Insulating structure, electronic equipment housing, electronic equipment unit, method for manufacturing an insulating structure, method for manufacturing an electronic equipment housing, and method for manufacturing an electronic equipment unit
The insulating structure with a recessed and re-welded joint design addresses short circuits in electronic device housings by creating a more complex and longer creepage path, enhancing insulation and preventing electrical failures.
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- NEC PLATFROMS LTD
- Filing Date
- 2024-10-10
- Publication Date
- 2026-04-22
AI Technical Summary
Welding joints in electronic device housings can lead to short circuits due to current flow through the joint surfaces, compromising insulation properties.
An insulating structure is implemented by forming a recess in the welded joint and filling it with a re-welded portion to create a more complex and longer creepage path, using the same material for the cylindrical container, lid, and re-welded portion.
This enhances insulation properties at the joint, preventing short circuits and improving electrical isolation.
Smart Images

Figure 2026068168000001_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to an insulating structure, an electronic device housing container, an electronic device unit, a method for manufacturing an insulating structure, a method for manufacturing an electronic device housing container, and a method for manufacturing an electronic device unit.
Background Art
[0002] Patent Document 1 discloses a battery case having a rectangular bottomed cylindrical battery case body and a sealing lid that seals the opening of the battery case body. Further, the battery case of Patent Document 1 has a welded portion formed by welding the opening portion of the battery case body and the peripheral edge portion of the sealing lid.
Prior Art Documents
Patent Documents
[0003]
Patent Document 1
Summary of the Invention
Problems to be Solved by the Invention
[0004] When welding a lid portion to, for example, a cylindrical member as in the battery case disclosed in Patent Document 1, one end portion and the other end portion of the welded portion are joined. When the end portions of the welded portion are joined, current may flow through the joint surface between the end portions of the welded portion, resulting in a possible short - circuit.
[0005] The present disclosure has been made in view of the above - described problems, and an object thereof is to improve the insulation property at the joint location between the end portions of the welded portion.
Means for Solving the Problems
[0006] An insulating structure according to one aspect of the present disclosure has an insulating re-welded portion provided at the joint between the first end and the second end of an insulating welded portion that joins a first member and a second member, wherein the re-welded portion is formed by embedding a recess provided by cutting out a part of the welded portion, including the joint surface between the first end and the second end.
[0007] An electronic device housing according to one aspect of the present disclosure comprises a cylindrical container which is a first member for housing electronic devices, a lid which is a second member for closing the open end of the cylindrical container, and a welded portion which joins the cylindrical container and the lid, and has the insulating structure.
[0008] An electronic device unit according to one aspect of this disclosure comprises the electronic device housing container and the electronic device.
[0009] A method for manufacturing an insulating structure according to one aspect of the present disclosure includes: a welded joint forming step of forming an insulating welded joint that joins a first member and a second member such that the first end and the second end of the welded joint are joined; a recess forming step of forming a recess by cutting out a part of the welded joint including the joining surface between the first end and the second end; and a re-welded joint forming step of filling the recess to form an insulating re-welded joint.
[0010] A method for manufacturing an electronic device housing according to one aspect of the present disclosure comprises: a welding joint forming step of forming an insulating welded joint that joins a cylindrical container housing an electronic device and a lid that closes the open end of the cylindrical container, such that a first end and a second end of the welding joint are joined; a recess forming step of forming a recess by cutting out a part of the welding joint including the joining surface between the first end and the second end; and a re-welding joint forming step of filling the recess to form an insulating re-welded joint.
[0011] A method for manufacturing an electronic device unit according to one aspect of the present disclosure includes: an electronic device housing step of housing the electronic device in a cylindrical container for housing the electronic device; a welded joint forming step of forming an insulating welded joint that joins the cylindrical container and a lid that closes the open end of the cylindrical container, such that the first end and the second end of the welded joint are joined; a recess forming step of forming a recess by cutting out a part of the welded joint including the joining surface between the first end and the second end; and a re-welded joint forming step of filling the recess to form an insulating re-welded joint. [Effects of the Invention]
[0012] This disclosure can improve the insulation at the joint between the ends of welded parts. [Brief explanation of the drawing]
[0013] [Figure 1] This is a schematic cross-sectional view showing the general configuration of the electronic equipment unit of this disclosure. [Figure 2] This is a front view from direction A in Figure 1. [Figure 3] This is an enlarged view of region B in Figure 2. [Figure 4] Figure 3 is a cross-sectional view of CC. [Figure 5] This is a flowchart illustrating the manufacturing method of the electronic device unit of this disclosure. [Figure 6] This is a schematic perspective view including a cylindrical container and a lid for illustrating the electronic device housing step in the manufacturing method of the electronic device unit of this disclosure. [Figure 7] This is an enlarged schematic diagram of a welded joint to illustrate the weld formation process in the manufacturing method of the electronic device unit of this disclosure. [Figure 8] This is an enlarged schematic cross-sectional view of a welded joint to illustrate the weld formation process in the manufacturing method of an electronic device unit of the present disclosure. [Figure 9] This is an enlarged schematic diagram of a welded portion illustrating the recess formation process in the manufacturing method of an electronic device unit according to the present disclosure. [Figure 10]It is an enlarged schematic cross-sectional view of a welded portion for explaining a recess forming step in a method of manufacturing an electronic device unit of the present disclosure. [Figure 11] It is a schematic cross-sectional view showing a schematic configuration of an insulating structure of the present disclosure.
