Method for manufacturing an insulating board and an insulating board

Abstract

This invention provides a novel technology for manufacturing insulation boards. [Solution] The method for manufacturing the heat-insulating board 10 comprises a core material 20 in which rigid foamed urethane chips 11 are bonded with a moisture-curing adhesive 21, and a breathable surface material 30 bonded to the surface of the core material 20. The method involves supplying a mixture 20P containing rigid foamed urethane chips 11 and moisture-curing adhesive 21 to a mold 70 in which the breathable surface material 30 is placed, and compressing and molding it while supplying moisture.

Description

[Technical Field]

[0001] This disclosure relates to a method for manufacturing an insulating board and to an insulating board. [Background technology]

[0002] Patent Document 1 discloses a heat-compressed molded board in which a core material is formed by heat-compressing a mixture obtained by mixing rigid urethane foam powder with an average particle size of 1 mm or less, non-foaming thermoplastic resin chips, isocyanate adhesive, and water. [Prior art documents] [Patent Documents]

[0003] [Patent Document 1] Japanese Patent Publication No. 2001-9854 [Overview of the Initiative] [Problems that the invention aims to solve]

[0004] Incidentally, in boards using rigid polyurethane foam chips, in order to suppress the immediate curing of the adhesive mixed with the rigid polyurethane foam chips, it is desirable to mix the rigid polyurethane foam chips with a moisture-curing adhesive first, and then supply water to the mixture to cure the moisture-curing adhesive.

[0005] Furthermore, boards using rigid polyurethane foam chips have the drawback of being more prone to chip shedding compared to boards using flexible polyurethane foam chips. To suppress the shedding of chip shedding, a configuration in which a surface material is applied to the surface of boards using rigid polyurethane foam chips is being considered.

[0006] However, if a surface material is applied to the board's surface, a challenge arises in achieving both the supply of moisture through the surface material and the suppression of chip debris falling off due to the surface material.

[0007] The present disclosure aims to solve at least one of the above problems. The present disclosure can be realized in the following forms.

Means for Solving the Problems

[0008] A method for manufacturing a heat insulation board comprising a core material to which a rigid foam urethane chip is adhered with a moisture-curing adhesive, and a breathable facing material adhered to the surface of the core material, comprising: In a mold in which a breathable facing material is disposed, Supplying a mixture containing rigid foam urethane chips and a moisture-curing adhesive, A method for manufacturing a heat insulation board by compression molding while supplying moisture.

Effects of the Invention

[0009] The present disclosure provides a novel method for manufacturing a heat insulation board that can provide a technology capable of solving at least one of the above problems. For example, the present disclosure can provide a technology that can achieve both the supply of moisture through the facing material and the suppression of the dropping of chip dust by the facing material.

Brief Description of the Drawings

[0010] [Figure 1] A diagram schematically showing a heat insulation board. [Figure 2] A diagram for explaining the preparation of rigid foam urethane chips. [Figure 3] A diagram schematically showing rigid foam urethane chips. [Figure 4] A diagram schematically showing a mixture containing rigid foam urethane chips and a moisture-curing adhesive. [Figure 5] A diagram for explaining the supply of the mixture to the mold. [Figure 6] A diagram showing the state before compression. [Figure 7] A diagram showing the state of compression molding while supplying moisture. [Figure 8] A diagram for explaining a method for specifying the maximum diameter of rigid foam urethane chips in the cross section of the core material. [Modes for carrying out the invention]

[0011] Herein lies a preferred example of this disclosure. [1] A method for manufacturing an insulating board comprising a core material in which rigid polyurethane foam chips are bonded with a moisture-curing adhesive, and a breathable surface material bonded to the surface of the core material, In a mold with a breathable surface material, A mixture containing rigid polyurethane foam chips and a moisture-curing adhesive is supplied. A method for manufacturing an insulating board by compression molding while supplying moisture. [2] The method for manufacturing an insulating board according to [1], wherein the breathable surface material is a nonwoven fabric. [3] A core material in which rigid polyurethane foam chips are bonded with a moisture-curing adhesive, An insulating board comprising a nonwoven fabric bonded to the surface of the aforementioned core material. [4] The density of the core material is 100 kg / m³ 3 The following is an example of an insulating board: [3]. [5] The insulation board according to [3] or [4], wherein rigid foamed urethane chips with a maximum diameter of 3 mm or more are observed in the cross-section of the core material.

