Support device, support method, and program

Abstract

To provide a support device that can effectively assist in the production of mounted circuit boards. [Solution] The support device 100 is a device for supporting the production of mounted circuit boards and comprises a first communication unit 108 and a processing unit 102. The first communication unit 108 acquires multiple component data Dc used in the production of mounted circuit boards from one or more mounting lines L. The processing unit 102 connects each of the multiple nodes corresponding to the acquired multiple component data Dc to other nodes based on predetermined conditions, and displays the multiple nodes connected to other nodes and the usage history of each of the multiple component data on the first display unit 104.

Description

Technical Field

[0001] The present disclosure relates to a support device for assisting in the production of a mounting substrate and the like.

Background Art

[0002] A component mounting device produces a mounting substrate by mounting components on the substrate based on component data including parameters that define operating modes related to component suction by a nozzle, imaging of components, mounting of components, and the like. The component data may be changed by an operator in order to set appropriate values according to the model of the component mounting device, the type of substrate, and the like, or to improve the mounting quality, the mounting error rate, and the like.

[0003] Patent Document 1 discloses a global component data approval request system including an administrator computer and an operator computer. The operator computer accumulates production result data for each component data created or modified by the operator, and when the production result data satisfies a certain level, transmits the component data to the administrator computer and requests registration as standard component data.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] However, the global component data approval request system of Patent Document 1 has a problem that it is difficult to appropriately support the production of a mounting substrate.

[0006] Therefore, the present disclosure provides a support device that can effectively support the production of a mounting substrate.

Means for Solving the Problems

[0007] An assistance device according to one aspect of the present disclosure is an assistance device for assisting the production of a mounted circuit board, comprising: an acquisition unit that acquires a plurality of component data used in the production of the mounted circuit board in one or more mounting lines; and a processing unit that connects each of the plurality of nodes corresponding to the acquired plurality of component data to other nodes based on predetermined conditions, and displays the plurality of nodes connected to other nodes and the usage record of each of the plurality of component data on a display unit.

[0008] These comprehensive or specific embodiments may be implemented as a system, method, integrated circuit, computer program, or recording medium such as a computer-readable CD-ROM, or as any combination of a system, method, integrated circuit, computer program, and recording medium. Furthermore, the recording medium may be a non-temporary recording medium. [Effects of the Invention]

[0009] The support device described herein can effectively support the production of mounted substrates.

[0010] Further advantages and effects of one aspect of this disclosure will be made apparent from the specification and drawings. Such advantages and / or effects are provided by several embodiments and configurations described in the specification and drawings, but not all configurations are necessarily required. [Brief explanation of the drawing]

[0011] [Figure 1] Figure 1 shows an example of the configuration of the production system in the embodiment. [Figure 2] Figure 2 shows an example of the configuration of a component mounting device in an embodiment. [Figure 3] Figure 3 is a diagram that partially shows an example of the AA cross-section in Figure 2. [Figure 4]Figure 4 is a block diagram showing examples of the functional configurations of the support device and the implementation line in the embodiment. [Figure 5] Figure 5 shows an example of a component library in an embodiment. [Figure 6] Figure 6 shows an example of how the component library is handled in this embodiment. [Figure 7] Figure 7 shows an example of data transmitted from the assembly line to the support device in the embodiment. [Figure 8] Figure 8 is a diagram illustrating an example of processing operation by the processing unit of the support device in the embodiment. [Figure 9] Figure 9 shows an example of the first support screen displayed on the first display unit of the support device in the embodiment. [Figure 10] Figure 10 shows another example of the first support screen displayed on the first display unit of the support device in the embodiment. [Figure 11] Figure 11 shows an example of a second support screen displayed on the first display unit of the support device in the embodiment. [Figure 12] Figure 12 is a flowchart showing an example of the processing operation of the support device in the embodiment. [Figure 13] Figure 13 is a diagram illustrating the evaluation of implementation parameters by the support device in the embodiment. [Figure 14] Figure 14 is a flowchart showing another example of the processing operation of the support device in the embodiment. [Modes for carrying out the invention]

[0012] (Knowledge that forms the basis of this disclosure) The inventors have found that the following problems arise with respect to the global parts data approval request system described in Patent Document 1 above, as stated in the "Background Art" section.

[0013] Component data may have some parameters changed when implementation errors occur during component implementation work, with the parameters of standard component data as the initial values. In the global component data approval request system of Patent Document 1 mentioned above, the changed component data that meets the predetermined conditions is registered as new standard component data.

[0014] In an actual production site, when different workers change the component data of the same component, multiple component data are generated for the same component, and each of the multiple component data may be applied to the production of mounting substrates. Furthermore, since there is no means to easily confirm multiple component data that have been applied to the production of mounting substrates in the past, when implementation errors occur during component implementation work and the component data is changed, component data identical to the component data that has been applied to production in the past may be generated and applied to production again. Thus, the number of multiple component data with usage records for the same component is large and tends to increase with production. Therefore, for example, when implementation errors occur during component implementation work, it is difficult to identify and compare one or more component data related to the target component data (e.g., current component data) from the multiple component data with usage records.

[0015] To solve such problems, a support device according to a first aspect of the present disclosure is a support device for supporting the production of a mounting substrate, including an acquisition unit that acquires a plurality of component data used in the production of the mounting substrate on one or more mounting lines, and a processing unit that connects each of the plurality of nodes corresponding to the acquired plurality of component data to other nodes based on predetermined conditions, and displays on a display unit the plurality of nodes each connected to other nodes and the usage record of each of the plurality of component data.

[0016] This allows multiple nodes to be connected to other nodes based on predetermined conditions and displayed along with their usage history. As a result, operators can understand the relationships between multiple component data corresponding to multiple nodes and compare them with each other in terms of usage history. In other words, it helps determine whether the target component data included in the multiple component data (for example, component data currently used in production and used in production over a predetermined period in the past) is appropriate. Consequently, if, for example, the target component data is determined to be inappropriate, it becomes possible to increase the likelihood of selecting reliable component data from the multiple component data that can produce high-quality mounted boards. Therefore, it can effectively support the production of mounted boards.

[0017] Furthermore, in the support device according to the second embodiment, the usage record is the time when the component data corresponding to the usage record was generated by the one or more mounting lines, and the processing unit may arrange the plurality of nodes in chronological order according to the time when the component data corresponding to each of the plurality of nodes was generated and display them on the display unit. Note that the second embodiment may be subordinate to the first embodiment.

[0018] This allows you to manage when each of multiple part data sets was generated and compare them with each other in terms of their generation time. In other words, by considering when each of the multiple part data sets was generated, you can increase the likelihood of selecting the most reliable part data from among them. Furthermore, since multiple nodes are displayed in chronological order, it is easy to understand when the part data corresponding to each of those nodes was generated.

[0019] Furthermore, in the support device according to the third embodiment, the usage record is at least one of the following when one of the one or more mounting lines performs component mounting work based on component data corresponding to the usage record: (1) an index based on at least one of the number of defective parts, the number of suction errors, the number of recognition errors, and the suction position that occurred in the component mounting work; (2) an index based on the number of mounting errors that occurred in the component mounting work; and (3) an index indicating the productivity of the mounted substrate produced. The processing unit may map each of the plurality of nodes to the position corresponding to the usage record of the component data that corresponds to that node, and display the mapped plurality of nodes on the display unit. Note that the third embodiment may be dependent on the first or second embodiment.

[0020] When assembly errors occur during component assembly and component data is modified, the frequency of errors during component assembly tends to decrease, but component data that reduces productivity may be generated. On the other hand, in the third embodiment, multiple component data can be compared with each other from any of the above viewpoints (1) to (3). As a result, for example, component data that suppresses indicators (1) and (2) and improves indicator (3) can be selected from multiple component data used in the past.

[0021] In other words, conventionally, it is difficult to judge the quality of component data from the perspectives of (1) to (3) above. More specifically, conventionally, when different component data is used for the same type of component on multiple mounting lines, it is difficult to judge the quality of component data used in the past on each mounting line, or component data currently in production that was used in production over a predetermined period in the past, from the perspectives of (1) to (3) above. On the other hand, in the third embodiment, as described above, it is possible to select component data that suppresses indicators (1) and (2) above and improves indicator (3) above. As a result, for example, when component data is changed by the mounting line, it is possible to suppress the possibility of changing the currently used component data to component data with a track record of use that does not allow for the production of effective mounted boards from the perspectives of (1) to (3) above.

[0022] Furthermore, in the support device according to the fourth embodiment, the processing unit may, upon receiving one or more parameters, identify component data containing the one or more parameters from the plurality of component data, and evaluate the one or more parameters based on the usage history of the identified component data. Note that the fourth embodiment may be dependent on any one of the first to third embodiments. For example, the one or more parameters are parameters indicating the mounting conditions of the component.

[0023] This allows, for example, when one or more parameters in component data are changed, the modified parameters are accepted before the component data containing the modified parameters is used in the production of the mounted circuit board. If there is a history of past use of component data containing the modified parameters, the modified parameters are evaluated based on that history. Therefore, if the evaluation result is favorable, component data containing the modified parameters is generated, and the production of mounted circuit boards using that component data is permitted, thereby more effectively supporting the production of mounted circuit boards.

[0024] Furthermore, in the support device according to the fifth embodiment, the processing unit may receive one or more parameters from one of the one or more mounting lines. Note that the fifth embodiment may be dependent on the fourth embodiment.

[0025] This allows the assembly line to accept one or more parameters, enabling the evaluation of one or more parameters used in the production of assembled circuit boards on that line, thereby more effectively supporting the production of assembled circuit boards on that line.

[0026] Furthermore, in the support device according to the sixth embodiment, the processing unit may determine whether the one or more parameters are usable by evaluating them, and if it determines that the one or more parameters are usable, it may generate component data including the one or more parameters, and if it determines that the one or more parameters are unusable, it may guide the generation of component data including one or more parameters different from the one or more parameters. Note that the sixth embodiment may be dependent on the fourth or fifth embodiment.

