Component mounting device, and program creation device for component mounting device

Abstract

To provide a component mounting device that can swap the order in which vacuum-break mounting and atmospheric release mounting processes are performed, and a program creation device for the component mounting device. [Solution] The control device for the component mounting apparatus of this disclosure is capable of performing an adsorption process in which negative pressure is supplied to the adsorption nozzle to adsorb a component onto the adsorption nozzle, an atmospheric release mounting process in which the inside of the adsorption nozzle is opened to the atmosphere and the component adsorbed by the adsorption nozzle is mounted onto the substrate, and a vacuum break mounting process in which positive pressure is supplied to the adsorption nozzle to generate a vacuum break and mount the component adsorbed by the adsorption nozzle onto the substrate. The control device performs the adsorption process, the atmospheric release mounting process, and the vacuum break mounting process based on the order set in the job, and if it detects that the component supply device cannot supply a target component which is a component for which the vacuum break mounting process is to be performed, it will perform the atmospheric release mounting process, which is later in the order of the job than the vacuum break mounting process for which the target component cannot be supplied, before performing the vacuum release mounting process.

Description

Technical Field

[0001] The present disclosure relates to a component mounting device and a program creation device for a component mounting device.

Background Art

[0002] Conventionally, various component mounting devices have been proposed in which components are mounted on a substrate by a mounting head to which suction nozzles are attached. Patent Document 1 below describes a component mounting device in which, in a mounting process, after a component held by a suction nozzle contacts the substrate, the pressure inside the suction nozzle is set to a positive pressure or atmospheric pressure to detach the component from the suction nozzle.

Prior Art Documents

Patent Documents:

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In the atmospheric release mounting process in which the inside of the suction nozzle is opened to the atmosphere and the component adsorbed by the suction nozzle is mounted on the substrate, there is a risk that the time until the component is detached becomes long. On the other hand, in the vacuum break mounting process in which a positive pressure is supplied to the suction nozzle to generate a vacuum break and the component adsorbed by the suction nozzle is mounted on the substrate, there is a risk of blowing off the surrounding components that have already been mounted.

[0005] In view of such circumstances, the present disclosure has been made, and an object thereof is to provide a component mounting device and a program creation device for a component mounting device that can switch the order of execution between a vacuum break mounting process and an atmospheric release mounting process.

Means for Solving the Problems

[0006] This specification discloses a component mounting device comprising: a component supply device for supplying components; a mounting head to which a suction nozzle can be attached; a pressure changing device for changing the pressure of the suction nozzle; a control device capable of controlling the pressure changing device and supplying negative pressure to the suction nozzle to cause the components supplied by the component supply device to be adsorbed onto the suction nozzle; an atmospheric release mounting process for opening the inside of the suction nozzle to the atmosphere and mounting the components adsorbed by the suction nozzle onto a substrate; and a vacuum break mounting process for supplying positive pressure to the suction nozzle to generate a vacuum break and mounting the components adsorbed onto the suction nozzle onto the substrate, wherein the control device executes the adsorption process, the atmospheric release mounting process and the vacuum break mounting process based on the order set in the job, and if the component supply device detects that it cannot supply a target component which is the component for which the vacuum break mounting process is performed, it executes the atmospheric release mounting process, which is later in the order of the job than the vacuum break mounting process for which the target component cannot be supplied, before the vacuum break mounting process. Furthermore, the contents of this disclosure are not limited to implementation as a component mounting device, but can be implemented in various forms. For example, the contents of this disclosure can also be useful when implemented as a program creation device for a component mounting device that edits jobs. [Effects of the Invention]

[0007] According to the component mounting apparatus and the program creation apparatus for the component mounting apparatus of this disclosure, the order in which the vacuum-break mounting process and the atmospheric release mounting process are executed can be swapped. [Brief explanation of the drawing]

[0008] [Figure 1] A diagram showing the configuration of the substrate production system 10 of this embodiment. [Figure 2] Block diagram of the line management device 3 and the mounting device 13. [Figure 3] Plan view of the mounting device 13. [Figure 4] A side view showing the mounting head 33. [Figure 5] A schematic diagram illustrating the adsorption process. [Figure 6] A schematic diagram illustrating the vacuum break mounting process. [Figure 7] A schematic diagram showing the process of venting to the atmosphere during installation. [Figure 8] A diagram showing the Job Editor screen 71. [Figure 9] A flowchart illustrating the installation order control process. [Figure 10] A diagram showing the state in which component P is mounted on circuit board SB. [Figure 11] A schematic side view showing the suction nozzle 35, target component P1, adjacent component P2, and substrate SB. [Modes for carrying out the invention]

[0009] Hereinafter, an embodiment of the component mounting apparatus and component mounting apparatus program creation apparatus of this disclosure will be described in detail with reference to the drawings. Figure 1 shows the configuration of the substrate production system 10 of this embodiment. As shown in Figure 1, the substrate production system 10 comprises a production line 2 and a line management device 3. The production line 2 comprises, for example, a printing press 11, a plurality of mounting devices 13, a reflow oven 14, and a substrate appearance inspection machine 15, moving from the upstream side (front process) to the downstream side (back process) of the production line 2 (from left to right in Figure 1). Each device is connected via a conveyor device 12 that relays the substrate SB. The substrate production system 10 is a system that transports the substrate SB from the upstream to the downstream of the production line 2 and mounts components (electronic components, etc.) on the substrate SB. Furthermore, the line management device 3 and each device of the production line 2 can communicate with each other via a network 7. The network 7 is, for example, a LAN or the internet.

[0010] The printing press 11 is a screen printing press, which prints a viscous fluid, such as solder paste, onto the substrate SB. As will be described later, each of the multiple mounting devices 13 is equipped with a component supply device (such as a tape feeder) and a mounting head, and is a device that mounts components onto the substrate SB on which the solder paste has been printed. The reflow oven 14 is a device that heats the substrate SB with the components mounted on it, melts the solder paste, and then solidifies it. This mounts the components onto the substrate SB. The substrate visual inspection machine 15 is a device that inspects the mounting state of the substrate SB with the components mounted on it.

[0011] As shown in Figures 1 and 2, the line management device 3 is, for example, a PC and includes a CPU 16, a storage device 17, a display device 18, a user interface 19, and a network interface 20. The network interface 20 is, for example, a LAN interface and is connected to network 7. The method of connecting network interface 20 and network 7 may be wired communication or wireless communication. The same applies to network interface 44, which will be described later.

[0012] The line management device 3 is a device that manages production line 2, and manages information about the substrates SB being produced and the progress status of each device on production line 2. Each device on production line 2 exchanges information with the line management device 3 and obtains information such as the progress status of other devices. Note that the configuration of the substrate production system 10 shown in Figure 1 is just one example. For example, the substrate production system 10 may have multiple production lines 2. In this case, a line management device 3 may be placed in each of the multiple production lines 2, or a device that manages multiple production lines 2 together may be placed.

