Terminal and battery wiring module

Abstract

The present invention provides terminals and battery wiring modules that enable improved connection reliability between conductive members and electronic components. [Solution] The terminal 14 comprises a resin molded portion 23, plate-shaped conductive members 21 and 22 partially embedded in the resin molded portion 23, and an electronic component 24 connected to the conductive members 21 and 22. The upper surfaces of the conductive members 21 and 22 include a first surface 43 in contact with the resin molded portion 23, a stepped surface 44 extending downward from the first surface 43, and a second surface 45 connected to the first surface 43 via the stepped surface 44 and located below the first surface 43. The entire second surface 45 is located outside the resin molded portion 23. The electronic component 24 is connected to the second surface 45.

Description

Technical Field

[0004] ,

[0001] The present disclosure relates to terminals and battery wiring modules.

Background Art

[0002] Conventionally, there are terminals on which electronic components such as chip fuses and diodes are mounted (see, for example, Patent Document 1). The terminal includes a resin mold part, a plate-shaped conduction member partially embedded in the resin mold part, and an electronic component connected to the conduction member. The conduction member has an embedded part embedded in the resin mold part and a protruding part protruding from the resin mold part. An electronic component is connected to the protruding part of the conduction member.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In the terminal as described above, if burrs of the resin mold part are formed on the surface of the protruding part of the conduction member, there is a risk that connection failure may occur between the conduction member and the electronic component due to the burrs.

[0005] An object of the present disclosure is to provide a terminal and a battery wiring module that can improve the connection reliability between a conduction member and an electronic component.

Means for Solving the Problems

[0007] The terminals and battery wiring modules of this disclosure make it possible to improve the reliability of the connection between conductive members and electronic components. [Brief explanation of the drawing]

[0008] [Figure 1] Figure 1 is a schematic diagram showing a battery wiring module of one embodiment. [Figure 2] Figure 2 is a perspective view of the terminals of the same embodiment. [Figure 3] Figure 3 is a cross-sectional view of the terminal of the same embodiment. [Figure 4] Figure 4 is a partial cross-sectional view showing the peripheral structure of the resin molded portion in the terminal of the same embodiment. [Figure 5] Figure 5 is a cross-sectional view showing the molding process of the resin molded portion in the terminal of the same embodiment. [Figure 6] Figure 6 is a partial cross-sectional view showing the surrounding structure of the resin molded portion in the modified terminal. [Modes for carrying out the invention]

[0009] [Description of Embodiments in this Disclosure] First, the embodiments of this disclosure will be listed and described. The terminals in this disclosure are [1] A terminal comprising a resin molded portion, a plate-shaped conductive member partially embedded in the resin molded portion, and an electronic component connected to the conductive member, wherein the upper surface of the conductive member includes a first surface in contact with the resin molded portion, a stepped surface extending downward from the first surface, and a second surface connected to the first surface via the stepped surface and located below the first surface, the entirety of which the second surface is located outside the resin molded portion, and the electronic component is connected to the second surface.

[0010] In this configuration, the second surface of the conductive member that connects to the electronic component is located entirely outside the resin molded portion. Furthermore, a stepped surface is provided on the upper surface of the conductive member between the second surface and the first surface that contacts the resin molded portion. As a result, burrs from the resin molded portion in contact with the first surface are less likely to reach the second surface due to the stepped surface, thus making it possible to prevent burr formation on the second surface. Consequently, it is possible to improve the reliability of the connection between the conductive member and the electronic component.

[0011] [2] In the above [1], the resin molded portion may have a positioning surface configured to position the electronic component, and the conductive member may have an embedded portion embedded in the resin molded portion having the first surface on its upper surface, and a first protruding portion having the second surface on its upper surface and protruding from the positioning surface to the outside of the resin molded portion.

[0012] With this configuration, when connecting electronic components to a conductive member, the positioning surface of the resin molded portion is used to position the electronic components, thereby suppressing misalignment of the electronic components.

[0013] [3] In the above [2], the positioning surface may be formed above the stepped surface. With this configuration, burrs extending from the positioning surface are less likely to reach the second surface due to the stepped surface, thus reducing the likelihood of burr formation on the second surface. Consequently, it becomes possible to improve the reliability of the connection between the conductive member and the electronic component.

