Sample carrier device and measuring instrument for thermal sample analysis.

Abstract

To provide a sample carrier device and a thermal sample analysis measuring instrument that overcome, at least partially, the drawbacks of conventional devices. [Solution] The present invention relates to a sample carrier device (1) for a measuring instrument for thermal sample analysis. This sample carrier device (1) comprises a main carrier structure (2), a reference unit (5) having a first thermocouple means (11), and a sample carrier unit (6) having a second thermocouple means (12), wherein the main carrier structure (2) is designed to hold the reference unit (5) and the sample carrier unit (6) spatially separated from each other. Furthermore, a defined heat flow element (14) is arranged between the reference unit 5 and the sample carrier unit (6). In addition, a measuring instrument (100) for thermal sample analysis is disclosed.

Description

Technical Field

[0001] The present invention relates to a sample carrier device for measuring instruments for hot samples and a measuring instrument for hot sample analysis.

Background Art

[0002] Measuring instruments for hot sample analysis are known in various designs and are available on the market. In order to further expand the applicable fields of this technology, currently, not only more functions need to be integrated by each instrument unit, but at the same time, a more compact structure needs to be realized, which will enable, for example, mobile applications in the future.

[0003] Among current instruments, there are also those that are not only difficult to handle but have dimensions that can be an obstacle for new applicable fields. Regarding available analysis techniques, current instruments also, in most cases, have only specific options, so in order to provide further analysis techniques, it is necessary to procure additional instruments.

[0004] Thus, instruments dedicated to differential thermal analysis (DTA), or differential scanning calorimetry (DSC), or thermogravimetric analysis (TGA) are known. TGA is used for the temperature- or time-dependent analysis of physical processes and chemical reactions accompanied by mass changes.

[0005] These differences often lie in the handling of each sample. Particularly in the case of DTA or DSC, for example, the instrument generally has two sample crucibles for the purpose, with the analysis target material accommodated in one crucible and the reference material accommodated in the other crucible, so a more complex structure is required. In contrast, instruments for TGA generally only require one crucible for the analysis target material. In TGA, a scale incorporated into the measuring instrument for detecting mass changes and temperature measurement on the sample are essential.

[0006] In a DTA or DSC configuration, two crucibles are heated or cooled under conditions as identical as possible while targeting a specific material. In this case, both crucibles are dimensionally defined with respect to their thermal behavior, thereby identifying the differences in the thermal behavior of the two materials.

[0007] Simultaneous thermal analysis (STA) is also known, in which case DTA or DSC method is combined with TGA method.

[0008] Future instruments should ideally offer a simpler configuration while also providing a wider range of analytical methods. [Overview of the Initiative] [Problems that the invention aims to solve]

[0009] In view of the above-mentioned background circumstances, the object of the present invention is to provide a sample carrier device for a thermal sample analysis measuring instrument and a thermal sample analysis measuring instrument that overcome the above-mentioned drawbacks at least partially. [Means for solving the problem]

[0010] This problem is solved by a sample carrier device for a measuring instrument having the features of claim 1 and a measuring instrument for thermal sample analysis having the features of claim 16.

[0011] Accordingly, a sample carrier device for measuring instruments for thermal sample analysis is provided, which comprises a main carrier structure, a reference unit having a first thermocouple means, and a sample carrier unit having a second thermocouple means, wherein the main carrier structure is designed to spatially separate and hold the reference unit and the sample carrier unit from each other. Furthermore, a defined heat flow element is arranged between the reference unit and the sample carrier unit.

[0012] Furthermore, a measuring instrument for thermal sample analysis is provided, which comprises a sample carrier device according to the present invention and a weight measuring means for capturing the sample mass of the sample to be analyzed.

[0013] The underlying idea of ​​this invention is to provide a compact sample carrier device that can be easily installed in measuring instruments for thermal sample analysis, which have spatially limited potential, without allowing for functional loss.

[0014] Despite its compact configuration, the present invention allows measurements, particularly differential scanning calorimetry (DSC), to be performed using a simplified reference unit without a reference sample. This is because the necessary calibration steps can be easily and user-friendly performed before the initial sample analysis using a defined heat flow element.