[0013] Furthermore, the line management device 3 changes the jobs (recipes, also known as recipes, or programs that control the production operations) executed by each device on the production line 2, according to the type of circuit board SB being produced. The storage device 17 includes, for example, RAM, ROM, HDD, etc. Note that the configuration of the storage device 17 is not limited to this configuration; an SSD may be used instead of an HDD. The storage device 17 stores multiple jobs executed by each device on the production line 2, and an editing program PG1 for editing the jobs. The display device 18 is, for example, an LCD monitor or an OLED monitor. The user interface 19 is, for example, a keyboard or mouse. Note that the above-described configuration of the line management device 3 is just an example, and the line management device 3 may be other processing devices such as a laptop computer or a tablet terminal.

[0014] A job contains setting data that, for example, instructs each of the multiple mounting devices 13 on the tasks to be performed. For example, a job contains data that instructs each of the mounting devices 13 on the tasks to be performed, such as "which mounting position (XY coordinates) on the transported substrate SB to mount which component." The line management device 3 executes the editing program PG1 on the CPU 16 and accepts editing of the job. For example, a user of the line management device 3 creates a job by operating the user IF 19 before the production of the substrate SB. The line management device 3 stores the created job in the storage device 17 and sends the created job to each device on the production line 2 in response to a so-called setup change, which is a change in the type of substrate SB to be produced on the production line 2. Details of the processing of jobs in the line management device 3 will be described later.

[0015] As shown in FIGS. 2 and 3, the mounting device 13 includes a substrate transfer device 21, a component supply device 22, a component transfer device 23, a component camera 24, a substrate camera 25, and a control device 26. The substrate transfer device 21 includes a belt conveyor and sequentially transfers the substrate SB in the transfer direction. In the following description, as shown in FIG. 2, the transfer direction of the substrate SB is the X-axis direction, the direction parallel to the plane of the substrate SB transferred perpendicular to the X-axis direction is the Y-axis direction, and the direction perpendicular to both the X-axis direction and the Y-axis direction is referred to as the Z-axis direction. The X-axis direction is the transfer direction of the production line 2 in FIG. 1 (the direction from left to right in FIG. 1).

[0016] The substrate transfer device 21 loads the substrate SB from an upstream device into the machine of the mounting device 13 and positions the substrate SB at a predetermined position in the machine. After the component mounting process by the mounting device 13 is completed, the substrate transfer device 21 unloads the substrate SB to a downstream device.

[0017] The component supply device 22 supplies components to be mounted on the substrate SB. The component supply device 22 has a plurality of feeders 28 set side by side in the X-axis direction. Each of the plurality of feeders 28 feeds a carrier tape in which a large number of components are stored and supplies the components so that they can be picked up at a supply position located at the tip side of the feeder 28. Note that the component supply device 22 is not limited to a feeder-type component supply device and may be a tray-type supply device that supplies components using a tray.

[0018] The component transfer device 23 includes a head drive device 31 and a moving stage 32. The head drive device 31 is configured to be able to move the moving stage 32 in the horizontal direction (X-axis direction and Y-axis direction) by a linear motion mechanism. A mounting head 33 is fixedly attached to the moving stage 32 by a clamping member (not shown) so that it can be replaced. The mounting head 33 adsorbs the components supplied by the component supply device 22 with a suction nozzle 35 and mounts them at predetermined mounting positions on the substrate SB.

[0019] The component camera 24 and the substrate camera 25 are imaging devices having image sensors such as CCDs and CMOS sensors. The component camera 24 and the substrate camera 25 perform imaging based on the control of the control device 26 and output the captured image data to the control device 26. The component camera 24 is provided between the feeder 28 and the substrate transport device 21 in the Y-axis direction and is configured to image components held by the suction nozzle 35 from below. The substrate camera 25 is provided on the movable table 32 of the component transfer device 23 and is configured to image the substrate SB from above.

[0020] The control device 26 comprises a controller 41, a plurality of drive circuits 43, and a network IF 44. The controller 41 includes, for example, a CPU 45 and a storage device 46. The storage device 46 stores the control program PG2 and the job. The plurality of drive circuits 43 are provided in correspondence to each of the above-mentioned devices (board transport device 21, component supply device 22, component transfer device 23, component camera 24, board camera 25, positive pressure supply device 47, negative pressure supply device 48, which will be described later). The controller 41 is connected to each device via the drive circuits 43. The controller 41 controls the operation of each device via the drive circuits 43 by executing the control program PG2 with the CPU 45, thereby comprehensively controlling the mounting device 13.

[0021] Network IF44 is, for example, a LAN interface and is connected to the line management device 3 via network 7. Controller 41 obtains jobs from the line management device 3 via network IF44 and network 7. Controller 41 controls each device of the mounting device 13 based on the information of the obtained jobs to mount components onto the substrate SB. In the mounting process of mounting components onto the substrate SB, the control device 26 receives information output from various sensors provided in the mounting device 13, as well as the results of recognition processing such as image processing. Based on the input information and the jobs obtained from the line management device 3, the control device 26 controls the component transfer device 23, etc., and controls the position and rotation angle of the suction nozzle 35 held by the mounting head 33 to mount the components.

[0022] (Regarding the mounting head 33) Figure 4 shows a side view of the mounting head 33. As shown in Figure 4, the mounting head 33 has a head body 51 that is clamped to a mobile base 32. The mounting head 33 is, for example, a rotary-type head device capable of mounting multiple suction nozzles 35. The mounting head 33 is equipped with a rotary head 52 capable of mounting multiple suction nozzles 35. The mounting head 33 also rotates the rotary head 52 around a predetermined axis of rotation (hereinafter referred to as the R axis) by driving an R-axis motor 53 attached to the head body 51, thereby changing the rotational position of the multiple suction nozzles 35. This makes it possible to determine the position of any suction nozzle 35 at the work position for mounting or picking up parts.

[0023] Figure 5 schematically shows the state of the suction process in which the part P is adsorbed by the suction nozzle 35. As shown in Figures 4 and 5, the suction nozzle 35 is attached to the rotary head 52 via the tool shaft 55. Also, as shown in Figure 2, the mounting device 13 includes a positive pressure supply device 47 that supplies positive pressure to the suction nozzle 35 and a negative pressure supply device 48 that supplies negative pressure to the suction nozzle 35. The positive pressure supply device 47 and the negative pressure supply device 48 supply air at a predetermined pressure based on the control of the control device 26. The positive pressure supply device 47 is equipped with, for example, a blower or compressor and supplies air at a predetermined positive pressure. The negative pressure supply device 48 is equipped with, for example, a negative pressure pump and supplies air at a predetermined negative pressure. Note that the gas supplied by the positive pressure supply device 47 and the negative pressure supply device 48 may be a gas other than air.

