Component mounting equipment

Abstract

To provide a component mounting device that can properly mount components on a warped circuit board. [Solution] The component mounting apparatus 1 for mounting components onto a substrate B comprises a substrate transport mechanism 3 for transporting the substrate B, a substrate holding unit 18 for holding the transported substrate B, an imaging means 30 for imaging the substrate B held by the substrate holding unit 18 under at least two different imaging conditions, and a warpage data acquisition unit for acquiring warpage data of the substrate B based on a plurality of images captured under different imaging conditions.

Description

Technical Field

[0001] The present disclosure relates to a component mounting device for mounting components on a substrate.

Background Art

[0002] In a component mounting device, the substrate on which components are to be mounted may be warped upward or downward. When mounting components on a warped substrate, there are problems such that at the warped-up portion, an excessive load is applied to the mounted component and the component may be damaged, or at the warped-down portion, the component cannot be mounted on the substrate and the component may be released into the air. In Patent Document 1, a laser displacement meter is moved to measure the height of the substrate at a plurality of measurement points set on the upper surface of the substrate, a curved surface model approximating the warping shape of the substrate is calculated from the measurement results, and the lowering amount of the suction nozzle is corrected based on the predicted height of the mounting point calculated from the curved surface model, thereby solving the problems caused by the warping of the substrate. A component mounting device is disclosed.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, in the prior art including Patent Document 1, since it is necessary to move a laser displacement meter for each substrate to be mounted and measure the heights of a plurality of measurement points, the production efficiency is reduced. Also, there is a problem that the prediction accuracy of the height decreases for a substrate with a complex warping shape or a mounting point far from the measurement point. There was room for further improvement in order to shorten the measurement time of the height of the substrate and accurately correct the lowering amount of the suction nozzle for a warped substrate.

[0005] Therefore, an object of the present disclosure is to provide a component mounting device capable of appropriately mounting components on a warped substrate. [Means for solving the problem]

[0006] The component mounting apparatus of the present disclosure is a component mounting apparatus for mounting components onto a substrate, comprising: a substrate transport mechanism for transporting the substrate; a substrate holding unit for holding the transported substrate; an imaging means for imaging the substrate held by the substrate holding unit under at least two different imaging conditions; and a warpage data acquisition unit for acquiring warpage data of the substrate based on a plurality of imaging images taken under the different imaging conditions. [Effects of the Invention]

[0007] According to this disclosure, components can be properly mounted on a warped substrate. [Brief explanation of the drawing]

[0008] [Figure 1] A plan view of a component mounting apparatus according to one embodiment of the present disclosure. [Figure 2] A diagram illustrating the function of an imaging means provided in a component mounting apparatus according to one embodiment of the present disclosure. [Figure 3] A block diagram showing the configuration of a control system for a component mounting device according to one embodiment of the present disclosure. [Figure 4] A diagram illustrating a method for acquiring substrate warpage data in a component mounting apparatus according to one embodiment of the present disclosure. [Figure 5] A plan view of a first modified example of the imaging means of one embodiment of the present disclosure. [Figure 6] A diagram illustrating the function of a first modified example of the imaging means of one embodiment of the present disclosure. [Figure 7] A block diagram showing the configuration of a control system for a component mounting device equipped with a first modified example of an imaging means according to one embodiment of the present disclosure. [Figure 8] A plan view of a second modified example of the imaging means of one embodiment of the present disclosure. [Figure 9] A diagram illustrating the function of a second modified example of the imaging means of one embodiment of the present disclosure. [Figure 10]A block diagram showing the configuration of a control system for a component mounting device equipped with a second modified example of the imaging means of one embodiment of the present disclosure. [Modes for carrying out the invention]

[0009] An embodiment of this disclosure will be described in detail below with reference to the drawings. The configurations, shapes, etc. described below are illustrative examples for illustrative purposes and can be modified as appropriate according to the specifications of the component mounting device and imaging means. In the following, corresponding elements are denoted by the same reference numerals in all drawings, and redundant explanations are omitted. In Figure 1 and some parts described later, the X-axis in the substrate transport direction (left-right direction in Figure 1) and the Y-axis in the substrate transport direction (up-down direction in Figure 1) are shown as two mutually orthogonal axes in the horizontal plane. In Figure 2 and some parts described later, the Z-axis (up-down direction in Figure 2) is shown as the height direction perpendicular to the horizontal plane.