[0027] As a result, if one or more parameters are determined to be available, component data containing those one or more parameters is generated, allowing production of mounted boards using that component data to be executed on one or more assembly lines. Consequently, the production of appropriate mounted boards can be executed on one or more assembly lines. Furthermore, if one or more parameters are determined to be unavailable, the system guides the generation of component data containing one or more parameters different from those one or more parameters, thereby preventing the production of inappropriate mounted boards.

[0028] Furthermore, in the support device according to the seventh embodiment, the predetermined condition may be that at least one of the following is indicated by two connected nodes: (1) standard component data is downloaded to one or more mounting lines and used as one of the multiple component data; (2) component data used by one or more mounting lines is uploaded as standard component data; (3) if the one or more mounting lines consist of multiple mounting lines, component data is transferred from the first mounting line to the second mounting line among the multiple mounting lines; or (4) in one of the one or more mounting lines, the component data used is changed to other component data. Note that the seventh embodiment may be dependent on any one of the first to sixth embodiments.

[0029] This allows operators to easily track component data downloads, component data uploads, component data transfers between two assembly lines, and component data changes on a single assembly line, all through the connections between nodes.

[0030] Furthermore, in the support device according to the eighth embodiment, the processing unit calculates an index related to production obtained when the mounted board is produced based on the component data as the usage record corresponding to the component data, maps each of the plurality of nodes to a position corresponding to the usage record of the component data corresponding to that node, and displays the mapped plurality of nodes on the display unit. If the one or more mounting lines include two or more mounting lines, and the mounted board is produced based on the same component data in each of the two or more mounting lines, the usage record corresponding to the same component data may be calculated based on the production index of each of the two or more mounting lines. Note that the eighth embodiment may be dependent on any one of the first to seventh embodiments.

[0031] This allows production metrics obtained from the production of mounted boards on two or more mounting lines based on the same component data to be aggregated, for example, to calculate the usage record corresponding to that same component data. Therefore, the reliability of the usage record for the same component data can be increased.

[0032] Furthermore, the support method according to the first embodiment is a support method for a computer to support the production of a mounted circuit board, wherein it acquires multiple component data used in the production of the mounted circuit board in one or more mounting lines, connects each of the multiple nodes corresponding to the acquired multiple component data to other nodes based on predetermined conditions, and displays the usage history of each of the multiple nodes connected to other nodes and each of the multiple component data on a display unit.

[0033] This makes it possible to achieve the same effects and advantages as the support device according to the first embodiment.

[0034] The comprehensive or specific embodiments of the above-described support device may be implemented as a system, method, integrated circuit, computer program, or recording medium such as a computer-readable CD-ROM, or as any combination of a system, method, integrated circuit, computer program, or recording medium. Furthermore, the recording medium may be a non-temporary recording medium.

[0035] The embodiments will be described in detail below with reference to the drawings.

[0036] The embodiments described below are all comprehensive or specific examples. The numerical values, shapes, materials, components, arrangement and connection configurations of components, steps, and the order of steps shown in the following embodiments are examples only and are not intended to limit this disclosure. Furthermore, among the components in the following embodiments, those not described in the independent claim representing the highest-level concept will be described as optional components.

[0037] Furthermore, each figure is a schematic diagram and not necessarily a strictly accurate representation. Also, the same component is denoted by the same reference numeral in each figure.

[0038] (Embodiment) [Production System] Figure 1 shows an example of the configuration of the production system in this embodiment.

[0039] In this embodiment, the production system 1 comprises three mounting lines L (i.e., mounting lines L1 to L3) and a support device 100. In the example shown in Figure 1, the production system 1 has three mounting lines L, but it is not limited to three; it may have one, two, or four or more.

[0040] Each of the assembly lines L1 to L3 is an example of assembly equipment for producing assembled circuit boards. These lines produce assembled circuit boards by performing solder printing, component mounting, and reflow operations on circuit boards brought in from the upstream side, and then transport the produced assembled circuit boards to the downstream side.

[0041] The support device 100 is a device for supporting the production of mounted circuit boards, and for example, it calculates and displays indicators related to the production of mounted circuit boards on each of the mounting lines L1 to L3. The support device 100 communicates with the mounting lines L1 to L3 via wireless or wired connection. The wireless connection may be Wi-Fi®, Bluetooth®, ZigBee®, or low-power radio.

[0042] The assembly line L1 comprises a line management device 200, a substrate supply device M1, a substrate transfer device M2, a solder printing device M3, component mounting devices M4 and M5, an inspection machine M6, a reflow machine M7, and a substrate recovery device M8. The devices included in the assembly line L1, other than the line management device 200, are arranged in the following order and connected in series: substrate supply device M1, substrate transfer device M2, solder printing device M3, component mounting devices M4 and M5, inspection machine M6, reflow machine M7, and substrate recovery device M8. These devices other than the line management device 200 are hereinafter referred to as work machines. The assembly line L1 does not need to include all of the above work machines, as long as it includes the substrate supply device M1, at least one component mounting device, inspection machine M6, and substrate recovery device M8. Furthermore, the mounting line L1 may include, in addition to the above-mentioned work machines, a soldering device for applying solder to the substrate, a component insertion machine for mounting radial or axial components to the substrate, and so on. Also, the arrangement order of each work machine is not limited to the order described above. For example, the inspection machine M6 may be placed after the reflow machine M7 or the substrate recovery device M8. Alternatively, the functions of the inspection machine M6 may be provided by the component mounting machine M4, component mounting machine M5, reflow machine M7, or substrate recovery device M8.

[0043] The line management device 200 retrieves the component library generated by the support device 100 from the support device 100 and causes each work machine included in the mounting line L1 to produce mounted boards based on that component library. As described later, the component library contains data for multiple components, and the line management device 200 may modify or change the component library.

[0044] The substrate supply device M1 supplies substrates to be used for the mounted boards produced on the mounting line L1 to the solder printing device M3 via the substrate transfer device M2. The solder printing device M3 performs the solder printing operation described above. In other words, the solder printing device M3 screen prints solder onto the substrates it receives from the substrate transfer device M2.

[0045] Each of the component mounting devices M4 and M5 performs the component mounting operation described above, which involves mounting one or more components onto one or more circuit boards. While the mounting line L1 is equipped with two component mounting devices M4 and M5, the number is not limited to two; it could be one, three, or more. Furthermore, it can be said that the mounted circuit boards are essentially produced through the component mounting operation performed by these component mounting devices M4 and M5.

[0046] The inspection machine M6 inspects the components mounted on the circuit board by the component mounting devices M4 and M5, and notifies the support device 100 of the inspection results via the line management device 200.

[0047] The reflow machine M7 performs the reflow operation described above. Specifically, the reflow machine M7 heats the circuit boards with components mounted on them, which have been transported from the component mounting machines M4 and M5 via the inspection machine M6, to harden the solder on the circuit boards and join the electrodes of the circuit boards to the components. In particular, the reflow machine M7 melts and solidifies the solder for component joining by heating according to a predetermined heating profile. This solders the components to the circuit board. The circuit board retrieval device M8 retrieves the circuit boards with the soldered components from the reflow machine M7.

[0048] The mounting lines L2 and L3 have the same configuration as mounting line L1. In this embodiment, each of the mounting lines L1 to L3 has the same configuration, but they may have different configurations. Also, in this embodiment, each of the mounting lines L1 to L3 is equipped with a line management device 200, but the line management device 200 may be provided independently of each of the mounting lines L1 to L3, or it may be incorporated into each of the mounting lines L1 to L3.

[0049] [Component mounting equipment] Figure 2 shows an example of the configuration of component mounting device M4. In this embodiment, component mounting device M5 has the same configuration as component mounting device M4. In this embodiment, the transport direction of substrate B is referred to as the X-axis direction, and the direction perpendicular to the X-axis direction is referred to as the Y-axis direction. The X-axis direction and Y-axis direction are directions along the horizontal plane. Furthermore, the direction perpendicular to the X-axis direction and Y-axis direction is referred to as the Z-axis direction. The positive and negative sides of the X-axis direction are the downstream and upstream sides in the transport direction of substrate B, respectively, and the positive and negative sides of the Y-axis direction are the rear (or far side) and front (or near side) in the front-to-back direction, respectively. The positive and negative sides of the Z-axis direction are the upper and lower sides in the up-and-down direction, respectively. Figure 2 shows the top surface of component mounting device M4.

[0050] The component mounting device M4 comprises a base 4, a substrate transport mechanism 5, two component supply units 6, two X-axis beams 9, a Y-axis beam 8, two mounting heads 10, two component recognition cameras 11, and two substrate recognition cameras 12.

[0051] The substrate transport mechanism 5 is equipped with two rails aligned in the X-axis direction and is positioned in the center of the base 4. The substrate transport mechanism 5 transports the substrate B brought in from the upstream side and positions and holds the substrate B in a position for performing component mounting work.

[0052] The two component supply units 6 are arranged so as to sandwich the substrate transport mechanism 5 in the Y-axis direction. Each component supply unit 6 has multiple feeders 7 arranged in parallel along the X-axis direction. The feeders 7 feed the component tape containing the components in a pitch in the tape feeding direction, supplying the components to the position where the components are picked up by the mounting head 10 (hereinafter referred to as the component pick-up position).

[0053] The parts supply unit 6 may also be equipped with a tray feeder, a stick feeder, or a bulk feeder. A tray feeder supplies parts from a tray containing parts. A stick feeder supplies parts from a stick case containing parts. A bulk feeder supplies parts from a bulk case containing parts.

[0054] The Y-axis beam 8 is positioned along the Y-axis direction at one end of the base 4's upper surface in the X-axis direction (the right side in Figure 2). Each of the two X-axis beams 9 is coupled to the Y-axis beam 8 so as to be movable in the Y-axis direction while remaining aligned with the X-axis direction.

