PCB transport robot

The substrate transfer robot uses a force sensor and control unit to automatically adjust the force applied to the workpiece, addressing the manual force adjustment burden in existing robots and improving operational efficiency.

JP2026073698APending Publication Date: 2026-05-01KAWASAKI JUKOGYO KK
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
KAWASAKI JUKOGYO KK
Filing Date
2024-10-18
Publication Date
2026-05-01

AI Technical Summary

Technical Problem

Existing substrate transfer robots require manual adjustment of the force applied to the workpiece by the pressing member, which is burdensome for operators.

Method used

A substrate transfer robot equipped with a force sensor and a control unit that automatically adjusts the movement of a movable support portion based on detected force, allowing easy adjustment of the force applied to the workpiece.

Benefits of technology

Facilitates easy and precise control of the force applied to the workpiece during gripping and holding, reducing operator burden and enhancing operational efficiency.

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  • Figure 2026073698000001_ABST
    Figure 2026073698000001_ABST
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Abstract

The present invention provides a substrate transport robot that allows for easy adjustment of the force applied to a workpiece when the workpiece is held in place by clamping it. [Solution] This substrate transport robot comprises fixed support parts 33 and 34, a movable support part 35, a drive unit 36, a force sensor 50, and a control unit. The fixed support parts 33 and 34 contact the workpiece W held by the hand 30. The movable support part 35 holds the workpiece W together with the fixed support parts 33 and 34 in the hand 30. The drive unit 36 ​​moves the movable support part 35. The force sensor 50 detects the force applied to the movable support part 35. The control unit controls the movement of the movable support part 35 by the drive unit 36 ​​based on the detection result of the force sensor 50.
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Citation Information

Patent Citations

  • Apparatus for grasping wafer

    JP2002184853A