[0024] The suction nozzle 35 is attached to the lower end of the tool shaft 55. The mounting head 33 includes a positive pressure supply passage 57 connected to a positive pressure supply device 47 and a negative pressure supply passage 58 connected to a negative pressure supply device 48. The suction nozzle 35, positioned at the work location, can be connected to the positive pressure supply passage 57 and the negative pressure supply passage 58 via the tool shaft 55. The mounting head 33 is also provided with a spool 59 and a stepping motor 61. The spool 59 is located in the middle of the flow paths of the positive pressure supply passage 57 and the negative pressure supply passage 58. The spool 59 has a first flow path 59A and a second flow path 59B formed therein. An engaging member 61A that engages with the spool 59 is connected to the output shaft of the stepping motor 61. The stepping motor 61 rotates its output shaft based on the control of the control device 26, changing the rotational position and orientation of the engaging member 61A, thereby changing the position of the spool 59 in the Z-axis direction. The control device 26 changes the supply path connected to the suction nozzle 35 at the work position by changing the position of the spool 59. Note that the air supply configuration shown in Figure 5 is just one example. For example, the mounting head 33 may be configured to include a solenoid valve as a device for switching the supply path. The mounting device 13 may also be configured to include a regulator (pressure adjustment device) that changes the pressure of the air supplied to the suction nozzle 35 from the positive pressure supply device 47 and the negative pressure supply device 48. Furthermore, the mounting head 33 may be configured to include multiple combinations of the positive pressure supply path 57, negative pressure supply path 58, spool 59, and stepping motor 61 described above.

[0025] The spool 59 of this embodiment can be positioned in three locations, for example, as shown in Figures 5 to 7. The spool 59 can slide to, for example, the lower end position shown in Figure 5, the intermediate position shown in Figure 6, or the upper end position shown in Figure 7. When the spool 59 is positioned in the lower end position shown in Figure 5, the first flow path 59A is positioned below the positive pressure supply path 57 and is not connected to anything. The positive pressure supply path 57 is also blocked by the portion of the spool 59 where no flow path is formed. The suction nozzle 35 is not supplied with positive pressure. The negative pressure supply path 58 is connected to the suction nozzle 35 via the second flow path 59B. The suction nozzle 35 picks up the parts P supplied by the feeder 28 when negative pressure is supplied from the negative pressure supply device 48. As the rotary head 52 rotates, the suction nozzle 35 at the working position rotates from the working position to another rotation position while maintaining negative pressure and holding onto the parts P. This allows parts P to be picked up by each suction nozzle 35.

[0026] Figure 6 also shows a vacuum-break mounting process (hereinafter sometimes referred to as vacuum-break mounting) in which positive pressure is supplied to the suction nozzle 35 that has adsorbed a component P by the suction process, causing a vacuum break and mounting the component P adsorbed by the suction nozzle 35 onto the substrate SB. When the spool 59 is positioned in the intermediate position shown in Figure 6, the second flow path 59B is positioned above the negative pressure supply path 58 and is not connected to anything. The negative pressure supply path 58 is also blocked by the portion of the spool 59 where no flow path is formed. The suction nozzle 35 is not supplied with negative pressure. The positive pressure supply path 57 is connected to the suction nozzle 35 via the first flow path 59A. For example, when the adsorbed component P is in contact with the substrate SB, the suction nozzle 35 generates a vacuum break when positive pressure is supplied into the nozzle from the positive pressure supply device 47, and mounts the adsorbed component P onto the substrate SB.

[0027] Figure 7 also shows an atmospheric release mounting process (hereinafter sometimes referred to as atmospheric release mounting) in which the inside of the suction nozzle 35, which has adsorbed a component P by the adsorption process, is opened to the atmosphere, and the component P adsorbed by the suction nozzle 35 is mounted onto the substrate SB. When the spool 59 is positioned at the upper end position shown in Figure 7, both the first and second flow paths 59A and 59B are not connected to the supply path. Both the positive pressure supply path 57 and the negative pressure supply path 58 are blocked by the portion of the spool 59 in which no flow path is formed. The suction nozzle 35 is not supplied with either positive or negative pressure. For example, the spool 59 is provided with a flow path (not shown) that opens the suction nozzle 35 to the atmosphere when it is positioned at the upper end position. For example, when the suction nozzle 35 has adsorbed a component P in contact with the substrate SB, the spool 59 is positioned at the upper end position and opened to the atmosphere, causing the pressure inside the nozzle to rise to atmospheric pressure, releasing the adsorbed component P and mounting it onto the substrate SB.

[0028] Furthermore, as shown in Figure 4, the mounting head 33 is equipped with a Z-axis motor 63 that moves the suction nozzle 35 at the working position in the Z-axis direction. The mounting head 33 is also equipped with a θ-axis motor 64 that rotates the suction nozzle 35 at the working position around a central axis (hereinafter referred to as the θ-axis) parallel to the tool axis 55 and the Z-axis direction. Note that the configuration of the mounting head 33 is not limited to the above configuration. For example, the mounting head 33 may be configured to be able to mount only one suction nozzle 35. Also, the spool 59 may be a valve that moves within the flow path to switch the flow path it connects to. Also, the mounting head 33 may be configured to have multiple working positions.

[0029] The control device 26 performs the operation of mounting parts P onto the substrate SB in the order described in the job JOB obtained from the line management device 3. The control device 26 controls the head drive device 31 to move the mounting head 33 to the position of the feeder 28 that supplies parts P of the type described in the job JOB. The control device 26 drives the Z-axis motor 63 to lower the suction nozzle 35 at the work position, controls the stepping motor 61 to position the spool 59 at the lower end position shown in Figure 5, and picks up the parts P from the feeder 28 to the suction nozzle 35. The control device 26 rotates the rotary head 52 to swap the suction nozzles 35 at the work position and picks up parts P onto each of the multiple suction nozzles 35.

[0030] The control device 26 captures an image of the component P held by the suction nozzle 35 using the component camera 24, and detects the orientation of the component P relative to the suction nozzle 35 based on the captured image data. The control device 26 controls the head drive device 31 to move the mounting head 33 to the mounting position described in the job, and mounts the component P onto the substrate SB. Based on the orientation of the component P detected from the image data of the component camera 24, the control device 26 corrects the position and orientation of the suction nozzle 35 and performs the mounting. The control device 26 drives the θ-axis motor 64 to rotate the suction nozzle 35 at the work position and corrects the orientation of the component P. The control device 26 also performs the vacuum-break mounting or atmospheric release mounting described above based on the information set in the job. The control device 26 mounts the component P onto the substrate SB by repeating the suction process shown in Figure 5 and the mounting process (vacuum-break mounting in Figure 6, atmospheric release mounting in Figure 7).

[0031] (Regarding Job Editor screen 71) Next, the job editor screen 71 used to edit jobs in the line management device 3 will be described. Figure 8 shows an example of the job editor screen 71 displayed on the display device 18 of the line management device 3. When the line management device 3 receives a predetermined operation input from, for example, user IF19, it executes the editing program PG1 using the CPU 16 (see Figure 2) and displays the job editor screen 71 shown in Figure 8 on the display device 18. The user operates user IF19 to select whether to create a new job or edit an existing job. If the user selects to create a new job, the line management device 3 accepts the data to be set for the new job on the job editor screen 71. If the user selects to edit an existing job, the line management device 3 accepts the selection of the job to be edited, displays the data of the selected job on the job editor screen 71, and accepts changes to the data. In the following description, the line management device 3, which executes the editing program PG1 using the CPU 16, may be simply referred to as the device name. The same applies to the control device 26, which executes the control program PG2 using the CPU 45.