Embodiments for Carrying Out the Invention
[0014] Hereinafter, an embodiment of an insulating structure, an electronic device housing container, an electronic device unit, a method of manufacturing an insulating structure, a method of manufacturing an electronic device housing container, and a method of manufacturing an electronic device unit according to the present disclosure will be described with reference to the drawings. In all the drawings, the same or corresponding components are denoted by the same reference numerals, and common descriptions are omitted.
[0015] (First Embodiment) As shown in FIG. 1, the electronic device unit 1 of the present embodiment includes an electronic device 2 and an electronic device housing container 3. The electronic device 2 is a device that can be driven by electric power. For example, the electronic device 2 is driven in a state where a high voltage is applied. Such an electronic device 2 may be a single device or a module composed of a plurality of devices.
[0016] The electronic device housing container 3 is a container that houses the electronic device 2. The electronic device housing container 3 is a container for protecting the electronic device 2 housed therein and preventing a short circuit between the internal electronic device 2 and an external member. For example, a conductive member is disposed outside the electronic device housing container 3. The electronic device housing container 3 electrically isolates the electronic device 2 from the external member so that the external member and the electronic device 2 do not short-circuit.
[0017] As shown in FIG. 2, the electronic device housing container 3 includes a cylindrical container 4 (first member), a lid portion 5 (second member), a welding portion 6, and a re-welding portion 7. In the present embodiment, the electronic device housing container 3 is entirely formed of the same insulating material. That is, in the present embodiment, the cylindrical container 4, the lid portion 5, the welding portion 6, and the re-welding portion 7 are formed of the same insulating material. Specifically, the cylindrical container 4, the lid portion 5, the welding portion 6, and the re-welding portion 7 can be formed of a polyethylene resin. However, the cylindrical container 4, the lid portion 5, the welding portion 6, and the re-welding portion 7 may be formed of different materials.
[0018] In the present embodiment, the electronic device housing container 3 is formed in a cylindrical shape centered on the central axis L. In the following description, for convenience of explanation, the direction along the central axis L is referred to as the axial direction. Also, the direction passing through the central axis L as viewed from the axial direction is referred to as the radial direction. Further, in the radial direction, the side closer to the central axis L is referred to as the inner side in the radial direction, and the side opposite to the central axis L is referred to as the outer side in the radial direction. Note that the installation posture of the electronic device housing container 3 serving as the center is not limited.
[0019] The cylindrical container 4 houses the electronic device 2 therein and is formed in a cylindrical shape with both ends open in the axial direction. That is, the cylindrical container 4 is provided with open ends that open in the axial direction on both sides in the axial direction. Note that the cylindrical container 4 may have a bottomed cylindrical shape in which one of both ends in the axial direction is closed. Also, in the present embodiment, the cylindrical container 4 is formed in a circular shape as viewed from the axial direction. That is, the cylindrical container 4 of the present embodiment is formed in a cylindrical shape. Note that the shape of the cylindrical container 4 as viewed from the axial direction may be a polygonal shape such as a quadrangle.
[0020] At both ends of the cylindrical container 4 in the axial direction, inclined surfaces 4a that slope radially outward as they extend from the center side to the outside of the cylindrical container 4 in the axial direction are provided. The inclined surfaces 4a are provided in an annular shape along the circumferential direction centered on the central axis L. These inclined surfaces 4a and an inclined surface 5a of the lid portion 5 described later form a V-shaped groove portion 8. The groove portion 8 is a portion where the welding portion 6 is provided. Such inclined surfaces 4a form the inner wall surface of the groove portion 8 and are surfaces to which the welding portion 6 is fixed.
[0021] The lid portion 5 is a member that closes the open end of the cylindrical container 4. As described above, the cylindrical container 4 has open ends at both ends in the axial direction. The lid portion 5 is provided for each of these two open ends. In other words, in this embodiment, the electronic device housing container 3 is equipped with two lid portions 5.