[0010] First, the configuration of the component mounting apparatus 1, which is a basic embodiment, will be explained with reference to Figures 1 and 2. Figure 2 schematically shows a part of the component mounting apparatus 1 in Figure 1. The component mounting apparatus 1 has the function of performing component mounting work, which involves mounting components supplied to the component supply unit onto a substrate. A substrate transport mechanism 3 is positioned along the X-axis in the center of the base 2. The substrate transport mechanism 3 transports the substrate B from upstream and positions it at the mounting work position. The substrate transport mechanism 3 also transports the substrate B downstream after the component mounting work is completed. Multiple electrodes Bb (lands) that are joined to the terminals of the components are formed on the upper surface Ba of the substrate B.

[0011] Component supply units 4 are located on both sides (front-to-back direction along the Y-axis) of the substrate transport mechanism 3. Multiple tape feeders 5 are arranged along the X-axis in each component supply unit 4. The tape feeders 5 feed component tapes, which have pockets for storing components, in a pitch direction from the outside of the component supply unit 4 toward the substrate transport mechanism 3 (tape feeding direction), thereby supplying components to the component supply positions from which the components will be picked up by the mounting head described below.

[0012] In Figure 1, Y-axis tables 6 equipped with linear drive mechanisms are arranged along the Y-axis at both ends in the X-axis direction on the upper surface of the base 2. A beam 7, similarly equipped with a linear drive mechanism, is coupled to the Y-axis tables 6 so as to be movable along the Y-axis. The beam 7 is arranged along the X-axis. A plate 7a is mounted on the beam 7 so as to be movable along the X-axis. A mounting head 8 is mounted on the plate 7a. The mounting head 8 comprises a plurality of mounting units 20 (Figure 3). A suction nozzle (not shown) for adsorbing and holding components is attached to the lower end of each mounting unit 20.

[0013] Each mounting unit 20 is equipped with a nozzle lifting mechanism 21 that raises and lowers the suction nozzle vertically and a nozzle rotation mechanism 22 that rotates the suction nozzle θ around the vertical axis (Z axis) (Figure 3). The mounting unit 20 rotates the suction nozzle to a predetermined rotation angle using the nozzle rotation mechanism 22 and lowers it to a predetermined mounting height in the Z-axis direction using the nozzle lifting mechanism 21, thereby mounting the component to be held by the suction nozzle onto the mounting point P (Figure 4) on the upper surface Ba of the substrate B.

[0014] In Figure 1, the Y-axis table 6 and beam 7 constitute a head movement mechanism 9 that moves the mounting head 8 in the X-axis and Y-axis directions. The head movement mechanism 9 and the mounting head 8 perform a mounting turn in which they pick up components from the component supply position of the tape feeder 5 located in the component supply unit 4 using a suction nozzle and mount them at the mounting point P of the substrate B positioned on the substrate transport mechanism 3.

[0015] In Figure 1, a component recognition camera 10 is positioned between the component supply unit 4 and the substrate transport mechanism 3. When the mounting head 8, which has taken a component from the component supply unit 4, moves above the component recognition camera 10, the component recognition camera 10 captures an image of the component held by the mounting head 8. The holding position of the component is recognized from the image result. A substrate recognition camera 11 is attached to the plate 7a on which the mounting head 8 is mounted. The substrate recognition camera 11 moves integrally with the mounting head 8.

[0016] By moving the mounting head 8, the substrate recognition camera 11 moves above the substrate B positioned on the substrate transfer mechanism 3 and images a substrate mark (not shown) provided on the substrate B. From the imaging result of the substrate mark, the position of the substrate B is recognized. In the component mounting operation on the substrate B by the mounting head 8, correction of the mounting point P is performed in consideration of the component recognition result by the component recognition camera 10 and the substrate position recognition result by the substrate recognition camera 11.

