Manufacturing methods for electronic components

Abstract

The present invention provides a method for manufacturing electronic components that can suppress damage to the cutting marks. [Solution] The method for manufacturing the coil component 1 includes the steps of forming a laminate 100 which is formed by stacking a plurality of laminate layers and which has cutting marks 102 exposed from an opening 104 that opens on the outer surface 100S of the laminate 100, and cutting the laminate 100 based on the cutting marks 102.

Description

Technical Field

[0001] This disclosure relates to a method for manufacturing electronic components.

Background Art

[0002] In Patent Document 1, in a method for manufacturing an electronic component having a laminate in which a plurality of insulator layers are laminated and including an electronic element made of a conductor layer, a first step of producing a mother laminate in which a plurality of laminates are arranged in a matrix and a cut mark is provided on the main surface, and a second step of cutting the mother laminate into a plurality of laminates based on the cut mark are provided. In the first step, when viewed in plan from the lamination direction, in the laminate overlapping the cut mark, a conductor layer having a shape different from that of the conductor layer of the laminate not overlapping the cut mark and having a shape overlapping the entire cut mark is formed. A method for manufacturing an electronic component is disclosed.

Prior Art Documents

Patent Documents

[0003] [[ID=2l]]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In the above method for manufacturing an electronic component, the cutting mark (cut mark) is provided protruding from the surface on the surface of the mother laminate. In this case, in the manufacturing process of the electronic component, if the cutting mark comes into contact with manufacturing equipment or the like, the cutting mark may be damaged.

[0005] One aspect of this disclosure aims to provide a method for manufacturing an electronic component that can suppress damage to the cutting mark.

Means for Solving the Problems

[0006] (1) A method for manufacturing an electronic component relating to one aspect of the present disclosure includes the steps of forming a laminate formed by stacking a plurality of laminate layers, the laminate having cutting marks exposed from openings that open to the outer surface of the laminate, and cutting the laminate based on the cutting marks.

[0007] In one aspect of the present disclosure, a method for manufacturing electronic components is used in the process of forming a laminate, in which a cutting mark is exposed from an opening that opens on the outer surface of the laminate. In this way, because the cutting mark is located within the opening, it is possible to prevent the cutting mark from coming into contact with manufacturing equipment or other objects during the manufacturing process of the electronic component. Therefore, it is possible to prevent damage to the cutting mark in the method for manufacturing electronic components.

[0008] (2) In the method for manufacturing electronic components described in (1) above, in the step of forming a laminate, when the cutting marks are viewed in cross-section in the stacking direction of multiple laminate layers, the width of the first surface exposed from the opening may be made larger than the width of the second surface which is opposite to the first surface in the stacking direction. In this method, the visibility of the cutting marks can be ensured because the width of the first surface exposed from the opening is made wider. Also, because the width of the second surface is made smaller, the volume of the cutting marks can be reduced.

[0009] (3) In the method for manufacturing electronic components described in (1) or (2) above, in the step of forming a laminate, a plurality of laminate layers including a conductor pattern are stacked to form a laminate, and the cut marks and the conductor pattern may be formed from the same material. With this method, the cut marks can be formed using the material used to form the conductor pattern, without having to prepare a separate material for forming the cut marks. Therefore, an increase in the cost of manufacturing the cut marks can be avoided. In addition, by forming the cut marks and the conductor pattern from the same material, the cut marks and the conductor pattern can be formed in the same process (timing). Therefore, the manufacturing process can be simplified.

[0010] (4) In any one of the methods for manufacturing electronic components described in (1) to (3) above, the color tone of the outer surface of the laminate and the color tone of the cutting marks may be made different in the step of forming the laminate. In this method, if the surface of the laminate (the laminate layer where the cutting marks are located) at the opening is not exposed (not exposed), the distinction between the cutting marks and the outer surface of the laminate can be made clearer by making the color tones of the outer surface of the laminate and the cutting marks different. Therefore, the cutting marks can be confirmed more reliably in the step of cutting the laminate.

[0011] (5) In any one of the methods for manufacturing electronic components described in (1) to (3) above, in the step of forming a laminate, the color tone of the surface of the laminate layer where the cutting mark is located, which is exposed from the opening, may be made different from the color tone of the cutting mark. In this method, if a large portion of the surface of the laminate (the laminate layer where the cutting mark is located) is exposed at the opening, the distinction between the cutting mark and the surface can be made clearer by making the color tones of the surface and the cutting mark different. Therefore, the cutting mark can be confirmed more reliably in the step of cutting the laminate.

[0012] (6) In any one of the methods for manufacturing electronic components described in (1) to (5) above, in the step of forming a laminate, the depth of the openings in the stacking direction of the multiple laminate layers may be greater than or equal to the thickness of the cutting marks in the stacking direction. In this method, since the cutting marks are positioned at a deep location in the openings of the laminate, it is possible to more reliably prevent the cutting marks from coming into contact with manufacturing equipment during the manufacturing process of electronic components.

[0013] (7) In any one of the methods for manufacturing an electronic component described in (1) to (5) above, in the step of forming a laminate, the depth of the openings in the stacking direction of the multiple laminate layers may be made smaller than the thickness of the cutting marks in the stacking direction. In this method, the cutting marks are positioned close to the outer surface of the laminate, so the visibility of the cutting marks can be ensured.

[0014] (8) In the method for manufacturing any one of the electronic components described in (1) to (7) above, in the step of forming a laminate, the length of the cutting marks may be made larger than the opening dimensions of the openings when viewed from the stacking direction of the multiple laminate layers.