[0022] Each lid portion 5 is formed in a plate shape with its front and back surfaces facing axially. In this embodiment, similar to the cylindrical container 4, the shape when viewed from the axial direction is circular. Furthermore, the radial dimension of each lid portion 5 is smaller than the inner diameter of the cylindrical container 4. For this reason, each lid portion 5 is formed to a size that can be accommodated inside the cylindrical container 4.
[0023] Each lid portion 5 has a circumferential surface provided with an inclined surface 5a that curves radially inward as it moves outward from the center of the cylindrical container 4 in the axial direction. The inclined surface 5a is connected in the axial direction to the outer surface of the lid portion 5 (the surface facing away from the electronic device 2). For example, the axial dimensions of the inclined surface 5a are the same as those of the inclined surface 4a of the cylindrical container 4. Furthermore, the inclined surface 5a is provided in an annular shape along the circumferential direction centered on the central axis L.
[0024] Such an inclined surface 5a is positioned opposite the inclined surface 4a of the cylindrical container 4 when the lid portion 5 is positioned to close the open end of the cylindrical container 4. The inclined surface 4a is positioned opposite the inclined surface 4a of the cylindrical container 4 located from the radially inner side to the radially outer side, and together with the inclined surface 4a, forms the groove portion 8. Such an inclined surface 5a forms the inner wall surface of the groove portion 8 and is the surface to which the welded portion 6 is fixed.
[0025] The welded joint 6 joins the cylindrical container 4 and the lid 5. The welded joint 6 is provided so as to embed the groove 8. The groove 8 has a V-shaped cross-section such that, in the axial direction, its radial width widens from the center of the electronic equipment housing container 3 outwards. The welded joint 6 is fixed to the inner wall surface of this groove 8 and joins the cylindrical container 4 and the lid 5.
[0026] Viewed from the axial direction, the groove 8 is formed in an annular shape with the central axis L at its center. The welded portion 6 that embeds the groove 8 is also formed in an annular shape with the central axis L at its center, similar to the groove 8. The welded portion 6 is provided to extend along the circumferential direction with the central axis L at its center when viewed from the axial direction, and is formed in an annular shape when both ends are joined together.
[0027] As shown in Figure 3, a re-welded section 7 is positioned to overlap a portion of the welded section 6 from the axial direction. As shown in Figure 4, the ends of the welded section 6 are joined together on the underside of the re-welded section 7 (the bottom side of the groove 8). In the following description, one of the two ends of the welded section 6 will be referred to as the first end 6a, and the other end of the welded section 6 will be referred to as the second end 6b. In other words, these first end 6a and second end 6b are joined together while covered by the re-welded section 7.
[0028] The first end 6a and the second end 6b are stacked in the axial direction. The axial direction is perpendicular to the direction of extension of the welded portion 6. In other words, the first end 6a and the second end 6b are stacked in a direction perpendicular to the direction of extension of the welded portion 6.
[0029] The second end portion 6b is located outside the electronic device housing 3 in the axial direction compared to the first end portion 6a. In other words, the second end portion 6b is positioned to cover the first end portion 6a from the outside of the electronic device housing 3.
[0030] The first end portion 6a is the part that is formed inside the groove portion 8 before the second end portion 6b when forming the weld portion 6. The weld portion 6 is formed continuously from the first end portion 6a to the second end portion 6b. Therefore, the second end portion 6b is the last part to be formed when forming the weld portion 6. This second end portion 6b is formed by stacking the last part to be formed of the weld portion 6 onto the first end portion 6a, which was formed first.
[0031] The joint surface 10 between the first end 6a and the second end 6b is an inclined surface that is inclined with respect to the extension direction of the welded portion 6. In this embodiment, the joint surface 10 is inclined so as it moves from the inner end 10a, located inside the electronic equipment housing 3, towards the first end 6a side, to the outer end 10b, located outside the electronic equipment housing 3. The outer end 10b of such a joint surface 10 is connected to the bottom surface of a recess 20, which will be described later.
[0032] As shown in Figure 4, the electronic equipment housing 3 is provided with a recess 20. The recess 20 is formed by cutting out a portion of the welded portion 6, including the joint surface 10. Here, including the joint surface 10 means including the portion of the joint surface 10 that would have been provided if the recess 20 were not provided. The bottom of such a recess 20 is connected to one end of the joint surface 10 that remains after the welded portion 6 has been cut out.
[0033] The re-welded portion 7 is provided at the joint 6c between the first end 6a and the second end 6b of the welded portion 6. The re-welded portion 7 is provided so as to embed a recess 20 and be fixed to the inner wall surface of the recess 20. Such a re-welded portion 7 is formed by placing, for example, a forming material (molten resin) for the re-welded portion 7 into a recess 20 provided by cutting out a part of the formed welded portion 6 and allowing it to harden.
