Component mounting device and component mounting method

Abstract

The present invention provides a component mounting apparatus and a component mounting method that can appropriately set the standby positions of two mounting heads that repeat the mounting turn. [Solution] When the second mounting turn of the second mounting head 10B starts after the first mounting turn in which the nozzles N1 to N8 of the first mounting head 10A pick up a component and mount it on the substrate B8, the system includes a standby position setting unit that sets a standby position E for the second mounting head 10B to wait during the second mounting turn. The standby position setting unit calculates a safe position F in which the first mounting head 10A is not likely to collide with the second mounting head 10B during the first mounting turn, taking into account the mounting position Q15 of the component P15 mounted during the first mounting turn and the maximum extension position G of the nozzle N5 toward the second mounting head 10B, which is assumed by the allowable holding range TR of the component P15, and determines the standby position E based on the calculated safe position F15.

Description

Technical Field

[0001] The present disclosure relates to a component mounting device and a component mounting method for mounting components on a substrate.

Background Art

[0002] There is known a component mounting device that includes two mounting heads facing each other with a substrate transfer conveyor for transferring a substrate therebetween, and mounts components on the substrate alternately with the two mounting heads (for example, Patent Document 1). When components are mounted alternately with the two mounting heads, the standby position of the mounting head is set so that the other mounting head does not interfere while one mounting head is mounting a component on the substrate. In Patent Document 1, a standby position is set outside the substrate transfer conveyor, and an electronic component mounting device is disclosed in which the standby position is changed according to the transfer width when changing the transfer width of the substrate transfer conveyor according to the width of the substrate. The electronic component mounting device described in Patent Document 1 can shorten the time until the standby mounting head moves to the mounting position of the substrate by changing the standby position according to the width of the substrate.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, in the prior art including Patent Document 1, although the working efficiency for substrates having different widths is improved, there are the following problems due to the setting of a fixed standby position determined by the width of the substrate. That is, depending on the mounting position of the component held by one mounting head, etc., there are cases where the standby position of the other mounting head can be brought closer to the side of one mounting head than the fixed standby position, and there is room for further improvement in order to improve the working efficiency.

[0005] Therefore, the present disclosure aims to provide a component mounting apparatus and a component mounting method that can appropriately set the standby positions of two mounting heads that repeat the mounting turn. [Means for solving the problem]

[0006] The component mounting apparatus of this disclosure includes a first mounting head and a second mounting head positioned opposite each other across a substrate transport conveyor, and is a component mounting apparatus that mounts components on a substrate transported by the substrate transport conveyor by repeatedly performing a first mounting turn in which the component holder of the first mounting head picks up a component and mounts it on the substrate, and a second mounting turn in which the component holder of the second mounting head picks up a component and mounts it on the substrate, and includes a standby position setting unit that sets a standby position for the second mounting head to wait in the middle of the second mounting turn when the second mounting turn is started after the first mounting turn, and the standby position setting unit calculates a safe position in which there is no risk of collision with the standby second mounting head even if the first mounting head is positioned closest to the second mounting head in the first mounting turn, taking into consideration the mounting position of the component to be mounted in the first mounting turn and the maximum extension position of the component holder toward the second mounting head as assumed by the allowable holding range of the component, and determines the standby position based on the calculated safe position.

[0007] The component mounting method of the present disclosure includes a first mounting head and a second mounting head positioned opposite each other across a substrate transport conveyor, and is a component mounting method in a component mounting apparatus that repeatedly performs a first mounting turn in which a component is picked up by a component holder of the first mounting head and mounted on the substrate, and a second mounting turn in which a component is picked up by a component holder of the second mounting head and mounted on the substrate, thereby mounting components on a substrate transported by the substrate transport conveyor, and includes a standby position setting step in which a standby position is set in which the second mounting head waits during the second mounting turn when the second mounting turn is started after the first mounting turn, and a standby step in which the second mounting head waits at the standby position in which the second mounting head waits until priority is set for the second mounting head if the first mounting head has priority in the second mounting turn. [Effects of the Invention]

[0008] According to this disclosure, the standby positions of the two mounting heads that repeat the implementation turn can be appropriately set. [Brief explanation of the drawing]

[0009] [Figure 1] A plan view showing the configuration of the main part of a component mounting device according to one embodiment of the present disclosure. [Figure 2] A perspective view showing the configuration of the main part of a mounting head used in a component mounting device according to one embodiment of the present disclosure. [Figure 3] A block diagram showing the configuration of the control system of a component mounting device according to one embodiment of the present disclosure. [Figure 4] An explanatory diagram of an example of component data used in a component mounting device according to one embodiment of the present disclosure. [Figure 5] (a) an explanatory diagram of the permissible holding range of a component mounted on a substrate in a component mounting device according to one embodiment of the present disclosure; (b) an explanatory diagram of component information; and (c) an explanatory diagram of another example of component information. [Figure 6] (a) an explanatory diagram of the permissible holding range of a component mounted on a substrate in a component mounting device according to one embodiment of the present disclosure; (b) an explanatory diagram of component information; and (c) an explanatory diagram of another example of component information. [Figure 7] A diagram illustrating an example of a mounting program used in a component mounting device according to one embodiment of the present disclosure. [Figure 8] An explanatory diagram of an example of a mounting turn in a component mounting device according to one embodiment of the present disclosure. [Figure 9] An explanatory diagram of a standby position set in a component mounting device according to one embodiment of the present disclosure when the safety position is on the opposite head side of the fixed standby position. [Figure 10] An explanatory diagram of an example of a mounting turn in a component mounting device according to one embodiment of the present disclosure. [Figure 11] An explanatory diagram of a standby position set in a component mounting device according to one embodiment of the present disclosure when the safety position is closer to the head than the fixed standby position. [Figure 12] An explanatory diagram of a standby position set in a component mounting device according to one embodiment of the present disclosure when the safety position is closer to the head than the fixed standby position. [Figure 13] An explanatory diagram of an example of a mounting head standby position setting screen displayed on a display unit of a component mounting device according to one embodiment of the present disclosure. [Figure 14] Flowchart of a component mounting method according to one embodiment of the present disclosure [Figure 15] (a) Diagram illustrating the independent mounting mode (fully independent) in a component mounting device according to one embodiment of the present disclosure; (b) Diagram illustrating the independent mounting mode (proximity to transport lane); (c) Diagram illustrating the alternating mounting mode (dual transport); (d) Diagram illustrating the alternating mounting mode (single transport). [Modes for carrying out the invention]