[0017] In FIG. 1, at the position where an operator works on the front surface of the component mounting apparatus 1, a touch panel 12 operated by the operator is installed. The touch panel 12 displays various information on its display unit, and the operator inputs data and operates the component mounting apparatus 1 using operation buttons and the like displayed on the display unit.

[0018] Next, referring to FIG. 2, the detailed configuration of the substrate transfer mechanism 3 will be described. The substrate transfer mechanism 3 has a pair of transfer conveyors 14 installed inside a pair of plate-like members 13 extending along the X-axis. The transfer conveyor 14 supports both ends of the substrate B from below by a transfer belt driven by a motor (not shown) and conveys it along the X-axis. At the upper ends of the pair of plate-like members 13, pressing plates 15 (also refer to FIG. 1) that project above the transfer conveyor 14 are installed respectively. The distance between the lower surface of the pressing plate 15 and the upper surface of the transfer conveyor 14 is wider than the thickness of the substrate B conveyed by the transfer conveyor 14.

[0019] Below the substrate B conveyed to the mounting operation position, a lower receiving member 17 that moves up and down by a cylinder 16 (arrow a) is installed. The substrate transfer mechanism 3 positions the substrate B at the mounting operation position, raises the lower receiving member 17 to lift the substrate B from the transfer conveyor 14, and presses both edge portions of the substrate B against the lower surface of the pressing plate 15, thereby holding the substrate B at the mounting operation position (the state shown in FIG. 2). When the substrate transfer mechanism 3 conveys the substrate B, it lowers the lower receiving member 17 to a position where it does not interfere with the lower surface of the substrate B. Thus, the pressing plate 15, the cylinder 16, and the lower receiving member 17 constitute a substrate holding portion 18 that holds the substrate B conveyed to the mounting operation position by the substrate transfer mechanism 3.

[0020] Next, with reference to Figures 1 and 2, the configuration of the imaging means 30 positioned above the substrate holding portion 18 will be described. The imaging means 30 includes a first stereo camera 31 having two imaging units 31a and 31b aligned in the X-axis direction, and a second stereo camera 32 having two imaging units 32a and 32b aligned in the Y-axis direction. In other words, the imaging means 30 includes two stereo cameras (first stereo camera 31 and second stereo camera 32) in which the two imaging units (imaging unit 31a and imaging unit 31b, and imaging unit 32a and imaging unit 32b) are aligned in different directions.

[0021] In Figure 2, the imaging units 31a and 31b of the first stereo camera 31 image the electrodes Bb formed on the upper surface Ba of the substrate B held by the substrate holder 18 at different imaging positions and different imaging angles (angle of the optical axis OA). Similarly, the imaging units 32a and 32b of the second stereo camera 32 image the electrodes Bb formed on the upper surface Ba of the substrate B held by the substrate holder 18 at different imaging positions and different imaging angles. The imaging field of view IR of the imaging units 31a, 31b, 32a, and 32b is wider than the range of the multiple electrodes Bb formed on the substrate B held by the substrate holder 18.

[0022] As described later, the distance Hs from the reference height Hs0 to the top surface Ba of the substrate B is measured based on multiple images captured by multiple imaging units 31a, 31b, 32a, 32b at different imaging positions or imaging angles. For example, the height of the lenses of the imaging units 31a, 31b, 32a, 32b is set as the reference height Hs0.

[0023] In this manner, the imaging means 30 images the substrate B held by the substrate holding portion 18 under at least two different imaging conditions (conditions with different imaging positions or angles, or conditions with different imaging positions and angles).

