Capacitor module

Abstract

This invention provides a capacitor module that suppresses cracking of the sealing resin even when the capacitor element expands due to moisture absorption. [Solution] The capacitor module 1 comprises a capacitor element 10 having a first external electrode 12a and a second external electrode 12b, a first busbar 20 electrically connected to the first external electrode 12a, a second busbar 30 electrically connected to the second external electrode 12b, an insulator 40 sandwiched between the first busbar and the second busbar so as to form a laminated structure together with the first busbar and the second busbar, a case 50 in which the capacitor element is housed, and a sealing resin 60 filled inside the case in which the capacitor element is embedded and the first busbar, the second busbar and the insulator are drawn out from the inside to the outside, wherein the first busbar and the insulator are locked together inside the sealing resin, and the second busbar and the insulator are locked together inside the sealing resin.

Description

Technical Field

[0001] The present invention relates to a capacitor module.

Background Art

[0002] Patent Document 1 discloses a capacitor including: a capacitor case having a bottom and an opening; a capacitor element accommodated in the capacitor case and including a first electrode E1 and a second electrode E2; a first terminal T1 connected to the first electrode E1; a second terminal T2 connected to the second electrode E2 and having a facing portion facing the first terminal T1; and an insulating member interposed between the first terminal T1 and the second terminal T2 and including an insulating plate that at least insulates the facing portion from the first terminal T1. The first terminal T1 and the second terminal T2 each have an extending portion TE extending outside the capacitor case. The capacitor case has a fixing portion A for fixing the insulating plate. The insulating member has a fixing portion B1 that fits with the fixing portion A and a fixing portion B2 that fixes at least one of the first terminal T1 and the second terminal T2.

[0003] Patent Document 2 discloses a bus bar structure of a capacitor in which an insulating plate is sandwiched between first and second opposing plate portions where first and second plate-like bus bars, each having a base end portion connected to a pair of electrodes of opposite polarities of a capacitor element, are close to each other and a part of each of them faces in a parallel posture. The insulating plate is integrally formed with a bulging portion that bulges in a first direction from the first opposing plate portion toward the second opposing plate portion. The first opposing plate portion is integrally formed with a first fitting portion that bulges in the first direction. The first fitting portion fits in the first direction with respect to one surface side of the bulging portion on the insulating plate. The second opposing plate portion is integrally formed with a second fitting portion that bulges in the first direction. The second fitting portion fits in a second direction opposite to the first direction with respect to the other surface side of the bulging portion.

Prior Art Documents

Patent Documents

[0004] [Patent Document 1] Japanese Patent Publication No. 2016-152243 [Patent Document 2] Japanese Patent Publication No. 2021-144964 [Overview of the project] [Problems that the invention aims to solve]

[0005] In a capacitor module in which a capacitor element is housed inside a case and a sealing resin is filled inside the case so that the capacitor element is embedded, generally, a first busbar electrically connected to the first external electrode of the capacitor element and a second busbar electrically connected to the second external electrode of the capacitor element are drawn out from the inside to the outside of the sealing resin and electrically connected to the object to be connected, such as a circuit board or device. Furthermore, in order to ensure insulation between the first busbar and the second busbar (to prevent a short circuit between the first busbar and the second busbar), an insulator is sandwiched between the first busbar and the second busbar, and the insulator, along with the first busbar and the second busbar, is drawn out from the inside to the outside of the sealing resin.

[0006] However, with the capacitor module configuration described above, there is a risk that moisture may be introduced into the encapsulating resin during manufacturing, or that moisture may penetrate into the encapsulating resin from the outside during use. Moisture that thus becomes present inside the encapsulating resin may penetrate into the capacitor elements present inside the encapsulating resin. When moisture penetrates into the capacitor elements, the capacitor elements expand as they absorb the moisture, and the first busbar, second busbar, and insulator surrounding the capacitor elements are pressed against the encapsulating resin by the expanded capacitor elements, which may cause the encapsulating resin to crack (for example, develop a fissure). When the encapsulating resin cracks, moisture can more easily penetrate into the capacitor elements from the encapsulating resin itself, which may lead to a deterioration in the electrical characteristics of the capacitor elements and thus reduce the reliability of the capacitor module.

[0007] Regarding the capacitor described in Patent Document 1, if we assume that the capacitor case shown in Figure 1 is filled with sealing resin and the capacitor element is embedded in the sealing resin, as described above, there is a risk that the sealing resin may crack due to moisture entering the capacitor element inside the sealing resin.

[0008] Regarding the capacitor busbar structure described in Patent Document 2, assuming that the capacitor elements of the capacitor element unit shown in Figure 1 are housed inside the case and that sealing resin is filled inside the case so that the capacitor elements are embedded, as described above, there is a risk that moisture may penetrate into the capacitor elements inside the sealing resin, causing the sealing resin to crack.

[0009] The present invention was made to solve the above problems and aims to provide a capacitor module that can suppress cracking of the sealing resin even when the capacitor element expands due to moisture absorption. [Means for solving the problem]

[0010] The capacitor module of the present invention comprises a capacitor element having a first external electrode and a second external electrode; a first busbar electrically connected to the first external electrode; a second busbar electrically connected to the second external electrode; an insulator sandwiched between the first busbar and the second busbar so as to form a laminated structure together with the first busbar and the second busbar; a case in which the capacitor element is housed; and a sealing resin filled inside the case so as to embed the capacitor element and allow the first busbar, the second busbar, and the insulator to be drawn out from the inside to the outside, wherein the first busbar and the insulator are locked together within the sealing resin, and the second busbar and the insulator are locked together within the sealing resin. [Effects of the Invention]

[0011] According to the present invention, it is possible to provide a capacitor module that can suppress cracking of the sealing resin even when the capacitor element expands due to absorbing moisture. [Brief explanation of the drawing]

[0012] [Figure 1] Figure 1 is a schematic perspective view showing an example of the capacitor module of the present invention. [Figure 2] Figure 2 is a schematic perspective view showing an example of the capacitor module in Figure 1 with the sealing resin removed. [Figure 3] Figure 3 is a schematic perspective view showing an example of the capacitor module in Figure 1 with the sealing resin and case removed. [Figure 4] Figure 4 is a schematic perspective view showing an example of the capacitor element in Figure 3. [Figure 5] Figure 5 is a schematic cross-sectional view showing an example of a cross-section along the line a1-a2 of the capacitor element in Figure 4. [Figure 6] Figure 6 is a schematic cross-sectional view showing an example of a cross-section along the line A1-A2 of the capacitor module in Figure 1. [Figure 7] Figure 7 is a schematic cross-sectional view illustrating another example of the capacitor module of the present invention, with a configuration different from that of Figure 6. [Figure 8] Figure 8 is a schematic cross-sectional view illustrating another example of the capacitor module of the present invention, with a configuration different from that of Figures 6 and 7. [Figure 9] Figure 9 is a schematic cross-sectional view illustrating another example of the capacitor module of the present invention, with a configuration different from that of Figures 6, 7, and 8. [Figure 10] Figure 10 is a schematic cross-sectional view illustrating another example of the capacitor module of the present invention, with a configuration different from that of Figures 6, 7, 8, and 9. [Modes for carrying out the invention]

[0013] Hereinafter, the capacitor module of the present invention will be described. Note that the present invention is not limited to the following configuration and may be appropriately modified without departing from the gist of the present invention. Also, a combination of a plurality of the individual preferred configurations described below is also within the scope of the present invention.

[0014] The drawings shown below are schematic diagrams, and their dimensions, scales of aspect ratios, etc. may differ from those of actual products.

[0015] In this specification, unless otherwise specified, terms indicating the relationship between elements (e.g., "parallel", "perpendicular", etc.) and terms indicating the shape of elements do not only mean a strictly literal aspect, but also mean a substantially equivalent range, for example, a range including a difference of about a few percent.

[0016] [Capacitor Module] The capacitor module of the present invention includes a capacitor element having a first external electrode and a second external electrode, a first bus bar electrically connected to the first external electrode, a second bus bar electrically connected to the second external electrode, an insulator sandwiched between the first bus bar and the second bus bar so as to form a laminated structure together with the first bus bar and the second bus bar, a case in which the capacitor element is housed inside, a sealing resin filled inside the case so that the capacitor element is embedded and the first bus bar, the second bus bar, and the insulator are drawn out from the inside to the outside, and inside the sealing resin, the first bus bar and the insulator are locked to each other, and the second bus bar and the insulator are locked to each other.

[0017] In a conventional capacitor module, when it is assumed that moisture enters the capacitor element existing inside the sealing resin due to moisture being brought into the inside of the sealing resin during manufacturing or moisture entering from the outside to the inside of the sealing resin during use, the capacitor element expands by absorbing the moisture, and the first bus bar, the second bus bar, and the insulator existing around the capacitor element are pressed against the sealing resin by the expanded capacitor element, so there is a risk that the sealing resin will crack (for example, develop cracks). For example, in a conventional capacitor module, as the capacitor element that expands by absorbing moisture presses the insulator, and the pressed insulator presses the first bus bar and the second bus bar, the expansion of the capacitor element makes the first bus bar, the second bus bar, and the insulator more likely to move. Therefore, in a conventional capacitor module, the first bus bar, the second bus bar, and the insulator are more likely to be pressed against the sealing resin by the expanded capacitor element, so the sealing resin is more likely to crack. When the sealing resin cracks, moisture is more likely to enter the capacitor element from the sealing resin itself, so there is a risk that the reliability of the capacitor module will decrease, such as the electrical characteristics of the capacitor element deteriorating.