[0014] [4] In [2] or [3] above, the conductive member may further include a second protruding portion that protrudes from the resin molded portion to the outside, and the second protruding portion may have a crimping portion to which an electric wire is crimped and a bending portion provided between the base portion of the second protruding portion and the crimping portion.

[0015] According to this configuration, when crimping the electric wire, the stress applied to the crimping portion is absorbed by the bending portion, so that it is possible to greatly suppress the crimping stress transmitted to the first protruding portion connected to the electronic component.

[0016] [5] In any one of [1] to [4] above, the terminal may include two of the conductive members, and the two conductive members may be electrically connected to each other via the electronic component.

[0017] According to this configuration, in a configuration where two conductive members are electrically connected to each other via an electronic component, it is possible to improve the connection reliability between each conductive member and the electronic component by the stepped surfaces of each conductive member.

[0018] [6] In [5] above, the resin molded portion includes a bottom wall that covers the lower sides of the two conductive members and a peripheral wall that extends upward from the bottom wall and surrounds the electronic component. The bottom wall has a recess that is recessed downward at a position between the second surfaces of the two conductive members, and the electronic component may be connected to the second surface by soldering.

[0019] According to this configuration, it is possible to allow the solder protruding from between the electronic component and the second surface of the conductive member to flow into the recess provided in the bottom wall of the resin molded portion. Therefore, it is possible to suppress the formation of solder bridges between the second surfaces of the two conductive members.

[0020] [7] The battery wiring module of the present disclosure includes the terminal according to any one of [1] to [6] above. In this configuration, the second surface of the conductive member of the terminal that connects to the electronic component is located entirely outside the resin molded portion. Furthermore, a stepped surface is provided on the upper surface of the conductive member between the second surface and the first surface that contacts the resin molded portion. As a result, burrs from the resin molded portion in contact with the first surface are less likely to reach the second surface due to the stepped surface, thus making it possible to prevent burr formation on the second surface. Therefore, it is possible to improve the reliability of the connection between the conductive member and the electronic component.

[0021] [Details of the embodiments of this disclosure] Specific examples of the terminal and battery wiring modules of this disclosure will be described below with reference to the drawings. In each drawing, some parts of the configuration may be exaggerated or simplified for ease of explanation. Also, the dimensional ratios of each part may differ in each drawing. In this specification, "orthogonal" includes not only strictly orthogonal connections but also connections that are approximately orthogonal within the scope of the function and effect of this embodiment. Also, terms such as "first," "second," etc., in this specification are used merely to distinguish between objects and do not rank them. The present invention is not limited to these examples and is shown in the claims, and all modifications within the meaning and scope equivalent to the claims are intended.

[0022] (Configuration of battery wiring module 10) As shown in Figure 1, the battery wiring module 10 of this embodiment is used in batteries installed in, for example, electric vehicles and hybrid vehicles. The battery wiring module 10 is provided on both sides in the width direction of a battery stack 12, which is made up of multiple battery cells 11 arranged in parallel. Each battery wiring module 10 includes multiple busbars 13 that connect adjacent battery cells 11, multiple terminals 14 connected to each of the multiple busbars 13, and wires 15 connected to each of the multiple terminals 14. The wires 15 are, for example, voltage-detecting wires for detecting the voltage of the battery cells 11. Each wire 15 is connected to a connector 16 which is connected to a voltage-detecting device (not shown).

[0023] (Configuration of terminal 14) As shown in Figures 2 and 3, the terminal 14 of this embodiment comprises a first conductive member 21, a second conductive member 22, a resin molded part 23 made of resin, and an electronic component 24.

[0024] The first conductive member 21 and the second conductive member 22 are each plate-shaped. The first conductive member 21 and the second conductive member 22 are formed, for example, from a metal plate by press working. The first conductive member 21 and the second conductive member 22 are electrically connected to each other via an electronic component 24. The electronic component 24 can be, for example, a chip fuse or a diode. The resin molded part 23 is configured to cover a part of the first conductive member 21, a part of the second conductive member 22, and the electronic component 24. The resin molded part 23 is formed by insert molding, with the first conductive member 21 and the second conductive member 22 as insert parts.

[0025] The drawing shows three mutually orthogonal directions: the longitudinal direction X, the width direction Y, and the height direction Z. In the following explanation, the upper and lower parts of the height direction Z may simply be referred to as "up" and "down." Note that terminal 14 is not necessarily installed with the upper part of the height direction Z facing upwards.

