Detection device, lithography device, and method for manufacturing articles

Abstract

This technology offers advantages in achieving both accuracy and cost-effectiveness in surface position detection. [Solution] The detection device for detecting the surface position of a surface under test comprises a mask with a plurality of slits formed therein, a light projection optical system that illuminates the surface under test from an oblique direction with light passing through the plurality of slits to form an image on the surface under test, an image sensor, and a light receiving optical system that forms an image on the image sensor with reflected light from the surface under test. If the angle of incidence of the light illuminated by the light projection optical system to the surface under test is θ1, the angle of incidence of the light illuminated by the light receiving optical system to the image sensor is θ2, and the optical magnification of the light receiving optical system is β1, then β1 = tanθ2 / tanθ1, 70°

Description

[Technical Field]

[0001] The present invention relates to a detection device, a lithography device, and a method for manufacturing articles. [Background technology]

[0002] Patent Document 1 discloses a surface position detection device in which the object under test and the light-receiving optical system satisfy the Scheinproof relationship, and a diffraction grating for tilt correction is arranged on the image plane of the light-receiving optical system. Patent Document 2 discloses a surface position detection device in which the object under test and the light-receiving optical system satisfy the Scheinproof relationship, and a diffuser plate is arranged on the image plane of the light-receiving optical system. Patent Document 3 discloses a surface position detection device in which the object under test and the light-receiving optical system satisfy the Scheinproof relationship, and a prism for tilt correction is arranged on the image plane of the light-receiving optical system. [Prior art documents] [Patent Documents]

[0003] [Patent Document 1] Patent No. 3204406 [Patent Document 2] Japanese Patent Application Publication No. 10-004054 [Patent Document 3] Patent No. 3271720 [Overview of the project] [Problems that the invention aims to solve]

[0004] However, conventional surface position detection devices require the use of a deflection optical element in the middle of the light-receiving optical system to change the incident angle of the image sensor. In this case, it is necessary to have an optical system that images the deflection optical element from the surface under test, and an optical system that images the deflection optical element and the image sensor. This increases the cost of the optical system and the size of the device. Furthermore, the cost of the deflection optical element itself increases. Diffraction gratings, which increase the intensity of diffracted light at a specific angle, are particularly expensive.

[0005] This invention provides a technology that is advantageous in achieving both accuracy and cost-effectiveness in surface position detection. [Means for solving the problem]

[0006] According to one aspect of the present invention, a detection device for detecting the surface position of a surface under test comprises a mask having a plurality of slits formed therein, a light projection optical system that illuminates the surface under test from an oblique direction with light passing through the plurality of slits to form an image on the surface under test, an image sensor, and a light receiving optical system that forms an image on the image sensor with reflected light from the surface under test, wherein the angle of incidence of the light illuminated by the light projection optical system to the surface under test is θ1, the angle of incidence of the light illuminated by the light receiving optical system to the image sensor is θ2, and the optical magnification of the light receiving optical system is β1. β1 = tanθ2 / tanθ1, 70°<θ1<85°, θ2 < 70°, 0.03 < β1 < 0.40 A detection device is provided that satisfies the following conditions. [Effects of the Invention]

[0007] According to the present invention, it is possible to provide a technology that is advantageous in achieving both accuracy and cost in surface position detection. [Brief explanation of the drawing]

[0008] [Figure 1] A diagram showing the configuration of a surface position detection device. [Figure 2] A diagram showing the relationship between the angle of incidence and surface reflectance. [Figure 3] A diagram showing the relationship of the Scheinproof optical system. [Figure 4] A diagram illustrating the relationship between the Scheinproof optical system and the light projection optical system. [Figure 5] A diagram illustrating the relationship between the light-receiving optical system and the Scheinproof optical system. [Figure 6] A diagram illustrating the light-receiving sensitivity of an image sensor with respect to the angle of incidence. [Figure 7] A diagram showing the image of the light projection pattern on the surface under test. [Figure 8] A diagram showing the relationship between the optical magnification of an imaging optical system, the incident angle of an imaging device, and the pixel sensitivity with respect to surface position fluctuations. [Figure 9] A diagram showing an example of an image of a light projection pattern on an imaging device. [Figure 10] A diagram showing the configuration of a surface position detection device. [Figure 11] A diagram showing the configuration of an exposure device.

