PCB transport device, component mounting machine, and PCB transport method

Abstract

In the present invention, a substrate B is conveyed along a prescribed conveyance path Tb. Moreover, the substrate B is located on the conveyance path Tb and is supported or guided by substrate-contacting surfaces (a side end surface 811 of a substrate guide 81, a lower end surface 851 of an upper clamp member 85, an upper end surface 861 of a lower clamp member 86, and a spherical surface 961 of a backup member 93) that are in contact with the substrate B. The substrate-contacting surfaces 811, 851, 861, 961 are electrically conductive. Accordingly, electrical charge retained by the substrate B flows out to the substrate-contacting surfaces 811, 851, 861, 961 in contact with the substrate B, relieving electrification of the substrate B. Moreover, the substrate-contacting surfaces 811, 851, 861, 961 are not metal, so outflow of electrical charge from the substrate B to the substrate-contacting surfaces 811, 851, 861, 961 is moderately suppressed.

Description

Technical Field

[0001] The present invention relates to a technique for transporting a substrate in order to execute processes such as component mounting, solder printing, or reflow on the substrate, and relates to a technique for coping with the charging of the transported substrate.

Background Art

[0002] In Patent Documents 1 and 2, techniques related to countermeasures against charging of circuit boards are disclosed. That is, in Patent Document 1, in order to prevent charging of a circuit board transported on a component mounting line, a part that contacts the circuit board is grounded. Further, in Patent Document 2, by setting the surface resistivity of an antistatic material provided in a case for housing a circuit board to 5.0×10^6 (Ω / square) or more, it is possible to prevent the pattern of the circuit board from being short-circuited by the antistatic material. In this specification, 10^N (N is a natural number of 1 or more) means 10 to the power of N (10 N )

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0004] Incidentally, in the component mounting line exemplified in Patent Document 1, the substrate is transported along a predetermined transport direction in order to perform processes such as component mounting, solder printing, or reflow on the substrate. In this scenario of transporting substrates in a component mounting line, unlike the storage case shown in Patent Document 2, there was no awareness that short circuits in the circuit board patterns were a problem, and the focus was on preventing static electricity buildup on the circuit board. Therefore, grounding was used to efficiently dissipate static electricity. However, in recent years, with the miniaturization of components mounted on substrates, damage to components caused by charge flowing out of the substrate due to grounding has become a concern. Furthermore, such damage to components could also be caused by charge flowing out of the substrate when the substrate comes into contact with metal members other than ground.

[0005] This invention has been made in view of the above-mentioned problems, and aims to provide a technology that can suppress the charging of substrates while slowing down the outflow of charge from substrates transported in a component mounting line. [Means for solving the problem]

[0006] The substrate transport device according to the present invention comprises a substrate transport unit that transports a substrate along a predetermined transport path, and a substrate transport assist unit that has a substrate contact surface and supports or guides the substrate by contacting the substrate located on the transport path with the substrate contact surface, wherein the substrate contact surface is made of a material other than metal and is conductive.

[0007] The substrate transport method according to the present invention comprises the steps of transporting a substrate along a predetermined transport path and supporting or guiding a substrate by contacting the substrate contact surface with the substrate located along the transport path, wherein the substrate contact surface is made of a material other than metal and is electrically conductive.

[0008] In the present invention (substrate transport device and substrate transport method) configured as described above, a substrate is transported along a predetermined transport path. Furthermore, a substrate located along the transport path is supported or guided by a substrate contact surface that contacts the substrate. In this case, the substrate contact surface is conductive. Therefore, any charge accumulated on the substrate flows out to the substrate contact surface that contacts the substrate, and the charge on the substrate is eliminated. Moreover, since the substrate contact surface is not metal, the outflow of charge from the substrate to the substrate contact surface is suppressed gradually. In this way, it is possible to suppress the charging of substrates while gradually reducing the outflow of charge from substrates transported in a component mounting line.

[0009] Furthermore, the electrical resistance of the substrate contact surface may be within a range that allows for electrostatic dissipation. This makes it possible to suppress the charging of the substrate while slowing down the outflow of charge from the substrate as it is transported on the component mounting line.

[0010] Furthermore, the electrical resistance of the substrate contact surface may be 1 × 10⁴ Ω or more and less than 1 × 10¹¹ Ω. Here, electrical resistance values ​​in the range of 1 × 10⁴ Ω or more and less than 1 × 10¹¹ Ω are indicated as electrostatically dissipative electrical resistance values ​​in IEC 61340-5-1 (standard). In this configuration, since the electrical resistance of the substrate contact surface is less than 1 × 10¹¹ Ω, the charge accumulated on the substrate flows out to the substrate contact surface that contacts the substrate, and the charge on the substrate is eliminated. Moreover, since the electrical resistance of the substrate contact surface is 1 × 10⁴ Ω or more, the outflow of charge from the substrate to the substrate contact surface is suppressed gradually. In this way, it is possible to suppress the charging of the substrate while gradually reducing the outflow of charge from the substrate being transported on the component mounting line.

[0011] Furthermore, the substrate transport assist unit may have a base material portion provided with a substrate contact surface, and the substrate transport device may be configured such that the hardness of the substrate contact surface is higher than the hardness of the base material portion. In such a configuration, the durability of the substrate contact surface can be increased, and deterioration of the substrate contact surface due to contact with the substrate can be suppressed.

[0012] In this case, various materials can be considered for the base material. For example, the base material may be metal.

[0013] Furthermore, the substrate contact surface may be made of ceramics. Ceramics have high friction resistance and do not rust. Therefore, replacement of the substrate contact surface will not be necessary for a long period of time, reducing the burden of maintenance.

[0014] Furthermore, the substrate contact surface may be composed of coated ceramics. Coating allows for the formation of a very thin layer of ceramics, enabling the creation of a ceramic substrate contact surface even for complex shapes.

[0015] Furthermore, the substrate contact surface may be formed by anodizing. Anodizing allows for the formation of a substrate contact surface even for complex shapes, and since anodizing is inexpensive, it can also reduce the cost of the substrate handling equipment.

