Multilayer electronic components

Abstract

We provide multilayer electronic components with excellent electrical properties. [Solution] The stacked electronic component includes an overlapping region RO containing first internal electrodes 121 and second internal electrodes 122 arranged alternately in the X direction with a dielectric layer 111 in between, a first margin region RM1 located between the overlapping region and a third surface where the second internal electrode is absent, and a second margin region RM2 located between the overlapping region and a fourth surface where the first internal electrode is absent, a main body 110 including first external electrodes 131 and second external electrodes 132 connected to the first internal electrode and second internal electrode, respectively, and first through electrodes 141 and second through electrodes 142 that penetrate the first margin region and second margin region, respectively and are connected to the first internal electrode and second internal electrode, respectively. If R1 is the ratio of the area of ​​the first through electrode to the area of ​​the first margin region, and R2 is the ratio of the area of ​​the second through electrode to the area of ​​the second margin region, then one or more of 3% ≤ R1 ≤ 7% and 3% ≤ R2 ≤ 7% are satisfied.

Description

[Technical Field]

[0001] This invention relates to a stacked electronic component. [Background technology]

[0002] Multi-Layered Ceramic Capacitors (MLCCs), a type of multilayer electronic component, are chip-type capacitors mounted on printed circuit boards of various electronic products such as LCDs (Liquid Crystal Displays) and PDPs (Plasma Display Panels), computers, smartphones, and mobile phones, playing the role of charging or discharging electricity. Due to their small size, guaranteed high capacitance, and ease of mounting, these multilayer ceramic capacitors can be used as components in a wide variety of electronic devices.

[0003] Recently, as the performance of electronic products equipped with MLCCs has improved, there has been a demand for higher capacitance and uniform capacitance of MLCCs. However, poor contact between the internal and external electrodes of an MLCC can lead to capacitance scattering and ESR scattering. One way to solve this problem is to create holes in the main body and place via electrodes that connect internal electrodes of the same polarity. [Prior art documents] [Patent Documents]

[0004] [Patent Document 1] Japanese Patent Publication No. 2004-281957 [Overview of the project] [Problems that the invention aims to solve]

[0005] One of the several objectives of the present invention is to provide a multilayer electronic component with excellent electrical properties.

[0006] However, the objectives of the present invention are not limited to those described above and can be more easily understood in the process of describing specific embodiments of the present invention. [Means for solving the problem]

[0007] A stacked electronic component according to one embodiment of the present invention includes a body comprising: first and second surfaces facing each other in a first direction; third and fourth surfaces connected to the first and second surfaces and facing each other in a second direction; fifth and sixth surfaces connected to the first, second, third, and fourth surfaces and facing each other in a third direction; an overlapping region including a dielectric layer and first and second internal electrodes alternately arranged in the first direction with the dielectric layer in between; a first margin region disposed between the overlapping region and the third surface where the second internal electrode is absent; and a second margin region disposed between the overlapping region and the fourth surface where the first internal electrode is absent. The body includes a first external electrode and a second external electrode, which are arranged on the third and fourth surfaces respectively and connected to the first internal electrode and the second internal electrode, respectively, and a first through electrode and a second through electrode, which penetrate the first margin region and the second margin region respectively and are connected to the first internal electrode and the second internal electrode, respectively, and in the cross-section of the body in the second and third directions, when R1 is the ratio of the area of ​​the first through electrode to the area of ​​the first margin region and R2 is the ratio of the area of ​​the second through electrode to the area of ​​the second margin region, one or more of 3% ≤ R1 ≤ 7% and 3% ≤ R2 ≤ 7% can be satisfied. [Effects of the Invention]

[0008] One of the various effects of the present invention is that it can provide a multilayer electronic component with excellent electrical characteristics. [Brief explanation of the drawing]

[0009] [Figure 1] This is a schematic perspective view of a stacked electronic component according to one embodiment of the present invention. [Figure 2] This is a schematic cross-sectional view showing a section along the line I-I' in Figure 1. [Figure 3] It is a cross-sectional view schematically showing a cross-section along the line II-II' of FIG. 1. [Figure 4] It is a cross-sectional view schematically showing a cross-section along the line III-III' of FIG. 2. [Figure 5] It is a cross-sectional view in which the internal electrodes and through electrodes are removed in FIG. 4, and schematically shows the area of the margin region. [Figure 6] It is a cross-sectional view in which the internal electrodes are removed in FIG. 4, and schematically shows the area of the through electrodes.