[0055] The mounting head 10 is mounted on each of the two X-axis beams 9 so as to be movable in the X-axis direction. The mounting head 10 is equipped with multiple suction units 10a that can move up and down while picking up and holding parts. Each tip of the suction unit 10a is provided with a suction nozzle 10b (see Figure 3).

[0056] Each of the two mounting heads 10 moves in the X-axis and Y-axis directions by driving the Y-axis beam 8 and the X-axis beam 9. As a result, each of the two mounting heads 10 picks up components from the component pick-up position of the feeder 7 located in the component supply unit 6 corresponding to the mounting head 10 using the suction nozzle 10b, and mounts them to the mounting point (or mounting position) on the substrate B positioned by the substrate transport mechanism 5.

[0057] Each of the two component recognition cameras 11 is positioned between one of the two component supply units 6 and the substrate transport mechanism 5. The component recognition camera 11 captures an image of a component as the mounting head 10, which has taken a component from the component supply unit 6, moves above the component recognition camera 11. In other words, the component recognition camera 11 recognizes the holding position of a component by capturing an image of the component while it is held by the mounting head 10.

[0058] The substrate recognition camera 12 is attached to the plate 9a to which the mounting head 10 is mounted. Therefore, the substrate recognition camera 12 moves integrally with the mounting head 10. As the mounting head 10 moves, the substrate recognition camera 12 moves above the substrate B positioned by the substrate transport mechanism 5, and recognizes the position of the substrate B by capturing images of the substrate marks (not shown) provided on the substrate B. When the mounting head 10 mounts components onto the substrate B, the mounting position is corrected based on the component recognition result by the component recognition camera 11 and the position recognition result of the substrate B by the substrate recognition camera 12.

[0059] It can be said that such a component mounting device M4 has two stages. Each of the two stages has a component supply unit 6, an X-axis beam 9, a mounting head 10, and a substrate recognition camera 12.

[0060] Figure 3 is a diagram partially showing an example of the AA cross-section in Figure 2. Component mounting devices M4 and M5 have the function of mounting components P onto substrate B.

[0061] As shown in Figure 3, the parts supply unit 6 comprises a feeder base 13a, a plurality of feeders 7 mounted on the feeder base 13a, and a trolley 13 that supports the feeder base 13a.

[0062] The trolley 13 is configured to be detachably attached to the component mounting devices M4 and M5, and is further equipped with a cassette holder 15. The cassette holder 15 is configured to hold multiple component reels C. Each component reel C stores a component tape 14 in a wound state. Each of the multiple component reels C is held in the upper holding position Hu or the lower holding position Hd of the cassette holder 15. The component tape 14 pulled out from the component reels C held by the cassette holder 15 is mounted on the feeder 7. The feeder 7 may be placed on a feeder base 13a provided on the base 4 without using the trolley 13. Alternatively, the trolley 13 may hold the component reels C instead of the cassette holder 15.

[0063] Each suction nozzle 10b attached to the mounting head 10 picks up and moves the component P supplied from the feeder 7 to the component picking position, thereby mounting the component P to the mounting position on the substrate B.

[0064] In this embodiment, as described above, the component mounting devices M4 and M5 have the same configuration, but they may have different configurations.

[0065] [Functional configuration of support equipment and implementation line] Figure 4 is a block diagram showing examples of the functional configurations of the support device 100 and the implementation lines L1 to L3.

[0066] The support device 100 includes a support control unit 101, a processing unit 102, a first input unit 103, a first display unit 104, a first production storage unit 105, a monitoring data storage unit 106, a used parts data storage unit 107, and a first communication unit 108.

[0067] The processing unit 102 generates a component library containing multiple component data and stores it in the first production storage unit 105. Each of the multiple component data indicates the shape, mounting conditions, etc., of the component P to be mounted on the substrate B. The processing unit 102 also generates production data based on these component libraries and stores it in the first production storage unit 105. The production data indicates, for example, the mounting order of at least one component P to be mounted on the substrate B and the position where those components P are mounted on the substrate B (i.e., the mounting position described above).

[0068] Furthermore, the processing unit 102 calculates production indicators for each of the mounting boards on mounting lines L1 to L3 based on multiple monitoring data sequences stored in the monitoring data storage unit 106. These production indicators are also referred to as production-related indicators below.

[0069] The first input unit 103 receives input operations from, for example, an operator of the production system 1, and outputs a signal corresponding to that input operation to at least one of the support control unit 101 and the processing unit 102. Such a first input unit 103 may include, for example, a keyboard, touch sensor, touchpad, or mouse.

[0070] The first display unit 104 displays, for example, nodes corresponding to each of the multiple component data used in the component mounting work, which are stored in the component data storage unit 107, as well as production-related indicators calculated by the processing unit 102. Specific examples of the first display unit 104 include, but are not limited to, liquid crystal displays, plasma displays, or organic EL (Electro-Luminescence) displays.

[0071] The first production storage unit 105 is a recording medium for storing a parts library and production data. The monitoring data storage unit 106 is a recording medium for storing monitoring data sequences showing the monitoring results for each of the mounting lines L1 to L3. The used parts data storage unit 107 is a recording medium for storing data on multiple parts used in the parts mounting work on each of the mounting lines L1 to L3 (hereinafter also referred to as used parts data). For example, these recording media may be hard disks, ROMs (Read Only Memory), RAMs (Random Access Memory), or semiconductor memory. Such recording media may be volatile or non-volatile.

[0072] The first communication unit 108 communicates with each of the mounting lines L1 to L3. For example, in response to control by the support control unit 101, the first communication unit 108 transmits the parts library and production data stored in the first production storage unit 105 to each of the mounting lines L1 to L3. The first communication unit 108 also receives the aforementioned monitoring data sequence from each of the mounting lines L1 to L3 and stores it in the monitoring data storage unit 106. Furthermore, the first communication unit 108 receives used parts data from each of the mounting lines L1 to L3 and stores it in the used parts data storage unit 107. It can also be said that the first communication unit 108 is configured as an acquisition unit that acquires the monitoring data sequence and used parts data.

[0073] The support control unit 101 controls the processing unit 102, the first display unit 104, the first production storage unit 105, the monitoring data storage unit 106, the parts usage data storage unit 107, and the first communication unit 108.

[0074] The support device 100 may be configured as a single device or as multiple devices. For example, the support device 100 may consist of a first device including a first input unit 103 and a first display unit 104, and a second device including all components other than the first input unit 103 and the first display unit 104. In this case, the first device may be located in the same factory as the mounting lines L1 to L3, and the second device may be located on a cloud server outside that factory. Alternatively, the entire support device 100 may be provided on the cloud server or located in the aforementioned factory.

[0075] The mounting line L1 comprises a line control unit 201, a second input unit 203, a second display unit 204, a second communication unit 208, a second production storage unit 205, and a plurality of work machines 210. The plurality of work machines 210 are component mounting devices M4 and M5, etc. In addition, each component other than the plurality of work machines 210 included in the mounting line L1 may be provided in the line management device 200 or in any of the work machines 210.

[0076] The second input unit 203, like the first input unit 103 of the support device 100, receives input operations from, for example, an operator of the production system 1, and outputs an input signal corresponding to that input operation to the line control unit 201. Such a second input unit 203 may include, for example, a keyboard, a touch sensor, a touchpad, or a mouse.

[0077] The second display unit 204 displays information corresponding to the input signal, for example, in response to control by the line control unit 201. Specific examples of the second display unit 204 include, but are not limited to, liquid crystal displays, plasma displays, or organic EL displays.

[0078] The second communication unit 208 communicates with the support device 100. For example, when the second communication unit 208 receives a parts library and production data from the first communication unit 108 of the support device 100, it stores the parts library and production data in the second production storage unit 205. Also, when the second communication unit 208 acquires a series of monitoring data generated based on the monitoring results of multiple work machines 210, it transmits the series of monitoring data to the first communication unit 108 of the support device 100.

[0079] The second production storage unit 205 is a recording medium for storing a parts library and production data. The second production storage unit 205 may also store a series of monitoring data. For example, the recording medium may be a hard disk, ROM, RAM, or semiconductor memory. Such a recording medium may be volatile or non-volatile.

[0080] The multiple work machines 210 include a substrate supply device M1, a substrate transfer device M2, a solder printing device M3, component mounting devices M4 and M5, an inspection machine M6, a reflow device M7, and a substrate recovery device M8.

[0081] The line control unit 201 controls each component of the mounting line L1 other than the line control unit 201 itself. For example, the line control unit 201 controls each component based on operator input operations received by the second input unit 203. The line control unit 201 also causes multiple work machines 210 to perform the aforementioned solder printing, component mounting, and reflow operations based on the component library and production data stored in the second production storage unit 205. The line control unit 201 also monitors the multiple work machines 210. As a result, the line control unit 201 generates a series of monitoring data indicating the status when the mounting line L1 was mounting component P onto the substrate B, and transmits this series of monitoring data to the support device 100 from the second communication unit 208. The line control unit 201 also modifies the component library, specifically component data, stored in the second production storage unit 205 according to the operator input operations received by the second input unit 203. When component data is changed, the line control unit 201 causes component mounting devices M4 and M5 to perform component mounting work according to the changed component data. The line control unit 201 then causes the second communication unit 208 to transmit the changed component data as used component data to the support device 100.

[0082] [Parts Library] Figure 5 shows an example of a parts library.

[0083] The component library Lb consists of multiple component data Dc. Each of the multiple component data Dc is data for one type of component P, and is associated with a component code that identifies the type of component P. Such component data Dc includes configuration information d regarding the configuration of component P, and mounting parameters f which are the mounting conditions for component mounting equipment M4 or M5 for mounting component P onto substrate B. In addition, images, numerical values, or terms are shown in the blank spaces of each item in the component data Dc shown in Figure 5.