[0018] In contrast, in the capacitor module of the present invention, the first busbar and the insulator are locked together within the encapsulating resin, and the second busbar and the insulator are also locked together. As a result, in the capacitor module of the present invention, the first busbar, the second busbar, and the insulator are integrated, making it difficult for them to move independently. Therefore, in the capacitor module of the present invention, even if the capacitor element expands due to absorbing moisture and tries to push the first busbar, the second busbar, and the insulator, the first busbar, the second busbar, and the insulator will be difficult to move. For example, in the capacitor module of the present invention, it is less likely that the capacitor element, which has expanded due to absorbing moisture, will push the insulator, and the pushed insulator will then push the first and second busbars. Consequently, in the capacitor module of the present invention, the first busbar, the second busbar, and the insulator are less likely to be pressed against the encapsulating resin by the expanded capacitor element, making it less likely for the encapsulating resin to crack. As described above, in the capacitor module of the present invention, even if the capacitor element expands due to absorbing moisture, it is possible to suppress cracking of the sealing resin, and as a result, it is possible to suppress a decrease in reliability.

[0019] The following describes a specific example of the capacitor module of the present invention.

[0020] Figure 1 is a schematic perspective view showing an example of the capacitor module of the present invention. Figure 2 is a schematic perspective view showing an example of the capacitor module in Figure 1 with the sealing resin removed. Figure 3 is a schematic perspective view showing an example of the capacitor module in Figure 1 with both the sealing resin and the case removed.

[0021] In Figure 1, etc., the first direction D1, the second direction D2, and the third direction D3 are perpendicular to each other.

[0022] As shown in Figures 1, 2, and 3, the capacitor module 1 includes a capacitor element 10, a first busbar 20, a second busbar 30, an insulator 40, a case 50, and a sealing resin 60.

[0023] <Capacitor element> Figure 4 is a schematic perspective view showing an example of a capacitor element in Figure 3. Figure 5 is a schematic cross-sectional view showing an example of a cross-section along the line a1-a2 of the capacitor element in Figure 4.

[0024] As shown in Figures 4 and 5, the capacitor element 10 includes a base body 11, a first external electrode 12a, and a second external electrode 12b.

[0025] The base body 11 is a wound body in which a first metallized film 13a and a second metallized film 13b are stacked in a first direction D1 and wound together. In other words, the capacitor element 10 is a wound-type film capacitor in which metallized films are stacked and wound together.

[0026] The capacitor element 10 may also be a multilayer film capacitor (for example, in the shape of a rectangular parallelepiped) formed by stacking metallized films.

[0027] The base body 11 has a first end face 11a and a second end face 11b that are opposite to the second direction D2.

[0028] The base body 11 further has a side surface 11c that extends in the second direction D2 so as to connect the periphery of the first end surface 11a and the second end surface 11b.

[0029] In the capacitor element 10, from the viewpoint of reducing the height, it is preferable that the cross-sectional shape of the base body 11 is flattened when viewed in a cross-section perpendicular to the winding axis direction (second direction D2 in Figures 4 and 5). Specifically, it is preferable that the cross-sectional shape of the base body 11 is pressed into a flattened shape such as an ellipse or oblong, and that the thickness is smaller than when the cross-sectional shape of the base body 11 is a perfect circle.

[0030] Whether the base body 11 was pressed to have a flattened cross-sectional shape can be confirmed, for example, by checking whether there are press marks on the base body 11.

[0031] The capacitor element 10 may have a cylindrical winding shaft. The winding shaft is positioned on the central axis of the first metallized film 13a and the second metallized film 13b in the wound state, and serves as the winding shaft when winding the first metallized film 13a and the second metallized film 13b.

[0032] The first metallized film 13a comprises a first dielectric film 14a and a first metal layer 15a.

[0033] The first dielectric film 14a has a first main surface 14aa and a second main surface 14ab that are opposite to the first direction D1.

[0034] The first metal layer 15a is provided on the first main surface 14aa of the first dielectric film 14a. Specifically, the first metal layer 15a is provided on the first main surface 14aa of the first dielectric film 14a such that, in the second direction D2, it reaches one side edge of the first dielectric film 14a but does not reach the other side edge of the first dielectric film 14a.

[0035] The second metallized film 13b comprises a second dielectric film 14b and a second metal layer 15b.

[0036] The second dielectric film 14b has a first main surface 14ba and a second main surface 14bb that are opposite to the first direction D1.

[0037] The second metal layer 15b is provided on the first main surface 14ba of the second dielectric film 14b. Specifically, the second metal layer 15b is provided on the first main surface 14ba of the second dielectric film 14b such that, in the second direction D2, it does not reach one side edge of the second dielectric film 14b but reaches the other side edge of the second dielectric film 14b.

[0038] In the base body 11, the adjacent first metallized film 13a and second metallized film 13b are shifted in the second direction D2 such that the end of the first metal layer 15a that reaches the side edge of the first dielectric film 14a is exposed on the first end face 11a of the base body 11, and the end of the second metal layer 15b that reaches the side edge of the second dielectric film 14b is exposed on the second end face 11b of the base body 11. In other words, in the adjacent first metallized film 13a and second metallized film 13b, the first metallized film 13a protrudes toward the first external electrode 12a side relative to the second metallized film 13b. Also, in the adjacent first metallized film 13a and second metallized film 13b, the second metallized film 13b protrudes toward the second external electrode 12b side relative to the first metallized film 13a. In this state, the first metal layer 15a is connected to the first external electrode 12a but not to the second external electrode 12b. Also, the second metal layer 15b is connected to the second external electrode 12b but not to the first external electrode 12a.

[0039] In the base body 11, as described above, the adjacent first metallized film 13a and second metallized film 13b are shifted in the second direction D2. Therefore, in the adjacent first dielectric film 14a and second dielectric film 14b, the first dielectric film 14a, on which the first metal layer 15a is provided on the first main surface 14aa, protrudes toward the first external electrode 12a side relative to the second dielectric film 14b, on which the first metal layer 15a is not provided on the main surface. Also, in the adjacent first dielectric film 14a and second dielectric film 14b, the second dielectric film 14b, on which the second metal layer 15b is provided on the first main surface 14ba, protrudes toward the second external electrode 12b side relative to the first dielectric film 14a, on which the second metal layer 15b is not provided on the main surface.

[0040] Since the base body 11 is formed by winding the first metallized film 13a and the second metallized film 13b in a state where they are stacked in a first direction D1, it can be said that it contains the first dielectric film 14a, the first metal layer 15a, the second dielectric film 14b, and the second metal layer 15b in the first direction D1 in that order. Alternatively, the base body 11 can be said to be a wound body formed by winding the first dielectric film 14a, the first metal layer 15a, the second dielectric film 14b, and the second metal layer 15b in a state where they are stacked in the first direction D1 in that order.

[0041] In the base material 11, the first main surface 14aa of the first dielectric film 14a and the second main surface 14bb of the second dielectric film 14b face each other in the first direction D1, and the second main surface 14ab of the first dielectric film 14a and the first main surface 14ba of the second dielectric film 14b face each other in the first direction D1. Thus, in the base material 11, the first metallized film 13a and the second metallized film 13b are wound in a state where they are stacked in the first direction D1. In other words, in the base material 11, the first metallized film 13a is on the inside of the second metallized film 13b, specifically, the first metal layer 15a is on the inside of the first dielectric film 14a, and the second metal layer 15b is on the inside of the second dielectric film 14b, so the first metallized film 13a and the second metallized film 13b are wound in a state where they are stacked in the first direction D1. In other words, in the base body 11, the first metal layer 15a and the second metal layer 15b face each other with either the first dielectric film 14a or the second dielectric film 14b in between.

[0042] A fuse portion may be provided in the first metal layer 15a. The fuse portion provided in the first metal layer 15a is, for example, a portion that connects a divided electrode portion, which is a portion of the first metal layer 15a that is divided into multiple parts, with an electrode portion that is not facing the second metal layer 15b. Examples of electrode patterns for the first metal layer 15a provided with a fuse portion include the electrode patterns disclosed in Japanese Patent Application Publication No. 2004-363431 and Japanese Patent Application Publication No. Hei 5-251266.

[0043] The second metal layer 15b may also be provided with a fuse portion, similar to the first metal layer 15a.

[0044] The first dielectric film 14a may contain a curable resin as its main component.

[0045] In this specification, the main component means the component with the highest weight percentage, and preferably means a component with a weight percentage higher than 50% by weight.

[0046] The curable resin may be a thermosetting resin or a photocurable resin.

[0047] In this specification, thermosetting resins mean resins that can be cured by heat, but this does not limit the curing method. Therefore, thermosetting resins include resins that can be cured by methods other than heat (e.g., light, electron beam, etc.), as long as they can be cured by heat. In addition, depending on the material, the reaction may be initiated by the reactivity of the material itself, and resins that proceed to cure without necessarily being subjected to external heat are also considered thermosetting resins. The same applies to photocurable resins; as long as they can be cured by light, they also include resins that can be cured by methods other than light (e.g., heat, etc.).

[0048] The curable resin is preferably composed of a cured product of a first organic material having hydroxyl groups (OH groups) and a second organic material having isocyanate groups (NCO groups). In this case, the curable resin is composed of a cured product having urethane bonds obtained by the reaction of the hydroxyl groups of the first organic material and the isocyanate groups of the second organic material.

[0049] The presence of urethane bonding in the first dielectric film 14a can be confirmed by analysis using Fourier transform infrared spectrophotometer (FT-IR).

