Information processing device and control method

The device uses dual fans and temperature sensors to adjust airflow based on temperature differentials, addressing inefficient heat management in electronic devices with fluctuating power consumption and multiple heat sources.

JP2026064514AActive Publication Date: 2026-04-14LENOVO (SINGAPORE) PTE LTD
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
LENOVO (SINGAPORE) PTE LTD
Filing Date
2024-10-02
Publication Date
2026-04-14

AI Technical Summary

Technical Problem

Existing heat dissipation mechanisms in electronic devices are ineffective for fluctuating power consumption and heat generation from various components, not just processors, leading to inefficient heat management.

Method used

An information processing device with dual heat dissipation fans and temperature sensors that adjust fan output ratios based on temperature differentials to concentrate airflow on hotter areas, using a controller to switch between equal and variable output modes.

Benefits of technology

Enhances heat dissipation efficiency by concentrating airflow on hotter areas within the device, preventing overall temperature rise and improving cooling performance.

✦ Generated by Eureka AI based on patent content.

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Abstract

It efficiently dissipates heat from the main heat source devices. [Solution] The system comprises a housing that houses a controller, multiple temperature sensors, a first cooling fan, and a second cooling fan. The first and second cooling fans are installed in close proximity within a predetermined range from one end and the other end of one side of the housing, respectively. The first and second cooling fans blow air in directions that face each other at least. The system has a first control mode that controls the output of the first cooling fan and the second cooling fan to be equal, and a second control mode that controls the output ratio of the first cooling fan and the second cooling fan in a variable manner. The controller selects the second control mode when, among the multiple temperature sensors, the first temperature detected by a predetermined first temperature sensor is lower than a predetermined first reference temperature, and the second temperature detected by a second temperature sensor located close to either the first or second cooling fan is higher than a predetermined second reference temperature.
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Description

Technical Field

[0001] This application relates to an information processing apparatus and a control method, for example, a heat exhaust mechanism that exhausts heat generated inside a housing.

Background Art

[0002] Electronic devices including personal computers (PCs) are configured to include devices that serve as heat sources. In particular, processors such as CPUs (Central Processing Units) that consume a large amount of power are the main heat sources. The temperature rise due to heat generation can cause malfunctions and failures. Therefore, many electronic devices include a heat exhaust mechanism for discharging the heat generated by the devices.

[0003] In addition, the power consumption tends to increase due to the high functionality of devices. Therefore, it has become even more important to improve the heat exhaust efficiency. For example, the electronic device described in Patent Document 1 includes a casing member, a low heat transfer medium, a second heat spreader, and a first heat spreader, and has a casing structure. When a user uses such an electronic device, the flow of heat generated from the heat source is transmitted from the first heat spreader to the second heat spreader. According to the low heat transfer medium, the heat conduction speed from the second heat spreader to the casing member is decelerated, and the heat flow is radiated from the outer surface of the casing member to dissipate heat to the atmosphere.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] Generally, power consumption of electronic devices fluctuates significantly depending on their operating status. This fluctuation in power consumption leads to changes in heat generation. Furthermore, the processor is not the primary heat source; depending on the operating conditions, memory or chargers may also be the main heat sources. The heat dissipation mechanism described in Patent Document 1 is effective for devices located in specific areas, but it may not be effective for heat generated by devices distributed throughout the device. [Means for solving the problem]

[0006] This invention was made to solve the above-mentioned problems, and an information processing device according to one aspect of this invention comprises a housing that houses a controller, a plurality of temperature sensors, a first heat dissipation fan, and a second heat dissipation fan, wherein the first heat dissipation fan and the second heat dissipation fan are installed in close proximity within a predetermined range from one end and the other end of one side of the housing, respectively, and the first heat dissipation fan and the second heat dissipation fan blow air in at least in directions facing each other, and has a first control mode that controls the output of the first heat dissipation fan and the output of the second heat dissipation fan to be equal, and a second control mode that controls the output ratio of the output of the first heat dissipation fan and the output of the second heat dissipation fan in a variable manner, wherein the controller selects the second control mode when the first temperature detected by a predetermined first temperature sensor among the plurality of temperature sensors is lower than a predetermined first reference temperature, and the second temperature detected by a second temperature sensor located close to either the first heat dissipation fan or the second heat dissipation fan is higher than a predetermined second reference temperature.

[0007] In the above-described information processing device, the controller may, in the second control mode, control the output of the first heat dissipation fan and the output of the second heat dissipation fan such that the closer the position of the second temperature sensor that detects a second temperature higher than the second reference temperature is to the first heat dissipation fan than the second heat dissipation fan, the greater the output ratio of the output of the second heat dissipation fan to the output of the first heat dissipation fan.

[0008] In the above-described information processing device, the housing may house a processor, memory, and a charger.

[0009] In the above-described information processing device, the housing may be provided with an air intake on the surface or bottom of the first cooling fan and the second cooling fan, and an exhaust port on the opposite side that is opposite to the one side.

[0010] In the above-described information processing apparatus, the housing contains a heat sink, one side is sealed, and the heat sink may be adjacent to at least a portion of the exhaust port.