Embodiments for Carrying Out the Invention

[0010] Hereinafter, embodiments of the present invention will be described with reference to specific embodiments and the accompanying drawings. However, the embodiments of the present invention can be deformed into various other forms, and the scope of the present invention is not limited to the embodiments described below. Also, the embodiments of the present invention are provided to more fully explain the present invention to ordinary technicians. Therefore, the shape, size, etc. of the elements in the drawings can be exaggerated for clearer explanation, and the elements denoted by the same reference numerals in the drawings are the same elements.

[0011] And, in order to clearly explain the present invention in the drawings, parts not related to the explanation are omitted, and the sizes and thicknesses of each configuration shown in the drawings are arbitrarily shown for convenience of explanation, so the present invention is not necessarily limited to what is shown in the drawings. Note that components having the same function within the scope of the same concept are described using the same reference numerals. Furthermore, throughout the specification, when a certain part says that a certain component "includes", this means that other components can be further included, not excluding other components, unless otherwise stated to the contrary.

[0012] In the drawings, the first direction X can be defined as the thickness T direction, the second direction Y as the length L direction, and the third direction Z as the width W direction.

[0013] Multilayer electronic component Figure 1 is a schematic perspective view of a stacked electronic component according to one embodiment of the present invention; Figure 2 is a schematic cross-sectional view showing a cross section along line I-I' in Figure 1; Figure 3 is a schematic cross-sectional view showing a cross section along line II-II' in Figure 1; Figure 4 is a schematic cross-sectional view showing a cross section along line III-III' in Figure 2; Figure 5 is a cross-sectional view of Figure 4 with the internal electrodes and through electrodes removed, schematically showing the area of ​​the margin region; and Figure 6 is a cross-sectional view of Figure 4 with the internal electrodes removed, schematically showing the area of ​​the through electrodes.

[0014] Hereinafter, with reference to Figures 1 to 6, a multilayer electronic component 100 according to one embodiment of the present invention will be described in detail. Furthermore, a multilayer ceramic capacitor will be described as an example of a multilayer electronic component, but the present invention is not limited thereto and can be applied to a variety of multilayer electronic components, such as inductors, piezoelectric elements, varistors, or thermistors.

[0015] A stacked electronic component 100 according to one embodiment of the present invention may include a body 110 including a dielectric layer 111 and internal electrodes 121, 122, external electrodes 131, 132, and through electrodes 141, 142.

[0016] There are no particular restrictions on the specific shape of the main body 110, but as shown in the figure, the main body 110 can be a hexahedron or a similar shape. During the firing process, due to the shrinkage of the ceramic powder contained in the main body 110, or the polishing process on the corners of the main body 110, the main body 110 may not be a perfectly straight hexahedron, but may have a substantially hexahedron shape.

[0017] The main body 110 may have a first surface 1 and a second surface 2 facing each other in a first direction, a third surface 3 and a fourth surface 4 connected to the first surface 1 and the second surface 2 and facing each other in a second direction, a fifth surface 5 and a sixth surface 6 connected to the first surface 1, the second surface 2, the third surface 3 and the fourth surface 4 and facing each other in a third direction.

[0018] The main body 110 can include a dielectric layer 111 and internal electrodes 121 and 122 that are alternately arranged with the dielectric layer 111. The plurality of dielectric layers 111 forming the main body 110 are in a fired state, and the boundaries between adjacent dielectric layers 111 can be integrated to such an extent that they are difficult to confirm without using a scanning electron microscope (SEM).

[0019] The dielectric layer 111 can contain, for example, a perovskite-type compound represented by ABO3 as a main component. The perovskite-type compound represented by ABO3 is, for example, BaTiO3, (Ba

[0022] , y , , x , ,

[0020] , ,

[0021] , , 1-y , Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1), Ba(Ti 1-y Zr y )O3 (0 < y < 1) and (Ca 1-x Sr x )(Zr 1-y Ti y )O3 (0 ≦ x ≦ 0.5, 0 ≦ y ≦ 0.5), and can contain one or more of them.

[0020] The average thickness of the dielectric layer 111 is not particularly limited. The average thickness of the dielectric layer 111 can be, for example, 0.1 μm to 20 μm, 0.1 μm to 10 μm, 0.1 μm to 5 μm, 0.1 μm to 2 μm, or 0.1 μm to 0.4 μm.

[0021] The first internal electrode 121 and the second internal electrode 122 can be alternately arranged in the first direction X with the dielectric layer 111 interposed therebetween. That is, the first internal electrode 121 and the second internal electrode 122, which are a pair of electrodes having different polarities, may be arranged so as to face each other with the dielectric layer 111 interposed therebetween. The first internal electrode 121 and the second internal electrode 122 can be electrically separated from each other by the dielectric layer 111 disposed therebetween.