[0024] Next, with reference to Figure 3, the configuration of the control system of the component mounting apparatus 1 will be described. The control device 40 of the component mounting apparatus 1 is connected to a substrate transport mechanism 3, a tape feeder 5, a mounting head 8, a head movement mechanism 9, a component recognition camera 10, a substrate recognition camera 11, a touch panel 12, and an imaging means 30. The mounting head 8 has multiple mounting units 20, each equipped with a nozzle lifting mechanism 21 and a nozzle rotation mechanism 22. The imaging means 30 has a first stereo camera 31 equipped with an imaging unit 31a and an imaging unit 31b, and a second stereo camera 32 equipped with an imaging unit 32a and an imaging unit 32b.

[0025] The control device 40 includes a mounting memory unit 41, an imaging control unit 45, a warpage data acquisition unit 46, and a mounting control unit 47. The mounting memory unit 41 is a memory device that stores mounting data 42, imaging image data 43, warpage data 44, etc. The mounting data 42 stores information necessary for component mounting work for each type of substrate B (substrate type), such as the size of the substrate B, the type of component to be mounted and the mounting point P (XY coordinates), the size of the component (length, width, height), and the position of the substrate mark (XY coordinates).

[0026] In Figure 3, the imaging control unit 45 controls the imaging means 30 to image the substrate B, which has been transported to the mounting work position by the transport conveyor 14 of the substrate transport mechanism 3 and is held in the substrate holding unit 18. Before the imaging means 30 images the substrate B, the imaging control unit 45 controls the head movement mechanism 9 to move the mounting head 8 out of the imaging field IR of the imaging means 30. The captured image is stored in the mounting storage unit 41 as image data 43. Thus, the image data 43 stores multiple images captured by the imaging means 30 under different imaging conditions.

[0027] The warp data acquisition unit 46 acquires warp data 44 of the substrate B based on multiple captured images taken under different imaging conditions, which are stored in the captured image data 43. The acquired warp data 44 is stored in the mounting storage unit 41.

[0028] Here, with reference to Figure 4, an example of the process by which the warpage data acquisition unit 46 acquires warpage data 44 of the substrate B will be described. The warpage data acquisition unit 46 acquires the distance Hs(1) from the reference height Hs0 to the mounting point P based on the parallax of the electrodes Bb near the mounting point P on the upper surface Ba of the substrate B, which are captured by the two imaging units 31a and 31b of the first stereo camera 31 provided in the imaging means 30. Similarly, the warpage data acquisition unit 46 acquires the distance Hs(2) from the reference height Hs0 to the mounting point P based on the parallax of the electrodes Bb near the mounting point P on the upper surface Ba of the substrate B, which are captured by the two imaging units 32a and 32b of the second stereo camera 32 provided in the imaging means 30.

[0029] Subsequently, the warp data acquisition unit 46 determines the distance Hs from the reference height Hs0 to the mounting point P based on the distances Hs(1) and Hs(2) acquired according to a predetermined algorithm, and stores it as warp data 44. For example, the warp data acquisition unit 46 determines the average value of distance Hs(1) and distance Hs(2) as distance Hs. Also, if distance Hs(1) cannot be acquired from the image captured by the first stereo camera 31 for reasons such as the electrode Bb being hidden by a component already mounted on the substrate B, distance Hs(2) is determined as distance Hs.

[0030] In the example shown in Figure 4, the distances Hs1 to Hs4 from the reference height Hs0 to the mounting points P1 to P4 are obtained based on the parallax of the electrodes Bb near the mounting points P1 to P4 in the images captured by the first stereo camera 31 and the second stereo camera 32, and are stored as warpage data 44. Since the imaging field of view IR of the imaging units 31a, 31b, 32a, and 32b is wider than the range of the multiple electrodes Bb formed on the substrate B held by the substrate holding unit 18, the distances Hs1 to Hs4 of multiple mounting points P1 to P4 can be obtained by image processing the images obtained in a single capture. This makes it possible to obtain warpage data 44 of the warped substrate B in a short time.

[0031] In Figure 3, the mounting control unit 47 controls the mounting head 8 and the head movement mechanism 9 based on the mounting data 42 and the warpage data 44 to pick up the component D from the tape feeder 5 using the suction nozzle and mount the component on the mounting point P of the substrate B.

