed between the first conductor layer and the second conductor layer.

[0017] In this wiring circuit board, the terminals include a raising member, so that the upper surface of the terminals can be reliably positioned above the upper surface of the cover insulating layer that covers the first wiring.

[0018] The present invention (7) includes the wiring circuit board described in (4), wherein the wiring circuit board comprises a first conductor layer, a second conductor layer, and a third conductor layer disposed above the base insulating layer, at least one of the plurality of terminals includes the first conductor layer, the second conductor layer, and the third conductor layer, and each of the plurality of wirings comprises one selected from the group consisting of the first conductor layer, the second conductor layer, and the third conductor layer.

[0019] In this wiring circuit board, despite its simple configuration, the conductor patterns have various thicknesses depending on their function. [Effects of the Invention]

[0020] The wiring circuit board of the present invention allows for simple and reliable electrical connection between elements and multiple terminals. [Brief explanation of the drawing]

[0021] [Figure 1] FIG. 1 is a partially enlarged plan view of an embodiment of the wiring circuit board of the present invention. [Figure 2] FIG. 2 is a cross-sectional view taken along line A-B of the wiring circuit board shown in FIG. 1. [Figure 3] FIGS. 3A to 3D are manufacturing process diagrams of the wiring circuit board shown in FIG. 2. FIG. 3A is a step of forming a first conductor layer. FIG. 3B is a step of forming a second conductor layer. FIG. 3C is a step of forming a cover insulating layer. FIG. 3D is a step of forming a protective metal layer. [Figure 4] FIG. 4 is a cross-sectional view of the first modification. [Figure 5] FIG. 5 is a cross-sectional view of the second modification. [Figure 6] FIG. 6 is a cross-sectional view of the third modification. [Figure 7] FIG. 7 is a cross-sectional view of the fourth modification.

MODE FOR CARRYING OUT THE INVENTION

[0022] 1. Wiring Circuit Board 1 An embodiment of the wiring circuit board of the present invention will be described with reference to FIGS. 1 to 2. The wiring circuit board 1 has a sheet shape with a thickness. The thickness is the length in the vertical direction. The wiring circuit board 1 extends in the plane direction. The plane direction is perpendicular to the vertical direction. The wiring circuit board 1 includes a lower surface 11 and an upper surface 12. The lower surface 11 is flat. The upper surface 12 is spaced above the lower surface 11.

[0023] The wiring circuit board 1 includes a base insulating layer 2, a conductor pattern 3, a cover insulating layer 4, and a protective metal layer 5. In the present embodiment, the wiring circuit board 1 preferably includes only the base insulating layer 2, the conductor pattern 3, the cover insulating layer 4, and the protective metal layer 5.

[0024] 1.1 Base Insulating Layer 2 The base insulating layer 2 has the same external shape as the wiring circuit board 1. The base insulating layer 2 forms the lower surface 11 of the wiring circuit board 1. The base insulating layer 2 has a sheet shape with thickness. The lower and upper surfaces of the base insulating layer 2 are both flat. The upper surface is parallel to the lower surface. Examples of materials for the base insulating layer 2 include insulating resin. Examples of insulating resins include polyimide. The thickness of the base insulating layer 2 is, for example, 1 μm or more, and for example, 1000 μm or less.

[0025] 1.2 Conductor Pattern 3 The conductor pattern 3 is arranged on the upper surface of the base insulating layer 2. Examples of materials for the conductor pattern 3 include copper, silver, gold, iron, aluminum, chromium, and alloys thereof. Preferably, copper and copper alloys are used, from the viewpoint of obtaining good electrical properties. The conductor pattern 3 comprises a plurality of wires 31 and a plurality of terminals 32.

[0026] The multiple wires 31 have different thicknesses. The multiple wires 31 include a first wire 311 and a second wire 312.

[0027] Each of the first wire 311 and the second wire 312 extends in a first direction. The first direction is included in the planar direction. The first wire 311 and the second wire 312 are spaced apart from each other in a second direction. The second direction is included in the planar direction and is perpendicular to the first direction. The first wire 311 is thicker than the second wire 312. In other words, in this embodiment, the first wire 311 is the thickest of the multiple wires 31.

[0028] The first wiring 311 is, for example, a high-current wiring for transmitting a relatively large current (e.g., 1A or more, and even 10A or more). An example of the first wiring 311 is a power wiring (power supply wiring). The thickness of the first wiring 311 is, for example, 2μm or more, preferably 5μm or more, more preferably 10μm or more, and also, for example, 300μm or less.