[0016] Furthermore, the substrate contact surface may be formed by DLC treatment. DLC treatment allows for the formation of a substrate contact surface with high precision, even for complex shapes. It also allows for the formation of a substrate contact surface with high hardness and wear resistance. Moreover, since it allows for the formation of a substrate contact surface with a low coefficient of friction, the smooth transport of the substrate is not hindered by the substrate contact surface.

[0017] Furthermore, the substrate transport assist unit may be configured such that it has a substrate guide provided adjacent to the transport path, and the side end face of the substrate guide contacts the edge of the substrate as a substrate contact surface to guide the substrate. In other words, since the substrate guide is provided adjacent to the transport path to guide the substrate, the side end face of the substrate guide comes into contact with the substrate at a high frequency. Therefore, it is particularly preferable to configure the side end face of the substrate guide as a substrate contact surface made of a material other than metal and having conductivity.

[0018] Furthermore, the substrate transport assist unit may have a lower clamping member that faces the substrate supported by the substrate transport unit from below, and an upper clamping member that faces the substrate supported by the substrate transport unit from above. The substrate transport device may be configured such that, while the clamping operation is performed, the upper end surface of the lower clamping member contacts the lower surface of the substrate as a substrate contact surface, and the lower end surface of the upper clamping member contacts the upper surface of the substrate as a substrate contact surface. In other words, the upper end surface of the lower clamping member and the lower end surface of the upper clamping member contact the substrate in order to clamp the substrate. In particular, the front and back surfaces of the substrate that the upper end surface of the lower clamping member and the lower end surface of the upper clamping member contact, respectively, correspond to the surfaces on which components are mounted (i.e., the surfaces on which lands are provided). Therefore, from the viewpoint of preventing damage to the components, it is particularly preferable to configure the upper end surface of the lower clamp member and the lower end surface of the upper clamp member as conductive substrate contact surfaces made of a material different from metal.

[0019] Furthermore, the substrate transport assist unit may have backup pins that face the substrate supported by the substrate transport unit from below, and perform a backup operation in which the backup pins are raised above the substrate transport unit to support the substrate lifted above the substrate transport unit, and a backup release operation in which the backup operation is released in which the backup operation is released by lowering the backup pins above the substrate transport unit. During the execution of the backup operation, the substrate transport device may be configured such that the upper end surface of the backup pins contacts the lower surface of the substrate as a substrate contact surface. In other words, the upper end surface of the backup pins contacts the substrate in order to support the substrate. In particular, the backup pins contact the substrate relatively close to the center of the substrate, in other words, near the mounting positions of components (i.e., lands). Therefore, from the viewpoint of preventing damage to components, it is particularly preferable to configure the upper end surface of the backup pins as a conductive substrate contact surface made of a material other than metal.

[0020] The component mounting machine according to the present invention includes the above-described substrate transfer device and a mounting unit that mounts components on the substrate carried in by the substrate transfer device. Therefore, it is possible to suppress the charging of the substrate while gently discharging the charge from the substrate conveyed on the component mounting line provided with the component mounting machine.

Effects of the Invention

[0021] According to the present invention, it is possible to suppress the charging of the substrate while gently discharging the charge from the substrate conveyed on the component mounting line.

Brief Description of the Drawings

[0022] [Figure 1] FIG. 1 is a block diagram showing an example of a component mounting line. [Figure 2] A front view schematically showing a solder printer. [Figure 3] A plan view schematically showing a component mounting machine. [Figure 4] A plan view schematically showing an example of a substrate transfer device. [Figure 5A] A side view schematically showing the substrate transfer device of FIG. [Figure 5B] A side view schematically showing the substrate transfer device of FIG. [Figure 6A] A front view schematically showing the substrate transfer device of FIG. [Figure 6B] A front view schematically showing the substrate transfer device of FIG. [Figure 7A] A front view schematically showing the substrate transfer device of FIG. [Figure 7B] A front view schematically showing the substrate transfer device of FIG. [Figure 8A] A view showing a backup member used in the substrate transfer device of FIG. [Figure 8B] A view showing a backup member used in the substrate transfer device of FIG.

Embodiments for Carrying Out the Invention

[0023] Figure 1 is a block diagram showing an example of a component mounting line. In Figure 1 and the following diagrams, the horizontal direction (X), the horizontal direction perpendicular to the X direction (Y), and the vertical direction (Z) are indicated as appropriate. Component mounting line 1 includes a solder printing machine 2, a component mounting machine 4, and a reflow oven 6. The solder printing machine 2 prints solder onto the substrate B (Figure 2), the component mounting machine 4 mounts components P (Figure 3) onto the substrate B on which the solder has been printed by the solder printing machine 2, and the reflow oven 6 melts the solder printed on the substrate B by heating the substrate B on which the components P have been mounted by the component mounting machine 4. In this way, component mounting line 1 produces substrates B with components mounted (substrate production).

[0024] Furthermore, the component mounting line 1 includes a substrate transport system 7 that transports the substrate B in the Y direction (transport direction) to the solder printing machine 2, the component mounting machine 4, and the reflow oven 6 in sequence. This substrate transport system 7 has substrate transport devices 72, 74, and 76 arranged in series in the Y direction. The substrate transport devices 72, 74, and 76 are positioned corresponding to the solder printing machine 2, the component mounting machine 4, and the reflow oven 6, respectively, and transport the substrate B in the Y direction. In other words, the solder printing machine 2 prints solder on the substrate B that has been brought into the solder printing machine 2 by the substrate transport device 72, the component mounting machine 4 mounts components P on the substrate B that has been brought into the component mounting machine 4 from the solder printing machine 2 by the substrate transport device 74, and the reflow oven 6 heats the substrate B that has been brought into the reflow oven 6 from the component mounting machine 4 by the substrate transport device 76.

[0025] Figure 2 is a schematic front view of a solder printing machine. The solder printing machine 2 prints solder onto the lands of the substrate B using a mask M through which pattern holes corresponding to the lands on the substrate B pass. The solder printing machine 2 comprises a mask holding unit 21 that holds the mask M, a substrate holding unit 23 positioned below the mask M, and a squeegee unit 29 positioned above the mask M. The solder printing machine 2 then uses the substrate holding unit 23 to bring the substrate B into contact with the mask M from below, while sliding the squeegee 291 of the squeegee unit 29 in the X direction across the upper surface of the mask M, thereby printing the solder supplied to the upper surface of the mask M onto the upper surface of the substrate B through the pattern holes in the mask M (printing process).