[0050] When a curable resin is obtained by the reaction described above, uncured portions of the starting material may remain in the first dielectric film 14a. For example, the first dielectric film 14a may contain at least one of hydroxyl groups and isocyanate groups. In this case, the first dielectric film 14a may contain either one of hydroxyl groups and isocyanate groups, or both hydroxyl groups and isocyanate groups.

[0051] The presence of hydroxyl groups and / or isocyanate groups in the first dielectric film 14a can be confirmed by analysis using a Fourier transform infrared spectrophotometer (FT-IR).

[0052] Examples of the first organic material include phenoxy resin, polyvinyl acetal resin, and polyvinyl butyral resin.

[0053] Multiple types of organic materials may be used in combination as the first organic material.

[0054] Examples of the second organic material include aromatic polyisocyanates such as diphenylmethane diisocyanate (MDI) and tolylene diisocyanate (TDI), and aliphatic polyisocyanates such as hexamethylene diisocyanate (HDI). As the second organic material, at least one modified form of these polyisocyanates may be used, or a mixture of at least one of these polyisocyanates and its modified form may be used.

[0055] Multiple types of organic materials may be used in combination as the second organic material.

[0056] The first dielectric film 14a may contain a thermoplastic resin as its main component.

[0057] Examples of thermoplastic resins include polypropylene resin, polyethersulfone resin, polyetherimide resin, and polyarylate resin.

[0058] The first dielectric film 14a may further contain additives for adding various functions.

[0059] Examples of additives include leveling agents used to impart smoothness.

[0060] The additive preferably has a functional group that reacts with hydroxyl groups and / or isocyanate groups, and forms part of the crosslinked structure of the cured product. Examples of such additives include resins having at least one functional group selected from the group consisting of hydroxyl groups, epoxy groups, silanol groups, and carboxyl groups.

[0061] The second dielectric film 14b, like the first dielectric film 14a, may contain a thermosetting resin as its main component, a photocurable resin as its main component, or a thermoplastic resin as its main component. Furthermore, the second dielectric film 14b, like the first dielectric film 14a, may also contain additives.

[0062] The constituent materials of the first dielectric film 14a and the second dielectric film 14b may be different from each other, but it is preferable that they be the same.

[0063] The thickness of the first dielectric film 14a and the second dielectric film 14b is preferably 1 μm or more and 10 μm or less, and more preferably 3 μm or more and 5 μm or less.

[0064] The thicknesses of the first dielectric film 14a and the second dielectric film 14b may be different, but it is preferable that they be the same.

[0065] The thicknesses of the first dielectric film 14a and the second dielectric film 14b are measured using an optical film thickness gauge.

[0066] The first dielectric film 14a and the second dielectric film 14b are preferably each produced by forming a resin solution containing the resin material described above into a film, and then curing it by heat treatment.

[0067] Examples of constituent materials for the first metal layer 15a and the second metal layer 15b include metals such as aluminum, zinc, titanium, magnesium, tin, and nickel.

[0068] The constituent materials of the first metal layer 15a and the second metal layer 15b may be different from each other, but it is preferable that they be the same.

[0069] The thickness of the first metal layer 15a and the second metal layer 15b is preferably 5 nm or more and 40 nm or less.

[0070] The thicknesses of the first metal layer 15a and the second metal layer 15b may be different, but it is preferable that they be the same.

[0071] The thicknesses of the first metal layer 15a and the second metal layer 15b are measured by observing the cross-sections of the first metallized film 13a and the second metallized film 13b along the first direction D1 using a transmission electron microscope (TEM).

[0072] The first metal layer 15a and the second metal layer 15b are preferably formed by depositing the above-described metal onto the main surfaces of the first dielectric film 14a and the second dielectric film 14b, respectively.

[0073] Although the above describes an embodiment in which the base body 11 includes two metallized films, the base body 11 may include only one metallized film. For example, the base body 11 may include a metallized film having a first dielectric film 14a in which a first metal layer 15a is provided on a first main surface 14aa and a second metal layer 15b is provided on a second main surface 14ab, and a second dielectric film 14b without a metal layer. Alternatively, the base body 11 may include a metallized film having a second dielectric film 14b in which a first metal layer 15a is provided on a second main surface 14bb and a second metal layer 15b is provided on a first main surface 14ba, and a first dielectric film 14a without a metal layer.

[0074] The first external electrode 12a is provided on the surface of the base body 11. In the example shown in Figures 4 and 5, the first external electrode 12a is provided on the first end face 11a of the base body 11. The first external electrode 12a is connected to the first metal layer 15a by contacting the end of the first metal layer 15a exposed on the first end face 11a of the base body 11. On the other hand, the first external electrode 12a is not connected to the second metal layer 15b.

[0075] The second external electrode 12b is provided on the surface of the base body 11 at a position away from the first external electrode 12a. In the example shown in Figures 4 and 5, the second external electrode 12b is provided on the second end face 11b of the base body 11. The second external electrode 12b is connected to the second metal layer 15b by contacting the end of the second metal layer 15b exposed on the second end face 11b of the base body 11. On the other hand, the second external electrode 12b is not connected to the first metal layer 15a.

[0076] The first external electrode 12a and the second external electrode 12b have opposite polarities. For example, the first external electrode 12a may be the positive electrode (P pole) and the second external electrode 12b may be the negative electrode (N pole), or the first external electrode 12a may be the negative electrode (N pole) and the second external electrode 12b may be the positive electrode (P pole).

[0077] Examples of materials that make up the first external electrode 12a and the second external electrode 12b include metals such as zinc, aluminum, tin, and zinc-aluminum alloys.

[0078] The constituent materials of the first external electrode 12a and the second external electrode 12b may be different from each other, but it is preferable that they be the same.

[0079] The first external electrode 12a and the second external electrode 12b are preferably formed by thermal spraying the above-described metal onto the first end face 11a and the second end face 11b of the base body 11, respectively.

[0080] The above configuration is merely one example of a capacitor element 10. In other words, the capacitor element 10 is not limited to the above configuration.

[0081] In the above example, the capacitor element 10 is shown to be a film capacitor, but the capacitor element 10 may be a capacitor element other than a film capacitor.

[0082] The number of capacitor elements 10 in the capacitor module 1 is not particularly limited. In other words, the capacitor module 1 only needs to have at least one capacitor element 10, and specifically, it may have one capacitor element 10 or it may have multiple capacitor elements 10.

[0083] If the capacitor module 1 has multiple capacitor elements 10, the configurations of the multiple capacitor elements 10 may be the same as each other, different from each other, or partially different.

[0084] When the capacitor module 1 has multiple capacitor elements 10, the arrangement of the multiple capacitor elements 10 when housed inside the case 50 is not particularly limited. For example, the multiple capacitor elements 10 may be arranged in one row or in multiple rows when housed inside the case 50. When the multiple capacitor elements 10 are arranged in multiple rows, the multiple capacitor elements 10 may be arranged in multiple rows in one direction or in multiple directions.

[0085] <First bus bar> The first busbar 20 is electrically connected to the first external electrode 12a. The first busbar 20 may be connected to the first external electrode 12a by, for example, welding or by a joining member such as solder. As a result, the first external electrode 12a is electrically drawn out through the first busbar 20. For example, if the first external electrode 12a is the positive electrode, the first busbar 20 becomes the lead conductor for the positive electrode.

[0086] The first busbar 20 has a first terminal 21 located outside the sealing resin 60. The first terminal 21 is located on the side of the first busbar 20 opposite to the capacitor element 10, rather than on the side of the first busbar 20 opposite to the capacitor element 10. The first terminal 21 is electrically connected to an object to be connected (not shown), such as a substrate or device, by, for example, laser welding.

[0087] The number of first terminals 21 on the first busbar 20 is not particularly limited. That is, the first busbar 20 may have one first terminal 21 or may have multiple first terminals 21.

[0088] The first busbar 20 may be bent inside the sealing resin 60. In the examples shown in Figures 1, 2, and 3, the first busbar 20 has a first type portion 20a that extends inside the sealing resin 60 in a direction along the side surface 11c of the element 11 on which the first external electrode 12a and the second external electrode 12b are not provided on the surface of the capacitor element 10, and a second type portion 20b that extends from the inside to the outside of the sealing resin 60 relative to the first type portion 20a. The first type portion 20a and the second type portion 20b extend in directions that intersect each other, and in this case, in directions perpendicular to each other. In other words, the first busbar 20 is bent inside the sealing resin 60 at the connection point between the first type portion 20a and the second type portion 20b. Note that although the first busbar 20 is bent at the first type portion 20a (see Figure 6 described later), it does not have to be bent at the first type portion 20a.

[0089] The first bus bar 20 does not need to be bent inside the sealing resin 60.

[0090] Examples of materials that can be used to construct the first busbar 20 include metals such as copper, oxygen-free copper, aluminum, and alloys containing at least one of these. In particular, the constituent material of the first busbar 20 is preferably copper or oxygen-free copper. When the constituent material of the first busbar 20 is a copper-based material, examples of materials that can be used include oxygen-free copper (copper: 99.96% by weight or more), tough pitch copper (copper: 99.90% by weight or more), and phosphorus-deoxidized copper (copper: 99.90% by weight or more, phosphorus: 0.015% by weight or more, 0.040% by weight or less).

[0091] <Second bus bar> The second busbar 30 is electrically connected to the second external electrode 12b. The second busbar 30 may be connected to the second external electrode 12b by, for example, welding or by a joining member such as solder. As a result, the second external electrode 12b is electrically drawn out through the second busbar 30. For example, if the second external electrode 12b is the negative electrode, the second busbar 30 becomes the lead conductor for the negative electrode.