[0029] The second wiring 312 is provided independently (electrically independent) of the first wiring 311. The second wiring 312 is a low-current wiring for transmitting a small current (e.g., 1A) compared to the current (large current) transmitted by the first wiring 311. Examples of the second wiring 312 include signal wiring (such as differential wiring) and ground wires (such as earthing wires). The thickness of the second wiring 312 is, for example, 200 μm or less, preferably 100 μm or less, more preferably 50 μm or less, and also, for example, 1 μm or more. The ratio of the thickness of the first wiring 311 to the thickness of the second wiring 312 is, for example, 1.1 or more, preferably 1.25 or more, more preferably 1.5 or more, even more preferably 1.75 or more, particularly preferably 2.0 or more, and also, for example, 100 or less, preferably 50 or less.

[0030] The layer configuration of each of the multiple wirings 31 will be described later.

[0031] Multiple terminals 32 are provided corresponding to multiple wirings 31. Multiple terminals 32 are arranged in parallel with spacing between them in the second direction. Multiple terminals 32 include a first terminal 321 and a second terminal 322.

[0032] The first terminal 321 is continuous with one end edge of the first wiring 311 in the first direction. The first terminal 321 is electrically connected to the first wiring 311. The first terminal 321 has a roughly rectangular land shape in plan view that is elongated in the first direction. Examples of the first terminal 321 include a signal terminal and a ground terminal. The signal terminal inputs and outputs power supply current to the element 8 (described later). The first terminal 321 is thicker than the first wiring 311. Specifically, the upper surface 321A of the first terminal 321 is located above the upper surface 311A ​​of the first wiring 311. The first terminal 321 may be singular or plural.

[0033] The second terminal 322 is continuous with one end edge of the second wiring 312 in the first direction. The second terminal 322 is electrically connected to the second wiring 312. The second terminal 322 has a roughly rectangular land shape in plan view that is elongated in the first direction. An example of the second terminal 322 is a power terminal. As a power terminal, for example, it inputs and outputs signals to and from element 8. The second terminal 322 is thicker than the second wiring 312. Specifically, the upper surface 322A of the second terminal 322 is located above the upper surface 312A of the second wiring 312. The second terminal 322 may be singular or plural.

[0034] In this embodiment, for example, the first terminal 321 and the second terminal 322 have the same thickness. Specifically, the upper surface 321A of the first terminal 321 and the upper surface 322A of the second terminal 322 are located at the same position in the vertical direction. In this embodiment, the upper surface 321A of the first terminal 321 and the upper surface 322A of the second terminal 322 are located at the uppermost part of the conductor pattern 3.

[0035] 1.2.1 Layer configuration of conductor pattern 3 The layer configuration of the conductor pattern 3 will now be described. In this embodiment, of the multiple terminals 32, both the first terminal 321 and the second terminal 322 are provided with multiple conductor layers 33 in order. The multiple conductor layers 33 consist of a first conductor layer 331 and a second conductor layer 332, arranged in order from the top. In this embodiment, both the first terminal 321 and the second terminal 322 are provided with a first conductor layer 331 and a second conductor layer 332, arranged in order from the top. On the other hand, the first wiring 311 consists of the second conductor layer 332. On the other hand, the second wiring 312 consists of the first conductor layer 331.

[0036] 1.2.2 First Conductor Layer 331 The first conductor layer 331 is located on the upper surface of the base insulating layer 2. The first conductor layer 331 is provided on the first terminal 321, the second terminal 322, and the second wiring 312.

[0037] 1.2.3 Second Conductor Layer 332 In this embodiment, the second conductor layer 332 is thicker than the first conductor layer 331. The second conductor layer 332 corresponding to the wiring 31 is located on the upper surface of the base insulating layer 2. The second conductor layer 332 corresponding to the terminal 32 is located on the upper surface of the first conductor layer 331 corresponding to the terminal 32. In other words, the second conductor layer 332 is provided on the first terminal 321, the second terminal 322, and the first wiring 311. Thus, both the first terminal 321 and the second terminal 322 are thicker than both the first wiring 311 and the second wiring 312. In other words, both the upper surface 321A of the first terminal 321 and the upper surface 322A of the second terminal 322 are located above the upper surface 311A ​​of the first wiring 311 and the upper surface 312A of the second wiring 312.

