Manufacturing method for light-emitting diode packages

Abstract

This invention provides a method for applying coloring or other treatments to the surface of a light-emitting diode package without generating unwanted transfer areas. [Solution] A method for manufacturing a light-emitting diode package having a package body, A method for manufacturing a light-emitting diode package, comprising the steps of: preparing a sheet with transfer resin components, which has a sheet and transfer resin components attached to multiple separate locations on one side of the sheet; and transferring the transfer resin components attached to the sheet with transfer resin components to a package body so that the transfer resin components attach to multiple separate locations on the upper surface of the package body, wherein in the step of transferring the transfer resin components to the package body, the transfer resin components are transferred to the package body by pressing the sheet with transfer resin components only in an inner region located inside the edge of the upper surface of the package body.

Description

Technical Field

[0001] The present disclosure relates to a method for manufacturing a package for a light-emitting diode, and particularly to a method for applying coloring or the like to the surface of a light-emitting diode package.

Background Art

[0002] Printing methods such as hot stamping and thermal printing, which simultaneously apply heat and pressure to thermally transfer a foil or ink, are known (Patent Document 1).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] When a continuous ink layer is thermally transferred onto the upper surface of the package body of a light-emitting diode package by a thermal printer, as shown in FIG. 15, the ink layer in a portion that is not originally transferred may not be separated from the adjacent transferred ink layer and may be transferred as an unnecessary transfer portion. Such an ink layer of the unnecessary transfer portion may block the light from the light-emitting diode chip or may come off the surface of the package body of the light-emitting diode package and become a foreign object. Patent Document 1 proposes providing a re-separable portion to re-separate the unnecessary transfer portion with an adhesive. However, since the re-separable portion may not necessarily come into contact with the unnecessary transfer portion protruding from the upper surface of the package body of the light-emitting diode package, it is necessary to prevent the occurrence of unnecessary transfer portions.

Means for Solving the Problems

[0005] A method for manufacturing a light-emitting diode package having a package body, comprising the steps of: preparing a sheet with a transfer resin member, which has a sheet and a plurality of separate portions of transfer resin member attached to one side of the sheet; and transferring the transfer resin member attached to the sheet with the transfer resin member to the package body so that the transfer resin member attaches to a plurality of separate portions on the upper surface of the package body, wherein in the step of transferring the transfer resin member to the package body, the transfer resin member is transferred to the package body by pressing the sheet with the transfer resin member only in an inner region located inside the edge of the upper surface of the package body. [Effects of the Invention]

[0006] According to the embodiments of this disclosure, during the transfer process, the transfer resin member is attached to multiple separate locations, and the transfer resin member is transferred to the package body only in the inner region located inside the edge of the top surface of the package body, so no unwanted transfer portions are generated. This eliminates the need to remove unwanted transfer portions or to inspect for the presence or absence of unwanted transfer portions. [Brief explanation of the drawing]

[0007] [Figure 1] These are schematic top and side views of an assembly of semiconductor diode packages obtained by the manufacturing method for light-emitting diode packages according to the first embodiment. [Figure 2] This is a schematic top view, enlarged, showing the portion of the package including the main body shown in Figure 1. [Figure 3] This is a schematic top view, enlarged, showing the area indicated by the circle in Figure 2. [Figure 4] These are schematic top view and side view diagrams showing a metal plate with a resin molded body according to the first embodiment. [Figure 5] These are schematic top and side views of a sheet with a transfer resin component used in a manufacturing method for a light-emitting diode package according to the first embodiment. [Figure 6]This is a schematic diagram showing a method for manufacturing a light-emitting diode package according to the first embodiment. [Figure 7] This is a schematic diagram showing a method for manufacturing a light-emitting diode package according to the first embodiment. [Figure 8] This is a schematic diagram showing a method for manufacturing a light-emitting diode package according to the first embodiment. [Figure 9] This is a schematic diagram showing a method for manufacturing a light-emitting diode package according to the first embodiment. [Figure 10] This is a schematic diagram showing a method for manufacturing a light-emitting diode package according to the second embodiment. [Figure 11] This is a schematic diagram showing a method for manufacturing a light-emitting diode package according to the second embodiment. [Figure 12] This is a schematic diagram showing a manufacturing method for a light-emitting diode package according to the third embodiment. [Figure 13] This is a schematic diagram showing a manufacturing method for a light-emitting diode package according to the third embodiment. [Figure 14] This is a schematic side view showing an enlarged portion of the area indicated by the circle in Figure 13. [Figure 15] This figure shows the unwanted transfer area generated by the thermal transfer process. [Modes for carrying out the invention]