[0032] In the example shown in Figure 4, the mounting control unit 47 moves the mounting head 8 above the substrate B held by the substrate holding unit 18 to align the component held by the suction nozzle above the mounting point P1. Next, the mounting control unit 47 lowers the suction nozzle to mount the component at the mounting point P1 on the substrate B based on the distance Hs1 from the reference height Hs0 included in the substrate B warp data 44 and the height of the component. Similarly, the mounting control unit 47 lowers the suction nozzle to mount the components at the mounting points P2 to P4 based on the distances Hs2 to Hs4 from the reference height Hs0 to the mounting points P2 to P4. This allows for the proper mounting of components on a warped substrate B.

[0033] Next, with reference to Figures 5 and 6, a component mounting device (hereinafter simply referred to as "component mounting device 1A") which is a variation 1 of the embodiment equipped with a first modified example of the imaging means (hereinafter simply referred to as "imaging means 50") will be described. The imaging means 50 differs from the imaging means 30 in that the position and angle of the imaging units 31a, 31b, 32a, and 32b are fixed, in that it is equipped with a third stereo camera 51 equipped with a spacing angle changing mechanism 55 and a rotation mechanism 56 for rotating the third stereo camera 51.Hereafter, the same reference numerals are used for the same parts as in component mounting device 1, and detailed explanations are omitted.

[0034] In Figure 5, the imaging means 50 includes a third stereo camera 51 having two imaging units 51a and 51b aligned in the Y-axis direction. The third stereo camera 51 also includes an angle changing mechanism 53a that rotates the imaging unit 51a around a rotation axis 52a in the X-axis direction, and an angle changing mechanism 53b that rotates the imaging unit 51b around a rotation axis 52b in the X-axis direction. The third stereo camera 51 also includes a spacing changing mechanism 54 that moves the angle changing mechanisms 53a and 53b along the Y-axis to change the distance between the imaging units 51a and 51b. In other words, the angle changing mechanisms 53a, 53b and the spacing changing mechanism 54 constitute a spacing angle changing mechanism 55 that changes the distance between the two imaging units 51a and 51b and the angle of the optical axes of the imaging units 51a and 51b.

[0035] In Figure 6, the imaging units 51a and 51b before the spacing and optical axis angle are changed by the spacing angle changing mechanism 55 are shown with solid lines, and the imaging units 51a and 51b after the spacing and optical axis angle are changed are shown with dashed lines. The spacing angle changing mechanism 55 changes the position and orientation of the imaging units 51a and 51b so that the distance L and optical axis angle θ of the imaging units 51a and 51b are symmetrical with respect to the center CL of the substrate transport mechanism 3. The spacing angle changing mechanism 55 also changes the optical axis angle so that the optical axes OA of the imaging units 51a and 51b intersect at the center CL. For example, before the change, the imaging units 51a and 51b are located at an equal distance L1 from the center CL, and the optical axis angle θ1 with respect to the center CL is also equal.

[0036] The spacing angle changing mechanism 55 moves the imaging unit 51a to a distance L2 from the center CL, and simultaneously moves the imaging unit 51b to a distance L2 from the center CL. The spacing angle changing mechanism 55 also changes the angle of the optical axes OA of the imaging unit 51a and imaging unit 51b from angle θ1 to angle θ2 so that they intersect at the center CL. The imaging means 50 changes the spacing between the two imaging units 51a and 51b (2 × L1, 2 × L2) and the angles θ1 and θ2 of the optical axes of the imaging units 51a and 51b, so that the electrode Bb is not obscured by components already mounted on the substrate B, and the optical axis angles θ1 and θ2 allow for imaging of the substrate B.

[0037] In Figure 5, the imaging means 50 includes a rotation mechanism 56 that rotates the third stereo camera 51 so that the direction in which the two imaging units 51a and 51b are aligned (the Y-axis direction in Figure 5) rotates around the Z-axis. By rotating the third stereo camera 51 and moving the positions of the imaging units 51a and 51b, the imaging means 50 can image the substrate B at a position where the electrodes Bb are not obscured by components already mounted on the substrate B from the imaging units 51a and 51b. Note that the imaging field of view IR of the imaging units 51a and 51b is wider than the range of the multiple electrodes Bb formed on the substrate B held by the substrate holding unit 18.

