Optical component, optical module equipped with optical component, and method for manufacturing optical component.

Abstract

To provide an easily assembled optical component and a method for manufacturing the same. [Solution] The optical component 100 comprises a metal member 3, a first glass material 1, a second glass material 2, and a light-transmitting member 5. The metal member 3 has a first surface 31s, a second surface 32s, and a through hole 30. The second surface 32s is located on the opposite side of the first surface 31s. The through hole 30 penetrates from the first surface 31s to the second surface 32s. The first glass material 1 is located on the first surface 31s and surrounds the through hole 30 in a plan view. The second glass material 2 is located on the first glass material 1 and surrounds the through hole 30 in a plan view. The light-transmitting member 5 is located on the second glass material 2 and overlaps with the through hole 30 in a plan view. The light-transmitting member 5 is also light-transmitting. The softening temperature of the first glass material 1 is higher than the softening temperature of the second glass material 2.

Description

Technical Field

[0001] Optical components, optical modules including the optical components, and manufacturing methods for the optical components.

Background Art

[0002] Conventional caps for semiconductor devices are described, for example, in Patent Document 1.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Means for Solving the Problems

[0004] In one embodiment, (1) the optical component includes a metal member, a first glass material, a second glass material, and a light-transmitting member. The metal member has a first surface, a second surface, and a through-hole. The second surface is located on the opposite side of the first surface. The through-hole penetrates from the first surface to the second surface. The first glass material is located on the first surface and surrounds the through-hole in a plan view. The second glass material is located on the first glass material and surrounds the through-hole in a plan view. The light-transmitting member is located on the second glass material and overlaps the through-hole in a plan view. Also, the light-transmitting member has light-transmitting properties. The softening temperature t1 of the first glass material is higher than the softening temperature t2 of the second glass material.

[0005] In one embodiment, (2) the optical component comprises a metal member, a first glass material, a second glass material, and a light-transmitting member. The metal member has a first surface, a second surface, and a through hole. The second surface is located on the opposite side of the first surface. The through hole extends from the first surface to the second surface. The first glass material is located on the first surface and surrounds the through hole in a plan view. The second glass material is located on the first glass material and surrounds the through hole in a plan view. The light-transmitting member is located on the second glass material and overlaps with the through hole in a plan view. The light-transmitting member is also light-transmitting. The mass percentage concentration of the first metal oxide material in the first glass material is lower than the mass percentage concentration of the first metal oxide material in the second glass material.

[0006] (3) In the optical component described in (2) above, the first metal oxide material includes at least one of the following: vanadium oxide (V2O5), ruthenium oxide (RuO2), phosphorus pentoxide (P2O5), arsenic trioxide (As2O3), boron oxide (B2O3), tellurium oxide (TeO2), bismuth oxide (Bi2O3), zinc oxide (ZnO), tin oxide (SnO2), and lead oxide (PbO).

[0007] (4) In the optical components described in (1) to (3) above, the light-transmitting member has a side surface located on a plane intersecting the first surface. The second glass material is in contact with at least a portion of the side surface.

[0008] (5) In the optical components described in (1) to (4) above, a plating layer is located on the metal member. The plating layer surrounds the first glass material.

[0009] (6) In the optical component described in (5) above, the plating layer is in contact with the first glass material.

[0010] (7) In the optical component described in (5) or (6) above, the material of the plating layer contains gold (Au).

[0011] (8) In the optical components described in (5) to (7) above, if the portion where the metal member and the first glass material are in contact is referred to as the first part, then in a plan view, the first part is surrounded by a plating layer.

[0012] (9) In the optical components described in (1) to (8) above, the softening temperature t0 of the light-transmitting member is lower than the softening temperature t1 of the first glass material and higher than the softening temperature t2 of the second glass material.

[0013] (10) In the optical components described in (1) to (9) above, a reflection reduction layer is located on at least a portion of the surface of the light-transmitting member.

[0014] (11) In the optical component described in (10) above, the reflection reduction layer is located between the light-transmitting member and the second glass material.

[0015] (12) In the optical components described in (1) to (11) above, in a plan view, the contact area between the first glass material and the metal member is larger than the contact area between the first glass material and the second glass material.

[0016] (13) In the optical components described in (1) to (12) above, the thickness of the first glass material is greater than the thickness of the second glass material.

[0017] (14) In the optical components described in (1) to (13) above, the first glass material and the second glass material are joined together.

[0018] (15) In the optical components described in (1) to (14) above, when viewed in a cross-sectional view perpendicular to the first surface, the point on the surface of the first glass material furthest from the first surface is designated as the first point, and the point on the surface of the second glass material furthest from the first surface is designated as the second point, the distance from the first surface to the second point is greater than or equal to the distance from the first surface to the first point.

[0019] (16) In one embodiment, the optical module comprises a substrate, electronic components, and the optical components described in (1) to (15) above. The electronic components are located on the substrate. The optical components are located on the substrate.

[0020] (17) In a method for manufacturing an optical component according to an embodiment, a first member having a first glass material applied to a predetermined position of a metal member is prepared. Then, the first member is subjected to metal plating. Thereafter, a second glass material having a softening temperature lower than that of the first glass material is applied onto the first glass material. Thereafter, a light-transmissive member having light-transmittance is adhered to the second glass material.