[0026] (Configuration of resin molded part 23) The resin molded portion 23 comprises a bottom wall 31 that covers the lower side of each conductive member 21, 22, and a peripheral wall 32 that extends upward from the bottom wall 31. The electronic component 24 is positioned on the inner circumference side of the peripheral wall 32. That is, the peripheral wall 32 is configured to surround the electronic component 24. Potting material (not shown) is filled into the inner circumference side of the peripheral wall 32 while the electronic component 24 is connected to each conductive member 21, 22.

[0027] As shown in Figure 4, the inner surface of the peripheral wall 32 includes a tapered surface 33 and a pair of positioning surfaces 34. The tapered surface 33 is inclined inward to guide the electronic component 24 when it is assembled. The pair of positioning surfaces 34 are provided at the lower end of the tapered surface 33. The pair of positioning surfaces 34 are provided on both sides of the electronic component 24 in the longitudinal direction X, so as to sandwich the electronic component 24 in the longitudinal direction X. Each positioning surface 34 is a surface that is perpendicular or intersects the longitudinal direction X. The electronic component 24 is positioned in the longitudinal direction X by the pair of positioning surfaces 34.

[0028] As shown in Figure 2, a positioning recess 35 extending along the height direction Z is formed on the outer circumferential surface of the resin molded portion 23. The positioning recess 35 is provided, for example, on both sides of the resin molded portion 23 in the width direction Y. For example, when connecting the electronic component 24 to the conductive members 21 and 22, the resin molded portion 23 is positioned by fitting a positioning pin (not shown) into the positioning recess 35.

[0029] (Configuration of the first conductive member 21) As shown in Figure 4, the first conductive member 21 comprises an embedded portion 40 embedded in the resin molded portion 23, and a first protruding portion 41 and a second protruding portion 42 that protrude from the resin molded portion 23, respectively.

[0030] The embedded portion 40 penetrates the interior of the peripheral wall 32 of the resin molded portion 23. The embedded portion 40 has a through hole 40a that penetrates the embedded portion 40 in the plate thickness direction (height direction Z). The resin that makes up the resin molded portion 23 is filled into the through hole 40a. This prevents the first conductive member 21 from coming out of the resin molded portion 23.

[0031] The first projection 41 is connected to the embedded portion 40 and protrudes from the positioning surface 34 towards the inner circumference of the peripheral wall 32. The first projection 41 is formed, for example, by a partial punching process, so that it is located below the embedded portion 40.

[0032] The upper surface of the first conductive member 21 includes a first surface 43 that contacts the resin molded portion 23, a stepped surface 44 that extends downward from the first surface 43, and a second surface 45 that is connected to the first surface 43 via the stepped surface 44 and is located below the first surface 43. The first surface 43 is the upper surface of the embedded portion 40. The stepped surface 44 is formed when the first protrusion 41 is deformed by the aforementioned partial punching process. The second surface 45 is the upper surface of the first protrusion 41. The entire second surface 45 is located outside the resin molded portion 23, more specifically, on the inner circumference side of the peripheral wall 32. The electronic component 24 is connected to the second surface 45.

[0033] The positioning surface 34 of the resin molded portion 23 is formed above the stepped surface 44. In this embodiment, the positioning surface 34 and the stepped surface 44 are formed to be continuous vertically and to be flush with each other.

[0034] The second projection 42 of the first conductive member 21 is connected to the embedded portion 40 and protrudes from the resin molded portion 23 towards the outer circumference of the peripheral wall 32. The second projection 42 is connected to the aforementioned busbar 13. The second projection 42 and the busbar 13 are connected to each other, for example, by laser welding.

[0035] (Configuration of the second conductive member 22) The second conductive member 22 will now be described. In the following description, components of the second conductive member 22 that are the same as those of the first conductive member 21 will be denoted by the same reference numerals as those of the first conductive member 21, and their detailed descriptions will be omitted.

[0036] As shown in Figures 2 and 3, the second conductive member 22 comprises an embedded portion 40 embedded in the resin molded portion 23 and a first protruding portion 41 and a second protruding portion 51 that protrude from the resin molded portion 23, respectively. Furthermore, as shown in Figure 4, the second conductive member 22 has a first surface 43, a stepped surface 44, and a second surface 45, similar to those of the first conductive member 21. The first conductive member 21 and the second conductive member 22 are electrically connected to each other via the electronic component 24 by soldering S to the second surface 45 of the first protruding portion 41 of each conductive member 21, 22.