[0010] Hereinafter, an embodiment of the present disclosure will be described in detail with reference to the drawings. The configurations, shapes, etc. described below are illustrative examples for explanation, and can be appropriately changed according to the specifications of the component mounting device and the mounting head. In the following, the same reference numerals are given to corresponding elements in all the drawings, and redundant explanations are omitted. In FIG. 1 and in part of the description below, as two axes orthogonal to each other in the horizontal plane, the X-axis in the substrate conveyance direction (the left-right direction in FIG. 1) and the Y-axis orthogonal to the substrate conveyance direction (the up-down direction in FIG. 1) are shown. In FIG. 1 and in part of the description below, the Z-axis (the up-down direction in FIG. 2) is shown as the height direction orthogonal to the horizontal plane.

[0011] First, referring to FIG. 1, the configuration of the component mounting device 1 will be described. At the upper center of the base 2, a first substrate conveyance unit 3A and a second substrate conveyance unit 3B that convey the substrate B along the X-axis from the upstream (left side of the paper) to the downstream (right side of the paper) are arranged apart in the Y-axis direction. Hereinafter, in the Y-axis direction, the side where the first substrate conveyance unit 3A is arranged is referred to as the front (lower side of the paper), and the side where the second substrate conveyance unit 3B is arranged is referred to as the rear (upper side of the paper).

[0012] The first substrate conveyance unit 3A includes a pair of first substrate conveyance conveyors 4A that convey the substrate B. The second substrate conveyance unit 3B includes a pair of second substrate conveyance conveyors 4B that convey the substrate B. The first substrate conveyance conveyor 4A and the second substrate conveyance conveyor 4B each convey, hold, and deliver the substrate B from the upstream to the downstream to an adjacent device. The first substrate conveyance conveyor 4A and the second substrate conveyance conveyor 4B are changed in position in the Y-axis direction by a conveyor movement mechanism (not shown) according to the width (length in the Y-axis direction) of the substrate B to be conveyed. Hereinafter, when there is no need to distinguish between the first substrate conveyance conveyor 4A and the second substrate conveyance conveyor 4B, they are simply referred to as "substrate conveyance conveyor 4".

[0013] In FIG. 1, a first component supply unit 5A is arranged in front of the first substrate transfer unit 3A in the component mounting apparatus 1, and a second component supply unit 5B is arranged behind the second substrate transfer unit 3B. A plurality of component supply units 6 (tape feeders) are mounted on the upper parts of the first component supply unit 5A and the second component supply unit 5B. The component supply unit 6 supplies components to the component supply position by pitch-feeding a carrier tape formed with pockets for storing components from the outside of the component supply unit (the first component supply unit 5A, the second component supply unit 5B) in the direction (tape feed direction) toward the substrate transfer unit (the first substrate transfer unit 3A, the second substrate transfer unit 3B).

[0014] In FIG. 1, a first Y-direction moving unit 7A having a linear drive mechanism is arranged along the Y-axis downstream of the base 2 in the X-axis direction, and a first Y-direction guide 8A is arranged along the Y-axis upstream. A first beam 9A having a linear drive mechanism similarly is movably coupled to the first Y-direction moving unit 7A along the Y-axis. The first beam 9A is arranged along the X-axis and is supported by the first Y-direction guide 8A on the upstream side. A first mounting head 10A is movably mounted on the first beam 9A along the X-axis. The first Y-direction moving unit 7A and the first beam 9A constitute a first mounting head moving unit 11A that moves the first mounting head 10A along the X-axis and the Y-axis.

[0015] A second Y-direction moving unit 7B having a linear drive mechanism is arranged along the Y-axis upstream of the base 2 in the X-axis direction, and a second Y-direction guide 8B is arranged along the Y-axis downstream. A second beam 9B having a linear drive mechanism similarly is movably coupled to the second Y-direction moving unit 7B along the Y-axis. The second beam 9B is arranged along the X-axis and is supported by the second Y-direction guide 8B on the downstream side. A second mounting head 10B is movably mounted on the second beam 9B along the X-axis. The second Y-direction moving unit 7B and the second beam 9B constitute a second mounting head moving unit 11B that moves the second mounting head 10B along the X-axis and the Y-axis.

[0016] In Figure 1, the first mounting head 10A and the second mounting head 10B are positioned at the same height, facing each other across the substrate transport conveyor 4. The first mounting head 10A is located at the front, and the second mounting head 10B is located at the rear. The first mounting head 10A can move above the substrate B transported by the first substrate transport conveyor 4A, as well as above the substrate B transported by the second substrate transport conveyor 4B. Similarly, the second mounting head 10B can move above the substrate B transported by the second substrate transport conveyor 4B, as well as above the substrate B transported by the first substrate transport conveyor 4A.

[0017] Here, with reference to Figure 2, the configurations of the first mounting head 10A and the second mounting head 10B will be described. Hereafter, unless it is necessary to distinguish between the first mounting head 10A and the second mounting head 10B, they will simply be referred to as "mounting head 10". Below the mounting head 10, a plurality of spindles 12 are arranged that move up and down along the Z axis and rotate around the Z axis. A holder 13 is positioned at the lower end of each spindle 12. Each holder 13 is fitted with a component holder 14 for holding components such as suction nozzles.