Embodiments for Carrying Out the Invention

[0009] Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. Note that the following embodiments do not limit the invention according to the claims. Although a plurality of features are described in the embodiments, not all of these plurality of features are essential for the invention, and the plurality of features may be arbitrarily combined. Further, in the accompanying drawings, the same or similar configurations are denoted by the same reference numerals, and redundant descriptions are omitted.

[0010] The present disclosure relates to a detection device for detecting the surface position of a test surface. The detection device according to the present disclosure can be applied to control of the surface position of a substrate (for example, focus control) in a lithography device such as an exposure device or an imprint device, but can also be applied to other devices such as a processing device, an inspection device, and a microscope.

[0011] <First Embodiment>[[ID=二十七]] Referring to FIG. 1, the configuration of a surface position detection device 100 (detection device) in the present embodiment will be described. The surface position detection device 100 detects the surface position (height of the detection target location) of the test surface 300. The surface position detection device 100 may include a light projection unit 110, a light receiving unit 120, and a control unit 130. The light projection unit 110 may include a light source 111, a mask 112 having a plurality of slits constituting a light projection pattern 112a, and a light projection optical system 113 for projecting the light projection pattern 112a onto the test surface 300. Note that depending on the arrangement constraints of the light projection unit 110, the light projection unit 110 may have one or more intermediate imaging points in the middle of the light projection optical system 113.

[0012] The light projection optical system 113 is configured to project light that has passed through multiple slits onto the surface under test 300 from a predetermined angle with respect to the normal to the surface under test 300, that is, from an oblique direction to the surface under test 300, thereby forming a pattern image on the surface under test 300. In particular, in semiconductor exposure equipment, a resist 302 is coated on the surface under test 300, and most of it transmits light. Figure 2 shows the reflectance in a transparent layer with a refractive index n=1.5. In the vicinity of incident angles of 0° to 45°, the average reflectance of S-polarized and P-polarized light is 10% or less, and therefore more than 90% is transmitted. When light is incident at an angle greater than the angle at which the reflectance of P-polarized light becomes 0 (Brewster angle), the reflectance increases. In order to avoid the influence of the pattern beneath the resist 302, it is desirable that the incident angle with high reflectance be 70° or more.

[0013] The light-receiving unit 120 may include an image sensor 121 having multiple pixels and a light-receiving optical system 122 that forms an image on the image sensor 121 of the reflected light from the surface under test 300. Depending on the arrangement constraints of the light-receiving optical system 122 and the image sensor 121, the light-receiving unit 120 may have one or more intermediate imaging points in the middle of the light-receiving optical system 122.

[0014] The control unit 130 is composed of a computer including, for example, a CPU and memory, and calculates the height of the surface under test 300 based on the detection result received by the image sensor 121. One example of a height measurement method by the control unit 130 is to determine the height from the change in the direction in which the pattern image acquired via the image sensor 121 is projected from the light projection unit 110 onto the surface under test 300. When a height change occurs on the surface under test 300, the projected light pattern projected onto the surface under test 300 changes depending on the direction of projection from the light projection unit 110 to the surface under test 300. The control unit 130 calculates the height of the surface under test 300 by measuring the change in position of the pattern image captured on the image sensor 121.

[0015] The mask 112 and the surface under test 300 have a relationship that satisfies the Scheinproof condition with respect to the light projection optical system 113, so that the entire surface of the light projection pattern 112a is in focus on the surface under test 300. This improves measurement accuracy. Furthermore, when measuring the height of the surface under test 300, it is possible to prevent changes in the measured value due to local tilt of the surface under test 300. Similarly, the surface under test 300 and the image sensor 121 have a relationship that satisfies the Scheinproof condition with respect to the light receiving optical system 122, so that the entire surface of the image sensor 121 is in focus on the surface under test 300. This improves measurement accuracy.

[0016] Generally, when the relationship of the Scheinproof optical system holds, the following equation holds. In Figure 3, the angle between the normal of the object plane 501 and the optical axis 500 of the imaging optical system 510 is θ. a The angle between the normal of the image plane 502 and the optical axis 500 of the imaging optical system 510 is θ. b If the optical magnification of the imaging optical system 510 is β, then equation (1) holds true.

