Microscope apparatus and observation method

Abstract

This invention provides a microscope apparatus and observation method that can improve the accuracy of analysis by observing the processed cross-section. [Solution] An observation method for forming a processed area PA having a processed cross section Ls intersecting the surface A1 by irradiating the surface A1 of the sample A with laser light L, and observing the processed cross section Ls, comprises a processing step in which, when the surface A1 is perpendicular to a first direction D1, the processed area PA includes a plurality of lines S aligned in a second direction D2, each extending in a third direction D3, and the incident direction D0 of the laser light L to the surface A1 is inclined to one side in the second direction D2 with respect to the first direction D1, while focusing the laser light L toward the sample A and moving the irradiation area R of the laser light L along each of the plurality of lines S; and an observation step in which the second end face E2 on the other side in the second direction D2 of the processed area PA is observed as the processed cross section Ls.

Description

Technical Field

[0001] The present invention relates to a microscope apparatus and an observation method.

Background Art

[0002] Patent Document 1 describes a focused ion beam processing apparatus in which an ion beam column, an electron beam column, a secondary electron detector, a reflected electron detector, and a sample stage are arranged in a vacuum chamber. In this apparatus, when forming a processed cross-section on a sample, an ion beam output from an ion source in the ion beam column is irradiated onto the surface of the sample. Further, in this apparatus, when observing the processed cross-section of the sample, an electron beam output from an electron gun in the electron beam column is irradiated onto the surface of the sample, and electrons emitted from the sample are detected by a secondary electron detector or a reflected electron detector.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In the apparatus as described above, when forming a processed cross-section on a sample, if a strong heat influence (for example, thermal distortion, thermal damage, etc.) occurs on the processed cross-section of the sample, the analysis accuracy by observing the processed cross-section may deteriorate.

[0005] An object of the present invention is to provide a microscope apparatus and an observation method capable of improving the analysis accuracy by observing a processed cross-section.

Means for Solving the Problems

[0006] The microscope apparatus of the present invention is [1] a microscope apparatus for irradiating the surface of an object with laser light to form a processing area on the object having a processing cross section intersecting the surface, and for observing the processing cross section, comprising: a support unit for supporting the object; an output unit for outputting the laser light; a focusing unit for focusing the laser light output from the output unit toward the object; a scanning unit for scanning the laser light output from the output unit toward the object; an angle adjustment unit for adjusting the direction of incidence of the laser light toward the surface; a microscope unit for observing the processing cross section; and a control unit for controlling at least the scanning unit and the angle adjustment unit. The microscope device comprises the following: The control unit controls the angle adjustment unit so that the incident direction is inclined to one side in the second direction with respect to the first direction when the surface is perpendicular to the first direction, and the processing area includes a plurality of lines arranged in a second direction perpendicular to the first direction, each of which extends in a third direction perpendicular to both the first and second directions; the scanning unit controls the irradiation area of ​​the laser light to move along each of the plurality of lines; and the microscope unit observes the other end face in the second direction of the processing area as the processed cross-section.

[0007] In the above-described microscope apparatus, when the surface of the object is perpendicular to the first direction, and the processing area includes multiple lines aligned in a second direction perpendicular to the first direction, each of which extends in a third direction perpendicular to both the first and second directions, the laser beam is focused toward the object while the irradiation area of ​​the laser beam is moved along each of the multiple lines, with the direction of incidence of the laser beam toward the surface of the object inclined toward one side in the second direction relative to the first direction. As a result, for example, compared to when the laser beam is focused and scanned with the direction of incidence of the laser beam perpendicular to the surface of the object, the thermal effects occurring on the other end face in the second direction of the processing area, which is observed as the processed cross-section, are suppressed. Therefore, the above-described microscope apparatus can improve the accuracy of analysis by observing the processed cross-section.

[0008] The microscope apparatus of the present invention may also be [2] "the microscope apparatus described in [1] above, wherein the angle that the end face makes with respect to the first direction is within the range of 0 ± 5 degrees." With this microscope apparatus, since the end face observed as the processed cross-section is substantially perpendicular to the surface of the object, observation of the processed cross-section from a direction perpendicular to the processed cross-section can be performed with a simple configuration and a simple process.

[0009] The microscope apparatus of the present invention may also be [3] "the microscope apparatus according to [1] or [2] above, wherein the control unit comprises a storage unit that stores a first angle made with respect to the first direction by the end face formed when the incident direction is at a predetermined angle with respect to the first direction, a receiving unit that receives input of a second angle made with respect to the first direction by the end face of the object to be observed, and a determination unit that determines the incident angle made with respect to the first direction when forming the processing area, based on the predetermined angle, the first angle and the second angle." With this microscope apparatus, a processed cross section that forms a desired angle with respect to the surface of the object can be obtained.

[0010] The microscope apparatus of the present invention may also be [4] "the microscope apparatus according to any one of [1] to [3] above, wherein the angle adjustment unit includes a changing mechanism that changes the angle of at least one of the support unit and the light-gathering unit." With this microscope apparatus, the direction of incidence of laser light on the surface of the object can be appropriately adjusted.

[0011] The microscope apparatus of the present invention may also be [5] "the microscope apparatus according to any one of [1] to [4] above, wherein the angle adjustment unit includes an optical element that changes the incident direction." According to this microscope apparatus, the incident direction of laser light on the surface of the object can be appropriately adjusted.

[0012] The microscope apparatus of the present invention may also be [6] "the microscope apparatus according to any one of [1] to [5] above, wherein the light-gathering unit includes an fθ lens." With this microscope apparatus, when scanning a laser beam over an object, the irradiation area of ​​the laser beam can be moved along a plane parallel to the surface of the object.

[0013] The microscope apparatus of the present invention may also be [7] "a microscope apparatus according to any one of [1] to [6] above, further comprising a branching unit that branches the laser light output from the output unit into a plurality of branched laser beams including a first branched laser beam having a first polarization direction and a second branched laser beam having a second polarization direction perpendicular to the first polarization direction, wherein the output unit outputs the laser light having a pulse width of 1 ps or less, the focusing unit focuses the first branched laser beam toward the object to form a first irradiation area of ​​the first branched laser beam on the object and focuses the second branched laser beam toward the object to form a second irradiation area of ​​the second branched laser beam on the object, and the control unit controls the scanning unit so that the first irradiation area and the second irradiation area, which are aligned in the second direction, move along each of the plurality of lines." This microscope device makes it possible to suppress the formation of a fine periodic structure (for example, a laser-induced periodic surface structure (LIPSS)) on the other end face in the second direction of the processing area, which is observed as a processed cross-section.

[0014] The microscope apparatus of the present invention may further include [8] "a microscope apparatus according to any one of [1] to [6] above, comprising: a polarization adjustment unit that adjusts the polarization direction of the laser light output from the output unit so that it includes a first component having a first polarization direction and a second component having a second polarization direction perpendicular to the first polarization direction, and so that the intensity of the first component is greater than or equal to the intensity of the second component; and a spatial light modulator that modulates the first component and emits it as modulated light, and emits the second component as unmodulated light, wherein the output unit outputs the laser light having a pulse width of 1 ps or less, the focusing unit focuses the modulated light and the unmodulated light toward the object to form a single irradiation area on the object including the modulated light and the unmodulated light, and the control unit controls the scanning unit so that the irradiation area moves along each of the plurality of lines such that the first polarization direction is along the second direction and the second polarization direction is along the third direction in the single irradiation area." According to this microscope, it is possible to suppress the formation of a microperiodic structure on the other end face in the second direction of the processing area, which is observed as a processed cross-section.