[0018] Figure 2 shows a contact-flat type mounting head 10 equipped with eight spindles 12, four in the X-axis direction and two in the Y-axis direction. Hereinafter, the component mounting device 1 will be described using an example where a first mounting head 10A and a second mounting head 10B are both contact-flat type mounting heads 10 equipped with eight component holders 14 (four in the X-axis direction and two in the Y-axis direction). Note that the mounting head 10 is not limited to a contact-flat type equipped with eight component holders 14. For example, the mounting head 10 may have 16 or 4 component holders 14, or it may be a rotary type with multiple component holders 14 arranged concentrically.

[0019] In Figure 1, the first mounting head 10A picks up components supplied to the component supply position of the component supply unit 6 mounted on the first component supply unit 5A with the component holder 14 and performs a first mounting turn in which it places the components at the mounting position on the substrate B transported by the first substrate transport conveyor 4A or the second substrate transport conveyor 4B. The second mounting head 10B picks up components supplied to the component supply position of the component supply unit 6 mounted on the second component supply unit 5B with the component holder 14 and performs a second mounting turn in which it places the components at the mounting position on the substrate B transported by the second substrate transport conveyor 4B or the first substrate transport conveyor 4A.

[0020] In Figure 1, a first component camera 15A, which images upwards, is positioned on the upper surface of the base 2 between the first component supply unit 5A and the first substrate transport unit 3A. A second component camera 15B, which images upwards, is positioned between the second component supply unit 5B and the second substrate transport unit 3B. The first component camera 15A images the component held by the component holder 14 when the first mounting head 10A, which has picked up the component, moves upwards during the first mounting turn. The second component camera 15B images the component held by the component holder 14 when the second mounting head 10B, which has picked up the component, moves upwards during the second mounting turn.

[0021] The imaging results are processed by image recognition to detect the holding position of each component held by the component holder 14. In the first and second mounting turns, the position of the mounting head 10 when mounting the components to the mounting position is corrected based on the holding position of the components held by the component holder 14.

[0022] Next, with reference to Figure 3, the configuration of the control system of the component mounting device 1 will be described. The component mounting device 1 has the function of mounting components onto the substrate B transported by the substrate transport conveyor 4 by repeatedly performing a first mounting turn and a second mounting turn. Here, we will mainly describe the function of safely and efficiently performing component mounting work by keeping the first mounting head 10A or the second mounting head 10B in standby position during the first mounting turn or the second mounting turn.

[0023] The control unit 20 of the component mounting device 1 is connected to a first substrate transport unit 3A, a second substrate transport unit 3B, a component supply unit 6, a first mounting head 10A, a second mounting head 10B, a first mounting head moving unit 11A, a second mounting head moving unit 11B, a first component camera 15A, a second component camera 15B, and an operation unit 16. The operation unit 16 includes a display unit 17 that displays various information and screens, a touchscreen 18 (input unit) that accepts input of various information, and the like.

[0024] In Figure 3, the control unit 20 includes a storage unit 21 and a component mounting operation execution unit 26. The storage unit 21 is a memory device that stores mounting data 22, component data 23, equipment data 24, setting data 25, etc. The mounting data 22 stores a mounting program that includes information necessary for component mounting work, such as the size of the board B, the type and mounting position (XY coordinates) of the components to be mounted, the supply position of the components in the component supply unit, and the position of the component holder 14 that picks up the components in the mounting head 10, for each type of mounting board, as well as information related to the operating mode (independent mounting mode, alternating mounting mode, etc.).

[0025] The component data 23 stores information for each type of component, such as the size, shape, allowable holding range, and type of component holder 14 that holds the component. The equipment data 24 stores various parameters related to the component mounting device 1. The equipment data 24 includes, for example, the position of the spindle 12 on the mounting head 10, and the dimensions and shape of the component holding surface of the component holder 14. The setting data 25 stores information set by operations from the operation unit 16. The setting data 25 includes, for example, information on whether or not to allow the standby position of the mounting head 10, set using the mounting head position setting screen, to be set above the substrate B held by the substrate transport conveyor 4.

[0026] In Figure 3, the component mounting operation execution unit 26 controls each unit connected to the control unit 20 based on various information stored in the memory unit 21 to perform the component mounting operation to mount components onto the circuit board B. The component mounting operation execution unit 26 includes a first mounting head control unit 27, a second mounting head control unit 28, a mounting head priority setting unit 29, and a standby position setting unit 30 as internal processing units.

[0027] The first mounting head control unit 27 controls the first mounting head 10A and the first mounting head movement unit 11A based on various information stored in the storage unit 21, as well as the standby position set by the standby position setting unit 30. The second mounting head control unit 28 controls the second mounting head 10B and the second mounting head movement unit 11B based on various information stored in the storage unit 21, as well as the standby position set by the standby position setting unit 30.

[0028] Now, with reference to Figure 15, the operating modes of the component mounting device 1 will be explained. First, with reference to Figures 15(a) and 15(b), the independent mounting mode will be explained. In the independent mounting mode, components are mounted on substrates B1 and B3 transported by the first substrate transport conveyor 4A during the first mounting turn (arrows a1, a3) of the first mounting head 10A, and components are mounted on substrates B2 and B4 transported by the second substrate transport conveyor 4B during the second mounting turn (arrows a2, a4) of the second mounting head 10B.