[0008] Examples of embodiments of the present invention will be described below with reference to the drawings. The method for manufacturing a light-emitting diode package according to the present invention is not limited to the embodiments exemplified below. The numerical values, shapes, materials, processes, and the order of those processes shown in the following embodiments are merely examples, and various modifications are possible as long as they do not create a technical inconsistency. Furthermore, various combinations are possible among the following embodiments as appropriate.

[0009] The dimensions and shapes of the components shown in the drawings may be exaggerated for clarity, and the actual dimensions, shapes, and relative sizes of the components may be altered. Furthermore, to avoid making the drawings excessively complex, schematic diagrams may be used with some components omitted, or diagrams showing the cross-section may be used instead of cross-sectional views.

[0010] <First Embodiment> The assembly 100 of light-emitting diode packages obtained by the manufacturing method for light-emitting diode packages according to the first embodiment includes a plurality of package bodies 20, a metal plate 10, and a coating resin member 30, as shown in Figure 1. The metal plate 10 supports the plurality of package bodies 20 so that they are arranged at regular intervals. The coating resin member 30 is placed on the upper surface 21 of each of the plurality of package bodies 20. The assembly 100 of light-emitting diode packages is separated into individual pieces to form light-emitting diode packages. A light-emitting device obtained by attaching light-emitting diode chips to each of the plurality of package bodies 20, sealing the light-emitting diode chips with a light-transmitting resin, and then separating the pieces is sometimes called a Plastic leaded chip carrier (PLCC) LED.

[0011] The metal plate 10 is a thin conductive sheet of copper or the like, with a predetermined opening pattern formed on it. The entire or partial surface of the metal plate 10 may be plated. The outer edge shape of the metal plate 10, as viewed from above, is, for example, rectangular. The metal plate 10, which uses a strip-shaped thin metal sheet, may also be rolled up. The metal plate 10 includes a surrounding frame portion and a portion that supports the light-emitting diode chip in the PLCC-LED and serves as a connection terminal connecting the light-emitting diode chip to an external electronic circuit. The portion of the metal plate 10 that protrudes to the side of the package body 20 and serves as an external connection terminal may be bent along the side and bottom surfaces of the package body 20.

[0012] The package body 20 is a resin molded body formed using an insulating resin, and is a part of the metal plate 90 with a resin molded body integrally formed with the metal plate 10 by injection molding or the like. In the example of FIG. 1, the metal plate 10 is positioned around the center in the height direction of the package body 20. The outer edge shape of the package body 20 as viewed from above is, for example, rectangular. The length of one side of the rectangle is from 0.5 mm to several tens of mm, for example, 3 mm.

[0013] In the example of FIG. 1, the package body 20 includes a recess surrounded by a peripheral wall. The top surface of the peripheral wall is the upper surface 21. The upper surface 21 may be subjected to a surface treatment such as plasma treatment or corona discharge treatment. In a PLCC-LED, a light-emitting diode chip is housed in the recess. The opening shape of the recess as viewed from above is, for example, circular or rectangular. A part of the metal plate 10 is exposed at the bottom of the recess.

[0014] The material of the package body 20 is obtained by dispersing a light-reflective substance and reinforcing fibers in a thermoplastic resin or a thermosetting resin. Examples of the thermoplastic resin include PA (polyamide), PPA (polyphthalamide), PPS (polyphenylene sulfide), or a liquid crystal polymer, etc. Examples of the thermosetting resin include an epoxy resin, a silicone resin, a modified epoxy resin, a urethane resin, or a phenol resin, etc. Examples of the light-reflective substance include titanium dioxide, aluminum oxide, silicon oxide, zinc oxide, a hollow filler, etc. Examples of the reinforcing fibers include glass fibers and carbon fibers.

[0015] As shown in FIG. 2, the coating resin member 30 according to the first embodiment is disposed on the upper surface 21 and is not disposed on the edge of the upper surface 21 and within the recess. As shown in FIG. 3, the coating resin member 30 is not a continuous film but is composed of a plurality of film pieces disposed with gaps therebetween. The thickness of the coating resin member 30 is, for example, from 0.5 μm to 100 μm, preferably from 1 μm to 25 μm.