[0022] The first internal electrode 121 is positioned at a distance from the fourth surface 4 and can be connected to the first external electrode 131 on the third surface 3. The second internal electrode 122 is positioned at a distance from the third surface 3 and can be connected to the second external electrode 132 on the fourth surface 4.

[0023] The conductive metal contained in the internal electrodes 121 and 122 may be one or more of Ni, Cu, Pd, Ag, Au, Pt, Sn, W, Ti, and alloys thereof, and may more preferably contain Ni, but the present invention is not limited thereto.

[0024] The average thickness of the internal electrodes 121 and 122 is not particularly limited. The average thickness of the internal electrodes 121 and 122 may be, for example, 0.1 μm to 10.0 μm, 0.1 μm to 3.0 μm, 0.1 μm to 1.0 μm, or 0.1 μm to 0.4 μm.

[0025] The average thickness of the dielectric layer 111 and the average thickness of the internal electrodes 121 and 122 refer to the average thickness of the dielectric layer 111 and the internal electrodes 121 and 122 in the first direction X, respectively. The average thickness of the dielectric layer 111 and the average thickness of the internal electrodes 121 and 122 can be measured by scanning the cross-sections of the main body 110 in the first and second directions with a scanning electron microscope (SEM) at 10,000x magnification. More specifically, the average thickness of the dielectric layer 111 can be measured by taking the average value after measuring the thickness at multiple points on one dielectric layer 111, for example, at five points equally spaced in the second direction. Similarly, the average thickness of the internal electrodes 121 and 122 can be measured by taking the average value after measuring the thickness at multiple points on one internal electrode 121 or 122, for example, at five points equally spaced in the second direction. The above 10 equally spaced points can be specified by an overlapping region RO. If such average values ​​are measured for 10 dielectric layers 111 and 10 internal electrodes 121 and 122, and then the average values ​​are measured again, the average thickness of the dielectric layer 111 and the average thickness of the internal electrodes 121 and 122 can be further generalized.

[0026] The main body 110 may include an overlapping region RO located inside the main body 110, in which capacitance is formed by a dielectric layer 111 and first internal electrodes 121 and second internal electrodes 122 arranged alternately in a first direction with the dielectric layer in between; a first margin region RM1 located between the overlapping region RO and the third surface 3, in which the second internal electrode 122 is absent; and a second margin region RM2 located between the overlapping region RO and the fourth surface 4, in which the first internal electrode 121 is absent. That is, margin regions RM1 and RM2 can be located on both sides of the overlapping region RO facing the second direction Y.

[0027] The first internal electrode 121 may include a first main portion 121a positioned in the overlapping region RO and overlapping with the second internal electrode 122 in the first direction X, and a first lead portion 121b positioned in the first margin region RM1 and extending from the first main portion 121a and exposed on the third surface 3. That is, the first margin region RM1 can mean a region in which multiple first lead portions 121b overlap in the first direction X without sandwiching the second internal electrode 122.

[0028] The second internal electrode 122 may include a second main portion 122a positioned in the overlapping region RO and overlapping with the first internal electrode 121 in the first direction X, and a second lead portion 122b positioned in the second margin region RM2 and extending from the second main portion 122a and exposed on the fourth surface 4. That is, the second margin region RM2 can mean a region in which multiple second lead portions 122b overlap in the first direction X without sandwiching the first internal electrode 121.

[0029] On the other hand, although the drawings show that the width of the lead portions 121b and 122b in the third direction Z is the same as the width of the main portions 121a and 122a in the third direction Z, the present invention is not limited thereto. For example, the width of the lead portions 121b and 122b in the third direction Z may be larger or smaller than the width of the main portions 121a and 122a in the third direction Z. Also, the width of the lead portions 121b and 122b in the third direction Z may gradually increase or decrease as you move from the main portions 121a and 122a toward the third surface 3 or the fourth surface 4.

[0030] The main body 110 may include a first cover portion 112 and a second cover portion 113 arranged on opposite sides of the overlapping region RO facing each other in the first direction X. The first cover portion 112 can be arranged continuously on one surface of the overlapping region RO in the first direction X, one surface of the first margin region RM1 in the first direction X, and one surface of the second margin region RM2 in the first direction X. The second cover portion 113 can be arranged continuously on the other surface of the overlapping region RO in the first direction X, the other surface of the first margin region RM1 in the first direction X, and the other surface of the second margin region RM2 in the first direction X. The cover portions 112 and 113 may have a configuration similar to the dielectric layer 111, except that they do not include internal electrodes.