[0015] Unlike the conventional definition of the DSC method, recent basic standards for DTA (Differential Thermal Analysis) and DSC (DIN 51007:2019-04) do not mention "specified heat flow paths," and rather clearly distinguish between differential thermal analysis (DTA), which measures temperature differences, and differential scanning calorimetry (DSC), which also measures the difference in heat flow between the sample and the reference.

[0016] Ultimately, the crucial requirement is the ability to perform the calibration necessary for measuring the thermal flux difference. In this regard, the standard thermal flux elements provided can meet this requirement and can be used advantageously for these purposes without requiring a complex structure in which the reference sample is placed in a further sample container (sample crucible).

[0017] In this regard, the sample carrier device for a thermal sample analysis measuring instrument according to the present invention can be advantageously used to measure the temperature difference between the sample and the reference object, and optionally the heat flow. In this case, the reference object is immutable and can be securely connected to each measuring instrument, at least temporarily, via the sample carrier device.

[0018] At the same time, when the sample carrier device according to the present invention is placed in a measuring instrument for thermal sample analysis, it is designed to measure the temperature of each sample placed in a container within the sample carrier unit.

[0019] The sample carrier device comprises a manageable number of components with respect to the desired functionality, thereby allowing it to be housed in a space-saving manner within a thermal sample analysis instrument. In this respect, the sample carrier device can be used, for example, within a thermal sample analysis instrument that surrounds it. In this respect, the sample carrier device can be integrated in a space-saving manner within a heating / cooling means having a small internal space in a thermal sample analysis instrument.

[0020] The sample carrier apparatus for the thermal sample analysis measuring instrument of the present invention is further designed to be advantageously used when calculating heat flow by calibration from the temperature difference between the sample and the reference unit.

[0021] In relation to the present invention, the term "spatially" is understood to be based on three dimensions. In other words, the reference unit and the sample carrier unit are arranged without direct contact with each other. Only the positioned heat flow elements connect the two components so that heat flows between them.

[0022] To the extent that it can be adapted, the advantages described above also apply to the measuring instrument for thermal sample analysis according to the present invention.

[0023] According to exemplary embodiments of the sample carrier apparatus, the defined heat flow elements are assumed to be selected from metal wires, copper wires, platinum wires, platinum alloy wires, nichrome wires, nickel alloy wires, metal sheets, copper sheets, platinum sheets, platinum alloy sheets, nichrome sheets, nickel alloy sheets, metal rods, copper rods, platinum rods, platinum alloy rods, nichrome rods, and nickel alloy rods.

[0024] In this way, the space-saving concept can be realized particularly easily and advantageously. Furthermore, since the selected materials are well known, the desired calibration steps can be carried out easily and simply.

[0025] According to a further configuration of the sample carrier device, it is assumed that the main carrier structure is designed to hold the reference unit below the sample carrier unit.

[0026] As a result, the resulting full circumference can have a predetermined maximum size. This is because the two components are arranged vertically with respect to each other, and thus a space-saving concept can be realized, for example, by selecting the outer circumference of each component to be the same.

[0027] According to the configuration of the sample carrier device, it is assumed that the main carrier structure has at least one first holding element designed to reversibly receive the reference unit and the sample carrier unit. Thereby, the number of necessary components can be further reduced, and the space-saving concept can be realized particularly advantageously.

[0028] According to an embodiment of the sample carrier device, it is assumed that the main carrier structure has a second holding element designed to receive each connection line section of the first and second thermocouple means and to hold the first holding element.

[0029] The advantage of such a modular configuration is that it can realize a particularly user-friendly concept in order to simplify the maintenance work or replacement process of the held components.

[0030] According to an embodiment of the sample carrier device, the second holding element has a first end region designed to be received by the first holding element and a second end region located on the opposite side of the first end region, and this second end region is designed to receive a plug contact unit in the sample carrier device for connecting each connection line section of the first and second thermocouple means to the measuring device.

[0031] Thus, since the sample carrier device can be inserted into the measuring instrument in a user-friendly and simple manner, maintenance work related to, for example, replacement with other sample carrier devices or replacement of held components or structures can be carried out particularly easily and advantageously.

[0032] Further configuration of the sample carrier device indicates that the sample carrier unit holds each sample container and has a flexibly configurable holding means, thereby allowing each sample container of different size and material to be individually and reversibly accepted by the sample carrier unit.