[0011] A control method according to one aspect of the present invention comprises a housing housing a controller, a plurality of temperature sensors, a first cooling fan, and a second cooling fan, wherein the first cooling fan and the second cooling fan are installed in close proximity within a predetermined range from one end and the other end of one side of the housing, respectively, and the first cooling fan and the second cooling fan blow air in directions that face each other at least, and the control method for an information processing device having a first control mode that controls the output of the first cooling fan and the output of the second cooling fan to be equal, and a second control mode that controls the output ratio of the output of the first cooling fan and the output of the second cooling fan in a variable manner, wherein the information processing device selects the second control mode when, among the plurality of temperature sensors, the first temperature detected by a predetermined first temperature sensor is lower than a predetermined first reference temperature, and the second temperature detected by a second temperature sensor located close to either the first cooling fan or the second cooling fan is higher than a predetermined second reference temperature. [Effects of the Invention]

[0012] According to the embodiment of the present invention, heat from the main heat source device can be dissipated with high efficiency. [Brief explanation of the drawing]

[0013] [Figure 1] This is a schematic block diagram showing an example configuration of the information processing device according to this embodiment. [Figure 2] This is a plan view showing an example of the device arrangement in the information processing device according to this embodiment. [Figure 3]This is a plan view showing a first example of operation of the information processing device according to this embodiment. [Figure 4] This is a plan view showing a second example of operation of the information processing device according to this embodiment. [Figure 5] This is a plan view showing a third example of operation of the information processing device according to this embodiment. [Figure 6] This flowchart illustrates a control method for the cooling fan according to this embodiment. [Modes for carrying out the invention]

[0014] The embodiments of this application will be described below with reference to the drawings. An example of the configuration of the information processing device 1 according to this embodiment will be described.

[0015] Figure 1 is a schematic block diagram showing an example of the configuration of the information processing device 1 according to this embodiment. In the example shown in Figure 1, the information processing device 1 is configured as a general-purpose personal computer (PC). The information processing device 1 comprises a host system 10, a display 14, a ROM (Read Only Memory) 22, an auxiliary storage device 23, a communication module 25, an input / output interface 26, an embedded controller (EC) 31, an input device 32, a power supply circuit 34, and a heat dissipation mechanism 35. The information processing device 1 also houses a battery 33.

[0016] The host system 10 is the core computer system of the information processing device 1. The host system 10 includes a CPU (Central Processing Unit) 11, main memory 12, GPU (Graphics Processing Unit) 13, VRAM (Video Random Access Memory) 132, and a chipset 21.

[0017] The main memory 12 is a writable memory that is used as a loading area for the execution program of the CPU 11 or as a working area for writing the processing data of the execution program. The main memory 12 is composed of, for example, a plurality of DRAM (Dynamic Random Access Memory) chips. The CPU 11 and the main memory 12 are the minimum hardware that forms the host system 10.

[0018] The GPU 13 is an arithmetic processing unit mainly for realizing functions related to image display. The GPU 13 processes (image processes) the drawing commands issued from the CPU 11 and writes the display data indicating the obtained display information into the VRAM 132 provided in its own part. The GPU 13 sequentially reads out the display data written from the VRAM 132 and outputs the read display data to the display 14. The GPU 13 may share some processing with the CPU 11. The GPU 13 may execute parallel arithmetic processing other than image processing or share some processing with the CPU 11.

[0019] The VRAM 132 temporarily stores the display data generated by the GPU 13 and functions as a buffer until it is output to the display 14. The VRAM 132 corresponds to a video memory. The VRAM 132 may be used for buffering the intermediate data generated by the rendering process of the GPU 13.

[0020] The display 14 displays a display screen based on the display data input from the GPU 13. The display 14 may be, for example, any of a liquid crystal display (LCD), an OLED (Organic Light Emitting Diode) display, etc.

[0021] The chipset 21 includes multiple controllers and can be connected to multiple devices to input and output various types of data. The controllers on the chipset 21 may be, for example, USB (Universal Serial Bus), SPI (Serial Peripheral Interface) bus, PCI-Express bus, etc. In the example in Figure 1, the chipset 21 is connected to ROM 22, auxiliary storage device 23, communication module 25, input / output I / F 26, and EC31.

[0022] ROM22 primarily stores firmware. Firmware stored in ROM22 includes BIOS (Unified Extensible Firmware Interface Basic Input / Output System) firmware and firmware for controlling individual devices. ROM22 can be either EEPROM (Electrically Erasable Programmable Read Only Memory) or flash ROM.

[0023] The auxiliary storage device 23 stores various data used in the processing of the host system 10, various data acquired through that processing, or various programs. The auxiliary storage device 23 is, for example, an SSD (Solid State Drive).

[0024] The communication module 25 connects to a communication network, enabling it to send and receive various types of data wirelessly or via wired connections. The communication module 25 communicates various types of data with other devices connected to the communication network. The communication module 25 is, for example, a wireless LAN module that connects to a wireless LAN.