[0015] (9) In any one of the methods for manufacturing an electronic component described in (1) to (8) above, the process of forming the laminate may involve making the opening and the cutting marks into different shapes.

[0016] (10) In any one of the methods for manufacturing electronic components described in (1) to (9) above, in the step of forming a laminate, a plurality of laminate layers including a conductor pattern are stacked to form a laminate, and the cutting marks and the conductor pattern may be formed on the same laminate layer. In this method, the conductor pattern and the cutting marks are arranged in the same position (layer). This makes it possible to set the position of the cutting marks in relation to the conductor pattern that is placed in the part that will become the electronic component in the method for manufacturing electronic components. Therefore, the positional accuracy of the cutting marks relative to the conductor pattern can be improved in the method for manufacturing electronic components. [Effects of the Invention]

[0017] According to one aspect of this disclosure, damage to the cutting marks can be suppressed. [Brief explanation of the drawing]

[0018] [Figure 1] This is a perspective view of a coil component manufactured by a manufacturing method for electronic components according to one embodiment. [Figure 2] Figure 2 is an exploded perspective view of the coil component shown in Figure 1. [Figure 3] Figure 3 is a side view of the coil component shown in Figure 1. [Figure 4] Figure 4 is a flowchart showing the manufacturing method of a coil component. [Figure 5] Figures 5(a), 5(b), 5(c), 5(d), 5(e), 5(f), 5(g), and 5(h) show the cutting marks and openings. [Figure 6] FIG. 6 is a view of the laminate seen from above. [Figure 7] FIG. 7 is a diagram schematically showing a part of the cross section of the laminate. [Figure 8] FIG. 8(a) is a diagram showing the cutting position of the cutting mark, and FIG. 8(b) is a diagram showing the cross-sectional configuration of the cutting mark. [Figure 9] FIGS. 9(a), 9(b), 9(c), 9(d), 9(e), 9(f) and 9(g) are diagrams showing the cutting marks of the coil component according to another embodiment. [Figure 10] FIG. 10 is a diagram schematically showing a part of the cross section of the laminate according to another embodiment. [Figure 11] FIG. 11 is a diagram schematically showing a part of the cross section of the laminate according to another embodiment. [Figure 12] FIG. 12 is a diagram schematically showing a part of the cross section of the laminate according to another embodiment. [Figure 13] FIG. 13 is a diagram schematically showing a part of the cross section of the laminate according to another embodiment. [Figure 14] FIGS. 14(a), 14(b), 14(c), 14(d), 14(e) and 14(f) are diagrams showing the cutting marks and openings according to a modification.

Embodiments for Carrying Out the Invention

[0019] Hereinafter, preferred embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. In the description of the drawings, the same or corresponding elements are denoted by the same reference numerals, and overlapping descriptions are omitted.

[0020] FIG. 1 is a perspective view of a coil component manufactured by a method for manufacturing an electronic component according to an embodiment. As shown in FIG. 1, the coil component (electronic component) 1 includes a rectangular parallelepiped-shaped body 2 and a pair of terminal electrodes 4 and 5. The pair of terminal electrodes 4 and 5 are respectively arranged at both ends of the body 2. The rectangular parallelepiped shape includes a rectangular parallelepiped shape with chamfered corners and ridge lines, and a rectangular parallelepiped shape with rounded corners and ridge lines.

[0021] The base body 2 has a pair of opposing end faces 2a, 2b, a pair of opposing main faces 2c, 2d, and a pair of opposing side faces 2e, 2f. The direction in which the pair of main faces 2c, 2d face each other, i.e., the direction parallel to the end faces 2a, 2b, is the first direction D1. The direction in which the pair of end faces 2a, 2b face each other, i.e., the direction parallel to the main faces 2c, 2d, is the second direction D2. The direction in which the pair of side faces 2e, 2f face each other is the third direction D3. In this embodiment, the first direction D1 is the height direction of the base body 2. The second direction D2 is the longitudinal direction of the base body 2 and is perpendicular to the first direction D1. The third direction D3 is the width direction of the base body 2 and is perpendicular to the first direction D1 and the second direction D2.

[0022] A pair of end faces 2a and 2b extend in a first direction D1 to connect a pair of main faces 2c and 2d. The pair of end faces 2a and 2b also extend in a third direction D3, i.e., in the direction of the shorter sides of the pair of main faces 2c and 2d. A pair of side faces 2e and 2f extend in a first direction D1 to connect a pair of main faces 2c and 2d. The pair of side faces 2e and 2f also extend in a second direction D2, i.e., in the direction of the longer sides of the pair of end faces 2a and 2b. The coil component 1 is solder-mounted to electronic equipment (e.g., a circuit board or electronic components). In the coil component 1, the main face 2c constitutes the mounting surface facing the electronic equipment.

[0023] As shown in Figure 2, the base body 2 is constructed by stacking multiple insulating layers (laminated layers) 6 in the third direction D3. The base body 2 has multiple stacked insulating layers 6. In the base body 2, the direction in which the multiple insulating layers 6 are stacked coincides with the third direction D3. In the actual base body 2, each insulating layer 6 is integrated to such an extent that the boundaries between each insulating layer 6 are not visible.

[0024] Each insulating layer 6 is formed of a dielectric material containing a glass component. That is, the base body 2 contains a dielectric material containing a glass component as a compound of the elements constituting the base body 2. The glass component is, for example, borosilicate glass. The dielectric material is a dielectric ceramic such as BaTiO3, Ba(Ti,Zr)O3, or (Ba,Ca)TiO3. Each insulating layer 6 is composed of a sintered body of a ceramic green sheet containing a glass ceramic material.