[0084] Configuration information d includes, for example, a shape diagram d1 of part P, size data d2, and part parameters d3.

[0085] Shape diagram d1 illustrates the external shape of part P corresponding to its part data Dc. Size data d2 numerically indicates information about the size of part P, namely its external dimensions, number of leads, lead pitch, lead length, lead width, and part height.

[0086] The component parameter d3 is attribute information about the component P. Such a component parameter d3 includes component attributes d31, which are information about the component P itself, and tape information d32, which are information about the component tape 14 for supplying the component P by the feeder 7. The component attributes d31 indicate, for example, the polarity, polarity mark, mark position, component type, and shape type of the component P. The tape information d32 includes, for example, the tape material of the component tape 14, the tape width indicating the width dimension of the component tape 14, the feed interval indicating the tape feed pitch of the component tape 14 by the feeder 7, and information about the color and material of the component tape 14.

[0087] The mounting parameter f is the mounting condition for the component mounting device M4 or M5 to mount component P onto substrate B. This mounting parameter f can also be described as a machine parameter that defines the operating mode of the component mounting device M4 or M5. In this example, the mounting parameter f includes nozzle information f2 indicating the type of suction nozzle 10b used. Furthermore, the mounting parameter f includes speed parameter f3, recognition information f4, gap information f5, suction information f6, and mounting information f7. Each of these nozzle information f2, speed parameter f3, recognition information f4, gap information f5, suction information f6, and mounting information f7 can also be described as a mounting parameter f.

[0088] The speed parameter f3 includes the lifting speed when the component P is picked up by the suction nozzle 10b, the mounting speed when the component P is transported by the mounting head 10, and the tape feeding speed when the component tape 14 is fed by the feeder 7. The recognition information f4 is a parameter that defines the manner of component recognition. Specifically, the recognition information f4 includes the camera type indicating the type of component recognition camera 11 used, the illumination mode indicating the illumination form when imaging is performed by the component recognition camera 11, and the recognition speed indicating the speed at which the mounting head 10 moves during imaging. The gap information f5 includes the suction gap when the component P is picked up by the suction nozzle 10b and the mounting gap when the picked-up component P is mounted on the substrate B.

[0089] The suction information f6 includes the suction position offset, which indicates the amount of offset when the component P is suctioned by the suction nozzle 10b, and the suction angle. The mounting information f7 indicates the mounting load, which is the pressing load when the component P, which has been suctioned by the suction nozzle 10b, is mounted on the substrate B.

[0090] Note that the configuration information d and implementation parameters f included in the component data Dc in Figure 5 are examples only, and may represent other information besides the information shown in Figure 5, may represent both the information shown in Figure 5 and other information, or may represent only a part of the information shown in Figure 5. Furthermore, the number of pieces of information included in each of the configuration information d and implementation parameters f may be one or multiple.

[0091] Figure 6 shows an example of how the component library Lb is handled.

[0092] First, the component library Lb generated by the processing unit 102 is stored in the first production storage unit 105 of the support device 100 as the first component library Lb1. This first component library Lb1 is also called the master or master component library.

[0093] Then, the support control unit 101 of the support device 100 transmits the first component library Lb1 stored in its first production storage unit 105 to each of the mounting lines L1 to L3. As a result, the first component library Lb1 is stored as the second component library Lb2 in the second production storage unit 205 of each of the mounting lines L1 to L3.

[0094] The component mounting devices M4 and M5 of each mounting line L mount one or more components P onto one or more substrates B according to the second component library Lb2 stored in the second production storage unit 205 located in the mounting line L. Here, the line control unit 201 of each mounting line L modifies the second component library Lb2 in response to, for example, an input operation by an operator to the second input unit 203. For example, the mounting parameter f of the component data Dc included in the second component library Lb2 is changed. Once such a change is made, the component mounting devices M4 and M5 of each mounting line L mount one or more components P onto one or more substrates B according to the modified and updated second component library Lb2.

[0095] As a result, when component mounting work begins on mounting lines L1 to L3, the first component library Lb1 and the second component libraries Lb2 of each mounting line L1 to L3 may be different from each other. Furthermore, the second component libraries Lb2 of each mounting line L1 to L3 may also be different from each other.

[0096] [Monitoring data columns and component data] Figure 7 shows an example of data transmitted from the implementation lines L1 to L3 to the support device 100.

[0097] Each of the mounting lines L1 to L3 monitors its own component mounting work while component mounting is being performed and transmits a monitoring data sequence Dx showing the monitoring results to the support device 100. This monitoring data sequence Dx consists of a sequence of multiple monitoring data Da. In other words, each of the mounting lines L1 to L3 repeatedly transmits the monitoring data Da to the support device 100, for example, periodically. Furthermore, each of the mounting lines L1 to L3 transmits the modified component data Dc to the support device 100 when the component data Dc contained in the second component library Lb2 stored in its second production storage unit 205 is changed, as described above. This modified component data Dc can also be said to be newly generated component data Dc. This modified component data Dc is also transmitted to the support device 100 as used component data Dc. In this way, the monitoring data sequence Dx and component data Dc are transmitted from the second communication unit 208 to the first communication unit 108.

[0098] [Processing operation of the support device] Figure 8 is a diagram illustrating an example of processing operation by the processing unit 102 of the support device 100.

[0099] The processing unit 102 of the support device 100 acquires a monitoring data sequence Dx from each of the mounting lines L1 to L3 via the first communication unit 108. The monitoring data sequence Dx consists of a sequence of monitoring data Da that is repeatedly transmitted while the component mounting work is being performed, and indicates the content of the component mounting work. In a specific example, the monitoring data Da shows, for each type of component P, the work time, which is the time spent performing the component mounting work to mount that type of component P onto the substrate B, and the actual number during that work time (i.e., the number of mounting operations, mounting points, losses, and defects of that type of component P). The number of mounting operations is sometimes also called the number of pick-up operations. The number of mounting points is the number of times that type of component P was mounted onto the substrate B. The number of losses is the sum of the number of pick-up errors where the pick-up nozzle 10b could not properly pick up that type of component P and the number of recognition errors where the component recognition camera 11 could not properly recognize that type of component P. The number of defects is the number of mounting errors where that type of component P was not correctly mounted in the mounting position on the substrate B. A suction error includes at least one of the following: an error in which the suction nozzle 10b fails to pick up the component P of that type; and an error in which the suction nozzle 10b picks up the component P of that type in an abnormal orientation. A recognition error includes at least one of the following: an error in which the orientation of the component P of that type held by the suction nozzle 10b cannot be recognized; and an error in which the component P of that type that should be held by the suction nozzle 10b cannot be recognized. The orientation of the component P is at least one of the center position, front / back, and supply direction of the component P. A mounting error includes at least one of the following: an error in which the component P of that type is not on the mounting substrate; an error in which the misalignment amount of the component P of that type exceeds an allowable value; and an error in which the suction nozzle 10b is unable to mount the component P of that type onto the substrate B and takes it back (hereinafter also called a take-back error). A take-back error is detected by measuring the flow rate of air sucked into the suction nozzle 10b after component mounting using a flow sensor.

[0100] Each of the mounting lines L1 to L3, when component mounting work is performed, aggregates the actual number of component P of each type (number of mounting operations, number of mounted items, number of spoiled items, number of defects) for that type of component P, based on the working time. For example, the line control unit 201 aggregates the number of mounting operations, number of mounted items, and number of spoiled items by monitoring component mounting devices M4 and M5. The line control unit 201 also aggregates the number of mounting errors, excluding the aforementioned take-back errors, by monitoring the inspection results of the mounted board by the inspection machine M6, and includes the number of take-back errors in the number of defects. The line control unit 201 also aggregates the number of aforementioned take-back errors in the number of defects by monitoring component mounting devices M4 and M5. For each working time, which is the time during which component mounting work is performed, the line control unit 201 generates the aggregated actual numbers (number of mounting operations, number of mounted items, number of spoiled items, number of defects) for that working time, along with monitoring data Da indicating the working time. Furthermore, each time the line control unit 201 generates monitoring data Da, it causes the second communication unit 208 to transmit the monitoring data Da to the support device 100.

[0101] In a specific example, as shown in Figure 8, the monitoring data Da shows the actual number of component Pa (number of mounting operations, number of mounted points, number of spoiled items, number of defects) of component Pa, which is component P of type a, at work time t, as (Aa1, Ab1, Ac1, Ad1). Furthermore, the monitoring data Da also shows the actual number of component P (number of mounting operations, number of mounted points, number of spoiled items, number of defects) at work time t for each of several other component P types, similar to component Pa. For example, work time t may be 1 minute or any other time. Alternatively, instead of work time t, the actual number of component Pa (component P of type a) may be aggregated by the number of mounted boards produced.

[0102] When the processing unit 102 of the support device 100 acquires a monitoring data sequence Dx containing such monitoring data Da from its mounting line L, it calculates production-related indicators for each type of component P based on the monitoring data sequence Dx and cumulative period information De. Production-related indicators are indicators related to the production of mounted boards, such as productivity, spoilage rate, and defect rate. Cumulative period information De indicates the period corresponding to the calculated production-related indicators. For example, when calculating production-related indicators for mounting line L1, the period indicated by cumulative period information De is the period from time t0 or time t1 shown in Figure 9 to the calculation time. The period indicated by cumulative period information De is also called the cumulative period.

[0103] In a specific example, the calculation date in Figure 8 indicates the day on which the production-related indicators were calculated. The production-related indicators corresponding to each calculation date in Figure 8 are production-related indicators based on the cumulative number of actual component mounting operations in which component Pa was picked up by component mounting machines M4 and M5 over a cumulative period. Productivity is, for example, the number of mounting operations per unit time, and CPH (chips per hour) is used as one specific unit of productivity. The spoilage rate is, for example, the ratio of the number of spoiled parts of a particular product type to the number of times the suction nozzle 10b attempted to pick up component P of that product type (i.e., the number of mounting operations or number of pick-ups). ppm (parts per million) is used as one specific unit of the spoilage rate. The defect rate is, for example, the ratio of the number of defective parts of a particular product type to the number of component P of that product type mounted (i.e., the number of mounted points). Similar to the spoilage rate, ppm is used as one specific unit of the defect rate.