[0037] (Configuration of the recess 36 in the resin molded part 23) The bottom wall 31 of the resin molded portion 23 has a recess 36 that is recessed downward at a position between the second surfaces 45 of each conductive member 21, 22. The recess 36 is, for example, a recess that does not penetrate the bottom wall 31 and has a bottom surface 36a. The bottom surface 36a is located below the lower surface of the first protrusion 41 of each conductive member 21, 22. If the solder S connecting the electronic component 24 and the second surface 45 of the first protrusion 41 protrudes from between the electronic component 24 and the second surface 45, the protruding solder S flows into the recess 36.

[0038] (Configuration of the second protrusion 51 of the second conductive member 22) As shown in Figure 3, the second projection 51 of the second conductive member 22 is connected to the embedded portion 40 and protrudes from the resin molded portion 23 to the outer circumference of the peripheral wall 32. The second projection 51 has a crimping portion 52 to which the aforementioned electric wire 15 is crimped, and a bent portion 53 provided between the base portion 51a of the second projection 51 and the crimping portion 52. The base portion 51a of the second projection 51 is the base end of the second projection 51 that protrudes from the resin molded portion 23, and is the portion of the second projection 51 near the resin molded portion 23. The bent portion 53 is bent in the thickness direction from the base portion 51a to the crimping portion 52. In this embodiment, the bent portion 53 is bent, for example, diagonally downward from the base portion 51a to the crimping portion 52.

[0039] (Operation of this embodiment) The operation of this embodiment will be described below. As shown in Figure 5, the resin molded part 23 is injection molded using the first mold 61 and the second mold 62. First, the conductive members 21 and 22 are placed in the first mold 61, and then the second mold 62 is placed on top of the first mold 61 from above, thereby forming a cavity between the first mold 61 and the second mold 62. Then, the resin molded part 23 is formed by filling the cavity between the first mold 61 and the second mold 62 with resin.

[0040] The second mold 62 has a pair of molding surfaces 63 that each form a pair of positioning surfaces 34 in the resin molded portion 23. Each molding surface 63 is perpendicular to or intersecting with the longitudinal direction X. During the molding of the resin molded portion 23, each molding surface 63 and the stepped surfaces 44 of each conductive member 21, 22 are in contact in the longitudinal direction X. As a result, the positioning surfaces 34 and the stepped surfaces 44 are formed to be aligned vertically and continuously along the molding surface 63. Because the stepped surfaces 44 are interposed between the positioning surfaces 34 and the second surface 45, it is possible to suppress the formation of burrs that may be formed on the positioning surfaces 34 up to the second surface 45 to which the electronic components 24 are connected. Furthermore, because the stepped surfaces 44 are interposed between the positioning surfaces 34 and the second surface 45, the stepped surfaces 44 can suppress the gas generated during resin molding from reaching the second surface 45. As a result, it is possible to suppress the formation of an insulating film on the second surface 45 due to the gas.

[0041] After the resin molded portion 23 is formed, the electronic components 24 are connected to the second surfaces 45 of each conductive member 21, 22 by soldering. As described above, the stepped surface 44 suppresses the generation of burrs and insulating films on the second surface 45, thereby suppressing the occurrence of connection failures between the electronic components 24 and the second surface 45.

[0042] (Effects of this embodiment) The effects of this embodiment will be described below. (1) The terminal 14 comprises a resin molded portion 23, plate-shaped conductive members 21 and 22 partially embedded in the resin molded portion 23, and an electronic component 24 connected to the conductive members 21 and 22. The upper surfaces of the conductive members 21 and 22 include a first surface 43 in contact with the resin molded portion 23, a stepped surface 44 extending downward from the first surface 43, and a second surface 45 connected to the first surface 43 via the stepped surface 44 and located below the first surface 43. The entire second surface 45 is located outside the resin molded portion 23. The electronic component 24 is connected to the second surface 45. With this configuration, the entire second surface 45 of the conductive members 21 and 22, which is connected to the electronic component 24, is located outside the resin molded portion 23. Furthermore, on the upper surfaces of the conductive members 21 and 22, a stepped surface 44 is provided between the second surface 45 and the first surface 43 that contacts the resin molded portion 23. This makes it difficult for burrs on the resin molded portion 23 in contact with the first surface 43 to reach the second surface 45 due to the stepped surface 44, thus making it possible to prevent burrs from forming on the second surface 45. Consequently, it is possible to improve the reliability of the connection between the conductive members 21 and 22 and the electronic component 24.