[0016] A method for manufacturing a light-emitting diode package according to the first embodiment includes the following steps: (First step) A step of preparing a sheet with transfer resin members, which has a sheet and transfer resin members attached to a plurality of separate locations on one side of the sheet. (Second step) A step in which the transfer resin material attached to the transfer resin material attached sheet is transferred to the package body so that the transfer resin material adheres to multiple separate locations on the upper surface of the package body.

[0017] For example, a metal plate 90 with a resin molded body, as shown in Figure 4, is prepared. The metal plate 90 with a resin molded body does not include a covering resin member 30, and has a plurality of package bodies 20 and a metal plate 10 that supports the plurality of package bodies 20 so that they are arranged at regular intervals. The metal plate 90 with a resin molded body can be prepared by purchasing or other means with the plurality of package bodies 20 already supported on the metal plate 10. Alternatively, only the metal plate 10 can be prepared by purchasing or other means, and the metal plate 90 can be prepared by placing the plurality of package bodies 20 on the metal plate 10. For example, as the metal plate 10, a lead frame obtained by processing a metal plate into a desired shape can be prepared, and the metal plate 90 with a resin molded body can be prepared by setting the lead frame in a mold and performing insert molding.

[0018] (Step 1) A step to prepare a sheet with transfer resin components, which has a sheet and transfer resin components attached to multiple separate locations on one side of the sheet. The sheet 80 with transfer resin members comprises a sheet 40 and transfer resin members 50 attached to multiple separate locations on one side of the sheet 40. The sheet 40 supports the transfer resin members 50 on one side. For example, prepare a sheet 80 with transfer resin members as shown in Figure 5. For example, the sheet 80 with transfer resin members can be prepared by purchasing it.

[0019] Alternatively, the sheet 40 may be prepared by purchasing or other means, and at least one layer of the liquid raw material for the transfer resin member 50 may be coated onto one side of the sheet 40. For coating, for example, blade coating or spin coating may be used. After gelling, for example, a dicing blade may be moved vertically and horizontally to divide the single continuous gel-like transfer resin member layer formed on the sheet 40 into multiple sections, thereby preparing the transfer resin member 50 attached to multiple separated locations.

[0020] Alternatively, the sheet 40 can be prepared by purchasing or otherwise obtaining it, and the liquid raw material for the transfer resin component 50 can be sprayed onto one side of the sheet 40, for example, by spraying droplets of the liquid raw material for the transfer resin component 50. Then, it can be prepared by gelling and forming the transfer resin component 50 attached to multiple separate locations.

[0021] The material of the sheet 40 is, for example, fluororesin, polyimide resin, acrylic resin, or silicone resin. The material of the sheet 40 is selected such that the adhesive force between the sheet 40 and the transfer resin member 50 is weaker than the adhesive force between the material of the package body 20 and the transfer resin member 50. For example, if the material of the package body 20 is PA with a light-reflective substance and reinforcing fibers dispersed in it, and the resin of the transfer resin member 50 is silicone resin, then fluororesin can be selected as the material for the sheet 40. The area of ​​the sheet 40 is larger than the area to be transferred, and the thickness of the sheet 40 can be 10 μm or more and 200 μm or less, preferably 10 μm or more and 50 μm or less.

[0022] The transfer resin members 50 attached to multiple separate locations are on one side of the sheet 40 with their adhesive force activated, and are connected by gaps. The contour of the aggregate consisting of a group of connected transfer resin members 50 may be similar in shape to the contour of one side of the sheet 40, or it may be a contour corresponding to the shape of the upper surface 21. In the latter case, the aggregate consisting of a group of connected transfer resin members 50 exists in multiple regions on one side of the sheet 40.

[0023] The transfer resin component 50 contains a resin and may contain a pigment or dye and a light diffusing agent. As the resin for the transfer resin component 50, thermosetting resins such as epoxy resin, modified epoxy resin, silicone resin, and modified silicone resin can be used.