[0104] In other words, for each of the multiple varieties of part P, the processing unit 102 accumulates the actual number of parts P of that variety (number of mounting operations, number of mounted parts, number of spoiled parts, number of defective parts), as shown in the monitoring data column Da, for the cumulative period at each predetermined calculation point. Then, the processing unit 102 calculates the (productivity, spoilage rate, defect rate) of part P of that variety from the actual number accumulated during that cumulative period. For example, the processing unit 102 calculates (Ae1, Af1, Ag1) as the (productivity, spoilage rate, defect rate) of part P at the first calculation point T1 (e.g., day 1). Furthermore, the processing unit 102 calculates (Ae2, Af2, Ag2) as the (productivity, spoilage rate, defect rate) of part P at the second calculation point T2 (e.g., day 2).

[0105] Figure 9 shows an example of the first support screen displayed on the first display unit 104 of the support device 100. In the example shown in Figure 9, the production system 1 includes not only mounting lines L1 to L3 but also mounting line L4. Mounting line L4 has the same configuration as mounting lines L1 to L3.

[0106] As shown in Figure 9, the processing unit 102 of the support device 100 displays the first support screen 104a on the first display unit 104. On the first support screen 104a, nodes corresponding to each of the multiple component data Dc are arranged in chronological order. The multiple component data Dc corresponding to the multiple nodes displayed in this way correspond to components P of the same type.

[0107] In Figure 9, nodes are represented by marks of various shapes, such as stars, triangles, squares, rhombuses, and circles. Furthermore, in Figure 9, the first production storage unit 105 and the second production storage units 205 for each of the mounting lines L1 to L4 are arranged sequentially along the vertical axis. The horizontal axis of Figure 9 indicates the time when the component data Dc corresponding to the node was generated or modified. Note that the time may include the year, month, and day, or it may simply represent a period of time.

[0108] Specifically, nodes n1, n2, and n3, corresponding to the component data Dc stored in the first production storage unit 105, are displayed at the positions of time t0, time t7, and time t11, respectively. Nodes n11, n12, and n13, corresponding to the component data Dc stored in the second production storage unit 205 of the mounting line L1, are displayed at the positions of time t2, time t3, and time t5, respectively. Node n21, corresponding to the component data Dc stored in the second production storage unit 205 of the mounting line L2, is displayed at the position of time t1. Nodes n31 and n32, corresponding to the component data Dc stored in the second production storage unit 205 of the mounting line L3, are displayed at the positions of time t9 and time t10, respectively. Nodes n41, n42, and n43, corresponding to the component data Dc stored in the second production storage unit 205 of the mounting line L4, are displayed at the positions of time t4, time t6, and time t8, respectively.

[0109] Furthermore, the processing unit 102 includes multiple arrows indicating the transitions between multiple component data Dc in the first support screen 104a. In other words, the processing unit 102 indicates the transitions between the component data Dc corresponding to a node and the component data Dc corresponding to other nodes by connecting each of the multiple nodes corresponding to multiple component data Dc to other nodes, for example, using arrows.

[0110] More specifically, the first support screen 104a shown in Figure 9 represents the following transition of component data Dc.

[0111] First, component data Dc corresponding to node n1 is generated by the support device 100 at time t0 and stored in the first production storage unit 105. This component data Dc is transmitted (i.e., downloaded) to the mounting line L2 at time t1, stored in the second production storage unit 205, and used for component mounting work on the mounting line L2. In other words, component data Dc corresponding to node n21 is generated at time t1.

[0112] Similarly, component data Dc corresponding to node n1 is transmitted (i.e., downloaded) to the mounting line L1 at time t2, stored in the second production storage unit 205, and used for component mounting work on the mounting line L1. In other words, component data Dc corresponding to node n11 is generated at time t2.

[0113] On assembly line L1, the component data Dc corresponding to node n11 is changed at time t3, generating the component data Dc corresponding to node n12, which is then used for component assembly work on assembly line L1. Furthermore, the component data Dc corresponding to node n12 is changed at time t5, generating the component data Dc corresponding to node n13, which is then used for component assembly work on assembly line L1.

[0114] Here, the component data Dc corresponding to node n13 is transmitted (i.e., uploaded) from the mounting line L1 to the support device 100, and the component data Dc corresponding to node n1 is changed to the component data Dc corresponding to node n13. As a result, component data Dc corresponding to node n2, which is identical to the component data Dc corresponding to node n13, is generated and stored in the first production storage unit 105. Then, at time t9, the component data Dc corresponding to node n2 is transmitted (i.e., downloaded) to the mounting line L3, stored in the second production storage unit 205, and used for component mounting work on the mounting line L3. In other words, the component data Dc corresponding to node n31 is generated at time t9.

[0115] In the assembly line L3, the component data Dc corresponding to node n31 is changed at time t10, generating component data Dc corresponding to node n32, which is then used for component assembly work in the assembly line L3. Here, the component data Dc corresponding to node n32 is transmitted (i.e., uploaded) from the assembly line L3 to the support device 100, and the component data Dc corresponding to node n2 is changed to the component data Dc corresponding to node n32. As a result, component data Dc corresponding to node n3, which is identical to the component data Dc corresponding to node n32, is generated and stored in the first production storage unit 105. The component data Dc corresponding to node n32 may be the component data Dc currently in use in the assembly line L3.

[0116] In assembly line L4, component data Dc corresponding to node n21 of assembly line L2 is transmitted (i.e., transferred) to assembly line L4 at time t4, stored in the second production storage unit 205, and used for component assembly work on assembly line L4. In other words, component data Dc corresponding to node n41 is generated at time t4. Furthermore, by changing the component data Dc corresponding to node n41 at time t6, component data Dc corresponding to node n42 is generated and used for component assembly work on assembly line L4. Furthermore, by changing the component data Dc corresponding to node n42 at time t8, component data Dc corresponding to node n43 is generated and used for component assembly work on assembly line L4. The component data Dc corresponding to node n43 may be the component data Dc currently in use on assembly line L4.

[0117] The display of this first support screen 104a references the parts usage data storage unit 107 and the first production storage unit 105.

[0118] The used parts data storage unit 107 stores used parts data Dc for each of the mounting lines L1 to L4. When the first communication unit 108 stores used parts data Dc transmitted from mounting line L in the used parts data storage unit 107, it adds additional information to the used parts data Dc in accordance with the control of the processing unit 102. The additional information includes identification information of the mounting line L that transmitted the used parts data Dc and the time when the used parts data Dc was transmitted. The first communication unit 108 associates this additional information with the used parts data Dc and stores the used parts data Dc with the associated additional information in the used parts data storage unit 107.

[0119] In addition, the first production storage unit 105 stores history information in addition to the first component library Lb1. The history information includes initial information, one or more download information entries, and one or more upload information entries. The initial information indicates the time (e.g., time t0) when the first component library Lb1 was generated by the processing unit 102. The download information includes the time (e.g., time t1) when the first component library Lb1 was downloaded to the mounting line L, and information for identifying the mounting line L to which the first component library Lb1 was downloaded. The upload information includes the time (e.g., time t7) when the component data Dc contained in the first component library Lb1 was modified by the aforementioned upload, information for identifying the mounting line L that performed the upload, and information for identifying the component data Dc that was modified by the upload.

[0120] When processing such as generating the first parts library Lb1, downloading the first parts library Lb1, or uploading parts data Dc is performed, the processing unit 102 of the support device 100 updates the history information stored in the first production storage unit 105 according to the content of that processing.

[0121] Then, in response to an input operation by the operator to the first input unit 103, the processing unit 102 receives a display instruction for the first support screen 104a and refers to the used parts data storage unit 107. At this time, the processing unit 102 refers to the multiple used parts data Dc stored in the used parts data storage unit 107 and the additional information associated with each of the multiple used parts data Dc. Furthermore, the processing unit 102 refers to the history information stored in the first production storage unit 105. Based on the results of these references, the processing unit 102 generates the first support screen 104a and displays it on the first display unit 104.

[0122] Figure 10 shows another example of the first support screen 104a displayed on the first display unit 104 of the support device 100. In the example of Figure 10, as in the example of Figure 9, the production system 1 is equipped not only with mounting lines L1 to L3 but also with mounting line L4.

[0123] In the example shown in Figure 10, the processing unit 102 displays identifiers such as (1), (2), (3), and (4) on the first support screen 104a on the first display unit 104. These identifiers are information for identifying the transitions in the component data Dc. Furthermore, the processing unit 102 displays the legend 41 on the first support screen 104a on the first display unit 104. The legend 41 shows the content of the transitions identified by each identifier.

[0124] For example, the identifier (1) is information used to identify the transition from the part data Dc corresponding to node n1 to the part data Dc corresponding to node n11. Legend 41 indicates that for the identifier (1), the transition is "derived from the master". In other words, it is indicated that the part data Dc corresponding to node n11 is derived from the part data Dc corresponding to node n1 (i.e., the part data Dc included in the master of the first production storage unit 105).

[0125] The identifier in (2) is information used to identify the transition from the part data Dc corresponding to node n11 to the part data Dc corresponding to node n12. Legend 41 indicates that the transition content for identifier (2) is "edit". In other words, it indicates that the part data Dc corresponding to node n12 was generated by editing (i.e., modifying) the part data Dc corresponding to node n11.

[0126] The identifier in (3) is information used to identify the transition from the part data Dc corresponding to node n12 to the part data Dc corresponding to node n13. Legend 41 indicates that the transition content for identifier (3) is "edit". In other words, it indicates that the part data Dc corresponding to node n13 was generated by editing (i.e., modifying) the part data Dc corresponding to node n12.