[0015] The microscope apparatus of the present invention may also be the microscope apparatus according to any one of the above [1] to [8], wherein the control unit controls the scanning unit such that the movement of the irradiation area along the line located at the other end in the second direction among the plurality of lines is the last. With this microscope apparatus, it is possible to suppress the adhesion of particles generated by irradiation with laser light to the other end face in the second direction of the processing area, which is observed as a processed cross-section.

[0016] The observation method of the present invention is

[10] "an observation method for forming a processing area on an object having a processed cross section intersecting the surface by irradiating the surface of the object with laser light, and observing the processed cross section, wherein when the surface is perpendicular to a first direction, the processing area includes a plurality of lines arranged in a second direction perpendicular to the first direction, each of which extends in a third direction perpendicular to both the first and second directions, and the direction of incidence of the laser light on the surface is inclined to one side in the second direction with respect to the first direction, while focusing the laser light toward the object and moving the irradiation area of ​​the laser light along each of the plurality of lines; and an observation step after the processing step of observing the other end face of the processing area in the second direction as the processed cross section."

[0017] According to the observation method described above, the accuracy of analysis by observing the processed cross-section can be improved for the reasons stated above. [Effects of the Invention]

[0018] According to the present invention, it is possible to provide a microscope device and observation method that can improve the accuracy of analysis by observing the processed cross-section. [Brief explanation of the drawing]

[0019] [Figure 1] This is a diagram showing a portion of the configuration of an example microscope apparatus. [Figure 2] Figure 1 shows another configuration diagram of the microscope apparatus. [Figure 3] This is a cross-sectional view of a sample used to illustrate laser processing performed in the microscope apparatus shown in Figure 1. [Figure 4] Figure 3 shows an SEM image of the processed area formed by laser processing. [Figure 5] Figure 1 shows a plan view and a cross-sectional view of a sample used to illustrate the laser processing performed in the microscope apparatus shown. [Figure 6]It is a cross-sectional view of a sample for explaining laser processing performed in the microscope apparatus shown in FIG. 1. [Figure 7] It is a configuration diagram of the control unit shown in FIG. 2. [Figure 8] It is a flowchart of the incident angle determination process performed in the microscope apparatus shown in FIG. 1. [Figure 9] It is a plan view and a cross-sectional view of a sample for explaining laser processing performed in the microscope apparatus shown in FIG. 1. [Figure 10] It is a flowchart of the incident angle determination process performed in the microscope apparatus shown in FIG. 1. [Figure 11] It is a secondary electron image of the first end face formed by the laser processing shown in FIG. 3. [Figure 12] It is a backscattered electron image of the first end face formed by the laser processing shown in FIG. 3. [Figure 13] It is a cross-sectional view of a sample for explaining laser processing performed in the microscope apparatus shown in FIG. 1. [Figure 14] It is a plan view and a cross-sectional view of a sample for explaining laser processing performed in the microscope apparatus shown in FIG. 1. [Figure 15] It is a schematic diagram of an irradiation region for explaining laser processing performed in the microscope apparatus shown in FIG. 1. [Figure 16] It is a schematic diagram of an irradiation region for explaining laser processing performed in the microscope apparatus shown in FIG. 1. B [Figure 17] It is a cross-sectional view of a sample for explaining laser processing performed in the microscope apparatus shown in FIG. 1. [Figure 18] It is a plan view of a sample for explaining laser processing performed in the microscope apparatus shown in FIG. 1. [Figure 19] It is a plan view and a side view of a sample for explaining laser processing performed in the microscope apparatus shown in FIG. 1.

Embodiments for Carrying Out the Invention

[0020] An example of the present invention will be described in detail below with reference to the drawings. In each figure, the same or corresponding parts are denoted by the same reference numerals, and redundant explanations are omitted. [Microscope setup configuration]

[0021] As shown in Figures 1 and 2, the microscope apparatus 1 comprises a support unit 2, a beam irradiation unit 3, a first microscope unit (microscope unit) 4, a second microscope unit (microscope unit) 5, a spare unit 6, a cover 7, a change mechanism (angle adjustment unit) 8, an optical element (angle adjustment unit) 9, a chamber 10, and a laser processing apparatus 20. The support unit 2, beam irradiation unit 3, first microscope unit 4, second microscope unit 5, spare unit 6, cover 7, change mechanism 8, and optical element 9 are arranged inside the chamber 10. The chamber 10 is provided with a window 11. The window 11 is made of a material that is transparent to the laser light L emitted from the laser processing apparatus 20. The window 11 functions as an inlet for the laser light L to enter the chamber 10. The space inside the chamber 10 is depressurized (i.e., vacuumed) by the exhaust unit 12.

[0022] Support unit 2 supports sample (object) A. Sample A may be held by support unit 2 by being fixed to support unit 2, or it may simply be placed on support unit 2. Beam irradiation unit 3 irradiates sample A, which is supported by support unit 2, with a focused ion beam. Beam irradiation unit 3 corresponds to the focused ion beam output unit in a focused ion beam (FIB) apparatus. An FIB apparatus is a device that irradiates sample A with a focused ion beam, such as Ga ions, to perform etching on sample A.

[0023] The first microscope unit 4 and the second microscope unit 5 each observe the sample A supported by the support unit 2. The first microscope unit 4 irradiates the sample A with an electron beam and detects secondary electrons emitted from the sample A. This obtains a secondary electron image of the sample A. The second microscope unit 5 irradiates the sample A with an electron beam and detects scattered electrons emitted from the sample A by electron backscatter diffraction (EBSD). This obtains a backscattered electron image of the sample A (an image including compositional information such as crystal structure). The first microscope unit 4 and the second microscope unit 5 each correspond to the electron beam emitter and detector in a scanning electron microscope (SEM). An SEM device is a device that observes the sample A by irradiating it with an electron beam. Note that the microscope device 1 may be equipped with a transmission electron microscope (TEM) device instead of or in addition to the SEM device. In that case, the first microscope unit 4 and the second microscope unit 5 each may correspond to the electron beam emitter and detector in a TEM device.

[0024] The cover 7 is made of a material that is transparent to laser light L. The cover 7 is positioned to cover the sample A supported by the support unit 2, with respect to the beam irradiation unit 3, the first microscope unit 4, and the second microscope unit 5. The laser light L is irradiated onto the sample A through the cover 7. The spare unit 6 may be used as another unit for processing or observing the sample A supported by the support unit 2.