[0092] The second busbar 30 has a second terminal 31 located outside the sealing resin 60. The second terminal 31 is located on the side of the second busbar 30 opposite to the capacitor element 10, rather than on the side of the second busbar 30 opposite to the capacitor element 10. The second terminal 31 is electrically connected to an object to be connected, such as a substrate or device, by laser welding, for example.

[0093] The number of second terminals 31 in the second busbar 30 is not particularly limited. That is, the second busbar 30 may have one second terminal 31 or may have multiple second terminals 31.

[0094] The second busbar 30 does not need to be bent inside the sealing resin 60. In the examples shown in Figures 1, 2, and 3, the second busbar 30 has a third type portion 30a that extends from the inside to the outside of the sealing resin 60. The third type portion 30a is not bent inside the sealing resin 60.

[0095] The second busbar 30 may be bent inside the sealing resin 60.

[0096] Examples of materials that can be used to construct the second busbar 30 include metals such as copper, oxygen-free copper, aluminum, and alloys containing at least one of these. In particular, it is preferable that the constituent material of the second busbar 30 be copper or oxygen-free copper. When the constituent material of the second busbar 30 is a copper-based material, examples of materials that can be used include oxygen-free copper (copper: 99.96% by weight or more), tough pitch copper (copper: 99.90% by weight or more), and phosphorus-deoxidized copper (copper: 99.90% by weight or more, phosphorus: 0.015% by weight or more, 0.040% by weight or less).

[0097] The constituent material of the second busbar 30 may be the same as the constituent material of the first busbar 20, or it may be different from the constituent material of the first busbar 20.

[0098] The thickness of the second busbar 30 may be the same as the thickness of the first busbar 20, or it may be different from the thickness of the first busbar 20.

[0099] <insulator> The insulator 40 is sandwiched between the first busbar 20 and the second busbar 30 so as to form a laminated structure together with the first busbar 20 and the second busbar 30. Specifically, the first busbar 20, the insulator 40, and the second busbar 30 are stacked in order to form a laminated structure. In such a laminated structure, the creepage distance between the first busbar 20 and the second busbar 30 is ensured by the insulator 40, thereby ensuring insulation between the first busbar 20 and the second busbar 30 (short circuits between the first busbar 20 and the second busbar 30 are prevented).

[0100] Examples of materials that make up the insulator 40 include resin.

[0101] The insulator 40 may include, for example, a super engineering plastic as the resin. In this case, the insulating properties of the insulator 40 tend to improve.

[0102] If the insulator 40 contains a super engineering plastic, the super engineering plastic is preferably a polyphenylene sulfide resin. In this case, the tracking resistance of the insulator 40 is more easily improved, and thus the insulating properties of the insulator 40 are more easily improved.

[0103] The thickness of the insulator 40 may be the same as the thickness of the first busbar 20 and the second busbar 30, or it may be different from the thickness of the first busbar 20 and the second busbar 30.

[0104] The insulator 40 is preferably in the form of a plate. In other words, the insulator 40 is preferably an insulating plate.

[0105] In this specification, the term "insulating board" also includes forms such as insulating paper, insulating sheets, and insulating films.

[0106] It is preferable that the insulator 40 is bent together with the first busbar 20 and the second busbar 30. In the example shown in Figure 1, the insulator 40 is bent in an L-shape together with the first busbar 20 and the second busbar 30 on the side opposite to the capacitor element 10. When the first busbar 20, the second busbar 30, and the insulator 40 are bent in this way, the creepage distance between the first busbar 20 and the second busbar 30 is more easily secured, making it easier to ensure insulation between the first busbar 20 and the second busbar 30 (making it easier to prevent short circuits between the first busbar 20 and the second busbar 30). Furthermore, when the first busbar 20, the second busbar 30, and the insulator 40 are bent, the electromagnetic fields generated by the first busbar 20 and the second busbar 30 tend to cancel each other out, making it easier to reduce the equivalent series inductance (ESL) between the first busbar 20 and the second busbar 30.

[0107] <Case> The capacitor element 10 is housed inside the case 50.

[0108] It is preferable that the capacitor element 10 is housed inside the case 50 so as to be separated from the inner surface of the case 50.

[0109] The case 50 may be a bottomed cylindrical shape with an opening 51. In the example shown in Figure 1, the case 50 is a bottomed cylindrical shape with an opening 51 at one end in the first direction D1.

[0110] If the case 50 is a bottomed cylindrical shape with an opening 51, it may have a bottom portion 52 facing the opening 51 and a side wall portion 53 extending from the bottom portion 52 toward the opening 51. In the example shown in Figure 1, the case 50 has a bottom portion 52 facing the opening 51 in a first direction D1, and a side wall portion 53 extending from the bottom portion 52 toward the opening 51 in the first direction D1.

[0111] The shape of case 50 may be other than the shape described above.

[0112] Examples of case 50 include resin cases, metal cases, and so on.

[0113] If case 50 is a resin case, examples of resins that make up the resin case include liquid crystal polymer, polyphenylene sulfide resin, polybutylene terephthalate resin, etc. Among these, it is preferable that the resin case contains liquid crystal polymer.

[0114] As for the liquid crystal polymer contained in the resin case, for example, a liquid crystal polymer having p-hydroxybenzoic acid and 6-hydroxy-2-naphthoic acid groups in its backbone can be used. In addition to p-hydroxybenzoic acid and 6-hydroxy-2-naphthoic acid groups, liquid crystal polymers formed by polycondensation using various components such as phenol, phthalic acid, and ethylene terephthalate can also be used. Furthermore, when classifying liquid crystal polymers, there are classification methods such as Type I, Type II, and Type III, but in terms of materials, these refer to the same materials as the liquid crystal polymers formed from the above-mentioned components.

[0115] The resin case preferably contains an inorganic filler in addition to the liquid crystal polymer.

[0116] As the inorganic filler included in the resin case, a material with higher strength than the liquid crystal polymer can be used. Preferably, the inorganic filler is a material with a higher melting point than the liquid crystal polymer, and more preferably a material with a melting point of 680°C or higher.

[0117] The form of the inorganic filler is not particularly limited, and examples include forms having a longitudinal direction, such as fibrous or plate-like shapes. Multiple types of inorganic materials may be used in combination as such inorganic fillers. Preferably, the resin case contains at least one of a fibrous inorganic material and a plate-like inorganic material as the inorganic filler.

[0118] In this specification, a filler is described as fibrous if the relationship between the longitudinal dimension in the longitudinal direction and the cross-sectional diameter in a section perpendicular to the longitudinal direction is such that longitudinal dimension / cross-sectional diameter ≥ 5 (i.e., an aspect ratio of 5:1 or greater). Here, the cross-sectional diameter is defined as the distance between the two longest points on the outer circumference of the cross-section. If the cross-sectional diameter differs in the longitudinal direction, the measurement is taken at the point where the cross-sectional diameter is maximum.

[0119] In this specification, a filler is described as being in the form of a plate, meaning that in the filler, the relationship between the cross-sectional diameter of the surface with the largest projected area and the maximum height in the direction perpendicular to this cross-section is such that the cross-sectional diameter / maximum height ≥ 3.

[0120] Preferably, the inorganic filler has at least a portion of it that is oriented in the direction from the bottom 52 side toward the opening 51 side on the side wall portion 53 of the case 50, and a portion that is oriented toward the outer circumference of the side wall portion 53, and is dispersed inside the case 50.

[0121] The inorganic filler material is preferably 5 μm or larger in diameter and 50 μm or larger in length.

[0122] It is preferable that the inorganic filler is dispersed throughout the case 50 without agglomerating.

[0123] Examples of inorganic fillers include fibrous glass fillers, plate-shaped talc, or mica. Among these, it is preferable that the inorganic filler primarily contains fibrous glass fillers.

[0124] Even when the resin case contains another resin (for example, polyphenylene sulfide resin) instead of the liquid crystal polymer, it is preferable that the resin case further contains the inorganic filler described above.

[0125] The resin case is manufactured by methods such as injection molding and 3D printing (three-dimensional modeling).

[0126] If case 50 is a metal case, examples of metals that make up the metal case include elemental metals such as aluminum, magnesium, iron, stainless steel, and copper, as well as alloys containing at least one of these elemental metals. In particular, it is preferable that the metal case contains aluminum or an aluminum alloy.

[0127] The metal case is manufactured by methods such as impact molding and 3D printing (three-dimensional molding).

[0128] <Sealing resin> The sealing resin 60 is filled inside the case 50 so that the capacitor element 10 is embedded within it. This fixes the capacitor element 10 in place within the case 50 using the sealing resin 60.

[0129] The sealing resin 60 is filled inside the case 50 so that the first busbar 20, the second busbar 30, and the insulator 40 are drawn out from the inside to the outside. In the example shown in Figure 1, the first busbar 20, the second busbar 30, and the insulator 40 are drawn out from the inside to the outside of the sealing resin 60 and also from the inside to the outside of the case 50. The first busbar 20 and the second busbar 30 (specifically, the first terminal 21 and the second terminal 31) drawn out in this way are electrically connected to an object to be connected, such as a substrate or device, by laser welding, for example, with insulation between them ensured by the insulator 40.

[0130] In the example shown in Figure 1, the first terminal 21 and the second terminal 31 are misaligned when viewed from the direction in which the first busbar 20 and the second busbar 30 protrude from the sealing resin 60 (first direction D1 in Figure 1) (they are misaligned in the third direction D3 in Figure 1), but the first terminal 21 and the second terminal 31 do not have to be misaligned (they may overlap).