Brief Description of the Drawings

[0021] [Figure 1] It is a perspective view of an optical component according to an embodiment. [Figure 2] It is an exploded perspective view of the optical component shown in FIG. 1. [Figure 3] It is a plan view of the optical component shown in FIG. 1. [Figure 4] It is a cross-sectional view of the optical component shown in FIG. 3 cut along IV-IV. [Figure 5] It is an enlarged view of main part A shown in FIG. 4. [Figure 6] It is an enlarged view of main part B shown in FIG. 4. [Figure 7] It is a perspective view of an optical component according to other embodiments. [Figure 8] It is a plan view of the optical component shown in FIG. 7. [Figure 9] It is a cross-sectional view of the optical component shown in FIG. 8 cut along IX-IX. [Figure 10] It is an exploded perspective view of an optical module according to an embodiment. [Figure 11] It is a flowchart showing a method for manufacturing an optical component according to an embodiment.

Modes for Carrying Out the Invention

[0022] As in the invention described in Patent Document 1, as a method for sealing a light-transmissive window body to a metal cap body, a method is known in which the cap body is heated, an oxide film is formed on the surface of the cap body, and the light-transmissive window body is sealed with a low-melting-point glass using this oxide film.

[0023] In the method described above, applying a corrosion-resistant plating such as nickel plating to the surface of the cap body required removing any unwanted oxide film from the surface of the cap body before forming the plating, which increased the number of manufacturing steps.

[0024] <Configuration of optical components> Several exemplary embodiments will be described below with reference to the drawings. For convenience, a Cartesian coordinate system xyz is defined for the optical components. Furthermore, in this disclosure, the concept of plan view includes planar perspective.

[0025] As shown in Figures 1 to 6, in one embodiment, the optical component 100 comprises a metal member 3, a first glass material 1, a second glass material 2, and a light-transmitting member 5.

[0026] The metal member 3 has a first surface 31s, a second surface 32s, and a through hole 30. The second surface 32s is located on the opposite side of the first surface 31s. The through hole 30 penetrates from the first surface 31s to the second surface 32s. In the metal member 3, either surface may be designated as the first surface 31s, but the surface on which the first glass material 1 is located can be defined as the first surface 31s. Alternatively, the surface facing the first translucent surface 51s of the translucent member 5, which will be described later, in the z-direction may be defined as the first surface 31s.

[0027] The metal member 3 may have a projection that protrudes in an annular shape around the through hole 30, in which case the first surface 31s may be located on the projection.

[0028] The material of the metal member 3 may be, for example, a metallic material such as iron, copper, nickel, chromium, cobalt, molybdenum, or tungsten, or it may be an alloy material that combines several of the aforementioned metallic materials, such as an iron-nickel alloy or an iron-cobalt-nickel alloy.

[0029] Furthermore, as shown in Figure 2, the metal member 3 may be a box-shaped body with a concave cross-section having a space continuous with the through-hole 30, a flat plate-shaped body, or an annular member. The metal member 3 may be, for example, a cube or a rectangular parallelepiped, with dimensions ranging from 0.1 mm × 0.1 mm × 0.1 mm to 50 mm × 50 mm × 50 mm. If the metal member 3 is a box-shaped body, the first surface 31s may be the inner surface of the box-shaped body. In other words, in this case, the light-transmitting member 5, described later, will be located on the inside of the box-shaped body.

[0030] The through-hole 30 may be rectangular in shape, circular including an ellipse, or rectangular with rounded corners when viewed from above. The through-hole 30 can be formed in the metal member 3 by known drilling processes such as drilling, blasting, and laser processing.

[0031] As shown in Figure 3, the first glass material 1 is located on the first surface 31s and surrounds the through hole 30 in a plan view. In one embodiment, the first glass material 1 surrounds the entire outer edge of the through hole 30, but it is not necessary for the first glass material 1 to surround the entire outer edge of the through hole 30. In other words, the first glass material 1 does not have to be a perfect ring and may be interrupted in part. In a plan view, the first glass material 1 may be in contact with the outer edge of the through hole 30 or may be separated from it.

[0032] An annular buffer member may be positioned between the first glass material 1 and the metal member 3. The material of the buffering member may be a metal material, for example, it may be the same metal material as the metal member 3, or it may be a different metal material. The presence of the buffering member reduces the possibility of damage to the optical component 100 due to the difference in thermal expansion coefficients between the metal member 3 and the first glass material 1 or the second glass material 2.

[0033] The material of the first glass material 1 is, for example, silica glass with silicon dioxide (SiO2) as the main component. Here, "main component" means that the mass percentage concentration is 50% or more. The first glass material 1 may also be a so-called high-melting-point glass.

[0034] When forming the first glass material 1 on the first surface 31s of the metal member 3, the first glass material 1 and the metal member 3 may react to form a partial oxide film at the point where the first glass material 1 and the metal member 3 are in contact. This improves the bonding strength between the first glass material 1 and the metal member 3. Furthermore, the step of forming an oxide film on the metal member 3 can be omitted.