[0038] 1.3 Cover insulation layer 4 The cover insulating layer 4 is positioned on the upper surface of the base insulating layer 2. The cover insulating layer 4 also covers the multiple wirings 31. The cover insulating layer 4 is positioned on the upper surface and side surface of each of the multiple wirings 31. Thus, the wiring circuit board 1 comprises the base insulating layer 2, the multiple wirings 31, and the cover insulating layer 4 facing upwards. On the other hand, the cover insulating layer 4 exposes the multiple terminals 32. Specifically, when projected in the vertical direction, the cover insulating layer 4 does not overlap the multiple terminals 32. Examples of materials for the cover insulating layer 4 include insulating resin. Examples of insulating resins include polyimide.

[0039] The cover insulating layer 4 covering the first wiring 311 will now be described. Hereinafter, the cover insulating layer 4 covering the first wiring 311 will be referred to as the wiring covering cover portion 41. The upper surface 41A of the wiring covering cover portion 41 is located below either the upper surface 321A of the first terminal 321 or the upper surface 322A of the second terminal 322. In other words, either the upper surface 321A of the first terminal 321 or the upper surface 322A of the second terminal 322 is located above the upper surface 41A of the wiring covering cover portion 41.

[0040] The upper surface 321A of the first terminal 321 and the upper surface 322A of the second terminal 322 are both located above the upper surface 41A of the wiring insulation cover portion 41 by, for example, 1 μm or more, preferably 2 μm or more, more preferably 5 μm or more, and for example, 100 μm or less. In other words, the vertical difference D between the upper surface 321A of the first terminal 321 and the upper surface 322A of the second terminal 322 and the upper surface 41A of the wiring insulation cover portion 41 is, for example, 1 μm or more, preferably 2 μm or more, more preferably 5 μm or more, and for example, 100 μm or less. Therefore, even when the element 8 is brought closer to the first terminal 321 and the second terminal 322 from above, contact with the upper surface 41A of the wiring insulation cover portion 41 can be more reliably suppressed.

[0041] In this embodiment, the wiring cover portion 41 is thinner than, for example, the first conductor layer 331 and the second conductor layer 332. In particular, the wiring cover portion 40 is thinner than the first conductor layer 331. The thickness of the wiring cover portion 41 is the vertical length between the upper surface of the wiring cover portion 41 and the upper surface 311A ​​of the first wiring 311. The thickness of the wiring cover portion 41 is, for example, 100 μm or less, preferably 50 μm or less, more preferably 20 μm or less, and also, for example, 1 μm or more.

[0042] 1.4 Protective metal layer5 The protective metal layer 5 is placed on the top and side surfaces of each of the multiple terminals 32. The protective metal layer 5 protects the top and side surfaces of each of the multiple terminals 32. The protective metal layer 5 has a thin film shape that conforms to the shape of each surface of the multiple terminals 32. The thickness of the protective metal layer 5 is thinner than the thickness of the wiring covering portion 41. Specifically, the thickness of the protective metal layer 5 is, for example, 0.01 μm or more, preferably 0.02 μm or more, more preferably 0.05 μm or more, and also, for example, 10 μm or less. The ratio of the thickness of the protective metal layer 5 to the thickness of the cover insulating layer 4 is, for example, 0.1 or less, preferably 0.01 or less, and also, for example, 0.00001 or more. As the material of the protective metal layer 5, corrosion-resistant materials can be used. Examples of corrosion-resistant materials include nickel and gold. In this embodiment, the material of the protective metal layer 5 and the material of the conductor pattern 3 are preferably different. The protective metal layer 5 is either a single layer or multiple layers.

[0043] 1.5 Manufacturing method of wiring circuit board 1 The method for manufacturing the wiring circuit board 1 will be described with reference to Figures 3A to 3D. As shown in Figures 3A to 3D, the method for manufacturing the wiring circuit board 1 comprises, for example, a first step, a second step, a third step, a fourth step, and a fifth step in order.

[0044] 1.5.1 First step As shown in Figure 3A, the first step involves preparing the base insulating layer 2. For example, the resin described above is applied to the surface of a support sheet (not shown), and if necessary, the base insulating layer 2 is formed in an appropriate pattern by photolithography. Alternatively, the base insulating layer 2 is prepared in a sheet shape beforehand.

[0045] 1.5.2 Second process As shown in Figures 3A and 3B, in the second step, the conductor pattern 3 is formed on the upper surface of the base insulating layer 2. The second step comprises, in order, the steps of forming the first conductor layer 331 and forming the second conductor layer 332.

[0046] 1.5.2.1 Process for forming the first conductor layer 331 As shown in Figure 3A, in the process of forming the first conductor layer 331, the first conductor layer 331 is formed on the upper surface of the base insulating layer 2 by an additive method or a subtractive method. This forms the second wiring 312 consisting of the first conductor layer 331.