[0032] As shown in Figure 8, the line management device 3 displays the flag setting field 72 and the job editing field 73 on the job editor screen 71. The user can change the items displayed in the flag setting field 72 and the job editing field 73, or edit the written content, by operating the mouse and keyboard of the user IF19.

[0033] The flag setting field 72 is for setting the execution flag FG. The execution flag FG can be set to either ON or OFF. When the control device 26 obtains and executes a job with the execution flag FG set to ON from the line management device 3, it executes the installation order control process (see Figure 9) described later. Conversely, when the control device 26 obtains and executes a job with the execution flag FG set to OFF from the line management device 3, it does not execute the installation order control process. Details of the installation order control process will be described later.

[0034] As shown in Figure 8, the flag setting field 72 is provided with radio buttons for selecting, for example, ON and OFF. The user can switch the execution flag FG ON / OFF by selecting a radio button in User IF19. Figure 8 shows the state when ON is selected.

[0035] Here, vacuum break mounting can shorten the mounting time compared to atmospheric mounting. For example, in the mounting process of component P, the suction nozzle 35 is lowered in the Z-axis direction, and the component P is released while in contact with the substrate SB. In vacuum break mounting, by applying positive pressure to the suction nozzle 35, the pressure inside the suction nozzle 35 can be increased more quickly than in atmospheric mounting, and component P can be released more quickly. Therefore, the time for which the suction nozzle 35 is maintained at the lowered end during mounting can be shortened, thereby shortening the mounting time. The time for which the suction nozzle 35 is maintained at the lowered end is set in advance according to the size of the component, etc. On the other hand, since positive pressure is discharged from the suction nozzle 35 during mounting, if there are already mounted components P (hereinafter referred to as adjacent components P2) around the mounting position of the component P to be mounted by vacuum break mounting (hereinafter referred to as target component P1), the blown-out air may blow away the adjacent component P2. Alternatively, the mounting position of adjacent component P2 may be shifted. Therefore, the line management device 3 of this embodiment can edit the job to execute vacuum break mounting first.

[0036] As shown in Figure 8, the job editing field 73 contains a predetermined program for executing processes on part P, described in blocks. For example, the line management device 3 displays each block for suction processing, vacuum break mounting processing, and atmospheric release mounting processing on one or more lines. The line management device 3 also displays a number 75 identifying each block at the left end of the job editing field 73. The user creates the desired job by adding, inserting, rearranging, editing, etc., each block.

[0037] For example, blocks 75, numbers 1-3, contain programs for the suction process. These programs include suction process identification information, holder numbers, suction positions, and part IDs. The holder number indicates the mounting position of the multiple suction nozzles 35 attached to the rotary head 52 of the mounting head 33, and is a number used to identify the multiple suction nozzles 35. The suction position is the XYZ coordinate where the part P is picked up by the suction nozzle 35 indicated by the holder number. The suction position indicates, for example, the coordinate where the part P is received from the feeder 28. The part ID is information used to identify the part P to be picked up. When the control device 26 executes the suction process, it moves the suction nozzle 35 identified by the holder number described in each block to the suction position and picks up the part P indicated by the part ID.

[0038] Furthermore, for example, in section NO:15~20 of section 75, the program for the mounting process (vacuum-break mounting process or atmospheric release mounting process) is described. The mounting process program contains information such as the mounting process identification information, holder number, mounting position, component size, and information indicating whether or not vacuum-break mounting will be performed. The holder number is the number of the suction nozzle 35 that will perform the mounting. The mounting position is the XYZ coordinates of the mounting location on the substrate SB where the component P will be mounted. The component size is the length, width, and height of the component P to be mounted. The information indicating whether or not vacuum-break mounting will be performed indicates that if ON is set, vacuum-break mounting will be performed for that block, and if OFF is set, atmospheric release mounting will be performed.

[0039] The user creates a job by adding, editing, etc., the programs in each block shown in Figure 8. The line management device 3 also receives instructions to optimize the created job. This optimization process executes processes on the job to improve the efficiency of suction and mounting operations, reduce the possibility of malfunctions occurring during each operation, or shorten the time required for each operation.

[0040] As shown in Figure 8, for example, at the top of the job editor screen 71, a first optimization button 77 and a second optimization button 78 are displayed as buttons for receiving optimization instructions. When the first optimization button 77 is operated, the line management device 3 optimizes the contents of the job JOB so that, for example, multiple blocks of the mounting process that instruct the mounting of parts P are mounted in order from the shortest part P (shortest in the Z-axis direction). In other words, the mounting process blocks are rearranged so that parts with a longer stroke amount for sliding the suction nozzle 35 in the Z-axis direction are mounted first. By mounting the shortest part P first, interference between already mounted parts P and parts P or suction nozzles 35 to be mounted later can be suppressed. Note that the optimization described above is just one example. For example, the line management device 3 may perform optimization to rearrange the mounting process blocks so that parts P with close mounting positions are mounted first. Alternatively, the line management device 3 may perform optimization to group suction processes that have close suction positions and can be suctioned simultaneously.

[0041] Furthermore, the second optimization button 78 is a button used to rearrange the order of vacuum-destruction mounting and atmospheric release mounting during the optimization of the job JOB edited on the job editor screen 71. When the second optimization button 78 is operated, the line management device 3 performs the optimization process described above when the first optimization button 77 is operated, in addition to rearranging the order of vacuum-destruction mounting and atmospheric release mounting processes. The line management device 3 performs the rearrangement based on the "information indicating whether or not vacuum-destruction mounting should be performed" set for each block. For example, after optimizing the job JOB so that the mounting blocks for parts with lower heights are executed first, the line management device 3 edits the job JOB so that the blocks in which vacuum-destruction mounting is performed are executed before the blocks in which atmospheric release mounting is performed (rearranges the blocks). By editing the job JOB so that vacuum-destruction mounting is performed before atmospheric release mounting, it is possible to suppress problems such as blowing away adjacent parts P2 already mounted around the mounting position of the target part P1 during vacuum-destruction mounting. Furthermore, the sorting process that prioritizes vacuum-break mounting, which is performed after the optimization based on the height of the component P described above, can be modified as appropriate. For example, the line management device 3 may sort the blocks in order from the lowest height of component P, and then sort them again so that vacuum-break mounting is performed before atmospheric mounting among blocks of the same component type. In other words, sorting may be performed only among blocks of the same component type. Alternatively, the line management device 3 may sort the blocks in order from the lowest height of component P, and then sort them again so that vacuum-break mounting is performed before atmospheric mounting, regardless of the component type of the block. In this case, even among blocks of the same component type, the sorting is performed so that the vacuum-break mounting block is executed before the atmospheric mounting block. In addition, when sorting so that vacuum-break mounting is performed before atmospheric mounting, the line management device 3 may sort or change the sorting according to the size of the component. For example, the line management device 3 may sort atmospheric mounting, which involves mounting a component P larger than a predetermined component size, so that it is performed after vacuum-break mounting.This specified part size is one that is unlikely to be blown away by vacuum rupture mounting (i.e., its weight).

