Substrate processing equipment

Abstract

The present invention provides a substrate transport device having an end effector that provides both an ideal substrate mapping sensor position and an ideal substrate handling tooth position for substrates of the same or different sizes, curved substrates, and / or warped substrates. [Solution] A substrate processing apparatus equipped with a substrate transport arm, wherein each end effector 350 has a base 350B and one or more teeth 350T1, 350T2 that hold and support a substrate S, at least one of the teeth being movable relative to the base, and the common substrate contacts 800A to 800D of each tooth contact the substrate held by the end effector between the common substrate contacts of each tooth to support the substrate within the substrate support sheet dimension span between the substrate contacts of each tooth, and the end effector drive section changes the distance between each tooth in place.

Description

Technical Field

[0001] [Cross - Reference to Related Applications] This application is a regular patent application claiming the benefit of U.S. Provisional Patent Application No. 62 / 385,150, filed on September 8, 2016, the entire disclosure of which is incorporated herein by reference.

[0002] [Technical Field] Exemplary embodiments generally relate to substrate processing apparatuses, and more particularly, to substrate handling.

Background Art

[0003] Handling substrates with one or more of high curvature, warp, and size variations is a challenge for robotic substrate handling apparatuses. In general, each of these three substrate conditions requires a dedicated end - effector geometry. For example, (1) an end - effector for handling a single - size substrate may not be suitable for other - size substrates, and (2) an end - effector for handling flat substrates may not be suitable for handling warped or curved substrates.

[0004] The location and position of a substrate within a substrate - holding station also need to be detected as the substrate is transferred to and from the substrate - holding station by a robotic substrate handling apparatus. Generally, a mapping device attached to the end - effector, such as on the teeth of the end - effector, is used to map the position and orientation of the substrate in the substrate - holding station as the end - effector passes the substrate and moves a substrate - scanning sensor within the substrate - holding station. In another example, stationary sensors may be used to scan the substrate within the substrate - holding station to determine the position and orientation of the substrate. However, the ideal position of the substrate - scanning sensor when attached to the teeth of the end - effector does not facilitate the ideal positioning of the teeth for handling the substrate.

[0005] Furthermore, mapping devices mounted on end effectors for mapping substrates are generally required to be extremely close to the substrate being mapped. This close proximity of the mapping device to the substrate can be problematic when curved and / or warped substrates are scanned or when substrates of multiple sizes / shapes are supported by the same end effector. [Overview of the Initiative]

[0006] Having a configurable and reconfigurable end-effector solution that can handle multiple sizes of substrates, curved substrates, and / or warped substrates is an advantage. Providing a configurable and reconfigurable end-effector solution that offers both ideal substrate mapping sensor positioning and ideal substrate handling tooth positioning for substrates of the same or different sizes, curved substrates, and / or warped substrates is also an advantage. [Brief explanation of the drawing]

[0007] The aforementioned aspects and other features of the disclosed embodiments are described in the following description in conjunction with the accompanying drawings.

[0008] [Figure 1A] This is a schematic diagram of a substrate processing apparatus incorporating an aspect of the disclosed embodiment. [Figure 1B] This is a schematic diagram of a substrate processing apparatus incorporating an aspect of the disclosed embodiment. [Figure 1C] This is a schematic diagram of a substrate processing apparatus incorporating an aspect of the disclosed embodiment. [Figure 1D] This is a schematic diagram of a substrate processing apparatus incorporating an aspect of the disclosed embodiment. [Figure 1E] This is a schematic diagram of a substrate processing apparatus incorporating an aspect of the disclosed embodiment. [Figure 1F] This is a schematic diagram of a substrate processing apparatus incorporating an aspect of the disclosed embodiment. [Figure 1G] This is a schematic diagram of a substrate processing apparatus incorporating an aspect of the disclosed embodiment. [Figure 1H] This is a schematic diagram of a substrate processing apparatus incorporating an aspect of the disclosed embodiment. [Figure 2A] This is a schematic diagram of a transport arm according to an embodiment of the disclosed model. [Figure 2B] This is a schematic diagram of a transport arm according to an embodiment of the disclosed model. [Figure 2C] This is a schematic diagram of a transport arm according to an embodiment of the disclosed model. [Figure 2D] This is a schematic diagram of a transport arm according to an embodiment of the disclosed model. [Figure 2E] This is a schematic diagram of a transport arm according to an embodiment of the disclosed model. [Figure 3A] This is a schematic diagram of a portion of a substrate transport device according to an embodiment of the disclosed model. [Figure 3B] This is a schematic diagram of a portion of a substrate transport device according to an embodiment of the disclosed model. [Figure 4A] This is a schematic diagram of a portion of a substrate transport device according to an embodiment of the disclosed model. [Figure 4B] This is a schematic diagram of a portion of a substrate transport device according to an embodiment of the disclosed model. [Figure 5A] This is a schematic diagram of a portion of a substrate transport device according to an embodiment of the disclosed model. [Figure 5B] This is a schematic diagram of a portion of a substrate transport device according to an embodiment of the disclosed model. [Figure 6A] This is a schematic diagram of a portion of a substrate transport device according to an embodiment of the disclosed model. [Figure 6B] This is a schematic diagram of a portion of a substrate transport device according to an embodiment of the disclosed model. [Figure 7A] This is a schematic diagram of a portion of a substrate transport device according to an embodiment of the disclosed model. [Figure 7B] This is a schematic diagram of a portion of a substrate transport device according to an embodiment of the disclosed model. [Figure 8A] This is a schematic diagram of a portion of a substrate transport device according to an embodiment of the disclosed model. [Figure 8B]Schematic diagram of a part of a substrate transfer device according to an aspect of the disclosed embodiment. [Figure 8C] Schematic diagram of a part of a substrate transfer device according to an aspect of the disclosed embodiment. [Figure 9] Schematic diagram of a part of a substrate transfer device according to an aspect of the disclosed embodiment. [Figure 10A] Schematic diagram of a part of a substrate transfer device according to an aspect of the disclosed embodiment. [Figure 10B] Schematic diagram of a part of a substrate transfer device according to an aspect of the disclosed embodiment. [Figure 11A] Schematic diagram of a part of a substrate transfer device according to an aspect of the disclosed embodiment. [Figure 11B] Schematic diagram of a part of a substrate transfer device according to an aspect of the disclosed embodiment. [Figure 12A] Schematic diagram of a part of a substrate transfer device according to an aspect of the disclosed embodiment. [Figure 12B] Schematic diagram of a part of a substrate transfer device according to an aspect of the disclosed embodiment. [Figure 13A] Schematic diagram of a part of a substrate transfer device according to an aspect of the disclosed embodiment. [Figure 13B] Schematic diagram of a part of a substrate transfer device according to an aspect of the disclosed embodiment. [Figure 13C] Schematic diagram of a part of a substrate transfer device according to an aspect of the disclosed embodiment. [Figure 14A] Schematic diagram of a part of a substrate transfer device according to an aspect of the disclosed embodiment. [Figure 14B] Schematic diagram of a part of a substrate transfer device according to an aspect of the disclosed embodiment. [Figure 14C] Schematic diagram of a part of a substrate transfer device according to an aspect of the disclosed embodiment. [Figure 15A] Schematic diagram of a part of a substrate transfer device according to an aspect of the disclosed embodiment. [Figure 15B] Schematic diagram of a part of a substrate transfer device according to an aspect of the disclosed embodiment. [Figure 16]This is a flowchart showing an aspect of the disclosed embodiment. [Figure 17] This is a flowchart showing an aspect of the disclosed embodiment. [Figure 18] This is a flowchart showing an aspect of the disclosed embodiment. [Figure 19] This is a flowchart showing an aspect of the disclosed embodiment. [Modes for carrying out the invention]

[0009] As further described herein, Figures 1A–1D show schematic diagrams of substrate processing apparatus or tools incorporating aspects of the disclosed embodiments. While aspects of the disclosed embodiments are described below with reference to the drawings, it should be understood that aspects of the disclosed embodiments can be carried out in many forms. Furthermore, elements or materials of appropriate size, shape, or type may be used as desired.

[0010] As will be described in more detail below, aspects of the disclosed embodiments provide a common end effector for handling and mapping any suitable workpiece, such as semiconductor substrates, isolated semiconductor devices / chips, reticles, reticle carriers, or any other suitable tray (e.g., a JEDEC (Joint Electron Device Engineering Council) or JEDEC-style tray, or any other tray that holds one or more articles such as isolated semiconductor devices / chips), carriers and / or tools used in semiconductor manufacturing, all of which are collectively referred to herein as “substrates.” Aspects of the disclosed embodiments also provide handling and mapping of curved substrates, warped substrates and / or substrates of various sizes (e.g., substrates of 100mm, 150mm, 200mm, 300mm, 450mm, etc.) using a common end effector (e.g., a single end effector solution), as will be described in more detail below. Aspects of the disclosed embodiments provide, for example, handling of substrates at contact points determined for each substrate depending on one or more of the substrate curvature, substrate warp and substrate size. As used herein, the term "bow" with respect to a substrate refers to the deviation from the center point of the central surface of a free, undamped substrate to a reference plane defined by the three angles of an equilateral triangle. The term "warp" with respect to a substrate refers to the difference between the maximum and minimum distances from the reference plane to the central surface of a free, undamped substrate. In one embodiment, transport of substrates by a common end effector is permitted under circumstances where the type, size, and / or shape of the substrates are constantly changing (e.g., substrates that differ in predetermined physical properties such as curvature, warp, and size), by changing the end effector / substrate contact position (e.g., the substrate support sheet dimension span between substrate contacts).

[0011] In one embodiment, the imaging device provides a common sensor for imaging one or more substrates located on an end effector and / or at a substrate holding station or other suitable location away from the end effector. In one embodiment, the common sensor provides both the ability to detect the presence of substrates on the end effector and the ability to map substrates located at a location away from the end effector (such as a substrate holding station). In one embodiment of the disclosed embodiments as described herein, a suitable sensor, such as a camera or other imaging device, is located on the substrate transport device. The camera trains the controller of the substrate transport device to sense substrates of different shapes, different flatnesses, and different sizes (for example, by providing substrate mapping data to facilitate changing the substrate support sheet dimension span between substrate contacts of the transport device end effector for each substrate, as described herein). In one embodiment, the trained controller can enable repositioning of the end effector substrate contact position (e.g., the substrate support sheet dimension span between substrate contacts) to handle substrates having one or more curvature conditions, warp conditions, and different sizes using the common end effector of the substrate transport device.

[0012] In this specification, the terms "substrate" and "wafer" are used interchangeably. Furthermore, as used herein, the term "substrate holding station" refers to a substrate holding location within a processing module, or any other suitable substrate holding location within a substrate processing apparatus, such as a load port (or a substrate cassette held thereon), load lock, or buffer station. The phrase "mapping a substrate" means determining the position, orientation, and / or physical conditions (e.g., curvature, warp, etc.) of each substrate at the substrate holding station in order to pick up / place the substrate at the substrate holding station and to position the end effector relative to the substrate holding station.

