Wiring board

Abstract

Improving the quality of wiring boards by suppressing crack formation in glass plates. [Solution] The wiring board 1 of the embodiment includes a core portion 100 including a glass plate 100G having a first surface 100A and a second surface 100B, and build-up portions 11 and 12 formed on both sides of the glass plate 100G and including conductor layers 112 and 122 and insulating layers 111 and 121. The build-up portions 11 and 12 are composed of four or more conductor layers 112 and 122 and four or more insulating layers 111 and 121. The core portion 100 includes a plurality of through-hole conductors 100t that connect the conductor layer 112 formed on the first surface 100A side and the conductor layer 122 formed on the second surface 100B side. The glass plate 100G has a thickness of 0.7 mm or more and 1.5 mm or less, and a thermal expansion coefficient of 5 ppm / °C or more and 8 ppm / °C or less. The minimum arrangement pitch PT of the plurality of through-hole conductors 100t is 100 μm or more and 200 μm or less.

Claims

1. A core portion including a glass plate having a first surface and a second surface which is the opposite surface of the first surface, A build-up portion formed on each of the two sides of the glass plate, consisting of a laminated conductive layer and an insulating layer, A wiring board including, The aforementioned build-up section is composed of four or more conductive layers and four or more insulating layers. The core portion includes a plurality of through-hole conductors that connect the conductor layer in the build-up portion formed on the first surface side and the conductor layer in the build-up portion formed on the second surface side. The glass plate has a thickness of 0.7 mm or more and 1.5 mm or less, and a thermal expansion coefficient of 5 ppm / °C or more and 8 ppm / °C or less. The minimum arrangement pitch of the aforementioned multiple through-hole conductors is 100 μm or more and 200 μm or less.

2. A wiring board according to claim 1, The glass plate has a rectangular planar shape, The length of each side of the aforementioned rectangle is 50 mm or more.

3. The wiring board according to claim 1, wherein the thermal expansion coefficient of the insulating layer constituting the build-up portion is 15 ppm / °C or more and 25 ppm / °C or less.

4. The wiring board according to claim 1, wherein the minimum arrangement pitch of the plurality of through-hole conductors is 150 μm or more.

5. The wiring board according to claim 1, wherein the through-hole conductor is made of a conductor that fills the through-holes that penetrate the glass plate.

6. The wiring board according to claim 1, wherein the shortest distance between the outer edges of the through-hole conductors is 50 μm or more and 150 μm or less.

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