[0033] In this regard, the sample carrier apparatus according to the present invention is designed to accept different containers for receiving each sample. In this case, each container can be designed to be used as is typically done in thermal analysis. In this regard, the containers may be, for example, crucibles of different sizes with respect to their average diameter.

[0034] Generally, the holding mechanism can be flexible enough to accommodate crucibles of different shapes. Since the holding mechanism can be flexible enough to accommodate different shapes, the container can also be made of different materials. The container is typically placed in the sample carrier device before measurement and removed again after measurement.

[0035] According to the example of the sample carrier device, the first retaining element is assumed to be composed of aluminum oxide (Al2O3).

[0036] Because this material has low thermal conductivity, the heat channel can be used without problems by a specified heat flow element. Furthermore, because it is also a highly heat-resistant material, such a holding means can be used particularly effectively in the measuring instrument area provided for heating each sample.

[0037] In the embodiment of the sample carrier device, the reference unit and the sample carrier unit are positioned above and below each other without direct contact, and each is assumed to have a diameter at least substantially twice the diameter of the second retaining element.

[0038] In this way, the space-saving concept can be advantageously realized. Various diameters are possible, and in this case, each component can have a specific diameter. However, in this case, it must not fall below a minimum value of twice the diameter. This has the advantage of always guaranteeing optimal placement in a particular measuring instrument.

[0039] According to an exemplary embodiment of the sample carrier device, the sample carrier unit is assumed to be reversibly fixed to the first retaining element by at least one first plug connector.

[0040] Therefore, the sample carrier unit replacement process can be carried out easily and at user-friendly time intervals.

[0041] According to the embodiment of the sample carrier device, the reference unit is assumed to be reversibly fixed to the first retaining element by at least one second plug connector.

[0042] Therefore, the replacement process for the reference carrier unit can be carried out easily and at user-friendly time intervals.

[0043] According to an exemplary embodiment of the sample carrier device, the first retaining element is assumed to be reversibly fixed to the second retaining element by at least one plug connector.

[0044] This facilitates an even better modular design, providing a flexible and user-friendly concept for, for example, maintenance work or the replacement of components in a sample carrier device.

[0045] In the embodiment of the sample carrier device, it is assumed that at least one plug connection portion between the first and second holding elements has a substantially conical shape.

[0046] The shape of this plug connector offers the advantages of both user-friendly reversibility and reliable strength against high temperature fluctuations, resulting in a particularly reliable and stable sample carrier device.

[0047] According to an embodiment of the sample carrier apparatus, the sample carrier unit is substantially composed of a metal film, the metal of which is selected from platinum, platinum alloys, nichrome, nickel alloys, steel, and similar alloys, and the thickness of the metal film is assumed to be 0.02 to 3 mm, preferably 0.03 to 2 mm, and preferably 0.05 to 1 mm.

[0048] Thus, since the sample carrier unit requires an extremely small spatial volume to be functionally used for a given purpose, the space-saving concept in sample carrier devices can be realized even more advantageously.

[0049] According to the example of the sample carrier device, it is assumed that each plug connection is reinforced with at least one type of ceramic adhesive.

[0050] This allows the sample carrier device to be used in applications requiring particularly high stability. Each ceramic adhesive used can be selected and manufactured to achieve, for example, heat resistance up to 1,700°C. In this case, reversibility may be limited, but the separation process can be carried out by applying some force as needed. A new bond can then be formed.

[0051] According to the embodiment of the measuring instrument, it is assumed that the measuring instrument does not have a means for measuring the mass of the sample to be analyzed.

[0052] The present invention will be described below with reference to the reference numerals in the drawings. [Brief explanation of the drawing]

[0053] [Figure 1] This is a schematic side view showing a sample carrier device for a measuring instrument used for thermal sample analysis. [Figure 2] This is a schematic side view showing an alternative and further sample carrier device for measuring instruments used in thermal sample analysis. [Figure 3] This is a schematic side view showing a further sample carrier device for measuring instruments used in thermal sample analysis. [Figure 4] This is a schematic top view showing a sample carrier device for a thermal sample analysis measuring instrument, with the sample carrier unit removed. [Figure 5] This is a schematic diagram showing measuring instruments for thermal sample analysis.

[0054] Unless otherwise specified, identical reference numerals in the figures indicate the same or functionally identical components. [Modes for carrying out the invention]

[0055] Figure 1 shows a schematic side view of sample carrier device 1 for a measuring instrument used for thermal sample analysis.

