Circuit board assembly and secondary battery containing the same

Abstract

The present invention provides a circuit board assembly and a secondary battery including the same, which can reduce the volume of the circuit board assembly for a secondary battery and improve the soldering accuracy and soldering strength between components of the circuit board assembly. [Solution] A substrate assembly according to one embodiment of the present disclosure includes an integrated module having a printed circuit board having a first surface and a second surface facing the first surface, a plurality of first pads arranged on the first surface, and a plurality of electronic components arranged on the second surface, and a flexible printed circuit board having a main line portion covering the plurality of first pads and a connecting portion extending from one side of the main line portion, with the first surface arranged on the main line portion, wherein the flexible printed circuit board and the printed circuit board can be electrically connected.

Description

Technical Field

[0001] The present disclosure relates to a substrate assembly and a secondary battery including the same.

Background Art

[0002] Unlike a primary battery that cannot be charged, a secondary battery is a battery that can be charged and discharged. Low-capacity secondary batteries are used in portable small electronic devices such as smartphones, feature phones, notebook computers, digital cameras, and camcorders (registered trademark), and high-capacity secondary batteries are widely used as power sources for motor drive such as hybrid vehicles and electric vehicles, and batteries for power storage.

[0003] A secondary battery can include a flexible printed circuit board (FPCB) that is electrically connected to each battery cell to measure information (e.g., voltage and current information) of the battery cell and transmit the information to the outside.

[0004] A flexible printed circuit board can be connected to various electronic components. Also, a flexible printed circuit board can be connected to a printed circuit board (PCB) on which various electronic components are arranged. The printed circuit board can be a rigid printed circuit board that is more rigid than the flexible printed circuit board.

[0005] The connection between the flexible printed circuit board and the printed circuit board is usually performed by connecting one end of the flexible printed circuit board to one end of the printed circuit board. In this case, the volume of the substrate assembly formed by integrating the printed circuit board and the flexible printed circuit board must consider the length of each substrate, so the volume may increase.

[0006] On the other hand, as the demand for secondary batteries with gradually increasing capacity increases, the capacity of the battery cells accommodated in the battery pack is also increasing. For this reason, the size of the battery cells may increase, but it is not preferable for the overall volume of the battery pack to increase due to this.

[0007] This is because, assuming that a battery pack has a limited volume that conforms to the standard, if the size of the battery cells increases, the space available for other electronic components inside the battery pack will inevitably decrease. For example, if there is insufficient space inside the battery pack for protective modules that ensure the stability of the secondary battery, and they cannot be installed, it could lead to stability problems not only for the battery pack itself, but also for the devices that use the battery pack as a power source (e.g., smartphones, wearable devices, etc.).

[0008] Therefore, there is an increasing need for methods to reduce the volume of electronic components when constructing secondary batteries.

[0009] The information disclosed above in the technology that forms the background of such inventions is solely for the purpose of improving the understanding of the background of the present invention and may include information that does not constitute prior art. [Overview of the Initiative] [Problems that the invention aims to solve]

[0010] This disclosure aims to reduce the volume of a substrate assembly for a secondary battery and to improve the soldering accuracy and soldering strength between components of the substrate assembly.

[0011] However, the technical problems that this invention aims to solve are not limited to those described above, and other problems not mentioned should be clearly understood by those skilled in the art from the description of the invention below. [Means for solving the problem]

[0012] A substrate assembly according to one embodiment of the present disclosure for solving the above technical problems includes an integrated module having a printed circuit board having a first surface and a second surface facing the first surface, a plurality of first pads arranged on the first surface, and a plurality of electronic components arranged on the second surface, and a flexible printed circuit board having a main line portion covering the plurality of first pads, and a connecting portion extending from one side of the main line portion, with the first surface arranged on the main line portion, wherein the flexible printed circuit board and the printed circuit board can be electrically connected.

[0013] The flexible printed circuit board may include a plurality of connecting pads arranged on one surface of the main line portion, corresponding to the arrangement of the first pads.

[0014] Among multiple connecting pads, the connecting pad positioned adjacent to the connecting portion may have a larger surface area than the other connecting pads.

[0015] Among the multiple connecting pads, the connecting pad positioned adjacent to the connecting portion may have a recess on at least one side that is indented in the width direction of the flexible printed circuit board.

[0016] A first pad positioned adjacent to the connecting portion among multiple first pads may have a larger area than the other first pads.