[0042] Furthermore, at least one of the above-mentioned optimization and vacuum-break mounting priority rearrangements may be performed by a device other than the line management device 3. For example, the control device 26 of the mounting device 13 may, after obtaining a job from the line management device 3, perform a rearrangement prioritizing vacuum-break mounting. After obtaining the job from the line management device 3, the control device 26 may edit (rearrange) the program described in the job so that the block in which the vacuum-break mounting process is executed is executed before the block in which the atmospheric release mounting process is executed. This allows the mounting device 13 to modify the blocks after obtaining the job from the line management device 3 to prevent the part P from being blown away. The line management device 3 does not need to perform the rearrangement process. In this case, the line management device 3 is an example of an "external device" in this disclosure. Furthermore, the "external device" in this disclosure is not limited to a device that manages the production line 2, such as the line management device 3, but may also be a dedicated device for editing jobs.

[0043] Furthermore, as shown in Figure 8, the line management device 3 accepts a selection in the "Information indicating whether or not to perform vacuum destructive mounting" field for each row of multiple blocks included in the job that instruct the mounting of part P. The selection is whether to perform atmospheric destructive mounting or vacuum destructive mounting. When the line management device 3 receives an instruction to optimize the job by operating the second optimization button 78, it edits the job based on the selection information received in the "Information indicating whether or not to perform vacuum destructive mounting" field, so that blocks in which vacuum destructive mounting is performed are executed before blocks in which atmospheric destructive mounting is performed. This allows the user to edit the job on the job editor screen 71 while selecting whether to perform vacuum destructive mounting or atmospheric destructive mounting for each block (each mounting process). For example, the user can select which mounting process to execute while checking the part size. In addition, when the line management device 3 receives an optimization instruction, it can accurately perform the editing to execute vacuum destructive mounting first based on this block-by-block information. The user's intentions can be reflected simply and accurately.

[0044] (When the execution flag FG is set to OFF) As described above, the control device 26 basically mounts the components P onto the substrate SB in the order described in the job JOB obtained from the line management device 3. The control device 26 executes the suction process and mounting process in the order of the blocks set in the job JOB. During the mounting operation, there is a possibility that an abnormality may occur in which the component supply device 22 is unable to supply components P for some reason (hereinafter referred to as a supply abnormality). Some reason here could be, for example, a shortage of components in the feeder 28 or a failure of the feeder 28. If the execution flag FG (see Figure 7) set in the job JOB is set to OFF, the control device 26 will not change the mounting order, as in the mounting order control process described later, even if a supply abnormality occurs during the execution of the job JOB. Therefore, the control device 26 will stop the mounting operation until the supply abnormality is resolved, for example, by the user replenishing components P.

[0045] (Regarding the installation order control process) Next, the mounting sequence control process executed by the control device 26 of the mounting device 13 will be described. Here, if a supply anomaly occurs in the target part P1 for vacuum destructive mounting, the mounting process described in the job JOB after the vacuum destructive mounting block in which the supply anomaly occurred can be executed before the vacuum destructive mounting block in which the supply anomaly occurred, allowing the mounting work to continue and shortening the overall work time. For example, if a supply anomaly due to a shortage of parts occurs, the mounting time can be shortened if the user of the mounting device 13 can replenish the target part P1 for vacuum destructive mounting while the parts P for subsequent mounting operations are mounted. Therefore, in this embodiment, if the control device 26 detects that a supply anomaly has occurred in vacuum destructive mounting after executing a job JOB with the execution flag FG set to ON, it will execute the mounting process described after the vacuum destructive mounting first. In the following description, the case in which, for example, an atmospheric release mounting process is adopted as the mounting process described after the vacuum destructive mounting block in which the supply anomaly occurred will be described. Note that the mounting process described later may be a vacuum destructive mounting process or multiple mounting processes. For this reason, the control device 26 may execute multiple subsequent mounting processes first until the supply anomaly is resolved.

[0046] Furthermore, the control device 26 performs vacuum destructive mounting, which could not be performed due to the supply abnormality, after the supply abnormality has been resolved by replenishing the target component P1, etc. However, as described above, in vacuum destructive mounting, there is a risk of blowing away adjacent components P2 by supplying positive pressure to the suction nozzle 35. Therefore, the control device 26 of this embodiment performs the mounting order control process shown in Figure 9 to switch between performing vacuum destructive mounting or atmospheric release mounting depending on the adjacent components P2 around the mounting position, when vacuum destructive mounting, which was originally scheduled to be performed first, is performed later due to a supply abnormality. For this reason, the conditions for starting the process in Figure 9 are, for example, when the execution flag FG of the job is set to ON, and after a supply abnormality occurs in vacuum destructive mounting during the execution of that job, the supply abnormality is resolved, and the vacuum destructive mounting that could not be performed is executed. The method for determining whether or not the supply abnormality has been resolved differs depending on the type of abnormality that occurred. For example, if a supply abnormality of component shortage occurs, it can be determined whether or not it has been resolved depending on whether or not the component P has been replenished by replacing the reel or splicing. Furthermore, if a supply anomaly occurs, such as a failure of feeder 28, it can be determined whether the issue has been resolved by whether or not a replacement feeder 28 has been installed.

[0047] As shown in Figure 9, when the control device 26 starts the mounting order control process, in step 1 (hereinafter simply referred to as S), it determines whether or not there are adjacent parts P2 already mounted around the mounting position. For example, the control device 26 determines whether or not there are adjacent parts P2 already mounted within an area of ​​a predetermined radius R, centered on the mounting position where the target part P1, which has become available after the supply abnormality has been resolved, is mounted by vacuum destruct mounting.

[0048] Figure 10 shows the state of mounting components P onto the substrate SB. Target components PA1 and PA2 represent components P that are to be mounted by vacuum destructive mounting. Adjacent components PB1 and PB2 are components P that are to be mounted, for example, after target components PA1 and PA2, and represent components P that will be mounted by atmospheric release mounting. For example, as shown in the substrate SB1 on the left side of Figure 10, suppose the control device 26 experiences a supply error for target components PA1 and PA2, and is unable to mount them, so it mounts the adjacent components PB1 and PB2 onto the substrate SB1 first.

[0049] Next, the control device 26 mounts the target components PA1 and PA2 to the substrate SB1 on which the adjacent components PB1 and PB2 are mounted, as shown in the substrate SB2 on the right side of Figure 10. When mounting the target component PA1, the control device 26 determines in S1 of Figure 9 whether the adjacent components PB1 and PB2 exist within an area 82 with radius R in the XY plane, centered on the mounting position 81 of the target component PA1 (see Figure 10). The adjacent components PB1 and PB2 do not exist within area 82. Therefore, the control device 26 makes a negative determination for the target component PA1 in S1 (S1: NO) and executes S2. The control device 26 performs vacuum destructive mounting of the target component PA1 (S2) and terminates the process shown in Figure 9.

