Support pin, component mounting device, and component mounting method

Abstract

Verify that the correct support pins are being used. [Solution] The support pin comprises a support portion that supports the lower surface of the circuit board on which the components are mounted, and a wireless tag that stores identification data for identifying the type of support portion.

Description

Technical Field

[0001] The technology disclosed in this specification relates to a support pin, a component mounting device, and a component mounting method. It relates to.

Background Art

[0002] In the technical field related to component mounting devices, support pins such as those disclosed in Patent Document 1 are known. The support pin supports the lower surface of the substrate on which the component is mounted. By supporting the substrate with the support pin, the deflection of the substrate is suppressed.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] If an appropriate support pin is not used, it may be difficult to sufficiently suppress the deflection of the substrate. Further, when a component is mounted on the lower surface of the substrate, if an appropriate support pin is not used, the support pin may contact the component.

[0005] The technology disclosed in this specification aims to confirm whether an appropriate support pin is used.

Means for Solving the Problems

[0006] This specification discloses a support pin. The support pin includes a support portion that supports the lower surface of the substrate on which the component is mounted, and a wireless tag in which identification data for identifying the type of the support portion is stored.

Effects of the Invention

[0007] The technology disclosed herein allows for verification of whether or not appropriate support pins are being used. [Brief explanation of the drawing]

[0008] [Figure 1] Figure 1 is a schematic side view showing a component mounting apparatus according to an embodiment. [Figure 2] Figure 2 is a schematic top view showing a parts supply device according to an embodiment. [Figure 3] Figure 3 is a schematic top view showing a substrate transport apparatus according to an embodiment. [Figure 4] Figure 4 is a schematic side view showing a nozzle according to an embodiment. [Figure 5] Figure 5 is a side view showing the support pin according to the embodiment. [Figure 6] Figure 6 is a diagram illustrating the types of support pins according to the embodiment. [Figure 7] Figure 7 is a schematic perspective view showing the support pin housing member according to the embodiment. [Figure 8] Figure 8 is a diagram illustrating a method for transporting support pins according to an embodiment. [Figure 9] Figure 9 shows the support pins that support the lower surface of the substrate according to the embodiment. [Figure 10] Figure 10 is a block diagram showing a component mounting apparatus according to an embodiment. [Figure 11] Figure 11 is a flowchart showing a component mounting method according to an embodiment. [Modes for carrying out the invention]

[0009] A component mounting device 1 according to an embodiment will be described with reference to the drawings. In this embodiment, an XYZ Cartesian coordinate system is set for the component mounting device 1, and the positional relationships of each part will be described with reference to this XYZ Cartesian coordinate system. The direction parallel to the X axis within a predetermined plane is defined as the X-axis direction. The direction parallel to the Y axis perpendicular to the X axis within a predetermined plane is defined as the Y-axis direction. The direction parallel to the Z axis perpendicular to both the X and Y axes is defined as the Z-axis direction. The rotation or tilt direction around the X axis is defined as the θX direction. The rotation or tilt direction around the Y axis is defined as the θY direction. The rotation or tilt direction around the Z axis is defined as the θZ direction. The predetermined plane including the X and Y axes will be appropriately referred to as the XY plane. In this embodiment, the XY plane is parallel to the horizontal plane. The Z-axis direction is the vertical direction. The +Z side is the upper side, and the -Z side is the lower side.

[0010] [Component mounting equipment] Figure 1 is a schematic side view showing a component mounting apparatus 1 according to an embodiment. The component mounting apparatus 1 mounts components C onto a substrate P. The component mounting apparatus 1 comprises a base 2, a component supply device 3 for supplying components C, a substrate transport device 4 for transporting the substrate P, support pins 5 for supporting the lower surface of the substrate P, a mounting head 6 for mounting components C onto the upper surface of the substrate P, a tag reader 7 for reading wireless tags 55 attached to the support pins 5, and a controller 8.

[0011] Figure 2 is a schematic top view showing a parts supply device 3 according to an embodiment. As shown in Figures 1 and 2, the parts supply device 3 includes a trolley 9, a reel holding mechanism 10, a feeder bank 11, a reel 12, and a parts feeder 13.

[0012] The trolley 9 supports the reel holding mechanism 10 and the feeder bank 11, respectively. The reel holding mechanism 10 supports the reel 12. The feeder bank 11 supports the parts feeder 13. The reel holding mechanism 10 is positioned on the -Y side of the feeder bank 11. The base 2 is positioned on the +Y side of the parts supply device 3. The feeder bank 11 is connected to the base 2.

[0013] The reel 12 is rotatably supported by the reel holding mechanism 10. The component feeder 13 is attached to the feeder bank 11. The carrier tape 14 is wound around the reel 12. The carrier tape 14 holds a plurality of components C. The component feeder 13 is a tape feeder. The carrier tape 14 is supplied from the reel 12 to the component feeder 13. The component feeder 13 supplies the component C held on the carrier tape 14 to the mounting head 6. An opening 13A is provided at the +Y side end of the upper surface of the component feeder 13. The component feeder 13 sends the component C held on the carrier tape 14 to the opening 13A. The mounting head 6 can hold and convey the component C sent to the opening 13A.

