Substrate processing equipment, substrate manufacturing system, substrate manufacturing method

Abstract

This technology is advantageous for uniformly performing UV ozone treatment across the entire surface of a substrate, even if the substrate is warped or deformed. [Solution] A substrate processing apparatus comprising: a light source capable of irradiating an irradiation area containing an oxygen-containing atmosphere with ultraviolet light; a moving unit for moving a substrate into the irradiation area; and a plurality of nozzles arranged in a direction intersecting the direction of movement of the substrate by the moving unit, each capable of supplying an inert gas to a different position in the irradiation area, wherein the amount of inert gas supplied from the plurality of nozzles is set according to the distance from the light source to the substrate at the different positions in the irradiation area.

Description

Technical Field

[0001] The present invention relates to a substrate processing apparatus that irradiates a substrate with light for cleaning, and the like.

Background Art

[0002] In the manufacturing processes of various devices including flat panel displays, a process of irradiating a substrate with light may be included. For example, when cleaning contaminants (e.g., organic substances) adhering to the surface of a display substrate, a dry cleaning process of irradiating ultraviolet light (hereinafter referred to as UV light) onto the surface of the substrate is known.

[0003] According to a cleaning method generally known as the UV ozone method, ozone is generated near the surface of the substrate by irradiation with UV light, and ozone is allowed to act on the contaminant substances (organic substances) adhering to the surface of the substrate, and the contaminant substances can be removed without damaging the substrate.

[0004] Patent Document 1 describes an ultraviolet irradiation apparatus having a light source that emits UV light, a light transmission window that enables irradiation of the irradiated object with UV light, and gas introduction means for introducing a mixed gas containing at least an inert gas and oxygen into the space between the light transmission window and the irradiated object.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0006] Patent Document 1 proposes a method for improving the utilization efficiency of a gas mixture containing an inert gas and oxygen when introducing it into the space between a light-transmitting window and the object to be irradiated. However, the method for uniformly performing UV treatment across the entire surface of a substrate when warping or deformation occurs in the substrate has not been considered. [Means for solving the problem]

[0007] One aspect of the present invention is a substrate processing apparatus comprising: a light source capable of irradiating an irradiation area containing an oxygen-containing atmosphere with ultraviolet light; a moving unit for moving a substrate into the irradiation area; and a plurality of nozzles arranged in a direction intersecting the direction of movement of the substrate by the moving unit, each capable of supplying an inert gas to different positions in the irradiation area, wherein the amount of inert gas supplied from the plurality of nozzles is set according to the distance from the light source to the substrate at the different positions in the irradiation area. [Effects of the Invention]

[0008] According to the present invention, it is possible to provide a technique that is advantageous for uniformly performing UV treatment across the entire surface of a substrate, even if the substrate is warped or deformed. [Brief explanation of the drawing]

[0009] [Figure 1] A schematic side view illustrating the substrate processing system according to Embodiment 1. [Figure 2] A schematic plan view showing a part of the substrate cleaning device through the Z-minus direction. [Figure 3] A schematic cross-sectional view showing a cross-section of the substrate cleaning device 100 cut along line AA in Figure 2. [Figure 4] A schematic cross-sectional view showing a cross-section of the substrate cleaning device 100 cut along line BB in Figure 2. [Figure 5] A graph illustrating the relationship between the optical path distance from the ultraviolet light source to the substrate and the amount of inert gas supplied. [Figure 6]A flowchart showing the first half of the procedure for the substrate processing method according to Embodiment 1. [Figure 7] A flowchart showing the latter half of the procedure for the substrate processing method according to Embodiment 1. [Figure 8] This diagram shows the state in which the circuit board is placed on the upper surface of the circuit board support part located at the circuit board receiving position. [Figure 9] This diagram shows the state in which the distance is measured across the entire surface of the substrate by the distance measuring unit while the substrate is being moved along the direction of movement C. [Figure 10] This diagram shows a state in which an inert gas with a controlled flow rate is supplied from a nozzle near a substrate being irradiated with UV light. [Figure 11] This diagram shows the state in which the substrate transport unit has moved the substrate out of the range where UV light is irradiated. [Figure 12] A flowchart showing the first half of the procedure for the substrate processing method according to Embodiment 2. [Figure 13] A flowchart showing the middle part of the procedure for the substrate processing method according to Embodiment 2. [Figure 14] A flowchart showing the latter half of the procedure for the substrate processing method according to Embodiment 2. [Figure 15] A perspective view illustrating the substrate support portion of the substrate processing apparatus according to Embodiment 3. [Modes for carrying out the invention]

[0010] In recent years, large-area, small-thickness substrates have come to be used in various devices, including flat-panel displays. Such substrates are prone to warping due to their own weight depending on their orientation, and are also susceptible to deformation due to external forces and vibrations during the operation of transport and support mechanisms.

[0011] When warping or deformation occurs during the cleaning of the substrate, the distance from the ultraviolet light source to the substrate surface becomes non-uniform, and the intensity of the UV light reaching the vicinity of the substrate surface varies depending on the location of the substrate. The cleaning power of the UV ozone method depends on the amount of ozone supplied to the substrate surface. However, if the amount of ozone generated by irradiating UV light in the vicinity of the substrate surface becomes non-uniform depending on the location, the cleaning power will also become non-uniform depending on the location.

[0012] Therefore, it is thought that if the entire surface of the substrate is irradiated with strong UV light, even if warping or deformation occurs in the substrate, a sufficient amount of ozone can be supplied to exert the cleaning power in any region of the substrate. However, when the entire surface of the substrate is irradiated with strong UV light, overly strong UV light will be irradiated depending on the location of the substrate.

[0013] For example, when a liquid containing a functional material is applied to a predetermined region on the substrate and dried to form a functional film, a structure (so-called bank) for defining the region to which the liquid is applied is formed on the substrate. When UV ozone cleaning is performed as a pretreatment before applying the liquid, changes may occur in the shape and surface state of the structure at locations irradiated with overly strong UV light.

[0014] For example, in a substrate for an organic EL device or the like, a bank for defining a region (for example, a pixel) to which a liquid is applied can be formed on the substrate surface using a fluorine-containing resin having liquid repellency. When the entire substrate is irradiated with strong UV light, in a portion irradiated with overly strong UV light due to the warping of the substrate, the fluorine-containing resin may be decomposed, resulting in changes in the shape, liquid repellency, or wettability of the bank. If the shape and liquid repellency of the bank become non-uniform depending on the location of the substrate, it becomes impossible to uniformly apply the liquid over the entire substrate, and it becomes impossible to form an organic EL device with uniform performance over the entire surface of the substrate.