[0131] If the capacitor element 10 is housed inside the case 50 so as to be separated from the inner surface of the case 50, it is preferable that the sealing resin 60 is filled between the capacitor element 10 and the case 50, specifically between the outer surface of the capacitor element 10 and the inner surface of the case 50. Furthermore, it is preferable that the sealing resin 60 is filled not only between the capacitor element 10 and the case 50, but also in the area extending from the opening 51 of the case 50 to the capacitor element 10.

[0132] From the viewpoint of suppressing the intrusion of moisture from the sealing resin 60 itself into the capacitor element 10, it is preferable that the thickness of the sealing resin 60 at the opening 51 of the case 50 is large. The thickness of the sealing resin 60 at the opening 51 of the case 50 is preferably sufficiently large within the allowable range of the overall volume (size) of the capacitor element 10 and the case 50, specifically preferably 2 mm or more, and more preferably 4 mm or more. Furthermore, it is preferable to position the capacitor element 10 on the bottom 52 side rather than the opening 51 side within the case 50 so that the thickness of the sealing resin 60 over the capacitor element 10 is larger on the opening 51 side than on the bottom 52 side.

[0133] The thickness of the sealing resin 60 is measured, for example, using a soft X-ray device in a non-destructive state, and using a length measuring device such as a caliper in a destructive state.

[0134] In the first direction D1, the relationship between the height of the case 50 and the height of the sealing resin 60 is such that the thickness of the sealing resin 60 at the opening 51 of the case 50 is as large as possible, and it may extend to the inside of the case 50, or it may fill it to the brim, or it may slightly overflow due to surface tension.

[0135] As the sealing resin 60, it is preferable to appropriately select a resin with low moisture permeability from the viewpoint of suppressing the penetration of moisture from the sealing resin 60 itself into the capacitor element 10. Examples include epoxy resin, silicone resin, and urethane resin. Examples of curing agents for epoxy resin include amine curing agents and imidazole curing agents.

[0136] As the sealing resin 60, only the resin described above may be used, but a resin to which a reinforcing agent has been added may also be used for the purpose of improving strength. Examples of reinforcing agents include silica and alumina.

[0137] The following describes the features of the capacitor module 1, specifically the configuration of the first busbar 20, the second busbar 30, and the insulator 40.

[0138] Figure 6 is a schematic cross-sectional view showing an example of a cross-section along the line A1-A2 of the capacitor module in Figure 1.

[0139] As shown in Figure 6, in the capacitor module 1, the first busbar 20 and the insulator 40 are locked together inside the sealing resin 60, and the second busbar 30 and the insulator 40 are locked together. In the example shown in Figure 6, the first busbar 20 and the insulator 40 are locked together inside the sealing resin 60 by a first hook 71 provided on the first busbar 20. Furthermore, in the example shown in Figure 6, the second busbar 30 and the insulator 40 are locked together by a second through hole 82 provided on the second busbar 30 and a second projection 92 provided on the insulator 40. As a result, in the capacitor module 1, the first busbar 20, the second busbar 30, and the insulator 40 are integrated and are less likely to move independently. Therefore, in capacitor module 1, even if the capacitor element 10 expands due to absorbing moisture and tries to push the first bus bar 20, the second bus bar 30, and the insulator 40, the first bus bar 20, the second bus bar 30, and the insulator 40 become less likely to move. For example, in capacitor module 1, it becomes less likely that the capacitor element 10, which has expanded due to absorbing moisture, will push the insulator 40, and the pushed insulator 40 will then push the first bus bar 20 and the second bus bar 30. Consequently, in capacitor module 1, the first bus bar 20, the second bus bar 30, and the insulator 40 are less likely to be pressed against the sealing resin 60 by the expanded capacitor element 10, thus making the sealing resin 60 less likely to crack. As a result, in capacitor module 1, even if the capacitor element 10 expands due to absorbing moisture, it is possible to suppress cracking of the sealing resin 60, and consequently, it is possible to suppress a decrease in reliability.

[0140] Furthermore, in the capacitor module 1, as described above, the first busbar 20, the second busbar 30, and the insulator 40 are integrated, making it difficult for them to move independently. Therefore, even if the capacitor element 10, which has expanded due to absorbing moisture, tries to push against the first busbar 20, the second busbar 30, and the insulator 40, the gaps between the first busbar 20 and the insulator 40, and between the second busbar 30 and the insulator 40, are less likely to increase. As a result, in the capacitor module 1, it is less likely that moisture will penetrate into the capacitor element 10 inside the sealing resin 60 from areas outside the sealing resin 60, such as the boundary between the first busbar 20 and the insulator 40, and the boundary between the second busbar 30 and the insulator 40. Consequently, the capacitor module 1 can improve moisture resistance, which is related to reliability.

[0141] Furthermore, in the capacitor module 1, as described above, the first busbar 20, the second busbar 30, and the insulator 40 are integrated, making it difficult for them to move independently. Therefore, even if the capacitor element 10, which has expanded due to absorbing moisture, tries to push against the first busbar 20, the second busbar 30, and the insulator 40, the relative positions of the first busbar 20, the second busbar 30, and the insulator 40 are less likely to change, and consequently, the first busbar 20 and the second busbar 30 are less likely to separate from each other. Thus, in the capacitor module 1, it is possible to suppress the increase in equivalent series inductance (ESL) between the first busbar 20 and the second busbar 30.

[0142] Furthermore, in the capacitor module 1, when the first busbar 20 and the second busbar 30 are electrically connected to an object to be connected, such as a substrate or device, and especially when the first busbar 20 and the second busbar 30 are laser-welded to the object to be connected, it is desirable to have high positional accuracy of the first busbar 20 and the second busbar 30 relative to the object to be connected, for reasons such as facilitating the connection of the first busbar 20 and the second busbar 30 to the object to be connected. In contrast, in the capacitor module 1, as described above, even if the capacitor element 10 expands due to absorbing moisture, the positional relationship between the first busbar 20 and the second busbar 30 is less likely to change, making it possible to have high positional accuracy of the first busbar 20 and the second busbar 30 relative to the object to be connected.

[0143] The following sections will describe specific examples of the locking mechanisms of the first busbar 20 and the insulator 40, and the locking mechanisms of the second busbar 30 and the insulator 40. In addition to Figure 6, Figures 7, 8, and 9 below will also be referenced in the following explanation.

[0144] Figure 7 is a schematic cross-sectional view illustrating another example of the capacitor module of the present invention, with a configuration different from that of Figure 6. Figure 8 is a schematic cross-sectional view illustrating another example of the capacitor module of the present invention, with a configuration different from that of Figures 6 and 7. Figure 9 is a schematic cross-sectional view illustrating another example of the capacitor module of the present invention, with a configuration different from that of Figures 6, 7, and 8.

[0145] First, a specific example of how the first busbar 20 and the insulator 40 are locked together will be described.

[0146] (Specific example 1-1) As shown in the capacitor module 1 in Figure 6 and the capacitor module 3 in Figure 8, a first hook 71 may be provided inside the sealing resin 60 to which one of the first busbar 20 or the insulator 40 is engaged. In the examples shown in Figures 6 and 8, a first hook 71 is provided inside the sealing resin 60 to which the first busbar 20 is engaged. Alternatively, a first hook 71 may be provided inside the sealing resin 60 to which the first busbar 20 is engaged.

[0147] The position of the first hook 71, which is provided on one of the first busbar 20 and the insulator 40, is not particularly limited as long as it is a position in which the other of the first busbar 20 and the insulator 40 can be locked. For example, the first hook 71 may be provided on one of the first busbar 20 and the insulator 40 at a position where the end of the other of the first busbar 20 and the insulator 40 is locked, or it may be provided at a position where a part of the other of the first busbar 20 and the insulator 40 other than the end is locked. For example, the first hook 71 may be provided on at least one of the first type portion 20a and the second type portion 20b of the first busbar 20. In other words, the first hook 71 may be provided on the first type portion 20a of the first busbar 20, on the second type portion 20b, or on both the first and second type portions 20a and 20b.

[0148] The shape of the first hook 71 provided on one of the first busbar 20 and the insulator 40 is not particularly limited, as long as it is a shape that can lock onto the other of the first busbar 20 and the insulator 40. For example, the first hook 71 may be bent in a straight line, bent (curved) in a curved shape, or bent into a shape that combines these.

[0149] The number of first hooks 71 provided on either the first busbar 20 or the insulator 40 is not particularly limited. In other words, either the first busbar 20 or the insulator 40 may have one first hook 71, or it may have multiple first hooks 71.

[0150] If a plurality of first hooks 71 are provided on either the first busbar 20 or the insulator 40, the shapes of the plurality of first hooks 71 may be the same as each other, different from each other, or partially different.

[0151] (Specific examples 1-2) As shown in the capacitor module 2 in Figure 7 and the capacitor module 4 in Figure 9, the first busbar 20 may have a first through-hole 81 inside the sealing resin 60, and the insulator 40 may have a first projection 91 that engages with the first through-hole 81. In the examples shown in Figures 7 and 9, the first projection 91 penetrates the first busbar 20 through the first through-hole 81 inside the sealing resin 60.

[0152] The position of the first through-hole 81 provided in the first busbar 20 is not particularly limited, as long as it is a position in which the first projection 91 provided in the insulator 40 can be engaged. For example, the first through-hole 81 may be provided at the end of the first busbar 20, or it may be provided at a location other than the end of the first busbar 20. For example, the first through-hole 81 may be provided in at least one of the first type portion 20a and the second type portion 20b of the first busbar 20. In other words, the first through-hole 81 may be provided in the first type portion 20a of the first busbar 20, or in the second type portion 20b, or in both the first type portion 20a and the second type portion 20b.