[0025] As shown in Figure 3, the base body 2 has recesses 7 and 8. Recess 7 is provided on the end face 2a side of the base body 2. Recess 7 is a space recessed inward from the outer surface of the base body 2. Recess 7 has a shape corresponding to the shape of the terminal electrode 4. In this embodiment, recess 7 is L-shaped when viewed from the third direction D3. Recess 8 is provided on the end face 2b side of the base body 2. Recess 8 is a space recessed inward from the outer surface of the base body 2. Recess 8 has a shape corresponding to the shape of the terminal electrode 5. In this embodiment, recess 8 is L-shaped when viewed from the third direction D3.

[0026] As shown in Figure 3, each terminal electrode 4 and 5 is embedded in the base body 2. Terminal electrode 4 is located on the end face 2a side of the base body 2. Terminal electrode 4 is located in the recess 7 of the base body 2. Terminal electrode 5 is located on the end face 2b side of the base body 2. Terminal electrode 5 is located in the recess 8 of the base body 2.

[0027] Terminal electrode 4 is arranged across the end face 2a and the main face 2c. Terminal electrode 5 is arranged across the end face 2b and the main face 2c. In this embodiment, the surface of terminal electrode 4 is substantially flush with the end face 2a and the main face 2c, respectively. The surface of terminal electrode 5 is substantially flush with the end face 2b and the main face 2c, respectively.

[0028] The terminal electrode 4 has an L-shape when viewed from the third direction D3. The terminal electrode 4 has multiple electrode portions 4a and 4b. In this embodiment, the terminal electrode 4 has a pair of electrode portions 4a and 4b. Electrode portions 4a and 4b are connected at the edges of the main body 2 and are electrically connected to each other. In this embodiment, electrode portions 4a and 4b are integrally formed. Electrode portion 4a extends along the first direction D1. Electrode portion 4a has a rectangular shape when viewed from the second direction D2. Electrode portion 4b extends along the second direction D2. Electrode portion 4b has a rectangular shape when viewed from the first direction D1. Each electrode portion 4a and 4b extends along the third direction D3.

[0029] As shown in Figure 2, the terminal electrode 4 is constructed by stacking multiple electrode layers 10 and multiple electrode layers 11. In this embodiment, the number of electrode layers 10 is "2" and the number of electrode layers 11 is "4". The electrode layers 10 are positioned to sandwich the electrode layers 11 in the third direction D3.

[0030] Each electrode layer 10 is provided in a defect formed in the corresponding insulator layer 6. The defect constitutes a recess 7. The electrode layer 10 is formed by firing a conductive paste. The conductive paste contains a metal component. The metal component is contained in the conductive material and is, for example, Ag or Pd. The conductive paste may also contain a glass component. The glass component is a compound of the elements that make up the base material 2 and may be the same component as the glass component contained in the base material 2. The content of the glass component can be set as appropriate. Each electrode layer 10 has an L-shape when viewed from a third direction D3. The electrode layer 10 has layer portions 10a and 10b. Layer portion 10a extends along the first direction D1. Layer portion 10b extends along the second direction D2.

[0031] Each electrode layer 11 is provided in a defect formed in the corresponding insulator layer 6. The defect constitutes a recess 7. The electrode layer 11 is formed by firing a conductive paste. The conductive paste contains a conductive material. The conductive material is, for example, Ag or Pd. Each electrode layer 11 has an L-shape when viewed from a third direction D3. The electrode layer 11 has layer portions 11a and 11b. Layer portion 11a extends along the first direction D1. Layer portion 11b extends along the second direction D2.

[0032] The electrode portion 4a is constructed by stacking the layer portions 10a and 11a of each electrode layer 10 and 11. In electrode portion 4a, the layer portions 10a and 11a are integrated to such an extent that the boundaries between them are not visible. The electrode portion 4b is constructed by stacking the layer portions 10b and 11b of each electrode layer 10 and 11. In electrode portion 4b, the layer portions 10b and 11b are integrated to such an extent that the boundaries between them are not visible.

[0033] As shown in Figure 3, the terminal electrode 5 has an L-shape when viewed from the third direction D3. The terminal electrode 5 has multiple electrode portions 5a and 5b. In this embodiment, the terminal electrode 5 has a pair of electrode portions 5a and 5b. Electrode portions 5a and 5b are connected at the edges of the main body 2 and are electrically connected to each other. In this embodiment, electrode portions 5a and 5b are integrally formed. Electrode portion 5a extends along the first direction D1. Electrode portion 5a has a rectangular shape when viewed from the second direction D2. Electrode portion 5b extends along the second direction D2. Electrode portion 5b has a rectangular shape when viewed from the first direction D1. Each electrode portion 5a and 5b extends along the third direction D3.

[0034] As shown in Figure 2, the terminal electrode 5 is constructed by stacking multiple electrode layers 12 and multiple electrode layers 13. In this embodiment, the number of electrode layers 12 is "2" and the number of electrode layers 13 is "4". The electrode layers 12 are positioned to sandwich the electrode layers 13 in the third direction D3.

[0035] Each electrode layer 12 is provided in a defect formed in the corresponding insulator layer 6. The defect constitutes a recess 8. The electrode layers 12 are formed by firing a conductive paste. The conductive paste contains a metal component. The metal component is contained in the conductive material and is, for example, Ag or Pd. The conductive paste may also contain a glass component. The glass component is a compound of the elements that make up the base material 2 and may be the same component as the glass component contained in the base material 2. Each electrode layer 12 has an L-shape when viewed from a third direction D3. The electrode layer 12 has layer portions 12a and 12b. Layer portion 12a extends along the first direction D1. Layer portion 12b extends along the second direction D2.