[0043] (2) The resin molded portion 23 is provided with a positioning surface 34 configured to position the electronic component 24. The conductive members 21 and 22 each have a first surface 43 on their upper surface and an embedded portion 40 embedded in the resin molded portion 23, and a second surface 45 on their upper surface and a first protruding portion 41 that protrudes from the positioning surface 34 to the outside of the resin molded portion 23. With this configuration, when connecting the electronic component 24 to the conductive members 21 and 22, the positioning surface 34 of the resin molded portion 23 is used to position the electronic component 24, thereby suppressing misalignment of the electronic component 24. In addition, the positioning surface 34 clearly defines the placement position of the electronic component 24, improving the ease of assembly of the electronic component 24.

[0044] (3) The positioning surface 34 is formed above the stepped surface 44. With this configuration, burrs extending from the positioning surface 34 are less likely to reach the second surface 45 due to the stepped surface 44, thus making it possible to reduce the formation of burrs on the second surface 45. Therefore, it is possible to improve the connection reliability between the conductive members 21, 22 and the electronic component 24.

[0045] (4) The second conductive member 22 is provided with a second projection 51 that protrudes outward from the resin molded portion 23. The second projection 51 has a crimping portion 52 to which the electric wire 15 is crimped, and a bent portion 53 provided between the base portion 51a of the second projection 51 and the crimping portion 52. With this configuration, the stress applied to the crimping portion 52 when the electric wire 15 is crimped is absorbed by the bent portion 53, so that the crimping stress transmitted to the first projection 41 connected to the electronic component 24 can be kept to a minimum.

[0046] (5) The terminal 14 is provided with two conductive members (a first conductive member 21 and a second conductive member 22). The first conductive member 21 and the second conductive member 22 are electrically connected to each other via an electronic component 24. With this configuration, in a configuration in which the first conductive member 21 and the second conductive member 22 are electrically connected to each other via an electronic component 24, the stepped surfaces 44 of each conductive member 21 and 22 make it possible to improve the connection reliability between each conductive member 21 and 22 and the electronic component 24.

[0047] (6) The resin molded portion 23 comprises a bottom wall 31 that covers the lower sides of the first conductive member 21 and the second conductive member 22, and a peripheral wall 32 that extends upward from the bottom wall 31 and surrounds the electronic component 24. The bottom wall 31 has a recess 36 that is recessed downward at a position between the second surfaces 45 of each conductive member 21, 22. The electronic component 24 is connected to the second surface 45 by soldering. With this configuration, it is possible to allow solder S that protrudes from between the electronic component 24 and the second surfaces 45 of the conductive members 21, 22 to flow into the recess 36 provided in the bottom wall 31 of the resin molded portion 23. Therefore, it is possible to suppress the formation of a solder bridge between the second surfaces 45 of the two conductive members 21, 22 and the electrical conductivity of each conductive member 21, 22 through the solder bridge.

[0048] (Other embodiments) The above embodiment can be implemented with the following modifications. The above embodiment and the following modifications can be combined with each other to the extent that they do not contradict each other technically.

[0049] As shown in Figure 6, in the resin molded portion 23, the recess 36 may be a hole that penetrates the bottom wall 31 along the height direction Z. With this configuration, it is possible to check from the bottom of the resin molded portion 23 whether or not a solder bridge has formed between the conductive members 21 and 22 through the recess 36 as a through hole. If the resin molded portion 23 is to be waterproof, it is necessary to seal the recess 36 as a through hole with, for example, a potting material. In this respect, by making the recess 36 not penetrate the bottom wall 31 as in the above embodiment, the waterproofness of the recess 36 can be ensured without using a potting material.

[0050] • In the resin molded portion 23 of the above embodiment, the recess 36 may be omitted. In the above embodiment, the positioning surface 34 of the resin molded portion 23 is formed above the stepped surface 44 of each conductive member 21, 22, but the embodiment is not particularly limited to this, and the positioning surface 34 may be formed above the first surface 43 of each conductive member 21, 22. In this case, the stepped surface 44 and a part of the first surface 43 are included in the first protrusion 41, that is, the stepped surface 44 and a part of the first surface 43 are located on the inner circumference side of the peripheral wall 32 of the resin molded portion 23. Even with such a configuration, the burrs of the resin molded portion 23 in contact with the first surface 43 are less likely to reach the second surface 45 due to the stepped surface 44, making it possible to reduce the formation of burrs on the second surface 45.