[0015] Therefore, this specification discloses a technique advantageous for uniformly performing UV treatment over the entire substrate even when warping or deformation occurs in the substrate.

[0016] With reference to the drawings, a substrate processing apparatus, etc., according to an embodiment of the present invention will be described. The embodiments shown below are illustrative, and for example, those skilled in the art can modify the detailed configuration as appropriate without departing from the spirit of the present invention.

[0017] In the drawings referenced in the following description of embodiments, elements indicated by the same reference numeral have the same function unless otherwise specified. If multiple identical elements are shown in a drawing, the assignment of reference numerals and their descriptions may be omitted.

[0018] Furthermore, since drawings may be schematically represented for the sake of illustration and explanation, the shape, size, and arrangement of elements shown in the drawings may not strictly correspond to those of actual objects.

[0019] In the following explanation, for example, when we refer to the X-plus direction, it refers to the same direction as the X-axis arrow in the illustrated Cartesian coordinate system, and when we refer to the X-minus direction, it refers to the direction 180 degrees opposite to the direction indicated by the X-axis arrow in the illustrated Cartesian coordinate system. Furthermore, when we simply refer to the X direction, it refers to the direction parallel to the X-axis, regardless of whether it is the same as or different from the direction indicated by the illustrated X-axis arrow. The same applies to directions other than X. Unless otherwise specified, in the Cartesian coordinate system XYZ coordinate system, the XY plane is the horizontal plane, and the Z-minus direction is the direction of gravity.

[0020] [Embodiment 1] (Basic configuration) Figure 1 is a schematic side view illustrating a substrate processing system (or substrate manufacturing system) according to an embodiment. The substrate processing system comprises a substrate cleaning device 100 as a substrate processing device according to Embodiment 1, a substrate transport device 200 for loading substrates S into and out of the substrate cleaning device 100, and a control unit 8.

[0021] The substrate processing system may further include a liquid coating device (e.g., an inkjet device) not shown. By transporting the substrate S, which has been cleaned using the substrate cleaning device 100, to the liquid coating device via the substrate transport device 200 and applying a liquid, the substrate processing system can manufacture substrates with high-quality functional films.

[0022] The substrate cleaning apparatus 100 may be configured, for example, as part of a film forming apparatus for forming an organic film on a substrate S. The organic film may be, for example, a hole injection layer, hole transport layer, light-emitting layer, electron transport layer, or electron injection layer of an organic light-emitting diode (OLED). A process for manufacturing an organic EL element using the substrate cleaning apparatus 100 according to this embodiment may include, for example, a step of loading a substrate with a bank formed on it into the substrate cleaning apparatus 100 and cleaning it, and then applying a liquid containing the material for the organic film to the substrate using an inkjet apparatus. Furthermore, it may include a step of drying the substrate to which the liquid has been applied and forming an organic film such as a hole injection layer, hole transport layer, light-emitting layer, electron transport layer, or electron injection layer. In addition to the substrate processing apparatus (substrate cleaning apparatus 100) according to this embodiment, the manufacturing system for manufacturing organic light-emitting diodes (OLEDs) may include apparatus for performing processes such as coating, vacuum drying, firing, cooling, electrode formation, and sealing film formation.

[0023] The control unit 8 is a computer for controlling the operation of each part of the substrate processing system, and internally it is equipped with a CPU, ROM, RAM, I / O ports, etc. The ROM stores the operation programs for each part of the substrate processing system, including the substrate cleaning device 100. The control unit 8 can communicate with the substrate cleaning device 100, the substrate transport device 200, and other devices of the substrate processing system, and control each of them. For example, the control unit 8 can communicate with each part of the substrate cleaning device 100, such as the gate valve 12, lift pin 6 (substrate receiving mechanism), substrate transport unit 2 (moving unit), ultraviolet irradiation unit 3, distance measuring unit 5, and inert gas supply unit 4, and control each of them.

[0024] The substrate transport device 200 is a mechanism for transporting substrates as objects to be processed, and includes, for example, a substrate transport robot 7 equipped with a robot hand 71 as shown in Figure 1. The robot hand 71 can hold the substrate and transport it into the substrate cleaning device 100, or transport the substrate out of the substrate cleaning device 100 while holding it. A robot is preferably used as the substrate transport device 200, but any device that can stably transport thin, large-area substrates is acceptable, and it is not limited to a robot as shown in the figure.

[0025] The substrate cleaning apparatus 100 is a device that performs UV ozone cleaning on a substrate, and comprises an airtight container 1, a substrate transport unit 2 which is a moving unit for moving the substrate S within the airtight container 1, and an ultraviolet irradiation unit 3 for irradiating the substrate S with ultraviolet light. The substrate cleaning apparatus 100 further comprises a distance measuring unit 5 for acquiring information on the distance from the ultraviolet irradiation unit 3 to the substrate surface, an inert gas supply unit 4 for supplying an inert gas near the substrate, and a control unit 8 for controlling the operation of each part of the apparatus.

[0026] The airtight container 1 is provided with an opening 11 that serves as an entrance and exit when loading or unloading substrates, and a gate valve 12 that can open and close the opening 11 under the control of the control unit 8. The airtight container 1 is also provided with an air inlet 13 for introducing an oxygen-containing gas (e.g., clean dry air) into the container, and an exhaust port 14 for discharging gas from the container. When performing UV ozone cleaning, if the direction in which the substrate S is moved while irradiating it with UV light is defined as the movement direction C, it is preferable to position the air inlet 13 upstream of the movement direction C relative to the UV irradiation unit 3, and the exhaust port 14 downstream of the movement direction C relative to the UV irradiation unit 3. This is to ensure that fresh oxygen-containing gas is always supplied to the area irradiated with UV light when generating ozone near the substrate surface by irradiating it with UV light. In the example shown in Figure 1, the movement direction C of the substrate coincides with the X-plus direction.

[0027] The substrate transport unit 2 includes a transfer unit 61 that transfers the substrate to and from the robot hand 71, a substrate support unit 22 on which the substrate S is placed, and a transport drive unit 21 that moves the substrate support unit 22 in the X direction under the control of the control unit 8.