[0036] Each electrode layer 13 is provided in a defect formed in the corresponding insulator layer 6. The defect constitutes a recess 8. The electrode layer 13 is formed by firing a conductive paste. The conductive paste contains a conductive material. The conductive material is, for example, Ag or Pd. Each electrode layer 13 has an L-shape when viewed from a third direction D3. The electrode layer 13 has layer portions 13a and 13b. Layer portion 13a extends along the first direction D1. Layer portion 13b extends along the second direction D2.

[0037] The electrode portion 5a is constructed by stacking the layer portions 12a and 13a of each electrode layer 12 and 13. In the electrode portion 5a, the layer portions 12a and 13a are integrated to such an extent that the boundaries between them are not visible. The electrode portion 5b is constructed by stacking the layer portions 12b and 13b of each electrode layer 12 and 13. In the electrode portion 5b, the layer portions 12b and 13b are integrated to such an extent that the boundaries between them are not visible.

[0038] The coil component 1 comprises a coil 9 located within the body 2, as shown in Figure 3. The coil axis AX of the coil 9 extends along a third direction D3.

[0039] As shown in Figure 2, coil 9 has a first coil conductor 22, a second coil conductor 23, a third coil conductor 24, and a fourth coil conductor 25. The first coil conductor 22, the second coil conductor 23, the third coil conductor 24, and the fourth coil conductor 25 are arranged in the order of first coil conductor 22, second coil conductor 23, third coil conductor 24, and fourth coil conductor 25 along the third direction D3. The first coil conductor 22, the second coil conductor 23, the third coil conductor 24, and the fourth coil conductor 25 have a shape in which a part of the loop is interrupted and have one end and the other end. The first coil conductor 22, the second coil conductor 23, the third coil conductor 24, and the fourth coil conductor 25 are formed with a predetermined width.

[0040] The first coil conductor 22 is located in the same layer as one electrode layer 11 and one electrode layer 13. The first coil conductor 22 is connected to the electrode layer 13 via a connecting conductor 26. The connecting conductor 26 is located in the same layer as the first coil conductor 22. One end of the first coil conductor 22 is connected to the connecting conductor 26. The connecting conductor 26 is connected to layer portion 13a. The connecting conductor 26 connects the first coil conductor 22 and the electrode layer 13. The connecting conductor 26 may also be connected to layer portion 13b. The first coil conductor 22 is spaced apart from the electrode layer 11, which is located in the same layer. In this embodiment, the first coil conductor 22, the connecting conductor 26, and the electrode layer 13 are formed integrally.

[0041] The second coil conductor 23 is located in the same layer as one electrode layer 11 and one electrode layer 13. The second coil conductor 23 is spaced apart from the electrode layers 11 and 13 located in the same layer. The first coil conductor 22 and the second coil conductor 23 are adjacent to each other in the third direction D3. When viewed from the third direction D3, the other end of the first coil conductor 22 and one end of the second coil conductor 23 overlap each other.

[0042] The third coil conductor 24 is located in the same layer as one electrode layer 11 and one electrode layer 13. The third coil conductor 24 is spaced apart from the electrode layers 11 and 13 located in the same layer. The second coil conductor 23 and the third coil conductor 24 are adjacent to each other in the third direction D3. Viewed from the third direction D3, the other end of the second coil conductor 23 and one end of the third coil conductor 24 overlap each other.

[0043] The fourth coil conductor 25 is located in the same layer as one electrode layer 11 and one electrode layer 13. The fourth coil conductor 25 is connected to the electrode layer 11 via a connecting conductor 27. The connecting conductor 27 is located in the same layer as the fourth coil conductor 25. The other end of the fourth coil conductor 25 is connected to the connecting conductor 27. The connecting conductor 27 is connected to layer portion 11a. The connecting conductor 27 connects the fourth coil conductor 25 and the electrode layer 11. The connecting conductor 27 may also be connected to layer portion 11b. The fourth coil conductor 25 is spaced apart from the electrode layer 13, which is located in the same layer. In this embodiment, the fourth coil conductor 25, the connecting conductor 27, and the electrode layer 11 are formed integrally.

[0044] The third coil conductor 24 and the fourth coil conductor 25 are adjacent to each other in the third direction D3. Viewed from the third direction D3, the other end of the third coil conductor 24 and one end of the fourth coil conductor 25 overlap each other.

[0045] The first coil conductor 22, the second coil conductor 23, the third coil conductor 24, and the fourth coil conductor 25 are electrically connected. The first coil conductor 22, the second coil conductor 23, the third coil conductor 24, and the fourth coil conductor 25 constitute coil 9. Coil 9 is electrically connected to terminal electrode 5 through connecting conductor 26. Coil 9 is electrically connected to terminal electrode 4 through connecting conductor 27.

[0046] The first coil conductor 22, the second coil conductor 23, the third coil conductor 24, and the fourth coil conductor 25, and the connecting conductors 27, 27 contain a conductive material. The conductive material contains Ag or Pd. The first coil conductor 22, the second coil conductor 23, the third coil conductor 24, and the fourth coil conductor 25, and the connecting conductors 27, 27 are constructed as sintered bodies of a conductive paste containing conductive material powder. The conductive material powder contains, for example, Ag powder or Pd powder.