[0012] The disclosure is described in detail below. In this specification, the upper and lower limits of each numerical range can be combined in any way. In this specification, when a numerical range is described using "-", it includes both the lower and upper limits unless otherwise specified. For example, the description "10-20" includes both the lower limit "10" and the upper limit "20". In other words, "10-20" has the same meaning as "10 or more and 20 or less". Furthermore, in this specification, the upper and lower limits of each numerical range can be combined in any way.

[0013] 1. Method for manufacturing the heat-insulating board 10 (first aspect) The first embodiment of the method for manufacturing the thermal insulation board 10 comprises a core material 20 in which rigid polyurethane foam chips 11 are bonded with a moisture-curing adhesive 21, and a breathable surface material 30 bonded to the surface of the core material 20. In this method, a mixture 20P containing rigid polyurethane foam chips 11 and moisture-curing adhesive 21 is supplied to a mold 70 in which the breathable surface material 30 is placed, and compression molding is performed while supplying moisture. An example of the thermal insulation board 10 is shown in Figure 1.

[0014] (1) Core material 20 The core material 20 consists of rigid polyurethane foam chips 11 bonded together with a moisture-curing adhesive 21.

[0015] (1.1) Rigid polyurethane foam chips 11 Rigid polyurethane foam chips 11 can be obtained by processing rigid polyurethane foam into chips. In this disclosure, rigid polyurethane foam conceptually includes rigid polyisocyanurate foam containing isocyanurate bonds.

[0016] From the viewpoint of flame retardancy, the rigid polyurethane foam is preferably a polyisocyanurate foam containing an isocyanurate ring. The polyisocyanurate foam can be obtained by using a trimerizing catalyst and blending an excess of polyisocyanate. The isocyanate index of the polyisocyanurate foam is, for example, 150 to 1200, and may be 200 to 1100 or 300 to 1000.

[0017] From the standpoint of material recycling, rigid polyurethane foam chips 11 are preferably obtained from products containing rigid polyurethane foam that are scheduled to be discarded, or from scraps generated during the manufacturing process of rigid polyurethane foam. The board to be processed 1 in Figure 2 is an example of a product containing rigid polyurethane foam. The method for obtaining rigid polyurethane foam chips 11 from the board to be processed 1 in Figure 2 will be described later.

[0018] The maximum diameter of the rigid polyurethane foam chips 11 is preferably 3 mm or more, more preferably 5 mm or more, and even more preferably 8 mm or more, from the viewpoint of suitably maintaining the independent cell structure of the rigid polyurethane foam. The maximum diameter of the rigid polyurethane foam chips 11 is preferably 30 mm or less, more preferably 25 mm or less, and even more preferably 20 mm or less, from the viewpoint of homogenizing the core material 20. From these viewpoints, the maximum diameter of the rigid polyurethane foam chips 11 is preferably 3 mm or more and 30 mm or less, more preferably 5 mm or more and 25 mm or less, and even more preferably 8 mm or more and 20 mm or less.

[0019] (1.2) Soft polyurethane foam chips The core material 20 includes rigid polyurethane foam chips 11 and resin chips other than rigid polyurethane foam, and these chips may be bonded together with a moisture-curing adhesive 21. From the viewpoint of improving sound absorption, the resin chips other than rigid polyurethane foam are preferably soft polyurethane foam chips.

[0020] The maximum diameter of the soft polyurethane foam chips is preferably 1 mm to 25 mm, more preferably 2 mm to 20 mm, and even more preferably 3 mm to 15 mm, taking into consideration the balance with the hard polyurethane foam chips 11.

[0021] The mass ratio of rigid polyurethane foam chips 11 to flexible polyurethane foam chips is not particularly limited. Preferably, the mass ratio of rigid polyurethane foam chips 11 to flexible polyurethane foam chips is 20:80-100:0, more preferably 30:70-100:0, and even more preferably 40:60-100:0.

[0022] (1.3) Moisture-curing adhesive 21 The moisture-curing adhesive 21 is not particularly limited. Preferably, the moisture-curing adhesive 21 is one or more selected from the group consisting of methylenediphenyl diisocyanate (MDI), MDI prepolymer (MDI prepolymer), toluene diisocyanate (TDI), and TDI prepolymer (TDI prepolymer). Among these, TDI prepolymer is more preferred.

[0023] The amount of moisture-curing adhesive 21 is not particularly limited. When the total amount of rigid foamed urethane chips 11 and flexible foamed urethane chips is 100 parts by mass, the amount of moisture-curing adhesive 21 is preferably 5 parts by mass or more and 30 parts by mass or less, more preferably 8 parts by mass or more and 25 parts by mass or less, and preferably 10 parts by mass or more and 20 parts by mass or less.