[0028] The transfer unit 61 is equipped with a lift pin 6 that can move back and forth in the Z direction. When receiving a substrate from the robot hand 71, the lift pin 6 is extended in the Z-positive direction to support the underside of the substrate and receive the substrate from the robot hand 71. After receiving the substrate, the lift pin 6 is moved in the Z-negative direction and embedded inside the substrate support unit 22, and the substrate is placed on the upper surface of the substrate support unit 22. On the other hand, when transferring the substrate to the robot hand 71, the lift pin 6 is moved from its embedded position inside the substrate support unit 22 in the Z-positive direction, extending to a height where the robot hand 71 can receive the substrate while supporting the underside of the substrate.

[0029] The transport drive unit 21 is a drive mechanism capable of moving the substrate support unit 22 in the X-positive or X-negative direction, and controls the stopping position, direction of movement, speed of movement, etc., of the substrate support unit 22 according to commands from the control unit 8. The transport drive unit 21 may be configured by combining, for example, a linear motor, a servo motor, gears, etc.

[0030] The ultraviolet irradiation unit 3 comprises a lamp house 31, which is an airtight container equipped with an ultraviolet-transmitting window 34, and an ultraviolet light source 32 housed within the lamp house 31. For the ultraviolet light source 32, a xenon excimer lamp that generates ultraviolet light with a wavelength of 172 nm is preferably used. The interior of the lamp house 31 is filled with an inert gas atmosphere (e.g., nitrogen) to prevent attenuation of the ultraviolet light. For the ultraviolet-transmitting window 34, synthetic quartz glass is preferably used. The UV light emitted from the ultraviolet light source 32 and transmitted through the ultraviolet-transmitting window 34 is irradiated into the airtight container 1.

[0031] The distance measuring unit 5 attached to the airtight container 1 is equipped with a distance sensor 511 that can measure the distance to the substrate S located directly below in the Z-minus direction through a measuring window 512, and transmits the measurement result to the control unit 8. A laser displacement meter is preferably used as the distance sensor 511, but other devices such as a distance measuring camera may also be used. The distance measuring unit 5 acquires information on the distance from the ultraviolet light source to the substrate at different positions within the UV light irradiation area. The information on the distance from the ultraviolet light source to the substrate refers to information used to calculate the distance from the ultraviolet light source to the substrate when the substrate moves directly below the ultraviolet light source. The value is not limited to the distance measured directly when the substrate is directly below the ultraviolet light source, but may also be the value measured from a distance sensor 511 placed at a predetermined position upstream in the direction of movement of the substrate to the substrate directly below the distance sensor. A preferred configuration is to place the distance sensor 511 near the ultraviolet light source 32 in the direction of movement C of the substrate, and to install it at the same height as the ultraviolet light source 32 in the Z direction. With this configuration, even if the measurement value of the distance sensor 511 is treated as the distance from the ultraviolet light source to the substrate when the substrate is moved directly under the ultraviolet light source, the actual error will be small. In some cases, a correction calculation may be performed on the measurement value of the distance sensor 511 to calculate the distance from the ultraviolet light source to the substrate when the substrate is moved directly under the ultraviolet light source.

[0032] The inert gas supply unit 4 attached to the airtight container 1 includes a pipe 412 for supplying inert gas from the outside and a nozzle 413 capable of ejecting (supplying) the inert gas toward the UV light irradiation area 33. A flow control valve 411 is connected between the pipe 412 and the nozzle 413 to adjust the flow rate of the inert gas supplied to the nozzle 413 according to the control of the control unit 8. For example, an electromagnetic valve capable of adjusting the degree of opening and closing based on a control signal is used as the flow control valve 411.

[0033] Figure 2 is a schematic plan view showing a part of the substrate cleaning apparatus 100 through a transparent lens along the Z-minus direction to illustrate the positional relationship between the distance measuring unit 5, the inert gas supply unit 4, and the ultraviolet light source 32. The substrate S, placed on the substrate support unit 22 of the substrate transport unit 2, moves in the movement direction C (X-plus direction in this example), passing directly beneath the distance measuring unit 5, the inert gas supply unit 4, and the ultraviolet light source 32 in sequence. In the following explanation, the Y direction perpendicular to the movement direction C will be referred to as the substrate width direction, and the size of the substrate S in this direction will be referred to as the substrate width.

[0034] The ultraviolet light source 32 can irradiate the substrate S with UV light across its entire width in the substrate width direction. When performing UV ozone cleaning, the substrate S moves along the movement direction C and passes directly beneath the ultraviolet light source 32. Directly beneath the ultraviolet light source 32, that is, at the position where UV light is irradiated, ozone is generated by the UV light and cleans the surface of the substrate S.

[0035] When localized warping or other deformation occurs in the substrate S, variations occur in the distance in the Z direction from the ultraviolet light source 32 to the substrate surface at the position where UV light is irradiated. In this embodiment, as shown in Figure 2, a plurality of distance sensors 511 capable of measuring the distance to the substrate S are arranged at equal intervals along a direction intersecting the movement direction C (for example, the substrate width direction perpendicular to the movement direction C). In the illustrated example, 10 distance sensors 511 are arranged in a row along the substrate width direction, but the number and arrangement of distance sensors are not limited to this example. Note that in Figure 2, when measuring while moving the substrate S along the movement direction C, the measurement areas are conveniently separated by dotted lines to distinguish the measurement areas of each distance sensor 511.

[0036] In order to accurately determine the deformation of the substrate S in the Z direction at the position where UV light is irradiated, it is preferable to install the distance sensor 511 upstream of the ultraviolet light source 32 in the direction of movement C, and as close to the ultraviolet light source 32 as possible.

[0037] Figure 3 is a schematic cross-sectional view showing a cross-section of the substrate cleaning apparatus 100 cut along line AA in Figure 2. Each distance sensor 511 in the distance measuring unit 5 measures the distance to the substrate S. If the distance sensors 511 are positioned close to the ultraviolet light source 32 in the movement directions C and Z, the measurement values ​​from the distance sensors 511 will be substantially equal to the distance between the ultraviolet light source 32 and the substrate S directly beneath the ultraviolet light source 32. Measurement values ​​of distances L1 to L10 are periodically transmitted from the 10 distance sensors 511 to the control unit 8.

[0038] Factors that cause the distances L1 to L10 to be non-uniform include, for example, as illustrated in Figure 3, the upper surface of the substrate support part 22 is curved rather than a flat horizontal surface, and the placed substrate S may deform accordingly. Alternatively, due to the history of previous manufacturing processes (e.g., bank formation), stress may be inherent in the substrate itself when it is brought into the substrate cleaning device 100, causing warping. Or, when the substrate is moved by the substrate transport part 2, the substrate may bend due to vibration or inertial force. In any case, the control unit 8 can obtain information regarding the distance between various parts of the substrate surface and the ultraviolet light source 32 from the distance measuring unit 5.