[0029] Figure 15(a) shows a case where the distance between the first substrate transport conveyor 4A and the second substrate transport conveyor 4B is wide, and even if the first mounting turn and the second mounting turn are performed completely independently, there is no possibility of collision (interference) between the first mounting head 10A and the second mounting head 10B (completely independent). Figure 15(b) shows a case where the distance between the first substrate transport conveyor 4A and the second substrate transport conveyor 4B is narrow (dotted rectangle b), and even if the first mounting turn and the second mounting turn are performed completely independently, there is a possibility of collision between the first mounting head 10A and the second mounting head 10B (close proximity of transport lanes).

[0030] Next, the alternating mounting mode will be explained with reference to Figures 15(c) and 15(d). In the alternating mounting mode, components are mounted to substrates B5 to B7 transported by the first substrate transport conveyor 4A or the second substrate transport conveyor 4B by alternating first mounting turns of the first mounting head 10A and second mounting turns of the second mounting head 10B.

[0031] Figure 15(c) shows the case where the first substrate transport conveyor 4A and the second substrate transport conveyor 4B each transport substrates B5 and B6, and the first mounting turn of the first mounting head 10A (arrows a5, a6) and the second mounting turn of the second mounting head 10B (arrows a7, a8) are performed alternately for each substrate B5 and B6 (dual transport). Figure 15(d) shows the case where only the first substrate transport conveyor 4A transports substrate B7, and the first mounting turn of the first mounting head 10A (arrow a9) and the second mounting turn of the second mounting head 10B (arrow a10) are performed alternately for substrate B7 transported by the first substrate transport conveyor 4A (single transport).

[0032] In alternating mounting mode, the first mounting head 10A and the second mounting head 10B advance (enter) above the same substrate B5~B7, so there is a possibility that the first mounting head 10A and the second mounting head 10B will collide. In both the independent mounting mode (close proximity to the transport lane) and the alternating mounting mode, where there is a possibility of collision between the first mounting head 10A and the second mounting head 10B, the standby position setting unit 30 sets a standby position for each mounting turn. Then, the first mounting head control unit 27 and the second mounting head control unit 28 control the first mounting head movement unit 11A and the second mounting head movement unit 11B based on the set standby position to prevent collision between the first mounting head 10A and the second mounting head 10B.

[0033] Next, an example of part data 23 will be described with reference to Figure 4. For each part type 40, part data 23 includes part dimensions 41 (length L, width W, thickness H), terminal information 42, allowable holding range information 43, part holder information 44, etc. Terminal information 42 includes the number of terminals, arrangement, and terminal dimensions of leaded parts. Part holder information 44 includes information on the type of part holder 14 used to hold the parts.

[0034] Next, the allowable holding range TR set for a part will be explained with reference to Figures 5 and 6. Figure 5 shows a part with part type 40 "P15", and Figure 6 shows a part with part type 40 "P26". Hereafter, a part with part type 40 "P15" will be referred to as "part P15", etc.

[0035] In Figure 5(a), component P15 is a leaded component having four lead terminals. The dimensions of the main body of component P15 are length L15, width W15, and thickness H15. The reference point when mounting component P15 on board B is set to the component center CP. The allowable holding range TR is set to a length L15a and width W15a including the component center CP (Figure 5(b)). The allowable holding range TR is the range of the center position of the component holder 14 that is allowed when the component holder 14 holds component P15 (allowable deviation of the holding position).

[0036] If the center of the component holder 14 that picked up component P15 is outside the allowable holding range TR of component P15, component P15 may fall from the component holder 14 while being transported to the mounting position on the substrate B. Therefore, if the center of the component holder 14 is outside the allowable holding range TR of component P15 (i.e., the amount of deviation in the holding position is outside the allowable range), component P15 held by the component holder 14 is discarded into a component waste box (not shown) placed on the base 2, and component P15 is picked up again.

[0037] Figure 5(c) shows another embodiment of the allowable holding range information 43 of the part data 23. In this other embodiment, instead of the dimensions of the allowable holding range TR shown in Figure 5(b) (length L15a, width W15a), an allowable holding range coefficient TN (0.6) is set as the allowable holding range information 43. In this case, the allowable holding range TR is calculated based on the part dimensions 41 and the allowable holding range coefficient TN. Specifically, the length L15a and width W15a of the allowable holding range TR are calculated by multiplying the length L15 and width W15 of the allowable holding range TR by the allowable holding range coefficient TN, respectively.

[0038] In Figure 6(a), component P26 is a chip component without lead terminals. Similar to component P15, the reference point for mounting component P26 on board B is set to the component center CP. Other than that, the allowable retention range TR and allowable retention range coefficient TN are the same as for component P15, and a detailed explanation is omitted.

[0039] Next, with reference to Figure 7, an example of an assembly program included in the assembly data 22 will be described. The assembly program includes component name information 46, mounting position information 47, supply position information 48, head information 49, spindle number information 50, component holder information 44, turn number information 51, etc., for each mounting order 45. The mounting order 45 is the order in which components are mounted on substrate B. The component name information 46 is information that identifies the component to be mounted on substrate B and includes information linked to the component type 40 of the component data 23. For example, a component name that includes characters indicating the component type 40 is used. The mounting position information 47 is information that specifies the mounting position (X coordinate, Y coordinate) and orientation (θ direction) of the component on substrate B.

[0040] The supply position information 48 is information regarding the supply position of the component in the component mounting device 1 (such as the mounting position of the component supply unit 6). The head information 49 is information that specifies the mounting head 10 to be used in the component mounting operation. In this example, "A" indicates that the first mounting head 10A is specified, and "B" indicates that the second mounting head 10B is specified. The spindle number information 50 is information that specifies the position of the spindle 12 of the mounting head used in the component mounting operation. The component holder information 44 is information regarding the type of component holder 14 used in the component mounting operation. The turn number information 51 is the order of the mounting turns in which components are mounted on the substrate B.