[0031] The average thickness of the cover portions 112 and 113 is not particularly limited. The average thickness of the cover portions 112 and 113 may be, for example, 300 μm or less, 100 μm or less, 30 μm or less, or 20 μm or less. The average thickness of the cover portions 112 and 113 may be, for example, 5 μm or more, 10 μm or more, or 20 μm or more. Here, the average thickness of the cover portions 112 and 113 refers to the average thickness of the first cover portion 112 and the second cover portion 113, respectively.

[0032] The average thickness of the cover portions 112 and 113 can refer to the average thickness of the cover portions 112 and 113 in the first direction X, and can be the average value of the thickness in the first direction X measured at five equally spaced points in the cross-section of the main body 110 in the first and second directions.

[0033] The main body 110 may include a first side portion 114 and a second side portion 115, respectively, arranged on both sides facing the third direction of the overlapping region RO. The first side portion 114 can be continuously arranged on one surface of the overlapping region RO in the third direction, one surface of the first margin region RM1 in the third direction, and one surface of the second margin region RM2 in the third direction. The second side portion 115 can be continuously arranged on the other surface of the overlapping region RO in the third direction, the other surface of the first margin region RM1 in the third direction, and the other surface of the second margin region RM2 in the third direction. That is, the side portions 114 and 115 can represent the regions between both ends of the internal electrodes 121 and 122 and the interface of the main body 110 in cross-sections obtained by cutting the main body 110 in the first and third directions. The side portions 114 and 115 may have a configuration similar to the dielectric layer 111, except that they do not include the internal electrodes 121 and 122.

[0034] The average thickness of the side portions 114 and 115 is not particularly limited. The average thickness of the side portions 114 and 115 may be, for example, 100 μm or less, 20 μm or less, or 15 μm or less. The average thickness of the side portions 114 and 115 may be, for example, 5 μm or more, or 10 μm or more. Here, the average thickness of the side portions 114 and 115 refers to the average thickness of the first side portion 114 and the second side portion 115, respectively.

[0035] The average thickness of the side portions 114 and 115 can represent the average thickness of the side portions 114 and 115 in the third direction Z, and can be the average value of the thickness in the third direction Z measured at five equally spaced points in the cross-section of the main body 110 in the first and third directions.

[0036] The external electrodes 131 and 132 may be arranged on the third surface 3 and the fourth surface 4. For example, the first external electrode 131 can be arranged on the third surface 3 and connected to the first internal electrode 121, and the second external electrode 132 can be arranged on the fourth surface 4 and connected to the second internal electrode 122. The first external electrode 131 can be arranged extending from the third surface 3 onto the first surface 1 and the second surface 2, and the second external electrode 132 can be arranged extending from the fourth surface 4 onto the first surface 1 and the second surface 2. In addition, the first external electrode 131 and the second external electrode 132 can be arranged extending onto the fifth surface 5 and the sixth surface 6.

[0037] The type and form of the external electrodes 131 and 132 are not particularly limited and may have a multilayer structure. For example, the external electrodes 131 and 132 may include a base electrode layer that contacts the internal electrodes 121 and 122 and a plating layer disposed on the base electrode layer.

[0038] The above-mentioned base electrode layer may be a fired electrode layer containing metal and glass. The metal contained in the fired electrode layer may include, for example, Cu, Ni, Pd, Pt, Au, Ag, Pb and / or alloys containing these. The glass contained in the fired electrode layer may include, for example, one or more oxides of Ba, Ca, Zn, Al, B and Si. However, the present invention is not limited thereto.

[0039] The above-mentioned base electrode layer may consist only of a fired electrode layer containing metal and glass, but the present invention is not limited thereto, and the base electrode layer may have a multilayer structure. For example, the base electrode layer may include a fired electrode layer containing metal and glass, and a resin electrode layer disposed on the fired electrode layer and containing metal particles and resin.

[0040] The metal particles contained in the resin electrode layer may include one or more spherical particles and flake-shaped particles. The metal particles contained in the resin electrode layer may include, for example, Cu, Ni, Pd, Pt, Au, Ag, Pb, Sn and / or alloys containing these. The resin contained in the resin electrode layer may include, for example, one or more epoxy resin, acrylic resin, and ethylcellulose.

[0041] The above-mentioned plating layer may include, for example, Ni, Sn, Pd, and / or alloys containing these, and may be formed in multiple layers. The above-mentioned plating layer may be, for example, a Ni plating layer or a Sn plating layer, or a Ni plating layer and a Sn plating layer may be formed sequentially. Furthermore, the above-mentioned plating layer may include multiple Ni plating layers and / or multiple Sn plating layers.