[0047] In this embodiment, the first coil conductor 22, the second coil conductor 23, the third coil conductor 24, and the fourth coil conductor 25, and the connecting conductors 26, 27 contain the same conductive material as each terminal electrode 4, 5. The first coil conductor 22, the second coil conductor 23, the third coil conductor 24, and the fourth coil conductor 25, and the connecting conductors 26, 27 may contain a different conductive material than each terminal electrode 4, 5. The first coil conductor 22, the second coil conductor 23, the third coil conductor 24, and the fourth coil conductor 25, and the connecting conductors 27, 27 are provided in the defects formed in the corresponding insulating layer 6.

[0048] Next, we will explain the manufacturing method of coil component 1. Figure 4 is a flowchart showing the manufacturing method of coil component 1.

[0049] As shown in Figure 4, first, a green sheet is formed (step S01). The green sheet is formed by applying a base paste containing the constituent materials of the insulating layer 6 and a photosensitive material onto a substrate (e.g., a PET film). The photosensitive material contained in the base paste may be either negative or positive type, and known types can be used.

[0050] Next, the green sheet is processed (step S02). In this embodiment, for example, the base material forming layer is exposed and developed by a photolithography method using a Cr mask to form a base material pattern on the substrate from which the shape corresponding to the shape of the conductor forming layer described later has been removed. The base material pattern is the layer that will become the insulating layer 6 after heat treatment. Note that the "photolithography method" in this embodiment refers to any method that processes a layer containing a photosensitive material into a desired pattern by exposing and developing it, and the type of mask is not limited.

[0051] Furthermore, the substrate layer is exposed and developed using photolithography to form a substrate pattern with openings 104 (see Figure 6) that expose the cutting marks 102 (see Figure 6). As shown in Figure 5, in this embodiment, for example, 25 cutting marks 102 are formed on the laminate 100. Therefore, 25 openings 104 are formed on the green sheet. In the example shown in Figure 6, the openings 104 are formed in a circular shape.

[0052] Figures 5(a), 5(b), 5(c), 5(d), 5(e), 5(f), 5(g), and 5(h) show the cutting mark 102 and the opening 104. As shown in Figures 5(a), 5(b), and 5(c), the opening 104 may be circular. As shown in Figures 5(d) and 5(e), the opening 104 may be rectangular. As shown in Figures 5(f) and 5(g), the opening 104 may be cross-shaped. The opening 104 may be the same shape as the cutting mark 102 (similar shape).

[0053] Next, a conductor pattern is formed as shown in Figure 4 (step S03). The conductor pattern is formed by applying a conductor paste containing the constituent materials of electrode layers 10, 11, 12, 13, the first coil conductor 22, the second coil conductor 23, the third coil conductor 24 and the fourth coil conductor 25, and the connecting conductors 26 and 27, as well as a photosensitive material, onto a substrate (e.g., a PET film) to form a conductor material layer. The photosensitive material contained in the conductive paste may be either negative or positive type, and known types can be used. Next, using a mask corresponding to the defect, the conductor material layer is exposed and developed by photolithography to form a conductor pattern on the substrate corresponding to the shape of the defect.

[0054] Furthermore, a conductive material layer is formed by applying a conductive paste containing the constituent materials of the cutting mark 102 and a photosensitive material onto the substrate. In this embodiment, the same conductive paste used to form the coil conductor is used. That is, the cutting mark 102 is formed from the same material as the coil conductor. Next, using a mask corresponding to the opening 104, the conductive material layer is exposed and developed by photolithography to form a conductive pattern on the substrate corresponding to the shape of the cutting mark 102. In the example shown in Figure 6, the cutting mark 102 is formed in a cross shape.

[0055] As shown in Figure 5(a), the cutting mark 102 may be smaller than the circular opening 104. The cutting mark 102 is positioned to fit within the opening 104, and is fully exposed from the opening 104. The cutting mark 102 may be formed so as to be centered within the opening 104 (so that the center of gravity of the cutting mark 102 coincides with the center of gravity of the opening 104). As shown in Figure 5(b), the cutting mark 102 may be the same size as the circular opening 104. The cutting mark 102 is positioned to fit within the opening 104, and is fully exposed from the opening 104. The cutting mark 102 may be formed so as to be centered within the opening 104 (so that the center of gravity of the cutting mark 102 coincides with the center of gravity of the opening 104).

[0056] As shown in Figure 5(c), the cutting mark 102 may be smaller than the circular opening 104. The cutting mark 102 is positioned so as to fit within the opening 104, with the entirety exposed from the opening 104. The cutting mark 102 may be formed such that the center of gravity of the cutting mark 102 is offset from the center of gravity of the opening 104. As shown in Figure 5(d), the cutting mark 102 is positioned so as to fit within the opening 104, with the portion exposed from the opening 104.

[0057] As shown in Figure 5(e), the cutting mark 102 may be smaller than the rectangular opening 104. The cutting mark 102 is positioned to fit within the opening 104, and is fully exposed from the opening 104. The cutting mark 102 may be formed so as to be centered within the opening 104 (so that the center of gravity of the cutting mark 102 coincides with the center of gravity of the opening 104). As shown in Figure 5(f), it may be smaller than the rectangular opening 104. The cutting mark 102 is positioned to fit within the opening 104, and is fully exposed from the opening 104. The cutting mark 102 may be formed so as to be centered within the opening 104 (so that the center of gravity of the cutting mark 102 coincides with the center of gravity of the opening 104).