[0017] Among the multiple first pads, the first pad positioned adjacent to the connecting portion may have a recess on at least one side that is indented in the width direction of the printed circuit board.

[0018] A connecting pad among multiple connecting pads that is positioned adjacent to the connecting portion may have a larger area than the other connecting pads, and a first pad among multiple first pads that is positioned adjacent to the connecting portion may have a larger area than the other first pads.

[0019] At least one of the connection pads arranged adjacent to the connection part side among the plurality of connection pads and at least one of the first pads arranged adjacent to the connection part side among the plurality of first pads can have a recess that sinks in the width direction of the flexible printed circuit board or the printed circuit board on at least one side.

[0020] The flexible printed circuit board has a hole that sinks inward with respect to the width direction of the flexible printed circuit board on one side, and the integrated module can include a protrusion that protrudes from the first surface and is accommodated in the hole.

[0021] There are a plurality of holes and protrusions, and the holes and protrusions can be arranged on one side of the flexible printed circuit board and the printed circuit board respectively.

[0022] There are a plurality of holes and protrusions, and the holes and protrusions can be alternately arranged on one side and the other side of the flexible printed circuit board and the printed circuit board respectively.

[0023] A secondary battery according to an embodiment of the present disclosure can include an electrode assembly including electrode leads, a case accommodating the electrode assembly, and the aforementioned substrate assembly electrically connected to the electrode leads.

Advantages of the Invention

[0024] According to the present disclosure, the volume of the substrate assembly can be reduced.

[0025] Also, according to the present disclosure, the soldering strength at the vulnerable part of the substrate assembly can be increased.

[0026] Also, according to the present disclosure, misalignment between the substrates of the substrate assembly can be suppressed and skewing can be prevented.

[0027] However, the effects obtained through the present invention are not limited to the above-mentioned effects, and other technical effects not mentioned should be clearly understood by those skilled in the art from the description of the invention described below.

Brief Description of the Drawings

[0028] The following drawings attached to this specification illustrate preferred embodiments of the present invention and serve to further understand the technical concept of the present invention together with the detailed description of the invention to be described later. Therefore, the present invention should not be construed as being limited only to the matters described in such drawings. [Figure 1] It is a perspective view of a secondary battery including a substrate assembly according to an embodiment of the present disclosure. [Figure 2] It is an exploded perspective view of the secondary battery of FIG. 1. [Figure 3] It is a perspective view of a substrate assembly according to an embodiment of the present disclosure. [Figure 4] It is a diagram for explaining an electrical connection relationship between an integrated module and a flexible printed circuit board. [Figure 5] It is a cross-sectional view taken along line V-V of FIG. 3. [Figure 6] It is a diagram showing a weak portion of a substrate assembly according to another embodiment of the present disclosure. [Figure 7] It is a partial cross-sectional view of a substrate assembly according to another embodiment of the present disclosure. [Figure 8] It is a cross-sectional view taken along line VIII-VIII of FIG. 3. [Figure 9] It is a bottom view of the substrate assembly of FIG. 3. [Figure 10] It is a bottom view of a substrate assembly according to another embodiment of the present disclosure.

Embodiments for Carrying Out the Invention

[0029] Preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings. Prior to this, terms and words used herein and in the claims should not be interpreted to be limited to their usual or lexicographical meanings, but rather to mean and to represent the technical idea of ​​the present invention, based on the principle that inventors may appropriately define the concepts of terms in order to best describe their invention. Accordingly, the embodiments described herein and the configurations shown in the drawings represent only some of the most preferred embodiments of the present invention and do not represent the entire technical idea of ​​the present invention, and it should be understood that there may be a variety of equivalents and modifications that can substitute for them at the time of filing. Also, where used herein, “comprise, include” and / or “comprising, including” specify the presence of the shapes, figures, stages, actions, members, elements, and / or groups thereof mentioned, and do not exclude the presence or addition of one or more other shapes, figures, actions, members, elements, and / or groups thereof. Also, when describing embodiments of the present invention, “may be” and “may include” “one or more embodiments of the present invention.”

[0030] Furthermore, for the sake of understanding the invention, the attached drawings are not shown to actual scale, and the dimensions of some components may be exaggerated. Also, the same component may be assigned the same reference numeral in different embodiments.