[0026] The substrate holding unit 23 is positioned below the mask M held by the mask holding unit 21 and aligns the position of the substrate B with respect to the mask M. The substrate holding unit 23 has a substrate holding section 25 that receives and holds the substrate B transported by the substrate transport device 76, and a flat, movable table 26 that supports the substrate holding section 25.

[0027] The substrate holding section 25 has a flat lifting table 251 and a sliding column 252 that can slide in the Z direction relative to the movable table 26, with the lifting table 251 supported by the upper end of the sliding column 252. In addition, a plurality of backup pins 253 are erected in the Z direction on the upper surface of the lifting table 251 and are arranged at intervals in the X and Y directions. When the sliding column 252 moves up and down, the backup pins 253 move up and down together with the lifting table 251. For example, before the substrate B is loaded by the substrate transport device 76, the upper end of each backup pin 253 is positioned below the substrate B held by the substrate transport device 76. When the substrate transport device 76 loads the substrate B directly above the backup pins 253, the backup pins 253 rise, and their upper ends protrude above the substrate transport device 76. In this way, the substrate B is transferred from the substrate transport device 76 to the upper end of each backup pin 253.

[0028] Furthermore, the substrate holding section 25 has a pair of clamp plates 254 positioned above the substrate transport device 76, spaced apart in the X direction. The upper surfaces of each clamp plate 254 are planes parallel to the X and Y directions and are located at the same height. At least one of these clamp plates 254 is movable in the X direction.

[0029] Then, the substrate B on the backup pin 253 rises to between the pair of clamp plates 254, and the movable clamp plate 254 moves in the X direction, narrowing the distance between these clamp plates 254, and the substrate B is clamped by these clamp plates 254 from the X direction (horizontal direction).

[0030] Furthermore, the substrate holding unit 23 has a table drive mechanism 27 that drives the movable table 26. This table drive mechanism 27 includes an X-axis table 271, a Y-axis table 272 mounted on the upper surface of the X-axis table 271, an R-axis table 273 mounted on the upper surface of the Y-axis table 272, and a ball screw 274 that raises and lowers the movable table 26 relative to the R-axis table 273. This table drive mechanism 27 drives the X-axis table 271 in the X direction, the Y-axis table 272 in the Y direction, the R-axis table 273 in the R direction (rotational direction around an axis parallel to the Z direction), and drives the movable table 26 in the Z direction by rotating the ball screw 274. In other words, the table drive mechanism 27 can drive the substrate holding unit 25 in the X, Y, Z, and R directions. For example, when positioning substrate B relative to mask M, the table drive mechanism 27 raises the substrate B, which is clamped to the clamp plate 254, in the Z direction while adjusting its position in the X, Y, and R directions. This causes the upper surfaces of both the clamp plate 254 and substrate B to come into contact with the lower surface of mask M.

[0031] The squeegee unit 29 adjusts the rotation angle of the squeegee 291 to bring the squeegee 291 into contact with the upper surface of the mask M at a predetermined angle (attack angle), and presses the squeegee 291 against the mask M with a predetermined pressure (printing pressure). From this state, the squeegee unit 29 moves the squeegee 291 in the X direction at a predetermined speed (squeegee speed), thereby printing solder onto the pads of the substrate B through the pattern holes of the mask M.

[0032] Figure 3 is a schematic plan view of the component mounting machine. As shown in Figure 3, a substrate transport device 74 of the substrate transport system 7 is positioned in relation to the component mounting machine 4. This substrate transport device 74 receives substrates B from a substrate transport device 72 positioned in relation to the solder printing machine 2 and transports them to the mounting processing position (the position of substrate B in Figure 3), and then transports the substrates B from the mounting processing position to a substrate transport device 76 positioned in relation to the reflow oven 6. The substrates B that the substrate transport device 74 transports to the component mounting machine 4 can include both substrates B with components P mounted on their underside (backside) and substrates B without components P mounted on their underside (backside). In addition, the upper surface (front surface) of the substrate B that the substrate transport device 74 transports out of the component mounting machine 4 has components P mounted on it by the component mounting machine 4.

[0033] In this component mounting machine 4, a pair of X-axis rails 421 parallel to the X direction, an X-axis ball screw 422 parallel to the X direction, and an X-axis motor 423 (servo motor) that rotates the X-axis ball screw 422 are provided. A Y-axis rail 424 parallel to the Y direction is fixed to the nuts of the X-axis ball screw 422 while being supported by the pair of X-axis rails 421 so as to be movable in the X direction. A Y-axis ball screw 425 parallel to the Y direction and a Y-axis motor 426 (servo motor) that rotates the Y-axis ball screw 425 are attached to the Y-axis rail 424, and a head unit 43 is fixed to the nuts of the Y-axis ball screw 425 while being supported by the Y-axis rail 424 so as to be movable in the Y direction. Therefore, the X-axis motor 423 can rotate the X-axis ball screw 422 to move the head unit 43 in the X direction, and the Y-axis motor 426 can rotate the Y-axis ball screw 425 to move the head unit 43 in the Y direction.

[0034] The head unit 43 has a so-called rotary-type mounting head 431. That is, the mounting head 431 has a plurality (8) of nozzles 432 arranged circumferentially at equal angular intervals around a rotation axis, and the plurality of nozzles 432 are rotatable around the rotation axis.

[0035] As shown in Figure 3, on each side of the substrate transport device 74 in the X direction, two component supply units 44 are arranged in the Y direction. Multiple tape feeders 441 are detachably mounted to each component supply unit 44, arranged in the Y direction. The tape feeders 441 extend in the X direction and have component supply locations 442 at their ends on the substrate transport device 74 side in the X direction. Component supply reels, around which tape containing small pieces of components P such as integrated circuits, transistors, and capacitors are wound at predetermined intervals, are placed for each tape feeder 441, and the tape drawn from the component supply reels is loaded into the tape feeders 441. The tape feeders 441 intermittently feed the tape in the X direction toward the substrate transport device 74. This causes the components P in the tape to be fed in the X direction (feed direction) and sequentially supplied to the component supply locations 442 of the tape feeders 441.