[0014] The feeder bank 11 has a plurality of mounting slots 15 into which the component feeder 13 is inserted. A plurality of mounting slots 15 are provided at equal intervals in the X-axis direction. One component feeder 13 is inserted into one mounting slot 15. In the feeder bank 11, a plurality of component feeders 13 are arranged in the X-axis direction.

[0015] The component mounting apparatus 1 includes a housing member 16 that houses a plurality of support pins 5. The housing member 16 is attached to the feeder bank 11. The housing member 16 is inserted into the mounting slot 15. The mounting head 6 can hold and convey the support pins 5 housed in the housing member 16.

[0016] FIG. 3 is a top view schematically showing the substrate transfer device 4 according to the embodiment. As shown in FIGS. 1 and 3, the substrate transfer device 4 is supported by the base 2. The substrate transfer device 4 transfers the substrate P from the inlet position Q1 to the processing position Q2. The processing position Q2 is a position where a mounting process of mounting the component C on the substrate P is performed. The inlet position Q1 is a position where a loading process of loading the substrate P into the processing position Q2 is performed. The inlet position Q1 is positioned on the -X side of the processing position Q2. The substrate transfer device 4 transfers the substrate P in the +X direction.

[0017] The upper surface and the lower surface of the substrate P are substantially parallel. The substrate transfer device 4 supports the substrate P such that the lower surface of the substrate P is parallel to the XY plane. The substrate transfer device 4 transfers the substrate P while maintaining the state in which the lower surface of the substrate P is parallel to the XY plane. In the embodiment, the outer shape of the substrate P is rectangular. The substrate P is long in the X-axis direction. The substrate transfer device 4 transfers the substrate P in the longitudinal direction of the substrate P.

[0018] The substrate transfer device 4 includes a pair of guide members 17 that guide the substrate P, and a pair of conveyor belts 18 that support and transfer both end portions of the substrate P in the Y-axis direction. The guide member 17 is long in the X-axis direction. One guide member 17 and the other guide member 17 are arranged in the Y-axis direction with a gap therebetween. The guide member 17 guides the substrate P in the X-axis direction. The conveyor belt 18 is annular. The conveyor belt 18 is an endless belt. One conveyor belt 18 and the other conveyor belt 18 are arranged in the Y-axis direction with a gap therebetween. One conveyor belt 18 supports the +Y side end portion of the lower surface of the substrate P from below. The other conveyor belt 18 supports the -Y side end portion of the lower surface of the substrate P from below. The conveyor belt 18 is supported by a plurality of pulleys (not shown). At least one of the plurality of pulleys is a drive pulley that rotates by a conveyor motor. The drive pulley rotates by the rotational force generated by the conveyor motor while supporting the conveyor belt 18. When the drive pulley rotates, the conveyor belt 18 rotates. The substrate P is transferred in the X-axis direction by the rotation of the conveyor belt 18.

[0019] The component mounting device 1 includes a substrate holding device 19 that holds the substrate P transferred to the processing position Q2. The substrate holding device 19 includes a clamping mechanism that clamps both end portions of the substrate P in the Y-axis direction. The substrate holding device 19 fixes the substrate P at the processing position Q2. The support pin 5 supports the lower surface of the substrate P disposed at the processing position Q2. The support pin 5 supports the lower surface of the substrate P held by the substrate holding device 19.

[0020] The mounting head 6 has a nozzle 20 for holding components C. The mounting head 6 mounts the components C held by the nozzle 20 onto the upper surface of the substrate P held by the substrate holding device 19. The mounting head 6 holds the components C supplied from the component feeder 13 with the nozzle 20 and mounts them onto the upper surface of the substrate P.

[0021] The mounting head 6 is movable in the XY plane, including above the component feeder 13, above the storage member 16, and above the substrate P located at the processing position Q2. The mounting head 6 is movably supported by a support member 21. The support member 21 includes a column 21A supported on a base 2 and a beam 21B extending horizontally from the top of the column 21A. The support member 21 includes a mounting head moving device 22 that can move the mounting head 6 in the X-axis direction and the Y-axis direction, respectively. The mounting head moving device 22 includes an X-axis guide mechanism that guides the mounting head 6 in the X-axis direction, a Y-axis guide mechanism that guides the mounting head 6 in the Y-axis direction, an X-axis actuator that generates power to move the mounting head 6 in the X-axis direction, and a Y-axis actuator that generates power to move the mounting head 6 in the Y-axis direction.

[0022] The nozzle 20 holds component C in a releaseable manner. The nozzle 20 holds component C supplied from component feeder 13 at the opening 13A of component feeder 13. After holding component C supplied from component feeder 13, the nozzle 20 transports it to processing position Q2 and mounts it on the upper surface of substrate P. After component C is mounted on the upper surface of substrate P, the nozzle 20 releases component C.