[0058] As shown in Figure 5(g), the cutting mark 102 may be smaller than the cross-shaped opening 104. The cutting mark 102 is positioned to fit within the opening 104, and is fully exposed from the opening 104. The cutting mark 102 may be formed so as to be centered within the opening 104 (so that the center of gravity of the cutting mark 102 coincides with the center of gravity of the opening 104). As shown in Figure 5(h), the cutting mark 102 may be the same size as the rectangular opening 104. In the example shown in Figure 5(h), a gap is formed between the cutting mark 102 and the opening 104, but a gap is not required between the cutting mark 102 and the opening 104. The cutting mark 102 is positioned to fit within the opening 104, and is fully exposed from the opening 104. The cutting mark 102 may be formed so as to be centered within the opening 104 (so that the center of gravity of the cutting mark 102 coincides with the center of gravity of the opening 104).

[0059] As shown in Figure 6, the laminate 100 has a product portion P (shown by a dashed line in Figure 6) which will become the coil component 1. Cutting marks 102 (openings 104) are provided on the cutting line (cutting allowance) CL. Specifically, cutting marks 102 are provided at the intersection of two cutting lines CL. In the example shown in Figure 6, eight cutting marks 102 are shown, but cutting marks 102 may be provided at all intersections of the cutting lines CL.

[0060] Next, as shown in Figure 4, a laminate 100 (see Figure 6) is formed (step S04). The laminate 100 is formed by repeatedly transferring the base pattern and the conductor pattern onto the support 200, thereby laminating the conductor pattern and the base pattern. Specifically, first, the conductor pattern is transferred from the substrate to the base-forming layer. Next, the base pattern is transferred from the substrate to the base-forming layer. The conductor pattern is combined with the missing parts of the base pattern, so that the base pattern and the conductor pattern are on the same layer on the base-forming layer. Furthermore, the transfer process of the conductor pattern and the base pattern is repeated, and the conductor pattern and the base pattern are laminated in a combined state. This forms the laminate 100.

[0061] The laminate 100 may be formed by laminating green sheets in which a base pattern and a conductor pattern are integrated. Specifically, first, a base pattern having a defect corresponding to the shape of the conductor pattern is formed, and then a conductor pattern is formed in the defect to obtain a green sheet in which the base pattern and the conductor pattern are integrated. Then, multiple green sheets are laminated. This forms the laminate 100.

[0062] As shown in Figure 6, in this embodiment, the laminate 100 is composed of, for example, a base material forming layer L1, a base material forming layer L2, a base material forming layer L3, a base material forming layer L4, a base material forming layer L5, a base material forming layer L6, a base material forming layer L7, a base material forming layer L8, a base material forming layer L9, and a base material forming layer L10. In the example shown in Figure 6, the base material forming layers are arranged in the order of base material forming layer L1, a base material forming layer L2, a base material forming layer L3, a base material forming layer L4, a base material forming layer L5, a base material forming layer L6, a base material forming layer L7, a base material forming layer L8, a base material forming layer L9, and a base material forming layer L10 from the support 200 side. The base material forming layer L10 constitutes the outer surface 100S of the laminate 100.

[0063] In Figure 7, the product portion P enclosed by the dashed line is the portion that will become the coil component 1 after the laminate 100 is cut. The conductor pattern CP is formed within the product portion P. In the example shown in Figure 7, the conductor pattern CP is shown in the base material forming layers L2, L5, L6, L8, and L9, but the conductor pattern CP is also formed in the base material forming layers L3, L4, and L7. The cutting marks 102 and openings 104 are formed on the outside of the product portion P. That is, the cutting marks 102 and openings 104 are located in the portion that will not be formed as the coil component 1. The cutting marks 102 and openings 104 are formed, for example, on the cutting line (including the cutting allowance). The cutting mark 102 is formed in the base material forming layer L9. That is, the cutting mark 102 is formed in the same layer as the part of the conductor pattern CP that forms the coil conductor. The openings 104 are formed in the base material forming layer L10. Note that the hatching of the cross-section is omitted in Figure 7.

[0064] Next, as shown in Figure 4, the laminate 100 is cut (step S05). In this embodiment, the laminate 100 is cut by a cutting machine (for example, a dicing blade). Specifically, the laminate 100 is cut based on cutting marks 102 provided on the laminate 100. This yields a plurality of green chips of a predetermined size.

[0065] Next, the green chips are fired (step S06). Then, a plating layer is formed on the surface of each terminal electrode 4, 5 (step S07). The plating layer is formed, for example, by electroplating or electroless plating. The plating layer contains, for example, Ni, Sn, or Au. As a result, the coil component 1 is obtained.

[0066] Figure 8(a) shows the cutting position of the cutting mark 102, and Figure 8(b) shows the cross-sectional configuration of the cutting mark 102. In Figure 8(b), the hatching of the cross section is omitted. As shown in Figure 8(b), in this embodiment, the cross section of the cutting mark 102 is trapezoidal. The cutting mark 102 has a first surface S1 and a second surface S2. The first surface S1 and the second surface S2 face each other in the stacking direction of the laminate 100. When viewed from the cross section along the stacking direction of the laminate 100, the width W1 of the first surface S1 is greater than the width W2 of the second surface S2 (W1 > W2). The cutting mark 102 is positioned such that the first surface S1 is located on the outer surface 100S side of the laminate 100 and the second surface S2 is located on the support 200 side. The cutting mark 102 is provided such that the first surface S1 is exposed from the opening 104.

[0067] The cutting mark 102 is provided penetrating the base material forming layer L9. In this embodiment, the thickness dimension T1 of the cutting mark 102 is equivalent to the depth dimension T2 of the opening 104 (T1=T2). In this embodiment, the shapes of the cutting mark 102 and the opening 104 are different, and the surface LS of the base material forming layer L9 where the cutting mark 102 is located is exposed from the opening 104. In this configuration, the cutting mark 102 and the surface LS of the base material forming layer L2 have different colors (brightness, saturation). The color of the cutting mark 102 is a color that can be distinguished from the color of the surface LS of the base material forming layer L9. In the example shown in Figure 6, the color of the cutting mark 102 is darker than the color of the surface LS of the base material forming layer L9.