[0013] Referring to Figures 1A and 1B, processing devices such as a semiconductor tool station or processing device 11090 are shown according to aspects of the disclosed embodiments. Although a semiconductor tool 11090 is shown in the drawings, aspects of the embodiments disclosed herein can be applied to applications employing any tool station or robotic manipulator. In this example, the tool 11090 is shown as a cluster tool, but aspects of the disclosed embodiments can be applied to any suitable tool station, such as the linear tool station shown in Figures 1C and 1D and described in U.S. Patent No. 8,398,355, issued on March 19, 2013, titled “Linearly Distributed Semiconductor Workpiece Processing Tool,” the entirety of which is incorporated herein by reference. The tool station 11090 generally includes an atmospheric front end 11000, a vacuum load lock 11010, and a vacuum back end 11020. In other embodiments, the tool station may have any suitable configuration. Each component of the front-end 11000, load lock 11010, and back-end 11020 may be connected to a controller 11091, which may be part of any suitable control architecture, such as a cluster architecture control. The control system may be a closed-loop controller having a master controller, a cluster controller, and an autonomous remote controller, as disclosed in U.S. Patent No. 7,904,182, issued on March 8, 2011, titled “Scalable Motion Control System,” the entirety of which is incorporated herein by reference. In other embodiments, any suitable controller and / or control system may be utilized. The controller 11091 includes any suitable memory and processor containing non-temporary program code for operating the processing apparatus described herein to handle and map curved substrates, warped substrates, and / or substrates of various sizes as described herein. For example, in one embodiment, the controller 11091 includes incorporated substrate placement commands.In one embodiment, the substrate placement command may be an integrated pick-up / placement command for determining the distance between the substrate and the end effector of the substrate transport device, as described herein. In one embodiment, the substrate placement command may be an integrated pick-up / placement command for moving the end effector to a predetermined position to acquire substrate mapping data in order to determine the position and / or state of one or more substrates at the substrate holding station. The controller is configured to determine the position of the substrate relative to the end effector and / or the substrate holding station, and to pick up and place curved substrates, warped substrates and / or substrates of various sizes. In one embodiment, the controller is configured to receive detection signals corresponding to one or more features of the end effector and / or the transport arm of the substrate transport device / robot, and to determine the position of the substrate relative to the end effector and / or the substrate holding station, as described herein, to pick up and place curved substrates, warped substrates and / or substrates of various sizes, and / or to determine the position of one or more end effector teeth.

[0014] In one embodiment, the front end 11000 generally includes a load port module 11005 and a mini-environment 11060, such as an Equipment Front End Module (EFEM). The load port module 11005 may be a Box Opener / Loader Tool Standard (BOLTS) interface compliant with SEMI standards E15.1, E47.1, E62, E19.5, or El.9 for 300mm load ports, front-opening or bottom-opening boxes / pods and cassettes. In other embodiments, the load port module may be configured as a 200mm or 450mm wafer interface, or any other suitable substrate interface such as a larger or smaller wafer or a planar panel for a flat panel display. Figure 1A shows two load port modules 11005, but in other embodiments, any suitable number of load port modules may be incorporated into the front end 11000. The load port module 11005 may be configured to receive the substrate carrier or cassette 11050 from an overhead transport system, an automated guided vehicle (AGV), a manned transport vehicle, a rail transport vehicle, or any other suitable transport method. The load port module 11005 may interface with the mini-environment 11060 via the load port 11040. In one embodiment, the load port 11040 allows the substrate to pass between the substrate cassette 11050 and the mini-environment 11060.

[0015] In one embodiment, the mini-environment 11060 includes any suitable transport robot 11013 that generally incorporates one or more embodiments of the embodiments described herein. In one embodiment, the robot 11013 may be, for example, a track-mounted robot as described in U.S. Patent No. 6,002,840, the entirety of which is incorporated herein by reference, and in other embodiments, it may be any other suitable transport robot having any suitable configuration. The mini-environment 11060 can provide a controlled clean zone for transporting substrates between multiple load port modules.

[0016] The vacuum load lock 11010 may be located between the mini-environment 11060 and the backend 11020 and connected to them. The term vacuum as used herein refers to the vacuum in which the substrate is processed. -5 This refers to a high vacuum of Torr or less. The load lock 11010 generally includes atmospheric slot valves and vacuum slot valves. The slot valves may provide environmental isolation, which is employed to maintain a vacuum in the transport chamber when evacuating the inside of the load lock after the substrate has been loaded from the atmospheric front end and when venting the inside of the lock with an inert gas such as nitrogen. In one embodiment, the load lock 11010 includes an aligner 11011 for aligning the reference of the substrate to the desired position for processing. In other embodiments, the vacuum load lock may be located at any suitable location in the processing apparatus and may have any suitable configuration and / or measuring instruments.

[0017] The vacuum backend 11020 generally includes a transport chamber 11025, one or more processing stations or modules 11030, and any suitable transport robot or device 11014. The transport robot 11014 may be positioned in the transport chamber 11025 to transport the substrate between the load lock 11010 and the various processing stations 11030, as described below. The processing stations 11030 may operate on the substrate through various deposition, etching, or other types of processes to form electrical circuits or other desired structures on the substrate. Typical processes include, but are not limited to, plasma etching or other etching processes, implantation such as chemical vapor deposition (CVD), plasma vapor deposition (PVD), ion implantation, measurement, rapid heat treatment (RTP), dry flake atomic layer deposition (ALD), oxidation / diffusion, nitride formation, vacuum lithography, epitaxy (EPI), wire bonding, and evaporation, or other thin-film processes using vacuum pressure. The processing station 11030 is connected to the transport chamber 11025 so that substrates can be passed from the transport chamber 11025 to the processing station 11030 and vice versa. In one embodiment, the load port module 11005 and the load port 11040 are substantially directly coupled to the vacuum backend 11020, and the cassette 11050 mounted on the load port substantially directly interfaces with the vacuum environment of the transport chamber 11025 and / or the processing vacuum of the processing station 11030 (for example, the processing vacuum and / or vacuum environment extend between the processing station 11030 and the cassette 11050 and are common to them) (for example, in one embodiment, at least the mini-environment 11060 is omitted, and in other embodiments, the vacuum load lock 11010 is also omitted so that the cassette 11050 is vacuumed as well as the vacuum load lock 11010).

[0018] Referring here to Figure 1C, a schematic plan view of a linear substrate processing system 2010 is shown, in which the tool interface section 2012 is mounted on the transport chamber module 3018 such that the tool interface section 2012 generally faces (for example, inward) the longitudinal axis X of the transport chamber 3018 and is offset therefrom. The transport chamber module 3018 can be extended in any suitable direction by mounting other transport chamber modules 3018A, 3018I, 3018J to interfaces 2050, 2060, and 2070, as described in U.S. Patent No. 8,398,355, which is incorporated herein by reference. Each transport chamber module 3018, 3019A, 3018I, 3018J includes any suitable substrate transport 2080, which may include one or more embodiments of the embodiments described herein, for transporting substrates through the processing system 2010 to and from the processing module PM (in one embodiment, which is substantially analogous to the processing station 11030 described herein). As can be understood, each chamber module is capable of maintaining an isolated or controlled atmosphere (e.g., N2, clean air, vacuum).

[0019] Referring to Figure 1D, a schematic elevation view of an exemplary processing tool 410 is shown, such that it is taken along the longitudinal axis X of a linear transport chamber 416. In an embodiment of the disclosed embodiment shown in Figure 1D, the tool interface section 12 may typically be connected to the transport chamber 416. In this embodiment, the interface section 12 can define one end of the tool transport chamber 416. As seen in Figure 1D, the transport chamber 416 may have, for example, another workpiece entry / exit station 412 at the end opposite to the interface station 12. In other embodiments, other entry / exit stations may be provided for inserting / removing workpieces from the transport chamber. In one embodiment, the interface section 12 and the entry / exit station 412 may enable the loading of workpieces onto the tool and the unloading of workpieces from the tool. In other embodiments, workpieces may be loaded onto the tool from one end and removed from the tool from the other end. In one embodiment, the transport chamber 416 may have one or more transport chamber modules 18B, 18i. Each chamber module may be capable of maintaining an isolated or controlled atmosphere (e.g., N2, clean air, vacuum). As previously stated, the configuration / arrangement of the workpiece stations comprising the transport chamber modules 18B, 18i, load lock modules 56A, 56 and transport chamber 416, as shown in Figure 1D, is merely illustrative, and in other embodiments, the transport chamber may have more or fewer modules arranged in any desired modular configuration. In the illustrated embodiment, station 412 may be a load lock. In other embodiments, the load lock module may be located between end-entry / exit stations (similar to station 412), or an adjacent transport chamber module (similar to module 18i) may be configured to act as a load lock.

[0020] As previously stated, the transport chamber modules 18B, 18i have one or more corresponding transport devices 26B, 26i, which may include one or more of the embodiments of the herein described herein arranged therein. The transport devices 26B, 26i of each transport chamber module 18B, 18i can cooperate to provide a workpiece transport system linearly arranged within the transport chamber. In this embodiment, the transport device 26B (substantially similar to the transport devices 11013, 11014 for the cluster tool shown in Figures 1A and 1B) may have a general SCARA arm configuration (in other embodiments, the transport arms may have other desired arrangements, such as a linear slide arm 214 as shown in Figure 2B or other suitable arms with any suitable arm coupling mechanism). Suitable examples of arm linkage mechanisms include, for example, U.S. Patent No. 7,578,649 issued on August 25, 2009; U.S. Patent No. 5,794,487 issued on August 18, 1998; U.S. Patent No. 7,946,800 issued on May 24, 2011; U.S. Patent No. 6,485,250 issued on November 26, 2002; U.S. Patent No. 7,891,935 issued on February 22, 2011; U.S. Patent No. 8,419,341 issued on April 16, 2013; as well as U.S. Patent Application No. 13 / 293,717 filed on November 10, 2011, titled "Dual Arm Robot"; and U.S. Patent Application No. 5,794,487 filed on September 5, 2013, titled "Linear Vacuum Robot with Z Motion and Articulated This is found in U.S. Patent Application No. 13 / 861,693, titled “Arm”, and its disclosures are incorporated herein by reference in their entirety. In aspects of the disclosed embodiments, at least one transport arm may be derived from a conventional SCARA (horizontal articulated robotic arm) type design including an upper arm, a band-driven forearm, and a band-restrained end effector, or from a telescopic arm or any other suitable arm design.Examples of suitable transport arms can be found, for example, in U.S. Patent Application No. 12 / 117,415, filed on 8 May 2008 and titled “Substrate Transport Apparatus with Multiple Movable Arms Utilizing a Mechanical Switch Mechanism,” and in U.S. Patent No. 7,648,327, issued on 19 January 2010, the disclosures thereof are incorporated herein by reference in their entirety. The operation of the transport arms may be independent of each other (for example, the extension and retraction of each arm may be independent of the other arms), may be operated via lost-motion switches, and may be operably connected to each other in any suitable manner so as to share at least one common drive axis. In further other embodiments, the transport arms may have any other desired configurations, such as a frog-leg arm 216 (Figure 2A) configuration, a leap-frog arm 217 (Figure 2D) configuration, a symmetrical arm 218 (Figure 2C) configuration, and so on. In another embodiment, referring to Figure 2E, the transport arm 219 includes at least first and second articulated arms 219A, 219B, each arm 219A, 219B including an end effector 219E configured to hold at least two substrates S1, S2 side by side in a common transport plane (each substrate holding position of the end effector 219E shares a common drive unit for picking up and positioning substrates S1, S2), and the distance DX between substrates S1, S2 corresponds to a fixed distance between the side by side substrate holding positions.Suitable examples of transport arms are U.S. Patent No. 6,231,297 issued on May 15, 2001, U.S. Patent No. 5,180,276 issued on January 19, 1993, U.S. Patent No. 6,464,448 issued on October 15, 2002, U.S. Patent No. 6,224,319 issued on May 1, 2001, U.S. Patent No. 5,447,409 issued on September 5, 1995, and August 2009. These disclosures are found in U.S. Patent No. 7,578,649, published on the 25th; U.S. Patent No. 5,794,487, published on August 18, 1998; U.S. Patent No. 7,946,800, published on May 24, 2011; U.S. Patent No. 6,485,250, published on November 26, 2002; U.S. Patent No. 7,891,935, published on February 22, 2011; as well as U.S. Patent Application No. 13 / 293,717, filed on November 10, 2011, titled "Dual Arm Robot"; and U.S. Patent Application No. 13 / 270,844, filed on October 11, 2011, titled "Coaxial Drive Vacuum Robot," the disclosures of which are incorporated herein by reference in their entirety. In one aspect, the embodiments of the disclosed designs are incorporated into the transport arm of a linear transport shuttle, as disclosed, for example, in U.S. Patent No. 8,293,066 and U.S. Patent No. 7,988,398, which are incorporated herein by reference in their entirety.