[0017] β = tanθ b / tanθ a (1)

[0018] Referring to Figure 4, the relationship between the light projection optical system 113 and the shineproof optical system will be explained. The angle of incidence of the light irradiated by the light projection optical system 113 with respect to the test surface 300 (resist 302) is θ1 (θ in Figure 3). b (corresponding to) Also, the angle between the optical axis of the projection optical system 113 and the normal to the surface of the mask 112 is set to θ3 (θ in Figure 3). a (corresponding to ). Also, the optical magnification of the light projection optical system 113 is β2. In this case, the optical magnification β2 of the light projection optical system 113 is expressed by the following equation.

[0019] β² = tanθ¹ / tanθ³(2)

[0020] By satisfying equation (2), the mask 112 and the surface under test 300 have a relationship that satisfies the Scheinproof condition with respect to the light projection optical system 113.

[0021] Here, when θ1 = 70° and the optical magnification β2 of the light projection optical system 113 is 2, from Equation (2), the angle θ3 formed between the optical axis of the light projection optical system 113 and the normal of the surface of the mask 112 is 54°.

[0022] Similarly, referring to FIG. 5, the relationship of the shine-proof optical system in the light receiving optical system 122 will be described. The incident angle of the light irradiated by the light projection optical system 113 with respect to the inspection surface 300 (resist 302) is θ1. Also, let the incident angle of the light irradiated by the light receiving optical system 122 with respect to the image pickup device 121 be θ2 (corresponding to θ in FIG. 3). Also, let the optical magnification of the light receiving optical system 122 be β1. In this case, the optical magnification β1 of the light receiving optical system 122 is expressed by the following equation. a Corresponding). Also, let the optical magnification of the light receiving optical system 122 be β1. In this case, the optical magnification β1 of the light receiving optical system 122 is expressed by the following equation.

[0023] β1 = tanθ2 / tanθ1 (3)

[0024] By satisfying Equation (3), the inspection surface 300 and the image pickup device 121 have a relationship that satisfies the shine-proof condition with respect to the light receiving optical system 122.

[0025] Here, the incident angle θ1 (corresponding to θ in FIG. 3) with respect to the inspection surface 300 (resist 302) = 70°, and the optical magnification β1 of the light receiving optical system 122 = 1 (i.e., equal magnification imaging). In this case, from Equation (3), the incident angle θ2 (θ a Corresponding) to the image pickup device 121 = 70°. In the case of such a large incident angle, due to surface reflection on the protective surface of the surface of the image pickup device 121 and the wiring layer inside the image pickup device 121, the light rays may not reach the photoelectric conversion surface, and effective light energy may not reach the pixels. b ) = 70°. In the case of such a large incident angle, due to surface reflection on the protective surface of the surface of the image pickup device 121 and the wiring layer inside the image pickup device 121, the light rays may not reach the photoelectric conversion surface, and effective light energy may not reach the pixels.

[0026] Therefore, in the surface position detection device 100 of this embodiment, the optical magnification β1 of the light-receiving optical system 122 is set to less than 1, taking equation (3) into consideration. This makes it possible to reduce the incident angle θ2 to the image sensor 121 when θ1 is fixed. In Figure 5, for example, if θ1 = 80° and the optical magnification β1 of the light-receiving optical system 122 = 0.2, then θ2 = 49°. By using an image sensor 121 that is sensitive to θ2 = 49°, it becomes possible to place the image sensor 121 on the image plane of the light-receiving optical system 122 and perform measurements.

[0027] Furthermore, if there is an intermediate image formation in the light-receiving optical system 122, it is sufficient if the optical magnification of a part of the light-receiving optical system 122 is greater than 1, as long as the optical magnification from the test surface 300 to the image sensor 121 is less than 1.