[0025] The modification mechanism 8 is attached to the support part 2. The modification mechanism 8 is a mechanism that changes the angle of the support part 2 by means of the driving force of a motor, for example. By changing the angle of the support part 2 by the modification mechanism 8, the incident direction of the laser light L on the surface A1 of the sample A is adjusted. The optical element 9 is positioned on the optical path of the laser light L that has passed through the window part 11. The optical element 9 is, for example, a wedge plate, prism, mirror, etc., whose angle itself is changed by the driving force of a motor. By changing the angle of the optical element 9 itself, the incident direction of the laser light L on the surface A1 of the sample A is adjusted. Note that the incident direction of the laser light L on the surface A1 of the sample A means the direction parallel to the optical axis of the laser light L incident on the surface A1 of the sample A. If the laser light L incident on the surface A1 of the sample A is branched into multiple branched laser beams, the incident direction of the laser light L on the surface A1 of the sample A means the direction parallel to the optical axis of each branched laser beam incident on the surface A1 of the sample A.

[0026] In the microscope apparatus 1 configured as described above, a processed cross-section is formed on the sample A supported by the support unit 2 by irradiation with a focused ion beam from the beam irradiation unit 3 and / or irradiation with laser light L from the laser processing apparatus 20. The processed cross-section of the sample A supported by the support unit 2 is then observed by detection of secondary electrons by the first microscope unit 4 and / or detection of scattered electrons by the second microscope unit 5. Processing of the sample A with a focused ion beam is selected when high-precision processing is required, while processing of the sample A with laser light L is selected when processing of a large area is required. [Configuration of the laser processing machine]

[0027] As shown in Figure 2, the laser processing apparatus 20 comprises a laser unit 60 including an output unit 30 and an optical system 40, and a control unit 70. The output unit 30 outputs a low-fluence, ultrashort-pulse laser beam L. In the laser processing apparatus 20, the output unit 30 outputs a laser beam L having a pulse width of 1 ps or less. As an example, a low-fluence laser beam L means a laser beam L having an energy density near the processing threshold of sample A, which is determined so that the processing of sample A by irradiation with the laser beam L becomes an ablation process. The optical system 40 guides the laser beam L output from the output unit 30 and causes it to enter the chamber 10 through the window 11.

[0028] The optical system 40 includes a spatial light modulator 41, a focusing unit 42, and a scanning unit 43. The spatial light modulator 41 modulates the laser light L output from the output unit 30. The spatial light modulator 41 is, for example, an LCOS-SLM (Liquid Crystal On Silicon Spatial Light Modulator), and modulates the laser light L entering and leaving the liquid crystal layer according to the modulation pattern displayed on the liquid crystal layer. The focusing unit 42 focuses the laser light L output from the output unit 30, which has been modulated by the spatial light modulator 41, toward the sample A supported by the support unit 2. The scanning unit 43 scans the laser light L output from the output unit 30, which has been modulated by the spatial light modulator 41, toward the sample A supported by the support unit 2. In the laser processing apparatus 20, the scanning unit 43 is a galvanometer mirror including a pair of mirrors 43a and 43b, and the focusing unit 42 is an fθ lens that focuses the laser beam L whose optical path has been changed by the driving of each mirror 43a and 43b.

[0029] The optical system 40 further includes a relay optical system 44. The relay optical system 44 is positioned on the optical path of the laser beam L between the spatial light modulator 41 and the scanning unit 43. The relay optical system 44 includes a pair of lenses 44a and 44b. The relay optical system 44 projects the image of the laser beam L modulated by the spatial light modulator 41 onto the focusing unit 42. The laser beam L that has passed through the relay optical system 44 has its optical path adjusted by a plurality of mirrors 56 and 57 and is incident on the scanning unit 43.

[0030] The optical system 40 further includes a collimating lens 51, an output adjustment unit 52, a beam diameter adjustment unit 53, and a half-wave plate 54. The collimating lens 51, the output adjustment unit 52, the beam diameter adjustment unit 53, and the half-wave plate 54 are arranged in this order on the optical path of the laser beam L between the output unit 30 and the spatial light modulator 41. The collimating lens 51 collimates the laser beam L. The output adjustment unit 52 adjusts the output of the laser beam L. The output adjustment unit 52 is, for example, an attenuator. The beam diameter adjustment unit 53 adjusts the beam diameter of the laser beam L. The beam diameter adjustment unit 53 is, for example, a beam expander. The half-wave plate 54 adjusts the polarization direction of the laser beam L.

[0031] The control unit 70 controls each part of the laser processing apparatus 20, including at least the scanning unit 43, the modification mechanism 8, and the optical element 9. The control unit 70 is configured as a computer device including a processor, memory, storage, and communication devices. In the control unit 70, the processor executes software (programs) loaded into memory, etc., and controls the reading and writing of data in memory and storage, as well as communication by the communication devices. [Formation of a processed cross-section by laser irradiation]

[0032] In microscope apparatus 1, as shown in Figures 3(a) and (b), a processing area PA is formed on sample A by irradiating the surface A1 of sample A with laser light L, and the processing cross section Ls that intersects surface A1 within the processing area PA is observed. The processing area PA is a recess CV that opens into surface A1, and the processing cross section Ls is the inner surface of the recess CV. Hereinafter, the direction perpendicular to surface A1 will be called the first direction D1, one direction perpendicular to the first direction D1 will be called the second direction D2, and the direction perpendicular to both the first direction D1 and the second direction D2 will be called the third direction D3.

[0033] As shown in Figure 3(a), when the incident direction D0 of the laser beam L is perpendicular to the surface A1, and the focal point of the laser beam L is aligned with the surface A1, and the laser beam L is scanned with respect to the surface A1 in the third direction D3 as the reciprocating direction, the inner surface of the recess CV will be inclined outward with respect to the first direction D1. When viewed from the third direction D3, if we define a clockwise angle as "+" and a counterclockwise angle as "-", the angle that the first end face E1 on one side of the inner surface of the recess CV in the second direction D2 makes with respect to the first direction D1 is (+α) degrees, and the angle that the second end face E2 on the other side of the inner surface of the recess CV in the second direction D2 makes with respect to the first direction D1 is (-α) degrees.

[0034] As shown in Figure 3(b), when the incident direction D0 of the laser beam L is tilted by (+θ) degrees with respect to the first direction D1 (i.e., the incident direction D0 of the laser beam L is tilted to one side in the second direction D2 with respect to the first direction D1), and the focal point of the laser beam L is aligned with the surface A1, and the laser beam L is scanned with respect to the surface A1 with respect to the third direction D3 as the reciprocating direction, the angle that the first end face E1 makes with respect to the first direction D1 becomes (+θ+α) degrees, and the angle that the second end face E2 makes with respect to the first direction D1 becomes (+θ-α) degrees. Therefore, when (+θ)=(+α), the angle that the first end face E1 makes with respect to the first direction D1 becomes (+2α) degrees, and the angle that the second end face E2 makes with respect to the first direction D1 becomes 0 degrees.

[0035] Figure 4(a) is an SEM image of the processed area PA formed by the processing steps shown in Figure 3(a), and Figure 4(b) is an SEM image of the processed area PA formed by the processing steps shown in Figure 3(b). As shown in Figure 4(a), in the processed area PA formed by the processing steps shown in Figure 3(a), thermal effects HA (e.g., thermal strain, thermal damage, etc.) occur in the region near surface A1 on both the first end face E1 and the second end face E2. In contrast, as shown in Figure 4(b), in the processed area PA formed by the processing steps shown in Figure 3(b), thermal effects HA occurring in the region near surface A1 on both the first end face E1 and the second end face E2 are suppressed. Thus, when the angle that the first end face E1 makes with respect to the first direction D1 falls within the range of 45 degrees or more and less than 90 degrees, thermal effects on the first end face E1 are suppressed. Furthermore, if the angle that the second end face E2 makes with respect to the first direction D1 falls within the range of 0 ± 5 degrees, the thermal effects on the second end face E2 are suppressed.