[0056] The illustrated sample carrier apparatus 1 is shown together with the main carrier structure 2. The main carrier structure 2 has first and second retaining elements 3 and 4. In the embodiment shown in Figure 1, the second retaining element 4 holds the first retaining element by a retaining means (not shown in detail).

[0057] This may be, for example, a plug connection or screw connection in which both retaining means 3, 4 are reversibly connected, thereby reversibly connecting the two retaining means 3, 4. In one embodiment (not shown in detail), it is conceivable that both retaining elements 3, 4 are provided as a substantially integrated unit.

[0058] In the schematic side view shown, the first retaining element 3 has a substantially rectangular shape and is positioned above the second retaining element 4 with respect to the drawing, and spatially protrudes more than the second retaining element 4 in each lateral region. In the illustrated modified embodiment, the main carrier structure 2 is arranged substantially rotationally symmetrically. The first retaining element 3 has a portion that is directed downward (with respect to the screen), and this portion is suitable for establishing a mechanical connection with the second retaining element 4. This portion has larger external dimensions than the retaining element 4. Therefore, for example, this downward-directed portion of the retaining element 3 can receive (accept) the retaining element 4 by insertion.

[0059] The retaining element 4 is shown as rod-shaped and substantially cylindrical. In one modified embodiment, alternative shapes (not shown in detail) are also conceivable. For example, a rectangular shape may be provided instead of a cylindrical shape, while being substantially the same shape downwards.

[0060] The first holding element 3 is designed to reversibly receive the illustrated reference unit 5 and sample carrier unit 6 in the sample carrier device 1.

[0061] In the schematic side view shown, the reference unit 5 has a substantially rectangular shape and is positioned below the sample carrier unit 6 with respect to the drawing.

[0062] In the schematic side view shown, the sample carrier unit 6 also has a substantially rectangular shape and is positioned above the reference unit 5, relative to the drawing.

[0063] The sample carrier unit 6 can be reversibly fixed to the first retaining element 3 by two first plug connectors 7. For this purpose, the first retaining element 3 may have slots into which the two first plug connectors 7 can be inserted so as to fit substantially precisely.

[0064] In one modified embodiment (not shown in detail), the number of first plug connectors can be changed, and in this case, the number of slots in the first retaining element 3 is also adjusted accordingly. For example, three or four first plug connectors 7 can be provided, in which case these first plug connectors are arranged at substantially the same distance in the outer region of the sample carrier unit 6 and also protrude substantially perpendicularly downward (with respect to the screen).

[0065] These two first plug connectors 7 are provided in opposing lateral regions of the sample carrier unit 6, protruding substantially perpendicularly downward from the sample carrier unit, and are arranged to be inserted into the first holding element 3 in the lower region.

[0066] As shown in the figure, these two first plug connectors 7 can be provided as separate components firmly connected to the sample carrier unit 6. Alternatively, the sample carrier unit 6 and the two first plug connectors 7 can be provided integrally, thus forming a structural unit. In either modification, the sample carrier unit 6 and the two first plug connectors 7 can be made of the same material and have substantially identical properties in terms of thickness. For example, they can be made of a metal film or a flexible metal plate.

[0067] In one modified embodiment (not shown in detail), two first plug connectors 7 are provided so as to be inserted through the first retaining element 3, and with reference to the drawing, the two plug connectors protrude downward from the first retaining element 3, and it is conceivable that the protruding portion (also called a tab) of each first plug connector 7 may be rotated or twisted by 90° or more, for example, 95°, 100°, or 120-150°.

[0068] Furthermore, small amounts of ceramic adhesive or similar material can be applied to each rotating or twisted point to provide additional stability. This amount can be selected, for example, to ensure sufficient stability while allowing the sample carrier unit 6 connected to the first holding element 3 to be separated by force.

[0069] The reference unit is shown to be reversibly secured to the first retaining element 3 by two second plug connectors 8. In this case, these second plug connectors 8 project substantially perpendicularly downwards and are located on the outside of the first retaining element 3.

[0070] In the outer region of the first retaining element 3, these second plug connectors protrude beyond the longitudinal center of the first retaining element 3. A portion of these second plug connectors 8 is located on the opposite side, which is not visible in the illustrated side view, and together with the portion of the illustrated second plug connectors 8, forms a clamp-like structure, thereby attaching the second plug connectors 8 to the first retaining element 3.