[0021] In the embodiment of the disclosed features shown in Figure 1D, the arms of the transport device 26B may be configured to provide what is called high-speed exchange placement, which allows for rapid exchange of wafers from a pick-up / placement position by transport (e.g., picking up a wafer from a substrate holding position and then immediately placing the wafer in the same substrate holding position). The transport arms 26B may have any suitable drive sections (e.g., coaxially arranged drive axes, juxtaposed drive axes, horizontally adjacent motors, vertically stacked motors, etc.) to provide each arm with any suitable number of degrees of freedom (e.g., independent rotation around the shoulder and elbow joints with Z-axis motion). As seen in Figure 1D, in this embodiment, modules 56A, 56, 30i may be arranged with gaps between the transport chamber modules 18B, 18i and may define suitable processing modules, (one or more) load lock LLs, (one or more) buffer stations, (one or more) measurement stations, or (one or more) any other desired stations. For example, gap modules such as load locks 56A, 56 and workpiece station 30i may each have stationary workpiece supports / racks 56S1, 56S2, 30S1, 30S2 that cooperate with a transport arm to transport workpieces along the linear axis X of the transport chamber over the length of the transport chamber. As an example, (one or more) workpieces may be loaded into the transport chamber 416 by the interface unit 12. (One or more) workpieces may be placed on the supports of the load lock module 56A using the transport arm 15 of the interface unit. (One or more) workpieces in the load lock module 56A may be moved between the load lock module 56A and the load lock module 56 by a transport arm 26B in module 18B, and in a similar continuous manner, they may be moved between the load lock 56 and the workpiece station 30i by arm 26i (in module 18i), and between station 30i and station 412 by arm 26i in module 18i.This process may be reversed entirely or partially to move (one or more) workpieces in opposite directions. Thus, in one embodiment, workpieces may be moved in any direction along axis X and to any position along the transport chamber, and may be loaded into and unloaded from any desired module (processing or otherwise) communicating with the transport chamber. In other embodiments, gap transport chamber modules having static workpiece supports or shelves may not be provided between transport chamber modules 18B, 18i. In such embodiments, the transport arms of adjacent transport chamber modules may feed workpieces directly from end effectors or from one transport arm to the end effector of another transport arm, moving the workpieces through the transport chamber. Processing station modules may operate on a substrate through various deposition, etching, or other types of processes to form electrical circuits or other desired structures on the substrate. Processing station modules may be connected to transport chamber modules to move substrates from the transport chamber to the processing station or vice versa. A suitable example of a processing tool having similar general characteristics to the processing apparatus shown in Figure 1D is described in U.S. Patent No. 8,398,355, which has been incorporated herein by reference in its entirety.

[0022] Figure 1E is a schematic diagram of a semiconductor tool station 11090A substantially similar to the semiconductor tool station described above. Here, the semiconductor tool station 11090A includes separate / individual inline processing units 11030SA, 11030SB, and 11030SC connected to a common atmospheric front end 11000. In this embodiment, at least one of the inline processing units 11030SA, 11030SB, and 11030SC is configured to process substrates S1, S2, and S3 having predetermined characteristics different from those processed by the other inline processing units 11030SA, 11030SB, and 11030SC. For example, the predetermined characteristic could be the size of the substrate. In one embodiment, for illustrative purposes only, the inline processing unit 11030SA may be configured to process a substrate with a diameter of 200 mm, the inline processing unit 11030SB may be configured to process a substrate with a diameter of 150 mm, and the inline processing unit 11030SC may be configured to process a substrate with a diameter of 300 mm. As described herein, at least one of the transport devices 11013, 11014 is configured to transport substrates S1, S2, S3 of different sizes that may be curved or warped, using a common end effector. In one embodiment, each of the load port modules 11050 is configured to hold and interface with cassettes 11050 that hold substrates S1, S2, S3 of different sizes on the common load port module. In other embodiments, each load port module 11050 may be configured to hold a predetermined cassette corresponding to a predetermined size of substrate. Processing substrates of different sizes using at least one common transport device 11013, 11014 can increase throughput and reduce machine downtime with respect to a single substrate batch processing.

[0023] Figure 1F is a schematic diagram of a semiconductor tool station 11090B that is substantially similar to the semiconductor tool station 11090. However, in this embodiment, the processing module 11030 and the load port module 11005 are configured to process substrates of different sizes with respect to the semiconductor tool station 11090A as described above. In this embodiment, the processing module 11030 may be configured to process substrates having different sizes, but in other embodiments, processing modules corresponding to substrates of different sizes processed in the semiconductor tool station 11090B may be provided.

[0024] Referring to Figures 1G and 1H, aspects of the disclosed embodiments may be incorporated into a sorter and / or stocker. In one embodiment, the sorter and / or stocker may be used to sort or store substrates (such as those described above). As an example, an operating device 12000 is shown in Figures 1G and 1H, which is substantially similar to that described in U.S. Patent No. 7,699,573 issued April 20, 2010, the disclosure of which is incorporated herein by reference in whole. Here, the operating device 12000 may be configured to operate a substrate such as a reticle, and in other embodiments, the operating device 12000 may be configured to operate any suitable substrate. The operating device 12000 may be a modular device having a housing 12200 for maintaining a clean indoor environment within the housing 12200. The operating device 12000 includes an input / output station 12700 integrated into the housing 12200, which includes a panel 12600. Each panel 12600 also belongs to a modular input / output unit 12800. One end of the opening 12900 of each panel 12600 is provided with a contour that at least substantially corresponds to the outer contour of each type of substrate processed by the operating device 12000 (e.g., a reticle transport box). The opening 12900 is configured so that substrates are loaded into and unloaded from the operating device 12000 through the opening 12900. In one embodiment, the operating device 12000 also includes drawers 12170, 12160, which are components of an additional input / output unit 12800 of the station 12700. The drawers 12170, 12160 may have different structural heights and can be pulled out to accommodate larger transport boxes, for example, one or more substrates, i.e., a larger transport box can be introduced into the operating device 12000 via the drawers 12160, 12170. The operating device 12000 also includes at least one transport device 11014 substantially similar to those described herein. The at least one transport device is configured to transport one or more substrates within the operating device 12000 for sorting, storage, or other processing operations.The configuration of the operating device 12000 described herein is illustrative, and in other embodiments, the operating device may have any suitable configuration for classifying and / or storing substrates in any suitable manner.

[0025] In one embodiment, the operating device 12000 may be included in the semiconductor tool station shown in Figure 1A-1F above. For example, in one embodiment, the operating device 12000 may be incorporated into the atmospheric front end 11000 of the semiconductor tool station / system 11090, 2010, 11090A, 11090B as a load port and / or atmospheric transfer chamber. In another embodiment, the operating device may be incorporated into the vacuum back end 11020 of the semiconductor tool station / system 1090, 2010, 11090A, 11090B as a processing module and / or transfer chamber. In one embodiment, the operating device 12000 may be connected to the atmospheric front end 11000 instead of the vacuum back end 11020. As can be understood, the operating device 12000 incorporating an embodiment of the disclosed embodiment can house multiple substrates of different shapes and / or sizes in a common housing using a common end effector.

[0026] Referring to Figures 3A to 3B, schematic diagrams are shown comparing, for example, the ideal sensor position for mapping a substrate at a substrate holding station with the ideal end effector tooth position for handling the substrate. Here, the end effector 350 of any suitable substrate transport device as described above includes a base 350B and one or more teeth 350T1, 350T2 configured to hold and support the substrate. In one embodiment, each tooth 350T1, 350T2 includes substrate contacts 800A to 800D, where the substrate contacts 800A to 800D are one or more vacuum back contacts, passive edge contacts, passive back contacts, or any other suitable substrate contacts. In one embodiment, teeth 350T1, 350T2 are interchangeable with other sets of teeth 350T3, 350T4 and 350T5, 350T6 in any suitable manner, as shown in Figures 14A-14C, where each set of teeth 350T1-350T6 has different predetermined characteristics, such as the type of substrate contact. For example, Figure 14A shows passive edge contacts 1400 on teeth 350T1, 350T2, Figure 14B shows passive back contacts 1401 on teeth 350T3, 350T4, and Figure 14C shows vacuum back contacts on teeth 350T5, 350T6. In this embodiment, the end effector includes two teeth 350T1, 350T2, and in other embodiments, the end effector may be a paddle end effector having movable substrate contacts according to the embodiments of the disclosed embodiment.

[0027] Here, teeth 350T1, 350T2 include one or more sensors 360A, 360B disposed on teeth 350T1, 350T2. In one embodiment, sensors 360A, 360B are located at the distal end of the teeth (e.g., opposite the base 350B), and sensors 360A, 360B form a full-beam sensor having a transmitter located on one tooth 350T1, 350T2 and a receiver located on the other teeth 350T1, 350T2. Sensors 360A, 360B are connected to any suitable controller, such as controller 11091, and may be configured to map the substrate as described herein, for example using controller 11091, to determine at least one of the substrate position, substrate shape, substrate curvature, and substrate warp within the substrate holding station. Controller 11091 is configured in any suitable way to determine the substrate support sheet dimension span DS of each mapped substrate based on the mapping data received from sensors 360A, 360B. In one embodiment, the substrate support sheet dimension span DS depends on the substrate size, substrate shape, substrate warp, and / or substrate curvature. In one embodiment, mapping data for each substrate is registered in the controller, and the controller may change the substrate support sheet dimension span DS on the fly when the transport device moves the end effector and picks up the substrate, as described herein. In another embodiment, the substrate support sheet dimension span DS may be determined on the fly when the transport device moves the end effector and picks up the substrate, as described herein.