[0031] The statement that two comparison subjects are "identical" means that they are "substantially identical." Therefore, substantially identical subjects may have deviations that are considered low in the industry, for example, deviations of 5% or less. Furthermore, the uniformity of a parameter within a given domain can mean that it is uniform from an average perspective.

[0032] While terms like "first," "second," etc., are used to describe various constituent elements, these elements are not limited by these terms. These terms are simply used to distinguish one element from another, and unless otherwise stated, the first element may also be the second element.

[0033] Throughout the specification, unless otherwise stated, each component may be singular or plural.

[0034] The placement of any configuration "above (or below)" or "above (or below)" a component means not only that the configuration is placed in contact with the upper (or lower) surface of the component, but also that other configurations may be interposed between the component and any configuration placed on (or below) it.

[0035] Furthermore, when it is stated that one component is “connected,” “joined,” or “connected” to another component, it should be understood that the components may be directly connected or linked to each other, but may also be “interposed” between each component, or each component may be “connected,” “joined,” or “connected” through other components. Also, when it is said that one part is electrically coupled to another part, this includes not only cases where they are directly connected, but also cases where they are connected with another element in between.

[0036] Whenever the specification states "A and / or B," it means A, B, or A and B, unless otherwise specified. That is, "and / or" includes all combinations or any combination of the listed items. When the specification states "C to D," it means C or greater and D or less, unless otherwise specified.

[0037] Figure 1 is a perspective view of a secondary battery 1 including a substrate assembly 50 according to one embodiment of the present disclosure. Figure 2 is an exploded perspective view of the secondary battery 1 of Figure 1. Referring to Figure 1, the secondary battery 1 includes a case 10, an electrode assembly 30 housed in the case 10, and a substrate assembly 50 electrically connected to the electrode assembly 30.

[0038] In this embodiment, the case 10 consists of a pouch type made of laminate film or plastic. Alternatively, the case 10 may consist of a metal can (e.g., cylindrical or rectangular).

[0039] The electrode assembly 30 may include a first electrode 310, a second electrode 330, and a separation membrane 350 interposed between them. The first electrode 310 and the second electrode 330 may have opposite polarities. For example, if the first electrode 310 is the positive electrode, the second electrode 330 may be the negative electrode, and the opposite is also true.

[0040] The electrode assembly 30 may be a stack type in which a first electrode 310 and a second electrode 330 are stacked with a separation membrane 350 in between, and such stacks are repeatedly stacked, or it may be a winding type in which the first electrode 310, which is placed on one side of the separation membrane 350, and the second electrode 330, which is placed on the other side of the separation membrane 350, are wound up while maintaining their stacked state.

[0041] Referring to Figure 2, the electrode assembly 30 may further include electrode leads 370. The electrode leads 370 may be configured as extensions of the substrates of each electrode 310, 330 that are not coated with the active material layer. The electrode assembly 30 can be electrically connected to an external configuration through the electrode leads 370. A substrate assembly 50 can be connected to the electrode leads 370.

[0042] The substrate assembly 50 may include an integrated module 510 and a flexible printed circuit board 530. The integrated module 510 may be a SIP (system in package) module in which numerous electronic components are mounted on the substrate. A detailed explanation of the integrated module 510 will be given later with reference to Figure 5.

[0043] The integrated module 510 can be placed on one side of the flexible printed circuit board 530. Alternatively, taps 550 made of a conductive material such as nickel may be placed on the other side of the flexible printed circuit board 530. The taps 550 may be used to electrically connect the board assembly 50 to the electrode leads 370.

[0044] However, the electrical connection between the electrode lead 370 and the substrate assembly 50 is not limited to an indirect method using the tap 550, but may also be performed by a direct method such as welding.

[0045] The secondary battery 1 may further include an insulating member 70 positioned between the substrate assembly 50 and the case 10. The insulating member 70 may have a structure in which two surfaces are connected at a right angle. The insulating member 70 is made of an insulating material and can prevent unintended electrical connections between the electrode assembly 30 and the substrate assembly 50.

[0046] The substrate assembly 50, which is electrically connected to the electrode assembly 30, can transmit information from the electrode assembly 30 to the outside, and can also transmit external signals to the electrode assembly 30. The substrate assembly 50 will be explained in detail through Figures 3 and 4.

[0047] Figure 3 is a perspective view of a substrate assembly 50 according to one embodiment of the present disclosure, and Figure 4 is a diagram illustrating the electrical connection relationship between the integrated module 510 and the flexible printed circuit board 530 of the substrate assembly 50 of Figure 3.