[0038] Next, with reference to Figure 7, the configuration of the control system of the component mounting device 1A will be described. The following description will explain a configuration that differs from that of the component mounting device 1. The imaging control unit 45A of the control device 40A of the component mounting device 1A controls the imaging means 50 connected to the control device 40A to image the substrate B that has been transported to the mounting work position by the transport conveyor 14 of the substrate transport mechanism 3 and held in the substrate holding unit 18.

[0039] In order to image substrate B, the imaging control unit 45A controls the spacing angle changing mechanism 55 of the third stereo camera 51 to change the spacing between the two imaging units 51a and 51b, and the angles θ1 and θ2 of the optical axes of the imaging units 51a and 51b. The imaging control unit 45A also controls the rotation mechanism 56 to rotate the third stereo camera 51. After that, the imaging control unit 45A causes the two imaging units 51a and 51b to image substrate B.

[0040] In Figure 7, the imaging control unit 45A then controls the spacing angle changing mechanism 55 and the rotation mechanism 56 to make the spacing, optical axis angles θ1, θ2, and positions of the two imaging units 51a and 51b different, causing the two imaging units 51a and 51b to image the substrate B. That is, the imaging means 50 images the substrate B held in the substrate holding unit 18 under at least two different imaging conditions (spacing of imaging units 51a and 51b, optical axis angles θ1, θ2, and position). The captured image is stored as image data 43.

[0041] If the warpage data acquisition unit 46 cannot acquire the distance Hs from the reference height Hs0 to the mounting point P based on the stored image data 43, the image capture control unit 45A changes the spacing between the imaging units 51a and 51b, the optical axis angles θ1 and θ2, and the position (imaging conditions) to image the substrate B. As a result, the third stereo camera 51 can image the electrodes Bb on the substrate B under imaging conditions where the electrodes Bb are not hidden by components already mounted on the substrate B, and acquire the distance Hs from the reference height Hs0 to the mounting point P.

[0042] Next, with reference to Figures 8 and 9, a component mounting device (hereinafter simply referred to as "component mounting device 1B") which is a variation 2 of the embodiment equipped with a second modified image imaging means (hereinafter simply referred to as "image imaging means 60") will be described. The image imaging means 60 differs from the image imaging means 30, in that it is equipped with a rocking camera 64 having one rocking image imaging unit 61, whereas the angles of the image imaging units 31a, 31b, 32a, and 32b are fixed. Hereafter, the same reference numerals are used for the same parts as in component mounting device 1, and detailed explanations are omitted.

[0043] In Figure 8, the imaging means 60 includes one imaging unit 61 positioned at the center CL of the substrate transport mechanism 3. The imaging means 60 also includes a rocking mechanism 63 that rocks the imaging unit 61 around a rotation axis 62 in the X-axis direction. The imaging unit 61 and the rocking mechanism 63 constitute a rocking camera 64.

[0044] In Figure 9, among the imaging units 61 whose optical axis angle changes due to oscillation by the oscillation mechanism 63, the imaging unit 61 with an optical axis angle of angle θ3 is shown by a solid line, and the imaging unit 61 with an optical axis angle of angle θ4 is shown by a dashed line. The imaging means 60 images the substrate B, which has been transported to the mounting work position by the transport conveyor 14 of the substrate transport mechanism 3 and held in the substrate holding unit 18, while oscillating the imaging unit 61. Thus, the imaging means 60 is equipped with one imaging unit 61 that images the substrate B by changing the optical axis angles θ3 and θ4. By oscillating the imaging unit 61 and imaging the substrate B, the imaging means 60 can take images under different imaging conditions (optical axis angles θ3 and θ4) using a single imaging unit 61.