[0042] The drawings illustrate a structure in which the stacked electronic component 100 has two external electrodes 131 and 132, but it is not limited to this, and the number and shape of the external electrodes 131 and 132 can be changed according to the form of the internal electrodes 121 and 122 or other purposes.

[0043] The stacked electronic component 100 may include a first through-electrode 141 that penetrates a first margin region RM1 and is connected to a first internal electrode 121, and a second through-electrode 142 that penetrates a second margin region RM2 and is connected to a second internal electrode 122.

[0044] The first through electrode 141 can be connected to a plurality of first lead portions 121b and positioned apart from the second internal electrode 122, and the second through electrode 142 can be connected to a plurality of second lead portions 122b and positioned apart from the first internal electrode 121.

[0045] The through electrodes 141 and 142 can stably connect multiple internal electrodes 121 and 122. That is, even if some internal electrodes 121 and 122 do not come into contact with the external electrodes 131 and 132 on the third surface 3 or fourth surface 4 due to shrinkage or poor polishing during the firing process, these internal electrodes 121 and 122 can be electrically connected to the external electrodes 131 and 132 via the through electrodes 141 and 142 and internal electrodes 121 and 122 in other layers. This improves the capacitance and ESR characteristics of the multilayer electronic component 100.

[0046] The through electrodes 141 and 142 do not necessarily need to be in contact with the external electrodes 131 and 132. However, in order to ensure a more stable electrical connection between the internal electrodes 121 and 122 and the external electrodes 131 and 132, the first through electrode 141 can be exposed on the first surface 1 and the second surface 2 and connected to the first external electrode 131, and the second through electrode 142 can be exposed on the first surface 1 and the second surface 2 and connected to the second external electrode 132.

[0047] According to one embodiment, in the cross-section of the main body 110 in the second direction Y and the third direction Z, when R1 is the ratio of the area of ​​the first through electrode 141 to the area of ​​the first margin region RM1 and R2 is the ratio of the area of ​​the second through electrode 142 to the area of ​​the second margin region RM2, one or more of 3% ≤ R1 ≤ 7% and 3% ≤ R2 ≤ 7% can be satisfied. More preferably, both 3% ≤ R1 ≤ 7% and 3% ≤ R2 ≤ 7% can be satisfied.

[0048] If R1 and / or R2 are less than 3%, the improvement in capacitance and ESR characteristics by the through electrodes 141 and 142 may be minimal. On the other hand, forming the through electrodes 141 and 142 requires drilling holes in the main body 110, but there is a risk of cracks occurring in the main body 110 during the drilling process. In particular, if R1 and / or R2 exceed 7%, the negative effect of cracks occurring in the main body 110 may become significantly apparent.

[0049] The number of through electrodes 141 and 142 is not particularly limited, but multiple first through electrodes 141 and multiple second through electrodes 142 may be arranged. For example, three or more first through electrodes 141 and multiple second through electrodes 142 may be arranged. Multiple first through electrodes 141 may be arranged, for example, in a third direction Z, and multiple second through electrodes 142 may be arranged, for example, in a third direction Z. In this case, the area of ​​the first through electrode 141 can be the total area of ​​multiple first through electrodes 141, and the area of ​​the second through electrode 142 can be the total area of ​​multiple second through electrodes 142.

[0050] Specifically, referring to Figures 5 and 6, R1 can represent the total area TM1 of the multiple first through electrodes relative to the area AM1 of the first margin region, and R2 can represent the total area TM2 of the multiple second through electrodes relative to the second margin region AM2.

[0051] R1 and R2 can be measured, for example, by analyzing images taken with an optical microscope of the cross-sections of the main body 110 in the second direction Y and the third direction Z. The overlapping region RO and the margin regions RM1 and RM2 can be distinguished by the difference in brightness within the image taken with the optical microscope, and the regions within the margin regions RM1 and RM2 in which the through electrodes 141 and 142 are located and the regions in which they are not located can also be distinguished by the difference in brightness. The cross-sections of the main body 110 in the second direction Y and the third direction Z can be any cross-section that passes through the overlapping region RO, but for example, the cross-sections of the main body 110 in the second direction Y and the third direction Z that have been polished up to the center of the first direction X may also be used.

[0052] In one embodiment, when the length of the first margin region RM1 in the second direction Y is L1, and the distance in the second direction Y between the third surface 3 and the first through electrode 141 is L1a, the ratio of L1a to L1 (L1a / L1) may be 5% or more. If L1a / L1 is less than 5%, the first through electrode 141 and the third surface 3, which is the surface of the main body 110, are too close together, and there is a risk of cracks occurring. There is no particular upper limit to L1a / L1, but if the first through electrode 141 and the second internal electrode 122 are too close together, there is a risk of short circuit. Therefore, it is preferable that L1a / L1 be 50% or less.