[0068] As described above, in the manufacturing method of the coil component 1 according to this embodiment, in the step of forming the laminate 100, the laminate 100 is formed such that the cutting marks 102 are exposed from an opening 104 that opens on the outer surface 100S of the laminate 100. In this way, in the manufacturing method of the coil component 1, since the cutting marks 102 are located within the opening 104, it is possible to prevent the cutting marks 102 from coming into contact with equipment or the like during the manufacturing process of the coil component 1. Therefore, in the manufacturing method of the coil component 1, it is possible to prevent damage to the cutting marks 102.

[0069] In the manufacturing method of the coil component 1 according to this embodiment, in the step of forming the laminate 100, when the cutting mark 102 is viewed in cross-section in the stacking direction of the multiple laminate layers, the width W1 of the first surface S1 exposed from the opening 104 is made larger than the width W2 of the second surface S2 which is opposite to the first surface S1 in the stacking direction. With this method, since the width W1 of the first surface S1 of the cutting mark 102 exposed from the opening 104 is wide, the visibility of the cutting mark 102 can be ensured. In addition, since the width of the second surface S2 of the cutting mark 102 is reduced, the volume of the cutting mark 102 can be reduced.

[0070] In the manufacturing method of the coil component 1 according to this embodiment, in the step of forming the laminate 100, the cutting marks 102 and the conductor pattern CP are formed from the same material. With this method, the cutting marks 102 can be formed using the material used to form the conductor pattern CP, without having to prepare a separate material for forming the cutting marks 102. Therefore, an increase in the cost of manufacturing the cutting marks 102 can be avoided. Furthermore, by forming the cutting marks 102 and the conductor pattern CP from the same material, the cutting marks 102 and the conductor pattern CP can be formed in the same process (timing). Thus, the manufacturing process can be simplified.

[0071] In the manufacturing method of the coil component 1 according to this embodiment, in the step of forming the laminate 100, the color tone of the surface LS of the base material forming layer L9 where the cutting mark 102 exposed from the opening 104 is located is made different from the color tone of the cutting mark 102. In this method, when a large amount of the surface LS of the laminate 100 (base material forming layer L9 where the cutting mark 102 is located) is exposed at the opening 104, the distinction between the cutting mark 102 and the surface LS can be made clearer by making the color tones of the surface LS and the cutting mark 102 different. Therefore, the cutting mark 102 can be confirmed more reliably in the step of cutting the laminate 100.

[0072] In the manufacturing method of the coil component 1 according to this embodiment, in the step of forming the laminate 100, the depth dimension T2 of the opening 104 is made to be greater than or equal to the thickness dimension T1 of the cutting mark 102. With this method, since the cutting mark 102 is positioned at a deep location of the opening 104 in the laminate 100, it is possible to more reliably suppress contact between the cutting mark 102 and manufacturing equipment during the manufacturing process of the coil component 1.

[0073] In the manufacturing method of the coil component 1 according to this embodiment, in the step of forming the laminate 100, the cutting marks 102 and the conductor pattern CP are formed in the same base material forming layer L9. In this method, the conductor pattern CP and the cutting marks 102 are arranged in the same position (layer). As a result, in the manufacturing method of the coil component 1, the position of the cutting marks 102 can be set in relation to the conductor pattern CP that is arranged in the part that will become the coil component 1. Therefore, in the manufacturing method of the coil component 1, the positional accuracy of the cutting marks 102 relative to the conductor pattern CP can be improved.

[0074] While embodiments of this disclosure have been described above, this disclosure is not necessarily limited to the embodiments described above, and various modifications are possible without departing from its essence.

[0075] In the above embodiment, an example was described in which the electronic component is a coil component. However, the electronic component manufactured by the manufacturing method of the electronic component according to this disclosure may be a capacitor component or the like.

[0076] In the above embodiment, a form in which the cross-section of the cutting mark 102 is trapezoidal was described as an example. However, the shape of the cross-section of the cutting mark 102 is not limited to this. The widths W1 and W2 of the cutting mark 102 can be set as appropriate. By narrowing the widths W1 and W2 of the cutting mark 102 relative to the base material forming layer, the volume of the cutting mark 102 can be reduced. In addition, the sides of the cross-section of the cutting mark 102 may be curved.

[0077] As shown in Figure 9(a), the cross-sectional shape of the cutting mark 102 may be rectangular. As shown in Figure 9(b), the cross-sectional shape of the cutting mark 102 may be trapezoidal, where the width of the first surface S1 is smaller than the width of the second surface S2. As shown in Figure 9(c), the cross-sectional shape of the cutting mark 102 may be triangular. As shown in Figure 9(d), the cross-sectional shape of the cutting mark 102 may be polygonal. As shown in Figure 9(e), the cross-sectional shape of the cutting mark 102 may be arched. As shown in Figure 9(f), the cross-sectional shape of the cutting mark 102 may be semicircular. As shown in Figure 9(g), the cross-sectional shape of the cutting mark 102 may be polygonal. Note that in Figures 9(a), 9(b), 9(c), 9(d), 9(e), 9(f), and 9(g), the hatching of the cross-section is omitted.

[0078] In the above embodiment, a configuration in which the cutting mark 102 penetrates the base material forming layer L9 was described as an example. However, the cutting mark 102 does not necessarily have to penetrate the base material forming layer L9.