[0050] On the other hand, an adjacent component PB2 exists in an area 84 with radius R in the XY plane, centered on the mounting position 83 of the target component PA2. In this case, if the target component PA2 is mounted using vacuum destructive force, the position of the already mounted adjacent component PB2 may shift, or the adjacent component PB2 may be blown away, as indicated by the arrows in Figure 10. For this reason, the control device 26 makes a positive judgment in S1 (S1: YES) in the case of the target component PA2 and executes S3.

[0051] The position of each component P can be determined, for example, based on the XY coordinates of the job's mounting position (see Figure 8). The radius R is the length that defines areas 82 and 84, and if the target component P1 and the adjacent component P2 get too close to radius R, there is a possibility that the adjacent component P2 may be blown away when the target component P1 is mounted. For this reason, the radius R can be determined according to the magnitude of the positive pressure air, the nozzle diameter of the suction nozzle 35, the size of the adjacent component P2, etc. For example, a fixed value for each nozzle diameter set in advance by performing a simulation can be used as the radius R. Alternatively, the user may set the radius R when editing the job in the line management device 3. Furthermore, the position of each component P, radius R, areas 82 and 84, etc. can also be determined from the image data of the substrate camera 25.

[0052] Furthermore, as shown in Figure 10, the control device 26 may make a positive decision in S1 if even a part of the adjacent component PB2 is within the area 84 with radius R. Alternatively, the control device 26 may make a positive decision in S1 only if the entire adjacent component PB2 is within the area 84. Also, Figure 10 shows a situation where supply anomalies occur in multiple target components PA1 and PA2. In this case, the control device 26 may, for example, execute the process in Figure 9 for the target component P1 whose supply anomaly was resolved first, and then execute the process in Figure 9 again for the target component P1 whose supply anomaly was resolved later. If there is only one target component P1 with a supply anomaly, the control device 26 executes the process in Figure 9 only once for that target component P1.

[0053] Therefore, in this embodiment, the control device 26 detects that it cannot supply the target component P1, then determines whether or not to perform a vacuum break mounting process on the sucked target component P1 after it becomes available and the sucked component P1 is sucked onto the sucking nozzle 35. In this case, the control device 26 determines whether or not adjacent components PB1 and PB2 are already mounted within areas 82 and 84 with a predetermined radius R centered on mounting positions 81 and 83 on the substrate SB2 (S1). In the case of target component PA1, the control device 26 determines that adjacent components PB1 and PB2 are not mounted within area 82 (S1: NO), and supplies positive pressure to the sucking nozzle 35 to generate a vacuum break and mount the target component PA1 to the substrate SB2 (S2).

[0054] According to this, when the target component P1 becomes available for supply, it is determined whether or not other components P are already installed within an area 82,84 with a predetermined radius R from the installation positions 81,83 of the target component P1 to be installed by vacuum break installation. If no other components P are installed within area 82,84, vacuum break installation is performed. This ensures that vacuum break installation can be performed only if adjacent components PB1,PB2, which were previously installed by atmospheric release installation while the target component P1 was unavailable, are not present around the installation positions 81,83. This prevents the installed adjacent components PB1,PB2 from being blown away by positive pressure air.

[0055] Next, in S3, the control device 26 compares the size of the target component P1 to be mounted with the inner diameter of the nozzle of the suction nozzle 35. In S3, the control device 26 determines whether the inner diameter of the opening of the suction nozzle 35 is less than or equal to the size of the target component P1. Figure 11 is a schematic side view showing the suction nozzle 35, the target component P1, the adjacent component P2, and the substrate SB. As shown in Figure 11, for example, the diameter of the nozzle hole of the suction nozzle 35 is the inner diameter of the nozzle, and the nozzle hole is circular with a diameter of the inner diameter of the nozzle. The opening 35A at the lower end of the suction nozzle 35 is circular with a diameter of the inner diameter of the nozzle.

[0056] In S3, the control device 26 makes an affirmative judgment (S3: YES) if at least one of the two conditions is met, and a negative judgment (S3: NO) if neither of the two conditions is met. The first condition is that the nozzle inner diameter L1 is longer than the length of the target part P1 in the X-axis direction. The second condition is that the nozzle inner diameter L1 is longer than the length of the target part P1 in the Y-axis direction. That is, when the center of the circular opening 35A and the center of the rectangular target part P1 in a plan view are aligned, the control device 26 determines whether the size of the part is greater than or equal to the nozzle inner diameter L1 in both the X and Y directions. If the size of the part is greater than or equal to the nozzle inner diameter L1 in both the X and Y directions, the opening 35A will be blocked by the target part P1, and even when positive pressure is supplied, the amount of air leaking from the opening 35A can be reduced or eliminated. On the other hand, if the part size is less than the nozzle inner diameter L1 in either the X or Y direction, a gap will be formed between the target part P1 and the side wall of the opening 35A, and when positive pressure is supplied, air will be blown out from this gap. As a result, there is a possibility that the adjacent part P2 will be blown away.

[0057] Therefore, in S1, the control device 26 determines whether the nozzle inner diameter L1 of the opening 35A of the suction nozzle 35 is less than or equal to the size of the target part P1 (S3), if an adjacent part P2 is mounted in the area (S1:YES). If both conditions 1 and 2 are met, the control device 26 determines that the nozzle inner diameter L1 is less than or equal to the size of the target part P1 (S3:NO), and mounts the target part P1 by vacuum break mounting (S2).

[0058] This allows the vacuum-break mounting process to be avoided if the nozzle inner diameter L1 of the opening 35A of the suction nozzle 35 is larger than the size of the target part P1, and there is a possibility that positive pressure will leak from the opening 35A if vacuum-break mounting is performed. This prevents surrounding parts P that have been mounted earlier from being blown away by the air used during vacuum-break mounting. Furthermore, if the nozzle inner diameter L1 is less than or equal to the size of the target part P1, even if other parts P are mounted around the mounting position, the possibility of them being blown away can be reduced by preventing air leakage before mounting, and the mounting time can be shortened by performing vacuum-break mounting.

[0059] The control device 26 may also detect the size of the target part P1, which is determined in S3, from the job. Alternatively, the control device 26 may detect the size of the target part P1 based on the image data from the part camera 24.

[0060] Furthermore, in S3, if at least one of the two conditions is met (S3:YES), that is, if the nozzle inner diameter L1 is larger than the part size, the control device 26 executes S4. In S4, the control device 26 determines whether the size of the adjacent part P2, which was determined to be present in the area in S1, is less than or equal to the standard size. Therefore, if another part P is installed in the area (S1:YES), the control device 26 determines whether that part P in the area is less than or equal to a predetermined standard size.

[0061] If the control device 26 determines that an adjacent component P2 in the area is larger than a predetermined standard size (S4: NO), it installs the target component P1 by vacuum release mounting (S2). On the other hand, if the control device 26 determines that an adjacent component P2 in the area is smaller than or equal to a predetermined standard size (S4: YES), it installs the target component P1 by atmospheric release mounting (S5).