[0028] Referring to Figures 3A and 3B, for illustrative purposes only, it is shown that at least one 300 mm substrate S300 is placed in the substrate holding station 300. In this embodiment, mapping sensors 360A and 360B are positioned close to the substrate S300 to map its position. Here, teeth 350T1 and 350T2 are separated from each other by a distance X1 to position sensors 360A and 360B in a suitable spatial arrangement for mapping the substrate S300. However, in order to handle the substrate S300 at its ideal contact position, teeth 350T1 and 350T2 are separated from each other by a distance X2 greater than the distance X1. Similarly, Figures 4A and 4B show, for illustrative purposes only, at least one 200mm substrate S200 placed at a substrate holding station 301, where the scanning / mapping distance between teeth 350T1 and 350T2 is distance X3, and the substrate handling distance between teeth 350T1 and 350T2 is distance X4, which is greater than distance X3. Figures 5A and 5B show, for illustrative purposes only, at least one 150mm substrate S150 placed at a substrate holding station 302, where the scanning / mapping distance between teeth 350T1 and 350T2 is distance X5, and the substrate handling distance between teeth 350T1 and 350T2 is distance X6, which is greater than distance X5. Figures 6A and 6B show, for illustrative purposes only, at least one 100 mm substrate S100 placed in a substrate holding station 303, where the scanning / mapping distance between teeth 350T1, 350T2 is distance X7, and the substrate handling distance between teeth 350T1, 350T2 is distance X8, which is greater than distance X7. Aspects of the embodiments described herein provide repositioning of at least one of the teeth 350T1, 350T2 of the end effector 350, where the teeth 350T1, 350T2 are placed apart by distances X1, X3, X5, and X7 to position sensors 360A, 360B in the ideal scanning position on their respective substrates S300, S200, S150, and S100.

[0029] Aspects of the embodiments described herein provide repositioning of at least one of the teeth 350T1, 350T2 of the end effector 350, thereby positioning the teeth 350T1, 350T2 at distances X2, X4, X6, and X8 to position the teeth 350T1, 350T2 at the ideal substrate handling positions on the respective substrates S300, S200, S150, and S100. Although only substrates of 300mm, 200mm, 150mm, and 100mm are illustrated in Figures 3A to 6B, it should be understood that in other embodiments, the embodiments of the disclosed embodiments provide handling for substrates of any suitable shape and size. Aspects of the disclosed embodiments enable users of semiconductor tool stations, such as those described herein, to handle different materials using common equipment (e.g., a common transport device having a common end effector common to multiple different sized substrates as described herein) by repositioning teeth 350T1, 350T2, thereby increasing throughput and reducing machine setup and / or downtime.

[0030] In one embodiment, referring to Figures 13A and 13B, the transport device (such as the one described above) includes a camera 1300 positioned on the transport device. In this embodiment, the camera 1300 is positioned on the base 350B of the end effector 350, but in other embodiments, the camera 1300 may be positioned on any suitable link of the transport device. In yet another embodiment, the camera may be positioned away from the transport device, such as at the stationary position of the semiconductor tool station (e.g., front-end module, load lock, processing module, transport chamber, etc.). In one embodiment, the camera 1300 is configured, for example, with a controller 11091, to image one or more substrates on the end effector and / or at a location away from the end effector, such as a substrate holding station. In one embodiment, the camera 1300 is configured, for example, with a controller 11091, to detect the presence of a substrate on the end effector 350. In one embodiment, the camera 1300 is configured to simultaneously map one or more substrates at one or more substrate holding stations to determine, for example, one or more of the following from a single image of the substrates at one or more substrate holding stations: substrate position, substrate size, substrate shape, substrate curvature, and substrate warp, using, for example, a controller 11091. The controller 11091 is configured to determine the substrate support sheet dimension span of each mapped substrate based on the mapping data received from the camera 1300 in any suitable manner. In one embodiment, the camera may be provided in place of sensors 350A, 350B, and in other embodiments, the camera may be used together with sensors 360A, 360B. As can be understood, the throughput of substrate mapping can be increased by the camera 1300, for example, by taking a single photograph of one or more substrate holding positions in situ and analyzing the mapping data while the substrate transport device (such as the one described above) is in motion, whether or not the substrates are supported on the end effector 350.

[0031] In one embodiment, the end effector may include any suitable sensor system for mapping and / or detecting a substrate held by or in close proximity to the end effector 350. For example, referring to Figure 13C, in one embodiment, one or more sensors 1350-1355 are mounted at fixed and known positions on the end effector 350 to sense the position / presence and / or notch orientation of the substrate S relative to the end effector 350. The data collected by sensors 1350-1355 is transmitted to, for example, a controller 11091. In one embodiment, the controller 11091 calculates the position of the center of the substrate S and its notch or flat portion before the substrate S is gripped by the end effector 350, a method similar to that described in U.S. Patent No. 8,016,541 issued September 13, 2011, the disclosure of which is incorporated herein by reference in whole. Using position data from sensors 1350 to 1355, the known center of the end effector 130 is positioned directly below the calculated center of the substrate S, and the end effector 350 is raised until the contacts 800A to 800D of the substrate support contact position make contact with the substrate S to pick it up.

[0032] Sensors 1350-1355 can be any suitable type, such as capacitive, optical, acoustic, or ultrasonic sensors. For example, when capacitive sensors are used, the capacitance increases as the sensor moves beneath the wafer. For each sensor, a voltage output proportional to the impedance is generated, and the detected capacitance depends on the distance from sensors 1350-1355 to the bottom surface of the substrate S. This distance may vary if the substrate S is, for example, curved, warped, or tilted within the substrate holding station. Sensors 1350-1355 are positioned on the end effector 350 to pass beneath the substrate S, thereby providing the distance from the end effector to the wafer for picking up the substrate and determining whether a picking error has occurred, as will be described in more detail below. In one embodiment, sensors 1350-1355 may also be used (in addition to or instead of cameras 1300 and / or sensors 360A, 360B) to determine whether there is any curvature, warping, or tilting of the substrate and to improve the robustness of the system.

[0033] Referring to Figure 7A, schematic diagrams of substrates S1 and S2 exhibiting curvature and / or warpage are shown. Here, the substrates are placed in a substrate holding station 700 and spaced apart from each other by a predetermined pitch P. When handling substrates S1 and S2 having curvature and / or warpage characteristics, the teeth 350T1 and 350T2 of the end effector 350 are positioned, for example, at the edges or periphery of substrates S1 and S2 (for example, close to the periphery of substrates S1 and S2) so that the substrates are picked up / placed in the substrate holding station without the teeth 350T1 and 350T2 substantially contacting other substrates. Placing the teeth at the edges of substrates S1 and S2 prevents forcing the flatness of the substrates which may affect the substrate processing. Aspects of the disclosed embodiments provide for positioning the teeth 350T1 and 350T2 in a predetermined location for each substrate S1 and S2 in order to pick up / place the substrates S1 and S2 in the substrate holding station 700. Referring also to Figure 7B, the substrate handling spacings X2, X4, X6, X8 between teeth 350T1, 350T2 for handling large substrates with curved and / or warped characteristics (see Figures 3A-6B) may not be provided for transporting small substrates using the common end effector 350. For illustrative purposes only, the substrates S1, S2 in Figure 7A may be 300 mm substrates, and the teeth may be spaced apart by a distance X2 to transport at least the curved / warped substrate S1. However, the distance X2 between teeth 350T1, 350T2 may interfere with the substrate support of station 710 configured to hold small substrates, such as 200 mm substrates S3, S4, S5. As described above, aspects of the disclosed embodiments provide adjustments of at least one tooth 350T1, 350T2 relative to other teeth 350T1, 350T2 to change the distance between teeth and the substrate support sheet dimension span DS of the substrate contacts 800A to 800D of teeth 350T1, 350T2 for handling substrates S1 to S5 having different curvature, warp, shape, and size characteristics using a common end effector 350.

[0034] Referring to Figures 8A-8C, the teeth 350T1 and 350T2 are movably mounted on the base 350B of the end effector 350 in order to adjust the distance between the teeth 350T1 and 350T2 and the span of the substrate support sheet dimensions between the contacts 800A-800D (also referred herein to as the contact positions of teeth 350T1 and 350T2). In one embodiment, as seen in Figure 8A, the teeth 350T1 and 350T2 are swivelably mounted on the base 350B of the end effector 350 in any suitable manner so that the teeth 350T1 and 350T2 move in the respective directions R1 and R2 to change the distance RX1 between the substrate contact positions 800A and 800B of the teeth 350T1 and 350T2 and the distance RX2 between the substrate contact positions 800C and 800D. In one embodiment, teeth 350T1, 350T2 are driven by a drive section 850 of any suitable end effector 350 so that the distance between teeth 350T1, 350T2 is changed in place (for example, at least one tooth moves relative to the other tooth), thereby changing the substrate support sheet dimension span DS (for example, corresponding to the distance between teeth) that extends between the substrate contacts 800A-800D of teeth 850T1, 850T2. In one embodiment, teeth 350T1, 350T2 are swivelably mounted on a base 350B, and the drive section includes any suitable linear and / or rotary drive components for swiveling one or more of teeth 350T1, 350T2 toward each other and toward the base 350B in order to adjust the distance RX1, RX2 between the substrate contacts 800A-800D of teeth 350T1, 350T2.

[0035] Referring to Figures 8B and 8C, in one embodiment, the teeth 350T1, 350T2 are mounted on the base 350B such that at least one of the teeth 350T1, 350T2 is linearly movable in the D1, D2 directions relative to the other and to the base 350B. Here, the end effector 350 is shown to hold a rectangular substrate SR and a circular substrate SC, but in other embodiments, the substrate may have any suitable shape / size. In this embodiment, the drive section 850 of the end effector 350 includes any suitable linear and / or rotary drive components that enable the movement of one or more teeth 350T1, 350T2. Also referring to Figure 9, in one embodiment, the drive section 850 includes one or more suitable linear guides 900, which include at least one linear guide member 900G and at least one movable member 900M that moves along the linear guide member 900G. In this embodiment, each tooth 350T1, 350T2 is attached to the respective movable member 900M to traverse the linear guide member 900G in the D1, D2 directions. In one embodiment, one or more stoppers 920-923 are provided to restrict the linear movement of the teeth 350T1, 350T2. Although the teeth 350T1, 350T2 are described herein as both movable, in other embodiments, only a single tooth may be movable. The movable member 900M can be driven in any suitable way to traverse the linear guide member 900G.