[0047] 1.5.2.2 Process for forming the second conductor layer 332 Next, as shown in Figure 3B, the second conductor layer 332 is formed on the upper surface of the portion of the first conductor layer 331 corresponding to the first terminal 321 and the second terminal 322, and on the upper surface of the base insulating layer 2, by an additive or subtractive method. This forms the first wiring 311 consisting of the second conductor layer 332. At the same time, the first terminal 321 and the second terminal 322 are formed, respectively, with the first conductor layer 331 and the second conductor layer 332 arranged in order.

[0048] 1.5.3 Third step As shown in Figure 3C, in the third step, the cover insulating layer 4 is formed on one side of the base insulating layer 2 in the thickness direction so as to cover the wiring 31. For example, a photosensitive resin is applied to the base insulating layer 2 and the conductor pattern 3, and a pattern that exposes the terminals 32 is formed by photolithography.

[0049] 1.5.4 4th step As shown in Figure 3D, in the fourth step, a protective metal layer 5 is formed on the surface of the terminal 32, for example, by plating.

[0050] 1.6 Connection between wiring circuit board 1 and element 8 As shown by the dashed lines in Figure 2, the element 8 is arranged at intervals above the multiple terminals 32 on the wiring circuit board 1. The element 8 has a roughly box-like shape in cross-section. The bottom surface 80 of the element 8 is flat. The bottom surface 80 of the element 8 includes a first electrode 81 and a second electrode 82. The first electrode 81 is, for example, a power electrode. The second electrode 82 is, for example, a signal electrode or a ground electrode.

[0051] Next, the element 8 is brought closer to the upper surface 12 of the wiring circuit board 1. Specifically, the first electrode 81 is brought closer to the upper surface 321A of the first terminal 321. The second electrode 82 is brought closer to the upper surface 322A of the second terminal 322.

[0052] As a result, the first terminal 321 is electrically connected to the first electrode 81, and the second terminal 322 is electrically connected to the second electrode 82.

[0053] 2. Effects of one embodiment In this wiring circuit board 1, the upper surface 321A of the first terminal 321 and the upper surface 322A of the second terminal 322 are located above the upper surface 41A of the wiring insulation cover portion 41. Therefore, even when the element 8 is brought close to the first terminal 321 and the second terminal 322 from above, the lower surface 80 of the element 8 is prevented from contacting the upper surface 41A of the wiring insulation cover portion 41. As a result, the first electrode 81 and the second electrode 82 can be easily and reliably connected to the upper surface 321A of the first terminal 321 and the upper surface 322A of the second terminal 322, respectively.

[0054] In this wiring circuit board 1, both the upper surface 321A of the first terminal 321 and the upper surface 322A of the second terminal 322 are located above the upper surface 41A of the wiring insulation cover portion 41 by, for example, 1 μm or more. Therefore, the lower surface 80 of the element 8 is more reliably prevented from coming into contact with the upper surface 41A of the wiring insulation cover portion 41.

[0055] The wiring circuit board 1 is further equipped with a protective metal layer 5, which prevents corrosion of the multiple terminals 32.

[0056] In this wiring circuit board 1, the first terminal 321 and the second terminal 322 each include a first conductor layer 331 and a second conductor layer 332. On the other hand, the first wiring 311 consists of the second conductor layer 332, and the second wiring 312 consists of the first conductor layer 331. Thus, in the conductor pattern 3, multiple wirings 31 of different thicknesses and multiple terminals 32 that are thicker than the wirings but of the same thickness are made up of the first conductor layer 331 and the second conductor layer 332 described above. Therefore, despite its simple configuration, the conductor pattern 3 has various thickness variations depending on its function.

[0057] 3. Variations In the following modifications, the same reference numerals are used for components and processes as in the above-described embodiment, and their detailed descriptions are omitted. Furthermore, each modification can achieve the same effects and advantages as the first embodiment, unless otherwise specified. Moreover, the first embodiment and its modifications can be combined as appropriate.

[0058] 3.1 First Variation As shown in Figure 4, the conductor pattern 3 further comprises a third conductor layer 333.

[0059] As shown in the left-hand diagram of Figure 4, for example, the third conductor layer 333 is positioned on the upper surface of the second conductor layer 332 at the first terminal 321 and the second terminal 322, respectively.

[0060] According to the first modified example, each of the first terminal 321 and the second terminal 322 is provided with a first conductor layer 331, a second conductor layer 332, and a third conductor layer 333 in that order from the top. Therefore, the upper surface 321A of the first terminal 321 and the upper surface 322A of the second terminal 322 can be reliably positioned above the upper surface 41A of the wiring insulation cover portion 41.