[0045] In Figure 8, the imaging means 60 is equipped with a rotation mechanism 65 that rotates the direction in which the imaging unit 61 swings. The imaging means 60 rotates the direction in which the imaging unit 61 swings to change the direction of swing, and then swings the imaging unit 61 to image the substrate B, thereby enabling imaging under different imaging conditions (optical axis angles θ3, θ4, and direction of swing) using a single imaging unit 61. The imaging field of view IR of the imaging unit 61 does not need to be narrower than the range of the multiple electrodes Bb formed on the substrate B held by the substrate holding unit 18. The imaging field of view IR of the imaging unit 61 only needs to be able to cover the range of the multiple electrodes Bb formed on the substrate B held by the substrate holding unit 18 by rotating the direction of swing and swinging the imaging unit 61.

[0046] Next, with reference to Figure 10, the configuration of the control system of the component mounting device 1B will be described. The following description will explain the configuration which differs from that of the component mounting device 1. The imaging control unit 45B of the control device 40B of the component mounting device 1B controls the imaging means 60 connected to the control device 40B to image the substrate B that has been transported to the mounting work position by the transport conveyor 14 of the substrate transport mechanism 3 and held in the substrate holding unit 18.

[0047] When imaging substrate B, the imaging control unit 45B controls the rotation mechanism 65 to change the direction in which the imaging unit 61 oscillates. Next, the imaging control unit 45B controls the oscillation mechanism 63 to change the angles θ3 and θ4 of the optical axis of the imaging unit 61, causing the imaging unit 61 to image substrate B. In other words, the imaging means 60 causes substrate B, held in the substrate holding unit 18, to be imaged under at least two different imaging conditions (angles θ3 and θ4 of the optical axis of the imaging unit 61, and direction of oscillation). The captured image is stored as image data 43.

[0048] If the warpage data acquisition unit 46 cannot acquire the distance Hs from the reference height Hs0 to the mounting point P based on the stored image data 43, the image control unit 45B changes the direction in which the imaging unit 61 swings to image the substrate B. This allows the swinging camera 64 to image the electrodes Bb of the substrate B under imaging conditions (direction in which the imaging unit 61 swings) that are not obscured by components already mounted on the substrate B, and to acquire the distance Hs from the reference height Hs0 to the mounting point P.

[0049] As explained above, this disclosure discloses the following technical concepts.

[0050] (Technology 1) Component mounting devices 1, 1A, 1B for mounting components onto circuit board B, A substrate transport mechanism 3 for transporting substrate B, A substrate holding section 18 that holds the transported substrate B, Imaging means 30, 50, 60 for imaging the substrate B held in the substrate holding part 18 under at least two different imaging conditions, A component mounting apparatus 1, 1A, 1B, comprising a warpage data acquisition unit 46 that acquires warpage data 44 of a substrate B based on multiple captured images taken under different imaging conditions.

[0051] This allows components to be properly mounted on the warped circuit board B.

[0052] (Technology 2) The imaging means 30, 50 photograph the substrate B at different shooting positions or different shooting angles, as described in the component mounting apparatus 1, 1A of Technology 1.

[0053] This allows for the proper mounting of components onto the warped substrate B based on the captured image.

[0054] (Technology 3) The imaging means 60 captures images under different imaging conditions using one imaging unit 61, as described in Technical Reference 1, for the component mounting apparatus 1B.

[0055] This allows for the proper mounting of components onto a warped substrate B using a single imaging unit.

[0056] (Technology 4) The imaging means 30, 50 are The component mounting apparatus 1, 1A according to Technical Reference 1, comprising a stereo camera (first stereo camera 31, second stereo camera 32, third stereo camera 51) having two imaging units 31a, 31b, 32a, 32b, 51a, 51b.

[0057] This allows for the proper mounting of components onto warped circuit board B using a stereo camera.

[0058] (Technology 5) The imaging means 50 is The component mounting apparatus 1A described in Technical Reference 4 further comprises a rotation mechanism 56 for rotating the stereo camera (third stereo camera 51) so that the direction in which the two imaging units 51a and 51b are aligned rotates.

[0059] This allows for the proper mounting of components onto circuit board B, even if the board is warped, even if components are already mounted on board B.