[0048] Referring to Figure 3, the flexible printed circuit board 530 may include a main line section 5310 and a connecting section 5330 extending from one side of the main line section 5310. An integrated module 510 may be arranged on the main line section 5310, and a terminal 5350 for connection to an external configuration may be arranged on the end of the connecting section 5330 that is not connected to the main line section 5310.

[0049] The integrated module 510, which is arranged on one surface of the main line section 5310, can be electrically connected to the flexible printed circuit board 530. For example, the electrical connection method may be soldering.

[0050] Referring to Figure 4, a bottom view of the integrated module 510 and a top view of the flexible printed circuit board 530 are shown to illustrate the electrical connection between the integrated module 510 and the flexible printed circuit board 530.

[0051] The flexible printed circuit board 530 may include a plurality of connecting pads 5370 arranged on one surface of the main line portion 5310. The plurality of connecting pads 5370 may be configured to electrically connect the flexible printed circuit board 530 to other components. In one embodiment, the plurality of connecting pads 5370 may be pads to which soldering is performed.

[0052] In response to this, the integrated module 510, which includes a printed circuit board (PCB) 5110, may also include a plurality of first pads 5150 arranged on the surface 5111 of the printed circuit board 5110 that contacts the flexible printed circuit board 530 (hereinafter referred to as the first surface for convenience).

[0053] The connecting pads 5370 and the first pads 5150 can be arranged identically so as to correspond to each other. For example, the arrangement of the connecting pads 5370 may be the same as the arrangement of the first pads 5150. For example, multiple connecting pads 5370 can be arranged in two rows.

[0054] The first row (upper row, reference to Figure 4) may have pads for soldering the negative terminal of the external connection terminal to the SWI (Switch input) terminal, and the second row (lower row, reference to Figure 4) may have pads for soldering the positive terminal of the external connection terminal to the internal connection terminal, SWI terminal, TP (Test point) terminal, and CON_DET (Connector detect) terminal, respectively. As mentioned above, multiple first pads 5150 can also have the same arrangement configuration.

[0055] The integrated module 510 and the flexible printed circuit board 530 can be electrically connected by soldering. For example, the integrated module 510 and the flexible printed circuit board 530 can be electrically connected by surface mounting technology (SMT).

[0056] Surface mount technology allows for the electrical connection between the printed circuit board 5110 and the integrated module 510 by first placing the integrated module 510 on the connecting pads 5370 already arranged on the flexible printed circuit board 530 without user intervention, and then melting the connecting pads 5370 at a high temperature and solidifying them at room temperature.

[0057] Generally, soldering requires an open space above the board for the user to perform the soldering. However, with surface mount technology, this open space is not required. Unlike existing methods, this allows for the additional placement of modules and electronic components in the upper space, reducing the volume of the finished board and enabling efficient use of the space in the electronic device on which the board is used.

[0058] In other words, the integrated module 510 can be configured such that the first surface 5111 of the printed circuit board 5110 is placed on one surface of the flexible printed circuit board 530, and the first surface 5111 is soldered to one surface of the flexible printed circuit board 530 via surface mount technology.

[0059] Therefore, unlike a typical substrate assembly in which a flexible printed circuit board is connected on one side of the module, the substrate assembly 50 according to one embodiment of the present disclosure can have its volume reduced.

[0060] Figure 5 is a cross-sectional view taken along the VV line in Figure 3. Referring to Figure 5, the integrated module 510 may include a printed circuit board 5110, electronic components 5130 mounted on the printed circuit board 5110, and a protective layer 5190 molded on the electronic components 5130.

[0061] Electronic components 5130 may be arranged on one surface of the printed circuit board 5110, and multiple second pads 5170 may be arranged on the second surface 5113 of the printed circuit board 5110, which faces the first surface 5111, for the purpose of electrical connection between the electronic components 5130 and the printed circuit board 5110.

[0062] In this case as well, the integrated module 510 can electrically connect the printed circuit board 5110 and the electronic components 5130 through surface mount technology in order to mount many electronic components 5130 onto the printed circuit board 5110.

[0063] Specifically, the electronic components 5130 are placed on a plurality of second pads 5170 arranged on the second surface 5113, and soldering is performed by melting and solidifying the second pads 5170 using temperature changes.