[0035] As shown in Figure 3, the second glass material 2 is located on the first glass material 1 and surrounds the through hole 30 in a plan view. In one embodiment, the second glass material 2 surrounds the entire outer edge of the through hole 30, but it is not necessary for the second glass material 2 to surround the entire outer edge of the through hole 30. The material of the second glass material 2 may include, for example, vanadium pentoxide (V2O5), tellurium dioxide (TeO2), barium oxide (BaO), zinc oxide (ZnO), and zirconium phosphate (O16P4Zr3). Alternatively, the material of the second glass material 2 may be silica glass to which impurities such as phosphorus and boron have been added.

[0036] Furthermore, the second glass material 2 may be so-called low-melting-point glass. Specifically, low-melting-point glass is amorphous or crystalline glass that softens, deforms, and flows at temperatures between 200°C and 600°C. Crystalline glass refers to a composite of amorphous and crystalline glass. Examples of low-melting-point glass include borosilicate glass, barium borosilicate glass, zinc borate glass, barium borate glass, high-silicic acid glass, aluminophosphate glass, phosphate glass, zinc phosphate glass, alkali glass, bismuth silicate glass, bismuth borosilicate glass, bismuth zinc borate glass, lead borosilicate glass, lead borate glass, potassium lead glass, and crystalline lead glass. Low-melting-point glass offers superior airtightness compared to resin-based adhesives.

[0037] As the material for the second glass material 2, lead-free low-melting-point glass may be used. Lead-free means that the lead content is 0.1% by mass or less (RoHS (Restriction of the use of certain hazardous substances in)). This means that it conforms to the (electrical and electronic equipment) regulations. Examples of Pb-free low-melting-point glass include borosilicate glass, barium borosilicate glass, zinc borate glass, barium borate glass, high-silicic acid glass, aluminophosphate glass, phosphate glass, zinc phosphate glass, alkali glass, bismuth silicate glass, bismuth borosilicate salt glass, and bismuth zinc borate glass.

[0038] The light-transmitting member 5 is located on the second glass material 2 and overlaps with the through-hole 30 in a plan view. The light-transmitting member 5 is also light-transmitting. Because the light-transmitting member 5 is light-transmitting, when the optical component 100 is used in the optical module 10, light emitted from the electronic component 9 (e.g., semiconductor laser) located inside the optical module 10 can be emitted to the outside of the optical module 10. Furthermore, if the electronic component 9 is a light-receiving element (e.g., a photodiode or CMOS sensor), the light transmitted through the light-transmitting member 5 can be received by the electronic component 9.

[0039] The light-transmitting member 5 may be a flat plate as shown in Figure 2, a curved plate, or a sphere. The material of the light-transmitting member 5 may be resin or glass. More specifically, the material of the light-transmitting member 5 may be sapphire glass or borosilicate glass. Sapphire glass has superior strength and transmittance compared to borosilicate glass. Also, borosilicate glass is easier to process and manufacture than sapphire glass. Furthermore, the light-transmitting member 5 may have a structure in which transparent members are laminated in multiple layers. When the material of the light-transmitting member 5 is glass, the electronic components 9 inside the optical module 10 can be more hermetically sealed when the optical component 100 is used in the optical module 10. In one embodiment, the light-transmitting member 5 may be a lens.

[0040] Here, the thickness of the light-transmitting member 5 (i.e., its dimension in the z-direction) is, for example, 0.1 mm to 1 mm.

[0041] The light-transmitting member 5 does not necessarily need to overlap the entire through-hole 30 in a plan view; it may overlap only a portion of it. The light-transmitting member 5 may overlap the entire through-hole 30 in a plan view. More specifically, as shown in Figure 3, the area of ​​the light-transmitting member 5 may be larger than the area of ​​the through-hole 30. In this case, the possibility of the light-transmitting member 5 falling into the through-hole 30 can be reduced, making it easier to stably position the light-transmitting member 5 on the first glass material 1 and the second glass material 2.

[0042] The softening temperature t1 of the first glass material 1 is higher than the softening temperature t2 of the second glass material 2. This configuration reduces the possibility of the first glass material 1 softening or deforming due to the temperature of the second glass material 2 when the second glass material 2 is heated and positioned on top of the first glass material 1. Therefore, the light-transmitting member 5 can be stably bonded to the second glass material 2. Consequently, the assembly of the optical component 100 can be facilitated. Furthermore, since the first glass material 1 and the second glass material 2 are positioned in layers, when the optical component 100 is used in the optical module 10, the heat generated from the electronic components 9 located inside the optical module 10 can be efficiently dissipated.

[0043] More specifically, the above-described configuration can be rephrased as having a high-melting-point glass (first glass material 1) positioned on a metal member 3, and a low-melting-point glass (second glass material 2) positioned on top of the high-melting-point glass (first glass material 1).