[0039] For example, in regions where the distance from the ultraviolet light source 32 is relatively small, such as distances L1 and L10 in the example in Figure 3, the intensity of UV light reaching near the surface of the substrate is strong, so a relatively large amount of ozone can be generated near the substrate. On the other hand, in regions where the distance from the ultraviolet light source 32 is relatively large, such as distances L4 to L6, the intensity of UV light reaching near the surface of the substrate is weaker, so a relatively small amount of ozone can be generated near the substrate.

[0040] In this embodiment, even if the distance between the substrate S and the ultraviolet light source 32 varies locally, inert gas is supplied from the inert gas supply unit 4 to suppress variations in the effectiveness of the UV ozone cleaning treatment. In areas where the distance from the ultraviolet light source 32 is relatively small, such as distances L1 and L10 in the example of Figure 3, a relatively large amount of inert gas is supplied to dilute (reduce) the oxygen concentration and suppress excessive ozone generation. On the other hand, in areas where the distance from the ultraviolet light source 32 is relatively large, such as distances L4 to L6, a relatively small amount of inert gas (including zero) is supplied to maintain the oxygen concentration and balance the amount of ozone generated with areas where the distance from the ultraviolet light source 32 is relatively small.

[0041] As shown in Figure 2, the inert gas supply unit 4 has multiple nozzles 413 capable of ejecting inert gas toward the UV light irradiation area 33, arranged at equal intervals along a direction intersecting the movement direction C (for example, the substrate width direction). In order to supply inert gas to each part of the irradiation area 33 with high precision and high speed according to the distance between the ultraviolet light source 32 and the substrate in each part, it is preferable to arrange the nozzles 413 upstream of the ultraviolet light source 32 in the movement direction C and as close to the ultraviolet light source 32 as possible. In the illustrated example, 10 nozzles 413 are arranged in a row along the substrate width direction, but the number and arrangement of nozzles are not limited to this example. However, since the control of the inert gas supplied from the nozzles 413 is performed based on the measurement value provided to the control unit 8 from the distance sensor 511, it is preferable to arrange the same number of nozzles 413 as the distance sensor 511, corresponding to the position of the distance sensor 511.

[0042] Figure 4 is a schematic cross-sectional view showing a cross-section of the substrate cleaning apparatus 100 cut along the BB line in Figure 2. Inert gas is supplied from piping 412 to each of the 10 nozzles 413, which are arranged at equal intervals along the width direction of the substrate, via a flow control valve 411. The degree of opening and closing of each flow control valve 411 is independently controlled by the control unit 8. Based on distance information acquired from the distance measuring unit 5, the control unit 8 controls the degree of opening and closing of the flow control valves 411, causing an appropriate flow rate of inert gas to be ejected (supplied) from each nozzle 413 toward the UV light irradiation area 33. An oxygen-containing atmosphere O is supplied into the airtight container 1 from the air inlet 13, but the oxygen concentration near the surface of each part of the substrate is adjusted by the inert gas supplied from the nozzles 413.

[0043] The orientation of each nozzle 413 is set so that the inert gas is supplied with components in the X-positive direction and the Z-negative direction, as schematically shown by the arrows in Figure 1. In other words, an appropriate flow rate of inert gas is supplied from each nozzle 413 to each part of the substrate within the UV light irradiation area 33, and the amount of ozone generated near the substrate is made uniform.

[0044] Figure 4 schematically shows the flow of inert gas ejected (supplied) from each nozzle 413 with arrows, where the wider (thicker) the arrow, the larger the relative flow rate. In this example, based on the distance measurement results shown in Figure 3, the control unit 8 controls the opening and closing of the flow control valve 411 so that the flow rate is larger for nozzles 413 that supply inert gas to irradiation positions that are closer to the substrate. Figure 5 illustrates the relationship between the ultraviolet light path distance from the ultraviolet light source 32 to the substrate and the amount of inert gas supplied in a graph.

[0045] The relationship between the distance measured by the distance sensor 511 and the amount of inert gas supplied to ensure proper UV ozone cleaning at that distance can be determined experimentally beforehand. Alternatively, the flow rate of the inert gas to be supplied can be calculated based on the distance measured by the distance sensor 511, for example, using the following formula (1). Q = α / d + β ... Formula (1)

[0046] Here, Q is the flow rate of the inert gas, α is a coefficient, d is the distance measured by the distance sensor 511, and β is a constant. Since α and β vary depending on the substrate size and process conditions, they should be determined experimentally beforehand. Note that formula (1) is just one example, and the flow rate of the inert gas to be supplied can be calculated using other arithmetic formulas.

[0047] The relationship between the distance measured by the distance sensor 511 and the amount of inert gas supplied to ensure that UV ozone cleaning is performed appropriately at that distance can be stored as control information in the memory of the control unit 8, for example, in the form of a data table or mathematical formula.

[0048] When the substrate cleaning apparatus 100 cleans a substrate to be processed, the control unit 8 controls the flow rate of inert gas supplied to each irradiation area irradiated with UV light, based on the measurement result of the distance sensor 511 for the substrate and the control information stored in advance. If the arrangement of the distance sensor 511 and the arrangement of the nozzle 413 do not correspond in a 1:1 ratio, the distance at the position where the nozzle 413 supplies inert gas can be estimated (e.g., interpolated) based on the measurement value of the distance sensor 511, and the flow rate of inert gas can be determined.

[0049] (Substrate processing method) The substrate processing method implemented in the substrate processing system (or substrate manufacturing system) described above will now be explained. Figures 6 and 7 are flowcharts showing a series of steps in the substrate processing method according to the embodiment. In the substrate processing method described below, signals are exchanged between each part of the substrate processing system and the control unit 8, and each process is executed under the control of the control unit 8.

[0050] In Figure 6, when the UV ozone cleaning process is started, in step S00, a substrate acceptance request signal is sent from the substrate transport device 200, which is ready to transport the substrate.

[0051] In the following step S01, the substrate cleaning device 100 opens the gate valve 12, opening the opening 11 which serves as the entrance and exit for the substrate.