[0036] Referring to Figures 10A and 10B, in one embodiment, the drive section 850 of the end effector 350 includes a frog leg linkage configured to move teeth 350T1 and 350T2 in directions D1 and D2. For example, the frog leg linkage includes a drive link 370 connected to pivot links 371A and 371B on a rotation axis A1. The pivot links 371A and 371B are connected to their respective driven links 372A and 372B on a rotation axis A3. The pivot links 371A and 371B are swivelably mounted to a base 350B on their respective rotation axes A2A and A2B, and the driven links 372A and 372B are connected to their respective moving members 900M. Any suitable actuator 850A of the drive section 850 is connected to the drive link 370 to reciprocate the drive link 370 in the D3 direction, and as the drive link 370 moves toward teeth 350T1, 350T1, it rotates the pivot links 371A, 371B around axes A2A, A2B, causing the axes A3 of the pivot links 371A, 371B to move toward each other in the R3, R4 directions. As the axes A3 move toward R3, R4, the driven links move toward each other, causing teeth 350T1, 350T2 to move closer to each other and reducing the distance DS between the substrate contacts 800A to 800D of teeth 350T1, 350T2. Conversely, the drive link 370 moves away from teeth 350T1, 350T1 in the D3 direction, causing the pivot links 371A, 371B to rotate around axes A2A, A2B, and the axes A3 of pivot links 371A, 37IB to move away from each other in the R3', R4' directions. As axis A3 moves in the R3', R4' directions, the driven links move further apart from each other, causing teeth 350T1, 350T2 to move further apart, increasing the spacing / distance between teeth 350T1, 350T2, and increasing the distance DS between the substrate contacts 800A to 800D of teeth 350T1, 350T2.

[0037] Referring here to Figures 11A and 11B, in one embodiment, the drive section 850 of the end effector 350 includes a drive linkage having a drive link 370' and driven links 372A', 372B'. The drive link 370' is connected to any suitable actuator 850A in a manner similar to movement in the direction D3. Each driven link 372A', 372B' is connected at one end to the drive link 370' around axis A4 and at the other end to its respective movable member 900M around axis A5. Here, as the drive link 370' moves toward teeth 350T1 and 350T2 in the D3 direction, the movable member 900M moves toward each other in the D1 and D2 directions, causing teeth 350T1 and 350T2 to move further apart, increasing the distance between teeth 350T1 and 350T2 and increasing the distance DS between the substrate contacts 800A to 800D of teeth 350T1 and 350T2. As the drive link 370' moves toward teeth 350T1 and 350T2 in the D3 direction, the movable member 900M moves toward each other in the D1 and D2 directions, bringing teeth 350T1 and 350T2 closer together and decreasing the distance DS between the substrate contacts 800A to 800D of teeth 350T1 and 350T2.

[0038] Referring to Figures 12A and 12B, the drive section 850 of the end effector 350 includes a ball screw drive unit. The ball screw drive unit includes a screw member 1201 attached to the base 350B of the end effector 350. The screw member 1201 includes a drive unit 1200 that connects the screw member 1201 to a suitable actuator 850A via any suitable transmission 1200T (such as a belt, band, cable, or gear), and when driven, the actuator 850A rotates the drive unit 1200 (and thus the screw member 1201) around the longitudinal axis of the screw member 1201. The driven members 1202 and 1203 are attached to the screw member 1201 and are connected to and rotatably fixed to their respective movable members 900M such that when the screw member 1201 rotates, the driven members 1202 and 1203 move along the screw member 1201 in directions D1 and D2, increasing or decreasing the distance between teeth 350T1 and 350T2, and increasing or decreasing the distance DS between the substrate contacts 800A to 800D of teeth 850T1 and 850T2.

[0039] Figures 8A to 82B show an exemplary configuration of the drive section 850, but it should be understood that in other embodiments, the drive section 850 of the end effector 350 may have any suitable configuration to increase or decrease the distance between teeth 350T1 and 350T2, and consequently increase or decrease the distance between the substrate contacts of teeth 350T1 and 350T2.

[0040] During operation, the controller 11091 is configured, for example, in one embodiment, to change in place the distance between teeth 350T1 and 350T2, and consequently the span DS of the substrate support sheet extending between the substrate contacts 800A to 800D of teeth 350T1 and 350T2, while the substrate transport device is moving. In one embodiment, the distance DS can be changed from one substrate to another within the same or different batch of substrates to compensate for one or more predetermined characteristics of individual substrates, where these predetermined characteristics include the amount of curvature of the substrate, the amount of warp of the substrate (where curvature and warp define the flatness of the substrate), the shape of the substrate, and the size of the substrate (e.g., the diameter of a circular substrate, the length / width of a rectangular substrate, etc.). As can be understood, the curvature or warp of a substrate can affect the size of the substrate, and a curved and / or warped substrate may have a smaller size than a substrate of the corresponding nominal size (e.g., a 300 mm curved and / or warped wafer may have a diameter / size smaller than 300 mm). For example, the distance DS can be varied for each substrate for multiple substrates arranged in a common stack (for example, the substrates have a common nominal diameter that varies depending on the curvature and / or warp of the substrate within a given tolerance). In another example, the distance DS can be varied between substrates arranged in different stacks, such that substrates in one stack have a given common nominal diameter, while substrates in another different stack have a different predetermined common nominal diameter (for example, one stack contains 300 mm substrates while another stack contains 200 mm substrates).

[0041] For example, as also referring to Figure 17, in one embodiment, the controller 11091 can move the substrate transport and end effector 350 toward a substrate holding station to pick up a substrate (Figure 17, block 1700). During or simultaneously with the movement toward the substrate holding station (for example, in place within the common movement of the transport device), for example, the camera 1300 and / or sensors 360A, 360B provide the controller 11091 with mapping data for one or more substrates positioned in the substrate holding position (Figure 17, block 1710). If sensors 360A, 360B are employed for mapping, the controller adjusts the teeth 350T1, 350T2 toward the mapping positions shown, for example, in Figures 3A, 4A, 5A, and 6A, where the nominal size of the substrates in the substrate holding station has been provided to the controller 11091 in advance. Mapping data is provided to the controller 11091 while the transporter is moving to the substrate holding station (for example, in place during the common movement of the transporter), and the controller 11091 determines the substrate support sheet dimension span of one or more substrates at the substrate holding station (Figure 17, block 1720). The controller 11091 moves the teeth 350T1, 350T2 of the end effector 350 in place during the common movement to adjust the spacing between the teeth so that the distance DS between the substrate contacts 800A to 800D of the teeth 350T1, 350T2 corresponds to (for example, substantially matches) the determined substrate support sheet dimension span of the substrate to be picked up (Figure 17, block 1730).

[0042] In one embodiment, referring to Figure 9, the movement of teeth 350T1, 350T2 between two positions (for example, defining at least two different substrate support sheet dimension spans) is controlled, for example, by mechanical stoppers 920, 921, 922, 923 of the end effector 350, and its movement is performed by an end drive section 850 of the end effector, which may be under the control of a controller 11091. In one embodiment, the stoppers 920, 921, 922, 923 are located at both ends of the movement of teeth 350T1, 350T2, providing two different substrate support sheet dimension spans.

[0043] In one embodiment, the movement of teeth 350T1, 350T2 may be controlled by any suitable method, such as a controller 11091, to have a variable / reconfigurable substrate support sheet dimension span DS, where the distance DS includes a range of positions, for example, two or more different substrate support sheet dimension span positions, where teeth 350T1, 350T2 engage with the substrate. In one embodiment, referring again to Figures 3A-6B, teeth 350T1, 350T2 have common substrate contacts 800A-800F, each of which engages with the substrate at each of the substrate support sheet dimension span positions. For example, when substrates of substantially similar size are arranged in a stack, the common substrate contacts engage with each substrate in the stack when each substrate S is picked up. In one embodiment, the common substrate contacts (see also contacts 800E, 800F) engage with different substrates, for example, when the substrates are of different sizes and teeth 350T1, 350T2 are positioned at their respective substrate support sheet dimension span positions for substrates of different sizes.

[0044] Referring to Figures 15A and 15B, in one embodiment, the range of different substrate support sheet dimension span positions is brought about by determining the positions of teeth 350T1, 350T2 relative to each other and / or the base (such as a reference feature of the base 350B, where in one embodiment, the reference feature is a known centerline CL of the base 350B) using a controller 11091. In one embodiment, the end effector 350 includes any suitable sensor system for tracking / determining the positions of teeth 350T1, 350T2. Although both teeth 350T1 and 350T2 are described as movable, it should be understood that in some embodiments, only a single tooth may be movable, as described above. In one embodiment, the sensor system includes any suitable sensor 1500, such as capacitive, inductive, or optical. The sensor 1500 interacts with each tooth 350T1, 350T2 in any suitable way to sense the position of each tooth 350T1, 350T2. As can be understood, if the movements of teeth 350T1 and 350T2 are linked via a ball screw, frog leg, or other linkage as described above, and a single drive unit moves both teeth, then the locations of the other teeth 350T1 and 350T2 are automatically known based on the linked movements and predetermined known relationships between teeth 350T1 and 350T2, so a single sensor may be provided to sense the position of one tooth 350T1 or 350T2. In some embodiments, the movements of teeth 350T1 and 350T2 are independent. For example, teeth 350T1 and 350T2 can be moved at different speeds at different times and / or to positions asymmetric with respect to the centerline of the end effector 350. When the movements of teeth 350T1 and 350T2 are independent, sensors may be provided for each tooth that moves independently.

[0045] In one embodiment, one or more teeth 350T1, 350T2 include a sensor track 1510 that forms one or more absolute encoders 1510A and incremental encoders 1510N. A sensor 1500 is positioned on the end effector 350 and, using a controller 11091, senses the sensor track 1510 to determine the relative positions of one or more teeth 350T1, 350T2 or their positions relative to known positions on the end effector, such as the centerline CL of the end effector 350. By determining the positions of the teeth 350T1, 350T2 using the sensor track 1510, the teeth 350T1, 350T2 can be positioned at any location along their range of movement such that the substrate contacts 800A to 800D of the teeth 350T1, 350T2 are positioned at predetermined substrate engagement positions corresponding to substrate support sheet dimension span positions determined for any given substrate.

[0046] In one embodiment, one or more teeth 350T1, 350T2 include one or more flags 1520 that interact with a sensor 1500 using a controller 11091 to determine the position of one or more teeth 350T1, 350T2. In one embodiment, one or more flags 1520 may be arranged to form one or more absolute and incremental encoders so that the position of teeth 350T1, 350T2 can be adjusted over the range of movement of teeth 350T1, 350T2. In another embodiment, the flags may be positioned at predetermined positions corresponding to predetermined substrate support sheet dimension span positions of the end effector. In one embodiment, each flag 1520 may be individually identifiable so that the positioning of teeth 350T1, 350T2 can be performed by sensing only one flag 1520. In other embodiments, the controller 11091 may be configured to "count" (for example, additively or subtractively) the number of flags detected in order to sequentially determine the locations of teeth 350T1 and 350T2.