[0034] The joint surface 11 between the re-welded portion 7 and the first end portion 6a is formed to extend from the outer end 10b of the joint surface 10 to the surface end 11a, which is the end located on the outer surface of the welded portion 6. Similarly, the joint surface 12 between the re-welded portion 7 and the second end portion 6b is formed to extend from the outer end 10b of the joint surface 10 to the surface end 12a, which is the end located on the outer surface of the welded portion 6.
[0035] The joint surface 11 between the re-welded portion 7 and the first end portion 6a, and the joint surface 12 between the re-welded portion 7 and the second end portion 6b, form the re-welded joint surface 13, which is the joint surface between the re-welded portion 7 and the welded portion 6. In other words, the re-welded joint surface 13 is formed to extend from the surface edge 11a to the surface edge 12a.
[0036] Such a re-welded joint surface 13 is connected in a way that it is bent relative to the joint surface 10. As a result, the shape of the surface (the surface including the joint surface 10 and the re-welded joint surface 13) from the inside to the outside of the lid 5 is more complex than when the re-welded portion 7 is not provided and the joint surface 10 extends from the inside to the outside of the lid 5.
[0037] Furthermore, the length of the re-welded joint surface 13 (the dimension from surface edge 11a to surface edge 12a) is greater than the length of the joint surface 10 (the dimension from inner edge 10a to outer edge 10b). As a result, the creepage distance of the electronic equipment housing container 3 is longer than in the case where the re-welded section 7 is not provided and the joint surface 10 extends from the inside of the lid 5 to the outside of the lid 5.
[0038] Furthermore, the dimension from the outer end 10b to the surface end 11a is longer than the length of the joint surface 10 that is cut out by the recess 20. Also, the dimension from the outer end 10b to the surface end 12a is longer than the length of the joint surface 10 that is cut out by the recess 20.
[0039] The electronic device housing container 3 of this embodiment has an insulating structure 30 that includes a welded portion 6 with such a recess 20 and a re-welded portion 7. The insulating structure 30 has a more complex and longer creepage surface than the case where the recess 20 and re-welded portion 7 are not provided, and has higher insulating properties than an insulating structure without the recess 20 and re-welded portion 7.
[0040] Next, the manufacturing method of the electronic equipment unit 1 of this embodiment will be described. As shown in Figure 5, the manufacturing method of the electronic equipment unit 1 of this embodiment includes an electronic equipment housing step S1, a welded part formation step S2, a recess formation step S3, and a re-welded part formation step S4.
[0041] The electronic device housing process S1 is the process of housing the electronic device 2 in the cylindrical container 4. In the electronic device housing process S1, the lid 5 is positioned to close the open end of the cylindrical container 4. As a result, the inclined surface 4a of the cylindrical container 4 and the inclined surface 5a of the lid 5 are positioned opposite each other, forming a groove 8.
[0042] The welding joint formation step S2 is a step in which a welded joint 6 is formed to join the cylindrical container 4 and the lid portion 5. In this welding joint formation step S2, the welded joint 6 is formed so that the first end portion 6a and the second end portion 6b are joined together. By performing the welding joint formation step S2, a joint portion 6c is formed where the first end portion 6a and the second end portion 6b are joined together, as shown in Figures 7 and 8.
[0043] Furthermore, in the weld formation process S2, for example, a rod-shaped welding rod made of the material for forming the weld 6 is placed in the groove 8, and the welding rod is melted using a heating blower or the like that which heats and blows air. After that, the molten welding rod is cooled to form the weld 6 that is joined to the cylindrical container 4 and the lid 5.
[0044] The recess formation step S3 is a step in which a recess 20 is formed by cutting out a part of the welded portion 6, including the joint surface 10 between the first end 6a and the second end 6b, as shown in Figures 9 and 10. The recess 20 is formed by, for example, excavation work performed from the outside of the lid portion 5 on the welded portion 6 formed in the weld formation step S2. With the formation of such a recess 20, the length dimension of the joint surface 10 becomes shorter than before the recess 20 was formed.
[0045] The re-welding section formation step S4 is a step in which the recess 20 is filled to form the re-welded section 7. In this re-welding section formation step S4, for example, a member made of the material for forming the re-welded section 7 is placed in the recess 20 and the member is melted with a heating fan or the like. After that, the molten member is cooled to form the re-welded section 7 that fills the recess 20.
[0046] Furthermore, the insulating structure 30 is formed in the electronic equipment housing container 3 by performing the above-described welding joint formation step S2, recess formation step S3, and re-welding joint formation step S4. In other words, the above-described welding joint formation step S2, recess formation step S3, and re-welding joint formation step S4 are one step in the manufacturing method of the insulating structure 30. Thus, the manufacturing method of the insulating structure 30 includes the above-described welding joint formation step S2, recess formation step S3, and re-welding joint formation step S4.