[0028] The image sensor 121 can be of the FSI (Front-Side Illumination) type, which has multilayer wiring between the image sensor surface and the light-receiving surface, or of the BSI (Back-Side Illumination) type, which has the light-receiving surface between the image sensor surface and the multilayer wiring. Generally, the BSI type does not have multilayer wiring between the image sensor surface and the light-receiving surface, and therefore is sensitive to large incident angles. When light is incident on the image sensor 121 at a large incident angle, as in this embodiment, it is desirable to use a BSI type image sensor.

[0029] Figure 6 shows an example of light sensitivity with respect to the angle of incidence to the image sensor. In Figure 6, generally, the light sensitivity of the image sensor decreases as the angle of incidence to the image sensor increases from 0°. This is due to the decrease in transmittance by the cover glass on the surface of the image sensor and the incidence of light rays in the wiring layer of the image sensor. Effective light sensitivity can be obtained at an angle of incidence of less than 70° (θ2 < 70°). It is preferable to keep the angle of incidence θ2 below the angle at which the image sensor's light sensitivity is obtained. This eliminates the need for an optical element to deflect the angle of incidence θ2 to the angle at which the image sensor's light sensitivity is obtained.

[0030] Furthermore, it is preferable to bring the optical magnification β1 of the light-receiving optical system 122 closer to 1 within a range of less than 1, depending on the measurement accuracy of the surface position detection device 100. If the amount of change in image position on the image sensor 121 when the surface position changes by dz is denoted as ds, the pixel sensitivity dz / ds is expressed by the following equation.

[0031]

number

[0032] When θ1 is fixed, increasing the optical magnification β1 of the light-receiving optical system 122 reduces pixel sensitivity and improves measurement accuracy. For example, if θ1 = 85°, β1 = 0.2, and the pixel size of the image sensor 121 is 2.0 μm / pixel, the pixel sensitivity to surface position fluctuations is 2.0 μm / pixel. In contrast, if β1 = 0.5 and approaches 1 within the range of less than 1, the pixel sensitivity becomes 0.34 μm / pixel, and the measurement accuracy improves by 5.8 times. From the required measurement accuracy, it is preferable that the pixel sensitivity of the image sensor 121 to surface position fluctuations of the test surface 300 is 0.1 μm / pixel or more. By approaching 1 the optical magnification within the range in which effective light energy for the light-receiving sensitivity of the image sensor 121 is obtained, the measurement accuracy is improved.

[0033] Furthermore, in order to prioritize measurement speed and obtain effective light energy for the light-receiving sensitivity of the image sensor 121, it is preferable to bring the optical magnification β1 of the light-receiving optical system 122 closer to 0 within the range of less than 1. For example, if θ1 = 70° and β1 = 0.05, and the pixel size of the image sensor 121 is 10 μm / pixel, the pixel sensitivity to surface position variation will be 105 μm / pixel. In contrast, if θ1 = 85° and β1 = 0.2, and the pixel size of the image sensor 121 is 2.0 μm / pixel, the light energy per pixel will be 3.9 times greater. Also, from equation (3), the incident angle will be smaller, so the light-receiving sensitivity will be improved. By improving the light energy per pixel, the exposure time of the image sensor can be shortened, thus shortening the measurement time.

[0034] In one example, the light projection pattern 112a may include multiple patterns. In other words, the multiple slits in the mask 112 are formed so that multiple pattern images are formed on the surface under test 300. Figure 7 shows an example of the pattern image 301 of the light projection pattern 112a on the surface under test. The pattern image 301 may include multiple partial patterns 312. This allows for surface position detection in multiple inspection areas 303 on the surface under test. The mask 112 and the surface under test 300 satisfy the conditions of a Scheinproof optical system, and the surface under test 300 and the image sensor 121 also satisfy the conditions of a Scheinproof optical system. Therefore, the pattern image 301 on the surface under test is formed with constant imaging performance regardless of position.