[0052] In the following step S02, as shown in Figure 1, the substrate S is transferred from the robot hand 71 of the substrate transport device 200 to the transfer section 61 (lift pin 6) of the substrate cleaning device 100.

[0053] In the following step S03, after the robot hand 71 has moved out of the airtight container 1 of the substrate cleaning device 100, the substrate cleaning device 100 closes the gate valve 12 to close the opening 11.

[0054] In the following step S04, as schematically shown in Figure 8, the lift pin 6 is moved in the Z-minus direction and embedded below the upper surface of the substrate support part 22, and the substrate S is placed on the upper surface of the substrate support part 22 at the substrate receiving position.

[0055] In the following step S05, the substrate transport unit 2 moves the substrate support unit 22 on which the substrate S is placed along the movement direction C to the starting position of the distance measuring unit 5.

[0056] In the subsequent step S06, as schematically shown in Figure 9, the distance is measured over the entire surface of the substrate S by the distance measuring unit 5 while the substrate S is moved along the movement direction C. The measurement results are stored in the memory unit of the control unit 8, corresponding to the parts of the substrate. During the distance measurement, a part of the substrate S may move directly beneath the ultraviolet light source 32, but since the ultraviolet light source 32 is not lit, the substrate is not affected.

[0057] In the subsequent step S07, the control unit 8 calculates the amount of inert gas to be supplied to each part of the substrate S based on the control information previously stored (the relationship between the amount of inert gas to be supplied and the distance measurement result) and the distance measurement result obtained in step S06. The amount of inert gas to be supplied from each nozzle 413 when the substrate S is moved in the movement direction C directly under the ultraviolet light source 32 may be calculated in a time series corresponding to the position of the substrate S in the movement direction C (or the elapsed time after the start of substrate movement). The calculation result is stored in the memory unit of the control unit 8 as a set value for the amount of inert gas to be supplied.

[0058] In the following step S08, the substrate transport unit 2 moves the substrate S in the X-minus direction, moving it away from directly beneath the ultraviolet light source 32.

[0059] In the following step S09, the ultraviolet light source 32 is turned on. Wait until the light emission intensity stabilizes and the atmosphere directly below the ultraviolet-transmitting window 34 stabilizes. For example, a timer may be used to wait for a predetermined time to elapse. If the atmosphere stabilizes quickly, the waiting time may be set to zero.

[0060] In the following step S10, the substrate transport unit 2 moves the substrate S to the scan start position. The scan start position corresponds to the outer edge of the region reached by the UV light irradiated by the ultraviolet light source 32. Moving the substrate S beyond this point in the movement direction C will cause the substrate S to be cleaned by the ozone generated by the UV light. Note that if the substrate S was moved to the scan start position in step S08, step S10 may be skipped.

[0061] In the subsequent step S11 (Figure 7), the substrate transport unit 2 moves the substrate S in the movement direction C, while the ultraviolet light source 32 irradiates the irradiation area 33 with UV light, and the individual nozzles 413 supply the amount of inert gas set in step S07. As schematically shown in Figure 10, inert gas, whose flow rate is controlled according to the warping and undulation of the substrate S (length of the UV light path), is supplied from the nozzles 413 to the vicinity of the substrate S being irradiated with UV light. As a result, the concentration of ozone that performs the cleaning action becomes highly uniform at all positions in the width direction (Y direction) and length direction (X direction) of the substrate S, and a uniform cleaning effect can be obtained.

[0062] In the subsequent step S12, as shown in Figure 11, the substrate transport unit 2 moves the substrate support unit 22, which holds the substrate S, outside the UV light irradiation area 33.

[0063] In the following step S13, the ultraviolet light source 32 is turned off and the supply of inert gas from the nozzle 413 is stopped.

[0064] In the following step S14, the substrate transport unit 2 moves the substrate support unit 22 in the X-minus direction to a position directly below where the robot hand 71 of the substrate transport device 200 can receive the substrate S.

[0065] In the following step S15, the lift pins 6 of the transfer unit 61 are extended in the Z-plus direction to raise the substrate S to a height where the robot hand 71 can receive the substrate.

[0066] In the following step S16, the circuit board cleaning device 100 issues a request to receive the circuit board.

[0067] In the following step S17, the substrate cleaning apparatus 100, having completed the substrate cleaning process, opens the gate valve 12 and opens the opening 11, which serves as the entrance and exit for the substrate.

[0068] In the following step S18, the robot hand 71 of the substrate transfer device 200 enters the transfer position inside the substrate cleaning device 100 through the opening 11. Once the robot hand 71 is confirmed to be in the transfer position, the substrate cleaning device 100 lowers the lift pin 6 to transfer the substrate S to the robot hand 71. After the robot hand 71 receives the substrate S, the substrate transfer device 200 moves the robot hand 71 out of the substrate cleaning device 100. In the following step S19, the substrate cleaning device 100 closes the gate valve 12, closing the opening 11 which serves as the entrance and exit for the substrate. With this, the series of steps for the substrate cleaning process is completed.

[0069] According to the embodiments described above, even if the distance from the ultraviolet light source varies depending on the part of the substrate due to deformation such as warping or bending of the substrate, the flow rate of the inert gas supplied to each part of the substrate can be adjusted according to the distance from the ultraviolet light source. In other words, the concentration of ozone generated can be adjusted for each ultraviolet irradiation position, thereby reducing unevenness in the UV ozone cleaning effect. For example, unevenness in the UV ozone cleaning effect can be reduced to plus or minus 10% or less.

[0070] [Embodiment 2] In Embodiment 1, the distance from each part of the substrate to the ultraviolet light source was measured in advance for the entire substrate without turning on the ultraviolet light source. However, the present invention is not limited to Embodiment 1 described above. Embodiment 2 will be described below, but matters common to Embodiment 1 will be simplified or omitted in the explanation.

[0071] In the substrate processing system (or substrate manufacturing system) according to Embodiment 2, the substrate transport unit 2 moves the substrate in the direction C while simultaneously performing distance measurement, UV light irradiation, and inert gas supply. The basic hardware configuration of the system is the same as in Embodiment 1, so a description is omitted.

[0072] (Substrate processing method) A substrate processing method implemented in the substrate processing system (or substrate manufacturing system) according to Embodiment 2 will be described. Figures 12 to 14 are flowcharts showing a series of steps in the substrate processing method according to this embodiment. In the substrate processing method described below, signals are exchanged between each part of the substrate processing system and the control unit 8, and each process is executed under the control of the control unit 8.