[0053] In one embodiment, when L1b is the distance in the second direction Y between the overlapping region RO and the first through electrode 141, the ratio of L1b to L1 (L1b / L1) may be 5% or more. If L1b / L1 is less than 5%, the first through electrode 141 and the second internal electrode 122 may be too close, potentially causing a short circuit. There is no particular upper limit to L1b / L1, but if the first through electrode 141 and the third surface 3 are too close, cracks may occur. Therefore, it is preferable that L1b / L1 be 45% or less.

[0054] In one embodiment, when the diameter of the first through electrode 141 is D1, D1 may be 5 μm or more. If D1 is less than 5 μm, the improvement effect of the first through electrode 141 on capacitance and ESR characteristics may be slight. The upper limit of D1 is not particularly limited and may be, for example, 0.9 × L1 or less. Alternatively, in order to prevent the occurrence of cracks, D1 may be 0.5 × L1 or less.

[0055] In one embodiment, when the distance between a plurality of first through electrodes 141 is D2, the ratio of D2 to D1 (D2 / D1) may be 1.2 or greater. If D2 / D1 is less than 1.2, the distance between the first through electrodes 141 is too close, and there is a risk of cracks occurring between the holes. There is no particular upper limit to D2 / D1, but for example, it may be 2.5 or less. If D2 / D1 exceeds 2.5, the improvement effect of the capacitance and ESR characteristics by the through electrodes 141 and 142 may be slight.

[0056] On the other hand, the only difference is that the first through electrode 141 is connected to the first internal electrode 121 and the second through electrode 142 is connected to the second internal electrode 122, but the first through electrode 141 and the second through electrode 142 may be substantially symmetrical to each other. Therefore, the explanations for L1a / L1, L1b / L1, D1, and D2 / D1 above can be similarly applied to the second margin region RM2 and the second through electrode 142.

[0057] The shape of the through electrodes 141 and 142 is not particularly limited, but the cross-sections of the through electrodes 141 and 142 may be circular, triangular, or square. However, in order to prevent the occurrence of cracks, the cross-sections of the through electrodes 141 and 142 are preferably triangular rather than square, and more preferably circular. That is, in one embodiment, the cross-sections of the first through electrode 141 and the second through electrode 142 in the cross-sections of the main body 110 in the second direction Y and the third direction Z may be circular.

[0058] The following describes an example of a method for forming a stacked electronic component 100. However, the manufacturing method of the stacked electronic component 100 is not limited to this example.

[0059] First, prepare the ceramic powder for forming the dielectric layer 111. The ceramic powder may be, for example, BaTiO3, (Ba 1-x Ca x )TiO3(0 <x<1)、Ba(Ti 1-y Ca y )O3(0 <y<1)、(Ba 1-xCa x )(Ti 1-y Zr y )O3(0 < x < 1, 0 < y < 1), Ba(Ti 1-y Zr y )O3(0 < y < 1) or (Ca 1-x Sr x )(Zr 1-y Ti y )O3(0 ≤ x ≤ 0.5, 0 ≤ y ≤ 0.5) can be included. BaTiO3 powder can be synthesized, for example, by reacting a titanium raw material such as titanium dioxide with a barium raw material such as barium carbonate. As the method for synthesizing the ceramic powder, for example, there are a solid-phase method, a sol-gel method, a hydrothermal synthesis method, etc., but the present invention is not limited thereto. Next, after drying and pulverizing the prepared ceramic powder, an organic solvent such as ethanol and a binder such as polyvinyl butyral are mixed to produce a ceramic slurry, and the ceramic slurry is applied and dried on a carrier film to provide a ceramic green sheet.

[0060] Next, an internal electrode conductive paste containing a metal powder, a binder, an organic solvent, etc. with a predetermined thickness is printed on the ceramic green sheet using a screen printing method, a gravure printing method, etc. to form an internal electrode pattern.

[0061] After that, the ceramic green sheet printed with the internal electrode pattern is peeled off from the carrier film, and then the ceramic green sheets printed with the internal electrode pattern are laminated and pressure-bonded by a predetermined number of layers to form a ceramic laminate. On the upper and lower parts of the ceramic laminate, in order to form the cover parts 112 and 113 after firing, ceramic green sheets without an internal electrode pattern can be laminated by a predetermined number of layers. Then, the ceramic laminate is cut to have a predetermined chip size, and the cut chip can be fired at a temperature of 1000 °C or higher and 1400 °C or lower to form the main body 110.

