A method of machining a workpiece using a cutting tool.

Abstract

This invention provides a technology that allows for the removal of cutting chips without scattering them during machining operations using a faceplate. [Solution] The method disclosed herein comprises the steps of: installing a suction nozzle between a faceplate and a workpiece, and providing a movable shutter on the side of the faceplate opposite to the workpiece; using the movable shutter to reduce the gap between the through hole in the faceplate and the cutting tool; and starting the suction of cutting chips using the suction nozzle at the start of machining with the cutting tool.

Description

Technical Field

[0001] The present disclosure relates to a method of machining a workpiece using a cutting tool.

Background Art

[0002] Patent Document 1 discloses a technique for sucking cutting chips generated during cutting. In this conventional technique, a suction hood is provided on a tool holder, and the cutting chips generated during cutting by a cutting tool are sucked by the suction hood.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] By the way, there is a case where a method is used in which a face plate for receiving a machining reaction force is installed near the workpiece, and the cutting tool is engaged with the face plate to greatly suppress displacement of the cutting tool due to the machining reaction force. In this method, since the machining reaction force is suppressed by the face plate, the device for holding the cutting tool can be miniaturized. For example, sufficient machining accuracy can be obtained by holding the cutting tool using a small robot.

[0005] However, when applying the above conventional technique to a machining operation using a face plate, there is a problem that the machining hole formed in the face plate becomes large and the device for holding the cutting tool becomes large. Therefore, a technique capable of removing cutting chips without scattering them in a machining operation using a face plate has been desired.

Means for Solving the Problems

[0006] The present disclosure can be realized in the following forms in order to solve at least a part of the above-described problems.

[0007] According to one embodiment of the present disclosure, a method is provided for machining a workpiece using a cutting tool that is mounted to pass through a through-hole in a faceplate. This method comprises the steps of: installing a suction nozzle between the faceplate and the workpiece, and providing a movable shutter on the side of the faceplate opposite to the workpiece; using the movable shutter to reduce the gap between the through-hole in the faceplate and the cutting tool; and starting the suction of cutting debris using the suction nozzle at the start of the machining by the cutting tool.

[0008] In this method, a suction nozzle is installed between the faceplate and the workpiece, and the suction of cutting chips begins at the start of machining, so cutting chips can be removed without scattering during machining using the faceplate. In addition, by using a movable shutter to reduce the gap between the through hole in the faceplate and the cutting tool, the efficiency of cutting chip suction can be improved. [Brief explanation of the drawing]

[0009] [Figure 1] An explanatory diagram showing the overall processing system in the embodiment. [Figure 2] An explanatory diagram showing examples of the shapes of the faceplate and engagement plate. [Figure 3] An explanatory diagram showing the configuration of a cutting debris suction device in an embodiment. [Figure 4] A flowchart illustrating the processing method in the embodiment. [Modes for carrying out the invention]

[0010] Figure 1 is an explanatory diagram showing the overall processing system in an embodiment. This processing system includes a chip suction device 100 installed on the front side of the workpiece WK, a cutting machine 200 that performs cutting on the workpiece WK, and a robot 300 that moves the cutting machine 200. The workpiece WK and the chip suction device 100 are installed on a base 160. In Figure 1, the X and Y axes, which indicate the horizontal direction, and the Z axis, which indicates the vertical upward direction, are depicted.

[0011] The cutting chip suction device 100 includes a faceplate 110 and a suction nozzle 120 provided between the faceplate 110 and the workpiece WK. The faceplate 110 is fixed on a base 160. However, the faceplate 110 may be fixed to another faceplate support, such as the floor, instead of the base 160. Further details of the cutting chip suction device 100 will be described later.

[0012] The cutting apparatus 200 includes a base 210 fixed to or held at the tip of a robot arm 310, and a cutting tool 220 fixed on the base 210. The cutting tool 220 is, for example, a spindle device for rotating a cutting tool 224. The cutting tool 224 is, for example, a drill for drilling holes. The cutting tool 224 is held in a cutting tool holder 222. The cutting tool holder 222 is installed so as to pass through a through hole in an engagement plate 212 provided at the tip of the base 210. The engagement plate 212 is provided parallel to the faceplate 110. An engagement pin 216 for engaging with the faceplate 110 is provided on the front surface of the engagement plate 212.