[0036] The mounting head 431 then uses its nozzles 432 to pick up and place the components P. Specifically, the mounting head 431 moves above the tape feeder 441 and brings the nozzles 432 into contact with the components P supplied to the component supply location 442 by the tape feeder 441. The mounting head 431 then generates a predetermined negative pressure, which causes the nozzles 432 to pick up (apply) the components P. With the components P held in this position, the mounting head 431 moves above the substrate B at the mounting processing location and places the components P on the substrate B. In this way, the mounting process of picking up components P and placing them on the substrate B is performed by the component mounting machine 4.

[0037] Thus, in component mounting line 1, a substrate B with components P mounted is produced through solder printing by a solder printing machine 2 (printing process), mounting of components P by a component mounting machine 4 (mounting process), and solder melting by a reflow oven 6 (reflow process). In this component mounting line 1, the substrate B is transported in the Y direction by a substrate transport system 7. Next, the configuration of the substrate transport system 7, and in particular the configuration of the substrate transport device 74 provided for the component mounting machine 4, will be described.

[0038] Figure 4 is a schematic plan view showing an example of a substrate transport device, Figures 5A and 5B are schematic side views showing the substrate transport device of Figure 4, Figures 6A, 6B, 7A, and 7B are schematic front views showing the substrate transport device of Figure 4, and Figures 8A and 8B show backup members used in the substrate transport device of Figure 4.

[0039] As shown in Figures 4, 5A, and 5B, the substrate transport device 74 comprises a pair of conveyor units 8 spaced apart in the X direction, with a transport path Tb through which the substrate B passes in the Y direction provided between the pair of conveyor units 8. The difference between the pair of conveyor units 8 is that one is provided at one end of the substrate B in the X direction, while the other is provided at the other end of the substrate B in the X direction (the opposite end of the first end), but these configurations are common. Therefore, this explanation will focus on one of the conveyor units 8.

[0040] The conveyor unit 8 has a substrate guide 81 that extends parallel to the Y direction along the transport path Tb. The substrate guide 81 has a side end face 811 at the inner end (towards the transport path Tb) in the X direction, and the side end face 811 is a vertical surface parallel to the Y and Z directions. This side end face 811 is adjacent to the transport path Tb from the X direction, that is, it faces the end Be of the substrate B being transported along the transport path Tb from the X direction. The substrate guide 81 consists of a side end face 811 and a base portion 812 that holds the side end face 811, and the side end face 811 and the base portion 812 have different electrical properties, specifically electrical resistance values. That is, the side end face 811 is made of a conductive material other than metal (ceramics in this example) and is an electrostatic dissipation surface with electrostatic dissipation properties, while the base portion 812 is made of metal and has a lower electrical resistance value than the side end face 811. For example, by performing surface treatment such as thermal spraying or ceramic coating on the surface of the metal substrate of the base portion 812, a thin layer with electrostatic dissipative properties (electrostatic dissipation layer) can be formed on the substrate of the base portion 812. The surface of this electrostatic dissipation layer functions as the side end surface 811 (electrostatic dissipation surface).

[0041] Furthermore, the conveyor unit 8 has a belt conveyor 83 provided at the end of the transport path Tb in the X direction to support the end of the substrate B located in the transport path Tb. The belt conveyor 83 has a plurality of pulleys 831 arranged at intervals in the Y direction and an endless belt 832 stretched across the plurality of pulleys 831. The upper surface of the endless belt 832 is a horizontal plane extending parallel to the Y direction. As the endless belt 832 rotates in conjunction with the rotation of the pulleys 831, the upper surface of the endless belt 832 moves in the Y direction. As a result, the substrate B placed on the upper surface of the endless belt 832 is transported along the transport path Tb in the Y direction. In the conveyor unit 8, a plurality (2) of belt conveyors 83 are arranged in series in the Y direction, and the conveyor unit 8 transports the substrate B in the Y direction by passing the substrate B between these belt conveyors 83. In this way, the substrate B transported in the Y direction by the belt conveyors 83 of the conveyor unit 8 passes through the transport path Tb.

[0042] In the X direction, the endless belt 832 protrudes inward (towards the transport path Tb) from the side end face 811 of the substrate guide 81, and the edge Be of the substrate B rests on the portion of the endless belt 832 that protrudes from the side end face 811. Therefore, the side end face 811 of the substrate guide 81 faces the edge Be of the substrate B placed on the endless belt 832 from the X direction. This side end face 811 of the substrate guide 81 guides the substrate B along the transport path Tb by contacting the edge Be of the substrate B which has been displaced outward (towards the opposite side of the transport path Tb) in the X direction.

[0043] Furthermore, the conveyor unit 8 has a clamper 84 provided on the end of the transport path Tb in the X direction. The clamper 84 has an upper clamp member 85 that faces the upper surface Bu of the substrate B placed on the belt conveyor 83 from above, and a lower clamp member 86 that faces the lower surface Bd of the substrate B placed on the belt conveyor 83 from below. A plurality of upper clamp members 85 are arranged at intervals in the Y direction, and one lower clamp member 86 is provided corresponding to the plurality of upper clamp members 85.

[0044] The upper clamp member 85 is attached to the upper surface of the substrate guide 81 and protrudes inward (towards the transport path Tb) from the side end surface 811 and the endless belt 832 of the substrate guide 81 in the X direction. This upper clamp member 85 is composed of a horizontal lower end surface 851 and a base portion 852 that holds the lower end surface 851, and the lower end surface 851 and the base portion 852 have different electrical characteristics, specifically electrical resistance values. That is, the lower end surface 851 is made of a conductive material other than metal (ceramics in this example) and is an electrostatic dissipation surface with electrostatic dissipation properties, while the base portion 852 is made of metal and has a lower electrical resistance value than the lower end surface 851. For example, by performing surface treatment processing such as thermal spraying or ceramic coating by heat coating on the surface of the metal base material of the base portion 852, a thin layer with electrostatic dissipation properties (electrostatic dissipation layer) can be formed on the base material of the base portion 852. The surface of this electrostatic diffusion layer functions as the lower end surface 851 (electrostatic diffusion surface).