[0062] On the other hand, the side portions 114 and 115 may be formed by applying a conductive paste for internal electrodes to the ceramic green sheet, except for the areas where the side portions 114 and 115 are formed, and then firing it. Alternatively, in order to suppress the step caused by the internal electrodes 121 and 122, the ceramic laminate can be cut so that the internal electrode pattern is exposed on both sides of the cut chip in the third direction, then the side portion forming sheet can be attached to both sides of the cut chip in the third direction, and then fired to form the side portions 114 and 115.

[0063] Next, holes are drilled into the main body 110. These holes can be formed by mechanical drilling or by irradiating the main body 110 with a CO2 laser, but the present invention is not limited to these methods. Subsequently, through electrodes 141 and 142 can be formed by filling the formed holes with conductive paste.

[0064] Subsequently, external electrodes 131 and 132 can be formed on the main body 110 on which through electrodes 141 and 142 are formed. The method for forming the external electrodes 131 and 132 is not particularly limited.

[0065] For example, if the external electrodes 131 and 132 include a fired electrode layer, the main body 110 can be dipped in an external electrode paste containing metal powder, glass frit, binder, and organic solvent, and then the external electrode paste can be fired at a temperature of 500°C to 900°C to form a fired electrode.

[0066] For example, if the external electrodes 131 and 132 include a resin electrode layer, the main body can be dipped in a conductive resin composition containing metal powder, resin, binder, and organic solvent, and then cured at a temperature of 250°C to 550°C to form the resin electrode layer.

[0067] Furthermore, an electrolytic plating method and / or an electroless plating method may be further used to form a plating layer on the above-mentioned fired electrode layer or resin electrode layer.

[0068] Experimental example Using the manufacturing method for the multilayer electronic component described above, a sample chip of size 1005 (length: approximately 1.0 mm, width: approximately 0.5 mm, thickness: approximately 0.5 mm) was prepared, and its electrical characteristics were evaluated using R1 and R2. R1 and R2 were measured by observing images of the cross-sections in the second and third directions, which were polished to half their length in the first direction, using an optical microscope. Sample number 1 was a sample chip without through electrodes.

[0069] For volume evaluation, a total of 10 sample tips for each sample number were measured using a volume meter, and the average volume for each sample number was measured. The relative values ​​were then expressed as percentages based on the target volume value of 15 μF and are listed in Table 1 below.

[0070] ESR was measured using an LCR meter (frequency: 500 kHz, SMD Fixture type probe). After measuring the ESR of a total of 10 sample tips for each sample number, the average value was recorded in Table 1 below.

[0071] Crack evaluation was performed by measuring the cross-sections of a total of 10 sample chips for each sample number using an optical microscope. If no sample chips showed cracks, it was evaluated as "Excellent (○)", if three or fewer sample chips showed cracks, it was evaluated as "Good (△)", and if more than three sample chips showed cracks, it was evaluated as "Poor (X)". The results are shown in Table 1 below.

[0072] The final evaluation was based on all characteristics being considered and categorized as Excellent (VG), Good (G), or Poor (B), as shown in Table 1 below.

[0073] [Table 1]

[0074] The volume values ​​of sample numbers 1 and 2 are around 60% of the target volume value, and it can be confirmed that when R1 (R2) is 3% or higher, the volume value increases sharply to 90% or higher of the target volume value. The volume characteristics improve as R1 (R2) increases from 3% to 7%, but it can be confirmed that the volume value converges once R1 (R2) exceeds 7%.

[0075] The ESR values ​​for sample numbers 1 and 2 are around 6 mΩ, and it can be confirmed that when R1 (R2) is 3% or higher, the ESR drops sharply to around 3%. Furthermore, the ESR decreases as R1 (R2) increases from 3% to 7%, but it can be confirmed that the ESR value converges once R1 (R2) exceeds 7%.

[0076] On the other hand, no cracks occurred when R1(R2) was within the range of 1% to 5%, but it was confirmed that cracks occurred when R1(R2) was 7% or higher.

[0077] From this, it can be confirmed that when R1 and / or R2 are between 3% and 7%, the electrical characteristics and reliability of the multilayer electronic component are significantly improved.

[0078] The present invention is not limited by the embodiments described above or the accompanying drawings, but is limited by the claims provided herein. Therefore, within the scope of the technical idea of ​​the present invention as described in the claims, various forms of substitution, modification, and alteration are possible by persons with ordinary skill in the art, and these also fall within the scope of the present invention.