[0047] In one embodiment, the flags 1520 and / or sensor track 1510 may enable the controller 11091 to perform fault recovery of the end effector 350 of the conveying device in the event of a power loss or emergency stop, for example, within a semiconductor tool station, substantially without human / operator intervention. For example, in one embodiment, the positions of teeth 350T1 and 350T2 determined using the flags 1520 and / or sensor track 1510 are registered in the memory of the controller 11091 in the event of a power loss, and when power is restored, the controller 11091 reads the positions of teeth 350T1 and 350T2 from memory (as they were before the power loss). If the last known positions of teeth 350T1 and 350T2 are registered in the controller 11091, when power is restored, the automatic initialization of the end effector can be disabled so that the end effector continues to operate based on the registered positions of teeth 350T1 and 350T2.

[0048] In one embodiment, when power is restored to the transport device and automatic initialization is provided, the absolute encoder described above (for example, provided by the sensor track 1510 or flag 1520) may provide the positions of teeth 350T1, 350T2 when power is restored. In one embodiment, when the absolute encoder is provided by flag 1520, flag 1520 may include n flags, each flag corresponding to a predetermined substrate support sheet dimension span position of teeth 350T1, 350T2. For example, flag 0 corresponds to the open position of the teeth, flag 1 corresponds to the first substrate support sheet dimension span position, flag 2 corresponds to the second substrate support sheet dimension span position, and flag n corresponds to the nth substrate support sheet dimension span position.

[0049] Referring to Figures 13C, 15A, 15B, and 16, the end effector 350 and controller 11091 are configured to provide a feedback loop for repositioning the end effector 350 and teeth 350T1, 350T2 when a board pick-up error is detected. The controller 11091 positions the end effector 350 in a predetermined location on the board holding station and adjusts the teeth 350T1, 350T2 so that the board support sheet dimension span DS position of the end effector 350 substantially matches the board support sheet dimension span of the board to be picked up. The controller 11091 moves the end effector 350 by a predetermined amount to pick up the board (Figure 16, block 1600). In one embodiment, one or more of the sensors 1350-1355 and / or the camera 1300 transmit a board detection signal to the controller 11091 indicating whether or not a board is present on the end effector 350 (Figure 16, block 1610). In one embodiment, the capacitance or inductance of the sensors 1350-1355, or the image from the camera 1300, may indicate the distance between the sensors 1350-1355 (and thus the board contacts 800A-800D) and the board. If the presence of a board is detected on the end effector, the board is picked up (Figure 16, block 1630), and the position of the board on the end effector is confirmed by any appropriate method, such as using the sensors 1350-1355 and / or the camera 1300 (Figure 16, block 1640).

[0050] If the presence of a substrate is not detected on the end effector 350, the controller performs incremental movement of teeth 350T1, 350T2 to adjust the substrate support sheet dimension span DS position of the end effector 350 (Figure 16, block 1620). In one embodiment, the adjustment of the substrate support sheet dimension span DS position is performed by flag 1520 and / or sensor track 1510, and an absolute scale, incremental scale, or continuous scale provided by flag 1520 and / or sensor track 1510 provides feedback to the control of the position of teeth 350T1, 350T2. The incremental movement of teeth 350T1, 350T2 may be any appropriate predetermined distance. As can be understood, the incremental movement of teeth 350T1, 350T2 may occur after the end effector has been retracted from the substrate holding station and / or after the end effector has returned to its pick-up position (for example, to create a gap between teeth 350T1, 350T2 and the substrate within the substrate holding station). The end effector 350 is repositioned to pick up the substrate (Figure 16, block 1600), and a substrate presence determination is made after the pick-up attempt to determine whether the substrate is present on the end effector 350 (Figure 16, block 1610). If the substrate is present, the substrate is picked up and its position is confirmed (Figure 16, blocks 1630, 1640). If the presence of the substrate is not detected, blocks 1600-1620 are repeated over a predetermined range of movement of teeth 350T1, 350T2, or until the presence of the substrate is detected in block 1610. In one embodiment, if the teeth move within a predetermined range and the presence of a substrate is not detected, an error occurs, and the controller 11091 performs remapping of the substrate holding station in order to determine the cause of the incorrect picking and / or to update the mapping data of the substrate in the substrate holding station.

[0051] Referring again to Figures 1E, 1F and 3A-6B described herein, the controller and end effector 350 are configured to change the distances X1-X8 between teeth 350T1 and 350T2 of the end effector 350, and consequently the distance DS between the substrate contacts 800A and 800C of one tooth 350T1 and the substrate contacts 800B and 800D of other teeth 350T2, based on one or more predetermined characteristics of the substrate being transported (e.g., size, curvature, warp, etc.). As seen in Figures 1E and 1F, the semiconductor tool stations 11090A and 11090B are configured to process substrates of different sizes. For example, substrate S2 has a predetermined nominal size, substrate S1 has a size smaller than the predetermined nominal size of substrate S2, and substrate S3 has a size larger than the predetermined nominal size of substrate S2. In one embodiment, the substrate transport devices 11013 and 11014 each include an end effector 350, while in another embodiment, the substrate transport device located in the chamber 11010 of Figure 1E does not need to include an adjustable end effector 350, for example, when substrates of a single size are processed by the respective processing modules 11030SA to 11030SC.

[0052] In one embodiment, referring to the substrate transport device 11013 and Figure 18 for illustrative purposes, the controller 11091 moves the transport device 11013 to, for example, a substrate holding station 11050S2, where the substrates of the substrate holding station 11050S2 are mapped, and the substrate support sheet dimension span of the substrate is determined in place as described above (Figure 18, block 1800). The teeth 350T1, 350T2 of the end effector 350 are adjusted in place as described above (Figure 18, block 1810). The substrate S2 is picked up from the substrate holding station 11050S2 and transported to, for example, one of the predetermined load lock / transfer chambers 11010 (Figure 18, block 1820). In one embodiment, after the placement of the substrate S2, the controller moves the transport device 11013 to, for example, the substrate holding station 11050S1, where the substrates of the substrate holding station 11050S1 are mapped, and the substrate support sheet dimension span of the substrate is determined in place as described above (Figure 18, block 1800). The teeth 350T1 and 350T2 of the end effector 350 are adjusted in place as described above (Figure 18, block 1810). The substrate S1 is picked up from the substrate holding station 11050S1 and transported to, for example, one of the predetermined load lock / transfer chambers 11010 (Figure 18, block 1820). In one embodiment, after the placement of the substrate S1, the controller moves the transport device 11013 to, for example, the substrate holding station 11050S3, where the substrates of the substrate holding station 11050S3 are mapped, and the substrate support sheet dimension span of the substrate is determined in place as described above (Figure 18, block 1800). The teeth 350T1 and 350T2 of the end effector 350 are adjusted in place as described above (Figure 18, block 1810). The substrate S3 is picked up from the substrate holding station 11050S3 and transported to, for example, one of the predetermined load lock / transfer chambers 11010 (Figure 18, block 1820).

[0053] In one embodiment, referring to the substrate transport device 11013 and Figure 19 for illustrative purposes, the controller 11091 moves the transport device 11013 to, for example, the substrate holding station 11050S2 in order to position the common end effector 350 to the substrate holding station 11050S2 configured to receive / hold a first type of substrate (Figure 19, block 1900). As described above, the substrates of the substrate holding station 11050S2 are mapped and the substrate support sheet dimension span of the substrate is determined in place. The teeth 350T1, 350T2 of the end effector 350 are adjusted in place as described above so that the substrate S2 is picked up from the substrate holding station 11050S2 using the common end effector 350 (Figure 19, block 1910) and transported to and placed in a substrate holding station configured to receive a first type of substrate, such as one of the predetermined load lock / transfer chambers 11010. In one embodiment, after the placement of the substrate S2, the controller moves the transport device 11013 to, for example, the substrate holding station 11050S1 to position the common end effector 350 to the substrate holding station 11050S1 configured to receive / hold a second type of substrate (Figure 19, block 1930). Here, the substrates of the substrate holding station 11050S1 are mapped, and the substrate support sheet dimension span of the substrate is determined in place as described above. The teeth 350T1, 350T2 of the end effector 350 are adjusted in place as described above. The substrate S1 is picked up from the substrate holding station 11050S1 using the common end effector 350 and transported to, for example, one of the predetermined load lock / transfer chambers 11010, configured to receive a second type of substrate (Figure 19, block 1940), and placed there (Figure 19, block 1950). In one embodiment, after the placement of the substrate S1, the controller moves the transport device 11013 to, for example, the substrate holding station 11050S3, in order to position the common end effector to the substrate holding station 11050S3, which is configured to receive / hold a third type of substrate (Figure 19, block 1960).Here, the substrate of the substrate holding station 11050S3 is mapped, and the substrate support sheet dimension span of the substrate is determined in place as described above. The teeth 350T1 and 350T2 of the end effector 350 are adjusted in place as described above. The substrate S3 is picked up from the substrate holding station 11050S3 using the common end effector 350 and transported to a substrate holding station configured to accept a third type of substrate, such as one of the predetermined load lock / transfer chambers 11010 (Figure 19, block 1970), where it is placed (Figure 19, block 1980).

[0054] As can be understood, substrates S1 to S3 of different sizes may be picked up for transport to and from the processing module 11030 in any appropriate order. In one embodiment, if the substrate holding station (such as a substrate cassette placed on the load port 11050) is pre-mapped so that predetermined characteristics of the substrates at that substrate holding station are determined by the controller 11091, then remapping of the substrate holding station may be omitted.

[0055] In one embodiment, the substrate transport device 11014 picks up different substrates S1-S3 from a common substrate holding station such as the load lock 11010 in Figure 1F, and the teeth 350T1 and 350T2 of the end effector 350 of the transport device 11014 are adjusted based on substrate data that has been pre-determined by transporting substrates S1-S3 using the transport device 11013 and recorded in the controller 11091. In one embodiment, the pre-determined substrate data may be verified by the transport device 11014 when picking up substrates S1-S3 from the substrate holding station 11010, so that further adjustments may be made for the teeth 350T1 and 350T2 of the transport device 11014 if necessary. In yet another embodiment, the substrate data (e.g., predetermined characteristics including size, curvature, and warp) may be determined for each pick-up performed by each transport device 11013, 11014.

[0056] According to one or more embodiments of the disclosed embodiments, the substrate processing apparatus is

[0057] Frame and,

[0058] It comprises a frame and at least one board transport arm connected thereto, the at least one board transport arm having at least one end effector, and each end effector is

[0059] A base configured to connect to each board transport arm,

[0060] First and second substrate support teeth attached to and subordinate to the base, wherein at least one of the first and second substrate support teeth is movable relative to the base, and each of the first and second substrate support teeth has its own substrate contact, and each substrate contact is configured to contact and support the substrate held by the end effector between the respective contacts of the first and second substrate support teeth within the substrate support sheet dimension span between the respective substrate contacts of the first and second substrate support teeth,

[0061] It includes an end effector drive section configured to change the distance between first and second substrate support teeth in place, and to change the substrate support sheet dimension span between the substrate contacts of the first and second substrate support teeth from a first substrate support sheet dimension span to a different second substrate support sheet dimension span.

[0062] According to one or more embodiments of the disclosed embodiments, the substrate processing apparatus further includes at least one substrate sensor located on at least one substrate transport arm, the at least one substrate sensor configured to determine the substrate support sheet dimension span in place.