[0045] The lower clamp member 86 is provided in the X direction, inside the side end face 811 of the substrate guide 81 and the endless belt 832 (on the transport path Tb side). The lower clamp member 86 extends in the Y direction and is a plate parallel to the Y and Z directions. This lower clamp member 86 is composed of an upper end face 861 parallel to the Y direction and a base portion 862 that holds the upper end face 861. The upper end face 861 and the base portion 862 have different electrical properties, specifically electrical resistance values. That is, the upper end face 861 is made of a conductive material other than metal (ceramics in this example) and is an electrostatic dissipation surface with electrostatic dissipation properties, while the base portion 862 is made of metal and has a lower electrical resistance value than the upper end face 861. For example, by performing surface treatment processing such as thermal spraying or ceramic coating by heat coating on the surface of the metal substrate of the base portion 862, a thin layer with electrostatic dissipation properties (electrostatic dissipation layer) can be formed on the substrate of the base portion 862. The surface of this electrostatic diffusion layer functions as the upper end surface 861 (electrostatic diffusion surface).

[0046] As shown in Figures 6A and 6B, multiple (2) lower clamp members 86 are provided in the Y direction, corresponding to multiple (2) belt conveyors 83 arranged in the Y direction. In addition, multiple (2) upper clamp members 85 are provided for each of the two lower clamp members 86.

[0047] The lower end surface 851 of the upper clamp member 85 and the upper end surface 861 of the lower clamp member 86 face each other from the Z direction, with the substrate B placed on the endless belt 832 in between. In contrast, the clamper 84 has a drive unit 87 that drives the lower clamp member 86 in the Z direction. The drive unit 87 is an actuator such as a solenoid or a cylinder, and may be provided in common to multiple upper clamp members 85 or individually. This drive unit 87 drives the lower clamp member 86 in the Z direction between a lowered position 86L and an elevated position 86U above the lowered position 86L.

[0048] As shown in Figures 5A and 6A, the lower clamp member 86, located in the lowered position 86L, ​​moves downward away from the substrate B supported by the belt conveyor 83. When the drive unit 87 raises the lower clamp member 86 from the lowered position 86L, ​​the upper end surface 861 of the lower clamp member 86 contacts the lower surface of the substrate B, lifting the substrate B away from the belt conveyor 83. Then, as shown in Figures 5B and 6B, when the lower clamp member 86 rises to the raised position 86U, the lower end surface 851 of the upper clamp member 85 contacts the upper surface of the substrate B, and the upper end surface 861 of the lower clamp member 86 contacts the lower surface of the substrate B, clamping the substrate B between the upper clamp member 85 and the lower clamp member 86 (clamping operation). As a result, the substrate B rises from the belt mounting position B1, where it is placed on the belt conveyor 83, to the clamp position B2, where it is clamped between the upper clamp member 85 and the lower clamp member 86. Furthermore, when the drive unit 87 lowers the lower clamp member 86 from the raised position 86U, the upper surface of the substrate B separates downward from the lower end surface 851 of the upper clamp member 85, and the substrate B is transferred from the upper end surface 861 of the lower clamp member 86 to the belt conveyor 83. When the lower clamp member 86 descends to the lowered position 86L, ​​the upper end surface 861 of the lower clamp member 86 separates downward from the substrate B supported by the belt conveyor 83 (clamp release operation). As a result, the substrate B descends from the clamped position B2 to the belt-mounted position B1.

[0049] Furthermore, as shown in Figures 4, 5A, and 5B, the substrate transport device 74 includes a backup unit 9 positioned between a pair of conveyor units 8 in the X direction. The backup unit 9 has a metal lifting table 91 and a drive unit 92 that drives the lifting table 91 in the Z direction. As shown in Figures 7A and 7B, a plurality of (two) lifting tables 91 are provided in the Y direction, corresponding to a plurality of (two) belt conveyors 83 arranged in the Y direction. The drive unit 92 is an actuator such as a solenoid or a cylinder, and may be provided in common to the plurality of lifting tables 91 or individually. The upper surface of the lifting table 91 is a horizontal pin arrangement plane 911, and the backup unit 9 has one or more backup members 93 arranged on the pin arrangement plane 911.

[0050] As shown in Figure 8A, the backup member 93 includes a base plate 931, a metal pin support 932 extending upward from the base plate 931, and a backup pin 94 attached to the pin support 932. The base plate 931 has a magnet and, when placed on the pin arrangement plane 911 of the lifting table 91, is attracted to the pin arrangement plane 911 by magnetic force. The pin support 932 includes a plate fastening portion 933 fastened to the upper surface of the base plate 931, an upright portion 934 erected upward in the Z direction from the plate fastening portion 933, and a pin fastening portion 935 extending horizontally from the upper end of the upright portion 934, with the backup pin 94 fastened to the pin fastening portion 935.

[0051] As shown in Figures 8A and 8B, the backup pin 94 has a metal shaft 95 erected above the pin fastening portion 935 in the Z direction, and a sphere 96 attached to the upper end of the shaft 95. The sphere 96 is composed of a spherical surface 961 and a base portion 962 that holds the spherical surface 961, and the spherical surface 961 and the base portion 962 have different electrical properties, specifically electrical resistance values. That is, the spherical surface 961 is made of a conductive material other than metal (in this example, ceramics) and is an electrostatic diffusion surface with electrostatic diffusion properties, while the base portion 962 is made of metal and has a lower electrical resistance value than the spherical surface 961. For example, by performing surface treatment processing such as thermal spraying or ceramic coating by heat coating on the surface of the metal substrate of the base portion 962, a thin layer with electrostatic diffusion properties (electrostatic diffusion layer) can be formed on the substrate of the base portion 962. The surface of this electrostatic diffusion layer functions as the spherical surface 961 (electrostatic diffusion surface). Furthermore, for the base portion 962, for example, balls used in ball bearings can be repurposed. In this case, the backup pin 94 can be completed simply by press-fitting the balls onto the shaft 95, and by using balls with a spherical shape, there is no need to consider the orientation of the balls during press-fitting, making it easy to assemble the backup pin 94. In the backup pin 94, the sphere 96 is fixed to the upper end of the shaft 95 and does not function as a bearing. Thus, a sphere 96 is provided at the tip of the backup pin 94, and the backup pin 94 supports the substrate B from below by the spherical surface 961 of the sphere 96.