[0023] The mounting head 6 supports the nozzle 20 so as to be movable in the Z-axis direction and the θZ direction. The mounting head 6 has a nozzle moving device 23 that can move the nozzle 20 in the Z-axis direction and the θZ direction, respectively. The nozzle moving device 23 includes a Z-axis actuator that generates power to move the nozzle 20 in the Z-axis direction and a θZ actuator that generates power to rotate the nozzle 20 in the θZ direction. The nozzle 20 is connected to a shaft 24. The nozzle moving device 23 moves the nozzle 20 in the Z-axis direction and the θZ direction by moving the shaft 24 in the Z-axis direction and the θZ direction.

[0024] In this embodiment, the nozzle 20 is movable in four directions: the X-axis direction, the Y-axis direction, the Z-axis direction, and the θZ direction, by the mounting head moving device 22 and the nozzle moving device 23. Alternatively, the nozzle 20 may be movable in six directions: the X-axis direction, the Y-axis direction, the Z-axis direction, the θX direction, the θY direction, and the θZ direction.

[0025] Figure 4 is a schematic side view showing a nozzle 20 according to an embodiment. In this embodiment, the nozzle 20 is a chuck nozzle that holds a part C by clamping it. The nozzle 20 has a nozzle body 25 and an arm 26 supported by the nozzle body 25. The arm 26 holds the part C in a releaseable manner. The arm 26 includes a fixed arm 26A and a movable arm 26B. The fixed arm 26A is fixed to the nozzle body 25. The movable arm 26B is rotatably supported by the nozzle body 25 via a support pin 27. The movable arm 26B is rotatable around the support pin 27 by the force of air supplied, for example, from an air supply source (not shown). The movable arm 26B is rotatable to approach the fixed arm 26A or to move away from the fixed arm 26A.

[0026] Arm 26 holds part C between a fixed arm 26A and a movable arm 26B. With part C positioned between the fixed arm 26A and the movable arm 26B, part C is held by arm 26 when the movable arm 26B rotates to approach the fixed arm 26A. When the movable arm 26B rotates to move away from the fixed arm 26A, part C held by arm 26 is released from arm 26.

[0027] Controller 8 outputs control commands for controlling the component mounting device 1. Controller 8 includes a computer. Controller 8 controls the supply of components C by the component supply device 3, the transport of the substrate P by the substrate transport device 4, the holding of the substrate P by the substrate holding device 19, the movement of the mounting head 6 in the X-axis and Y-axis directions, the movement of the nozzle 20 in the Z-axis and θZ directions, and the holding and release of components C by the nozzle 20.

[0028] [Support pin] Figure 5 is a side view showing a support pin 5 according to an embodiment. The support pin 5 supports the lower surface of the substrate P on which the component C is mounted. The support pin 5 supports the lower surface of the substrate P from below. The support pin 5 supports the lower surface of the substrate P located at processing position Q2. The support pin 5 supports the lower surface of the substrate P held by the substrate holding device 19. The support pin 5 supports the lower surface of the substrate P to suppress the deflection of the substrate P held by the substrate holding device 19. By supporting the substrate P from below with the support pin 5, the deflection of the substrate P located at processing position Q2 is suppressed.

[0029] The support pin 5 is long in the vertical direction. The support pin 5 has a base portion 51, a shaft portion 52 extending upward from the base portion 51, and a support portion 53 connected to the upper end of the shaft portion 52. The base portion 51 is cylindrical. The shaft portion 52 is cylindrical. The diameter of the base portion 51 is greater than the diameter of the shaft portion 52. The length of the shaft portion 52 is longer than the length of the base portion 51.

[0030] The base portion 51 includes the lower end of the support pin 5. The base portion 51 is installed on the upper surface of the base 2. The base portion 51 is supported by the base 2. The lower surface of the base portion 51 is in contact with the upper surface of the base 2. A magnet 54 is provided on the base portion 51. The magnet 54 is located inside the base portion 51. The base 2 is made of metal. The magnet 54 generates a magnetic force to fix the support pin 5 and the base 2. The magnetic force generated by the magnet 54 fixes the base portion 51 and the base 2.

[0031] The support portion 53 includes the upper end of the support pin 5. The support portion 53 supports the lower surface of the substrate P on which the component C is mounted. The support portion 53 is in contact with the lower surface of the substrate P. The support portion 53 has a support surface that is in contact with the lower surface of the substrate P. The support surface of the support portion 53 includes the upper end surface of the support portion 53.

[0032] In one embodiment, the support pin 5 has a wireless tag 55. The wireless tag 55 stores identification data for identifying the type of support pin 5. The type of support pin 5 includes the type of support portion 53. The wireless tag 55 stores identification data for identifying the type of support portion 53. The type of support pin 5 includes the type of support portion 53. The type of support portion 53 includes either or both the shape and material of the support portion 53.

[0033] An example of a wireless tag 55 is an RFID (Radio Frequency Identification) tag. The wireless tag 55 is attached to the outer surface of the support pin 5. In this embodiment, the wireless tag 55 is attached to the side of the base portion 51. The tag reader 7 reads the wireless tag 55. The tag reader 7 reads the identification data stored in the wireless tag 55 wirelessly using radio waves. The tag reader 7 reads the identification data of the wireless tag 55 and identifies the type of support pin 5.