[0024] (2) Surface material 30 The facing material 30 is bonded to the surface of the core material 20. The facing material 30 may be bonded to both sides of the core material 20, or to only one side of the core material 20. In the insulation board 10 shown in Figure 1, the facing material 30 is bonded to both sides of the core material 20.

[0025] The facing material 30 is breathable. The facing material 30 can be selected from the group consisting of, for example, nonwoven fabric, porous synthetic resin film, porous metal vapor-deposited film, and paper. Among these, nonwoven fabric is preferred from the viewpoint of moisture permeability, suppression of chip debris (for example, powder generated when part of the chip breaks off), sound absorption, and corrosion resistance.

[0026] The nonwoven fabric is preferably an entangled material containing one or more fibers selected from the group consisting of rayon fibers, polyolefin fibers, polyester fibers, nylon fibers, vinylon fibers, acrylic fibers, urethane fibers, glass fibers, carbon fibers, metal fibers, and cellulose fibers. Among these, an entangled material containing rayon fibers and / or polyolefin fibers is preferred. From the viewpoint of adhesion to moisture-curing adhesives, the nonwoven fabric is more preferably an entangled material of rayon fibers and polypropylene / polyethylene core-sheath composite fibers, an entangled material of polypropylene fibers, or an entangled material of rayon fibers and polyethylene terephthalate / polyethylene split composite fibers. Split composite fibers are fibers having a fiber cross-section in which two or more components form segments for each component, and multiple segments of different components are joined to each other.

[0027] The nonwoven fabric is preferably a spunlace nonwoven fabric from the viewpoint of moisture permeability and ease of penetration of the moisture-curing adhesive 21. Spunlace nonwoven fabric is a nonwoven fabric manufactured by entangling the fibers in the web with a high-pressure water flow without using a binder (adhesive).

[0028] The basis weight of the nonwoven fabric is not particularly limited. Preferably, the basis weight of the nonwoven fabric is 30 g / m². 2 More than 100g / m 2 The following is more preferable: 25 g / m² 2 More than 80g / m 2 The following, and more preferably 30 g / m² 2 More than 60g / m 2 The following applies: The thickness of the nonwoven fabric is not particularly limited. For example, the thickness of the nonwoven fabric may be between 0.1 mm and 3.0 mm.

[0029] (3) Specific examples of methods for manufacturing the heat-insulating board 10 An example of a method for manufacturing the thermal insulation board 10 will be described with reference to Figures 2 to 7. In this example of a method for manufacturing the thermal insulation board 10, rigid polyurethane foam chips 11 are prepared, a mixture 20P containing the rigid polyurethane foam chips 11 and a moisture-curing adhesive 21 is prepared, the mixture 20P is supplied to a mold 70 on which a breathable surface material 30 is placed, and compression molding is performed while supplying moisture. In other words, in this example of a method for manufacturing the thermal insulation board 10, moisture is supplied to the mixture 20P via the surface material 30.

[0030] The process for preparing the rigid polyurethane foam chips 11 shown in Figures 2 and 3 involves obtaining the rigid polyurethane foam chips 11 from a workpiece board 1 equipped with rigid polyurethane foam (polyisocyanurate foam). The workpiece board 1 consists of a metal foil surface material 3, a plate-shaped core material 11P of polyisocyanurate foam, and another metal foil surface material 3, laminated in this order. The process for preparing the rigid polyurethane foam chips 11 involves peeling off the metal foil surface materials 3,3 from the plate-shaped core material 11P and then crushing the plate-shaped core material 11P. At this time, by setting a value for the crushed particle size in advance in the crushing device, or by separating the particles using a filter after crushing, rigid polyurethane foam chips 11 having a predetermined maximum diameter can be obtained.

[0031] The process for preparing the mixture 20P shown in Figure 4 involves mixing rigid polyurethane foam chips 11 and moisture-curing adhesive 21. When using flexible polyurethane foam chips (not shown), the process for preparing the mixture 20P involves mixing the rigid polyurethane foam chips 11, the flexible polyurethane foam chips, and the moisture-curing adhesive 21. Mixing may be done using a mixing device such as a blender, by spraying the moisture-curing adhesive 21 onto the rigid polyurethane foam chips 11, or by using a combination of spraying and a mixing device.