[0062] For example, in the case of substrate SB2 in Figure 10, if an adjacent component PB2 exists in area 84 (S1:YES) and the size of the component to be mounted PA2 is greater than or equal to the nozzle inner diameter L1 (S3:NO), the control device 26 mounts the component PA2 by vacuum detonation (S2). If the size of the component PA2 is less than the nozzle inner diameter L1 (S3:YES), the control device 26 determines the size of the adjacent component PB2 (S4). If the size of the adjacent component PB2 is greater than the standard size (S4:NO), the control device 26 mounts the component PA2 by vacuum detonation (S2). If the size of the adjacent component PB2 is less than or equal to the standard size (S4:YES), the control device 26 opens the inside of the suction nozzle 35 to the atmosphere and mounts the component PA2 to substrate SB2 (S5). The control device 26 then completes the process shown in Figure 9.

[0063] Even if a component P exists within the area, if the component P is above a certain size, the position of the component P within the area will not shift even if the target component P1 is later attached to the mounting position using vacuum detonation. Therefore, a standard size is defined, and if the component P within the area is larger than that standard size, the target component P1 is attached using vacuum detonation. If the component P is smaller than or equal to the standard size, the target component P1 is attached using atmospheric release attachment. This allows the target component P1 to be attached using an appropriate attachment process according to the size of the component P within the area.

[0064] Furthermore, if the control device 26 determines that the inner diameter L1 of the suction nozzle 35 is larger than the size of the target component P1 (S3:YES), it performs atmospheric release mounting in S5 and mounts the target component P1 to the substrate SB. In this case, if the inner diameter L1 of the opening 35A of the suction nozzle 35 is larger than the size of the target component P1, atmospheric release mounting is performed, allowing the target component P1 to be mounted later without blowing away the components P in the area.

[0065] Furthermore, as described above, an execution flag FG can be set for a job (see Figure 8). When the execution flag FG set for a job is ON, the control device 26 executes the atmospheric release mounting process, which is later in the order of the job than the vacuum release mounting process, which cannot supply the target component P1. Conversely, when the execution flag FG set for a job is OFF, even if the component supply device 22 detects that it cannot supply the target component P1, the control device 26 does not execute the atmospheric release mounting process, which is later in the order of the job than the vacuum release mounting process, which cannot supply the target component P1. Instead, it executes the suction process, atmospheric release mounting process, and vacuum release mounting process in the order set for the job.

[0066] Vacuum-break mounting involves supplying positive pressure to the suction nozzle 35 to detach the part P from the suction nozzle 35, thus shortening the mounting time compared to atmospheric mounting, which opens the inside of the suction nozzle 35 to the atmosphere. Furthermore, if other mounting processes are performed before vacuum-break mounting, there is a possibility that adjacent parts P2 may be blown off during the vacuum-break mounting process. For this reason, the device does not make an automatic decision, but only executes control to change the mounting order when the user intentionally turns on the execution flag FG in the job. This allows the user to turn off the execution flag FG if they want to prioritize maintaining the mounting order, or turn on the execution flag FG if they want to shorten the mounting time and improve production efficiency.

[0067] Incidentally, the relationship between the contents of this disclosure and the terminology of the above embodiments is as follows. In the above embodiments, the line management device 3 is an example of an external device, a program creation device for a component mounting device. The mounting device 13 is an example of a component mounting device. The positive pressure supply device 47, negative pressure supply device 48, positive pressure supply path 57, negative pressure supply path 58, spool 59, stepping motor 61, and engaging member 61A are examples of pressure changing devices. Adjacent components P2, PB1, and PB2 are examples of other components. Nozzle inner diameter L1 is an example of an inner diameter. The process in S1 is an example of surrounding component determination process. The process in S3 is an example of nozzle diameter determination process. The process in S4 is an example of component size determination process.

[0068] As described above, the embodiments described above produce the following effects. In one embodiment of this system, the control device 26 executes suction processing, atmospheric release mounting processing, and vacuum break mounting processing based on the order set in the job. If the control device 26 detects a supply anomaly in which the component supply device 22 cannot supply the target component P1 for vacuum break mounting, it will execute atmospheric release mounting, which is later in the order of the job than vacuum break mounting, before the target component P1 that cannot be supplied.

[0069] According to this, the decision of whether or not to perform vacuum-break mounting can be made not only based on the order set in the job, but also based on the status of the parts supply device 22. By performing atmospheric release mounting before vacuum-break mounting, which cannot supply the target part P1, the waiting time for the mounting process can be reduced. The user can check the status of the parts supply device 22 and perform recovery work while atmospheric release mounting is being performed.

[0070] Furthermore, the contents of this disclosure are not limited to the embodiments described above, and can be implemented in various forms with various modifications and improvements based on the knowledge of those skilled in the art. For example, in the above embodiment, when the second optimization button 78 is operated, the line management device 3 performs optimization processing and also performs editing to execute vacuum destructive mounting first, but it is not limited to this. The line management device 3 may also perform only the process of editing the job so that the block in which the vacuum destructive mounting process is performed is executed before the block in which the atmospheric release mounting process is performed, without performing optimization processing (such as rearranging the components so that the smaller components P are mounted first). Furthermore, while the line management device 3 accepts the selection of whether to perform vacuum-break mounting or atmospheric release mounting for each block, it may also accept a change in the type of mounting process for multiple blocks at once. Furthermore, in the above embodiment, when the execution flag FG is set to ON, the control device 26 executes the atmospheric release mounting block described after the vacuum release mounting block in the job JOB before the vacuum release mounting block in which the supply abnormality occurred. However, it is not limited to this. The control device 26 may also execute the vacuum release mounting block described after the vacuum release mounting block in which the supply abnormality occurred before the vacuum release mounting block in which the supply abnormality occurred.

[0071] Furthermore, although the above embodiment employs the line management device 3 as the program creation device for the component mounting device of this disclosure, the invention is not limited to this. For example, the mounting device 13 may be employed as the program creation device for the component mounting device. In this case, the mounting device 13 may be configured to accept instructions for editing and optimizing jobs via a user interface such as a touch panel attached to the mounting device 13. Furthermore, in the above embodiment, the control device 26 executed the mounting order control process shown in Figure 9 when the execution flag FG was set to ON, but it is not limited to this. For example, the control device 26 may be configured to switch between a mode in which the mounting order control process is executed and a mode in which it is not executed. The control device 26 may then execute the mounting order control process while the execution mode is set. Furthermore, the configuration of the pressure changing device described herein is not limited to the configuration shown in Figure 5; it may also be a configuration using a regulator or a switching valve.

[0072] Furthermore, the content and order of each process shown in Figure 9 are examples and can be changed as appropriate. For example, the control device 26 does not have to perform at least one of the decision processes S1, S3, and S4. Also, although the control device 26 determined the size of the adjacent part P2 in S4, it may also determine the weight of the adjacent part P2. The heavier the adjacent part P2, the higher the probability that the position of the adjacent part P2 will not shift even if vacuum detonation mounting is performed later. Therefore, the control device 26 may be configured to perform vacuum detonation mounting (S2) if the weight of the adjacent part P2 in the area is equal to or greater than the standard weight, and to perform atmospheric release mounting (S5) if it is less than the standard weight. In this case, the weight information of the part P may be set in the job JOB.