[0034] Figure 6 is a diagram illustrating the types of support pins 5 according to the embodiment. Multiple types of support pins 5 are used in the component mounting apparatus 1. A single substrate P is supported by multiple types of support pins 5.

[0035] The type of support pin 5 includes the type of support portion 53. The type of support portion 53 includes either or both of the shape and material of the support portion 53. The support portion 53 has a support surface that contacts the lower surface of the substrate P. The shape of the support portion 53 includes the area of ​​the support surface of the support portion 53. The shape of the support portion 53 includes the contact area with the lower surface of the substrate P. The material of the support portion 53 includes the hardness or strength of the support portion 53.

[0036] Examples of materials for the support portion 53 include metal, synthetic resin, and rubber. Examples of metals include iron, aluminum, and stainless steel.

[0037] Figure 6 shows four types of support pins 5: a first type support pin 5A, a second type support pin 5B, a third type support pin 5C, and a fourth type support pin 5D. Support pin 5A has a first type support portion 53A. Support pin 5B has a second type support portion 53B. Support pin 5C has a third type support portion 53C. Support pin 5D has a fourth type support portion 53D.

[0038] In the example shown in Figure 6, the area of ​​the support surface of support part 53B is smaller than the area of ​​the support surface of support part 53A. The area of ​​the support surface of support part 53C is larger than the area of ​​the support surface of support part 53A. The material of support part 53A, support part 53B, and support part 53C is iron. The material of support part 53D is rubber. The material of support part 53D may be synthetic resin. Support part 53D may be a porous member made of synthetic resin or a sponge. The hardness of support part 53D is lower than the hardness of support parts 53A, support part 53B, and support part 53C.

[0039] The wireless tag 55 has pre-stored identification data indicating the type of support part 53. The wireless tag 55A attached to support pin 5A has stored identification data indicating the type of support part 53A. The wireless tag 55B attached to support pin 5B has stored identification data indicating the type of support part 53B. The wireless tag 55C attached to support pin 5C has stored identification data indicating the type of support part 53C. The wireless tag 55D attached to support pin 5D has stored identification data indicating the type of support part 53D.

[0040] The tag reader 7 can identify that the support pin 5 to which wireless tag 55A is attached is a first-type support pin 5A by reading the identification data stored in wireless tag 55A. The tag reader 7 can identify that the support pin 5 to which wireless tag 55B is attached is a second-type support pin 5B by reading the identification data stored in wireless tag 55B. The tag reader 7 can identify that the support pin 5 to which wireless tag 55C is attached is a third-type support pin 5C by reading the identification data stored in wireless tag 55C. The tag reader 7 can identify that the support pin 5 to which wireless tag 55D is attached is a fourth-type support pin 5D by reading the identification data stored in wireless tag 55D.

[0041] [Housing components] Figure 7 is a schematic perspective view showing a housing member 16 for support pins 5 according to an embodiment. The housing member 16 holds a plurality of support pins 5. The plurality of support pins 5 are housed in the housing member 16.

[0042] As described above, the housing member 16 is mounted on the feeder bank 11. The external shape of the housing member 16 is the same as at least a part of the external shape of the parts feeder 13. The housing member 16 has a body portion 28 located on the -Y side of the feeder bank 11, a handle portion 29 located on the upper part of the body portion 28, and a housing portion 30 located on the +Z side of the feeder bank 11. The housing portion 30 has housing holes 31 into which the support pins 5 are inserted. Multiple housing holes 31 are provided in the Y-axis direction. The multiple housing holes 31 are provided at equal intervals in the Y-axis direction. In this embodiment, 20 housing holes 31 are provided in the Y-axis direction. One support pin 5 is inserted into one housing hole 31. 20 support pins 5 are housed in the housing portion 30.

[0043] The housing hole 31 is provided so as to be recessed downward from the upper surface of the housing portion 30. The support pin 5 is inserted into the housing hole 31 through the opening at the upper end of the housing hole 31. The lower part of the base portion 51 and the shaft portion 52 are positioned inside the housing hole 31. The upper part of the support portion 53 and the shaft portion 52 are positioned outside the housing hole 31.

[0044] The housing member 16 accommodates multiple types of support pins 5 that support the lower surface of the circuit board P. The housing member 16 accommodates multiple types of support pins 5 for supporting one circuit board P. Each of the multiple housing holes 31 is assigned a number (address). The number of the housing hole 31 and the type of support pin 5 housed in that housing hole 31 are pre-associated. Address data showing the relationship between the number of the housing hole 31 and the type of support pin 5 housed in that housing hole 31 is pre-stored in the controller 8.

[0045] [Method for transporting support pins] Figure 8 is a diagram illustrating a method for transporting support pins 5 according to an embodiment. In this embodiment, the support pins 5 housed in the housing member 16 are transported from the housing member 16 to the base 2 by the mounting head 6. The mounting head 6 can unload at least one support pin 5 from the housing member 16. The mounting head 6 can then install the unloaded support pin 5 onto the upper surface of the base 2.