[0047] Furthermore, the electronic equipment housing container 3 is manufactured by performing the above-described welding joint formation step S2, recess formation step S3, and re-welding joint formation step S4. In other words, the above-described welding joint formation step S2, recess formation step S3, and re-welding joint formation step S4 are one step in the manufacturing method of the insulating structure 30. Thus, the manufacturing method of the electronic equipment housing container 3 includes the above-described welding joint formation step S2, recess formation step S3, and re-welding joint formation step S4.
[0048] The insulating structure 30 of this embodiment, as described above, has an insulating re-welded section 7. The re-welded section 7 is provided at the joint 6c between the first end 6a and the second end 6b of the insulating welded section 6 that joins the cylindrical container 4 and the lid 5. The re-welded section 7 is formed by embedding a recess 20, which is provided by cutting out a part of the welded section 6, including the joint surface 10 between the first end 6a and the second end 6b.
[0049] The insulating structure 30 of this embodiment forms a creepage surface that is more complex and has a larger length than the case where the recess 20 and re-welded portion 7 are not provided. For this reason, the insulating structure 30 of this embodiment has higher insulating properties than the insulating structure without the recess 20 and re-welded portion 7. Therefore, the insulating structure 30 of this embodiment can improve the insulating properties at the joint 6c between the ends of the welded portion 6.
[0050] Furthermore, in this embodiment, since the re-welded portion 7 is embedded in the recess 20 of the insulating structure 30, the amount of axial protrusion of the re-welded portion 7 from the cover portion 5 can be suppressed. Therefore, interference between the re-welded portion 7 and other members can be prevented.
[0051] Furthermore, in the insulating structure 30 of this embodiment, the first end portion 6a and the second end portion 6b are arranged to overlap in a direction perpendicular to the extension direction of the linearly extending welded portion 6.
[0052] In this embodiment of the insulating structure 30, the creepage can be made longer compared to the case where the first end 6a and the second end 6b are not overlapped. Therefore, the insulating structure 30 of this embodiment can further improve the insulating properties.
[0053] Furthermore, in this embodiment, the length dimension of the re-welded joint surface 13, which is the joint surface 10 between the re-welded portion 7 and the welded portion 6, is greater than the length dimension of the joint surface 10 between the first end 6a and the second end 6b, in a cross section along the stretching direction and along the stacking direction between the first end 6a and the second end 6b.
[0054] In this embodiment of the insulating structure 30, the creepage length can be increased compared to the case where the length dimension of the re-welded joint surface 13 is smaller than the length dimension of the joint surface 10 between the first end 6a and the second end 6b. Therefore, the insulating structure 30 of this embodiment can further improve the insulating properties.
[0055] Furthermore, in the insulating structure 30 of this embodiment, the cylindrical container 4, the lid 5, the welded portion 6, and the re-welded portion 7 are all made of the same material.
[0056] In this embodiment, the insulating structure 30 integrates the cylindrical container 4, the lid 5, the welded portion 6, and the re-welded portion 7 when they are welded together, enabling a reliable and strong joint.
[0057] Furthermore, in the insulating structure 30 of this embodiment, the cylindrical container 4, the lid 5, the welded portion 6, and the re-welded portion 7 are all made of polyethylene resin.
[0058] According to this embodiment of the insulating structure 30, the cylindrical container 4, the lid 5, the welded part 6, and the re-welded part 7 are formed from polyethylene resin, which is highly processable and inexpensive, so the insulating structure 30 can be formed easily and inexpensively.
[0059] Furthermore, the electronic device housing container 3 of this embodiment includes a cylindrical container 4 for housing the electronic device 2, a lid portion 5 that closes the open end of the cylindrical container 4, and a welded portion 6 that joins the cylindrical container 4 and the lid portion 5. In addition, the electronic device housing container 3 of this embodiment has an insulating structure 30. Because the electronic device housing container 3 of this embodiment has an insulating structure 30, the insulation performance at the joint 6c between the ends of the welded portion 6 can be improved.
[0060] Furthermore, the electronic equipment unit 1 of this embodiment comprises the electronic equipment housing container 3 and the electronic equipment 2 described above. Therefore, since the electronic equipment unit 1 of this embodiment has an insulating structure 30, the insulation performance at the joint 6c between the ends of the welded portion 6 can be improved.