[0041] Figure 7 shows an example of a mounting program used in component mounting operations where components are mounted on a substrate B8 transported by a second substrate transport conveyor 4B in alternating mounting mode (dual transport). For example, when the mounting order 45 is in the order of "65" to "72", it indicates that in the "N-1"th mounting turn (turn number information 51 is "N-1"), the component identified by component name information 46 is mounted at the mounting position specified by mounting position information 47 by the first mounting turn of the first mounting head 10A (head information 49 is "A").

[0042] Now, referring to Figure 8, we will describe the first mounting turn of the first mounting head 10A in the "N-1" mounting turn of the mounting program shown in Figure 7. First, the first mounting head 10A picks up parts P11 to P18 supplied from the parts supply unit 6 attached to the first parts supply unit 5A using each of the parts holders 14 attached to the holders 13 of the eight spindles 12 with spindle numbers S1 to S8. Hereafter, the parts holder 14 attached to the holder 13 of spindle 12 with spindle number S5 will be referred to as "nozzle N5" (see Figure 9).

[0043] Next, the first mounting head 10A moves above the first component camera 15A, and the first component camera 15A images the components P11 to P18 held by the nozzles N1 to N8. The component mounting work execution unit 26 detects the holding positions of the components P11 to P18 held by the nozzles N1 to N8 based on the imaging results. Next, the first mounting head 10A moves above the substrate B8 held on the second substrate transport conveyor 4B, corrects the stopping positions of the nozzles N1 to N8 based on the holding positions of the components P11 to P18 held by the nozzles N1 to N8, and mounts the components P11 to P18 at the mounting positions Q11 to Q18 on the substrate B8.

[0044] Next, with reference to Figure 9, the process of setting the standby position E by the standby position setting unit 30 will be explained. Here, the standby position E of the second mounting head 10B, which is set for the second mounting turn of the "N"th second mounting head 10B that starts after the first mounting turn of the "N-1"th first mounting head 10A in the implementation program shown in Figure 7, will be explained as an example.

[0045] First, the standby position setting unit 30 determines a safe position F in which there is no risk of collision with the standby second mounting head 10B, even if the first mounting head 10A is positioned furthest toward the second mounting head 10B during the first mounting turn. Specifically, the standby position setting unit 30 calculates safe positions F11 to F18 for each nozzle N1 to N8 based on the mounting positions Q11 to Q18 of the components P11 to P18 to be mounted during the "N-1" first mounting turn, and the allowable holding range TR of the components P11 to P18. Then, the standby position setting unit 30 determines the safe position F11 to F18 that is furthest toward the second mounting head 10B (opposing head side) among the calculated safe positions F11 to F18 as the safe position F in which there is no risk of collision with the standby second mounting head 10B.

[0046] In the example shown in Figure 9, the safety position F15 calculated for nozzle N5 that holds component P15 is the closest to the second mounting head 10B, and safety position F15 is set as the safety position F of the second mounting head 10B in the "N"th second mounting turn. The mounting position Q15 of component P15 is the closest to the second mounting head 10B (opposing head side). Also, component P15 is held by nozzle N5 in the row of nozzles N1 to N8 arranged in two rows on the first mounting head 10A, the row furthest from the second mounting head 10B (own head side).

[0047] In Figure 9, the standby position setting unit 30 calculates the maximum extension position G at which the nozzle N5 extends furthest toward the opposing head, assuming that the holding position of the nozzle N5 that holds the part P15 is shifted furthest toward the opposing head. That is, it assumes that the center of the nozzle N5 is located furthest toward the opposing head within the allowable holding range TR of the part P15.

[0048] If the holding position of nozzle N5 shifts towards the opposing head, the nozzle N5 that holds component P15 is moved towards the opposing head by the amount of the shift in the holding position, and nozzle N5 is lowered onto substrate B8 so that component P15 is mounted on substrate B8 such that the component center CP of component P15 becomes the mounting position Q15. Therefore, the maximum extension position G of nozzle N5 is the position obtained by adding the allowable holding range TR of the opposing head to the mounting position Q15 of component P15.

[0049] In Figure 9, the standby position setting unit 30 calculates the safe position F15 by considering the maximum extension position G of the nozzle N5, the position of the nozzle N5 on the first mounting head 10A, the size of the first mounting head 10A, and the safety margin M to prevent collision between the first mounting head 10A and the second mounting head 10B.

[0050] A first fixed standby position JA is set in front of the first substrate transport conveyor 4A (not shown). A second fixed standby position JB is set in front of the second substrate transport conveyor 4B. In other words, fixed standby positions J (the first fixed standby position JA and the second fixed standby position JB) are set outside the substrate transport conveyors 4 (the first substrate transport conveyor 4A and the second substrate transport conveyor 4B).

[0051] In the example shown in Figure 9, the calculated safety position F is located behind the second fixed standby position JB. The standby position setting unit 30 sets the safety position F to standby position E if the safety position F is located on the opposite head side of the fixed standby position J (second fixed standby position JB).

[0052] In this manner, the standby position setting unit 30 sets a standby position E for the second mounting head 10B to be in standby position during the second mounting turn if the second mounting turn starts after the first mounting turn. Specifically, the standby position setting unit 30 calculates a safe position F15 by considering the mounting position Q15 of the component P15 mounted in the first mounting turn and the maximum extension position G of the nozzle N5 (component holder 14) toward the second mounting head 10B (opposing head), which is assumed to be determined by the allowable holding range TR of the component P15, and sets the calculated safe position F15 as the standby position E.

[0053] Next, with reference to Figures 10 to 12, other examples of the standby position E set by the standby position setting unit 30 will be described. Figure 10 schematically shows the first mounting turn of the first mounting head 10A in the "N+1"th mounting turn of the mounting program shown in Figure 7. The first mounting head 10A picks up components P21 to P28 supplied from the component supply unit 6 mounted on the first component supply unit 5A with nozzles N1 to N8, and mounts the components P21 to P28 at mounting positions Q21 to Q28 on the substrate B8 based on the holding positions of the components P21 to P28 held by nozzles N1 to N8 detected from the image captured by the first component camera 15A.