[0046] When removing the support pin 5 from the housing member 16, the mounting head 6 moves above the housing member 16, and then the nozzle 20 holds the upper part of the support pin 5. As the nozzle 20, holding the upper part of the support pin 5, moves upward, the support pin 5 is pulled out from the housing hole 31. After the support pin 5 is pulled out from the housing hole 31, the mounting head 6 moves above the base 2. After the mounting head 6 moves above the base 2, the nozzle 20, still holding the support pin 5, moves downward, thereby installing the support pin 5 on the upper surface of the base 2. After the support pin 5 is installed on the base 2, the nozzle 20 releases the support pin 5.

[0047] In this embodiment, the wireless tag 55 attached to the support pin 5 is read by the tag reader 7 before the support pin 5, which has been discharged from the housing member 16, is transported to the base 2. The tag reader 7 reads the wireless tag 55 attached to the support pin 5 as it is discharged from the housing member 16. The tag reader 7 is positioned in the transport path of the support pin 5 from the housing member 16 to the base 2. The tag reader 7 can read the wireless tag 55 attached to the lower part of the support pin 5 while the upper part of the support pin 5 is held by the nozzle 20.

[0048] The read data, which indicates the reading result of the tag reader 7 reading the wireless tag 55, is transmitted to the controller 8. Based on the read data of the wireless tag 55, the controller 8 determines whether the type of support pin 5 ejected from the housing member 16 is the specified type.

[0049] If the controller 8 determines that the type of support pin 5 is a specified type, it controls the mounting head 6 so that the support pin 5 is transported to a specified position on the upper surface of the base 2 capable of supporting the lower surface of the circuit board P. If the controller 8 determines that the type of support pin 5 is not a specified type, it does not transport the support pin 5 to the base 2. If the controller 8 determines that the type of support pin 5 is not a specified type, it controls the mounting head 6 so that the support pin 5 is returned to the housing member 16.

[0050] [Specified type and specified location] Figure 9 shows a support pin 5 that supports the lower surface of the substrate P according to the embodiment. Multiple support pins 5 are installed on the upper surface of the base 2. The support pins 5 are installed at positions facing the lower surface of the substrate P, which is located at the processing position Q2. The support pins 5 support the lower surface of the substrate P from below in order to suppress the bending of the substrate P. The support pins 5 support the lower surface of the substrate P, which is held by the substrate holding device 19 at the processing position Q2. With the support pins 5 supporting the lower surface of the substrate P, the mounting head 6 mounts components C onto the upper surface of the substrate P.

[0051] As shown in Figure 9, components C may already be mounted on the underside of the substrate P. When the underside of the substrate P on which components C are already mounted is supported by support pins 5, it is preferable to suppress contact between the support pins 5 and components C.

[0052] If the underside of the circuit board P is not supported at the correct position with the appropriate type of support pins 5, it may be difficult to adequately suppress the bending of the circuit board P. Furthermore, if components C are mounted on the underside of the circuit board P, if the underside of the circuit board P is not supported at the correct position with the appropriate type of support pins 5, the support pins 5 may come into contact with the components C.

[0053] In this embodiment, the type of support pins 5 that support the underside of the substrate P and the position where the support pins 5 are installed are predetermined and registered in the controller 8, so that the appropriate position on the underside of the substrate P is supported by the appropriate type of support pins 5. The designated type of support pins 5 refers to the type of support pins 5 predetermined so as to be able to properly support the substrate P. The designated position of the support pins 5 refers to the target position of the support pins 5 predetermined so as to be able to properly support the substrate P. The upper surface of the base 2 is substantially parallel to the XY plane. The designated position of the support pins 5 includes the X-axis coordinates and Y-axis coordinates on the upper surface of the base 2 where the support pins 5 should be installed. By installing the designated type of support pins 5 at the designated position on the upper surface of the base 2, contact between the components C mounted on the underside of the substrate P and the support pins 5 is suppressed, and the bending of the substrate P is suppressed.

[0054] For example, when supporting the first area Ar1 on the underside of the substrate P where the spacing between adjacent components C is standard, the first type of support pin 5A is specified as the support pin 5 supporting the first area Ar1. When supporting the second area Ar2 on the underside of the substrate P where the spacing between adjacent components C is smaller than the standard, the second type of support pin 5B is specified as the support pin 5 supporting the second area Ar2. When supporting the third area Ar3 on the underside of the substrate P where the spacing between adjacent components C is larger than the standard, the third type of support pin 5C is specified as the support pin 5 supporting the third area Ar3. When supporting the fourth area Ar4 on the underside of the substrate P near a component C that protrudes significantly from the underside of the substrate P, the fourth type of support pin 5D is specified as the support pin 5 supporting the fourth area Ar4.

[0055] The position of support pin 5A on the upper surface of the base 2 is designated as the first position Pr1 so that support pin 5A supports the first area Ar1 on the lower surface of the substrate P. The position of support pin 5B on the upper surface of the base 2 is designated as the second position Pr2 so that support pin 5B supports the second area Ar2 on the lower surface of the substrate P. The position of support pin 5C on the upper surface of the base 2 is designated as the third position Pr3 so that support pin 5C supports the third area Ar3 on the lower surface of the substrate P. The position of support pin 5D on the upper surface of the base 2 is designated as the fourth position Pr4 so that support pin 5D supports the fourth area Ar4 on the lower surface of the substrate P.