[0071] In one modified embodiment (not shown in detail), the second plug connection portion 8 is attached to the first retaining element 3 as shown in the figure, and it is conceivable that the end regions of each portion may protrude downward (relative to the drawing) beyond the first retaining element 3.

[0072] The second plug connector 8 shown in the figure is further shown connected to one another, and the connection area 9 has the same side length as the reference unit 5 and is located below the reference unit 5.

[0073] In one modified embodiment (not shown in detail), it is conceivable that the connection regions 9 on which the second plug connectors 8 are each located are integrally provided with the reference unit 5 and the second plug connectors 8. It is also conceivable that these are simply structures connected to each other, in which case at least the reference unit 5 is made of a different material. In this regard, it is conceivable that the connection regions 9 and the second plug connectors 8 together constitute a single material unit, and the reference unit 5 is made of a different material corresponding to it, and is at least different in terms of thermal conductivity properties from the material of the material unit.

[0074] The reference unit 5 and the sample carrier unit 6 are shown to be spatially separated from each other, in which case the main carrier structure 2 is formed and provided specifically for this purpose.

[0075] Based on the drawing, the sample carrier unit 6 has a total of three retaining means 10 at its top, connected to the body of the sample carrier unit 6. These connections may be material connections. In other words, each retaining means 10 may be an integral component of the sample carrier unit 6. The retaining means 10 project substantially perpendicularly upward (based on the drawing) and are provided to hold each sample container (not shown in detail). The retaining means 10 are designed to be flexibly adjustable so that the sample carrier unit 6 can individually and reversibly accept each sample container (not shown in detail) of different sizes and materials. Thus, for example, the sample carrier unit 6 can accept sample containers containing the sample to be measured, and in particular, sample containers of different sizes with varying average diameters, in which case the retaining means 10 ensure a certain level of stability during acceptance. For example, the retaining means 10 are provided to be bendable toward the wall of the accepted sample container so that they can exert a corresponding retaining force to hold the accepted sample container approximately in the center of the sample carrier unit 6.

[0076] Furthermore, the sample carrier device 1 for the thermal sample analysis measuring instrument is shown together with a reference unit 5 having a first thermocouple means 11 and a sample carrier unit 6 having a second thermocouple means 12. In Figure 1, only the corresponding thermocouple wires 13 of the first thermocouple means 11 and the second thermocouple means 12 are visible. In this side view, the corresponding thermocouples are hidden by the sample carrier unit 6 or the reference unit 5.

[0077] When the sample carrier device 1 of the present invention is functionally connected to a measuring instrument for thermal sample analysis, the temperatures of the sample carrier unit 6 and the reference unit 5 can be measured by their respective thermocouple means 11 and 12. The temperature difference between the two thermocouple means 11 and 12 can also be captured by the corresponding evaluation electronic equipment.

[0078] Furthermore, the diagram shows that a defined heat flow element 14 is positioned between the reference unit 5 and the sample carrier unit 6. In particular, in the side view shown in Figure 1, this heat flow element 14 is positioned on the main bodies of both the reference unit 5 and the sample carrier unit 6. In this case, the heat flow element 14 is provided to be firmly connected to both the reference unit 5 and the sample carrier unit 6, respectively.

[0079] In other words, connections are provided that are suitable for providing heat flow between each component. For example, each connection can be envisioned as being substantially equivalent to a material connection between each component.

[0080] The main carrier structure 2 has a second retaining element 4 designed to receive the connecting wire sections, i.e., thermocouple wires 13, of the first and second thermocouple means 11, 12, and to simultaneously hold the first retaining element 3. Furthermore, the main carrier structure 2 is designed to hold the reference unit 5 below the sample carrier unit 6, and each connecting wire section, i.e., thermocouple wire 13, is indicated to be guided in substantially the central part of the sample carrier device 1.

[0081] The second retaining element 4 has a first end region 15 that is received by the first retaining element 3, and a second end region 16 located on the opposite side of the first end region 15. The second end region 16 is designed to receive a plug contact unit 17 of the sample carrier device 1 for connecting the connecting wire sections of the first and second thermocouple means 11, 13, i.e., the thermocouple wires 13, to a measuring instrument (not shown in detail). In Figure 1, these thermocouple wires 13 protrude downward (relative to the drawing). These are the same thermocouple wires 13 partially shown between the sample carrier unit 6 and the first retaining element 3.