[0025] The I / F26 input / output interface connects to various devices for data input and output via wired or wireless connections. For example, the I / F26 includes a connector (USB connector) for wired data input and output in accordance with USB specifications. EC31 is a controller that monitors and controls the operation of various devices connected to it, regardless of the operating state of the host system 10. EC31 has a CPU, ROM, RAM, timer, and input / output interface, separate from the host system 10. Devices with a lower data transfer speed than the chipset 21 can be connected to EC31. In the example in Figure 1, an input device 32, a power supply circuit 34, and a heat dissipation mechanism 35 are connected to EC31.

[0026] The input device 32 detects user operations, generates an operation signal according to the detected operation, and outputs it to EC31. The input device 32 may be, for example, a keyboard, a touchpad, or any other. Battery 33 stores power supplied from the power supply circuit 34. Alternatively, battery 33 discharges the power it has stored to the power supply circuit 34. The battery may be, for example, a lithium-ion battery, a sodium-ion battery, or any other type.

[0027] The power supply circuit 34 supplies power to each device according to the control of EC31. The power supply circuit 34 includes a charger 341 and a DC / DC (Direct Current / Direct Current) converter 342. The charger 341 charges the battery 33 with the remaining power from the external power source that is not consumed by each device. If no power is supplied from the external power source, or if the power supplied from the external power source does not meet the demand, the charger 341 supplies power discharged from the battery 33 to each device.

[0028] The DC / DC342 is a voltage converter that converts the voltage of DC power supplied from an external power source or battery (not shown) into the voltage required for the operation of each device constituting the information processing device 1. The DC / DC342 supplies the DC power with the converted voltage to the receiving device.

[0029] The heat dissipation mechanism 35 is housed inside the housing 50 (Figure 2) of the information processing device 1 and controls the distribution of heat dissipation from the information processing device 1 according to the temperature distribution detected under the control of EC31. The heat dissipation mechanism 35 comprises multiple temperature sensors, a drive circuit 353, and two heat dissipation fans 355. The multiple temperature sensors are distributed at different locations inside the housing 50. The multiple temperature sensors consist of one or more first temperature sensors 351 and one or more second temperature sensors 352. The first temperature sensor 351 is positioned approximately midway between the two heat dissipation fans 355. The second temperature sensor 352 is positioned closer to one of the two heat dissipation fans 355 than to the other.

[0030] In the example shown in Figure 1, the heat dissipation mechanism 35 comprises one first temperature sensor, N (where N is a predetermined integer of 2 or more) second temperature sensors 352, two drive circuits 353, and two heat dissipation fans 355. In Figure 1, components such as the N second temperature sensors 352, the two drive circuits 353, and the two heat dissipation fans 355 are distinguished by assigning sub-numbers (-1, etc.). In this application, sub-numbers may be omitted for common features among multiple identical components, or for other features that do not need to be distinguished.

[0031] The first temperature sensor 351 and the second temperature sensors 352-1 to 352-N each detect their own temperature and output a temperature signal indicating the detected temperature to EC31. Each drive circuit 353 supplies power from the power supply circuit 34 to its corresponding cooling fan 355, according to the control of the EC31. The operation of each cooling fan 355 is controlled according to the power supplied from the power supply circuit 34. Each cooling fan 355 is equipped with a motor that rotates using power supplied from its corresponding drive circuit 353, and the motor rotates its blades. The rotation of the blades causes air to flow into the housing 50, creating an airflow. The incoming air exchanges heat with the components of the information processing device 1 and is then discharged outside the housing 50. The arrangement of the two cooling fans 355 and some devices inside the housing 50, as well as the output control of the cooling fans 355, will be described later.

[0032] The host system 10 has a CPU 11 that executes various programs and works in cooperation with hardware such as main memory 12, chipset 21, and EC31 to realize its functions. The host system 10 is a computer system that executes the OS (Operating System) and manages the execution of other programs, manages computing resources such as memory and processes, and manages input / output with each device. The host system 10 is connected to the temperature sensor 351 via EC31. The host system 10 operates according to one of several predetermined power control modes. Power control parameters are set in the registers of the CPU 11 for each power mode.

[0033] The host system 10 may select a power control mode indicated by an operation signal input from the input device 32 in response to user operation, or it may select a power control mode that satisfies the power consumption due to the processing of the CPU 11 or the application program being executed. The host system 10 notifies EC31 of the selected power control mode.

[0034] Power control parameters may include, for example, a first power limit (PL1). PL1 corresponds to the rated power. The rated power is a threshold that allows the moving average of the CPU 11's power consumption to temporarily exceed this value, but prevents it from consistently exceeding this value (for example, for several seconds to tens of seconds or more). The window length in the moving average (i.e., the observation period for the moving average of power consumption) is, for example, about 1 to 10 seconds. Power control parameters may also include a second power limit (PL2). PL2 is a threshold that prevents the power consumption from exceeding this value, even if only temporarily. Generally, the higher the clock frequency of the CPU 11, the more calculations it performs, and consequently, the more power it consumes. The CPU 11 adjusts its clock frequency, for example, so that the instantaneous value of power consumption does not exceed PL2, and the moving average of power consumption does not exceed PL1.