[0024] The pigments contained in the transfer resin component 50 are appropriately selected according to the application, and multiple types of pigments may be blended. Known light diffusing agents include barium sulfate, silica-based inorganic fillers such as inorganic hollow fillers and glass fillers, and hollow polymer fine particles. Light diffusing agents are appropriately selected according to the application and may be blended with pigments and dyes. For example, in light-emitting devices for LED displays, it is necessary to lower the light reflectivity of the upper surface 21 in order to increase the contrast between the illuminated area and the unilluminated area. When used in light-emitting devices for LED displays, the transfer resin component 50 may contain carbon black in order to increase the light absorption rate of all visible light and lower the light reflectivity. Depending on the application, if the light reflectivity of visible light is to be increased, the coating resin component 30 may contain titanium dioxide as a white pigment. Also, if the refractive index is to be lowered and the light reflectivity is to be reduced, the transfer resin component 50 may contain hollow fillers.

[0025] The thickness of the transfer resin member 50 is, for example, 0.5 μm to 100 μm, preferably 1 μm to 25 μm. The maximum length of the transfer resin member 50 in the direction perpendicular to the thickness direction is determined by the dimensions of the top surface 21, etc. The length of the transfer resin member 50 located at the periphery of the area where the sheet 80 with the transfer resin member attached is pressed against the top surface 21, in the direction perpendicular to the thickness direction, is 1 μm or more and is less than half the difference between the width wh of the pressure head 60 used in the transfer process (second step) described later and the width Wp of the top surface 21. The length of the transfer resin member 50 located outside the periphery within the area where the sheet 80 with the transfer resin member attached is pressed against the top surface 21, in the direction perpendicular to the thickness direction, is 1 μm or more and is less than the difference between twice the width of the gap between the transfer resin members 50 and the width wh of the pressure head 60.

[0026] The width of the gap between the transfer resin members 50 depends on whether the deformation of the transfer resin members 50 when pressed toward the upper surface 21 in the transfer process (second step) described later is plastic deformation or elastic deformation. If the deformation of the transfer resin members 50 is plastic deformation, the width of the gap between the transfer resin members 50 depends on whether the length of the transfer resin member 50 perpendicular to the thickness direction before pressing and the length of the transfer resin member 50 perpendicular to the thickness direction after plastic deformation by pressing are greater than the difference between the length of the transfer resin member 50 perpendicular to the thickness direction and the length of the transfer resin member 50 perpendicular to the thickness direction before pressing. If the deformation of the transfer resin members 50 is elastic deformation, the width of the gap between the transfer resin members 50 depends on whether the transfer resin members 50 remain adhesive after elastic deformation by pressing, or whether the transfer resin members 50 return to their dimensions in the thickness direction and perpendicular to the thickness direction before pressing after elastic deformation by pressing. In the former case, the width of the gap between the transfer resin members 50 is greater than the difference between the length of the transfer resin member 50 in the direction perpendicular to the thickness direction before pressing and the length of the transfer resin member 50 in the direction perpendicular to the thickness direction when pressed, and is less than the length of the transfer resin member 50 in the direction perpendicular to the thickness direction. In the latter case, the width of the gap between the transfer resin members 50 is 1 μm or more and is less than the length of the transfer resin member 50 in the direction perpendicular to the thickness direction.

[0027] (Second step) A step in which the transfer resin material attached to the transfer resin material attached sheet is transferred to the package body so that the transfer resin material adheres to multiple separate locations on the upper surface of the package body. Figure 6 shows a state in which a sheet 80 with transfer resin members, on which the transfer resin members 50 are evenly distributed on one side of the sheet 40, is placed between a metal plate 90 with a resin molded body and a pressure head 60. The transfer resin members 50 of the sheet 80 with transfer resin members face the upper surface 21. The shape of the pressure head 60 corresponds to the shape of the region 22 of the upper surface 21 shown in Figure 8 in plan view.

[0028] Then, the transfer resin sheet 80 is pressed against the upper surface 21 using the pressure head 60. In Figure 7, the width wh of the pressure head 60 when the transfer resin sheet 80 is pressed against the upper surface 21 by the pressure head 60 is smaller than the width Wp of the upper surface 21. In other words, the transfer resin sheet 80 is pressed only in the inner region of the upper surface 21 that is located inside the edge of the upper surface 21. Viewed from above, as shown in Figure 8, the region 22 in which the transfer resin sheet 80 is pressed against the upper surface 21 by the pressure head 60 does not extend beyond the upper surface 21, but is entirely contained within the region inside the edge of the upper surface 21. The transfer resin 50 that is within region 22 is pressed against the upper surface 21 and adheres to the upper surface 21 by adhesive. The transfer resin 50 outside region 22 does not adhere to the upper surface 21. The edge of the upper surface 21 is outside region 22.