[0082] However, these ends are positioned within the plug connection unit 17, and it is conceivable that they can be connected to the connection area of ​​a measuring instrument (not shown in detail) by the plug connection principle or the like.

[0083] In further implementation variations (not shown in detail), the first and second retaining elements 3 and 4 may be configured as a single material unit, i.e., a component having the functions of the first retaining element 3 and the second retaining element 4.

[0084] Figure 2 shows a schematic side view of an alternative additional sample carrier apparatus 1 for a measuring instrument for thermal sample analysis.

[0085] The illustrated apparatus 1 is substantially the same as the sample carrier apparatus 1 for the thermal sample analysis measuring instrument shown and described in Figure 1. The same reference numerals are used here, so no further explanation is necessary.

[0086] The substantial difference between the embodiment shown in Figure 2 and the embodiment shown in Figure 1 lies in the location of the defined heat flow element 14. In the embodiment of Figure 2, this defined heat flow element 14 is also provided between the reference unit 5 and the sample carrier unit 6, but the connection point on the sample carrier unit 6 is provided via the first plug connection portion 7. In Figure 2, the sample carrier unit 6 and each of the first plug connection portions 7 are provided as a material unit. In other words, this is a component of an integrated structure and is formed to be inherently thermally conductive. The sample carrier unit 6, having each corresponding first plug connection portion 7, can be formed, for example, as a metal film or metal sheet, and each first plug connection portion 7 is bent downward with respect to the drawing. Thus, the connection point of the defined heat flow element 14 is on the sample carrier unit 6, and in Figure 2, a heat conduction path is provided via one of the plug connection portions 7.

[0087] Figure 3 shows a schematic side view of a further sample carrier apparatus 1 for a measuring instrument for thermal sample analysis.

[0088] The illustrated apparatus 1 is substantially the same as the sample carrier apparatus 1 for the thermal sample analysis measuring instrument shown and described in Figure 1. The same reference numerals are used here, so no further explanation is necessary.

[0089] Figure 3 shows a side view rotated 90° relative to Figure 1. In this view, each second plug connector 8 is shown attached to the first retaining element 3, with the end region of each part protruding downward (relative to the drawing) beyond the first retaining element 3. In this respect, each second plug connector 8 is not merely attached to the first retaining element 3, but rather clamped, so that the reference unit 5 is securely held on the retaining element 3.

[0090] Each of the connection wire sections of the first and second thermocouple means 11 and 12, i.e., the thermocouple wires 13 that protrude downward beyond the plug connection unit 17, conceals one thermocouple wire 13 in each section, so only two thermocouple wires 13 are shown in the side view of Figure 3.

[0091] Above the first holding element 3, four thermocouple wires 13 are shown, and each thermocouple means 11, 12 is provided with two thermocouple wires 13. In this respect, the thermocouple wires 13 of each thermocouple means 11, 12 are guided from bottom to top within the main carrier structure 2 and distributed above the first holding element 3 according to their function.

[0092] Figure 4 shows a schematic top view of the sample carrier device 1 for a thermal sample analysis measuring instrument, with the sample carrier unit removed.

[0093] The illustrated apparatus may be substantially the same as the sample carrier apparatus 1 for the thermal sample analysis measuring instrument shown and described in Figure 1. The same reference numerals are used here, so no further explanation is necessary.

[0094] In this case, the reference unit 5 is shown as a substantially circular element with free space in the center. The first retaining element 3 is shown as substantially rectangular in shape, and a view to the second retaining element 4 is ensured in the center of the first retaining element 3. In this respect, since the second retaining element 4 is hollow inside, the thermocouple wires 13 of each thermocouple means 11, 12 can be guided in this hollow space.

[0095] Figure 4 shows a thermocouple means 11 for measuring the temperature on a reference unit 5, with a thermocouple 18 connected so as to be in direct contact with a surface section of the reference unit 5. The thermocouple 18 is surrounded by each thermocouple wire 13 of the thermocouple means 11. In this case, these thermocouple wires 13 are arranged to be in direct contact with the thermocouple 18. The thermocouple 18 can have a spatial spread of several millimeters in all directions, for example, 1 to 35 mm, preferably 5 to 20 mm, preferably 2 to 15 mm, and preferably 3 to 7 mm.