[0013] Figure 2 is an explanatory diagram showing an example of the shape of the faceplate 110 and the engagement plate 212, and is a view in the -Y direction. The faceplate 110 is provided with a through hole 114 for the tool holder 222 to pass through and two engagement holes 116. The engagement holes 116 have a large diameter portion 116b and a small diameter portion 116s. The engagement plate 212 is provided with a through hole 214 for the tool holder 222 to pass through and two engagement pins 216. The engagement pins 216 have a pin shape composed of a head and a rod-shaped portion. The outer diameter of the head of the engagement pin 216 is set to be smaller than the inner diameter of the large diameter portion 116b of the engagement hole 116 and larger than the inner diameter of the small diameter portion 116s. Also, the outer diameter of the rod-shaped portion of the engagement pin 216 is set to be smaller than the inner diameter of the small diameter portion 116s of the engagement hole 116.

[0014] The through-hole 114 in the faceplate 110 is set to be larger than the through-hole 214 in the engagement plate 212. This is because, when engaging the faceplate 110 and the engagement plate 212, the engagement pin 216 is first passed through the large-diameter portion 116b of the engagement hole 116, and then the engagement plate 212 is moved downward to engage the engagement pin 216 with the small-diameter portion 116s of the engagement hole 116. During this engagement operation, the tool holder 222 moves up and down inside the through-hole 114 of the faceplate 110. Therefore, the through-hole 114 of the faceplate 110 is set to be considerably larger than the outer diameter of the tool holder 222.

[0015] When the engagement pin 216 is engaged with the engagement hole 116, the faceplate 110 and the engagement plate 212 become engaged. In this engaged state, the faceplate 110 functions as a movement restricting unit that restricts the movement of the base 210, including the engagement plate 212, in the Y direction. The number and position of the engagement holes 116 and engagement pin 216 can be arbitrarily set. Alternatively, the faceplate 110 and the engagement plate 212 may be engaged using other engagement means besides the engagement holes 116 and engagement pin 216.

[0016] When performing cutting, the robot 300 is used to move the base 210, engaging the engagement pin 216 with the engagement hole 116, and the cutting tool 224 is pressed against the surface of the workpiece WK and rotated, thereby enabling hole machining in the workpiece WK. Since the faceplate 110 and the base 210 are engaged, the faceplate 110 can receive the machining reaction force in the Y direction that the cutting device 200 receives during hole machining. As a result, cutting can be performed with high precision using a small robot 300.

[0017] Figure 3 is an explanatory diagram showing the configuration of the cutting debris suction device 100 in the embodiment. In Figure 3, the base 160, the base 210, and the robot 300 are omitted from the illustration.

[0018] The cutting chip suction device 100 includes a faceplate 110 and a suction nozzle 120, as well as a suction hose 130, a suction source 140, and a movable shutter 150.

[0019] The suction nozzle 120 has a large-diameter portion 121 connected to the face plate 110 and a small-diameter portion 122 that contacts the surface of the workpiece WK. Both the large-diameter portion 121 and the small-diameter portion 122 have a hollow cylindrical shape. The inner diameter of the large-diameter portion 121 is set larger than the outer diameter of the tool holder 222. The inner diameter of the small-diameter portion 122 is set smaller than the outer diameter of the tool holder 222 and larger than the outer diameter of the tool 224. However, the inner diameters of both may be set the same without dividing them into the large-diameter portion 121 and the small-diameter portion 122. It is preferable that the tip of the small-diameter portion 122 contacts the surface of the workpiece WK without a gap. That is, it is preferable that the suction nozzle 120 covers the space between the face plate 110 and the surface of the workpiece WK without a gap.

[0020] The name "suction nozzle 120" means that the tip of the member 120 has a nozzle-like shape when it is separated from the surface of the workpiece WK. Since the suction nozzle 120 is formed to cover the space around the cutting tool 220 between the face plate 110 and the surface of the workpiece WK, it may also be called by other names such as "suction hood", "suction housing", "suction box", etc.

[0021] A connection port 123 is provided on the side surface of the suction nozzle 120, that is, the lower end portion of the large-diameter portion 121. A suction hose 130 is connected to the connection port 123, and the suction hose 130 is connected to a suction source 140. The cutting chips generated during drilling can be removed from around the tool 224 by suction with the suction source 140 through the suction nozzle 120. The suction of the cutting chips using the suction nozzle 120 is preferably started simultaneously with the start of the machining by the cutting tool 220.