[0063] According to one or more aspects of the disclosed embodiments, at least one substrate sensor is attached to each of the first and second substrate support teeth.

[0064] According to one or more aspects of the disclosed embodiments, the substrate processing apparatus further includes at least one substrate sensor, the at least one substrate sensor including a camera mounted on a base and configured to image one or more substrates at a substrate holding station.

[0065] According to one or more embodiments of the disclosed embodiments, at least one substrate sensor is configured to determine one or more substrate characteristics for each substrate in a substrate holding station.

[0066] According to one or more embodiments of the disclosed embodiments, at least one substrate sensor is configured to determine the substrate support sheet dimension span during mapping of at least one substrate in the substrate holding station and before the lifting operation of at least one substrate transport arm.

[0067] According to one or more aspects of the disclosed embodiments, the substrate contacts of the first and second substrate support teeth include vacuum back contacts.

[0068] According to one or more aspects of the disclosed embodiments, the substrate contacts of the first and second substrate support teeth include passive edge contacts.

[0069] According to one or more aspects of the disclosed embodiments, the substrate contacts of the first and second substrate support teeth include passive back contacts.

[0070] According to one or more aspects of the disclosed embodiments, the substrate processing apparatus further comprises third and fourth substrate support teeth having predetermined characteristics different from the first and second substrate support teeth, the first and second substrate support teeth being detachably connected to a base so as to be interchangeable with the third and fourth substrate support teeth.

[0071] According to one or more aspects of the disclosed embodiments, the predetermined characteristics include different substrate contacts.

[0072] According to one or more aspects of the disclosed embodiments, the first and second substrate support teeth are rotatably mounted to the base.

[0073] According to one or more aspects of the disclosed embodiments, the end effector drive section includes a linear slide that movably connects at least one of the first and second substrate support teeth to the base.

[0074] According to one or more aspects of the disclosed embodiments, the end effector drive section includes a frog leg drive linkage connected to a linear slide and moving at least one of the first and second substrate support teeth.

[0075] According to one or more aspects of the disclosed embodiments, the end effector drive section includes at least one drive link connected to a linear slide and moving at least one of the first and second substrate support teeth.

[0076] According to one or more embodiments of the disclosed embodiments, the end effector drive section includes a ball screw drive unit connected to a linear slide and moving at least one of the first and second substrate support teeth.

[0077] According to one or more embodiments of the disclosed embodiments, the substrate processing apparatus further includes at least one stopper member disposed on a base and restricting the movement of at least one of the first and second substrate support teeth.

[0078] According to one or more embodiments of the disclosed embodiments, the substrate processing apparatus further includes a controller connected to at least one substrate transport arm, the controller,

[0079] Picking up and moving the circuit board transport arm,

[0080] Adjustment of the substrate support sheet dimension span to accommodate substrates with nominal dimensions larger than the specified substrate dimensions, and

[0081] It is configured to perform one or more of the following: adjusting the dimension span of the substrate support sheet to pick up substrates with nominal dimensions smaller than the specified substrate dimensions.

[0082] According to one or more embodiments of the disclosed embodiments, the substrate processing apparatus further comprises a controller connected to at least one substrate transport arm and configured to move at least one of the first and second substrate support teeth to change the substrate support sheet dimension span.

[0083] According to one or more aspects of the disclosed embodiments, the end effector drive section includes an encoder configured to determine the position of at least one of the first and second substrate support teeth relative to a predetermined position of the end effector.

[0084] According to one or more aspects of the disclosed embodiments, the end effector drive section includes one or more flags configured to determine the position of at least one of the first and second substrate support teeth relative to a predetermined position of the end effector.

[0085] According to one or more aspects of the disclosed embodiments, the substrate processing apparatus further includes at least one substrate detection sensor and a controller connected to the at least one substrate detection sensor, the controller configured to repeatedly move at least one of the first and second substrate support teeth relative to the other of the first and second substrate support teeth in response to a null substrate detection signal from the at least one substrate detection sensor during a lifting operation.

[0086] According to one or more embodiments of the disclosed embodiments, the distance between the first and second substrate support teeth is variable to change the substrate support sheet dimension span so that the substrate support sheet dimension span is in the range between a minimum substrate support sheet dimension span and a maximum substrate support sheet dimension span, and so that at least one end effector picks up substrates having a diameter in the range of 100 mm to 450 mm, and curved or warped substrates, using first and second substrate support teeth common to each pick-up.

[0087] According to one or more embodiments of the disclosed embodiments, the substrate processing apparatus is

[0088] Frame and,

[0089] It comprises a frame and at least one board transport arm connected thereto, the at least one board transport arm having at least one end effector, and each end effector is

[0090] A base configured to connect to each board transport arm,

[0091] A gripping portion having first and second substrate support teeth attached to a base and subordinate to the base, wherein at least one of the first and second substrate support teeth is movable relative to the base, each of the first and second substrate support teeth has its own substrate contact, and each substrate contact is configured to support a substrate held by an end effector between the respective substrate contacts of the first and second substrate support teeth within a substrate support sheet dimension span between the first and second substrate support teeth, and the gripping portion has one or more different substrate support sheet dimension spans common to the first and second substrate support teeth,

[0092] The system includes at least one substrate sensor connected to the base and configured to determine the substrate support sheet dimension span between the first and second substrate support teeth from more than one different substrate support sheet dimension span of the gripping portion, wherein the determination of the substrate support sheet dimension span is performed by the operation of only one of the at least one substrate transport arm for picking up and gripping the substrate at the substrate holding station,

[0093] It has an end effector drive section configured to change the distance between first and second substrate support teeth in place based on a determined substrate support sheet dimension span.

[0094] According to one or more aspects of the disclosed embodiments, the determination of the substrate support sheet dimension span is performed simultaneously with the transport arm movement for lifting the substrate from the substrate holding station.

[0095] According to one or more aspects of the disclosed embodiments, at least one substrate sensor is attached to each of the first and second substrate support teeth.

[0096] According to one or more embodiments of the disclosed embodiments, at least one substrate sensor includes a camera mounted on a base and configured to image one or more substrates at a substrate holding station.

[0097] According to one or more embodiments of the disclosed embodiments, at least one substrate sensor is configured to determine one or more substrate characteristics for each substrate in a substrate holding station.

[0098] According to one or more embodiments of the disclosed embodiments, at least one substrate sensor is configured to determine the substrate support sheet dimension span during mapping of at least one substrate in the substrate holding station and before the lifting operation of at least one substrate transport arm.

[0099] According to one or more aspects of the disclosed embodiments, the substrate contacts of the first and second substrate support teeth include vacuum back contacts.

[0100] According to one or more aspects of the disclosed embodiments, the substrate contacts of the first and second substrate support teeth include passive edge contacts.

[0101] According to one or more aspects of the disclosed embodiments, the substrate contacts of the first and second substrate support teeth include passive back contacts.

[0102] According to one or more aspects of the disclosed embodiments, the substrate processing apparatus further comprises third and fourth substrate support teeth having predetermined characteristics different from the first and second substrate support teeth, the first and second substrate support teeth being detachably connected to a base so as to be interchangeable with the third and fourth substrate support teeth.

[0103] According to one or more aspects of the disclosed embodiments, the predetermined characteristics include different substrate contacts.

[0104] According to one or more aspects of the disclosed embodiments, the first and second substrate support teeth are rotatably mounted to the base.

[0105] According to one or more aspects of the disclosed embodiments, the end effector drive section includes a linear slide that movably connects at least one of the first and second substrate support teeth to the base.

[0106] According to one or more aspects of the disclosed embodiments, the end effector drive section includes a frog leg drive linkage connected to a linear slide and moving at least one of the first and second substrate support teeth.

[0107] According to one or more aspects of the disclosed embodiments, the end effector drive section includes at least one drive link connected to a linear slide and moving at least one of the first and second substrate support teeth.

[0108] According to one or more embodiments of the disclosed embodiments, the end effector drive section includes a ball screw drive unit connected to a linear slide and moving at least one of the first and second substrate support teeth.

[0109] According to one or more embodiments of the disclosed embodiments, the substrate processing apparatus further includes at least one stopper member disposed on a base and restricting the movement of at least one of the first and second substrate support teeth.

[0110] According to one or more embodiments of the disclosed embodiments, the substrate processing apparatus further includes a controller connected to at least one substrate transport arm, the controller

[0111] Picking up and moving the circuit board transport arm,

[0112] Adjustment of the relative substrate support sheet dimension span between the first and second substrate support teeth for lifting substrates with nominal dimensions larger than predetermined substrate dimensions, and

[0113] It is configured to perform one or more of the following actions: adjusting the relative span of the substrate support sheet dimensions between the first and second substrate support teeth to pick up a substrate with nominal dimensions smaller than a predetermined substrate dimension.

[0114] According to one or more aspects of the disclosed embodiments, the substrate processing apparatus further includes a controller connected to at least one substrate transport arm and configured to move at least one of the first and second substrate support teeth relative to each other.

[0115] According to one or more aspects of the disclosed embodiments, the end effector drive section includes an encoder configured to determine the position of at least one of the first and second substrate support teeth relative to a predetermined position of the end effector.

[0116] According to one or more aspects of the disclosed embodiments, the end effector drive section includes one or more flags configured to determine the position of at least one of the first and second substrate support teeth relative to a predetermined position of the end effector.

[0117] According to one or more embodiments of the disclosed embodiments, the substrate processing apparatus further comprises at least one substrate detection sensor and a controller connected to the at least one substrate detection sensor, the controller configured to repeatedly move at least one of the first and second substrate support teeth relative to the other of the first and second substrate support teeth in response to a null substrate detection signal from the at least one substrate detection sensor during a lifting operation.

[0118] According to one or more aspects of the disclosed embodiments, the substrate processing apparatus further includes a controller configured to calculate and determine a substrate support sheet dimension span based on signals from at least one substrate sensor, and to adjust the first and second substrate support teeth such that the distance between each substrate contact of the first and second substrate support teeth is substantially the same as the determined substrate support sheet dimension span.

[0119] According to one or more embodiments of the disclosed embodiments, the distance between the first and second substrate support teeth is variable to change the substrate support sheet dimension span so that the substrate support sheet dimension span is in the range between a minimum substrate support sheet dimension span and a maximum substrate support sheet dimension span, and so that at least one end effector picks up substrates having a diameter in the range of 100 mm to 450 mm, and curved or warped substrates, using first and second substrate support teeth common to each pick-up.

[0120] According to one or more embodiments of the disclosed embodiments, a method for processing a substrate is:

[0121] Transporting a substrate of a first size using a common end effector of a substrate transport arm having a variable gripping configuration,

[0122] This includes transporting a substrate having a second size different from a first size using a common end effector.

[0123] According to one or more aspects of the disclosed embodiments, the first size is a nominal substrate dimension greater than or equal to a predetermined substrate dimension, the variable gripping configuration of the common end effector is configured to pick up and transport a substrate having the nominal substrate dimension, and the common end effector is further configured to pick up a substrate having the nominal substrate dimension from a substrate holding station configured for substrates of the first size and to place a substrate having the nominal substrate dimension into a substrate holding station configured for substrates of the first size.