[0044] Herein, in this disclosure, the softening temperature refers to the temperature at which each component begins to deform. If the first glass material 1 contains 60% to 70% silicon dioxide (SiO2) and 20% to 30% boron oxide (B2O3) in mass percent concentrations, the softening temperature t1 of the first glass material 1 is, for example, 650°C to 800°C. If the second glass material 2 contains 30% to 35% vanadium oxide (V2O5), 30% to 50% tellurium oxide (TeO2), and 15% to 35% zirconium phosphate (O16P4Zr3) in mass percent concentrations, the softening temperature t2 of the second glass material 2 is, for example, 300°C to 500°C.

[0045] As shown in Figures 4 and 5, a diffusion layer 12 may be located between the first glass material 1 and the second glass material 2. The diffusion layer 12 may be a portion where the first glass material 1 and the second glass material 2 have melted and mixed together. By having a diffusion layer 12 located between the first glass material 1 and the second glass material 2, the bonding strength between the first glass material 1 and the second glass material 2 can be improved. Therefore, when the optical component 100 is used in the optical module 10, the electronic components 9 inside the optical module 10 can be sealed more hermetically.

[0046] Furthermore, a frame-shaped member that surrounds the through-hole 30, or a light-transmitting filter, may be positioned between the first glass material 1 and the second glass material 2. The material of the frame-shaped member may be, for example, The material may be a ceramic material such as alumina. If a frame-shaped member made of a ceramic material is positioned between the first glass material 1 and the second glass material 2, the difference in thermal expansion between the first glass material 1 and the second glass material 2 can be mitigated. Therefore, residual stress when assembling the optical component 100 can be reduced. In addition, since alumina has higher rigidity than the metal material used in the metal member 3, for example, when seam welding the optical component 100 to the substrate 8 described later, the possibility of deformation or damage to the light-transmitting member 5 due to thermal deformation can be reduced. The filter may be, for example, a color filter or an IR (Infrared Rays) cut filter.

[0047] More specifically, the state in which the aforementioned frame-shaped member or a light-transmitting filter is not located between the first glass material 1 and the second glass material 2 can be rephrased as the first glass material 1 and the second glass material 2 being joined. Note that the state in which the first glass material 1 and the second glass material 2 are joined also includes the state in which the diffusion layer 12 is located between the first glass material 1 and the second glass material 2.

[0048] The mass percentage concentration (wt%) of the first metal oxide material in the first glass material 1 is lower than the mass percentage concentration (wt%) of the first metal oxide material in the second glass material 2. Here, a low mass percentage concentration includes cases where the mass percentage concentration of the first metal oxide material in the first glass material 1 is zero. Note that the ionization tendency of the metal contained in the first metal oxide material is greater than that of gold (Au). Therefore, since the mass percentage concentration of the first metal oxide material in the first glass material 1 is lower than that of the second glass material 2, the first glass material 1 is less likely to dissolve in the plating solution during metal plating (e.g., gold plating or nickel-gold plating), allowing for stable metal plating to be formed on the metal member 3 on which the first glass material 1 is positioned. This configuration reduces the steps of forming an oxide film on the entire metal member 3 and / or removing the formed oxide film. The second glass material 2 can be positioned on the first glass material 1 after metal plating, as described in the manufacturing method of the optical component 100 later.

[0049] The first metal oxide material may contain at least one of the following: vanadium oxide (V2O5), ruthenium oxide (RuO2), phosphorus pentoxide (P2O5), arsenic trioxide (As2O3), boron oxide (B2O3), tellurium oxide (TeO2), bismuth oxide (Bi2O3), zinc oxide (ZnO), tin oxide (SnO2), and lead oxide (PbO). Since the first metal oxide material contains the above-mentioned materials, and the mass percentage concentration of the first metal oxide material in the second glass material 2 is lower than the mass percentage concentration of the first metal oxide material in the first glass material 1, the softening temperature t2 of the second glass material 2 can be lower than the softening temperature t1 of the first glass material 1. For this reason, the second glass material 2 is easier to process than the first glass material 1.

[0050] The light-transmitting member 5 may have a side surface 5s located on a plane intersecting the first surface 31s. The side surface 5s is connected to the first light-transmitting surface 51s and the second light-transmitting surface 52s, which will be described later. The second glass material 2 may be in direct or indirect contact with the first light-transmitting surface 51s. Here, indirect contact between the second glass material 2 and the first light-transmitting surface 51s means that the first reflection reduction layer 511, which will be described later, is located between the second glass material 2 and the first light-transmitting surface 51s. Furthermore, the second glass material 2 may be in direct or indirect contact with the second light-transmitting surface 52s. Here, indirect contact between the second glass material 2 and the second light-transmitting surface 52s means that the second reflection reduction layer 522, which will be described later, is located between the second glass material 2 and the second light-transmitting surface 52s.

[0051] The light-transmitting member 5 may be in contact with the first glass material 1. In this case, the light-transmitting member 5 and the first glass material 1 do not need to be joined together.

[0052] As shown in Figure 4, the second glass material 2 may be in contact with at least a portion of the side surface 5s. More specifically, the second glass material 2 may be bonded to the side surface 5s. Such a configuration As a result, the contact area between the second glass material 2 and the light-transmitting member 5 increases, thereby improving the bonding strength between the second glass material 2 and the light-transmitting member 5. In addition, since at least a portion of the side surface 5s is in contact with the second glass material 2, the light-transmitting member 5 can be protected from external impacts. The second glass material 2 may be in contact with the entire side surface 5s.