[0054] In Figure 11, among the safety positions F21 to F28 calculated for each nozzle N1 to N8 in the "N+1"th first mounting turn, the safety position F26 for nozzle N6 that holds component P26 is located furthest towards the second mounting head 10B (opposing head side). Therefore, the standby position setting unit 30 determines the safety position F26, calculated by considering the mounting position Q26 of component P26 mounted in the first mounting turn and the maximum extension position G of nozzle N6 toward the opposing head side, which is assumed by the allowable holding range TR of component P25, as the safety position F of the second mounting head 10B in the "N+1"th first mounting turn.

[0055] In Figures 11 and 12, the safety position F calculated for the "N+1" first mounting turn is located in front of (towards the head) the second fixed standby position JB. When setting the standby position E, the standby position setting unit 30 first refers to the setting data 25 and determines whether or not the second fixed standby position JB is registered to be used as standby position E for the second mounting head 10B.

[0056] If it is registered that the second fixed standby position JB will be used as standby position E, the standby position setting unit 30 sets the second fixed standby position JB as standby position E (Figure 11). If it is registered that the second fixed standby position JB will not be used as standby position E, the standby position setting unit 30 sets the calculated safety position F (safety position F26) as standby position E (Figure 12).

[0057] Thus, if the safety position F (safety position F26) is on the substrate transport conveyor 4 side or above the substrate B8 beyond the substrate transport conveyor 4, the standby position setting unit 30 refers to the setting data 25 stored in the storage unit 21.

[0058] If the system is set to use fixed standby position J as standby position E (fixed standby position priority), the standby position setting unit 30 sets fixed standby position J as standby position E (Figure 11). If the system is set not to use fixed standby position J as standby position E (safety position priority), the standby position setting unit 30 sets safety position F as standby position E, even if safety position F is closer to the substrate transport conveyor 4 than fixed standby position J or is above substrate B8 beyond the substrate transport conveyor 4 (Figure 12).

[0059] Next, the registration of setting data 25 by the mounting head priority setting unit 29 will be explained with reference to Figure 13. Figure 13 shows an example of the mounting head standby position setting screen 60 displayed on the display unit 17 of the operation unit 16 by the mounting head priority setting unit 29. The mounting head standby position setting screen 60 displays the first mounting head setting field 61, the second mounting head setting field 62, the back button 63, and the register button 64. The first mounting head setting field 61 and the second mounting head setting field 62 are provided with checkboxes 61a and 62a, respectively. The first mounting head setting field 61 and the second mounting head setting field 62 are set to indicate whether or not to allow the first mounting head 10A and the second mounting head 10B to wait above the substrate.

[0060] If checkbox 61a in the first mounting head setting section 61 is not checked, the first mounting head 10A is set to "fixed standby position priority," which does not allow it to wait above the circuit board. If checkbox 61a in the first mounting head setting section 61 is checked, the first mounting head 10A is set to "safe position priority," which allows it to wait above the circuit board. Similarly, if checkbox 62a in the second mounting head setting section 62 is not checked, the second mounting head 10B is set to "fixed standby position priority." If checkbox 62a in the second mounting head setting section 62 is checked, the second mounting head 10B is set to "safe position priority."

[0061] In Figure 13, when the back button 63 is pressed, the screen of the display unit 17 returns to the previous display. When the registration button 64 is pressed, the mounting head priority setting unit 29 stores setting data 25 in the storage unit 21 that corresponds to the settings of checkbox 61a in the first mounting head setting field 61 and checkbox 62a in the second mounting head setting field 62. In the example in Figure 13, setting data 25 is stored in which the first mounting head 10A is set to "safe position priority" and the second mounting head 10B is set to "fixed standby position priority". In this way, the setting data 25 is stored separately for the first mounting head 10A and the second mounting head 10B.

[0062] Furthermore, when the operating mode is independent mounting mode (proximity to transport lane) (Figure 15(b)) or alternating mounting mode (Figures 15(c), 15(d)), the mounting head priority setting unit 29 determines, based on the mounting program, which of the first mounting head 10A and the second mounting head 10B has priority to advance onto the substrate B and mount the component, and stores the priority information in the setting data 25. The mounting head priority setting unit 29 updates the priority information stored in the setting data 25 each time a mounting turn is completed.

[0063] Next, the component mounting method in the component mounting device 1 will be explained following the flow chart in Figure 14. In the component mounting device 1, based on various information stored in the memory unit 21, the first mounting turn of the first mounting head 10A by the first mounting head control unit 27 and the second mounting turn of the second mounting head 10B by the second mounting head control unit 28 are executed in parallel. The processing related to the first mounting head 10A by the first mounting head control unit 27 and the processing related to the second mounting head 10B by the second mounting head control unit 28 are similar, and the following explanation will mainly focus on the processing related to the first mounting head 10A.

[0064] In Figure 14, first, the first mounting head control unit 27 acquires the mounting program for the first mounting turn from the mounting data 22 (ST1A: Turn data acquisition process). Next, the first mounting head control unit 27 controls the first mounting head moving unit 11A to move the first mounting head 10A to the component supply position of the component supply unit 6 attached to the first component supply unit 5A (ST2A: Component supply position movement process). Next, the first mounting head control unit 27 controls the first mounting head 10A to pick up the component with the nozzle N1 (component holder 14) (ST3A: Component pickup process). Next, the first mounting head control unit 27 repeatedly executes the component supply position movement process (ST2A) and the component pickup process (ST3A) to hold the component in each of the nozzles N1 to N8 of the first mounting head 10A.