[0032] As shown in Figures 5 to 7, the mold 70 comprises a frame 74 with a steam inlet 73 formed on its lower surface, a bottom plate 71 positioned and fixed within the frame 74, and a press mold 75 that is movable up and down relative to the bottom plate 71. Steam passages 72 and 77 are formed to penetrate the bottom plate 71 and the press mold 75 in the vertical direction.

[0033] The frame 74 is provided with a stopper (not shown) that restricts the lowest position of the press die 75. When the press die 75 descends by a predetermined amount, it collides with the stopper, and the stopper restricts the press die 75 from descending any further. By adjusting the vertical position of this stopper, the lowest position of the press die 75, that is, the distance between the bottom plate 71 and the press die 75 (corresponding to the thickness of the molded product), can be adjusted.

[0034] One example of a method for manufacturing the insulation board 10 is to lay a facing material 30 on a base plate 71 and pour a mixture 20P onto the facing material 30. The facing material 30 is then placed on top of the poured mixture 20P. The mold 75 is lowered by a press device 76 to compress the mixture 20P between the base plate 71 and the mold 75. Through compression, the moisture-curing adhesive 21 spreads into the gaps between the rigid polyurethane foam chips 11, as well as between the rigid polyurethane foam chips 11 and the facing material 30. If the facing material 30 is a nonwoven fabric, the moisture-curing adhesive 21 also penetrates the nonwoven fabric through compression.

[0035] During compression, steam Vp is supplied into the mold 70 from an external steam supply device (not shown) through a steam inlet 73 on the bottom surface of the mold 70. The supplied steam Vp enters the space between the bottom plate 71 and the press mold 75 through the steam passage 72 of the bottom plate 71. As this steam Vp passes between the bottom plate 71 and the press mold 75, it comes into contact with the moisture-curing adhesive 21, curing the adhesive 21, bonding the rigid foamed urethane chips 11 together, and bonding the surface material 30 to the rigid foamed urethane chips 11 (core material 20). The steam Vp is then released to the outside through the steam passage 77 of the press mold 75. The bonding of the rigid foamed urethane chips 11 together and the bonding of the surface material 30 to the core material 20 forms a plate-shaped molded product between the bottom plate 71 and the press mold 75. After that, the mold 70 is opened and the molded product is removed, and an insulating board 10 made of the molded product is obtained.

[0036] Furthermore, by adjusting the distance between the bottom plate 71 and the press mold 75 of the mold 70 to set the volume between the bottom plate 71 and the press mold 75 to a predetermined value, and by adjusting the amount of mixture 20P put into the mold 70, the density of the resulting heat-insulating board 10 can be set to the desired value.

[0037] Depending on the shape and size of the mold 70, the molded product removed may be cut to a predetermined thickness or external dimensions to form the insulation board 10. Furthermore, the shape of the mat to be manufactured is not limited to a flat plate; it may also be bent at a predetermined position or have an uneven surface. By shaping the opposing surfaces of the base plate 71 and the press mold 75 to the desired shape of the mat, an insulation board 10 of the desired shape can be molded.

[0038] In the process of supplying a mixture 20P to a mold 70 on which a breathable surface material 30 is placed, and compression molding while supplying moisture, the manner in which moisture is supplied is not limited to the supply of water vapor. For example, the manner in which moisture is supplied may be by spraying water in the form of a mist.

[0039] When the facing material 30 is a nonwoven fabric, the above compression molding process may have the following configuration. That is, the above compression molding process may cure the moisture-curing adhesive 21 that has penetrated the nonwoven fabric by compression within the nonwoven fabric, thereby tightening the weave of the nonwoven fabric. With this configuration, the tightening of the weave of the nonwoven fabric effectively suppresses the passage of chip debris from the core material 20 through the nonwoven fabric. Furthermore, the above compression molding process may cure the moisture-curing adhesive 21 that has penetrated the nonwoven fabric by compression within the nonwoven fabric, thereby bonding the fibers of the nonwoven fabric together. With this configuration, even when using a nonwoven fabric with excellent moisture permeability and low fiber bonding, the fibers of the nonwoven fabric are less likely to fall off.

[0040] (4) Characteristics of the core material 20 By appropriately designing the properties of the core material 20, the desired properties can also be imparted to the heat insulation board 10. The properties of the core material 20 shown below can be measured by fabricating a core material 20 to which the facing material 30 is not adhered. These properties of the core material 20 are similarly exhibited in the heat insulation board 10 to which the facing material 30 is adhered.