[0051] • In the resin molded portion 23 of the above embodiment, the positioning surface 34 may be omitted. In the above embodiment, a stepped surface 44 is formed in each of the conductive members 21 and 22 by partial punching, but the invention is not particularly limited to this.

[0052] In each of the above embodiments, the lower surface of the portion corresponding to the stepped surface 44 in each conductive member 21, 22 may be flat. That is, the stepped surface 44 may be formed solely by the displacement of the upper surface of the conductive members 21, 22.

[0053] The thickness and other configurations of each conductive member 21, 22 are not limited to the above embodiment and can be changed as appropriate. The shape of the bent portion 53 in the second protrusion 51 is not limited to the above embodiment and can be changed as appropriate depending on the configuration. Also, the bent portion 53 may be omitted in the second conductive member 22 of the above embodiment.

[0054] In the second conductive member 22 of the above embodiment, the crimping portion 52 may be omitted, and the second conductive member 22 may be connected to the electric wire 15 by welding or the like. In the above embodiment, the terminal 14 may be configured to be connected to a member other than the busbar 13.

[0055] In the above embodiment, the terminal 14 may be configured to be connected to a component other than the electric wire 15. • The terminal 14 in the above embodiment is provided with two conductive members 21 and 22, but it is not limited to this configuration, and may be configured to have only one conductive member.

[0056] • In the above embodiment, the application was made to terminals 14 used in the battery wiring module 10, but it is not limited to this and may also be applied to terminals used in devices other than the battery wiring module 10. The embodiments disclosed herein are illustrative in all respects, and the present invention is not limited to these examples. That is, the scope of the present invention is indicated by the claims, and all modifications within the meaning and scope equivalent to the claims are intended to be included. [Explanation of Symbols]

[0057] 10 Battery Wiring Modules 11 battery cells 12 Battery Stack 13 Bassba 14 terminals 15 Electric wire 16 connectors 21. First conductive member (conductive member) 22. Second conductive member (conductive member) 23 Resin molded part 24 Electronic Components 31 Bottom wall 32 Peripheral wall 33 Tapered surface 34 Positioning surface 35 Positioning recess 36 recesses 36a Bottom 40 Buried section 40a through hole 41 1st protrusion 42 Second protrusion 43 Page 1 44 Step surface 45 Side 2 51 Second protrusion 51a Root 52 Crimping section 53. Bending section 61 First mold 62. Second mold 63 Molding surface S solder X Longitudinal direction Y width direction Z (height direction)

Claims

1. The resin molded part, A plate-shaped conductive member partially embedded in the resin molded portion, A terminal comprising an electronic component connected to the conductive member, The upper surface of the conductive member includes a first surface in contact with the resin molded portion, a stepped surface extending downward from the first surface, and a second surface connected to the first surface via the stepped surface and located below the first surface. The second surface is located entirely outside the resin mold portion. The aforementioned electronic component is connected to the second surface, Terminal.

2. The resin molded portion includes a positioning surface configured to position the electronic component, The conductive member is, Having the first surface on its upper surface, and an embedded portion embedded in the resin mold portion, The upper surface has the second surface and includes a first projection that protrudes from the positioning surface to the outside of the resin mold portion, The terminal according to claim 1.

3. The positioning surface is formed above the stepped surface, The terminal according to claim 2.

4. The conductive member further comprises a second projection that protrudes outward from the resin molded portion, The second projection has a crimping portion to which the electric wire is crimped, and a bent portion provided between the base of the second projection and the crimping portion. The terminal according to claim 2.

5. The terminal comprises two of the conductive members, The two conductive members are electrically connected to each other via the electronic component. The terminal according to claim 1.

6. The resin molded portion comprises a bottom wall covering the lower side of the two conductive members, and a peripheral wall extending upward from the bottom wall and surrounding the electronic component. The bottom wall has a recess that is recessed downward at a position between the second surfaces of each of the two conductive members, The aforementioned electronic component is connected to the second surface by soldering. The terminal according to claim 5.

7. A terminal comprising the terminal described in any one of claims 1 to 6, Battery wiring module.

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