[0052] As shown in Figures 5A and 7A, the backup pin 94, located in the lowered position 94L, moves downward away from the substrate B, which is supported at the belt mounting position B1 by the belt conveyor 83. When the drive unit 92 raises the backup pin 94 from the lowered position 94L, the spherical surface 961 (upper end surface) of the backup pin 94 contacts the lower surface of the substrate B at the belt mounting position B1, lifting the substrate B from the belt conveyor 83. Then, as shown in Figures 5B and 7B, when the backup pin 94 is raised to the raised position 94U, the spherical surface 961 of the backup pin 94 contacts the lower surface of the substrate B clamped at the clamp position B2, supporting the substrate B from below (backup operation). This backup operation is performed simultaneously with the clamping operation described above. Furthermore, the backup position where the spherical surface 961 of the backup pin 94 contacts the substrate B is inward (towards the center) in the X direction, relative to the clamp position (the edge of the substrate B) where the upper clamp member 85 and the lower clamp member 86 that clamp the substrate B contact the substrate B. When the drive unit 92 lowers the backup pin 94 from the raised position 94U, the substrate B lowers, and the substrate B is transferred from the spherical surface 961 of the backup pin 94 to the belt conveyor 83. When the backup pin 94 further lowers to the lowered position 94L, the spherical surface 961 of the backup pin 94 separates downward from the substrate B which is supported at the belt mounting position B1 by the belt conveyor 83 (backup release operation). This backup release operation is performed simultaneously with the clamp release operation described above.

[0053] In the embodiment configured as described above, the substrate B is transported along a predetermined transport path Tb. The substrate B located on the transport path Tb is supported or guided by substrate contact surfaces that contact the substrate B (the side end surface 811 of the substrate guide 81, the lower end surface 851 of the upper clamp member 85, the upper end surface 861 of the lower clamp member 86, and the spherical surface 961 of the backup member 93). At this time, the substrate contact surfaces 811, 851, 861, and 961 are conductive. Therefore, any charge accumulated on the substrate B flows out to the substrate contact surfaces 811, 851, 861, and 961 that contact the substrate B, and the charge on the substrate B is eliminated. Moreover, since the substrate contact surfaces 811, 851, 861, and 961 are not metals, the outflow of charge from the substrate B to the substrate contact surfaces 811, 851, 861, and 961 is suppressed gradually. In this way, it is possible to slow down the outflow of charge from substrate B as it is transported on component mounting line 1, while suppressing the charging of substrate B.

[0054] In this case, the electrical resistance values ​​of the substrate contact surfaces 811, 851, 861, and 961 can be set within a range that allows for electrostatic dissipation. This makes it possible to suppress the charging of substrate B while slowing down the outflow of charge from substrate B as it is transported on the component mounting line 1.

[0055] Alternatively, the electrical resistance values ​​of the substrate contact surfaces 811, 851, 861, and 961 can be set to 1 × 10⁴ Ω or more and less than 1 × 10¹¹ Ω. Here, electrical resistance values ​​in the range of 1 × 10⁴ Ω or more and less than 1 × 10¹¹ Ω are indicated as electrostatically dissipative electrical resistance values ​​in IEC 61340-5-1 (standard). In this configuration, since the electrical resistance values ​​of the substrate contact surfaces 811, 851, 861, and 961 are less than 1 × 10¹¹ Ω, the charge accumulated on substrate B flows out to the substrate contact surfaces 811, 851, 861, and 961 that are in contact with substrate B, and the charge on substrate B is eliminated. Moreover, since the electrical resistance values ​​of the substrate contact surfaces 811, 851, 861, and 961 are 1 × 10⁴ Ω or more, the outflow of charge from substrate B to the substrate contact surfaces 811, 851, 861, and 961 is slowly suppressed. In this way, it is possible to slow down the outflow of charge from substrate B as it is transported on component mounting line 1, while suppressing the charging of substrate B.

[0056] Furthermore, the substrate guide 81, upper clamp member 85, lower clamp member 86, and sphere 96 each have a base material portion (base portion 812, base portion 852, base portion 862, and base portion 962) on which substrate contact surfaces 811, 851, 861, and 961 are provided. In this configuration, since the substrate guide 81, upper clamp member 85, lower clamp member 86, and sphere 96 are not all made of ceramics, costs can be reduced. Moreover, the hardness of the substrate contact surfaces 811, 851, 861, and 961 is higher than the hardness of the base material portions 812, 852, 862, and 962. In this configuration, the durability of the substrate contact surfaces 811, 851, 861, and 961 is increased, and the deterioration of the substrate contact surfaces 811, 851, 861, and 961 due to contact with substrate B can be suppressed.

[0057] Furthermore, the substrate contact surfaces 811, 851, 861, and 961 are made of ceramics, which have high friction resistance and do not rust. Therefore, replacement of the substrate contact surfaces 811, 851, 861, and 961 will not be necessary for a long period of time, reducing the burden of maintenance.

[0058] Furthermore, the substrate contact surfaces 811, 851, 861, and 961 may be composed of coated ceramics as described above. Coating allows for the provision of ceramics in a very thin layer, making it possible to form substrate contact surfaces 811, 851, 861, and 961 composed of ceramics even for complex shapes.

[0059] Furthermore, a substrate guide 81 is provided adjacent to the transport path Tb, and the side end surface 811 of the substrate guide 81 contacts the edge Be of the substrate B as an electrostatically dissipative substrate contact surface, i.e., an electrostatically dissipative surface, to guide the substrate B. In other words, since the substrate guide 81 is provided adjacent to the transport path Tb to guide the substrate B, the side end surface 811 of the substrate guide 81 comes into contact with the substrate B at a high frequency. Therefore, it is particularly preferable to configure the side end surface 811 of the substrate guide 81 as a substrate contact surface, i.e., an electrostatically dissipative surface, which is made of a material other than metal and has conductivity.