[0035] Power modes include, for example, performance mode, balanced mode, and eco mode. PL1 is set to decrease in the order of performance mode, balanced mode, and eco mode, and to be greatest for performance mode. PL2 may decrease in the order of performance mode, balanced mode, and eco mode, or it may be equal for some or all power control modes. Maximum output is set to decrease in the order of performance mode, balanced mode, and eco mode, and to be greatest for performance mode. Of the three stages, the operation of the cooling fan 355 is permitted for performance mode, which tends to consume more power than the other power modes, while the operation of the cooling fan 355 may be stopped for balanced mode and eco mode.

[0036] Next, an example of device arrangement in the information processing device 1 according to this embodiment will be described. Figure 2 is a plan view showing an example of the device arrangement in the information processing device 1 according to this embodiment. The information processing device 1 has a housing 50, and various devices are housed in the space inside the housing 50. The housing 50 has a horizontally elongated shape in which one side is longer than the other sides. Cooling fans 355-1 and 355-2 are positioned at a predetermined distance from one end and the other end in the longitudinal direction (referred to in this application as the "left end" and the "right end," respectively, and their respective directions as "left" and "right"). Cooling fans 355-1 and 355-2 are arranged symmetrically. Fins 356-1 and 356-2 are positioned between one side of the housing 50 parallel to the longitudinal direction (referred to in this application as the "rear") and cooling fans 355-1 and 355-2, respectively. The rear of the housing 50 has an open area. This area is formed as an exhaust port 50e. The other side of the housing 50 parallel to the longitudinal direction (referred to in this application as the "front") is sealed and does not have an opening.

[0037] The cooling fans 355-1 and 355-2 occupy an area within a predetermined range from one end and the other end of the front panel. The housing 50 has an open area on the surface (sometimes referred to as the "top surface" in this application) that covers each of the cooling fans 355-1 and 355-2. This area is formed as an air intake port 50i-1 and 50i-2.

[0038] Therefore, the airflow generated by the operation of the cooling fans 355-1 and 355-2 passes through while absorbing the heat radiated from the fins 356-1 and 356-2, and is discharged from the exhaust port 50e. Here, the cooling fans 355-1 and 355-2 each rotate their blades to blow air through the fins 356-1 and 356-2 towards the exhaust port 50e. The fins 356-1 and 356-2 have the function of heat sinks. That is, the fins 356-1 and 356-2 dissipate the heat conducted to themselves into the surrounding air. The air flowing around the fins 356-1 and 356-2 absorbs the heat dissipated from the fins 356-1 and 356-2, and its temperature rises. The heated air is then discharged to the outside of the housing 50 from the exhaust port 50e.

[0039] The housings of the cooling fans 355-1 and 355-2 each have a region that opens onto the surface facing cooling fans 355-2 and 355-1, respectively. These regions are formed as exhaust ports 355o-1 and 355o-2, respectively. As illustrated in Figure 3, cooling fans 355-1 and 355-2 each rotate their blades to blow air toward the opposing cooling fans 355-2 and 355-1, respectively. The airflows generated by cooling fans 355-1 and 355-2 then collide with each other and change direction toward the exhaust port 50e. In the example in Figure 3, the strength of the airflows generated by cooling fans 355-1 and 355-2 is equivalent. Therefore, the point where the airflows change direction is located midway between cooling fans 355-1 and 355-2.

[0040] Other devices are placed in the area between the cooling fans 355-1 and 355-2. In the example shown in Figure 3, the other devices placed on the board include a CPU 11, a GPU 13, a VRAM 132, an auxiliary storage device 23, a charger 341, a DC / DC converter 342, a first temperature sensor 351, and second temperature sensors 352-1 to 352-4. Therefore, the heat generated by these devices is absorbed by the airflow from the cooling fans 355-1 and 355-2 toward the exhaust port 50e. The airflow, whose temperature has risen due to heat absorption, is then discharged from the exhaust port 50e.

[0041] The first temperature sensor 351 is positioned approximately in the center of the inside of the enclosure 50. This position is midway between the exhaust port 355o-1 of the cooling fan 355-1 and the exhaust port 355o-2 of the cooling fan 355-2. The temperature detected by the first temperature sensor 351 (sometimes collectively referred to as the "first temperature" in this application) may be represented as the temperature inside the enclosure 50, as will be described later. The position of the first temperature sensor 351 is midway between the CPU 11 and the GPU 13. If the CPU 11 or GPU 13 generates a lot of heat, the temperature detected by the temperature sensor 351, which is close to the CPU 11 and GPU 13, will be higher. The first temperature sensor 351 is also called the "main temperature sensor".

[0042] The second temperature sensors 352-1 to 352-4 are positioned closer to either the exhaust port 355o-1 of the cooling fan 355-1 or the exhaust port 355o-2 of the cooling fan 355-2 than to the other. In this application, the temperature detected by any or all of the second temperature sensors 352-1 to 352-4 may be collectively referred to as the "second temperature".