[0079] Furthermore, the expression "one embodiment" does not mean that each embodiment is the same as another, but is provided to highlight and explain the unique and distinct characteristics of each embodiment. However, the above-presented embodiments do not preclude their realization in combination with the features of other embodiments. For example, even if a matter described in one embodiment is not described in another embodiment, it can be understood as a description related to the other embodiment, unless there is a description in the other embodiment that contradicts or is contrary to that matter.

[0080] In this invention, "connected" includes not only direct connection but also indirect connection via an adhesive layer or the like. Furthermore, "electrically connected" includes both cases where they are physically connected and cases where they are not. In addition, expressions such as "first," "second," etc., are used to distinguish one component from another and do not limit the order and / or importance of the components. In some cases, within the scope of the rights, the first component may be named the second component, and similarly, the second component may be named the first component. [Explanation of Symbols]

[0081] 100: Stacked Electronic Components 110: Main unit RO: Overlapping Areas RM1, RM2: Margin area 111: Dielectric layer 112, 113: Cover section 114, 115: Side section 121, 122: Internal electrode 131, 132: External electrode 141, 142: Through electrode

Claims

1. It includes a first and second surface facing each other in a first direction, a third and fourth surface connected to the first and second surfaces and facing each other in a second direction, and a fifth and sixth surface connected to the first, second, third and fourth surfaces and facing each other in a third direction, A body comprising a dielectric layer, an overlapping region including first and second internal electrodes alternately arranged in the first direction with respect to the dielectric layer, a first margin region disposed between the overlapping region and a third surface where the second internal electrode is absent, and a second margin region disposed between the overlapping region and a fourth surface where the first internal electrode is absent, A first external electrode and a second external electrode are arranged on the third and fourth surfaces, respectively, and connected to the first internal electrode and the second internal electrode, respectively. It includes a first through electrode and a second through electrode that penetrate the first margin region and the second margin region, respectively, and are connected to the first internal electrode and the second internal electrode, respectively. In the cross-sections of the main body in the second and third directions, when R1 is the ratio of the area of ​​the first through electrode to the area of ​​the first margin region, and R2 is the ratio of the area of ​​the second through electrode to the area of ​​the second margin region, A multilayer electronic component that satisfies at least one of the following conditions: 3% ≤ R1 ≤ 7% and 3% ≤ R2 ≤ 7%.

2. Multiple instances of the first through electrode and the second through electrode are arranged. The area of ​​the first through electrode is the total area of ​​the plurality of first through electrodes. The stacked electronic component according to claim 1, wherein the area of ​​the second through electrode is the total area of ​​the plurality of second through electrodes.

3. The plurality of first through electrodes are arranged in the third direction, The plurality of second through electrodes are arranged in the third direction, as described in claim 2.

4. The stacked electronic component according to claim 1, wherein when the length of the first margin region in the second direction is L1 and the distance between the third surface and the first through electrode in the second direction is L1a, the ratio of L1a to L1 (L1a / L1) is 5% or more.

5. The stacked electronic component according to claim 1, wherein when L1 is the length of the first margin region in the second direction and L1b is the distance in the second direction between the overlapping region and the first through electrode, the ratio of L1b to L1 (L1b / L1) is 5% or more.

6. The stacked electronic component according to claim 1, wherein the diameter of the first through electrode is D1, and D1 is 5 μm or more.

7. The stacked electronic component according to claim 3, wherein when the diameter of the first through electrode is D1 and the distance between the plurality of first through electrodes is D2, the ratio of D2 to D1 (D2 / D1) is 1.2 or more.

8. The stacked electronic component according to claim 7, wherein the ratio of D2 to D1 (D2 / D1) is 2.5 or less.

9. The first external electrode is arranged extending from the third surface onto the first and second surfaces, The second external electrode is arranged extending from the fourth surface onto the first and second surfaces, The first through electrode is exposed on the first and second surfaces and connected to the first external electrode. The stacked electronic component according to any one of claims 1 to 8, wherein the second through electrode is exposed on the first and second surfaces and connected to the second external electrode.

10. The first internal electrode includes a first main portion arranged in the overlapping region and overlapping with the second internal electrode, and a first lead portion arranged in the first margin region, extending from the first main portion and exposed on the third surface. The stacked electronic component according to any one of claims 1 to 8, wherein the second internal electrode includes a second main portion arranged in the overlapping region and overlapping with the first internal electrode, and a second lead portion arranged in the second margin region and extending from the second main portion and exposed on the fourth surface.

11. The stacked electronic component according to any one of claims 1 to 8, wherein in the cross-sections of the main body in the second and third directions, the cross-sections of the first through electrode and the second through electrode are circular.

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