[0035] Figure 8 shows the relationship between the optical magnification β1 of the light-receiving optical system 122, the incident angle θ2 of the image sensor 121, and the pixel sensitivity dz / ds of the image sensor 121 to surface position changes of the surface under test 300. In this case, θ1 = 80° and the pixel size is 5.5 μm / pixel. The incident angle of the image sensor 121 is determined by equation (3), and the pixel sensitivity of the image sensor 121 to surface position changes of the surface under test 300 is determined by equation (4). Assuming that the incident angle at which the image sensor 121 has effective light-receiving sensitivity is less than 65°, the upper limit of the optical magnification β1 that can be set is determined from the incident angle of the image sensor 121, and in the case of Figure 8, β1 < 0.40. In addition, the pixel sensitivity of the image sensor 121 to surface position changes of the surface under test 300 is set to 100 μm / pixel or less. The lower limit of the optical magnification that can be set is determined by the upper limit of pixel sensitivity to plane position variation, which is 100 μm / pixel. In the case of Figure 8, β1 > 0.03. Therefore, when θ1 = 80° and the pixel size is 5.5 μm / pixel, the optical magnification should be set within the range of 0.03 < β1 < 0.40.

[0036] To summarize, when the angle of incidence of light irradiated by the light projection optical system 113 to the test surface 300 is θ1, the angle of incidence of light irradiated by the light receiving optical system 122 to the image sensor 121 is θ2, and the optical magnification of the light receiving optical system 122 is β1, 70°<θ1<85°, θ2 < 70°, 0.03 < β1 < 0.40 It is preferable that the following conditions be met.

[0037] Furthermore, in the configuration shown in Figure 4, if the angle between the optical axis of the light projection optical system 113 and the normal to the surface of the mask 112 is θ3, and the optical magnification of the light projection optical system is β2, β² = tanθ¹ / tanθ³ It is preferable that the following conditions be met.

[0038] Figure 9 shows an example of a pattern image 304 on the image sensor 121. Because imaging is performed on an image plane that satisfies the conditions of a Scheinproof optical system, the aspect ratio differs from that of the pattern image 301 on the surface under test (Figure 7). The image sensor 121 may also be an area sensor with two-dimensional pixels. Using an area sensor allows for surface position detection across the entire surface of the inspection area 303 on multiple surfaces under test, thus enabling more accurate surface position detection.

[0039] <Second Embodiment> Referring to Figure 10, the configuration of the surface position detection device 100 in the second embodiment will be described. In Figure 10, the image sensor 121 has a line sensor 124 with pixels in only one direction. Line sensors are faster than area sensors in terms of the number of pixels and are superior in terms of measurement speed. In addition, line sensors are generally less expensive than area sensors and are superior in terms of device cost.

[0040] A cylindrical lens 123 may be used in the light-receiving optical system 122. By focusing light with the cylindrical lens 123, the amount of light per pixel is improved. By using the cylindrical lens 123, the reduced light energy caused by tilting the light rays relative to the normal to the image sensor can be compensated for, and the required amount can be obtained.

[0041] By providing multiple line sensors 124, it is possible to detect the surface position of multiple measurement positions on the surface under test 300. Alternatively, an optical path splitting element 125 may be used in the light-receiving optical system 122. By using the optical path splitting element 125, the number of line sensors 124 can be increased, allowing for more detailed detection of the surface position of the surface under test 300.

[0042] <Third Embodiment> Referring to Figure 11, a lithography apparatus including the surface position detection device described above will be explained. Figure 11 is a diagram showing the configuration of an exposure apparatus 400, which is an example of a lithography apparatus. The exposure apparatus 400 may include, for example, an illumination optical system 401, a master plate stage 403 that holds a master plate 402, a projection optical system 404, a substrate stage 406 that holds a substrate 405, a position measurement unit 407, a focus detection unit 408, and a control unit 410. The control unit 410 is configured by, for example, a computer having a CPU and memory, and controls the process of transferring the pattern of the master plate 402 to the substrate 405 (the process of exposing the substrate 405).

[0043] The exposure apparatus 400 may be an exposure apparatus (stepper) that fixes the master plate 402 (i.e., in a step-and-repeat manner) and projects the pattern of the master plate 402 onto the substrate 405. Alternatively, the exposure apparatus 400 may be a scanning exposure apparatus (scanner) that synchronously scans the master plate 402 and the substrate 405 in the scanning direction (i.e., in a step-and-scan manner) and transfers the pattern of the master plate 402 onto the substrate 405.