[0043] The second temperature sensors 352-1 and 352-2 are positioned slightly to the left or right of the center inside the housing 50. In other words, the second temperature sensors 352-1 and 352-2 are positioned closer to the cooling fans 355-1 and 355-2 than to the cooling fans 355-2 and 355-1, respectively. The second temperature sensor 352-1 is positioned close to the left of the CPU 11. When the CPU 11 generates a lot of heat, the temperature detected by the second temperature sensor 352-1, which is close to the CPU 11, will also increase. The second temperature sensor 352-2 is positioned closer to the right of the first temperature sensor 351, with the GPU 13 and VRAM 132 in between. If the VRAM 132 generates a lot of heat, the temperature measured by the second temperature sensor 352-2, which is closer to the GPU 13 and VRAM 132, will be higher.

[0044] The second temperature sensors 352-3 and 352-4 are positioned further from the exhaust port 50e than the second temperature sensors 352-1 and 352-2, respectively. The second temperature sensors 352-3 and 352-4 are positioned off-center to the left and right of the center inside the housing 50. That is, the second temperature sensors 352-3 and 352-5 are positioned closer to the cooling fans 355-1 and 355-2 than to the cooling fans 355-2 and 355-1, respectively. If the auxiliary storage device 23 generates a lot of heat, the temperature measured by the nearby second temperature sensor 352-3 tends to be high. If the charger 341 generates a lot of heat, the temperature measured by the nearby second temperature sensor 352-4 tends to be high.

[0045] Next, we will describe an example of controlling cooling fans 355-1 and 355-2 using EC31. In the following explanation, we will use the example where EC31 operates cooling fans 355-1 and 355-2 when the power mode at that time is performance mode. EC31 does not operate cooling fans 355-1 and 355-2 when the power mode at that time is a power mode with a lower rated power (i.e., balanced mode or eco mode).

[0046] EC31 determines the control mode of cooling fans 355-1 and 355-2 based on the temperature signals received from the first temperature sensor 351 and the second temperature sensors 352-1 to 352-4, and controls the output of cooling fans 355-1 and 355-2 according to the determined control mode. There are two control modes for cooling fans 355-1 and 355-2: a first control mode and a second control mode. The first control mode controls the output of cooling fan 355-1 and cooling fan 355-2 to be equal. In the first control mode, the output values ​​of cooling fans 355-1 and 355-2 are determined so that the airflow generated inside the enclosure 50 is symmetrical. The first control mode may also be called the "normal mode" or "symmetric mode". The second control mode controls the output ratio between the output of cooling fan 355-1 and the output of cooling fan 355-2 in a variable manner. In the second control mode, the output values ​​of the cooling fans 355-1 and 355-2 are determined so that the airflow generated inside the enclosure 50 is asymmetrical. The second control mode may also be called the "unbalanced mode" or "asymmetrical mode".

[0047] EC31 monitors the temperatures reported by the first temperature sensor 351 and the second temperature sensors 352-1 to 352-4, and determines the control mode based on the temperatures reported by each sensor. EC31 selects the second control mode if the first temperature detected by the first temperature sensor 351 is lower than a predetermined first reference temperature, and any of the second temperatures detected by the second temperature sensors 352-1 to 352-4 are higher than a predetermined second reference temperature. Otherwise, EC31 selects the first control mode. That is, if the first temperature is equal to or greater than the first reference temperature, or if there is no second temperature sensor 352 that detects a second temperature higher than the second reference temperature, EC31 selects the first control mode. The first reference temperature is set to be higher than the second reference temperature and lower than the upper limit of the predetermined operating temperature range of the heat dissipation mechanism 35.

[0048] When the first control mode is selected, the EC31 sets a common output between cooling fans 355-1 and 355-2 that increases as the temperature reported by the first temperature sensor 351 increases, and does not exceed the maximum output of each cooling fan 355-1 and 355-2. In the first control mode, the EC31, for example, refers to a pre-configured first control table to determine the output values ​​of cooling fans 355-1 and 355-2 corresponding to the first temperature. The common output value for cooling fans 355-1 and 355-2 set in the first control table is set to increase as the first temperature increases, and does not exceed the maximum output of each cooling fan 355-1 and 355-2.

[0049] When the second control mode is selected, EC31 identifies a second temperature sensor among the second temperature reported by second temperature sensors 352-1 to 352-4 that is higher than the second reference temperature. The closer the identified second temperature sensor is to the cooling fan 355-1, the larger the output ratio of the output from cooling fan 355-2 to the output from cooling fan 355-1. The higher the second temperature, the larger the output values ​​for cooling fans 355-1 and 355-2 are, and the output values ​​for cooling fans 355-1 and 355-2 are set so as not to exceed the maximum output of cooling fans 355-1 and 355-2.