[0061] Furthermore, the manufacturing method of the insulating structure 30 of this embodiment includes a welded joint formation step S2, a recess formation step S3, and a re-welded joint formation step S4. The welded joint formation step S2 is a step of forming an insulating welded joint 6 that joins the cylindrical container 4 and the lid 5, such that the first end 6a and the second end 6b of the welded joint 6 are joined. The recess formation step S3 is a step of forming a recess 20 by cutting out a part of the welded joint 6, including the joining surface 10 between the first end 6a and the second end 6b. The re-welded joint formation step S4 is a step of filling the recess 20 to form an insulating re-welded joint 7.
[0062] The manufacturing method for the insulating structure 30 of this embodiment forms an insulating structure 30 having a more complex creepage surface and a larger length dimension than when the recess 20 and re-welded portion 7 are not provided. For this reason, the manufacturing method for the insulating structure 30 of this embodiment can improve the insulation performance at the joint 6c between the ends of the welded portion 6.
[0063] Furthermore, the manufacturing method of the electronic equipment housing container 3 of this embodiment includes a welded joint formation step S2, a recess formation step S3, and a re-welded joint formation step S4. The welded joint formation step S2 is a step of forming an insulating welded joint 6 that joins the cylindrical container 4 and the lid 5, such that the first end 6a and the second end 6b of the welded joint 6 are joined. The recess formation step S3 is a step of forming a recess 20 by cutting out a part of the welded joint 6, including the joining surface 10 between the first end 6a and the second end 6b. The re-welded joint formation step S4 is a step of filling the recess 20 to form an insulating re-welded joint 7.
[0064] The manufacturing method for the electronic device housing container 3 in this embodiment forms an insulating structure 30 with a more complex and longer creepage surface than in the case where the recess 20 and re-welded portion 7 are not provided. Therefore, the manufacturing method for the electronic device housing container 3 in this embodiment can improve the insulation performance at the joint 6c between the ends of the welded portion 6.
[0065] Furthermore, the manufacturing method of the electronic equipment unit 1 of this embodiment includes an electronic equipment housing step S1, a welded joint formation step S2, a recess formation step S3, and a re-welded joint formation step S4. The electronic equipment housing step S1 is a step of housing the electronic equipment 2 in a cylindrical container 4 that houses the electronic equipment 2. The welded joint formation step S2 is a step of forming an insulating welded joint 6 that joins the cylindrical container 4 and the lid 5, such that the first end 6a and the second end 6b of the welded joint 6 are joined. The recess formation step S3 is a step of forming a recess 20 by cutting out a part of the welded joint 6, including the joining surface 10 between the first end 6a and the second end 6b. The re-welded joint formation step S4 is a step of filling the recess 20 to form an insulating re-welded joint 7.
[0066] The manufacturing method of the electronic equipment unit 1 in this embodiment forms an insulating structure 30 that has a more complex creepage surface and a larger length than when the recess 20 and re-welded portion 7 are not provided. Therefore, the manufacturing method of the electronic equipment unit 1 in this embodiment can improve the insulation performance at the joint 6c between the ends of the welded portion 6.
[0067] (Second Embodiment) Next, a second embodiment of the present invention will be described. In this embodiment, the same parts as those in the first embodiment described above will be omitted or simplified.
[0068] As shown in Figure 11, the insulating structure 100 of this embodiment has an insulating re-welded portion 102 provided at the joint location 101c between the first end 101a and the second end 101b of the insulating welded portion 101 that joins the first member and the second member. The re-welded portion 102 is formed by embedding a recess 103 which is provided by cutting out a part of the welded portion 101, including the joint surface 101d between the first end 101a and the second end 101b.
[0069] The insulating structure 100 of this embodiment forms a creepage surface that is more complex and has a larger length dimension than the case where there are no recesses 103 or re-welded parts 102. For this reason, the insulating structure 100 of this embodiment has higher insulating properties than the insulating structure without recesses 103 or re-welded parts 102. Accordingly, the insulating structure 100 of this embodiment can improve the insulating properties at the joint 101c between the ends of the welded parts 101.
[0070] While embodiments of this disclosure have been described above, these embodiments are provided as examples and are not intended to limit the scope of this disclosure. These embodiments can be implemented in various other forms, and various omissions, substitutions, and modifications can be made without departing from the spirit of this disclosure. Furthermore, each embodiment can be combined with other embodiments as appropriate.
[0071] For example, in the above embodiment, a configuration was described in which one joint 6c and one re-welded portion 7 are provided with respect to the welded portion 6. However, the present invention is not limited thereto. For example, multiple joint 6c and re-welded portions 7 may be provided with respect to the welded portion 6.
[0072] Furthermore, in the above embodiment, a configuration was described in which the first end 6a and the second end 6b are ends of a single welded joint 6. However, one end of different welded joints may be designated as the first end and the other as the second end.