[0153] The shape of the first through-hole 81 provided in the first busbar 20 is not particularly limited, as long as it is a shape that allows the first projection 91 provided in the insulator 40 to engage. For example, the planar shape of the first through-hole 81 (in Figures 7 and 9, the planar shape when viewed from the second direction D2) may be rectangular (including rectangular and square shapes), circular, or elliptical. Also, for example, the cross-sectional shape of the first through-hole 81 (in Figures 7 and 9, the cross-sectional shape when viewed along the first direction D1 and the second direction D2) may be a shape in which the width (diameter) is constant from the insulator 40 side toward the opposite side of the insulator 40, or a tapered shape in which the width (diameter) decreases from the insulator 40 side toward the opposite side of the insulator 40. The cross-sectional shape of the first through-hole 81 may be a shape in which the outer edge is composed of a straight line, a shape in which the outer edge is composed of a curve, or a shape in which the outer edge is composed of both a straight line and a curve.

[0154] The number of first through-holes 81 provided in the first busbar 20 is not particularly limited. In other words, the first busbar 20 may have one first through-hole 81, or it may have multiple first through-holes 81.

[0155] If the first bus bar 20 is provided with a plurality of first through holes 81, the shapes (including the planar shape and cross-sectional shape) of the plurality of first through holes 81 may be the same as each other, may be different from each other, or may be different in part.

[0156] The position of the first projection 91 provided on the insulator 40 is not particularly limited, as long as it is in a position that can engage with the first through-hole 81 provided on the first busbar 20. For example, the first projection 91 may be provided on the end of the insulator 40, or it may be provided elsewhere than the end of the insulator 40. For example, the first projection 91 may be provided on a portion of the insulator 40 that faces at least one of the first type portion 20a and the second type portion 20b of the first busbar 20. In other words, the first projection 91 may be provided on a portion of the insulator 40 that faces the first type portion 20a of the first busbar 20, or on a portion of the first busbar 20 that faces the second type portion 20b, or on both the portion of the first busbar 20 that faces the first type portion 20a and the portion of the first busbar 20 that faces the second type portion 20b.

[0157] The shape of the first projection 91 provided on the insulator 40 is not particularly limited, as long as it is a shape that can engage with the first through hole 81 provided on the first busbar 20. For example, the planar shape of the first projection 91 (in Figures 7 and 9, the planar shape when viewed from the second direction D2) may be rectangular (including rectangular and square shapes), circular, or elliptical. Also, for example, the cross-sectional shape of the first projection 91 (in Figures 7 and 9, the cross-sectional shape when viewed along the first direction D1 and the second direction D2) may be a shape in which the width (diameter) is constant from the opposite side of the first busbar 20 toward the first busbar 20, or a tapered shape in which the width (diameter) decreases from the opposite side of the first busbar 20 toward the first busbar 20. The cross-sectional shape of the first projection 91 may be a shape in which the outer edge is composed of a straight line, a shape in which the outer edge is composed of a curve, or a shape in which the outer edge is composed of both a straight line and a curve.

[0158] The number of first protrusions 91 provided on the insulator 40 is not particularly limited. In other words, the insulator 40 may have one first protrusion 91, or it may have multiple first protrusions 91.

[0159] If the insulator 40 is provided with a plurality of first protrusions 91, the shapes (including the planar shape and cross-sectional shape) of the plurality of first protrusions 91 may be the same as each other, may be different from each other, or may be different in part.

[0160] It is preferable that the tip of the first projection 91 is in contact with the sealing resin 60. Specifically, it is preferable that the tip of the first projection 91 is in contact with the sealing resin 60 when the first projection 91 is locked in the first through hole 81 (in Figures 7 and 9, the first projection 91 penetrates the first bus bar 20 through the first through hole 81). In this case, the first projection 91, and by extension the insulator 40, is more easily fixed by the sealing resin 60. Therefore, even if the capacitor element 10, which has expanded due to absorbing moisture, tries to push against the first bus bar 20, the second bus bar 30, and the insulator 40, not only the insulator 40 but also the first bus bar 20 and the second bus bar 30, which are integrated with the insulator 40, will be less likely to move. As a result, the first bus bar 20, the second bus bar 30, and the insulator 40 are less likely to be pressed against the sealing resin 60 by the expanded capacitor element 10, and the sealing resin 60 will be less likely to crack.

[0161] Of Specific Examples 1-1 and 1-2, in Specific Example 1-2, the volume of the first busbar 20 is reduced by the amount of the first through-hole 81, so the equivalent series resistance (ESR) of the capacitor module 1 may be higher compared to Specific Example 1-1. Therefore, from the viewpoint of suppressing the increase in the equivalent series resistance (ESR) of the capacitor module 1, Specific Example 1-1 is preferable to Specific Example 1-2.

[0162] In the above, specific examples 1-1 and 1-2 have been individually described as examples of how the first busbar 20 and the insulator 40 are locked together, but specific examples 1-1 and 1-2 may be combined. Specifically, the following may all be combined: one of the first busbar 20 and the insulator 40 is provided with a first hook 71 to which the other is locked; the first busbar 20 is provided with a first through hole 81; and the insulator 40 is provided with a first projection 91 to which the first through hole 81 is locked.

[0163] Next, specific examples of how the second busbar 30 and the insulator 40 are locked together will be described.

[0164] (Specific example 2-1) As shown in the capacitor module 3 in Figure 8 and the capacitor module 4 in Figure 9, a second hook 72 may be provided inside the sealing resin 60 to which one of the second busbar 30 or the insulator 40 is engaged. In the examples shown in Figures 8 and 9, a second hook 72 is provided inside the sealing resin 60 to which the insulator 40 is engaged. Alternatively, a second hook 72 may be provided inside the sealing resin 60 to which the second busbar 30 is engaged.

[0165] The position of the second hook 72, which is provided on one of the second busbar 30 and the insulator 40, is not particularly limited as long as it is a position in which the other of the second busbar 30 and the insulator 40 can be locked. For example, the second hook 72 may be provided on one of the second busbar 30 and the insulator 40 at a position where the end of the other of the second busbar 30 and the insulator 40 is locked, or it may be provided at a position where a part of the other of the second busbar 30 and the insulator 40 other than the end is locked. For example, the second hook 72 may be provided on the third type portion 30a of the second busbar 30.

[0166] The shape of the second hook 72 provided on one of the second busbar 30 and the insulator 40 is not particularly limited, as long as it is a shape that can lock onto the other of the second busbar 30 and the insulator 40. For example, the second hook 72 may be bent in a straight line, bent (curved) in a curved shape, or bent into a shape that combines these.

[0167] The number of second hooks 72 provided on either the second busbar 30 or the insulator 40 is not particularly limited. In other words, either the second busbar 30 or the insulator 40 may be provided with one second hook 72, or with multiple second hooks 72.

[0168] If a plurality of second hooks 72 are provided on one of the second busbar 30 and the insulator 40, the shapes of the plurality of second hooks 72 may be the same as each other, may be different from each other, or may be different in part.

[0169] (Specific example 2-2) As shown in the capacitor module 1 in Figure 6 and the capacitor module 2 in Figure 7, the second busbar 30 may have a second through-hole 82 inside the sealing resin 60, and the insulator 40 may have a second projection 92 that engages with the second through-hole 82. In the examples shown in Figures 6 and 7, the second projection 92 penetrates the second busbar 30 through the second through-hole 82 inside the sealing resin 60.

[0170] The position of the second through-hole 82 provided in the second busbar 30 is not particularly limited, as long as it is a position in which the second projection 92 provided in the insulator 40 can be engaged. For example, the second through-hole 82 may be provided at the end of the second busbar 30, or it may be provided at a location other than the end of the second busbar 30. For example, the second through-hole 82 may be provided in the third type portion 30a of the second busbar 30.

[0171] As shown in Figure 7, if the first busbar 20 is provided with a first through-hole 81 and the second busbar 30 is provided with a second through-hole 82, the second through-hole 82 may be located at the same height as the first through-hole 81 (the height in the first direction D1 in Figure 7), or it may be located at a different height from the first through-hole 81.

[0172] As shown in Figure 7, when a first through-hole 81 is provided in the first busbar 20 and a second through-hole 82 is provided in the second busbar 30, the second through-hole 82 may or may not overlap the first through-hole 81 via the insulator 40. In the example shown in Figure 7, the second through-hole 82 may or may not overlap the first through-hole 81 in the second direction D2 via the insulator 40. In the latter case, the second through-hole 82 may be offset from the first through-hole 81 in the first direction D1 or the third direction D3.

[0173] The shape of the second through-hole 82 provided in the second busbar 30 is not particularly limited, as long as it is a shape that allows the second projection 92 provided in the insulator 40 to engage. For example, the planar shape of the second through-hole 82 (in Figures 6 and 7, the planar shape when viewed from the second direction D2) may be rectangular (including rectangular and square shapes), circular, or elliptical. Also, for example, the cross-sectional shape of the second through-hole 82 (in Figures 6 and 7, the cross-sectional shape when viewed along the first direction D1 and the second direction D2) may be a shape in which the width (diameter) is constant from the insulator 40 side toward the opposite side of the insulator 40, or a tapered shape in which the width (diameter) decreases from the insulator 40 side toward the opposite side of the insulator 40. The cross-sectional shape of the second through-hole 82 may be a shape in which the outer edge is composed of a straight line, a shape in which the outer edge is composed of a curve, or a shape in which the outer edge is composed of both a straight line and a curve.