[0096] In one embodiment, the thermocouple 18 may have dimensions exceeding those of a typical thermocouple bead, and is thus suitable and designed to determine, to some extent, the temperature profile in the range between the sample under measurement and the reference unit 5.

[0097] In this regard, in the application of the sample carrier device 1, a defined heat channel exists between the sample to be measured (stored, for example, in a crucible and held on the sample carrier unit 5) and the reference unit 5. In this respect, the sample carrier unit 6 of the sample carrier device 1 is directly connected to the reference unit 5 and the defined thermal resistance section via a solid material.

[0098] In Figure 4, the sample carrier apparatus 1 for a thermal sample analysis measuring instrument is shown with the sample carrier unit 6 removed, and the first and second holding elements 3 and 4 are clearly visible. The sample carrier unit 6 is connected above the illustrated reference unit 5 without direct contact, in this case by a defined heat flow element 14.

[0099] Furthermore, insertion slot regions 19 into which a sample carrier unit 6 (not shown) can be inserted are shown in each lateral end region of the first holding element 3. In the illustrated embodiment, these insertion slot regions 19 have a substantially rectangular shape.

[0100] However, in other embodiments (not shown in detail), these insertion slot areas may have alternative shapes. In this case, the insertion slot area is preferably selected according to the shape of the first plug connection portion 7 of the sample carrier unit 6 (not shown), thereby allowing the plug connection portion 7 to be fixed to the first retaining element 3 as precisely as possible at this location.

[0101] Figure 5 shows a schematic diagram of a measuring instrument for thermal sample analysis. The sample carrier device 1 for the measuring instrument for thermal sample analysis according to the present invention is shown positioned within the heating / cooling means 20 of the measuring instrument 100.

[0102] The illustrated apparatus may be substantially the same as the sample carrier apparatus 1 for the thermal sample analysis measuring instrument shown and described in Figure 1.

[0103] The sample carrier device 1 is located substantially in the center of the heating / cooling means 20 in the measuring instrument 100, and in this case, the sample carrier device 1 is shown functionally coupled to the connection unit 21 of the measuring instrument 100 via a plug connection unit 17.

[0104] In this case, each thermocouple wire 13 of each thermocouple means 11, 12 in the sample carrier device 1 is provided to be coupled to the measuring instrument 100, thereby enabling corresponding control and measurement processing via the control means (not shown in detail) of the measuring instrument 100.

[0105] In particular, the measuring instrument 100 may include a weight measuring means in the form of a scale (not shown in detail), and the sample carrier device 1 may be connected to this weight measuring means via a plug connection unit 17.

[0106] This allows for the capture of temperature and its temperature difference via thermocouples 11 and 12, while simultaneously measuring the sample mass as a function of temperature and time. With appropriate calibration, heat flow can be calculated from the temperature difference.

[0107] Due to its space-saving structure and characteristics, the sample carrier device 1 can be advantageously positioned within the measuring instrument 100, and maintenance or replacement can be easily performed. The sample to be measured in the corresponding sample container can also be easily inserted into or placed in the sample carrier device 1.

[0108] The measuring instrument 100 has a lifting mechanism (not shown in detail), and it is conceivable that, based on the drawing, the sample carrier device 1 can be displaced upward and stored or functionally coupled to it. The user can then perform replacement work, for example, through the opening area 22 provided with the cover element 23 in the measuring instrument 100. For example, the components of the sample carrier device 1 can also be easily accessed in this way for maintenance or replacement processes. This is because the sample carrier device 1 has a slim design, and the arrangement of its individual components is particularly advantageous for these purposes.