[0022] As described in FIG. 2, the through hole 114 of the face plate 110 is set to be considerably larger than the outer diameter of the tool holder 222. In this case, since the opening area of the through hole 114 is large, the suction force of the cutting chips by the suction source 140 may decrease. Therefore, in the present embodiment, a movable shutter 150 is provided on the surface of the face plate 110 opposite to the workpiece WK. The movable shutter 150 is configured to be able to change the opening area. When sucking the cutting chips, it is preferable to use the movable shutter 150 to reduce the gap between the through hole 114 of the face plate 110 and the cutting tool 220. However, the movable shutter 150 may be omitted.

[0023] FIG. 4 is a flowchart showing the processing method in the embodiment. In step S11, the workpiece WK and the cutting chip suction device 100 are installed. In the present embodiment, the workpiece WK and the cutting chip suction device 100 are installed on the base 160. Note that, with the cutting chip suction device 100 already installed, a new workpiece WK may be exchanged with the processed workpiece WK. Also in this case, it is preferable to install the new workpiece WK so that the tip of the suction nozzle 120 of the cutting chip suction device 100 contacts the surface of the workpiece WK without a gap. In step S11, the suction nozzle 120 is installed between the face plate 110 and the workpiece WK, and the movable shutter 150 is provided in the through hole 114 of the face plate [[ID=][6]]

[0024] In step S12, the face plate 110 and the engagement plate 212 are engaged. This operation is executed by moving the base 210 using the robot 300. Note that if the engagement between the face plate 110 and the engagement plate 212 is completed in step S11, step S12 is omitted.

[0025] In step S13, the movable shutter 150 is closed. That is, the movable shutter 150 is used to reduce the gap between the through hole 114 of the face plate 110 and the cutting tool 220. The opening and closing of the movable shutter 150 may be performed using a driving device such as a motor, or may be manually performed by an operator.

[0026] In step S14, machining using the cutting tool 220 is started, and at the same time, the suction of cutting chips is started. Specifically, the cutting tool 220 is rotated while being pressed against the workpiece WK, and suction by the suction source 140 is started.

[0027] As described above, in this embodiment, a suction nozzle 120 is installed between the faceplate 110 and the workpiece WK, and suction of cutting chips is started at the start of machining, so that cutting chips can be removed without scattering during machining using the faceplate 110. In addition, by using the movable shutter 150 to reduce the gap between the through hole 114 of the faceplate 110 and the cutting tool 220, the suction efficiency of cutting chips can be increased. Furthermore, there is no need to install a cutting chip processing device in the machining equipment, and the labor required to clean up cutting chips can also be omitted.

[0028] Other forms: This disclosure is not limited to the embodiments described above, and can be implemented in various forms without departing from its spirit. For example, this disclosure can also be implemented in the following forms (aspects). The technical features in the embodiments described above that correspond to the technical features in each of the forms described below can be replaced or combined as appropriate in order to solve some or all of the problems of this disclosure, or to achieve some or all of the effects of this disclosure. Furthermore, if such technical features are not described as essential in this specification, they can be deleted as appropriate. [Explanation of Symbols]

[0029] 100...Cutting chip suction device, 110...Face plate, 114...Through hole, 116...Engagement hole, 116b...Large diameter section, 116s...Small diameter section, 120...Suction nozzle, 121...Large diameter section, 122...Small diameter section, 123...Connection port, 130...Suction hose, 140...Suction source, 150...Movable shutter, 160...Base, 200...Cutting device, 210...Base, 212...Engagement plate, 214...Through hole, 216...Engagement pin, 220...Cutting tool, 222...Tool holder, 224...Tool, 300...Robot, 310...Robot arm

Claims

[Claim 1] A method of machining a workpiece using a cutting tool that is mounted to pass through a through-hole in a faceplate, The steps include: installing a suction nozzle between the faceplate and the workpiece, and providing a movable shutter on the side of the faceplate opposite to the workpiece; A step of using the movable shutter to reduce the gap between the through hole in the faceplate and the cutting tool, The process includes starting the machining with the cutting tool and simultaneously starting the suction of cutting debris using the suction nozzle, A method for providing this.

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