[0056] In other words, in the example shown in Figure 9, the designated type of support pin 5 supporting the first area Ar1 is the first type (support pin 5A), and its designated position is the first position Pr1. The designated type of support pin 5 supporting the second area Ar2 is the second type (support pin 5B), and its designated position is the second position Pr2. The designated type of support pin 5 supporting the third area Ar3 is the third type (support pin 5C), and its designated position is the third position Pr3. The designated type of support pin 5 supporting the fourth area Ar4 is the fourth type (support pin 5D), and its designated position is the fourth position Pr4.

[0057] For example, when installing a first type support pin 5A at a first position Pr1, the controller 8 moves the mounting head 6 above the housing hole 31 where the first type support pin 5A is housed, based on the address data of the housing member 16, and then holds the upper part of the first type support pin 5A with the nozzle 20. After the first type support pin 5A is held by the nozzle 20, the controller 8 controls the mounting head 6 so that the support pin 5A held by the nozzle 20 is positioned facing the tag reader 7. After the support pin 5A is positioned facing the tag reader 7, the tag reader 7 reads the identification data of the wireless tag 55 attached to the support pin 5A. The read data of the wireless tag 55 read by the tag reader 7 is transmitted to the controller 8. Based on the read data of the wireless tag 55, the controller 8 determines whether the type of support pin 5 ejected from the housing member 16 is the specified type, the first type.

[0058] If the controller 8 determines that the type of support pin 5 is a specified type (first type), it controls the mounting head 6 so that the support pin 5 is transported to a specified position (first position Pr1). If the controller 8 determines that the type of support pin 5 is not a specified type, it controls the mounting head 6 so that the support pin 5 is returned to the housing hole 31 of the housing member 16.

[0059] Note that the specified types and positions described with reference to Figure 9 are just examples. For example, the number of support pins 5 may be one, two, or three types, or five or more types. Furthermore, the number, position, and type of specified positions will be appropriately determined based on the position, number, and size of the components C mounted on the underside of the base 2, as well as the size and thickness of the circuit board P.

[0060] [controller] Figure 10 is a block diagram showing a component mounting apparatus 1 according to an embodiment. The controller 8 includes a computer. The controller 8 has a processor 8A such as a CPU (Central Processing Unit), a main memory 8B including non-volatile memory such as ROM (Read Only Memory) and volatile memory such as RAM (Random Access Memory), a storage 8C, and an interface 8D including input / output circuits and communication circuits. The functions of the controller 8 are stored in the storage 8C as a computer program. The processor 8A reads the computer program from the storage 8C, loads it into the main memory 8B, and executes processing according to the computer program. The computer program may be distributed to the controller 8 via a network.

[0061] The storage 8C has an address data storage unit 81 and a production data storage unit 82. The processor 8A has a determination unit 83 and a control unit 84. A tag reader 7 and an input device 41 are connected to the controller 8. The input device 41 generates input data when operated by an operator. The input data generated by the input device 41 is input to the controller 8. Examples of input devices 41 include a touch panel, a computer keyboard, buttons, and a mouse.

[0062] The address data storage unit 81 stores address data. As described above, each of the multiple housing holes 31 of the housing member 16 is assigned a number (address). The number of the housing hole 31 and the type of support pin 5 housed in that housing hole 31 are pre-associated. The address data shows the relationship between the number of the housing hole 31 and the type of support pin 5 housed in that housing hole 31. For example, when an operator houses a support pin 5 in a housing hole 31, the operator may operate the input device 41 to input address data to the controller 8. That is, the operator may input the type of support pin 5 housed in the housing hole 31 and the number (address) of the housing hole 31 in which the support pin 5 is housed to the controller 8.

[0063] The production data storage unit 82 stores production data indicating the operating conditions of the component mounting device 1. The production data includes data used for the mounting process of component C. The production data includes substrate data relating to the substrate P on which component C is mounted, and target position data indicating the target position of component C to be mounted on the substrate P. The substrate data includes the size, thickness, and flexibility of the substrate P. If component C is already mounted on the lower surface of the substrate P, the substrate data includes the position, number, and size of component C mounted on the lower surface of the substrate P. The production data includes the specified type and specified position of the support pins 5 that support the substrate P on which component C is mounted. In the embodiment, the production data defines the relationship between the substrate data relating to the substrate P on which component C is mounted and the specified type and specified position of the support pins 5 that support the substrate P. As explained with reference to Figure 9, if component C is already mounted on the lower surface of the substrate P, the specified type and specified position of the support pins 5 used to support the substrate P are predetermined based on the position, number, and size of component C mounted on the lower surface of the substrate P. Furthermore, the specified type and position of the support pins 5 used to support the substrate P are predetermined based on the size, thickness, and flexibility of the substrate P.