[0064] This allows the integrated module 510 to use the space on the printed circuit board 5110 more efficiently, enabling the mounting of more electronic components 5130 on the printed circuit board 5110 than in the typical case. In other words, two surface mounting techniques can be performed. However, in this case, there may need to be a difference in the temperature at which each surface mounting technique is performed to prevent the solder pads that have already been soldered from melting again.

[0065] Furthermore, the integrated module 510 may further include a protective layer 5190 in order to avoid impairing the electrical connections between the above-mentioned components. With the electronic components 5130 electrically connected to the printed circuit board 5110, the protective layer 5190, formed to have a certain shape using a molding compound, can be placed on the electronic components 5130. In this case, the molding compound can have high mechanical strength and excellent electrical insulation properties, and may be an epoxy substrate.

[0066] When the integrated module 510 and the flexible printed circuit board 530 are electrically connected, the connecting portion 5330 side of the flexible printed circuit board 530 does not need to be connected to the integrated module 510. Therefore, when an external force is applied to the connecting portion 5330, there is a high possibility that the soldering will be damaged in the part of the WP located close to the connecting portion 5330 (hereinafter referred to as the weak part for convenience).

[0067] Figure 6 shows a weak portion WP of the substrate assembly 50 according to another embodiment of the present disclosure, and Figure 7 is a partial cross-sectional view of the substrate assembly 50 according to another embodiment of the present disclosure. Figure 6 may show either the printed circuit board 5110 or the flexible printed circuit board 530 of the substrate assembly 50.

[0068] Referring to Figures 6 and 7, the substrate assembly 50 according to other embodiments of the present disclosure can enlarge the area of ​​the pads 5150, 5370 placed on the fragile portion WP to prevent damage at the fragile portion WP. That is, the substrate assembly 50 can enlarge the area by merging the pads 5150, 5370 for soldering to adjacent terminals of the same type.

[0069] For example, the area of ​​the flexible printed circuit board 530 can be increased by merging the connecting pads 5370 in the weak portion WP. However, when merging the connecting pads 5370, it is preferable to merge connecting pads 5370 that are used to solder terminals of the same type.

[0070] For example, referring to Figure 4, two connecting pads 5370 for connecting the positive terminals in the external connecting terminals are located on the fragile portion WP side of the flexible printed circuit board 530, and a connecting pad 5370 for soldering the CON_DET terminal is located on one side of it. Therefore, in this case, it is preferable to merge only the two connecting pads 5370 for connecting the positive terminals in the external connecting terminals to increase the area.

[0071] In other embodiments of the present disclosure, the substrate assembly 50 may have a recess 5371 on at least one side of the connecting pad 5370 that is recessed in the width direction (up and down direction with reference to Figure 6) of the flexible printed circuit board 530, in order to prevent additional misalignment between the flexible printed circuit board 530 and the integrated module 510 during soldering due to an increase in the area of ​​the connecting pad 5370.

[0072] The recess 5371 allows the molten connecting pads 5370 to concentrate in the center during soldering, thereby correctly aligning the soldering positions of each component. There may be multiple recesses 5371.

[0073] Similarly, the first pad 5150 of the printed circuit board 5110 in the weak portion WP can also be merged, and the printed circuit board 5110 can have at least one recess 5151 that is recessed in the width direction (vertical direction with respect to Figure 6).

[0074] Along with this, it is natural that the area of ​​both the connecting pad 5370 and the first pad 5150 can be enlarged so that they have at least one or more recesses 5371 and 5151.

[0075] Figure 8 is a cross-sectional view taken along line VIII-VIII in Figure 3. Referring to Figure 8, the flexible printed circuit board 530 may have a hole 5380 on one side that is recessed inward with respect to the width direction of the flexible printed circuit board 530, and the printed circuit board 5110 of the integrated module 510 may have a projection 5180 that protrudes from the first surface 5111 and is housed in the hole 5380.

[0076] The substrate assembly 50 can prevent twisting between the integrated module 510 and the flexible printed circuit board 530, which can occur during the SMT process where soldering is performed without human intervention through holes 5380 and protrusions 5180 housed within them. By preventing this twisting, the substrate assembly 50 does not increase in volume.

[0077] Figure 9 is a bottom view of the substrate assembly 50 of Figure 3, and Figure 10 is a bottom view of the substrate assembly 50 according to another embodiment of the present disclosure.