[0044] The illumination optical system 401 uniformly illuminates the master plate 402 held by the master plate stage 403 using light emitted from a light source (not shown). Examples of exposure light include the g-line and i-line of a high-pressure mercury lamp, a KrF excimer laser, an ArF excimer laser, and an F2 laser. Furthermore, to manufacture finer semiconductor devices, extreme ultraviolet (EUV) light in the range of several nanometers to several hundred nanometers may be used as exposure light.

[0045] The projection optical system 404 has a predetermined projection magnification and projects the pattern of the master plate 402 onto the substrate 405. The substrate stage 406 may include, for example, a substrate chuck 406a for holding the substrate 405 and a substrate drive unit 406b for driving the substrate chuck 406a (substrate 405). The substrate drive unit 406b is configured to move the substrate chuck 406a (substrate 405) in at least a direction perpendicular to the optical axis of the projection optical system 404 (XY direction). The position measuring unit 407 includes, for example, a laser interferometer and measures the position of the substrate stage 406. The laser interferometer irradiates a reflector 411 provided on the substrate stage 406 with laser light and detects the displacement of the substrate stage 406 using the laser light reflected by the reflector 411. As a result, the position measuring unit 407 can determine the current position of the substrate stage 406 based on the displacement detected by the laser interferometer.

[0046] The number of substrate stages is not limited to one. The exposure apparatus 400 may be a twin-stage exposure apparatus having, for example, two substrate stages 406. With a twin-stage exposure apparatus, for example, while exposure processing is being performed on a substrate on one substrate stage, pre-measurement can be performed on another substrate on the other substrate stage.

[0047] The focus detection unit 408 may include the configuration of the surface position detection device 100 according to the above embodiment. By making the precision inspection area the area on which the pattern of the original plate 402 is transferred, high-precision and high-throughput measurements can be performed.

[0048] The control unit 410 can control the position of the substrate stage 406 based on the detection result from the surface position detection device (focus detection unit 408). During exposure of the substrate 405, the control unit 410 can perform focus control so that the surface of the substrate 405 is positioned on the imaging plane (focus plane) of the projection optical system 404 according to the position on the substrate to be exposed (position of the shot area). Focus control can be performed, for example, by driving an optical element (lens) provided in the projection optical system 404, or by driving the substrate stage 406 in a direction parallel to the optical axis of the projection optical system 404.

[0049] <Embodiment of Article Manufacturing Method> The article manufacturing method in this embodiment is suitable for manufacturing articles such as microdevices, semiconductor devices, and elements having microstructures. The article manufacturing method of this embodiment includes a forming step of forming a pattern of a master plate on a substrate using the above-mentioned lithography apparatus (exposure apparatus, imprint apparatus, etc.), and a processing step of processing the substrate on which the pattern has been formed in the forming step. Furthermore, this manufacturing method includes other well-known steps (oxidation, film formation, vapor deposition, doping, planarization, etching, resist stripping, dicing, bonding, packaging, etc.). The article manufacturing method of this embodiment is advantageous over conventional methods in at least one of the performance, quality, productivity, and production cost of the article.