[0061] In the first modified example, the conductor pattern 3, which has a simple configuration, includes a first conductor layer 331, a second conductor layer 332, and a third conductor layer 33, and has various thickness variations depending on its function.

[0062] 3.2 Second Variation As shown in Figure 5, the third conductor layer 333 is also included in the first wiring 311. On the other hand, the second conductor layer 332 is not included in the first wiring 311.

[0063] 3.3 Third Modified Example As shown in Figure 6, each of the first terminal 321 and the second terminal 322 includes a riser member 6. The riser member 6 raises the upper surface 321A of the first terminal 321 and the upper surface 322A of the second terminal 322 upwards. The riser member 6 has a flat plate shape. When projected in the vertical direction, the riser member 6 is included in the respective outlines of the first terminal 321 and the second terminal 322. At each of the first terminal 321 and the second terminal 322, the peripheral edge of the first conductor layer 331 and the peripheral edge of the second conductor layer 332 are in contact around the riser member 6. In this embodiment, the material of the riser member 6 is an insulating material. In this embodiment, the material of the riser member 6 is the same as the material of the cover insulating layer 4 (preferably polyimide). The thickness of the raising member 6 is, for example, 1 μm or more, preferably 2 μm or more, more preferably 5 μm or more, and also, for example, 100 μm or less. Preferably, the thickness of the raising member 6 is the same as the thickness of the cover insulating layer 4.

[0064] According to the third modification, since each of the first terminal 321 and the second terminal 322 includes a raising member 6, the upper surface 321A of the first terminal 321 and the upper surface 322A of the second terminal 322 can be reliably positioned above the upper surface 41A of the wiring insulation cover portion 41.

[0065] 3.4 Fourth Variation As shown in Figure 7, the second terminal 322 may be interposed in the middle of the second wiring 312 in the first direction.

[0066] 3.5 Fifth Variation As shown by the dashed lines in Figure 2, the wiring circuit board 1 further comprises a metal support substrate 7. The metal support substrate 7 is positioned on the lower surface of the base insulating layer 2. Examples of materials for the metal support substrate 7 include iron, stainless steel, copper, and copper alloys. [Explanation of Symbols]

[0067] 1 Wiring circuit board 2 Base insulating layer 3 Conductor Patterns 31 Multiple Wirings 32 Multiple terminals 33 Multiple Conductor Layers 311 1st wiring 311A Top view of the first wiring 321A Top view of the first terminal 322A Top view of the second terminal 331 First Conductor Layer 332 Second Conductor Layer 333 Third Conductor Layer 4. Cover insulation layer 41A Upper surface of the wiring insulation cover 5 Protective metal layer 6. Raising member

Claims

1. This is a wiring circuit board that has a base insulating layer, multiple wirings of different thicknesses, and a cover insulating layer arranged in order from the top. The plurality of wirings include the thickest first wiring, The wiring circuit board further comprises a plurality of terminals arranged on the upper surface of the base insulating layer, each of which is electrically connected to the plurality of wirings. The wiring circuit board wherein the upper surface of each of the plurality of terminals is located above the upper surface of the cover insulating layer that covers the first wiring.

2. The wiring circuit board according to claim 1, wherein the upper surface of each of the plurality of terminals is located at least 1 μm above the upper surface of the cover insulating layer.

3. The wiring circuit board according to claim 1 or claim 2, further comprising a protective metal layer disposed on the upper surface of each of the plurality of terminals.

4. The wiring circuit board according to any one of claims 1 to 3, wherein at least one of the plurality of terminals includes a plurality of conductor layers in order toward the top.

5. The aforementioned wiring circuit board comprises a first conductor layer and a second conductor layer, which are arranged in order above the base insulating layer. At least one of the plurality of terminals includes the first conductor layer and the second conductor layer, The wiring circuit board according to claim 4, wherein each of the plurality of wirings comprises one selected from the group consisting of the first conductor layer and the second conductor layer.

6. The wiring circuit board according to claim 5, wherein at least one of the plurality of terminals includes a raising member disposed between the first conductor layer and the second conductor layer.

7. The aforementioned wiring circuit board comprises a first conductor layer, a second conductor layer, and a third conductor layer, which are arranged above the base insulating layer. At least one of the plurality of terminals includes the first conductor layer, the second conductor layer, and the third conductor layer. The wiring circuit board according to claim 4, wherein each of the plurality of wirings comprises one selected from the group consisting of the first conductor layer, the second conductor layer, and the third conductor layer.

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