[0073] Furthermore, the contents of this disclosure are not limited to the dependencies described in the claims. For example, this specification also discloses a technical concept in which "the component mounting device described in claim 2 or claim 3" in claim 5 is changed to "the component mounting device described in any one of claims 2 to 4". This specification also discloses a technical concept in which "the component mounting device described in claim 1 or claim 2" in claim 6 is changed to "the component mounting device described in any one of claims 1 to 5". This specification also discloses a technical concept in which "the component mounting device described in claim 1 or claim 2" in claim 7 is changed to "the component mounting device described in any one of claims 1 to 6". [Explanation of Symbols]

[0074] 3 Line management device (external device, program creation device for component mounting device), 13 Mounting device (component mounting device), 19 User interface, 22 Component supply device, 26 Control device, 33 Mounting head, 35 Suction nozzle, 35A Opening, 47 Positive pressure supply device (pressure change device), 48 Negative pressure supply device (pressure change device), 57 Positive pressure supply path (pressure change device), 58 Negative pressure supply path (pressure change device), 59 Spool (pressure change device), 61 Stepping motor (pressure change device), 61A Engaging member (pressure change device), 81,83 Mounting position, 82,84 Area, FG Execution flag, JOB Job, L1 Nozzle inner diameter (inner diameter), SB,SB1,SB2 Substrate, P Component, P1,PA1,PA2 Target component, P2,PB1,PB2 Adjacent component (other component), R Radius.

Claims

1. A parts supply device that supplies parts, A mounting head to which a suction nozzle can be attached, A pressure changing device for changing the pressure of the adsorption nozzle, A control device capable of controlling the pressure changing device and performing the following operations: an adsorption process in which negative pressure is supplied to the adsorption nozzle to adsorb the component supplied by the component supply device onto the adsorption nozzle; an atmospheric release mounting process in which the inside of the adsorption nozzle is opened to the atmosphere and the component adsorbed by the adsorption nozzle is mounted onto a substrate; and a vacuum break mounting process in which positive pressure is supplied to the adsorption nozzle to generate a vacuum break and mount the component adsorbed by the adsorption nozzle onto the substrate. Equipped with, The control device is Based on the order set for the job, the adsorption process, the atmospheric release mounting process, and the vacuum break mounting process are executed. A component mounting device that, when it detects that it cannot supply a target component which is the component on which the vacuum-break mounting process is performed, executes the atmospheric release mounting process, which is later in the job sequence than the vacuum-break mounting process for which the target component cannot be supplied, before the target component mounting process.

2. The control device is After detecting that the target component cannot be supplied, when the target component becomes available for supply, and the target component is picked up by the suction process and the vacuum break mounting process is performed on the picked-up target component, a surrounding component determination process is performed to determine whether or not other components are already mounted within a predetermined radius area centered on the mounting position for the target component on the substrate. The component mounting device according to claim 1, wherein, as a result of the surrounding component determination process, it is determined that no other components are mounted within the area, and a positive pressure is supplied to the suction nozzle to cause a vacuum break and mount the target component to the substrate.

3. The control device is If, as a result of the surrounding component determination process, other components are found to be mounted within the area, a nozzle diameter determination process is executed to determine whether the inner diameter of the opening of the suction nozzle is less than or equal to the size of the target component. The component mounting device according to claim 2, wherein, as a result of the nozzle diameter determination process, it is determined that the inner diameter of the suction nozzle is less than or equal to the size of the target component, and a positive pressure is supplied to the suction nozzle to cause a vacuum break and mount the target component to the substrate.

4. The control device is The component mounting device according to claim 3, wherein, as a result of the nozzle diameter determination process, it is determined that the inner diameter of the suction nozzle is larger than the size of the target component, the atmospheric release mounting process is executed, the inside of the suction nozzle is opened to the atmosphere and the target component is mounted on the substrate.

5. The control device is If, as a result of the surrounding parts determination process, other parts are installed within the area, a parts size determination process is executed to determine whether the other parts within the area are below a predetermined standard size. If the component size determination process determines that other components in the area are larger than a predetermined standard size, positive pressure is supplied to the suction nozzle to cause a vacuum break and attach the target component to the substrate. The component mounting apparatus according to claim 2 or 3, wherein, as a result of the component size determination process, it is determined that other components in the area are below a predetermined standard size, the atmospheric release mounting process is executed, the inside of the suction nozzle is opened to the atmosphere and the target component is mounted on the substrate.

6. The aforementioned job includes, The execution flag can be set, The control device is If the execution flag set for the job indicates ON, the atmospheric release mounting process, which is later in the order of the job than the vacuum break mounting process, which cannot supply the target component, is executed first. If the execution flag set for the job indicates OFF, even if the parts supply device detects that it cannot supply the target parts, it does not execute the atmospheric release mounting process, which is later in the order of the job than the vacuum release mounting process, which cannot supply the target parts, before the adsorption process, the atmospheric release mounting process, and the vacuum release mounting process, according to the order set for the job, as described in claim 1 or claim 2.

7. The control device is The component mounting apparatus according to claim 1 or 2, wherein, after acquiring the job from an external device, the program described in the job is edited so that the block in which the vacuum-break mounting process is performed is executed before the block in which the atmospheric release mounting process is performed.

8. A program creation device for a component mounting device that edits jobs that control the component mounting device, The aforementioned component mounting device is A parts supply device that supplies parts, A mounting head to which a suction nozzle can be attached, A pressure changing device for changing the pressure of the adsorption nozzle, A control device capable of executing, based on the job, the following: an adsorption process that controls the pressure changing device and supplies negative pressure to the adsorption nozzle to adsorb the component supplied by the component supply device onto the adsorption nozzle; an atmospheric release mounting process that opens the inside of the adsorption nozzle to the atmosphere and mounts the component adsorbed by the adsorption nozzle onto the substrate; and a vacuum break mounting process that supplies positive pressure to the adsorption nozzle to generate a vacuum break and mounts the component adsorbed by the adsorption nozzle onto the substrate. Equipped with, The program creation device for the component mounting device is, Equipped with a user interface, A program creation device for a component mounting device, which, based on operations on the user interface, edits the program described in the job so that the block in which the vacuum-break mounting process is performed is executed before the block in which the atmospheric release mounting process is performed.

9. For any of the multiple blocks included in the job that instruct the installation of the component, the user interface accepts a selection of whether to perform the atmospheric release installation process or the vacuum destruction installation process. The program creation apparatus for a component mounting apparatus according to claim 8, wherein, upon receiving instructions to optimize the job via the user interface, the program creation apparatus for a component mounting apparatus edits the job based on the selection information received via the user interface, such that the block in which the vacuum destructive mounting process is performed is executed before the block in which the atmospheric release mounting process is performed.

10. The program creation apparatus for a component mounting apparatus according to claim 9, wherein, upon receiving an instruction to optimize the job via the user interface, the program optimizes the job so that, for a plurality of blocks instructing the mounting of the components, the components to be mounted are mounted in order from the lowest to the highest height, and then edits the job so that the block in which the vacuum-break mounting process is performed is executed before the block in which the atmospheric release mounting process is performed.

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