[0073] In Figure 12, once the UV ozone cleaning process is started, the steps from step S00 onwards are carried out. Steps S00 to S04 are the same as in Embodiment 1, so their explanation is omitted.

[0074] In Embodiment 1, steps S05 to S08 were executed after step S04, but in this embodiment, these steps are skipped and the process proceeds to step S09. In step S09, the ultraviolet light source 32 is turned on. The process waits until the light emission intensity stabilizes and the atmosphere directly below the ultraviolet transmission window 34 stabilizes. For example, a timer may be used to wait for a predetermined amount of time to elapse. If the atmosphere stabilizes quickly, the waiting time may be set to zero.

[0075] In this embodiment, in step S106 following step S09, the substrate transport unit 2 moves the substrate S to the distance measurement start position. The distance measurement start position corresponds to the position where the distance measurement unit 5 measures the distance (for example, directly below the distance sensor 511), and when the substrate S is moved beyond this position in the movement direction C, the distance sensor 511 can measure the distance to the part of the substrate S located directly below it.

[0076] The following processing steps will be outlined below. For the sake of explanation, the substrate S will be described by dividing it into three parts: the leading edge, the middle section, and the trailing edge, in the direction of movement C.

[0077] When the substrate S starts moving from the distance measurement start position, the leading edge of the substrate S first passes directly under the distance sensor 511 when viewed in the direction of movement C, and distance measurement is performed on the leading edge. Based on the distance measurement results, the control unit 8 calculates the amount of inert gas to be supplied to the leading edge of the substrate.

[0078] As the substrate S moves further in the direction C, the leading edge of the substrate S reaches the area irradiated with UV light, and the middle section passes directly beneath the distance sensor 511. The leading edge is subjected to UV ozone cleaning while receiving a supply of inert gas calculated according to the distance measurement result. In parallel with the UV ozone cleaning treatment of the leading edge, distance measurement is performed on the middle section, and the amount of inert gas to be supplied to the middle section is calculated.

[0079] As the substrate S moves further in the direction of movement C, the middle portion of the substrate S reaches the area irradiated with UV light, and the rear portion reaches directly below the distance sensor 511. For the middle portion, UV ozone cleaning is performed while supplying an amount of inert gas calculated according to the distance measurement result. In parallel with the UV ozone cleaning treatment for the middle portion, distance measurement is performed for the rear portion, and the amount of inert gas to be supplied to the rear portion is calculated.

[0080] As the substrate S moves further in the direction C, the rear end of the substrate passes directly beneath the distance sensor 511, and distance measurement for the entire substrate is completed. As the substrate S moves further, the rear end of the substrate S reaches the area irradiated with UV light, and UV ozone cleaning is performed on the rear end while receiving a supply of inert gas in an amount calculated according to the distance measurement result.

[0081] Thus, when all parts of the substrate S have passed through the area irradiated with UV light, the UV ozone cleaning process is completed. In this substrate processing method of this embodiment, there are timings in which only distance measurement is performed, timings in which distance measurement and UV ozone cleaning are performed simultaneously, and timings in which only UV ozone cleaning is performed.

[0082] As shown in Figure 13, in step S107, the substrate transport unit 2 moves the substrate S along the movement direction C, and the distance to each part of the substrate S is measured using the distance measuring unit 5. The measurement results are transmitted to the control unit 8 in correspondence with the parts of the substrate.

[0083] In the subsequent step S108, the control unit 8 calculates the amount of inert gas to be supplied to each region of the substrate S based on the control information stored in advance (the relationship between the amount of inert gas to be supplied and the measurement distance) and the measurement results obtained in step S107.

[0084] In the subsequent step S109, the substrate transport unit 2 moves the substrate S along the movement direction C so that a portion of the substrate S passes through the area irradiated with UV light from the ultraviolet light source 32. At this time, the amount of inert gas determined in step S108 is supplied from individual nozzles 413 to the irradiation position of the ultraviolet light source 32.

[0085] In the following step S110, it is determined whether distance measurement has been completed for all parts of the substrate S. If distance measurement has not been completed for all parts of the substrate S (step S110: NO), the process returns to step S107 and the loop continues. In other words, distance measurement and UV ozone cleaning are performed in parallel until distance measurement is completed for all parts of the substrate S.

[0086] If distance measurements have been completed for the entire substrate S (step S110: YES), the process proceeds to step S111. Since the rear end of the substrate S has already passed the distance measurement position, no distance measurement is performed in step S111. Instead, the substrate is moved in the direction C while only the UV ozone cleaning process is carried out. At this time, the amount of inert gas determined in step S108 is supplied from individual nozzles 413 to the irradiation position of the ultraviolet light source 32.

[0087] In the following step S112, it is determined whether the UV ozone cleaning treatment has been completed for the entire substrate S in step S111. If the UV ozone cleaning treatment has not been completed for the entire substrate S (step S112: NO), the process returns to step S111 and the loop continues.

[0088] If UV ozone cleaning treatment has been completed on the entire substrate S (step S112: YES), proceed to step S13 in Figure 14. Steps S13 to S19 are the same as in Embodiment 1, so their explanation is omitted.

[0089] Similar to Embodiment 1, in this embodiment as well, even if the distance to the ultraviolet light source varies depending on the part of the substrate due to deformation such as warping or bending of the substrate, the flow rate of the inert gas supplied to each part of the substrate can be adjusted according to the distance to the ultraviolet light source. In other words, since the concentration of ozone generated can be adjusted for each ultraviolet irradiation position, unevenness in the UV ozone cleaning effect can be reduced. For example, unevenness in the UV ozone cleaning effect can be reduced to plus or minus 10% or less.

[0090] Furthermore, in this embodiment, some of the processes—measuring the distance to the substrate (corresponding to the optical path length of the UV light), calculating the amount of inert gas to be supplied based on the distance measurement result, and irradiating with UV light while supplying the calculated amount of inert gas—can be carried out simultaneously. As a result, the cycle time required for UV ozone cleaning treatment of a single substrate can be shortened compared to Embodiment 1. This improves the throughput of substrate manufacturing and enhances mass production capabilities.

[0091] [Embodiment 3] In Embodiments 1 and 2, when the substrate is moved along the movement direction C, it was assumed that the distance between the substrate and the ultraviolet light source could fluctuate in both the width direction (Y direction) and the length direction (X direction) of the substrate due to warping or undulation of the substrate. To allow the supply amount of inert gas to be adjusted over time while the substrate is moved, an electromagnetic valve capable of adjusting the flow rate under a control signal from the control unit 8 was used as the flow control valve 411. However, depending on the configuration of the device, the distance between the substrate and the ultraviolet light source may be non-uniform along a certain profile in the width direction (Y direction) of the substrate, but this profile may not change in the length direction (X direction) of the substrate.