[0050] In the second control mode, the EC31, for example, refers to a pre-configured second control table and determines the output values ​​of the cooling fans 355-1 and 355-2 corresponding to the second temperature for the identified second temperature sensor. The output values ​​of cooling fans 355-1 and 355-2 set in the second control table are set for each second temperature sensor. The output values ​​of cooling fans 355-1 and 355-2 are set such that the ratio of the output from cooling fan 355-2 to the output from cooling fan 355-1 is larger for second temperature sensors closer to cooling fan 355-1, and the values ​​are larger for cooling fans 355-1 and 355-2 as the second temperature increases, and the values ​​are set so as not to exceed the maximum output of cooling fans 355-1 and 355-2.

[0051] EC31 notifies the corresponding drive circuits 353-1 and 353-2 of the output values ​​defined for each of the cooling fans 355-1 and 355-2. Drive circuits 353-1 and 353-2 supply power to the cooling fans 355-1 and 355-2 so that they operate at the output values ​​notified by EC31.

[0052] Next, an example of controlling the cooling fans 355-1 and 355-2 will be described. Figure 4 illustrates a case where the temperature detected by the second temperature sensor 352-4 is higher than the second reference temperature and lower than the first reference temperature, and the temperatures detected by the other temperature sensors are lower than the second reference temperature. Since the second temperature sensor 352-4 is closer to cooling fan 355-2 than to cooling fan 355-1, EC31 sets the output values ​​of cooling fans 355-1 and 355-2 so that the output from cooling fan 355-1 is greater than the output from cooling fan 355-2. As a result, the strength of the airflow generated by cooling fan 355-1 is higher than the strength of the airflow generated by cooling fan 355-2. The position of the bending point where the respective airflows collide and change direction toward the exhaust port 50e is biased towards cooling fan 355-2 rather than cooling fan 355-1. In the example shown in Figure 4, the inflection point is located on the charger 341. Since the airflow is concentrated at the inflection point, the amount of heat dissipated in that vicinity is higher than in other areas. Therefore, heat dissipation from the charger 341, which is close to the second temperature sensor 352-4 that detects a significant rise in temperature, is promoted.

[0053] Figure 5 illustrates a case where the temperature detected by the second temperature sensor 352-3 is higher than the second reference temperature and lower than the first reference temperature, and the temperatures detected by the other temperature sensors are lower than the second reference temperature. Since the second temperature sensor 352-3 is closer to the cooling fan 355-1 than to the cooling fan 355-2, EC31 sets the output values ​​of cooling fans 355-1 and 355-2 such that the output from cooling fan 355-2 is greater than the output from cooling fan 355-1. As a result, the strength of the airflow generated by cooling fan 355-2 is greater than the strength of the airflow generated by cooling fan 355-1. The bending point where the respective airflows collide and change direction toward the exhaust port 50e is located more towards cooling fan 355-1 than towards cooling fan 355-2. In the example in Figure 5, the bending point is located on the auxiliary storage device 23. Therefore, heat dissipation from the auxiliary storage device 23, which is in close proximity to the second temperature sensor 352-3 that detects the significantly rising temperature, is promoted.

[0054] Next, the control method for the heat dissipation fans 355-1 and 355-2 according to this embodiment will be described. Figure 6 is a flowchart illustrating the control method for the heat dissipation fans 355-1 and 355-2 according to this embodiment.

[0055] (Step S102) EC31 monitors the power mode notified from the host system 10 and determines whether the power mode is performance mode. If the notified power mode is performance mode (Step S102 YES), the process proceeds to step S104. If the notified power mode is a power mode with a lower rated power than performance mode (Step S102 NO), the process of step S102 is repeated.

[0056] (Step S104) EC31 monitors the temperature (detected temperature) notified by the second temperature sensors 352-1 to 352-4 and determines whether there is a second temperature sensor whose detected temperature exceeds the second reference temperature. If it is determined that there is a second temperature sensor whose detected temperature exceeds the second reference temperature (Step S104 YES), the process proceeds to Step S106. If it is determined that there is no second temperature sensor whose detected temperature exceeds the second reference temperature (Step S104 NO), the process returns to Step S102.

[0057] (Step S106) EC31 determines the output values ​​of cooling fans 355-1 and 355-2 according to the second control mode. Here, EC31 identifies a second temperature sensor whose detected temperature exceeds the second reference temperature, and uses the second control table to determine the output values ​​of cooling fans 355-1 and 355-2 corresponding to the detected temperature detected by the second temperature sensor. According to this step, the closer the identified second temperature sensor is to cooling fan 355-1 than to cooling fan 355-2, the greater the output ratio of the output of cooling fan 355-2 to the output of cooling fan 355-1, and the more the outputs from cooling fans 355-1 and 355-2 are controlled.

[0058] (Step S108) EC31 monitors the temperature (detected temperature) notified from the first temperature sensor 351. (Step S110) EC31 determines whether the first temperature notified by the first temperature sensor 351 is equal to or greater than the first reference temperature. If it is determined that the first temperature is equal to or greater than the first reference temperature (Step S110 YES), the process proceeds to step S112. If the first temperature is lower than the first reference temperature (Step S110 NO), EC31 controls the drive circuits 353-1 and 353-2 to operate the heat dissipation fans 355-1 and 355-2 based on the output values ​​determined using the second control table. After that, the process proceeds to step S102.