[0029] To lower the Young's modulus of the transfer resin member 50, the region 22 may be heated, for example, in the range of 40°C to 150°C, at the same time as pressing it against the upper surface 21. In this case, the transfer resin member 50 in the inner region of the upper surface 21 is heated at the same time as pressing. If the Young's modulus of the transfer resin member 50 is small, less pressing force is required from the pressure head 60, and the time required for adhesion to the upper surface 21 is shortened.

[0030] The material for the pressure head 60 may be metal or synthetic resin such as engineering plastic. The Young's modulus of the pressure head 60 is preferably greater than that of the transfer resin member 50 and less than that of the package body 20. The Young's modulus of the pressure head 60 is, for example, 0.2 MPa to 200 GPa, with 500 MPa to 100 GPa being more preferable.

[0031] As shown in Figure 9, the sheet 80 with the transfer resin member is separated from the top surface 21. Since the sheet 80 with the transfer resin member, which is attached to multiple separate locations on one side of the sheet 40, is used, a portion of the transfer resin member 50 of the sheet 80 with the transfer resin member exists within region 22. The portion of the transfer resin member 50 that exists within region 22 adheres to multiple separate locations on the top surface 21, separates from the sheet 40, and becomes a coating resin member 30 attached to multiple separate locations on the top surface 21. This is because the adhesive force between the sheet 40 and the transfer resin member 50 is weaker than the adhesive force between the top surface 21 and the transfer resin member 50. It is preferable that the adhesive force between the sheet 40 and the transfer resin member 50 is 0.46 N / 10 mm or less than the adhesive force between the top surface 21 and the transfer resin member 50. In other words, it is preferable that the adhesive force between the sheet 40 and the transfer resin member 50 is greater than 0 N / 10 mm and less than or equal to the value obtained by subtracting 0.46 N / 10 mm from the adhesive force between the upper surface 21 and the transfer resin member 50. The adhesive force here is the average of the stable 5 mm measurements of the remaining length, excluding the measurement taken for the first 15 mm when peeling off a test piece with a width of 10 mm and a length of 30 mm at room temperature within 1 minute of being pressed at a speed of 50 mm / min in the direction normal to the adherend. The pressing is performed by moving a 2 kg roller back and forth twice at 10 mm / second. On the other hand, the transfer resin member 50 that was not pressed against the upper surface 21 separates from the upper surface 21 together with the sheet 40.

[0032] Since there are gaps between the transfer resin members 50 of the transfer resin member-attached sheet 80, no unwanted transfer areas are generated. The edge of the top surface 21 is outside the region 22. At the same time, since the length of the transfer resin member 50 located at the periphery of the region 22 in the direction perpendicular to the thickness direction is less than half the difference between the width wh of the pressure head 60 and the width Wp of the top surface 21, the transfer resin member 50 does not protrude from the top surface 21. In other words, in a PLCC-LED in which a light-emitting diode chip is housed in a recess of the package body 20, the light emitted from the light-emitting diode chip is not blocked by the covering resin member 30 that protrudes from the top surface 21.

[0033] The method for manufacturing a light-emitting diode package according to the first embodiment is not limited to using a resin-molded metal plate 90, but may also be used to manufacture a light-emitting diode package by forming individual pieces of the resin-molded metal plate 90.

[0034] Furthermore, the manufacturing method for a light-emitting diode package according to the first embodiment may also include a step after the transfer step (second step) in which heat is applied to the coating resin member 30 on the upper surface 21 or ultraviolet light is irradiated to reduce the adhesive strength of its surface.

[0035] <Second Embodiment> The method for manufacturing a package for a light-emitting diode according to the second embodiment includes the steps described above in the order of the first and second steps, as well as the following steps. (Third step) A step in which the coating resin material attached to multiple separate locations on the upper surface of the package body is heated to connect the coating resin material to each other. Parts of the manufacturing method for the light-emitting diode package according to the first embodiment will be omitted from the explanation as appropriate.