[0078] Referring to Figure 9, the substrate assembly 50 can be provided with a plurality of holes 5380 and a plurality of protrusions 5180 housed within them. In this case, the shape of the holes 5380 may be semicircular, but is not limited to this. When there are multiple holes 5380 and protrusions 5180, the holes 5380 and protrusions 5180 are arranged parallel to one side of the flexible printed circuit board 530 and the printed circuit board 5110, respectively.

[0079] Referring to Figure 10, the substrate assembly 50 according to other embodiments of the present disclosure may have multiple holes 5380 and projections 5180, which may be alternately arranged on one side and the other side of the flexible printed circuit board 530 and the printed circuit board 5110. In this case, the anti-twisting effect will be even better than when they are arranged parallel to one side.

[0080] Although the present invention has been described above with reference to the limited embodiments and drawings provided, the present invention is not limited thereto, and various modifications and variations are possible within the equivalent scope of the technical concept of the present invention and the claims described below by persons with ordinary skill in the art to which the present invention pertains. [Explanation of Symbols]

[0081] 1: Secondary battery 10: Case 30: Electrode assembly 50: Circuit board assembly 70: Insulating material 310: 1st electrode 330:Second electrode 350: Separation membrane 370: Electrode Lead 510: Integrated Module 530: Flexible printed circuit board 550: Tap 5110: Printed circuit board 5111: 1st page 5113:Second side 5130: Electronic components 5150: First pad 5151: Recess 5170: Second pad 5180: Protrusion 5190: Protective layer 5310: Main line section 5330:Connection part 5350: Terminal 5370: Connecting pad 5371: Recess 5380: Hall WP: Weak point

Claims

1. An integrated module comprising a printed circuit board having a first surface and a second surface opposite the first surface, a plurality of first pads arranged on the first surface, and a plurality of electronic components arranged on the second surface, A flexible printed circuit board includes a main line portion that covers the plurality of first pads, and a connecting portion that extends from one side of the main line portion, wherein the first surface is disposed on the main line portion, Includes, A circuit board assembly in which the flexible printed circuit board and the printed circuit board are electrically connected.

2. The substrate assembly according to claim 1, wherein the flexible printed circuit board further includes a plurality of connecting pads arranged on one surface of the main line portion and arranged in correspondence with the arrangement of the first pads.

3. The substrate assembly according to claim 2, wherein the connecting pad among the plurality of connecting pads that is positioned adjacent to the connecting portion has a larger area than the other connecting pads.

4. The substrate assembly according to claim 3, wherein the connecting pad among the plurality of connecting pads that is positioned adjacent to the connecting portion has a recess on at least one side that is recessed in the width direction of the flexible printed circuit board.

5. The substrate assembly according to claim 2, wherein the first pad among the plurality of first pads that is positioned adjacent to the connecting portion has a larger area than the other first pads.

6. The substrate assembly according to claim 5, wherein the first pad among the plurality of first pads, the one adjacent to the connecting portion side, has a recess on at least one side that is recessed in the width direction of the printed circuit board.

7. The connecting pad among the plurality of connecting pads that is positioned adjacent to the connecting portion has a larger area than the other connecting pads. The substrate assembly according to claim 2, wherein the first pad among the plurality of first pads that is positioned adjacent to the connecting portion has a larger area than the other first pads.

8. The substrate assembly according to claim 7, wherein at least one of the plurality of connecting pads, the connecting pad located adjacent to the connecting portion side, and the plurality of first pads, the first pad located adjacent to the connecting portion side, has a recess on at least one side that is recessed in the width direction of the flexible printed circuit board or printed circuit board.

9. The flexible printed circuit board has a hole on one side that is recessed inward with respect to the width direction of the flexible printed circuit board, The substrate assembly according to claim 1, wherein the integrated module includes a projection that protrudes from the first surface and is housed in the hole.

10. The aforementioned holes and protrusions are multiple in number. The circuit board assembly according to claim 9, wherein the hole and the projection are respectively located on the flexible printed circuit board and on one side of the printed circuit board.

11. The aforementioned holes and protrusions are multiple in number. The circuit board assembly according to claim 9, wherein the holes and protrusions are arranged alternately on the flexible printed circuit board and on one side and the other side of the printed circuit board, respectively.

12. Electrode assembly including electrode leads; A case for housing the electrode assembly; A substrate assembly according to any one of claims 1 to 11, electrically connected to the electrode lead; Rechargeable batteries, including those mentioned above.

Images