[0064] The determination unit 83 acquires the reading data of the wireless tag 55 read by the tag reader 7. Based on the reading data of the wireless tag 55, the determination unit 83 determines whether the type of support pin 5 discharged from the housing member 16 is the specified type. The determination unit 83 acquires production data from the production data storage unit 82 that defines the relationship between the substrate data related to the substrate P and the specified type and specified position of the support pin 5. Based on the reading data of the wireless tag 55 and the production data stored in the production data storage unit 82, the determination unit 83 determines whether the type of support pin 5 to be transported to the base 2 is the specified type.

[0065] The control unit 84 outputs control commands for controlling the components of the component mounting device 1. The control unit 84 outputs control commands for controlling the supply of components C by the component supply device 3, the transport of the substrate P by the substrate transport device 4, the holding of the substrate P by the substrate holding device 19, the movement of the mounting head 6 in the X-axis and Y-axis directions, the movement of the nozzle 20 in the Z-axis and θZ directions, and the holding and release of components C by the nozzle 20.

[0066] If the determination unit 83 determines that the type of support pin 5 is of a specified type, the control unit 84 controls the mounting head 6 so that the support pin 5 is transported to a specified position on the upper surface of the base 2. If the determination unit 83 determines that the type of support pin 5 is not of a specified type, the control unit 84 controls the mounting head 6 so that the support pin 5 is returned to the housing member 16.

[0067] [Component mounting method] Figure 11 is a flowchart illustrating a component mounting method according to an embodiment. The control unit 84 determines the support pins 5 to be used to support the substrate P based on production data. The control unit 84 controls the mounting head 6 so that the specified type of support pins 5 are discharged from the housing member 16. The control unit 84 discharges the support pins 5 from the housing holes 31 based on address data and production data (step S1).

[0068] The control unit 84 controls the mounting head 6 so that the support pins 5 ejected from the housing member 16 face the tag reader 7. After the support pins 5 are positioned to face the tag reader 7, the tag reader 7 reads the identification data of the wireless tag 55 attached to the support pins 5. The read data of the wireless tag 55 read by the tag reader 7 is transmitted to the controller 8. The determination unit 83 acquires the read data of the wireless tag 55 (step S2).

[0069] The determination unit 83 determines, based on the reading data from the wireless tag 55 and the production data, whether the type of support pin 5 discharged from the housing member 16 is a specified type (step S3).

[0070] In step S3, if it is determined that the type of support pin 5 is the specified type (step S3: Yes), the control unit 84 controls the mounting head 6 so that the support pin 5 is transported to the specified position. The control unit 84 controls the mounting head 6 so that the support pin 5 is placed in the specified position (step S4).

[0071] In step S3, if it is determined that the type of support pin 5 is the specified type (step S3: No), the control unit 84 controls the mounting head 6 so that the support pin 5 is transported to the housing member 16. The support pin 5 is returned to the housing hole 31 of the housing member 16 (step S5).

[0072] The determination unit 83 determines whether or not the support pins 5 have been installed at all designated positions (step S6). If it is determined in step S6 that the installation of the support pins 5 is not complete (step S6: No), the process returns to step S1. If it is determined in step S6 that the installation of the support pins 5 is complete (step S6: Yes), the control unit 84 controls the substrate transport device 4 so that the substrate P is transported from the input position Q1 to the processing position Q2 (step S7).

[0073] After the substrate P is loaded into the processing position Q2, the control unit 84 controls the substrate holding device 19 so that the substrate P is held in the processing position Q2. The substrate P is supported by a plurality of support pins 5. After the substrate P is held in the substrate holding device 19, the control unit 84 controls the mounting head 6 so that components C are mounted on the substrate P (step S8).

[0074] [effect] As described above, according to the embodiment, a wireless tag 55 storing identification data for identifying the type of support pin 5 is attached to the support pin 5. The wireless tag 55 is read by the tag reader 7. The controller 8 can confirm whether the correct support pin 5 is being used based on the data read from the wireless tag 55.

[0075] In this embodiment, multiple types of support pins 5 are housed in the housing member 16. The support pins 5 housed in the housing member 16 are managed by address data. Based on the address data and production data, the controller 8 retrieves the support pin 5 to be installed at a designated position from the multiple support pins 5 housed in the housing member 16. Even if there is an error in the address data, the controller 8 can confirm whether the support pin 5 retrieved from the housing member 16 is the support pin 5 to be installed at the designated position, based on the data read from the wireless tag 55. As described above, when an operator houses the support pins 5 in the housing holes 31, there is a possibility that the support pins 5 may be mistakenly housed in the housing holes 31 due to human error. For example, when a first type of support pin 5A should be housed in a first numbered housing hole 31, a second type of support pin 5B may be mistakenly housed there. If the support pin 5 is retrieved from the first numbered housing hole 31 based on the address data in order to retrieve the first type of support pin 5A, the second type of support pin 5B will be mistakenly retrieved. Even if the wrong support pin 5 is ejected from the housing member 16 based on the address data, the controller 8 can verify whether the correct support pin 5 has been ejected by reading the wireless tag 55 with the tag reader 7. By reading the wireless tag 55 with the tag reader 7, the transport of the wrong support pin 5 to the designated position is prevented.