[0127] The identifier in (4) is information used to identify the transition from the part data Dc corresponding to node n13 to the part data Dc corresponding to node n2. Legend 41 indicates that the transition for identifier (4) is "reflection to the master". In other words, it indicates that the part data Dc corresponding to node n2, which is included in the master of the first production storage unit 105, was generated by reflecting the part data Dc corresponding to node n13. To put it another way, it indicates that the part data Dc corresponding to node n1, which was included in the master of the first production storage unit 105, has been updated to the part data Dc corresponding to node n2.

[0128] Note that the horizontal axis shown in Figures 9 and 10 represents time, but it may also represent a period. Such time or period can be said to represent the actual usage of component data Dc. Furthermore, in this embodiment, multiple nodes corresponding to multiple component data for each of the four mounting lines L1 to L4 are displayed, but multiple nodes for a single mounting line L may also be displayed.

[0129] As described above, the support device 100 in this embodiment is a device for supporting the production of mounted circuit boards, and comprises a first communication unit 108 corresponding to an acquisition unit and a processing unit 102. The first communication unit 108 acquires a plurality of component data Dc used in the production of mounted circuit boards in one or more mounting lines L. The processing unit 102 then connects each of the plurality of nodes corresponding to the acquired plurality of component data Dc to other nodes based on predetermined conditions, and displays the plurality of nodes connected to other nodes, as well as the usage history of each of the plurality of component data on the first display unit 104.

[0130] This allows multiple nodes to be connected to other nodes based on predetermined conditions and displayed along with their usage history. As a result, operators can understand the relationships between multiple component data Dc corresponding to multiple nodes and compare them with each other in terms of usage history. In other words, it helps determine whether a target component data Dc included in multiple component data Dc (for example, component data Dc currently in production and used in production over a predetermined period in the past) is appropriate. Consequently, if, for example, a target component data Dc is determined to be inappropriate, it becomes possible to increase the likelihood of selecting a reliable component data Dc from multiple component data Dc that can produce high-quality mounted boards. Therefore, it can effectively support the production of mounted boards.

[0131] In this embodiment, the usage record is the time when the component data Dc corresponding to that usage record was generated by one or more mounting lines L. The processing unit 102 displays the multiple nodes in chronological order on the first display unit 104 according to the time when the component data Dc corresponding to each of the multiple nodes was generated.

[0132] This allows us to manage when each of the multiple part data Dc files was generated and compare them with each other in terms of their generation time. In other words, by considering when each of the multiple part data Dc files was generated, we can increase the likelihood of selecting a reliable part data Dc from among them. Furthermore, since multiple nodes are displayed in chronological order, it is easy to understand when the part data Dc corresponding to each of those nodes was generated.

[0133] Furthermore, in this embodiment, the predetermined conditions are that at least one of the following is indicated by two connected nodes: (1) standard component data Dc is downloaded to one or more mounting lines L and used as one of the multiple component data Dc mentioned above; (2) component data Dc used by one or more mounting lines L is uploaded as standard component data Dc; (3) if one or more mounting lines L consist of multiple mounting lines L, component data Dc is moved from the first mounting line L to the second mounting line L of the multiple mounting lines L; or (4) in one of the one or more mounting lines L, the component data Dc used is changed to another component data Dc. The standard component data Dc is, for example, component data Dc included in the master. Also, condition (1) is satisfied between nodes n1 and n11 shown in Figures 9 and 10, and condition (2) is satisfied between nodes n13 and n2 shown in Figures 9 and 10. Furthermore, condition (3) is satisfied between nodes n21 and n41 shown in Figures 9 and 10, and condition (4) is satisfied between nodes n11 and n12 shown in Figures 9 and 10.

[0134] This allows operators to easily track the download of component data Dc, the upload of component data Dc, the transfer of component data Dc between two assembly lines L, and the modification of component data Dc on one assembly line L, based on the connections between nodes.

[0135] Therefore, in this embodiment, the operator can easily get an overview of when, where, and how the part data Dc was generated. Thus, changes to the part data Dc can be tracked. Furthermore, the operator can intuitively identify the most recently generated part data Dc from among multiple part data Dc files. In addition, it is easy to revert the current part data Dc back to a previously used part data Dc.

[0136] Figure 11 shows an example of the second support screen displayed on the first display unit 104 of the support device 100.

[0137] The processing unit 102 of the support device 100 displays the second support screen 104b on the first display unit 104, as shown in Figure 11. On the second support screen 104b, nodes corresponding to each of the multiple component data Dc are plotted on the graph. Furthermore, arrows similar to those shown in the examples in Figures 9 and 10, i.e., arrows connecting two plotted nodes, are also displayed on the second support screen 104b. The vertical axis of the graph represents the first production-related indicator, and the horizontal axis represents the second production-related indicator. The first and second production-related indicators are the production-related indicators described above. Specifically, the first production-related indicator is one of productivity, spoilage rate, and defect rate, and the second production-related indicator is one of productivity, spoilage rate, and defect rate that is different from the first production-related indicator. Note that the first and second production-related indicators may be indicators different from or similar to productivity, spoilage rate, and defect rate. For example, either the first production-related indicator or the second production-related indicator may be yield or assembly accuracy. For example, a similar indicator may be any indicator that can be calculated from the actual numbers shown in the monitoring data Da, and may be the cumulative number of at least one of the following over a cumulative period: number of spoilages, number of adsorption errors, number of recognition errors, and number of assembly errors. In addition, the monitoring data Da may include the adsorption location, and the first or second production-related indicator may be a statistic calculated from the adsorption location. Also, in the example in Figure 11, as in the examples in Figures 9 and 10, the multiple part data Dc corresponding to the multiple nodes displayed correspond to parts P of the same type.

[0138] Specifically, as shown in Figure 11, each of nodes n1, n2, n11, n12, and n13 is plotted on the graph at a position corresponding to the first and second production-related indicators obtained by the part data Dc corresponding to that node. Furthermore, identifiers (1), (2), (3), and (4), multiple arrows connecting the nodes, and explanatory windows 51-54 that specifically show the content of the transitions identified by those identifiers are displayed. Each of the explanatory windows 51-54 shows the change and the reason for the change. The change is the specific change or transition of the part data Dc, and the reason for the change is the reason why the part data Dc was changed or transitioned.

[0139] For example, the identifier (1) and the description window 51 are displayed in association between node n1 and node n11. The description window 51 shows the change "Download" and the reason for the change "Master Loading". The change "Download" indicates that the part data Dc corresponding to node n1 was downloaded as part data Dc corresponding to node n11. The reason for the change "Master Loading" indicates that the change to part data Dc was made for the purpose of loading the master.

[0140] Additionally, the identifier (2), the arrow, and the explanation window 52 are displayed in association with node n11 and node n12. The explanation window 52 shows the change "implementation speed" and the reason for the change "productivity improvement". The change "implementation speed" indicates that the implementation speed included in the speed parameter f3 of the component data Dc corresponding to node n11 has been changed, and the component data Dc corresponding to node n12 has been generated. The reason for the change "productivity improvement" indicates that the change to component data Dc was made to improve productivity.

[0141] Furthermore, the identifier in (3), the arrow, and the explanation window 53 are displayed in association with nodes n12 and n13. The explanation window 53 shows the change "Adsorption Speed" and the reason for the change "Productivity Improvement". The change "Adsorption Speed" indicates that the adsorption speed included in the speed parameter f3 of the component data Dc corresponding to node n12 has been changed, and the component data Dc corresponding to node n13 has been generated. The component data Dc corresponding to node n13 may be the component data Dc currently used on the assembly line L1.

[0142] Additionally, the identifier (4), the arrow, and the explanation window 54 are displayed in association with nodes n1 and n2. The explanation window 54 shows the change "upload" and the reason for the change "master update". The change "upload" indicates that the part data Dc corresponding to node n1 has been changed to the part data Dc corresponding to node n2 by upload. The reason for the change "master update" indicates that the upload was performed to update the part data Dc corresponding to node n1 included in the master.

[0143] The display of this second support screen 104b references not only the parts usage data storage unit 107 and the first production storage unit 105, but also the monitoring data storage unit 106.

[0144] The processing unit 102 of the support device 100 uses the monitoring data column Dx generated when component mounting work is performed using component data Dc corresponding to each node to calculate the first production-related indicator and the second production-related indicator corresponding to that component data Dc. Then, for each of the multiple nodes, the processing unit 102 plots that node at the position on the graph indicated by the first production-related indicator and the second production-related indicator calculated for the component data Dc corresponding to that node.

[0145] Furthermore, when component data Dc is changed on the mounting line L, the processing unit 102 obtains change information from the mounting line L indicating the change and the reason for the change. This change information may be information received through an input operation to the second input unit 203 by an operator. The processing unit 102 may then store this change information in the used component data storage unit 107 in association with the used component data Dc. When the processing unit 102 displays the second support screen 104b, it refers to this change information and displays the above-described explanation windows 51 to 54 on the second support screen 104b.

[0146] In this second support screen 104b, production-related indicators are used as usage data.

[0147] In other words, in the example shown in Figure 11, the usage record is at least one of the following when one of the one or more mounting lines L performs component mounting work based on the component data Dc corresponding to its usage record: (1) an index based on at least one of the number of defects, the number of suction errors, the number of recognition errors, and the suction position that occurred during the component mounting work; (2) an index based on the number of mounting errors that occurred during the component mounting work; and (3) an index indicating the productivity of the mounted substrate produced. The processing unit 102 then maps each of the multiple nodes to a position corresponding to the usage record of the component data Dc that corresponds to that node, and displays the mapped multiple nodes on the first display unit 104. Note that the index in (1) corresponds to, for example, the defect rate, and the index in (2) corresponds to, for example, the defect rate.