[0041] The thickness of the core material 20 can be appropriately determined according to the application and the like. The thickness of the core material 20 is, for example, 5 mm or more and 100 mm or less, and may be 10 mm or more and 50 mm or less, or 15 mm or more and 30 mm or less.

[0042] From the viewpoint of preferably maintaining the independent cell structure of the rigid urethane foam, it is preferable that a rigid foam urethane chip 11 having a maximum diameter of 3 mm or more is observed in the cross section of the core material 20. The above maximum diameter is more preferably 5 mm or more, and even more preferably 10 mm or more. The upper limit value of the above maximum diameter is not particularly limited, and is, for example, 30 mm or less. FIG. 8 is a schematic diagram of an observation image of the cross section of the core material 20. The maximum diameter of the rigid foam urethane chip 11 in the cross section of the core material 20 can be specified as the maximum diameter D of the contour shape by specifying the contour shape of the rigid foam urethane chip 11. "A rigid foam urethane chip 11 having a maximum diameter of 3 mm or more is observed in the cross section of the core material 20" means that in any cross section of the core material 20, it is sufficient that at least one rigid foam urethane chip 11 having a maximum diameter of 3 mm or more is observed.

[0043] The density of the core material 20 is not particularly limited. From the viewpoint of ensuring various physical properties, the density of the core material 20 is preferably 30 kg / m 3 or more, more preferably 40 kg / m 3 or more, and even more preferably 50 kg / m 3 or more. From the viewpoint of weight reduction, the density of the core material 20 is preferably 150 kg / m 3 or less, more preferably 120 kg / m 3 or less, and even more preferably 100 kg / m 3 or less. From these viewpoints, the density of the core material 20 is preferably 30 kg / m 3 or more and 150 kg / m3 The following is more preferable: 40 kg / m 3 More than 120kg / m 3 The following, and more preferably 50 kg / m 3 More than 100kg / m 3 The following applies:

[0044] The compressive strength of the core material 20 (according to JIS A 9521:2017) is not particularly limited. Preferably, the compressive strength of the core material 20 is 1.5 N / cm². 2 The above is more preferable to 2 N / cm 2 The above is preferable, and more preferably 2.5 N / cm 2 That concludes the explanation. The upper limit of the compressive strength of the core material 20 is not particularly limited; for example, 10 N / cm². 2 The following applies. The compressive strength of core material 20 was determined by preparing a test specimen with a thickness of 25 mm ± 5 mm and measuring the maximum force (N) that resulted in a deformation rate of 10% or less across the initial cross-sectional area (cm²) of the test specimen. 2 The result is calculated by dividing by ( ). Two test specimens are used, and their average value is taken as the compressive strength of core material 20.

[0045] The thermal conductivity of the core material 20 (according to JIS A 9521:2017) is not particularly limited. The thermal conductivity of the core material 20 is preferably 0.045 W / (m·K) or less, more preferably 0.040 W / (m·K) or less, and even more preferably 0.035 W / (m·K) or less. The lower limit of the thermal conductivity of the core material 20 is usually 0.019 W / (m·K) or more. When calculating the thermal conductivity of the core material 20, two test pieces are used, and the average value is taken as the thermal conductivity of the core material 20.

[0046] The normal incidence sound absorption coefficient of the core material 20 (in accordance with JIS A1405-2:2007 / ISO 10534-2:1998) is not particularly limited. From the viewpoint of ensuring sound absorption in the high-frequency range, the normal incidence sound absorption coefficient is preferably 0.3 or higher, more preferably 0.35 or higher, and even more preferably 0.4 or higher at all frequencies from 1000Hz to 6300Hz. The normal incidence sound absorption coefficient is usually 0.9 or lower at all frequencies from 1000Hz to 6300Hz. Furthermore, the above-mentioned perpendicular incidence sound absorption coefficient is preferably 0.25 or higher at a frequency of 500 Hz, but may also be 0.3 or higher, or 0.35 or higher, from the viewpoint of ensuring sound absorption in the mid-range to high-range. The above-mentioned perpendicular incidence sound absorption coefficient is usually 0.6 or lower at a frequency of 500 Hz. Furthermore, the above sound absorption coefficient tends to be improved by increasing the mass ratio of soft polyurethane foam chips in the core material 20.

[0047] (5) Characteristics of the insulation board 10 The thickness of the insulation board 10 can be determined as appropriate depending on the application. For example, the thickness of the insulation board 10 may be 5 mm or more and 50 mm or less, or 10 mm or more and 40 mm or 15 mm or more and 30 mm or less.