[0076] The designated type and position of the support pins 5 are predetermined and stored in the production data storage unit 82 as production data. Therefore, the type of support pins 5 to be used and the target position for installing the support pins 5 are determined based on the board data.

[0077] [Other embodiments] In the above-described embodiment, the control unit 84 can count the number of uses of each of the multiple support pins 5 based on the data read from the wireless tag 55. For example, if a support pin 5 is ejected from the housing member 16 by the mounting head 6, passes through the tag reader 7, and is installed at a designated position, the control unit 84 counts the number of uses of that support pin 5 as 1. In other words, the control unit 84 can count the number of uses of the support pins 5 based on the data read from the wireless tag 55. If the number of uses exceeds a predetermined threshold, the control unit 84 may output a notification recommending maintenance of that support pin 5.

[0078] In the embodiment described above, identification data for identifying the type of support pin 5 is pre-stored in the wireless tag 55. Identification data for identifying the position on the base 2 where the support pin 5 should be installed may also be pre-stored in the wireless tag 55. [Explanation of symbols]

[0079] 1...Component mounting device, 2...Base, 3...Component supply device, 4...Board transport device, 5...Support pin, 5A...Support pin, 5B...Support pin, 5C...Support pin, 5D...Support pin, 6...Mounting head, 7...Tag reader, 8...Controller, 8A...Processor, 8B...Main memory, 8C...Storage, 8D...Interface, 9...Cart, 10...Reel holding mechanism, 11...Feeder bank, 12...Reel, 13...Component feeder, 13A...Opening, 14...Carrier tape, 15...Mounting slot, 16...Storage member, 17...Guide member, 18...Conveyor belt, 19...Board holding device, 20...Nozzle, 21...Support member, 21A...Support column, 21B...Beam, 22...Mounting head moving device, 23...Nozzle moving device, 24...Shaft, 25...Nozzle body , 26...arm, 26A...fixed arm, 26B...movable arm, 27...support pin, 28...body part, 29...handle part, 30...housing part, 31...housing hole, 41...input device, 51...base part, 52...shaft part, 53...support part, 53A...support part, 53B...support part, 53C...support part, 53D...support part, 54...magnet, 55...wireless tag, 55A...wireless tag, 55B...wireless tag, 55C...wireless tag, 55D...wireless tag, 81...address data storage unit, 82...production data storage unit, 83...determination unit, 84...control unit, Ar1...first area, Ar2...second area, Ar3...third area, Ar4...fourth area, C...part, P...circuit board, Pr1...first position, Pr2...second position, Pr3...third position, Pr4...fourth position, Q1...entrance position, Q2...processing position.

Claims

1. A support part that supports the lower surface of the circuit board on which components are mounted, The system includes a wireless tag that stores identification data for identifying the type of support part, Support pin.

2. The type of support portion includes either or both of the shape and material of the support portion. The support pin according to claim 1.

3. A mounting head for mounting components on the top surface of the circuit board, A housing member for housing multiple types of support pins that support the lower surface of the substrate, A transport device for discharging at least one support pin from the aforementioned housing member, A tag reader that reads a wireless tag attached to the support pin removed from the housing member and which stores identification data for identifying the type of support pin, The system includes a controller that determines, based on the read data of the wireless tag, whether the type of support pin discharged from the housing member is a specified type. Component mounting equipment.

4. The aforementioned controller, If it is determined that the type of support pin is the specified type, the transport device is controlled so that the support pin is transported to a specified position capable of supporting the lower surface of the substrate. The component mounting apparatus according to claim 3.

5. The aforementioned controller, Production data is obtained that defines the relationship between the substrate data relating to the said substrate, the specified type, and the specified position. Based on the read data and the production data, if it is determined that the type of support pin is the specified type, the transport device is controlled so that the support pin is transported to the specified position. The component mounting apparatus according to claim 4.

6. The aforementioned controller, If it is determined that the type of the support pin is not the specified type, the transport device is controlled so that the support pin is returned to the housing member. The component mounting apparatus according to claim 4.

7. The support pin has a support portion that supports the lower surface of the substrate, The type of support pin includes the type of support portion. The component mounting apparatus according to claim 3.

8. The type of support portion includes either or both of the shape and material of the support portion. The component mounting apparatus according to claim 7.

9. The system includes a feeder bank on which a parts feeder for supplying the aforementioned parts is mounted, The aforementioned housing member is attached to the feeder bank. The component mounting apparatus according to claim 3.

10. The process involves removing at least one support pin from the housing member, among the multiple types of support pins housed within the housing member. Reading a wireless tag attached to the support pin that has been removed from the housing member and which stores identification data for identifying the type of the support pin, Based on the data read from the wireless tag, it is determined whether the type of support pin discharged from the housing member is of a specified type. The lower surface of the circuit board is supported by the support pins that have been determined to be of the specified type, This includes mounting components on the upper surface of the substrate supported by the support pins, Component mounting method.

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