[0148] When a mounting error occurs during component mounting work and the component data Dc is changed, the frequency of errors in component mounting work tends to decrease, but component data Dc that reduces productivity may be generated. On the other hand, in this embodiment, multiple component data Dc can be compared with each other from any of the above usage history aspects (1) to (3). As a result, for example, component data Dc that suppresses indicators (1) and (2) and improves indicator (3) can be selected from multiple component data Dc used in the past.

[0149] In other words, conventionally, it is difficult to judge the quality of component data Dc from the perspectives of (1) to (3) above. More specifically, conventionally, when different component data Dc are used for the same type of component on multiple mounting lines, it is difficult to judge the quality of component data Dc used in the past on each mounting line, or component data Dc currently in production that was used in production over a predetermined period in the past, from the perspectives of (1) to (3) above. On the other hand, in the example of Figure 11, as described above, it is possible to select component data Dc that suppresses indicators (1) and (2) above and improves indicator (3) above. As a result, for example, when component data Dc is changed by mounting line L, it is possible to suppress the possibility of changing the currently used component data Dc to component data Dc with a track record of use that does not allow for the production of effective mounted boards from the perspectives of (1) to (3) above. In other words, it is possible to suppress unnecessary attempts to change component data Dc. Furthermore, even if usage performance deteriorates due to changes in component data Dc, it can be easily reverted to the component data Dc before the deterioration by performing a rollback.

[0150] Furthermore, explanation windows 51-54 are displayed, making it easy to understand the changes and reasons for each modification to the part data Dc. In other words, it is possible to get an overview of the history of changes to the part data Dc. Moreover, it is easy to verify whether the changes to the part data Dc were made in accordance with the stated reasons for the changes.

[0151] Here, if the same component data Dc is used for component mounting work on two or more mounting lines L, the usage record of that same component data Dc may be based on the usage record of each of the two or more mounting lines L. For example, the usage record of the same component data Dc may be an average of the usage records of each of the two or more mounting lines L, or it may be a sum of those records.

[0152] In other words, the processing unit 102 calculates production indicators obtained when a mounted board is produced based on component data Dc as usage records corresponding to the component data Dc. The processing unit 102 then maps each of the multiple nodes to a position corresponding to the usage records of the component data Dc that corresponds to that node, and displays the mapped multiple nodes on the first display unit 104. Here, if one or more mounting lines L include two or more mounting lines L, and a mounted board is produced based on the same component data Dc in each of those two or more mounting lines L, the usage records corresponding to that same component data are calculated based on the production indicators for each of those two or more mounting lines.

[0153] This allows production metrics obtained from the production of mounted boards on two or more mounting lines L based on the same component data Dc to be aggregated, for example, to calculate the usage record corresponding to that same component data Dc. Therefore, the reliability of the usage record for the same component data Dc can be increased.

[0154] Figure 12 is a flowchart showing an example of the processing operation of the support device 100 in this embodiment.

[0155] The first communication unit 108 of the support device 100 acquires multiple component data Dc used from the mounting lines L1 to L3 (step S1). Then, the processing unit 102 displays each of the multiple nodes corresponding to these multiple component data Dc on the first display unit 104, connected to the other nodes (step S2). At this time, the processing unit 102 also displays the usage history of each of the multiple component data Dc on the first display unit 104. This usage history may be the time when the component data Dc was generated, as in the examples in Figures 9 and 10, or it may be a production-related indicator, as in the example in Figure 11.

[0156] In this embodiment, the support device 100 may evaluate one or more implementation parameters f that are to be included in the modified part data Dc before the part data Dc is modified and used for part mounting work. Each of these one or more implementation parameters f is a parameter that has been changed from the implementation parameter f included in the original part data Dc, and is also called the implementation parameter f to be evaluated.

[0157] Figure 13 is a diagram illustrating the evaluation of the implementation parameter f by the support device 100.

[0158] The processing unit 102 of the support device 100 receives a request to change component data Dc corresponding to node n31 from the implementation line L3 via the first communication unit 108. The change request includes one or more implementation parameters f to be evaluated and the reason for the change.

[0159] When the processing unit 102 receives such a change request, it determines whether the component data Dc containing the one or more implementation parameters f to be evaluated is stored in the used component data storage unit 107 as used component data Dc. Note that the remaining one or more implementation parameters f included in the used component data Dc, other than the one or more implementation parameters f to be evaluated, may be the same as the one or more implementation parameters f included in the component data Dc before the change (i.e., the component data Dc corresponding to node n31).

[0160] Then, if the processing unit 102 determines that the used component data Dc is stored in the used component data storage unit 107 as component data Dc corresponding to node n12, it may display a prediction arrow 61 pointing from node n31 to node n12, as shown in Figure 13.

[0161] Here, the processing unit 102 determines whether the change from the first and second production-related indicators of node n31 to the first and second production-related indicators of node n12 is in accordance with the reason for change included in the change request. That is, if the change is in accordance with the reason for change, the processing unit 102 determines that one or more implementation parameters f to be evaluated are available for that reason for change. On the other hand, if the change is not in accordance with the reason for change, the processing unit 102 determines that one or more implementation parameters f to be evaluated are unavailable for that reason for change. By making such determinations, the processing unit 102 evaluates one or more implementation parameters f to be evaluated. For the reason for change "productivity improvement," if the first production-related indicator, which is productivity, decreases as shown in Figure 13, the processing unit 102 determines that the decrease in the first production-related indicator does not conform to the reason for change. That is, the processing unit 102 determines that one or more implementation parameters f to be evaluated are unavailable for that reason for change. In this case, the processing unit 102 instructs the assembly line L3 via the first communication unit 108 to modify one or more implementation parameters f to be evaluated. Alternatively, the processing unit 102 may search the used parts data storage unit 107 for used parts data Dc corresponding to nodes where the first production-related indicator is greater than node n31. The processing unit 102 may then send a message to the assembly line L3 via the first communication unit 108 prompting a change to the used parts data Dc. In other words, the processing unit 102 guides the generation of part data Dc that includes one or more implementation parameters f different from the one or more implementation parameters f to be evaluated.

[0162] On the other hand, if the reason for the change is "productivity improvement" and the first production-related indicator, which is productivity, is increasing, the processing unit 102 determines that the increase in the first production-related indicator is consistent with the reason for the change. In other words, the processing unit 102 determines that one or more implementation parameters f to be evaluated are available for use in accordance with that reason for the change. In this case, the processing unit 102 generates component data Dc that includes one or more implementation parameters f to be evaluated and transmits the component data Dc to the assembly line L3 via the first communication unit 108. As a result, the assembly line L3 can use the component data Dc generated in accordance with the reason for the change for component assembly work. The processing unit 102 may also permit the assembly line L3 via the first communication unit 108 to generate component data Dc that includes one or more implementation parameters f to be evaluated. In this case, the assembly line L3 can generate component data Dc that is consistent with the reason for the change and use the component data Dc for component assembly work.

[0163] Figure 14 is a flowchart showing another example of the processing operation of the support device 100 in this embodiment.

[0164] The support device 100 performs the processing in steps S1 and S2, similar to the example shown in Figure 12. Next, the processing unit 102 of the support device 100 determines whether or not it has received a request to change the component data Dc from the mounting line L via the first communication unit 108 (step S3).

[0165] Here, if the processing unit 102 determines that it has not received a change request (No in step S3), it repeatedly executes the process in step S3. On the other hand, if the processing unit 102 determines that it has received a change request (Yes in step S3), it further determines whether or not there is a record of use for the used parts data Dc corresponding to that change request (step S4). In other words, the processing unit 102 determines whether or not a record of use has been calculated for the used parts data Dc that includes one or more implementation parameters f to be evaluated, which are included in the change request. Here, if the processing unit 102 determines that there is a record of use (Yes in step S4), it evaluates one or more implementation parameters f to be evaluated, which are included in the change request, based on that record of use (step S5). In other words, the processing unit 102 evaluates one or more implementation parameters f to be evaluated based on the record of use for the used parts data Dc that includes one or more implementation parameters f to be evaluated. Here, the record of use is the first production-related indicator and the second production-related indicator calculated for the used parts data Dc mentioned above.

[0166] Next, the processing unit 102 performs processing according to the evaluation result (step S6). For example, if the evaluation result is good, that is, if it determines that one or more implementation parameters f to be evaluated are usable, the processing unit 102 generates component data Dc that includes one or more implementation parameters f to be evaluated, as described above. In this case, the component data Dc before the change is changed to component data Dc that includes one or more implementation parameters f to be evaluated. Alternatively, if the evaluation result is bad, that is, if it determines that one or more implementation parameters f to be evaluated are unusable, the processing unit 102 guides the generation of component data Dc that includes one or more implementation parameters f different from the one or more implementation parameters f to be evaluated.

[0167] On the other hand, if the processing unit 102 determines that there is no record of using the used part data Dc in response to the change request (No. in step S4), it generates part data Dc that includes one or more implementation parameters f to be evaluated (step S7). In this case, the part data Dc before the change is changed to part data Dc that includes one or more implementation parameters f to be evaluated, without the one or more implementation parameters f to be evaluated being evaluated.

[0168] As shown in the examples in Figures 13 and 14, when the processing unit 102 receives one or more implementation parameters f to be evaluated, it identifies a component data Dc containing the one or more implementation parameters f to be evaluated from among the multiple component data Dc stored in the component data storage unit 107. Then, the processing unit 102 evaluates the one or more implementation parameters f to be evaluated based on the usage history of the identified component data Dc.

[0169] This allows, for example, when one or more implementation parameters f included in component data Dc are changed, the changed one or more implementation parameters f are accepted as the one or more implementation parameters f to be evaluated before the component data Dc containing the changed one or more implementation parameters f is used in the production of the mounted board. If there is a history of past use of the component data Dc containing the one or more implementation parameters f to be evaluated, the one or more implementation parameters f to be evaluated are evaluated based on that history. Therefore, if the evaluation result is good, the component data Dc containing the one or more implementation parameters f to be evaluated is generated, and the production of mounted boards using that component data Dc is permitted, thereby more effectively supporting the production of mounted boards.