[0053] A plating layer 4 may be located on the metal member 3. The plating layer 4 may surround the first glass material 1. In other words, the surface of the metal member 3 may be covered with the plating layer 4. This configuration can reduce the possibility of corrosion of the metal member 3. For example, when an optical module 10 equipped with optical components 100 is used in information display devices such as VR goggles or AR glasses, the optical module 10 may be located near or in contact with the human body, but the possibility of corrosion of the metal member 3 due to sweat or tears from the human body can be reduced.

[0054] Furthermore, the plating layer 4 may also be located on the inner circumferential surface of the through hole 30.

[0055] As the material for the plating layer 4, highly corrosion-resistant metallic materials such as gold, nickel, tin, copper, zinc, chromium, and palladium can be used. Alternatively, the material for the plating layer 4 may be an alloy of the aforementioned metallic materials (for example, nickel-gold, nickel-palladium-gold). When the material for the plating layer 4 contains gold (Au), gold has particularly excellent corrosion resistance due to its low ionization tendency.

[0056] Furthermore, the plating layer 4 may be in contact with the first glass material 1. More specifically, the plating layer 4 may be in contact with the first glass material 1 without any gaps. With this configuration, the possibility of moisture entering between the first glass material 1 and the plating layer 4 and corroding the metal member 3 can be reduced.

[0057] Here, the thickness of the plating layer 4 (i.e., the dimension in the z-direction) is, for example, 0.5 μm to 10 μm.

[0058] If the portion where the metal member 3 and the first glass material 1 are in contact is defined as the first part 301, then in a plan view, the first part 301 may be surrounded by a plating layer 4. More specifically, the plating layer 4 does not need to be located on the first part 301. The absence of the plating layer 4 on the first part 301 makes it easier to form an oxide film on the first part 301. Therefore, an oxide film formed by the oxidation of a portion of the metal member 3 may be located only on the first part 301. Because the oxide film is located only on the first part 301, the oxide film reacts with the first glass material 1, thereby improving the bonding strength between the first glass material 1 and the metal member 3.

[0059] Furthermore, the surface roughness of the first part 301 may be rougher than the surface roughness of the metal member 3 other than the first part 301. More specifically, as shown in Figure 6, the metal member 3 may have one or more protrusions 315 and / or recesses 316 in the first part 301.

[0060] The projection 315 may be embedded in the first glass material 1, or the first glass material 1 may be embedded in the recess 316. This increases the bonding strength between the metal member 3 and the first glass material 1. The metal member 3 may have the projection 315 or recess 316 formed in the first part 301 in advance under predetermined conditions. Sandblasting and etching methods can be applied as methods for forming the projection 315 or recess 316.

[0061] The softening temperature t0 of the light-transmitting member 5 may be lower than the softening temperature t1 of the first glass material 1. Also, the softening temperature t0 of the light-transmitting member 5 may be higher than the softening temperature t2 of the second glass material 2. Since the softening temperature t0 of the light-transmitting member 5 is higher than the softening temperature t2 of the second glass material 2, when joining the light-transmitting member 5 to the second glass material 2, the temperature of the second glass material 2 causes the light-transmitting member 5 to soften. This reduces the possibility of deformation or other damage.

[0062] At least a portion of the surface of the light-transmitting member 5 may have reflection-reducing layers 511 and 522. By having reflection-reducing layers 511 and 522, the reflection of light in the light-transmitting member 5 can be reduced and the refractive index of the light-transmitting member 5 can be adjusted. The reflection-reducing layers 511 and 522 may be, for example, an AR (Anti-Reflective) coating. The AR coating can be formed, for example, by vacuum deposition of magnesium fluoride. The thickness of the reflection-reducing layers 511 and 522 is, for example, 50 nm to 500 nm.

[0063] The reflection reduction layers 511 and 522 may include a first reflection reduction layer 511 located on a first translucent surface 51s and a second reflection reduction layer 522 located on a second translucent surface 52s. The first translucent surface 51s is the surface facing the first surface 31s of the metal member 3 in the z direction, and the second translucent surface 52s is located on the opposite side of the first translucent surface 51s. In other words, in the translucent member 5, of the two surfaces facing the first surface 31s, the one closer to the first surface 31s can be defined as the first translucent surface 51s, and the one further away from the first surface 31s can be defined as the second translucent surface 52s.

[0064] The reflection reduction layers 511 and 522 do not necessarily have to be located on the side surface 5s of the light-transmitting member 5.

[0065] The anti-reflective layers 511 and 522 may be located between the light-transmitting member 5 and the second glass material 2. More specifically, the first anti-reflective layer 511 may be located between the light-transmitting member 5 and the second glass material 2. With this configuration, the first anti-reflective layer 511 and the second glass material 2 react and bond together, thereby improving the bonding strength between the light-transmitting member 5 and the second glass material 2.