[0050] The disclosures herein include at least the following technologies: (Item 1) A detection device for detecting the surface position of a surface under test, A mask with multiple slits formed therein, A projection optical system that projects light passing through the plurality of slits onto the surface under test from an oblique direction to form an image on the surface, Image sensor and A light-receiving optical system that forms an image of reflected light from the surface under test onto the image sensor, It has, If the angle of incidence of the light irradiated by the light projection optical system to the surface under test is θ1, the angle of incidence of the light irradiated by the light receiving optical system to the image sensor is θ2, and the optical magnification of the light receiving optical system is β1, β1 = tanθ2 / tanθ1, 70°<θ1<85°, θ2 < 70°, 0.03 < β1 < 0.40 A detection device characterized by satisfying the following conditions. (Item 2) If the angle between the optical axis of the light projection optical system and the normal to the surface of the mask is θ3, and the optical magnification of the light projection optical system is β2, β² = tanθ¹ / tanθ³ A detection device according to item 1, characterized by satisfying the requirements. (Item 3) β1 = tanθ2 / tanθ1 The detection device according to item 1, characterized in that by satisfying the condition, the mask and the surface under test have a relationship that satisfies the shine-proof condition with respect to the light projection optical system. (Item 4) β² = tanθ¹ / tanθ³ The detection device according to item 2, characterized in that by satisfying the condition, the surface under test and the image sensor have a relationship that satisfies the Scheinproof condition with respect to the light-receiving optical system. (Item 5) The detection device according to any one of items 1 to 4, characterized in that the pixel sensitivity of the image sensor to surface position fluctuations of the surface under test is 0.1 μm / pixel or more. (Item 6) The detection device according to any one of items 1 to 5, characterized in that the pixel sensitivity of the image sensor to surface position fluctuations of the surface under test is 100 μm / pixel or less. (Item 7) The detection device according to any one of items 1 to 6, characterized in that the plurality of slits in the mask are formed so as to form a plurality of pattern images on the surface to be examined. Place. (Item 8) A lithography apparatus that forms a pattern on a substrate using an original plate, A stage for holding the substrate, A detection device according to any one of items 1 to 7 for detecting the surface position of the substrate held by the stage, A control unit controls the position of the stage based on the detection results from the detection device, A lithography apparatus characterized by having [a certain feature]. (Item 9) A forming step of forming a pattern on a substrate using the lithography apparatus described in item 8, The process includes processing the substrate on which the pattern has been formed in the forming step, A method for manufacturing an article, characterized by manufacturing an article from the substrate processed in the aforementioned processing step.

[0051] The invention is not limited to the embodiments described above, and various modifications and variations are possible without departing from the spirit and scope of the invention. Accordingly, claims are attached to disclose the scope of the invention. [Explanation of Symbols]

[0052] 100: Surface position detection device, 110: Light emitting unit, 120: Light receiving unit, 130: Control unit, 300: Surface under inspection

Claims

1. A detection device for detecting the surface position of a surface under test, A mask with multiple slits formed therein, A projection optical system that projects light passing through the plurality of slits onto the surface under test from an oblique direction to form an image on the surface, Image sensor and A light-receiving optical system that forms an image of reflected light from the surface under test onto the image sensor, It has, The angle of incidence of the light irradiated by the aforementioned projection optical system to the surface under inspection is θ １ , the angle of incidence of the light irradiated by the light-receiving optical system to the image sensor is θ ２ The optical magnification of the light-receiving optical system is β １ So, β １ =tanθ ２ / tanθ １ 、 70°<θ １ <85°、 i ２ <70°、 ０．０３＜β １ ＜０．４０、 A detection device characterized by satisfying the following conditions.

2. The angle between the optical axis of the projection optical system and the normal to the surface of the mask is θ. ３ The optical magnification of the aforementioned projection optical system is β ２ So, β ２ =tanθ １ / tanθ ３ The detection device according to claim 1, characterized in that it satisfies the following conditions.

3. β １ =tanθ ２ / tanθ １ The detection device according to claim 1, characterized in that by satisfying the condition, the mask and the surface to be inspected have a relationship that satisfies the shine-proof condition with respect to the light projection optical system.

4. β ２ =tanθ １ / tanθ ３ The detection device according to claim 2, characterized in that by satisfying the condition, the surface under test and the image sensor have a relationship that satisfies the shineproof condition with respect to the light-receiving optical system.

5. The detection device according to claim 1, characterized in that the pixel sensitivity of the image sensor to surface position fluctuations of the surface under test is 0.1 μm / pixel or more.

6. The detection device according to claim 1, characterized in that the pixel sensitivity of the image sensor to surface position fluctuations of the surface under test is 100 μm / pixel or less.

7. The detection device according to claim 1, characterized in that the plurality of slits in the mask are formed so as to form a plurality of pattern images on the surface to be examined. Place.

8. A lithography apparatus that forms a pattern on a substrate using an original plate, A stage for holding the substrate, A detection device according to any one of claims 1 to 7, which detects the surface position of the substrate held by the stage, A control unit controls the position of the stage based on the detection results from the detection device, A lithography apparatus characterized by having [a certain feature].

9. A forming step of forming a pattern on a substrate using the lithography apparatus described in claim 8, The process includes processing the substrate on which the pattern has been formed in the forming step, A method for manufacturing an article, characterized by manufacturing an article from the substrate processed in the aforementioned processing step.

Images