[0059] (Step S112) EC31 determines the output values ​​of the cooling fans 355-1 and 355-2 according to the first control mode. Here, EC31 uses the first control table to determine the output values ​​of the cooling fans 355-1 and 355-2 corresponding to the first temperature notified by the first temperature sensor 351. EC31 controls drive circuits 353-1 and 353-2 to operate cooling fans 355-1 and 355-2 based on output values ​​determined using the first control table. According to this step, the output from cooling fans 355-1 and 355-2 is controlled to be equal. As a result, the airflow inside the enclosure 50 is controlled symmetrically between cooling fans 355-1 and 355-2. The process then proceeds to step S102.

[0060] In the above explanation, the example given is that EC31 uses a first control table and a second control table to determine the output values ​​of the cooling fans 355-1 and 355-2, but it is not limited to this. Instead of the first control table, EC31 may use a mathematical model that calculates the output values ​​of the cooling fans 355-1 and 355-2 corresponding to the first temperature detected by the first temperature sensor as input values. Instead of the second control table, EC31 may use a mathematical model that calculates the output values ​​of the cooling fans 355-1 and 355-2 corresponding to the second temperature detected by each of the second temperature sensors 352-1 to 352-4 as input values.

[0061] In the above explanation, EC31 assumes that there is one second temperature sensor among the second temperatures reported by the second temperature sensors 352-1 to 352-4 that detects a second temperature higher than the second reference temperature. However, there may be two or more such sensors. In that case, EC31 may identify the second temperature sensor that detected the highest second temperature among the detected second temperatures, and determine the output values ​​of the heat dissipation fans 355-1 and 355-2 based on the identified second temperature sensor and its second temperature. This promotes heat dissipation from the hottest part.

[0062] Furthermore, if two or more second temperature sensors that detect a second temperature higher than the second reference temperature are located in positions closer to the cooling fan 355-1 than to the cooling fan 355-2, and also in positions closer to the cooling fan 355-2 than to the cooling fan 355-1, the EC31 may select the first control mode as the control mode. This avoids the phenomenon where heat dissipation is concentrated from a part closer to either the cooling fan 355-1 or the cooling fan 355-2, preventing the temperature rise from being suppressed from a part closer to the other.

[0063] The number of second temperature sensors 352 is not limited to four; it may be one to three, or five or more. The number of first temperature sensors 351 is not limited to one, but may be two or more. In that case, EC31 may determine the output values ​​of the cooling fans 355-1 and 355-2 based on the highest first temperature among the two or more first temperature sensors 351.

[0064] Furthermore, while the above description illustrates the case where EC31 controls the output values ​​of cooling fans 355-1 and 355-2 using drive circuits 353-1 and 353-2, it is not limited to this. Instead of EC31, the chipset 21 or CPU 11 may control the output values ​​of cooling fans 355-1 and 355-2. Furthermore, the enclosure 50 may be provided with air intakes on the bottom surface in addition to the surfaces of the respective cooling fans 355-1 and 355-2.

[0065] Figure 6 illustrates, but is not limited to, the execution of steps S104 to S112 when the power mode is performance mode. Steps S104 to S112 should be executed if there is a possibility that the cooling fans 355-1 and 355-2 are enabled and can operate. For example, steps S104 to S112 may also be executed when the cooling fans 355-1 and 355-2 are enabled when the power mode is balanced mode. If the cooling fans 355-1 and 355-2 are enabled regardless of the power mode, step S102 may be omitted and steps S104 to S112 may be executed. Furthermore, although the above explanation uses the example of a power mode with three stages, it may also be one, two, or four stages.

[0066] As described above, the information processing device 1 according to this embodiment includes a housing 50 that houses a controller (e.g., EC31), a plurality of temperature sensors, a first heat dissipation fan (e.g., heat dissipation fan 355-1), and a second heat dissipation fan (e.g., heat dissipation fan 355-2). The first heat dissipation fan and the second heat dissipation fan are installed in close proximity within a predetermined range from one end and the other end of one side surface (e.g., the rear) of the housing, and the first heat dissipation fan and the second heat dissipation fan blow air in directions that face each other at least. The information processing device 1 also has a first control mode that controls the output of the first heat dissipation fan and the output of the second heat dissipation fan to be equal, and a second control mode that controls the output ratio of the output of the first heat dissipation fan and the output of the second heat dissipation fan in a variable manner. The controller selects a second control mode if, among the multiple temperature sensors, the first temperature detected by a predetermined first temperature sensor 351 is lower than a predetermined first reference temperature, and the second temperature detected by a second temperature sensor 352 located near either the first or second cooling fan is higher than a predetermined second reference temperature. The enclosure 50 may house a heat source device (for example, a processor, memory, charger, or any combination thereof). In this configuration, if the first temperature is lower than the first reference temperature and the second temperature is higher than the second reference temperature, the second control mode is selected, and the output ratio between the output of the first cooling fan and the output of the second cooling fan is variably controlled. Therefore, under conditions where a temperature difference occurs inside the enclosure 50, the airflow from the first and second cooling fans can be concentrated on the hotter areas by adjusting the output ratio of the first and second cooling fans. Since heat dissipation from the hotter areas is promoted before the temperature of the entire enclosure 50 rises, the heat dissipation efficiency can be improved.