[0060] Furthermore, the system is equipped with a lower clamping member 86 that faces the substrate B supported by the belt conveyor 83 (substrate transport section) from below, and an upper clamping member 85 that faces the substrate B supported by the belt conveyor 83 from above. A clamping operation is performed by raising the lower clamping member 86 above the belt conveyor 83 to clamp the substrate B, which has been lifted from the belt conveyor 83 by the lower clamping member 86, between the lower clamping member 86 and the upper clamping member 85. A clamp release operation is performed by lowering the lower clamping member 86 above the belt conveyor 83 to release the clamping operation. During the clamping operation, the upper end surface 861 of the lower clamping member 86 contacts the lower surface of the substrate B as a substrate contact surface (electrostatic diffusion surface), and the lower end surface 851 of the upper clamping member 85 contacts the upper surface of the substrate B as a substrate contact surface (electrostatic diffusion surface). In other words, the upper end surface 861 of the lower clamping member 86 and the lower end surface 851 of the upper clamping member 85 contact the substrate B in order to clamp the substrate B. In particular, the upper surface (front) and lower surface (back) of the substrate that the upper end surface 861 of the lower clamping member 86 and the lower end surface 851 of the upper clamping member 85 contact, respectively, correspond to the surface on which the component P is mounted (i.e., the surface on which the lands are provided). Therefore, from the viewpoint of preventing damage to the component P, it is particularly preferable to configure the upper end surface 861 of the lower clamping member 86 and the lower end surface 851 of the upper clamping member 85 as conductive substrate contact surfaces (electrostatic diffusion surfaces) made of a material other than metal.

[0061] Furthermore, a backup pin 94 is provided that faces the substrate B, which is supported by the belt conveyor 83, from below. A backup operation is performed by raising the backup pin 94 above the belt conveyor 83 to support the substrate B that has been lifted by the belt conveyor 83, and a backup release operation is performed by lowering the backup pin 94 above the belt conveyor 83 to release the backup operation. During the execution of the backup operation, the spherical surface 961 (upper end surface) of the backup pin 94 contacts the lower surface of the substrate B as a substrate contact surface (electrostatic diffusion surface). In other words, the spherical surface 961 of the backup pin 94 contacts the substrate B in order to support the substrate B. In particular, the backup pin 94 contacts the substrate B relatively close to the center of the substrate B, in other words, near the mounting position (i.e., land) of the component P. Therefore, from the viewpoint of preventing damage to the component P, it is particularly preferable to configure the substrate contact surface (electrostatic diffusion surface), the spherical surface 961 of the backup pin 94, to be made of a material other than metal and having conductivity.

[0062] In the above embodiment, the component mounting machine 4 corresponds to an example of the "component mounting machine" of the present invention, the head unit 43 corresponds to an example of the "mounting unit" of the present invention, the substrate transport device 74 corresponds to an example of the "substrate transport device" of the present invention, the belt conveyor 83 corresponds to an example of the "substrate transport section" of the present invention, the side end face 811, the lower end face 851, the upper end face 861, and the spherical surface 961 each correspond to an example of the "substrate contact surface" of the present invention, and the substrate guide 81, the clamper 84, and the backup unit 9 cooperate to form an example of the "substrate transport assistance section" of the present invention. It functions as such, with base portion 812, base portion 852, base portion 862 and base portion 962 each corresponding to an example of the "substrate portion" of the present invention, substrate guide 81 corresponding to an example of the "substrate guide" of the present invention, lower clamp member 86 corresponding to an example of the "lower clamp member" of the present invention, upper clamp member 85 corresponding to an example of the "upper clamp member" of the present invention, backup pin 94 corresponding to an example of the "backup pin" of the present invention, substrate B corresponding to an example of the "substrate" of the present invention, and transport path Tb corresponding to an example of the "transport path" of the present invention.

[0063] It should be noted that the present invention is not limited to the embodiments described above, and various modifications can be made to those described above without departing from the spirit of the invention. For example, the substrate contact surfaces 811, 851, 861, and 961 may be formed by anodizing. Anodizing allows for the formation of substrate contact surfaces 811, 851, 861, and 961 even for complex shapes, and since anodizing is inexpensive, the cost of the substrate transport device 74 can also be reduced.

[0064] Furthermore, the substrate contact surfaces 811, 851, 861, and 961 may be formed by DLC treatment. DLC treatment allows for the formation of substrate contact surfaces 811, 851, 861, and 961 with high precision, even for complex shapes. It also allows for the formation of substrate contact surfaces 811, 851, 861, and 961 with high hardness and wear resistance. Moreover, it allows for the formation of substrate contact surfaces 811, 851, 861, and 961 with a low coefficient of friction, so that the smooth transport of substrate B is not hindered by the substrate contact surfaces 811, 851, 861, and 961.

[0065] Furthermore, the number of belt conveyors 83 in the conveyor unit 8 is not limited to two; it may be one or three or more. Also, when multiple belt conveyors 83 are provided, as in the example above, multiple belt conveyors 83 may support one substrate B, or each of the multiple belt conveyors 83 may support one substrate B.

[0066] Furthermore, in a plan view, the shape of substrate B is not limited to the rectangle described above; it may be a shape other than a rectangle. [Explanation of symbols]

[0067] 4…Component mounting machine 43…Head unit (mounted unit) 74... Circuit board transport device 83... Belt conveyor (circuit board transport section) 811...Side end surface (substrate contact surface) 851…Bottom end surface (substrate contact surface) 861…Top end surface (substrate contact surface) 961…Spherical surface (substrate contact surface) 81... Circuit board guide (circuit board transport assist unit) 84...Clamper (substrate transport assist unit) 9…Backup unit (circuit board transport assist unit) 812...Base part (base material part) 852...Base part (substrate part) 862...Base part (base material part) 962...Base part (base material part) 81... Circuit board guide 86...Lower clamp member 85…Upper clamp member 94…Backup pin B... Circuit board Tb... Transport route

Claims

1. A substrate transport unit that transports the substrate along a predetermined transport path, A substrate transport assist unit having a substrate contact surface, which supports or guides the substrate by contacting the substrate located in the transport path with the substrate contact surface, Equipped with, The substrate contact surface is made of a material different from metal and has conductivity. The substrate transport assist unit has a substrate guide provided adjacent to the transport path, and the side end surface of the substrate guide contacts the edge of the substrate as the substrate contact surface to guide the substrate. The substrate contact surface is made of ceramics in the substrate transport device.