[0065] Next, the mounting head control unit 27 controls the first mounting head movement unit 11A and the first component camera 15A to capture images of the components held by the nozzles N1 to N8 using the first component camera 15A (ST4A: component imaging step). The holding position of the components held by the nozzles N1 to N8 is detected from the captured images. Next, the mounting head control unit 27 determines whether or not the first mounting head 10A has priority based on the priority information stored in the setting data 25 (ST5A: priority determination step).

[0066] In Figure 14, if the first mounting head 10A has priority (Yes in ST5A), the first mounting head control unit 27 controls the first mounting head 10A and the first mounting head moving unit 11A to move the first mounting head 10A above the substrate B and mount the components held by the nozzles N1 to N8 to the mounting position (ST7A: component mounting process).

[0067] If the first mounting head 10A does not have priority (No in ST5A), the first mounting head control unit 27 controls the first mounting head moving unit 11A to move the first mounting head 10A to the waiting position E set in the waiting position setting step (ST10B) for processing related to the second mounting head 10B (ST6A: waiting step). The first mounting head 10A stops and waits at the waiting position E until the second mounting turn by the second mounting head 10B is completed and priority is set to the first mounting head 10A.

[0068] In Figure 14, after the turn data acquisition process (ST1A), the standby position setting unit 30 calculates the maximum extension position G of nozzles N1 to N8 based on the mounting position of the component to be mounted in the first mounting turn and the allowable holding range TR of the component included in the component data 23 (ST9A: maximum extension position calculation process). Next, considering the calculated maximum extension position G of nozzles N1 to N8, the standby position setting unit 30 sets a standby position E in which the second mounting head 10B will be in standby position during the second mounting turn if the second mounting turn is started after the first mounting turn (ST10A: standby position setting process).

[0069] Specifically, in the standby position setting step (ST10A), the standby position setting unit 30 considers the maximum extension position G of the nozzles N1 to N8 and calculates a safe position F in which there is no risk of collision with the standby second mounting head 10B even if the first mounting head 10A is positioned closest to the second mounting head 10B during the first mounting turn, and determines the standby position E based on the calculated safe position F.

[0070] For example, in the standby position setting step (ST10A), if the safety position F is on the opposing head side of the fixed standby position J, the safety position F is set to standby position E (Figure 9). Also, in the standby position setting step (ST10A), if the safety position F is on the substrate transport conveyor 4 side of the fixed standby position J or above the substrate B beyond the substrate transport conveyor 4, if the first mounting head 10A is set to prioritize the fixed standby position, the fixed standby position J is set to standby position E (Figure 11), and if the first mounting head 10A is set to prioritize the safety position, the safety position F is set to standby position E (Figure 12).

[0071] The standby position E of the second mounting head 10B, set in the standby position setting step (ST10A), is used in the standby step (ST6B) for processing related to the second mounting head 10B. Specifically, if the first mounting head 10A has priority in the second mounting turn (No in ST5B), the second mounting head 10B waits at standby position E (ST6B) until priority is set for the second mounting head 10B (Yes in ST5B).

[0072] In Figure 14, if there is a next first mounting turn after the component mounting process (ST7A) (Yes in ST8A), the process returns to the turn data acquisition process (ST1A) and the next first mounting turn is executed. Also, based on the mounting position of the component to be mounted in the next first mounting turn and the allowable holding range TR of the component included in the component data 23, the maximum advance position calculation process (ST9A) and the standby position setting process (ST10A) are executed. If there is no next first mounting turn (No in ST8A), the second mounting turn ends (No in ST8B), and when the component mounting operation is completed (Yes in ST11), the component mounting work on substrate B is completed.

[0073] As explained above, this disclosure discloses the following technical concepts.

[0074] (Technology 1) A component mounting device 1 includes a first mounting head 10A and a second mounting head 10B positioned opposite each other across a substrate transport conveyor 4 (first substrate transport conveyor 4A, second substrate transport conveyor 4B), and repeatedly performs a first mounting turn in which the component holder 14 of the first mounting head 10A picks up a component and places it on the substrate B, and a second mounting turn in which the component holder 14 of the second mounting head 10B picks up a component and places it on the substrate, thereby mounting a component on a substrate B transported by the substrate transport conveyor 4. The system includes a standby position setting unit 30 that sets a standby position E for the second mounting head 10B to be in standby position during the second mounting turn if the second mounting turn starts after the first mounting turn. The component mounting device 1 calculates a safe position F that prevents collision with the standby second mounting head 10B even if the first mounting head 10A is positioned closest to the second mounting head 10B during the first mounting turn, taking into account the mounting positions Q11 to Q18 of the components P11 to P18 mounted during the first mounting turn and the maximum extension position G of the component holder 14 toward the second mounting head 10B, which is assumed to be determined by the allowable holding range TR of the components, and determines the standby position E based on the calculated safe position F.

[0075] This allows for the appropriate setting of the standby positions E of the two mounted heads 10 that repeat the implementation turn.

[0076] (Technology 2) Outside the substrate transport conveyor 4 (first substrate transport conveyor 4A, second substrate transport conveyor 4B), a fixed standby position J is set. The component mounting device 1 according to Technical Reference 1, wherein the standby position setting unit 30 sets the fixed standby position J to the standby position E if the safety position F is on the substrate transport conveyor 4 side or above the substrate B beyond the substrate transport conveyor 4 than the fixed standby position J.

[0077] This allows the standby position E of the two mounted heads 10 that repeat the implementation turn to be set to a fixed standby position J.

[0078] (Technology 3) It has a storage unit 21 that stores setting data 25 that sets whether or not to use the fixed standby position J as standby position E, The component mounting device 1 described in Technical Reference 2, wherein the standby position setting unit 30 refers to the setting data 25 and, if the setting is not to use the fixed standby position J as standby position E, sets the safety position F to standby position E even if the safety position F is closer to the substrate transport conveyor 4 than the fixed standby position J or above the substrate B beyond the substrate transport conveyor 4.