[0092] For example, as shown in Figure 15, the upper surface of the substrate support portion 22 is curved in the width direction (Y direction) of the substrate, but the profile of this curvature may hardly change in the direction of movement C (length direction of the substrate). When a substrate with a small thickness is placed on such a substrate support portion 22, the substrate deforms to conform to the upper surface of the substrate support portion 22. In such a case, when performing UV ozone treatment, it is necessary to adjust the flow rate of the inert gas supplied from the multiple nozzles 413 arranged along the Y direction for each nozzle, but it is not necessary to change the flow rate over time while moving the substrate in the direction of movement C.

[0093] Therefore, in this embodiment, an inert gas can be supplied to each of the nozzles 413 arranged along the Y direction via a mechanical flow control valve 411. A mechanical flow control valve is a valve whose degree of opening and closing can be mechanically adjusted and fixed.

[0094] The distance from each part of the substrate to the UV light source as it moves through the UV light irradiation area 33 is measured in advance, the flow rate of the inert gas to be supplied from each nozzle 413 to the UV light irradiation area 33 is calculated and set, and the degree of opening and closing of each valve is adjusted in advance based on the set flow rate.

[0095] Furthermore, it is desirable to install an electromagnetic valve between the piping 412 for supplying inert gas from an external source and the mechanical flow control valve 411, which can be opened and closed under a control signal from the control unit 8. This is so that the control unit 8 can control the start and stop of the supply of inert gas in conjunction with the start and end of the UV ozone treatment.

[0096] The distance sensor 511 may be made detachable and configured to be attached to the substrate cleaning device 100 only when measuring distance in advance. By sharing the distance sensor among multiple substrate cleaning devices, the device cost can be reduced.

[0097] Similar to Embodiment 1, in this embodiment, an inert gas, whose flow rate is controlled according to the warping and undulation of the substrate S (length of the UV light path), is supplied from the nozzle 413 to the vicinity of the substrate S being irradiated with UV light. As a result, the uniformity of the supplied ozone concentration is high at any position on the substrate S, and a uniform cleaning effect can be obtained.

[0098] In this embodiment, instead of measuring the distance to each substrate to be processed to determine the flow rate of the inert gas, the inert gas is supplied using a mechanical flow control valve with a pre-adjusted opening, thus simplifying the control procedure by the control unit 8. Furthermore, since a mechanical flow control valve, which is less expensive than an electromagnetic valve, is used, the cost of the substrate cleaning equipment can be reduced.

[0099] [Other embodiments] It should be noted that the present invention is not limited to the embodiments described above, and many modifications are possible within the technical concept of the present invention. For example, all or part of the different embodiments described above may be combined and implemented.

[0100] A method for manufacturing an article, in which a control computer of a manufacturing system equipped with a substrate processing apparatus according to an embodiment controls the substrate processing apparatus, is also included in the embodiments of the present invention. A method for manufacturing an article, in which not only the substrate processing apparatus but also at least a portion of a substrate transport apparatus, a liquid coating apparatus, and a drying apparatus are controlled, is also included in the embodiments of the present invention.

[0101] The substrate processing apparatus according to the embodiment can be suitably applied to a manufacturing system for manufacturing substrates used in organic EL display devices, but the present invention may also be implemented in a manufacturing system for manufacturing substrates or articles for other applications. For example, it may be applied to a manufacturing system for manufacturing energy storage elements by UV-ozone cleaning a substrate, applying a liquid containing an electrical material, and drying it. Alternatively, it may be applied to a manufacturing system for manufacturing optical elements by UV-ozone cleaning a substrate, applying a liquid containing an optical material such as a reflective material or an antistatic material, and drying it. Alternatively, it may be applied to a manufacturing system for manufacturing semiconductor elements by UV-ozone cleaning a substrate equipped with a semiconductor layer. The substrate to be cleaned can be various types of substrates, such as glass substrates, resin substrates, semiconductor substrates, and flexible substrates.

[0102] The present invention can also be realized by supplying a program that implements one or more of the functions of the embodiments to a system or device via a network or storage medium, and by having one or more processors in the computer of that system or device read and execute the program. It can also be realized by a circuit (e.g., an ASIC) that implements one or more functions.