[0036] Based on the above findings, in the microscope apparatus 1, the first end face E1 and / or the second end face E2 are observed as processed cross-sections by the first microscope section 4 and / or the second microscope section 5. The processing steps when the second end face E2 is the object of observation, and the processing steps when the first end face E1 is the object of observation, will be described below in this order. [Observation method when the second end face is the object of observation]

[0037] As shown in Figure 5(a), when the surface A1 of sample A is perpendicular to the first direction D1, multiple lines S are set up such that the processing area PA includes multiple lines S aligned in the second direction D2, each extending in the third direction D3. In this case, as shown in Figure 5(b), the control unit 70 controls at least one of the modification mechanism 8 and optical element 9 so that the incident direction D0 of the laser light L is tilted to one side (right side in Figure 5) in the second direction D2 with respect to the first direction D1, and in this state, as shown in Figure 5(a), the scanning unit 43 is controlled so that the irradiation area R of the laser light L moves along each of the multiple lines S. At this time, the control unit 70 controls the scanning unit 43 so that the movement of the irradiation area R of the laser light L along line S2 located at the other end (left side in Figure 5) of the multiple lines S is the last. As an example, the control unit 70 controls the scanning unit 43 so that the irradiation area R of the laser light L moves in a zigzag pattern from one side (right side in Figure 5) to the other side (left side in Figure 5) in the second direction D2.

[0038] As described above, in the observation method performed in the microscope device 1, the laser beam L is focused toward sample A while the irradiation area R of the laser beam L is moved along each of the multiple lines S, with the incident direction D0 of the laser beam L toward the surface A1 of sample A tilted toward one side of the second direction D2 (right side in Figure 5) relative to the first direction D1. Subsequently, the microscope device 1 performs an observation step in which the second end face E2 on the other side of the second direction D2 (left side in Figure 5) of the processing area PA is observed as the processed cross section Ls. Furthermore, if the second end face E2 is perpendicular to the surface A1 of sample A, that is, if the angle that the second end face E2 makes with respect to the first direction D1 is 0 degrees, then, as shown in Figure 6, if the recess CV is formed in sample A such that the bottom surface of the recess CV reaches the outer surface A2 of one side of sample A in the second direction D2 (the right side in Figure 6), it becomes easier to observe the second end face E2 from one side in the second direction D2 (observation in the direction of the white arrow in Figure 6).

[0039] Here, we will explain the process for determining the incident angle formed by the incident direction D0 of the laser light L with respect to the first direction D1. This determination process is performed by the control unit 70. As shown in Figure 7, the control unit 70 has a storage unit 71, a receiving unit 72, and a determination unit 73. The storage unit 71 is composed of, for example, a hard disk and stores various data. The receiving unit 72 is composed of, for example, a keyboard, mouse, GUI (Graphical User Interface), and accepts input of various data. The determination unit 73 is a functional unit composed of, for example, a CPU (Central Processing Unit), and executes the above determination process.

[0040] The above determination process will be explained with reference to Figure 8. First, the memory unit 71 stores a first angle for the second end face E2 (S11 in Figure 8). The first angle is the angle that the second end face E2 makes with respect to the first direction D1 when the second end face E2 is formed with respect to the first direction D1 when the incident direction D0 of the laser light L forms a predetermined angle with respect to the first direction D1. As an example, as shown in Figure 3(a), the second end face E2 is formed with respect to the first direction D1 when the incident direction D0 of the laser light L forms an angle of 0 degrees with respect to the first direction D1, and in that case, the angle that the second end face E2 makes with respect to the first direction D1, i.e., (-α) degrees, is stored by the memory unit 71.

[0041] Next, the reception unit 72 receives input for the second angle of the second end face E2 (S12 in Figure 8). The second angle is the angle that the second end face E2 of the object being observed makes with respect to the first direction D1. For example, the reception unit 72 receives input of 0 degrees so that the second end face E2 is perpendicular to the surface A1 of the sample A, that is, so that the angle that the second end face E2 makes with respect to the first direction D1 is 0 degrees.

[0042] Next, the determination unit 73 determines the incident angle for the second end face E2 based on the predetermined angle, the first angle, and the second angle (S13 in Figure 8). The incident angle is the angle that the incident direction D0 of the laser beam L makes with respect to the first direction D1 when forming the processing area PA, and is "second angle - first angle + predetermined angle". For example, if the predetermined angle is 0 degrees, the first angle is (-α) degrees, and the second angle is 0 degrees, the determination unit 73 determines the incident angle to be (+α) degrees (= 0 degrees - (-α) degrees + 0 degrees). This corresponds to the case where (+θ) = (+α) in the example shown in Figure 3(b), in which case the angle that the second end face E2 makes with respect to the first direction D1 is 0 degrees.

[0043] As described above, the incident angle formed by the incident direction D0 of the laser beam L with respect to the first direction D1 is determined. Note that when acquiring the first angle, the predetermined angle formed by the incident direction D0 of the laser beam L with respect to the first direction D1 is not limited to 0 degrees. For example, if the predetermined angle is (+β) degrees, the first angle is (-α) degrees, and the second angle is 0 degrees, the incident angle is determined by the determination unit 73 to be (+α+β) degrees (= 0 degrees - (-α) degrees + (+β degrees)). [Effects and benefits when the second end face is the object of observation]

[0044] In the microscope apparatus 1 and the observation method described above, when the surface A1 of sample A is perpendicular to the first direction D1, and the processing area PA includes multiple lines S aligned in the second direction D2, each extending in the third direction D3, the laser beam L is focused toward sample A while the irradiation area R of the laser beam L is moved along each of the multiple lines S, with the incident direction D0 of the laser beam L toward the surface A1 of sample A being inclined toward one side in the second direction D2 relative to the first direction D1. As a result, compared to, for example, when the laser beam L is focused and scanned with the incident direction D0 of the laser beam L perpendicular to the surface A1 of sample A, the thermal effects on the second end face E2 on the other side in the second direction D2 of the processing area PA, which is observed as the processed cross-section Ls, are suppressed. Therefore, the microscope apparatus 1 and the observation method described above can improve the accuracy of analysis by observing the processed cross-section Ls.

[0045] In the microscope apparatus 1 and the observation method described above, the angle that the second end face E2 makes with respect to the first direction D1 is within the range of 0 ± 5 degrees. As a result, the second end face E2 observed as the processed cross-section Ls is approximately perpendicular to the surface A1 of the sample A, so that the processed cross-section Ls can be observed from a direction perpendicular to the processed cross-section Ls with a simple configuration and process. It is also possible to increase the energy of the laser beam L to bring the angle that the second end face E2 makes with respect to the first direction D1 closer to 90 degrees, but in that case, there is a risk of strong thermal effects on the formed second end face E2.