[0073] Some or all of the above embodiments may also be described as follows, but are not limited to the following:
[0074] (Note 1) The first member and the second member are joined together, and an insulating re-welded portion is provided at the joint between the first and second ends of the insulating welded portion. The re-welded portion is formed by embedding a recess that is provided by cutting out a part of the welded portion, including the joint surface between the first end and the second end. Insulating structure.
[0075] (Note 2) The first end and the second end are arranged to overlap in a direction perpendicular to the extension direction of the linearly extending welded portion. The insulating structure is as described in Appendix 1.
[0076] (Note 3) The joint surface between the first end and the second end is an inclined surface that is inclined with respect to the extension direction. The insulating structure is as described in Appendix 2.
[0077] (Note 4) In a cross-section along the extension direction and along the lamination direction between the first end and the second end, the length dimension of the re-welded joint surface, which is the joint surface between the re-welded portion and the welded portion, is greater than the length dimension of the joint surface between the first end and the second end. The insulating structure described in Appendix 2 or 3.
[0078] (Note 5) The first member, the second member, the welded portion, and the re-welded portion are all formed from the same material. The insulating structure described in any one of the appendices 1 to 4.
[0079] (Note 6) The first member, the second member, the welded portion, and the re-welded portion are all made of polyethylene resin. The insulating structure is as described in Appendix 5.
[0080] (Note 7) The first component, a cylindrical container, houses the electronic device, The lid portion, which is the second member, closes the open end of the cylindrical container, The welded portion that joins the cylindrical container and the lid, Equipped with, Having one of the insulating structures described in Appendix 1 to 6, Electronic device enclosure.
[0081] (Note 8) The electronic equipment housing container described in Appendix 7, The aforementioned electronic device, Equipped with, Electronic equipment unit.
[0082] (Note 9) A welding joint forming step is to form an insulating welded joint that joins a first member and a second member, such that the first end and the second end of the welded joint are joined together. A recess forming step involves forming a recess by cutting out a portion of the welded portion, including the joint surface between the first end and the second end, A re-welding part formation step involves filling the recess and forming an insulating re-welded part, possess, A method for manufacturing an insulating structure.
[0083] (Note 10) The first end and the second end are arranged to overlap in a direction perpendicular to the extension direction of the linearly extending welded portion. A method for manufacturing the insulating structure described in Appendix 9.
[0084] (Note 11) The joint surface between the first end and the second end is an inclined surface that is inclined with respect to the extension direction. A method for manufacturing the insulating structure described in Appendix 10.
[0085] (Note 12) In a cross-section along the extension direction and along the lamination direction between the first end and the second end, the length dimension of the re-welded joint surface, which is the joint surface between the re-welded portion and the welded portion, is greater than the length dimension of the joint surface between the first end and the second end. A method for manufacturing an insulating structure as described in Appendix 10 or 11.
[0086] (Note 13) The first member, the second member, the welded portion, and the re-welded portion are all formed from the same material. A method for manufacturing an insulating structure as described in any one of the appendices 9 to 12.
[0087] (Note 14) The first member, the second member, the welded portion, and the re-welded portion are all made of polyethylene resin. A method for manufacturing the insulating structure described in Appendix 13.
[0088] (Note 15) A welding joint forming step is performed to form an insulating welded joint that joins a cylindrical container for housing electronic equipment and a lid that closes the open end of the cylindrical container, such that the first end and second end of the welded joint are joined together. A recess forming step involves forming a recess by cutting out a portion of the welded portion, including the joint surface between the first end and the second end, A re-welding part formation step involves filling the recess and forming an insulating re-welded part, possess, A method for manufacturing an electronic device enclosure.
[0089] (Note 16) The first end and the second end are arranged to overlap in a direction perpendicular to the extension direction of the linearly extending welded portion. A method for manufacturing an electronic device housing as described in Appendix 15.
[0090] (Note 17) The joint surface between the first end and the second end is an inclined surface that is inclined with respect to the extension direction. A method for manufacturing an electronic device housing as described in Appendix 16.
[0091] (Note 18) In a cross-section along the extension direction and along the lamination direction between the first end and the second end, the length dimension of the re-welded joint surface, which is the joint surface between the re-welded portion and the welded portion, is greater than the length dimension of the joint surface between the first end and the second end. A method for manufacturing an electronic device housing as described in Appendix 16 or 17.
[0092] (Note 19) The cylindrical container, the lid, the welded portion, and the re-welded portion are all made of the same material. A method for manufacturing an electronic device housing container as described in any one of Appendix 15 to 18.
[0093] (Note 20) The cylindrical container, the lid, the welded portion, and the re-welded portion are all made of polyethylene resin. A method for manufacturing an electronic device housing as described in Appendix 19.