[0036] After the transfer process (second step), the coating resin members 30 attached to the multiple separated areas of the upper surface 21 are heated to fluidize them. For example, if the coating resin members 30 are mainly composed of thermosetting resin, the coating resin members 30 are heated to a temperature of 50°C to 130°C to fluidize them. Heating can be done, for example, by heating with infrared rays emitted from an infrared lamp (Figure 10) or by heating in an oven. The coating resin members 30 that have been fluidized by heating spread into the gaps between the coating resin members 30 that existed during the transfer process, and the coating resin members 30 connect with each other, forming a single continuous coating resin member layer 31 on the upper surface 21 (Figure 11).

[0037] After connecting the covering resin members, the package body 20 and the covering resin members 30 are cooled to form the assembly 100 of the light-emitting diode package. The exposed upper surface 21 is reduced, and for example, when used in a light-emitting device for an LED display, the contrast between the illuminated area and the non-illuminated area can be increased.

[0038] Furthermore, the manufacturing method for a light-emitting diode package according to the second embodiment may include, after the step of connecting the coating resin members (third step), a step of applying heat or irradiating ultraviolet light to the coating resin member 30 which has become a single continuous layer on the upper surface 21 to reduce the adhesive strength of its surface.

[0039] <Third Embodiment> The manufacturing method for a light-emitting diode package according to the third embodiment includes the steps described above in the order of the first and second steps, as well as the following steps. (Fourth step) A step in which pressure is applied to the coating resin components attached to multiple separate locations on the upper surface of the package body, thereby connecting the coating resin components together. Parts of the manufacturing method for the light-emitting diode package according to the first embodiment will be omitted from the explanation as appropriate.

[0040] After the transfer process (second step), the coating resin members 30 attached to multiple separated locations on the upper surface 21 are pressed toward the upper surface 21 by the second pressure head 61, as shown in Figure 12. The coating resin members 30 are then spread out in the in-plane direction of the upper surface 21, and as shown in Figures 13 and 14, the gaps between the coating resin members 30 are eliminated and the coating resin members are connected to form a crushed coating member 32. In Figure 12, the width of the second pressure head 61 may be the same as the width of the upper surface 21, or it may be greater than the width of the upper surface 21.

[0041] After the transfer step (second step) and before the step of joining the coated resin members together (fourth step), the process may include applying heat or irradiating ultraviolet light to the coated resin members 30 attached to multiple separate locations on the upper surface 21 to reduce the adhesive strength of their surfaces. [Explanation of symbols]

[0042] 10 Metal plate, 20 Package body, 21 Top surface of package body, 22 Area where the transfer resin component sheet is pressed against the top surface by the pressure head, 30 Covering resin component, 40 Sheet, 50 Transfer resin component, 60 Pressure head, 70 Infrared lamp, 71 Infrared light, 80 Transfer resin component sheet, 90 Metal plate with resin molded body, 100 Assembly of light-emitting diode packages

Claims

1. A method for manufacturing a light-emitting diode package having a package body, A step of preparing a sheet with transfer resin members, which has a sheet and transfer resin members attached to multiple separate locations on one side of the sheet, The process includes a step of transferring the transfer resin member attached to the sheet with the transfer resin member to the package body so that the transfer resin member adheres to a plurality of separate locations on the upper surface of the package body, In the step of transferring the transfer resin member to the package body, the transfer resin member is transferred to the package body by pressing the sheet with the transfer resin member attached only in the inner region located inside the edge of the upper surface. A method for manufacturing packages for light-emitting diodes.

2. A method for manufacturing a light-emitting diode package according to claim 1, comprising the step of connecting the coating resin members after the transfer step, wherein a portion of the transfer resin member becomes a coating resin member attached to the plurality of separated locations on the upper surface.

3. A method for manufacturing a light-emitting diode package according to claim 1, wherein in the transfer step, the inner region is heated at the same time as pressing.

4. The method for manufacturing a light-emitting diode package according to claim 1, wherein in the preparation step, a continuous transfer resin member layer formed on one side of the sheet is divided into multiple portions using a dicing blade to obtain the transfer resin member attached to the multiple divided portions of the sheet.

5. The method for manufacturing a light-emitting diode package according to claim 1, wherein in the preparation step, the transfer resin member attached to the plurality of separate portions on one side of the sheet is formed using a spray.

6. A method for manufacturing a light-emitting diode package according to claim 2, wherein in the step of connecting the aforementioned coating resin members together, the coating resin member on the upper surface is heated.

7. A method for manufacturing a light-emitting diode package according to claim 2, wherein pressure is applied to the upper surface of the coating resin member in the step of connecting the coating resin members together.

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