[0170] Furthermore, in the examples shown in Figures 13 and 14, the processing unit 102 receives one or more implementation parameters f from one of the one or more implementation lines L. In other words, that one or more implementation parameters f is received as the one or more implementation parameters f to be evaluated.

[0171] This allows for the reception of one or more mounting parameters f from the mounting line L, enabling the evaluation of one or more mounting parameters f used in the production of mounted substrates on that mounting line L, thereby more effectively supporting the production of mounted substrates on that mounting line L.

[0172] Furthermore, in the examples shown in Figures 13 and 14, the processing unit 102 evaluates one or more implementation parameters f to determine whether or not those one or more implementation parameters f are usable. If the processing unit 102 determines that one or more implementation parameters f are usable, it generates component data Dc that includes those one or more implementation parameters f. On the other hand, if the processing unit 102 determines that one or more implementation parameters f are unusable, it guides the generation of component data Dc that includes one or more implementation parameters f different from those f.

[0173] As a result, if it is determined that one or more implementation parameters f are available, component data Dc containing those one or more implementation parameters f is generated, allowing one or more implementation lines L to produce an implemented board using that component data Dc. Consequently, one or more implementation lines L can produce an appropriate implemented board. Furthermore, if it is determined that one or more implementation parameters f are unavailable, the generation of component data Dc containing one or more implementation parameters f different from those f is guided, thereby preventing the production of an inappropriate implemented board.

[0174] Although one or more embodiments of the support device 100 and support method have been described above based on embodiments, this disclosure is not limited to those embodiments. Various modifications of the above embodiments that a person skilled in the art could conceive of may also be included in this disclosure, as long as they do not depart from the spirit of this disclosure.

[0175] In the above embodiment, one or more components included in the support device 100 and the implementation line L may be implemented by dedicated hardware or by executing software programs suitable for those components. One or more components may be implemented by a program execution unit such as a CPU (Central Processing Unit) or processor reading and executing software programs recorded on a recording medium such as a hard disk or semiconductor memory. Here, the software that implements the support device 100 etc. in the above embodiment causes a computer to execute each step of the flowchart shown in Figures 12 and 14.

[0176] The following cases are also included in this disclosure.

[0177] (1) The one or more components described above may specifically be a computer system consisting of a microprocessor, ROM (Read Only Memory), RAM (Random Access Memory), a hard disk unit, a display unit, a keyboard, a mouse, etc. A computer program is stored in the RAM or hard disk unit. The microprocessor operates according to the computer program, thereby enabling one or more components to perform their functions. Here, a computer program is composed of a combination of multiple instruction codes that indicate commands to the computer in order to achieve a predetermined function.

[0178] (2) The one or more components described above may be comprised of a single system LSI (Large Scale Integration). The system LSI is a highly functional LSI manufactured by integrating multiple components onto a single chip, and specifically, it is a computer system comprising a microprocessor, ROM, RAM, etc. The RAM stores a computer program. The system LSI achieves its function by operating the microprocessor in accordance with the computer program.

[0179] (3) The one or more components described above may consist of a detachable IC card or a standalone module. The IC card or module is a computer system consisting of a microprocessor, ROM, RAM, etc. The IC card or module may include the above-mentioned multi-functional LSI. The IC card or module achieves its function by the operation of the microprocessor according to the computer program. The IC card or module may be tamper-resistant.

[0180] (4) The disclosure may also be the methods described above. Alternatively, it may be a computer program that implements these methods using a computer, or a digital signal consisting of a computer program.

[0181] Furthermore, this disclosure may also refer to a computer program or digital signal recorded on a computer-readable recording medium, such as a flexible disk, hard disk, CD (Compact Disc)-ROM, DVD, DVD-ROM, DVD-RAM, BD (Blu-ray® Disc), semiconductor memory, etc. Alternatively, it may refer to a digital signal recorded on such a recording medium.

[0182] Furthermore, this disclosure may also include the transmission of computer programs or digital signals via telecommunications lines, wireless or wired communication lines, networks such as the Internet, data broadcasting, etc.

[0183] Alternatively, the program or digital signal may be carried out by another independent computer system by recording and transferring it on a recording medium, or by transferring the program or digital signal via a network or the like. [Industrial applicability]

[0184] This disclosure can be used, for example, in support equipment for assisting in the production of mounted circuit boards. [Explanation of Symbols]

[0185] 1. Production System 4 base 5. Substrate transport mechanism 6. Parts Supply Department 7 feeders 8 Y-axis beam 9 X-axis beam 9a Plate 10 Mounting Head 10a Adsorption Unit 10b Suction nozzle 11. Part Recognition Camera 12. Circuit board recognition camera 13 bogies 13a Feeder base 14-part tape 15 Cassette Holder 41 Legend 51, 52, 53, 54 Explanation Window 61 Predictive Arrows 100 Support equipment 101 Support Control Unit 102 Processing Unit 103 First Input Section (Input Section) 104 1st display section (display section) 104a 1st support screen 104b 2nd support screen 105 First Production Storage Unit 106 Monitoring data storage unit 107 Parts Usage Data Storage Unit 108 1st Communications Department (Acquisition Department) 200 Line Management Device 201 Line Control Unit 203 Second Input Section 204 2nd display section 205 Second Production Storage Unit 208 Second Communications Department 210 Work Machines a variety B substrate C Parts Reel d Configuration information d1 Shape diagram d2 size data d3 component parameters Da monitoring data DC Part Data De Cumulative Period Information Dx monitoring data column f Implementation parameters f2 nozzle information f3 speed parameters f4 recognition information f5 gap information f6 Adsorption Information f7 Installation Information Hu upper holding position Hd lower holding position L Implementation Line L1, L2, L3, L4 implementation lines LB component library Lb1 First Component Library Lb2 Second Part Library M1 board supply device M2 PCB Transfer Device M3 Solder Printing Machine M4, M5 component mounting equipment M6 Inspection Machine M7 Reflow System M8 Substrate Recovery Device n1, n2, n3, n11, n12, n13, n21, n31, n32, n41, n42, n43 nodes P, Pa parts

Claims

1. A support device for assisting in the production of mounted circuit boards, An acquisition unit that acquires data on multiple components used in the production of the mounted circuit board in one or more mounting lines, A processing unit that connects each of the multiple nodes corresponding to the acquired multiple component data to other nodes based on predetermined conditions, and displays the usage history of each of the multiple nodes connected to other nodes and the multiple component data on a display unit. A support device equipped with the following features.

2. The aforementioned usage record is the time when the component data corresponding to the aforementioned usage record was generated by the one or more mounting lines. The processing unit displays the plurality of nodes in chronological order according to the time when the component data corresponding to each of the plurality of nodes was generated, on the display unit. The support device according to claim 1.

3. The aforementioned usage record is, When one of the one or more mounting lines performs component mounting work based on component data corresponding to the usage record, at least one of the following is obtained: (1) an index based on the number of defective parts, the number of suction errors, the number of recognition errors, and at least one of the suction positions that occurred during the component mounting work; (2) an index based on the number of mounting errors that occurred during the component mounting work; and (3) an index indicating the productivity of the mounted substrate produced. The processing unit maps each of the plurality of nodes to a position corresponding to the usage history of the component data that corresponds to that node, thereby displaying the mapped plurality of nodes on the display unit. The support device according to claim 1.

4. The aforementioned processing unit further, When one or more parameters are received, the component data containing the one or more parameters is identified from the plurality of component data. Based on the usage history of the identified component data, the one or more parameters are evaluated. The support device according to claim 1.

5. The aforementioned processing unit, One of the one or more implementation lines receives the one or more parameters. The support device according to claim 4.

6. The aforementioned processing unit, By evaluating the one or more parameters mentioned above, it is determined whether or not the one or more parameters are usable. If it is determined that one or more of the above parameters are usable, component data including the one or more of the above parameters is generated. If it is determined that one or more of the above parameters are unavailable, the system will guide the generation of component data that includes one or more parameters different from the above one or more parameters. The support device according to claim 4.

7. The aforementioned predetermined conditions are: (1) Standard component data was downloaded to one or more mounting lines and used as one of the multiple component data sets. (2) The component data used by the one or more mounting lines has been uploaded as the standard component data. (3) When the one or more mounting lines consist of multiple mounting lines, the component data has been transferred from the first mounting line to the second mounting line among the multiple mounting lines. (4) In one of the one or more mounting lines, the component data used has been changed to other component data. The condition is that at least one of them is represented by two connected nodes. The support device according to claim 1.

8. The aforementioned processing unit, When the mounted circuit board is produced based on the component data, the production indicators obtained are calculated as the usage results corresponding to the component data. By mapping each of the aforementioned plurality of nodes to a position corresponding to the usage history of the component data that corresponds to that node, the mapped plurality of nodes are displayed on the display unit. If the aforementioned one or more mounting lines include two or more mounting lines, and the production of the mounted circuit board based on the same component data is carried out in each of the two or more mounting lines, the usage record corresponding to the same component data is calculated based on the production indicators for each of the two or more mounting lines. The support device according to claim 1.

9. A computer-assisted method for supporting the production of printed circuit boards, In one or more mounting lines, acquire data on multiple components used in the production of the mounted circuit board. Each of the multiple nodes corresponding to the acquired multiple component data is connected to other nodes based on predetermined conditions, and the usage history of each of the multiple nodes connected to other nodes, as well as the usage history of each of the multiple component data, is displayed on the display unit. How to help.

10. This is a program to support the production of mounted circuit boards. In one or more mounting lines, acquire data on multiple components used in the production of the mounted circuit board. Each of the multiple nodes corresponding to the acquired multiple component data is connected to other nodes based on predetermined conditions, and the usage history of each of the multiple nodes connected to other nodes, as well as the usage history of each of the multiple component data, is displayed on the display unit. A program that causes a computer to perform a task.

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