[0066] In a plan view, the contact area between the first glass material 1 and the metal member 3 may be larger than the contact area between the first glass material 1 and the second glass material 2. This configuration reduces the possibility of the second glass material 2 coming into contact with the metal member 3 and / or the plating layer 4. However, if the second glass material 2 comes into contact with the metal member 3 and / or the plating layer 4, the bonding strength will be insufficient at the point of contact. As a result, when the optical component 100 is deformed, for example by heat from the electronic component 9, it may break at the point of contact between the second glass material 2 and the metal member 3 and / or the plating layer 4, making it difficult to maintain airtightness inside the optical module 10. However, with the above configuration, the possibility of the second glass material 2 coming into contact with the metal member 3 and / or the plating layer 4 can be reduced, thus reducing the possibility of damage to the optical component 100.

[0067] Furthermore, as shown in Figure 4, the width W1 of the first glass material 1 may be greater than the width W2 of the second glass material 2 in a plan view or cross-sectional view. This configuration reduces the possibility of the second glass material 2 coming into contact with the metal member 3, even if the second glass material 2 sags. Note that the width referred to here is the maximum dimension in the y-direction or x-direction.

[0068] The thickness T1 of the first glass material 1 may be greater than the thickness T2 of the second glass material 2. This configuration reduces the possibility of the second glass material 2 coming into contact with the metal member 3 and / or the plating layer 4. Here, thickness refers to the dimension in the z direction. The thickness T1 of the first glass material 1 can be rephrased as the distance from the first surface 31s to the first point P1 described later, in a cross-sectional view perpendicular to the first surface 31s. The thickness T2 of the second glass material 2 can be rephrased as the distance from the first point P1 to the second point P2, in a cross-sectional view perpendicular to the first surface 31s.

[0069] (Other embodiments) Here, other embodiments of the optical component 100 will be described using Figures 7 to 9. In these other embodiments, only the parts that differ from the configuration in the embodiments will be described, and other components will be denoted by the same reference numerals as in the embodiments and their descriptions will be omitted.

[0070] In other embodiments, the metal member 3 differs from the embodiments described above in that it has a recess 33. The recess 33 has an inner wall surface 331. The first surface 31s may be connected to the inner wall surface 331, in which case, as shown in Figure 9, the first surface 31s will be located at the bottom of the recess 33. The through hole 30 will also be located at the bottom of the recess 33. Even in this case, the surface facing the first translucent surface 51s of the translucent member 5 in the z direction can be defined as the first surface 31s. As shown in Figure 8, in a plan view, the area of ​​the translucent member 5 is larger than the area of ​​the through hole 30 and smaller than the area of ​​the recess 33 (i.e., the area of ​​the portion enclosed by the inner wall surface 331).

[0071] Because the metal member 3 has the recess 33 described above, the light-transmitting member 5 is positioned within the recess 33, thus protecting the light-transmitting member 5 from external impacts. A portion of the light-transmitting member 5 may be in contact with the inner wall surface 331. In this case, positioning the light-transmitting member 5 can be easily achieved by bringing it into contact with the inner wall surface 331.

[0072] As shown in Figure 9, the first glass material 1 may be in contact with the inner wall surface 331. Alternatively, the first glass material 1 may be bonded to the inner wall surface 331. More specifically, an oxide film formed by the oxidation of a portion of the metal member 3 may be located on the inner wall surface 331. In this case, the oxide film reacts with the first glass material 1, thereby improving the bonding strength between the first glass material 1 and the metal member 3.

[0073] In a cross-sectional view perpendicular to the first surface 31s, if the point on the surface of the first glass material 1 furthest from the first surface 31s is defined as the first point P1, and the point on the surface of the second glass material 2 furthest from the first surface 31s is defined as the second point P2, then the distance T3 from the first surface 31s to the second point P2 may be greater than or equal to the distance T1 from the first surface 31s to the first point P1. More specifically, the end of the second glass material 2 on the inner wall surface 331 side may be covered by the first glass material 1. In this case, the contact area between the first glass material 1 and the second glass material 2 increases, thereby improving the bonding strength between the first glass material 1 and the second glass material 2. Therefore, a highly reliable optical component 100 can be provided.

[0074] <Configuration of the optical module> An optical module 10 according to one embodiment will be described with reference to Figure 10. The optical module 10 comprises a substrate 8, an electronic component 9, and an optical component 100. The electronic component 9 is located on the substrate 8. The optical component 100 is located on the substrate 8.

[0075] The substrate 8 is, for example, rectangular in shape when viewed from above, with dimensions of 10mm x 10mm to 50mm x 50mm and a thickness of 0.5mm to 20mm. Examples of materials for the substrate 8 include metal materials such as copper, iron, tungsten, molybdenum, nickel, or cobalt, or alloys containing these metal materials. In this case, the substrate 8 may be a single metal plate or a laminate formed by stacking multiple metal plates.

[0076] Furthermore, the material of the substrate 8 is an insulating material, and may be, for example, an aluminum oxide sintered body, a mullite sintered body, a silicon carbide sintered body, an aluminum nitride sintered body, a silicon nitride sintered body, or a ceramic material such as glass ceramics. In this case, a metal layer 81, a terminal portion 82, and a base portion 83 may be located on the substrate 8. The metal layer 81 and the terminal portion 82 may be formed by sintering a metal paste, or they may be formed using thin-film formation techniques such as vapor deposition or sputtering.