2. The substrate transport apparatus according to claim 1, wherein the substrate contact surface is composed of coated ceramics.

3. A substrate transport unit that transports the substrate along a predetermined transport path, A substrate transport assist unit having a substrate contact surface, which supports or guides the substrate by contacting the substrate located in the transport path with the substrate contact surface, Equipped with, The substrate contact surface is made of a material different from metal and has conductivity. The substrate transport assist unit has a substrate guide provided adjacent to the transport path, and the side end surface of the substrate guide contacts the edge of the substrate as the substrate contact surface to guide the substrate. The substrate contact surface of the substrate transport device is constructed by anodizing.

4. A substrate transport unit that transports the substrate along a predetermined transport path, A substrate transport assist unit having a substrate contact surface, which supports or guides the substrate by contacting the substrate located in the transport path with the substrate contact surface, Equipped with, The substrate contact surface is made of a material different from metal and has conductivity. The substrate transport assist unit has a substrate guide provided adjacent to the transport path, and the side end surface of the substrate guide contacts the edge of the substrate as the substrate contact surface to guide the substrate. The substrate contact surface is formed by DLC treatment in the substrate transport device.

5. A substrate transport unit that transports the substrate along a predetermined transport path, A substrate transport assist unit having a substrate contact surface, which supports or guides the substrate by contacting the substrate located in the transport path with the substrate contact surface, Equipped with, The substrate contact surface is made of a material different from metal and has conductivity. The substrate transport assist unit has a lower clamping member that faces the substrate supported by the substrate transport unit from below, and an upper clamping member that faces the substrate supported by the substrate transport unit from above, and performs a clamping operation in which the lower clamping member raises the lower clamping member above the substrate transport unit to clamp the substrate lifted from the substrate transport unit between the lower clamping member and the upper clamping member, and a clamp release operation in which the lower clamping member lowers the lower clamping member above the substrate transport unit to release the clamping operation. During the clamping operation, the upper end surface of the lower clamping member contacts the lower surface of the substrate as the substrate contact surface, and the lower end surface of the upper clamping member contacts the upper surface of the substrate as the substrate contact surface. The substrate contact surface is made of ceramics in the substrate transport device.

6. The substrate transport apparatus according to claim 5, wherein the substrate contact surface is composed of coated ceramics.

7. A substrate transport unit that transports the substrate along a predetermined transport path, A substrate transport assist unit having a substrate contact surface, which supports or guides the substrate by contacting the substrate located in the transport path with the substrate contact surface, Equipped with, The substrate contact surface is made of a material different from metal and has conductivity. The substrate transport assist unit has a lower clamping member that faces the substrate supported by the substrate transport unit from below, and an upper clamping member that faces the substrate supported by the substrate transport unit from above, and performs a clamping operation in which the lower clamping member raises the lower clamping member above the substrate transport unit to clamp the substrate lifted from the substrate transport unit between the lower clamping member and the upper clamping member, and a clamp release operation in which the lower clamping member lowers the lower clamping member above the substrate transport unit to release the clamping operation. During the clamping operation, the upper end surface of the lower clamping member contacts the lower surface of the substrate as the substrate contact surface, and the lower end surface of the upper clamping member contacts the upper surface of the substrate as the substrate contact surface. The substrate contact surface of the substrate transport device is constructed by anodizing.

8. A substrate transport unit that transports the substrate along a predetermined transport path, A substrate transport assist unit having a substrate contact surface, which supports or guides the substrate by contacting the substrate located in the transport path with the substrate contact surface, Equipped with, The substrate contact surface is made of a material different from metal and has conductivity. The substrate transport assist unit has a lower clamping member that faces the substrate supported by the substrate transport unit from below, and an upper clamping member that faces the substrate supported by the substrate transport unit from above, and performs a clamping operation in which the lower clamping member raises the lower clamping member above the substrate transport unit to clamp the substrate lifted from the substrate transport unit between the lower clamping member and the upper clamping member, and a clamp release operation in which the lower clamping member lowers the lower clamping member above the substrate transport unit to release the clamping operation. During the clamping operation, the upper end surface of the lower clamping member contacts the lower surface of the substrate as the substrate contact surface, and the lower end surface of the upper clamping member contacts the upper surface of the substrate as the substrate contact surface. The substrate contact surface is formed by DLC treatment in the substrate transport device.

9. The substrate transport assist unit has backup pins that face the substrate supported by the substrate transport unit from below, and performs a backup operation in which the backup pins raise the substrate from the substrate transport unit to support the substrate lifted from the substrate transport unit by the backup pins, and a backup release operation in which the backup operation is released in which the backup pins lower the substrate transport unit. The substrate transport device according to any one of claims 1, 3, 4, 5, 7, and 8, wherein during the execution of the backup operation, the upper end surface of the backup pin contacts the lower surface of the substrate as the substrate contact surface.

10. The substrate transport apparatus according to any one of claims 1, 3, 4, 5, 7, and 8, wherein the electrical resistance of the substrate contact surface is within the range of electrostatic dissipation.

11. The substrate transport apparatus according to any one of claims 1, 3, 4, 5, 7, and 8, wherein the electrical resistance of the substrate contact surface is 1 × 10⁴ Ω or more and less than 1 × 10¹¹ Ω.

12. The substrate transport assisting unit has a base material portion on which the substrate contact surface is provided, The substrate transport apparatus according to any one of claims 1, 3, 4, 5, 7, and 8, wherein the hardness of the substrate contact surface is higher than the hardness of the base material.

13. The substrate transport apparatus according to claim 12, wherein the base material is made of metal.

14. A substrate transport apparatus according to any one of claims 1, 3, 4, 5, 7, and 8, A mounting unit for mounting components onto a circuit board transported by the aforementioned circuit board transport device. A component mounting machine equipped with the following features.

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