[0046] In the microscope apparatus 1 and the observation method described above, when a second end face E2 is formed with the incident direction D0 of the laser beam L forming a predetermined angle with respect to the first direction D1, the first angle formed by the second end face E2 with respect to the first direction D1 is stored in the storage unit 71 of the control unit 70. The input of the second angle formed by the second end face E2 of the object to be observed with respect to the first direction D1 is received by the receiving unit 72 of the control unit 70. When forming a processing area PA, the incident angle formed by the incident direction D0 of the laser beam L with respect to the first direction D1 is determined by the determination unit 73 of the control unit 70 based on the predetermined angle, the first angle, and the second angle. As a result, a processed cross section Ls that forms a desired angle with respect to the surface A1 of the sample A can be obtained.

[0047] In the microscope apparatus 1 and the observation method described above, the angle of the support part 2 can be changed by the changing mechanism 8. This allows for appropriate adjustment of the incident direction D0 of the laser light L to the surface A1 of the sample A.

[0048] In the microscope apparatus 1 and the observation method described above, the incident direction D0 of the laser light L can be changed by the optical element 9. This allows for appropriate adjustment of the incident direction D0 of the laser light L to the surface A1 of the sample A.

[0049] In the microscope apparatus 1 and the observation method described above, the light-gathering unit 42 includes an fθ lens. This allows the irradiation area R of the laser beam L to be moved along a plane parallel to the surface A1 of the sample A when scanning the laser beam L over the sample A.

[0050] In the microscope apparatus 1 and the observation method described above, the scanning unit 43 is controlled by the control unit 70 so that the movement of the irradiation area R along line S2, which is located at the other end of the multiple lines S in the second direction D2, is the last step. This makes it possible to suppress the adhesion of particles generated by irradiation with laser light L to the second end surface E2 on the other side of the processing area PA in the second direction D2, which is observed as the processed cross section Ls. [Observation method when the first end face is the object of observation]

[0051] As shown in Figure 9(a), when the surface A1 of sample A is perpendicular to the first direction D1, multiple lines S are set up such that the processing area PA includes multiple lines S aligned in the second direction D2, each extending in the third direction D3. In this case, as shown in Figure 9(b), the control unit 70 controls at least one of the modification mechanism 8 and optical element 9 so that the incident direction D0 of the laser light L is tilted to one side (right side in Figure 9) in the second direction D2 with respect to the first direction D1, and in this state, as shown in Figure 9(a), the scanning unit 43 is controlled so that the irradiation area R of the laser light L moves along each of the multiple lines S. At this time, the control unit 70 controls the scanning unit 43 so that the movement of the irradiation area R of the laser light L along line S1 located at the end of one side (right side in Figure 9) of the multiple lines S is the last. As an example, the control unit 70 controls the scanning unit 43 so that the irradiation area R of the laser light L moves in a zigzag pattern from the other side (left side in Figure 9) to the one side (right side in Figure 9) in the second direction D2.

[0052] As described above, in the observation method performed in the microscope device 1, the laser beam L is focused toward sample A while the irradiation area R of the laser beam L is moved along each of the multiple lines S, with the incident direction D0 of the laser beam L toward the surface A1 of sample A tilted toward one side of the second direction D2 (right side in Figure 9) relative to the first direction D1. Subsequently, the microscope device 1 performs an observation step in which the first end face E1 on one side of the processing area PA in the second direction D2 (right side in Figure 9) is observed as the processed cross section Ls.

[0053] Here, the process for determining the incident angle formed by the incident direction D0 of the laser beam L with respect to the first direction D1 will be explained with reference to Figure 10. First, the storage unit 71 stores a first angle for the first end face E1 (S21 in Figure 10). The first angle is the angle that the first end face E1 makes with respect to the first direction D1 when the first end face E1 is formed with respect to the first direction D1 when the incident direction D0 of the laser beam L forms a predetermined angle with respect to the first direction D1. As an example, as shown in Figure 3(a), the first end face E1 is formed with respect to the first direction D1 when the incident direction D0 of the laser beam L forms an angle of 0 degrees with respect to the first direction D1, and in that case, the angle that the first end face E1 makes with respect to the first direction D1, i.e., (+α) degrees, is stored by the storage unit 71.

[0054] Next, the reception unit 72 receives input for the second angle of the first end face E1 (S22 in Figure 10). The second angle is the angle that the first end face E1 of the object being observed makes with respect to the first direction D1. For example, the reception unit 72 receives input of (+2α) degrees so that the angle that the first end face E1 makes with respect to the first direction D1 is (+2α) degrees.

[0055] Next, the determination unit 73 determines the incident angle for the first end face E1 based on the predetermined angle, the first angle, and the second angle (S23 in Figure 10). The incident angle is the angle that the incident direction D0 of the laser beam L makes with respect to the first direction D1 when forming the processing area PA, and is "second angle - first angle + predetermined angle". For example, if the predetermined angle is 0 degrees, the first angle is (+α) degrees, and the second angle is (+2α) degrees, the determination unit 73 determines the incident angle to be (+α) degrees (= (+2α) degrees - (+α) degrees + 0 degrees). This corresponds to the case where (+θ) = (+α) in the example shown in Figure 3(b), in which case the angle that the second end face E2 makes with respect to the first direction D1 is 0 degrees.

[0056] As described above, the incident angle formed by the incident direction D0 of the laser beam L with respect to the first direction D1 is determined. Note that when acquiring the first angle, the predetermined angle formed by the incident direction D0 of the laser beam L with respect to the first direction D1 is not limited to 0 degrees. For example, if the predetermined angle is (+β) degrees, the first angle is (+α) degrees, and the second angle is (+2α) degrees, then the determination unit 73 determines the incident angle as (+α+β) degrees (=(+2α) degrees - (+α) degrees + (+β degrees)). [Effects and benefits when the first end face is the object of observation]

[0057] In the microscope apparatus 1 and the observation method described above, when the surface A1 of sample A is perpendicular to the first direction D1, and the processing area PA includes multiple lines S aligned in the second direction D2, each extending in the third direction D3, the laser beam L is focused toward sample A while the irradiation area R of the laser beam L is moved along each of the multiple lines S, with the incident direction D0 of the laser beam L toward the surface A1 of sample A being inclined toward one side in the second direction D2 relative to the first direction D1. As a result, compared to, for example, when the laser beam L is focused and scanned with the incident direction D0 of the laser beam L perpendicular to the surface A1 of sample A, the thermal effects on the first end face E1 on one side in the second direction D2 of the processing area PA, which is observed as the processed cross-section Ls, are suppressed. Therefore, the microscope apparatus 1 and the observation method described above can improve the accuracy of analysis by observing the processed cross-section Ls.

[0058] In the microscope apparatus 1 and the observation method described above, the angle that the first end face E1 makes with respect to the first direction D1 is within the range of 45 degrees or more and less than 90 degrees. This makes it possible to more reliably suppress the thermal effects occurring on the first end face E1. Furthermore, since the area of ​​the first end face E1 observed as the machined cross-section Ls is increased, the machined cross-section Ls can be observed with high resolution.