[0067] In the second control mode, the controller may control the output of the first heat dissipation fan and the output of the second heat dissipation fan such that the closer the position of the second temperature sensor, which detects a second temperature higher than the second reference temperature, is to the first heat dissipation fan than the second heat dissipation fan, the greater the output ratio of the output of the second heat dissipation fan to the output of the first heat dissipation fan. This configuration allows airflow from the first and second cooling fans to be concentrated at the location of the second temperature sensor, which detects a second temperature higher than the second reference temperature. As a result, heat dissipation from devices close to the second temperature sensor is promoted.

[0068] The housing 50 may be provided with intake ports on the surface or bottom of the first cooling fan and the second cooling fan, and may be provided with exhaust ports on the opposite side of the housing 50 that is opposite to one side. With this configuration, the airflow drawn in from the surface or bottom of the first and second cooling fans and expelled from the opposite surface is not obstructed. Therefore, it is possible to promote airflow between the first and second cooling fans facing each other.

[0069] The housing 50 houses a heat sink (for example, fins 356-1, 356-2), one side of the housing 50 is sealed, and the heat sink may be adjacent to at least a portion of the exhaust port. In this configuration, airflow from the first and second cooling fans, facing each other, is guided to the exhaust port, and heat dissipation by the heat sink is promoted.

[0070] Although embodiments of the present invention have been described in detail above with reference to the drawings, the specific configurations are not limited to the embodiments described above, and include designs and the like that do not depart from the spirit of this invention. The configurations described in the embodiments described above can be combined in any way. [Explanation of Symbols]

[0071] 1…Information processing unit, 10…Host system, 11…CPU, 12…Main memory, 13…GPU, 14…Display, 21…Chipset, 22…ROM, 23…Auxiliary storage device, 25…Communication module, 26…Input / Output I / F, 31…EC, 32…Input device, 33…Battery, 34…Power supply circuit, 35…Heat dissipation mechanism, 36…Power switch, 132…VRAM, 341…Charger, 342…DC / DC, 351…First temperature sensor, 352 (352-1~352-N)…Second temperature sensor, 353 (353-1, 353-2)…Drive circuit, 355 (355-1, 355-2)…Heat dissipation fan, 356 (356-1, 356-2)…Fin

Claims

1. It comprises a controller, multiple temperature sensors, a first cooling fan, and a second cooling fan, in an enclosure. The first cooling fan and the second cooling fan are installed in close proximity within a predetermined range from one end and the other end of one side of the housing, respectively. The first cooling fan and the second cooling fan blow air in directions that face each other at least. A first control mode that controls the output of the first cooling fan and the output of the second cooling fan to be equal, It has a second control mode that variably controls the output ratio between the output of the first cooling fan and the output of the second cooling fan, The aforementioned controller, If, among the plurality of temperature sensors, the first temperature detected by a predetermined first temperature sensor is lower than a predetermined first reference temperature, and the second temperature detected by a second temperature sensor located near either the first or second heat dissipation fan is higher than a predetermined second reference temperature, Select the second control mode. Information processing device.

2. The aforementioned controller, In the second control mode, The output of the first and second heat dissipation fans is controlled such that the closer the position of the second temperature sensor, which detects a second temperature higher than the second reference temperature, is to the first heat dissipation fan than the second heat dissipation fan, the greater the output ratio of the output of the second heat dissipation fan to the output of the first heat dissipation fan. The information processing apparatus according to claim 1.

3. The aforementioned enclosure houses a processor, memory, and charger. The information processing apparatus according to claim 1.

4. The housing is provided with an air intake on the surface or bottom of the first cooling fan and the second cooling fan, and an exhaust port on the opposite side that is opposite to the one side. The information processing apparatus according to claim 1.

5. The aforementioned enclosure houses a heat sink, The aforementioned side is sealed, and the heat sink is adjacent to at least a portion of the exhaust port. The information processing apparatus according to claim 4.

6. It comprises a controller, multiple temperature sensors, a first cooling fan, and a second cooling fan, in an enclosure. The first cooling fan and the second cooling fan are installed in close proximity within a predetermined range from one end and the other end of one side of the housing, respectively. The first cooling fan and the second cooling fan blow air in directions that face each other at least. A first control mode that controls the output of the first cooling fan and the output of the second cooling fan to be equal, A control method for an information processing apparatus having a second control mode that variably controls the output ratio between the output of the first heat dissipation fan and the output of the second heat dissipation fan, The aforementioned information processing device is If, among the plurality of temperature sensors, the first temperature detected by a predetermined first temperature sensor is lower than a predetermined first reference temperature, and the second temperature detected by a second temperature sensor located near either the first or second cooling fan is higher than a predetermined second reference temperature, then the second control mode is selected. Control method.

Citation Information

Patent Citations

  • Casing structure provided with high efficiency heat source management

    JP2021197174A