[0060] (Technology 6) The component mounting apparatus 1A according to Technology 4 or Technology 5 further comprises a stereo camera (third stereo camera 51) and a spacing angle changing mechanism 55 for changing the spacing between two imaging units 51a and 51b and the angles θ1 and θ2 of the optical axes of the imaging units 51a and 51b.

[0061] This allows for the proper mounting of components onto circuit board B, even if the board is warped, even if components are already mounted on board B.

[0062] (Technology 7) The imaging means 30 is The component mounting apparatus 1 according to Technical Reference 4, comprising at least two stereo cameras (first stereo camera 31, second stereo camera 32) in which two imaging units 31a, 31b, 32a, 32b are aligned in different directions.

[0063] This allows for the proper mounting of components onto circuit board B, even if the board is warped, even if components are already mounted on board B.

[0064] (Technology 8) The imaging means 60 is The component mounting apparatus 1B described in Technical Reference 1 is further comprising an imaging unit 61 that images the substrate B by changing the optical axis angles θ3 and θ4.

[0065] This allows components to be properly mounted on a warped substrate B using a single imaging unit 61.

[0066] (Technology 9) A component mounting apparatus according to any one of the technologies 1 to 8, comprising a mounting head 8 having a suction nozzle for holding components, which moves above a substrate B held by a substrate holding section 18, and which lowers the suction nozzle based on the warpage data 44 of the substrate B to mount components at mounting points P on the substrate B.

[0067] This allows the mounting head 8 to properly mount components onto the warped substrate B. [Industrial applicability]

[0068] The component mounting apparatus of this disclosure has the effect of being able to properly mount components on a warped substrate and is useful in the field of mounting components on a substrate. [Explanation of symbols]

[0069] 1, 1A, 1B Component mounting equipment 3. Substrate transport mechanism 8 Mounting Head 18 Board holding part 30, 50, 60 Imaging means 31. First Stereo Camera (Stereo Camera) 32. Second Stereo Camera (Stereo Camera) 31a, 31b, 32a, 32b, 51a, 51b, 61 Imaging unit 51. Third stereo camera (stereo camera) 55. Interval angle change mechanism 56, 65 Rotation mechanism B substrate P, P1~P4 mounting point θ1~θ4 Angle of the optical axis

Claims

1. A component mounting device for mounting components onto a circuit board, A substrate transport mechanism for transporting the aforementioned substrate, A substrate holding section for holding the transported substrate, An imaging means for imaging the substrate held in the substrate holding portion under at least two different imaging conditions, A component mounting apparatus comprising: a warpage data acquisition unit that acquires warpage data of the substrate based on a plurality of captured images taken under the aforementioned different imaging conditions.

2. The component mounting apparatus according to claim 1, wherein the imaging means photographs the substrate at different shooting positions or different shooting angles.

3. The component mounting apparatus according to claim 1, wherein the imaging means uses one imaging unit to take images under the different imaging conditions.

4. The imaging means is The component mounting apparatus according to claim 1, comprising a stereo camera having two imaging units.

5. The imaging means is The component mounting apparatus according to claim 4, further comprising a rotation mechanism for rotating the stereo camera such that the direction in which the two imaging units are aligned rotates.

6. The component mounting apparatus according to claim 4, further comprising a spacing angle changing mechanism for changing the spacing between the two imaging units and the angle of the optical axis of the imaging unit, wherein the stereo camera is further provided with the spacing angle changing mechanism.

7. The imaging means is The component mounting apparatus according to claim 4, comprising at least two stereo cameras in which the two imaging units are aligned in different directions.

8. The imaging means is The component mounting apparatus according to claim 1, comprising one imaging unit that images the substrate by changing the angle of the optical axis.

9. A component mounting apparatus according to any one of claims 1 to 8, comprising a mounting head having a suction nozzle for holding the component, which moves above the substrate held by the substrate holding portion, and which lowers the suction nozzle based on the warpage data of the substrate to mount the component at the mounting point of the substrate.

Images