[0103] This specification discloses at least the following: [Matter 1] A light source capable of irradiating an irradiation area containing an oxygen-containing atmosphere with ultraviolet light, A moving unit for moving the substrate into the irradiation area, The system comprises a plurality of nozzles arranged in a direction intersecting the direction of movement of the substrate by the moving part, each capable of supplying inert gas to a different position in the irradiation area, The amount of inert gas supplied from the plurality of nozzles is set according to the distance from the light source to the substrate at the different positions in the irradiation area. A substrate processing apparatus characterized by the following: [Matter 2] In the irradiation region, a relatively large amount of inert gas is supplied from the nozzle at positions where the distance from the light source to the substrate is relatively small. A substrate processing apparatus as described in item 1, characterized by the features described above. [Matter 3] In the direction of movement of the substrate by the moving part, the plurality of nozzles are arranged upstream of the light source. A substrate processing apparatus according to item 1 or 2, characterized by the above. [Matter 4] The system includes a distance measuring unit for acquiring information regarding the distance from the light source to the substrate at different locations within the irradiation area. A substrate processing apparatus according to any one of items 1 to 3, characterized by the features described herein. [Matter 5] In the direction of movement of the substrate by the moving part, the distance measuring part is positioned upstream of the light source. A substrate processing apparatus as described in item 4, characterized by the features described above. [Matter 6] In the direction of movement of the substrate by the moving part, the distance measuring part is positioned upstream of the plurality of nozzles. A substrate processing apparatus as described in item 4, characterized by the features described above. [Matter 7] Each of the aforementioned nozzles is connected to a flow control valve capable of adjusting the flow rate of inert gas. A substrate processing apparatus according to any one of items 1 to 6, characterized by the features described herein. [Matter 8] The irradiation area has a distance measuring unit for acquiring information regarding the distance from the light source to the substrate at different positions within the irradiation area, Each of the aforementioned nozzles is connected to a flow control valve capable of adjusting the flow rate of inert gas. Based on the information obtained by the distance measuring unit regarding the distance from the light source to the substrate at different positions within the irradiation area, the flow rate of the flow control valve is adjusted. A substrate processing apparatus according to any one of items 1 to 3, characterized by the features described herein. [Matter 9] While the light source is not irradiating the irradiation area with ultraviolet light, the distance measuring unit acquires information regarding the distance from the light source to the substrate at different locations within the irradiation area. Based on the information acquired by the distance measuring unit, the flow rate of the flow control valve is adjusted when the light source is irradiating the irradiation area with ultraviolet light. A substrate processing apparatus according to item 8, characterized by the features described above. [Matter 10] While the light source is irradiating the irradiation area with ultraviolet light, the distance measuring unit acquires information regarding the distance from the light source to the substrate at different locations within the irradiation area. Based on the information acquired by the distance measuring unit, the flow rate of the flow control valve is adjusted. A substrate processing apparatus according to item 8, characterized by the features described above. [Matter 11] A substrate processing apparatus described in any one of items 1 to 10, The substrate processing apparatus is equipped with a transport device for transporting substrates. A substrate manufacturing system characterized by the following features. [Matter 12] A substrate processing apparatus described in any one of items 1 to 10, The system includes a liquid coating apparatus for applying a liquid to a substrate processed by the aforementioned substrate processing apparatus. A substrate manufacturing system characterized by the following features. [Matter 13] The aforementioned liquid is a liquid used to form one of the hole injection layer, hole transport layer, light-emitting layer, electron transport layer, or electron injection layer of an organic EL element. A substrate manufacturing system as described in item 12, characterized by the features described above. [Matter 14] A step of performing UV ozone treatment on a substrate using a substrate processing apparatus described in any one of items 1 to 10, The process includes a liquid application step of applying a liquid to the substrate processed by the substrate processing apparatus. A method for manufacturing a substrate, characterized by the following: [Matter 15] The aforementioned liquid is a liquid used to form one of the hole injection layer, hole transport layer, light-emitting layer, electron transport layer, or electron injection layer of an organic EL element. A method for manufacturing a substrate as described in item 14. [Explanation of Symbols]

[0104] 1··Airtight container / 2··Substrate transport unit / 3··UV irradiation unit / 4··Inert gas supply unit / 5··Distance measurement unit / 6··Lift pin / 7··Substrate transport robot / 8··Control unit / 11··Opening / 12··Gate valve / 13··Air intake / 14··Exhaust port / 21··Transport drive unit / 22··Substrate support unit / 31··Lamp housing / 32··UV light source / 33··Irradiation area / 34··UV transmission window / 61··Transfer unit / 71··Robot hand / 100··Substrate cleaning device / 200··Substrate transport device / 411··Flow control valve / 412··Piping / 413··Nozzle / 511··Distance sensor / 512··Measurement window / C··Direction of movement / S··Substrate

Claims

1. A light source capable of irradiating an irradiation area containing an oxygen-containing atmosphere with ultraviolet light, A moving unit for moving the substrate into the irradiation area, The system comprises a plurality of nozzles arranged in a direction intersecting the direction of movement of the substrate by the moving part, each capable of supplying inert gas to a different position in the irradiation area, The amount of inert gas supplied from the plurality of nozzles is set according to the distance from the light source to the substrate at the different positions in the irradiation area. A substrate processing apparatus characterized by the following:

2. In the irradiation region, a relatively large amount of inert gas is supplied from the nozzle at positions where the distance from the light source to the substrate is relatively small. The substrate processing apparatus according to claim 1.

3. In the direction of movement of the substrate by the moving part, the plurality of nozzles are arranged upstream of the light source. The substrate processing apparatus according to claim 1.

4. The system includes a distance measuring unit for acquiring information regarding the distance from the light source to the substrate at different locations within the irradiation area. The substrate processing apparatus according to claim 1.

5. In the direction of movement of the substrate by the moving part, the distance measuring part is positioned upstream of the light source. The substrate processing apparatus according to feature 4.

6. In the direction of movement of the substrate by the moving part, the distance measuring part is positioned upstream of the plurality of nozzles. The substrate processing apparatus according to feature 4.

7. Each of the aforementioned nozzles is connected to a flow control valve capable of adjusting the flow rate of inert gas. The substrate processing apparatus according to claim 1.

8. The irradiation area has a distance measuring unit for acquiring information regarding the distance from the light source to the substrate at different positions within the irradiation area, Each of the aforementioned nozzles is connected to a flow control valve capable of adjusting the flow rate of inert gas. Based on the information obtained by the distance measuring unit regarding the distance from the light source to the substrate at different positions within the irradiation area, the flow rate of the flow control valve is adjusted. The substrate processing apparatus according to claim 1.

9. When the light source is not irradiating the irradiation area with ultraviolet light, the distance measuring unit acquires information regarding the distance from the light source to the substrate at different locations in the irradiation area. Based on the information acquired by the distance measuring unit, the flow rate of the flow control valve is adjusted when the light source is irradiating the irradiation area with ultraviolet light. The substrate processing apparatus according to feature 8.

10. While the light source is irradiating the irradiation area with ultraviolet light, the distance measuring unit acquires information regarding the distance from the light source to the substrate at different locations within the irradiation area. Based on the information acquired by the distance measuring unit, the flow rate of the flow control valve is adjusted. The substrate processing apparatus according to feature 8.

11. A substrate processing apparatus according to any one of claims 1 to 10, The substrate processing apparatus is equipped with a transport device for transporting substrates. A substrate manufacturing system characterized by the following features.

12. A substrate processing apparatus according to any one of claims 1 to 10, The system includes a liquid coating apparatus for applying a liquid to a substrate processed by the aforementioned substrate processing apparatus. A substrate manufacturing system characterized by the following features.

13. The aforementioned liquid is a liquid used to form one of the hole injection layer, hole transport layer, light-emitting layer, electron transport layer, or electron injection layer of an organic EL element. A substrate manufacturing system according to claim 12.

14. A step of performing UV ozone treatment on a substrate using a substrate processing apparatus according to any one of claims 1 to 10, The process includes a liquid application step of applying a liquid to the substrate processed by the substrate processing apparatus. A method for manufacturing a substrate, characterized by the following:

15. The aforementioned liquid is a liquid used to form one of the hole injection layer, hole transport layer, light-emitting layer, electron transport layer, or electron injection layer of an organic EL element. The method for manufacturing a substrate according to claim 14.

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