[0077] The metal layer 81 has the same or similar shape as the outer shape of the metal member 3 in a plan view, and is located below the metal member 3 when the optical module 10 is assembled. The metal member 3 and the metal layer 81 may be directly joined, or a sealing ring may be located between the metal layer 81 and the metal member 3. The optical component 100 may be joined to the metal member 3 and / or the substrate 8 by welding, or by an adhesive such as solder, brazing material, glass or resin adhesive.

[0078] The terminal section 82 can be electrically connected to the electronic component 9 by conductive wiring formed inside the substrate 8. A flexible printed circuit board (FPC) or a printed circuit board (PCB) on which an electronic circuit is formed may be connected to the terminal section 82, or metal wires such as lead terminals and / or bonding wires may be mounted on it.

[0079] The base portion 83 may be integrally molded with the substrate 8, or it may be a separate component from the substrate 8. An electrode 85 may be located on the base portion 83. The electrode 85 may be formed, for example, using the same material and method as the terminal portion 82. The electrode 85 can be electrically connected to the electronic component 9.

[0080] Furthermore, a submount 84 for mounting electronic components 9 may be located on the base portion 83.

[0081] The electronic component 9 is located on the base portion 83 on the substrate 8. Alternatively, the electronic component 9 may be located on a submount 84. Multiple electronic components 9 may be located within the optical module 10.

[0082] The electronic component 9 may be, for example, an optical semiconductor element such as a semiconductor laser (LD) or photodiode (PD), a semiconductor integrated circuit element, a sensor element such as an optical sensor, or a power amplifier IC. The electronic component 9 can be formed from a semiconductor material such as gallium arsenide or gallium nitride. More specifically, the electronic component 9 may be three light-emitting elements 9A to 9C, each emitting red (R), green (G), and blue (B) light, respectively. In this case, the optical module 10 can be an RGB laser light source module and can be used, for example, in information display devices such as VR goggles or AR glasses.

[0083] Furthermore, various combinations of each embodiment are not limited to the examples of embodiments described above. Combinations of each embodiment with each other are also possible.

[0084] <Manufacturing method for optical components> Here, the manufacturing method of the optical component 100 will be described using Figure 11. In the description of this manufacturing method, the components of the optical component 100 may be denoted by the same reference numerals as in the embodiments described above, and their descriptions may be omitted.

[0085] (1) First, a first member is prepared by applying the first glass material 1 to a predetermined position on the metal member 3. This step is referred to as the first member preparation step S1. The first glass material 1 may be applied by partially heating a pre-formed and hardened piece of glass material 1 and pressing it onto the predetermined position on the metal member 3, or by placing the first glass material 1 on the metal member 3 and then heating the metal member 3 itself to melt and bond the first glass material 1 with the heat. Alternatively, the unhardened first glass material 1 may be applied to a predetermined position on the metal member 3 and then cooled to harden the first glass material 1.

[0086] By performing step S1 before subsequent steps S2 to S4, when forming the first glass material 1 on the first surface 31s of the metal member 3, the first glass material 1, heated to a high temperature, reacts with the metal member 3, allowing for the partial formation of an oxide film at the point where the first glass material 1 and the metal member 3 come into contact. This improves the bonding strength between the first glass material 1 and the metal member 3. Furthermore, step S1 eliminates the need to heat the metal member 3 to form an oxide film.

[0087] The step of forming the through hole 30 in the metal member 3 may be performed between steps S3 and S4, which will be described later, or the through hole 30 may be formed in the metal member 3 in advance before step S1.

[0088] (2) Next, the first component is plated with metal. A plating layer 4 is formed on the surface of the metal component 3 by the metal plating. This step is called the plating step S2. The metal plating in step S2 may be electroless plating or electrolytic plating.

[0089] (3) Subsequently, a second glass material 2 (softening temperature t2) which has a softening temperature lower than the softening temperature t1 of the first glass material 1 is applied onto the first glass material 1. This process is referred to as the glass material application process S3.

[0090] The second glass material 2 may be applied by partially heating and pressing a pre-formed and hardened glass material 2 onto the first glass material 1. Alternatively, the unhardened second glass material 2 may be applied to a predetermined position on the first glass material 1, and then the second glass material 2 may be cooled and hardened.

[0091] (4) Finally, the light-transmitting member 5 is bonded to the second glass material 2. This step is called the bonding step S4. As for the method of bonding the light-transmitting member 5 to the second glass material 2, in step S3 above, the light-transmitting member 5 may be pressed against the second glass material 2 before the applied second glass material 2 hardens. Alternatively, the second glass material 2 may be partially heated to soften it once it has hardened, and then the light-transmitting member 5 may be pressed against the second glass material 2 to bond them.

[0092] The second glass material 2 contains impurities because its softening temperature is lower than that of the first glass material 1, making it more likely to dissolve in the plating solution. However, since the first glass material 1 is a material that does not easily dissolve in the plating solution, the above manufacturing method allows for the formation of a plating layer 4 on the surface of the metal member 3 other than the part where the first glass material 1 is located (i.e., the first part 301). Furthermore, since the plating layer 4 can be in contact with the first glass material 1, the possibility of moisture entering between the plating layer 4 and the first glass material 1 and corroding the metal member 3 can be effectively reduced.