[0094] (Note 21) A process of housing electronic equipment, which involves housing the electronic equipment in a cylindrical container for housing electronic equipment, A welding joint forming step is to form an insulating welded joint that joins the cylindrical container and the lid that closes the open end of the cylindrical container, such that the first end and the second end of the welded joint are joined together. A recess forming step involves forming a recess by cutting out a portion of the welded portion, including the joint surface between the first end and the second end, A re-welding part formation step involves filling the recess and forming an insulating re-welded part, possess, A method for manufacturing electronic equipment units.
[0095] (Note 22) The first end and the second end are arranged to overlap in a direction perpendicular to the extension direction of the linearly extending welded portion. A method for manufacturing the electronic equipment unit described in Appendix 21.
[0096] (Note 23) The joint surface between the first end and the second end is an inclined surface that is inclined with respect to the extension direction. A method for manufacturing the electronic equipment unit described in Appendix 22.
[0097] (Note 24) In a cross-section along the extension direction and along the lamination direction between the first end and the second end, the length dimension of the re-welded joint surface, which is the joint surface between the re-welded portion and the welded portion, is greater than the length dimension of the joint surface between the first end and the second end. A method for manufacturing an electronic device unit as described in Appendix 22 or 23.
[0098] (Note 25) The cylindrical container, the lid, the welded portion, and the re-welded portion are all made of the same material. A method for manufacturing an electronic device unit as described in any one of the appendices 21 to 24.
[0099] (Note 26) The cylindrical container, the lid, the welded portion, and the re-welded portion are all made of polyethylene resin. A method for manufacturing the electronic equipment unit described in Appendix 25. [Explanation of Symbols]
[0100] 1. Electronic equipment unit 2 Electronic equipment 3. Electronic equipment housing 4. Cylindrical container 4a Slope 5 Lid 5a Slope 6. Welded section 6a First end 6b Second end 6c Joint 7. Re-welded section 8 grooves 10 Joint surface 10a Inner end 10b Outer edge 11 Joint surface 11a Surface edge 12 Joint surface 12a Surface edge 13 Re-welded joint surface 20 recesses 30 Insulation structure 100 Insulation structure 101 Welded section 101a First end 101b Second end 101c Joint 101d Joint surface 102 Re-welded section 103 Recess L center axis
Claims
1. It has an insulating re-welded portion provided at the joint between the first end and the second end of the insulating welded portion that joins the first member and the second member, The re-welded portion is formed by embedding a recess that is provided by cutting out a part of the welded portion, including the joint surface between the first end and the second end. Insulating structure.
2. The first end and the second end are arranged to overlap in a direction perpendicular to the extension direction of the linearly extending welded portion. The insulating structure according to claim 1.
3. The joint surface between the first end and the second end is an inclined surface that is inclined with respect to the extension direction. The insulating structure according to claim 2.
4. In a cross-section along the extension direction and along the stacking direction between the first end and the second end, the length dimension of the re-welded joint surface, which is the joint surface between the re-welded portion and the welded portion, is greater than the length dimension of the joint surface between the first end and the second end. The insulating structure according to claim 2 or 3.
5. The first component, a cylindrical container, houses electronic equipment, The lid portion, which is the second member, closes the open end of the cylindrical container, The welded portion that joins the cylindrical container and the lid, Equipped with, Having an insulating structure according to any one of claims 1 to 3, Electronic device enclosure.
6. The electronic device housing container according to claim 5, The aforementioned electronic device, Equipped with, Electronic equipment unit.
7. A welding joint forming step is to form an insulating welded joint that joins a first member and a second member, such that the first end and the second end of the welded joint are joined together. A recess forming step involves forming a recess by cutting out a portion of the welded portion, including the joint surface between the first end and the second end, A re-welding part formation step involves filling the recess and forming an insulating re-welded part, possess, A method for manufacturing an insulating structure.
8. A welding joint forming step is performed to form an insulating welded joint that joins a cylindrical container for housing electronic equipment and a lid that closes the open end of the cylindrical container, such that the first end and the second end of the welded joint are joined together. A recess forming step involves forming a recess by cutting out a portion of the welded portion, including the joint surface between the first end and the second end, A re-welding part formation step involves filling the recess and forming an insulating re-welded part, possess, A method for manufacturing an electronic device enclosure.
9. A process of housing electronic equipment, which involves housing the electronic equipment in a cylindrical container for housing electronic equipment, A welding joint forming step is to form an insulating welded joint that joins the cylindrical container and the lid that closes the open end of the cylindrical container, such that the first end and the second end of the welded joint are joined together. A recess forming step involves forming a recess by cutting out a portion of the welded portion, including the joint surface between the first end and the second end, A re-welding part formation step involves filling the recess and forming an insulating re-welded part, possess, A method for manufacturing electronic equipment units.
Citation Information
Patent Citations
Battery and battery manufacturing method
JP2012186005A