[0048] The thickness of the core material 20 in the insulation board 10 is the same as the thickness of the core material 20 described above. The thickness of the facing material 30 in the insulation board 10 is, for example, 0.1 mm to 3.0 mm when the cross-section of the insulation board 10 is observed. If the facing material 30 is a nonwoven fabric, the moisture-curing adhesive 21 hardens within the nonwoven fabric, resulting in a state where the weave of the nonwoven fabric is tightly packed. If the facing material 30 is a nonwoven fabric, the moisture-curing adhesive 21 hardens within the nonwoven fabric, resulting in a state where the fibers of the nonwoven fabric are bonded together.

[0049] The density of the insulation board 10 is not particularly limited. From the viewpoint of ensuring various physical properties, the density of the insulation board 10 is preferably 30 kg / m³. 3 The above is preferable to 40 kg / m 3 The above is preferable to 50 kg / m 3 That concludes the explanation. From the viewpoint of reducing weight, the density of the insulation board 10 is preferably 150 kg / m³. 3 The following, and more preferably 120 kg / m³ 3 The following, and more preferably 100 kg / m 3 The following applies. From these perspectives, the density of the insulation board 10 is preferably 30 kg / m³. 3 More than 150kg / m 3 The following is more preferable: 40 kg / m3 More than 120kg / m 3 The following, and more preferably 50 kg / m 3 More than 100kg / m 3 The following applies:

[0050] The compressive strength of the insulation board 10 (according to JIS A 9521:2017) is not particularly limited. Preferably, the compressive strength of the insulation board 10 is 1.5 N / cm². 2 The above is more preferable to 2 N / cm 2 The above is preferable, and more preferably 2.5 N / cm 2 That concludes the explanation. The upper limit of the compressive strength of the insulation board 10 is not particularly limited; for example, 10 N / cm². 2 The following applies. The compressive strength of the insulation board 10 is determined by preparing a test specimen with a thickness of 25 mm ± 5 mm and measuring the maximum force (N) that resulted in a deformation rate of 10% or less across the initial cross-sectional area (cm²) of the test specimen. 2 The result is calculated by dividing by ( ). Two test specimens are used, and their average value is taken as the compressive strength of the insulation board 10.

[0051] The thermal conductivity of the insulation board 10 (according to JIS A 9521:2017) is not particularly limited. The thermal conductivity of the insulation board 10 is preferably 0.045 W / (m·K) or less, more preferably 0.040 W / (m·K) or less, and even more preferably 0.035 W / (m·K) or less. The lower limit of the thermal conductivity of the insulation board 10 is usually 0.019 W / (m·K) or more. When calculating the thermal conductivity of the insulation board 10, two test pieces are used, and the average value is taken as the thermal conductivity of the insulation board 10.

[0052] The thermal conductivity of the insulation board 10 (according to JIS A 9521:2017) is not particularly limited. The thermal conductivity of the insulation board 10 is preferably 0.045 W / (m·K) or less, more preferably 0.040 W / (m·K) or less, and even more preferably 0.035 W / (m·K) or less. The lower limit of the thermal conductivity of the insulation board 10 is usually 0.019 W / (m·K) or more. When calculating the thermal conductivity of the insulation board 10, two test pieces are used, and the average value is taken as the thermal conductivity of the insulation board 10.

[0053] 2. Insulation board 10 (second aspect) The insulation board 10 (second embodiment) comprises a core material 20 in which rigid foamed urethane chips 11 are bonded with a moisture-curing adhesive 21, and a nonwoven fabric bonded to the surface of the core material 20.

[0054] The insulation board 10 (second embodiment) can be suitably obtained, for example, by using a nonwoven fabric as the facing material 30 in the "1. Method for manufacturing the insulation board 10 (first embodiment)" described above. In the insulation board 10 (second embodiment), the following description in "1. Method for manufacturing the insulation board 10" is applied as is, and its description is omitted. • Description in the column "(1) Core material 20" • Explanation of "nonwoven fabric" in the section "(2) Surface material 30" • Explanation of the case where the facing material 30 is a nonwoven fabric in the section "(3) Specific examples of the manufacturing method of the insulation board 10" • Description in the section "(4) Characteristics of Core Material 20" • Explanation of the case where the facing material 30 is nonwoven fabric in the section "(5) Characteristics of the insulation board 10"

[0055] 3. Effects of this embodiment The thermal insulation board 10 of this embodiment uses rigid polyurethane foam chips 11, and therefore has excellent thermal insulation properties. The thermal insulation board 10 of this embodiment also has sound absorption and / or sound insulation properties. Since the heat-insulating board 10 of this embodiment uses rigid polyurethane foam chips 11, flame retardancy can be improved compared to the case where only flexible polyurethane foam chips are used.