[0174] The number of second through-holes 82 provided in the second busbar 30 is not particularly limited. In other words, the second busbar 30 may have one second through-hole 82, or it may have multiple second through-holes 82.

[0175] If the second bus bar 30 is provided with a plurality of second through holes 82, the shapes (including the planar shape and cross-sectional shape) of the plurality of second through holes 82 may be the same as each other, may be different from each other, or may be different in part.

[0176] The position of the second projection 92 provided on the insulator 40 is not particularly limited, as long as it is in a position that can engage with the second through-hole 82 provided on the second busbar 30. For example, the second projection 92 may be provided on the end of the insulator 40, or it may be provided elsewhere. For example, the second projection 92 may be provided on the portion of the insulator 40 that faces the third portion 30a of the second busbar 30.

[0177] As shown in Figure 7, when the insulator 40 is provided with a first projection 91 and a second projection 92, the second projection 92 may be located at the same height as the first projection 91 (the height in the first direction D1 in Figure 7), or it may be located at a different height from the first projection 91.

[0178] As shown in Figure 7, when the insulator 40 is provided with a first projection 91 and a second projection 92, the second projection 92 may or may not overlap the first projection 91. In the example shown in Figure 7, the second projection 92 may or may not overlap the first projection 91 in the second direction D2. In the latter case, the second projection 92 may be offset from the first projection 91 in the first direction D1 or the third direction D3.

[0179] The shape of the second projection 92 provided on the insulator 40 is not particularly limited, as long as it is a shape that can engage with the second through-hole 82 provided on the second busbar 30. For example, the planar shape of the second projection 92 (in Figures 6 and 7, the planar shape when viewed from the second direction D2) may be rectangular (including rectangular and square shapes), circular, or elliptical. Also, for example, the cross-sectional shape of the second projection 92 (in Figures 6 and 7, the cross-sectional shape when viewed along the first direction D1 and the second direction D2) may be a shape in which the width (diameter) is constant from the opposite side of the second busbar 30 toward the second busbar 30, or a tapered shape in which the width (diameter) decreases from the opposite side of the second busbar 30 toward the second busbar 30. The cross-sectional shape of the second projection 92 may be a shape in which the outer edge is composed of a straight line, a shape in which the outer edge is composed of a curve, or a shape in which the outer edge is composed of both a straight line and a curve.

[0180] The number of second protrusions 92 provided on the insulator 40 is not particularly limited. In other words, the insulator 40 may have one second protrusion 92, or it may have multiple second protrusions 92.

[0181] If the insulator 40 is provided with a plurality of second protrusions 92, the shapes (including the planar shape and cross-sectional shape) of the plurality of second protrusions 92 may be the same as each other, may be different from each other, or may be different in part.

[0182] It is preferable that the tip of the second projection 92 is in contact with the sealing resin 60. Specifically, it is preferable that the tip of the second projection 92 is in contact with the sealing resin 60 when the second projection 92 is locked in the second through-hole 82 (in Figures 6 and 7, the second projection 92 penetrates the second bus bar 30 through the second through-hole 82). In this case, the second projection 92, and by extension the insulator 40, is more easily fixed by the sealing resin 60. Therefore, even if the capacitor element 10, which has expanded due to absorbing moisture, tries to push against the first bus bar 20, the second bus bar 30, and the insulator 40, not only the insulator 40 but also the first bus bar 20 and the second bus bar 30, which are integrated with the insulator 40, will be less likely to move. As a result, the first bus bar 20, the second bus bar 30, and the insulator 40 are less likely to be pressed against the sealing resin 60 by the expanded capacitor element 10, and the sealing resin 60 is less likely to crack.

[0183] Of Specific Examples 2-1 and 2-2, in Specific Example 2-2, the volume of the second busbar 30 is reduced by the amount of the second through-hole 82, so the equivalent series resistance (ESR) of the capacitor module 1 may be higher compared to Specific Example 2-1. Therefore, from the viewpoint of suppressing the increase in the equivalent series resistance (ESR) of the capacitor module 1, Specific Example 2-1 is preferable to Specific Example 2-2.

[0184] In the above, specific examples 2-1 and 2-2 have been individually described as examples of how the second busbar 30 and the insulator 40 are locked together, but specific examples 2-1 and 2-2 may be combined. Specifically, the following may all be combined: one of the second busbar 30 and the insulator 40 is provided with a second hook 72 to which the other is locked; the second busbar 30 is provided with a second through hole 82; and the insulator 40 is provided with a second projection 92 to which the second through hole 82 is locked.

[0185] The locking configuration of the first busbar 20 and the insulator 40 may be as shown in Figure 10.

[0186] Figure 10 is a schematic cross-sectional view illustrating another example of the capacitor module of the present invention, with a configuration different from that of Figures 6, 7, 8, and 9.

[0187] As shown in Figure 10, the capacitor module 5 may have through holes 41 in the insulator 40 inside the sealing resin 60, and the first busbar 20 may be locked to the insulator 40 by passing through the through holes 41. In the example shown in Figure 10, the first busbar 20 passes through the insulator 40 through the through holes 41 inside the sealing resin 60 so as not to come into contact with the second busbar 30.

[0188] The location of the through-hole 41 provided in the insulator 40 is not particularly limited, as long as it is a position where the first busbar 20 can be locked so as not to come into contact with the second busbar 30. For example, the through-hole 41 may be provided at the end of the insulator 40, or it may be provided at a location other than the end of the insulator 40.

[0189] The shape of the through-hole 41 provided in the insulator 40 is not particularly limited, as long as it is a shape that allows the first busbar 20 to be locked so as not to come into contact with the second busbar 30. For example, the planar shape of the through-hole 41 (in Figure 10, the planar shape when viewed from the first direction D1) may be rectangular (including rectangular and square shapes), circular, or elliptical. Also, for example, the cross-sectional shape of the through-hole 41 (in Figure 10, the cross-sectional shape when viewed along the first direction D1 and the second direction D2) may be a shape in which the width (diameter) is constant from one end to the other, or a tapered shape in which the width (diameter) decreases from one end to the other. The cross-sectional shape of the through-hole 41 may be a shape in which the outer edge is composed of a straight line, a shape in which the outer edge is composed of a curve, or a shape in which the outer edge is composed of both a straight line and a curve.

[0190] The number of through holes 41 provided in the insulator 40 is not particularly limited. In other words, the insulator 40 may have one through hole 41 or may have multiple through holes 41.

[0191] If the insulator 40 is provided with multiple through holes 41, the shapes of the multiple through holes 41 (including the planar shape and cross-sectional shape) may be the same as each other, may be different from each other, or may be different in part.

[0192] Regarding the locking configuration of the first busbar 20 and the insulator 40, the configuration shown in Figure 10 may be combined with at least one of Specific Examples 1-1 and 1-2. For example, the configuration in which the insulator 40 has a through hole 41 inside the sealing resin 60, the configuration in which the first busbar 20 is locked to the insulator 40 through the through hole 41, the configuration in which one of the first busbar 20 and the insulator 40 is provided with a first hook 71 to which the other is locked, the configuration in which the first busbar 20 has a first through hole 81, and the configuration in which the insulator 40 is provided with a first projection 91 locked to the first through hole 81 may all be combined.

[0193] The manner in which the second busbar 30 and the insulator 40 are locked together may be the same as that shown in Figure 10. Specifically, the insulator 40 may have a through hole inside the sealing resin 60, and the second busbar 30 may be locked to the insulator 40 through the through hole. In this case, the second busbar 30 penetrates the insulator 40 through the through hole inside the sealing resin 60 so as not to come into contact with the first busbar 20.

[0194] Regarding the locking configuration of the second busbar 30 and the insulator 40, the same configuration as in Figure 10 may be combined in at least one of Specific Examples 2-1 and 2-2. For example, the following configurations may be combined: one in which the insulator 40 has a through hole inside the sealing resin 60; one in which the second busbar 30 is locked to the insulator 40 through the through hole; one of the second busbar 30 and the insulator 40 is provided with a second hook 72 to which the other is locked; one in which the second busbar 30 has a second through hole 82; and one in which the insulator 40 is provided with a second projection 92 locked to the second through hole 82.

[0195] The following describes a configuration example in which moisture intrusion into the capacitor element 10 located inside the sealing resin 60 is considered to have a significant impact. Even with the following configuration example, the capacitor module 1 makes it possible to suppress cracking of the sealing resin 60 caused by the expansion of the capacitor element 10 due to moisture absorption.

[0196] (Configuration Example 1) Within the encapsulating resin 60, at least one selected from the group consisting of the first busbar 20, the second busbar 30, and the insulator 40 may face the surface of the capacitor element 10 where the first external electrode 12a and the second external electrode 12b are not provided. In the example shown in Figure 6, etc., within the encapsulating resin 60, the first busbar 20 and the insulator 40 of the first busbar 20, the second busbar 30, and the insulator 40 face the side surface 11c of the element 11 where the first external electrode 12a and the second external electrode 12b are not provided.