[0059] Figure 11(a) is a secondary electron image of the first end face E1 formed by the processing steps shown in Figure 3(a), and Figure 11(b) is a secondary electron image of the first end face E1 formed by the processing steps shown in Figure 3(b). Also, Figure 12(a) is a backscattered electron image of the first end face E1 formed by the processing steps shown in Figure 3(a), and Figure 12(b) is a backscattered electron image of the first end face E1 formed by the processing steps shown in Figure 3(b). As shown in Figures 11(a) and 12(a), in the first end face E1 formed by the processing steps shown in Figure 3(a), thermal influence HA occurs in the region near surface A1 on the first end face E1. In contrast, as shown in Figures 11(b) and 12(b), the thermal influence HA occurring in the region near surface A1 on the first end face E1 formed by the processing step shown in Figure 3(b) is suppressed. Thus, when the angle that the first end face E1 makes with respect to the first direction D1 falls within the range of 45 degrees or more and less than 90 degrees, the thermal influence occurring on the first end face E1 is suppressed.

[0060] Figure 13(a) is a cross-sectional view of sample A having a first end face E1 formed by the "processing step for forming the second end face E2" shown in Figure 3(b), when sample A has a laminated structure, and Figure 13(b) is a cross-sectional view of sample A having a first end face E1 formed by the "processing step for forming the first end face E1" shown in Figure 3(b), when sample A has a laminated structure. As shown in Figures 13(a) and (b), when the angle that the first end face E1 makes with respect to the first direction D1 falls within the range of 45 degrees or more and less than 90 degrees (case of Figure 13(b)), the area of ​​the first end face E1 observed as the processed cross section Ls (in other words, the cross-sectional area of ​​each layer) is larger compared to when the angle that the first end face E1 makes with respect to the first direction D1 is approximately 90 degrees (case of Figure 13(a)), so that each layer of sample A can be observed with high resolution.

[0061] In the microscope apparatus 1 and the observation method described above, when the first end face E1 is formed with the incident direction D0 of the laser light L forming a predetermined angle with respect to the first direction D1, the first angle formed by the first end face E1 with respect to the first direction D1 is stored in the storage unit 71 of the control unit 70. The input of the second angle formed by the first end face E1 of the object to be observed with respect to the first direction D1 is received by the reception unit 72 of the control unit 70. When forming a processing area PA, the incident angle formed by the incident direction D0 of the laser light L with respect to the first direction D1 is determined by the determination unit 73 of the control unit 70 based on the predetermined angle, the first angle, and the second angle. As a result, a processed cross section Ls that forms a desired angle with respect to the surface A1 of the sample A can be obtained.

[0062] In the microscope apparatus 1 and the observation method described above, the angle of the support part 2 can be changed by the changing mechanism 8. This allows for appropriate adjustment of the incident direction D0 of the laser light L to the surface A1 of the sample A.

[0063] In the microscope apparatus 1 and the observation method described above, the incident direction D0 of the laser light L can be changed by the optical element 9. This allows for appropriate adjustment of the incident direction D0 of the laser light L to the surface A1 of the sample A.

[0064] In the microscope apparatus 1 and the observation method described above, the light-gathering unit 42 includes an fθ lens. This allows the irradiation area R of the laser beam L to be moved along a plane parallel to the surface A1 of the sample A when scanning the laser beam L over the sample A.

[0065] In the microscope apparatus 1 and the observation method described above, the scanning unit 43 is controlled by the control unit 70 so that the movement of the irradiation area R along line S1, which is located at one end of the multiple lines S in the second direction D2, is the last step. This makes it possible to suppress the adhesion of particles generated by irradiation with laser light L to the first end surface E1 on one side of the processing area PA in the second direction D2, which is observed as the processed cross section Ls. [Deep drilling of recessed areas]

[0066] The process of deep-cutting recessed areas (CVs) will now be described. As shown in Figures 14(a) and (b), the incident direction D0 of the laser beam L on the surface A1 of the sample A is inclined toward one side of the second direction D2 (right side in Figure 14) relative to the first direction D1. A first processing step is performed in which the laser beam L is focused toward the sample A and scanned in a first scanning range SR1 perpendicular to the first direction D1. This forms recessed areas (CVs) corresponding to the first scanning range SR1. In the first processing step, the focal point of the laser beam L is aligned, for example, with the surface A1.

[0067] Next, a second processing step is performed in which the laser beam L is focused toward sample A while scanning sample A in a second scanning range SR2 perpendicular to the first direction D1, with the incident direction D0 of the laser beam L toward the surface A1 of sample A tilted toward one side in the second direction D2 (right side in Figure 14) relative to the first direction D1. When viewed from the first direction D1, the second scanning range SR2 includes the first scanning range SR1, and the "pair of sides facing each other in the second direction D2" of the second scanning range SR2 are located outside the "pair of sides facing each other in the second direction D2" of the first scanning range SR1. As a result, a recess CV corresponding to the second scanning range SR2 is formed. The depth of the recess CV corresponding to the second scanning range SR2 is greater than the depth of the recess CV corresponding to the first scanning range SR1, and the areas of the first end face E1 and the second end face E2 of the recess CV corresponding to the second scanning range SR2 are greater than the areas of the first end face E1 and the second end face E2 of the recess CV corresponding to the first scanning range SR1. In the second processing step, the focal point of the laser beam L is aligned, for example, with the bottom surface of the recess CV formed in the first processing step.

[0068] By performing the deep-cutting process of the recessed CV described above, it is possible to increase the area of ​​the first end face E1 and the second end face E2 while suppressing the thermal effects on the first and second end faces E2 of the object to be observed. To further increase the area of ​​the first and second end faces E1 and E2, the second processing step described above can be treated as the first processing step, and a new second processing step can be performed. The deep-cutting process of the recessed CV described above is applicable to both the "observation method when the first end face E1 is the object to be observed" and the "observation method when the second end face E2 is the object to be observed" described above.

[0069] Furthermore, if it is necessary to increase the area of ​​the first end face E1 of the object to be observed while suppressing the thermal effects occurring on the first end face E1, the setting of the second scanning range SR2 should be done by positioning "one side in the second direction D2" of the second scanning range SR2 outside of "one side in the second direction D2" of the first scanning range SR1. Similarly, if it is necessary to increase the area of ​​the second end face E2 of the object to be observed while suppressing the thermal effects occurring on the second end face E2, the setting of the second scanning range SR2 should be done by positioning "the other side in the second direction D2" of the second scanning range SR2 outside of "the other side in the second direction D2" of the first scanning range SR1. [Laser beam branching processing]

[0070] The branching process of the laser beam L will now be explained. First, a laser beam L having a pulse width of 1 ps or less is output from the output unit 30. Then, the laser beam L having a pulse width of 1 ps or less is branched into multiple branched laser beams by a spatial light modulator 41 which functions as a branching unit. In this example, the multiple branched laser beams are, as shown in Figure 15, a first branched laser beam L1 having a first polarization direction P1, a second branched laser beam L2 having a second polarization direction P2 perpendicular to the first polarization direction P1, and a third branched laser beam L3 having the first polarization direction P1.