[0056] The insulation board 10 of this embodiment includes a facing material 30 adhered to the surface of the core material, so even when rigid polyurethane foam chips 11 are used, the shedding of chip debris can be suppressed. Furthermore, the insulation board 10 of this embodiment includes a facing material 30 adhered to the surface of the core material, so even when rigid polyurethane foam chips 11 are used, surface irregularities can be reduced.

[0057] Furthermore, in the manufacturing method of the heat-insulating board 10 of this embodiment, the facing material 30 is bonded to the core material 20 during compression molding. Unlike configurations in which the facing material is attached to the core material afterward, this reduces the shedding of chip debris even during compression molding. Furthermore, if the facing material 30 is a nonwoven fabric, it is possible to suitably achieve both the supply of moisture through the facing material 30 and the suppression of chip debris shedding by the facing material 30. Also, since nonwoven fabric itself is a material with excellent sound absorption properties, if the facing material 30 is a nonwoven fabric, it may contribute to improving the sound absorption of the insulation board 10.

[0058] When using a mixture of rigid polyurethane foam chips 11 and flexible polyurethane foam chips, the strength and sound absorption performance of the insulation board 10 can be controlled by adjusting the mass ratio of the rigid polyurethane foam chips 11 to the flexible polyurethane foam chips. [Examples]

[0059] The following will provide a more detailed explanation using examples.

[0060] 1. Experiment 1 (1) Preparation of core material We created a core material without adhesive to the surface material and conducted tests to investigate the properties of the core material.

[0061] As the board to be processed, we prepared product name Thermax (registered trademark), product number SIII, manufactured by Inoac Corporation. This board to be decomposed consists of an aluminum foil surface and a plate-shaped core made of polyisocyanurate foam. The aluminum foil surface was peeled off the board to be decomposed, and the resulting plate-shaped core was crushed to obtain rigid foamed urethane chips with a maximum diameter of approximately 15 mm.

[0062] Soft polyurethane foam was crushed to prepare soft foamed urethane chips with a maximum diameter of approximately 5 mm.

[0063] Experimental Example 1 used rigid polyurethane foam chips and flexible polyurethane foam chips in a mass ratio of 100:0. A mixture was obtained by mixing 15 parts by mass of moisture-curing adhesive (TDI prepolymer) with a total of 100 parts by mass of rigid and flexible polyurethane foam chips. A mold measuring 550 mm × 550 mm × 20 mm was prepared. The target density was 80 kg / m³. 3 The mixture was then poured into the mold. The mold was closed, and 100°C steam was supplied to heat and compress the material. Two core materials for Experimental Example 1 were produced (N=2).

[0064] In Experimental Example 2, two core materials were prepared in the same manner as in Experimental Example 1, except that rigid polyurethane foam chips and flexible polyurethane foam chips were used in a mass ratio of 75:25 (N=2). Experimental Example 3 involved preparing two core materials in the same manner as in Experimental Example 1, except that rigid polyurethane foam chips and flexible polyurethane foam chips were used in a mass ratio of 50:50 (N=2).

[0065] (2) Evaluation of Experimental Examples 1-3 Test specimens of the dimensions listed in Table 1 were cut from the core materials of Experimental Examples 1-3, and their density, compressive strength, and thermal conductivity were determined. Density was calculated for each of the two test specimens of each core material. Compressive strength and thermal conductivity were calculated as the average values ​​of the two test specimens of each core material using the method described in the embodiment. The results are shown in Table 1.

[0066] [Table 1]

[0067] The normal incidence sound absorption coefficient (compliant with JIS A1405-2:2007 / ISO 10534-2:1998) of the core material for Experimental Examples 1-3 was measured. The results are shown in Table 2. In Table 2, the numbers from "125" to "6300" in the left column represent frequency (Hz). The sound absorption coefficient result for Experimental Example 1 is shown in the "Hard / Soft = 100 / 0" column of Table 2. The sound absorption coefficient result for Experimental Example 2 is shown in the "Hard / Soft = 75 / 25" column of Table 2. The sound absorption coefficient result for Experimental Example 3 is shown in the "Hard / Soft = 50 / 50" column of Table 2.

[0068] [Table 2]

[0069] 2. Experiment 2 Making insulation boards The core material configuration was the same as in Experimental Example 1 of Experiment 1 described above (rigid polyurethane foam chips and flexible polyurethane foam chips in a mass ratio of 100:0).