[0093] In the manufacturing method of the optical component 100 according to one embodiment, the above steps S1 to S4 may be performed in the order described above, and there may be steps different from S1 to S4 between each step. For example, if the optical component 100 has the aforementioned frame-shaped member between the first glass material 1 and the second glass material 2, the step of joining the frame-shaped member to the first glass material 1 may be performed between steps S1 and S2, or between steps S2 and S3. [Explanation of Symbols]

[0094] 1. First glass material 12 Diffusion layer 2. Second glass material 3 Metal components 30 Through holes 31s 1st page 32s 2nd page 301 Part 1 315 Protrusion 316 Recessed area 33 Recess 331 Interior wall surface 4 Plating layer 5 Light-transmitting member 5s side 51s 1st transparent surface 52s 2nd transparent surface 511 First reflection reduction layer 522 Second Reflectance Reduction Layer T1 Thickness of the first glass material (distance from the first surface to the first point) T2 Thickness of the second glass material (distance from the first point to the second point) T3 Distance from the first face to the second point W1 Width of the first glass material W2 Width of the second glass material P1 1st point P2 2nd point 8 circuit boards 81 Metal layer 82 Terminal section 83 Base 84 Submount 85 electrode 9 Electronic Components 9A~9C Light-emitting element 10 Optical Modules 100 Optical Components

Claims

1. A metal member having a first surface, a second surface opposite to the first surface, and a through hole extending from the first surface to the second surface, A first glass material located on the first surface and surrounding the through hole in a plan view, A second glass material is located on the first glass material and surrounds the through hole in a plan view, A light-transmitting member is located on the second glass material, overlaps with the through-hole in a plan view, and has light-transmitting properties, An optical component in which the softening temperature t1 of the first glass material is higher than the softening temperature t2 of the second glass material.

2. A metal member having a first surface, a second surface opposite to the first surface, and a through hole extending from the first surface to the second surface, A first glass material located on the first surface and surrounding the through hole in a plan view, A second glass material is located on the first glass material and surrounds the through hole in a plan view, A light-transmitting member is located on the second glass material, overlaps with the through-hole in a plan view, and has light-transmitting properties, An optical component wherein the mass percentage concentration of the first metal oxide material in the first glass material is lower than the mass percentage concentration of the first metal oxide material in the second glass material.

3. The optical component according to claim 2, wherein the first metal oxide material includes at least one of vanadium oxide (V2O5), ruthenium oxide (RuO2), phosphorus pentoxide (P2O5), arsenic trioxide (As2O3), boron oxide (B2O3), tellurium oxide (TeO2), bismuth oxide (Bi2O3), zinc oxide (ZnO), tin oxide (SnO2), and lead oxide (PbO).

4. The light-transmitting member has a side surface located on a plane intersecting the first surface, The optical component according to claim 1 or 2, wherein the second glass material is in contact with at least a portion of the side surface.

5. A plating layer is located on the aforementioned metal member. The optical component according to claim 1 or 2, wherein the plating layer surrounds the first glass material.

6. The optical component according to claim 5, wherein the plating layer is in contact with the first glass material.

7. The optical component according to claim 5, wherein the material of the plating layer includes gold (Au).

8. When the portion where the metal member and the first glass material are in contact is defined as the first part, In a plan view, the first part is surrounded by the plating layer, as described in claim 5.

9. The optical component according to claim 1, wherein the softening temperature t0 of the light-transmitting member is lower than the softening temperature t1 of the first glass material and higher than the softening temperature t2 of the second glass material.

10. The optical component according to claim 1 or 2, wherein a reflection-reducing layer is located on at least a portion of the surface of the light-transmitting member.

11. The optical component according to claim 10, wherein the reflection reduction layer is located between the light-transmitting member and the second glass material.

12. In a plan view, the contact area between the first glass material and the metal member is the first glass material The optical component according to claim 1 or 2, which has a contact area larger than that of the second glass material.

13. The optical component according to claim 1 or 2, wherein the thickness of the first glass material is greater than the thickness of the second glass material.

14. The optical component according to claim 1 or 2, wherein the first glass material and the second glass material are joined together.

15. In a cross-sectional view perpendicular to the first surface, The first point is defined as the point on the surface of the first glass material that is furthest from the first surface. When the point on the surface of the second glass material that is furthest from the first surface is designated as the second point, The optical component according to claim 1 or 2, wherein the distance from the first surface to the second point is greater than or equal to the distance from the first surface to the first point.

16. circuit board and Electronic components located on the aforementioned substrate, An optical module comprising an optical component according to any one of claims 1 to 3, located on the substrate.

17. A first member is prepared by applying the first glass material to a predetermined position on the metal member. The first member is subjected to metal plating. A second glass material having a softening temperature lower than that of the first glass material is applied onto the first glass material. A method for manufacturing an optical component, comprising bonding a light-transmitting member having light-transmitting properties to the second glass material.

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