[0071] As an example, the modulation pattern displayed on the liquid crystal layer of the spatial light modulator 41 is a diffraction grating pattern. When a diffraction grating pattern is displayed on the liquid crystal layer of the spatial light modulator 41, for example, the component of the laser light L emitted from the half-wave plate 54 in the second polarization direction P2 is not modulated (diffracted) by the spatial light modulator 41 and is emitted from the spatial light modulator 41 as the 0th-order light, the second branched laser light L2. On the other hand, for example, the component of the laser light L emitted from the half-wave plate 54 in the first polarization direction P1 is modulated (diffracted) by the spatial light modulator 41 and is emitted from the spatial light modulator 41 as the ±1st-order light, the first branched laser light L1 and the third branched laser light L3.

[0072] The first branched laser beam L1, the second branched laser beam L2, and the third branched laser beam L3 are focused toward sample A by the focusing unit 42, forming a first irradiation area R1 of the first branched laser beam L1, a second irradiation area R2 of the second branched laser beam L2, and a third irradiation area R3 of the third branched laser beam L3 on sample A. The first irradiation area R1, the second irradiation area R2, and the third irradiation area R3 are then moved along each of the multiple lines S while aligned in the second direction D2 by the control unit 70 and the scanning unit 43. In this example, the first irradiation area R1, the second irradiation area R2, and the third irradiation area R3 are continuous as a single irradiation area, with the second irradiation area R2 positioned between the first irradiation area R1 and the third irradiation area R3.

[0073] By performing the above-described branching process of the laser beam L, it is possible to suppress the formation of a fine periodic structure (for example, a laser-induced periodic surface structure (LIPSS)) on the first end face E1 and the second end face E2 of the object being observed. The above-described branching process of the laser beam L is applicable to both the "observation method when the first end face E1 is the object being observed" and the "observation method when the second end face E2 is the object being observed" described above.

[0074] Furthermore, if it is necessary to suppress the formation of a fine periodic structure on the first end face E1 of the object to be observed, the first irradiation region R1, the second irradiation region R2, and the third irradiation region R3 should be moved along at least a line S1 (see Figure 9) along the first end face E1. Similarly, if it is necessary to suppress the formation of a fine periodic structure on the second end face E2 of the object to be observed, the first irradiation region R1, the second irradiation region R2, and the third irradiation region R3 should be moved along at least a line S2 (see Figure 5) along the second end face E2. In addition, in the laser beam branching process described above, the multiple branched laser beams should include at least a first branched laser beam L1 having a first polarization direction P1, and a second branched laser beam L2 having a second polarization direction P2 perpendicular to the first polarization direction P1. [Laser beam polarization adjustment processing]

[0075] The process of adjusting the polarization of the laser beam L will now be explained. First, a laser beam L having a pulse width of 1 ps or less is output from the output unit 30. The polarization direction of the laser beam L having a pulse width of 1 ps or less is adjusted by a half-wave plate 54, which functions as a polarization adjustment unit, so as shown in Figure 16, that it includes a first component C1 having a first polarization direction P1 and a second component C2 having a second polarization direction P2 perpendicular to the first polarization direction P1, and that the intensity of the first component C1 is greater than or equal to the intensity of the second component C2. The first component having the first polarization direction P1 is then modulated by a spatial light modulator 41 and emitted as modulated light Lm, while the second component having the second polarization direction P2 is not modulated by the spatial light modulator 41 and is emitted as unmodulated light Ln.

[0076] The modulated light Lm and unmodulated light Ln are focused toward sample A by the focusing unit 42, and a single irradiation region R including the modulated light Lm and unmodulated light Ln is formed on sample A. Then, the single irradiation region R is moved along each of the multiple lines S by the control unit 70, under the control of the scanning unit 43, such that the first polarization direction P1 is aligned with the second direction D2 and the second polarization direction P2 is aligned with the third direction D3 within the single irradiation region R.

[0077] By performing the polarization adjustment process of the laser beam L described above, the formation of a fine periodic structure on the first end face E1 and the second end face E2 of the object being observed can be suppressed. The polarization adjustment process of the laser beam L described above can be applied to either the "observation method when the first end face E1 is the object being observed" or the "observation method when the second end face E2 is the object being observed."

[0078] Furthermore, if it is necessary to suppress the formation of a fine periodic structure on the first end face E1 of the object to be observed, one irradiation region R including modulated light Lm and unmodulated light Ln should be moved along at least a line S1 (see Figure 9) along the first end face E1. Similarly, if it is necessary to suppress the formation of a fine periodic structure on the second end face E2 of the object to be observed, one irradiation region R including modulated light Lm and unmodulated light Ln should be moved along at least a line S2 (see Figure 5) along the second end face E2. [Method for observing the end face parallel to the surface of the sample]

[0079] Observation of the end face parallel to the surface A1 of sample A will be described. As shown in Figures 17(a) and (b), when the surface A1 of sample A is perpendicular to the first direction D1, multiple lines S are set up so that the processing area PA includes multiple lines S aligned in the second direction D2, each extending in the third direction D3. Subsequently, a processing step is performed in which the irradiation area R of the laser beam L is moved along each of the multiple lines S while the incident direction D0 of the laser beam L to the surface A1 of sample A is inclined toward one side in the second direction D2 (right side in Figure 17) with respect to the first direction D1. At this time, the incident direction D0 is adjusted so that the end face E is parallel to the surface A1. In this example, the processing area PA is formed on sample A so that the end face E reaches the outer surface A2 of one side of the side surface of sample A in the second direction D2 (right side in Figure 17). Next, an observation step is performed in which the end face E parallel to surface A1 within the processing area PA is observed as a processed cross-section Ls along surface A1. By repeating the above processing step and observation step, it is possible to analyze each processed cross-section Ls of sample A, which have different depths from surface A1. [Differentiation]

[0080] The present invention is not limited to any of the examples described above. For example, in any of the examples described above, the processing area PA may include a plurality of lines S aligned in the second direction D2, each extending in the third direction D3. The plurality of lines S may be arranged such that at least a portion of each line S is located along the second direction D2. That is, the lengths of each line S may differ, and at least one position of one end, other end, and center of each line S may not coincide with each other along the second direction D2. As an example, as shown in Figures 18(a) and (b), if the processing area PA includes a plurality of lines S aligned in the second direction D2, each extending in the third direction D3, the plurality of lines S may be arranged in a spiral. When observing the second end face E2 on the other side of the second direction D2 within the processing area PA as the processing cross-section Ls, it is preferable that the control unit 70 controls the scanning unit 43 so that the movement of the irradiation area R along line S2, located at the other end of the second direction D2 among the multiple lines S, is the last, in order to suppress particles generated by irradiation with laser light L from adhering to the second end face E2, as shown in Figure 18(a). When observing the first end face E1 on one side of the second direction D2 within the processing area PA as the processing cross-section Ls, it is preferable that the control unit 70 controls the scanning unit 43 so that the movement of the irradiation area R along line S1, located at the one end of the second direction D2 among the multiple lines S, is the last, in order to suppress particles generated by irradiation with laser light L from adhering to the first end face E1, as shown in Figure 18(b).