[0070] The following nonwoven fabrics A-C were prepared as facing materials. Nonwoven fabric A: A spunlace nonwoven fabric made of rayon fibers and polypropylene / polyethylene core-sheath composite fibers, with a basis weight of 40g / m². 2 Product number RH3-40B, manufactured by Yamato Spinning Co., Ltd. Nonwoven fabric B: Intertwined polypropylene fibers (short fibers of approximately 51 mm), spunlace nonwoven fabric, basis weight 50 g / m² 2 Product code RPX275, manufactured by Yamato Spinning Co., Ltd. Nonwoven fabric C: Entangled rayon fibers and polyethylene terephthalate / polyethylene split composite fibers, spunlace nonwoven fabric, basis weight 50g / m² 2 Product code DF(S)SH R5-50, manufactured by Yamato Spinning Co., Ltd.

[0071] Experimental example A used two sheets of nonwoven fabric A measuring 550 mm x 550 mm. A mixture was obtained by mixing 15 parts by mass of moisture-curing adhesive (TDI prepolymer) with a total of 100 parts by mass of rigid polyurethane foam chips and flexible polyurethane foam chips. A mold measuring 550 mm x 550 mm x 20 mm was prepared, and the first sheet of nonwoven fabric A was placed on the bottom plate. The target density was 80 kg / m³. 3 The mixture was poured onto the first sheet of nonwoven fabric A. The second sheet of nonwoven fabric A was placed on top of the mixture. The mold was closed, and 100°C steam was supplied to heat and compress the material. Two insulation boards of Experimental Example 1 were thus produced (N=2).

[0072] Experimental Example B involved creating two insulation boards in the same manner as Experimental Example A, except that nonwoven fabric B was used (N=2). Experimental Example C involved creating two insulation boards in the same manner as in Experimental Example A, except that nonwoven fabric C was used (N=2).

[0073] (2) Evaluation of Experimental Example A - Experimental Example C Test specimens of the dimensions listed in Table 3 were cut from the insulation boards of Experimental Examples A-C, and their density, compressive strength, and thermal conductivity were determined. Density was calculated for each pair of test specimens from each insulation board. Compressive strength and thermal conductivity were calculated as the average values ​​of each pair of test specimens from each insulation board using the method described in the embodiment. The results are shown in Table 3.

[0074] [Table 3]

[0075] The normal incidence sound absorption coefficient (in accordance with JIS A1405-2:2007 / ISO 10534-2:1998) of the insulation boards in Experimental Examples A-C was measured. The normal incidence sound absorption coefficient of the insulation boards in Experimental Examples A-C was approximately the same as the result for the normal incidence sound absorption coefficient of the core material in Experimental Example 1.

[0076] 3.Results This embodiment provides a novel method for manufacturing a thermal insulation board. This embodiment provides a novel thermal insulation board. For example, this embodiment provides a technology that can achieve both the supply of moisture through the facing material and the suppression of chip debris falling off by the facing material.

[0077] This disclosure is not limited to the embodiments detailed above, and various modifications or changes are possible within the scope of this disclosure. [Explanation of Symbols]

[0078] 10…Insulation board 11… Rigid polyurethane foam chips 20 ... Core material 20P…Plate-shaped core material 21P…Mixture 21… Moisture-curing adhesive 30 ... Surface material 70…Mold 71...Bottom plate 72 ... water vapor passage 73... Steam inlet 74 …Frame body 75… mold 76 ... Pressing device 77 ... water vapor passage

Claims

1. A method for manufacturing an insulating board comprising a core material in which rigid polyurethane foam chips are bonded with a moisture-curing adhesive, and a breathable surface material bonded to the surface of the core material, In a mold with a breathable surface material, A mixture containing rigid polyurethane foam chips and a moisture-curing adhesive is supplied. A method for manufacturing an insulating board by compression molding while supplying moisture.

2. The method for manufacturing an insulating board according to claim 1, wherein the breathable surface material is a nonwoven fabric.

3. A core material made of rigid polyurethane foam chips bonded with a moisture-curing adhesive, An insulating board comprising a nonwoven fabric bonded to the surface of the aforementioned core material.

4. The density of the core material is 100 kg / m³ ３ The thermal insulation board according to claim 3, which is as follows:

5. The thermal insulation board according to claim 3, wherein rigid foamed urethane chips with a maximum diameter of 3 mm or more are observed in the cross-section of the core material.

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