[0109] Therefore, for example, from the viewpoint of the modular design principle, different thermocouple means 11 and 12 can be provided, in which case the individual components are easily interchangeable without the need to disassemble the measuring instrument 100 into individual parts for that purpose. [Explanation of Symbols]

[0110] 1. Sample carrier device 2. Main carrier structure 3 First holding element 4 Second holding element 5. Reference Unit 6. Sample carrier unit 7. First plug connection section 8. Second plug connection section 9 Connection Area 10 Retention means 11. First thermocouple means 12. Second thermocouple means 13 Thermocouple wire 14. Specified heat flow elements 15 First end area 16 Second end area 17 Plug Contact Unit 18 Thermocouples 19 Insertion slot area 20 Heating / cooling means 21 Connection Units 22 Opening area 23 Cover Elements

Claims

1. A sample carrier device (1) for a measuring instrument for thermal sample analysis, wherein the sample carrier device (1) comprises a main carrier structure (2), a reference unit (5) having a first thermocouple means (11), and a sample carrier unit (6) having a second thermocouple means (12), and the main carrier structure (2) is designed to hold the reference unit (5) and the sample carrier unit (6) spatially separated from each other. A sample carrier apparatus characterized in that a defined heat flow element (14) is arranged between a reference unit (5) and a sample carrier unit (6).

2. A sample carrier device (1) according to claim 1, wherein the defined heat flow element (14) is selected from metal wire, copper wire, platinum wire, platinum alloy wire, nichrome wire, nickel alloy wire, metal sheet, copper sheet, platinum sheet, platinum alloy sheet, nichrome sheet, nickel alloy sheet, metal rod, copper rod, platinum rod, platinum alloy rod, nichrome rod, and nickel alloy rod.

3. A sample carrier device (1) according to claim 2, wherein the main carrier structure (2) is designed to hold the reference unit (5) below the sample carrier unit (6).

4. A sample carrier device (1) according to any one of claims 1 to 3, wherein the main carrier structure (2) has at least one first retaining element (3) designed to reversibly receive the reference unit (5) and the sample carrier unit (6).

5. A sample carrier device (1) according to any one of claims 1 to 4, wherein the main carrier structure (2) has a second holding element (4) designed to receive the connecting wire sections of the first and second thermocouple means (11, 12) and to hold the first holding element (3).

6. A sample carrier device (1) according to claim 5, wherein the second retaining element (4) has a first end region (15) designed to be received by the first retaining element (3) and a second end region (16) located opposite the first end region (15), the second end region (16) being designed to receive a plug contact unit (17) in the sample carrier device (1) for connecting the respective connecting wire sections of the first and second thermocouple means (11, 12) to a measuring instrument.

7. A sample carrier device (1) according to any one of claims 1 to 6, wherein the sample carrier unit (6) holds each sample container and has a holding means designed to be flexibly configurable, thereby allowing each sample container of different size and material to be individually and reversibly received by the sample carrier unit (6).

8. A sample carrier device (1) according to any one of claims 1 to 7, wherein the first holding element (3) is aluminum oxide (Al 2 O 3 A sample carrier device consisting of the following components.

9. A sample carrier device (1) according to any one of claims 1 to 8, wherein the reference unit (5) and the sample carrier unit (6) are arranged vertically to each other without direct contact, and each has a diameter at least substantially twice the diameter of the second holding element (4).

10. A sample carrier device (1) according to any one of claims 4 to 9, wherein the sample carrier unit (6) is reversibly fixed to the first holding element (3) by at least one first plug connector (7).

11. A sample carrier device (1) according to any one of claims 4 to 10, wherein the reference unit (5) is reversibly fixed to the first holding element (3) by at least one second plug connector (8).

12. A sample carrier device (1) according to any one of claims 4 to 11, wherein the first holding element (3) is reversibly fixed to the second holding element (4) by at least one plug connector.

13. A sample carrier device (1) according to claim 12, wherein at least one plug connection between the first and second holding elements has a substantially conical shape.

14. A sample carrier device (1) according to any one of claims 1 to 13, wherein the sample carrier unit (6) is substantially composed of a metal film, the metal being selected from platinum, platinum alloys, nichrome, nickel alloys, steel, and similar alloys, and the thickness of the metal film being 0.02 to 3 mm, preferably 0.03 to 2 mm, preferably 0.05 to 1 mm.

15. A sample carrier device (1) according to any one of claims 4 to 11, wherein each plug connection portion is reinforced with at least one type of ceramic adhesive.

16. A measuring instrument (100) for thermal sample analysis, comprising a sample carrier device (1) according to any one of claims 1 to 15, and a weight measuring means for capturing the sample mass of a sample to be analyzed.

17. A measuring instrument (100) according to claim 16, wherein the measuring instrument does not include a weight measuring means for capturing the sample mass of the sample to be analyzed.

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