[0079] This allows the standby position E of the two mounting heads 10 that repeat the implementation turn to be set to the safe position F.

[0080] (Technology 4) The component mounting apparatus 1 described in Technical Reference 3 has setting data 25 stored separately in the first mounting head 10A and the second mounting head 10B.

[0081] This allows the standby position E to be appropriately set separately for the first mounting head 10A and the second mounting head 10B.

[0082] (Technology 5) A component mounting method in a component mounting apparatus 1, which includes a first mounting head 10A and a second mounting head 10B positioned opposite each other across a substrate transport conveyor 4 (first substrate transport conveyor 4A, second substrate transport conveyor 4B), and which repeatedly performs a first mounting turn in which the component holder 14 of the first mounting head 10A picks up a component and mounts it on the substrate B, and a second mounting turn in which the component holder 14 of the second mounting head 10B picks up a component and mounts it on the substrate B, thereby mounting a component on a substrate B transported by the substrate transport conveyor 4, If the second implementation turn starts after the first implementation turn, a standby position setting step (ST10A) is performed to set a standby position E for the second mounting head 10B to wait during the second implementation turn, A component mounting method comprising: a waiting step (ST6B) in which, if the first mounting head 10A has priority in the second mounting turn (No in ST5B), the second mounting head 10B waits at the waiting position E until priority is set for the second mounting head 10B.

[0083] This allows for the appropriate setting of the standby positions E of the two mounted heads 10 that repeat the implementation turn.

[0084] (Technology 6) The component mounting method described in Technical Reference 5, wherein in the standby position setting step (ST10A), a safe position F is calculated that will not collide with the standby second mounting head 10B even if the first mounting head 10A is positioned closest to the second mounting head 10B during the first mounting turn, taking into account the mounting positions Q11 to Q18 of the components P11 to P18 mounted during the first mounting turn and the maximum extension position G of the component holder 14 toward the second mounting head 10B, which is assumed by the allowable holding range TR of the components P11 to P18, and the standby position E is determined based on the calculated safe position F.

[0085] This allows for the appropriate setting of the standby positions E of the two mounted heads 10 that repeat the implementation turn. [Industrial applicability]

[0086] The component mounting apparatus and component mounting method of this disclosure have the effect of being able to appropriately set the standby positions of two mounting heads that repeat the mounting turn, and are useful in the field of mounting components onto a substrate. [Explanation of Symbols]

[0087] 1. Component mounting device 4. Circuit board transport conveyor 4A First circuit board transport conveyor 4B Second circuit board transport conveyor 10 mounted heads 10A First mounted head 10B Second mounted head 14. Parts holder B, B1~B8 board E Standby position F, F15, F26 safe position G Maximum advance position J Fixed standby position Parts P11-P18, P21-P28 Q11~Q18, Q21~Q28 mounting position TR Allowable Holding Range

Claims

1. A component mounting device that includes a first mounting head and a second mounting head positioned opposite each other across a substrate transport conveyor, and repeatedly performs a first mounting turn in which the component holder of the first mounting head picks up a component and mounts it on the substrate, and a second mounting turn in which the component holder of the second mounting head picks up a component and mounts it on the substrate, thereby mounting a component on a substrate transported by the substrate transport conveyor, The system includes a standby position setting unit that sets a standby position for the second mounting head to be in standby position during the second mounting turn when the second mounting turn is started after the first mounting turn. The standby position setting unit calculates a safe position in which there is no risk of collision with the standby second mounting head even if the first mounting head is positioned closest to the second mounting head during the first mounting turn, taking into consideration the mounting position of the component to be mounted during the first mounting turn and the maximum extension position of the component holder toward the second mounting head, which is assumed to be determined by the allowable holding range of the component, and determines the standby position based on the calculated safe position, in a component mounting device.

2. A fixed standby position is set outside the aforementioned substrate transport conveyor. The component mounting device according to claim 1, wherein the standby position setting unit sets the fixed standby position to the standby position if the safety position is on the substrate transport conveyor side or above the substrate beyond the substrate transport conveyor than the fixed standby position.

3. The system has a storage unit that stores setting data for whether or not to use the fixed standby position as the standby position, The component mounting device according to claim 2, wherein the standby position setting unit refers to the setting data and, if the fixed standby position is set not to be used as the standby position, sets the safety position to the standby position even if the safety position is closer to the substrate transport conveyor than the fixed standby position or above the substrate beyond the substrate transport conveyor.

4. The component mounting apparatus according to claim 3, wherein the setting data is stored separately for the first mounting head and the second mounting head.

5. A component mounting device comprising a first mounting head and a second mounting head positioned opposite each other across a substrate transport conveyor, wherein a first mounting turn is performed, in which a component is picked up by the component holder of the first mounting head and mounted on the substrate, and a second mounting turn is performed, in which a component is picked up by the component holder of the second mounting head and mounted on the substrate, is repeatedly executed to mount components on a substrate transported by the substrate transport conveyor, A standby position setting step is performed to set a standby position for the second mounting head to wait during the second mounting turn when the second mounting turn is started after the first mounting turn, A component mounting method comprising: a waiting step in which, if the first mounting head has priority in the second mounting turn, the second mounting head waits at the waiting position until priority is set for the second mounting head.

6. The component mounting method according to claim 5, wherein in the standby position setting step, a safe position is calculated, in which there is no risk of collision with the standby second mounting head even if the first mounting head is positioned closest to the second mounting head during the first mounting turn, taking into consideration the mounting position of the component to be mounted during the first mounting turn and the maximum extension position of the component holder toward the second mounting head, which is assumed to be determined by the allowable holding range of the component, and the standby position is determined based on the calculated safe position.

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