[0081] Furthermore, in any of the examples described above, the modification mechanism 8 may change the angle of the light-gathering unit 42 in addition to or instead of changing the angle of the support unit 2. In other words, the modification mechanism 8 only needs to be a mechanism that changes the angle of at least one of the support unit 2 and the light-gathering unit 42. If the modification mechanism 8 changes both the angle of the support unit 2 and the angle of the light-gathering unit 42, the mechanism for changing the angle of the support unit 2 and the mechanism for changing the angle of the light-gathering unit 42 may be provided separately. Also, in any of the examples described above, the optical element 9 may be positioned between the light-gathering unit 42 and the window unit 11. Furthermore, in any of the examples described above, if the microscope device 1 is provided with an angle adjustment unit for adjusting the incident direction D0 of the laser light L to the surface A1 of the sample A, the angle adjustment unit may be composed of something other than the modification mechanism 8 and the optical element 9. Furthermore, when the control unit 70 controls the angle adjustment unit so that the incident direction D0 of the laser beam L is inclined to one side in the second direction D2 with respect to the first direction D1, the incident direction D0 of the laser beam L only needs to include at least "a component that is inclined to one side in the second direction D2 with respect to the first direction D1", and may also include, for example, "a component that is inclined to one or the other side in the third direction D3 with respect to the first direction D1". Also, the surface A1 does not have to be a perfectly flat surface, for example, a surface that includes fine irregularities, as long as it is a surface that extends along a direction perpendicular to the first direction D1 when viewed macroscopically.

[0082] As an example, when forming a hole H in sample A with an inner surface H1 perpendicular to the surface A1, as shown in Figures 19(a), (b), and (c), a line S extending along the inner surface H1 is set, and the irradiation area R of the laser beam L is moved along line S while tilting the incident direction D0 of the laser beam L toward the center of the hole H so that the inner surface H1 is perpendicular to the surface A1. In this case, if the incident direction D0 of the laser beam L relative to the surface A1 of sample A can be adjusted, the angle of the support part 2 or the angle of the light-gathering part 42 can be changed. Note that Figure 19(a) is a plan view of sample A, and Figures 19(b) and (c) are cross-sectional views of sample A. [Explanation of symbols]

[0083] 1...Microscope device, 2...Support unit, 4...First microscope unit (microscope section), 5...Second microscope unit (microscope section), 8...Changing mechanism (angle adjustment unit), 9...Optical element (angle adjustment unit), 30...Output unit, 41...Spatial light modulator (branching unit), 42...Light collecting unit, 43...Scanning unit, 70...Control unit, 71...Storage unit, 72...Receiving unit, 73...Decision unit, A...Sample (object), A1...Surface, C1...First component, C2...Second Components, D0...incident direction, D1...first direction, D2...second direction, D3...third direction, E...end face, E1...first end face (end face), E2...second end face (end face), L...laser light, L1...first branched laser light, L2...second branched laser light, Lm...modulated light, Ln...unmodulated light, Ls...machined cross section, PA...machining area, R...irradiation area, R1...first irradiation area, R2...second irradiation area, S, S1, S2...lines.

Claims

1. A microscope device for irradiating the surface of an object with laser light to form a processing area on the object having a processing cross-section that intersects the surface, and for observing the processing cross-section, A support portion that supports the aforementioned object, The output unit that outputs the aforementioned laser light, A focusing unit that focuses the laser light output from the output unit toward the target object, A scanning unit that scans the laser beam output from the output unit onto the target object, An angle adjustment unit for adjusting the direction of incidence of the laser light on the surface, A microscope unit for observing the processed cross-section, It comprises at least a control unit that controls the scanning unit and the angle adjustment unit, When the surface is perpendicular to the first direction, and the processing area includes a plurality of lines arranged in a second direction perpendicular to the first direction, each of which extends in a third direction perpendicular to both the first and second directions, the control unit provides the control. The angle adjustment unit is controlled so that the incident direction is inclined to one side in the second direction with respect to the first direction. The scanning unit is controlled so that the irradiation area of ​​the laser light moves along each of the plurality of lines. The microscope unit is a microscope device that observes the other end face in the second direction of the processing area as the processed cross-section.

2. The microscope apparatus according to claim 1, wherein the angle that the end face makes with respect to the first direction is within the range of 0 ± 5 degrees.

3. The control unit, A storage unit that stores the first angle formed with respect to the first direction by the end face which is formed such that the incident direction forms a predetermined angle with respect to the first direction, A receiving unit that receives input of a second angle that the end face of the object to be observed makes with respect to the first direction, The microscope apparatus according to claim 1, comprising: a determination unit that determines the angle of incidence that the incident direction makes with respect to the first direction when forming the processing area, based on the predetermined angle, the first angle and the second angle.

4. The microscope apparatus according to claim 1, wherein the angle adjustment unit includes a changing mechanism for changing the angle of at least one of the support unit and the light-gathering unit.

5. The microscope apparatus according to claim 1, wherein the angle adjustment unit includes an optical element that changes the incident direction.

6. The microscope apparatus according to claim 1, wherein the light-gathering unit includes an fθ lens.

7. The output unit further comprises a branching unit that branches the laser light output from the output unit into a plurality of branched laser beams, including a first branched laser beam having a first polarization direction and a second branched laser beam having a second polarization direction perpendicular to the first polarization direction. The output unit outputs the laser light having a pulse width of 1 ps or less. The focusing unit focuses the first branched laser beam toward the object to form a first irradiation area of ​​the first branched laser beam toward the object, and focuses the second branched laser beam toward the object to form a second irradiation area of ​​the second branched laser beam toward the object, The microscope apparatus according to claim 1, wherein the control unit controls the scanning unit so that the first irradiation area and the second irradiation area, which are aligned in the second direction, move along each of the plurality of lines.

8. A polarization adjustment unit adjusts the polarization direction of the laser light output from the output unit so that it includes a first component having a first polarization direction and a second component having a second polarization direction perpendicular to the first polarization direction, and so that the intensity of the first component is greater than or equal to the intensity of the second component. The system further comprises a spatial light modulator that modulates the first component and emits it as modulated light, and emits the second component as unmodulated light, The output unit outputs the laser light having a pulse width of 1 ps or less. The light-gathering unit focuses the modulated light and the unmodulated light toward the object, thereby forming a single irradiation area on the object that includes the modulated light and the unmodulated light. The microscope apparatus according to claim 1, wherein the control unit controls the scanning unit so that the irradiation region moves along each of the plurality of lines such that the first polarization direction is along the second direction and the second polarization direction is along the third direction within one irradiation region.

9. The microscope apparatus according to claim 1, wherein the control unit controls the scanning unit such that the movement of the irradiation area along the line located at the other end of the plurality of lines in the second direction is the last.

10. An observation method for irradiating the surface of an object with laser light to form a processing area on the object having a processed cross-section that intersects the surface, and observing the processed cross-section, When the surface is perpendicular to a first direction, and the processing area includes a plurality of lines arranged in a second direction perpendicular to the first direction, each of which extends in a third direction perpendicular to both the first and second directions, the processing step involves focusing the laser beam toward the object while moving the irradiation area of ​​the laser beam along each of the plurality of lines, with the incident direction of the laser beam toward the surface being inclined toward one side in the second direction relative to the first direction. An observation method comprising, after the processing step, an observation step of observing the other end face in the second direction of the processing area as the processed cross-section.

Images