[0124] According to one or more aspects of the disclosed embodiments, the second size is another nominal board dimension smaller than a given board dimension, and the method further includes using a common end effector to place the board of the second size into different board holding stations configured to accept boards of the other nominal board dimension but not boards of the first size.

[0125] According to one or more aspects of the disclosed embodiments, the method further includes changing in place the distance between first and second substrate support teeth of a variable gripping configuration, and changing the substrate support sheet dimension span between the substrate contacts of the first and second substrate support teeth from a first substrate support sheet dimension span to a different second substrate support sheet dimension span.

[0126] According to one or more embodiments of the disclosed embodiments, the method further includes determining the substrate support sheet dimension span of the substrates during mapping of one or more substrates in the substrate holding station, before picking up one or more substrates from the substrate holding station.

[0127] According to one or more embodiments of the disclosed embodiments, the method further includes determining the substrate support sheet dimension span of the substrate in conjunction with the movement of a substrate transport arm for picking up and gripping the substrate from a substrate holding station.

[0128] According to one or more aspects of the disclosed embodiments, the determination of the substrate support sheet dimension span is at least partially performed by the operation of a substrate transport arm for picking up and gripping a substrate from a substrate holding station.

[0129] It should be understood that the foregoing description is merely illustrative of the aspects of the disclosed embodiments. Various alternatives and modifications can be devised by those skilled in the art without departing from the aspects of the disclosed embodiments. Accordingly, the aspects of the disclosed embodiments are intended to encompass all such alternatives, modifications, and variations that fall within the scope of the appended claims. Furthermore, the mere fact that different features are described in different dependent or independent claims does not imply that combinations of these features cannot be used advantageously, and these combinations fall within the scope of the embodiments of the invention.

Claims

1. A method for processing substrates, To provide a substrate processing apparatus, wherein the substrate processing apparatus is A frame positioned to hold a substrate container having stacked substrates inside, A substrate transport arm connected to the frame, wherein the substrate transport arm has an end effector, and the end effector is A base portion configured to connect to the aforementioned substrate transport arm, A gripping portion having first and second substrate support teeth attached to the base, wherein at least one of the first and second substrate support teeth is movable relative to the base, and each of the first and second substrate support teeth has a substrate contact, and the substrate contacts are configured to contact and support the substrate held by the end effector with respect to the substrate, with respect to the substrate sheet span dimension between the respective substrate contacts of the first and second substrate support teeth. A substrate transport arm having To provide a substrate processing apparatus having, Observe the stacked substrates through the side opening of the substrate container and use a camera positioned to image the side profile of each of the stacked substrates to determine one or more amounts of warping and curvature for a selected substrate among the stacked substrates. Using the end effector drive section, based on the determination of one or more amounts of warping and curvature of the selected substrate among the stacked substrates, the arrangement of the first and second substrate support teeth along the reference plane is changed to the selected substrate support sheet span dimension, the end effector is moved to a position inside the carrier directly below the selected substrate among the stacked substrates, and the end effector is moved upward so that the end effector lifts and supports the selected substrate among the stacked substrates, and the selected substrate is moved again from the substrate container. Methods that include...

2. The method according to claim 1, wherein the determination of the substrate support sheet span dimension is performed in place simultaneously with the movement of the transport arm for picking up a substrate from the substrate holding station.

3. The method according to claim 1, wherein the camera is subordinate to the end effector.

4. The method according to claim 1, wherein the mapping of the stacked substrates by the camera for determining one or more of the warps and curvatures of each of the stacked substrates is performed in part by imaging the edges of the substrates.

5. The method according to claim 1, further comprising using the camera to determine one or more substrate characteristics for each substrate at the substrate holding station.

6. The method according to claim 5, further comprising using the camera to determine the substrate support sheet span dimension during mapping of the stacked substrates and before the lifting operation of the substrate transport arm.

7. The method according to claim 1, wherein each of the substrate contacts of the first and second substrate support teeth includes at least one of a vacuum back contact, a passive edge contact, and a passive back contact.

8. The method according to claim 1, further comprising providing third and fourth substrate support teeth having predetermined characteristics different from the first and second substrate support teeth, wherein the first and second substrate support teeth are detachably connected to the base so as to be interchangeable with the third and fourth substrate support teeth.

9. The method according to claim 8, wherein the different predetermined characteristics include different substrate contacts.

10. The method according to claim 1, wherein the first and second substrate support teeth are rotatably mounted to the base.

11. The method according to claim 1, wherein the end effector drive section includes a linear slide that movably connects at least one of the first and second substrate support teeth to the base.

12. The system further includes a controller connected to the aforementioned substrate transport arm, Using the aforementioned controller, Picking up and moving the circuit board transport arm, Adjustment of the relative substrate support sheet span dimensions between the first and second substrate support teeth for picking up substrates with nominal dimensions larger than predetermined substrate dimensions, and Adjustment of the relative substrate support sheet span dimensions between the first and second substrate support teeth for picking up a substrate with nominal dimensions smaller than a predetermined substrate dimension, The method according to claim 1, further comprising performing one or more of the following.

13. The method according to claim 1, further comprising using one or more flags of the end effector drive section to determine the position of at least one of the first and second substrate support teeth relative to a predetermined position of the end effector.

14. The method according to claim 1, further comprising using the camera and a controller connected to the camera to repeatedly move at least one of the first and second substrate support teeth relative to the other of the first and second substrate support teeth in response to a null substrate detection signal from the camera during the lifting operation.

15. The method according to claim 1, further comprising using a controller to calculate and determine the substrate support sheet span dimension based on a signal from the camera, and adjusting the first and second substrate support teeth such that the distance between the respective substrate contacts of the first and second substrate support teeth is substantially the same as the determined substrate support sheet span dimension.

16. The method according to claim 1, wherein the distance between the first and second substrate support teeth is changed in order to change the substrate support sheet span dimension such that the substrate support sheet span dimension is within the range between the minimum substrate support sheet span dimension and the maximum substrate support sheet span dimension, and the end effector picks up substrates having a diameter in the range of 100 mm to 450 mm, and curved or warped substrates, using the first and second substrate support teeth which are common to each pick-up.

17. A frame positioned to hold a substrate container having stacked substrates held inside, A substrate transport arm connected to the frame, wherein the substrate transport arm has an end effector, and the end effector is A base portion configured to connect to the aforementioned substrate transport arm, First and second substrate support teeth attached to and subordinate to the base, wherein at least one of the first and second substrate support teeth is movable relative to the base, and each of the first and second substrate support teeth has a substrate contact, and the substrate contacts are configured such that each substrate contact of the first and second substrate support teeth contacts the substrate held by the end effector and supports the substrate within the substrate support sheet span dimension between the respective substrate contacts. A substrate transport arm having, A camera positioned to observe the stacked substrates through a side opening of the substrate container and to image the side profile of each of the stacked substrates, wherein the image of the side profile of each of the stacked substrates leads to the determination of one or more amounts of warping and curvature for a selected substrate among the stacked substrates; An end effector drive section is configured to change the arrangement of the first and second substrate support teeth along the reference plane to the selected substrate support sheet span dimension based on one or more determinations of warping and curvature, move the end effector to a position inside the substrate container directly below the selected substrate among the stacked substrates, move the end effector upward so that the end effector lifts and supports the selected substrate among the stacked substrates, and move the selected substrate among the stacked substrates back out of the substrate container. A substrate processing apparatus equipped with the following:

18. The substrate processing apparatus according to claim 17, wherein the camera is configured to determine the substrate support sheet span dimension in place.

19. The substrate processing apparatus according to claim 18, wherein the camera is subordinate to the end effector.

20. The substrate processing apparatus according to claim 17, wherein the camera is configured to map the stacked substrates by partially imaging the edges of the substrates in order to determine one or more of the warps and curvatures of each of the stacked substrates.

21. The substrate processing apparatus according to claim 17, wherein the camera is configured to determine one or more substrate characteristics for each of the stacked substrates.

22. The substrate processing apparatus according to claim 21, wherein the camera is configured to determine the substrate support sheet span dimension during mapping of the stacked substrates and before the lifting operation of at least one of the substrate transport arms.

23. The substrate processing apparatus according to claim 17, further comprising third and fourth substrate support teeth having predetermined characteristics different from the first and second substrate support teeth, wherein the first and second substrate support teeth are detachably connected to the base so as to be interchangeable with the third and fourth substrate support teeth.

24. The substrate processing apparatus according to claim 23, wherein the different predetermined characteristics include different substrate contacts.

25. The substrate processing apparatus according to claim 17, wherein the first and second substrate support teeth are rotatably mounted on the base.

26. The substrate processing apparatus according to claim 17, wherein the end effector drive section includes a linear slide that movably connects at least one of the first and second substrate support teeth to the base.

27. The substrate processing apparatus according to claim 26, wherein the end effector drive section further includes at least one drive link connected to the linear slide for moving at least one of the first and second substrate support teeth.

28. The substrate processing apparatus according to claim 26, wherein the end effector drive section further includes a ball screw drive unit connected to the linear slide for moving at least one of the first and second substrate support teeth.

29. The system further comprises a controller connected to at least one of the board transport arms, The aforementioned controller, Picking up and moving the circuit board transport arm, Adjustment of the substrate support sheet span dimension to accommodate substrates with nominal dimensions larger than the specified substrate dimensions, and Adjustment of the substrate support sheet span dimension to handle substrates with nominal dimensions smaller than the specified substrate dimensions. A substrate processing apparatus according to claim 17, configured to perform one or more of the following.

30. The substrate processing apparatus according to claim 17, further comprising a controller connected to at least one of the substrate transport arms and configured to move at least one of the first and second substrate support teeth to change the substrate support sheet span dimension.

31. The substrate processing apparatus according to claim 17, wherein the end effector drive section includes an encoder configured to determine the position of at least one of the first and second substrate support teeth relative to a predetermined position of the end effector.

32. The substrate processing apparatus according to claim 17, wherein the end effector drive section includes one or more flags configured to determine the position of at least one of the first and second substrate support teeth relative to a predetermined position of the end effector.

33. The substrate processing apparatus according to claim 17, further comprising a controller connected to the camera, wherein the controller is configured to repeatedly move at least one of the first and second substrate support teeth relative to the other of the first and second substrate support teeth in response to a null substrate detection signal from the camera during the lifting operation.

34. A substrate processing apparatus according to claim 17, wherein the distance between the first and second substrate support teeth is changed to change the substrate support sheet span dimension such that the substrate support sheet span dimension is within the range between a minimum substrate support sheet span dimension and a maximum substrate support sheet span dimension, and at least one of the end effectors picks up substrates having a diameter in the range of 100 mm to 450 mm, and curved or warped substrates, using the first and second substrate support teeth which are common to each pick-up.

35. The substrate processing apparatus according to claim 17, wherein the movement of the support teeth is performed in place in at least partially coincide with the movement of at least one of the substrate transport arms, thereby moving the end effector as a unit relative to the substrate.

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