[0079] In the above embodiment, one example described was a configuration in which, during the process of forming the laminate, the color tone of the surface of the base material forming layer L9 where the cutting mark 102 exposed from the opening 104 is located is made different from the color tone of the cutting mark 102. However, if the shapes of the cutting mark 102 and the opening 104 are the same, the color tone of the outer surface 100S of the laminate 100 and the color tone of the cutting mark 102 may be made different. In this method, if the surface of the laminate 100 (the base material forming layer where the cutting mark 102 is located) at the opening 104 is not exposed (not exposed), the distinction between the cutting mark 102 and the outer surface 100S of the laminate 100 can be made clearer by making the color tones of the outer surface 100S of the laminate 100 and the cutting mark 102 different. Therefore, the cutting mark 102 can be confirmed more reliably during the process of cutting the laminate 100.

[0080] In the above embodiment, one example described was a configuration in which the depth dimension T2 of the opening 104 is greater than or equal to the thickness dimension T1 of the cutting mark 102 in the process of forming the laminate 100. However, in the process of forming the laminate 100, the depth dimension T2 of the opening 104 may be smaller than the thickness dimension of the cutting mark 102. In this method, the cutting mark 102 is positioned close to the outer surface 100S of the laminate 100, so the visibility of the cutting mark 102 can be ensured.

[0081] In the above embodiment, the cutting mark 102 was described as being formed in the substrate forming layer L9 as shown in Figure 7. However, the formation position of the cutting mark 102 is not limited to this.

[0082] As shown in Figure 10, the cutting mark 102 may be formed in the base material forming layer L6. A portion of the conductor pattern CP is formed in the base material forming layer L6. That is, the cutting mark 102 is located in the same layer as the conductor pattern CP. The opening 104 is formed across the base material forming layers L7, L8, L9 and L10.

[0083] As shown in Figure 11, the cutting mark 102 may be formed in the base material forming layer L2. A portion of the conductor pattern CP is formed in the base material forming layer L2. That is, the cutting mark 102 is located in the same layer as the conductor pattern CP. The opening 104 is formed across base material forming layers L3, L4, L5, L6, L7, L8, L9 and L10.

[0084] As shown in Figure 12, the cutting mark 102 may be formed in the substrate forming layer L10. The opening 104 is also formed in the substrate forming layer L10. That is, the cutting mark 102 and the opening 104 are located in the same layer.

[0085] In the above embodiment, a configuration in which the cut mark 102 is formed in the same layer as a part of the conductor pattern CP was described as an example. However, as shown in Figure 13, the cut mark 102 may be formed in a different layer from the part of the conductor pattern CP.

[0086] In the above embodiment, a form in which the cutting mark 102 has a cross shape was described as an example. However, the shape of the cutting mark 102 may be other shapes. As shown in Figures 14(a), 14(b), 14(c), 14(d), 14(e), and 14(f), various shapes can be used for the cutting mark. [Explanation of Symbols]

[0087] 1...Coil component (electronic component), 6...Insulator layer (laminated layer), 100...Laminate, 100S...Outer surface, 102...Cutting mark, 104...Opening, CP...Conductor pattern, LS...Surface, S1...First surface, S2...Second surface, T1, T2...Dimensions, W1, W2...Width.

Claims

1. A step of forming a laminate formed by stacking multiple laminate layers, wherein the laminate has cutting marks exposed from openings that open to the outer surface of the laminate, A method for manufacturing an electronic component, comprising the step of cutting the laminate based on the cutting marks.

2. The method for manufacturing an electronic component according to claim 1, wherein, in the step of forming the laminate, when the cutting marks are viewed in cross-section in the stacking direction of the multiple laminate layers, the width of the first surface exposed from the opening is made larger than the width of the second surface that is opposite to the first surface in the stacking direction.

3. In the process of forming the laminate, a plurality of laminate layers including a conductor pattern are stacked to form the laminate. A method for manufacturing an electronic component according to claim 1 or 2, wherein the cutting marks and the conductor pattern are formed from the same material.

4. A method for manufacturing an electronic component according to claim 1 or 2, wherein in the step of forming the laminate, the color tone of the outer surface of the laminate and the color tone of the cutting mark are made different.

5. A method for manufacturing an electronic component according to claim 1 or 2, wherein in the step of forming the laminate, the color tone of the surface of the laminate layer where the cutting mark exposed from the opening is located is made different from the color tone of the cutting mark.

6. The method for manufacturing an electronic component according to claim 1 or 2, wherein in the step of forming the laminate, the depth dimension of the opening in the stacking direction of the plurality of laminate layers is made to be greater than or equal to the thickness dimension of the cutting mark in the stacking direction.

7. A method for manufacturing an electronic component according to claim 1 or 2, wherein in the step of forming the laminate, the depth dimension of the opening in the stacking direction of the plurality of laminate layers is made smaller than the thickness dimension of the cutting mark in the stacking direction.

8. The method for manufacturing an electronic component according to claim 1 or 2, wherein in the step of forming the laminate, the length of the cutting mark is made larger than the opening dimension of the opening when viewed from the stacking direction of the multiple laminate layers.

9. The method for manufacturing an electronic component according to claim 1 or 2, wherein in the step of forming the laminate, the opening and the cutting mark are made to have different shapes.

10. In the process of forming the laminate, a plurality of laminate layers including a conductor pattern are stacked to form the laminate. A method for manufacturing an electronic component according to claim 1 or 2, wherein the cutting marks and the conductor pattern are formed in the same laminated layer.

Images