[0197] On the other hand, when the capacitor element 10 expands due to the absorption of moisture, the capacitor element 10 is more likely to expand on the surface side where the first external electrode 12a and the second external electrode 12b are not provided than on the surface side where the first external electrode 12a and the second external electrode 12b are provided. In the example shown in Figure 6, the capacitor element 10 is more likely to expand on the side surface 11c of the base body 11 than on the first end surface 11a and the second end surface 11b of the base body 11. In other words, in the example shown in Figure 6, the capacitor element 10 is more likely to expand in the first direction D1 and the third direction D3, which the side surface 11c of the base body 11 faces, than in the second direction D2, which the first end surface 11a and the second end surface 11b of the base body 11 face. Thus, if the capacitor element 10 tends to expand on the side 11c of the base body 11 (in the first direction D1 in Figure 6, etc.), the first bus bar 20, the second bus bar 30, and the insulator 40 that face the side 11c of the base body 11 (the first bus bar 20 and the insulator 40 in Figure 6, etc.) will be more easily pressed against the sealing resin 60 by the expanded capacitor element 10, which may result in the sealing resin 60 becoming more prone to cracking.

[0198] Even in the above-mentioned case, as described above, the first busbar 20 and the insulator 40 are locked together inside the sealing resin 60, and the second busbar 30 and the insulator 40 are locked together, so the first busbar 20, the second busbar 30, and the insulator 40 are less likely to be pressed against the sealing resin 60 by the expanded capacitor element 10, and thus the sealing resin 60 is less likely to crack.

[0199] In this configuration example, if at least one of the first busbar 20 and the second busbar 30 faces the surface of the capacitor element 10 where the first external electrode 12a and the second external electrode 12b are not provided, the equivalent series inductance (ESL) of the capacitor module 1 tends to decrease.

[0200] In this configuration example, at least one selected from the group consisting of the first busbar 20, the second busbar 30, and the insulator 40 may or may not be in contact with the surface of the capacitor element 10 that does not have the first external electrode 12a and the second external electrode 12b, when facing the surface of the capacitor element 10 that does not have the first external electrode 12a and the second external electrode 12b. For example, the insulator 40 may or may not be in contact with the surface of the capacitor element 10 that does not have the first external electrode 12a and the second external electrode 12b.

[0201] In this configuration example, within the encapsulating resin 60, the first busbar 20 may extend longer than the second busbar 30 along the surface of the capacitor element 10 where the first external electrode 12a and the second external electrode 12b are not provided. In the example shown in Figure 6, etc., within the encapsulating resin 60, the first busbar 20 extends longer than the second busbar 30 along the side surface 11c of the body 11 where the first external electrode 12a and the second external electrode 12b are not provided.

[0202] (Configuration example 2) The surface of the capacitor element 10 that does not have the first external electrode 12a and the second external electrode 12b may face the opening 51 of the case 50. In the example shown in Figure 6, the side surface 11c of the body 11 that does not have the first external electrode 12a and the second external electrode 12b faces the opening 51 of the case 50.

[0203] When the capacitor element 10 expands due to the absorption of moisture, as described above, the capacitor element 10 is more likely to expand on the surface side where the first external electrode 12a and the second external electrode 12b are not provided than on the surface side where the first external electrode 12a and the second external electrode 12b are provided. In the example shown in Figure 6, the capacitor element 10 is more likely to expand on the side surface 11c of the base body 11 than on the first end surface 11a and the second end surface 11b of the base body 11. In other words, in the example shown in Figure 6, the capacitor element 10 is more likely to expand in the first direction D1 and the third direction D3, which the side surface 11c of the base body 11 faces, than in the second direction D2, which the first end surface 11a and the second end surface 11b of the base body 11 face. Furthermore, inside the case 50, the sealing resin 60 is often filled more in the region between the capacitor element 10 and the opening 51 than in other regions. Therefore, as described above, if the capacitor element 10 is prone to expanding on the side 11c of the base body 11 facing the opening 51 of the case 50 (in the first direction D1 in Figure 6, etc.), the area of ​​the sealing resin 60 that is pressed against the first bus bar 20, the second bus bar 30, and the insulator 40 (in Figure 6, etc., the first bus bar 20 and the insulator 40) by the expanded capacitor element 10 will increase, and as a result, there is a possibility that the sealing resin 60 will become prone to cracking over a wide area.

[0204] Even in the above-mentioned case, as described above, the first busbar 20 and the insulator 40 are locked together inside the sealing resin 60, and the second busbar 30 and the insulator 40 are locked together, so the first busbar 20, the second busbar 30, and the insulator 40 are less likely to be pressed against the sealing resin 60 by the expanded capacitor element 10, and thus the sealing resin 60 is less likely to crack.

[0205] (Configuration Example 3) If there are multiple capacitor elements 10, the multiple capacitor elements 10 may be arranged along the bottom 52 of the case 50. Furthermore, the first bus bar 20 and the second bus bar 30 may extend across the multiple capacitor elements 10.

[0206] In this case, moisture that seeps in from areas outside the sealing resin 60, such as the boundary between the first busbar 20 and the insulator 40, and the boundary between the second busbar 30 and the insulator 40, can easily travel along the first busbar 20 and the second busbar 30 and penetrate into the multiple capacitor elements 10 located inside the sealing resin 60. When the multiple capacitor elements 10 expand due to absorbing moisture, the area of ​​the sealing resin 60 that is pressed against the first busbar 20, the second busbar 30, and the insulator 40 by the expanded multiple capacitor elements 10 becomes larger, potentially making the sealing resin 60 more prone to cracking over a wide area.

[0207] Even in the above-mentioned case, as described above, the first busbar 20 and the insulator 40 are locked together inside the sealing resin 60, and the second busbar 30 and the insulator 40 are locked together, so the first busbar 20, the second busbar 30, and the insulator 40 are less likely to be pressed against the sealing resin 60 by the expanded capacitor element 10, and thus the sealing resin 60 is less likely to crack.

[0208] Although configuration examples 1 to 3 have been described individually above, these configuration examples may be combined in multiple ways. Even in this case, the capacitor module 1 makes it possible to suppress cracking of the sealing resin 60 caused by the expansion of the capacitor element 10 due to moisture absorption.

[0209] The capacitor module of the present invention is not limited to the above-described form, and various applications and modifications can be made within the scope of the present invention regarding the configuration, manufacturing conditions, etc., of the capacitor module.

[0210] The capacitor module of the present invention is useful for automotive applications, such as inverters, chargers, DC-DC converters, etc., installed in electric vehicles.

[0211] The capacitor module of the present invention can be applied not only to automotive applications but also to various fields such as power electronics. [Explanation of Symbols]

[0212] 1, 2, 3, 4, 5 Capacitor Modules 10 Capacitor element 11 Base Body 11a First end face of the base body 11b Second end face of the base body 11c Side view of the base body 12a 1st external electrode 12b 2nd external electrode 13a First Metallized Film 13b Second Metallized Film 14a First dielectric film 14aa First main surface of the first dielectric film 14ab Second main surface of the first dielectric film 14b Second Dielectric Film 14ba First main surface of the second dielectric film 14bb Second main surface of the second dielectric film 15a 1st metal layer 15b 2nd metal layer 20 First Bus Bar 20a Class 1 part 20b Type 2 part 21 1st terminal 30 Second Bus Bar 30a Type 3 part 31 2nd terminal 40 Insulator 41 Through hole 50 cases 51 Opening 52 Bottom 53 Side wall section 60 Sealing resin 71 First Hook 72. Second hook 81 First through hole 82 Second through hole 91 1st protrusion 92 Second protrusion D1 1st direction D2 2nd direction D3 Third direction

Claims

1. A capacitor element having a first external electrode and a second external electrode, A first busbar electrically connected to the first external electrode, A second busbar electrically connected to the second external electrode, An insulator sandwiched between the first busbar and the second busbar so as to form a laminated structure together with the first busbar and the second busbar, A case in which the aforementioned capacitor element is housed, The capacitor element is embedded in the case, and the case is filled with a sealing resin such that the first busbar, the second busbar, and the insulator are drawn out from the inside to the outside. A capacitor module characterized in that the first busbar and the insulator are locked together within the sealing resin, and the second busbar and the insulator are locked together within the sealing resin.

2. The capacitor module according to claim 1, wherein a first hook is provided inside the sealing resin, with one of the first busbar and the insulator being locked to the other.

3. The capacitor module according to claim 1 or 2, wherein the first busbar is provided with a first through-hole inside the sealing resin, and the insulator is provided with a first projection that engages with the first through-hole.

4. The capacitor module according to claim 3, wherein the tip of the first projection is in contact with the sealing resin.

5. A capacitor module according to any one of claims 2 to 4, wherein a second hook is provided inside the sealing resin, with one of the second busbar and the insulator being locked to the other.

6. A capacitor module according to any one of claims 2 to 5, wherein the second busbar is provided with a second through-hole inside the sealing resin, and the insulator is provided with a second projection that engages with the second through-hole.

7. The capacitor module according to claim 6, wherein the tip of the second projection is in contact with the sealing resin.

8. A capacitor module according to any one of claims 1 to 7, wherein, inside the sealing resin, at least one selected from the group consisting of the first busbar, the second busbar, and the insulator faces the surface of the capacitor element where the first external electrode and the second external electrode are not provided.

9. The capacitor module according to any one of claims 1 to 8, wherein the case is a bottomed cylindrical shape with an opening, and has a bottom facing the opening and a side wall extending from the bottom toward the opening.

10. The capacitor module according to claim 9, wherein the surface of the capacitor element on which the first external electrode and the second external electrode are not provided faces the opening of the case.

11. Multiple capacitor elements are arranged along the bottom of the case, The capacitor module according to claim 9 or 10, wherein the first busbar and the second busbar extend across a plurality of capacitor elements.

12. The capacitor module according to any one of claims 1 to 11, wherein the capacitor element is a film capacitor.

Images